Display device and method for manufacturing a display device

Abstract

A display device is provided. The display device includes subpixels formed on a base layer, a color conversion layer in a first subpixel region including quantum dots, a first scattering layer in a second subpixel region, and a second scattering layer in a third subpixel region, a second scattering layer including the second scattering layer, a first scattering layer in the first subpixel region, and a second scattering layer including the second scattering layer, a first color filter in the first subpixel region, a second color filter in the second subpixel region, and a third color filter in the third subpixel region, wherein the light emitted from the light-emitting element includes second-color light and third-color light, and the color of the light that has passed through the first and second scattering layers is substantially unchanged by the first and second scattering layers.

Description

TECHNICAL FIELD

[0001] Aspects according to some embodiments of the present disclosure relate to a display device and a method for manufacturing the same. BACKGROUND ART

[0002] In recent years, as interest in information displays has increased, research and development on display devices have been continuously carried out.

[0003] The above information disclosed in this Background section is only for enhancement of understanding of the background of the present disclosure, and therefore it may contain information that does not form the prior art. SUMMARY OF THE INVENTION Problems to be Solved by the Invention

[0004] An aspect of the present disclosure is to provide a display device with improved light extraction efficiency and a method for manufacturing the display device.

[0005] An aspect of the present disclosure is to provide a display device capable of realizing sufficient luminance and a method for manufacturing the display device.

[0006] An aspect of the present disclosure is to provide a display device capable of improving process efficiency and a method for manufacturing the display device.

[0007] An aspect of the present disclosure is to provide a display device capable of reducing manufacturing costs and a method for manufacturing the display device.

[0008] An aspect of the present disclosure is to provide a display device having excellent optical properties and a method for manufacturing the display device. Means for Solving the Problems

[0009] According to some embodiments of the present disclosure, a subpixel may include a first subpixel formed on a base layer and configured to provide light of a first color, a second subpixel forming a second subpixel region configured to provide light of a second color, and a third subpixel forming a third subpixel region configured to provide light of a third color. The subpixel may include a display layer on the base layer including a light-emitting element, an optical control layer on the display layer including a color conversion layer disposed within the first subpixel region and including a quantum dot, a first scattering layer disposed within the second subpixel region and including a first scatterer, and a second scattering layer disposed within the third subpixel region and including a second scatterer, and a color filter layer disposed on the optical control layer and including a first color filter disposed within the first subpixel region, a second color filter disposed within the second subpixel region, and a third color filter disposed within the third subpixel region. The light emitted by the above-mentioned light-emitting element includes the second color of light and the third color of light, and at least a portion of the emitted light can pass through the light control layer and the color filter layer and be emitted. The color of the light transmitted through the first scattering layer and the second scattering layer may not be altered by the first scattering layer and the second scattering layer.

[0010] The above-mentioned display device may further include a capping layer that at least partially passesivates the color conversion layer. A first portion of the capping layer may be positioned on the color conversion layer within the first subpixel region, and a second portion of the capping layer may be positioned below the first and second scattering layers within the respective second and third subpixel regions.

[0011] The above-mentioned display device may further include an upper layer, which is arranged on the color filter layer and includes an upper substrate. The color filter layer and the light control layer may be sequentially stacked below the upper substrate. A packing layer may be interposed between the display layer, the color conversion layer, the first scattering layer, and the second scattering layer.

[0012] The above-mentioned display device may further include an upper layer, which is disposed on the color filter layer and includes an upper substrate. The above-mentioned light control layer may be disposed on the display layer. A packing layer may be interposed between the color conversion layer, the first scattering layer, the second scattering layer and the color filter layer.

[0013] The above-described display device may further include an upper layer, which is placed on the above-described color filter layer and includes an upper film. The above-described light control layer and the above-described color filter layer may be sequentially laminated on the above-described display layer.

[0014] The above color conversion layer may have a first thickness. The above first scattering layer may have a second thickness. The above second scattering layer may have a third thickness. The above first thickness may be greater than the above second thickness and the above third thickness. The above second thickness and the above third thickness may be substantially the same as each other.

[0015] Each of the above-mentioned first scatterer and second scatterer may be included in the first and second scatter layers in an amount ranging from approximately 1.5% by weight to approximately 8.5% by weight.

[0016] The size of the first scattering body described above can be larger than the size of the second scattering body described above.

[0017] The first scattering material can be included in the first scattering layer in a first weight ratio. The second scattering material can be included in the second scattering layer in a second weight ratio. The first weight ratio can be greater than the second weight ratio.

[0018] The first scattering layer may include one or more scattering bodies that have the same composition ratio as the first scattering body but differ in size. The second scattering layer may include one or more scattering bodies that have the same composition ratio as the second scattering body but differ in size.

[0019] The above color filter layer may further include an optical layer with a refractive index smaller than that of the above color conversion layer. The above optical layer can be placed between the above light control layer and the above first color filter, the above second color filter, and the above third color filter. The above optical layer can be placed only in the first subpixel region among the above first subpixel region, the above second subpixel region, and the above third subpixel region.

[0020] The above-mentioned display device may further include a filling scattering layer that is arranged within the second subpixel region and the third subpixel region, superimposed on the first scattering layer and the second scattering layer along the thickness direction, and containing a filling material and a scattering substance.

[0021] The above-mentioned display device may further include a bank that extends in the thickness direction and at least a portion of the first subpixel region surrounds the above-mentioned first subpixel region.

[0022] The above-mentioned bank may not be located between the second subpixel region and the third subpixel region. The display device may further include a black matrix layer that is located at least partially between the second subpixel region and the third subpixel region and penetrates between the first scattering layer and the second scattering layer.

[0023] The above-mentioned bank may be formed around all sides of the first subpixel region in a plan view, but not around parts of the second subpixel region and the third subpixel region, respectively.

[0024] At least one side of the second subpixel region may include an open edge where the bank is not located. The open edge may be formed to be oriented away from the third subpixel region.

[0025] The above-mentioned bank may, in a plan view, be formed around all sides of the first subpixel region and the second subpixel region, but not around at least a portion of the third subpixel region.

[0026] The above display device may further include a capping layer at least a part of which passivates the above color conversion layer and the above first scattering layer. At least a part of the above capping layer may be disposed between the above second scattering layer and the above third color filter in the above third sub-pixel region.

[0027] The thickness of the above first scattering layer may be greater than the thickness of the above second scattering layer.

[0028] The above bank may further include an isolated bank portion. The above isolated bank portion may be disposed between the above second sub-pixel region and the above third sub-pixel region.

[0029] The above display device may further include a spacer disposed on the above bank, and disposed above the above color conversion layer, the above first scattering layer, and the above second scattering layer.

[0030] The above spacer may be disposed between the above first sub-pixel region and the above second sub-pixel region, between the above second sub-pixel region and the above third sub-pixel region, and between the above first sub-pixel region and the above third sub-pixel region.

[0031] The above first sub-pixel, the above second sub-pixel, and the above third sub-pixel may be adjacent to each other in a first direction to form a first pixel. The above first pixel may be adjacent to a second pixel in a second direction different from the above first direction. The above spacer may be disposed between the above first sub-pixel region of the above first pixel and the above first sub-pixel region of the above second pixel, between the above second sub-pixel region of the above first pixel and the above second sub-pixel region of the above second pixel, and between the above third sub-pixel region of the above first pixel and the above third sub-pixel region of the above second pixel.

[0032] The first subpixel region and the third subpixel region are adjacent in a first direction, and the second subpixel region can be adjacent to the first subpixel region and the third subpixel region in a second direction different from the first direction. The spacer can be superimposed on the second subpixel region along the first direction.

