Substrate processing equipment

JP2026533897APending Publication Date: 2026-10-13ACM RES (SHANGHAI) INC +2
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Patent Information

Application Number
JP2026519083
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-27
Filing Date
2024-08-23
Publication Date
2026-10-13

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    Figure 2026533897000001_ABST
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Abstract

The present invention provides a substrate processing apparatus, which comprises a reaction chamber, a plurality of substrate support members provided for supporting substrates and mounted within the reaction chamber, a transport assembly including a motor, a transport member that rotates by the drive of the motor, and a suspension rod located between the motor and the transport member, and a sealing gas pipeline configured to introduce sealing gas into the gap between the suspension rod and the reaction chamber to seal the gap, wherein the transport member is suspended within the reaction chamber via the suspension rod, the motor rotates the transport member so that the transport member engages with the substrate and transports the substrate engaged between the plurality of substrate support members, and the suspension rod is inserted into the reaction chamber. By sealing the gap with sealing gas, reaction gas in the reaction chamber enters the bellows through the gap and forms a film there, preventing particles from falling onto the substrate when the bellows frequently expands and contracts.
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Description

TECHNICAL FIELD

[0001] The present invention belongs to the field of semiconductor technology, and relates to a substrate processing apparatus. BACKGROUND ART

[0002] Throughout the entire substrate manufacturing process, substrates need to undergo deposition, etching, baking, and curing treatments inside a chamber. Particularly in a vacuum processing chamber for PECVD (plasma enhanced chemical vapor deposition), layer stack structures of different materials are deposited on the substrate. The inside of the chamber must be constantly maintained in a low-vacuum state, and reaction gases are continuously introduced into the chamber to react therein and deposit a thin film on the substrate surface. However, the PECVD process has the following problems.

[0003] While introducing the reaction gases into the chamber, unreacted gases in the chamber are continuously discharged from the exhaust port, so as to keep the gas inside the chamber in a flowing state at all times and rapidly deposit the thin film on the substrate surface. However, there is a problem that particles not removed in a timely manner by the gas tend to contaminate the substrate surface.

[0004] Accordingly, there is a need to provide a substrate processing apparatus. SUMMARY OF THE INVENTION

[0005] In view of the above-described drawbacks of the prior art, an object of the present invention is to provide a substrate processing apparatus for solving the problem of substrate surface contamination caused by particles in the prior art.

[0006] To achieve the above objects and other related objects, the present invention provides a substrate processing apparatus, The substrate processing apparatus comprises a reaction chamber, a plurality of substrate support members provided for supporting substrates and mounted within the reaction chamber, a transmission assembly including a motor, a transport member that rotates by the drive of the motor, and a suspension rod located between the motor and the transport member, and a seal gas pipeline configured to introduce a seal gas into the gap between the suspension rod and the reaction chamber to seal the gap. The transport member is suspended within the reaction chamber by the suspension rod, and the motor rotates the transport member, thereby engaging the transport member with the substrate and transmitting the engaged substrate between a plurality of substrate support members. The suspension rod is inserted into the reaction chamber.

[0007] Preferably, the transmission assembly further comprises a magnetic fluid, the motor is coupled to the transport member via the magnetic fluid and the suspension rod, the suspension rod having one end fixedly connected to the transport member and the other end fixedly connected to the magnetic fluid.

[0008] Preferably, the magnetic fluid includes a shaft connected to the motor, and the other end of the shaft is fixedly connected to the suspension rod.

[0009] Preferably, the substrate processing apparatus further includes a bellows enclosed below the magnetic fluid, the sealing gas pipeline includes a gas introduction pipe connected to the bellows, and the sealing gas flows from the gas introduction pipe through the bellows into the gap.

[0010] Preferably, the reaction chamber includes a mounting hole, the suspension rod is fixedly connected to the transport member by passing through the mounting hole, and the gap is formed between the suspension rod and the inner wall of the mounting hole.

[0011] Preferably, the reaction chamber further includes a recess, the mounting hole is formed at the bottom of the recess, and the bellows includes an upper flange and a lower flange located at both ends thereof, the upper flange being fixed to the magnetic fluid, and the lower flange being fixed to the bottom of the recess and positioned around the mounting hole.

