conditioning machine

Abstract

The present invention relates to a cooking appliance that forms a central internal region inside the burner where no working coil pattern is formed, and places a dummy via hole or dummy pattern in the central internal region in an electrically isolated state from the working coil pattern, thereby minimizing the possibility of damage to the working coil pattern due to heat concentration in the working coil pattern and the possibility of eddy current loss occurring, and effectively preventing thermal deformation of the coil circuit board module due to heat generation in the central internal region.

Description

Technical Field

[0001] The present invention relates to a cooking appliance, and more particularly, to a cooking appliance in which a central inner region where no working coil pattern is formed is formed inside a burner, and a dummy via hole or a dummy pattern formed in the central inner region in a state of being electrically separated from the working coil pattern is disposed, so that the possibility of damage to the working coil pattern due to heat concentration of the working coil pattern and the possibility of eddy current loss can be minimized, and thermal deformation of a coil circuit board module caused by heat generation in the central inner region can be effectively prevented.

Background Art

[0002] A cooking appliance is a type of home appliance for cooking food, which is installed in a kitchen space and cooks food according to a user's intention. These cooking appliances can be variously classified according to the heat source or form used, and the type of fuel.

[0003] When classifying cooking appliances according to the form of cooking food, they can be classified into open-type and closed-type cooking appliances according to the form of the space where food is placed. Closed-type cooking appliances include ovens, microwave ovens, etc., and open-type cooking appliances include cooktops, hobs, etc.

[0004] Among open-type cooking appliances, the cooktop may be provided so as to heat an object to be cooked placed in a cooking container through at least one or more burners.

[0005] These cooktops may be provided in a form including a burner using electricity, or may be provided in a form including a burner using gas.

[0006] In addition, the cooktop may be implemented independently, or may be implemented in the form of an oven range including an oven at a lower portion of the cooktop.

[0007] One example of a cooktop equipped with an electric burner is an induction heating appliance.

[0008] An induction heating cooking appliance is a cooking appliance that performs cooking functions using an induction heating method. In an induction heating cooking appliance, when high-frequency power is applied to the working coil, a magnetic field may be formed around the working coil.

[0009] The generated magnetic field may cause eddy currents to form in the cooking container, which is made of magnetic material. These eddy currents act as a resistance, and the heated cooking container may then be used to cook the food.

[0010] These induction cookers do not require gas combustion and do not produce combustion exhaust gases. Furthermore, induction cookers generate heat instantly within the container itself, minimizing the processes of heat transfer through radiation and conduction, allowing for rapid heating of food.

[0011] Conventional induction heating cooktops are constructed by twisting together numerous Litz wires to form a working coil, and then winding the working coil multiple times in a spiral, multi-layered structure to form individual burners.

[0012] In this case, each burner must be equipped with a coil frame to maintain and support the winding shape of the working coil.

[0013] Therefore, the combined vertical size of the individual burner, which includes the vertical size of the working coil wound in a multi-layer structure and the vertical size of the coil frame, inevitably accounts for a considerably larger proportion than the vertical size of the overall cooktop.

[0014] Due to the size limitations of the individual burners that make up these cooktops, conventional cooktops inevitably had limitations in increasing the output of the individual burners.

[0015] Furthermore, when designing a cooktop with multiple burners, conventional cooktops suffer from significant spatial constraints, lacking sufficient space for other components or parts. This severely limits the total number of burners that can be installed on a cooktop.

[0016] As an alternative to these Litz wire type working coils, a technology has been developed for cooktops that form the burner by creating a spiral multilayer pattern of working coils on a printed circuit board (Prior reference 1, Design and Optimization of Small Inductors on Extra-Thin PCB for Flexible Cooking Surfaces / IEEE TRANSACTIONS ON INDUSTRY APPLICATIONS, VOL.53, NO.1, JANUARY / FEBRUARY 2017).

[0017] The cooktop disclosed in Prior Art 1 can be configured to form a torch by forming a working coil pattern, which is wound spirally on a single printed circuit board, in layers or in sections.

[0018] Thus, the cooktop disclosed in Prior Art 1 has the advantage that, because the working coil pattern forming the burner is integrally formed on a single printed circuit board, the vertical size of the cooktop can be significantly reduced compared to conventional cooktops, improving vertical space utilization, and the number of burners can be significantly increased compared to conventional cooktops, improving horizontal space utilization. [Overview of the Initiative] [Problems that the invention aims to solve]

[0019] In the cooktop disclosed in the aforementioned prior art document 1, the working coil patterns constituting the individual burners are wound in a spiral shape, causing the heat generated by the individual patterns to concentrate in the central internal region of the working coil, resulting in a phenomenon where the highest temperature distribution appears in the central internal region.

[0020] Therefore, the cooktop disclosed in prior art 1 has the problem that such temperature deviations are likely to damage the working coil pattern formed in the central internal region of the burner.

[0021] Furthermore, the cooktop disclosed in prior art 1 has the problem that such heat concentration can cause significant eddy current losses in the working coil pattern formed in the central internal region of the burner.

[0022] Furthermore, the cooktop disclosed in Prior Art 1 has the problem that if a region is created in the central internal region of the burner where a working coil pattern is not formed, this region will be filled only with an insulating material (Prepreg) containing glass fibers, and the central internal region will likely experience thermal deformation due to the heat generated by the working coil pattern.

[0023] Furthermore, the cooktop disclosed in prior art 1 has the problem of increased manufacturing costs compared to one in which the central internal region is filled only with insulating material (Prepreg), because a working coil pattern is not formed in the central internal region of the burner.

[0024] The present invention was devised to solve the problems of these prior art devices, and its primary objective is to provide a cooking device that minimizes the possibility of damage to the working coil pattern due to heat concentration in the working coil pattern and the possibility of eddy current loss occurring by forming a central internal region inside the burner where no working coil pattern is formed.

[0025] A second object of the present invention is to provide a cooking apparatus in which dummy via holes or dummy patterns, which are formed in a state electrically separated from a working coil pattern, are disposed in a central inner region where no working coil pattern is formed, thereby effectively preventing thermal deformation of a coil circuit board module due to heat generation in the central inner region.

[0026] A third object of the present invention is to provide a cooking apparatus in which dummy via holes or dummy patterns, which are formed in a state electrically separated from a working coil pattern, are disposed in a central inner region where no working coil pattern is formed, thereby increasing the rigidity of the central inner region of the burner, reducing the proportion of the insulating material, and cutting down manufacturing costs.

[0027] The objects of the present invention are not limited to those mentioned above; other objects and advantages of the present invention that are not mentioned can be understood from the following description, and can be more clearly understood from the embodiments of the present invention. In addition, it can be easily understood that the objects and advantages of the present invention can be achieved by the means and combinations thereof set forth in the claims. Means for Solving the Problems

[0028] The cooking apparatus according to the present invention comprises: a top plate on which a container is placed; and a heating unit to which electric power is applied to generate a magnetic field and heat the container, wherein the heating unit includes a coil circuit board module provided with a working coil pattern that generates the magnetic field, and the coil circuit board module further comprises a dummy via hole or a dummy pattern formed in a state electrically separated from the working coil pattern.

[0029] Further, the coil circuit board module may further include a sensing coil pattern for sensing whether a container is seated, and the dummy via hole and the dummy pattern may be arranged so as to be electrically isolated from the sensing coil pattern.

[0030] Further, with reference to the horizontal direction, a central inner region is formed inside the working coil pattern, and the dummy via hole and the dummy pattern may be arranged so as to belong to the central inner region when viewed from the top plate.

[0031] Further, the working coil pattern forms a plurality of turns in a spiral shape, and with reference to the horizontal direction, an inter-turn region is formed between adjacently arranged turns that constitute the working coil pattern, and the dummy via hole and the dummy pattern may be arranged so as to belong to the inter-turn region when viewed from the top plate.

[0032] Further, a plurality of the working coil patterns are provided, and with reference to the horizontal direction, an inter-coil region is formed between a plurality of adjacently arranged working coil patterns, and the dummy via hole and the dummy pattern may be arranged so as to belong to the inter-coil region when viewed from the top plate.

[0033] Further, a plurality of the dummy via holes are provided, and the plurality of dummy via holes may be arranged in a grid pattern when viewed from the top plate.

[0034] Further, the grid pattern may be a square grid pattern or a hexagonal grid pattern.

[0035] Furthermore, each of the plurality of dummy via holes comprises a top pad formed on the upper end surface of the coil circuit board module, and a bottom pad formed on the lower end surface of the coil circuit board module, electrically connected to the top pad. The horizontal distance between the centers of adjacent pairs of via holes among the plurality of dummy via holes may be formed to be even larger than the outer diameter of the top pad and the outer diameter of the bottom pad.

[0036] Furthermore, the dummy via holes may extend vertically from the upper end surface of the coil circuit board module to the lower end surface of the coil circuit board module, along a through-hole formed through the coil circuit board module.

[0037] Furthermore, the dummy via hole may comprise a top pad formed on the upper end surface of the coil circuit board module; a bottom pad formed on the lower end surface of the coil circuit board module; and an internal conductor extending along the through hole, electrically connecting the top pad and the bottom pad.

[0038] Furthermore, the dummy via hole may be formed in a hollow state from the top pad to the bottom pad.

[0039] Furthermore, the dummy via hole may be formed in a solid state from the top pad to the bottom pad.

[0040] Furthermore, the dummy via hole may be formed such that at least one of the top pad and the bottom pad closes the through hole.

[0041] Furthermore, the dummy pattern may extend in a direction parallel to the winding direction of the working coil pattern, or in a direction intersecting the winding direction of the working coil pattern.

[0042] Furthermore, the dummy pattern may be provided in multiple units, and the multiple dummy patterns may be arranged in a separated state.

[0043] Furthermore, the coil circuit board module may have multiple working coil patterns arranged in multiple layered structures, and these multiple layered structures may be formed as a single integrated unit.

[0044] Furthermore, the dummy pattern may be provided in multiple quantities, and at least some of the multiple dummy patterns may be arranged on the upper or lower end surface of the coil circuit board module.

[0045] Furthermore, the coil circuit board module may have multiple working coil patterns arranged in multiple layered structures along the vertical direction, and some of the other dummy patterns may be placed in the inner layers of the multiple layered structures.

[0046] Furthermore, the dummy via holes and the dummy pattern may be arranged together on the coil circuit board module, and one end or the other end of the dummy pattern may be connected to the dummy via holes.

[0047] On the other hand, the home appliance according to the present invention includes a top plate in contact with an object; and a coil circuit board module disposed below the top plate and equipped with a working coil pattern for heating the container; wherein the coil circuit board module further comprises a dummy metal part electrically separated from the working coil pattern. [Effects of the Invention]

[0048] The present invention has the effect of minimizing the possibility of damage to the working coil pattern due to heat concentration in the working coil pattern and the possibility of eddy current loss occurring by forming a central internal region inside the torch where no working coil pattern is formed.

[0049] Furthermore, the present invention has the effect of improving the heat dissipation effect in the vertical direction via the dummy via holes or dummy patterns formed electrically separated from the working coil pattern in the central internal region where the working coil pattern is not formed, thereby improving the heat dissipation effect in the front-to-back or left-to-right direction via the dummy patterns, and effectively preventing thermal deformation of the coil circuit board module due to heat generation in the central internal region.

[0050] Furthermore, the present invention has the effect of increasing the rigidity in the central internal region of the nozzle by arranging dummy via holes or dummy patterns that are electrically separated from the working coil pattern in the central internal region where the working coil pattern is not formed, thereby reinforcing the rigidity in the vertical direction through the dummy via holes and reinforcing the rigidity in the front-rear or left-right direction through the dummy patterns.

[0051] Furthermore, the present invention has the effect of improving heat dissipation in the front-to-back, left-to-right, and up-and-down directions, and reinforcing rigidity, by arranging both dummy via holes and dummy patterns in the central internal region where no working coils are formed. However, this should not be interpreted as meaning that the heat dissipation improvement effect and reinforcement effect on the central internal region are limited to a specific direction, but rather that they can be further reinforced relatively in that direction.

[0052] Furthermore, the present invention has the effect of reducing manufacturing costs by arranging dummy via holes or dummy patterns in a central internal region where a working coil pattern is not formed, in a state where they are electrically separated from the working coil pattern, thereby reducing the specific gravity occupied by the insulating material.

[0053] The effects described above, as well as the specific effects of the present invention, will be explained and described below in the following descriptions of embodiments for carrying out the invention. [Brief explanation of the drawing]

[0054] [Figure 1]This is a front perspective view of a cooking appliance according to one embodiment of the present invention. [Figure 2] Figure 1 is a plan view of the cooking appliance, showing the indicator line illuminated. [Figure 3] Figure 1 is a perspective view of the cooking equipment shown. [Figure 4] Figure 1 is an exploded perspective view of the cooktop of the cooking appliance shown. [Figure 5] Figure 4 is a plan view of the cooktop, showing a perspective view of the lower part of the top plate. [Figure 6] Figure 4 is a schematic cross-sectional view illustrating the layered structure of the first coil circuit board module. [Figure 7] Figure 4 is a plan view of the first layer constituting the layered structure of the first coil circuit board module shown. [Figure 8] This is a magnified view of a portion of Figure 7. [Figure 9] Figure 4 is a plan view of the second layer that constitutes the layered structure of the first coil circuit board module shown. [Figure 10] This is a partially enlarged view of Figure 7, showing the patterns formed in layers 1 through 12. [Figure 11] Figure 4 is a plan view of the third to seventh layers that constitute the layered structure of the first coil circuit board module shown. [Figure 12] Figure 4 shows plan views of the 8th to 12th layers that constitute the layered structure of the first coil circuit board module. [Figure 13] (a) is a plan view showing a portion of the first type pattern shown in Figure 11, and (b) is a plan view showing a portion of the second type pattern shown in Figure 12. [Figure 14] (a) is a magnified view of a portion of Figure 13(a), and (b) is a magnified view of a portion of Figure 13(b). [Figure 15] Figure 4 is a schematic cross-sectional view illustrating a structure in which the Type 1 pattern, comprising layers 3 to 7, and the Type 2 pattern, comprising layers 8 to 12, are connected collectively via working coil via holes. [Figure 16] (a) is a partially enlarged view of Figure 13(a), and (b) is a partially enlarged view of Figure 13(b), both of which are partially enlarged views illustrating the common terminals of the Type 1 pattern and the Type 2 pattern, respectively. [Figure 17] This is a partially enlarged view of Figure 7, illustrating the position where the dummy via hole according to the present invention is arranged. [Figure 18] This is a plan view, based on the Type 1 pattern, showing the state in which numerous dummy via holes are formed in the central region inside the working coil pattern that forms individual burners. [Figure 19] This is a plan view, based on the Type 1 pattern, showing the state in which numerous dummy via holes are formed in the central region inside the working coil pattern that forms individual burners. [Figure 20] Figures 18 and 19 are partially enlarged views illustrating an example of a shape in which a plurality of dummy via holes are arranged in the internal central region according to the first embodiment of the present invention. [Figure 21] This is a schematic cross-sectional view of a first coil circuit board module illustrating an example of the shapes of a plurality of dummy via holes according to a first embodiment of the present invention. [Figure 22] Figures 18 and 19 are plan views showing a state in which multiple dummy patterns are formed in the internal central region according to a second embodiment of the present invention, with the first type pattern as the reference. [Figure 23] Figures 18 and 19 are partial enlarged views illustrating an example of a shape in which multiple derby patterns are arranged in the central internal region according to a second embodiment of the present invention. [Figure 24] This is a schematic cross-sectional view of a first coil circuit board module illustrating an example of a configuration in which a plurality of dummy patterns are arranged in a plurality of layered structures according to a second embodiment of the present invention. [Figure 25] Figures 18 and 19 are simple diagrams showing a configuration in which a plurality of dummy via holes and a plurality of dummy patterns are formed together in the central internal region according to a third embodiment of the present invention. [Figure 26]Figures 18 and 19 are schematic cross-sectional views showing a configuration in which a plurality of dummy via holes and a plurality of dummy patterns are formed together in the internal central region according to a third embodiment of the present invention. [Modes for carrying out the invention]

[0055] The aforementioned objectives, features, and advantages will be described in detail below with reference to the attached drawings, so that a person with ordinary skill in the art to which the present invention pertains can easily implement the technical concept of the present invention. In describing the present invention, if a specific description of known technology according to the present invention is deemed to obscure the gist of the present invention, then such detailed description will be omitted. Hereafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. The same reference numerals in the drawings are used to indicate the same or similar components.