[0033] The above-mentioned display device may further include, at least in part, a capping layer that passesivates the color conversion layer, the bank, the first scattering layer, the second scattering layer, and the spacer.

[0034] The above-mentioned display device may further include a capping layer that passesivates at least a portion of the color conversion layer, the bank, the first scattering layer, and the second scattering layer. The spacer may be placed on the capping layer.

[0035] The above bank includes a first bank portion separated by a first distance from the second bank portion, the second subpixel region is located between the first bank portion and the second bank portion, and includes a third bank portion separated by a second distance from the second bank portion, the third subpixel region is located between the third bank portion and the second bank portion. The thickness of the first scattering layer can be greater than the thickness of the second scattering layer.

[0036] The above-mentioned light-emitting element may include one or more organic light-emitting diodes containing organic materials or inorganic light-emitting diodes containing inorganic materials.

[0037] A method for manufacturing a display device according to some embodiments of the present disclosure may include the steps of manufacturing a first panel, manufacturing a second panel, and joining the first panel and the second panel. The step of manufacturing the first panel may include the step of providing a light-emitting element on a lower substrate. The step of manufacturing the second panel may include the steps of providing a color filter layer on an upper substrate and providing a light control layer on the color filter layer. The step of providing the light control layer may include the steps of patterning a bank on the color filter layer, arranging a color conversion layer containing quantum dots in a first subpixel region, arranging a first scattering layer containing a first scatterer in a second subpixel region, and arranging a second scattering layer containing a second scatterer in a third subpixel region. The first scattering layer and the second scattering layer may be configured so that the applied light passes through the first scattering layer and the second scattering layer without changing the color of the applied light.

[0038] The step of providing the above-mentioned light control layer further includes the step of forming a capping layer on the above-mentioned color conversion layer, wherein the capping layer passesivates the above-mentioned color conversion layer, and the step of providing the above-mentioned color conversion layer may include the step of patterning the above-mentioned color conversion layer using an inkjet process. The steps of providing the first scattering layer and providing the second scattering layer are performed after the step of forming the capping layer and can be performed based on a photolithography process.

[0039] The above-mentioned color conversion layer, the above-mentioned first scattering layer, and the above-mentioned second scattering layer can be patterned based on a photolithography process. The step of providing the above-mentioned light control layer further includes the step of forming a capping layer on the above-mentioned color conversion layer - the capping layer can passivate the above-mentioned color conversion layer.

[0040] The above-mentioned color conversion layer, the first scattering layer, and the second scattering layer can be formed based on an inkjet process.

[0041] The bonding step described above may further include the step of providing a packing layer between the first panel and the second panel.

[0042] According to some embodiments of this disclosure, the process may include the steps of manufacturing a first panel, manufacturing a second panel, and joining the first and second panels. The step of manufacturing the first panel may include the steps of providing a display layer including light-emitting elements on a lower substrate and providing a light control layer on the display layer. The step of manufacturing the second panel may include providing a color filter layer on an upper substrate. The step of providing the light control layer may include the steps of patterning a bank on the display layer, providing a color conversion layer including quantum dots in a first subpixel region, providing a first scattering layer including a first scatterer in a second subpixel region, and providing a second scattering layer including a second scatterer in a third subpixel region. The first and second scattering layers can be configured to transmit applied light through the first and second scattering layers without changing the color of the applied light.

[0043] The step of providing the above-mentioned light control layer may further include the step of forming a capping layer on the above-mentioned color conversion layer. The capping layer passesivates the above-mentioned color conversion layer. The step of providing the above-mentioned color conversion layer may include the step of patterning the above-mentioned color conversion layer using an inkjet process. The steps of providing the first scattering layer and providing the second scattering layer are performed after the step of forming the capping layer and can be performed based on a photolithography process.

[0044] The above-mentioned color conversion layer, the first scattering layer, and the second scattering layer can be patterned based on a photolithography process. The step of providing the above-mentioned light control layer may further include the step of forming a capping layer on the above-mentioned color conversion layer. The capping layer passesivates the above-mentioned color conversion layer, the first scattering layer, and the second scattering layer.

[0045] The above-mentioned color conversion layer, the first scattering layer, and the second scattering layer can be formed based on an inkjet process. [Effects of the Invention]

[0046] According to aspects of some embodiments, it is possible to provide a display device with improved light emission efficiency and a method for manufacturing the display device.

[0047] According to aspects of some embodiments, it is possible to provide a display device and a method for manufacturing a display device that can achieve sufficient brightness.

[0048] According to some aspects of the embodiments, it is possible to provide a display device and a method for manufacturing the display device that can improve process efficiency.

[0049] According to some aspects of the embodiments, it is possible to provide a display device and a method for manufacturing the display device that can reduce manufacturing costs.

[0050] According to aspects of some embodiments, it is possible to provide a display device having excellent optical properties and a method for manufacturing the display device. [Brief explanation of the drawing]

