Heat dissipation devices

Abstract

To provide a heat dissipation device that maximizes heat dissipation performance and significantly improves product productivity. [Solution] The heat dissipation device includes a heat conduction panel on one side made of a metal panel member, a refrigerant flow space between the heat conduction panel on one side where a refrigerant undergoes a phase change and flows, a heat conduction panel on the other side made of a metal panel member, and a joining mediating frame body provided to mediate the joining of the edges of the heat conduction panel on one side and the heat conduction panel on the other side.

Description

TECHNICAL FIELD

[0001] The present invention relates to a heat dissipation apparatus, and more specifically, is designed to prevent volume changes in the refrigerant flow space despite changes in internal pressure within the refrigerant flow space during the phase change of the refrigerant which is a phase change material, and to allow condensed liquid-phase refrigerant to be evenly collected in the direction of gravity, thereby maximizing heat dissipation performance, and forming sharp edge portions into rounded shapes, so as to not only prevent injuries to workers, but also improve the productivity of the product.

BACKGROUND ART

[0002] Related technologies in various industrial fields such as communications, electronics, and electricity tend to be continuously highly developed for application to more advanced industries. Advanced technology development requires high-output energy, and devices that use high-output energy inevitably face the problem of high heat generation, so the development of a cooling system of a level suitable for this must be accompanied accordingly.

[0003] Heat dissipation systems are used in various industries such as air conditioners, mobile communications, data centers, aeronautical mobility, electric vehicles, energy storage devices, and displays. Such heat dissipation systems are one of the main causes of power consumption, and power consumption tends to gradually increase with the development of industries.

[0004] In general, heat dissipation devices are broadly divided into active cooling devices and passive cooling devices. Active cooling devices mainly utilize forced convection by a fan, and passive cooling devices can be classified as technologies that utilize natural convection without using a fan.

[0005] However, conventional heat dissipation systems have limitations in dissipating the high heat generated by continuously evolving advanced technologies. Therefore, there is a need for innovative technologies to solve these problems in related industrial sectors, and heat dissipation devices are being developed as part of this effort.

[0006] Phase change refers to the change in the inherent state of a liquid, gas, or solid when it stores a large amount of energy or releases stored thermal energy.

[0007] Phase change refers to a change in the physical arrangement of molecules that is not a chemical reaction such as chemical bonding or formation. When energy is applied to a substance, the heat at which no phase change occurs is called sensible heat, and the heat used when the phase changes is called latent heat.

[0008] However, heat dissipation devices have a problem in that, because the relationship between temperature and pressure is proportional, as the temperature rises, the pressure also rises. If the pressure rises due to the high temperature conducted from the heat source inside a sealed heat dissipation device, it can cause the heat dissipation device itself to rupture. To solve this, the pressure must not rise, and heat dissipation devices require a sufficient internal volume to achieve pressure equilibrium during the process of phase change circulation of matter. [Overview of the project] [Problems that the invention aims to solve]

[0009] The present invention was made to solve the above technical problems, and aims to provide a heat dissipation device that can maximize heat dissipation performance.

[0010] In addition, another objective of the present invention is to provide a heat dissipation device that can improve the productivity of products.

[0011] Furthermore, another objective of the present invention is to provide a heat dissipation device that can prevent injury to installation workers.

[0012] The technical problems of the present invention are not limited to those mentioned above, and other technical problems not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0013] A heat dissipation device according to one embodiment of the present invention includes a heat conduction panel on one side made of a metal panel member, a heat conduction panel on the other side made of a metal panel member that forms a refrigerant flow space between the heat conduction panel on one side and the refrigerant flowing through a phase change, and a joining mediating frame body provided to mediate the joining of the edges of the heat conduction panel on one side and the other side.

[0014] Here, the joining mediating frame body is formed between the one-side heat conduction panel and the other-side heat conduction panel, and can shield the refrigerant flow space.

[0015] Furthermore, the heat conduction panel on one side and the heat conduction panel on the other side may be made of the same metal material having a predetermined or higher thermal conductivity.

[0016] Furthermore, the bonding mediating frame body can mediate the bonding and lamination of surfaces along the edges of the one-sided heat conduction panel and the other-sided heat conduction panel.

[0017] Furthermore, the bonding mediating frame body is positioned between the one-side heat conduction panel and the other-side heat conduction panel, and can provide a predetermined bonding surface to the inner surface of the edge of the one-side heat conduction panel and the inner surface of the edge of the other-side heat conduction panel.

[0018] Furthermore, the connecting mediation frame body may have a square pipe cross-section made of copper (Cu) material.

[0019] Furthermore, the first surface of the square pipe cross-section of the joining mediating frame body may be surface-jointed with the inner surface of the edge of the one-side heat conduction panel, and the second surface of the square pipe cross-section of the joining mediating frame body facing the first surface may be surface-jointed with the inner surface of the edge of the other-side heat conduction panel.

[0020] Furthermore, when the evaporation section is defined as a portion of the refrigerant flow space that is located relatively below the direction of gravity and is relatively close to the heating element, which is a source of heat supply and where liquid phase refrigerant is stored, the joining mediating frame body may have different materials for the first frame installed close to the evaporation section and the second frame provided in a portion other than the evaporation section.

