Integrated power and data transmission system for transporting circuit boards.

Abstract

The substrate transport device includes a base and a multi-jointed arm connected to the base, and a power and data communication system is distributed through the multi-jointed arm, and the power and data communication system has a wireless power and data communication interface disposed through at least one rotary joint of the housing of at least one movable arm link of the multi-jointed arm, and the wireless power and data communication interface is configured as a contactless wireless communication interface through at least one rotary joint.

Description

Technical Field

[0001] [Cross-Reference to Related Applications] This application is a non-provisional application of, and claims the benefit of, U.S. Provisional Patent Application No. 63 / 612,055 filed on December 19, 2023 and U.S. Provisional Patent Application No. 63 / 660,187 filed on June 14, 2024, the entire disclosures of which are incorporated herein by reference. This application also claims the benefit of U.S. Provisional Patent Application No. 63 / 581,512 filed on September 8, 2023 and U.S. Provisional Patent Application No. 63 / 685,401 filed on August 21, 2024, the entire disclosures of which are incorporated herein by reference.

[0002] [Technical Field] The present disclosure relates generally to robotic systems, and more specifically to robotic transport systems.

Background Art

[0003] Automated processing systems, such as semiconductor processing systems, include a plurality of components that support the execution of processes that provide a predetermined level of quality and reproducibility in semiconductor chip manufacturing. These semiconductor processing systems are being configured to achieve higher throughput. For example, in semiconductor processing, there is a trend toward narrow or elongated vacuum systems. These narrow vacuum systems have an increased footprint, particularly in length, and when these vacuum systems are pressurized, the time required for evacuating and purging the vacuum systems will reduce the throughput of semiconductor production. In view of maintaining or achieving higher throughput, there is a trend among manufacturers of semiconductor processing equipment to implement maintenance and diagnostic procedures that are automatically performed by the semiconductor processing equipment without loss of vacuum in the vacuum system. The maintenance and diagnostic procedures may include replacing parts of a process module using a substrate transport robot, transporting a metrology kit (such as a metrology wafer or substrate) to the process module using the substrate transport robot, or any other appropriate maintenance / diagnostic procedure.

[0004] It should be noted that the instrumentation kit may be configured to inspect the condition of the wafer chuck, showerhead, lift, or any other suitable feature of the process module. In other embodiments, the instrumentation kit may be used to calibrate the placement of wafers within a semiconductor processing system. Generally, conventional instrumentation kits are battery-powered and utilize Bluetooth® or Wi-Fi networks for data communication to an external (e.g., outside the semiconductor processing system) host. The architecture of these battery-powered instrumentation kits may be limited because the operation of the instrumentation kit and the communication from the instrumentation kit must be configured to be low-power due to the instrumentation kit's battery power. Here, due to the low-power communication system, the communication from the instrumentation kit may be subject to radio frequency (RF) interference from other RF-generating components within the semiconductor manufacturing facility.

[0005] Currently, the best practice for automating substrate or wafer handling in a vacuum environment is to avoid placing electrical wiring (including that oriented through the arms of a substrate handling robot) and electronic equipment within the vacuum environment. In addition to the wire conductors and insulators of electronic equipment, potting epoxy resin (and any non-metallic parts) can release gases, potentially introducing molecular contamination into semiconductor manufacturing processes in a vacuum environment. Generally, data transmission within, or in, the rotary joints or axes of, handling equipment, is achieved through the use of slip rings and / or hard cable solutions.

[0006] To protect wiring and electronics (in an atmospheric environment), wiring must pass through at least hermetic feedthroughs in robot joints, where flexible cables are used. However, if a robot joint is configured to rotate indefinitely, flexible cables (e.g., hard cable solutions) cannot be used because they restrict the rotation of the arm joint. Hard cable solutions, such as clock spring cables, do not allow for unlimited rotation of the axis of rotation. Clock spring cables also occupy considerable space if further rotation is required. Hard cable solutions also introduce additional torque load to the axis of rotation, meaning that a more powerful motor is required to drive the axis of rotation, including clock spring cables. Cables are also wear parts that can generate fine particles over time.

[0007] Slip rings can be used to provide rotational degrees of freedom for robot joints, but while they are sufficient for power transmission, they may be unreliable for data communication at speeds in the Gbit / sec range. While slip rings allow for unlimited rotation of the axis, they are typically not recommended for data transmission because they introduce noise into the signal, especially as the slip ring module degrades over time. Slip rings also contain brushes, which are wear parts with limited lifespans that can generate many fine particles, making them unsuitable for use in cleanrooms.

[0008] Furthermore, the bending of wires, such as hard cable solutions within the robot arm during joint movement, can cause wire wear, and power and data transmission via slip rings may not provide thermal management for active electronic components within the transport arm of a substrate transport robot.

[0009] Therefore, this disclosure addresses several of these issues. [Overview of the project]

[0010] The aforementioned aspects and other features of this disclosure are described in the following description obtained in connection with the attached drawings. [Brief explanation of the drawing]

[0011] [Figure 1A] This is a schematic diagram of the substrate processing apparatus according to the present disclosure. [Figure 1B] This is a schematic diagram of the substrate processing apparatus according to the present disclosure. [Figure 1C] This is a schematic diagram of the substrate processing apparatus according to the present disclosure. [Figure 1D] This is a schematic diagram of the substrate processing apparatus according to the present disclosure. [Figure 1E] This is a schematic diagram of the substrate processing apparatus according to the present disclosure. [Figure 1F] This is a schematic diagram of the substrate processing apparatus according to the present disclosure. [Figure 1G] This is a schematic diagram of the substrate processing apparatus according to the present disclosure. [Figure 1H] This is a schematic diagram of the substrate processing apparatus according to the present disclosure. [Figure 1I] This is a schematic diagram of the substrate processing apparatus according to the present disclosure. [Figure 2A] This is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 2B] This is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 2C] This is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 2D] This is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 2E] This is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 2F]This is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 2G] This is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 2H] This is a schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3A] This is a partial schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3B] This is a partial schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3C] This is a partial schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3D] This is a partial schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3E] This is a partial schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3F] This is a partial schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3G] This is a partial schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3H] This is a partial schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3I] This is a partial schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3J] This is a partial schematic diagram of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3K] This is a schematic view of a part of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3L] This is a schematic view of a part of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3M] This is a schematic view of a part of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3N] This is a schematic view of a part of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3O] This is a schematic view of a part of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3P] This is a schematic view of a part of an exemplary substrate transfer apparatus according to the present disclosure, which can be used in any of the substrate processing apparatuses of Figures 1A to 1I. [Figure 3Q] This is a schematic cross-sectional view of a part of a rotary joint or shaft of the transfer apparatus of Figure 3C according to the present disclosure. [Figure 3R] This is an exemplary cross-sectional view of a part of a rotary joint of the transfer apparatus of Figure 3C according to the present disclosure. [Figure 3S] This is a schematic plan view of a part of a wireless data transmission module of a part of the rotary joint illustrated in Figure 3R according to the present disclosure. [Figure 3T] This is a schematic cross-sectional view of a part of the transfer apparatus of the processing apparatus of Figures 1A to 1I according to the present disclosure. [Figure 3U] This is an exemplary cross-sectional view of a part of a rotary joint of the transfer apparatus of Figure 3C according to the present disclosure. [Figure 4A] This is a schematic view of a compartmentalized arm link structure of the substrate transfer apparatus according to the present disclosure. [Figure 4B] This is a schematic view of a compartmentalized arm link structure of the substrate transfer apparatus according to the present disclosure. [Figure 4C] This is a schematic view of a compartmentalized arm link structure of the substrate transfer apparatus according to the present disclosure. [Figure 4D]This is a schematic diagram of the partitioned arm link structure of the substrate transport device according to the present disclosure. [Figure 4E] This is a schematic diagram of the partitioned arm link structure of the substrate transport device according to the present disclosure. [Figure 4F] This is a schematic diagram of the partitioned arm link structure of the substrate transport device according to the present disclosure. [Figure 5] These are schematic diagrams of a portion of the arm link structure shown in Figures 4A to 4F of this disclosure. [Figure 6] These are schematic diagrams of a portion of the arm link structure shown in Figures 4A to 4F of this disclosure. [Figure 7] These are schematic diagrams of a portion of the arm link structure shown in Figures 4A to 4F of this disclosure. [Figure 7A] These are schematic diagrams of a portion of the arm link structure shown in Figures 4A to 4F of this disclosure. [Figure 7B] These are schematic diagrams of a portion of the arm link structure shown in Figures 4A to 4F of this disclosure. [Figure 8A] These are schematic diagrams illustrating exemplary connecting parts between the arm link structures shown in Figures 4A to 4F of this disclosure. [Figure 8B] These are schematic diagrams illustrating exemplary connecting parts between the arm link structures shown in Figures 4A to 4F of this disclosure. [Figure 8C] These are schematic diagrams illustrating exemplary connecting parts between the arm link structures shown in Figures 4A to 4F of this disclosure. [Figure 9] This is an illustrative diagram of the Gray code pattern of the encoder of the substrate transport device described herein in this disclosure. [Figure 10] This is an exemplary scale of the encoder of the substrate transport apparatus described herein in this disclosure. [Figure 11A] This is a schematic diagram of a part of an exemplary substrate transfer apparatus according to the present disclosure, which may be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 11B] This is a schematic diagram of a part of an exemplary substrate transfer apparatus according to the present disclosure, which may be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 11C]This is a schematic diagram of a part of an exemplary substrate transfer apparatus according to the present disclosure, which may be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 12] Figures 11A to 11C in this disclosure are schematic diagrams of a portion of the partitioned arm link structure of the substrate transport device. [Figure 13] Figures 11A to 11C in this disclosure are schematic diagrams of a portion of the partitioned arm link structure of the substrate transport device. [Figure 14] This is a schematic diagram of a part of an exemplary substrate transfer apparatus according to the present disclosure, which may be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 15A] This is a schematic diagram of a part of an exemplary substrate transfer apparatus according to the present disclosure, which may be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 15B] This is a schematic diagram of a part of an exemplary substrate transfer apparatus according to the present disclosure, which may be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 16] This is a schematic diagram of a part of an exemplary substrate transfer apparatus according to the present disclosure, which may be used in any of the substrate processing apparatuses shown in Figures 1A to 1I. [Figure 17] This is a flowchart illustrating the method described herein. [Figure 18] This is a flowchart illustrating the method described herein. [Figure 19] This is a flowchart illustrating the method described herein. [Figure 20] Figures 1A to 1I are exemplary schematic diagrams of parts of the power and data communication systems of the exemplary substrate transport apparatus according to the disclosed embodiments. [Figure 21] This is a flowchart illustrating the method described herein. [Modes for carrying out the invention]

[0012] The following detailed explanation is intended to aid the understanding of those skilled in the art and is not intended in any way to unduly limit the claims relating to or related to this disclosure.

[0013] The following detailed explanation refers to various drawings, but here, regardless of whether a specific drawing is referenced or not, the same reference numbers across the various drawings refer to the same components and features.

[0014] As used herein, the word “each” refers to a single object (i.e., an object) in the case of a single object, and to each object in the case of multiple objects. As used herein, the words “a,” “an,” and “the” encompass “at least one” and “one or more” so as not to limit the noun being referred to to its “singular” form.

[0015] Figures 1A to 1I are schematic diagrams of the substrate processing apparatus according to the present disclosure. The present disclosure will be described with reference to the drawings, but it should be understood that it can be embodied in many forms. Furthermore, elements or materials of any suitable dimensions, shape, or type may be used.

[0016] This disclosure may provide one or more power and communication systems for the entire substrate handling robot arm while addressing one or more of the aforementioned drawbacks.

[0017] This disclosure may provide a vacuum substrate transfer device 104 (which may also be used in an atmospheric environment) for substrate processing apparatuses 100A, 100B, 100C, 100D, 100E, 100F, and 100G shown in Figures 1A-1I. The substrate transfer device 104 is configured to operate at high process temperatures (such as about 70°C, about 100°C, about 150°C, or higher, depending on the semiconductor process described herein). Here, the substrate transfer device 104 may include a hybrid rotary seal configuration in which a magnetic fluid seal is located at a lower temperature within the substrate transfer device 104 (for example, at a temperature of about 70°C or below, away from the end effector and wrist joint), which may improve the reliability of the substrate transfer device compared to conventional transfer devices. The wrist joint WX includes at least one vacuum isolation wall and utilizes the sealing of a rotor and magnetic encoder for cleanliness and corrosion resistance (the magnetic encoder provides a higher operating temperature for the substrate transfer device 104, such as at the high process temperatures described herein). The architecture of the board handling apparatus (and other rotary joints of the board handling apparatus) and arm links can provide hydrogen resistance and mitigation / virtually elimination of electrostatic discharge.

[0018] As described herein, at least the mechanical joints housing the motor stator and motor encoder (for example, one or more of the shoulder joints 179S, elbow joints 179E, and wrist joints 179W, generally and / or collectively referred to as mechanical or rotary joints MJ) share a common pressurized environment that is sealed from the vacuum or reduced pressure environment in which the articulated arms 333 of the substrate transporter 104 (see, for example, Figure 3A) operate. The method of sealing the mechanical joints enables the operation of the substrate transporter 104 when exposed to high processing temperatures. By utilizing the features of the present disclosure, exposure of active electronic components to a vacuum environment can be substantially eliminated or minimized. For example, the present disclosure can provide a power bus and a high-speed data communication bus (see Figure 20, which may form a common (e.g., combined) bus or separate bus) distributed across one or more arms of the substrate transporter 104 while maintaining a common pressurized environment.

[0019] Power and / or data can be communicated between adjacent arm links via one or more mechanical joints 179 by a power and / or data communication interface WPDC (also referred to herein as a wireless data transfer module) located on one or more of each of the mechanical joints 179. The power and / or data communication interface WPDC can provide unlimited rotation of the mechanical joints 179, does not involve wear parts, does not generate particulate matter, and / or can be used for power and / or data transmission without introducing noise into the data signal being transmitted. The power and / or data communication interface WPDC can provide better signal integrity and lifespan compared to conventional slip ring and hard cable solutions (such as clock spring cables). The power and / or data communication interface WPDC may be built outside the conveyor and may be a modular unit or subassembly that can be installed as a modular unit where needed inside the conveyor, such as on one or more of the mechanical joints 179.

[0020] The power distributed through the power bus may be DC power or AC power. The power and data communication system PDCS may be distributed through an articulated arm, where the power and data communication system PDCS has at least one wireless power and / or data communication interface WPDC disposed through at least one rotary joint (e.g., at least one of (one or more) joints in the respective axes BSX, BEX, SX, EX, WX) of the housing of at least one movable arm link. The wireless power and / or data communication interface WPDC through at least one rotary joint is configured as a contactless wireless communication interface. A data communication and bus power network PDCN (e.g., the network formed by the power and data communication system PDCS) is mounted on the articulated arm as described herein. The data communication and bus power network PDCN is distributed throughout the entire articulated arm, from the terminal joints (such as the mechanical joint MJ located on one or more axes SX, BSX) through the distal joints (e.g., the mechanical joint MJ located on the wrist axis WX), see, for example, the wireless power and / or data communication interfaces WPDCA, WPDCB, and WPDCC in Figure 3C. The data communication and bus power network PDCN is housed within and intersects at least one rotary joint of the housing.The data communication and bus power network PDCN incorporates local control units (e.g., transmitters, receivers, controllers, etc. of the board handling equipment described herein) and sensors (e.g., encoders, board sensors, measurement kit sensors, accessory sensors, imaging / visual sensors, thermal sensors, displacement sensors, and other sensors described herein) respectively, which are connected via a network interface (e.g., the respective wireless power and / or data communication interface WPDC described herein) and positioned on each of the end effectors and at least one of the movable arm links and at least one of the movable arm links, to bring about at least one local, onboard, and on-the-fly control of the end effector, the kinematic operation of the board holding station SHS via the articulation of one or more movable arm links of the articulated arm, measurement of the board or process, imaging of at least a portion of the articulated arm by onboard imaging sensors, and onboard health monitoring of the articulated arm.

[0021] As described herein, the disclosure may provide a way to arrange power and communication components to electrical components (e.g., motors, motor encoders, power docks, communication docks, accessories, etc.) located outside the vacuum environment inside (one or more) arms, or connected to (one or more) arms, in such a way that the power and communication components are not affected by the vacuum environment and gas release. Conductors (e.g., electrical wiring and communication wiring) and cooling tubes within (one or more) arms are fixed to their respective arm links so that the conductors and cooling tubes do not bend relative to the articulated arm 333 as a result of the joint movement of the arms, thereby extending the lifespan of the electrical conductors and cooling tubes and improving the reliability of the substrate transport device 104.

[0022] At least the data communications provided by this disclosure can be achieved without mechanical contact with, for example, the slip rings of the (one or more) arms. The data communications are not limited by the use of slip rings and can support high-bandwidth (gigabits or more) data rates for high-speed (gigabits or more) synchronous data transmission, resulting in the control of the (one or more) arms and digital signal processing of the arm electronics. While electrical transmission (some of which may be high-current) can be achieved within the arms via the use of slip rings, data transmission bypasses the slip rings. In some parts of the articulated arm 333, power may be transmitted without the use of slip rings (e.g., electrical transmission) so that power can be transmitted between pressurized and non-pressurized environments, or between pressurized environments via non-pressurized environments. Thus, this disclosure allows sensors and / or actuators to be placed within or on the arms and end effectors without exposing the sensor and / or actuator electronics and / or cables to a vacuum environment. Wireless power / data transfer between arm links and / or between arm links and end effectors provides substantially unlimited rotation of one or more joints of the articulated arm 333 of the substrate transport device 104. The wireless power / data transfer of the disclosed embodiment may provide high-capacity / high-speed data bandwidth (e.g., about 1 gigabit / second or more) and ultra-low latency (e.g., in the nanosecond range) to enable direct driving of one or more joints of the articulated arm 333 and / or sensing of the substrate being transported by the substrate transport device 104.

[0023] This disclosure may provide power and data docking (e.g., an interface or wireless docking station) on an arm wrist plate, on an end effector, or at any other suitable location on the arm. The docking station interfaces with any suitable accessory that utilizes power and / or data communication. Such accessory includes, but is not limited to, instrumentation kits. When one or more instrumentation kits receive power from a power dock and communicate via the data dock of the docking station, the instrumentation kits may receive substantially unlimited power and provide high-speed data transmission that is substantially resistant to external radio frequency interference (e.g., brought about by short-range, high-bandwidth data communication as described herein).

[0024] This disclosure may provide sensor solutions for various types of sensor feedback to improve the performance of the substrate transport device 104. The implementation of the sensor functions described herein is an application-dependent, modular, and flexible architecture. The substrate transport device 104 may include all or some of the sensors described herein.

[0025] According to this disclosure, one or more of the following may be provided (as described herein): a wireless power and / or data communication interface WPDC to at least one of at least one other arm link and end effector through at least one other rotary joint, configured as a contactless wireless communication interface, wherein at least one or at least another rotary joint comprises at least a wrist joint of a polyarticulated arm that connects an end effector to one or more movable arm links; the contactless wireless communication interface is at least one of proximity wireless communication and short-range wireless communication (as described herein); the contactless wireless communication interface is proximity wireless power and / or data communication, including optical communication, radio frequency communication, Wi-Fi communication, near-field wireless communication, ultra-wideband communication, millimeter-wave communication, inductive communication, capacitive communication, resonant capacitance communication, Bluetooth®, infrared, and Zigbee® (as described herein). The non-contact wireless communication interface is configured for a communication distance of about 20 mm or less than about 20 mm (as described herein); the non-contact wireless power and / or data communication interface through another rotary joint forms a non-contact communication power and / or data link between at least one of the other arm links and end effectors and at least one movable arm link, the non-contact communication link crossing a spatial gap (e.g., gap MAG) formed by the rotary joint between the movable arm link and at least one of the other arm links and end effectors in the rotary joint; the housing is configured to form an internal sealed plenum (see, for example, Figure 3C, etc.) that houses the respective parts of the transmitter and receiver of the wireless communication power and / or data communication interface in a sealed atmosphere sealed from the depressurized environment outside the housing (see, for example, Figures 3D-3G, 3L, 3P, etc.); and any other features as described herein.

[0026] As described herein, the disclosure may provide active forced convection cooling to each arm joint via a common pressurized environment, which cools the arm and electrical components (such as those described herein) located within the shared common pressurized environment.

[0027] Referring still to Figures 1A-1I, substrate processing equipment 100A, 100B, 100C, 100D, 100E, 100F, 100G, such as a semiconductor tool station, are shown in accordance with this disclosure. Although a semiconductor tool station is shown in the drawings, the features of this disclosure described herein can be applied to any tool station or robotic manipulator-based application. Processing equipment 100A, 100B, 100C, 100D, 100E, 100F, 100G are shown having a clustered tool arrangement (e.g., having a substrate holding station connected to a central chamber), but the processing equipment may have linearly arranged tools or any suitable tool station. Processing equipment 100A, 100B, 100C, 100D, 100E, 100F, 100G generally include an atmospheric front end 101, at least one vacuum load lock 102, 102A, 102B, and a vacuum back end 103. At least one vacuum load lock 102, 102A, 102B can be connected in any suitable configuration to any suitable port or opening (one or more) of the front end 101 and / or back end 103. For example, one or more load locks 102, 102A, 102B can be arranged side by side in a common horizontal plane, as can be seen in Figures 1B, 1D-1H. One or more load locks can be arranged in a grid, as shown in Figure 1I, such that at least two load locks 102A, 102B, 102C, 102D are arranged in rows (e.g., with spaced horizontal planes) and columns (e.g., with spaced vertical planes). One or more load locks can be a single inline load lock 102, as shown in Figure 1A. At least one load lock 102, 102E can be arranged in a stacked inline configuration, as shown in Figure 1C.Load locks are exemplified at the ends 100E1 or facet 100F1 of the transport chambers or transport devices 125A, 125B, 125C, 125D, 125E, 125F, 125G (each of which has a frame TCF forming a sealed chamber arranged to maintain a processing vacuum (such as high vacuum) inside), but it should be understood that one or more load locks may be located at any number of sides 100S1, 100S2, ends 100E1, 100E2, or facets 100F1-100F8 of the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G. Each of at least one load lock may also include one or more wafer / substrate mounting surfaces WRP (Figure 1C), where the substrate is held on appropriate supports within each load lock, although the tool station may have any appropriate configuration. Each component of the front end 101, at least one load lock 102, 102A, 102B, and back end 103 may be connected to a controller 110, which may be part of any suitable control architecture, such as a clustered architecture control unit. The control system may be a closed-loop controller having a master controller, a cluster controller, and an autonomous remote controller, such as the one disclosed in U.S. Patent No. 7,904,182, published March 8, 2011, entitled “Scalable Motion Control System,” which is incorporated herein by reference in its entirety. In other embodiments, any suitable controller and / or control system may be utilized.