[0051] The aspects and features of this disclosure described herein, whether or not, will be more clearly understood from the following detailed description of exemplary and non-limiting embodiments with reference to the accompanying drawings. [Figure 1] This is a schematic plan view showing a display device according to some embodiments of the present disclosure. [Figure 2] This is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. [Figure 3] This is a schematic diagram showing a display layer according to some embodiments of the present disclosure. [Figure 4] This is a schematic diagram illustrating the path of light for each subpixel according to some embodiments of the present disclosure. [Figure 5] This is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. [Figure 6]This is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. [Figure 7] This is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. [Figure 8] This is a schematic cross-sectional view illustrating the thickness relationship between the first scattering layer, the second scattering layer, and the color conversion layer according to some embodiments of this disclosure. [Figure 9] This is a schematic cross-sectional view illustrating the relationship between the scattering materials contained in the first scattering layer and the second scattering layer, respectively, according to some embodiments of this disclosure. [Figure 10] This is a schematic cross-sectional view illustrating the relationship between the scattering materials contained in the first scattering layer and the second scattering layer, respectively, according to some embodiments of this disclosure. [Figure 11] This is a schematic cross-sectional view illustrating the relationship between the scattering materials contained in the first scattering layer and the second scattering layer, respectively, according to some embodiments of this disclosure. [Figure 12] This is a cross-sectional view illustrating the features of the optical control layer according to some embodiments of the present disclosure. [Figure 13] This is a cross-sectional view illustrating the features of the optical control layer according to some embodiments of the present disclosure. [Figure 14] This is a cross-sectional view illustrating the features of the optical control layer according to some embodiments of the present disclosure. [Figure 15] This is a cross-sectional view illustrating the features of the optical control layer according to some embodiments of the present disclosure. [Figure 16] This is a plan view illustrating the arrangement relationship between the bank and the subpixel region according to some embodiments of the present disclosure. [Figure 17] This is a plan view illustrating the arrangement relationship between the bank and the subpixel region according to some embodiments of the present disclosure. [Figure 18] This is a plan view illustrating the arrangement relationship between the bank and the subpixel region according to some embodiments of the present disclosure. [Figure 19] This is a plan view illustrating the arrangement relationship between the bank and the subpixel region according to some embodiments of the present disclosure. [Figure 20] This is a plan view illustrating the arrangement relationship between the bank and the subpixel region according to some embodiments of the present disclosure. [Figure 21] This is a plan view illustrating the arrangement relationship between the bank and the subpixel region according to some embodiments of the present disclosure. [Figure 22] This is a plan view illustrating the arrangement relationship between a spacer and a subpixel region according to some embodiments of the present disclosure. [Figure 23] This is a plan view illustrating the arrangement relationship between a spacer and a subpixel region according to some embodiments of the present disclosure. [Figure 24] This is a plan view illustrating the arrangement relationship between a spacer and a subpixel region according to some embodiments of the present disclosure. [Figure 25] This is a plan view illustrating the arrangement relationship between a spacer and a subpixel region according to some embodiments of the present disclosure. [Figure 26] This is a plan view illustrating the arrangement relationship between a spacer and a subpixel region according to some embodiments of the present disclosure. [Figure 27] This is a schematic plan view showing the display area of ​​a display device according to some embodiments of the present disclosure. [Figure 28] This is a schematic cross-sectional view along A to A' in Figure 27, showing a schematic cross-sectional view of the second panel according to some embodiments of the present disclosure. [Figure 29] This is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. [Figure 30] This is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. [Figure 31] This is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. [Figure 32] This is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. [Figure 33] This is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. [Figure 34] This is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. [Figure 35] This is a schematic cross-sectional view illustrating the relationship between the first scattering layer and the second scattering layer in some embodiments of this disclosure. [Figure 36] This flowchart shows a method for manufacturing a display device according to some embodiments of the present disclosure. [Figure 37] This is a flowchart showing a sub-operation of the operation for manufacturing a second panel according to some embodiments of the present disclosure. [Figure 38] This is a schematic cross-sectional view showing a method for manufacturing a display device according to some embodiments of the present disclosure, broken down by process operation. [Figure 39] This is a schematic cross-sectional view showing a method for manufacturing a display device according to some embodiments of the present disclosure, broken down by process operation. [Figure 40] This is a schematic cross-sectional view showing a method for manufacturing a display device according to some embodiments of the present disclosure, broken down by process operation. [Figure 41] This is a schematic cross-sectional view showing a method for manufacturing a display device according to some embodiments of the present disclosure, broken down by process operation. [Figure 42] This is a schematic cross-sectional view showing a method for manufacturing a display device according to some embodiments of the present disclosure, broken down by process operation. [Figure 43] This is a schematic cross-sectional view showing a method for manufacturing a display device according to some embodiments of the present disclosure, broken down by process operation. [Figure 44] This flowchart shows a sub-operation of the operation for manufacturing the first panel according to some embodiments of the present disclosure. [Figure 45] This is a schematic cross-sectional view showing a method for manufacturing a display device according to some embodiments of the present disclosure, broken down by process operation. [Figure 46] This is a schematic cross-sectional view showing a method for manufacturing a display device according to some embodiments of the present disclosure, broken down by process operation. [Figure 47] This is a schematic cross-sectional view showing a method for manufacturing a display device according to some embodiments of the present disclosure, broken down by process operation. [Figure 48] This is a schematic cross-sectional view showing a method for manufacturing a display device according to some embodiments of the present disclosure, broken down by process operation. [Figure 49] This flowchart shows a method for manufacturing a display device according to some embodiments of the present disclosure. [Modes for carrying out the invention]

[0052] Some embodiments will be described in more detail below with reference to the attached drawings. Please note that only the parts relevant to understanding the operation of this disclosure will be described below, and explanations of the remaining parts may be omitted in order not to obscure the gist of this disclosure. Some embodiments are described, and this disclosure is not limited to the embodiments described herein and can be embodied in other forms. The embodiments will be described in more detail below so that those skilled in the art can properly implement the technical ideas of this disclosure.

[0053] This disclosure allows for various modifications and numerous embodiments, some of which are illustrated in the drawings and described in more detail in the detailed description. However, this is not intended to limit this disclosure to any particular mode of practice, and it should be understood that all modifications, equivalents, and substitutes are included in this disclosure as long as they do not deviate from the idea and technical scope of this disclosure.

[0054] When a part is said to be “connected” to another part, it means that it can be connected “directly” to the other part, or it can be connected “indirectly” to the other part, including a part interposed between them. The terms used herein are for the purpose of describing specific embodiments and are not intended to limit this disclosure. The terms “includes” or “have” as used herein identify the presence of a described component but do not exclude the presence or addition of one or more other components. “At least one of X, Y, and Z,” “At least one of X, Y, or Z,” and “At least one selected from the group consisting of X, Y, and Z” can be interpreted as one X, one Y, one Z, or any combination of two or more X, Y, and Z (e.g., XYZ, XYY, YZ, ZZ, etc.). The terms “or” and “and” as used herein include any combination of one or more components.

[0055] In this specification, terms such as “first,” “second,” etc., may be used to describe various components, but it should be understood that such components should not be limited by these terms. The terms are used solely to distinguish one component from another. For example, the first component described below may be referred to as the second component, to the extent that it does not deviate from the teachings of this disclosure. Similarly, the second component may be referred to as the first component. In this disclosure, the singular form is intended to include the plural form unless the context clearly indicates otherwise.

[0056] The terms “including” and “having” as used in this disclosure express the presence of explicitly stated features, integers, steps, operations, elements, components, and / or combinations thereof, but do not exclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof. Furthermore, if a first part, such as a layer, film, region, or plate, is placed on (e.g., positioned or provided on) a second part, the first part may not only be directly on the second part, but the third part may also be interposed between them. Note that when it is stated that a first part, such as a layer, film, region, or plate, is formed on a second part, the surface of the second part on which the first part is formed is not limited to the top surface of the second part, but may also include other surfaces such as the sides or bottom surface of the second part. Conversely, if a first part, such as a layer, film, region, or plate, is below a second part, the first part may not only be directly below the second part, but the third part may also be interposed between them.

[0057] Spatially relative terms such as “below” and “above” may be used for descriptive purposes to explain the relationship between one component or feature and another, as illustrated in the drawings. Spatially relative terms are intended to include directions that differ in use, operation, and / or manufacture, in addition to the directions depicted in the drawings. For example, if the apparatus illustrated in the drawings is inverted, a component depicted as being “below” another component or feature will be located “above” the other component or feature. Thus, in some embodiments, the term “below” may include both the upward and downward directions. In some embodiments, the apparatus may be oriented in other directions (e.g., rotated 90 degrees or in other directions). Therefore, spatially relative terms as used herein should be interpreted accordingly.

[0058] Some embodiments are described with reference to the accompanying drawings with respect to functional blocks, units, and / or modules. Those skilled in the art will understand that these blocks, units, and / or modules are physically embodied by logic circuits, discrete components, microprocessors, wired circuits, memory elements, wiring connections, and other electronic circuits. These can be formed using semiconductor substrate manufacturing techniques or other manufacturing techniques. Blocks, units, and / or modules embodied by microprocessors or other similar hardware can be programmed and controlled by using software to perform the various functions described herein, and can be selectively driven by firmware and / or software. In some embodiments, each block, unit, and / or module may be embodied by dedicated hardware, or by a combination of dedicated hardware performing some functions and a processor (e.g., one or more programmed microprocessors and associated circuits) performing other functions. In some embodiments, blocks, units, and / or modules may be physically separated into two or more separate blocks, units, and / or modules that interact within the scope of this disclosure. In some embodiments, blocks, units, and / or modules may be physically coupled to more complex blocks, units, and / or modules, without exceeding the scope of the disclosure.

[0059] Various embodiments will be described with reference to drawings illustrating non-limiting embodiments. Therefore, it can be expected that the shape may vary, for example, depending on tolerances and / or manufacturing techniques. Accordingly, the embodiments disclosed herein should not be construed as being limited to specific exemplified shapes, but rather as including, for example, variations in shape resulting from manufacturing. Thus, the shapes illustrated in the drawings do not necessarily depict the actual shape of the device region, and these embodiments are not limited thereto.

