Light-emitting devices and laser projection equipment

Abstract

The present invention provides a light-emitting device (2000), a method for manufacturing the same, and a laser projection device (10). The light-emitting device (2000) includes a light-emitting assembly (200) and a substrate (100). The substrate (100) includes a substrate body, at least one connection pattern (13), a plurality of interconnection regions (12), and a plurality of sets of first pads (11). The light-emitting assembly (200) is fixed on at least one connection pattern (13) and includes at least one package (202), a conductive structure (24), a first wiring (23), and a plurality of types of laser chips (203, 221, 222, 223). The first wiring (23) is provided on at least one of the side walls or bottom walls of at least one package (202). Multiple types of laser chips (203, 221, 222, 223) are housed in at least one package (202) and electrically connected to wiring (23), and the multiple types of laser chips (203, 221, 222, 223) emit laser light of at least two different colors.

Description

[[Technical Field]]

[0001] (Cross-Reference to Related Applications) The present application claims priority based on the Chinese patent application with application number 202311683844.6 filed on December 8, 2023, and the Chinese patent application with application number 202410089831.4 filed on January 22, 2024, the entire content of which is incorporated herein by reference.

[0002] The present disclosure relates to the field of laser projection technology, and in particular to a light emitting device and a laser projection apparatus. [[Background Art]]

[0003] With the improvement of living standards, people's demand for television products with high chroma saturation and high brightness has been increasing year by year, and the advantages of laser projection apparatuses have become obvious. In recent years, laser projection apparatuses with excellent portability have been greatly welcomed by the market, and miniaturized laser projection apparatuses have come to be applied. [[Summary of the Invention]] [[Means for Solving the Problems]]

[0004] In one embodiment, a light-emitting device is provided. The light-emitting device includes a substrate and a light-emitting assembly. The substrate includes a substrate body, at least one connection pattern, a plurality of interconnection regions, and a plurality of sets of first pads. At least one connection pattern is provided on the substrate body and includes a conductive portion. The plurality of interconnection regions are provided on the substrate body. The plurality of sets of first pads are provided on the substrate body. The plurality of sets of first pads are electrically connected to the conductive portion via the plurality of interconnection regions, and any one set of first pads among the plurality of sets of first pads includes two first pads with different polarities. The light-emitting assembly is mounted on at least one connection pattern and includes at least one package, a conductive structure, and a plurality of types of laser chips. At least one of the side walls or bottom wall of at least one package is provided with first wiring. The conductive structure is provided on the substrate-facing side of at least one package and is electrically connected to the first wiring and the conductive portion. The plurality of types of laser chips are provided in at least one package and are electrically connected to the first wiring. The plurality of types of laser chips are configured to emit laser light of at least two different colors. Among several types of laser chips, any laser chip of the same type is electrically connected to one of the first pads.

[0005] In another embodiment, a laser projection apparatus is provided. The laser projection apparatus includes a light source assembly, an optical modulation assembly, and a lens. The light source assembly is configured to emit an illumination beam, and the light source assembly includes the light-emitting device. The optical modulation assembly is configured to modulate the illumination beam provided by the light source assembly to obtain a projection beam. The lens is configured to image the projection beam. [Brief explanation of the drawing]

[0006] To more clearly illustrate some embodiments of the present disclosure or related technologies, the following briefly describes the drawings necessary for describing some embodiments of the present disclosure or related technologies. Clearly, the drawings described below are drawings of some embodiments of the present disclosure, and those skilled in the art may obtain other drawings based on these. [Figure 1] This is a configuration diagram of a laser projection device according to several embodiments. [Figure 2] These are optical path diagrams of the light source assembly, optical modulation assembly, and lens in a laser projection device according to several embodiments. [Figure 3] This is a schematic diagram illustrating the principle of projection imaging by a laser projection device according to several embodiments. [Figure 4] This figure shows the operation of a micro-mirror piece according to several embodiments. [Figure 5] This is a diagram showing the configuration of a light-emitting device related to the technology. [Figure 6] This is an exploded view of a light-emitting device related to the technology. [Figure 7] This is a configuration diagram of a light-emitting device according to several embodiments. [Figure 8] This is another configuration diagram of a light-emitting device according to several embodiments. [Figure 9] This is yet another configuration diagram of a light-emitting device according to several embodiments. [Figure 10] This diagram shows the configuration of a cover plate and multiple first sealing portions according to several embodiments. [Figure 11] This is another configuration diagram of a cover plate and multiple first sealing portions according to several embodiments. [Figure 12] This is yet another configuration diagram of a cover plate and multiple first sealing portions according to several embodiments. [Figure 13] This is a diagram illustrating the configuration of a housing structure according to several embodiments. [Figure 14] This is a diagram showing the configuration of multiple housing structures according to several embodiments. [Figure 15] This is an exploded view of a light-emitting assembly according to several embodiments. [Figure 16] This is yet another configuration diagram of a light-emitting device according to several embodiments. [Figure 17] This is a diagram illustrating the operating principle of a light-emitting device in related technologies. [Figure 18] This is a circuit diagram of multiple laser chips using a common anode wiring method in related technologies. [Figure 19] It is a circuit diagram of a plurality of laser chips adopting a cathode common wiring scheme in the related art. [Figure 20] It is still another configuration diagram of a light-emitting device according to some embodiments. [Figure 21] It is a configuration diagram of a substrate according to some embodiments. [Figure 22] It is another configuration diagram of a substrate according to some embodiments. [Figure 23] It is a block diagram of a light-emitting device according to some embodiments. [Figure 24] It is a bottom view of a package according to some embodiments. [Figure 25] It is a circuit diagram of a light-emitting device according to some embodiments. [Figure 26] It is still another configuration diagram of a light-emitting device according to some embodiments. [Figure 27] It is a circuit diagram of a temperature measurement component according to some embodiments. [Figure 28] It is still another configuration diagram of a substrate according to some embodiments. [Figure 29] It is still another configuration diagram of a substrate according to some embodiments. [Figure 30] It is still another configuration diagram of a substrate according to some embodiments. [Figure 31] It is a circuit diagram of a package according to some embodiments. [Figure 32] It is still another configuration diagram of a light-emitting device according to some embodiments. [Figure 33] It is a configuration diagram of wiring in a first package according to some embodiments. [Figure 34] It is a top view of wiring in a first package according to some embodiments. [Figure 35] It is still another configuration diagram of a light-emitting device according to some embodiments. [Figure 36] It is a configuration diagram of wiring in a second package according to some embodiments. [Figure 37]This is a top view of the wiring in a second package according to several embodiments. [Figure 38] This is yet another configuration diagram of a light-emitting device according to several embodiments. [Figure 39] This is a configuration diagram of multiple packages relating to several embodiments. [Figure 40] This is yet another configuration diagram of a substrate according to several embodiments. [Figure 41] This is yet another configuration diagram of a light-emitting device according to several embodiments. [Figure 42] This is another bottom view of the package according to some embodiments. [Figure 43] This is a configuration diagram of a light-emitting assembly according to several embodiments. [Figure 44] This is yet another configuration diagram of a substrate according to several embodiments. [Figure 45] This is a top view of the wiring in a package according to several embodiments. [Figure 46] This is yet another configuration diagram of a light-emitting device according to several embodiments. [Figure 47] This is another bottom view of the package according to some embodiments. [Figure 48A] This is a flowchart of the manufacturing method of a light-emitting device according to several embodiments. [Figure 48B] This is another flowchart of the manufacturing method of a light-emitting device according to several embodiments. [Figure 49] This is another flowchart of the manufacturing method of a light-emitting device according to several embodiments. [Figure 50] This is another flowchart of the manufacturing method of a light-emitting device according to several embodiments. [Figure 51] This diagram shows the configuration of the cover plate and the second seal portion according to several embodiments. [Figure 52] This diagram shows the configuration of a cover plate, a plurality of first sealing portions, and a second sealing portion according to several embodiments. [Figure 53] This is another configuration diagram of a light-emitting assembly according to several embodiments. [Figure 54] This is yet another configuration diagram of a light-emitting device according to several embodiments. [Figure 55] This is a diagram showing the configuration of a cover plate according to several embodiments. [Modes for carrying out the invention]

[0007] In the following, several embodiments of this disclosure will be clearly and completely described with reference to the drawings. It is clear that the embodiments described are only a selection of the embodiments of this disclosure, not all embodiments. All other embodiments obtained by those skilled in the art based on some embodiments of this disclosure are all within the scope of this disclosure.

[0008] In this specification and in the claims, the term “comprise” and other forms, such as the third-person singular “comprises” and the present participle “comprising,” should be interpreted as open, comprehensive, i.e., “including, but not limited to,” unless otherwise specified in the context. In the description of the specification, terms such as “one embodiment,” “some embodiments,” “exemplary embodiments,” “example,” “specific example,” or “some examples” are intended to indicate that certain features, structures, materials, or properties related to this embodiment or example are included in at least one embodiment or example of this disclosure. The general expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, any specific features, structures, materials, or properties described may be included in any one or more embodiments or examples in any suitable manner.

[0009] In the following, the terms “first” and “second” are used solely for descriptive purposes and should not be understood as expressing or implying relative importance or the number of technical features being described. Therefore, features limited by “first” and “second” may include one or more such features, expressly or implicitly. In the description of the embodiments of this disclosure, unless otherwise specified, “multiple” means two or more.

[0010] In describing some embodiments, the term "connection" and related expressions may be used. The term "connection" should be interpreted broadly; for example, a "connection" may be a fixed connection, a detachable connection, or an integral connection, and may be a direct connection or an indirect connection via an intermediate medium. The embodiments disclosed herein are not necessarily limited to those described herein.

[0011] "At least one of A, B, and C" is the same as "at least one of A, B, or C," and both include A only, B only, C only, a combination of A and B, a combination of A and C, a combination of B and C, and a combination of A, B, and C.

[0012] As used herein, depending on the context, the term “case” is optionally interpreted to mean “when…” or “on the occasion of…” or “in response to a decision of…” or “in response to the detection of…” Similarly, depending on the context, the phrases “when… is decided” or “when [the described condition or event] is detected” are optionally interpreted to mean “when… is decided,” or “in response to a decision of…” or “when [the described condition or event] is detected.”

[0013] In this specification, “to apply to…” or “to be arranged to…” means an open and inclusive language that does not exclude devices to be applied to or configured to perform additional tasks or steps.

[0014] Furthermore, the use of "based on" implies that a process, step, calculation, or other action performed "based on" one or more stated conditions or values ​​is open and inclusive, as it may actually be based on additional conditions or exceed the stated values.

[0015] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the mean value within an acceptable range of deviation of a particular value, where the acceptable range of deviation is determined taking into account the errors associated with the measurement and the measurement of a particular quantity (i.e., limitations of the measurement system) as considered by those skilled in the art.

[0016] As used herein, “about,” “substantially,” and “generally” include the described condition and conditions similar to the described condition, and the range of similar conditions is determined by taking into account the errors associated with the measurement and measurement of specific quantities (i.e., limitations of the measurement system) as considered by those skilled in the art.

[0017] Figure 1 shows the configuration diagram of a laser projection device according to several embodiments.

[0018] Some embodiments of this disclosure provide a laser projection device 10. As shown in Figure 1, the laser projection device 10 includes a light source assembly 500, an optical modulation assembly 600, and a lens 700. The light source assembly 500 is configured to provide an illumination beam. The optical modulation assembly 600 is configured to modulate the illumination beam provided by the light source assembly 500 using an image signal to obtain a projection beam. The lens 700 is configured to project the projection beam onto a screen or wall surface for imaging.

[0019] The light source assembly 500, the optical modulation assembly 600, and the lens 700 are sequentially connected along the beam propagation direction and each is surrounded by a corresponding housing. Each housing of the light source assembly 500, the optical modulation assembly 600, and the lens 700 supports each optical component and ensures that each optical component achieves a predetermined sealing or airtightness requirement.

[0020] As shown in Figure 1, the first end of the optical modulation assembly 600 is connected to the light source assembly 500, and the light source assembly 500 and the optical modulation assembly 600 are positioned along the direction of emission of the illumination beam of the laser projection device 10 (see direction M shown in Figure 1). The second end of the optical modulation assembly 600 is connected to the lens 700, and the optical modulation assembly 600 and the lens 700 are positioned along the direction of emission of the projection beam of the laser projection device 10 (see direction N shown in Figure 1). The M and N directions are approximately perpendicular. Such a connection structure is advantageous for the structural arrangement of the laser projection device 10, as it adapts to the optical path characteristics of the reflective optical bulb in the optical modulation assembly 600 on the one hand, and is advantageous for shortening the length of the optical path in one dimension on the other hand.

[0021] For example, if the light source assembly 500, the optical modulation assembly 600, and the lens 700 are arranged in one dimensional direction (e.g., the M direction), the length of the optical path in this dimensional direction becomes very long, which is disadvantageous for the structural arrangement of the laser projection device 10.

[0022] In some embodiments, the light source assembly 500 can provide primary color light (with other colored lights added based on the primary color light) in a time series. Due to the afterimage effect of the human eye, what the human eye sees is the white light formed by the mixing of the primary color light. Alternatively, the light source assembly 500 can simultaneously output the primary color light to continuously emit white light. The light source assembly 500 may include a light-emitting device that can emit a laser beam of at least one color, such as a red laser beam, a blue laser beam, or a green laser beam.

[0023] Figure 2 shows the optical path diagrams of the light source assembly, optical modulation assembly, and lens in a laser projection device according to several embodiments. Figure 3 shows the principle diagram of projection imaging by a laser projection device according to several embodiments.

[0024] The illumination beam emitted from the light source assembly 500 enters the optical modulation assembly 600. As shown in Figures 2 and 3, the optical modulation assembly 600 includes an illumination lens group 501 and an optical modulation device (or optical bulb) 502. The illumination lens group 501 is configured to receive the illumination beam provided by the light source assembly 500 and propagate the illumination beam to the optical modulation device 502 at a set angle and direction. The optical modulation device 502 is configured to modulate the illumination beam to obtain a projected beam and to reflect the projected beam to the lens 700.

