Speaker with thin film conductor

Abstract

The speaker formed by the thin film conductor according to the present invention includes a voice coil 50, a thin film conductor 60 joined to the voice coil 50, and a diaphragm 70 fixed on the thin film conductor 60, wherein the temperature T_low, which is the joining temperature of the diaphragm 70 bonded to the thin film conductor 60, is lower than the temperature T_high, which is the joining temperature of the voice coil 50 and the thin film conductor 60, and the electrode portion has a straight line, an arc shape, or a curved shape.

Description

Technical Field

[0001] The present invention relates to a speaker in which a thin film conductor is formed between a voice coil and a diaphragm.

Background Art

[0002] Generally, a speaker refers to an acoustic device that converts electrical signals into vibration of a diaphragm and generates dense and rarefied waves in air to produce sound waves. That is, a speaker is a conversion device that converts electrical energy into acoustic energy, and is largely composed of components of a vibration system, a support system, and a magnetic system. Such speakers can be classified into various types according to the position where the diaphragm, which is a component of the vibration system, is placed, the shape of the diaphragm, and the principle and method of converting electrical signals into sound waves. In particular, speakers used in display devices such as TVs are radiation-type speakers in which the diaphragm is placed directly in air, and it is common to utilize the principle that when an audio signal current is passed through a coil located in a magnetic field formed by a permanent magnet, a mechanical force acts on the coil according to the intensity of the current to cause motion.

[0003] Recently, in the speaker manufacturing process, there is a problem that speaker performance and durability deteriorate due to deterioration and deformation of heat-sensitive diaphragms.

Summary of the Invention

Problem to be Solved by the Invention

[0004] In order to solve such problems, an object of the present invention is to add a thin film conductor as an intermediate medium to prevent direct bonding between a voice coil and a diaphragm, thereby protecting the speaker including the diaphragm from bonding temperature during the manufacturing process, and realizing various shapes of electrode portions from the thin film conductor.

Means for Solving the Problem

[0005] A speaker having a thin film conductor formed on it according to one embodiment of the present invention includes a voice coil 50, a thin film conductor 60 joined to the voice coil 50, and a diaphragm 70 fixed on the thin film conductor 60, wherein the joining temperature T_low of the diaphragm 70 joined to the thin film conductor 60 is lower than the joining temperature T_high of the voice coil 50 and the thin film conductor 60.

[0006] Furthermore, the thin film conductor 60 is arranged parallel to the inner circumferential surface of the diaphragm 70.

[0007] Furthermore, the thin film conductor 60 has the shape of an arc with a certain width.

[0008] Furthermore, the thin film conductor 60 has electrode portions 62 of electrodes A and B extending from the arcuate surface of a certain width, electrode surface contact portions 64 extending and protruding from the electrode portions toward the center, and electrode end portions 66 for connecting to the PCB in a direction away from the center from the electrode portions, for energizing the voice coil 50.

[0009] Furthermore, the electrode portions 62 of electrodes A and B, the electrode surface contact portions 64 that extend and protrude from the electrode portions toward the center, and the lower surface of the diaphragm 70 are bonded together at a bonding temperature T_low.

[0010] Furthermore, the electrode portions 62 of electrodes A and B are bonded together so as to make surface contact along the curved shape of the diaphragm.

[0011] Another speaker having a thin film conductor formed according to one embodiment of the present invention includes a voice coil 50, a thin film conductor 60 joined to the voice coil 50, and a diaphragm 70 fixed on the thin film conductor 60, wherein the inner circumferential surfaces of the diaphragm 70 bonded to the thin film conductor 60 are parallel to each other, and the voice coil 50 bonded to the thin film conductor 60 may have a structure in which they are orthogonal to each other.