[0060] If a particular embodiment is manifested differently, the order of a particular process may differ from the order described. For example, two processes described consecutively may be identical or substantially simultaneous, and may be performed in the reverse order of the described order.

[0061] As used herein, “substantial,” “approximately,” and similar terms are used as approximations, not terms of degree, to describe the inherent variations in measured or calculated values ​​that can be recognized by an ordinary person skilled in the art. Furthermore, when describing embodiments of the Disclosure, the use of “may” means “one or more embodiments of the Disclosure.” As used herein, “use,” “using,” and “used” can be considered synonymous with “utilize,” “utilizing,” and “utilized,” respectively.

[0062] Unless otherwise defined, all terms used herein (including technical and scientific terms) have the same meaning as that ordinarily understood by one ordinary person skilled in the art to which this disclosure belongs. Terms such as those defined in commonly used dictionaries should be construed to have a meaning consistent with their meaning in the context of the relevant art and / or this specification, and should not be construed in an idealized or overly formal sense unless otherwise specifically defined herein.

[0063] The various embodiments of this disclosure relate to display devices and methods for manufacturing display devices. Below, some embodiments of display devices and methods for manufacturing display devices will be described with reference to the attached drawings.

[0064] Figure 1 is a schematic plan view showing a display device according to some embodiments of the present disclosure.

[0065] Referring to Figure 1, the display device DD may include a base layer BSL and pixels PXL arranged (e.g., located or provided) on the base layer BSL. Although not shown in the drawing, the display device DD may further include drive circuits (e.g., a scanning drive unit and a data drive unit), wiring, and pads for driving the pixels PXL.

[0066] A display device DD (or base layer BSL) may include a display area DA and a non-display area NDA. For example, the display area DA may be configured to display an image. The non-display area NDA may represent an area other than the display area DA. The non-display area NDA may surround at least a portion of the display area DA.

[0067] The base layer BSL can form the base surface of the display device DD. The base layer BSL may be a rigid or suitably flexible substrate or film. For example, the base layer BSL may contain a glass material. Alternatively, the base layer BSL may contain a silicon material. Alternatively, the base layer BSL may contain polyimide. However, this disclosure is not limited thereto.

[0068] In some embodiments, the base layer BSL may be the lower substrate BSUB. For example, the base layer BSL may be the first substrate. The base layer BSL may include a base substrate for manufacturing the first panel PNL1 (see Figure 5).

[0069] The display area DA can represent the area where pixels PXL are located. The non-display area NDA can represent the area where pixels PXL are not located. The non-display area NDA may contain drive circuits, wiring, and pads connected to the pixels PXL of the display area DA.

[0070] In some embodiments, the pixel PXL (or sub-pixel SPX) is striped or pentiled. TMThe elements may be arranged along a sequence structure, but are not limited thereto, and various embodiments can be applied to this disclosure.

[0071] In some embodiments, a pixel PXL (or subpixel SPX) may include a first subpixel SPX1, a second subpixel SPX2, and a third subpixel SPX3. The first subpixel SPX1, the second subpixel SPX2, and the third subpixel SPX3 can each be a subpixel. At least one first subpixel SPX1, the second subpixel SPX2, and the third subpixel SPX3 can form a single pixel unit capable of emitting light of various colors.

[0072] Each of the first subpixel SPX1, the second subpixel SPX2, and the third subpixel SPX3 is capable of emitting light of a single color.

[0073] For example, the first subpixel SPX1 may be a red pixel that emits red light (e.g., first color), the second subpixel SPX2 may be a green pixel that emits green light (e.g., second color), and the third subpixel SPX3 may be a blue pixel that emits blue light (e.g., third color). The red pixel can provide light in the wavelength range of approximately 600 nm to approximately 750 nm. The green pixel can provide light in the wavelength range of approximately 480 nm to approximately 560 nm. The blue pixel can provide light in the wavelength range of approximately 370 nm to approximately 460 nm.

[0074] In some embodiments, the number of second subpixels SPX2 may be greater than the number of first subpixels SPX1 and third subpixels SPX3. However, the color, type, and / or number of the first subpixels SPX1, second subpixels SPX2, and third subpixels SPX3 forming each pixel unit are not limited to specific examples.

[0075] Referring to Figures 2 to 4, a schematic structure including the cross-sectional structure (e.g., the cross-sectional structure) of the display device DD according to some embodiments will be described.

[0076] Figure 2 is a schematic cross-sectional view showing a display device according to some embodiments of the present disclosure. Figure 3 is a schematic diagram showing a display layer according to some embodiments of the present disclosure. Figure 4 is a schematic diagram illustrating the optical paths for each subpixel according to some embodiments of the present disclosure.

[0077] Referring to Figures 2 to 4, the display device DD may include a display layer DL, a light control layer LCL, a color filter layer CFL, and an upper layer UPL.

[0078] The display layer DL can be configured to emit light. The display layer DL can form a base on which the light control layer LCL is placed.

[0079] The display layer DL may include a pixel circuit layer PCL that includes a base layer BSL, and a light-emitting element layer LEL that includes a light-emitting element LD and can form a pixel PXL.

[0080] The base layer (BSL) can form a base on which a pixel circuit (PXC) is placed. The pixel circuit (PXC) may be placed on the base layer (BSL) and may be configured to drive a light-emitting element (LD). The pixel circuit layer (PCL) may include a conductive layer and an insulating layer, and the conductive layer may form the pixel circuit (PXC). The pixel circuit (PXC) may include circuit elements that can drive a sub-pixel (SPX) (or light-emitting element (LD). The circuit elements may include a drive transistor and may include additional transistors and capacitors.

[0081] The light-emitting element layer LEL can be placed on the pixel circuit layer PCL. According to some embodiments, the light-emitting element layer LEL may include light-emitting elements LD.

[0082] For example (see Figure 3), the light-emitting element LD may include an organic light-emitting diode (OLED) containing an organic material. Figure 3 schematically shows an embodiment in which the light-emitting element LD is an organic light-emitting diode, and schematically shows the cross-sectional structure of the display layer DL, which includes the pixel circuit layer PCL and the light-emitting element layer LEL, of the display device DD within the display area DA.

[0083] According to some embodiments, the light-emitting element layer LEL may further include a pixel definition film PDL, a capping layer CPL, and a sealing film TFE.

[0084] According to some embodiments, the light-emitting element LD may be arranged on the pixel circuit layer PCL. The light-emitting element LD may include a first light-emitting element (e.g., a first part of the light-emitting element LD) included in a first subpixel SPX1, a second light-emitting element (e.g., a second part of the light-emitting element LD) included in a second subpixel SPX2, and a third light-emitting element (e.g., a third part of the light-emitting element LD) included in a third subpixel SPX3.

[0085] According to some embodiments, the light-emitting element LD may include a first electrode EL1, a light-emitting portion EL, and a second electrode EL2. According to some embodiments, the light-emitting portion EL may be arranged in a region defined by a pixel-defining film PDL. One side of the light-emitting portion EL may be electrically connected to the first electrode EL1, and the other side of the light-emitting portion EL may be electrically connected to the second electrode EL2.