[0028] The front end 101 generally includes a load port module 105 and a mini-environment 106, such as an equipment front end module (EFEM). The load port module 105 may be a 300mm load port, a Box Opener / Loader Tool Standard (BOLTS) interface compliant with SEMI standards E15.1, E47.1, E62, E19.5 or E1.9 for front-opening or bottom-opening boxes / pods and cassettes. The load port module may be configured as a 200mm wafer / substrate interface, a 450mm wafer / substrate interface, or any other suitable substrate interface such as larger or smaller semiconductor wafers / substrates, flat panels for flat panel displays, solar panels, reticles or any other suitable object. Three load port modules 105 are shown in Figures 1A, 1B, 1D, 1E, 1F, 1G, and 1H, but any suitable number of load port modules may be incorporated into the front end 101. The load port module 105 may be configured to receive a substrate carrier or cassette C from an overhead transport system, an automated guided vehicle (AGV), a manned AGV, a rail-based AGV, or any other suitable transport method. The load port module 105 may interface with a mini-environment 106 via a load port 107. The load port 107 may allow the passage of substrates between the substrate cassette and the mini-environment 106.

[0029] The mini-environment 106 generally includes any suitable transfer robot 108 that can incorporate one or more features of the disclosure described herein. The robot 108 may be a track-mounted robot, such as those described in U.S. Patent No. 6,002,840 issued December 14, 1999, U.S. Patent No. 8,419,341 issued April 16, 2013, and U.S. Patent No. 7,648,327 issued January 19, 2010, the entire disclosure of which is incorporated herein by reference. The robot 108 may be substantially similar to that described herein with respect to the backend 103. The mini-environment 106 may provide a controlled clean area for substrate transfer between multiple load port modules.

[0030] At least one vacuum load lock 102, 102A, 102B may be positioned between the mini-environment 106 and the backend 103 and may be connected to them. The load port 105 may be substantially directly connected to at least one load lock 102, 102A, 102B or to the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G, where the substrate carrier C is pumped down to the vacuum of the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G, and the substrate is transported directly between the substrate carrier C and the vacuum load lock or transport chamber. The substrate carrier C may function as a load lock so that the processing vacuum of the transport chamber extends within the substrate carrier C. As can be understood, if the substrate carrier C is substantially directly connected to the load lock via a suitable load port, any suitable transfer device may be provided within the load lock or otherwise have access to the substrate carrier C for transferring substrates to and from the substrate carrier C. The term vacuum as used herein refers to the 1 × 10⁻¹⁶ vacuum in which the substrates are being processed. -5It should be noted that this may mean a high vacuum, such as below Torr. At least one load lock 102, 102A, 102B generally includes atmospheric and vacuum slot valves. The slot valves of load locks 102, 102A, 102B (and processing station 130) may provide environmental separation, used to evacuate the load lock after loading substrates from the atmospheric front end and to maintain a vacuum inside the transport chamber when venting the lock with an inert gas such as nitrogen. As described herein, the slot valves of the processing units 100A, 100B, 100C, 100D, 100E, 100F, 100G may be arranged in the same plane (as described above with respect to the load port) or in different vertically stacked planes, or in combination of slot valves arranged in the same plane and slot valves arranged in different vertically stacked planes, to accommodate the transfer of substrates to / from the processing station 130 and load locks 102, 102A, 102B connected to the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G. At least one load lock 102, 102A, 102B (and / or front end 101) may also include an aligner ALN for aligning the reference of the substrate to a desired position for processing, or any other suitable substrate measuring instrument. The vacuum load lock may be located in any suitable place in the processing unit and may have any suitable configuration.

[0031] The vacuum backend 103 generally includes any suitable number of transport unit modules 104 (also referred to herein as substrate transport devices), including transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G, one or more processing stations 130, and one or more transport robots which may include one or more features of the disclosure described herein. The transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G may have any suitable shape and dimensions, for example, in accordance with the SEMI standard E72 guidelines. One or more transfer unit modules 104 and one or more transfer robots, as described below, may be at least partially located within transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G to transport substrates between vacuum load locks 102, 102A, 102B and (or cassette C located in the load port) various processing stations 130. The transfer unit modules 104 may be removable from the transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G as modular units to comply with SEMI standard E72 guidelines.

[0032] The processing station 130 can act on the substrate through various deposition, etching, or other types of high-vacuum processes to form electrical circuits or other desired structures on the substrate. Typical processes include, but are not limited to, vacuum-based thin-film processes such as plasma etching or other etching processes, implantation such as chemical vapor deposition (CVD), plasma vapor deposition (PVD), ion implantation, measurement, rapid thermal processing (RTP), dry strip atomic layer deposition (ALD), oxidation / diffusion, nitride formation, vacuum lithography, epitaxy (EPI), wire bonding and deposition, or other thin-film processes using vacuum pressure. The processing station 130 is connected to the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G in any suitable way, such as via slot valves SV, allowing substrates to pass from the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G to the processing station 130 or vice versa. The slot valves SV of the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, and 125G may be positioned to allow connection of pairs (e.g., more than one substrate processing chamber located in a common housing) or parallel-configured process stations 130T1, 130T2, a single process station 130S, and / or stacked process modules / load locks (Figures 1C and 1I).

[0033] It should be noted that the transfer of substrates to / from processing stations 130, load locks 102, 102A, 102B (or cassette C) connected to transfer chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G may occur when one or more arms of the transfer unit module 104 are aligned with a predetermined processing station 130. According to this disclosure, one or more substrates may be transferred to each predetermined processing station 130 individually or substantially simultaneously (for example, when substrates are picked / placed from parallel or tandem processing stations as shown in Figures 1B, 1D, and 1H). The transfer unit module 104 may be mounted on a boom arm 143 (see, for example, Figures 1E, 1F, 1H) or a linear carriage 144 (see, for example, Figure 1C), such as those described in U.S. Patent No. 10,777,438, issued September 15, 2020, titled "Processing Apparatus," and International Patent Application No. PCT / US13 / 25513, filed February 11, 2013, titled "Substrate Processing Apparatus."

[0034] Referring to Figures 2A and 2B, an exemplary boom arm configuration in which a transfer unit module 104 may be connected is described. The boom arm 143 and the transfer unit module 104 may together be referred to as a substrate transport device (however, if the transfer unit module 104 is used without the boom arm 143, the transfer unit module may be referred to as a substrate transport device as described herein). Here, the boom arm 143 may be a single non-articulated link boom arm 220 (Figure 2A) or an articulated link boom arm 222 (Figure 2B).

[0035] Referring to Figure 2A, a single non-articulated link boom arm 220 is rotatably connected to the frame or base 201 of the transport device. The base 201 includes a drive section 200 configured to rotate the boom arm 220 around the boom arm rotation axis BSX. The transport unit module 104 is connected to the distal end of the boom arm 143 (opposite the boom arm rotation axis BSX). The transport unit module 104 is illustrated as having a SCARA arm 210 (or dual SCARA arm 210, 210A) configuration, but it should be understood that the transport unit module 104 may have any suitable arm configuration, including, but not limited to, those described herein.

[0036] Referring to Figure 2B, the articulated link boom arm 220 includes an upper boom link 220, which is rotatably connected at its proximal end to the frame or base 201 of the transporter (on the boom arm rotation axis BAX). The other or distal end of the upper boom link 220 is rotatably connected to the proximal end of the forearm boom link 221 on the boom articulation rotation axis BEX, where the transport unit module 104 is connected to and supported by the forearm boom link 221 at its distal end. The drive section is configured to drive the rotation of the upper boom link 220 around axis BSX and the rotation of the forearm boom link 221 around axis BEX in any suitable manner. For example, the upper boom link 220 may be driven by a motor in the drive section 20, while the forearm boom link 221 is rotationally dependent (for example, a band and pulley transmission makes the rotation of the forearm boom link 221 dependent on the frame 201), although the forearm boom link 221 and the upper boom link 220 may each be driven by their respective motors in the drive section 200. Although the articulated link boom arm 222 is illustrated with two links, it should be understood that the articulated link boom arm 222 may have any suitable number of links connected in series with one another. Suitable examples of boom arms that may be used in aspects of the disclosed embodiments are described in U.S. Patent Application No. 15 / 215,143, filed July 20, 2016, titled “Substrate Processing Apparatus”, the entire disclosure of which is incorporated herein by reference.

[0037] The transport unit module or substrate transport device 104 in Figures 2A and 2B is illustrated as having a SCARA arm 210 (or dual SCARA arm 210, 210A) configuration, but the transport unit module 104 may have any suitable transport arm configuration, including, but not limited to, those described herein. For example, the transport unit module 104 may have any other desired arrangement, such as a frog leg arm 216 (Figure 2C) configuration, a leap frog arm 217 (Figure 2D) configuration, or a bidirectional symmetric arm 218 (Figure 2E) configuration. As another example, referring to Figure 2F, the transport unit module 104 may be configured as a transport arm 219. The transport arm 219 includes at least first and second articulated SCARA arms 210, 210A, where each arm 210, 210A includes an end effector 211 configured to hold at least two substrates S1, S2 side by side on a common transport plane (each substrate holding position of the end effector 211 shares a common drive for grasping and positioning substrates S1, S2), where the distance DX between substrates S1, S2 corresponds to a fixed distance between the side by side substrate holding positions. Referring to Figures 2F and 2G, the SCARA arm 210 (and arm 210A) includes an upper arm 213, a forearm 212, and an end effector 211, which are connected in series with each other to form an articulated chain of arm links. The end effector 211 described herein has at least one substrate holding station 211S, where each substrate holding station 211S has a predetermined center or end effector reference point 211C. The end effector 211 is configured to hold a substrate S (also referred to herein as a wafer) at the substrate holding station 211S and to transport the substrate within the substrate processing apparatus. Here, at least one of the arm links 213, 212, and 211 is driven by the respective drive motors of the drive section. One or more of the arm links, such as the forearm 212 and / or the end effector 211, may be driven rotation by any suitable band and pulley transmission (or other suitable transmission) to result in extension and retraction of the SCARA arm.Suitable examples of transport arms in which this disclosure may be used are U.S. Patent No. 6,231,297 issued on 15 May 2001, U.S. Patent No. 5,180,276 issued on 19 January 1993, U.S. Patent No. 6,464,448 issued on 15 October 2002, U.S. Patent No. 6,224,319 issued on 1 May 2001, U.S. Patent No. 5,447,409 issued on 5 September 1995, U.S. Patent No. 7,578,649 issued on 25 August 2009, and U.S. Patent No. 18 issued on 18 August 1998, the entire disclosure of which is incorporated herein by reference. U.S. Patent No. 5,794,487, U.S. Patent No. 7,946,800 issued on 24 May 2011, U.S. Patent No. 6,485,250 issued on 26 November 2002, U.S. Patent No. 7,891,935 issued on 22 February 2011, U.S. Patent No. 11,569,111 issued on 31 January 2023, U.S. Patent No. 8,752,449 issued on 17 June 2014, U.S. Patent No. 8,918,203 issued on 23 December 2014, and U.S. Patent No. 11,235,935 issued on 1 February 1, 2022, as well as "Dual Applicable examples can be found in U.S. Patent Application No. 13 / 293,717, filed November 10, 2011, titled “Arm Robot”, and in U.S. Patent Application No. 13 / 270,844, filed October 11, 2011, titled “Coaxial Drive Vacuum Robot”. Suitable examples of band / pulley transmissions that may be used in this disclosure are found in U.S. Patent No. 5,682,795, published November 4, 1997, U.S. Patent No. 5,778,730, published July 14, 1998, and U.S. Patent No. 11,201,073, published December 14, 2021, the entire disclosure of which is incorporated herein by reference.

[0038] Referring to Figure 2H, another transport unit module 104 is illustrated. The transport unit module of Figure 2H, like other transport unit modules described herein, can be coupled to the boom arm 143 (see, for example, Figures 1H, 2A, and 2B) so as to be transported by the boom arm 143, or coupled to the linear carriage 144 (see, for example, Figure 1G) so as to be transported by the linear carriage 144, or stationary and fixed to the frame TCF (or frame of the mini-environment 106) (illustrated in Figures 1A-1I) of the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G. Here, the transport unit module 104 includes a frame 266F to which a turret 266 is rotatably coupled for rotation around the turret rotation axis TAX. The drive section 200 includes a turret drive unit 200R located on the turret rotation axis TAX, which drives the rotation of the turret 266 in direction T3. The turret 266 includes transport arm support sections 270A, 270B extending from both sides of the turret 266, to which (one or more) transport arms 210, 210A, 216, 217, 218 are connected. The transport arm supports 270A and 270B are spaced apart from each other so that each transport arm is supported in parallel by a turret 266 (for example, in a manner similar to the method described with respect to Figure 2F and as described in U.S. Patent No. 10,134,621 issued November 20, 2018, the entire disclosure of which is incorporated herein by reference), where each of the parallel transport arms includes one or more end effectors 211 configured to hold at least one substrate side by side in a common transport plane, where the distance DX between substrates S1 and S2 corresponds to a fixed distance between the parallel substrate holding positions.

[0039] The turret 266 may include one or more linear motors 200LM connected to each transfer arm support 270A, 270B to move each transfer arm support 270A, 270B in directions 271A, 271B, resulting in adjustment of distance DX (or independent adjustment of respective distances DX1, DX2 from axis TAX), thereby taking into account variations between substrate holding stations and resulting in independent automatic wafer centering for one or more transfer arms held on each transfer arm support 270A, 270B. The turret 266 provides individual or independent Cartesian adjustments for each of the respective transport arm supports 270A, 270B (and each of the (one or more) transport arms connected thereto) to maintain substrate alignment, and the position correction brought about by the Cartesian coordinate (e.g., XY) positioning of the end effector 211 of at least one transport arm connected to the transport arm support 270A is performed in parallel with the Cartesian coordinate positioning of the end effectors 211, 211DS, 211DE, 211DT, 211DQ of at least one other transport arm connected to the transport arm support 270B, thus reducing substrate change time. Each transport arm support 270A, 270B may also include a respective Z-axis drive for moving each of the (one or more) transport arms held by the transport arm supports 270A, 270B, independently of the Z-axis motion of each transport arm held by the other transport arm supports 270A, 270B. A separate Z-axis drive device may be provided for moving the turret 266 and any transport arm connected thereto together in the Z-direction.

[0040] The drive section 200 may be a distributed drive section in which the drive motors 200M1, 200M2, 200M3A, and 200M3B of the drive section 200 are distributed within the arm 333, or otherwise within the links 213 and 212 of the arm 333, such as by mechanical joints MJ. However, the drive section 200 may also be a coaxial drive section (see Figure 3T) in which the arm link drive motors are located within the housing 200H of the drive section 200, where each motor is connected to the respective arm links 213, 212, and 211 for rotational drive of the respective arm links 213, 212, and 211 by any suitable transmission (e.g., direct drive of the drive shaft (see motor 200M1 in Figures 3C and 3T), band and pulley transmissions BPT, BPTE (see Figure 3T), and / or any other suitable transmission).

[0041] Referring to Figures 3A-3C, an exemplary vacuum substrate transfer device 104 is illustrated as having a base or frame 201 and an articulated arm 333 connected to the base 201. As described in more detail herein, the articulated arm 333 is connected to the base 201 using terminal (rotational) joints MJ (e.g., one or more axes SX, BSX, etc.) and extends around the terminal joints. The articulated arm 333 has one or more movable arm links 213, 212 and end effectors 211, 211A, 211B connected to one or more movable arm links 213, 212 at distal (rotational) joints MJ (e.g., at a wrist axis WX, etc.). The terminal and distal joints are rotational joints MJ, and the end effectors 211, 211A, 211B have substrate holding stations SHS on them.

[0042] At least one of the movable arm links, 213, 212, of the one or more movable arm links, is connected to a housing 370-375, 200H which includes at least one rotary joint MJ having rotation axes SX, BSX, EX, and at least one of the movable links 213, 212 rotates in articulation around rotation axes SX, BSX, EX to extend and retract the articulated arm 333, and at least one of the movable links 213, 212 has a link housing 370-375 which includes at least another rotary joint MJ having corresponding rotation axes EX, WX, and at least one of the arm links, 212, and end effectors 211, 211A, 211B, is rotatably joined to at least one of the movable links 213, 212 with respect to at least one rotary joint MJ.

[0043] The power and data communication system PDCS is distributed through the articulated arm 333. The power and data communication system PDCS has a contactless wireless data transfer or communication module 180 in at least one or at least another rotary joint MJ. The contactless wireless data communication module 180 has a module housing 2010 that houses transmitter and receiver printed circuit boards 250, 251 of a pair of printed circuit boards that form a contactless wireless communication interface WPDC in and across at least one or at least another rotary joint MJ, decoupling the rotation of at least one or at least another rotary joint MJ from the constraints of the power and data communication system PDCS so that the rotation of at least one or at least another rotary joint MJ is substantially unlimited (see at least Figure 3U). The transmitter and receiver printed circuit boards 250, 251 of the printed circuit board pair are aligned to predetermined alignment tolerances to provide transmission speeds of the contactless wireless data communication interface WPDC in the range of gigabytes per second (Gbps) over virtually unlimited rotations.

[0044] As described herein, an exemplary vacuum substrate transfer apparatus 104 may include one or more of the following, individually or in any suitable combination thereof and / or in any suitable combination with other features described herein: a non-contact wireless data communication interface (WPDC) with a transmission speed in the range of up to approximately 3.125 Gbps; a module housing 2010 having a static housing component 2000 and a dynamic housing component 205 joined to each other, with one of the printed circuit boards 250, 251 of a transmitter or receiver of a printed circuit board pair housed in the static housing component 2000 and the other of the printed circuit boards 250, 251 of a transmitter or receiver of a printed circuit board pair housed in the dynamic housing component 205; the static housing component 2000 is fixedly connected to housing 200H and at least one of link housings 370-375; and the dynamic housing component 205 is connected to the static housing component 2000 over the entire rotation of at least one rotary joint MJ or at least another rotary joint MJ J has a rotor 2100 that rotates around the corresponding rotation axis SAX; the other of the transmitter or receiver printed circuit boards 250, 251 of the printed circuit board pair is stationary within a static housing component 2000 for the entire rotation of at least one or at least another rotary joint MJ, while the other of the transmitter or receiver printed circuit boards 250, 251 is stationary within a dynamic housing component 205 to rotate together with the rotor 2100 around the corresponding rotation axis SAX of at least one or at least another rotary joint MJ. Mounted on the rotor 2100; the other of the transmitter or receiver printed circuit boards 250, 251 of the printed circuit board pair is aligned to one of the transmitter or receiver printed circuit boards 250, 251 of the printed circuit board pair with a predetermined alignment tolerance over the entire rotation of at least one or at least another rotary joint MJ, substantially free from the alignment tolerances and runout tolerances of at least one or at least another rotary joint MJ exceeding a predetermined alignment tolerance, and held by the rotor 2100;The rotor 2100 is positioned relative to the static housing component 2000 by a deep groove radial ball bearing 215; the deep groove radial ball bearing 215 determines a predetermined alignment tolerance of the transmitter and receiver printed circuit boards 250, 251 of the printed circuit board pair; the module housing 2010 has a static housing component 2000 and a dynamic housing component 205 joined to each other, and one of the transmitter or receiver printed circuit boards 250, 251 of the printed circuit board pair is housed within the static housing component 2000, and the transmitter or The other of the receiver's printed circuit boards 250, 251 is mounted on the rotor 2100 of the dynamic housing component 205, and an airtight isolation wall HSIW separates the rotor 2100 from the static housing component 2000, and the airtight isolation wall HSIW is configured to allow data transmission between the transmitter and receiver printed circuit boards 250, 251 of the printed circuit board pair; and a flexible shaft coupling 260 interposed between the rotor 2100 of the dynamic housing component 205 and the output shaft 290 of at least one rotary joint MJ or at least another rotary joint MJ to pair them.

[0045] The base 201 may be connected to the frame of the substrate processing apparatus (such as the frames of the transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G). The articulated arm 333 has a terminal or shoulder (rotational) joint 309 (for example, on the shoulder axis SX), around which the articulated arm 333 rotates and extends. The articulated arm 333 also includes at least one movable arm link 213, 212 and at least one end effector 211A, 211B connected to the at least one movable arm link 213, 212. Here, the articulated arm 333 rotates and extends around the terminal joint 309 and is exemplified as a SCARA arm extending from the terminal joint 309, but may be any suitable configuration such as those described herein. The SCARA arm has one or more arm links 213, 212 and at least one end effector 211A, 211B dependent on one or more arm links 213, 212. Each arm link 213, 212 is joined in series with the end effector 211A, 211B at the distal end of the SCARA arm. At least one movable arm link of the SCARA arm includes an upper arm link 213 and a forearm link 212. The proximal end of the upper arm link 213 is rotatably connected to the base 201 at the shoulder joint 309. The proximal end of the forearm link 212 is rotatably connected to the distal end of the upper arm link 213 at the elbow joint 310. At least one end effector is rotatably connected to the distal end of the forearm link 212 at the wrist joint 311. At least one end effector 211A, 211B is illustrated as two end effectors 211A, 211B, each substantially similar to the end effector 211DS in Figure 2F, but at least one end effector may have any suitable configuration. Each end effector 211A, 211B includes at least one substrate holding station SHS positioned on it.

[0046] Each of the movable arm links 213, 212 has an outer housing 213H, 212H which includes at least one rotary joint having a pivot axis (for example, one each of a shoulder joint 309 and an elbow joint 310, with the elbow joint 310 being distal to the shoulder joint 309), and at least one of the movable arm links 213, 212 rotates in articulation around the pivot axis to result in extension and contraction of the articulated arm 333. As described in more detail herein, each of the outer housings 213H, 212H is an assembly formed of housing components 370-375 which are sealed to retain a sealed atmosphere within the outer housings 213H, 212H, and each outer housing 213H, 212H is in the vacuum of a sealed chamber (transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G, etc.). The outer housings 213H, 212H are configured such that at least one movable arm link 213, 212 forms a pressure vessel (as described herein and illustrated in Figure 3C), with the axes of rotation (e.g., shoulder and elbow joints) extending from the pressure vessel. As illustrated in Figure 3C, the outer housings 213H, 212H are at least partially depressurized (see pressure vessel or tubes PT1-PT3), thereby exposing the walls 213W, 212W of the depressurized portion of the outer housings 213H, 212H to pressure equilibrium across a wall thickness WTH (e.g., the vacuum pressure on one side of wall 213W, 212W is approximately the same as the vacuum pressure on the other side of wall 213W, 212W). The depressurized portions of the outer housings 213H and 212H are configured to correspond to the static and dynamic loads applied to at least one movable arm link 213, 212 from the corresponding static and dynamic operating conditions of the articulated arm 333, and are not subjected to differential pressure loads.