[0025] In some embodiments, as shown in Figures 2 and 3, the illumination lens group 501 includes a light equalizer 510, a lens group 520, and a prism group 550. The light equalizer 510 is configured to receive the illumination beam provided by the light source assembly 500 and to equalize the illumination beam. The lens group 520 is configured to focus the illumination beam emitted from the light equalizer 510 onto the prism group 550. The prism group 550 is configured to reflect the illumination beam onto the light modulation device 502.

[0026] In some embodiments, as shown in Figures 2 and 3, the light equalizer component 510 includes a light pipe 5101. The light outlet of this light pipe 5101 may be rectangular, thereby providing a shaping effect on the light spot. This allows the shape of the light spot of the illumination beam emitted from the light pipe 5101 to match the rectangular light-receiving surface of the light modulation device 502. Alternatively, the light equalizer component 510 may include a fly-eye lens. This fly-eye lens can homogenize the incident illumination beam and shape it to output a rectangular light spot.

[0027] In some embodiments, as shown in Figures 2 and 3, the illumination lens group 501 includes a reflector 530. The reflector 530 is located on the light-emitting side of the lens group 520 and is configured to reflect the illumination beam emitted from the lens group 520 to the prism group 550.

[0028] In some embodiments, as shown in Figure 3, the optical modulation device 502 includes a digital micromirror device (DMD) 540.

[0029] In the optical modulation assembly 600, the DMD 540 is a core component configured to modulate the illumination beam provided by the light source assembly 500 using an image signal. That is, the DMD 540 controls the illumination beam to display different brightness and gradation for different pixels of the image to be projected, ultimately forming an optical image.

[0030] Figure 4 shows the operation of micro-mirror pieces according to several embodiments. As shown in Figure 4, the digital micromirror device 540 includes thousands of individually driven and rotatable micro-mirror pieces 2401. Light reflected by the micro-mirror pieces 2401 at a negative deflection angle is called OFF light, and OFF light is inactive light.

[0031] As light-emitting devices become smaller, the difficulty of sealing them increases as product sizes are continuously and repeatedly reduced. Current soldering methods make it difficult to achieve high airtightness, and problems such as solder overflow and glass stress exist. Glass stress refers to the localized thermal stress that occurs when a high-energy laser beam rapidly heats the soldering area during the soldering process, causing localized thermal expansion of the soldered area. Because glass has poor thermal conductivity, the temperature difference between the inside and outside of the soldered area of ​​the glass becomes large, resulting in localized thermal stress.

[0032] Figure 5 is a diagram showing the configuration of a light-emitting device related to the relevant technology. Figure 6 is an exploded view of the light-emitting device related to the relevant technology.

[0033] Typically, as shown in Figures 5 and 6, the light-emitting device 1000 includes a substrate 1001 and at least one light-emitting assembly 2001. The light-emitting assembly 2001 includes a collimating section 2010 (such as a collimating lens), a package 2020, a laser chip 2030, and an optical deflection component 2040 (such as a reflective prism). The laser chip 2030 and the optical deflection component 204 are each housed inside the package 2020. The package 2020 includes a housing structure 20201 and a cover plate 20202, the cover plate 20202 and the housing structure 20201 being connected to each other to form a sealing space. This sealing space is configured to house the laser chip 2030 and the optical deflection component 2040.

[0034] As shown in Figures 5 and 6, at least one light-emitting assembly 2001 comprises multiple light-emitting assemblies 2001. The multiple light-emitting assemblies 2001 are arranged at equal intervals along the longitudinal direction of the substrate 1001. A low-temperature sintering process fixes the laser chip 2030 and the optical deflection component 2040 within the package 2020 using nanometal paste. After sintering, the thermal conductivity and high-temperature mechanical reliability of the laser chip 2030 are greatly improved. The optical deflection component 2040 deflects the beam emitted by the laser chip 2030 by 90°, so that the beam is emitted along a direction perpendicular to the substrate 1001. The reflected beam passes through the cover plate 20202 and is finally collimated by the collimation unit 201 before being emitted.

[0035] The laser chip 2030 is an active device and must be packaged in a dust-free, dry, and highly airtight space to prevent water vapor and oxygen from entering this space, thereby ensuring the reliability of the long-term operation of the light-emitting device 1000. Gold-tin alloy soldering material is a common solder for hermetically sealing Package 2020. Gold-tin alloy has high strength and excellent wettability. Wettability refers to the ability of the gold-tin alloy to form a uniform and dense wet layer on the surface of a material when it comes into contact with the material's surface. This wet layer can rapidly expand and uniformly cover the surface of the material, filling minute pores and depressions and forming a stable contact interface.

[0036] As shown in Figure 6, the light-emitting assembly 2001 further includes a soldering piece 205. The soldering piece 205 can be manufactured in advance from a gold-tin alloy soldering material, and the thickness of the soldering piece 205 can be adjusted as needed, and the thickness of the soldering piece 205 is substantially uniform.

[0037] Typically, in the process of achieving an alloy eutectic seal using a pre-formed soldering piece 205, it is necessary to gold-plate the soldering surface (e.g., at least a portion of the contact surface between the cover plate 20202 and the housing structure 20201). In this way, when the temperature rises above the melting point of the soldering material, the soldering material melts and fills the gap between the cover plate 20202 and the housing structure 20201, achieving airtightness. The soldering piece 205 is usually pre-formed on the cover plate 20202, and during the soldering process, after the soldering piece 205 comes into contact with the housing structure 20201, the soldering piece 205 is heated to complete the soldering. When the soldering piece 205 melts and some pressure is applied, the molten soldering material very easily overflows from the sealing area (e.g., the contact area between the cover plate 20202 and the housing structure 20201), so if there is insufficient soldering material, soldering voids are likely to form. A solder void refers to a hole or gap that occurs during the soldering process when the solder joint cannot be completely filled. Furthermore, excess solder material can easily flow into the seal space, potentially affecting the laser chip 2030.

[0038] To solve the above problems, some embodiments of this disclosure provide a light-emitting device 2000. This light-emitting device 2000 includes a plurality of first sealing parts. Two adjacent first sealing parts come into contact with each other by changing their own physical shape, sealing the housing structure and cover plate to improve the airtightness of the soldering, preventing overflow of soldering material and avoiding impact on the laser tip.

[0039] Figure 7 is a configuration diagram of a light-emitting device according to several embodiments. As shown in Figure 7, the light-emitting device 2000 includes a substrate 100 and a light-emitting assembly 200. The substrate 100 includes an electrical connection structure. The light-emitting assembly 200 is fixed to one side of the substrate 100. The substrate 100 is configured to mount and fix the light-emitting assembly 200 and to electrically connect with the light-emitting assembly 200 to provide specific electrical signals to the light-emitting assembly 200, thereby enabling the light-emitting assembly 200 to emit light. The light-emitting assembly 200 includes a package 202, a laser chip 203 (as shown in Figures 13 and 14), an optical deflection component 204 (as shown in Figures 13 and 14), and a conductive structure. The laser chip and optical deflection component are installed in the package 202, and the conductive structure is provided on the side of the package 202 facing the substrate 100 and connected to the electrical connection structure. This allows the light-emitting assembly 200 and the substrate 100 to achieve electrical connection via the conductive structure and the electrical connection structure.

[0040] As shown in Figure 7, the package 202 includes a housing structure 2021, a cover plate 2022, and a plurality of first sealing portions 2023. The housing structure 2021 is installed on the substrate 100, and the side of the housing structure 2021 away from the substrate 100 is recessed to form a cavity. The cover plate 2022 covers the housing structure 2021 and seals the cavity to form a sealed space. The plurality of first sealing portions 2023 are installed between the housing structure 2021 and the cover plate 2022. The plurality of first sealing portions 2023 are configured to connect the housing structure 2021 and the cover plate 2022 and to seal the gap at the connection between the housing structure 2021 and the cover plate 2022.

[0041] Before soldering the cover plate 2022 and the housing structure 2021, the multiple first sealing portions 2023 are separated from each other, and the multiple first sealing portions 2023 are installed at intervals on the side of the cover plate 2022 facing the housing structure 2021. When soldering the cover plate 2022 and the housing structure 2021, two adjacent first sealing portions 2023 come into contact with each other due to a change in their own material form, sealing the gap at the connection between the housing structure 2021 and the cover plate 2022. The material form may include solids, liquids, etc.

[0042] For example, when soldering the cover plate 2022 to the housing structure 2021, the two adjacent first seal portions 2023 melt due to heating and change from solid to liquid, so the two adjacent first seal portions 2023 come into contact with each other and seal the gap at the connection between the housing structure 2021 and the cover plate 2022.

[0043] In some embodiments of the present invention, sealing the housing structure 2021 and the cover plate 2022 with a plurality of first sealing portions 2023 isolates the laser chip installed in the package 202 from the outside world, ensuring that the light-emitting device 2000 operates reliably for a long period of time. The plurality of first sealing portions 2023 are separated from each other, and any one of the first sealing portions 2023 is an independent structure. After the plurality of first sealing portions 2023 change from solid to liquid, two adjacent first sealing portions 2023 come into contact with each other due to their own shape change, thereby achieving the objective of sealing the gap at the connection between the housing structure 2021 and the cover plate 2022.

[0044] Compared to the sealing method of the housing structure 2021 and cover plate 2022 using preformed soldering pieces 205 in related technologies, some embodiments of this disclosure can prevent the formation of solder voids caused by overflow of the first seal portions 2023 and improve airtightness by sealing the housing structure 2021 and cover plate 2022 with a plurality of first seal portions 2023. Furthermore, it is possible to prevent the laser chip from being affected by overflow of the first seal portions 2023.

[0045] Figure 8 is another configuration diagram of a light-emitting device according to several embodiments. In some embodiments, as shown in Figure 8, the light-emitting device 2000 further includes a second seal portion 2024. The orthogonal projections of the plurality of first seal portions 2023 onto the plane on which the cover plate 2022 resides and the orthogonal projection of the second seal portion 2024 onto the plane on which the cover plate 2022 resides overlap at least partially. The second seal portion 2024 satisfies at least one of the following conditions: the second seal portion 2024 is installed on the side of the cover plate 2022 facing the housing structure 2021 and is located between the cover plate 2022 and the plurality of first seal portions 2023, or the second seal portion 2024 is installed on the side of the housing structure 2021 facing the cover plate 2022 and is located between the housing structure 2021 and the plurality of first seal portions 2023. Figure 8 shows an example in which the second seal portion 2024 is installed on the side of the cover plate 2022 facing the housing structure 2021.

[0046] In some embodiments, the second seal portion 2024 may be a plated structure such as a metallized layer. For example, this metallized layer may include at least one material from titanium (Ti), platinum (Pt), or gold (Au), or at least one material from nickel (Ni) or Au, or at least one material from chromium (Cr) or gold (Au). Multiple first seal portions 2023 may be provided on the second seal portion 2024, and the multiple first seal portions 2023 and the second seal portion 2024 can cooperate with each other to stably fix the cover plate 2022 and the housing structure 2021, and to achieve the objective of sealing the gap at the connection between the housing structure 2021 and the cover plate 2022.

[0047] Figure 9 is another configuration diagram of a light-emitting device according to some embodiments. In some embodiments, as shown in Figure 9, the light-emitting device 2000 further includes two seal regions 300. These two seal regions 300 are a first seal region and a second seal region, respectively. The first seal region is provided on the side of the housing structure 2021 closer to the cover plate 2022. The second seal region is installed corresponding to the first seal region and is provided on the side of the cover plate 2022 closer to the housing structure 2021. Multiple first seal portions 2023 are provided in the first and second seal regions. The orthogonal projection of the second seal portion onto the plane on which the substrate 100 exists and the orthogonal projection of the first seal portion onto the plane on which the substrate 100 exists overlap at least partially. The first seal region and the second seal region are each metallized layers. The first seal portion 2023 connects the first seal region and the second seal region and seals the gap at the connection between the housing structure 2021 and the cover plate 2022.

[0048] In some embodiments, at least one of the first or second sealing regions may include the second sealing portion 2024. For example, if the second sealing portion 2024 is located on the side of the cover plate 2022 closer to the housing structure 2021, the second sealing region includes the second sealing portion 2024. If the second sealing portion 2024 is located on the side of the housing structure 2021 closer to the cover plate 2022, the first sealing region includes the second sealing portion 2024. To make it clear, the second sealing portion 2024 may also be provided independently of the first or second sealing region. For example, the second sealing portion 2024 may be provided connected to the first or second sealing region.

[0049] Furthermore, to make it easier to understand, the second seal portion 2024 satisfies either the following conditions: the orthogonal projection of the second seal portion 2024 onto the surface of the cover plate 2022 closest to the housing structure 2021 is within the second seal region, or the orthogonal projection of the second seal portion 2024 onto the surface of the housing structure 2021 closest to the cover plate 2022 is within the first seal region.

[0050] In some embodiments, the sealing region 300 may be insulated from the circuit structure in the light-emitting device 2000 (for example, the conductive structure and the electrical connection structure). By installing the sealing area 300, the reliability of the connection between the first sealing portion 2023, the cover plate 2022, and the housing structure 2021 can be improved. In some embodiments, the sealing area 300 may be implemented using a method similar to that shown in Figure 8, combined with the material of the sealing area 300, the flatness of its surface, its insulating properties, etc. This improves the stability of the seal between the housing structure 2021 and the cover plate 2022.

[0051] Figure 10 is a configuration diagram of a cover plate and a plurality of first sealing portions according to some embodiments. Figure 11 is another configuration diagram of a cover plate and a plurality of first sealing portions according to some embodiments. In some embodiments, as shown in Figures 10 and 11, a plurality of first sealing portions 2023 are installed in a second sealing region, the first sealing portions 2023 are hemispherical in shape, and there is a gap between two adjacent first sealing portions 2023.

[0052] As shown in Figures 10 and 11, the first seal portion 2023 is a hemispherical metal soldering ball, and the material of the first seal portion 2023 may be a gold-tin alloy. There is a gap between two adjacent metal soldering balls placed on the cover plate 2022. Due to the action of pressure, the shape of the metal soldering ball is easily changed, and as a result, the two adjacent metal soldering balls extend in a direction toward each other and come into contact with each other, achieving the purpose of sealing the gap between the cover plate 2022 and the housing structure 2021. After the action of pressure, the metal soldering ball may take on a disc shape.