[0056] Although terms such as "first," "second," etc., are used to indicate various components, these components are not limited by these terms. These terms are simply used to distinguish one component from another, and unless otherwise specified, the first component may also be the second component.

[0057] In the entire specification, unless otherwise stated, each component may be singular or plural.

[0058] Hereinafter, the placement of any configuration on the "upper (or lower)" or "above (or below)" of a component means not only that the configuration is placed in contact with the upper (or lower) surface of the component, but also that other configurations may be interposed between the component and any configuration placed on (or below) it.

[0059] Furthermore, where it is stated that one component is “linked,” “joined,” or “connected” to another component, it should be understood that the components may be directly linked or connected to one another, but may also be “interposed” between each component, or each component may be “linked,” “joined,” or “connected” through other components.

[0060] In this specification, singular expressions include plural expressions unless otherwise explicitly stated in the context. Terms such as “composed of” or “including” in this application should not be interpreted as necessarily including all of the multiple components or stages described in the specification, but rather as meaning that some of the components or stages may not be included, or that further components or stages may be included.

[0061] Furthermore, singular expressions used herein include plural expressions unless otherwise explicitly stated in the context. Terms such as “composed of” or “including” in this application should not be interpreted as necessarily including all of the multiple components or stages described in the specification, but rather as meaning that some of the components or stages may not be included, or that further components or stages may be included.

[0062] In the entire specification, "A and / or B" means A, B, or A and B unless otherwise specified, and "C to D" means C or greater and D or less unless otherwise specified.

[0063] [General structure of cooking appliances] This specification describes below an embodiment in which a coil circuit board module is used in cooking equipment 1.

[0064] However, the coil circuit board modules in other embodiments can also be applied to other devices that require induction heating.

[0065] For example, a coil circuit board module may be installed in a washing machine to heat the water tank, drum, or wash tub inside the washing machine, or to heat the wash water. In another example, a coil circuit board module may be installed in a water purifier to heat the hot water pipes or tank. In yet another example, a coil circuit board module may be installed in a clothes dryer or garment care machine to heat the air used to dry clothes, or a coil circuit board module may be installed in an electric kettle or rice cooker to heat the liquid or food inside the appliance.

[0066] Figure 1 is a perspective view showing a cooking appliance 1 according to one embodiment of the present invention, and Figure 2 is a plan view of the cooktop 20 constituting the cooking appliance 1 shown in Figure 1, viewed from above.

[0067] Referring to Figures 1 and 2, a cooking appliance 1 according to one embodiment of the present invention may include a cooktop 20 and an oven section 10 located below the cooktop 20.

[0068] Thus, the cooking appliance 1 according to the embodiment of the present invention may be an oven range type in which a cooktop 20 is arranged on the upper side and an oven section 10 is arranged on the lower side. However, the present invention is not limited thereto, and the cooking appliance 1 may be composed of a cooktop 20 alone. In the following, the cooking appliance 1 configured as an oven range type, as shown as an example, will be described as a reference.

[0069] The cooking appliance 1 of the embodiment of the present invention, provided in the form of an oven range, can provide both the function of an oven, which is a sealed cooking means, and the function of a cooktop, which is an open means.

[0070] A cooking chamber may be formed inside the oven section 10, which is a sealed cooking device. In the oven section 10, food can be cooked while the inside of the cooking chamber is heated.

[0071] Therefore, although not shown in the diagram, the oven section 10 may be equipped with a heating section for heating the inside of the cooking chamber. The heating section may be a heating device that uses gas fuel or electricity.

[0072] The oven section 10 of the cooking appliance 1 may be rotatably equipped with a door 11 that selectively opens and closes the cooking chamber.

[0073] For example, the door 11 may be provided in the oven section 10 in a pull-down manner, where the upper end rotates vertically around the lower end to open and close the cooking compartment.

[0074] A control panel 30 may be provided on the upper front surface of the cooking appliance 1 for operating the oven section 10 and the cooktop 20.

[0075] By being positioned on the front surface of the cooking appliance 1, the control panel 30 can form part of the appearance of the front surface of the cooking appliance 1.

[0076] These control panels 30 may include multiple switches for controlling the operation of the cooking appliance 1, and a display 31 for displaying the operating status of the cooking appliance 1.

[0077] Furthermore, as shown, the control panel 30 of the cooking appliance 1 may be further provided with a plurality of knobs 32. That is, the control panel 30 located on the upper part of the front surface of the cooking appliance 1 may be provided with a plurality of knobs 32 for adjusting the operation of the cooking appliance 1, along with the display 31.

[0078] Each knob 32 may be provided in a form that allows for rotational operation. These knobs 32 may be provided to allow operation of either the oven section 10 or the cooktop 20, or to allow operation of both the oven section 10 and the cooktop 20.

[0079] By operating the knob provided as described above, one of several pre-set cooking modes can be selected, or the heating temperature or heating stage can be selected.

[0080] Furthermore, the control panel 30 of the cooking appliance 1 according to this embodiment may also be provided with a knob ring 33. The knob ring 33 may be positioned radially outside the knob 32. For example, the knob ring 33 may be provided in the shape of a ring that surrounds the knob 32 radially outside.

[0081] The knob ring 33 can serve to support the knob 32 and also to seal the appearance around the knob 32, thereby improving the appearance quality of the cooking appliance 1.

[0082] Furthermore, the knob ring 33 in this embodiment can serve both as a timer operation switch and as a display for the timer duration and the intensity of the flame.

[0083] The knob ring 33 is installed to be rotatable independently of the knob 32, and the timer time may be set by rotating the knob ring 33 in this manner.

[0084] On the other hand, as mentioned above, a cooktop 20 may be placed above the oven section 10.

[0085] The Cooktop 20 is attached to the upper surface of the Cooktop 20 and can perform the function of heating food, a container of food, or an object to be heated.

[0086] Therefore, the cooktop 20 may include a top plate 21 that forms the upper surface of the cooktop 20 and to which a container of food is attached or which comes into contact with the object to be heated.

[0087] Furthermore, a heating element may be provided in the lower part of the top plate 21, inside the cooktop 20, for heating a container of food or an object to be heated.

[0088] The heating section may be configured to include at least one burner. For example, the burner constituting the heating section may be configured to include a working coil that converts the supplied electrical force into magnetic force, or a heating wire coil that converts the supplied electrical force into thermal energy.

[0089] The cooktop 20 of the cooking appliance 1 according to one embodiment of the present invention may be provided by an induction heating method.

[0090] For this purpose, the burner of the cooktop 20 may be configured to include a working coil. In this way, the burner, including the working coil, can be operated by a high-frequency current generated and supplied by an inverter to generate a strong magnetic field.

[0091] Thus, the magnetic field generated by the torch, including the working coil, generates eddy currents in the container containing the metal component. The flow of these eddy currents in the container generates heat, which heats the container, and the food contained in the container may be heated as a result of the container being heated.

[0092] However, the working coils used in conventional induction heating cooktops were typically constructed by twisting together numerous electrically conductive wires to form a cable, and then winding the cable in a spiral shape.

[0093] However, as will be described later, the working coil constituting the cooktop 20 of the cooking appliance 1 according to one embodiment of the present invention may be composed of a number of patterns formed by spirally stacking them on a printed circuit board.

[0094] Thus, having a structure formed in layers on a printed circuit board, the working coil of the cooking appliance 1 according to the present invention can be called a working coil pattern.

[0095] The detailed configuration of the heating section, which includes a working coil pattern, will be described later with reference to Figure 2 and subsequent figures.

[0096] [Overall configuration of the cooktop] In the following, the configuration of the cooktop 20 constituting a cooking appliance 1 according to one embodiment of the present invention will be described with reference to Figures 2 to 4.

[0097] Figure 2 is a plan view of the cooktop 20 viewed from above with the indicator line (L) illuminated, Figure 3 is a perspective view of the cooktop 20 according to the present invention, Figure 4 is an exploded perspective view of the cooktop 20 shown in Figure 3, and Figure 6 is a plan view showing the interior of the cooktop 20 shown in Figure 3.

[0098] Referring to Figures 2 to 5, the cooktop 20 according to this embodiment can be equipped with a control panel 22, similar to the oven unit 10 described above.

[0099] As shown, the control panel 22 of the cooktop 20 is located on the top plate 21, but for the convenience of the user, it may be positioned slightly forward.

[0100] These control panels 22 may include various switches for adjusting the operation of the cooktop 20, and a display panel 221 for displaying the operating status of the cooktop 20.

[0101] As described later, when the sensing coil pattern 2514 detects that the container is securely attached to the upper surface 21a of the top plate 21, an icon corresponding to the container may be displayed on the display panel 221 of the control panel 22 provided on the cooktop 20. For example, the icon may be provided in a form corresponding to the size and shape of the container, and may be placed in a position on the display panel 221 corresponding to the position of the cooking appliance 1.

[0102] The user can press the displayed icon to select the container that the icon indicates, and then perform operations to control the operation of cooking appliance 1 in relation to the selected container.

[0103] For example, a user can select the container to be operated on by pressing an icon, and then select the desired heating temperature for that container.

[0104] Thus, when heating of the container is started by operating the control panel 22, the fact that heating of the container has started may be indicated on the top plate 21 via the display line (L), as shown in Figure 2.

[0105] As shown in Figure 2, the top plate 21 of the cooktop 20 may be provided with multiple indicator lines (L).

[0106] The display line (L) displays information such as the container's position, heating status, and temperature on the top plate 21 in the form of an illuminated area, thereby visually communicating this information to the user.

[0107] Figure 2 shows an example of an embodiment equipped with a total of seven indicator lines (L). These indicator lines (L) can be conveniently named, from left to right, as the 1st indicator line to the 7th indicator line L1, L2, L3, L4, L5, L6, and L7, relative to the top plate 21. Although the present invention is not limited thereto, for convenience, the following explanation will be based on the embodiment equipped with a total of seven indicator lines (L) as shown.

[0108] These display lines (L) may be light-emitting regions formed with a width in the left-right direction that is much smaller than the width in the front-back direction, as shown.

[0109] The display lines (L) may be formed in the shape of the light-emitting region by a light source module 23 located at the lower part of the top plate 21 and on a substrate supporter 26, which will be described later.

[0110] The light source module 23 may include a plurality of light source elements 231 that generate visible light, and a light source circuit board 232 on which the plurality of light source elements 231 are mounted.

[0111] Multiple light source elements 231 may be arranged to irradiate visible light toward the lower surface of the top plate 21, and the incident visible light can irradiate the lower surface of the top plate 21 by passing through light-transmitting holes formed through the substrate supporter 26, light-transmitting slit holes (H_sl) formed in each coil circuit board module constituting the heating section 25, and the gap formed between adjacent coil circuit board modules, as will be described later.

[0112] The light source module 23 may include a plurality of light source elements 231 that are supplied with power and generate visible light, and a light source circuit board 232 on which the plurality of light source elements 231 are mounted.

[0113] The light source element 231 can be any means to which power is supplied and a predetermined visible light is generated, and may include an LED element as an example. The present invention is not limited thereto, but the following description will be based on an embodiment in which an LED element is applied as the light source element 231.

[0114] As shown, each light source circuit board 232 may extend linearly along the front-to-back direction in correspondence with each linearly extending display line (L), and each light source circuit board 232 may be linearly arranged and positioned such that multiple light source elements 231 are spaced evenly or unevenly along the front-to-back direction.

[0115] Furthermore, as mentioned above, the light source module 23 is provided in multiple units so that visible light can be independently irradiated onto the first to seventh display lines L1, L2, L3, L4, L5, L6, and L7. These multiple light source modules 23 can be conveniently named, from left to right, as the first to seventh light source modules 23a, 23b, 23c, 23d, 23e, 23f, and 23g, relative to the top plate 21.

[0116] Corresponding to the first to seventh display lines L1, L2, L3, L4, L5, L6, L7, these first to seventh light source modules 23a, 23b, 23c, 23d, 23e, 23f, 23g may be arranged spaced apart along the left-right direction so as to have a predetermined interval between them.

[0117] As will be described later, the spacing between adjacent display lines (L) and the spacing between adjacent light source modules 23 may be the same as, or slightly larger than, the width of the working coil pattern 2512 constituting the heating section 25 in the left-right direction.

[0118] On the other hand, as shown, the cooktop 20 of the cooking appliance 1 according to one embodiment of the present invention may include a bottom case 24 that forms the front surface, rear surface, front surface, both sides, and bottom surface of the exterior of the cooktop 20.

[0119] The bottom case 24 may be formed with its upper surface completely open, and the aforementioned top plate 21 may be attached to the open upper surface.

[0120] As shown in Figure 4, a fastening bracket 211 may be provided on the lower surface of the top plate 21 at a position corresponding to the upper end of the bottom case 24 for connection to the bottom case 24.

[0121] Thus, by connecting the top plate 21 to the upper side of the bottom case 24, the internal space enclosed by the top plate 21 and the bottom case 24 may accommodate a number of internal components that make up the cooktop 20.

[0122] Furthermore, the bottom case 24 may be equipped with multiple mounting brackets 241, either integrally or separately.

[0123] The mounting bracket 241 may be positioned in the internal space of the cooktop 20 and may protrude upward from its lower surface toward the electrical components.

[0124] These mounting brackets 241 support the various electrical components 28 that make up the cooktop 20 from below, thereby limiting the occurrence of sagging of components such as the main circuit board module 281, SMPS circuit board module 282, inverter circuit board module 283, resonant circuit board module 284, and EMI filter module 285, and providing support for them.

[0125] Furthermore, as shown in Figure 4, intake holes 242 and exhaust holes 243 may be formed through the lower surface 24a of the bottom case 24, allowing air to enter and exit to cool the various electrical components constituting the cooktop 20, extending in the vertical direction.

[0126] On the other hand, the cooktop 20 of the cooking appliance 1 according to one embodiment of the present invention may further include a heating section 25 equipped with a working coil for heating a container by induction heating, and as described above, the working coil may be composed of a plurality of working coil patterns 2512 formed by spirally stacking them on a printed circuit board.

[0127] Thus, considering that multiple working coil patterns 2512 are stacked in multiple layered structures to form a torch, a printed circuit board formed by stacking working coil patterns 2512 can be called a coil circuit board module.

[0128] Furthermore, as will be described later, the multiple working coil patterns 2512, multiple sensing coil patterns 2514, multiple lead patterns 2513, etc. that constitute the coil circuit board module may be formed in a manner similar to the pattern manufacturing method for ordinary printed circuit boards. Therefore, taking this into consideration, the configurations referred to as patterns below can be referred to by various terms such as conductive parts, metal parts, copper parts, thin film parts, and printed parts. Also, similar to the multiple working coil patterns 2512, multiple sensing coil patterns 2514, and multiple lead patterns 2513, the dummy patterns provided in the coil circuit board module can be referred to by terms such as dummy conductive parts, dummy metal parts, dummy copper parts, dummy thin film parts, and dummy printed parts.

[0129] Furthermore, similar to conventional printed circuit boards having a multilayer structure, the coil circuit board module of the present invention may include working coil via holes (H_v1), sensing coil via holes (H_v2), and temperature sensor via holes (H_v3) for electrically connecting patterns arranged in different layers, as well as a plurality of dummy via holes that are not electrically connected to other patterns. As in the conventional, the via holes may be formed in through holes formed in the coil circuit board module by physical or chemical vapor deposition or coating methods, and can therefore be referred to by various terms such as conductive coating portion or conductive vapor deposition portion.