[0047] The sealed housing components 370–375 of the respective outer housings 213H, 212H are connected to one another using at least one mechanical joint MJ that forms a sealed interface (see Figure 3B), through which a sealed atmosphere is communicated between each sealed housing component of the outer housings 213H, 212H and each of the other sealed housing components (for example, the sealed housing components share a common pressurized environment). One or more of the sealed housing components 370–375 (for example, forming part of the respective housings of the respective arm links and arms) are configured to form a sealed plenum (for example, see Figures 3B, 3C, 3P, etc.) inside the respective sealed housing component, housing the respective components of the transmitter and receiver of the contactless communication power and / or data link (as described herein) from the reduced-pressure environment outside the housing to a sealed atmosphere. As shown in Figure 3B, the sealed interface bisects at least one movable arm link 213, 212 between ends 370, 372, 373, 375 of at least one movable arm link 213, 212 and other ends 370, 372, 373, 375. Also as shown in Figure 3B, the sealed interface bisects the outer walls or shells 213W, 212W of the outer housings 213H, 212H. Figure 3C is an illustrative diagram of the sealed communication between each of the housing components, where the pressurized environment (compared to the vacuum or reduced pressure environment of the chamber in which the substrate transport arm is located) within the sealed atmosphere extends from the base 201 to the list housing component 375 with a minimized volume that minimizes exposure of the sealed boundary of the sealed atmosphere to the vacuum environment. As can be understood, in the shoulder axis SX and elbow axis EX, when a magnetic fluid seal FFS is used between the drive shafts 200M1D and 200M2D and their respective motor housings, both the motor stator and motor rotor (see Figure 3B) can be placed in an atmospheric environment. In the wrist axis WX and the like, when a magnetic fluid seal is not used, the stator is isolated from the vacuum by an isolation wall (as described herein), and the rotor is placed in a vacuum environment.

[0048] At least one enclosed housing component 370, 372, 373, 375 is an end or connecting part of at least one movable arm link 213, 212. At least one enclosed housing component 370, 372, 373, 375 houses at least one rotary joint 309, 310, 311 (or at least a part thereof), and at least one rotary joint 309, 310, 311 is contained within at least one enclosed housing component 370, 372, 373, 375 of at least one movable arm link 213, 212. See also Figures 4A-4E, for example, the movable arm links 213, 212 are reconfigurable arm links 213R, 212R having modular composite arm link casings or housings 213H, 212H, formed by link case modules that are rigidly connected to one another. As described in more detail herein, the rigidly connected link case module includes end connectors 370, 372, 373, 375 (also referred to herein as link case end modules or housing components) connected by at least one central arm section 371, 374 (also referred herein as interchangeable link case extension modules or extruded arm casing components) having predetermined characteristics that determine the length OAL of the movable arm links 213, 212. According to this disclosure, at least one central arm section 371, 374 forms reconfigurable arm links 213R, 212R, which are selectable for connection to end connectors 370, 372, 373, 375 from several different central arm sections (interchangeable link case extension modules) 371A1~371An, 374B1~374Bn, each having different corresponding predetermined characteristics that determine the corresponding different lengths of the movable arm links 213, 212, thereby enabling the selection of modular composite arm link casings 213H, 212H to a predetermined arm link length OALn from several predetermined arm link lengths OALn (each different length OALn corresponds to different lengths CAL1~CALn of different central arm sections 371A1~371An, 374B1~374Bn) and the reconfiguration of the arm links 213R, 212R.

[0049] For example, the upper arm link 213 and the forearm link 212 are modular arm links having their respective central arm sections 371, 374 and their respective end connectors 370-375. For instance, the upper arm link 213 includes a proximal end connector 370 that forms the proximal end 213E1 of the upper arm link 213. The central arm section 371 is connected to the proximal end connector 370 in any suitable way, such as using any suitable removable fasteners. The distal end connector 372 is connected to the central arm section 371 on the opposite side of the proximal end connector 370 so as to form the distal end 213E2 of the upper arm 213. Similarly, the forearm link 212 includes a proximal end connector 373 that forms the proximal end 212E1 of the forearm link 212. The central arm section 374 is connected to the proximal end connector 370 in any suitable way, such as using any suitable removable fasteners. The distal end connector 375 is connected to the central arm section 374 on the opposite side of the proximal end connector 373 so as to form the distal end 212E2 of the forearm link 212.

[0050] The central arm sections 371, 374 have a closed cross-section (e.g., a closed box shape) as described herein. For example, the central arm sections 371, 374 comprise a monolithic tube frame 410F which may have any suitable cross-section. In the examples illustrated in Figures 4A-4E, the tube frame 410F is shown as having a rectangular cross-section, but the cross-section may be square, circular, oval, “I” beam shape, open channel “C” or “U” shape, or any combination thereof. The central arm sections 371, 374 are mechanically fixed to each of the (respective) end connectors 370, 372, 373, 375 to form modular composite arm link casings 213H, 212H. The central arm sections 371 and 374 can be mechanically fixed to end connectors 370, 372, 373, and 375, respectively, using mechanical fastener joints (including removable mechanical fasteners as described herein) to form modular composite arm link casings 213H and 212H.

[0051] The tube frame 410F includes end flanges 540, 541 configured to connect one of the end connectors 370, 372, 373, 375 to the tube frame 410F. The flanges 540, 541 can be formed integrally with the tube frame 410F or connected to the tube frame 410F by any suitable method. For example, the flanges 540, 541 can be forged, cast, or molded together with the tube frame 410F, but the flanges 540, 541 can be connected to the tube frame by welding, mechanical fasteners, adhesives, friction fits (e.g., shrink fit, press fit, etc.), clamps, or any other suitable method. The end flanges 540, 541 may include positioning features (such as holes 545 and slots 546), and the end connectors 370, 372, 373, 375 may include mating positioning features (e.g., pins 547 or other projections that engage with the positioning features of the end flanges 540, 541 (see Figure 5C)) that orient / position each of the end connectors 370, 372 of the upper arm link 213 (or, with respect to the forearm link 212, the end connectors 373, 375) to and from the central arm section 371 (or, with respect to the forearm link 212, the central arm section 374) with at least two degrees of freedom. The positioning features and mating positioning features may be asymmetrical so that the connection is poka-yoke (e.g., asymmetrical positioning features substantially avoid assembly errors when the end connectors are connected to their respective central arm sections). Referring also to Figure 8A, the positioning feature may include projections 4100 and recesses 4110 formed on the central arm sections 371, 374 and the end connecting sections 370, 372, 373, 375, where the projections 4100 and recesses 4110 are configured to position the end connecting sections 370, 372, 373, 375 in predetermined positions relative to the respective central arm sections 371, 374.For example, the central arm sections 371, 374 may include one or more recesses 4110, and the end connectors 370, 372, 373, 375 may include one or more projections 4100, where the recesses 4110 receive the respective projections 4100 and position the end connectors 370, 372, 373, 375 in a predetermined position relative to the respective central arm sections 371, 374. The end connectors may include recesses, and the central arm sections may include projections. The recesses and projections may be continuous and extend around the entire peripheral edge of each end connector and central arm section, but the recesses and projections may be discontinuous so as to extend around a predetermined portion of the peripheral edge of each end connector and central arm section. Projections and recesses may be used with one or more pins / holes / slots so that the pins / holes / slots define the directional assembly orientation of the end connectors relative to the central arm section (e.g., which face of the end connector is the top, bottom, etc.), while the recesses and projections position the end connectors in a predetermined position relative to the central arm section. The end connectors 370, 372, 373, and 375 may be connected to their respective central arm sections 371 and 374 without positioning features, in which case the assembly of the end connectors and central arm sections is secondarily machined to a predetermined dimensional tolerance from one end connector to the other.

[0052] The end flanges 540, 541 also include fastener connectors 560-563, and the end connectors 370, 372, 373, 375 include mating fastener connectors 560A-563A that together bring the end connectors 370, 372, 373, 375 to the central arm sections 371, 374. For example, the fastener connectors 560-563 and mating fastener connectors 560A-563A may be in the form of threaded holes and openings into which bolts / screws are inserted, or any other removable fastener system. Referring also to Figure 8B, as described herein, the end connectors 370, 372, 373, and 375 are illustrated as being connected to the central arm sections 371 and 374 by clamps 4200, where each clamp engages with both the end connectors 370, 372, 373, and 375 and the central arm sections 371 and 374, thereby forming a compression connection between the end connectors 370, 372, 373, and 375 and the central arm sections 371 and 374. Referring also to Figure 8C, as described herein, the end connectors 370, 372, 373, and 375 are illustrated as being connected to the central arm sections 371 and 374 by friction fitting (e.g., shrink fitting, press fitting, etc.), where projections 4300 on the end connectors 370, 372, 373, and 375 frictionally engage with recesses 4310 (or their inner or outer surfaces) on the central arm sections 371 and 374 (and vice versa), thereby connecting the end connectors 370, 372, 373, and 375 to the central arm sections 371 and 374. The recesses 4310 and projections 4300 are substantially similar to the recesses 4110 and projections 4100 described above, except that they have a friction fit (also known as a press fit or rib fit, which is a fastening between two parts achieved by friction after the parts are forcibly pressed together - there is no clearance between the parts being assembled) (Figure 8C) rather than a slide fit (for example, the end coupling and the central arm section slide easily against each other during assembly - there is clearance between the parts being assembled) (Figure 8A).

[0053] The central arm sections 371, 374, together with their respective end connectors 370, 372, 373, 375, may have a length CAL that defines the total length OAL (from articulation center to articulation center (see Figure 4C)) of the respective upper arm link 213 or forearm link 212. The articulated arm 333 (and other arms described herein) can be constructed / reconfigured by changing the length CAL of the central arm sections 371, 374. As described herein, the central arm sections 371, 374 can be manufactured as described herein to have different predetermined lengths CAL, CAL1 to CALn. Thus, each of the central arm sections 371, 374 may be selected from several central arm sections 371A1 to 371An, 374B1 to 374Bn, where "n" is an integer indicating an upper limit on the number of central arm sections. Each of the selectable central arm sections 371A1-371An, 374B1-374Bn may have lengths CAL1-CALn that are different in length from another of the selectable central arm sections 371A1-371An, 374B1-374Bn. Here, the selection of the selectable arm sections 371A1-371An, 374B1-374Bn for installation in each upper arm link 213 or fore arm link 212 defines a variable (i.e., variable via the selection of central arm sections 371A1-371An, 374B1-374Bn) length of the upper arm link 213 or fore arm link 212, together with the respective end connectors 370, 372, 373, 375. As can be understood, the overall length OAL of one or more upper arm links 213 and forearm links 212 can be increased or decreased through the selection of selectable central arm sections 371A1-371An, 374B1-374Bn.

[0054] Referring also to Figure 7A, one or more of the central arm sections 371, 374 may be a telescopic central arm section 510T (for example, the arms of the telescopic arm section slide against each other to change length, similar to a segmented optical telescope). The telescopic central arm section 510T includes a first frame section 510T1 and a second frame section 510T2. The first frame section 510T1 is shaped and sized to receive the second frame section 510T2 in a sliding fit such that the first frame section 510T1 or the second frame section 510T2 slides longitudinally linearly relative to the other of the first frame section 510T1 or the second frame section 510T2 to increase or decrease the length CAL of the telescopic central arm section 510T. The telescopic central arm section 510T may include any suitable removable or non-removable fasteners 4000 (e.g., screws, bolts, pins, clips, welds, etc.) for locking the movement of the first frame section 510T1 relative to the second frame section 510T2 to set / fix the length CAL of the telescopic central arm section 510T. If the fasteners are removable, the length of the arm link may be adjusted as needed to accommodate additional or removed substrate processing modules, transfer chamber sections (e.g., the reach of the arm may be increased or decreased as needed).

[0055] Referring to Figure 7B, one or more of the central arm sections 371, 374 may be segmented arm sections 510S, where each segment 4020 has a fixed length CAS and is connected to one another (e.g., end to end) by abutting such that when the ends are connected together, the segments have a length CAL of the central arm sections 371, 374. The fixed lengths CAS of different segments 4020 may be the same, but the fixed lengths of the segments 4020 may be different.

[0056] The central arm sections 371, 374, 371A1-371An, 374B1-374Bn of different lengths may be manufactured from any suitable material in any suitable manner as described herein. For example, each of at least one interchangeable central arm section 371, 374, and several different interchangeable central arm sections 371A1-371An, 374B1-374Bn has a corresponding box-shaped cross section 598, and a predetermined characteristic is that each of the interchangeable central arm sections 371, 374, and several different interchangeable central arm sections 371A1-371An, 374B1-374Bn has different corresponding lengths CAL, CAL1-CALn.

[0057] The box-shaped cross section 598 provides the tubular shape of the tube frame 410F and facilitates the low-cost and / or mass production method of the central arm sections 371, 374, 371A1-371An, 374B1-374Bn. For example, the central arm sections 371, 374, 371A1-371An, 374B1-374Bn can be manufactured by extrusion or casting (for example, to form an extruded member with the box-shaped cross section 598), which reduces machining requirements (compared to conventional arm links machined from billets of material, for example). Other manufacturing methods that may be utilized may include, but are not limited to, additive manufacturing, conventional machining, folded and welded sheet metal, forging, and injection molding. The tubular shape of the tube frame 410F that can be achieved by the manufacturing processes described above results in an extruded member with a monolithic box section 598 that is significantly more robust compared to the conventional machined arm links described above. The more robust box-shaped cross section 598 allows for a longer arm length than could be achieved with conventionally machined arm links by other means, and a tube frame 410F with thinner side walls 510W is manufactured, thereby reducing the weight of the arm link and increasing the operating speed of the substrate transport device 130.

[0058] The corresponding box-shaped section 598 may have dimensions and shape corresponding to different corresponding lengths CAL, CAL1 to CALn, so as to maintain a predetermined stiffness (end to end) for each different interchangeable central arm section 371, 371A1 to 371An, 374, 374B1 to 374Bn. The corresponding box-shaped section 598 may have dimensions and shape corresponding to different corresponding lengths CAL, CAL1 to CALn, so as to maintain a predetermined stiffness (end to end) for each different selectable predetermined arm link length OAL, OALn. For example, with respect to a predetermined stiffness, as the lengths CAL, CAL1 to CALn of the central arm sections 371, 371A1 to 371An, 374, 374B1 to 374Bn increase, the thickness THK of one or more walls 510W of the box-shaped section 598 (Figure 5E) may also increase. One or more thicknesses THK of the wall 510W may taper along their respective lengths CAL, CAL1 to CALn, with the wall being thickest at the proximal end of the arm link (relative to the shoulder axis SX) and thinnest at the distal end of the arm link (relative to the shoulder axis SX; for example, considering arm link 212, the wall thickness is greatest in the portion adjacent to the elbow axis AX and thinnest in the portion adjacent to the wrist axis WX). For example, reinforcing ribs may be formed in the box-shaped section 598 during extrusion of the box-shaped section 598. The material of at least one interchangeable central arm section 371, 374, and several different interchangeable central arm sections, 371A1 to 371An, 374B1 to 374Bn, has a higher stiffness (spring constant) than the material of the end connecting sections 370, 372, 373, 375.

[0059] A modular arm link configuration can also simplify the manufacturing of the arm link ends. For example, in conventional arm links, the arm link ends, to which the arm pulley and pulley shaft are connected, are machined from a billet of material as a unit with the central portion of the arm. According to this disclosure, the modular configuration of the arm link allows for the use of separate manufacturing techniques for the end connecting sections 370, 372, 373, 375 and the central arm sections 371, 374, 371A1-371An, 374B1-374Bn. For example, the central arm sections 371, 374, 371A1-371An, 374B1-374Bn may be extruded (or manufactured by other methods described herein), while the end connectors 370, 372, 373, 375 may be cast or forged in a near-net shape (i.e., the initial manufacturing of the end connectors is very close to the final (net) shape of the end connectors, reducing the need for surface finishing) to reduce the machining and costs of the end connectors 370, 372, 373, 375, and thus reduce the overall cost of the substrate transport device 130. This can be achieved by casting, forging, additive manufacturing, conventional machining, and injection molding. The end connectors 370, 372, 373, and 375 may be provided as a pre-assembled / manufactured arm joint 4700, where at least a portion of one transmission member (such as one or more pulleys of transmission members 490, 492, 493, 494, and 495) is pre-installed in the pre-assembled arm joint 4700. Pre-assembling the arm joint 4700 can reduce manufacturing costs and shorten the lead time for assembling the transport arm.

[0060] One or more of the central arm sections 371, 374, 371A1-371An, 374B1-374Bn and the end connectors 370, 372, 373, 375 may be constructed of metal parts, such as aluminum, stainless steel, Inconel, or other metal alloys, or one or more of any other suitable materials. One or more of the central arm sections 371, 374, 371A1-371An, 374B1-374Bn and the end connectors 370, 372, 373, 375 may be constructed of any suitable material, including but not limited to non-metallic materials, including ceramics, polymers, composite materials, and carbon fiber. As described herein, one or more of the central arm sections 371, 374, 371A1-371An, 374B1-374Bn and the end connectors 370, 372, 373, 375 may be constructed using mass production methods (e.g., molding, casting, forging, extrusion, etc.) in one or more near-net shape or rough shape (which requires more extensive secondary machining operations than near-net shape casting, forging, forming, etc.), and it should be noted that the interior of one or more of the central arm sections 371, 374, 371A1-371An, 374B1-374Bn and the end connectors 370, 372, 373, 375 may be forged, cast, etc. in a near-net shape, while the exterior may be forged, cast, etc. in a rough shape. Secondary machining operations include, but are not limited to, conventional machining, cutting, grinding, and electrostatic discharge machining. Examples of arm components having both (one or more) formed as-shape (e.g., casting, forging, extrusion, etc.) surfaces and (one or more) machined surfaces / features are illustrated in Figures 5-7. Figure 5 illustrates end connectors 370, 373 having formed as-shape (e.g., near-net shape or rough shape) surfaces and corresponding finished end connectors 370, 373 having machined surfaces / features (using methods as described herein).Figure 6 illustrates the formed end joints 372, 375 (e.g., near net shape or rough shape) and the corresponding finished end joints 372, 375 having machined surfaces / features (using methods as described herein). Figure 7 illustrates the formed central arm sections 371, 374 (e.g., near net shape or rough shape) and the corresponding finished central arm sections 371, 374 having machined surfaces / features (using methods as described herein).

[0061] As seen in Figures 4A–4C, each of the upper arm link 213 and the fore arm link 212 has its own height AH. The height AH1 of the fore arm link 212 may be lower than the height AH2 of the upper arm link 213 (or vice versa), but the height AH1 of the fore arm link 212 may be approximately the same as the height AH2 of the upper arm link 213. The respective heights AH1 and AH2 may depend on the number of pressure vessels or tubes PT1–PT3 (as described herein – see Figures 3B, 3C, and 4E) extending through the arm links, or on the position of the arm links in a series-connected arm link (for example, the height of an arm link may decrease as it moves away from the shoulder axis SX).

[0062] Referring again to Figures 3A-3C, the transport arm may include at least one end effector 211A, 211B (also referred to herein as a substrate holder). For illustrative purposes, two end effectors 211A, 211B are illustrated, but as described herein, the transport arm may have any number of end effectors, each end effector having any suitable configuration for holding one or more substrates. Each of the end effectors 211A, 211B is rotatably and separately joined to a joint at a common end of the forearm link 212, so that each end effector 211A, 211B rotates relative to the forearm link 212 about its joint or about a common axis formed thereby (see, for example, the wrist axis or joint WX).

[0063] Referring again to Figures 3A-3C, 3H, and 4E, the outer housings 213H, 212H of at least one movable arm link 213, 212 are configured such that at least one movable arm link 213, 212 forms a pressure vessel, with each of the rotation axes (or multiple rotation axes) SX, EX, WX extending from the pressure vessel. For example, each of the end couplings 370, 372, 373, 375 and the arm central arm sections 371, 374 includes at least one atmospheric chamber or pressurized chamber (also referred to herein as a pressure vessel) ACH1-ACH5, PT1-PT3 which is sealed in any suitable way from the sealed or vacuum (e.g., reduced pressure) environment of the transport chamber 125A, 125B, 125C, 125D, 125E, 125F, 125G (or other chamber that maintains a process vacuum) in which the transport arm is located. For example, in shoulder shafts SX and elbow shafts EX, pressurized chambers ACH1-ACH3 may be sealed at least partially by cap plates 386 and their respective annular seals 386S (such as O-rings or other suitable static seals) and one or more magnetic fluid seals FFS. In wrist shafts, which are exposed to higher temperatures than elbow and shoulder shafts, (one or more) pressurized chambers ACH4, ACH5 are sealed at least partially by cap plates 387, 387E, 387EA (see also Figures 3H and 3I) and their respective annular seals 387S.

[0064] As illustrated in Figures 3B, 3C, and 4E, the respective pressurized chambers ACH1 to ACH2 of the end couplings 370 and 372 of the movable arm link 213 are connected to each other by at least one pressure tube PT1. The shoulder rotation axis SX of the movable arm link 213 extends from the shoulder pressurized chamber ACH1 to the interior of the base 201, for example, via the hollow drive shaft 200M1D of the direct-drive shoulder motor 200M1 (also called a brushless motor) of the drive section 200 (the direct-drive shoulder motor 200M1 is directly connected to the movable arm link 213 and directly drives the movable arm link 213 around the shoulder axis SX). Here, at least one enclosed housing component 370 houses at least a portion of the brushless motor 200M1. The elbow rotation axis EX of the movable arm link 212 extends from the pressure chamber ACH2 of the elbow end connector 372 to the pressure chamber ACH3 of the elbow end connector 373 via the hollow drive shaft 200M2D of the direct-drive elbow motor 200M2 of the drive section 200 (the direct-drive elbow motor 200M2 (also referred to herein as a brushless motor) is directly connected to the movable arm link 212 and directly drives the movable arm link 212 around the elbow axis EX). Here, at least one enclosed housing component 372, 373 houses at least a portion of the brushless motor 200M2. The pressure chambers ACH4, ACH5 of the wrist end connector 375 are connected to the pressure chamber ACH3 of the end connector 373, respectively, by at least one pressure tube PT2, PT3.