[0053] Compared to soldering methods using soldering pieces 205 in related technologies, the metal soldering balls contact each other in an extended manner, thereby sealing the gap between the housing structure 2021 and the cover plate 2022. This prevents overflow of soldering material, and consequently prevents the generation of soldering voids and the impact of overflowing soldering material on the laser chip 203.

[0054] Figure 12 is another configuration diagram of a cover plate and a plurality of first seal portions according to some embodiments. In some embodiments, as shown in Figure 12, the seal region 300 is annular. If we define the area of ​​the seal region 300 as S, the distance between the housing structure 2021 and the cover plate 2022 as H, the number of hemispherical first seal portions 2023 as M, and the radius of the hemispherical first seal portion 2023 as R, then the area S of the seal region 300, the distance H between the housing structure 2021 and the cover plate 2022, the number M of the plurality of first seal portions 2023, and the radius R of the first seal portion 2023 satisfy equation (1).

[0055]

number

[0056] What can be understood is that equation (1) means that the total volume of the multiple first seal portions 2023 is greater than or equal to the volume of the soldering area. This soldering area is the area defined by the seal area 300, the housing structure 2021, and the cover plate 2022.

[0057] As shown in Figure 12, by eutectic welding the housing structure 2021 and the cover plate 2022 using the hemispherical first seal portion 2023, the unfilled area of ​​the first seal portion 2023 can be reduced, and the first seal portion 2023 in a high-temperature molten state can fill the seal area 300, thus guaranteeing an airtight effect.

[0058] In some embodiments, the radius R of the first seal portion 2023 and the distance between two adjacent first seal portions 2023 are related to the thickness of the first seal portion 2023 as it is deployed under pressure and after welding. As shown in Figure 12, the lengths of the outer sides of any seal region 300 are defined as the first length L1 and first width L3, respectively, the lengths of the inner sides are defined as the second length L2 and second width L4, respectively, and the total volume of the multiple first seal portions 2023 is defined as V. If the multiple first seal portions 2023 fill the space corresponding to the seal region 300 between the housing structure 2021 and the cover plate 2022, the total volume V of the multiple first seal portions 2023 satisfies equations (2) and (3).

[0059]

number

[0060]

number

[0061] Ideally, the total volume V of the multiple first seal portions 2023 in some embodiments of the present disclosure is equal to the target volume V1. However, given that there may be errors in the accuracy of the total volume of the first seal portions 2023, the total volume V of the multiple first seal portions 2023 may be set to be slightly larger than the target volume V1. In some embodiments, the total volume V of the first seal portions 2023 may exceed 10% of the target volume V1 by up to 10%. The volume V2 of any spherical first seal portion 2023 satisfies equation (4).

[0062]

number

[0063] The volume V3 of any hemispherical first seal portion 2023 is half the volume V2 of the spherical first seal portion 2023, and satisfies equation (5).

[0064]

number

[0065] Therefore, if each of the multiple first seal portions 2023 is hemispherical, the total volume V of the multiple first seal portions 2023 satisfies equations (6) and (7).

number

number

[0066] In some embodiments, the perimeter of an arbitrary seal region 300 is defined as L, and the distance between two adjacent hemispherical first seal portions 2023 is defined as A. The perimeter L of the seal region 300, the distance A between two adjacent hemispherical first seal portions 2023, and the number M of the first seal portions 2023 satisfy equation (8).

number

[0067] As shown in Figure 12, the perimeter L of the seal region 300 is approximated by the sum of the first length L1, the second length L2, the first width L3, and the second width L4 (L = L1 + L2 + L3 + L4). The distance A between two adjacent hemispherical first seal portions 2023 is defined as the distance between the centers of the faces of the two adjacent first seal portions 2023 that are close to the cover plate 2022. In order for multiple first seal portions 2023 to fill the seal region 300, the perimeter L of the seal region 300, the distance A between the centers of the faces of the two adjacent first seal portions 2023 that are close to the cover plate 2022, and the number M of the first seal portions 2023 satisfy equation (8).

[0068] As can be seen from equations (6), (7), and (8), when the distance H between the housing structure 2021 and the cover plate 2022 and the size of the sealing area 300 are determined, the relationship between the number M of the first sealing portion 2023 and the radius R of the first sealing portion 2023 can be obtained. The distance H between the housing structure 2021 and the cover plate 2022 can refer to the thickness of the first sealing portion 2023 after the housing structure 2021 and the cover plate 2022 are sealed, and will be hereinafter abbreviated as the sealing thickness. The sealing thickness may also be the distance between the cover plate 2022 and the housing structure 2021 in a direction perpendicular to the plane on which the substrate 100 exists.

[0069] In some embodiments, during the manufacturing process of the first seal portion 2023, the radius R of the first seal portion 2023 is between 5 μm and 300 μm (5 μm ≤ R ≤ 300 μm). For example, the radius R of the first seal portion 2023 may be 5 μm, 100 μm, 200 μm, 250 μm, or 300 μm. Different dimensions of the radius R of the first seal portion 2023 correspond to different seal thicknesses.

[0070] For packages 202 with a volume less than a first predetermined threshold (e.g., small packages), the seal thickness may be 20 μm or more, and correspondingly the radius of the hemispherical first seal portion 2023 may be 40 μm or more; or the seal thickness may be 50 μm or less, and correspondingly the radius of the hemispherical first seal portion 2023 may be 100 μm or less; or the seal thickness may be 20 μm or more and 50 μm or less, and correspondingly the radius of the hemispherical first seal portion 2023 may be 40 μm or more and 100 μm or less. For example, the seal thickness may be 20 μm, 25 μm, 30 μm, 40 μm, or 50 μm. For example, the radius of the hemispherical first seal portion 2023 may be 40 μm, 50 μm, 70 μm, 90 μm, or 100 μm.

[0071] For packages 202 whose volume is greater than a first predetermined threshold, the seal thickness may be 50 μm or more, and correspondingly the radius of the hemispherical first seal portion 2023 may be 120 μm or more; or the seal thickness may be 100 μm or less, and correspondingly the radius of the hemispherical first seal portion 2023 may be 180 μm or less; or the seal thickness may be 50 μm or more and 100 μm or less, and correspondingly the radius of the hemispherical first seal portion 2023 may be 120 μm or more and 180 μm or less. For example, the seal thickness may be 50 μm, 60 μm, 70 μm, 90 μm, or 100 μm, and the radius of the hemispherical first seal portion 2023 may be 120 μm, 140 μm, 150 μm, 170 μm, or 180 μm. This makes it possible to increase the seal strength and the contact area between the first seal portion 2023, the cover plate 2022, and the housing structure 2021. The required seal thickness can be obtained by adjusting the pressure on the cover plate 2022 and the spacing between adjacent first seal portions 2023. When the radius of the hemispherical first seal portion 2023 is within a radial range (e.g., 40 μm to 100 μm, 120 μm to 180 μm), the ideal bonding objective can be achieved by controlling the pressure during the sealing process. As a result, when sealing is performed using a gold-tin alloy material for the first seal portion 2023, the diffusion of the first seal portion 2023 can be performed uniformly and densely as the temperature rises.

[0072] If the radius of the hemispherical first seal portion 2023 is between 5 μm and 40 μm, for example, if the radius of the hemispherical first seal portion 2023 is 5 μm, 15 μm, 20 μm, 35 μm, or 40 μm, the seal contact area is small, the seal thickness is thin, and phenomena such as tack welding and dummy bonding are likely to occur at the soldered part of the seal area 300, reducing the reliability and environmental adaptability of the light-emitting device 2000. Therefore, adopting a first seal portion 2023 within the above radius range is suitable for packages 202 with small dimensions and a small area of ​​the seal area 300 (for example, a single-chip package 202).

[0073] If the radius of the hemispherical first seal portion 2023 is between 200 μm and 300 μm, for example, if the radius of the hemispherical first seal portion 2023 is 200 μm, 220 μm, 250 μm, 280 μm, or 300 μm, the first seal portion 2023 is prone to leakage during the sealing process, requiring strict control of parameters such as pressure and temperature, thus increasing the difficulty of the sealing process. In this case, because the radius of the first seal portion 2023 is large, it is difficult to control the seal thickness, and as a result, the thickness of the first seal portion 2023 may become uneven. Also, the volume of the first seal portion 2023 increases, which increases the sealing cost. Therefore, adopting a first seal portion 2023 within the above radius range is suitable for packages 202 with large dimensions and a large area of ​​the sealing region 300 (for example, large packages 202).

[0074] When the radius of the first seal portion 2023 and the dimensions of the package 202 are determined, the required seal thickness can also be achieved by adjusting the number of first seal portions 2023. When the dimensions of the package 202 are determined, the smaller the radius of the first seal portion 2023, the more first seal portions 2023 are required. In some embodiments, when the number of first seal portions 2023 is between 100 and 300, sealing can be performed using a small number of first seal portions 2023 with radii greater than the second predetermined threshold (i.e., first seal portions 2023 with large radii). For small-sized packages 202, when the radius of the first seal portion 2023 is small, the number of first seal portions 2023 may be between 4000 and 8000.

[0075] In some embodiments, the number of first sealing portions 2023 ranges from 500 to 2000. Within this range, by adjusting the radius of the first sealing portions 2023, a uniform sealing thickness can be obtained, resulting in a better sealing effect.

[0076] In the preamble, the case where the first sealing portion 2023 is hemispherical was mainly described as an example, but of course, in some embodiments, the first sealing portion 2023 may be of other shapes, such as a cube, a rectangular prism, a sphere, an ellipsoid, a tetrahedron, etc.

[0077] Taking the case where the first seal portion 2023 is spherical as an example, let R be the radius of the first seal portion 2023, and the volume V2 of any first seal portion 2023 satisfies equation (9).

number

[0078] Therefore, if each of the multiple first seal portions 2023 is hemispherical, the total volume V of the multiple first seal portions 2023 satisfies equations (10) and (11).

number

number

[0079] The process for determining the total volume of the multiple first seal portions 2023 having other shapes is the same as the process described above and will not be explained again here.

[0080] Figure 13 is a configuration diagram of a housing structure according to several embodiments. Figure 14 is a configuration diagram of multiple housing structures according to several embodiments. As shown in Figures 13 and 14, the housing structure 2021 includes a side wall 208 and a base plate. The side wall 208 is placed on the base plate. The side wall 208 may be formed from a ceramic material or from a metal alloy material. The base plate is the surface mount area for the laser chip 203 and the optical deflection component 204. Considering surface mount accuracy and heat dissipation effect, the flatness requirement of the base plate is high, and therefore, a material with good heat dissipation, such as oxygen-free copper or diamond, may be used for the base plate. The base plate and the side wall 208 may be joined by sintering to form the housing structure 2021.

[0081] As shown in Figures 13 and 14, the housing structure 2021 further includes at least two stepped portions 206. The at least two stepped portions 206 are provided on both sides of the side wall 208 along the longitudinal direction of the housing structure 2021. Any stepped portion 206 is provided with a metal film that is electrically connected to the base plate, thereby enabling the stepped portion 206 to be electrically connected to the base plate, and thereby achieving an electrical connection between the light-emitting assembly 200 and the substrate 100. The housing structure 2021 further includes a positioning portion 207. The positioning portion 207 is provided in the middle portion of the stepped portion 206 in the width direction of the housing structure 2021, and the positioning portion 207 may function as an identification area. For example, a global coordinate system is constructed using the positioning portions 207 on both sides. The rectangular portion between at least two stepped portions 206 is a circuit isolation area, which makes the electrical connections between at least two stepped portions 206 and the base plate independent of each other. An identification area may be provided on one side of the side wall 208 to identify the orientation and direction of the side wall 208 when attaching the side wall 208 to the substrate 100.

[0082] The laser tip 203 can be soldered to a heat sink by a eutectic process, and the main material of the heat sink is aluminum nitride (ALN), silicon carbide (SiC), etc. The waveguide layer of the laser tip 203 has a small dimension in the high-speed axis direction, the beam quality of the beam output by the laser tip 203 is close to the diffraction limit, and the beam divergence angle is large. In the case of a laser tip 203 with different waveguide layer dimensions in the high-speed axis direction, the beam divergence angle of the beam output by the laser tip 203 may be between 40° and 60°. In the low-speed axis direction, the beam divergence angle of the beam output by the laser tip 203 may be between 6° and 15°, the beam quality is poor, the dimensions of the active region are between 100 μm and 500 μm, and the beam quality is low. Here, the high-speed axis direction and the low-speed axis direction are perpendicular to each other.

[0083] The optical deflection component 204 can deflect the path of the beam emitted by the laser chip 203 by 90° before emission. The material of the optical deflection component 204 may be borosilicate glass, quartz, silicon, etc., and an anti-reflective coating may be provided on the surface of the optical deflection component 204 to increase reflectivity. Because the laser chip 203 has a large divergence angle in the high-speed axis direction, a small portion of the beam emitted by the laser chip 203 does not form effective light and is emitted from the side of the optical deflection component 204, forming a stray light beam.

[0084] Figure 15 is an exploded view of a light-emitting assembly according to several embodiments. In some embodiments, as shown in Figure 15, the light-emitting assembly 200 further includes at least one collimator section 201. At least one collimator section 201 is provided on a cover plate 2022. The collimator section 201 is configured to handle the divergence angle of the beam emitted by the laser tip 203. For example, the collimator section 201 collimates the beam emitted from the laser tip 203. Therefore, the collimator section 201 needs to be designed to match the divergence angle of the laser tip 203 and the optical path length of the light-emitting device 2000. The curvature of the collimator section 201 may be adjusted according to the different characteristics of different light-emitting devices 2000 (for example, one collimator section 201 may have a different curvature), or one collimator section 201 may have a single curvature for ease of processing and cost reduction.