[0130] On the other hand, the coil circuit board module constituting the heating section 25 may be provided in multiple units, taking into consideration ease and efficiency of manufacturing.

[0131] Figures 4 and 5 show an example of a cooktop 20 equipped with a heating section 25 containing a total of three coil circuit board modules. The present invention is not limited thereto, but the following description will be based on the example shown, in which three coil circuit board modules are provided.

[0132] The three coil circuit board modules 251, 252, and 253 will be referred to as the first coil circuit board module 251, the second coil circuit board module 252, and the third coil circuit board module 253, respectively, from left to right.

[0133] Each coil circuit board module 251, 252, and 253 may have multiple nozzles 2511 formed therein for heating the container.

[0134] Figure 5 shows an example embodiment in which the first coil circuit board module 251 and the third coil circuit board module 253 are each equipped with eight burners 2511, and the second coil circuit board module 252 is equipped with six burners 2511. As will be described later, the number and size of these burners 2511 may be set to differ depending on the size and output of the cooktop 20. In the following description, as an example, an embodiment in which the eight first coil circuit board modules 251 and the third coil circuit board module 253 are each equipped with eight burners 2511, and the second coil circuit board module 252 is equipped with six burners will be used as the basis for explanation.

[0135] Furthermore, although Figure 5 shows that the shape and size of each nozzle 2511 are identical, this is merely illustrative, and similarly, the shape and size of the nozzle 2511 may be set to differ depending on the size and output of the cooktop 20.

[0136] Each of the coil circuit board modules 251, 252, and 253 may have a working coil pattern 2512 forming these multiple torches 2511 stacked in multiple layers.

[0137] Furthermore, sensing coil patterns 2514 may be laminated on each of the coil circuit board modules 251, 252, and 253 as a means for sensing whether or not a container is securely attached to a specific position on the upper surface 21a of the top plate 21.

[0138] Furthermore, each coil circuit board module 251, 252, and 253 may be equipped with a temperature sensor 2515 to sense the temperature of their respective top plates 21.

[0139] In this case, as will be described later, the working coil pattern 2512, the sensing coil pattern 2514, and the temperature sensor 2515 may be provided in a form in which they are integrated into their respective coil circuit board modules 251, 252, and 253. Therefore, the heating section 25 of the cooktop 20 according to the present invention has a significantly reduced vertical width compared to conventional cooktops, which reduces the vertical size of the cooktop 20, significantly improves space utilization, and significantly simplifies the manufacturing process of the cooktop 20.

[0140] The working coil pattern 2512 and the sensing coil pattern 2514 may be provided in a form that extends in a spiral shape but is stacked in the vertical direction.

[0141] In this case, as will be described later, the first to third coil circuit board modules 251, 252, and 253 may be formed in a manner in which the working coil pattern 2512 is stacked in 10 to 12 layers and the sensing coil pattern 2514 is stacked in 2 layers along the vertical direction. Thus, each coil circuit board module 251, 252, and 253 can have a layered structure having 12 to 14 layers.

[0142] Furthermore, due to the characteristics of the lamination process for printed circuit boards, the thickness of individual layers in the upward direction is formed to be thin, so each coil circuit board module 251, 252, and 253 may be laminated in more than 14 layers. In other words, although it is determined by the specific design conditions, there is no limit to the number of layers for each coil circuit board module 251, 252, and 253.

[0143] When viewed from a cross-section perpendicular to the direction of current flow, the copper pattern must extend in both the vertical and horizontal directions, forming a helical working coil pattern 2512. Therefore, the working coil pattern 2512 may be applied with four or more layers. That is, each coil circuit board module 251, 252, and 253 may be divided into a minimum of four or more layers of copper patterns.

[0144] On the other hand, each sensing coil pattern may be located within the area occupied by the working coil pattern 2512 that forms the individual burner nozzle 2511, or in the area between an adjacent pair of working coil patterns 2512.

[0145] In this embodiment, considering the efficiency and accuracy of container sensing, as will be described later, a pair of sensing coil patterns 2514 may be arranged inside the area occupied by each working coil pattern 2512, or a pair of sensing coil patterns 2514 may be arranged in the area between adjacent pairs of working coil patterns 2512.

[0146] On the other hand, in order to sense the temperature of the top plate 21, the temperature sensors 2515 may be positioned at the center of each sensing coil pattern 2514.

[0147] Detailed information regarding the working coil pattern 2512, sensing coil pattern 2514, and temperature sensor 2515 that constitute the first to third coil circuit board modules 251, 252, and 253 will be described later with reference to Figure 6 and subsequent figures.

[0148] On the other hand, the cooktop 20 of the cooking appliance 1 according to one embodiment of the present invention may further include a substrate supporter 26.

[0149] The circuit board supporter 26 is responsible for supporting the internal components that are placed inside the cooktop 20.

[0150] More specifically, as shown in Figure 4, the first to third coil circuit board modules 251, 252, and 253, and the ferrite core module 27 may be attached to the upper side of the board supporter 26. Thus, the board supporter 26 functions as a coil base to which conventional working coils and ferrite cores are attached.

[0151] Furthermore, as shown in Figure 4, various electrical components 28 that constitute the cooktop 20 may be installed on the underside of the circuit board supporter 26.

[0152] These electrical components 28 may include a main circuit board module 281, an SMPS circuit board (switching mode power supply) 282, an inverter circuit board module 283, a resonant circuit board module 284, an EMI filter module 285, a blower fan module 286, a light source module 23, and the like.

[0153] These electrical components 28 may be located on the lower side of the circuit board supporter 26, in the space formed between the lower surface 24a of the bottom case 24 and the circuit board supporter 26.

[0154] As an example, the circuit board supporter 26 may have an inverted box shape, configured such that its lower surface facing the bottom case 24 is completely open, so that these electrical components 28 can be effectively accommodated.

[0155] Therefore, the main circuit board module 281, the SMPS circuit board (switching mode power supply) 282, the inverter circuit board module 283, the resonant circuit board module 284, the EMI filter module 285, the blower fan module 286, and the light source module 23 may be assembled on the circuit board supporter 26 in a manner in which they are stacked in the housing space formed inside the circuit board supporter 26.

[0156] In this way, the first to third coil circuit board modules 251, 252, and 253 are fixed to the upper surface 21a of the board supporter 26, and the electrical components 28 are fixed to the lower surface of the board supporter 26 inside the board supporter 26. This makes it possible to significantly simplify and streamline the wiring structure between the electrical components 28 and the wiring structure between the electrical components 28 and the first to third coil circuit board modules 251, 252, and 253.

[0157] In particular, the conventional Cooktop 20 has a structure that requires the disassembly of almost all components in the reverse order of the assembly process in order to repair the inverter circuit board, which is the main cause of failures and malfunctions.

[0158] In contrast, the cooktop 20 of the cooking appliance 1 according to one embodiment of the present invention is configured such that when the bottom case 24 is turned upside down so that it faces upwards, and only the bottom case 24 is disassembled, it is easy to access the electrical components 28 such as the inverter circuit board module 283, thus providing the effect of easily repairing or replacing the electrical components 28 when they malfunction.

[0159] In relation to this, we will briefly explain the assembly process of the cooktop 20 of the cooking appliance 1 according to one embodiment of the present invention.

[0160] For the time being, multiple ferrite core modules 27 may be assembled on the upper surface 261 of the circuit board supporter 26.

[0161] The ferrite core module 27 according to an embodiment of the present invention may be configured in a manner that combines multiple ferrite cores to form a module. This is in consideration of the fact that when a ferrite core composed of a single body and forming a relatively large volume is applied, crack defects and magnetic field losses may occur.

[0162] In this way, by modularizing multiple ferrite cores to form a ferrite core module 27 and installing it on the substrate supporter 26, the number of components can be reduced and the assembly process can be simplified.

[0163] As an example, the ferrite core module 27 can be manufactured using an insert injection molding method. By manufacturing the ferrite core module 27 using this insert injection molding method, a separate jig is no longer required to fix the individual ferrite core during the assembly of the cooktop 20, as was done in the conventional method.

[0164] Furthermore, by modularizing the ferrite cores in this way and forming a large number of ferrite core modules 27, it becomes possible to repair the system by simply replacing any damaged ferrite cores.

[0165] On the other hand, once the arrangement of the multiple ferrite core modules 27 on the upper surface 261 of the substrate supporter 26 is complete, the first to third coil circuit board modules 251, 252, and 253 may be fixedly attached to the upper side of the ferrite core modules 27.

[0166] Next, with the first to third coil circuit board modules 251, 252, and 253 securely in place, the board supporter 26 can be inverted upside down to assemble the electrical components 28.

[0167] As mentioned above, various electrical components 28 can be installed and assembled on the lower surface of the circuit board supporter 26. In this case, these electrical components 28 may be installed and assembled on the circuit board supporter 26 in an inverted state.

[0168] On the other hand, the cooktop 20 of the cooking appliance 1 according to one embodiment of the present invention may further include an insulating material 291 positioned above the first to third coil circuit board modules 251, 252, 253 and between the first to third coil circuit board modules 251, 252, 253 and the top plate 21.

[0169] The insulating material 291 is placed on the upper surface 21a of the top plate 21 and plays a role in minimizing the transfer of heat generated from the container heated by the working coil pattern 2512 to the working coil pattern 2512.

[0170] To achieve this thermal insulation function, the thermal insulation material 291 may be arranged in a pad-like manner that completely covers the first to third coil circuit board modules 251, 252, and 253.

[0171] On the other hand, the thermal insulation material 291 in this embodiment may be provided in the form of multiple pads.

[0172] More specifically, each insulation material 291 may be divided into multiple pads having a width in the left-right direction corresponding to the width in the left-right direction of the torch 2511 formed in the first to third coil circuit board modules 251, 252, 253.

[0173] In this way, by dividing the insulation material 291 into multiple pieces and arranging them, a predetermined gap may be formed between adjacent insulation materials 291, and visible light generated by the aforementioned light source module 23 may pass through the predetermined gap and irradiate the lower surface of the top plate 21, thereby displaying the aforementioned display line (L) on the top plate 21.

[0174] On the other hand, the thermal insulation material 291 can further play a role in electrically insulating the working coil pattern 2512 or sensing coil pattern 2514 formed on the first to third coil circuit board modules 251, 252, and 253 from the top plate 21.

[0175] In this case, the thermal insulation material 291 may be made of a material that simultaneously possesses thermal insulation and electrical insulation properties.

[0176] On the other hand, although not shown, an insulating material may be added above the insulating material 291 and between the insulating material 291 and the top plate 21 to further complement the insulating performance of the insulating material 291. For example, the insulating material may be a mica sheet that is even thinner than the vertical thickness of the insulating material 291.

[0177] [Detailed configuration of the coil circuit board module] In the following, with reference to Figures 6 to 15, the detailed configurations of the coil circuit board modules 251, 252, and 253 of the cooktop 20, which constitutes a cooking appliance 1 according to one embodiment of the present invention, will be described.

[0178] As described above, embodiments of the present invention may include first to third coil circuit board modules 251, 252, and 253.

[0179] In this case, the first to third coil circuit board modules 251, 252, and 253 may be configured in roughly the same way, except for the number of working coil patterns 2512 that constitute the torch 2511 and the number of sensing coil patterns 2514.

[0180] Therefore, the following explanation will be based on the first coil circuit board module 251, and unless otherwise specified, the contents described below can be applied in much the same way to the second coil circuit board module 252 and the third coil circuit board module 253.

[0181] For the time being, as mentioned above, the first coil circuit board module 251 may be formed by stacking multiple working coil patterns 2512 that form a plurality of torches 2511 in a multilayer structure.

[0182] As shown in Figure 6, the first coil circuit board module 251 may, as an example, include a working coil pattern 2512 arranged in 10 layers, a sensing coil pattern 2514 arranged in 2 layers, and an insulating material placed between each working coil pattern 2512 and each sensing coil pattern 2514 to insulate them. The insulating material may be formed by curing a prepreg, which is made of a thermosetting resin and glass fiber commonly used to construct printed circuit boards. As an example, an epoxy resin-based thermosetting resin is preferred, and specifically, FR-4 can be used.

[0183] Thus, the insulating material formed via the prepreg can be placed between each working coil pattern 2512 arranged in a layered structure to insulate them, and between each sensing coil pattern 2514 to insulate them. Furthermore, the insulating material can be configured to fill areas where no patterns are formed, such as the working coil pattern 2512, sensing coil pattern 2514, and lead coil pattern 2513, and can play a role in forming the layered structure of individual layers.

[0184] Therefore, with respect to the working coil pattern 2512 and the sensing coil pattern 2514, the first coil circuit board module 251 may have a layered structure with a total of 12 layers, from the first layer 251a forming the uppermost layer to the twelfth layer 251l forming the lowermost layer, with respect to the vertical direction.

[0185] Furthermore, coating layers (not shown) may be laminated on the top and bottom layers of the first coil circuit board module 251. The coating layers serve an insulating role and can also serve to prevent the interior of the cooktop 20 from being easily seen through the top plate 21, which is made of a transparent material. For this reason, the coating layers may be coated in black.

[0186] On the other hand, the dummy via holes (H_vd), described later, may be formed after the coating layer is formed. That is, the conductors constituting the dummy via holes (H_vd) may be exposed to the outside and can be visually inspected through the top plate 21. Also, the dummy pattern 2519, described later, may not be exposed to the outside, either by being shielded by the coating layer or by being formed in the intermediate layer between the uppermost and lowermost layers via the top plate 21.

[0187] However, this is not the only option; the coating layer can also be formed after generating the dummy via holes (H_vd) or dummy pattern 2519. This ensures that the dummy via holes (H_vd) or dummy pattern 2519 do not need to be exposed to the outside.

[0188] Furthermore, among the components of the first coil circuit board module 251, the high-power terminal pattern 2516, which requires electrical contact and needs to be exposed to the outside, does not need to be coated with a coating layer.

[0189] In this case, the first sensing coil pattern 2514a, which constitutes the sensing coil pattern 2514, may be arranged on the first layer 251a of the first coil circuit board module 251 having a 12-layer structure.

[0190] Furthermore, the first layer 251a may either electrically connect the first sensing coil pattern 2514a to the signal processing unit 2518 described later, or it may have a lead pattern 2513 that electrically connects the working coil patterns 2512, which are located in layers 3 to 12 (251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k, 251l), to the high-power terminal pattern 2516 to which high-frequency power is supplied.

[0191] Here, the lead pattern 2513 can be divided into a first lead pattern 2513a that electrically connects the working coil patterns 2512, which are located in layers 3 to 12 (251c, 251d, 251e, 251f, 251g, 251h, 251i, 251j, 251k, 251l), to the high-power terminal pattern 2516, and a second lead pattern 2513b that electrically connects the first sensing coil pattern 2514a to the signal processing unit 2518.

[0192] Although not shown in Figure 6, the first layer 251a may also include a temperature sensor 2515 for sensing the temperature of the top plate 21, a high-power terminal pattern 2516 to which high-frequency power is supplied from the inverter circuit board module 283, a signal processing unit 2518 for processing the output signal of the sensing coil pattern 2514 and the output signal of the temperature sensor 2515, and a third lead pattern 2513c for electrically connecting the temperature sensor 2515 and the signal processing unit 2518.

[0193] On the other hand, the second layer 251b of the first coil circuit board module 251 may include a second sensing coil pattern 2514b that constitutes the sensing coil pattern 2514, and a second lead pattern 2513b that electrically connects the second sensing coil pattern 2514b to the signal processing unit 2518.

[0194] In other words, in order to improve the efficiency and effectiveness of sensing the container, the sensing coil pattern 2514 may be divided and arranged into a first sensing coil pattern 2514a located on the first layer 251a and a second sensing coil pattern 2514b located on the second layer 251b.