[0065] Referring to Figures 3D, 4E, and 8C, the pressure tubes PT1-PT3 are sealed in any suitable manner to their respective end connectors 370, 372, 373, and 375. For example, each end connector 370, 372, 373, and 375 has at least one opening 555, 555A, and 555B into which at least a portion of the respective pressure tube PT1-PT3 is inserted. The openings 555, 555A, and 555B may be arranged in a single row or in a two-dimensional array. Each pressure tube PT1-PT3 may include at least one annular seal 801A, 80IB (such as an O-ring or any other suitable static seal) interface connecting both the outer surface of the pressure tube PT1-PT3 and the surface of the respective opening 555, 555A, and 555B in order to at least partially seal the pressurized chambers ACH1-ACH5 from the vacuum environment. The insertion of pressure tubes PT1 to PT3 into openings 555, 555A, and 555B compresses the annular seals 801A and 801B, thereby sealing the pressurized chambers ACH1 to ACH5 from a vacuum environment. Each pressure tube PT1 to PT3 may include an annular flange 810 and an annular seal 811 that abuts against the annular flange 810. With the pressure tubes PT1 to PT3 inserted into openings 555, 555A, and 555B, the annular flange 810 compresses the annular seal 811 against the machined surfaces of their respective end connectors 370, 372, 373, and 375, thereby sealing the pressurized chambers ACH1 to ACH5 from a vacuum environment, where the compressive force on the annular seal 811 is provided by the fixing of the end connectors 370, 372, 373, and 375 to their respective central arm sections 371 and 374. Pressure tubes PT1 to PT2 may include both annular flanges 810 and annular seals 801A, 801B, and 811, or any suitable combination thereof.

[0066] As described herein, each pressure tube PT1-PT3 has a minimized internal volume to minimize the surface area of ​​each arm link exposed to the vacuum environment (and the pressure difference created thereby). For example, the hollow drive shafts 200M1D, 200M2D and pressure tubes PT1-PT3 are configured for the passage of one or more electrical / communication cables CBL (which may be optical fiber or Ethernet cable, or other suitable cable / conductor transmitting one or more electrical and data), cooling line tubes CLTB, and discharge line tubes EXL, for example, from the base 201 to the wrist axis WX (e.g., the wrist end coupling 375). A short-range proximity wireless network (as described herein, where data (and / or power) is transmitted across a minimum spatial gap MAG between the transmitter and receiver) may be used for high-speed data transmission across at least the entire articulated arm 333 of the substrate transport device 104. It should be noted that proximity data transmission, such as those described herein, operates at the physical layer (of the Open System Interconnection Reference Model) between nodes, enabling support for industrial networks including, but not limited to, EtherCat, profibus, and deviceNet, thus resulting in real-time data transmission, and therefore does not require changes to the communication protocol (e.g., from 3jnet to Wi-Fi to Ethernet or any other suitable protocol).

[0067] One or more of the pressure tubes PT1-PT3 may be sized such that one or more of the electrical / communication cables CBL, cooling line tube CLTB, and discharge line tube EXL extending through them occupy the internal volume of the pressure tubes PT1-PT3, leaving as little empty space as possible within the pressure tubes PT1-PT3. One or more of the pressure tubes PT1-PT3 may be used solely for fluid transfer (e.g., inflow or discharge), where the pressure tubes PT1-PT3 have dimensions minimized to provide a predetermined volumetric flow rate of fluid, for example, to provide cooling for the transfer arm components. In this way, the central arm sections 371, 374 can be reduced to a process (high) vacuum of the transfer chamber, except for the minimized volume of the (one or more) pressure tubes PT1-PT3.

[0068] Figures 3D–3G illustrate an exemplary rotary joint configuration in which hollow drive shafts 200M1D, 200M2D and pressure tubes PT1–PT3 are configured for the passage of one or more of the following: electrical / communication cable CBL, cooling line tube CLTB, and discharge line tube EXL. The rotary joint configuration provides wireless delivery of at least data communications across the air gap MAG (in this specification, the term “air” is used for convenience, as the gap may exist in a vacuum atmosphere, as described herein with respect to the wrist joint). The rotary joint may also provide power supply via slip rings 379 (in the shoulder joint and elbow joint, etc.), although the power supply may be wireless power supply (in one or more of the wrist joint, shoulder joint and elbow joint, etc.) similar to the power supply for wireless data communications across the air gap MAG. The power supply and data communication provided by this disclosure may provide integration of sensors and / or actuators / direct drive motors into the articulated arm 333 as described herein, while isolating the sensors and actuators from the vacuum environment in which the articulated arm 333 operates. Any cables, cooling tubes, and other electronic equipment (including at least sensors (such as encoders, substrate sensors, measurement kit sensors, accessory sensors, imaging / visual sensors, thermal sensors, displacement sensors, etc. as described herein) and direct drive motors as described herein) are embedded within the atmospheric chambers ACH1-ACH5 (see Figure 3C) within the articulated arm 333 structure, thereby significantly eliminating contamination of the vacuum environment by gas release from cables, cooling tubes, and other electronic equipment.

[0069] Figures 3D-3G illustrate the elbow joint of the articulated arm 333, but shoulder joints and / or wrist joints may be configured similarly. See also Figure 3B, the conduit 381 may extend through the hollow drive shaft 200M2D and motor rotor (the motor rotor is formed by the drive shaft, or vice versa, or otherwise connected to it). The conduit 381 may be formed in other ways by the hollow drive shaft 200M2D and / or motor rotor. On both sides of the rotary joint (elbow joint in this example), the conduit 381 includes a rotating manifold or union 381M1, 381M2 at each end of the conduit 381. The manifold 381M1 includes a stationary portion 382 (relative to the upper arm 213) and a movable portion 383 (relative to the upper arm 213) which forms part of the conduit 381 or is otherwise connected to communicate with the conduit 381. The input section 382 is fixed to the end 372 of the upper arm 213 so as to be stationary relative to the upper arm 213 and is configured to connect to one or more cooling line tubes CLTB. The conduit 381 and movable section 383 of the manifold 381M1 are connected to the motor rotor and / or drive shaft 200M2D so as to rotate together with the end 373 of the forearm 212 around the elbow axis EX (i.e., the movable section 383 is stationary relative to the forearm 212 but rotates around the elbow axis EX relative to the upper arm 213). The movable section 383 of the manifold 381M1 is sealed against the stationary section 382 of the manifold 381M1 by (one or more) suitable annular shaft seals 381MS to form a rotating manifold 381M1. The rotating manifold 381M1 keeps one or more cooling line tubes CLTB stationary relative to the upper arm 213 while the cooling fluid passes between the conduit 381 and the one or more cooling line tubes CLTB, with the conduit 381 (and forearm 212) rotating around the elbow axis EX. The manifold 381M2 includes one or more couplings configured to connect to the cooling line tubes CLTB and is fixed (relative to the forearm 212) as described above.

[0070] Each of the manifolds 381M1 and 381M2 also includes an opening sealed to at least one communication cable CBL extending through conduit 381. This (one or more) communication cable CBL is any (one or more) suitable communication cable providing high-speed data communication to, for example, motors 200M1-200M3B, encoders 388, 389, 389A, and / or any other suitable electronic equipment integrated with the articulated arm 333. In the upper arm 213, at least one communication cable enters conduit 381 through seal 385A of manifold 381M1, extends through conduit 381 in a passage common with the flow of cooling fluid, and exits conduit 381 through another seal 385B of manifold 381M2 (seals 385A and 385B form a seal between the respective manifold and at least one communication cable). A communication cable CBL extending through conduit 381 may be replaced by an optical or radio frequency data coupling having a transmitter and receiver positioned in seals 385A, 385B for data transmission through conduit 381. Seals 385A, 385B may be zero-pressure seals (e.g., substantially no pressure difference on the opposite side of the seal) that provide structural support for holding one or more cable CBLs within the articulated arm 333. Seal 385A may also substantially prevent cooling fluid from leaving conduit 381 in the wire feedthrough section, thereby directing the cooling fluid from inside conduit 381 to a predetermined cooling fluid outlet or coupling (see Figure 3E). The cooling fluid connection can be connected to any suitable tube extending through each arm link (the tube is illustrated at end 372 in Figures 3D, 3F, and 3G, but not at end 373 for clarity), but the cooling fluid connection can open to the atmospheric chambers at each end 370, 372, 373, and 375 (see atmospheric chambers ACH1 to ACH5 in Figure 3C) via the respective pressure tubes PT1 to PT3 of the central arm sections 371 and 374, but the cooling fluid connection can open to the atmospheric chambers at each end 370, 372, 373, and 375.

[0071] It should be noted again that, in order to provide data transmission via a rotary joint, the conduit 381 rotates relative to the upper arm 213, and the wireless transmitter 377T is fixed (i.e., stationary) to the end 372 of the upper arm 213. A wireless receiver 377R (e.g., having a disc-shaped antenna or any suitable antenna) is fixed to the conduit 381 (e.g., to the end of the manifold 381M1) and connected to the communication cable CBL so as to rotate together with the conduit 381. The wireless transmitter 377T (e.g., having a disc-shaped antenna or any suitable antenna) is positioned relative to the wireless receiver 377R to transmit data to and from it. Although the transmitters and receivers 377T and 377R are illustrated, it should be understood that the positions of the transmitters and receivers may be reversed, there may be two transceivers (to provide bidirectional data communication), and there may be two sets of transmitters and receivers (to provide bidirectional data communication). The transmitters and receivers 377T and 377R may be configured for optical communications, radio frequency communications (e.g., Wi-Fi, near-field communication, ultra-wideband, millimeter wave, etc.), inductive communications, or other short-range wireless communication protocols described herein that operate over very short distances, such as about 20 mm or less (the communication distance may exceed about 20 mm), such as Bluetooth®, infrared, Zigbee®, etc. The short-range communication effect ensures data transmission and immunity to radio frequency noise within semiconductor manufacturing fabrications or factories. A minimized air gap MAG is provided between the transmitting and receiving sections of the transmitters and receivers 377T and 377R. The minimized air gap is dimensioned to be the smallest possible gap, allowing the receiver 377R to rotate without contacting the transmitter 377T.

[0072] Still referring to Figures 3B, 3D, and 3E, power is transmitted through the slip ring 379 via the rotary joint. For example, the brush block 379B of the slip ring 379 is fixed (stationary) connected to the end 372 of the upper arm 213, while the rotating ring 379R of the slip ring is fixed to the conduit 381 (for example, relative to the conduit 381) so as to rotate together with the conduit 381. Power is supplied to the brush block 379B using any suitable power cable CBL and from the rotating ring to the forearm 212 using any suitable power cable CBL located adjacent to the conduit 381 and within the drive shaft 200M2D. Power supplied to the articulated arm 333 via cables and slip rings (and via wireless couplings in some examples) provides power to motors 200M1-200M3B, encoders 388, 389, 389A, and / or any other suitable electronic equipment integrated with the articulated arm 333.

[0073] As seen in Figures 3D and 3E, the rotary joint provides virtually unlimited rotation of the forearm 212 relative to the upper arm 213. Furthermore, since the cable CBL and cooling line tube in the upper arm 213 at the elbow joint interface only with components stationary relative to the upper arm 213 (e.g., transmitter 377T, stationary part 382 of manifold 381M1, brush block 379B of slip ring 379), the cable CBL and cooling line tube CLTB do not bend or move with the articulation of the forearm 212 relative to the upper arm 213, thereby potentially improving the reliability and lifespan of the cable CBL and tube CLTB. Similarly, since the cable CBL and cooling line tube within the forearm 212 at the elbow joint only interface with components stationary relative to the forearm 212 (e.g., receiver 377R, movable part 383 of manifold 381M1, rotating ring 379R of slip ring 379), the cable CBL and cooling line tube CLTB do not bend or move with the articular movement of the forearm 212 relative to the upper arm 213, thereby potentially improving the reliability and lifespan of the cable CBL and tube CLTB. As can be understood, if substantially unlimited rotation of the arm joint is not required or otherwise undesirable, one or more of the electrical slip rings and data transmitters / receivers may be removed so that (one or more) power and / or data cables extend through conduit 381 to seal 385B (conduit 381 is stationary and fixed to the upper arm 213), where (one or more) cables form a clock spring within the forearm 212, which winds and unwinds (in a manner similar to a helical clock spring) as the forearm 212 rotates relative to the upper arm 213.

[0074] See also Figure 3P, power transmission and data communication via rotary joints can both be wireless. For example, rotary joints such as elbow joints (shoulder joints and / or wrist joints can be substantially similar) are substantially similar to those illustrated in Figures 3D and 3E. A data transmitter 377T and a power transmitter 379TX may be located within the enclosed housing component 372. Each of the data transmitter 377T and power transmitter 379TX has its respective transmitter antennas 377TA, 379TXA, located within the enclosed housing component 372. One or more of the data transmitter 377T, power transmitter 379TX, antenna 377TA, and antenna 379TXA may form part of the enclosed housing component 372, but one or more of the data transmitter 377T, power transmitter 379TX, antenna 377TA, and antenna 379TXA may form part of the enclosed housing component 372 and may be connected to the enclosed housing component 372 in any suitable manner.

[0075] The data receiver 377RA and power receiver 379RX are mounted on the hollow drive shaft 200M2D of the motor 200M2 and connected to the respective data receiving antenna 377RA and power receiving antenna 379RXA. The antennas 377RA and 377RXA may be disk-shaped to maintain communication with the respective transmitting antennas 377TA and 379TXA even when the arm link 212 rotates relative to the arm link 213.

[0076] One or more of the receivers 377R, 379RX and the antennas 377RA, 379RXA may be positioned on the hollow drive shaft 200M2D to form part of a sealing member SLM that seals the vacuum atmosphere (where the motor rotor is located, for example) from the internal atmosphere of the sealed housing component 372. One or more of the receivers 377R, 379RX and the antennas 377RA, 379RXA may be positioned on the sealing member SLM or otherwise connected to the sealing member SLM. As shown in Figure 3P, the sealing member SLM may at least partially seal the encoder's reading head ENH from the vacuum atmosphere, although the reading head ENH may be sealed from the vacuum atmosphere in any suitable manner.

[0077] The data transmitter 377T, power transmitter 379TX, antenna 377TA, and antenna 379TXA are exemplified on the bottom side of the hollow drive shaft 200M2D or the bottom side of the sealed housing component 372 (the spatial term "bottom" is used here for convenience), with the receivers 377R, 379RX and antennas 377RA, 379RX positioned on the hollow drive shaft 200M2D. However, the receivers 377R, 379RX and antennas 377RA, 379RX are positioned on the bottom side of the sealed housing component 373 to communicate with each other through the walls of the housing component between the arm links 212, 213 and the vacuum atmosphere, while one or more of the data transmitter 377T, power transmitter 379TX, antenna 377TA, and antenna 379TXA may be positioned on the top side of the sealed housing (the spatial term "top" is used here for convenience) and the bottom side of the sealed housing 372.

[0078] Referring to Figures 3B and 3F, rotational joints such as elbow joints (although shoulder and / or wrist joints may be substantially similar) are substantially similar to those illustrated in Figures 3D and 3E. However, the cooling fluid and communication cable CBL do not necessarily share a common passage. Here, conduit 381 forms two concentric chambers or passages, where the cooling fluid flows through the outer chamber and the communication cable CBL extends through the inner chamber. The dual chambers of conduit 381 may provide an increase in laminar cooling fluid flow compared to the cooling fluid flow in Figure 3D, where the communication cable CBL is positioned in the cooling fluid flow and in direct contact with the cooling fluid flow.

[0079] Referring to Figures 3B and 3G, rotational joints such as elbow joints (although shoulder and / or wrist joints may be substantially similar) are substantially similar to those illustrated in Figures 3D and 3E. However, both the power cable CBL and the communication cable CBL extend through the interior of the hollow drive shaft 200M2D and are in direct contact with the flow of cooling fluid. Here, both the power cable CBL and the communication cable CBL enter the interior of the hollow drive shaft 200M2D through seal 385A. Conduit 381 (similar to the double-chamber conduit in Figure 3F, but may also be similar to the single-chamber conduit in Figure 3D) may be connected to the motor rotor or drive shaft 200M2D (for example, sealed to rotate as a whole) and terminate at its bottom. Conduit 381 may extend into the forearm 212 in a manner similar to that illustrated in Figures 3D and 3F. The inner chamber includes a seal 385F that seals the cable CBL to the hollow drive shaft 200M2D as the cable CBL enters the interior of the hollow drive shaft 200M2D.

[0080] Referring to Figures 3A, 3C, and 3H, the wrist axis WX may include one or more radial flux motors 200M3A, 200M3B (also called brushless motors), each having (one or more) stators 391, (one or more) rotors 392, and output or drive shafts 300M3AD, 300M3BD connected to each rotor 392. Here, at least one enclosed housing component 375 houses at least a portion of the brushless motors 200M3A, 200M3B. End effectors 211, 211A, 211B are connected to their respective drive shafts 300M3AD, 300M3BD for rotation around the wrist axis WX. Each stator 391 of the motors 200M3A, 200M3B may be sealed from the vacuum environment in which the transport arm operates by any suitable isolation wall 395. Suitable examples of radial flux motors and isolation walls that can be incorporated into a list axis WX are described in U.S. Patent No. 9,948,155 issued April 17, 2018 and U.S. Patent No. 9,186,799 issued November 17, 2015, the entire disclosure of which is incorporated herein by reference. For example, referring to motor 200M3A (and motor 200M3B substantially similarly), the stator 391 (and its stator coils) is located within a pressure chamber ACH4, where the pressure chamber ACH4 is sealed by a cap plate 387 (and their respective seals 387S) and an isolation wall 395. The isolation wall 395 is in substantial contact with the cap plate 387, where (one or more) any suitable static seal (such as an O-ring) 395S is compressed (at least by the pressure difference between atmospheric pressure and vacuum pressure) between the isolation wall 395 and the cap plate 387. The isolation wall 395 may be a thin film attached to the pole or core of the stator 391, or otherwise matching it, such that the stator substantially supports the isolation wall. The isolation wall 395 may be structurally bonded to the inner diameter of the stator 391 (or any other suitable part thereof) in any suitable manner, for example, using any suitable binder, such that the isolation wall 395 integrates with the stator 391 (e.g., forms a single structure or assembly with it) and / or is dependent on the stator 391.The isolation wall 395 may be a coating formed on the poles or core of the stator 391, or otherwise fixed thereto. The isolation wall 395 may extend beyond the stator 391 and interface with the cap plate 387. As seen in Figure 3H, the isolation wall 395 may not have to support any additional structural loads other than the pressure difference load between the vacuum environment and the atmospheric pressure environment (i.e., the pressure difference load is shared between the isolation wall and the stator).

[0081] As can be understood, motors 200M3A and 200M3B may have rotors that utilize magnets that may be affected by gases used in semiconductor manufacturing processes. As described herein, the motor rotors of elbow motor 200M2 and shoulder motor 200M1 are sealed from the vacuum environment by at least a magnetic fluid seal (FFS). With respect to the listed locations where the temperature to which the magnet fluid seal may be too high to be used, the rotor magnets 392M of rotor 392 are sealed to isolate the magnets 392M from the vacuum environment. For example, at least a portion of rotor 392 is sealed in a highly airtight non-ferrous housing 392H that seals the magnets 392M from the vacuum environment with substantially no degradation of motor performance. The non-ferrous housing 392H may extend over it to enclose the magnets 392M and may be hermetically sealed to rotor 392 in any suitable way (by any suitable vacuum-compatible sealant, adhesive, epoxy, etc.).

[0082] See also Figure 3L, power and / or data may be transmitted wirelessly from the atmospheric chambers ACH4, ACH5 of the List (e.g., end or sealed housing component 375) to the end effectors 211A, 211B. Power and / or data communication is provided to the List via a cable to bring at least the operation of the drive motors 200M3A, 200M3B and their respective encoders 389, 389A, where the cable extends into the respective atmospheric chambers ACH4, ACH5 through one or more respective pressure tubes PT2, PT3. A short-range proximity wireless communication network may be provided for transmitting power and / or data to and from the end effectors 211A, 211B. The short-range proximity wireless communication network may include a power and / or data transmitter 341T located in the List and a power and / or data receiver 341R located in the end effectors 211A, 211B. A short-range proximity wireless communication network may be used for power and / or data transmission between frame 201 and upper arm 213, and / or between upper arm 213 and forearm 212. Referring to atmospheric chamber ACH4, the power and / or data transmitter 341T is located within atmospheric chamber ACH4. The power and / or data transmitter 341T is coupled to a transmitter antenna 341TA located in a vacuum environment. The transmitter antenna 341TA is constructed of any suitable vacuum-compatible material (e.g., stainless steel) and is secured to the end 375 in any suitable manner (e.g., with any suitable fasteners). Any suitable seal (e.g., an O-ring) may be provided between the transmitter antenna 341TA and the end 375 to seal any feedthrough portion connecting the transmitter antenna 341TA to the power and / or data transmitter 341T.The transmitter antenna 341TA may surround the drive shaft 200M3AD of the motor 200M3A (and therefore the connection between the drive shaft 200M3AD and the respective end effectors 211B) so as to maintain substantially wireless communication between the power and / or data transmitter 341T and the end effectors 211B even when the end effectors 211B are rotating.

[0083] The power and / or data receiver 341R is embedded within the end effector 211B in any suitable manner (e.g., during the manufacturing of the end effector or within a sealed atmospheric chamber within the end effector 211B). The receiver antenna 341RA is positioned in a vacuum environment. The receiver antenna 341RA is constructed of any suitable vacuum-compatible material (e.g., stainless steel) and is secured to the end effector 211B in any suitable manner (e.g., with any suitable fasteners). Any suitable seal (e.g., an O-ring) may be provided between the receiver antenna 341RA and the end effector 211B to seal any feedthrough portion connecting the receiver antenna 341RA to the power and / or data receiver 341R. The receiver antenna 341RA may surround the drive shaft 200M3AD of the motor 200M3A (and therefore the connection between the drive shaft 200M3AD and the respective end effectors 211B) so as to allow passage of the drive shaft 200M3AD of the motor 200M3A, and so as the end effector 211B rotates, wireless communication between the power and / or data transmitter 341T and the end effector 211B is substantially maintained via wireless communication between the two ring-shaped antennas 341TA, 341RA. The antennas 341TA, 341RA may have any suitable shape. For example, the antennas 341TA, 341RA may be constructed of thin foil to conform to / with the surface on which they are mounted. As can be understood, the transmitter 341T and receiver 341R may also provide bidirectional data communication. In a manner similar to that described herein, the antennas 341TA, 341RA are separated by a minimized gap MAG.

[0084] Still referring to Figure 3L, power and / or data can be transmitted to (and from) end effector 211A in a manner substantially similar to that described with respect to end effector 211B. For example, a power and / or data transmitter 342T is located inside the atmospheric chamber ACH5 (transmitter 342T is described as transmitting both data and power, but there may be separate transmitters for power and data, as illustrated in Figure 3P, etc.). The power and / or data transmitter 342T may be coupled to a transmitter antenna 342TA located in a vacuum environment (the antenna may be at least a dual-band antenna with one band for power transmission and the other for data transmission, but there may be separate antennas for power and data). The transmitter antenna 342TA is constructed of any suitable vacuum-compatible material (e.g., stainless steel) and is fixed to end 375 in any suitable manner (with any suitable fasteners, etc.). Any suitable seal (such as an O-ring) may be provided between the transmitter antenna 342TA and the end 375 to seal any feedthrough portion connecting the transmitter antenna 342TA to the power and / or data transmitter 342T. The transmitter antenna 342TA may surround the drive shaft 200M3BD of the motor 200M3B (and therefore the connection between the drive shaft 200M3BD and the respective end effectors 211A) so that wireless communication between the power and / or data transmitter 342T and the end effector 211A is substantially maintained even when the end effector 211A rotates.