[0086] The first electrode EL1 may be the anode electrode for the light-emitting part EL, and the second electrode EL2 may be the cathode electrode for the light-emitting part EL. According to some embodiments, the first electrode EL1 and the second electrode EL2 may contain a conductive material. For example, the conductive material may contain one or more of the following: gold (Au), silver (Ag), aluminum (Al), molybdenum (Mo), chromium (Cr), titanium (Ti), nickel (Ni), neodymium (Nd), copper (Cu), or platinum (Pt). In some embodiments, and according to some embodiments, the conductive material may include one or more of the following: silver nanowires (AgNW), ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), IGZO (Indium Gallium Zinc Oxide), AZO (Antimony Zinc Oxide), ITZO (Indium Tin Zinc Oxide), ZnO (Zinc Oxide), SnO2 (Tin Oxide), carbon nanotubes, or graphene. However, this disclosure is not limited to the examples given above.

[0087] The light-emitting part EL can emit light based on electrical signals provided by the anode electrode (e.g., first electrode EL1) and the cathode electrode (e.g., second electrode EL2).

[0088] The light-emitting element (EL) may include a multilayer structure. For example, the light-emitting element (EL) may include multiple light-emitting structures, each including a hole transport section, a light-emitting layer (or photo-generating layer), and an electron transport section. Each layer forming the light-emitting structure may contain an organic material, and according to some embodiments, it may further contain an inorganic material such as a metal-containing compound or quantum dots.

[0089] According to some embodiments, the light-emitting element (EL) can include a tandem structure. For example, the light-emitting element (EL) can emit monochromatic light containing a second color component and a third color component. For example, the multiple light-emitting structures may include a first light-emitting structure and a second light-emitting structure. The first light-emitting structure may include a multilayer structure that emits the second color of light. The second light-emitting structure may include a multilayer structure that emits the third color of light. As a result, the light emitted by the light-emitting element (EL) can be a mixture of the second and third colors.

[0090] The hole transport section may include a multilayer structure having multiple layers, each containing a different material. For example, the hole transport section may include at least one of a hole injection layer and a hole transport layer, and according to some embodiments, it may further include an emissive layer, an electron blocking layer, and / or the like. For example, the hole transport section may have a multilayer structure such as a hole injection layer / hole transport layer, a hole injection layer / hole transport layer / emissive layer, a hole injection layer / emissive layer, a hole transport layer / emissive layer, an electron blocking layer / hole injection layer / hole transport layer, sequentially arranged hole transport layers containing different materials, or a hole injection layer / hole transport layer / electron blocking layer. However, this disclosure is not limited to specific examples.

[0091] The light-emitting layer may include a material capable of emitting light of a single color. The light-emitting layer may include a host and a dopant. The host of the light-emitting layer is a light-emitting material capable of capturing carriers (e.g., electrons and holes) for light generation and can be induced to efficiently generate excitons. The dopant may include a phosphorescent dopant or a fluorescent dopant. According to some examples, the examples of dopants are not particularly limited. According to some examples, the dopant may include an organic material, a metal complex, and / or the like.

[0092] The electron transport section may include a multilayer structure having multiple layers, each containing a different material. The electron transport section may include at least one electron injection layer and / or electron transport layer, and according to some embodiments, may further include an electron buffer layer, a hole blocking layer, and so on. For example, the electron transport section may have a multilayer structure such as an electron transport layer / electron injection layer, a hole blocking layer / electron transport layer / electron injection layer, an electron adjustment layer / electron transport layer / electron injection layer, or a buffer layer / electron transport layer / electron injection layer. However, this disclosure is not limited to specific examples.

[0093] The pixel definition film PDL is placed on the pixel circuit layer PCL and can define the positions in which the light-emitting parts EL are arranged. The pixel definition film PDL may contain organic materials. For example, the pixel definition film PDL may contain one or more of acrylic resin, epoxy resin, phenol resin, polyamide resin, or polyimide resin. However, the disclosure is not limited thereto. According to some embodiments, the pixel definition film PDL may contain inorganic materials. For example, the pixel definition film PDL may contain one or more of silicon oxide (SiOx) or silicon nitride (SiNx). According to some embodiments, the pixel definition film PDL may have a multilayer structure in which layers containing silicon oxide (SiOx) and / or layers containing silicon nitride (SiNx) are stacked.

[0094] The capping layer CPL can be placed on the second electrode EL2. The capping layer CPL can cap the second electrode EL2. The capping layer CPL may contain an inorganic material.

[0095] The encapsulation film TFE can be placed on a light-emitting element LD (e.g., a second electrode EL2). The encapsulation film TFE can cancel out the steps created by the light-emitting element LD and the pixel definition film PDL. The encapsulation film TFE may include a plurality of insulating films covering the light-emitting element LD. According to some embodiments, the encapsulation film TFE may have a structure in which inorganic films and organic films are alternately stacked. According to some embodiments, the encapsulation film TFE may be a thin film encapsulation film.

[0096] According to some embodiments, the light-emitting element LD may be an inorganic light-emitting diode containing an inorganic material. For example, the display device DD may include a structure in which a light-emitting element LD containing an inorganic material is aligned between a plurality of spaced electrodes. According to some embodiments, the display device DD may include a structure in which the light-emitting element LD is a microLED (light-emitting diode) and is transferred to a pixel circuit layer PCL based on a transfer method. The transfer method may be any one of a stamp-based transfer method, a laser-based transfer method, an electrostatic force-based transfer method, a magnetic force and electromagnetic force-based transfer method, or an adhesive-based transfer method. However, this disclosure is not limited to the examples given above.

[0097] Even when the light-emitting diode (LD) contains an inorganic material, it can be configured to emit light containing a second and a third color component, according to some embodiments. For example, a portion of the light-emitting diode (LD) may be configured to emit light containing a second color component, while another portion of the light-emitting diode (LD) may be configured to emit light containing a third color component.

[0098] The optical control layer LCL can be placed on the display layer DL (e.g., the light-emitting element layer LEL). For example, the optical control layer LCL can be placed above the display layer DL with respect to the display direction (e.g., the third direction DR3) - the above display direction can also be called the thickness direction.

[0099] According to some embodiments, the light control layer (LCL) can change the color of applied light and can be a layer that scatters applied light. For example, the light control layer (LCL) may include a color conversion layer (CCL) (see Figure 5) and a scattering layer (SCT) (see Figure 5). For example, the portion of the light control layer (LCL) corresponding to the color conversion layer (CCL) may be provided to change the color of applied light, and the other portion corresponding to the scattering layer (SCT) may be provided to scatter the applied light.

[0100] The color filter layer (CFL) can be placed on the optical control layer (LCL). For example, the color filter layer (CFL) can be placed above the optical control layer (LCL) with respect to the display direction (e.g., the third direction DR3).

[0101] According to some embodiments, the color filter layer CFL may include a color filter CF (Figure 5) that can selectively transmit light of one color.

[0102] The upper layer (UPL) can be positioned on top of the color filter layer (CFL). For example, the upper layer (UPL) can be positioned above the color filter layer (CFL) with respect to the display direction (e.g., the third direction DR3).

[0103] In some embodiments, the upper layer UPL may include an upper substrate USUB (see Figure 5). Alternatively, the upper layer UPL may include an upper film layer UFM (see Figure 7). In some embodiments, the upper substrate USUB may be a second substrate.

[0104] Referring to Figure 4, the structural features of how the display device DD embodies a full-color display will be described using some embodiments. Content that may overlap with the above will be briefly explained or omitted.

[0105] Figure 4 is a schematic block diagram showing the light paths provided by a display device according to some embodiments of this disclosure, broken down by subpixel.

[0106] Referring to Figure 4, the display device DD may include a subpixel region SPXA and a non-subpixel region NSPXA.

