Local absorption cover glass

JP2026534197APending Publication Date: 2026-10-14APPLIED MATERIALS INC
View PDF 0 Cites 0 Cited by

Patent Information

Application Number
JP2026517522
Authority / Receiving Office
JP · JP
Patent Type
Applications
Current Assignee / Owner
Priority Date
2023-09-25
Filing Date
2024-09-24
Publication Date
2026-10-14

Smart Images

  • Figure 2026534197000001_ABST
    Figure 2026534197000001_ABST
Patent Text Reader

Abstract

This disclosure provides a waveguide combiner. The waveguide combiner includes a substrate having a top surface. The waveguide combiner includes a plurality of structures disposed on the top surface. The waveguide combiner includes a cover glass disposed on the top surface. The cover glass includes an absorption region and a transparent region. The absorption region includes an absorption material.
Need to check novelty before this filing date? Find Prior Art

Description

[Technical Field]

[0001]

[0001] Embodiments of the present disclosure relate more broadly to waveguide combiners for augmented reality, mixed reality, and virtual reality. [Background technology]

[0002]

[0002] Virtual reality is generally considered to be a computer-generated simulated environment in which the user has an apparent physical presence. Virtual reality experiences are generated in 3D and can be viewed with a head-mounted display (HMD) (for example, glasses or other wearable display devices having a near-eye display panel as a lens for displaying a virtual reality environment that replaces the actual environment).

[0003]

[0003] However, augmented reality allows users to still see their surroundings through the display lenses of glasses or other HMD devices, but also to see images of virtual objects that are generated for display and appear as part of the environment. Augmented reality may include any type of input, such as voice input or haptic input, as well as virtual images, graphics, and videos that enhance or extend the environment experienced by the user. As a newly emerging technology, augmented reality faces many challenges and design constraints.

[0004]

[0004] One of these challenges is to display a virtual image so that it is overlaid on the surrounding environment. Waveguide combiners, such as augmented reality waveguide combiners, are used to assist in overlaying images. The generated light propagates through the waveguide combiner until the light exits the waveguide combiner and is overlaid on the surrounding environment. Unfortunately, waveguide combiners incorporate both grid and non-grid regions, which are visually distinct.

[0005]

[0005] Accordingly, there is a need for an improved waveguide combiner whose regions are not distinguishable in appearance.

Summary of the Invention

[0006]

[0006] The present disclosure provides a waveguide combiner. The waveguide combiner includes a substrate having an upper surface. The waveguide combiner includes a plurality of structures disposed on the upper surface. The waveguide combiner includes a cover glass disposed on the upper surface. The cover glass includes an absorption region and a transparent region. The absorption region includes an absorbing material.

[0007]

[0007] The present disclosure also provides a waveguide combiner. The waveguide combiner includes a substrate having an upper surface. The waveguide combiner includes a plurality of structures disposed on the upper surface. The plurality of structures includes a first grating, a second grating, and a third grating. The waveguide combiner includes a cover glass disposed on the upper surface. The cover glass includes an absorption region and a transparent region. The absorption region includes an absorbing material.

[0008]

[0008] The present disclosure also provides a method of forming a waveguide combiner. The method includes disposing a plurality of structures on a substrate having an upper surface. A cover glass is disposed on the upper surface of the substrate. The cover glass includes an absorption region and a transparent region. The transparent region is disposed over each structure of the plurality of structures. The cover glass and the substrate are bonded using an edge material.

[0009]

[0009] So that the above features of the present disclosure can be understood in detail, a more specific description of the present disclosure, briefly summarized above, may be had by reference to embodiments, some of which are illustrated in the accompanying drawings. It is to be noted, however, that the accompanying drawings illustrate only exemplary embodiments and are therefore not to be considered limiting of the scope of the present disclosure, as other equally effective embodiments may be permitted.