[0085] The power and / or data receiver 342R is positioned in any suitable manner within the drive shaft 200M3BD so as to be located within the sealed atmospheric chamber ACH6, which is at least partially formed by the hollow drive shaft 200M3BD (whereas the receiver 342R is described as receiving both data and power, there may be separate receivers for power and data, as illustrated in Figure 3P, etc.). The receiving antenna 342RA is positioned in a vacuum environment and coupled to the drive shaft 200M3BD so as to seal the receiver 342R within the drive shaft 200M2BD (the antenna may be at least a dual-band antenna with one band for power reception and the other for data reception, but there may be separate antennas for power and data). Any suitable data / communication cable CBL (or optical communication) extends from the receiver 342R to the end effector 211A within the hollow drive shaft 200M3BD, where the end effector forms a seal with the drive shaft 200M3BD, sealing the atmospheric chamber ACH6 within the drive shaft 200M3BD from the vacuum environment.

[0086] The receiver antenna 342RA is constructed of any suitable vacuum-compatible material (e.g., stainless steel) and is fixed to the drive shaft 200M3BD in any suitable manner (e.g., with any suitable fasteners). Any suitable seal (e.g., an O-ring) may be provided between the receiver antenna 342RA and the drive shaft 200M3BD to seal any feedthrough portion connecting the receiver antenna 342RA to the power and / or data receiver 342R. The receiver antenna 342RA may have a disk shape so that wireless communication between the power and / or data transmitter 342T and the end effector 211A is substantially maintained via wireless communication between the ring-shaped antenna 342TA and the disk-shaped antenna 342RA, even if the end effector 211B rotates. Antennas 342TA and 342RA may have any suitable shape. For example, antennas 342TA and 342RA may be constructed of thin foil to conform to the surface on which they are mounted. As can be understood, the transmitter 342T and receiver 342R can also provide bidirectional data communication. In a manner similar to that described herein, the antennas 342TA and 342RA are separated by a minimized gap MAG.

[0087] Antennas 341T, 341R, 342T, and 342R may be configured to transmit power by one or more of the following: inductive coupling, capacitive coupling, resonant capacitive coupling, power beam, Wi-Fi coupling, and magnetodynamic coupling, to accommodate one or more of radio frequency communications or optical communications. If radio frequency communications are used, they may be near-field radio communications, ultra-wideband, millimeter wave, or any other frequency / protocol. If optical communications are used, they may include beam steering for beam alignment between antennas 341TA, 341RA, 342T, and 342R. In cases where magnetodynamic coupling is used, for example, the end effectors 211B and 211A (or one or more articulated arm links) may include an onboard battery or capacitor PWR that is charged in stages via magnetodynamic coupling by articulation of one or more arm joints (e.g., via wireless power transmission as described herein with respect to Figure 3L). One or more of the upper arm 213 and forearm 212 may include one or more onboard battery / capacitor PWRs that can be charged in stages via magnetodynamic coupling by articular movement of one or more arm joints. Within the board processing apparatus, there may be a wireless charging station (see, for example, Figure 3B) in which articulated arms 333 and / or end effectors 211A, 211B are moved in close proximity to wirelessly charge the onboard battery / capacitor PWRs. The onboard battery / capacitor PWRs inside one or more of the upper arm 213 and forearm 212 may be discharged, and power from the battery / capacitor PWRs may be transmitted wirelessly to the end effectors 211A, 211B in the manner described herein.

[0088] Referring to Figures 1A-1I, 3A-3C, and 3R, the power and / or data communication interface WPDC is configured as a contactless wireless data transfer or communication module 180, comprising a housing 2010 having a lower, or first, or static housing component 2000 and an upper, or second, or dynamic housing component 205. The first housing component 2000 and the second housing component 205 are connected to each other by any suitable fasteners, such as screws, bolts, welds, or mechanical or chemical bonding / joining. A rotating shaft or rotor 2100 is rotatably connected to the second, or dynamic housing component 205 by any suitable bearing 215, which may be a deep groove radial ball bearing, a tapered bearing, or any other suitable bearing that provides axial / radial alignment between the wireless data transfer module 180 and the wireless data communication module 255.

[0089] The wireless data transfer module 180 includes a pair of printed circuit boards, which may be called carrier printed circuit boards (PCBs) 250, 251. One of the printed circuit boards 250 is connected to the first housing component 2000 in any suitable way using appropriate fasteners (such as screws, bolts, mechanical or chemical adhesives / bonds). The other of the printed circuit boards 251 is connected to the rotating shaft 2100 in any suitable way using appropriate fasteners, etc., so as to rotate together with the rotating shaft 2100. Each of the printed circuit boards 250, 251 may be equipped with any suitable communication module, but each includes a millimeter-wave wireless data communication module 255, such as the Rosenberger RoProxCon® system-on-module (SoM), which is a surface-mount, full-duplex millimeter-wave module achieving a maximum transmission speed of 3.125 Gbps. The printed circuit boards 250 and 251 are mounted relative to each other, so that the antennas of the wireless data communication module 255 face each other and maintain axial / radial alignment through positional constraints provided at least partially by the bearings 215 that rotatably connect the rotating shaft 2100 and the housing 2010.

[0090] See also Figure 3S, each printed circuit board 250, 251 includes alignment holes 401 and slots 402 that can provide precise alignment of each printed circuit board 250, 251 to housing components (e.g., a first housing component 2000 and a second housing component 205). Printed circuit board 251 is connected to the first housing component 2000, which includes openings 290A, 290B (e.g., holes for receiving alignment pins or shoulder bolts / screws 291) located at predetermined known positions relative to the first housing component 2000. The printed circuit board 251 includes an alignment hole 401, which is aligned with one of the openings 290A, 290B such that an alignment pin or shoulder bolt / screw 291 extends through the alignment hole 401 into the openings 290A, 290B to position the printed circuit board 251 in a predetermined known position within the first housing component 2000. A slot 402 is aligned with the other openings 290A, 290B such that another alignment pin or shoulder bolt / screw 291 extends through the slot 402 into the other openings 290A, 290B to position the printed circuit board 251 in a rotational direction in a predetermined known position within the first housing component 2000. The slot is configured to prevent over-restraint of the printed circuit board 251 when connected to the first housing component 2000.

[0091] The rotating shaft 2100 is positioned by bearings 215 at predetermined known positions relative to the openings 290A, 290B and the printed circuit board 251 such that the rotation axis SAX of the rotating shaft 2100 is substantially aligned with the wireless data communication module 255 of the printed circuit board 251. The rotating shaft 2100 includes openings 290C, 290D (for example, holes for receiving alignment pins or shoulder bolts / screws 291) positioned at predetermined known positions relative to the rotating shaft 2100. The printed circuit board 250 includes an alignment hole 401, which is aligned with one of the openings 290C, 290D such that an alignment pin or shoulder bolt / screw 291 extends through the alignment hole 401 into the openings 290C, 290D to position the printed circuit board 250 at predetermined known positions on the rotating shaft 2100. Slot 402 is aligned with other openings 290C, 290D so that another alignment pin or shoulder bolt / screw 291 extends through slot 402 to other openings 290C, 290D to position the printed circuit board 250 in the rotational direction at a predetermined known position on the rotary shaft 2100. The slot is configured to prevent over-restraint of the printed circuit board 250 when connected to the rotary shaft 2100. The connection of the printed circuit board 250 to the rotary shaft 2100 using the alignment holes 401 and slot 402 aligns the wireless data communication modules 255 on the printed circuit boards 250, 251 with the rotation axis SAX of the rotary shaft 2100 so that the wireless data communication modules 255 on the printed circuit boards 250, 251 are aligned with each other over the entire rotation of the rotary shaft 2100 around the rotation axis SAX (for example, substantially along the rotation axis SAX).

[0092] The bearing 215 of the housing 2010 provides axial / radial alignment of the wireless data communication modules 255 of two printed circuit boards 250, 251 over the entire rotation (for example, around the axis of rotation or central axis SAX of the rotating shaft 2100), and can maintain a predetermined separation gap / distance G between the wireless data communication modules 255.

[0093] The housing 201 provides a clean and constant environment, both environmentally and in terms of radio frequency, so that the wireless data communication module 255 can function optimally. The isolation distance G and axial alignment between the wireless data communication modules 255 can provide high-bitrate, error-free communication.

[0094] Referring to Figures 3A-3C, 3Q, and 3R, the rotating part of the wireless data transfer module 180 (e.g., the rotating shaft 2100 and the printed circuit board 250) may be connected via the coupler 260 to the shaft 290 (i.e., a drive shaft such as a direct drive motor (see shafts 200M1D, 200M2D, 200M3AD, 200M3BD) or a driven shaft such as a transmission system (see driven shafts 290F, 290E in Figures 11A-11C and 3T), where such a shaft may be connected to one or more such as an arm link or a pulley of an arm drive transmission), while the stationary part of the wireless data transfer module 180 (e.g., the first housing component 2000, the second housing component 205, and the printed circuit board 251) may be mounted to any available support structure (e.g., an arm link, a transport device frame, etc.). For illustrative purposes only, Figure 3Q illustrates a wireless data transfer module 180 located at the elbow joint 179E, but the wireless data transfer module 180 may be located at one or more of the shoulder joint 179S, elbow joint 179E, and wrist joint 179W. The housing 2010 is connected to the upper arm 213 in any suitable manner, including, but not limited to, any suitable fasteners described herein. The housing 2010 is connected to the upper arm 213 such that the rotation axis SAX of the rotary shaft 2100 is substantially aligned (for example, coaxial) with the elbow axis EX.

[0095] Coupler 260 connects the rotary shaft 2100 to the drive shaft 290 (which is the drive shaft 200M2D of motor 200M2 in Figure 3Q), and in this example, the drive shaft 290 directly drives the rotation of the forearm 212 around the elbow axis EX. However, if a distributed direct drive motor is not used, coupler 260 can connect the rotary shaft 2100 to the drive pulley of any suitable transmission system (such as those described herein (see Figure 3T)) and / or can be used with a coaxial drive system in which the motor is located within the housing 200H (see Figure 3T). Coupler 260 may be a flexible coupler that corrects / compensates for any misalignment and runout that may exist with respect to the drive shaft 290 and the rotary shaft 2100. Coupler 260 is configured to have sufficient flexibility to provide a degree of freedom to compensate for any misalignment between the wireless data transfer module 180 and the drive shaft 290.

[0096] Referring to Figure 3U, if the wireless data transfer module 180 is used against a vacuum environment, such as through the walls of the transfer chamber or the walls of the arm link (the inside of the arm link is exposed to vacuum), the wireless data transfer module 180 may include appropriate seals for isolating the vacuum environment. For example, inside the rotating shaft 2100 (such as where the cable CBL exits the rotating shaft 2100), a vacuum cable pass-through section 666 may be included to seal the inside of the rotating shaft 2100 from the vacuum environment. The outside of the rotating shaft 2100 may be sealed against the upper side or the second housing component 205 in any suitable way, such as by a magnetic fluid seal 668 separated from the bearing 215 by a separator ring 669. The second housing component 205 may be sealed against the walls of the vacuum chamber or the arm link in any suitable way, such as by an O-ring 667 (any suitable fastener may be used to connect the second housing component 205 to the wall and compress the O-ring 667). Otherwise, the wireless data transfer module 180 is the same as that described with respect to Figures 3Q and 3R.

[0097] Referring to Figures 3Q and 3R, a data communication cable CBLA may be disposed in the housing 2010 through the upper arm link 213 (or one or more other suitable parts of the arm 333) and connected to the printed circuit board 251, so as to transmit data signals to / from the data communication module 255 of the printed circuit board 251. Another data communication cable CBLB may be connected to the printed circuit board 250 and disposed in the forearm 212 (or one or more other suitable parts of the arm 333) through the drive shaft 290. The printed circuit board 250 rotates together with the rotary shaft 2100 so as not to rotate relative to the forearm 212, the rotary shaft 2100 is connected to the drive shaft 290, and the drive shaft 290 is connected to the forearm 212 (i.e., the drive shaft 290 and the forearm 212 drive the rotation of the forearm 212 so as to rotate together about the elbow axis EX). The relative rotation of the printed circuit boards 250 and 251 and wireless data communication between them and their data communication modules 255 decouple the data communication cable CBLB from the upper arm 213 (and data communication cable CBLA) to allow unlimited rotation of the forearm 212 around the elbow axis EX relative to the upper arm 213.

[0098] Referring to Figures 3A-3C, 3L, and 3M, the present disclosure may provide improved semiconductor throughput and placement accuracy. For example, one or more substrate sensors 366A-366C may be placed on end effectors 211A, 211B and positioned to sense a substrate S held on the end effectors. The one or more substrate sensors 366A-366C are positioned relative to each other and to the substrate holding station SHS of the end effectors 211A, 211B in a predetermined spatial relationship with respect to the substrate holding station SHS, and sense at least three edge points SP1-SP3 on the circumference of the substrate S. The substrate sensors 366A to 366C are calibrated in any suitable way (for example, within the reference coordinate system of the substrate transport device 104) so ​​that the controller 110 determines the center SC of the substrate S (within the reference coordinate system of the substrate transport device 104) relative to the reference position or center position of the substrate holding station SHS of the end effectors 211A and 211B, based on three points SP1 to SP3 sensed by one or more sensors 366A to 366C. The center of the substrate S may be determined using the three points SP1 to SP3 in any suitable way, such as the method described in U.S. Patent No. 7,894,657 issued on February 22, 2011. The center positions of the end effectors 211A and 211B are known in the coordinate system of the substrate transport device (for example, based on the geometric shapes of the articulated arm and the end effectors), and the eccentricity or offset of the substrate S relative to the center positions of the end effectors 211A and 211B can be determined by comparing the determined center position of the substrate with the known center positions of the end effectors 211A and 211B. By knowing the center position of the substrate S relative to the center positions of the end effectors 211A and 211B, the controller 110 can adjust the movement / trajectory of the articulated arm 333 so that the center of the substrate S is positioned approximately at the center of the substrate holding position of the substrate processing device 100A to 100G (for example, process module 130, aligner, etc.).

[0099] As can be understood, during transport of the substrate S by the articulated arm 333, on-the-fly, automatic wafer centering (for positioning or picking the substrate) can be provided by sensors 366A-366C integrated into the end effectors 211A, 211B (for example, with substantially no sensors outside the substrate transport device 104). In another example, the end effector may include an active edge gripping section for the substrate S, where the end effectors 211A, 211B include one or more active grippers 367A-367C that move to engage and disengage from the peripheral edge of the substrate S. Gripping the substrate S during transport allows for a faster transport speed of the substrate, thereby reducing transport time and improving throughput. Power and / or data communication to grippers 367A-367C and sensors 366A-366C is transmitted between the list of articulated arms 333 and each end effector 211A, 211B via wireless transfer between antennas 341TA, 341RA as described above.

[0100] The end effectors 211A, 211B may be constructed with an integrated power / communication path 369A, 369B formed inside them. The integrated power / communication path 369A, 369B may be formed by any suitable method, such as additive manufacturing, lamination of structural materials of the end effector, or any other suitable method in which the electronic / communication system of the end effector is sealed (or otherwise encapsulated) between structural layered materials within the end effectors 211A, 211B. The electronic / communication system of the end effector may be isolated from the vacuum environment in which the articulated arm 333 operates. The end effectors 211A, 211B may include an onboard processing unit 368 that receives communication signals from, for example, the controller 110 and, based on the communication signals, performs the operation of one or more of the sensors 366A-366C and grippers 367A-367C. The processing unit 368 can also distribute power to sensors 366A-366C and grippers 367A-367C.

[0101] As can be understood, referring to Figures 3B–3H (and also Figure 3P), each of the direct-drive motors 200M1, 200M2, 200M3A, and 200M3B includes their respective encoders 388, 389, and 389A, to which power and / or data communication is provided in the manner described herein. Here, at least one enclosed housing component 372, 375 houses at least a portion of each of the encoders 388, 389, and 389A. The encoders 388, 389, and 389A include any suitable reading head ENH and (one or more) any suitable encoder tracks or scales ENT (e.g., one or more absolute position tracks / scales and incremental tracks / scales). At the elbow and shoulder joints of the transport arm, encoder 388 may be exposed to temperatures of approximately 70°C or less. Thus, the encoders may be optical encoders, magnetic encoders, or any other suitable encoders configured for operation in a vacuum environment. In shoulder and elbow joints, the reading head ENH is located in the respective pressurized chambers ACH1 and ACH2, while the encoder track ENT is located in a process vacuum (however, the encoder track may be isolated from the vacuum environment in a manner similar to that described herein). A suitable example of an encoder that may be used in at least the wrist and shoulder joints using this disclosure is described in U.S. Patent No. 10,742,092, issued on 11 August 2020, the entire disclosure of which is incorporated herein by reference.

[0102] See also Figures 3I-3K as an example, the encoder track ENT is positioned on the motor rotor 200MR of each motor 200M1, 200M2, or otherwise coupled to the motor rotor 200MR. The encoder track ENT defines at least two scales for measuring the position of the rotor 200MR. The at least two scales include an incremental position scale and an absolute position scale. The absolute position scale may include additional position information required to uniquely identify the position of the rotor 200MR. Absolute position encoders can generally provide a unique position without requiring a reference motion. Typically, such encoders may require several scales, where each scale may be read by an independent sensor system. The number of scales may determine the number of bits in the absolute position encoder, and consequently, its resolution. Using a digital absolute position scale, the digital absolute position may be read by several independent sensors, each facing its respective scale. Each sensor may provide the state of one bit each in a word that defines the digital position. Figure 9 shows a typical example of pattern 905, called a 5-bit Gray code. Each row of pattern 905 contains a 5-bit word indicating an absolute position, which can be expressed as an angular position in degrees. S4 represents the most significant bit of each 5-bit word, and each word differs from the next word by only a single bit, which is typical of Gray code sequences.

[0103] The absolute position can be obtained by utilizing a single digital scale mounted on the rotor 200MR. To read the absolute digital position, a series of sensors (e.g., reading heads ENH) may be positioned facing the absolute position scale at regular intervals from one another. The number of sensors may determine the number of bits for the absolute position. The use of a single-scale design has the advantage of allowing for a smaller footprint for the absolute encoder design. The bit pattern sequence of the single scale may take the form of a Gray code, i.e., only one bit changes at a time.

[0104] Figure 10 shows an example of a single scale 1005 for indicating absolute position. The single scale 1005 has a pattern that mimics the pattern shown with respect to S4 in Figure 9. By placing five sensors S0 1010, S1 1015, S2 1020, S3 1025, and S4 1030 at specific positions around the scale, the sensors generate the sequence in Figure 9 as the pattern rotates, thus generating an absolute position indication relative to the mounted rotor. It is important to understand that scales can be constructed that utilize any number of bits suitable to provide the desired position resolution. A single absolute scale can be used in combination with an incremental scale, e.g., 1035 in Figure 10, and an incremental scale sensor 1040.

[0105] In another embodiment, the single absolute scale 1005 in Figure 10 may be used alone to simultaneously generate a digital absolute position and an interpolated incremental position within the resolution of the digital absolute position. As described above, the sensor may provide a digital or analog output. If the sensor can provide an analog output, a digital output pattern of the absolute position scale may be generated from the analog output signal by setting a threshold for determining when the bits of the pattern change. Simultaneously, the analog value of the changing signal may be measured, and this changing analog value may be used to determine the position with an additional resolution beyond the resolution provided by the single absolute scale. For example, a digital signal processor may be used to measure the output of the sensor and sense the digital output of the sensor according to a set threshold, as well as sense the instantaneous analog output of the sensor when a single bit changes. This instantaneous analog output may be used to generate an interpolated position between the current digital absolute position and the next digital absolute position.

[0106] As is best seen in Figures 3H and 3I, in the wrist joint, encoders 389, 389A may be exposed to substrate process temperatures (such as those described herein) exceeding approximately 70°C, which may be the operating limit for optical encoders. In the wrist joint, encoders 389, 389A are magnetic encoders, where a magnetic encoder scale ENT (which may have a Gray code configuration with absolute and incremental scales similar to those described with respect to Figures 9 and 10) is mounted on a motor rotor 392, and an encoder reading head ENH is mounted within the wrist motor housing (e.g., within pressurized chambers ACH4, ACH5). Any suitable non-ferrous isolation wall 399 is placed between the reading head ENH and the vacuum environment to isolate the reading head ENH from the vacuum environment (and at least partially seal the pressurized chambers ACH4, ACH5 from the vacuum environment). By positioning the encoder reading head ENH within the pressurized chamber, the magnetic flux from the magnetic encoder scale ENT is sensed by the reading head ENH behind the isolation wall 399, and the electronics of the encoders 389, 389A are placed in an air environment where they can be actively cooled (for example, by at least a cooling line tube CLTB as described herein).

[0107] Referring to Figure 20, sensor feedback can be integrated into the control logic of the substrate transport device 104, improving trajectory, repeatability, and diagnostics without contamination of the processing environment. A partial exemplary architecture of the power and data communication system PDCS is illustrated in Figure 20. Power 20101 can be transmitted to the power bus of the power data and communication system PDCS by slip ring 379 or any suitable wireless coupling unit WC (including, but not limited to, those described herein). Data 20111 can be transmitted to the data bus of the power data and communication system PDCS by slip ring 379 or any suitable wireless coupling unit WC (including, but not limited to, those described herein). The power and data communication system PDCS (and its data communication and bus power network PDCN) can provide flexible and modular sensor integration, where sensors can be added to or removed from the power data and communication system PDCS as desired. The high data transmission rates provided by the data and power couplings described herein may enable the deployment of high-performance sensors within the substrate handling device 104 with virtually no limitations on power consumption and data bandwidth. Sensor feedback provided by sensors coupled to the power and data communication system PDCS may be provided in real time with respect to monitoring of robot status and operating environment (including seismic events affecting the substrate processing tool and sensing information across different areas of the substrate processing tool), where such robot status and operating environment may be monitored by the local control of the substrate handling device 104 or broadcast to an external host for processing. Integration of sensors into the data communication network may provide the substrate handling device controller with access to sensing information across different areas of the processing tool on which the substrate handling device 104 operates, and / or provide the controller with sensor information of the processing tool from the substrate handling device 104, thereby improving the operation of the substrate handling device 104 and one or more of the processing tools.