[0012] Preferably, a gas inlet is formed in the lower flange, and the gas inlet is connected to the gas inlet pipe.

[0013] Preferably, the transport member includes a central part and a plurality of arms extending outward from the central part, the ends of which are used to engage a substrate.

[0014] Preferably, the suspension rod is aligned with and connected to the central part.

[0015] Preferably, the transmission assembly further comprises a support and a lifting power source that drives the transmission assembly to move up and down relative to the reaction chamber, the lifting power source being mounted between the support and the reaction chamber.

[0016] Preferably, the motor is fixedly connected to the support portion, and when the support portion moves up and down, the conveying member connected to the motor also moves up and down simultaneously.

[0017] Preferably, the sealing gas is nitrogen.

[0018] As described above, in the substrate processing apparatus of the present invention, the transport member is suspended inside the reaction chamber, and the gap between the suspension rod for suspending the transport member and the reaction chamber is sealed with a sealing gas. This allows the reaction gas to enter the bellows through the gap and form a film there, preventing particles from falling onto the substrate when the bellows frequently expands and contracts. Therefore, the cleanliness of the inside of the bellows can be maintained by the sealing gas. [Brief explanation of the drawing]

[0019] [Figure 1] This is a schematic diagram showing a partial cross-sectional structure of a substrate processing apparatus in an embodiment of the present invention. [Figure 2] This is a schematic diagram showing the structure of a transmission assembly in an embodiment of the present invention. [Figure 3] This is a schematic diagram showing the state in which the transport member of the transmission assembly in an embodiment of the present invention is in a retracted position. [Figure 4] This is a schematic diagram showing the operating state of the conveying member in an embodiment of the present invention. [Figure 5] This is a schematic diagram showing a bellows in an embodiment of the present invention. [Modes for carrying out the invention]

[0020] Embodiments of the present invention will be described below with reference to specific examples. Those skilled in the art will readily understand other advantages and effects of the present invention from the disclosure herein. The present invention can also be implemented or applied by other different specific embodiments, and each detail herein can be modified or altered in various ways to suit different viewpoints and applications, without departing from the spirit of the invention.

[0021] In describing embodiments of the present invention in detail, for the sake of convenience of explanation, the cross-sectional views showing the device structure are partially enlarged without following general proportions, and the schematic diagrams are merely illustrative and do not limit the scope of protection of the present invention. Furthermore, actual manufacturing involves three-dimensional spatial dimensions of length, width, and depth.

[0022] For convenience of explanation, terms of spatial relationship such as "below", "lower", "beneath", "lower surface", "above", "upper" are used herein to describe the relationship between one illustrated element or feature and another element or feature. It should be understood that these spatial relationship terms are intended to include other orientations of the device in use or in operation other than the orientation illustrated. When a layer is referred to as being "between" two layers, it may be the only layer between the two layers, or one or more intervening layers may also be present. As used herein, "intervening between" means including the values of both endpoints.

[0023] In the context of the present application, the structure in which the described first feature is "on" the second feature includes embodiments where the first feature and the second feature are formed in direct contact, as well as embodiments where another feature is formed between the first feature and the second feature such that the first feature and the second feature may not be in direct contact.

[0024] It should be noted that the drawings provided in the present embodiment are only for schematically illustrating the basic concept of the present invention, and the drawings show only the components related to the present invention, and are not drawn according to the number, shape and dimensions of the components in the actual embodiment. In actual implementation, the form, quantity and proportion of each component can be arbitrarily changed, and the arrangement form of the components can also be more complex.

[0025] As shown in Figure 1, the present embodiment provides a substrate processing apparatus comprising a reaction chamber 100 and a transmission assembly 200 for transmitting the substrate W in the reaction chamber 100.