[0021] Furthermore, the first frame may be formed to have a square pipe cross-section made of copper (Cu) material, and the second frame may be formed to have a square pipe cross-section made of SUS material.

[0022] Furthermore, the system may further include a plurality of condensation sintered body columns arranged in the refrigerant flow space and connected to the bonding mediation frame body.

[0023] Furthermore, the plurality of condensation section sintered body columns can be connected to the bonding mediation frame body via an evaporation section sintered body base that connects one end of each column.

[0024] Furthermore, although the plurality of condensed sintered body columns are arranged in a straight line, the lower end corresponding to one end can be positioned relatively lower than the upper end with respect to the direction of gravity.

[0025] Furthermore, one end of the plurality of condensed sintered body columns can be connected to the inside of the bonding mediation frame body, which is located relatively below the direction of gravity.

[0026] Furthermore, the other ends of the plurality of condensed sintered body columns can be connected to the inside of the bonding mediation frame body, which is located relatively above the direction of gravity.

[0027] Further, the other ends of the plurality of sintered condenser part columns may be spaced a predetermined distance apart from the connection mediating frame body positioned relatively on the upper side with reference to the direction of gravity.

[0028] Further, the one-side heat conductive panel and the other-side heat conductive panel may be provided as metal panel members made of SUS material.

[0029] Further, the plurality of sintered condenser part columns and the sintered evaporator part base may be formed by sintering SUS material powder.

[0030] Further, the connection mediating frame body may be formed with an air vent hole to which an air vent tube for evacuating the refrigerant flow space or filling the refrigerant is connected.

[0031] Further, the air vent hole may be formed to communicate with the refrigerant flow space.

[0032] Further, the one-side heat conductive panel, the other-side heat conductive panel, and the connection mediating frame body may be laminated and joined by a laser welding method.

[0033] Further, the one-side heat conductive panel, the other-side heat conductive panel, and the connection mediating frame body may be laminated and joined by a brazing welding method.

[0034] Further, the plurality of sintered condenser part columns may be formed with a plurality of support protrusions that protrude and are supported on the inner side surface of the one-side heat conductive panel or the other-side heat conductive panel within the refrigerant flow space.

[0035] Further, the tip end surfaces of the plurality of support protrusions can be in contact with the inner side surface of the one-side heat conductive panel or the other-side heat conductive panel. Advantageous Effects of Invention

[0036] According to one embodiment of the present invention, a heat dissipation device can achieve a variety of effects, including the following:

[0037] Firstly, the present invention has the effect of significantly improving the overall heat dissipation performance by dissipating system heat through the process of phase change in which a refrigerant is filled inside.

[0038] Secondly, the present invention has the effect of greatly improving the productivity of products by easily forming a refrigerant flow space inside two metal panel members using a laser welding method or a brazing welding method.

[0039] Third, the present invention has the effect of preventing worker injury and improving work stability by rounding the sharp edges of the product. [Brief explanation of the drawing]

[0040] [Figure 1] This is a perspective view showing a heat dissipation device according to one embodiment of the present invention. [Figure 2] This is an exploded perspective view showing a heat dissipation device according to one embodiment of the present invention. [Figure 3A] This is an exploded perspective view showing a heat dissipation device according to one embodiment of the present invention. [Figure 3B] This is an exploded perspective view showing a heat dissipation device according to one embodiment of the present invention. [Figure 3C] This is an exploded perspective view showing a heat dissipation device according to one embodiment of the present invention. [Figure 3D] This is an exploded perspective view showing a heat dissipation device according to one embodiment of the present invention. [Figure 4] This is an exploded perspective view showing a modified example of one embodiment of the present invention. [Figure 5A] Figures 3A to 3D show a perspective view with the one-sided and the other-sided heat conduction panels removed from the configuration shown. [Figure 5B] Figures 3A to 3D show a perspective view with the one-sided and the other-sided heat conduction panels removed from the configuration shown. [Figure 5C] Figures 3A to 3D show a perspective view with the one-sided and the other-sided heat conduction panels removed from the configuration shown. [Figure 5D] Figures 3A to 3D show a perspective view with the one-sided and the other-sided heat conduction panels removed from the configuration shown. [Figure 6] Figure 2 is a perspective view showing various examples of the configuration of the condensation section sintered column and the evaporation section sintered base. [Figure 7] This is a perspective view showing a heat dissipation device according to another embodiment of the present invention. [Figure 8] Figure 7 is an exploded perspective view. [Figure 9] This is an exploded perspective view showing a modified example of another embodiment of the present invention. [Modes for carrying out the invention]

[0041] A heat dissipation device according to one embodiment of the present invention will be described in detail below with reference to the attached drawings.

[0042] When assigning reference numerals to the components in each drawing, it should be noted that, as far as possible, identical components should have the same reference numeral even if they are shown in other drawings. Furthermore, when describing embodiments of the present invention, if it is determined that a specific description of such known configurations or functions would hinder understanding of the embodiments of the present invention, such detailed description will be omitted.