[0108] The exemplary architecture illustrates the transmission of power 20101 and data 20111 (such as via any suitable network, such as those described herein) to sensors such as sensors 366A-366C and encoders 388, 389, 389A (or any other suitable digital, analog, and / or image processing sensors, generally referred to as sensors 20130A, 20130B). As described herein, sensors 20130A, 20130B may be located within the arm assembly of the board transporter 104, such as within arm links 212, 213, end effectors 211A, 211B, or rotary joints (shoulder joint SX, elbow joint EX, and / or wrist joint WX). In these locations, sensor data is connected by cable or wirelessly to sensor input / output modules 20140 connected to a data network, such as data bus 20110. In these locations, the sensor power 20101 is connected to a sensor input / output module 20140, which is connected to the power network via a power bus 20100, etc., either by cable or wirelessly. The sensor input / output module 20140 may be a separate module or may be integrated with another communication module of the power and data communication system PDCS (such as another EtherCat module, but not limited to a servo amplifier 20141). This provides scalability of sensor support in a distributed architecture that supports motion control, and selective addition (or removal) of sensors to the power and data communication system (PDCS) as desired. The connection of sensors 20130A, 20130B to the power and data communication system PDCS allows sensor data to be accessed by other devices in the power and data communication system PDCS (via a data processing unit 20150, etc.), regardless of the native sensor signal (i.e., 2D, digital, analog, etc.).

[0109] See also Figures 3J and 3K, as described herein, the pressurizing chambers ACH4, ACH5 are sealed at least partially by cap plates 387, 387E, 387EA (and their respective seals 387S) (see Figures 3H and 3I). The encoder isolation wall 399 may be formed integrally with the respective cap plates 387E, 387EA as a single integrated or monolithic member. As seen in Figure 3I, to facilitate the sealing of the respective pressurizing chambers ACH4, ACH5 by the cap plates 387, 387E, 387EA, the wrist end connector 375 may be a two-part connector, where one end connector 375A houses the wrist motor 200M3A and the other end connector 375B houses the wrist motor 200M3B. Two end connectors 375A, 375B (or more end connectors on the wrist shaft including more than two motors) can be connected to each other in any suitable way, for example, using mechanical fasteners, to form the wrist end connector 375. Each end connector 375A, 375B may be substantially similar to those described above with respect to Figure 6. Here, the encoders 389, 389A (and their respective cap plates 387E, 387EA) are arranged adjacent to each other in a mirror image configuration in the central plane of the wrist end connector 375 so as to isolate the encoders 389, 389A from the high-temperature environment that comes into contact with the outer surface of the wrist end connector 375. Each of the cap plates 387E, 387EA (and encoder scale ENT) includes a central opening 361 through which the drive shaft 200M3BD passes.

[0110] As described herein, the encoder scale ENT is a magnetic scale located in a vacuum environment, where the magnetic scale is enclosed within a highly airtight housing 396. As best seen in Figures 3J and 3K (see also Figures 3H and 3I), the highly airtight housing 396 includes a ferromagnetic backing or frame 396F, including a coupling 396C, the coupling 396C being configured to connect the frame 396F to each motor rotor 392 (or drive shaft) using any suitable mechanical fasteners. The frame 396F is configured to extend radially outward with respect to the rotation axis WX to position the encoder scale ENT in communication with the reading head ENH, although the frame 396F may have any suitable configuration in which the encoder track is positioned to communicate with the reading head. The frame 396F includes a recess 396R in which the encoder scale ENT is located. A non-ferrous isolation wall 396W is placed on the encoder scale ENT and sealed to the frame 396F (by welding, epoxy, or any other vacuum-compatible fixing method that forms an airtight seal) so that the encoder scale ENT is enclosed within the frame 396F. The frame 396S or stator 391 may include a ferromagnetic shield 397 configured to magnetically isolate the motor rotor 392 and stator 391 from the interface between the reading head ENH and the encoder scale ENT.

[0111] As described herein, the encoder scale ENT includes an absolute position scale that provides the absolute position of the rotor 392 without utilizing a home flag or reference operation. Here, the absolute zero of the absolute position scale (or any suitable reference position) can be mechanically aligned with the frame 396F in any suitable manner. Each rotor 392 and stator 391 can also be positioned at a constant electrical position relative to the encoder 389, 389A assembly to obtain a constant motor phase angle between the board transporters within a predetermined tolerance (e.g., less than about 5 electrical angles) so as to eliminate the need for measuring their respective phase angles during the assembly of the board transporters (e.g., they can be aligned by rotating around the list axis WX).

[0112] As can be understood, although encoders 389, 389A are described herein as being located on the wrist axis WX, encoders 389, 389A may be located on one or more of the elbow axis EX and shoulder axis SX instead of encoder 388. Here, the central opening 361 provides passages through the assemblies of encoders 389, 389A to and through the drive shafts and rotors of the respective motors 200M1, 200M2, one or more of the electrical / communication cables CBL, cooling line tubes CLTB, and discharge line tubes EXL.

[0113] While the features described herein have been explained in relation to a transport arm in which a direct drive motor is located on each of the shoulder axis SX, elbow axis EX, and wrist axis WX, the features of this disclosure may also be applied to a transport arm having at least one dependent arm link or at least one dependent end effector. For example, Figure 11A illustrates a substrate transport robot having dependent end effectors 211A, 211B. Power and / or data may be transmitted to and / or from the dependent end effectors 211A, 211B in a manner similar to that described herein. Here, the substrate transport arm is a dual SCARA arm including partitioned arm links 213, 212L, 212R, substantially similar to those described herein. The dual SCARA transport arm includes an upper arm 213 (which is partitioned in a manner similar to the upper arm 213, where the upper arm 213 includes a central housing component 370A and two housing components 372, with housing component 370A being substantially similar to housing component 370), and two forearms 212R, 212L subordinate to opposing ends 213R, 213L of the common (substantially rigid and non-articulated) upper arm 213 (for example, with respect to the shoulder axis SX). Forearm 212R is connected to end 213R of the upper arm 213 by elbow axis EXR. Forearm 212L is connected to end 213L of the upper arm 213 by elbow axis EXL. Each forearm 212R, 212L is connected to at least one end effector 211A, 211B by wrist axes WXR, WXL, respectively. In Figure 11A, the rotation of the end effectors 211A and 211B is dependent on the respective upper arm portions 213L and 213R. However, drive motors may be provided on the wrist axes WXL and WXR (for example, in a manner similar to the method described herein) to directly drive the rotation of the end effectors 211A and 211B.As can be understood, by providing drive motors on each axis SX, EXR, EXL, WXR, and WXL, nonlinear or offset extension of end effectors 211A and 211B is achieved, where the drive motors are driven almost simultaneously to extend end effectors 211, 211DS, 211DE, 211DT, and 211DQ along radial or non-radial paths or trajectories, while the dependent end effectors are restricted to moving along the radial line of extension.

[0114] The upper arm 213 is connected to the frame 201 in a manner similar to that described herein and is driven directly by the drive motor 200M1. In this example, each forearm 212R, 212L is driven directly by their respective drive motors 200M2A, 200M2B in a manner similar to that described herein, while the rotation of the end effectors 211A, 211B is subordinate to their respective upper arm sections 213L, 213R. Here, the elbow drive pulleys 1110 at each elbow shaft EXL, EXR may be positioned on their respective struts 1110S, which are fixed (for example, non-rotatably) connected to the upper surfaces (the term "upper surface" is used for convenience only, and it should be understood that any spatial identifier may be used to refer to what is called the upper surface) of their respective upper arm sections 213L, 213R. The support column 1110S (and elbow drive pulley 1110) is hollow so as to surround the hollow drive shaft 200M2D of the respective motors 200M2A and 200M2B. As shown in Figure 11, the support column 1110S may have any appropriate height or length depending on the arm configuration such that at least portions of the forearms 212R, 212L and the respective end effectors 211A, 211B are stacked vertically (for example, at least the forearms and end effectors are in the retracted configuration illustrated in Figure 11A).

[0115] See also Figures 11B, 11C, 12, and 13, the forearms 212R and 212L are configured to receive an elbow (drive) pulley 1110, a wrist (driven) pulley 1150, one or more bands 1160 connecting the elbow drive pulley 1110 to the wrist driven pulley 1150, and one or more pressure tubes PT. The elbow joint 373 and wrist joint 375 may be substantially similar to those described herein, but each of the elbow joint 373 and wrist joint 375 may be formed to include a pulley cavity, a pressure chamber recess, an opening 1200 opening into the interior of the hollow drive shaft 200M2D, and a transmission band passage. The pulley cavity and transmission band passage open into a vacuum environment when the forearms 212L and 212R are assembled. The central arm section 374 is formed having a box or channel-shaped cross section (as described above) that opens into a vacuum environment, and is configured to connect to the end connectors 373, 375 (for example, when the forearm is assembled) such that the elbow pulley 1110 and the wrist pulley 1150 are connected to each other by a band 1160 that passes through the central arm section 374. One or more pressure tubes also pass through the central arm section 374 between the respective pressure chambers ACH3 to ACH5 of the end connectors 373, 375.

[0116] As best seen in Figures 11B and 11C, each of the elbow end connector 373 and the wrist end connector 375 branches to form the respective pressure chambers ACH3-ACH5 (communicating with pressure chambers ACH2, ACH1 in a manner similar to that illustrated in Figure 3C) and the respective pulley cavities (exposed to vacuum pressure). One or more of the electrical / communication cable CBL, cooling line tube CLTB, and discharge line tube EXL extend to the wrist axis WX, providing the transfer of fluid to and from pressure chambers ACH4, ACH5, and / or providing power to pressure chambers ACH4, ACH5, with one or more pressure tubes PT, PT2, PT3 extending between the elbow end connector 373 and the wrist end connector 375. The transfer of fluid (such as a forced convection cooling fluid) to the pressure chambers ACH4 and ACH5 may cool the wrist pulley bearings (for example, via a conductive heat path between the pressure chamber and the bearing connected to the end coupling 375), thereby allowing the bearing mounting area to be cooled to about 50% to about 60% of the ambient temperature of the process vacuum (e.g., above about 70°C or above about 100°C), thereby extending the life of the bearing lubricant of the wrist pulley 1150 (or, in the case of a directly driven end effector, the rotor / drive shaft bearing). Cooling of the wrist may also provide cooling of the wireless transmitters 34IT and 342T (for example, via convection or conduction) and / or the wireless receivers 341R and 342R (via conduction).

[0117] Referring to Figures 1A-1I, 3R, 3S, and 3T, the arm 333 of the conveying device 104 is illustrated as having a drive section 200 with a coaxial drive shaft assembly 176, where drive motors 200M3, 200M1 are located within a housing 200H to drive the respective arm links 211, 213. Motor 200M1 is connected to the upper arm 213 by a drive shaft 200M1D, where the drive shaft 200M1D and the upper arm 213 rotate together about the shoulder axis SX under the thrust of motor 200M1D. Motor 200M3 is connected to the end effector 211 (and the shaft 290EE connected to it) by a drive shaft 200M3D and a transmission BPTE (e.g., a band and pulley transmission, or any other suitable transmission) to drive the rotation of the end effector 211 (and the shaft 290EE connected to it) about the wrist axis WX. The forearm 212 is exemplified as being subordinate to the housing 200H by a transmission BPT (e.g., a band and pulley transmission, or any other suitable transmission) and shafts 290F, 290FA, although a motor 200M2 may be provided within the housing 200H to drive shaft 290F, resulting in independent rotation of the forearm 212 around elbow axis EX. Shaft 290FA is fixed to the forearm 212 so as to rotate integrally with the forearm 212 around elbow axis EX.

[0118] The wireless data communication modules 180A, 180B, and 180C (configured as described above with respect to the wireless data communication module 180) are located on the shoulder axis SX, elbow axis EX, and wrist axis WX, respectively, but wireless data communication modules do not need to be provided on axes in the downstream arm links (for example, downstream is in the direction extending from the shoulder axis SX to the wrist axis WX through arm 333). The housing 2010 of wireless data communication module 180A is fixedly connected to housing 200H, while the rotating shaft 2100 of wireless data communication module 180A is connected to drive shaft 200M3D by its respective coupler 260. The housing 2010 of wireless data communication module 180B is fixedly connected to upper arm 213, while the rotating shaft 2100 of wireless data communication module 180B is connected to shaft 290FA by its respective coupler 260. The housing 2010 of the wireless data communication module 180C is fixed and connected to the forearm 212, while the rotating shaft 2100 of the wireless data communication module 180C is connected to the shaft 290EE by the respective couplers 260.

[0119] The data communication cable CBLA is housed within the housing 200H and connected to the printed circuit board 251 of the wireless data transfer module 180A. The data communication cable CBLB, connected to the printed circuit board 250 of the wireless data transfer module 180A, extends through the drive shaft 200M3D to the upper arm 213. Data signals are communicated between the data communication cables CBLA and CBLB via the interface between the data communication modules 255 on the printed circuit boards 250 and 251 of the wireless data communication module 180A. Although the data communication cable CBLB is illustrated as being connected to the printed circuit board 251 of the wireless data transfer module 180B, the data communication cable CBLB may also provide data communication to components CC located within the upper arm 213 (including the wireless docking stations 345, 345A-345C and instrumentation kits 340A, 340B as described herein, encoders, other suitable sensors, motors, etc.). The data communication cable CBLC, connected to the printed circuit board 250 of the wireless data transfer module 180B, extends through the shaft 290FA to the forearm 212. Data signals are communicated between the data communication cables CBLB and CBLC via an interface between the data communication modules 255 on the printed circuit boards 250 and 251 of the wireless data communication module 180B. Although the data communication cable CBLC is illustrated as being connected to the printed circuit board 251 of the wireless data transfer module 180B, the data communication cable CBLC may also provide data communication to components CC located within the forearm 212 (including the wireless docking stations 345, 345A-345C and instrumentation kits 340A, 340B as described herein, encoders, other suitable sensors, motors, etc.).The data communication cable CBLD, connected to the printed circuit board 250 of the wireless data transfer module 180C, extends through the shaft 290EE to the end effector 211, providing data communication signals to / from any suitable component of the end effector 211 (including the wireless docking stations 345, 345A-345C and instrumentation kits 340A, 340B as described herein, encoders, other suitable sensors, motors, etc.).

[0120] Referring to Figures 3B, 3D-3G, 3N, and 3O, the present disclosure may result in the positioning of wireless power and / or data transmission docks 345A-345C (also known as wireless docking stations) at any suitable position (one or more) of the articulated arm 333 and / or end effectors 211A, 211B. These wireless docking stations may provide power and high-speed data transfer to (and / or from) any suitable accessories carried by the articulated arm 333. The accessories are configured to provide automated maintenance and / or diagnostics of the board processing equipment 100A-100G (or any part thereof). These accessories include, but are not limited to, instrumentation kits 340A, 340B. Measurement kits 340A and 340B may include any suitable sensors 340S, including, but not limited to, cameras, accelerometers, thermometers, tactile sensors (e.g., pressure-sensing pads, transducers, etc.), magnetometers, gyroscopes, contaminant sensors, humidity sensors, gas sensors, chemical sensors, pressure sensors, sound sensors, etc. Measurement kits 340A and 340B may also include a processor 340C. Measurement kits 340A and 340B may also include a power supply 340P (e.g., battery, capacitor, etc.). Measurement kit 340A may have a shape and dimensions similar to product board S, but may be any suitable instrumentation board configured to have one or more sensors (such as those described above) to bring about measurements for board processing devices 100A to 100G.

[0121] Power and high-speed data transmission are provided to the processor by a paired wireless dock 340D, which is configured to wirelessly mate with one of each of the wireless docking stations 345A to 345C (distributing power to the (one or more) sensors 340S and power supply 340P of the attached equipment, and capable of communicating with the (one or more) sensors 340S) (see also Figure 20 described herein). Here, virtually unlimited power and high-speed data transmission are provided to the measurement kits 340A and 340B for power supply to the sensors 340S and / or charging of the power supply 340P, and for providing sensor feedback to the controller 110 (or any other suitable controller or operator station of the board processing equipment 100A to 100G).

[0122] While the wireless docking stations 345A-345C are exemplified as being located on the end effectors 211A, 211B and the wrist joint 340B, (one or more) wireless docking stations may be located at any suitable position on the articulated arm 333 that can provide the measurement kit to any desired part of the substrate processing apparatus 100A-100G. For example, wireless docking stations may be located on the shoulder joint, elbow joint, wrist joint, on the upper arm 213, on the forearm 212, and / or on the end effectors 211A, 211B (or any other suitable position on the substrate transport apparatus 104). The docking stations 345, 345A-345C may have any suitable configuration for transferring power and / or data to and / or from the measurement kits 340A, 340B (and the paired wireless dock 340D may have any suitable pair configuration). Docking stations 345, 345A-345C communicate with their paired wireless dock 340D via any suitable short-range transmission (such as those described herein), including, but not limited to, one or more of millimeter-wave (ultra-wideband) transmission, capacitive transmission, and inductive transmission. Measurement kits 340A and 340B are configured so that when picked by the board transport device 104, the paired wireless dock 340D aligns with each of the respective docking stations 345, 345A-345C to establish a wireless power / data link between the paired wireless dock 340D and the respective docking stations 345, 345A-345C.

[0123] As can be understood, wireless power and / or data communication between the substrate transport device 104 and the measurement kits 340A and 340B may result in the implementation of measurement kits 340A and 340B with virtually no limitations on power and / or data bandwidth. In this regard, measurement kits 340A and 340B may include faster and more powerful processors, an increased number of sensors, etc., which may improve the performance and functionality of the measurement kits compared to conventional battery-powered measurement kits. The performance and functionality of the measurement kits compared to conventional battery-powered measurement kits (e.g., virtually unlimited inspection / maintenance periods) may also be improved through the use of high-speed data transfer (e.g., at least Gigabit Ethernet or EtherCat, etc.) provided by this disclosure.

[0124] Referring to Figures 14-16, as described herein, the present disclosure may be used to provide power and / or data transmission to an accessory connected to the articulated arm 333. For example, the accessory may include substrate sensors located on one or more of the articulated arm 333 and end effectors 211A, 211B. The accessory may include one or more thermal sensors 1410, heating elements 1520, and imaging sensors 1610. As seen in Figure 14, one or more thermal sensors 1410 may be connected to an end 373 of the forearm 212 at or adjacent to the elbow joint. One or more thermal sensors 1410 may be infrared thermal sensors configured to sense at least the temperature of a substrate S held on the end effectors 211A, 211B as the end effectors 211A, 211B rotate around the wrist axis WX such that the substrate S passes over the thermal sensors 1410. The substrate temperature may be received by the controller 110, at least for process control purposes, and / or reported to the operators of the substrate processing equipment 100A-100G. One or more thermal sensors 1410 may sense the temperature of the end effectors 211A, 211B before picking the substrate S, where the end effector temperature may be used by the controller 110 to determine the thermal expansion of the end effectors and / or whether the end effector temperature is suitable for picking the substrate (for example, to substantially avoid thermal shock to the substrate by the end effectors 211A, 211B). Power and / or data may be transmitted wirelessly to and from one or more thermal sensors 1410, for example, using a wireless docking station 345, etc. (for example, as shown in Figures 3D, 3F, and 3G, if the thermal sensors include a paired wireless docking station 340D, and the paired wireless docking station 340D is fixed to the upper arm 212 so as to be paired with a wireless docking station 345). One or more thermal sensors may be directly connected to the power / data cable CBL via a sealed opening at the end 373.Thermal management of the end effector (or other parts of the conveyor arm) may be managed in a manner similar to that described in the U.S. Provisional Patent Application No. 390P017165-US(-#1), filed December 19, 2023, entitled “Active Thermal Management Of Substrate Holding Apparatus On A Substrate Handling System,” the entire disclosure of which is incorporated herein by reference.

[0125] Referring to Figure 15A, the heating element 1520 may be positioned on a cantilevered support member 1510, which can be fixedly connected to the end 373 of the forearm 212 such that the support member 1510 rotates together with the forearm 212 around the elbow axis EX. Referring to Figure 15B, the support member 1510A may be fixedly connected to the upper arm at the wrist axis WX (the support member 1510A extends through the hollow drive shafts of the wrist motors 200M3A and 200M3B). The connection of the support member 1510A to the forearm 212 at the wrist axis is such that the support member 1510 rotates together with the forearm 212 around the elbow axis EX. Power and / or data may be transmitted to the heating elements in any suitable manner, such as by wireless transmission from a wireless docking station 345 (as illustrated in Figures 3D, 3F, and 3G), where each heating element 1520 includes a power and / or data receiver 341R and associated antenna 341RA that receive power and / or data transmitted from a power and / or data transmitter 341T and associated antenna 341TA of the wireless docking station 345. A data and / or power cable CBL may be embedded within a support member 1510 (so as to be sealed from a vacuum environment) and connected to the heating elements 1520. The data and / or power cable CBL of the support member 1510 is connected to the data and / or power cable in the atmospheric chamber ACH3 of the end 373 of the forearm 212 (see Figure 3C) via a sealed port at the end 373 or via a wireless docking station 345 located in the atmospheric chamber ACH3 of the end 373 (the wireless docking station 345 is paired with the wireless dock 340D of the support member 1510). The heating element 1520 may be used to temperature-regulate the substrate before and / or after processing the substrate in the process module 130. The heating element 1520 may be used to maintain predetermined temperatures of the end effectors 211A, 211B so as to substantially avoid thermal shock to the substrate S by the end effectors before and after processing the substrate in the process module 130.The heating element 1520 may be any suitable heating element, such as an LED heating element. The forearm 212 may include a heat shield to prevent the heating element 1520 from substantially heating the forearm 212.

[0126] Referring to Figure 16, one or more imaging sensors 1610 are positioned on at least one end 373 of the forearm. The imaging sensors may be linear laser imaging sensors or any other suitable sensors for detecting at least the edge of the substrate S (e.g., CCD sensors, CMOS sensors, capacitive sensors, inductive sensors, etc.). Power and / or data transmission may be provided to one or more imaging sensors 1610 in a manner similar to that described above with respect to the thermal sensor 1410. A light reflector 1610R may be positioned above one or more imaging sensors 1610, such as on a support member 1510A (or support member 1510). The end effectors 211A, 211B are rotated around a list axis WX between the light reflector 1610R and one or more imaging sensors 1610 so that one or more imaging sensors 1610 sense the end effectors 211A, 211B and the respective substrate S on them to determine the position of the substrate S on the respective end effectors 211A, 211B. The position of the substrate S relative to the end effectors 211A and 211B can be used by the controller 110 to bring about on-the-fly automatic substrate centering to place the substrate S in a holding position (such as the process module 130 or other holding position), or to position the end effectors 211A and 211B to pick up the substrate S from the holding position.