[0107] A subpixel region SPXA is formed by subpixels SPX and can be a region that provides light of a single color. A non-subpixel region NSPXA is a region formed between adjacent subpixel regions SPXA and can be a region that does not provide light of a single color.

[0108] The subpixel region SPXA may include a first subpixel region SPXA1 defined by a first subpixel SPX1 to which light of a first color is provided, a second subpixel region SPXA2 defined by a second subpixel SPX2 to which light of a second color is provided, and a third subpixel region SPXA3 defined by a third subpixel SPX3 to which light of a third color is provided.

[0109] According to some embodiments, a light control layer (LCL) and a color filter layer (CFL) are sequentially arranged on a display layer (DL) (for example, they may be provided sequentially), and first to third subpixels SPX1 to SPX3 can be defined.

[0110] In some embodiments, light-emitting diodes (LDs) may be placed in each of the first to third sub-pixel regions SPXA1 to SPXA3. For example, the first portion of the light-emitting diode LD may be provided in the first sub-pixel region SPXA1, the second portion in the second sub-pixel region SPXA2, and the third portion in the third sub-pixel region SPXA3. In some embodiments, the light-emitting diode LDs can emit light of a predetermined color. For example, the light-emitting diodes LDs placed in each of the first to third sub-pixel regions SPXA1 to SPXA3 can emit light of the same color from each other.

[0111] According to some embodiments, the light emitted by a light-emitting element LD located in the subpixel region SPXA may include a third color component and a second color component. For example, the light emitted by the light-emitting element LD may be a mixture of light corresponding to the third color spectrum and light corresponding to the second color spectrum.

[0112] According to some embodiments, the optical control layer LCL may include a color conversion layer CCL located within the first subpixel region SPXA1, and may also include a scattering layer SCT located within the second subpixel region SPXA2 and the third subpixel region SPXA3, respectively. For example, the scattering layer SCT may include a first scattering layer SCT1 located within the second subpixel region SPXA2 and a second scattering layer SCT2 located within the third subpixel region SPXA3.

[0113] According to some embodiments, the color filter layer CFL may include a color filter CF, and the color filter CF may include a first color filter CF1 located in a first subpixel region SPXA1, a second color filter CF2 located in a second subpixel region SPXA2, and a third color filter CF3 located in a third subpixel region SPXA3.

[0114] Within the first subpixel region SPXA1, the light emitted by the light-emitting element LD can be transmitted through the color conversion layer CCL and provided as light of the first color. For example, the color conversion layer CCL can convert light of the third color (or second color) to the first color. Then, the light provided as light of the first color after being transmitted through the color conversion layer CCL can be transmitted through the first color filter CF1 and provided as light of the first color. In this way, the first subpixel SPX1 can be configured to provide light of the first color.

[0115] Within the second subpixel region SPXA2, the light emitted by the light-emitting element LD can be transmitted through the first scattering layer SCT1 and provided as light of the same color as the emitted light. Then, the light provided as light of the same color as the emitted light after being transmitted through the first scattering layer SCT1 can be transmitted through the second color filter CF2 and provided as light of the second color. For example, the second color filter CF2 can selectively transmit light of the second color. In this way, the second subpixel SPX2 can be configured to provide light of the second color.

[0116] Within the third subpixel region SPXA3, the light emitted by the light-emitting element LD can be transmitted through the second scattering layer SCT2 and provided as light of the same color as the emitted light. Then, the light provided as light of the same color as the emitted light after being transmitted through the second scattering layer SCT2 can be transmitted through the third color filter CF3 and provided as light of a third color. For example, the third color filter CF3 can selectively transmit light of a third color. In this way, the third subpixel SPX3 can be configured to provide light of a third color.

[0117] In other words, according to some embodiments, the color conversion layer CCL, which is included in the light control layer LCL and changes the color of a single color of light, can be formed only on the first subpixel SPX1. In this case, it is possible to provide the technical effect of simplifying process operations while ensuring sufficient light emission efficiency and brightness.

[0118] According to some embodiments, when a display device DD embodies a full-color display structure including red, green, and blue subpixels SPX, even if a color conversion layer CCL containing quantum dots QD is formed only on the first subpixel SPX1 for displaying red light, without forming a color conversion structure containing quantum dots on the second and third subpixels SPX2 and SPX3 for displaying green and blue light respectively, the display device DD may still be equipped with desirable structural features and be able to ensure sufficient light efficiency. For example, the display device DD can be configured to have a simplified (e.g., cost-effective) design by using a color conversion layer CCL for only one type of subpixel (e.g., a red subpixel) out of three types of subpixels (e.g., a red subpixel, a green subpixel, and a blue subpixel), while still providing sufficient light efficiency.

[0119] First, the reason why it is appropriate to use a color conversion layer CCL to form the first subpixel SPX1 is as follows: Experimentally, when a light-emitting element LD emits light containing a red light component, the red light component emitted by the light-emitting element LD can have a relatively broad wavelength spectrum. In this case, even if the red light component emitted by the light-emitting element LD is transmitted through the first color filter CF1, it may be difficult to ensure sufficient light efficiency. For example, even if the red light component emitted by the light-emitting element LD is transmitted through the first color filter CF1, it may be difficult to ensure sufficient color purity. Therefore, in order to form a first subpixel SPX1 that ensures sufficient light efficiency (e.g., sufficient color purity), it may be appropriate to configure the first subpixel SPX1 so that the light emitted by the light-emitting element LD contains a blue light component, but a color conversion layer CCL is formed in the first subpixel SPX1 so that the blue light is converted into red light. Therefore, in some embodiments, the first subpixel SPX1 can be embodied using a color conversion layer CCL and a first color filter CF1, thereby (for example) the first subpixel SPX1 can provide (e.g., guarantee) sufficient light efficiency and / or color purity (e.g., sufficiently high light efficiency and / or color purity).

[0120] Next, the reason why the second subpixel SPX2 can be formed without forming a color conversion structure including quantum dots is as follows: Experimentally, when a light-emitting element LD emits light containing a green light component, the green light component emitted by the light-emitting element LD can have a relatively narrow wavelength spectrum. In this case, even if the green light component emitted by the light-emitting element LD passes through the second color filter CF2 without passing through a color conversion structure, it is possible to provide (e.g., ensure) optical efficiency and / or color purity (e.g., high optical efficiency and / or sufficiently high color purity) for providing green light to the second subpixel region SPXA2. Based on this principle, the light-emitting element LD in some embodiments can be configured to emit light containing a green light component, and the second subpixel SPX2 may be provided with a second color filter CF2 that provides green light without including a color conversion structure. As a result, the second subpixel SPX2 in some embodiments can have sufficient optical efficiency and / or color purity (e.g., it can have sufficiently high optical efficiency and / or high color purity characteristics).

[0121] Similarly, the light emitted by the light-emitting element LD can include a blue light component. The blue light element emitted from the light-emitting element LD can also have a relatively narrow wavelength spectrum. In this case, the third subpixel SPX3 does not need to include a color conversion structure having quantum dots. For example, even if the blue light component emitted from the light-emitting element LD passes through the third color filter CF3 without going through a color conversion structure, the third subpixel region SPXA3 can still provide (or be sufficiently ensured) sufficient light efficiency and / or color purity (e.g., sufficiently high light efficiency and / or sufficiently high color purity) to emit blue light.