[0043] In describing the components of the embodiments of the present invention, terms such as First, Second, A, B, (a), (b), etc., may be used. Such terms are merely for distinguishing a component from other components, and do not limit the nature, order, or procedure of that component. Furthermore, unless otherwise specified, all terms used herein, including technical or scientific terms, have the same meaning as generally understood by a person of ordinary skill in the art to which the present invention pertains. Terms as defined in commonly used dictionaries should be interpreted as having the meaning consistent with their meaning in the context of the relevant art, and not in an ideal or overly formal sense unless explicitly defined in this application.

[0044] Figure 1 is a perspective view showing a heat dissipation device according to an embodiment of the present invention, and Figure 2 is an exploded perspective view showing a heat dissipation device according to an embodiment of the present invention.

[0045] As shown in Figures 1 and 2, a heat dissipation device 200 according to one embodiment of the present invention includes a one-side heat conduction panel 200A made of a metal panel member, a other-side heat conduction panel 200B made of a metal panel member that forms a refrigerant flow space 205 between the one-side heat conduction panel 200A and the other-side heat conduction panel 200B through which the refrigerant undergoes a phase change and flows, and a joining mediating frame body 280 that mediates the joining of the edges of the one-side heat conduction panel 200A and the other-side heat conduction panel 200B.

[0046] Here, the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B may be made of the same metal material (metal panel material) having a predetermined or higher thermal conductivity.

[0047] Preferably, the metal material may be at least stainless steel (SUS) to facilitate the phase change of the refrigerant due to heat exchange with the outside air (in particular, the phase change in which the refrigerant condenses from a gaseous state to a liquid state).

[0048] The specific reasons for adopting SUS material as the metal material for the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B will be explained in more detail later.

[0049] In addition, in a heat dissipation device 200 according to one embodiment of the present invention, the one-side heat conduction panel 200A and the other-side heat conduction panel 200B can be formed by sheet metal processing in a press die process.

[0050] For reference, although the press die process is not shown in the diagram, it can be understood as a process in which a metal base panel made of SUS material is sheet metal processed using a press die machine so that at least each edge is joined to each other by a joining mediating frame body 280. At this time, multiple strength reinforcing parts 230 of the heat dissipation device 200-5 according to other embodiments of the present invention, which will be described later, can be formed simultaneously.

[0051] In other words, the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B may be sheet metal processed products of metal panel members made of SUS material. The thickness of the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B is set to be very thin, and can be set to a thickness not exceeding 0.15t.

[0052] Generally, among metal materials, aluminum (Al) is the most widely used in terms of thermal conductivity and weight. Here, if the heat dissipation device that substantially performs the heat dissipation or heat exchange function is in the form of a heat sink fin, and heat transfer is performed solely by the material itself without using a phase-changeable refrigerant as a heat transfer medium, as in one embodiment of the present invention, it goes without saying that aluminum can be adopted as the optimal material.

[0053] In other words, aluminum is one of the most commonly used materials for heat dissipation because, in addition to having an excellent thermal conductivity of 230, it has a low specific gravity.

[0054] However, although aluminum has superior thermal conductivity and specific gravity compared to the SUS material used for the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B in one embodiment of the present invention (in fact, the thermal conductivity of SUS is 20), it has the problem of being relatively expensive relative to its cost, and when a refrigerant is filled inside, the type of refrigerant that can be filled is very limited.

[0055] For example, if distilled water (water) were used as a refrigerant, it would undergo a chemical reaction in the case of aluminum materials, making it impossible to function as a refrigerant. Therefore, distilled water had to be excluded from the list of possible refrigerants.

[0056] To address the problems associated with aluminum materials, in a heat dissipation device 200 according to one embodiment of the present invention, SUS material, which hardly reacts with distilled water, is used as the metal material for the one-side heat conduction panel 200A and the other-side heat conduction panel 200B.

[0057] Such a one-sided heat conduction panel 200A and a other-sided heat conduction panel 200B can be joined together by interposing a joining mediating frame body 280 along their edges.

[0058] More specifically, the bonding mediating frame body 280 is positioned to mediate the surface bonding lamination along the edges of the one-side heat conduction panel 200A and the other-side heat conduction panel 200B, as shown in Figures 1 and 2, but is positioned between the one-side heat conduction panel 200A and the other-side heat conduction panel 200B, and can play the role of providing a predetermined bonding surface to the inner surface of the edge of the one-side heat conduction panel 200A and the inner surface of the edge of the other-side heat conduction panel 200B.

[0059] Here, the joining mediating frame body 280 may be formed to have a square pipe cross-section made of Cu material. More specifically, the joining mediating frame body 280 may be formed by bending a metal plate made of Cu material to have a square cross-section.

[0060] The joining mediating frame body 280, which is formed in a straight line with a rectangular cross-section as described above, may be bent to correspond to the edge shapes of the one-side heat conduction panel 200A and the other-side heat conduction panel 200B using a bending tool (not shown).

[0061] Furthermore, as described above, the joining mediating frame body 280 also plays a role in shielding the refrigerant flow space 205 formed between the one-side heat conduction panel 200A and the other-side heat conduction panel 200B.