[0127] As can be understood, the thermal sensor 1410, heating element 1520, and imaging sensor 1610 in Figures 14-16 can be used in any suitable combination.

[0128] Referring again to Figure 14, other sensors that may be used in power and / or data transmission disclosed herein include arm link thermal sensors TS1-TS5, displacement sensors DS1, DS2, and vision sensor CM. For example, thermal sensors TS1-TS5 may be located at each end 370, 372, 373, 375, where the temperature of the ends 370, 372, 373, 375 is used by the controller to determine, for example, the amount of thermal expansion of the respective upper arm 213 and forearm 212.

[0129] The displacement sensor DS1 may be a line-of-sight displacement sensor having a transmitter DS1A positioned at one end 370, 372, 373, 375 of each of the upper arm 213 and forearm 212, and a receiver DS1B (or a reflector if DS1A is a transmitter / receiver) positioned at the other end 370, 372, 373, 375 of each of the upper arm 213 and forearm 212. Here, the thermal expansion of the upper arm 213 and forearm 212 can be measured directly by the controller 110 using the displacement sensor DS1.

[0130] The displacement sensor DS2 may be a strain sensor having a strain gauge DS2G positioned at one end 370, 372, 373, 375 of each of the upper arm 213 and forearm 212, and an anchor DS2A positioned at the other end 370, 372, 373, 375 of each of the upper arm 213 and forearm 212. A strain element DS2W, such as a wire or band, is stretched between the strain gauge DS2G and the anchor DS2A, where the thermal expansion of the upper arm 213 and forearm 212 can be determined by the controller 110 from the change in tension of the strain element DS2W.

[0131] The visual sensor CM can be any suitable camera (e.g., CCD, CMOS, etc.). The visual sensor CM can be positioned on the arm link at each arm joint and positioned to view adjacent arm links. For example, referring to the elbow joint in Figure 14, the visual sensor CM can be positioned in the atmospheric chamber ACH2 at the end 372 of the upper arm 213. The visual sensor CM is positioned to view the forearm 212 via the hollow drive shaft of the motor 200M2. Any suitable reference mark RM can be provided within the forearm 212 at the elbow joint and within the field of view of the visual sensor CM. The controller 110 can be configured such that the orientation of the reference mark RM relative to the reference coordinate system of the visual sensor CM indicates the rotational orientation of the forearm 212 relative to the upper arm 213, and the visual sensor CM can be calibrated. Here, the rotational position of the forearm 212 relative to the upper arm 213 can be determined not by determining the rotational position of the forearm using the encoder of the motor 200M2, but rather (or in addition to) by the visual sensor CM.

[0132] An accelerometer and / or tilt sensor AIS may be placed within the articulated arm 333 (e.g., adjacent to the wrist axis WX) to determine the drooping of the arm. The controller 110 determines the drooping of the arm based on signals received from the accelerometer and / or tilt sensor AIS and is configured to compensate for the drooping of the arm by, for example, movement of the articulated arm 333 in the Z-axis direction (where the arm's drive section includes a Z-axis drive motor / system).

[0133] An exemplary method is described with reference to Figures 1-16 and 17, in which a substrate transport device 104 is provided (Figure 17, block 17000). The substrate transport device 104 (as described herein) may be provided with or without attachment to the boom arm 143. For example, the substrate transport device includes a base 201 and articulated arms (including boom arm 143, turret 266, arm 210, arm 210A, arm 216, arm 217, arm 218, arm 219, arm 333, and one or more of any other articulated arms described herein). The articulated arm (such as those described above) is connected to the base 201 using terminal joints (e.g., one or more joints SX and / or BSX), the articulated arm rotates and extends around the terminal joints, and has one or more movable arm links (e.g., arm links 220, 221, 212, 213 and one or more of the arm links illustrated in Figures 2A-16), and an end effector (e.g., one or more of the end effectors illustrated in Figures 2A-16) connected to one or more movable arm links at the distal joint WX, the end effector having a substrate holding station SHS on it (see, for example, Figure 3A, and note that other end effectors described herein also each have one or more similar substrate holding stations).

[0134] At least one of the one or more movable arm links has a housing (see, for example, housings 212H, 213H and other arm link housings described and illustrated with respect to Figures 2A-16) which includes at least one rotary joint (e.g., one or more joints on each of the axes BSX, BEX, SX, EX, WX) having a rotation axis (see axes BSX, BEX, SX, EX, WX), and at least one movable arm link rotates in articulation around the rotation axis to result in extension and contraction of the articulated arm. The housing includes at least another rotary joint (e.g., another axis on one of the axes BSX, BEX, SX, EX, WX), and at least one of the other movable arm links and an end effector is rotatably joined to at least one movable arm link to at least one movable arm link to at least one rotary joint.

[0135] The method also includes the step of distributing power and / or data through an articulated arm using a power and data communication system PDCS distributed through the articulated arm (Figure 17, block 17010), wherein the power and data communication system PDCS has at least one wireless power and / or data communication interface WPDC disposed through at least one rotary joint of the housing of at least one movable arm link (e.g., at least one of (one or more) joints in the respective axes BSX, BEX, SX, EX, WX). The wireless power and / or data communication interface WPDC through at least one rotary joint is configured as a contactless wireless communication interface.

[0136] The method may include one or any combination of the following: a wireless power and / or data communication interface WPDC reaching at least one other arm link and at least one end effector through at least one other rotary joint is configured as a contactless wireless communication interface; the contactless wireless communication interface is at least one of proximity wireless communication (as described herein) and short-range wireless communication (as described herein); the contactless wireless communication interface is configured for proximity wireless power and / or data communication, including optical communication, radio frequency communication, Wi-Fi communication, near-field wireless communication, ultra-wideband communication, millimeter-wave communication, inductive communication, Bluetooth®, infrared, and Zigbee® (as described herein); the contactless wireless communication interface is configured to reach approximately 20 mm (as described herein). or configured for a communication distance of less than approximately 20 mm; a non-contact wireless power and / or data communication interface through another rotary joint forms a non-contact communication power and / or data link between at least one of the arm links and end effectors and at least one movable arm link, the non-contact communication link intersects in the rotary joint in a spatial gap (e.g., gap MAG) formed by the rotary joint between the movable arm link and at least one of the arm links and end effectors; the housing is configured to form an internal sealed plenum (see, for example, Figure 3C, etc.) that houses the respective parts of the transmitter and receiver of the wireless communication power and / or data communication interface in a sealed atmosphere, protected from the reduced pressure environment outside the housing (see, for example, Figures 3D-3G, 3L, 3P, etc.); and any other features as described herein.

[0137] An exemplary method is described with reference to Figures 1-16 and 18. In this method, a transfer device (125A, 125B, 125C, 125D, 125E, 125F, 125G, etc.) is provided (Figure 18, block 18000). The transfer device includes a frame TCF that forms a sealed chamber (as described herein) arranged to maintain a processing vacuum inside. The transfer device also includes articulated arms (including boom arm 143, turret 266, arm 210, arm 210A, arm 216, arm 217, arm 218, arm 219, arm 333, and one or more of any other articulated arms described herein). The articulated arm (such as those described above) is connected to a frame TCF within a sealed chamber using terminal joints (e.g., one or more joints SX and / or BSX), and the articulated arm rotates and extends around the terminal joints and has at least one movable arm link (e.g., arm links 220, 221, 212, 213 and one or more of the arm links illustrated in Figures 2A-16), and an end effector (e.g., one or more of the end effectors illustrated in Figures 2A-16) connected to at least one movable arm link, the end effector having a substrate holding station SHS on it (see, for example, Figure 3A, and it should be noted that other end effectors described herein also each have one or more similar substrate holding stations). The sealed housing components 370-375 are connected to one another using at least one mechanical joint MJ that forms a sealed interface (see, for example, Figure 3B), through which a sealed atmosphere communicates between each sealed housing component of the outer housing and each other.

[0138] As described herein, at least one movable arm link 213, 212 (and / or links 220, 221) has an outer housing 213H, 212H (links 220, 221 may also have a similar outer housing) which includes at least one rotary joint (e.g., one or more joints on each axis BSX, BEX, SX, EX, WX) having a rotation axis (e.g., axes BSX, BEX, SX, EX, WX), and at least one movable arm link 213, 212 rotates in articulation around the rotation axis to result in extension and retraction of the articulated arm. Each of the outer housings is an assembly formed of housing components 370-375 which are sealed to retain a sealed atmosphere within each outer housing, and each outer housing is in a vacuum of a sealed chamber (transport chambers 125A, 125B, 125C, 125D, 125E, 125F, 125G, etc.).

[0139] The method also includes the step of distributing power and data through a multi-joint arm using a power and data communication system PDCS distributed through the multi-joint arm (Figure 18, block 18010). The power and data communication system PDCS has a wireless power and / or data communication interface WPDC disposed through each of at least one rotary joint of the outer housing of at least one movable arm link. The wireless power and / or data communication interface WPDC through at least one rotary joint is configured as a contactless wireless communication interface.

[0140] The method may include one or any combination of the following: a non-contact wireless communication interface is at least one of proximity wireless communication (as described herein) and short-range wireless communication (as described herein); the non-contact wireless communication interface is configured for proximity wireless power and / or data communication, including optical communication, radio frequency communication, Wi-Fi communication, near-field wireless communication, ultra-wideband communication, millimeter-wave communication, inductive communication, Bluetooth®, infrared, and Zigbee® (as described herein); the non-contact wireless communication interface is configured for a communication distance of about 20 mm or less than about 20 mm (as described herein); and non-contact wireless power and / or data communication input through another rotary joint. The surface forms a contactless communication power and / or data link between at least one of the arm links and end effectors and at least one movable arm link, the contactless communication link intersects in a rotary joint in a spatial gap (e.g., gap MAG) formed by the rotary joint between the movable arm link and at least one of the arm links and end effectors; the housing is configured to form an internal sealed plenum (see, for example, Figure 3C, etc.) that houses the respective parts of the transmitter and receiver of the wireless communication power and / or data communication interface in a sealed, sealed atmosphere, protected from the reduced pressure environment outside the housing (see, for example, Figures 3D-3G, 3L, 3P, etc.); and any other features as described herein.

[0141] An exemplary method is described with reference to Figures 1-16 and 19, in which a substrate transport device 104 is provided (Figure 17, block 19000). The substrate transport device 104 (as described herein) may be provided with or without attachment to the boom arm 143. For example, the substrate transport device includes a base 201 and articulated arms (including boom arm 143, turret 266, arm 210, arm 210A, arm 216, arm 217, arm 218, arm 219, arm 333, and one or more of any other articulated arms described herein). The articulated arm (such as those described above) is connected to the base 201 using terminal joints (e.g., one or more joints SX and / or BSX), the articulated arm rotates and extends around the terminal joints, and has one or more movable arm links (e.g., arm links 220, 221, 212, 213 and one or more of the arm links illustrated in Figures 2A-16), and an end effector (e.g., one or more of the end effectors illustrated in Figures 2A-16) connected to one or more movable arm links at the distal joint WX, the end effector having a substrate holding station SHS on it (see, for example, Figure 3A, and note that other end effectors described herein also each have one or more similar substrate holding stations).

[0142] At least one of the one or more movable arm links has a housing (see, for example, housings 212H, 213H and other arm link housings described and illustrated with respect to Figures 2A-16) which includes at least one rotary joint (e.g., one or more joints on each of the axes BSX, BEX, SX, EX, WX) having a rotation axis (see axes BSX, BEX, SX, EX, WX), and at least one movable arm link rotates in articulation around the rotation axis to result in extension and contraction of the articulated arm. The housing includes at least another rotary joint (e.g., another axis on one of the axes BSX, BEX, SX, EX, WX), and at least one of the other movable arm links and an end effector is rotatably joined to at least one movable arm link to at least one movable arm link to at least one rotary joint.

[0143] The method also includes the step of distributing a data communications and bus power network PDCN (e.g., a network formed by and with a power and data communications system PDCS) mounted on the articulated arm, from the terminal joint to the distal joint (Figure 19, block 19010). The data communications and bus power network PDCN is housed within and intersects at least one rotary joint of the housing. The data communication and bus power network PDCN incorporates local control units (e.g., transmitters, receivers, controllers, etc. of the board handling equipment described herein) and sensors (e.g., encoders, board sensors, measurement kit sensors, accessory sensors, imaging / visual sensors, thermal sensors, displacement sensors, and other sensors described herein) located on each of the end effectors and at least one of the movable links and movable arm links connected via a network interface (e.g., the wireless power and / or data communication interface WPDC described herein) to provide local, onboard, and on-the-fly control of at least one of the following: active thermal control of the end effector, kinematic operation of the board holding station SHS via the articulation of one or more movable arm links of the articulated arm, measurement of the board or process, imaging of at least a portion of the articulated arm by an onboard imaging sensor, and onboard health monitoring of the articulated arm.

[0144] While the Power and / or Data Communication Interface (WPDC) is described in relation to a transport device, the WPDC as illustrated and described may offer a modular approach that allows for easy integration into a wide range of automation applications requiring data transmission across rotating axes. Although the WPDC may be described as having a modular-style implementation (see Figures 3B, 3C, and 3Q-3T), it may also be fully integrated into an existing rotating axis via the use of rotating and non-rotating printed circuit boards 251 and / or as described with respect to Figures 3B, 3C, 3D-3G, 3L, and 3P. This integrated implementation may be useful in cases where space is limited.

[0145] When a power and / or data communication interface (WPDC) is used in a vacuum or isolated environment (such as an inert gas environment), the rotating and non-rotating parts of the WPDC may optionally be separated by an airtight isolation wall (HSIW) constructed of any suitable material (shown in Figure 3R) that provides data transmission between opposing wireless power and / or data communication components. The use of the WPDC in a vacuum or isolated environment may reduce the cost of rotary vacuum-compatible seals in rotary joints.

[0146] As described herein, the Power and / or Data Communication Interface WPDC can provide a solution to the signal integrity problems caused by slip rings and the rotational limitations inherent in hard-cable systems. Axial / radial alignment of wireless power and / or data communication components, such as the wireless data communication module 255 on two printed circuit boards 250, 251, can provide high-quality signal transmission at high bandwidths, and the housing 201 can provide a homogeneous and stable environment for millimeter-wave wireless signal transmission, resulting in greater reliability of communication. The Power and / or Data Communication Interface WPDC can provide a contactless system that can eliminate the component lifespan problems inherent in slip ring and hard-cable connections.

[0147] Referring to Figures 1A-16, 20, and 21, a typical method is described in accordance with this disclosure. The method includes the step of providing a substrate transport device 104 as described herein (Figure 21, block 2500). For example, the substrate transport device 104 is connected to a base 201 using terminal (rotational) joint MJs (e.g., one or more axes SX, BSX, etc.) and extends around the terminal joint. The articulated arm 333 has one or more movable arm links 213, 212 and end effectors 211, 211A, 211B connected to one or more movable arm links 213, 212 at distal (rotational) joint MJs (e.g., at a wrist axis WX, etc.). The terminal and distal joints are rotational joint MJs, and the end effectors 211, 211A, 211B have a substrate holding station SHS on them. At least one of the movable arm links, 213, 212, of one or more movable arm links, is connected to a housing 370-375, 200H which includes at least one rotary joint MJ having rotation axes SX, BSX, EX. At least one of the movable links 213, 212 rotates in articulation around rotation axes SX, BSX, EX to extend and retract the articulated arm 333. At least one of the movable links 213, 212 has a link housing 370-375 which includes at least another rotary joint MJ having corresponding rotation axes EX, WX. At least one of the other arm links 212 and end effectors 211, 211A, 211B is rotatably joined to at least one of the movable links 213, 212. The substrate transport device 104 may also include a power and data communication system PDCS.

[0148] The method also includes the step of distributing power and data communication system PDCS through articulated arm 333 (Figure 21, block 2510). Power and data communication system PDCS has a contactless wireless data transfer or communication module 180 in at least one or at least another articulated joint MJ. The contactless wireless data communication module 180 has a module housing 2010 that houses transmitter and receiver printed circuit boards 250, 251 of a pair of printed circuit boards that form a contactless wireless communication interface WPDC across at least one or at least another articulated joint MJ, which decouples the rotation of at least one or at least another articulated joint MJ from the constraints of power and data communication system PDCS so that the rotation of at least one or at least another articulated joint MJ is substantially unlimited (see at least Figure 3U). The transmitter and receiver printed circuit boards 250, 251 of the printed circuit board pair are aligned to predetermined alignment tolerances to provide transmission speeds of the contactless wireless data communication interface WPDC in the range of gigabytes per second (Gbps) over virtually unlimited rotations.

[0149] The method may include one or more of the following, individually or in any suitable combination thereof and / or in any suitable combination with other features described herein: the transmission speed of the contactless wireless data communication interface WPDC is in the range of up to about 3.125 Gbps; the module housing 2010 has a static housing component 2000 and a dynamic housing component 205 joined to each other, and one of the printed circuit boards 250, 251 of the transmitter or receiver of the printed circuit board pair is housed in the static housing component 2000 and the printed circuit board The other of the pair of transmitter or receiver printed circuit boards 250, 251 is housed in a dynamic housing component 205; the static housing component 2000 is fixedly connected to housing 200H and at least one of link housings 370-375, and the dynamic housing component 205 has a rotor 2100 that rotates around the corresponding rotation axis SAX of at least one or at least another rotary joint MJ relative to the static housing component 2000 over the entire rotation of at least one or at least another rotary joint MJ; the pair of printed circuit boards The other of the transmitter or receiver printed circuit boards 250, 251 is mounted on the rotor 2100 in a dynamic housing component 205 so as to rotate together with the rotor 2100 about the corresponding rotation axis SAX of the at least one or at least another rotary joint MJ, with respect to one of the transmitter or receiver printed circuit boards 250, 251 which remains stationary within a static housing component 2000 over the entire rotation of at least one or at least another rotary joint MJ; the other of the transmitter or receiver printed circuit boards 250, 251 of the printed circuit board pair The other of 51 is substantially decoupled from the alignment and runout tolerances of at least one or at least another rotary joint MJ exceeding a predetermined alignment tolerance, and is aligned with one of the printed circuit boards 250, 251 of the transmitter or receiver of the printed circuit board pair with a predetermined alignment tolerance over the entire rotation of at least one or at least another rotary joint MJ, and is held by the rotor 2100; the rotor 2100 is positioned relative to the static housing component 2000 by a deep groove radial ball bearing 215;Deep groove radial ball bearings 215 define predetermined alignment tolerances for the transmitter and receiver printed circuit boards 250, 251 of the printed circuit board pair; the module housing 2010 has a static housing component 2000 and a dynamic housing component 205 joined to each other, with one of the transmitter or receiver printed circuit boards 250, 251 of the printed circuit board pair housed within the static housing component 2000, and the other of the transmitter or receiver printed circuit boards 250, 251 of the printed circuit board pair mounted on the rotor 2100 of the dynamic housing component 205, with an airtight isolation wall HSIW separating the rotor 2100 from the static housing component 2000, and the airtight isolation wall HSIW configured to allow data transmission between the transmitter and receiver printed circuit boards 250, 251 of the printed circuit board pair; and a flexible shaft coupling 260 interposed between the rotor 2100 of the dynamic housing component 205 and the output shaft 290 of at least one rotary joint MJ or at least another rotary joint MJ to pair them.

[0150] The following are provided pursuant to this disclosure and may be used individually, in any combination with each other, and / or in any combination with the features described above.

[0151] According to the present invention, a substrate transport device comprises a base and a multi-joint arm connected to the base using terminal joints, the multi-joint arm having one or more movable arm links and an end effector connected to one or more movable arm links at the distal joint, the end effector having a substrate holding station on it, at least one of the one or more movable arm links having a housing including at least one rotary joint having a rotation axis, the at least one movable arm link rotating in articulation about the rotation axis to cause extension and contraction of the multi-joint arm, the housing including at least another rotary joint, and at least one of the other movable arm links and the end effector being rotatably joined to at least one movable arm link, a power and data communication system being distributed through the multi-joint arm, the power and data communication system having a wireless power and data communication interface disposed through at least one rotary joint of the housing of at least one movable arm link, the wireless power and data communication interface being configured as a contactless wireless communication interface through at least one rotary joint.

[0152] The substrate transport device includes one or more of the following, individually or in any suitable combination:

[0153] A wireless power and data communication interface is configured as a contactless wireless communication interface, extending through at least one other rotary joint to at least one other arm link and at least one end effector, and at least one or at least another rotary joint comprises at least a wrist joint of a multi-joint arm connecting the end effector to one or more movable arm links;

[0154] A contactless wireless communication interface is at least one of proximity wireless communication and short-range wireless communication;

[0155] Contactless wireless communication interfaces are configured for proximity wireless power and data communications, including optical communication, radio frequency communication, Wi-Fi communication, near-field wireless communication, ultra-wideband communication, millimeter-wave communication, inductive communication, Bluetooth®, infrared, and Zigbee®;

[0156] The contactless wireless communication interface is configured for communication distances of approximately 20 mm or less than approximately 20 mm;

[0157] A contactless wireless power and data communication interface through another rotary joint forms a contactless communication power and data link between at least one of the other arm links and end effectors and at least one movable arm link, and the contactless communication link intersects in the rotary joint in the spatial gap formed by the rotary joint between the movable arm link and at least one of the other arm links and end effectors; and

[0158] The housing is configured to form an internal sealed plenum that houses the transmitter and receiver portions of the wireless communication power and data communication interface, respectively, within a sealed atmosphere, protected from the reduced pressure environment outside the housing.

[0159] According to this disclosure, the transfer device comprises a frame forming a sealed chamber disposed to hold a processing vacuum inside, and a multi-joint arm connected to the frame within the sealed chamber by terminal joints, the multi-joint arm having at least one movable arm link and an end effector connected to at least one movable arm link, on which a substrate holding station is disposed, the at least one movable arm link having an outer housing including at least one rotary joint having a pivot axis, the at least one movable arm link rotating in articulation around the pivot axis to result in extension and contraction of the multi-joint arm, and the outer housing is tightly packed inside the outer housing within the processing vacuum of the sealed chamber. An assembly formed of housing components sealed to retain a closed atmosphere, through which a power and data communication system is distributed via a multi-joint arm, the power and data communication system having a wireless power and data communication interface disposed through at least one rotary joint of the outer housing of at least one movable arm link, the wireless power and data communication interface configured as a contactless wireless communication interface through at least one rotary joint, the sealed housing components are connected to each other using at least one mechanical joint that forms a sealed interface, and through the sealed interface, the closed atmosphere is in communication between each sealed housing component of the outer housing and each other sealed housing component.