[0085] In some embodiments, the surface shape of the collimating section 201 may be an aspherical shape, a free-form surface shape, or a Fresnel structure may be used to implement a function that compresses the divergence angle. The Fresnel structure is similar to a Fresnel lens. The surface shape parameters of the collimating section 201 are related to the optical path length of the beam. Therefore, in the light-emitting device 2000, the position of the laser tip 203, the position of the optical deflection component 204, and the distance between the cover plate 2022 and the housing structure 2021 must each be set within a predetermined tolerance range. The number of collimating sections 201 may be the same as the number of light-emitting assemblies 200.

[0086] In some embodiments, as shown in Figure 15, at least one collimating section 201 includes multiple collimating sections 201. The collimating sections 201 can be fixed by applying adhesive to the four corners of any collimating section 201, and the adhesive application positions must avoid the optically effective area. The optically effective area can refer to the area in which the collimating section 201 can effectively process and transmit light. After the beam emitted by the laser tip 203 is reflected by the optical deflection component 204, the high-speed axis direction of the laser becomes parallel to the short-side direction of the collimating section 201, and the low-speed axis direction of the laser becomes parallel to the long-side direction of the collimating section 201, at which point the multiple collimating sections 201 are arranged along the length direction of the substrate 100.

[0087] Figure 16 is another configuration diagram of a light-emitting device according to several embodiments. After sealing the gap at the connection between the housing structure 2021 and the cover plate 2022, the packaged light-emitting assembly 200 can be separated. After separating the cover plate 2022 and the housing structure 2021, as shown in Figure 16, when observing the seal region 300, it can be seen that the distribution shape of the intermetallic compounds formed at the first seal portion 2023 is circular. Since the thickness of the intermetallic compounds at the first seal portion 2023 is thicker than in other regions, it can be clearly observed that the region corresponding to the first seal portion 2023 and the region where solder is not filled are represented by different colors.

[0088] The widespread application of miniaturized laser projection equipment has increased the design difficulty of miniaturized light-emitting devices. To reduce the wiring required to interconnect each component within the light-emitting device and save space, multiple laser chips within the device typically employ either anode-common or cathode-common wiring schemes. Here, anode-common wiring means that the anodes of multiple laser chips are connected to the positive terminal of the same power supply, and the cathodes of multiple laser chips are each connected to multiple drive circuits of the light-emitting device. Cathode-common wiring means that the cathodes of multiple laser chips are connected to the negative terminal of the same power supply, and the anodes of multiple laser chips are each connected to multiple drive circuits of the light-emitting device.

[0089] However, using a common anode wiring method makes it difficult to precisely control the input voltage of the laser chip, resulting in power loss and increased risk of damaging the laser chip. While a common cathode wiring method allows for effective control of the input voltage of the laser chip and reduces power consumption, it is difficult to overcome the challenge of increased costs associated with the increased number of drive circuits when it is necessary to operate multiple laser chips simultaneously to increase brightness.

[0090] In related technologies, as shown in Figure 17, a drive circuit board is used to transmit drive signals to the light-emitting device, and a power supply board is used to supply power to the light-emitting device. When the light-emitting device is energized, it emits three colored lasers (e.g., a red laser, a blue laser, and a green laser) in response to the received drive signals. Figure 18 is a circuit diagram when multiple laser chips in the light-emitting device employ an anode common wiring method, and Figure 19 is a circuit diagram when multiple laser chips in the light-emitting device employ a cathode common wiring method. As shown in Figures 18 and 19, one light-emitting device is configured for every three laser chips (e.g., a red laser chip R, a green laser chip G, and a blue laser chip B), and this light-emitting device can emit red, green, and blue lasers. In the figures, R_T, G_T, and B_T (e.g., R_T0, G_T0, B_T0; R_T1, G_T1, B_T1; R_T2, G_T2, B_T2) represent the drive circuits of the light-emitting device. When it is necessary to operate multiple light-emitting devices simultaneously to increase brightness, the number of drive circuits increases as the number of light-emitting devices increases, resulting in increased costs.

[0091] To solve the above problems, some embodiments of the present disclosure provide a light-emitting device. The light-emitting device according to some embodiments of the present disclosure includes a substrate and a light-emitting assembly, the light-emitting assembly being fixed on a connection pattern on the substrate, and any type of laser chip being electrically connected to two corresponding first pads via first wiring, conductive structures, conductive parts, and interconnection areas. This enables individual power supply to laser chips emitting lasers of different colors, solves the problem that the number of laser chips used is limited by the number and cost of drive circuits, allows the number of laser chips to be increased while maintaining the number of drive circuits, effectively improves the work efficiency of the drive circuits, and reduces costs.

[0092] The following describes some embodiments of the light-emitting devices described herein, with reference to the drawings.

[0093] In some embodiments, as shown in Figure 20, the light-emitting device 2000 includes a substrate 100 and a light-emitting assembly 200, the light-emitting assembly 200 being located on one side of the substrate 100. As shown in Figures 21 and 22, the substrate 100 includes at least one connection pattern 13, a plurality of first pads 11, a plurality of interconnection regions 12, and a substrate body 1100. The at least one connection pattern 13, the plurality of first pads 11, and the plurality of interconnection regions 12 are each provided on the substrate body.

[0094] In some embodiments, the multiple interconnection regions 12 are multiple wirings or metal film layers. The multiple second wirings or metal film layers may be provided within the substrate body 1100. To make it clear, in some embodiments, the multiple interconnection regions 12 may be provided on the surface of the substrate body 1100 facing the light-emitting assembly 200. In some embodiments, multiple first pads 11 are electrically connected to at least one connection pattern 13 via multiple interconnection areas 12. The multiple first pads 11 are further connected to a drive circuit and a power supply. For example, the multiple first pads 11 may be connected to the power supply via a connector, a flexible substrate, a glass epoxy substrate, a spring terminal, or the like.

[0095] In some embodiments, the multiple first pads 11 include multiple sets of first pads 11, for example, any set of first pads 11 includes two first pads 11. Any set of first pads 11 includes a positive polarity pad and a negative polarity pad.

[0096] In some embodiments, the multiple sets of first pads 11 satisfy at least one of the following conditions: in the plane on which the substrate 100 exists, all sets of first pads 11 are located on the same side of at least one package and close to the edge of the substrate body; first pads 11 of the multiple sets of first pads 11 with the same polarity are installed adjacent to each other; and first pads 11 of any set of first pads 11 with different polarities are installed adjacent to each other.

[0097] In some embodiments, any first pad 11 is a metal layer and is rectangular.

[0098] In some embodiments, as shown in Figures 21 and 22, one of at least one connection pattern 13 includes a fixing portion 132. The fixing portion 132 is provided on the substrate body and corresponds to the bottom wall of at least one package 202. For example, the fixing portion 132 is electrically connected to the bottom wall of at least one package 202. The light-emitting assembly 200 is placed (e.g., fixed) on the fixing portion 132, the material of the fixing portion 132 may be metal, and the shape of the fixing portion 132 may be rectangular. The connection pattern 13 further includes a conductive portion 131, which is electrically connected to the light-emitting assembly 200. The area marked with a thick black border in Figure 21 is the position where the light-emitting assembly 200 is fixed on the substrate 100. In some embodiments, at least one connection pattern 13 and a plurality of first pads 11 are provided on the surface of the substrate body 1100 facing the light-emitting assembly 200.

[0099] In some embodiments, as shown in Figure 20, the light-emitting assembly 200 includes at least one package 202. Any one of the at least one package 202 includes a bottom wall, a side wall, and a sealing glass (e.g., the cover plate 2022 described above), wherein the bottom wall of the package 202 is parallel to the plane on which the substrate 100 resides, the side wall of the package 202 is perpendicular to the plane on which the substrate 100 resides, and the sealing glass is located on the side of the side wall away from the bottom wall of the package, and the bottom wall, side wall, and sealing glass of the package 202 form a sealing space. The lower surface of the bottom wall of the package 202 is connected to the fixing portion 132. Wiring may be provided on at least one of the bottom wall or side wall of the package 202, and at least one of the bottom wall or side wall of the package 202 may be made of a ceramic material.

[0100] In some embodiments, the side walls of package 202 are made of ceramic, and the bottom walls of package 101 are made of metal.

[0101] In some embodiments, as shown in Figure 23, the light-emitting device 2000 further includes an electrical coupling assembly 400. The electrical coupling assembly 400 is located in an area of ​​the substrate body close to multiple sets of first pads 11, and is electrically connected to the multiple sets of first pads 11, and is configured to be connected to an external electrical signal source. For example, the electrical coupling assembly 400 can be a connector (or pin header).

[0102] In some embodiments, as shown in Figure 20, the light-emitting assembly 200 further includes a first wiring 23, the first wiring 23 being provided on at least one of the side walls or bottom walls of the package 202.

[0103] As shown in Figure 24, the light-emitting assembly 200 further includes a conductive structure 24 and a first metal film 25 (metal film). The conductive structure 24 and the first metal film 25 are provided on the side of the package 202 facing the substrate body (i.e., the lower surface of the bottom wall of the package 202), the position of the conductive structure 24 corresponds to the position of the conductive part 131, and the conductive structure 24 is electrically connected to the conductive part 131 and the first wiring 23. The position of the first metal film 25 corresponds to the position of the fixed part 132, and the first metal film 25 is connected to the fixed part 132.

[0104] In some embodiments, as shown in Figures 20 and 26, the light-emitting assembly 200 further includes a plurality of stepped portions 206. The plurality of stepped portions 206 are provided within an arbitrary package 202 and are located on both sides of the package 202 in the longitudinal direction. For example, as shown in Figure 26, the plurality of stepped portions 206 includes four stepped portions 206, two of which are located within a first package 211 and the remaining two are located within a second package 212. A second metal film is provided on the upper surface of the stepped portion 206 (i.e., the surface of the stepped portion 206 away from the substrate 100), and this second metal film is electrically connected to the conductive structure 24 via a first wiring 23. The first package 211 and the second package 212 will be described later.

[0105] In some embodiments, as shown in Figure 20, the light-emitting assembly 200 further includes a plurality of laser chips 203, which are located within a package 202. For example, the plurality of laser chips 203 are located within a sealing space formed by the bottom wall of the package 202, the side walls of the package 202, and the sealing glass. The plurality of laser chips 203 include laser chips 203 having at least two different emission colors, and any type of laser chip 203 corresponds to a pair of first pads 11.

[0106] Multiple laser chips 203 may each be electrically connected to a conductive structure 24 via a first wiring 23, and the conductive portion 131 is electrically connected to multiple first pads 11 via multiple interconnection regions 12. This enables electrical connection between multiple laser chips 203 and multiple first pads 11.

[0107] Taking the case where the light-emitting assembly 200 includes a first wiring 23 as an example, laser chips 203 of the same type are electrically connected to a corresponding set of first pads 11 via the first wiring 23, conductive structure 24, conductive part 131, and interconnection area 12, thereby enabling power supply for multiple types of laser chips 203.

[0108] For example, as shown in Figure 20, the multiple laser chips 203 include a first type laser chip 221 and a second type laser chip 222, where the first type laser chip 221 emits a blue laser and the second type laser chip 222 emits a red or green laser. Since the first type laser chip 221 is electrically connected to a corresponding pair of first pads 11 and the second type laser chip 222 is electrically connected to another corresponding pair of first pads 11, the substrate 100 includes at least four first pads 11.

[0109] Note that Figure 20 illustrates an example where the light-emitting device 2000 includes two types of laser chips 203, but this is not limited to the light-emitting device 2000. In some other embodiments, the multiple laser chips 203 may further include three types of laser chips 203, each emitting a laser of a different color, and each of these three types of laser chips 203 is electrically connected to three corresponding sets of first pads 11 via a first wiring 23, thereby enabling individual power supply for any one of the three types of laser chips 203. This publication does not limit the types of laser chips 203.

[0110] For example, as shown in Figure 25, the light-emitting device 2000 includes three types of laser chips 203, such as red laser chips (e.g., R, R1, R2), green laser chips (e.g., G, G1, G2), and blue laser chips (e.g., B, B1, B2). The red laser chip can emit a red laser, the green laser chip can emit a green laser, and the blue laser chip can emit a blue laser. Since any type of laser chip 203 is connected in series with its corresponding power supply and drive circuit (e.g., R_T0, G_T0, B_T0), the number of drive circuits can be kept constant regardless of how the number of laser chips 203 increases. This solves the problem of the number of laser chips 203 being limited by the drive circuits, and also effectively improves the operating efficiency of the drive circuits, thereby reducing costs.

[0111] In some embodiments, the substrate 100 can be made of copper, and the substrate 100 is a single-sided printed circuit board (PCB), which allows for sufficient heat dissipation on the back surface of the substrate 100 (i.e., the side of the substrate 100 away from the light-emitting assembly 200), which is advantageous for heat dissipation of the light-emitting device 2000. Furthermore, the substrate 100 can enable individual power supply for any type of laser chip 203 and also satisfy the miniaturization design of the light-emitting device 2000. This disclosure does not limit the dimensions of the substrate 100, and the dimensions of the substrate 100 can be flexibly set as needed. For example, the substrate 100 can be a copper substrate with a width of 15.8 mm, a length of 26 mm, and a thickness of 1.6 mm.

[0112] In some embodiments, when copper is used as the material for the substrate 100, the thickness of the substrate 100 may be 2 ounces (oz) of copper foil, or approximately 70 micrometers.

[0113] In some embodiments, as shown in Figures 21 to 24, in a direction perpendicular to the plane on which the substrate 100 exists, one of the multiple first pads 11 and one of the multiple interconnection regions 12 at least partially overlap, the connection pattern 13 and the multiple interconnection regions 12 at least partially overlap, and the conductive structure 24 and the connection pattern 13 at least partially overlap.

[0114] In a direction perpendicular to the plane on which the substrate 100 exists, there is an overlapping region between the first pad 11 and the interconnection region 12, and this overlapping region is the connection region between the first pad 11 and the interconnection region 12. By increasing the connection area between the first pad 11 and the interconnection region 12, the stability of the electrical connection between the first pad 11 and the interconnection region 12 and the amount of current flowing can be improved. It can be understood that the first pad 11 and the interconnection region 12 overlap at least partially when viewed in a direction perpendicular to the plane on which the substrate 100 exists, either the first pad 11 is within the interconnection region 12 (as shown in Figure 21 or Figure 22), or the first pad 11 and the interconnection region 12 partially overlap, with other areas that do not overlap (e.g., are offset).