[0012] A method for manufacturing a speaker having a thin film conductor, according to one embodiment of the present invention, includes the steps of joining a thin film conductor 60 having the shape of an arc surface of a certain width and a voice coil 50 at a joining temperature T_high such that they are perpendicular to each other, and joining the inner circumferential surfaces of a diaphragm 70 at a joining temperature T_low such that they are in surface contact parallel to each other on a certain width of the thin film conductor 60, and is characterized in that the joining temperature T_high > T_low. [Brief explanation of the drawing]

[0013] [Figure 1] This is an exploded view of the speaker according to the present invention. [Figure 2] This is a cross-sectional view of the speaker according to the present invention, cut along the thin film conductor 60. [Figure 3] In this invention, the diaphragm is covered with a dust cap. [Figure 4] In this invention, the thin film conductor 60 is joined to the voice coil 50. [Figure 5] This is the lower shape of the speaker diaphragm of the present invention, and the structure is such that the voice coil 50 is omitted from Figure 4. [Figure 6] This is the structure of the speaker diaphragm of the present invention as seen from below. [Figure 7] This is a cross-sectional view of the speaker diaphragm of the present invention, and the enlarged view shows the diaphragm and electrode portion separately. [Figure 8] The present invention has a structure in which the electrode portion 62, including the electrode surface contact portion 64 and the electrode end portion 66, forms a 180-degree angle. [Figure 9] The present invention has a structure in which the electrode portion 62, including the electrode surface contact portion 64 and the electrode end portion 66, forms a 90-degree angle. [Figure 10] In this invention, the electrode portion has a curved structure. [Figure 11] In this invention, the electrode portion has an arc-shaped structure. [Modes for carrying out the invention]

[0014] Figure 1 is an exploded view of the speaker according to the present invention. The speaker frame 10 is circular in shape, with a circumferential wall formed at a constant height along the circumference, forming a lower enclosure that houses components described later. A portion of the circumferential wall of the speaker frame 10 is missing, and the PCB is located on the circumference. The PCB plays a role in controlling the voice coil.

[0015] The speaker frame has a hollow shape with a certain radius from the center, and a yoke 20 is formed in the hollow portion of the circular plate. The yoke 20 forms a concave housing portion and is inserted into the hollow portion formed in the center of the speaker frame to form an integral part.

[0016] A magnet 30 is positioned on the yoke 20, fixed to the yoke 20 in the shape of a disc of a certain thickness, and the outer diameter of the magnet 30 is smaller than the inner diameter of the yoke 20. A circular plate 40 is positioned above the magnet 30. The diameter of the circular plate and the diameter of the magnet are the same. Therefore, the magnet 30 is located inside the yoke 20, and the circular plate 40 is located on top of the magnet.

[0017] A voice coil 50 is formed along the circumference of a circular plate 40. A thin film conductor 60 is joined to the upper part of the voice coil of the present invention. The thin film conductor 60 is joined to the voice coil on the lower side and to the diaphragm 70 on the upper side. More specifically, the thin film conductor 60 is integrally joined to the lower surface of the diaphragm 70. The joining temperature between the upper part of the voice coil and the thin film conductor 60 reaches several hundred degrees (hereinafter, T_high) as an example, and the joining temperature between the thin film conductor 60 and the diaphragm 70 is 100 degrees or less (hereinafter, T_low) as an example.

[0018] That is, the bonding between the thin film conductor 60 and the voice coil 50 is performed within the temperature range of T_high, and the bonding between the thin film conductor 60 and the diaphragm 70 is performed within the temperature range of the bonding temperature T_low. T_high and T_low are related to the material of the diaphragm, and the thin film conductor 60 and the diaphragm 70 are bonded within the temperature range of T_low where the diaphragm material is not affected by the bonding temperature. At a temperature at which the diaphragm material would be affected by the bonding temperature, the voice coil 50 avoids direct bonding with the diaphragm 70, and the bonding between the thin film conductor 60 and the voice coil 50 is performed on the premise that the diaphragm material is not affected by the bonding temperature within the temperature range of T_high.

[0019] On the other hand, the thin film conductor 60 and the diaphragm 70 are configured to be bonded within the temperature range of the bonding temperature T_low. An electrode end portion 66 of the thin film conductor 60, which will be described later, is also bonded within the temperature range of T_low.

[0020] The thin film conductors 60 are in the shape of two flat half rings, and the lower surface of each thin film conductor is electrically connected to a respective voice coil. The thin film conductor 60 and the voice coil 50 are not directly electrically connected, and are merely bonded together by thermal fusion; an electrode surface contact portion additionally formed on the thin film conductor 60 is required for electrical conduction. The electrode surface contact portion will be described later. The thin film conductor 60 has a structure separated into two parts along electrodes A and B, and when the number of thin film conductors increases to an even number, the same number of electrode surface contact portions are also required accordingly.