[0160] The transfer device includes one or more of the following, individually or in any suitable combination:

[0161] A contactless wireless communication interface is at least one of proximity wireless communication and short-range wireless communication;

[0162] Contactless wireless communication interfaces are configured for proximity wireless power and data communications, including optical communication, radio frequency communication, Wi-Fi communication, near-field wireless communication, ultra-wideband communication, millimeter-wave communication, inductive communication, Bluetooth®, infrared, and Zigbee®;

[0163] The contactless wireless communication interface is configured for communication distances of approximately 20 mm or less than approximately 20 mm;

[0164] The contactless wireless power and data communication interface forms a contactless communication power and data link between at least one movable arm link and an end effector, and the contactless communication link intersects in the rotary joint in the spatial gap formed by the rotary joint between at least one movable arm link and an end effector; and

[0165] The outer housing is configured to form an internal sealed plenum that houses the respective transmitter and receiver components of the wireless communication power and data communication interface within a sealed atmosphere, protected from the reduced pressure environment outside the outer housing.

[0166] According to the present invention, a substrate transport device comprises a base and a multi-joint arm connected to the base using terminal joints, the multi-joint arm having one or more movable arm links and an end effector connected to one or more movable arm links at the distal joint, the end effector having a substrate holding station on it, at least one of the one or more movable arm links having a housing including at least one rotary joint having a rotation axis, the at least one movable arm link rotating in articulation about the rotation axis to cause extension and contraction of the multi-joint arm, the housing including at least another rotary joint, and at least one of the other movable arm links and the end effector being rotatably joined to at least one movable arm link A data communication and bus power network is mounted on the articulated arm, the network is distributed throughout the articulated arm from the terminal joint through the distal joint, housed within at least one rotary joint of the housing, and intersects at least one rotary joint, and the network is connected via a network interface to provide at least one local, onboard, on-the-fly control of active thermal control of the end effector, kinematic motion of a substrate holding station via the articulation of one or more movable arm links of the articulated arm, measurement of a substrate or process, imaging of at least a portion of the articulated arm by onboard imaging sensors, and onboard health monitoring of the articulated arm, and incorporates local control and sensors respectively positioned on at least one movable link and at least another movable arm link of the movable arm links and on each of the end effector.

[0167] In a substrate transport device, the bus power is DC bus power.

[0168] According to the present invention, the method is a step of providing a substrate transport device, the substrate transport device comprising a base and a multi-joint arm connected to the base using terminal joints, the multi-joint arm having one or more movable arm links and an end effector connected to one or more movable arm links at the distal joint, the end effector having a substrate holding station on it, at least one of the one or more movable arm links having a housing including at least one rotary joint having a rotation axis, the at least one movable arm link rotating in articulation around the rotation axis to cause extension and contraction of the multi-joint arm, and the housing is less The process includes: a step of including another rotary joint, wherein at least one of the movable arm links and an end effector is rotatably joined to at least one movable arm link, with respect to at least one rotary joint; and a step of distributing power and data through the articulated arm using a power and data communication system distributed through the articulated arm, wherein the power and data communication system has a wireless power and data communication interface disposed through at least one rotary joint of the housing of at least one movable arm link, and the wireless power and data communication interface is configured as a contactless wireless communication interface through at least one rotary joint.

[0169] The method includes one or more of the following, individually or in any suitable combination:

[0170] A wireless power and data communication interface is configured as a contactless wireless communication interface, extending through at least one other rotary joint to at least one other arm link and at least one end effector, and at least one or at least another rotary joint comprises at least a wrist joint of a multi-joint arm connecting the end effector to one or more movable arm links;

[0171] A contactless wireless communication interface is at least one of proximity wireless communication and short-range wireless communication;

[0172] Contactless wireless communication interfaces are configured for proximity wireless power and data communications, including optical communication, radio frequency communication, Wi-Fi communication, near-field wireless communication, ultra-wideband communication, millimeter-wave communication, inductive communication, Bluetooth®, infrared, and Zigbee®;

[0173] The contactless wireless communication interface is configured for communication distances of approximately 20 mm or less than approximately 20 mm;

[0174] A contactless wireless power and data communication interface through another rotary joint forms a contactless communication power and data link between at least one of the other arm links and end effectors and at least one movable arm link, and the contactless communication link intersects in the rotary joint in the spatial gap formed by the rotary joint between the movable arm link and at least one of the other arm links and end effectors; and

[0175] The housing is configured to form an internal sealed plenum that houses the transmitter and receiver portions of the wireless communication power and data communication interface, respectively, within a sealed atmosphere, protected from the reduced pressure environment outside the housing.

[0176] According to this disclosure, the method is a step of providing a transfer device, the transfer device comprising: a frame forming a sealed chamber disposed to hold a processing vacuum inside; and a multi-joint arm connected to the frame within the sealed chamber by terminal joints, the multi-joint arm having at least one movable arm link and an end effector connected to at least one movable arm link, on which a substrate holding station is disposed, the at least one movable arm link having an outer housing including at least one rotary joint having a pivot axis, the at least one movable arm link rotating in articulation about the pivot axis to cause extension and contraction of the multi-joint arm, the outer housing being tightly sealed to hold a sealed atmosphere inside the outer housing within the processing vacuum of the sealed chamber. The process includes: an assembly formed of closed housing components; and a process of distributing power and data through a multi-joint arm using a power and data communication system distributed through a multi-joint arm, wherein the power and data communication system has a wireless power and data communication interface disposed through at least one rotary joint of the outer housing of at least one movable arm link, and the wireless power and data communication interface is configured as a contactless wireless communication interface through at least one rotary joint, wherein the sealed housing components are connected to each other using at least one mechanical joint that forms a sealed interface, and a sealed atmosphere is in communication between each sealed housing component of the outer housing and each other sealed housing component via the sealed interface.

[0177] The method includes one or more of the following, individually or in any appropriate combination:

[0178] A contactless wireless communication interface is at least one of proximity wireless communication and short-range wireless communication;

[0179] Contactless wireless communication interfaces are configured for proximity wireless power and data communications, including optical communication, radio frequency communication, Wi-Fi communication, near-field wireless communication, ultra-wideband communication, millimeter-wave communication, inductive communication, Bluetooth®, infrared, and Zigbee®;

[0180] The contactless wireless communication interface is configured for communication distances of approximately 20 mm or less than approximately 20 mm;

[0181] The contactless wireless power and data communication interface forms a contactless communication power and data link between at least one movable arm link and an end effector, and the contactless communication link intersects in the rotary joint in the spatial gap formed by the rotary joint between at least one movable arm link and an end effector; and

[0182] The outer housing is configured to form an internal sealed plenum that houses the respective transmitter and receiver components of the wireless communication power and data communication interface within a sealed atmosphere, protected from the reduced pressure environment outside the outer housing.

[0183] According to the present invention, the method is a step of providing a substrate transport device, the substrate transport device comprising a base and a multi-joint arm connected to the base using terminal joints, the multi-joint arm having one or more movable arm links and an end effector connected to one or more movable arm links at the distal joint, the end effector having a substrate holding station on it, at least one of the one or more movable arm links having a housing including at least one rotary joint having a rotation axis, the at least one movable arm link rotating in articulation about the rotation axis to cause extension and contraction of the multi-joint arm, the housing including at least another rotary joint, and at least one of the other movable arm links and the end effector being rotatably joined to at least one movable arm link The process includes a step of distributing a data communication and bus power network mounted on an articulated arm from the terminal joint through the distal joint to the entire articulated arm, wherein the network is housed within at least one rotary joint of the housing and intersects at least one rotary joint, and the network is connected via a network interface to provide at least one local, onboard, on-the-fly control of active thermal control of the end effector, kinematic motion of a substrate holding station via the joint movement of one or more movable arm links of the articulated arm, measurement of a substrate or process, imaging of at least a portion of the articulated arm by an onboard imaging sensor, and onboard health monitoring of the articulated arm, and sensors respectively positioned on at least one movable link and at least another movable arm link of the movable arm links and on each of the end effector.

[0184] In this method, the bus power is DC bus power.

[0185] According to the present invention, the substrate transport device comprises a base and a multi-joint arm connected to the base using terminal joints, wherein the multi-joint arm extends around the terminal joint and has one or more movable arm links and an end effector connected to one or more movable arm links at the distal joint, the terminal and distal joints are rotational joints, and the end effector has a substrate holding position on it, and at least one of the one or more movable arm links is connected to a housing including at least one rotational joint having a rotation axis, at least the movable link rotates in articulation around the rotation axis to cause extension and contraction of the multi-joint arm, at least one movable link has a link housing including at least another rotational joint having a corresponding rotation axis, and at least one of the arm links and the end effector is rotatably joined to at least one movable link with respect to at least one rotational joint, and power The power and data communication system is distributed through a multi-joint arm, and the power and data communication system has a contactless wireless data communication module in at least one or at least one other rotary joint, the contactless wireless data communication module has a module housing that houses a pair of transmitter and receiver printed circuit boards forming a contactless wireless communication interface in and across at least one or at least one rotary joint, which decouples the rotation of at least one or at least another rotary joint from the constraints of the power and data communication system, such that the rotation of at least one or at least another rotary joint is substantially unlimited, the transmitter and receiver printed circuit boards of the pair of printed circuit boards are aligned to a predetermined alignment tolerance to provide a transmission rate of the contactless wireless data communication interface in the range of gigabytes per second (Gbps) over the substantially unlimited rotation.

[0186] The substrate transport device includes one or more of the following, individually or in any suitable combination:

[0187] The transmission speed of the contactless wireless data communication interface is in the range of up to approximately 3.125 Gbps;

[0188] The module housing has a static housing component and a dynamic housing component joined to each other, where one of the transmitter or receiver printed circuit boards of a pair of printed circuit boards is housed in the static housing component, and the other of the transmitter or receiver printed circuit boards of the pair is housed in the dynamic housing component;

[0189] The static housing component is fixedly connected to at least one of the housing and link housings, and the dynamic housing component has a rotor that rotates around the corresponding axis of rotation of at least one or at least another rotary joint relative to the static housing component over the entire rotation of at least one or at least another rotary joint;

[0190] The other printed circuit board of a transmitter or receiver in a printed circuit board pair is mounted to a rotor in a dynamic housing component so as to rotate together with the rotor about the corresponding axis of rotation of at least one or at least another rotary joint, relative to the one printed circuit board of the transmitter or receiver that is stationary in a static housing component over the entire rotation of at least one or at least another rotary joint;

[0191] The other printed circuit board of the transmitter or receiver of the printed circuit board pair is held by the rotor, substantially isolated from the alignment and runout tolerances of at least one or at least another rotary joint exceeding a predetermined alignment tolerance, and aligned to one of the transmitter or receiver printed circuit boards of the printed circuit board pair with a predetermined alignment tolerance throughout the entire rotation of at least one or at least another rotary joint;

[0192] The rotor is positioned relative to the static housing component by deep groove radial ball bearings;

[0193] Deep groove radial ball bearings define predetermined alignment tolerances for the printed circuit boards of a transmitter and receiver pair of printed circuit boards;

[0194] The module housing has a static housing component and a dynamic housing component joined to each other, one of the transmitter or receiver printed circuit boards of the printed circuit board pair is housed in the static housing component, the other of the transmitter or receiver printed circuit boards of the printed circuit board pair is mounted on the rotor of the dynamic housing component, and an airtight isolation wall separates the rotor from the static housing component, and the airtight isolation wall is configured to allow data transmission between the transmitter and receiver printed circuit boards of the printed circuit board pair; and

[0195] A flexible shaft coupling interposed between the rotor of a dynamic housing component and the output shaft of at least one or at least another rotary joint, pairing them together.

[0196] According to the present invention, the method is a step of providing a substrate transport device, wherein the substrate transport device comprises a base and a multi-joint arm connected to the base using terminal joints, the multi-joint arm extending about terminal joints and having one or more movable arm links and end effectors connected to one or more movable arm links at distal joints, the terminal and distal joints being rotational joints, and the end effectors having a substrate holding position thereon, the multi-joint arm comprising, at least one of the one or more movable arm links being connected to a housing including at least one rotational joint having a rotation axis, at least one movable link rotating in articulation about the rotation axis to cause extension and contraction of the multi-joint arm, at least one movable link having a link housing including at least another rotational joint having a corresponding rotation axis, and at least one of the arm links and end effectors being rotatably joined to at least one movable link with respect to at least one rotational joint, and the substrate transport device further comprises power The process includes: a process comprising a power and data communication system, and a process of distributing the power and data communication system through an articulated arm, wherein the power and data communication system has a non-contact wireless data communication module in at least one or at least another articulated joint, the non-contact wireless data communication module having a module housing that accommodates a transmitter and receiver printed circuit board of a pair of printed circuit boards forming a non-contact wireless communication interface in and spanning at least one or at least another articulated joint, which decouples the rotation of at least one or at least another articulated joint from the constraints of the power and data communication system, such that the rotation of at least one or at least another articulated joint is substantially unlimited, and the transmitter and receiver printed circuit boards of the pair of printed circuit boards are aligned to a predetermined alignment tolerance so as to provide a transmission rate of the non-contact wireless data communication interface in the range of gigabytes per second (Gbps) over the entire substantially unlimited rotation.

[0197] The method includes one or more of the following, individually or in any suitable combination:

[0198] The transmission speed of the contactless wireless data communication interface is in the range of up to approximately 3.125 Gbps;

[0199] The module housing has a static housing component and a dynamic housing component joined to each other, where one of the transmitter or receiver printed circuit boards of a pair of printed circuit boards is housed in the static housing component, and the other of the transmitter or receiver printed circuit boards of the pair is housed in the dynamic housing component;

[0200] The static housing component is fixedly connected to at least one of the housing and link housings, and the dynamic housing component has a rotor that rotates around the corresponding axis of rotation of at least one or at least another rotary joint relative to the static housing component over the entire rotation of at least one or at least another rotary joint;

[0201] The other printed circuit board of a transmitter or receiver in a printed circuit board pair is mounted to a rotor in a dynamic housing component so as to rotate together with the rotor about the corresponding axis of rotation of at least one or at least another rotary joint, relative to the one printed circuit board of the transmitter or receiver that is stationary in a static housing component over the entire rotation of at least one or at least another rotary joint;

[0202] The other printed circuit board of the transmitter or receiver of the printed circuit board pair is held by the rotor, substantially isolated from the alignment and runout tolerances of at least one or at least another rotary joint exceeding a predetermined alignment tolerance, and aligned to one of the transmitter or receiver printed circuit boards of the printed circuit board pair with a predetermined alignment tolerance throughout the entire rotation of at least one or at least another rotary joint;

[0203] The rotor is positioned relative to the static housing component by deep groove radial ball bearings;

[0204] Deep groove radial ball bearings define predetermined alignment tolerances for the printed circuit boards of a transmitter and receiver pair of printed circuit boards;

[0205] The module housing has a static housing component and a dynamic housing component joined to each other, one of the transmitter or receiver printed circuit boards of the printed circuit board pair is housed in the static housing component, the other of the transmitter or receiver printed circuit boards of the printed circuit board pair is mounted on the rotor of the dynamic housing component, and an airtight isolation wall separates the rotor from the static housing component, and the airtight isolation wall is configured to allow data transmission between the transmitter and receiver printed circuit boards of the printed circuit board pair; and

[0206] A flexible shaft connector is interposed between the rotor of the dynamic housing component and the output shaft of at least one or at least another rotary joint, pairing them together.

[0207] It should be understood that the foregoing description is merely illustrative of the present disclosure. Various alternatives and modifications can be attempted by those skilled in the art without departing from the present disclosure. Accordingly, the present disclosure is intended to encompass all such alternatives, modifications, and variations that fall within the scope of any claims appended to this specification. Furthermore, the mere fact that different features are described in different dependent or independent claims does not imply that combinations of these features cannot be used to their advantage, and such combinations are also included within the scope of the present disclosure.

Claims

1. A substrate transport device, wherein the substrate transport device is Bass and, A multi-joint arm connected to the base using terminal joints, wherein the multi-joint arm rotates and extends around the terminal joints, and has one or more movable arm links, and an end effector connected to the one or more movable arm links at the distal joints, the end effector having a substrate holding station on it, and Equipped with, At least one of the one or more movable arm links has a housing that includes at least one rotary joint having a pivot axis, and the at least one movable arm link rotates in articulation about the pivot axis to extend and retract the articulated arm, and the housing includes at least another rotary joint, and at least one of the movable arm links and the end effector is rotatably joined to the at least one movable arm link, A substrate transport device in which a power and data communication system is distributed through the articulated arm, and the power and data communication system has a wireless power and data communication interface disposed through the at least one rotary joint of the housing of the at least one movable arm link, and the wireless power and data communication interface is configured as a contactless wireless communication interface through the at least one rotary joint.

2. A wireless power and data communication interface, which extends through at least one other rotary joint to at least one other arm link and at least one of the end effectors, is configured as a contactless wireless communication interface, and the at least one rotary joint or the at least another rotary joint comprises at least a wrist joint of the articulated arm that connects the end effector to one or more movable arm links, according to claim 1.

3. The substrate transport apparatus according to claim 1, wherein the non-contact wireless communication interface is at least one of proximity wireless communication and short-range wireless communication.

4. The substrate transport apparatus according to claim 1, wherein the non-contact wireless communication interface is configured for proximity wireless power and data communication, including optical communication, radio frequency communication, Wi-Fi communication, short-range wireless communication, ultra-wideband communication, millimeter-wave communication, inductive communication, Bluetooth®, infrared, and Zigbee®.

5. The substrate transport apparatus according to claim 1, wherein the non-contact wireless communication interface is configured for a communication distance of about 20 mm or less than about 20 mm.

6. The substrate transport apparatus according to claim 1, wherein a non-contact wireless power and data communication interface through the other rotary joint forms a non-contact communication power and data link between the other arm link and at least one of the end effectors and the at least one movable arm link, and the non-contact communication link intersects in the rotary joint in the spatial gap formed by the rotary joint between the movable arm link and at least one of the other arm link and the end effector.

7. The substrate transport apparatus according to claim 1, wherein the housing is configured to form a sealed plenum inside which parts of the transmitter and receiver of the wireless communication power and data communication interface are housed in a sealed atmosphere sealed from the reduced pressure environment outside the housing.

8. A transfer device, wherein the transfer device is A frame forming a sealed chamber arranged to maintain a processing vacuum inside, A multi-joint arm connected to the frame within the sealed chamber using terminal joints, wherein the multi-joint arm rotates and extends around the terminal joint and has at least one movable arm link and an end effector connected to the at least one movable arm link, on which a substrate holding station is disposed, and Equipped with, The assembly is formed of a housing component which is sealed to hold a sealed atmosphere within the outer housing within the processing vacuum of the sealed chamber, the at least one movable arm link having an outer housing including at least one rotary joint having a pivot axis, the at least one movable arm link rotating in articulation around the pivot axis to cause extension and contraction of the articulated arm, and the outer housing having an outer housing including at least one rotary joint having a pivot axis, A power and data communication system is distributed through the articulated arm, and the power and data communication system has a wireless power and data communication interface disposed through the at least one rotary joint of the outer housing of the at least one movable arm link, and the wireless power and data communication interface is configured as a contactless wireless communication interface through the at least one rotary joint. A transfer device in which the sealed housing components are connected to one another using at least one mechanical joint that forms a sealed interface, and the sealed atmosphere communicates between each sealed housing component of the outer housing and each other through the sealed interface.

9. The substrate transport apparatus according to claim 8, wherein the non-contact wireless communication interface is at least one of proximity wireless communication and short-range wireless communication.

10. The substrate transport apparatus according to claim 8, wherein the non-contact wireless communication interface is configured for proximity wireless power and data communication, including optical communication, radio frequency communication, Wi-Fi communication, short-range wireless communication, ultra-wideband communication, millimeter-wave communication, inductive communication, Bluetooth®, infrared, and Zigbee®.

11. The substrate transport apparatus according to claim 8, wherein the non-contact wireless communication interface is configured for a communication distance of about 20 mm or less than about 20 mm.

12. The substrate transport apparatus according to claim 8, wherein a contactless wireless power and data communication interface forms a contactless communication power and data link between the at least one movable arm link and the end effector, and the contactless communication link intersects, at the rotary joint, in a spatial gap formed between the at least one movable arm link and the end effector by the rotary joint.

13. The substrate transport apparatus according to claim 8, wherein the outer housing is configured to form a sealed plenum inside which parts of the transmitter and receiver of the wireless communication power and data communication interface are housed in a sealed atmosphere sealed from the reduced pressure environment outside the outer housing.

14. A method, wherein the method is A step in providing a substrate transport device, wherein the substrate transport device is Bass and, A multi-joint arm connected to the base using terminal joints, wherein the multi-joint arm rotates and extends around the terminal joints, and has one or more movable arm links, and an end effector connected to the one or more movable arm links at the distal joints, the end effector having a substrate holding station on it, and Includes, The process includes: at least one of the one or more movable arm links having a housing that includes at least one rotary joint having a pivot axis, the at least one movable arm link rotating in articulation around the pivot axis to extend and retract the articulated arm, the housing including at least another rotary joint, and at least one of the movable arm links and the end effector being rotatably joined to the at least one movable arm link with respect to the at least another rotary joint; A step of distributing power and data through the articulated arm using a power and data communication system distributed through the articulated arm, wherein the power and data communication system has a wireless power and data communication interface disposed through the at least one rotary joint of the housing of the at least one movable arm link, and the wireless power and data communication interface is configured as a contactless wireless communication interface through the at least one rotary joint. Methods that include...

15. The method according to claim 14, wherein a wireless power and data communication interface, through at least another rotary joint to at least one other arm link and at least one of the end effectors, is configured as a contactless wireless communication interface, and the at least one rotary joint or the at least another rotary joint comprises at least a wrist joint of the articulated arm that connects the end effector to one or more movable arm links.

16. The method according to claim 14, wherein the non-contact wireless communication interface is at least one of proximity wireless communication and short-range wireless communication.

17. The method according to claim 14, wherein the non-contact wireless communication interface is configured for proximity wireless power and data communication, including optical communication, radio frequency communication, Wi-Fi communication, near-field wireless communication, ultra-wideband communication, millimeter-wave communication, inductive communication, Bluetooth®, infrared, and Zigbee®.

18. The method according to claim 14, wherein the non-contact wireless communication interface is configured for a communication distance of about 20 mm or less than about 20 mm.

19. The method according to claim 14, wherein a non-contact wireless power and data communication interface through the other rotary joint forms a non-contact communication power and data link between the other arm link and at least one of the end effectors and the at least one movable arm link, and the non-contact communication link intersects in the rotary joint in a spatial gap formed by the rotary joint between the movable arm link and at least one of the other arm link and the end effector.

20. The method according to claim 14, wherein the housing is configured to form a sealed plenum inside which parts of the transmitter and receiver of the wireless communication power and data communication interface are housed in a sealed atmosphere sealed from the reduced pressure environment outside the housing.

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