[0195] In this configuration, as will be described later, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b are configured to be connected in series via sensing coil via holes (H_v2) that extend through the first layer 251a and the second layer 251b, and can act on a single sensing coil pattern 2514.

[0196] On the other hand, a second sensing coil pattern 2514b, which constitutes the sensing coil pattern 2514, may be arranged on the second layer 251b of the first coil circuit board module 251.

[0197] As described later, the working coil pattern 2512 provided on the cooktop 20 of a cooking appliance 1 according to one embodiment of the present invention may include a first type pattern 2512a and a second type pattern 2512b, in which the direction of travel or winding direction of individual pattern books 2512a-1 and 2512b-1 are formed in opposite directions to each other, so that a magnetic field acts uniformly on the container.

[0198] As shown in Figure 6, as an example, although working coil patterns 2512 are formed in the third to seventh layers 251c, 251d, 251e, 251f, and 251g, a first type pattern 2512a may be arranged such that the direction of travel or winding direction of the individual pattern books 2512a-1 is the first direction.

[0199] As an example, although working coil patterns 2512 are formed in layers 8 to 12 251h, 251i, 251j, 251k, and 251l, a second type pattern 2512b may be arranged such that the direction of travel or winding direction of the individual pattern 2512b-1 is a second direction.

[0200] In this case, as shown, the first lead pattern 2513a formed on the first layer 251a, the first type pattern 2512a arranged on the third to seventh layers 251c, 251d, 251e, 251f, and 251g, and the second type pattern 2512b arranged on the eighth to twelfth layers 251h, 251i, 251j, 251k, and 251l may be configured to be connected collectively via a working coil via hole (H_v1) that is continuously formed through from the first layer 251a to the twelfth layer 251l.

[0201] Therefore, among the multiple torches described later, the multiple first-type patterns 2512a and multiple second-type patterns 2512b that form a specific torch may be connected together in series via a working coil via hole (H_v1).

[0202] On the other hand, although not shown, an insulating material may be further formed on the upper side of the first layer 251a and on the lower side of the twelfth layer 251l.

[0203] On the other hand, the layered structure of the first coil circuit board module 251 shown in Figure 6 is merely illustrative.

[0204] In other words, the layered structure may be modified so that the second sensing coil pattern 2514b is placed in a layer other than the second layer 251b, such as the sixth layer 251f or the seventh layer 251g which becomes an intermediate layer, or in the twelfth layer 251l which becomes the bottom layer.

[0205] Furthermore, while Figure 6 shows that the first type pattern 2512a is arranged continuously from the third layer 251c to the seventh layer 251g, and the second type pattern 2512b is arranged continuously from the eighth layer 251h to the twelfth layer 251l, the arrangement may be modified so that the first type pattern 2512a and the second type pattern 2512b are arranged alternately in a repeating pattern.

[0206] These modifications naturally fall within the scope of the present invention. However, although the present invention is not limited thereto, the following explanation will be based on the layered structure of the first coil circuit board module 251 as shown in Figure 6.

[0207] In the first coil circuit board module 251 having such a multilayer structure, the shape of the working coil pattern 2512, which will become the second type pattern 2512b, is masked and printed onto a copper foil film, and unnecessary parts are removed by etching to form the pattern. The bottom layer, the 12th layer 251l, is then formed by coating the formed pattern with an insulating material.

[0208] The thickness of the copper foil used in this embodiment may be in the range of 0.13 mm to 0.15 mm, and preferably 0.14 mm.

[0209] Therefore, if no further surface treatment is performed during the lamination process, the vertical thickness of the individual patterns formed via the copper foil film may be 0.13 mm to 0.15 mm.

[0210] Furthermore, the thickness of the insulating material used in this embodiment is in the range of 0.09 mm to 0.11 mm, and preferably 0.1 mm.

[0211] Thus, after the 12th layer 251l, which is the bottom layer, is formed, the same process as in the formation of the 12th layer 251l may be repeated on top of it to form a multilayer structure as shown in Figure 6.

[0212] Therefore, once the formation of the first coil circuit board module 251 is complete with a total of 12 layers, the vertical thickness of the first coil circuit board module 251 will be in the range of 2.7 mm to 3.3 mm, and preferably 3 mm.

[0213] To form the first coil circuit board module 251 having such a shape and structure, the manufacturing method of the multilayer printed circuit board can be the same as that already known in the industry, and therefore, a detailed explanation of the manufacturing method will be omitted below.

[0214] Figures 7 and 8 show the planar structures of the first layer 251a and the second layer 251b of the first coil circuit board module 251, which each has a multilayer structure.

[0215] In this embodiment, the first coil circuit board module 251 may be configured to have a rectangular shape in which the width in the front-to-back direction is greater than the width in the left-to-right direction, based on the state in which it is placed on the cooktop 20.

[0216] In response to this, the uppermost first layer 251a and the second layer 251b, which is the next uppermost layer, may be configured to have a rectangular shape in which the width in the front-to-back direction is even greater than the width in the left-to-right direction.

[0217] As described above, the first layer 251a may have a first sensing coil pattern 2514a that forms one of the two layers of the sensing coil pattern 2514, and the second layer 251b may have a second sensing coil pattern 2514b that forms two of the two layers of the sensing coil pattern 2514.

[0218] As shown in this example, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be wound in a different shape from the working coil pattern 2512.

[0219] In other words, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be wound in a circular spiral shape. For example, the number of turns of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be set to 18 turns, and the outer diameter may be in the range of 32 mm to 34 mm, preferably in the range of 33 mm. In addition, the width of the individual pattern strands constituting the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be in the range of 0.27 mm to 0.33 mm, preferably in the range of 0.3 mm.

[0220] As will be described later, the working coil pattern 2512 is wound in a square spiral shape.

[0221] Furthermore, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b are arranged such that they partially overlap with the working coil pattern 2512, with respect to the vertical direction.

[0222] Therefore, these overlapping regions may cause malfunctions or sensing errors in the first sensing coil pattern 2514a and the second sensing coil pattern 2514b.

[0223] In this way, by winding the first sensing coil pattern 2514a and the second sensing coil pattern 2514b in a circular spiral shape, interference with the working coil pattern 2512, which is wound in a square spiral shape, can be minimized, and the possibility of malfunction and sensing errors in the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be minimized.

[0224] On the other hand, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be wound in such a way that a starting point is not formed at the center of the circular spiral. That is, a first central internal region may be formed in the center of the circular spiral in which the first sensing coil pattern 2514a and the second sensing coil pattern 2514b are not formed.

[0225] A temperature sensor 2515 may be mounted in the central internal region of these first sensing coil patterns 2514a, as will be described later. To distinguish it from the central internal region formed inside the working coil pattern 2512, which will be described later, the central internal region of the first sensing coil pattern 2514a will be referred to as the first central internal region below.

[0226] The specific configuration regarding the placement of the temperature sensor 2515 will be described later with reference to Figure 9.

[0227] In this embodiment, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b may be provided in multiple quantities.

[0228] More specifically, the plurality of first sensing coil patterns 2514a and the plurality of second sensing coil patterns 2514b may include, in part, patterns that are arranged entirely inside a particular burner and patterns that are arranged across a pair of adjacent burners 2511.

[0229] As an example, in the embodiment shown in Figure 7, if the first coil circuit board module 251 has a total of eight torches 2511, the number of first sensing coil patterns 2514a and the number of second sensing coil patterns 2514b may each be provided in a total of 28.

[0230] However, this is merely illustrative, and the number of first sensing coil patterns 2514a may be adjusted to vary depending on the size of the individual burner 2511 and the size of the first coil circuit board module 251. The present invention is not limited thereto, but the following description will be based on an embodiment in which the first coil circuit board module 251 is equipped with 28 first sensing coil patterns 2514a and second sensing coil patterns 2514b.

[0231] The first sensing coil patterns 2514a, which are positioned at different locations from each other, may be configured to have approximately the same number of turns, and similarly, the second sensing coil patterns 2514b, which are positioned at different locations from each other, may be configured to have the same number of turns.

[0232] A sensing coil via hole (H_v2) may be formed at the start or end point of the first sensing coil pattern 2514a, and the sensing coil via hole (H_v2) may be connected to the end or start point of the second sensing coil pattern 2514b. In this way, the first sensing coil pattern 2514a and the second sensing coil pattern 2514b can be connected in series to form a single sensing coil pattern 2514.

[0233] Start or end points that are not connected by sensing coil via holes (H_v2) can be electrically connected to a signal processing unit 2518 provided in the first layer 251a via a second lead pattern 2513b formed in the first layer 251a or the second layer 251b, as shown in Figures 7 and 8.

[0234] On the other hand, the signal processing unit 2518 can be electrically connected to the temperature sensor 2515, which will be described later, via the third lead pattern 2513c. As shown in Figure 8, the third lead pattern 2513c may be formed on the second layer 251b.

[0235] As in the embodiment shown in Figure 7, when a total of 28 sensing coil patterns 2514 are provided, for example, a total of four signal processing units 2518 may be provided, and a pair of signal processing units 2518 may be formed adjacent to each other at the center of the rear edge of the first layer 251a, and the other pair of signal processing units 2518 may be arranged adjacent to each other at the center of the front edge of the first layer 251a.

[0236] As an example, using the embodiment shown in Figure 7 as a reference, the left signal processing unit 2518 of the pair of signal processing units 2518 located at the front edge of the first layer 251a may be assigned a group of six sensing coil patterns 2514 arranged on the left side of a plurality of sensing coil patterns 2514 that are divided into left and right sections and arranged toward the rear from the front edge of the first layer 251a, and a temperature sensor 2515 placed on each of these. The right signal processing unit 2518 may be assigned a group of six sensing coil patterns 2514 arranged on the right side of a plurality of sensing coil patterns 2514 that are arranged toward the rear from the front edge of the first layer 251a, and a temperature sensor 2515 placed on each of these.

[0237] A similar method may be used to assign groups of sensing coil patterns 2514 and temperature sensors 2515 to the pair of signal processing units 2518 located at the trailing edge of the first layer 251a.

[0238] In this way, by arranging the two pairs of signal processing units 2518 at positions that are maximally separated along the front-to-back direction, the structure of the second lead pattern 2513b connecting the individual sensing coil pattern 2514 to the signal processing unit 2518, and the third lead pattern 2513c connecting the individual temperature sensor 2515 to the signal processing unit 2518 can be simplified, resulting in the effect of minimizing their lengths.

[0239] Furthermore, adjacent to each signal processing unit 2518, low-power terminals (not shown) for transmitting and receiving signals and board connectors (not shown) mounted on the low-power terminals may also be mounted on the front and rear edges of the first layer 251a, respectively, for transmitting the electrical signals output to the signal processing unit 2518 to the main circuit board module 281 mentioned above.

[0240] On the other hand, as will be described later, a first lead pattern 2513a may be formed in the first layer 251a to transmit high-frequency power to the first type pattern 2512a and the second type pattern 2512b, which constitute the working coil pattern 2512.

[0241] As shown, each first lead pattern 2513a may be configured to be divided into multiple pattern books.

[0242] Therefore, the first lead pattern 2513a is divided into multiple pattern sections, minimizing power loss that may occur due to the skin effect when high-frequency power is applied.

[0243] On the other hand, considering the efficiency of power supply, a number of pattern lines may be converged at one end and the other end of the first lead pattern 2513a to form a common lead terminal 2513a1.

[0244] A common lead terminal 2513a1 formed at one end of the first lead pattern 2513a may be connected to a high-power terminal pattern 2516 formed at the front edge and rear edge of the first layer 251a, respectively.

[0245] On the other hand, the first lead pattern 2513a may be positioned inside the first layer 251a from one end and extend toward a common lead terminal 2513a1 formed at the other end.

[0246] On the other hand, in this embodiment, a pair of working coil patterns 2512 arranged adjacent to each other may be configured to be supplied with high-frequency power via three high-power terminal patterns 2516 and three first lead patterns 2513a.

[0247] In other words, if each working coil pattern 2512 is configured to be supplied with high-frequency power via a pair of high-power terminal patterns 2516 and a pair of first lead patterns 2513a, then each pair of working coil patterns 2512 must be assigned two pairs of high-power terminal patterns 2516 and two pairs of first lead patterns 2513a.

[0248] The present invention configures the circuit to supply high-frequency power to a pair of working coil patterns 2512 via three adjacent high-power terminal patterns 2516 and three first lead patterns 2513a, thereby minimizing the number of high-power terminal patterns 2516 and first lead patterns 2513a, and thus simplifying the circuit configuration.

[0249] This will be explained in more detail by referring to Figure 8.

[0250] Figure 8 is a partial enlargement of Figure 7, showing the detailed configuration of the high-power terminal pattern 2516 and the first lead pattern 2513a for supplying power to a pair of working coil patterns 2512 located adjacent to each other on the left rear side, relative to the state shown in Figure 7.

[0251] Based on the shown configuration, the leftmost high-power terminal pattern 2516 will be referred to as the first high-power terminal 2516a, the middle high-power terminal pattern 2516 as the second high-power terminal 2516b, and the rightmost high-power terminal pattern 2516 as the third high-power terminal 2516c.

[0252] Furthermore, the first lead pattern 2513a connected to the first high-power terminal 2516a will be referred to as the 1-1 lead pattern 2513a-1, the first lead pattern 2513a connected to the second high-power terminal 2516b will be referred to as the 1-2 lead pattern 2513a-2, and the first lead pattern 2513a connected to the third high-power terminal 2516c will be referred to as the 1-3 lead pattern 2513a-3.

[0253] As shown, the first high-power terminal 2516a can be electrically connected to the external common terminal of the working coil pattern 2512 located further rearward in the pair of working coil patterns 2512 via the first lead pattern 2513a-1.

[0254] Hereafter, the external common terminals of the working coil pattern 2512 will be referred to as the second common terminals 2512a-3 and 2512b-3, and the internal common terminals of the working coil pattern 2512 will be referred to as the first common terminals 2512a-2 and 2512b-2.

[0255] As will be described later, the first common terminals 2512a-2 and 2512b-2 include the first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b, and the first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b may be connected in series via a working coil via hole (H_v1). As will be described later, the first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b may be formed in positions that overlap each other perpendicularly.

[0256] Similarly, the second common terminals 2512a-3 and 2512b-3 include the second common terminal 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b, and the second common terminal 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b may be connected in series via a working coil via hole (H_v1). As will be described later, the second common terminal 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b may be formed in positions that overlap each other perpendicularly.

[0257] In this case, the common lead terminal 2513a1 formed at the other end of the first lead pattern 2513a-1 may be formed in a position that overlaps perpendicularly with the second common terminals 2512a-3 and 2512b-3 of the working coil pattern 2512 located behind it, or it may be connected in series with the second common terminals 2512a-3 and 2512b-3 of the working coil pattern 2512 via a working coil via hole (H_v1).

[0258] On the other hand, as shown, the second high-power terminal 2516b can be electrically connected to the second common terminals 2512a-3, 2512b-3 of the working coil pattern 2512 that is located further forward among the pair of working coil patterns 2512, via the first-to-second lead pattern 2513a-2.

[0259] In this case, the common lead terminal 2513a1 formed at the other end of the first-to-second lead pattern 2513a-2 may be formed in a position that overlaps perpendicularly with the second common terminals 2512a-3 and 2512b-3 of the working coil pattern 2512 which is positioned in front of it, or it may be connected in series with the second common terminals 2512a-3 and 2512b-3 of the working coil pattern 2512 via a working coil via hole (H_v1).

[0260] Furthermore, the third high-power terminal 2516c can be electrically connected simultaneously to the first common terminals 2512a-2 and 2512b-2 of the pair of working coil patterns 2512 via the first to third lead patterns 2513a-3.

[0261] That is, as shown, the first to third lead patterns 2513a-3 may have a common lead terminal 2513a1 formed at the other end, and a further common lead terminal 2513a1 may be provided at an intermediate position between one end and the other end.