[0062] More specifically, the upper and lower surfaces of the four cross-sections of the joining mediating frame body 280, which correspond to mutually opposing cross-sections, are laminated so as to be in contact with the lower surface, which corresponds to the edge of the one-side heat conduction panel 200A positioned above it in the drawing, and the upper surface, which corresponds to the edge of the other-side heat conduction panel 200B positioned below it, respectively, and are joined together via surface bonding through these laminated surfaces.

[0063] For example, the first surface (not indicated in the drawing reference numeral) of the square pipe cross-section of the joining mediating frame body 280 may be surface-jointed with the inner surface of the edge of the one-side heat conduction panel 200A, and the second surface (the surface opposite the first surface) of the square pipe cross-section of the joining mediating frame body 280 may be surface-jointed with the inner surface of the edge of the other-side heat conduction panel 200B.

[0064] Here, the surface joint portion between the upper surface of the joining mediating frame body 280 and the one-sided heat conduction panel 200A, and the surface joint portion between the lower surface of the joining mediating frame body 280 and the other-sided heat conduction panel 200B, can be joined by welding.

[0065] The welding method used in this case may include either brazing welding or laser welding.

[0066] However, the welding method is not necessarily limited to just one of either brazing welding or laser welding.

[0067] For example, brazing welding is a more suitable joining method for joining parts inside the refrigerant flow space 205, such as the multiple strength reinforcement parts 230 described later, and laser welding is more suitable for joining the edges of the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B. Therefore, it may be possible to combine the two methods.

[0068] Figures 3A to 3D are exploded perspective views showing individual heat dissipation devices according to embodiments of the present invention; Figure 4 is an exploded perspective view showing a modified example of one embodiment of the present invention; Figures 5A to 5D are perspective views showing the configuration of Figures 3A to 3D with the one-sided heat conduction panel and the other-sided heat conduction panel removed; and Figure 6 is a perspective view showing various embodiments of the condensation section sintered body column and the evaporation section sintered body base in the configuration of Figure 2.

[0069] A heat dissipation device 200 according to one embodiment of the present invention may further include a plurality of condensate sintered body columns 250 arranged on a refrigerant flow space 205 and connected to a bonding mediation frame body 280, as shown in Figures 3A to 6.

[0070] Here, the multiple condensing section sintered columns 250 and the evaporation section sintered base 255, which will be described later, may be formed by sintering SUS material powder. The following explanation assumes that the manufacturing method is the same for the multiple condensing section sintered columns 250 and the evaporation section sintered base 255, which will be described later, as they differ only in their characteristics (functions) that contribute to the phase change of the refrigerant depending on their installation position within the refrigerant flow space 205.

[0071] Furthermore, in the heat dissipation device 200 according to one embodiment of the present invention, the explanation will be based on the premise that the bonding mediation frame body 280 is provided in a substantially rectangular (quadrilateral) shape, as shown in Figures 3A to 3D.

[0072] However, the bonding mediating frame body 280 does not necessarily have to be formed in the same rectangular shape as the outer shape of the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B, as shown in Figures 1 to 6. It may also be formed in different shapes for each product, as shown in Figures 7 to 9, which will be described later.

[0073] For example, in the case of the heat dissipation device 200 according to one embodiment of the present invention, as shown in Figures 3A to 3D, it is given as an example in which the width and length are all the same as a rectangle. However, it goes without saying that the width and length can be varied to suit the shape and layout design of actual electronic devices (electronic equipment) that require system heat dissipation.

[0074] Furthermore, as with the heat dissipation device 200-5 in another embodiment of the present invention described later, it may be possible to modify the design to extend the condensing section 203 to have a larger area than the evaporation section 201, so that system heat dissipation can be performed at a greater distance compared to the area of ​​the actual installation site of the electronic device.

[0075] However, in the heat dissipation device 200 according to one embodiment of the present invention, for the sake of ease of understanding, it will be explained on the premise that the one-side heat conduction panel 200A and the other-side heat conduction panel 200B and the corresponding joining mediating frame body 280 are also designed and manufactured in a rectangular shape.

[0076] More specifically, since the joining mediating frame body 280 is formed in a rectangular shape, the parts corresponding to one end and the other end in the width direction are defined as "one long side 280L-1" and "the other long side 280L-2," and the parts corresponding to one end and the other end in the longitudinal direction are defined as "one short side 280S-1" and "the other short side 280S-2."

[0077] Generally, when receiving heat generated from a heat source such as an electronic device (not shown) and exchanging it with the outside air, it is not the case that only a single heat dissipation device 200 according to one embodiment of the present invention is applicable to the product (electronic device). Rather, the optimal number of heat dissipation devices 200 required can be determined according to the number of heat sources and their arrangement.

[0078] In particular, although not shown in the diagram, when the heat-generating elements are arranged vertically with respect to the direction of gravity, the arrangement and coupling structure of the individual heat dissipation devices 200 for effectively dissipating heat can be determined in various ways depending on the optimal design.