[0026] The reaction chamber 100 includes a chamber body 110 (see Figure 3) and a lid 120 attached to the chamber body 110 and forming a sealed space 112 together with the chamber body 110. In this embodiment, the sealed space 112 is formed by the lid 120 and the chamber body, but the shape and size of the lid 120 are not particularly limited, as long as it can form a sealed space together with the chamber body. Exemplarily, in one embodiment, the lid 120 is an upper housing and forms a sealed space 112 together with the chamber body, which is a lower housing. In another embodiment, the chamber body is a container that defines a space and has an opening, and as shown in Figure 1, the lid 120 seals the opening of the chamber body 110 to form a sealed space 112. The reason for making the reaction chamber 100 a divided structure is to facilitate the installation and maintenance of structures installed inside the reaction chamber (e.g., transport member 240, substrate support member 140). Furthermore, the reaction process of the substrate W is carried out in the sealed space 112 consisting of the lid 120 and the chamber body 110. The lid 120 includes a mounting portion 121 that penetrates its upper and lower surfaces, and the mounting portion 121 includes a recess 1211 and a mounting hole 1212 that communicate with each other. Specifically, the recess 1212 is formed recessed inward from the surface of the lid 120, and the mounting hole 1212 is formed at the bottom of the recess 1211 and penetrates the lid 120. Referring to Figures 3 and 4, the reaction chamber 100 is further provided with a plurality of substrate support members 140 that support the substrate W.

[0027] Referring to Figure 1, the transmission assembly 200 includes a motor 210, a transport member 240 rotationally driven by the motor 210, and a magnetic fluid 220 and a suspension rod 230 connected between the motor 210 and the transport member 240. The magnetic fluid 220 includes a flange 222 protruding outward from its outer surface and a shaft 221 rotatably movable relative to the flange 222. The motor 210 is coupled to the transport member 240 via the shaft 221 and the suspension rod 230. Specifically, the motor 210 is fixedly connected to the shaft 221 of the magnetic fluid 220, and the suspension rod 230 has one end fixedly connected to the shaft 221 of the magnetic fluid 220 and the other end fixedly connected to the transport member 240. This allows the transport member 240 to rotate under the drive of the motor 210. Referring to Figure 2, the transport member 240 includes a central part 241 aligned with and connected to the suspension rod 230, and a plurality of arms 242 extending outward from the central part 241, the ends of which are formed with rings, hooks, forks, or other structures for engaging a substrate W. In embodiments of this technology, any number of arms 242 may be included, and the number of arms may be the same as the number of substrate support members 140 in the chamber body 110. In the embodiments shown in Figures 2 to 4, for three substrate support members 140, the transport member 240 includes three arms 242. In embodiments of this technology, the transmission assembly 200 can engage and / or transmit one, two, three, or any number of substrates W.

[0028] The transport member 240 rotates to engage with the substrate W and transmits the substrate W between the multiple substrate support members 140. The transport member 240 may engage with the substrate from above or below, or it may transmit the substrate W between the multiple substrate support members 140 by engaging with the outer edge of the substrate and rotating. As shown in Figure 3, when the transport member 240 is in the retracted position, the arm 242 of the transport member 240 is positioned between the substrate support members 140, allowing the substrate W to be transported from outside the chamber into the chamber and placed on the substrate support members 140, or surface treatment (e.g., material deposition on the substrate W) to be performed on the substrate W. Exemplarily, the transport member 240 is in the retracted position, the substrate W is transported from outside the chamber to one of the substrate support members 140 inside the chamber, and the transport member 240 transmits the substrate W to the other substrate support members 140. Specifically, in one embodiment, referring to Figure 3, the substrate W is transported from the opening 111 of the chamber body to the first substrate support member 140a inside the chamber body, and the transport member 240 rotates along its axis from its retracted position to engage the substrate W on the first substrate support member 140a and transmit it to the second substrate support member 140b (see the operation state diagram in Figure 4). In this way, the transport member 240 engages one, two, or any number of substrates W and transmits the substrates W between the substrate support members 140a to 140c.