Brief Description of the Drawings

[0010] [Figure 1]

[0010] Figure is a perspective front view of a waveguide combiner in accordance with a plurality of embodiments described in the present specification. [Figure 2]

[0011] Figure is a perspective front view of a cover glass in accordance with a plurality of embodiments described in the present specification. [Figure 3A]

[0012] Figure is a perspective front view of a waveguide combiner having a locally absorbing cover glass disposed on the top surface of a substrate in accordance with a plurality of embodiments described in the present specification. [Figure 3B]

[0013] Figure is a cross-sectional view of a waveguide combiner having a locally absorbing cover glass disposed on the top surface of a substrate in accordance with a plurality of embodiments described in the present specification. [Figure 4]

[0014] Figure is a flow diagram of a method for forming a waveguide combiner in accordance with certain specific embodiments. [Figure 5A]

[0015] Figure is a schematic cross-sectional view of a portion of a substrate during a method for forming a waveguide combiner in accordance with certain specific embodiments. [Figure 5B] Figure is a schematic cross-sectional view of a portion of a substrate during a method for forming a waveguide combiner in accordance with certain specific embodiments. [Figure 5C] Figure is a schematic cross-sectional view of a portion of a substrate during a method for forming a waveguide combiner in accordance with certain specific embodiments.

Detailed Description of the Embodiments

[0011]

[0016] For ease of understanding, identical reference numerals have been used, where possible, to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation.

[0012]

[0017] Multiple embodiments of this disclosure relate, generally, to film stacks for electronic devices and to methods for forming them. Film stacks described herein may have superior device performance compared to the prior art. Multiple methods described herein are reproducible and can produce a uniform passivation layer with reduced impedance. Furthermore, multiple embodiments described herein may enable streamlined material handling and integration, as well as a longer shelf life for passivated film stacks (passivated film rolls) than the prior art.

[0013]

[0018] Figure 1 shows a perspective front view of the waveguide combiner 100. It should be understood that the waveguide combiner 100 described below is an exemplary waveguide combiner. The waveguide combiner 100 may be an augmented reality waveguide combiner. The waveguide combiner 100 includes a plurality of device structures 102 disposed within or on a substrate 101.

[0014]

[0019] The substrate 101 can be any substrate used in the art and may be opaque or transparent to a selected wavelength of light, depending on the application of the substrate 101 (as a waveguide substrate). The substrate options may include, but are not limited to, any suitable material substrates, including amorphous dielectrics, non-amorphous dielectrics, crystalline dielectrics, polymers, or combinations thereof. In some embodiments, the substrate 101 includes, but is not limited to, silicon-containing materials, silicon and oxygen-containing compounds, germanium-containing materials, indium and phosphorus-containing compounds, gallium and arsenic-containing compounds, gallium and nitrogen-containing compounds, carbon-containing materials, silicon and carbon-containing compounds, silicon and carbon and oxygen-containing compounds, silicon and nitrogen-containing compounds, silicon and oxygen and nitrogen-containing compounds, niobium and oxygen-containing compounds, lithium and niobium and oxygen-containing compounds, aluminum and oxygen-containing compounds, indium and tin and oxygen-containing compounds, titanium and oxygen-containing compounds, lanthanum and oxygen-containing compounds, gadolinium and oxygen-containing compounds, zinc and oxygen-containing compounds, yttrium and oxygen-containing compounds, tungsten and oxygen-containing compounds, potassium and oxygen-containing compounds, phosphorus and oxygen-containing compounds, barium and oxygen-containing compounds, sodium and oxygen-containing compounds, or combinations thereof. In some other embodiments that may be combined with other embodiments described herein, the substrate 101 comprises an oxide containing one or more of the following materials: gadolinium, silicon, sodium, barium, potassium, tungsten, phosphorus, zinc, calcium, titanium, tantalum, niobium, lanthanum, zirconium, lithium, or yttrium.Exemplary materials of the substrate 101 include silicon (Si), silicon monoxide (SiO), silicon dioxide (SiO2), silicon carbide (SiC), fused silica, diamond, quartz germanium (Ge), silicon germanium (SiGe), indium phosphide (InP), gallium arsenide (GaAs), gallium nitride (GaN), sapphire, sapphire (Al2O3), lithium niobate (LiNbO3), and indium tin oxide (I This includes lanthanum oxide (La2O3), gadolinium oxide (Gd2O5), zinc oxide (ZnO), yttrium oxide (Y2O3), tungsten oxide (WO3), titanium oxide (TiO2), zirconium oxide (ZrO3), sodium oxide (Na2O), niobium oxide (Nb2O5), barium oxide (BaO), potassium oxide (K2O), phosphorus pentoxide (P2O5), calcium oxide (CaO), or combinations thereof.