[0115] In a direction perpendicular to the plane on which the substrate 100 exists, there is an overlapping region between the connection pattern 13 or conductive part 131 and the interconnection region 12, and this overlapping region is the connection region between the connection pattern 13 or conductive part 131 and the interconnection region 12. By increasing the connection area between the connection pattern 13 or conductive part 131 and the interconnection region 12, the stability of the electrical connection between the connection pattern 13 or conductive part 131 and the interconnection region 12 and the amount of current flowing can be improved. Taking the case where there is an overlapping region between the conductive part 131 and the interconnection region 12 as an example, it can be understood that the conductive part 131 and the interconnection region 12 overlap at least partially when viewed in a direction perpendicular to the plane on which the substrate 100 exists, either the conductive part 131 is within the interconnection region 12 (as shown in Figure 21 or Figure 23), or the conductive part 131 and the interconnection region 12 partially overlap, with some areas of the first pad 131 and the interconnection region 12 not overlapping.

[0116] By installing it in this manner, the first pad 11 can be electrically connected to the connection pattern 13 via the interconnection area 12.

[0117] In a direction perpendicular to the plane on which the substrate 100 exists, the conductive structure 24 and the connection pattern 13 overlap at least partially; that is, an overlapping region exists between the conductive structure 24 and the connection pattern 13, thereby realizing an electrical connection between the conductive structure 24 and the connection pattern 13. The statement that the conductive structure 24 and the connection pattern 13 overlap at least partially means that, in a direction perpendicular to the plane on which the substrate 100 exists, the conductive structure 24 is within the connection pattern 13, or the connection pattern 13 is within the conductive structure 24, or the conductive structure 24 and the connection pattern 13 partially overlap, with some regions not overlapping.

[0118] In some embodiments, as shown in Figures 21 and 22, the multiple first pads 11 are located on the same side of the substrate 100 within the plane in which the substrate 100 resides. This ensures that after the package 202 is placed on the substrate 100, the multiple first pads 11 are also located on the same side of the package 202. This not only ensures miniaturization of the light-emitting device 2000, but also enhances the aesthetic appearance of the light-emitting device 2000 and facilitates manual soldering.

[0119] Of course, in some other embodiments, the multiple first pads 11 may be located on opposing sides of the package 202 in the longitudinal or widthwise direction, which can also enable independent power supply for any type of laser chip 203.

[0120] As shown in Figure 20, the plurality of laser chips 203 include a first type of laser chip 221 and a second type of laser chip 222, and the first type of laser chip 221 emits a blue laser, and the second type of laser chip 222 emits a red or green laser. Of course, in some embodiments, the plurality of laser chips 203 may further include three types of laser chips 203.

[0121] For example, as shown in Figure 26, the multiple laser chips 203 include two first-type laser chips 221, three second-type laser chips 222, and four third-type laser chips 223, each of which emits a laser of a different color. Laser chips 203 of the same type within the same package 202 are connected in series with each other and connected to a corresponding set of first pads 11. The number of first pads 11 electrically connected to the light-emitting assembly 200 is twice the number of types of laser chips 203.

[0122] One type of laser chip 203 emits a laser of one color, while the first type of laser chip 221, the second type of laser chip 222, and the third type of laser chip 223 emit lasers of different colors. For example, the first type of laser chip 221 emits a blue laser, the second type of laser chip 222 emits a green laser, and the third type of laser chip 223 emits a red laser. Alternatively, the first type of laser chip 221 emits a green laser, the second type of laser chip 222 emits a blue laser, and the third type of laser chip 223 emits a red laser.

[0123] In some embodiments, as shown in Figure 26, the wavelength of the laser emitted by the third type laser chip 223 is greater than the wavelength of the lasers emitted by the first type laser chip 221 and the second type laser chip 222. For example, the third type laser chip 223 emits a red laser with an emission wavelength of any value within the range of 622 nm to 760 nm, the first type laser chip 221 emits a blue laser with an emission wavelength of any value within the range of 435 nm to 450 nm, and the second type laser chip 222 emits a green laser with an emission wavelength of any value within the range of 492 nm to 577 nm. In some other embodiments, the first type laser chip 221, the second type laser chip 222, and the third type laser chip 223 may also emit lasers of other colors, but are not limited thereto.

[0124] In some embodiments, as shown in Figure 26, at least one of the multiple laser chips 203 is located within a package 202. Within the same package 202, all laser chips 203 emitting lasers of the same color are connected in series and connected to a corresponding pair of first pads 11.

[0125] For example, as shown in Figure 26, at least one package 202 includes a first package 211 and a second package 212. The first package 211 and the second package 212 are arranged side by side along the length of the light-emitting assembly 200 (for example, the left-right direction in Figure 26).

[0126] In this case, the four third-type laser chips 223 are housed within the first package 211, and the four third-type laser chips 223 are connected in series via a conductor (e.g., gold wire or bonding wire), with both ends of this series circuit electrically connected to the second metal film on the stepped portions 206 on both sides of the third-type laser chip 223. The second metal film is electrically connected to the conductive structure 24 via the first wiring 23, the conductive structure 24 is electrically connected to the conductive portion 131, and the conductive portion 131 is electrically connected to the two corresponding first pads 11 via the interconnection region 12. This enables the electrical connection between the four third-type laser chips 223 and the corresponding pair of first pads 11.

[0127] Two first-type laser chips 221 and three second-type laser chips 222 are housed in a second package 212. The two first-type laser chips 221 are connected in series via a wire, and both ends of this series circuit are electrically connected to two second metal films on the stepped portions 206 on either side. These two second metal films are electrically connected to a conductive structure 24 via a first wiring 23, the conductive structure 24 is electrically connected to a conductive portion 131, and the conductive portion 131 is electrically connected to two corresponding first pads 11 via an interconnection region 12. This enables an electrical connection between the two first-type laser chips 221 and a corresponding pair of first pads 11.

[0128] Three second-type laser chips 222 are connected in series via a conductor, and both ends of this series circuit are electrically connected to a second metal film on another stepped portion 206. These two second metal films are electrically connected to a conductive structure 24 via a first wiring 23, the conductive structure 24 is electrically connected to a conductive portion 131, and the conductive portion 131 is electrically connected to two corresponding first pads 11 via an interconnection region 12. This enables the electrical connection between the three first-type laser chips 221 and a corresponding pair of first pads 11.

[0129] Note that Figure 26 shows an example where multiple packages 202 contain two packages 202, but this disclosure is not limited to this. In some other embodiments, at least one package 202 further contains one package 202, and a first type laser chip 221, a second type laser chip 222, and a third type laser chip 223 are located within the same package 202, or at least one package 202 contains three packages 202, with a first type laser chip 221, a second type laser chip 222, and a third type laser chip 223 corresponding to three packages 202, and laser chips 203 of the same type located within the same package 202, but this disclosure does not limit the number of packages 202.

[0130] In some embodiments, as shown in Figure 21, the plurality of first pads 11 include four sets of first pads 11, where each of the four sets of first pads 11 is a first positive polarity pad (R+) and a first negative polarity pad (R-), a second positive polarity pad (B+) and a second negative polarity pad (B-), a third positive polarity pad (G+) and a third negative polarity pad (G-), and a fourth positive polarity pad (NTC+) and a fourth negative polarity pad (NTC-).

[0131] As shown in Figure 21, the first positive polarity pad (R+) corresponds to the first positive polarity pad 1012, and the first negative polarity pad (R-) corresponds to the first negative polarity pad 1013. The second positive polarity pad (B+) corresponds to the second positive polarity pad 1015, and the second negative polarity pad (B-) corresponds to the second negative polarity pad 1014. The third positive polarity pad (G+) corresponds to the third positive polarity pad 1016, and the third negative polarity pad (G-) corresponds to the third negative polarity pad 1017. The fourth positive polarity pad (NTC+) corresponds to the fourth positive polarity pad 1011, and the fourth negative polarity pad (NTC-) corresponds to the fourth negative polarity pad 1018.

[0132] In some embodiments, as shown in Figure 21, the arrangement order of the eight first pads 11 along the length direction of the substrate 100 (for example, from left to right) is: fourth positive polarity pad (NTC+), first positive polarity pad (R+), first negative polarity pad (R-), second negative polarity pad (B-), second positive polarity pad (B+), third positive polarity pad (G+), third negative polarity pad (G-), and fourth negative polarity pad (NTC-). In this case, the fourth positive polarity pad (NTC+) is adjacent to the first positive polarity pad (R+), the first negative polarity pad (R-) is adjacent to the second negative polarity pad (B-), the second positive polarity pad (B+) is adjacent to the third positive polarity pad (G+), and the third negative polarity pad (G-) is adjacent to the fourth negative polarity pad (NTC-). In this way, by arranging the positions of multiple first pads 11 according to the principle that adjacent pads have the same polarity, it is possible to prevent short circuits between the positive and negative electrodes due to soldering errors. To make it easier to understand, in some embodiments, it is also possible to swap the positions of two first pads 11 in any one set of four sets of first pads 11. For example, the positions of the second negative polarity pad and the second positive polarity pad in Figure 21 may be swapped, and the positions of the third positive polarity pad and the third negative polarity pad may be swapped. In this case, the arrangement order of the eight first pads 11 along the length direction of the substrate 100 (for example, from left to right) would be fourth positive polarity pad, first positive polarity pad, first negative polarity pad, second positive polarity pad, second negative polarity pad, third negative polarity pad, third positive polarity pad, and fourth negative polarity pad.

[0133] This disclosure does not limit the type of the first pad 11. For example, as shown in Figure 21, the first pad 11 may be set to a cross-shaped pad. Of course, the first pad 11 may be set to other types of pads known to those skilled in the art.

[0134] In some embodiments, as shown in Figure 21, the substrate 100 further includes a temperature measuring component (e.g., a thermistor) 4, which is connected to a corresponding set of first pads 11 via a second wiring. The temperature measuring component 4 is configured to detect the heat generation status of the laser chip 203. For example, the temperature measuring component 4 may include, but is not limited to, a negative temperature coefficient (NTC) temperature measuring component or other types of temperature measuring components known to those skilled in the art.

[0135] In some embodiments, the temperature measuring component 4 satisfies at least one of the following conditions: the temperature measuring component 4 is located in the middle of the arrangement direction of multiple sets of first pads 11, and the multiple sets of first pads 11 are symmetrically arranged on both sides of the temperature measuring component 4. As shown in Figures 21 and 27, the temperature measuring component 4 is located on the side of the connection pattern 13 closer to the eight first pads 11, which are symmetrically distributed on both sides of the temperature measuring component 4, and a pair of first pads 11 corresponding to the temperature measuring component 4 (i.e., the fourth positive polarity pad NTC+ and the fourth negative polarity pad NTC-) is located on the outermost side of the multiple first pads 11 (i.e., the two first pads 11 connected to the temperature measuring component 4 are each located on either side of the other first pad 11), and the temperature measuring component 4 is electrically connected to the fourth positive polarity pad (NTC+) and the fourth negative polarity pad (NTC-) via the corresponding interconnection region 12. The circuit of the temperature measuring component 4 is shown in Figure 27. In Figure 27, TP1 represents the fourth positive polarity pad (NTC+), and TP8 represents the fourth negative polarity pad (NTC-).

[0136] In some embodiments, as shown in Figure 24, the conductive structure 24 includes a plurality of second pads 241, the second pads 241 being connected to the first wiring 23. The plurality of second pads 241 are positioned corresponding to the side walls of at least one package 202. For example, the plurality of second pads 241 correspond to the side walls of at least one package 202. Correspondingly, as shown in Figures 21 and 22, in a direction perpendicular to the plane on which the substrate 100 exists, the conductive portion 131 includes a plurality of third pads 1311, any one of the plurality of third pads 1311 at least partially overlaps with the interconnection region 12.

[0137] In this case, multiple third pads 1311 and multiple second pads 241 are electrically connected in correspondence, and the multiple third pads 1311 are further electrically connected to multiple first pads 11 via interconnection regions 12. The second pads 241 are connected to first wiring 23 by soldering, and are connected to the corresponding laser chips 203 via this first wiring 23. Furthermore, multiple laser chips 203 emitting the same laser within the same package 202 are connected in series. This allows for individual power supply to laser chips 203 of any color, avoiding an increase in the number of drive circuits due to an increase in the number of laser chips 203, which is advantageous for cost reduction.

[0138] In some embodiments, if at least one package 202 includes a first package 211 and a second package 212, and a plurality of laser chips 203 include a first type laser chip 221, a second type laser chip 222, and a third type laser chip 223, and the third type laser chip 223 is provided in the first package 211 and the first type laser chip 221 and the second type laser chip 222 are provided in the second package 212, then the conductive structure 24 includes eight second pads 241, and any package 202 is also provided with four second pads 241 arranged side by side, and these four second pads 241 are provided in close proximity to the first pad 11.

[0139] Two second pads 241 on the second package 212 are connected to a first pair of first pads 11, and two other second pads 241 on the second package 212 are connected to a second pair of first pads 11. Two second pads 241 on the first package 211 that are far from the second package 212 are connected to a third pair of first pads 11, and one of the other two adjacent second pads 241 on the first package 211 that is closer to the second package 212 is electrically connected to the second pad 241 on the second package 212 that is closer to the first package 211.

[0140] In this case, a first metal film 25 is further provided on the side of the first package 211 and the second package 212 facing the substrate 100, and the first metal film 25 is connected in correspondence with the fixing portion 132, and the multiple second pads 241 and the multiple third pads 1311 are electrically connected in correspondence with each other. This makes it possible to fix and electrically connect the light-emitting assembly 200 and the substrate 100.