[0262] The common lead terminal 2513a1 formed at the other end of the first-to-third lead pattern 2513a-3 may be electrically connected via a working coil via hole (H_v1) to the first common terminal 2512a-2, 2512b-2 of the working coil pattern 2512 that is positioned forward among a pair of working coil patterns 2512.

[0263] Furthermore, the common lead terminal 2513a1 formed in the middle of the first-to-third lead patterns 2513a-3 may be electrically connected to the first common terminals 2512a-2 and 2512b-2 of the rearmost working coil pattern 2512 of the pair of working coil patterns 2512 via a working coil via hole (H_v1).

[0264] In other words, the first to third lead patterns 2513a-3 may be configured to act as a common lead pattern that can simultaneously supply power to a pair of working coil patterns 2512.

[0265] Therefore, when only the rear working coil pattern 2512 is driven, the driving of the pair of working coil patterns 2512 may be controlled by supplying power to the first high-power terminal 2516a and the third high-power terminal 2516c and cutting off power to the second high-power terminal 2516b; when only the front working coil pattern 2512 is driven, power is supplied to the second high-power terminal 2516b and the third high-power terminal 2516c and cutting off power to the first high-power terminal 2516a; and when the pair of working coil patterns 2512 are driven simultaneously, power is supplied to all of the first to third high-power terminals 2516c.

[0266] On the other hand, based on the state shown in Figures 7 and 8, multiple edge notches 2517 may be formed on the front and rear edges of the first layer 251a.

[0267] The edge notch 2517 serves to provide a coupling space into which a connector (not shown) that supplies high-frequency power to the high-power terminal pattern 2516 is sandwiched and coupled.

[0268] As shown, the individual high-power terminal patterns 2516 may be arranged in such a way that they are divided via the edge notches 2517 that the connectors are clamped and coupled to the edge notches 2517 and connected to the high-power terminal patterns 2516.

[0269] Thus, the edge notch 2517 plays the role of providing a space into which the connector described later is connected. Therefore, considering its function and shape, the edge notch 2517 can be referred to as a connector connection part, edge part, cut-out part, opening, etc. In order to reduce manufacturing costs through parts commonality, connectors having the same shape and structure may be connected to each edge notch 2517. For this reason, each edge notch 2517 may be formed to have the same shape and size as the others.

[0270] On the other hand, as shown in FIG. 9, the edge notch 2517 may be entirely formed from the first layer 251a of the first coil circuit board module 251 through the second layer 251b to the twelfth layer 251l.

[0271] Furthermore, a screw hole (H_sc) may be formed through the first coil circuit board module 251. Similar to the edge notch 2517, the screw hole (H_sc) may be formed penetrating from the first layer 251a to the twelfth layer 251l.

[0272] A fastening means such as a screw bolt (not shown) may pass through the screw hole (H_sc) and be coupled to the aforementioned board supporter 26, whereby the first coil circuit board module 251 may be firmly fastened to the aforementioned board supporter 26.

[0273] By way of example, the screw holes (H_sc) may be arranged at four corner sides so as not to interfere with the patterns constituting the first coil circuit board module 251.

[0274] Furthermore, a ground terminal for grounding the first coil circuit board module 251 may be formed on the first layer 251a around the screw hole (H_sc).

[0275] On the other hand, the first coil circuit board module 251 may be provided with a light-transmitting slit hole (H_sl) formed penetrating from the first layer 251a to the twelfth layer 251l.

[0276] The aforementioned light source module 23 may be arranged below the light-transmitting slit hole (H_sl), and visible light generated from the light source module 23 may pass through the light-transmitting slit hole (H_sl) and irradiate the lower surface of the top plate 21. Thereby, a linearly extending display line (L) may be formed on the top plate 21.

[0277] In order to implement a linearly extending display line (L), the light-transmitting slit hole (H_sl) may extend linearly corresponding to the shape of the display line (L).

[0278] However, as shown in Fig. 7, in order to prevent the rigidity of the first coil circuit board module 251 from decreasing sharply, the light-transmitting slit hole (H_sl) may be formed by being divided into a plurality of pieces, and the divided light-transmitting slit holes (H_sl) may be arranged linearly.

[0279] Furthermore, a connecting portion for connecting the divided light-transmitting slit holes (H_sl) may be provided between the divided light-transmitting slit holes (H_sl).

[0280] The light-transmitting slit hole (H_sl) may be formed by a step of punching out a corresponding portion after all the lamination steps of the circuit board module are completed.

[0281] Alternatively, in order to project the visible light generated by the light source module 23, the two coil circuit board modules can be spaced apart such that a predetermined gap is formed between the two completely separated coil circuit board modules. This makes it possible to omit a separate punching fixing or slit hole process for the coil circuit board modules.

[0282] Hereinafter, the relative arrangement position of the sensing coil pattern 2514 and the arrangement and array structure of the temperature sensor 2515 will be described with reference to Fig. 10.

[0283] Fig. 10 is a partially enlarged plan view of the illustrated first coil circuit board module 251 as viewed from above, and both the sensing coil pattern 2514 and the working coil pattern 2512 are shown together for explanation and understanding of their relative positions. However, in the present embodiment, since the sensing coil pattern 2514 and the working coil pattern 2512 are actually disposed in different layers from each other, the sensing coil pattern 2514 and the working coil pattern 2512 cannot be observed at the same time in practice.

[0284] As mentioned above, the individual sensing coil pattern 2514, which is wound in a circular spiral shape, may be arranged such that a region partially overlaps with the working coil pattern 2512, which is wound in a square spiral shape, with respect to the vertical direction.

[0285] In this case, some of the multiple sensing coil patterns 2514 may be arranged entirely inside a single nozzle 2511 formed via a working coil pattern 2512, while other parts of the multiple sensing coil patterns 2514 may be arranged across a pair of adjacent nozzles 2511.

[0286] Figure 10(a) shows the sensing coil pattern 2514 being entirely arranged inside the working coil pattern 2512, and Figure 10(b) shows the sensing coil pattern 2514 being arranged between an adjacent pair of working coil patterns 2512.

[0287] For the time being, as will be described later, the working coil pattern 2512, which is formed by stacking multiple first-type patterns 2512a and multiple second-type patterns 2512b, can be wound multiple times to have a square spiral shape.

[0288] As an example, the first type pattern 2512a and the second type pattern 2512b that constitute the working coil pattern 2512 can be wound a total of nine times. That is, they can be wound to have nine turns. Here, each individual turn of the first type pattern 2512a and the second type pattern 2512b can be defined as a state in which they are wound once in a spiral. That is, the number of turns of nine may mean the state in which the first type pattern 2512a and the second type pattern 2512b are wound nine times in a spiral and the number of turns.

[0289] As an example, 6 to 5 pattern books 2512a-1 and 2512b-1 can be bundled together to form a single turn.

[0290] In this case, as shown, the intervals between each turn forming the first type pattern 2512a and the second type pattern 2512b are maintained at approximately constant levels, although the horizontal interval between the third turn and the fourth turn may be made slightly larger.

[0291] Thus, internal play (D1) may be formed through a relatively larger horizontal gap.

[0292] Furthermore, as shown in Figure 10(b), with reference to the state in which the first coil circuit board module 251 is positioned, an external play (D2) in the front-to-back direction may be formed between a pair of working coil patterns 2512 that are positioned adjacent to each other in the front-to-back direction, similar to the internal play (D1).

[0293] The internal play (D1) and external play (D2) may be formed to have the same size as each other. For example, the internal play (D1) and external play (D2) may be in the range of 3.8 mm to 4.2 mm, preferably 4 mm.

[0294] As shown, the sensing coil pattern 2514 may be arranged such that its center point is located within the internal play (D1) and external play (D2).

[0295] Preferably, as shown in Figure 10(a), when the center point of the sensing coil pattern 2514 is located in the internal play (D1), the center point of the sensing coil pattern 2514 can substantially coincide with the intermediate position between the third turn and the fourth turn.

[0296] Furthermore, preferably, as shown in Figure 10(b), if the center point of the sensing coil pattern 2514 is located in the external play (D2), the center point of the sensing coil pattern 2514 can substantially coincide with the intermediate position between a pair of adjacent working coil patterns 2512.

[0297] Further, as described above, each of the first sensing coil pattern 2514a and the second sensing coil pattern 2514b has a region in which no pattern is formed inside itself, whereby a first central inner region 2514c may be formed on the inner side of the sensing coil pattern 2514.

[0298] As shown, the first central inner region 2514c of the sensing coil pattern 2514 may have a disc shape, and the diameter of the disc-shaped inner region may be formed to be the same as or slightly smaller than the sizes of the inner clearance (D1) and the outer clearance (D2).

[0299] The inner clearance (D1) and outer clearance (D2) of the working coil pattern 2512, and the first central inner region 2514c of the sensing coil pattern 2514 can provide a space where the temperature sensor 2515 can be mounted.

[0300] As shown, in the first central inner region 2514c of each sensing coil pattern 2514, a temperature sensor 2515 for sensing the temperature of the top plate 21 may be mounted on the first layer 251a. At this time, the sizes of the inner clearance (D1) and the outer clearance (D2) and the diameter of the sensing coil pattern 2514 may be formed larger than the size of the temperature sensor 2515, that is, the width in the vertical direction.

[0301] Thereby, as viewed from the top plate 21, each individual temperature sensor 2515 is located at a position surrounded by the corresponding sensing coil pattern 2514, and may be arranged on the first layer 251a so as to belong to the first central inner region 2514c.

[0302] Further, in order to prevent interference with the sensing coil pattern 2514, the temperature sensor 2515 may be arranged inside the first central inner region 2514c at a position where no overlapping in the vertical direction occurs with respect to the sensing coil pattern 2514 as shown.

[0303] On the other hand, as an example, the temperature sensor 2515 can be a chip-type SMD (Surface Mounted Device) sensor that is relatively small, easy to mount on the first layer 251a, and has excellent sensing capabilities.

[0304] The SMD type temperature sensor 2515 may, for example, consist of a sensor body, a thermistor placed in the sensor body, and a pair of electrodes exposed on the upper end surface of the first coil circuit board module 251.

[0305] These temperature sensors 2515 may be mounted on the upper end surface of the first coil circuit board module 251. That is, the temperature sensors 2515 may be attached to and fixed to the upper end surface of the first coil circuit board module 251.

[0306] More specifically, the first coil circuit board module 251 is provided with a pair of conductive sensor pads (not shown) for attaching the temperature sensor 2515, and the pair of electrodes of the temperature sensor 2515 may be attached to the pair of sensor pads, respectively.

[0307] In this case, the pair of electrodes of the temperature sensor 2515 may be electrically connected to and attached to the corresponding pair of pads by various physical and chemical methods such as welding, soldering, or adhesive.

[0308] However, when the SMD type temperature sensor 2515 is attached to and mounted on the upper surface of the first coil circuit board module 251, it is highly likely to be affected by the heat generated from the working coil pattern 2512.

[0309] These components need to be positioned as far away from the working coil pattern 2512 as possible, with respect to the horizontal direction, in order to minimize the impact of heat generation on the working coil pattern 2512.

[0310] To minimize the effects of such heat generation, the region where the first central internal region 2514c of the sensing coil pattern 2514 and the internal play (D1) overlap, and the region where the first central internal region 2514c of the sensing coil pattern 2514 and the external play (D2) overlap can be selected.

[0311] Figure 10 shows that the temperature sensor 2515 is positioned so that its center point and the center point of the first central internal region 2514c of the sensing coil pattern 2514 approximately coincide. However, this is merely illustrative, and even if the temperature sensor 2515 is simply positioned at any location in the region where the first central internal region 2514c of the sensing coil pattern 2514 and the internal play (D1) overlap, and the region where the first central internal region 2514c of the sensing coil pattern 2514 and the external play (D2) overlap, the influence of heat generation from the working coil pattern 2512 can be minimized.

[0312] Furthermore, by configuring the temperature sensor 2515 to be positioned in the region where the first central internal region 2514c of the sensing coil pattern 2514 and the internal play (D1) overlap, and in the region where the first central internal region 2514c of the sensing coil pattern 2514 and the external play (D2) overlap, it is possible to effectively secure space for the installation of the third lead pattern 2513c that electrically connects the temperature sensor 2515 and the signal processing unit 2518, and the temperature sensor via hole (H_v3) to which the temperature sensor 2515 and the third lead pattern 2513c are connected.

[0313] In this case, as described above, the SMD type temperature sensor 2515 may have a first electrode and a second electrode formed at both ends, with respect to the vertical direction, and the first layer 251a may be provided with a pair of sensor pads that are soldered to these first and second electrodes, respectively.

[0314] As shown, in this embodiment, the direction in which the first electrode and the second electrode provided at both ends of the temperature sensor 2515 are arranged to be separated from each other may be aligned with the direction of travel of the working coil pattern 2512 arranged adjacent to the temperature sensor 2515, or may be arranged in a direction that intersects the direction of travel of the working coil pattern 2512.

[0315] In other words, as shown in Figure 10(a), when the temperature sensor 2515 is positioned in the first play (D1) region, the individual pattern lines 2512a-1 and 2512b-1 of the working coil pattern 2512 arranged adjacent to both sides of the temperature sensor 2515 will advance along the front-to-back direction. Therefore, the direction in which the first and second electrodes of the temperature sensor 2515 positioned in the first play (D1) region are arranged to be separated from each other may be the front-to-back direction or the left-to-right direction intersecting the front-to-back direction.

[0316] Furthermore, as shown in Figure 10(b), when the temperature sensor 2515 is positioned in the second play (D2) region, the individual pattern lines 2512a-1 and 2512b-1 of the working coil pattern 2512 arranged adjacent to both sides of the temperature sensor 2515 will advance along the left-right direction. Therefore, the direction in which the first and second electrodes of the temperature sensor 2515 positioned in the second play (D2) region are arranged to be separated from each other may be the left-right direction or the front-back direction intersecting the left-right direction.

[0317] In this case, the first and second electrodes of the temperature sensor 2515 located in the first play (D1) region, and the pair of sensor pads corresponding to the first and second electrodes of the temperature sensor 2515 located in the second play (D2), may be arranged to have the same orientation as these electrodes.

[0318] This allows the third lead pattern 2513c to extend toward the signal processing unit 2518 in order to transmit the electrical signal generated from the temperature sensor 2515 to the signal processing unit 2518, without interfering with the working coil pattern 2512, or with minimal interference with the working coil pattern 2512.

[0319] More specifically, the portion of the third lead pattern 2513c that overlaps with the sensing coil pattern 2514 and extends across the sensing coil pattern 2514 may be present in any of the third to seventh layers 251c, 251d, 251e, 251f, 251g on which the first type pattern 2512a is formed, or in any of the eighth to twelfth layers 251h, 251i, 251j, 251k, 251l on which the second type pattern 2512b is formed.

[0320] As an example, in this embodiment, as shown in Figure 13, a third lead pattern 2513c may be provided on any of the 8th to 12th layers 251h, 251i, 251j, 251k, 251l on which the second type pattern 2512b is formed, and the third lead pattern 2513c formed on any of the 8th to 12th layers 251h, 251i, 251j, 251k, 251l may extend within the first play (D1) and the second play (D2) so as to be aligned with the pattern book 2512b-1 of the second type pattern 2512b.

[0321] As a result, the third lead pattern 2513c may extend while effectively avoiding the working coil pattern 2512.

[0322] The remainder of the third lead pattern 2513c may be formed in the first layer 251a or the second layer 251b, as shown in Figures 9 and 10, so as not to interfere with the working coil pattern 2512.

[0323] The following describes the detailed configurations of the first type pattern 2512a and the second type pattern 2512b that constitute the working coil pattern 2512, with reference to Figures 11 to 16.

[0324] Figure 11 shows the planar structure of the third layer 251c of the first coil circuit board module 251, which has a multilayer structure.