[0021] The flat half-ring shape means a thin-film disk shape with a rectangular cross-section. For the thin film conductors to connect to an external power supply, respective electrode portions 62 of the two half-rings are further formed, attached to and extending along the lower surface of the diaphragm, and connected to conduct electricity to the PCB of the speaker frame 10. A dust cap 80 is formed in the hollow portion located at the center of the diaphragm 70, and the dust cap 80 can be seated on the inner peripheral surface formed along the hollow portion of the diaphragm 70.

[0022] Figure 2 is a cross-sectional view of the speaker according to the present invention, showing a vertical cross-section that allows us to understand the joint shape between the voice coil 50 on the lower side and the diaphragm 70 on the upper side along the thin film conductor 60.

[0023] The circular container-shaped speaker frame 10 is divided into a lower part of the speaker frame that houses the yoke 20 and an upper part of the speaker frame that supports the diaphragm 70. The yoke 20, which is fixed to the lower part of the speaker frame, is circular container-shaped and houses the magnet 30 and the circular plate 40. The circular plate 40 supports the magnet 30 so that the electromagnet formed by the voice coil moves up and down along the yoke 20. The voice coil 50, which is wound around the outer circumference of the circular plate 40, acts as an electromagnet by power supplied via the PCB, and the relative movement of the voice coil 50 with respect to the magnet 30 is controlled.

[0024] The magnet 30, circular plate 40, and voice coil 50 within the yoke 20 may all have clearance from the inner circumferential surface of the yoke. This is because the voice coil 50 moves up and down, and the magnet is attached or fixed so as to be securely fitted within the yoke.

[0025] A thin film conductor 60 is located at the upper end of the voice coil 50, and the thin film conductor 60 is attached perpendicularly to the upper end of the voice coil so as to be parallel to the upper surface of the circular plate 40. An electrode section 62 consisting of electrodes A and B is connected from the thin film conductor 60 to the PCB, and an electrode surface contact section 64 is formed on the inside of the thin film conductor, projecting toward the center of the diaphragm, in order to ensure an electrical contact area between the voice coil, the electrode section, and the thin film conductor.

[0026] The electrode surface contact portion 64 is also flat, similar to the thin film conductor, and is formed on each of the annular semi-rings. The thin film conductor 60 has two semi-ring shapes and is a flat arc surface of a certain width.

[0027] Furthermore, in order to ensure a sufficient contact area between the electrode portion and the PCB, electrode end portions 66 are formed at the ends of each electrode portion. Both the electrode surface contact portions 64 and the electrode end portions 66, which are further formed on each electrode portion of electrode A and electrode B, are formed in a straight line from the center of the diaphragm. Since the diaphragm moves up and down along the voice coil, it is necessary to ensure a sufficient contact area between the diaphragm and the PCB.

[0028] The electrode end portions 66, further formed on electrodes A and B of the electrode portion 62, are connected to a position between the fastening points of the upper and lower parts of the speaker frame so as to be stably supported by the speaker frame 10, inserted into the gap between the upper and lower parts of the speaker frame, fixed by the engagement of the upper and lower parts of the speaker frame, and energized to the PCB by the energizing means connecting the upper and lower parts of the speaker frame. The energizing means may be an electrically conductive structure or component.

[0029] Each of the two thin-film conductors 60 has an electrode portion 62 formed on it for supplying an external power source, and the electrode portion can have various functional shapes.

[0030] The electrode portions 62 of electrodes A and B are bonded to the lower surface of the diaphragm to support it. The diaphragm 70 has a curved shape with radially elastic peaks and valleys so that it can move up and down in accordance with the movement of the voice coil 50. A curved shape means that the surface is smoothly curved, and the diaphragm can form peaks and valleys that form a smooth curve.

[0031] The electrode portions of electrodes A and B can be joined along the curved shape of the diaphragm. That is, the electrode portions must have the same shape as the curved shape of the diaphragm so that they are joined by surface contact with the lower surface of the diaphragm along the curved shape of the diaphragm.