[0079] Furthermore, as in the heat dissipation device 200 according to one embodiment of the present invention, the refrigerant flow space 205 can also be partially divided into an evaporation section and a condensation section, taking into account the gas-liquid circulation due to the influence of gravity on each phase of the refrigerant that has undergone a phase change (evaporation) from a liquid phase refrigerant to a gaseous phase refrigerant, or a phase change (condensation) from a gaseous phase refrigerant to a liquid phase refrigerant, within the refrigerant flow space 205.

[0080] In this case, the bonding mediation frame body 280 may be made entirely of copper (Cu) material, as shown in Figure 4, regardless of the functional division between the evaporation section and the condensation section described above. Furthermore, while copper material is used for the evaporation section side where a higher thermal conductivity is required (for example, see "one long side 280L-1" in Figure 4), the remaining condensation section side (for example, see "other long side 280L-2, one short side 280S-1, and other short side 280S-2" in Figure 4) may be made of SUS material, which is the material of the one-side heat conduction panel 200A and the other-side heat conduction panel 200B.

[0081] However, the two intermediary frame bodies 280, which are manufactured separately from two different materials, can be joined together by butt welding at their boundary points to form a single unit. Alternatively, they may be laminated and joined to the respective parts of the heat conduction panel 200A on one side and the heat conduction panel 200B on the other side without any further joining.

[0082] In the following explanation, the long side 280L-1 of the joining mediating frame body 280 and the corresponding parts of the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B are defined as the evaporation section, which receives heat from the heat-generating element, and the remaining parts are defined as the condensation section.

[0083] On the other hand, as shown in Figures 3A to 3D, at least one end of each of the multiple condensation sintered body columns 250 can be directly connected to the bonding mediation frame body 280 without the need for another bonding mediation component such as the evaporation sintered body base 255 described later.

[0084] Here, one end of the bonding mediating frame body 280 and the multiple condensation sintered column 250 is located approximately downward with respect to the direction of gravity, and can be defined as the end of the long side 280L-1 corresponding to the evaporation section described above.

[0085] Conversely, the other end of the bonding mediating frame body 280 and the multiple condensation sintered column 250 is located approximately above the direction of gravity and can be defined as the end (edge) of the other long side 280L-2, which corresponds to the condensation portion described above.

[0086] In a heat dissipation device 200 according to one embodiment of the present invention, the plurality of condensation section sintered body columns 250 may have one end connected to the bonding mediating frame body 280 via an evaporation section sintered body base 255, as shown in Figures 3A and 3C, or one end may be directly connected to the bonding mediating frame body 280, as shown in Figures 3B and 3D.

[0087] As already explained, the multiple condensation section sintered column 250 and the evaporation section sintered base 255 may be formed by sintering SUS material powder.

[0088] Thus, the multiple condensation section sintered body columns 250 and evaporation section sintered body bases 255, formed by sintering a predetermined metal powder, can absorb and disperse liquid-phase refrigerant through numerous pores naturally formed during sintering, via surface tension or capillary force.

[0089] Here, the multiple condensation section sintered column 250 plays a role in guiding the flow so that when the gaseous refrigerant condenses into a liquid phase refrigerant through heat exchange with the outside air (outside air) in the condensation section, and the liquid phase refrigerant that has condensed relatively downward in the direction of gravity flows down to the evaporation section, the liquid phase refrigerant flows down in an evenly distributed manner without being biased.

[0090] In addition, the sintered evaporation base 255 can play a role in actively inducing a phase change (evaporation) of the liquid-phase refrigerant absorbed through the numerous pores formed therein into a gaseous-phase refrigerant by the heat supplied from the heating element.

[0091] Furthermore, the connecting mediating frame body 280 may have air vent holes 285 through which air vent tubes 290 are connected.

[0092] The air vent hole 285 can be formed in communication with a refrigerant flow space 205 whose boundary is defined by the one-sided heat conduction panel 200A, the other-sided heat conduction panel 200B, and the joining mediating frame body 280.

[0093] On the other hand, the one-sided heat conduction panel 200A, the other-sided heat conduction panel 200B, and the joining mediating frame body 280 can be laminated and joined by welding. The welding method here can include not only general welding but also laser welding.

[0094] However, the method of joining the one-sided heat conduction panel 200A, the other-sided heat conduction panel 200B, and the joining mediating frame body 280 is not limited to the welding method described above, nor is the method of lamination joining by brazing excluded.

[0095] As described above, the heat dissipation device 200 according to one embodiment of the present invention can be realized in various modified forms depending on whether or not the evaporation section sintered body base 255 is provided and the method of connecting the condensation section sintered body column 250 to the bonding mediation frame body 280, as shown in Figures 3A to 3D.

[0096] In other words, the heat dissipation device 200 according to one embodiment of the present invention may include first implementation example 200-1 and third implementation example 200-3, which are realized in a form in which the lower ends of each of the multiple condensation sintered body columns 250 corresponding to the lower side with respect to the direction of gravity are connected, and an evaporation sintered body base 255 is connected to the inner end of a joining mediating frame body 280 located at the end of the edge of one-side heat conduction panel 200A and the other-side heat conduction panel 200B corresponding to the lower side with respect to the direction of gravity.