[0015]

[0020] Substrate 101 has a substrate transmittance (T NG ) has. Substrate transmittance (T NG ) represents the amount of light passing through the substrate 101. The substrate 101 has a substrate reflectance (R NG ) has. Substrate reflectance (R NG ) represents the amount of light reflected by the outer surface of the substrate 101. The sum of the substrate transmittance and substrate reflectance is 1, for example, T NG +R NG = 1. The substrate 101 can be selected to transmit a suitable amount of light of a desired wavelength or wavelength range. For example, T NG R NG It is greater than . In one embodiment, the wavelength range includes one or more wavelengths from about 100 to about 3000 nanometers. In some embodiments, the substrate 101 is configured to transmit about 50% to about 100% of the infrared to ultraviolet region of the light spectrum. The substrate 101 may have a refractive index greater than about 1.8. For example, the substrate may include silicon carbide, lithium niobate, and glass having a refractive index greater than 1.8.

[0016]

[0021] The device structure 102 is formed from a structural material formed on and / or covering the substrate 101. The structural material and the substrate 101 include different materials. The structural material includes, without limitation, one or more oxides, carbides, or nitrides of silicon, aluminum, zirconium, tin, tantalum, zirconium, barium, titanium, hafnium, lithium, lanthanum, cadmium, niobium, or combinations thereof. A plurality of exemplary materials of the structural material include silicon carbide, silicon oxycarbide, titanium oxide, silicon oxide, vanadium oxide, aluminum oxide, aluminum-doped zinc oxide, indium tin oxide, tin oxide, zinc oxide, tantalum oxide, silicon nitride, zirconium oxide, niobium oxide, cadmium stannate, silicon oxynitride, barium titanate, diamond-like carbon, hafnium oxide, lithium niobate, silicon carbonitride, silver, cadmium selenide, mercury telluride, zinc selenide, silver-indium-gallium-sulfur-based compounds, silver-indium-sulfur-based compounds, indium phosphide, gallium phosphide, lead sulfide, lead selenide, zinc sulfide, molybdenum sulfide, tungsten sulfide, or combinations thereof.

[0017]

[0022] The device structure 102 may be a nanostructure having sub-micron dimensions, for example, nanoscale dimensions such as critical dimensions of less than 1 μm. Regions of the device structure 102 may correspond to one or more gratings 104, such as the first grating 104a, the second grating 104b, and the third grating 104c. The waveguide combiner 100 at least includes the first grating 104a corresponding to the input coupling grating and the third grating 104c corresponding to the output coupling grating. The waveguide combiner may include the second grating 104b corresponding to the intermediate grating.

[0018]

[0023] The device structure 102 has a structural transmittance (T G ). The structural transmittance (T G ) represents the amount of light passing through the device structure 102. The device structure 102 has a structural reflectance (R G ). The structural reflectance (R G) represents the amount of light reflected by the outer surface of structure 102. Device structure 102 has at least diffraction order (D G,n ) has such that n is any non-zero integer. The diffraction order represents the amount of light that enters the outer surface of the device structure 102 and diffracts into the interior of the device structure 102. The sum of the structural transmittance, structural reflectance, and diffraction order is 1, for example, T G +R G +D G,n = 1. In one embodiment, the device structure has a first diffraction order (D G,+1 ) and the second diffraction order (D G,-1 ) includes, here, T G +R G +D G,+1 +D G,-1 = 1

[0019]