[0325] The configuration of the third layer 251c of the first coil circuit board module 251 described below can be similarly applied to the fourth to seventh layers 251d, 251e, 251f, and 251g, unless otherwise specified.

[0326] Referring to Figure 11, the third layer 251c of the first coil circuit board module 251 may have a first type pattern 2512a of a working coil pattern 2512 consisting of a total of eight torches 2511 arranged thereon.

[0327] As shown, one nozzle 2511 may be assigned one type 1 pattern 2512a, and the size of each type 1 pattern 2512a may be the same so that the individual nozzles 2511 are formed to be of the same size.

[0328] In this case, as an example, the eight nozzles 2511 may be arranged in a grid pattern, thereby arranging the first type pattern 2512a in a grid pattern.

[0329] Therefore, although they are arranged in a grid pattern, the first type pattern 2512a may be configured to be wound in a square spiral shape, thereby uniformly forming a heating region inside the third layer 251c.

[0330] On the other hand, when multiple Type 1 patterns 2512a are arranged in a grid pattern, these Type 2 patterns 2512b may be arranged symmetrically.

[0331] In other words, the multiple Type 1 patterns 2512a may be arranged symmetrically with respect to the translucent slit hole (H_sl) which is the center line in the left-right direction of the third layer 251c.

[0332] Furthermore, the multiple Type 1 patterns 2512a may be arranged symmetrically in the front-to-back direction with respect to the front-to-back center line of the third layer 251c. With respect to the shown embodiment, the front-to-back center line of the third layer 251c can be defined as a virtual horizontal line that divides the total of eight nozzles 2511 along the front-to-back direction into four front nozzles 2511 and four rear nozzles 2511.

[0333] By arranging multiple such first-type patterns 2512a symmetrically, the length of the first lead pattern 2513a can be minimized in order to supply high-frequency power to individual third layers 251c, thereby simplifying the structure of the first lead pattern 2513a.

[0334] Figure 12 shows the planar structure of the eighth layer 251h of the first coil circuit board module 251, which has a multilayer structure.

[0335] The configuration of the 8th layer 251h of the first coil circuit board module 251 described below can be similarly applied to the 9th to 12th layers 251i, 251j, 251k, and 251l, unless otherwise specified.

[0336] As shown in Figure 12, the eighth layer 251h of the first coil circuit board module 251 may have a second type pattern 2512b of a working coil pattern 2512 consisting of a total of eight torches 2511 arranged thereon.

[0337] As shown, one type 2 pattern 2512b may be assigned to one nozzle 2511, and the size of each type 2 pattern 2512b may be formed to be the same so that the size of the individual nozzles 2511 is formed to be the same.

[0338] In this case, similar to the first type pattern 2512a, the second type pattern 2512b may be arranged in a grid pattern.

[0339] Furthermore, similar to the first type pattern 2512a described above, the multiple second type patterns 2512b may be arranged symmetrically from left to right with respect to the light-transmitting slit hole (H_sl), or the multiple second type patterns 2512b may be arranged symmetrically from front to back with respect to the front-to-back center line of the third layer 251c.

[0340] Figure 13 shows Type 1 pattern 2512a and Type 2 pattern that form a single identical nozzle 2511.

[0341] The first type pattern 2512a and the second type pattern 2512b shown in Figure 13 may be arranged in a layered structure along the vertical direction, as described above, so that they can form the same nozzle 2511 with each other.

[0342] As shown in Figure 13, the first type pattern 2512a and the second type pattern 2512b constituting the working coil pattern 2512 can be wound in a square spiral shape from the first common terminals 2512a-2, 2512b-2 formed on the inside to the second common terminals 2512a-3, 2512b-3 formed on the outside, as described above.

[0343] As an example, windings can be made in a total of nine turns from the first common terminals 2512a-2, 2512b-2 to the second common terminals 2512a-3, 2512b-3. That is, the windings may be made to have nine turns.

[0344] As shown, the first common terminals 2512a-2, 2512b-2 may be formed at an eccentric position outward from the center of the nozzle 2511. That is, a region may be formed in the center of the nozzle 2511 where the first type pattern 2512a and the second type pattern 2512b are not formed. This is to prevent overheating that may occur if the heat generated by the individual pattern books 2512a-1, 2512b-1 concentrates in the center of the nozzle 2511. Although not shown, means for preventing overheating towards the center of the nozzle 2511 may be further provided in the form of via holes on the center side of the nozzle 2511.

[0345] Furthermore, as mentioned above, although the intervals between each turn forming the first type pattern 2512a and the second type pattern 2512b are maintained at approximately constant levels, an internal gap (D1) may be formed between the third turn and the fourth turn to accommodate the placement of the temperature sensor 2515.

[0346] On the other hand, as an example, in the first type pattern 2512a, six pattern pieces 2512a-1 can be bundled together to form one turn, and in the second type pattern 2512b, five pattern pieces 2512b-1 can be bundled together to form one turn.

[0347] The widths of the individual pattern pieces 2512a-1 and 2512b-1 that constitute the first type pattern 2512a and the second type pattern 2512b may be similarly formed in the range of 0.27 mm to 0.33 mm, preferably 0.3 mm.

[0348] However, although the first type pattern 2512a consists of a total of six individual pattern books 2512a-1 that constitute one turn, the first to ninth turns are not performed solely by the six individual pattern books 2512a-1.

[0349] Similarly, in the second type pattern 2512b, although a total of five individual pattern books 2512b-1 constitute one turn, turns 1 through 9 are not performed solely by the five individual pattern books 2512b-1.

[0350] In other words, the first type pattern 2512a is performed from the first to the ninth turn, and when one turn is completed, one of the six individual pattern books 2512a-1 is interrupted, and a new individual pattern book 2512a-1 is performed anew, thus allowing a large number of pattern books 2512a-1 to be divided and arranged.

[0351] Similarly, the second type pattern 2512b can be performed from the first to the ninth turn, and when one turn is completed, one of the five individual pattern books 2512b-1 is interrupted, and a new individual pattern book 2512b-1 is performed anew, thus allowing multiple pattern books 2512b-1 to be divided and arranged.

[0352] In this way, the first type pattern 2512a and the second type pattern 2512b are formed via a large number of divided individual pattern pieces 2512a-1, 2512b-1, thereby eliminating the effect of bundled wires, similar to Litz wire applied to conventional cooktops.

[0353] In this case, as shown in Figure 14, the start and end points of individual pattern pieces 2512a-1 of the first type pattern 2512a, which are arranged to constitute a new turn, and the start and end points of individual pattern pieces 2512b-1 of the second type pattern 2512b, which are arranged to constitute a new cylinder, may each be connected in series via working coil via holes (H_v1).

[0354] In this case, the working coil via holes (H_v1) that connect the start and end points of the individual pattern book 2512a-1 of the first type pattern 2512a to the start and end points of the individual pattern book 2512b-1 of the second type pattern 2512b may be configured to penetrate the entire area from the third layer 251c to the twelfth layer 251l, as shown in Figure 15, and to connect the individual pattern books 2512a-1 and 2512b-1 arranged in each layer all at once.

[0355] However, as shown in Figure 14, the individual pattern pieces 2512a-1 constituting the first type pattern 2512a and the individual pattern pieces 2512b-1 constituting the second type pattern 2512b may be configured to extend in opposite directions.

[0356] For example, individual pattern pieces 2512a-1 constituting the first type pattern 2512a may extend along the first direction (W1), and individual pattern pieces 2512b-1 constituting the second type pattern 2512b may extend along the second direction (W2), which is opposite to the first direction (W1).

[0357] As illustrated, the first direction (W1) may be clockwise, and the second direction (W2) may be counterclockwise.

[0358] Therefore, when high-frequency power is supplied through the same working coil via hole (H_v1), currents with opposite directions may flow through the individual pattern 2512a-1 of the first type pattern 2512a and the individual pattern 2512b-1 of the second type pattern 2512b, which are simultaneously electrically connected to the same working coil via hole (H_v1), and a magnetic field in opposite directions may be formed.

[0359] Thus, by forming magnetic fields in opposite directions in the first type pattern 2512a and the second type pattern 2512b, a magnetic field dispersion effect can be generated, similar to that of conventional twisted Litz wires.

[0360] As a result, the magnetic fields generated by the first pattern 2512a and the second pattern 2512b are not concentrated in specific parts of the container, but are instead transmitted uniformly to the container, thereby improving the heating efficiency and heating effect on the container.

[0361] On the other hand, as shown in Figure 16, a number of working coil via holes (H_v1) may be formed at the first common terminal 2512a-2 of the first type pattern 2512a and the first common terminal 2512b-2 of the second type pattern 2512b in order to minimize losses due to resistance.

[0362] Such a large number of working coil via holes (H_v1) may be formed to penetrate throughout from the first layer 251a to the twelfth layer 251l so as to be electrically connected to the first lead pattern 2513a formed in the first layer 251a.

[0363] Thus, by forming a common working coil via hole (H_v1) through the entire layer, the heat generated by the individual working coil patterns 2512 may be effectively released from the first coil circuit board module 251 through the working coil via hole (H_v1). In other words, the working coil via hole (H_v1) can act as a vent to prevent overheating of the first coil circuit board module 251.

[0364] Although not shown in Figure 16, similar to the first common terminals 2512a-2 and 2512b-2, the second common terminal 2512a-3 of the first type pattern 2512a and the second common terminal 2512b-3 of the second type pattern 2512b may also have numerous working coil via holes (H_v1) formed throughout from the first layer 251a to the twelfth layer 251l.

[0365] [Detailed structure of dummy via holes and dummy patterns] In the following, with reference to Figures 17 to 26, the detailed configuration of the dummy via holes (H_vd) and dummy patterns 2519 provided in the first coil circuit board module 251 according to the present invention will be described.

[0366] For the time being, Figures 17 to 21 show a configuration in which a dummy via hole (H_vd) is formed in the first coil circuit board module 251 according to the first embodiment of the present invention.

[0367] Referring to Figures 17 and 18, a central internal region 2512a-1 may be formed inside the working coil pattern 2512 that constitutes the first coil circuit board module 251, in which the pattern bodies 2512a-1 and 2512b-1 that constitute the working coil pattern 2512 are not formed.

[0368] To distinguish it from the first central internal region 2514c of the sensing coil pattern 2514 mentioned above, the central internal region of the working coil pattern 2512 will be referred to as the second central internal region 2511a below.

[0369] As mentioned above, when high-frequency power is applied to the working coil pattern 2512 in order to heat the container, each pattern 2512a-1 and 2512b-1 acts as a resistor, generating a considerable amount of heat.

[0370] In particular, as in this embodiment, when the working coil pattern 2512 is wound in a spiral shape, there is a very high probability that the highest temperature distribution will be observed in the second central internal region 2511a where the heat generated by the numerous pattern strands 2512a-1, 2512b-1 are superimposed. This makes it very likely that eddy current losses will occur in the working coil pattern 2512.

[0371] To prevent overheating and eddy current loss of the first coil circuit board module 251 due to the superposition of such heat, the first coil circuit board module 251 constituting the cooktop 20 of the cooking appliance 1 according to the first embodiment of the present invention may be configured to include a second central internal region 2511a on which pattern lines 2512a-1 and 2512b-1 are not formed.

[0372] However, in the second central internal region 2511a inside the working coil pattern 2512, the pattern mains 2512a-1 and 2512b-1 are not formed, resulting in a region that is at least partially filled with insulating material formed only from prepreg, specifically FR-4, as described above.

[0373] In particular, as in the embodiment, when the working coil patterns 2512 are arranged in a layered structure along the vertical direction in a total of 10 layers to constitute the individual burner nozzles 2511, regions may be formed where the working coil patterns 2512 are not formed over the entirety of the 10 layers, and regions filled only with insulating material may be formed.

[0374] In this case, as shown in Figures 17 and 18, if the sensing coil pattern 2514 or lead pattern 2513 formed on the first layer 251a and the second layer 251b, respectively, in a manner relative to the embodiment, is arranged to partially overlap with the second central internal region 2511a, then the second central internal region 2511a can be divided into an overlapping region 2511a-1, where the patterns are overlapped along the vertical direction, and a non-overlapping region 2511a-2, where the patterns are not overlapped along the vertical direction.

[0375] Furthermore, similar to the second central internal region 2511a, the inter-turn region 2511b formed between turns of working coil patterns 2512 that are spaced apart from each other may have an overlapping region 2511b-1 and a non-overlapping region 2511b-2, and the inter-coil region 2511c formed between working coil patterns 2512 that form different torches 2511 can be divided into an overlapping region 2511c-1 and a non-overlapping region 2511c-2.

[0376] These non-overlapping regions 2511a-2, 2511b-2, and 2511c-2, based on the embodiment, must have a structure formed only of insulating material, without any pattern being formed from the first layer 251a to the twelfth layer 251l, that is, from the upper end surface 251t to the lower end surface 251v of the first coil circuit board module 251.

[0377] Therefore, because the interlayer structure between the multilayers is formed with only insulating material without a pattern from the upper end surface 251t to the lower end surface 251v, the rigidity is significantly weakened, and the non-superimposed region 2511a-2 of the second central internal region 2511a is more likely to experience thermal deformation due to heat generation from the working coil pattern 2512, and will be filled with prepreg alone, which is likely to increase manufacturing costs.

[0378] To minimize thermal deformation and increased manufacturing costs due to reduced rigidity of the first coil circuit board module 251, these non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 may be provided with at least one via hole (H_vd) formed in an electrically isolated manner from other patterns, such as the working coil pattern 2512 and the sensing coil pattern 2514, as shown in Figures 17 and 18.

[0379] Thus, at least one via hole (H_vd) provided in the non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 can be referred to as a dummy via hole (H_vd) because it is formed in an electrically isolated state from other patterns and does not serve the purpose of power supply or signal transmission. Hereafter, via holes provided in the non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 will be referred to as dummy via holes (H_vd).

[0380] Since the dummy via hole (H_vd) is located in the non-overlapping region 2511a-2 of the first coil circuit board module 251, it is positioned so as not to contact or overlap with other patterns, including the working coil pattern 2512, the sensing coil pattern 2514, and the lead pattern 2513, with respect to the vertical direction.

[0381] Therefore, when viewed from the top plate 21, the dummy via holes (H_vd) may be arranged so as to belong entirely to the non-overlapping region 2511a-2 of the second central internal region 2511a, the non-overlapping region 2511c-2 of the inter-coil region 2511c, and the non-overlapping region 2511b-2 of the inter-turn region 2511b.

[0382] Furthermore, as shown in Figure 17, the dummy via holes (H_vd) are positioned so as not to contact or overlap with other patterns, including the working coil pattern 2512, with respect to the vertical direction. Therefore, the shapes and sizes of the non-overlapping regions 2511a-2 of the second central internal region 2511a, 2511c-2 of the inter-coil region 2511c, and 2511b-2 of the inter-turn region 2511b may differ or be formed irregularly depending on their respective positions. Thus, as shown, the shapes in which the dummy via holes (H_vd) are positioned in these non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 may differ or be formed irregularly depending on their respective positions.

[0383] Here, "irregular" means that the position and number of dummy via holes (H_vd) may be set in a point-asymmetrical and line-asymmetrical manner based on the center point or a line crossing the center of each individual working coil pattern 2512. This is because the shape and arrangement of the working coil patterns 2512 and the sensing coil patterns 2514 are asymmetrical, and each individual working coil pattern 2512 and individual sensing coil pattern 2514 has terminals or ends, and the lead pattern 2513 passes through the region between adjacent working coil patterns 2512 and the region between adjacent sensing coil patterns 2514. As a result, the arrangement of dummy via holes (H_vd) may also be asymmetrical.

[0384] Furthermore, by positioning dummy via holes (H_vd) so as not to come into contact with conductors such as the working coil pattern 2512 and the sensing coil pattern 2514, the electrical conduction of the working coil pattern 2512 and the sensing coil pattern 2514 is not hindered, and the heat dissipation performance of the first coil circuit board module 251 can be improved.