[0032] Figures 3 and 4 show a structure in the present invention in which each of the flat, semi-ring-shaped thin film conductors 60 is joined to the voice coil 50. This structure protects the diaphragm during soldering inside the diaphragm, as conventionally, when joining (soldering) work was performed on the diaphragm, the diaphragm would sometimes melt or deform. The present invention is a structure that forms a hollow portion of the diaphragm, joins the voice coil 50 and the thin film conductor 60 at a specific joining temperature, and then covers and joins the diaphragm. The lower surface of the diaphragm can be supported by surface contact due to the radial width of the thin film conductor, and the larger the radial width of the thin film conductor, the larger the area that can be supported, enabling stable support of the diaphragm.

[0033] Figure 3 shows the upper structure in which the diaphragm 70 and dust cap 80 are covered over the speaker frame 10. When viewed from above, the thin film conductor 60 is hidden by the dust cap and is not visible. Figure 4 shows the lower structure of the diaphragm, in which the electrode end portion 66 is joined to the lower surface of the diaphragm. In Figures 3 and 4, the electrode portions A and B may be provided so as to be surface-jointed to the lower surface along the curved shape of the diaphragm.

[0034] The thin film conductor 60 is joined perpendicularly to the ends along the circumference of the voice coil 50 and is joined to the hollow diaphragm 70 so as to be supported by surface contact. That is, the thin film conductor 60, which has a flat disc-shaped cross-section, is joined horizontally to the voice coil 50, which is formed perpendicularly to the voice coil 50 at its ends. In addition, an electrode portion 62 is formed to provide stable surface contact support to the diaphragm along the hollow diaphragm, while also allowing current to flow with the voice coil and an external power supply.

[0035] The thin film conductor 60 has electrode surface contact portions 64 formed on each of the two semi-ring shaped thin film conductors 60, protruding toward the center of the diaphragm 70. The electrode surface contact portions 64, electrode portions 62, and electrode end portions 66 formed on each of the two semi-ring shaped thin film conductors 60 may be formed in a straight line radially from the center of the diaphragm with the same cross-sectional thickness.

[0036] Figure 5 shows the lower shape of the diaphragm, where the thin film conductor 60 is joined to the lower surface of the diaphragm 70 in surface contact. The dust cap 80 is located on the opposite side.

[0037] The thin film conductor 60 has two flat half-ring shapes and a rectangular disc-like cross-section. The lower surface of the thin film conductor 60 is joined to the voice coil and conducts current to the voice coil via the electrode surface contact portion 64. The thin film conductor 60 is surface-jointed along the diaphragm 70 from the electrode surface contact portion 64 along the electrode portion 62 to the electrode end portion 66 in order to conduct current to the PCB to which an external power supply is applied.

[0038] Figure 6 shows that two thin-film conductors 60 can each be formed with 180-degree arc surfaces so that they conduct electricity with the voice coil. The thin-film conductors 60 are further formed with an electrode surface contact portion 64 for conducting electricity with the voice coil and an electrode end portion 66 that has a certain area for connecting to an external power supply, so electrode portions 62 are also formed including the electrode surface contact portion 64 and the electrode end portion 66.

[0039] The electrode surface contact portion 64 secures additional area from the semi-ring shaped thin film conductor 60 toward the center of the diaphragm, thereby ensuring sufficient contact area for current flow with the voice coil due to vibration. Similarly, the electrode end portion 66, with a shape wider than the width of the electrode portion 62, ensures sufficient contact area with the PCB.

[0040] The electrode portion 62, including the electrode surface contact portion 64 and the electrode end portion 66, is positioned at a constant angle from the center of the diaphragm to each electrode of the semi-ring shaped thin film conductor 60, and may consist of not only two electrodes A and B, but also 2N, i.e., an even number of electrodes (+ / -). When N=1, there are two electrodes, and when N>1, there may be four, six, or eight electrodes. As the number of electrodes increases, the number of electrode surface contact portions, electrode portions, and electrode end portions also increases. The more electrode surface contact portions, electrode portions, and electrode end portions that support the entire surface area of ​​the circular diaphragm are in contact, the more securely the diaphragm is fixed, and stable movement becomes possible even when vertical movement occurs.