[0024] During the operation of the waveguide combiner 100, a virtual image is projected onto the first grating 104a from a near-eye display such as a microdisplay. The device structure 102 of the first grating 104a incidentally combines the incident beam of light of the virtual image and diffracts the incident beam to the diffraction order D G,n The beam is diffracted by the second grating 104b. The diffracted beam undergoes total internal reflection (TIR) ​​as it passes through the waveguide combiner 100 until the diffracted beam contacts the device structure 102 of the second diffraction grating 104b. In one embodiment, the diffracted beam is diffracted at diffraction order D to generate a first portion of the beam, a second portion of the beam, and a third portion of the beam. G,nThe beam may be divided accordingly. The first portion of the beam is refracted back or lost in the waveguide combiner 100. The second portion of the beam may come into contact with the structure of the device structure 102, including the second grating 104b. The third portion of the beam may come into contact with the structure of the device structure 102, including the third grating 104c. Each portion of the beam, for example, the first portion of the beam, the second portion of the beam, or the third portion of the beam, may continue to come into contact with the structure of the device structure 102 until the intensity of the beam refracted through the waveguide combiner 100 to the device structure 102 is exhausted, or until the portion of the beam refracted through the device structure 102 reaches the end of the second grating 104b or the third grating 104c. The beam of the virtual image propagates from the second grating 104b or the third grating 104c to overlay the virtual image onto the surrounding environment.

[0020]

[0025] Figure 2 shows a perspective front view of the cover glass 200. It should be understood that the cover glass 200 described below is an illustrative cover glass. The cover glass 200 may include any protective material that protects the substrate 101. For example, the cover glass 200 may include amorphous dielectrics, non-amorphous dielectrics, crystalline dielectrics, silicon oxide, polymers, and combinations thereof. The cover glass 200 is a transparent material. In some embodiments, the cover glass 200 is transparent with an absorption coefficient of less than 0.001. Several suitable examples of the cover glass 200 may include silicon (Si), silicon dioxide (SiO2), fused silica, quartz, silicon carbide (SiC), germanium (Ge), silicon germanium (SiGe), indium phosphide (InP), gallium arsenide (GaAs), gallium nitride (GaN), sapphire, or combinations thereof.

[0021]

[0026] The cover glass 200 includes a plurality of transparent regions 202. Each of the transparent regions is placed on the corresponding device structure. Each transparent region has a region transmittance (T C ) includes. Regional transmittance (T C) represents the amount of light passing through the transparent region of the cover glass that overlaps each of the multiple device structures. In one embodiment, the cover glass 200 includes a first transparent region 202a, a second transparent region 202b, and a third transparent region 202c. The first transparent region 202a may correspond to a first grid 104a. The second transparent region 202b may correspond to a second grid 104b. The third transparent region 202c may correspond to a third grid 104c.

[0022]

[0027] The cover glass 200 includes an absorption region 204. The absorption region 204 has an absorption transmittance (T A ) represents the absorption transmittance (T A ) represents the amount of light passing through the absorption region 204 of the cover glass that does not overlap with the device structure of the waveguide combiner 100. In one embodiment, the absorption transmittance (T A ) is the area transmittance (T C The value may be lower than the transmission region, indicating that less light passes through the absorption region than through the transmission region. The absorption region 204 of the cover glass does not overlap with the device structure of the waveguide combiner 100. For example, the absorption region 204 may be oriented and / or shaped to complement the waveguide grating regions, e.g., a first grating 104a, a second grating 104b, and / or a third grating 104c.