[0385] On the other hand, as described above, the present invention provides a working coil via hole (H_v1), a sensing coil via hole (H_v2) for the purpose of transmitting the output signal of the sensing coil pattern 2514, and a temperature sensor via hole (H_v3) for the purpose of transmitting the output signal of the temperature sensor 2515, for supplying power to the working coil pattern 2512 arranged in a multilayer structure.

[0386] The dummy via hole (H_vd) may be configured to have the same shape and size as the working coil via hole (H_v1), the sensing coil via hole (H_v2), and the temperature sensor via hole (H_v3).

[0387] Therefore, the system may be configured to allow the processing of dummy via holes (H_vd) without changing the settings or manufacturing equipment for forming functional via holes such as working coil via holes (H_v1), sensing coil via holes (H_v2), and temperature sensor via holes (H_v3). Thus, it is possible to minimize the increase in manufacturing costs and manufacturing time required to further form dummy via holes (H_vd).

[0388] However, this is merely illustrative, and the dummy beer hole (H_vd) may be configured to have a different shape and size from the other functional beer holes described above, which is naturally within the scope of the present invention. The present invention is not limited thereto, but below, as an example, an embodiment in which the dummy beer hole (H_vd) is configured to have the same shape and size as the other functional beer holes will be described as a basis.

[0389] Figures 19 and 20 illustrate an example in which a plurality of dummy via holes (H_vd) are provided in the non-overlapping region 2511a-2 of the second central internal region 2511a of the working coil pattern 2512 that forms a particular nozzle 2511.

[0390] In the following, the configuration for the dummy via hole (H_vd) can be applied in much the same way to the non-overlapping region 2511b-2 of the inter-turn region 2511b and the non-overlapping region 2511c-2 of the inter-coil region 2511c, unless otherwise specified.

[0391] As shown in Figure 19, the multiple dummy via holes (H_vd) may be arranged in a grid pattern in the non-overlapping region 2511a-2 of the second central internal region 2511a when viewed from the top plate 21.

[0392] In Figure 19, the area within the second central internal region 2511a where dummy via holes (H_vd) are not placed, near the left and right edges, is the superimposed region 2511a-1, and in particular, it corresponds to the region that superimposes with the sensing coil pattern 2514 in the vertical direction.

[0393] As in the embodiment, if the working coil pattern 2512 is wound in a square spiral shape, a second central internal region 2511a having a substantially square shape may be formed inside the working coil pattern 2512.

[0394] Taking into account the shape of these second central internal regions 2511a, individual dummy via holes (H_vd) may be linearly arranged along a direction parallel to the extending direction of the working coil pattern 2512. Thus, multiple dummy via holes (H_vd) may be arranged in a grid pattern within the second central internal region 2511a.

[0395] Furthermore, by arranging them in a grid pattern in this manner, the spacing between adjacent dummy via holes (H_vd) can be maintained to be approximately equal, and multiple dummy via holes (H_vd) may be arranged in such a way that the non-overlapping region 2511a-2 of the second central internal region 2511a can be uniformly filled overall.

[0396] In this case, the multiple dummy via holes (H_vd) may be arranged in a square grid, as shown in Figure 20(a), or in a hexagonal grid, as shown in Figure 20(b).

[0397] In this way, by arranging multiple dummy via holes (H_vd) in a square or hexagonal grid, the horizontal spacing (G_vd) between the centers of adjacent dummy via holes (H_vd) can be maintained at approximately the same level.

[0398] More specifically, as shown in Figure 20(a), when multiple dummy via holes (H_vd) are arranged in a square grid, the spacing between the centers of adjacent dummy via holes (H_vd) can be kept the same in the front-to-back and left-to-right directions, but the spacing in the diagonal direction may be made somewhat larger. This results in the multiple dummy via holes (H_vd) being arranged in a fairly dense manner.

[0399] Therefore, the square grid arrangement is suitable for positions where the rigidity of the first coil circuit board module 251 needs to be reinforced more significantly, such as the central position of the working coil pattern 2512, or for positions where the greatest amount of heat generation is expected.

[0400] Furthermore, as shown in Figure 20(b), when multiple dummy via holes (H_vd) are arranged in a hexagonal grid, the spacing between the centers of adjacent dummy via holes (H_vd) in the front-to-back direction, the spacing in the left-to-right direction, and the spacing in the diagonal direction may all be formed to be approximately the same. As a result, the multiple dummy via holes (H_vd) are arranged in a relatively slightly denser state compared to a square grid arrangement.

[0401] Therefore, the square grid arrangement is suitable for positions where the rigidity of the first coil circuit board module 251 is not relatively insufficient, such as positions that are horizontally close to the working coil pattern 2512, or for positions where significant heat generation is not expected.

[0402] On the other hand, when multiple dummy via holes (H_vd) are arranged in a grid pattern, the horizontal spacing between the centers of adjacent dummy via holes (H_vd) must be larger than the outer diameter of the top pad (H_vd2) and the bottom pad (H_vd3) that constitute the dummy via hole (H_vd).

[0403] This is to prevent damage that may occur due to interference with adjacent dummy via holes (H_vd) during the machining process of individual dummy via holes (H_vd).

[0404] Furthermore, this takes into account the possibility that the rigidity of the first coil circuit board module 251 may actually decrease if multiple dummy via holes (H_vd) are formed by getting too close.

[0405] On the other hand, Figure 21 shows the vertical cross-sectional shape of the dummy via hole (H_vd) shown in Figure 20.

[0406] Similar to the functional via holes described above, the exemplary dummy via hole (H_vd) may include a top pad (H_vd2) formed on the upper end surface 251t of the first coil circuit board module 251, a bottom pad (H_vd3) formed on the lower end surface 251v of the first coil circuit board module 251, and an internal conductor (H_vd4) that extends along the through hole (H_vd1) of the first coil circuit board module 251, electrically connecting the top pad (H_vd2) and the bottom pad (H_vd3).

[0407] Similar to a functional beer hole, the top pad (H_vd2) and bottom pad (H_vd3) of the dummy beer hole (H_vd) may be formed in a disc shape, and the internal conductor (H_vd4) may be configured in a cylindrical shape with its upper and lower ends integrally connected to the top pad (H_vd2) and bottom pad (H_vd3), respectively.

[0408] Furthermore, similar to functional via holes, the top pad (H_vd2), bottom pad (H_vd3), and internal conductor (H_vd4) that constitute the dummy via hole (H_vd) may be formed by chemically or physically depositing conductive metal material to form a thin film.

[0409] Therefore, by arranging dummy via holes (H_vd) made of a metal material having even greater strength than the insulating material formed by the prepreg, so as to extend vertically in the second central internal region 2511a, the dummy via holes (H_vd) can act as a framework that reinforces the vertical rigidity of the first coil circuit board module 251.

[0410] This significantly improves the strength of the non-superposition region 2511a-2 of the second central internal region 2511a, and effectively prevents thermal deformation of the working coil pattern 2512 due to heat generation.

[0411] Furthermore, by forming the dummy via holes (H_vd) with a metal material that has higher thermal conductivity than the insulating material, the dummy via holes (H_vd) can act as a heat sink, absorbing and distributing the heat generated in the working coil pattern 2512.

[0412] This allows the heat generated in the working coil pattern 2512 to be efficiently conducted to the lower temperature side, effectively improving overheating of the second central internal region 2511a.

[0413] On the other hand, as shown in Figure 21(a), the dummy via hole (H_vd) may be provided in a through-via form, where a through hole (H_vd1) formed radially inside the internal conductor (H_vd4) is open from the upper end surface 251t to the lower end surface 251v of the first coil circuit board module 251, resulting in a hollow state.

[0414] In this way, the upper space of the upper end surface 251t of the first coil circuit board module 251 and the lower space of the lower end surface 251v of the first coil circuit board module 251 can communicate with each other through the through-hole (H_vd1) which is open overall.

[0415] In other words, the through-hole (H_vd1) of the through-via type dummy via hole (H_vd) can function as a ventilation hole that connects the upper space of the upper end surface 251t of the first coil circuit board module 251 and the lower space of the lower end surface 251v of the first coil circuit board module 251.

[0416] Therefore, through the through-hole (H_vd1) acting as a vent, the high-temperature air formed in the upper space of the second central internal region 2511a is discharged to the lower space, and the relatively low-temperature air present in the lower space can effectively flow into the upper region. This further prevents overheating of the first coil circuit board module 251.

[0417] On the other hand, as shown in Figures 21(b) and 21(c), the dummy via hole (H_vd) may be provided in the form of a blind via, where the through hole (H_vd1) formed radially inside the internal conductor (H_vd4) is at least partially blocked.

[0418] Figure 21(b) shows an example of a blind via where the top pad (H_vd2) closes the through hole (H_vd1), and Figure 21(c) shows an example of a blind via where the through hole (H_vd1) is completely filled with a conductor and formed in a solid state.

[0419] As in the embodiment, when it consists of a dummy via hole (H_vd) and a blind via, the through hole (H_vd1) is partially or completely blocked, making it impossible for it to function as a vent.

[0420] However, by filling the through-hole (H_vd1) with a conductor at least partially, it is possible to expect an effect that increases the rigidity and thermal conductivity of the dummy via hole (H_vd) compared to the sulvia type, as shown in Figure 21(a).

[0421] Although not shown in Figure 21, as will be described later, the dummy via hole (H_vd) can also be provided in the form of a buried via, which is embedded entirely inside the first coil circuit board module 251.

[0422] Figures 22 to 24 show a configuration in which a dummy pattern 2519 is formed on the first coil circuit board module 251 according to a second embodiment of the present invention.

[0423] Similar to the dummy via holes (H_vd) described above, at least one pattern 2519 may be formed in non-overlapping regions 2511a-2, 2511b-2, 2511c-2 in an electrically isolated manner from other patterns such as the working coil pattern 2512 and the sensing coil pattern 2514, in order to minimize thermal deformation and increased manufacturing costs due to reduced rigidity of the first coil circuit board module 251.

[0424] Thus, at least one pattern 2519 present in the non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 can be referred to as a dummy pattern 2519, as it is formed in an electrically isolated state from other patterns and does not serve the purpose of power supply or signal transmission. Hereinafter, at least one pattern present in the non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 will be referred to as a dummy pattern 2519.

[0425] Since the dummy pattern 2519 is located in the non-overlapping area 2511a-2 of the first coil circuit board module 251, it may be positioned so as not to contact or overlap with other patterns, including the working coil pattern 2512, with respect to the vertical direction.

[0426] Therefore, when viewed from the top plate 21, the dummy pattern 2519 may be arranged so as to belong entirely to the non-overlapping region 2511a-2 of the second central internal region 2511a, the non-overlapping region 2511c-2 of the inter-coil region 2511c, and the non-overlapping region 2511b-2 of the inter-turn region 2511b.

[0427] Furthermore, similar to the dummy via holes (H_vd) mentioned above, the dummy pattern 2519 is positioned so as not to contact or overlap with other patterns, including the working coil pattern 2512, with respect to the vertical direction. Therefore, the shapes and sizes of the non-overlapping regions 2511a-2 of the second central internal region 2511a, the non-overlapping regions 2511c-2 of the inter-coil region 2511c, and the non-overlapping regions 2511b-2 of the inter-turn region 2511b may differ depending on their position or be formed irregularly. Thus, the shapes in which the dummy pattern 2519 is positioned in these non-overlapping regions 2511a-2, 2511b-2, and 2511c-2 may differ depending on their position or be formed irregularly.

[0428] On the other hand, as described above, the present invention is configured such that the working coil pattern 2512 and the sensing coil pattern 2514 are arranged in a multilayer structure.

[0429] The dummy pattern 2519 may be configured to have the same size as the working coil pattern 2512 and the sensing coil pattern 2514, etc.

[0430] Therefore, the system may be configured to allow the dummy pattern 2519 to be processed without any changes to the settings or manufacturing equipment for forming functional patterns such as the working coil pattern 2512 and the sensing coil pattern 2514. Thus, it is possible to minimize the increase in manufacturing costs and manufacturing time required to further form the dummy pattern 2519.

[0431] However, this is merely illustrative, and the dummy pattern 2519 may be configured to have a different size from the other functional patterns described above, which is naturally within the scope of the present invention. The present invention is not limited thereto, but below, as an example, an embodiment in which the dummy pattern 2519 is configured to have the same size as the other functional patterns will be described.

[0432] Figures 22 and 23 show an example in which a plurality of dummy patterns 2519 are provided in the non-overlapping region 2511a-2 of the second central internal region 2511a of the working coil pattern 2512 that forms a specific nozzle 2511.

[0433] The configuration described below for the dummy pattern 2519 can be applied in much the same way to the non-overlapping region 2511b-2 of the inter-turn region 2511b and the non-overlapping region 2511c-2 of the inter-coil region 2511c, unless otherwise specified.

[0434] As shown in Figure 22, the multiple dummy patterns 2519 may be arranged so as to extend in a direction parallel to or intersecting the winding direction of the working coil pattern 2512 in the non-overlapping region 2511a-2 of the second central internal region 2511a when viewed from the top plate 21. Thus, the multiple dummy patterns 2519 can act as a framework to reinforce the lateral rigidity of the first coil circuit board module 251.

[0435] As in the embodiment, if the working coil pattern 2512 is wound in a square spiral shape, a second central internal region 2511a having a substantially square shape may be formed inside the working coil pattern 2512.

[0436] Taking into account the shape of the second central internal region 2511a, the individual dummy patterns 2519 may extend linearly in the front-to-back or left-to-right direction along a direction parallel to or intersecting the extending direction of the working coil pattern 2512.

[0437] In this case, the multiple dummy patterns 2519 may be configured to extend linearly along the left-right direction and be arranged in parallel while being separated from each other, as shown in Figure 23(a); to extend linearly along the diagonal direction and be arranged in parallel while being separated from each other, as shown in Figure 23(b); or to be arranged so that a pattern extending linearly along the front-back direction and a pattern extending linearly along the left-right direction are connected to each other and intersect, as shown in Figure 23(c).

[0438] As shown in Figure 23(c), the configuration in which the dummy patterns 2519 are arranged to intersect each other is suitable for positions where the rigidity of the first coil circuit board module 251 needs to be reinforced more significantly, such as the central position of the working coil pattern 2512, or for positions where the greatest amount of heat generation is expected.

[0439] Furthermore, the arrangement of the dummy patterns 2519 as shown in Figures 23(a) and 23(b) is suitable for positions where the rigidity of the first coil circuit board module 251 is not relatively insufficient, or for positions where significant heat generation is not expected, such as positions that are horizontally close to the working coil pattern 2512.

[0440] On the other hand, Figures 23(a) and 23(b) show a configuration in which individual dummy patterns 2519 are arranged parallel to each other and separated from one another. However, they may also be composed of a single connected pattern. That is, the dummy patterns 2519 may be configured to form a single continuous pattern that is not separated by connecting both ends of dummy patterns 2519 that are arranged adjacent to each other. These modifications are naturally within the scope of the present invention.

[0441] On the other hand, as described above, the present invention is configured such that the working coil pattern 2512 is arranged in a layered structure along multiple layers.

[0442] In response to this, the dummy pattern 2519 according to the second embodiment of the present invention may be arranged in a layered structure, as shown in Figure 24.

[0443] Figure 24(a) shows a configuration in which, according to this embodiment, a dummy pattern 2519 is formed only on the first layer 251a which forms the upper end surface 251t of the first coil circuit board module 251, and on the twelfth layer 251l which forms the lower end surface 251v of the first coil circuit board module 251.

[0444] Thus, the configuration in which the dummy pattern 2519 is formed only on the 12th layer 251l that forms the lower end surface 251v of the first coil circuit board module 251 is suitable for positions where the rigidity of the first coil circuit board module 251 is not relatively insufficient, such as positions that are horizontally close to the working coil pattern 2512, or for positions where it is not expected that a large amount of heat will be generated.