[0041] Figure 7 shows a cross-sectional structure to illustrate this. It can be seen that the cross-sectional thickness of the diaphragm 70 to which the electrode portion 62 of the thin film conductor 60 is attached is greater than the cross-sectional thickness of the diaphragm without the thin film conductor 60. When magnified, the peaks 62_H and valleys 62_L of the thin film conductor 60 can be distinguished from the peaks 72_H and valleys 72_L of the cross-section of the diaphragm 70. In this case, the electrode surface contact portion 64 is located inside the thin film conductor 60 and toward the center of the diaphragm, and the electrode end portion 66 is positioned at the edge of the diaphragm 70 so as to be connectable to the PCB. If the electrode portion can be installed uniformly 360 degrees without being biased to either side of the diaphragm, the speaker can be made with more stable diaphragm movement.

[0042] Figure 8 shows a structure in which the electrode portion 62, including the electrode surface contact portion 64 and the electrode end portion 66, are at 180 degrees from each other, while Figure 9 shows a structure in which they are at 90 degrees. In Figure 8, the first electrode surface contact portion 64a, the first electrode portion 62a, and the first electrode end portion 66a are at 180 degrees from the second electrode surface contact portion 64b, the second electrode portion 62b, and the second electrode end portion 66b.

[0043] The electrode surface contact portion 64, the electrode portion 62, and the electrode end portion 66 formed on each of the two semi-ring shaped thin film conductors 60 are aligned in a straight line.

[0044] In Figure 9, the third electrode surface contact portion 64c, the third electrode portion 62c, and the third electrode end portion 66c are all at a 90-degree angle to each other, including the fourth electrode surface contact portion 64d, the fourth electrode portion 62d, and the fourth electrode end portion 66d.

[0045] Furthermore, when the semi-ring-shaped thin film conductor that is in direct contact with the voice coil expands and contracts in the plane of the paper shown in Figures 8 and 9 in accordance with the movement of the voice coil, the electrode portions 62a, 62b, 62c, and 62d move in conjunction with this expansion and contraction at each of the four points.

[0046] The shapes of the electrode portions 62a, 62b, 62c, and 62d are such that they are integrated with or in contact with the diaphragm, and the electrode portions move in conjunction with the movement of the diaphragm.

[0047] In other words, the thin film conductor 60 is not limited to two, but may be 2N (N>1) semi-ring shapes, or it may be a flat arc surface of a certain width.

[0048] The electrode section that supports the bent shape is what effectively affects the stable movement of the diaphragm.

[0049] Figure 10 shows an embodiment of the electrode portion of the present invention, the electrode portion including a curved portion 82. The electrode portion has the same thickness as the thin film conductor and is formed to be joined to the lower surface of the diaphragm by surface contact along its curved shape. Unlike the electrode portion 62 which is formed linearly in the radial direction from the center of the diaphragm, as illustrated earlier, the electrode portion of Figure 10 has a curved shape when connecting the electrode surface contact portion and the electrode end portion.

[0050] In other words, the electrode portion 82, including the electrode surface contact portion 84 and the electrode end portion 86, is arranged to connect the thin film conductor 60 and the PCB, and the positions of the electrode surface contact portion 84 and the electrode end portion 86 are the same as those of the straight electrode portion 62, but in Figure 10 the electrode portion has a curved shape.

[0051] Figure 11 shows another embodiment of the electrode portion of the present invention, the electrode portion including an arc portion 92a. The arc portion 92a refers to an arc-shaped electrode portion. Unlike the electrode portion 62 and curved portion 82 that are formed in a straight line radially from the center of the diaphragm, as illustrated earlier, when connecting the electrode surface contact portion and the electrode end portion, the electrode portion of Figure 11 includes an arc portion that is formed at a certain angle along the arc of the diaphragm.

[0052] The electrode portion 92, including the electrode surface contact portion 94 and the electrode end portion 96, is arranged to connect the thin film conductor 60 and the PCB. The positions of the electrode surface contact portion 94 and the electrode end portion 96 are the same as those of the parallel electrode portion 62, but the arc portion 92a is in surface contact with the lower surface of the diaphragm, which forms an arc at a certain angle with respect to the center of the diaphragm, and may be formed particularly along the peaks and valleys of the curved shape of the diaphragm.