[0141] As shown in Figures 21, 22, and 26, the method of fixing and electrically connecting the first package 211 and the second package 212 to the substrate 100 is such that the fixing portion 132 of the right-hand connection pattern 13 is fixedly connected to the first metal film 25 on the substrate 100 side of the second package 212, and the four third pads 1311 corresponding to the four second pads 241 of the second package 212 are positioned close to the first pads 11. Two of the four third pads 1311 are connected to a pair of first pads 11 via an interconnection region 12, and the other two third pads 1311 are connected to another pair of first pads 11 via an interconnection region 12.

[0142] The fixing portion 132 of the left-side connection pattern 13 is fixedly connected to the first metal film 25 on the substrate 100 side of the first package 211, and the four third pads 1311 corresponding to the four second pads 241 of the first package 211 are positioned close to the first pads 11. Of the four third pads 1311, the two third pads 1311 that are away from the right-side connection pattern 13 are connected to a pair of third pads 1311 via an interconnection region 12, and of the other two third pads 1311 (the two third pads 1311 numbered 3 and 4 in Figure 22), at least one of the third pads 1311 closer to the right is connected via the same interconnection region 12 to the third pad 1311 of the right-side connection pattern 13 that is closest to the left-side first package 211 (for example, the third pad 1311 numbered 5 in Figure 22).

[0143] For example, as shown in Figure 28, the third pads 1311 numbered 3 and 4 are electrically connected to the third pad 1311 numbered 5 via the interconnection area 12. Also, as shown in Figure 29, the third pad 1311 numbered 4 is electrically connected to the third pad 1311 numbered 5 via the interconnection area 12. Note that the connection pattern 13 on the right corresponds to the second package 212, and the connection pattern 13 on the left corresponds to the first package 211, with the third pad 1311 numbered 3 being electrically connected to the third pad 1311 numbered 2 via the interconnection area 12.

[0144] If positioning holes need to be provided in the substrate 100, and the distance between the package 202 and the positioning holes 14 (for example, as shown in Figures 28-29) is compressed to 0.5 mm or less, the area between the package 202 and the positioning holes is unsuitable for wiring. Therefore, in some embodiments of this disclosure, the second pad 241 is provided in an area of ​​the package 202 close to the first pad 11, and the second pad 241 may be electrically connected to the corresponding first pad 11 via a third pad 1311 close to the first pad 11 and an interconnection area 12.

[0145] In some other embodiments, the second pad 241 is located in a region of the package 202 away from the first pad 11, provided that the spacing between the positioning hole and the package 202 and the spacing between two packages 202 satisfy the minimum wiring width. In this case, an interconnection region 12 may be provided in at least one of the regions on the substrate 100 between the positioning hole and the package 202, or between two packages 202 on the substrate 100. This allows the third pad 1311, which is in close proximity to each other, to be electrically connected to the first pad 11 by being connected via the interconnection region 12, thereby increasing the wiring width and increasing the amount of current that can flow.

[0146] The following describes the various electrical connection relationships between the light-emitting assembly 200 and the substrate 100, using as an example a case where the substrate 100 includes eight first pads 11, at least one package includes two packages, and the multiple laser chips include laser chips that emit three different colored lasers.

[0147] As shown in Figure 26, the eight first pads 11 are located on the same side of the two packages 202, and each package 202 is provided with four second pads 241 close to the first pads 11. The substrates corresponding to the first package 211 and the second package 212 are shown in Figure 21 or Figure 23. Correspondingly, the conductive portion 131 includes eight third pads 1311. To clarify the correspondence between the laser chip 203, the second pads 241, the third pads 1311 and the first pads 11, as shown in Figures 21 and 22, the eight third pads 1311 close to the first pads 11 are numbered 1 to 4, the four third pads 1311 corresponding to the four second pads 241 on the first package 211 are numbered 5 to 8, and the four third pads 1311 corresponding to the four second pads 241 on the second package 212 are numbered 5 to 8. Note that there are two sets of numbers 1 to 8 in Figures 21 and 22. This is to show that the second package 212 is obtained by rotating the first package 211 180° clockwise, and the eight third pads 1311 numbered 1 to 8 above refer to a set of numbers 1 to 8 of the first pad 11 that are close to the first pad 11 in Figures 21 and 22.

[0148] The first type laser chip 221 emits a blue laser, the second type laser chip 222 emits a green laser, and the third type laser chip 223 emits a red laser. Multiple third type laser chips 223 are packaged in a first package 211, and the third type laser chips 223 are electrically connected to two corresponding second pads 241 via first wiring 23 of the first package 211. These two second pads 241 are connected to two corresponding third pads 1311 (third pads 1311 numbered 1 and 2). Third pad 1311 numbered 1 is connected to the first positive polarity pad (R+) via interconnection region 12, and third pad 2 numbered 2 is connected to the first negative polarity pad (R-) via interconnection region 12.

[0149] Multiple first-type laser chips 221 and multiple second-type laser chips 222 are housed in a second package 212. The first-type laser chips 221 are electrically connected to two corresponding second pads 241 via first wiring 23 in the second package 212. These two second pads 241 are connected to two corresponding third pads 1311 (third pads 5 and 6). Third pad 5 1311 is connected to a second negative polarity pad (B-) via an interconnection area 12, and third pad 6 1311 is connected to a second positive polarity pad (B+) via an interconnection area 12. The second-type laser chips 222 are electrically connected to two corresponding second pads 241 via first wiring 23 in the second package 212. These two second pads 241 are connected to two corresponding third pads 1311 (third pads 7 and 8). The third pad 1311 numbered 7 is connected to the third positive polarity pad (G+) via the interconnection region 12, and the third pad 1311 numbered 8 is connected to the third negative polarity pad (G-) via the interconnection region 12.

[0150] Based on the above structure, the third pad 1311 number 3, the third pad 1311 number 4, and the third pad 1311 number 5 may have multiple connection methods.

[0151] In some embodiments, as shown in Figures 21 and 28, due to the limitations of wiring space and the addition of temperature measuring component 4, wiring between the third pad 1311 (third pad 1311 number 5) and the second negative polarity pad (B-) may reduce the area of ​​other wiring or cause the wiring to overlap with the temperature measuring component 4 and short-circuit. Therefore, the third pad 1311 number 3, the third pad 1311 number 4, and the third pad 1311 number 5 may be electrically connected to the second negative polarity pad (B-) via the same interconnection region 12. For example, the second negative polarity pad (B-) is connected to the three third pads 1311 numbers 3, 4, and 5 via the corresponding interconnection region 12. This arrangement allows for increasing the wiring width and thus the amount of current flowing, improving the light emission intensity of the laser chip 203, while simultaneously simplifying the structure of the light-emitting device 2000 without affecting the position of the temperature measuring component 4 and the first pad 11.

[0152] In some embodiments, as shown in Figure 29, the third pad 4 1311 and the third pad 5 1311 may be electrically connected to the second negative polarity pad (B-) via the same interconnection region 12. The third pad 5 1311 is connected to the second pad 241 at the bottom of the second package 212, which is connected to the negative electrode of the blue laser chip, thereby achieving an electrical connection between the blue laser chip and the second negative polarity pad (B-). In this case, the third pad 3 1311 and the third pad 2 1311 may be electrically connected to the first negative polarity pad (R-) via the same interconnection region 12. The third pad 2 1311 is connected to the second pad 241 at the bottom of the second package 211, which is connected to the negative electrode of the red laser chip, thereby achieving an electrical connection between the red laser chip and the first negative polarity pad (R-). By installing them in this manner, the wiring width between the first negative polarity pad (R-) and the second negative polarity pad (B-) is doubled, increasing the amount of current that flows and improving the light emission intensity of the laser chip 203. On the other hand, the positions of the temperature measuring component 4 and the first pad 11 are not affected, and the structure of the light emission device 2000 can be simplified.

[0153] In some embodiments, taking the orientation shown in Figure 28 or Figure 29 as an example, the position where the temperature measuring component 4 is located may be used as a boundary line, with the first positive polarity pad (R+) and the first negative polarity pad (R-) placed only to the left of the temperature measuring component 4, and the second negative polarity pad (B-), second positive polarity pad (B+), third positive polarity pad (G+), and third negative polarity pad (G-) placed to the right of the temperature measuring component 4. Accordingly, the positions of the multiple third pads 1311 and the multiple second pads 241 are aligned to ensure a uniform wiring width.

[0154] For example, as shown in Figure 30, the fourth positive polarity pad (NTC+) and the fourth negative polarity pad (NTC-) may be located to the left of the temperature measuring component 4, respectively. With this arrangement, the second pad 241 of any package 202 may be directly electrically connected to the first pad 11 adjacent to that second pad 241, but the wiring between the first pad 11 and the temperature measuring component 4 will need to be readjusted. For example, the space on the underside of the substrate 100 (for example, the portion of the substrate 100 located on the side of the multiple first pads 11 away from the package 202) will need to be increased to accommodate the wiring between the first pad 11 and the temperature measuring component 4. Alternatively, the fourth positive polarity pad (NTC+) and the fourth negative polarity pad (NTC-) may be located on the left and right sides of the temperature measuring component 4, in which case the number of first pads 11 on each side of the temperature measuring component 4 will be different.

[0155] In some embodiments, where space requirements for the temperature measuring component 4 do not need to be considered, the third pad 1311 corresponding to any type of laser chip 203 can be aligned with the position of the second pad 241 on the package 202 and evenly distributed, but this disclosure is not limited thereto.

[0156] For example, as shown in Figure 31, Figure 31 is a circuit diagram corresponding to the light-emitting device 2000 shown in Figure 21 or Figure 28, where U1 represents the first package 211 and U2 represents the second package 212. The structure of the first package 211 and the second package 212 is the same, and U2 is U1 rotated 180° clockwise. Pin 1 of U1 is connected to TP2, and pin 2 of U1 is connected to TP3. Pins 3 and 4 of U1 and pin 5 of U2 are connected to TP4, respectively. Pin 6 of U2 is connected to TP5, pin 7 of U2 is connected to TP6, and pin 8 of U2 is connected to TP7. Pins 1 to 4 of U1 correspond to four third pads 1311 numbered 1 to 4, respectively, and pins 5 to 8 of U2 correspond to four third pads 1311 numbered 5 to 8, respectively. TP2 corresponds to the first positive polarity pad (R+), TP3 corresponds to the first negative polarity pad (R-), TP4 corresponds to the second negative polarity pad (B-), TP5 corresponds to the second positive polarity pad (B+), TP6 corresponds to the third positive polarity pad (G+), and TP7 corresponds to the third negative polarity pad (G-).

[0157] In some embodiments, as shown in Figure 32, if at least one package 202 includes a first package 211 and a second package 212, the first package 211 and the second package 212 may be arranged along direction Y. The light-emitting assembly 200 further includes a lens 8 (e.g., a collimating portion 201), which is located on the side of the package 202 away from the substrate 100. The first package 211 and the second package 212 are provided with a laser chip 203 and a reflective prism 5 (e.g., an optical deflection component 204), respectively, where the laser chip 203 emits a laser along direction Y or the opposite direction of direction Y, the laser is incident on the reflective surface of the reflective prism and reflected, and the reflected laser passes through at least one of the optical window (e.g., the sealing glass described above) or the lens 8 and exits from the light-emitting assembly 200, where direction Y is the direction from right to left in Figure 26.

[0158] In some embodiments, as shown in Figure 32, the light-emitting assembly 200 further includes at least one cover plate 2022 (e.g., the light window or sealing glass described above), which is also called a light-transmitting glass sealing member. The light-transmitting glass sealing member is located on the side of the package 202 away from the substrate 100, and the package 202 and the light-transmitting glass sealing member form a housing space, which houses at least one of several types of laser chips.

[0159] In some other embodiments, the light-emitting device 2000 may further include other devices known to those skilled in the art, such as a heat sink 6, but is not limited to these embodiments.

[0160] As shown in Figures 33 to 35, a plurality of third-type laser chips 223 are provided within the first package 211, and the plurality of third-type laser chips 223 are connected in series with each other. The negative and positive terminals of the plurality of third-type laser chips 223 are connected to a second pad 241 provided at the bottom of the first package 211 via wiring (e.g., first wiring 23) within the first package 211. The second pad 241 is electrically connected to a third pad 1311 of the substrate 100, and the third pad 1311 is electrically connected to the first pad 11 via an interconnection region 12. This realizes an electrical connection between the third-type laser chip and the substrate 100. The wiring within the first package 211 may be located within at least one of the side walls and the bottom wall of the package 202.

[0161] As shown in Figures 36 to 38, the second package 212 contains a plurality of first-type laser chips 221 and a plurality of second-type laser chips 222. The plurality of first-type laser chips 221 are connected in series with each other, and the plurality of second-type laser chips 222 are connected in series with each other, while the series circuits of the plurality of first-type laser chips 221 and the series circuits of the plurality of second-type laser chips 222 are independent of each other. The positive and negative terminals of the first-type laser chips 221 are electrically connected to the second pad 241 at the bottom of the second package 212 via wiring within the second package 212. The second pad 241 is electrically connected to the third pad 1311 of the substrate 100, and the third pad 1311 is electrically connected to the corresponding first pad 11 via the interconnection region 12. The positive and negative terminals of the second-type laser chips 222 are electrically connected to the second pad 241 at the bottom of the second package 212 via wiring within the second package 212. The second pad 241 is electrically connected to the third pad 1311 of the substrate 100, and the third pad 1311 is connected to the corresponding first pad 11 via the interconnection region 12. This enables the electrical connection between the first type laser chip 221 and the substrate 100, and the electrical connection between the second type laser chip 222 and the substrate 100. The wiring within the second package 212 (e.g., the first wiring 23) may be located within at least one of the side walls and the bottom wall of the package 202.

[0162] In some embodiments, as shown in Figures 39 to 41, one type of laser chip 203 is provided in one of the packages 202, and the arrangement direction of the multiple packages 202 is the same as the arrangement direction of the multiple first pads 11. In any package 202, at least two second pads 241 are provided side by side on the side facing the substrate 100, and these at least two second pads 241 are provided in close proximity to the first pads 11, and each of these at least two second pads 241 is connected to a pair of first pads 11.