[0097] Conversely, the heat dissipation device 200 according to one embodiment of the present invention may include a second implementation example 200-2 and a fourth implementation example 200-4, in which, as shown in Figures 3B and 3D, the lower ends of each of the multiple condensing section sintered body columns 250 are directly connected to the inner ends of a bonding mediating frame body 280 located at the lower ends of the edges of the one-side heat conduction panel 200A and the other-side heat conduction panel 200B with respect to the direction of gravity, without the intervening of the evaporation section sintered body base 255.

[0098] Furthermore, the heat dissipation device 200 according to one embodiment of the present invention may include first implementation example 200-1 and second implementation example 200-2, in which the upper ends of each of the multiple condensed sintered body columns 250 are directly connected to the upper end of the edge of one-side heat conduction panel 200A and the other-side heat conduction panel 200B, with reference to the direction of gravity.

[0099] Conversely, a heat dissipation device 200 according to one embodiment of the present invention may include a third implementation example 200-3 and a fourth implementation example 200-4, in which the upper ends of each of the multiple condensed sintered body columns 250 are separated from the edges of the one-side heat conduction panel 200A and the other-side heat conduction panel 200B, with respect to the direction of gravity, and are not connected to them.

[0100] On the other hand, in the heat dissipation device 200 according to one embodiment of the present invention, a plurality of support protrusions 251 can be integrally formed on the condensation sintered column 250 of all realization examples 200-1 to 200-4, respectively, so as to be supported on the inner surface of one heat conduction panel 200A and the inner surface of the other heat conduction panel 200B.

[0101] More specifically, the condensation section sintered column 250 is sintered into a square bar shape having four faces, but one of the faces (hereinafter referred to as the "first face") is supported or fixed so as to be in contact with the inner surface of either the one-side heat conduction panel 200A or the other-side heat conduction panel 200B (hereinafter, assuming the "one-side heat conduction panel 200A"), and the tip surfaces of the multiple support protrusions 251 may be formed on the face of the condensation section sintered column 250 facing the first face (hereinafter referred to as the "second face") and supported or fixed so as to be in contact with the inner surface of the other-side heat conduction panel 200B.

[0102] Such a condensed sintered column 250 has its first surface supported on the inner surface of one-side heat conduction panel 200A, and the tip surfaces of a plurality of support protrusions 251 formed on the second surface are supported on the inner surface of the other-side heat conduction panel 200B. This not only reinforces the rigidity of the one-side heat conduction panel 200A and the other-side heat conduction panel 200B, which are formed to a relatively thin thickness (0.15T), but also prevents the one-side heat conduction panel 200A and the other-side heat conduction panel 200B from fluctuating (or flowing) due to changes in the internal pressure of the refrigerant flow space 205 during the phase change of the refrigerant. This prevents the energy involved in the phase change of the refrigerant from being converted into physical energy unrelated to heat dissipation, thereby improving heat dissipation performance.

[0103] Furthermore, the smooth flow of gaseous or liquid refrigerant through the spaces between the multiple support protrusions 251 ensures that the gas-liquid circulation is not biased to one side but rather evenly and uniformly dispersed.

[0104] Figure 7 is a perspective view showing a heat dissipation device according to another embodiment of the present invention, Figure 8 is an exploded perspective view of Figure 7, and Figure 9 is an exploded perspective view showing a modified example of the heat dissipation device according to another embodiment of the present invention.

[0105] Another embodiment of the present invention, a heat dissipation device 200-5, as shown in Figures 7 to 9, includes a one-sided heat conduction panel 200A, which is provided by sheet metal processing in a press die process as a metal panel member having a predetermined or higher thermal conductivity; a other-sided heat conduction panel 200B, which is provided by sheet metal processing in a press die process as the same metal panel member as the one-sided heat conduction panel 200A, forming a refrigerant flow space 205 between it and the one-sided heat conduction panel 200A where the refrigerant undergoes a phase change and flows; and a bonding mediating frame body 280, which is arranged along the edges of the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B to mediate surface bonding lamination.

[0106] Herein, the heat dissipation device 200-5 according to another embodiment of the present invention may consist of components that perform the same function as the heat dissipation device 200 according to one embodiment of the present invention, which has already been described with reference to Figures 1 to 6, except for the configuration of the multiple strength reinforcing parts 230 and column support protrusions 235 which will be described later.

[0107] More specifically, in another embodiment of the present invention, the heat dissipation device 200-5 also has a refrigerant flow space 205 formed between one heat conduction panel 200A and the other heat conduction panel 200B, where the refrigerant undergoes a phase change and flows. The edges of the one heat conduction panel 200A and the other heat conduction panel 200B are joined together by a joining mediating frame body 280 so as to be mutually stacked, thereby shielding the refrigerant flow space 205.

[0108] Furthermore, the connecting mediating frame body 280 may be additionally provided with an air vent tube 290 for vacuuming the refrigerant flow space 205 or for filling the refrigerant.

[0109] Therefore, in describing the heat dissipation device 200-5 according to another embodiment of the present invention, we will focus on the differences between it and the heat dissipation device 200 according to one embodiment of the present invention described earlier.