[0053] In Figure 11, not only the arc portion 92a but also the electrode surface contact portion 94 and the electrode end portion 96 are connected by a U-turn portion 92b. The arc portion 92a and the U-turn portion 92b enable a structure in which the diaphragm is supported by uniform surface contact with the electrodes.

[0054] On the other hand, the thin film conductor 60 of the present invention can prevent problems such as the diaphragm melting or deforming due to welding heat during the joining process between the voice coil 50 and the diaphragm 70. The thin film conductor 60, which is in surface contact parallel to the inner circumferential surface formed along the hollow portion of the diaphragm, is preferentially joined to the voice coil 50. That is, the structure is such that the diaphragm is fixed onto the thin film conductor 60 after the thin film conductor 60 and the voice coil 50 have been joined, and by performing the joining in stages, the heat required during the joining process between the thin film conductor 60 and the voice coil 50 is not transferred to the diaphragm when the diaphragm is subsequently joined onto the thin film conductor 60. Normally, the joining temperature between the thin film conductor 60 and the voice coil 50 is the temperature T_high, and the joining temperature of the diaphragm onto the thin film conductor 60 is the temperature T_low, so T_high > T_low.

Claims

1. Voice coil 50 and A thin film conductor 60 is joined to the upper end of the voice coil 50 at a right angle, The thin film conductor 60 includes a diaphragm 70 which is joined to the conductor in surface contact with the conductor, The speaker has a thin film conductor formed on it, characterized in that the thin film conductor 60 has two semi-ring shapes and forms a flat arc surface of a certain width.

2. A speaker having a thin film conductor as described in claim 1, characterized in that electrode portions 62 for supplying external power are further formed on each of the two thin film conductors 60.

3. The speaker having a thin film conductor as described in claim 2, characterized in that the electrode portion has the curved shape so as to contact the lower surface of the diaphragm along the curved shape of the diaphragm.

4. The speaker having a thin film conductor as described in claim 2, characterized in that the thin film conductor 60 further has electrode surface contact portions 64 that protrude toward the center of the diaphragm 70 from each of the two semi-ring shaped thin film conductors 60.

5. The speaker having a thin film conductor as described in claim 4, characterized in that electrode end portions 66 are further formed on the edges of each of the two semi-ring shaped thin film conductors 60.

6. A speaker having a thin film conductor as described in claim 5, characterized in that the thickness of the electrode surface contact portion 64, the electrode portion 62, and the electrode end portion 66 formed on each of the thin film conductors 60 are the same and are located in a straight line radially from the center of the diaphragm 70.

7. A speaker having a thin film conductor as described in claim 5, characterized in that the thickness of the electrode surface contact portion 64, the electrode portion 62, and the electrode end portion 66 formed on each of the thin film conductors 60 are the same, and the electrode portion includes a curved portion 82 formed along the diaphragm.

8. A speaker having a thin film conductor as described in claim 5, characterized in that the thickness of the electrode surface contact portion 64, the electrode portion 62, and the electrode end portion 66 formed on each of the thin film conductors 60 are the same, and the electrode portion includes an arc portion 92a formed along the diaphragm.

9. The speaker having a thin film conductor as described in claim 8, characterized in that the arc portion 92a of the electrode portion is formed at a certain angle along the peaks and valleys of the bent shape of the diaphragm.

10. The speaker having a thin film conductor formed on it, as described in claim 8, further characterized in that the electrode portion includes a U-turn portion 92b that switches the direction in which the arc portion 92a is formed.

11. A speaker having a thin film conductor formed on it, characterized in that the temperature T_low, which is the junction temperature between the thin film conductor 60 and the diaphragm 70, is lower than the temperature T_high, which is the junction temperature between the voice coil 50 and the thin film conductor 60.

12. Voice coil 50 and A thin film conductor 60 is joined to the upper end of the voice coil 50 at a right angle, The thin film conductor 60 includes a diaphragm 70 which is joined to the conductor in surface contact with the conductor, The speaker is characterized in that the thin film conductor 60 has 2N (N>1) semi-ring shapes and forms a flat arc surface of a certain width.

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