[0163] In some examples, the light-emitting device 2000 includes three packages 202, and each type of laser chip 203 is individually packaged within one package 202. That is, multiple laser chips 203 within one package 202 have the same emitted color and are connected in series with each other. For example, all first-type laser chips 221 are located within the same package 202 and are connected in series with each other; all second-type laser chips 222 are located within the same package 202 and are connected in series with each other; and all third-type laser chips 223 are located within the same package 202 and are connected in series with each other. Multiple first pads 11 are located on the same side of the three packages 202, and the multiple first pads 11 and the multiple packages 202 are arranged along the same direction. Each package 202 is provided with two second pads 241 close to the first pad 11, and the arrangement direction of these two second pads 241 is the same as the arrangement direction of the multiple first pads 11. The two second pads 241 of each package 202 are electrically connected to a corresponding pair of first pads 11.

[0164] In this case, as shown in Figures 40 to 41, the substrate 100 includes three connection patterns 13 corresponding to three packages 202, each connection pattern 13 including two third pads 1311, these two third pads 1311 are close to multiple sets of first pads 11, and each third pad 1311 is electrically connected to the corresponding first pad 11 via an interconnection area 12. These two third pads 1311 are connected to multiple second pads 241 of the package 202 (as shown in Figure 42), and the second pads 241 are electrically connected to the laser chip 203 located inside the package 202 via first wiring 23, thereby achieving an electrical connection between the laser chip 203 and the corresponding first pad 11.

[0165] For example, as shown in Figures 40 and 41, the leftmost of the three packages 202 is used to package a red laser chip, and its two corresponding second pads 241 are connected to the first positive polarity pad (R+) and the first negative polarity pad (R-) via the third pad 1311 and the interconnection area 12, respectively. The middle of the three packages 202 is used to package a blue laser chip, and its two corresponding second pads 241 are connected to the second negative polarity pad (B-) and the second negative-positive polarity pad (B+) via the third pad 1311 and the interconnection area 12, respectively. The rightmost of the three packages 202 is used to package a blue laser chip, and its two corresponding second pads 241 are connected to the third negative polarity pad (G+) and the third negative-positive polarity pad (G-) via the third pad 1311 and the interconnection area 12, respectively.

[0166] In some other embodiments, as shown in Figure 42, the first portion of the plurality of second pads 241 on the package 202 may be located close to the first pad 11, and the second portion of the plurality of second pads 241 on the package 202 may be located away from the first pad 11. Correspondingly, the first portion of the plurality of third pads 1311 provided on the substrate body may be located close to the first pad 11, and the second portion of the plurality of third pads 1311 provided on the substrate body may be located away from the first pad 11. If the spacing between the positioning holes and the package 202, and the spacing between the plurality of packages 202, satisfies the minimum wiring width, the interconnection region 12 may be located between the positioning holes and the package 202, or between the plurality of packages 202. In this way, the plurality of third pads 1311 located away from the first pad 11 can be electrically connected to the plurality of third pads 1311 located close to the first pad 11, thereby increasing the wiring width and increasing the current flow.

[0167] In some embodiments, as shown in Figures 43 to 45, if at least one package 202 includes one package 202, then three types of laser chips 203 (i.e., a first type of laser chip 221, a second type of laser chip 222, and a third type of laser chip 223) may be provided within the package 202. The package 202 is provided with six second pads 241, four of which are arranged side by side and located close to the first side of the package 202. Here, the first side is the side of the package 202 closest to the first pad 11. The remaining two second pads 241 are located close to the second and third sides of the package 202, adjacent to the first side, respectively.

[0168] For example, as shown in Figure 45, the first type laser chip 221, the second type laser chip 222, and the third type laser chip 223 are located within the same package 202, the three laser chips 203 are arranged from left to right, and each is electrically connected to the wiring (e.g., the first wiring 23) within the package 202 via a conductor. For example, the third type laser chip 223 is a red laser chip, the first type laser chip 221 is a blue laser chip, and the second type laser chip 222 is a green laser chip. As shown in Figure 45, the light-emitting assembly 200 further includes an anti-static device 7. The blue and green laser chips are required to be provided with the anti-static device 7, but since the material of the red laser chip has strong anti-static capabilities, the anti-static device 7 may be omitted for the red laser chip.

[0169] As shown in Figure 45, the light-emitting assembly 200 further includes a plurality of reflective prisms 5 and a plurality of heat sinks 6, the plurality of laser chips 203 and a plurality of antistatic devices 7 are provided on the side of the heat sink 6 away from the substrate 100, the plurality of reflective prisms 5 are located on the light-emitting side of the plurality of laser chips 203, and the reflective surfaces of the plurality of reflective prisms 5 are aligned with the plurality of laser chips 203. The plurality of laser chips 203 may be provided corresponding to each of the plurality of heat sinks 6, and multiple laser chips 203 with the same emission color may be provided on the same heat sink 6, but this is not limited to the present disclosure.

[0170] As shown in Figures 46 and 47, the side of the package 202 closest to the first pad 11 is the first side, and the second and third sides are located on the left and right sides of the first side, respectively, and are adjacent to the first side. The package 202 is provided with six second pads 241, four of which are installed side by side and are located close to the first side of the package 202, and two of which are located close to the second and third sides of the package 202, respectively.

[0171] Correspondingly, as shown in Figure 44, four third pads 1311 are provided on the side of the connection pattern 13 closest to the first pad 11 (corresponding to the first side of the package 202), and one third pad 1311 is provided on the left and right sides corresponding to these four third pads 1311 (corresponding to the second and third sides of the package 202). These six third pads 1311 are connected to six second pads 241, and each of these six third pads 1311 is electrically connected to the corresponding first pad 11 via the interconnection area 12, thereby realizing a corresponding connection between the six second pads 241 and the six first pads 11.

[0172] The connection relationships between the six second pads 241 and the six first pads 11 are as follows:

[0173] As shown in Figures 44 and 47, the second pad 241 closer to the second side (for example, the left side of package 202) is electrically connected to the third pad 1311 numbered 1, and the third pad 1311 numbered 1 is electrically connected to the first positive polarity pad (R+) via the interconnection region 12. In this case, at least one of the third pads 9 or 10 and the third pad 1311 numbered 1 may be electrically connected to the first positive polarity pad (R+) via the same interconnection region 12.

[0174] The first second pad 241 on the left end of the first side is electrically connected to the third pad 1311 numbered 2, and the third pad 1311 numbered 2 is electrically connected to the first negative polarity pad (R-) via the interconnection area 12. The second second pad 241 on the left end of the first side is electrically connected to the third pad 1311 numbered 3, and the third pad 1311 numbered 3 is electrically connected to the second negative polarity pad (B-) via the interconnection area 12. The second second pad 241 on the right end of the first side is electrically connected to the third pad 1311 numbered 4, and the third pad 1311 numbered 4 is electrically connected to the second positive polarity pad (B+) via the interconnection area 12. The first second pad 241 on the right end of the first side is electrically connected to the third pad 1311 numbered 5, and the third pad 1311 numbered 5 is electrically connected to the third positive polarity pad (G+) via the interconnection area 12.

[0175] The second pad 241 closest to the third side is electrically connected to the third pad 1311 numbered 6, and the third pad 1311 numbered 6 is electrically connected to the third negative polarity pad (G-) via the interconnection region 12. In this case, at least one of the third pads 1311 numbered 7 or 8, and the third pad 1311 numbered 6, may be electrically connected to the third positive polarity pad (G-) via the same interconnection region 12.

[0176] Of course, in some other embodiments, the first positive polarity pad (R+) may be further connected via interconnection region 12 to at least one of the third pads 1311 numbered 1, 10, or 9, and similarly, the third negative polarity pad (G-) may be connected via interconnection region 12 to at least one of the third pads 6, 7, and 8. The above structure may be configured depending on the relative position and size of the substrate 100, package 202, and positioning holes, but is not limited to this disclosure.

[0177] In some embodiments, as shown in Figures 46 and 47, the package 202 is provided with four second pads 241 near the fourth side of the package 202, these four second pads 241 are arranged side by side, and the fourth side is facing the first side. Two of these four second pads 241 are connected to two corresponding third pads 1311, these two third pads 1311 are connected to one third pad 1311 via the same interconnection area 12, and this third pad 1311 is connected to a second pad 241 near the second side. The other two of these four second pads 241 are connected to two corresponding third pads 1311, these two third pads 1311 are connected to one third pad 1311 via the same interconnection area 12, and this third pad 1311 is connected to a second pad 241 near the third side.

[0178] The fourth side of package 202 is the side away from the first pad 11, and four second pads 241 are provided close to the fourth side. Correspondingly, as shown in Figure 44, the connection pattern 13 further includes four third pads 1311 (for example, third pads 7, 8, 9, and 10), which are electrically connected to the four second pads 241 that are away from the first pad 11 and closer to the fourth side.

[0179] The two third pads 1311 numbered 9 and 10 are electrically connected to one third pad 1311 (the third pad 1311 numbered 1) located to the left of the adjacent connection pattern 13, and the three third pads 1311 numbered 1, 9 and 10 are electrically connected to the first positive polarity pad (R+) via the same interconnection area 12, thereby enabling the two second pads 241 closer to the fourth side of the package 202 to be connected to the second pad 241 closer to the second side of the package 202 via the same interconnection area 12. The two third pads 1311 numbered 7 and 8 are electrically connected to one third pad 1311 (the third pad 1311 numbered 6) located to the right of the adjacent connection pattern 13, thereby enabling the three third pads 1311 numbered 6, 7, and 8 to be electrically connected to the third negative polarity pad (G-) via the same interconnection area 12. This also enables two other second pads 241 closer to the fourth side of the package 202 to be connected to the second pads 241 closer to the third side of the package 202 via the same interconnection area 12.

[0180] By configuring it in this way, the first positive polarity pad (R+) and the third negative polarity pad (G-) are each connected to three third pads 1311, which increases the width of the interconnection region 12 and is advantageous for improving current capacity.

[0181] Figures 44 and 46 show an example where multiple third pads 1311 that are separated from the first pad 11 are grouped into pairs, i.e., third pads 9 and 10 are grouped together, third pads 7 and 8 are grouped together, and third pads 9 and 10 are electrically connected to third pad 1311, and third pads 7 and 8 are electrically connected to third pad 6. However, this does not limit the light-emitting device 2000.

[0182] In some other embodiments, at least one of the four third pads 1311 (third pads 7, 8, 9, and 10) corresponding to the fourth side of package 202 may be electrically connected to third pad 1311 number 1, and at least one of the remaining third pads 1311 may be electrically connected to third pad 6 number 6. For example, the third pads 1311 of numbers 8, 9, and 10 are electrically connected to the third pad 1311 of number 1, and the third pad 1311 of number 7 is electrically connected to the third pad 1311 of number 6, or the third pad 1311 of number 10 is electrically connected to the third pad 1311 of number 1, and the third pads 1311 of numbers 7, 8, and 9 are electrically connected to the third pad 1311 of number 6, or the third pads 1311 of numbers 7, 8, 9, and 10 are electrically connected to the third pad 1311 of number 1, or the third pads 1311 of numbers 7, 8, 9, and 10 are electrically connected to the third pad 1311 of number 6, and so on, but are not limited to these disclosures.

[0183] In some embodiments, the width of one side of the first pad 11 in the plane on which the substrate 100 exists is a value within the range of 1.3 mm to 1.7 mm. For example, the width of one side of the first pad 11 is 1.3 mm, 1.4 mm, 1.5 mm, 1.6 mm, or 1.7 mm. Along the alignment direction of the multiple first pads 11, the spacing between two adjacent first pads 11 is a value within the range of 0.8 mm to 1.2 mm. For example, the spacing between two adjacent first pads 11 is 0.8 mm, 0.9 mm, 1.0 mm, 1.1 mm, or 1.2 mm. Here, the width of one side refers to the distance from the reference line of the structure (e.g., the center line or reference plane) to the boundary on one side.

[0184] In some embodiments, the width of the long side of the third pad 1311 in the plane where the substrate 100 is located is one of the values ​​within the range of 1.1 mm to 1.5 mm. For example, the width of the long side of the third pad 1311 is 1.1 mm, 1.2 mm, 1.3 mm, 1.4 mm, or 1.5 mm. The width of the short side of the third pad 1311 is one of the values ​​within the range of 0.4 mm to 0.8 mm. For example, the width of the short side is 0.4 mm, 0.5 mm, 0.6 mm, 0.7 mm, or 0.8 mm. Along the arrangement direction of the multiple first pads 1311, the spacing between two adjacent first pads 1311 is one of the values ​​within the range of 0.1 mm to 0.5 mm. For example, the spacing between two adjacent first pads 1311 is 0.1 mm, 0.2 mm, 0.3 mm, 1.1 mm, or 1.2 mm.

[0185] This disclosure does not limit the dimensions of package 202 (including, for example, the length and width of package 202), and the dimensions of package 202 may be set according to the requirements of the light-emitting device 2000. For example, the dimensions of package 202 are 10.6 mm in length and 6.4 mm in width.

[0186] Some embodiments of this disclosure further provide a method for manufacturing a light-emitting device. This method may be applied to manufacture any of the light-emitting devices 2000 of the above embodiments. Figure 48A is a flowchart of a method for manufacturing a light-emitting device according to some embodiments. As shown in Figure 48A, the method includes steps 901 to 905.

[0187] Step 901 provides a laser chip, a housing structure, a cover plate, and a plurality of first sealing parts.

[0188] In step 902, the laser chip is installed inside the housing structure.

[0189] In step 903, multiple first sealing portions are installed on the side of the cover plate facing the housing structure, and two adjacent first sealing portions are spaced apart.

[0190] In step 904, the housing structure and the cover plate are connected via multiple first sealing portions, and any two adjacent first sealing portions contact each other to connect the housing structure and the cover plate, thereby sealing the gap at the connection between the housing structure and the cover plate and forming the light-emitting assembly.

[0191] In step 905, the light-emitting assembly is electrically connected to the substrate.

[0192] In some embodiments, the method further includes the step of installing a second seal portion on the side of the cover plate facing the housing structure before providing a plurality of first seal portions on the cover plate.

[0193] Figure 48B is another flowchart of a method for manufacturing a light-emitting device according to some embodiments. In some embodiments, the method further includes step 913, as shown in Figure 48B.