[0110] In another embodiment of the present invention, the heat dissipation device 200-5 may have, as shown in Figures 7 to 9, a plurality of strength reinforcing parts 230 formed during the press die process so as to be recessed into the refrigerant flow space 205 side on one heat conduction panel 200A and the other heat conduction panel 200B, and column support protrusions 235 for supporting the installation of the condensation sintered body column 250.

[0111] Here, the column support protrusions 235 are designed to be spaced apart by the width of a pair of approximately condensed sintered body columns 250, and when the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B are joined together, they simultaneously support both ends of the condensed sintered body column 250 in the width direction on both sides inside the refrigerant flow space 205, thereby playing a role in stably supporting the condensed sintered body column 250, which is a somewhat fragile sintered body.

[0112] On the other hand, the multiple strength-reinforcing sections 230 not only serve to reinforce the strength of the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B, which are formed to be very thin, but also allow the parts that come into contact with each other in the refrigerant flow space 205 to be joined by welding, thereby enabling them to actively respond to changes in internal pressure that occur during phase changes of the refrigerant.

[0113] Here too, the bonding mediating frame body 280 is formed to correspond to the outer shapes of the one-side heat conduction panel 200A and the other-side heat conduction panel 200B, and it goes without saying that when the multiple condensation section sintered body columns 250 are arranged vertically with respect to the direction of gravity, the evaporation section sintered body base 255 can be positioned relatively lower with respect to the direction of gravity.

[0114] However, while the realization examples 200-1 to 200-4 of the heat dissipation device 200 according to one embodiment of the present invention described above are formed in a rectangular shape, and one long side corresponding to its long side 280L-1 serves as an evaporation section that is closely connected to the heat-generating element, in the case of the heat dissipation device 200-5 according to another embodiment of the present invention, only a part of the edge of the evaporation section 201 corresponds to the part that is substantially connected to the heat-generating element (not shown) that receives heat, and the remaining part has been redesigned to function as a condensation section 203.

[0115] More specifically, in a heat dissipation device 200-5 according to another embodiment of the present invention, if the dotted line represented by reference numeral 205C in Figure 7 is used as a reference and the lower part corresponds to an evaporation section 201 where the refrigerant is stored in a liquid phase form, then the portion excluding the evaporation section 201 is a part where the gaseous refrigerant is dispersed and flows, or where the condensed liquid phase refrigerant flows down in the direction of gravity, and can function as a condensation section 203.

[0116] Here, it is preferable that the evaporation section sintered body base 255 is formed only on the evaporation section 201 side. However, in the heat dissipation device 200-5 according to another embodiment of the present invention, a first additional sintered body base 255-1 may be provided, which extends additionally to the end of the condensation section 203 that is located relatively lower with respect to the direction of gravity and corresponds to the upper side of the evaporation section 201, and a second additional sintered body base 255-2 may be provided, which extends additionally to the end of the condensation section 203 that corresponds to the lower side of the evaporation section 201.

[0117] Since the first additional base 255-1 of the sintered body is located relatively above the evaporation section 201, it plays a role in smoothly supplying the liquid phase refrigerant, whose flow is guided in the direction of gravity through the multiple condensation section sintered body columns 250, to the evaporation section sintered body base 255 on the evaporation section 201 side.

[0118] In contrast, the second additional base 255-2 of the sintered body is formed to extend and come into contact with the evaporation section sintered body base 255, which performs its original function. This allows the sintered base 255-2 to indirectly expand the area of ​​the evaporation section 201, which has a relatively small heat transfer area for heat generated from the heating element.

[0119] Thus, according to the heat dissipation devices 200 and 200-5 of the present invention, the productivity of the product can be greatly improved by manufacturing a device that allows for the mutual joining of two metal base material panels, one heat conduction panel 200A and the other heat conduction panel 200B, which are made of stainless steel (SUS), a metal material that has slightly lower thermal conductivity and is less expensive than aluminum (Al), and by enabling the flow of refrigerant due to phase change in the refrigerant flow space 205 provided between them.

[0120] Furthermore, because the thickness of the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B can be minimized during manufacturing, the heat generated from the heat source can be quickly received, enabling active gas-liquid circulation through heat exchange with the outside air, thus offering the advantage of significantly improving heat dissipation performance.

[0121] In addition, the heat dissipation devices 200 and 200-5 according to the embodiments of the present invention can prevent injury to workers by rounding the sharp metal parts that are generated along the edges of the one-sided heat conduction panel 200A and the other-sided heat conduction panel 200B, which are made of metal, using the joining mediating frame body 280.