[0023]

[0028] The absorption region 204 includes an absorbing material. The absorbing material may include a polymer matrix of one or more types of particles, at least one of one or more dyes or one or more pigments, and one or more binders coated on or embedded within the absorption region 204. In some embodiments, the absorbing material includes at least one metal film. The at least one metal film may include a stack of metal films. The one or more metal films include, but are not limited to, chromium-containing films and titanium-containing films. The one or more metal films may be configured to absorb light of one or more wavelengths within the absorption region 204. In some embodiments, the absorbing material may include one or more filler dispersions, one or more photoinitiators, one or more epoxy resins, one or more additives, one or more silanes, one or more isocyanates, one or more acids, one or more phosphine oxides, or a combination thereof. Several examples of filler dispersions include acrylates or methacrylates. Several examples of additives include amines or amides. Several examples of dyes include organic dyes. One or more pigments include, but are not limited to, carbon black, carbon nanotubes, iron oxide black, black pigments, or combinations thereof. One or more binders are operable to be cured by radiation to form a polymer matrix. One or more types of particles are arranged within the polymer matrix. One or more binders include, but are not limited to, UV-curable binders, LED-curable binders, thermosetting binders, infrared-curable binders, or combinations thereof.

[0024]

[0029] One or more types of particles include, but are not limited to, titanium, titanium oxide (TiO2), chromium, Si, zirconium oxide (ZrO2), zinc oxide (ZnO), iron(II,III) oxide (Fe3O4), germanium (Ge), SiC, diamond, dopants thereof, or any combination thereof. One or more types of particles include at least one of nanoparticles or fine particles. Each nanoparticle (NP) or fine particle (MP) may be a coated particle, such as one, two, or more shells arranged around a core. In some embodiments, an NP or MP may contain one or more types of ligands. These ligands are bound to the outer surface of the NP or MP (e.g., coordinated NP or stabilized NP). The NP or MP may have one or more different shapes or morphological dimensions, such as spherical, oval, rod-shaped, cubic, wire-shaped, cylindrical, rectangular, or a combination thereof. The NP may have a size or diameter ranging from about 2 nm to about 200 nm.

[0025]

[0030] The particle refractive index of one or more types of particles is greater than 2.0. In some embodiments, which may be combined with several other embodiments described herein, the particle refractive index of one or more types of particles is about 2.4 or greater. A particle refractive index greater than 2.0 provides an absorption region having a refractive index of about 1.7 or greater. The optical density of the absorption region of about 2.0 or greater is provided by at least one of one or more dyes or one or more pigments. A refractive index of about 1.7 or greater in the absorption region 204 is adapted to a high refractive index substrate, i.e., a substrate 101 having a refractive index greater than about 1.8.

[0026]

[0031] Figure 3A is a perspective front view of a waveguide combiner 300 having an absorbing cover glass 200 disposed on the upper surface of a substrate 101, according to several embodiments described herein. In some embodiments, the absorbing glass 200 is disposed on the upper surface of the substrate 101. The waveguide combiner 300 has a uniform appearance due to the fact that the transmittance and reflectance of the areas of the waveguide combiner 100 having the device structure 102 and the areas without the device structure 102 are the same or similar. By superimposing the cover glass 200 on the waveguide combiner 100, the device structure 102 on the waveguide combiner 100 has the same appearance as the areas of the waveguide combiner 100 without the device structure 102, or an appearance with an error of about 0.1% to about 2%, for example, about 0.1% to about 1%, about 0.5% to about 1.5%, or about 1% to about 2%.

[0027]

[0032] In one embodiment, the waveguide combiner 300 can achieve a uniform appearance. In that case, as shown by Equation 1, the value obtained by multiplying the substrate transmittance by the absorption transmittance is equal to the value obtained by multiplying the structural transmittance by the regional transmittance. That is, T NG × T A = T G × T C Formula 1

[0028]

[0033] Furthermore, the waveguide combiner 300 can achieve a uniform appearance. In that case, as shown by Equation 2, the reflectance of the absorption region 204 (R A The value obtained by adding ) to the structural reflectance is the reflectance of the transparent region 202 (R C It is equal to the value obtained by adding ) to . That is, R NG + R A = R G + R C Formula 2

[0029]

[0034] Furthermore, the waveguide combiner 300 can achieve a uniform appearance. In that case, the absorption rate of the absorption region 204 (A) is expressed by equation 3. A) is equal to the value obtained by subtracting the structural reflectance from the value obtained by subtracting the structural transmittance from 1. That is, A A = 1 - T G - R G Formula 3

[0030]