[0029] Referring to Figures 1 and 2, the transmission assembly 200 further comprises a support section 270 and a lifting power source 260 attached to the support section 270, the lifting power source 260 for moving the transmission assembly 200 up and down relative to the reaction chamber 100. Exemplarily, the lifting power source 260 moves the support section 270 up and down relative to the reaction chamber 100, and the support section 270 moves the transport member 240 coupled to the support section 270 up and down. Specifically, the motor 210 of the transmission assembly 200 is fixedly connected to the support section 270, and the transport member 240 is coupled to the motor 210. This allows the transport member 240 to move up and down when the support section 270 moves up and down. In the embodiment shown in Figures 3 and 4, the transmission assembly 200 transmits the substrate W between a plurality of substrate support members 140a to 140c. Specifically, referring to Figure 3, the transport member 240 rotates from its retracted position and moves below the substrate W on the first substrate support member 140a, engaging with the substrate W. Next, referring to Figures 1 and 2, the lifting power source 260 drives the support unit 270 upward, raising both the transport member 240 and the substrate W on the first substrate support member 140a, thereby separating the substrate W from the first substrate support member 140a. Furthermore, referring to Figure 4, the transport member 240 is rotated to the position of the second substrate support member 140b, and the lifting power source 260 drives the support unit 270 downward, lowering both the transport member 240 and the substrate W, thereby placing the substrate W on the second substrate support member 140b. As a result, the substrate W is transmitted from the first substrate support member 140a to the second substrate support member 140b. Here, when transmitting the substrate W between the substrate support members 140a to 140c, it is necessary to raise the substrate W to separate it from the substrate support members 140a to 140c, thereby avoiding damage to the substrate W due to friction between the substrate W and the substrate support members 140a to 140c during the transmission process. In this embodiment of the technology, an electric cylinder may be selected as the lifting power source 260, and by evenly arranging three electric cylinders between the support part 270 and the lid 120 of the reaction chamber 100, the force applied to the support part 270 and the lid 120 of the reaction chamber 100 becomes equal.

[0030] The substrate processing apparatus further includes a bellows 600 enclosed below the magnetic fluid 220. Referring to Figures 1 and 5, the upper flange 601 of the bellows 600 is fixedly connected to the flange 222 of the magnetic fluid 220, and the lower flange 602 of the magnetic fluid 600 is fixedly connected to the bottom of the recess 1211 of the mounting portion 121 and is positioned around the mounting hole 1212. The suspension rod 230 passes through the mounting hole 1212, with one end extending into the bellows 600 and fixedly connected to the shaft 221 of the magnetic fluid 220, and the other end aligned and fixedly connected to the center 241 of the transport member 240. When the transmission assembly 200 moves up and down, the bellows 600 moves in a corresponding expansion and contraction motion. Referring to Figures 1 and 5, the seal gas pipeline introduces seal gas into the gap, and the seal gas pipeline includes a gas introduction pipe 500 connected to the bellows 600. Specifically, a gas inlet 603 is formed in the lower flange 602 of the bellows 600 and connected to the gas inlet pipe 500. Referring to Figure 1, the seal gas flows from the gas inlet pipe 500 through the bellows 600 into the gap 800 between the suspension rod 230 and the lid 120. The seal gas introduced into the gas inlet pipe 500 may be nitrogen. The supply source C of the seal gas pipeline is connected to the bellows 600 via the gas inlet pipe 500, and the gas inlet pipe 500 is further equipped with an on / off valve A and a flow control valve B to adjust and control the flow rate of the seal gas. The gap 800 is located where the suspension rod 230 is inserted into the inside of the reaction chamber 100 (for example, the lid 120 or the chamber body 110). More specifically, the gap 800 is located between the suspension rod 230 and the inner wall of the mounting hole 1212. When sealing gas is introduced into the gap 800 between the suspension rod 230 and the inner wall of the mounting hole 1212, the gas fills the entire gap 800 and forms a sealing effect against the chamber body 110, preventing particles in the bellows 600 from falling through the gap 800 onto the substrate inside the chamber body 110.