[0122] The heat dissipation devices according to embodiments of the present invention have been described in detail above with reference to the attached drawings. However, the embodiments of the present invention are not necessarily limited to the embodiments described above, and it goes without saying that various modifications and equivalent implementations are possible by persons with ordinary skill in the art to which the present invention pertains. Therefore, the true scope of the rights of the present invention is determined by the claims described later. [Industrial applicability]

[0123] This invention provides a heat dissipation device that maximizes heat dissipation performance and improves productivity. [Explanation of symbols]

[0124] 200: Heat dissipation device, 200A: Single-sided heat conduction panel 200B: Other side heat conduction panel, 201: Evaporation section 203: Condensing section, 205: Refrigerant flow space 230: Strength reinforcement section, 235: Column support protrusion 250: Condensation section sintered column, 255: Evaporation section sintered base 280: Joint mediating frame body, 285: Air vent hole 290: Air vent tube

Claims

1. A one-sided heat conduction panel made of a metal panel member, A refrigerant flow space is formed between the one-side heat conduction panel and the other-side heat conduction panel, which is provided with a metal panel member, A heat dissipation device comprising a joining mediating frame body provided to mediate the joining of the edges of one heat conduction panel and the other heat conduction panel.

2. The heat dissipation device according to claim 1, wherein the joining mediating frame body shields the refrigerant flow space formed between the one-side heat conduction panel and the other-side heat conduction panel.

3. The heat dissipation device according to claim 1, wherein the heat conduction panel on one side and the heat conduction panel on the other side are made of the same metal material having a predetermined or higher thermal conductivity.

4. The heat dissipation device according to claim 1, wherein the bonding mediating frame body mediates the bonding and lamination of surfaces along the edges of the one-side heat conduction panel and the other-side heat conduction panel.

5. The heat dissipation device according to claim 1, wherein the bonding mediating frame body is disposed between the one-side heat conduction panel and the other-side heat conduction panel, and provides a predetermined bonding surface to the inner surface of the edge of the one-side heat conduction panel and the inner surface of the edge of the other-side heat conduction panel.

6. The heat dissipation device according to claim 1, wherein the connecting mediating frame body has a square pipe cross-section made of copper (Cu) material.

7. The first surface of the square pipe cross-section of the joining mediating frame body is surface-joined with the inner surface of the edge of the one-sided heat conduction panel. The heat dissipation device according to claim 6, wherein the second surface of the square pipe cross-section of the joining mediating frame body that is opposite the first surface is joined to the inner surface of the edge of the other side heat conduction panel.

8. When the evaporation section is defined as the part of the refrigerant flow space that is located relatively below the direction of gravity and is relatively close to the heating element, which is the source of the heat supply and where the liquid phase of the refrigerant is stored, The heat dissipation device according to claim 1, wherein the joining mediating frame body has a first frame installed in close proximity to the evaporation section and a second frame provided in a part other than the evaporation section, and these materials are different.

9. The first frame is formed to have a square pipe cross-section made of copper (Cu) material, The heat dissipation device according to claim 8, wherein the second frame is formed to have a square pipe cross-section made of SUS material.

10. The heat dissipation device according to claim 1, further comprising a plurality of condensation sintered body columns arranged in the refrigerant flow space and connected to the bonding mediation frame body.

11. The heat dissipation device according to claim 10, wherein the plurality of condensation section sintered body columns are connected to the bonding mediating frame body via an evaporation section sintered body base that connects one end of each column.

12. The heat dissipation device according to claim 11, wherein the plurality of condensate sintered body columns are arranged in a straight line, but the lower end corresponding to one end is located relatively lower than the upper end with respect to the direction of gravity.

13. The heat dissipation device according to claim 10, wherein one end of the plurality of condensed sintered body columns is connected to the inside of the bonding mediation frame body which is located relatively below with respect to the direction of gravity.

14. The heat dissipation device according to claim 13, wherein the other ends of the plurality of condensed sintered body columns are connected to the inside of the bonding mediation frame body which is located relatively above with respect to the direction of gravity.

15. The heat dissipation device according to claim 13, wherein the other ends of the plurality of condensed sintered body columns are separated by a predetermined distance from the bonding mediation frame body which is located relatively above with respect to the direction of gravity.

16. The heat dissipation device according to claim 3, wherein the heat conduction panel on one side and the heat conduction panel on the other side are provided with metal panel members made of SUS material.

17. The heat dissipation device according to claim 10, wherein the plurality of condensing section sintered body columns and evaporation section sintered body bases are formed by sintering SUS material powder.

18. The heat dissipation device according to claim 1, wherein the connecting mediating frame body has an air vent hole formed therein, to which an air vent tube for vacuuming the refrigerant flow space or for filling the refrigerant is connected.

19. The heat dissipation device according to claim 18, wherein the air vent hole is formed in communication with the refrigerant flow space.

20. The heat dissipation device according to claim 1, wherein the one-side heat conduction panel, the other-side heat conduction panel, and the joining mediating frame body are laminated and joined by laser welding.

21. The heat dissipation device according to claim 1, wherein the one-side heat conduction panel, the other-side heat conduction panel, and the joining mediating frame body are laminated and joined by a brazing welding method.

22. The heat dissipation device according to claim 10, wherein the plurality of condensation sintered body columns are formed with a plurality of support protrusions that project outwards and are supported on the inner surface of the one-side heat conduction panel or the other-side heat conduction panel within the refrigerant flow space.

23. The heat dissipation device according to claim 22, wherein the tip surfaces of the plurality of support protrusions are in contact with the inner surface of the one-side heat conduction panel or the other-side heat conduction panel.

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