[0035] Figure 3B is a cross-sectional view of a waveguide combiner 300 having a local absorption cover glass 200 positioned on the upper surface of a substrate 101. In some embodiments, the waveguide combiner 300 may include a cover glass 200. The cover glass 200 includes an absorption region 302 and a transparent region 303 corresponding to the device structure 102 of the waveguide combiner 300. In some embodiments, which can be combined with several other embodiments, an edge material 305 may be included. The edge material 305 may include an inner surface 306 having an adhesive material. The adhesive material may include a polymer adhesive, epoxy, acrylate, or a combination thereof. The inner surface 306 of the edge material 305 may be bonded to a side surface 307 of the substrate 101 and to a side surface 308 of the cover glass 200.

[0031]

[0036] The edge material 305 includes silicon-containing materials, silicon and oxygen-containing compounds, germanium-containing materials, indium and phosphorus-containing compounds, gallium and arsenic-containing compounds, gallium and nitrogen-containing compounds, carbon-containing materials, silicon and carbon-containing compounds, silicon and carbon and oxygen-containing compounds, silicon and nitrogen-containing compounds, silicon and oxygen and nitrogen-containing compounds, niobium and oxygen-containing compounds, lithium and niobium and oxygen-containing compounds, aluminum and oxygen-containing compounds, indium and tin and oxygen-containing compounds, titanium and oxygen-containing compounds, lanthanum and oxygen-containing compounds, gadolinium and oxygen-containing compounds, zinc and oxygen-containing compounds, yttrium and oxygen-containing compounds, tungsten and oxygen-containing compounds, potassium and oxygen-containing compounds, phosphorus and oxygen-containing compounds, barium and oxygen-containing compounds, sodium and oxygen-containing compounds, or combinations thereof. The edge material 305 may have an absorption coefficient smaller than 0.001. Suitable examples of edge material 305 may include silicon (Si), silicon dioxide (SiO2), fused silica, quartz, silicon carbide (SiC), germanium (Ge), silicon germanium (SiGe), indium phosphide (InP), gallium arsenide (GaAs), gallium nitride (GaN), sapphire, or combinations thereof.

[0032]

[0037] The edge material 305 may define a cavity 310. The cavity 310 may be filled with a material having a refractive index of about 1 to about 1.3 (e.g., air or aerogel material). For example, the cavity 310 may contain an air material having a refractive index of about 1.0. In a further embodiment, the cavity 310 may be filled with an aerogel material having a refractive index of about 1.1 to about 1.3. In some embodiments, which may be combined with several other embodiments, the aerogel material may be bonded to the substrate 101 and / or cover glass 200 via one or more adhesives disposed on the upper surface of the substrate 101 or the lower surface of the cover glass 200. The adhesives may include one or more polymer adhesives, epoxy, acrylates, or combinations thereof.

[0033]

[0038] In one embodiment, the absorbing region 302 and the transparent region 303 may correspond to the alternating gradient of the waveguide combiner 100. In this case, each alternating gradient has an independent transmittance or reflectance (not shown). In some embodiments, the waveguide combiner 300 may include a cover glass 200 that includes the absorbing region 302 and the transparent region 303. The transparent region 303 corresponds to a spatially varying grid of the waveguide combiner 100, or a spatially varying region of a waveguide combiner without a device structure 102. A spatially varying grid is a grid having a transmittance or reflectance that varies within a lateral (e.g., x,y) position of the grid. In one embodiment, the waveguide combiner 100 may have a spatially varying transmittance or reflectance that varies over one or more positions of the waveguide combiner 100. In one embodiment, when the waveguide combiner 300 includes one or more overlapping cover glass 200s or waveguide combiners 100, it may have a uniform transmittance or reflectance.