[0194] In step 913, multiple first seal sections are connected to the second seal section.

[0195] Figure 49 is another flowchart of a method for manufacturing a light-emitting device according to some embodiments. In some embodiments, as shown in Figure 49, step 904 includes steps 9041 and 9042.

[0196] In step 9041, multiple first seal portions are heated and melted.

[0197] In step 9042, multiple first seals are connected to the housing structure simultaneously, and pressure is applied to the multiple first seals to bring adjacent first seals into contact with each other, thereby sealing the gap at the connection between the housing structure and the cover plate.

[0198] Figure 50 is another flowchart of a method for manufacturing a light-emitting device according to some embodiments. In some embodiments, as shown in Figure 50, step 913 includes steps 9131 and 9132.

[0199] In step 9131, the number of first seals, the distance between any two adjacent first seals in a plurality of first seals, and the radius of the first seals are determined.

[0200] In step 9132, the multiple first seals are connected to the second seal according to the number of first seals, the distance between any two adjacent first seals in the multiple first seals, and the radius of the first seals. Detailed explanations regarding the structure and connection method of the first seal section, the second seal section, the laser tip, the housing structure, and the cover plate can be found in the relevant information of the aforementioned light-emitting device 2000 and will not be repeated here.

[0201] The manufacturing method and operating principle of some embodiments of the light-emitting device described herein will be explained below with reference to the drawings. Note that the manufacturing methods in some embodiments of this disclosure are illustrative only, and some steps in the methods may be interchangeable. In some embodiments of this disclosure, the manufacturing process for all possible components of the light-emitting device may not be described in detail, and for the sake of brevity, redundant descriptions of components not illustrated should be considered omitted.

[0202] First, a laser chip 203, a housing structure 2021, a cover plate 2022, and a plurality of first sealing parts 2023 and second sealing parts 2024 are provided.

[0203] Figure 51 is a diagram showing the configuration of a cover plate and a second seal portion according to several embodiments. As shown in Figure 51, a second seal portion 2024 is provided in the second seal region corresponding to the side of the cover plate 2022 facing the housing structure 2021. The second seal portion 2024 may be used to connect the first seal portion 2023. For example, a metallization layer is formed in the second seal region. The cover plate 2022 is connected to the housing structure 2021 to form a package 202 and is used to seal the laser chip inside the package 202. The material of the cover plate 2022 may be high-strength sapphire, or quartz, glass, etc. The second seal portion 2024 is provided around the cover plate 2022, the other areas of the cover plate 2022 are translucent areas, and the second seal portion 2024, in combination with the first seal portion 2023, achieves high airtightness.

[0204] Figure 52 is a diagram showing the configuration of a cover plate, a plurality of first seal portions, and a second seal portion according to several embodiments. As shown in Figure 52, the number of first seal portions 2023, the distance between any two adjacent first seal portions 2023 from the plurality of first seal portions 2023, and the radius of the first seal portions 2023 are determined according to the dimensions of the package 202, and the plurality of first seal portions 2023 are connected to the second seal portion 2024 according to the number of first seal portions 2023, the distance between any two adjacent first seal portions 2023 from the plurality of first seal portions 2023, and the radius of the first seal portions 2023.

[0205] Subsequently, as shown in Figure 13, elements or structures such as a laser chip 203, an optical deflection component 204, and a heat sink are installed within the housing structure 2021. The laser chip 203 is configured to emit a laser, and the optical deflection component 204 is configured to change the direction of the laser. For example, the optical deflection component 204 is a reflective prism. The heat sink is configured to dissipate heat generated by the laser chip 203 by conducting it.

[0206] Figure 53 is another configuration diagram of a light-emitting assembly according to some embodiments. As shown in Figure 53, the fabricated cover plate 2022 and the housing structure 2021 are aligned, and the cover plate 2022 is placed over the housing structure 2021. Then, the first seal portion 2023 is heated, and pressure is applied to the cover plate 2022. The multiple first seal portions 2023 change their shape under the action of the pressure, filling the seal area 300 and completing the seal between the cover plate 2022 and the housing structure 2021.

[0207] Figure 54 is another configuration diagram of a light-emitting device according to several embodiments. As shown in Figure 54, the light-emitting assembly 200 is electrically connected to the substrate 100 to complete the manufacturing of the light-emitting device 2000. The substrate 100 is used not only to fix the light-emitting assembly 200, but a printed circuit board can also be provided inside the substrate 100 to interconnect the circuit of the substrate 100 and the package 202, and the substrate 100 can be electrically connected to the laser chip 203. The package 202 and the substrate 100 may be fixed by reflow soldering using a tin-silver-copper alloy, or the package 202 and the substrate 100 may be fixed by high-temperature, high-pressure sintered silver paste or copper paste. The material of the substrate 100 may be a metallic material such as oxygen-free copper or purple copper.

[0208] In some embodiments, the first seal portion 2023 may be pre-formed on a large scale on the substrate corresponding to the cover plate 2022. Figure 55 is a partial configuration diagram of a cover plate according to some embodiments. As shown in Figure 55, the transmittance of the cover plate 2022 is increased by providing a transparent film layer, and the second seal portion 2024 is formed by metallization sputtering on the cover plate 2022. Subsequently, the first seal portion 2023 is pre-fabricated on the second seal portion 2024. After all steps (i.e., the connection between the cover plate 2022 and the housing structure 2021 is completed), the cover plate 2022 is cut to shape. Metallization sputtering is a common surface coating technique that forms a thin metal film on the material surface and may also be achieved by a physical sputtering process.

[0209] In the above-described embodiments, specific features, structures, materials, or characteristics can be combined in an appropriate manner in any one or more embodiments or examples.

[0210] Furthermore, any one of the disclosed technical solutions in this disclosure can solve one or more of the above-mentioned technical problems to some extent and achieve the corresponding technical effects. Alternatively, multiple disclosed technical solutions may be combined into a single overall solution to solve one or more of the above-mentioned technical problems and achieve the corresponding technical effects. Alternatively, even when some of the disclosed technical solutions are combined into a single overall solution and combined with related technologies and degradation solutions, the technical means of this disclosure can complement the degradation trend, solving one or more of the above-mentioned technical problems to some extent and achieving the corresponding technical effects as a whole. Alternatively, each disclosed technical solution can be combined into a single complete technical solution, forming an organically inseparable overall solution that solves the technical problems and achieves the corresponding technical effects as a whole.

[0211] Any one of the disclosed technical solutions, and any combination of the disclosed technical solutions, can each form a complete technical solution and solve one or more of the aforementioned technical problems and achieve the corresponding technical effects, all of which are within the scope of this disclosure and are directly and unquestionably determined from the scope of this disclosure.

[0212] Those skilled in the art will understand that the scope of this disclosure is not limited to the specific embodiments described above, and that modifications and substitutions can be made to specific elements of the embodiments without departing from the spirit of this disclosure. The scope of this disclosure is limited by the claims.

Claims

1. A light-emitting device, the light-emitting device comprising a substrate and a light-emitting assembly, The aforementioned substrate is The main circuit board and The substrate body is provided with at least one connection pattern including a conductive portion, Multiple interconnection regions provided on the substrate body, A plurality of sets of first pads provided on the substrate body, wherein the plurality of sets of first pads are electrically connected to the conductive portion via the plurality of interconnection regions, and any one set of first pads among the plurality of sets of first pads includes a plurality of sets of first pads including two first pads with different polarities, The light-emitting assembly is fixed on the at least one connection pattern, and The at least one package wherein a first wiring is provided on at least one of the side walls or bottom walls of the at least one package, A conductive structure provided on the side of the at least one package facing the substrate and electrically connected to the first wiring and the conductive part, A plurality of types of laser chips provided within the at least one package and electrically connected to the first wiring, wherein the plurality of types of laser chips emit laser light of at least two different colors, and the plurality of types of laser chips of the same type are electrically connected to any one set of the first pads, Light-emitting device.

2. The at least one connection pattern is provided on the surface of the substrate body facing the light-emitting assembly, a plurality of second wirings are provided within the substrate body, and the plurality of second wirings form the plurality of interconnection regions, and in a direction perpendicular to the plane on which the substrate exists, at least partially overlap between one of the plurality of sets of first pads and one of the plurality of interconnection regions, at least partially overlap between the conductive portion and the plurality of interconnection regions, and at least partially overlap between the conductive structure and the conductive portion. The light-emitting device according to claim 1.

3. Any one of the multiple types of laser chips includes multiple laser chips, and the multiple laser chips of the same type are connected in series to form a series circuit, and both ends of the series circuit are electrically connected to two corresponding first pads, and the number of the multiple sets of first pads that are electrically connected to the light-emitting assembly is twice the number of types of laser chips. The light-emitting device according to claim 1 or 2.

4. The conductive structure includes a plurality of second pads, the plurality of second pads corresponding to the side walls of at least one package, the conductive portion includes a plurality of third pads, the plurality of third pads and the plurality of second pads correspond to each other and are soldered together, and the plurality of second pads are electrically connected to the first wiring. A light-emitting device according to any one of claims 1 to 3.

5. Any one of the aforementioned multiple types of laser chips includes one or more laser chips, each emitting a laser of the same color; the multiple types of laser chips include a first type of laser chip, a second type of laser chip, and a third type of laser chip, each emitting a laser of a different color. A light-emitting device according to any one of claims 1 to 4.

6. The wavelengths of the lasers emitted by the third type of laser chip are all greater than the wavelengths of the lasers emitted by the first type of laser chip and the second type of laser chip. The light-emitting device according to claim 5.

7. The system includes a first package and a second package in which at least one of the aforementioned packages are arranged side by side, wherein the third type of laser chip is provided in the first package, and both the first type of laser chip and the second type of laser chip are provided in the second package. The at least one package comprises three packages, the three packages are arranged along the length of the substrate, and the first type of laser chip, the second type of laser chip, and the third type of laser chip are each provided within the three packages. The at least one package includes one package, and the first type of laser chip, the second type of laser chip, and the third type of laser chip are all provided within the package, The light-emitting device according to claim 5 or 6.

8. The aforementioned at least one package includes a plurality of packages, and within any one of the plurality of packages, at least one type of laser chip from the plurality of types of laser chips is provided. The light-emitting device according to any one of claims 1 to 7.

9. The arrangement direction of the plurality of packages is the same as the arrangement direction of the plurality of sets of first pads. The light-emitting device according to claim 8.

10. The material of the side wall of the at least one package is ceramic, and the material of the bottom wall of the at least one package is metal. A light-emitting device according to any one of claims 1 to 9.

11. The light-emitting device further includes a temperature measuring component, The temperature measuring component is connected via a second wiring to a corresponding set of first pads among the multiple sets of first pads. A light-emitting device according to any one of claims 1 to 10.

12. The aforementioned temperature measuring component is The temperature measuring component is located in the middle of the arrangement direction of the plurality of sets of first pads, or the plurality of sets of first pads are installed symmetrically on both sides of the temperature measuring component, The light-emitting device according to claim 11.

13. The aforementioned multiple sets of first pads are Within the plane on which the substrate exists, the multiple sets of first pads are all located on the same side of the substrate body and are close to the edge of the substrate body, The first pads of the same polarity among the multiple sets of first pads are installed adjacent to each other, The following conditions must be met: either a pair of first pads with different polarities is installed adjacent to each other; A light-emitting device according to any one of claims 1 to 12.

14. Within the plane in which the substrate exists, the width of one side of any one of the multiple sets of first pads is a value within the range of 1.3 mm to 1.7 mm, and the spacing between two adjacent first pads along the arrangement direction of the multiple sets of first pads is a value within the range of 0.8 mm to 1.2 mm. A light-emitting device according to any one of claims 1 to 13.

15. One of the multiple sets of first pads is a metal layer and is rectangular. A light-emitting device according to any one of claims 1 to 14.

16. Any one of the at least one connection patterns further includes a fixing portion, the fixing portion is provided on the substrate body, the fixing portion corresponds to the bottom wall of the at least one package, and the light-emitting assembly is provided on the fixing portion. The light-emitting assembly further includes at least one metal film, the at least one metal film provided on the side of the at least one package facing the substrate body, and any one of the at least one metal film is connected in correspondence with the fixing portion. A light-emitting device according to any one of claims 1 to 15.

17. The light-emitting device further includes an electrical coupling assembly, the electrical coupling assembly is installed in a region of the substrate body close to the plurality of sets of first pads, the electrical coupling assembly is electrically connected to the plurality of sets of first pads, and the electrical coupling assembly is configured to be connected to an external electrical signal. A light-emitting device according to any one of claims 1 to 16.

18. The light-emitting assembly further includes at least one translucent glass sealing member, the at least one translucent glass sealing member located on the side of the at least one package away from the substrate, the at least one package and the at least one translucent glass sealing member form a housing space, the housing space housing at least one of the plurality of laser chips, The light-emitting device according to any one of claims 1 to 17.

19. A method for manufacturing a light-emitting device, wherein the light-emitting device includes a substrate and a light-emitting assembly, the light-emitting assembly includes a laser chip, a housing structure, a cover plate, and a plurality of first sealing parts, and the method is The steps include providing the laser chip, the housing structure, the cover plate, and the plurality of first sealing portions, The steps include: installing the laser chip inside the housing structure; A step of installing the plurality of first sealing portions on the side of the cover plate facing the housing structure, wherein two adjacent first sealing portions among the plurality of first sealing portions are installed with a gap between them, The steps include: connecting the housing structure and the cover plate via the plurality of first sealing portions so that any two adjacent first sealing portions come into contact with each other to connect the housing structure and the cover plate, sealing the gap in the connection portion between the housing structure and the cover plate, thereby forming the light-emitting assembly; The steps include electrically connecting the light-emitting assembly to the substrate, A method for manufacturing a light-emitting device.

20. It is a laser device, A light source assembly configured to emit an illumination beam, wherein the light source assembly includes a light-emitting device as described in claim 1, A light modulation assembly configured to modulate the illumination beam provided by the light source assembly to obtain a projected beam, A lens configured to image the projection beam, Laser equipment.

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