[0031] During the reaction process within the chamber body, a small amount of reaction gas is introduced into the chamber body 110, creating a low vacuum state. Simultaneously, any unreacted gas remaining in the chamber body 110 is also exhausted, so the reaction gas within the chamber body 110 is always in a flowing state. Here, the exhaust port from which the gas in the chamber body 110 is exhausted is positioned in alignment with the center 241 of the transport member 240. One exhaust port can act on multiple substrates W simultaneously, eliminating the need to provide multiple exhaust ports aligned for each substrate. As a result, the transport member 240 is configured to be suspended within the chamber body 110.

[0032] In this invention, during the reaction process in the reaction chamber 100, the transport member 240 is suspended inside the chamber body 110, and the gap 800 between the suspension rod 230 for suspending the transport member 240 and the reaction chamber 100 is sealed with a sealing gas. This allows the reaction gas to enter the bellows 600 through the gap 800 and form a film there, preventing particles from falling onto the substrate when the bellows 600 frequently expands and contracts. Therefore, the cleanliness of the inside of the bellows can be maintained by the sealing gas.

[0033] The embodiments described above are illustrative in illustrating the mechanism and effects of the present invention and do not limit the invention. Those skilled in the art can modify or change the embodiments described above without departing from the spirit and scope of the invention. Accordingly, all equivalent modifications or changes made by those skilled in the art without departing from the spirit and technical concept disclosed herein should be included in the claims of the present invention.

Claims

1. Reaction chamber and A plurality of substrate support members provided for supporting the substrate and installed within the reaction chamber, A transmission assembly comprising a motor, a conveying member that rotates by the drive of the motor, and a suspension rod positioned between the motor and the conveying member, A seal gas pipeline configured to introduce a seal gas into the gap between the suspension rod and the reaction chamber to seal the gap, Equipped with, The transport member is suspended within the reaction chamber by the suspension rod, and the motor rotates the transport member, thereby engaging the transport member with the substrate and transmitting the engaged substrate between the plurality of substrate support members. The suspension rod is inserted into the reaction chamber. A substrate processing apparatus characterized by the following:

2. The transmission assembly further comprises a magnetic fluid, the motor is coupled to the transport member via the magnetic fluid and the suspension rod, the suspension rod having one end fixedly connected to the transport member and the other end fixedly connected to the magnetic fluid. The substrate processing apparatus according to claim 1.

3. The magnetic fluid includes a shaft connected to the motor, the other end of which is fixedly connected to the suspension rod. The substrate processing apparatus according to feature 2.

4. The substrate processing apparatus further includes a bellows enclosed below the magnetic fluid, the sealing gas pipeline includes a gas introduction pipe connected to the bellows, and the sealing gas flows from the gas introduction pipe through the bellows into the gap. The substrate processing apparatus according to feature 2.

5. The reaction chamber includes a mounting hole, the suspension rod is fixedly connected to the transport member by passing through the mounting hole, and the gap is formed between the suspension rod and the inner wall of the mounting hole. The substrate processing apparatus according to feature 4.

6. The reaction chamber further includes a recess, the mounting hole is formed at the bottom of the recess, and the bellows includes an upper flange and a lower flange located at both ends thereof, the upper flange being fixed to the magnetic fluid, and the lower flange being fixed to the bottom of the recess and positioned around the mounting hole. The substrate processing apparatus according to claim 5.

7. A gas inlet is formed in the lower flange, and the gas inlet is connected to the gas inlet pipe. The substrate processing apparatus according to claim 6.

8. The transport member includes a central part and a plurality of arms extending outward from the central part, the ends of which are used to engage a substrate. The substrate processing apparatus according to claim 1.

9. The aforementioned suspension rod is aligned with and connected to the central part. The substrate processing apparatus according to feature 8.

10. The transmission assembly further comprises a support and a lifting power source for raising and lowering the transmission assembly relative to the reaction chamber, the lifting power source being mounted between the support and the reaction chamber. The substrate processing apparatus according to claim 1.

11. The motor is fixedly connected to the support portion, and when the support portion moves up and down, the conveying member coupled to the motor also moves up and down simultaneously. The substrate processing apparatus according to feature 10.

12. The sealing gas is nitrogen. The substrate processing apparatus according to claim 1.