[0034]

[0039] For example, the transmittance of waveguide combiner 300 is a function of x,y position (for example, T n The transmittance of the nth sheet (e.g., either the cover glass 200 or the waveguide combiner 100) can be expressed as (x,y), where n is a non-zero integer. The transmittance of the waveguide combiner 300 can then be determined by taking the product of all the transmittances of the sheets, as expressed by Equation 4. That is, For all x, y, Π n T n (x,y) = T Equation 4

[0035]

[0040] Alternatively, the reflectivity of waveguide combiner 300 is a function of x,y position (e.g., R n The reflectance of the nth sheet (e.g., either the cover glass 200 or the waveguide combiner 100) can be expressed as (x,y), where n is a non-zero integer. The reflectance of the waveguide combiner 300 can then be determined by taking the sum of all the reflectances of the sheets, as expressed by Equation 5. That is, For all x, y, Σ n R n (x,y) = R Equation 5

[0036]

[0041] In one embodiment, there may be constant values ​​of transmittance T and reflectance R that are uniform across positions x and y for each sheet numbered n of the sheets. Alternatively, if uniformity does not exist across positions x and y for each sheet numbered n of the sheets, the cover glass 200 may exclude the region. For example, if there are locations of waveguide combiners 100 with a transmittance of 0 in surface incouplers, black edge coatings, or other forms of markings, the cover glass 200 may exclude those objects from the absorption region 204.

[0037]

[0042] In one embodiment, the waveguide combiner 300 may include a waveguide combiner 100 and a cover glass 200 arranged to match a wavelength (λ). The wavelength (λ) may correspond to a color shift in the transmittance or reflectance of the waveguide combiner 100 or the cover glass 200. The wavelength (λ) can be adjusted to visible wavelengths such as approximately 380 nm to 700 nm, approximately 400 nm to 600 nm, approximately 450 nm to 700 nm, approximately 500 nm to 600 nm, or approximately 380 nm to 500 nm. The transmittance and reflectance of the waveguide 300 can then be calculated according to equations 6 and 7. That is, For all x, y, λ, Π n T n (x,y,λ)= T Equation 6 For all x, y, λ, Σ n R n (x,y,λ)= R Equation 7

[0038]

[0043] Referring next to Figure 4, a method 400 for forming a waveguide combiner 100. Figures 5A to 5C show a portion of the substrate 101. In one embodiment, this portion corresponds to the first grid 104a of the waveguide combiner 100 to be formed.

[0039]

[0044] In step 402, as shown in Figure 5A, a plurality of device structures 102 are placed on and / or covering the substrate 101. The device structures 102 may be placed on and / or covering the top surface of the substrate 101. The device structures 102 may be placed on and / or covering the top surface of the substrate 101 according to one or more deposition processes. In step 404, as shown in Figure 5B, a cover glass 200 is placed over the top surface of the substrate. The cover glass 200 includes an absorption region 204 and a transparent region 202. The absorption region 204 of the cover glass 200 is placed on the substrate 101. Thereafter, the absorption region 204 does not overlap with the device structures of the waveguide combiner 100. The transparent region 202 is placed on the corresponding device structures.

[0040]

[0045] In step 406, as shown in Figure 5C, the cover glass 200 and the substrate 101 are joined using an edge material 305. The edge material 305 includes an inner surface 306 having an adhesive material to be joined. The adhesive material may be configured to bond and / or adhere to the side surface 307 of the substrate 101 and / or the side surface 308 of the cover glass 200.

[0041]

[0046] In some embodiments, which may be combined with several other embodiments, bonding the cover glass 200 to the substrate 101 further includes forming a cavity 310 between the cover glass 200 and the substrate 101. The cavity 310 may be filled with a material having a refractive index of about 1 to about 1.3 (e.g., air or aerogel material). For example, the cavity 310 may include an air material having a refractive index of about 1.0. In a further embodiment, the cavity 310 may be filled with an aerogel material having a refractive index of about 1.1 to about 1.3. In some embodiments, which may be combined with several other embodiments, the aerogel material may be bonded to the substrate 101 and / or the cover glass 200 via one or more adhesives disposed on the upper surface of the substrate 101 or the lower surface of the cover glass 200. The adhesives may include one or more polymer adhesives, epoxy, acrylate, or combinations thereof.