[0122] In summary, based on the characteristics of the red / green / blue light spectra, a color conversion structure can be applied to only certain colored subpixels SPX. According to some embodiments, a display device DD can be provided configured such that each of the first to third subpixels SPX1 to SPX3 includes a color conversion layer CCL / first scattering layer SCT1 / second scattering layer SCT2. In some embodiments, the display device DD may be configured such that only the first subpixel SPX1 of the first, second, and third subpixels SPX1 to SPX3 includes the color conversion layer CCL. Ultimately, the display device DD according to some embodiments can have sufficient optical efficiency, and the manufacturing method of the display device DD according to some embodiments can be provided in such a way that some process operations are simplified and process costs are reduced (e.g., reduced process costs).

[0123] Referring to Figures 5 to 27, a display device DD according to some embodiments will be described in more detail below. Content that may overlap with the above will be briefly explained or omitted.

[0124] In the display device DD according to the embodiments shown in Figures 5 to 27, the color conversion layer CCL is manufactured by an inkjet process, but one or more of the first scattering layer SCT1 or the second scattering layer SCT2 may be manufactured by a photolithography process using a mask. For example, the color conversion layer CCL can be manufactured by an inkjet process, and the first scattering layer SCT1 and / or the second scattering layer SCT2 can be manufactured by a photolithography process.

[0125] Figures 5 to 7 are schematic cross-sectional views showing a display device according to some embodiments of the present disclosure.

[0126] According to some embodiments, the layers of the display device DD may be manufactured on the same substrate, or they may be manufactured on different substrates and then bonded together.

[0127] For example (see Figure 5), a first panel PNL1 can be manufactured by forming a display layer DL on the lower substrate BSUB, and a second panel PNL2 can be manufactured by forming a color filter layer CFL and an optical control layer LCL on the upper substrate USUB. The first panel PNL1 and the second panel PNL2 may be bonded together by interposing a packing layer FIL between them, thereby providing a display device DD. According to some embodiments, the first panel PNL1 and / or the second panel PNL2 may further include a dam structure to reduce (e.g., prevent) risks such as the diffusion of the packing layer FIL to the outside.

[0128] According to some embodiments, the light control layer LCL is formed below the color filter layer CFL and may include a bank QBNK, a color conversion layer CCL, a first capping layer QCP1, a first scattering layer SCT1, a second scattering layer SCT2, a spacer CS, and a second capping layer QCP2.

[0129] For example, the light control layer LCL may be formed on the upper substrate USUB and manufactured to be included in the second panel PNL2, thereby allowing it to be placed below the color filter layer CFL.

[0130] According to some embodiments, the bank QBNK can be located below the color filter layer CFL. For example, the bank QBNK may be located directly on the optical capping layer LCP. According to some embodiments, if the optical capping layer LCP is not formed, the bank QBNK may be located directly on the optical layer LR.

[0131] Bank QBNK can be placed between adjacent subpixel regions SPXA in a plan view. For example, bank QBNK can be superimposed with a non-subpixel region NSPXA along a third direction DR3 (e.g., in the corresponding plan view in Figure 16).

[0132] Bank QBNK can surround at least a portion of a region. For example, bank QBNK may surround at least a portion of a region for forming a subpixel region SPXA and may protrude in the thickness direction (e.g., third direction DR3) of the lower substrate BSUB (e.g., base layer BSL). This allows bank BNK to form a space in which the color conversion layer CCL and the scattering layer SCT are positioned (e.g., accommodated).

[0133] The planes defined herein are directions extending in the first direction DR1 and the second direction DR2 (see Figure 1), and can be defined relative to the plane on which the base layer BSL is located. According to some embodiments, the third direction DR3 may be the thickness direction of the base layer BSL, and the third direction DR3 may also be the light emission direction of the display device DD.

[0134] According to some embodiments, the bank QBNK may include tapered sides that are inclined on the sides adjacent to the surface on which the bank QBNK is placed. In this case, the area of ​​the region surrounded by the bank QBNK can be expanded as it moves outward with respect to the direction in which light diverges. For example, the area surrounded by the bottom of the bank QBNK may be smaller than the area surrounded by the top of the bank QBNK.

[0135] Bank QBNK can contain a variety of materials. For example, Bank QBNK may contain organic materials. According to some examples, Bank QBNK may contain one or more of acrylic resin, epoxy resin, phenolic resin, polyamide resin, or polyimide resin. According to some examples, Bank QBNK may further contain a scattering material (e.g., titanium oxide (TiOx)). However, the disclosure is not limited thereto.

[0136] The color conversion layer CCL can be located below the color filter layer CFL. For example, the color conversion layer CCL may be located directly on the optical capping layer LCP. According to some embodiments, if the optical capping layer LCP is not formed, the color conversion layer CCL may be located directly on the optical layer LR.

[0137] The color conversion layer CCL can be formed within the first subpixel region SPXA1. In a plan view (e.g., in the third direction DR3), the color conversion layer CCL can be superimposed on the first subpixel region SPXA1, but does not necessarily have to be superimposed on the second subpixel region SPXA2 and the third subpixel region SPXA3.

[0138] The color conversion layer CCL can be a configuration for forming the first subpixel SPX1. For example, the color conversion layer CCL may include a first color conversion particle that converts light supplied to the light-emitting element LD (e.g., light containing the second and third color components) into the first color. For example, the color conversion layer CCL may include a quantum dot QD that converts the third color light into the first color light. The quantum dot QD can absorb the third color light and shift its wavelength through energy transition, thereby emitting the first color light. The quantum dot QD may be dispersed within a matrix layer such as an organic material.

[0139] The first capping layer QCP1 may be located across the sub-pixel region SPXA and the non-sub-pixel region NSPXA. The first capping layer QCP1 may be located on at least a portion of the bank QBNK, the color conversion layer CCL, and the optical capping layer LCP.

[0140] The first capping layer QCP1 can be positioned on the color conversion layer CCL (e.g., color conversion layer CCL) within the first subpixel region SPXA1, with reference to the base (e.g., color conversion layer CFL, optical layer LR, or optical capping layer LCP) on which the optical control layer LCL (e.g., color conversion layer CCL) is positioned. The first capping layer QCP1 can be positioned on (e.g., below) the first and second scattering layers SCT1 and SCT2 (e.g., first and second scattering layers SCT1 and SCT2) within the second and third subpixel regions SPXA2 and SPXA3, with reference to the base (e.g., color conversion layer CFL, optical layer LR, or optical capping layer LCP) on which the optical control layer LCL (e.g., first and second scattering layers SCT1 and SCT2) is positioned. For example, the first capping layer QCP1 can passivate the color conversion layer CCL. The first capping layer QCP1 may be positioned on (e.g., directly on) the optical capping layer LCP within the second subpixel region SPXA2 and the third subpixel region SPXA3. According to some embodiments, if an optical capping layer LCP is not formed, the first capping layer QCP1 may be placed on (for example, directly on) the optical layers LR in the second subpixel region SPXA2 and the third subpixel region SPXA3.

[0141] Here, the first capping layer QCP1 may also be referred to as the "capping layer".

[0142] The first capping layer QCP1 may be manufactured after the inkjet process for manufacturing the color conversion layer CCL, or before the photolithography process for manufacturing the first scattering layer SCT1 and the second scattering layer SCT2. This allows the first capping layer QCP1 to be located below the color conversion layer CCL and above the first scattering layer SCT1 and the second scattering layer SCT2.

[0143] The first capping layer QCP1 is an inorganic layer and may contain one or more of the following: silicon nitride (SiNx), aluminum nitride (AlNx), titanium nitride (TiNx), silicon oxide (SiOx), aluminum oxide (AlxOy), titanium oxide (TiOx), silicon carbide (SiOxCy), or silicon oxynitride (SiOxNy). However, this disclosure is not limited to examples.