[0445] Furthermore, if the number of layers in the working coil pattern 2512 is five or fewer, and even fewer than in the embodiment, the first coil circuit board module 251 can be modified so that the dummy pattern 2519 is formed only on either the upper end surface 251t or the lower end surface 251v, particularly on the first layer 251a, which is further affected by the temperature of the container and top plate 21.

[0446] Furthermore, as shown in Figure 24(b), in addition to the first layer 251a and the twelfth layer 251l, the dummy pattern 2519 can also be further arranged in the inner layers, the sixth layer 251f and the seventh layer 251g.

[0447] The embodiment shown in Figure 24(b) is suitable for locations where the rigidity of the first coil circuit board module 251 is relatively insufficient compared to Figure 24(b), or for locations where a slightly larger amount of heat generation is expected.

[0448] Furthermore, as shown in Figure 24(c), the dummy pattern 2519 may be arranged in all layers from the first layer 251a to the twelfth layer 251l.

[0449] The embodiment shown in Figure 24(c) is more suitable than those in Figures 24(b) and 24(b) for locations where the rigidity of the first coil circuit board module 251 must be significantly increased or where significant heat generation is expected.

[0450] On the other hand, in the embodiment shown in Figure 24, the dummy patterns 2519 placed in each layer are arranged in each layer so as to overlap each other along the vertical direction. However, in contrast to this, the configuration may be such that no overlapping portions occur between dummy patterns 2519 placed in adjacent layers, or the degree of overlap is kept low. These modifications can be said to naturally fall within the scope of the present invention.

[0451] On the other hand, Figures 25 and 26 show a configuration in which a dummy via hole (H_vd) and a dummy pattern 2519 are formed together on the first coil circuit board module 251 according to a third embodiment of the present invention.

[0452] In the first embodiment described above, only dummy via holes (H_vd) are provided in the second central internal region 2511a of the first coil circuit board module 251, and in the second embodiment, only dummy patterns 2519 are provided in the second central internal region 2511a of the first coil circuit board module 251. However, contrary to these, the dummy via holes (H_vd) and dummy patterns 2519 may be provided together.

[0453] In other words, although the above-described embodiment was explained based on a first coil circuit board module 251 having a total of 12 layers, if the first coil circuit board module 251 has a layered structure with even more layers, the dummy via holes (H_vd) and dummy patterns 2519 alone may not be sufficient to adequately compensate for the rigidity of the second central internal region 2511a, or the overheating improvement effect may be small.

[0454] Thus, if the goal is to further reinforce the rigidity of the second central internal region 2511a or to further improve the heat generation efficiency by expanding the layers of the first coil circuit board module 251, dummy via holes (H_vd) and dummy patterns 2519 may be provided in the second central internal region 2511a, as shown in Figure 25.

[0455] The dummy pattern 2519 may be configured to extend linearly with equal intervals, similar to the dummy pattern 2519 of the second embodiment described above.

[0456] As shown, the first end 2519a and the second end 2519b of each dummy pattern 2519 can be physically connected to and integrated with the top pad (H_vd2) or bottom pad (H_vd3) of the dummy via hole (H_vd).

[0457] In other words, the dummy pattern 2519 placed on the upper end surface 251t of the first coil circuit board module 251 may be configured such that its respective first end 2519a and second end 2519b are physically connected to the top pad (H_vd2) of the dummy via hole (H_vd).

[0458] Alternatively, the dummy pattern 2519, which is placed on the lower end surface 251v of the first coil circuit board module 251, may be configured such that its respective first end 2519a and second end 2519b are physically connected to the bottom pad (H_vd3) of the dummy via hole (H_vd).

[0459] Furthermore, although not shown, if the dummy pattern 2519 is located between the upper end surface 251t and the lower end surface 251v of the first coil circuit board module 251 and is placed in an internal layer, the first end 2519a and the second end 2519b of the dummy pattern 2519 may be configured to be connected to the internal conductor (H_vd4) of the dummy via hole (H_vd), respectively.

[0460] In this way, by placing a dummy pattern 2519 between a pair of dummy via holes (H_vd) that are spaced apart from each other, and physically connecting the pair of dummy via holes (H_vd) via the dummy pattern 2519, the rigidity reinforcement efficiency and heat transfer efficiency can be further improved compared to a configuration in which the dummy pattern 2519 and the dummy via holes (H_vd) are physically separated.

[0461] However, the configuration shown in Figure 25 is merely illustrative, and it is naturally within the scope of the present invention to configure the dummy via hole (H_vd) and the dummy pattern 2519 so that they are not connected to each other. In the following, as an example, we will explain based on a configuration in which the top pad (H_vd2) and bottom pad (H_vd3) of the dummy via hole (H_vd) are connected to the first end 2519a or the second end 2519b of the dummy pattern 2519, respectively.

[0462] Figure 26 shows an exemplary connecting structure between the Derbivore Hole (H_vd) and the dummy pattern 2519.

[0463] That is, as shown in Figure 26(a), the top pad (H_vd2) or bottom pad (H_vd3) of a pair of sulvia-type dummy via holes (H_vd) may be configured to be connected by a dummy pattern 2519.

[0464] In the shown embodiment, the top pad (H_vd2) and bottom pad (H_vd3) of a pair of through-via type dummy via holes (H_vd) are configured to be connected by a dummy pattern 2519. However, it is also possible to configure the pair of dummy via holes (H_vd) to be connected by a dummy pattern 2519 to be connected by only the top pad (H_vd2) or the bottom pad (H_vd3).

[0465] Furthermore, as shown, even when the dummy via hole (H_vd) is provided in a beared via form embedded inside the first coil circuit board module 251, the dummy pattern 2519 can be connected to the top pad (H_vd2) and bottom pad (H_vd3) of the beared via, respectively.

[0466] Furthermore, as shown in Figure 26(b), it is also possible to configure the system so that two or more dummy patterns 2519 are connected to the top pad (H_vd2) or bottom pad (H_vd3) of a single dummy via hole (H_vd).

[0467] Furthermore, as shown in Figure 26(c), the first end 2519a and the second end 2519b of the dummy pattern 2519 can be connected to the top pad (H_vd2) and bottom pad (H_vd3) of the dummy via hole (H_vd) provided in the blind via configuration.

[0468] However, the above-described connection structure between the dummy via hole (H_vd) and the dummy pattern 2519 is merely illustrative.

[0469] The connecting structure of the dummy via hole (H_vd) and the dummy pattern 2519 can be modified or combined in various ways, taking into account multiple factors such as the number of layers of the first coil circuit board module 251, its vertical thickness, and the area of ​​the second central internal region 2511a, which naturally falls within the scope of the present invention.

[0470] As described above, the present invention has been explained with reference to the illustrative drawings, but it is clear that the present invention is not limited to the embodiments and drawings disclosed herein, and that various modifications can be made by an ordinary person of the art within the scope of the technical concept of the present invention. Furthermore, even if the effects of the configuration of the present invention are not explicitly described in the embodiments described above, it is natural that the effects that can be predicted by the configuration should also be recognized.

[0471] [Claims when filing an international application] [Claim 1] Cooking appliance, The top plate to which the container is attached; and, It comprises a heating unit to which power is applied, generating a magnetic field and causing the container to heat up; The heating unit includes a coil circuit board module equipped with a working coil pattern that generates the magnetic field, The cooking appliance further comprises a coil circuit board module with dummy via holes or dummy patterns formed in an electrically isolated manner from the working coil pattern. [Claim 2] The coil circuit board module further includes a sensing coil pattern that senses whether the container is securely attached, The cooking appliance according to claim 1, wherein the dummy beer hole and the dummy pattern are arranged to be electrically isolated from the sensing coil pattern. [Claim 3] With respect to the horizontal direction, a central internal region is formed inside the working coil pattern. The cooking appliance according to claim 1, wherein the dummy beer hole and the dummy pattern are arranged to belong to the central internal region when viewed from the top plate. [Claim 4] The working coil pattern forms multiple turns in a spiral shape. The working coil pattern is configured with respect to the horizontal direction, and inter-turn regions are formed between adjacent turns. The cooking appliance according to claim 1, wherein the dummy beer hole and the dummy pattern are arranged to belong to the inter-turn region when viewed from the top plate. [Claim 5] The aforementioned working coil pattern comprises multiple units, With respect to the horizontal direction, an inter-coil region is formed between multiple working coil patterns that are arranged adjacent to each other. The cooking appliance according to claim 1, wherein the dummy beer hole and the dummy pattern are arranged to belong to the inter-coil region when viewed from the top plate. [Claim 6] The aforementioned dummy beer hall consists of multiple units, The cooking appliance according to claim 1, wherein the plurality of dummy beer holes are arranged in a grid pattern when viewed from the top plate. [Claim 7] The cooking appliance according to claim 6, wherein the grid is a square grid or a hexagonal grid. [Claim 8] Each of the aforementioned dummy beer halls is: The top pad formed on the upper end surface of the coil circuit board module, and A bottom pad is electrically connected to the top pad and formed on the lower end surface of the coil circuit board module, The cooking apparatus according to claim 6, wherein the horizontal distance between the centers of a pair of adjacent beer holes among the plurality of dummy beer holes is formed to be even larger than the outer diameter of the top pad and the outer diameter of the bottom pad. [Claim 9] The cooking appliance according to claim 1, wherein the dummy via hole extends along a through hole formed in the coil circuit board module in the vertical direction, from the upper end surface of the coil circuit board module to the lower end surface of the coil circuit board module. [Claim 10] The aforementioned dummy via hole is A top pad formed on the upper end surface of the coil circuit board module, A bottom pad formed on the lower end surface of the coil circuit board module, and The cooking appliance according to claim 9, comprising an internal conductor extending along the through hole, electrically connecting the top pad and the bottom pad. [Claim 11] The cooking appliance according to claim 10, wherein the dummy beer hole is formed in a hollow state from the top pad to the bottom pad. [Claim 12] The cooking appliance according to claim 10, wherein the dummy beer hole is formed in a solid state from the top pad to the bottom pad. [Claim 13] The cooking appliance according to claim 10, wherein the dummy beer hole is formed such that at least one of the top pad and the bottom pad closes the through hole. [Claim 14] The cooking appliance according to claim 1, wherein the dummy pattern extends in a direction parallel to the winding direction of the working coil pattern, or in a direction intersecting the winding direction of the working coil pattern. [Claim 15] The aforementioned dummy pattern consists of multiple instances, The cooking appliance according to claim 1, wherein the plurality of dummy patterns are arranged in a separated state. [Claim 16] The coil circuit board module has multiple working coil patterns arranged in multiple layered structures. The cooking appliance according to claim 1, wherein the plurality of layered structures are formed integrally. [Claim 17] The aforementioned dummy pattern consists of multiple instances, The cooking appliance according to claim 19, wherein at least a portion of the plurality of dummy patterns are arranged on the upper or lower end surface of the coil circuit board module. [Claim 18] The coil circuit board module has multiple working coil patterns arranged in multiple layered structures along the vertical direction. The cooking appliance according to claim 1, wherein some of the other dummy patterns are arranged in the inner layers of the plurality of layered structures. [Claim 19] The dummy via holes and the dummy patterns are both located on the coil circuit board module. The cooking apparatus according to claim 1, wherein one end or the other end of the dummy pattern is connected to the dummy beer hole. [Claim 20] It is a home appliance, The top plate that the object comes into contact with; and, A coil circuit board module is provided, located below the top plate and having a working coil pattern for heating the container; The coil circuit board module further comprises a dummy metal part electrically isolated from the working coil pattern, in a home appliance.

Claims

1. Cooking appliance, The top plate to which the container is attached; and, It comprises a heating unit to which power is applied, generating a magnetic field and causing the container to heat up; The heating unit includes a coil circuit board module equipped with a working coil pattern that generates the magnetic field, The cooking appliance further comprises a coil circuit board module with dummy via holes or dummy patterns formed in an electrically isolated manner from the working coil pattern.

2. The coil circuit board module further includes a sensing coil pattern that senses whether the container is securely attached, The cooking apparatus according to claim 1, wherein the dummy beer hole and the dummy pattern are arranged to be electrically isolated from the sensing coil pattern.

3. With respect to the horizontal direction, a central internal region is formed inside the working coil pattern. The cooking appliance according to claim 1, wherein the dummy beer hole and the dummy pattern are arranged to belong to the central internal region when viewed from the top plate.

4. The working coil pattern forms multiple turns in a spiral shape. The working coil pattern is configured with respect to the horizontal direction, and inter-turn regions are formed between adjacent turns. The cooking appliance according to claim 1, wherein the dummy beer hole and the dummy pattern are arranged to belong to the inter-turn region when viewed from the top plate.

5. The aforementioned working coil pattern comprises multiple units, With respect to the horizontal direction, an inter-coil region is formed between multiple working coil patterns that are arranged adjacent to each other. The cooking appliance according to claim 1, wherein the dummy beer hole and the dummy pattern are arranged to belong to the inter-coil region when viewed from the top plate.

6. The aforementioned dummy beer hall consists of multiple units, The cooking appliance according to claim 1, wherein the plurality of dummy beer holes are arranged in a grid pattern when viewed from the top plate.

7. The cooking appliance according to claim 6, wherein the grid is a square grid or a hexagonal grid.

8. Each of the aforementioned dummy beer halls is: The top pad formed on the upper end surface of the coil circuit board module, and A bottom pad is electrically connected to the top pad and formed on the lower end surface of the coil circuit board module, The cooking apparatus according to claim 6, wherein the horizontal distance between the centers of a pair of adjacent beer holes among the plurality of dummy beer holes is formed to be even larger than the outer diameter of the top pad and the outer diameter of the bottom pad.

9. The cooking appliance according to claim 1, wherein the dummy via hole extends along a through hole formed in the coil circuit board module in the vertical direction, from the upper end surface of the coil circuit board module to the lower end surface of the coil circuit board module.

10. The aforementioned dummy via hole is A top pad formed on the upper end surface of the coil circuit board module, A bottom pad formed on the lower end surface of the coil circuit board module, and The cooking appliance according to claim 9, comprising an internal conductor extending along the through hole, electrically connecting the top pad and the bottom pad.

11. The cooking appliance according to claim 10, wherein the dummy beer hole is formed in a hollow state from the top pad to the bottom pad.

12. The cooking appliance according to claim 10, wherein the dummy beer hole is formed in a solid state from the top pad to the bottom pad.

13. The cooking appliance according to claim 10, wherein the dummy beer hole is formed such that at least one of the top pad and the bottom pad closes the through hole.

14. The cooking appliance according to claim 1, wherein the dummy pattern extends in a direction parallel to the winding direction of the working coil pattern, or in a direction intersecting the winding direction of the working coil pattern.

15. The aforementioned dummy pattern consists of multiple instances, The cooking apparatus according to claim 1, wherein the plurality of dummy patterns are arranged in a separated state.

16. The coil circuit board module has multiple working coil patterns arranged in multiple layered structures. The cooking appliance according to claim 1, wherein the plurality of layered structures are formed as a single unit.

17. The aforementioned dummy pattern consists of multiple instances, The cooking appliance according to claim 19, wherein at least a portion of the plurality of dummy patterns are arranged on the upper or lower end surface of the coil circuit board module.

18. The coil circuit board module has multiple working coil patterns arranged in multiple layered structures along the vertical direction. The cooking appliance according to claim 1, wherein some of the other dummy patterns are arranged in the inner layers of the plurality of layered structures.

19. The dummy via holes and the dummy patterns are both located on the coil circuit board module. The cooking apparatus according to claim 1, wherein one end or the other end of the dummy pattern is connected to the dummy beer hole.

20. It is a home appliance, The top plate that the object comes into contact with; and, A coil circuit board module is provided, located below the top plate and having a working coil pattern for heating the container; The coil circuit board module further comprises a dummy metal part electrically isolated from the working coil pattern, in a home appliance.

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