[0042]

[0047] Overall, a waveguide combiner having a cover glass that compensates for the difference in transmittance and reflectance between regions of the waveguide combiner with multiple device structures (e.g., grids) and regions without device structures is presented herein. The cover glass may be superimposed so that the waveguide combiner has a uniform appearance rather than having the appearance of both regions with and without device structures. The waveguide combiner of this disclosure will have improved aesthetics compared to a waveguide combiner without a cover glass.

[0043]

[0048] The above description applies to embodiments of the present disclosure, but other embodiments and further embodiments of the present disclosure can be devised without departing from the basic scope of the present disclosure, and the scope of the present disclosure is defined by the following claims.

Claims

1. Waveguide combiner, A substrate having an upper surface, Multiple structures arranged on the upper surface, and A waveguide combiner comprising a cover glass disposed on the upper surface, the cover glass including an absorption region and a transparent region, the absorption region including an absorption material.

2. The waveguide combiner according to claim 1, wherein the transparent region is arranged on top of each of the plurality of structures.

3. The aforementioned substrate has a substrate transmittance (T NG ) and substrate reflectance (R NG ) has the substrate transmittance (T NG ) is the reflectance of the substrate (R NG A waveguide combiner according to claim 1, which is larger than ).

4. The substrate has a structural transmittance (T G ) and structural reflectance (R G ), as well as diffraction order (D G,n The waveguide combiner according to claim 3, further comprising ) where n is a non-zero integer.

5. the substrate transmittance (T NG ) and the substrate reflectance (R NG ) is greater than the sum of the structure transmittance (T G ) and the structure reflectance (R G ). The waveguide combiner according to claim 4.

6. The cover glass has an absorption transmittance (T A ) and area transmittance (T C A waveguide combiner according to claim 4, having )

7. The structural transmittance (T G ) and the absorption transmittance (T A The product of ) is the substrate transmittance (T NG ) and the area transmittance (T C The waveguide combiner according to claim 6, which is equal to the product of ).

8. The absorbent material is titanium, titanium oxide (TiO 2 ), silicon (Si), zirconium oxide (ZrO 2 ), chromium, zinc oxide (ZnO), triiron tetroxide (Fe 3 O 4 A waveguide combiner according to claim 1, comprising germanium (Ge), silicon carbide (SiC), diamond, dopants thereof, or any combination thereof.

9. The waveguide combiner according to claim 1, wherein the absorbing material includes one or more metal films.

10. The waveguide combiner according to claim 9, wherein the absorbing material includes one or more metal films.

11. The waveguide combiner according to claim 1, wherein the absorption region has a refractive index of about 1.7 or higher and an optical density of about 2.0 or higher.

12. The waveguide combiner according to claim 1, wherein the absorbing material comprises at least one of one or more dyes or one or more pigments.

13. The waveguide combiner according to claim 1, wherein the absorbing material comprises a polymer matrix of one or more binders.

14. Waveguide combiner, A substrate having an upper surface, A plurality of structures arranged on the upper surface, comprising a first grid, a second grid, and a third grid, and A waveguide combiner comprising a cover glass disposed on the upper surface, the cover glass including an absorption region and a transparent region, the absorption region including an absorption material.

15. The waveguide combiner according to claim 14, wherein the first grid includes a spatially varying grid.

16. The waveguide combiner according to claim 14, wherein the second grid includes a spatially varying grid.

17. The waveguide combiner according to claim 14, wherein the third grid includes a spatially varying grid.

18. The arrangement of multiple structures on a substrate, wherein the substrate has an upper surface, Placing a cover glass on the upper surface of the substrate, wherein the cover glass includes an absorption region and a transparent region, and the transparent region is placed on each of the multiple structures, and A method comprising bonding the cover glass and the substrate using an edge material.

19. The method according to claim 18, further comprising arranging an aerogel material between the substrate and the cover glass.

20. The method according to claim 18, wherein bonding the cover glass and the substrate further comprises placing an adhesive material on the inner surface of the edge material and bonding the cover glass and the substrate using the adhesive material.