[0144] The first scattering layer SCT1 and the second scattering layer SCT2 can be located below the color filter layer CFL. For example, the first scattering layer SCT1 and the second scattering layer SCT2 may be located on the first capping layer QCP1 (e.g., directly). For example, the process for forming the first scattering layer SCT1 and the second scattering layer SCT2 may be carried out after the first capping layer QCP1 has been manufactured (e.g., after the first capping layer QCP1 has passedivated the color conversion layer CCL), so that the first scattering layer SCT1 and the second scattering layer SCT2 can be directly adjacent to the first capping layer QCP1.

[0145] The first scattering layer SCT1 can be formed within the second subpixel region SPXA2, and the second scattering layer SCT2 can be formed within the third subpixel region SPXA3. The first scattering layer SCT1 can be superimposed on the second subpixel region SPXA2 in a plan view (for example, along the third direction DR3), and the second scattering layer SCT2 can be superimposed on the third subpixel region SPXA3 in a plan view (for example, along the third direction DR3). The first scattering layer SCT1 and the second scattering layer SCT2 do not necessarily have to be superimposed on the first subpixel region SPXA1.

[0146] The first scattering layer SCT1 and the second scattering layer SCT2 may be layers provided to improve light emission efficiency (e.g., brightness) and improve viewing angle characteristics. For example, each of the first scattering layer SCT1 and the second scattering layer SCT2 may contain a scatterer SC. The scatterer SC may be dispersed in a matrix such as an organic material (e.g., a transparent organic material). According to some embodiments, the scatterer SC may include a first scatterer SC1 contained in the first scattering layer SCT1 and a second scatterer SC2 contained in the second scattering layer SCT2.

[0147] According to some embodiments, the concentrations of the first scatterer SC1 in the first scattering layer SCT1 and the second scatterer SC2 in the second scattering layer SCT2 may be different. This allows the relationship between the optical properties of the second and third subpixels SPX2 and SPX3 to be adjusted based on the concentrations of the first and second scatterers SC1 and SC2.

[0148] According to some embodiments, the scatterer SC may include a variety of light-scattering particles. For example, the scatterer SC may include one or more of the following: titanium oxide (TiOx), silica (SiOx) (e.g., silica beads, hollow silica, etc.), zirconium oxide (ZrOx), aluminum oxide (AlxOy), indium oxide (InxOy), zinc oxide (ZnOx), tin oxide (SnOx), or antimony oxide (SbxOy). However, the disclosure is not limited thereto.

[0149] According to some embodiments, the scatterer SC may be included in an amount ranging from about 0.1% to about 8.5% by weight relative to the scattering layer SCT. According to some embodiments, the scatterer SC may be included in an amount ranging from about 1.5% to about 8.5% by weight relative to the scattering layer SCT. According to some embodiments, the scatterer SC may be included in an amount ranging from about 4.0% to about 7.5% by weight relative to the scattering layer SCT. The above numerical ranges may be applied independently of each other in the first scattering layer SCT1 and the second scattering layer SCT2. However, this disclosure is not limited to examples.

[0150] The first scattering layer SCT1 and the second scattering layer SCT2 are color conversion particles and do not necessarily contain single quantum dots. For example, the first scattering layer SCT1 does not necessarily contain quantum dots for providing green light. The second scattering layer SCT2 does not necessarily contain quantum dots for providing blue light. As a result, the first scattering layer SCT1 and the second scattering layer SCT2 can transmit applied light without changing the color of the applied light.

[0151] In this specification, "without changing the color of the light applied to the first scattering layer SCT1 and the second scattering layer SCT2" can mean that the color of the light before and after transmission to the first scattering layer SCT1 and the second scattering layer SCT2 is substantially within the same range. For example, the light before transmission to the first scattering layer SCT1 may include a mixture of green and blue light (or have a wavelength band including green and blue light components), and the light after transmission to the first scattering layer SCT1 may include a mixture of green and blue light (or have a wavelength band including green and blue light components). The light before transmission to the second scattering layer SCT2 may include a mixture of green and blue light (or have a wavelength band including green and blue light components), and the light after transmission to the second scattering layer SCT2 may include a mixture of green and blue light (or have a wavelength band including green and blue light components).

[0152] According to some embodiments, the color conversion layer CCL may also include a scatterer SC. In this case, in the region where the color conversion layer CCL is formed, the light emitted by the light-emitting element LD can be scattered, and the viewing angle characteristics of the first subpixel SPX1 can be improved.

[0153] According to some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 can be manufactured in the same photolithography process. In this case, at least some of the process operations for manufacturing the second subpixel SPX2 and the third subpixel SPX3 can be simplified. However, the disclosure is not limited thereto. In some examples, the second photolithography process for manufacturing the second scattering layer SCT2 may be performed after the first photolithography process for manufacturing the first scattering layer SCT1, and the first photolithography process for manufacturing the first scattering layer SCT1 may be performed after the second photolithography process for manufacturing the second scattering layer SCT2.

[0154] According to some embodiments, the subpixel SPX can be manufactured to be even smaller by manufacturing the first scattering layer SCT1 and the second scattering layer SCT2 based on a photolithography process, thereby enabling the manufacture of a high-performance display device DD (e.g., high resolution).

[0155] The spacer CS can be positioned within the non-subpixel region NSPXA. According to some embodiments, the spacer CS does not need to overlap with the subpixel region SPXA in a plan view (for example, along the third direction DR3).

[0156] Spacer CS can be placed on bank QBNK. For example, spacer CS can be placed between bank QBNK and display layer DL. Spacer CS can also be placed directly on the first capping layer QCP1.

[0157] The spacer CS can be positioned above the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2, relative to the base on which the light control layer LCL is located. For example, the spacer CS can protrude in the thickness direction (e.g., the third direction DR3) of the lower substrate BSUB (e.g., the base layer BSL). When the process of joining the first panel PNL1 and the second panel PNL2 is carried out, the spacer CS can form a separation distance between the other components of the light control layer LCL and the display layer DL. For this reason, the spacer CS can be closest to the display layer DL compared to the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2.

[0158] The spacer CS can be manufactured in the same photolithography process as at least one of the first scattering layer SCT1 and the second scattering layer SCT2. This simplifies the process operation for forming the spacer CS and reduces process costs. In some examples, the spacer CS may be formed in the same process as the first scattering layer SCT1, the spacer CS may be formed in the same process as the second scattering layer SCT2, or the spacer CS may be formed in the same process as both the first and second scattering layers SCT1 and SCT2.

[0159] The spacer CS is manufactured in the same process as at least one of the first scattering layer SCT1 and the second scattering layer SCT2, and may contain the same materials as at least one of them, and may also contain a scatterer SC.

[0160] The second capping layer QCP2 can be positioned across the sub-pixel region SPXA and the non-sub-pixel region NSPXA. The second capping layer QCP2 can be positioned on the first capping layer QCP1, the first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS. The second capping layer QCP2 can passivate the first scattering layer SCT1 and the second scattering layer SCT2.

[0161] The second capping layer QCP2 can be manufactured after the photolithography process for producing the first scattering layer SCT1 and the second scattering layer SCT2.

[0162] The second capping layer QCP2 is an inorganic layer and may contain one or more of the following: silicon nitride (SiNx), aluminum nitride (AlNx), titanium nitride (TiNx), silicon oxide (SiOx), aluminum oxide (AlxOy), titanium oxide (TiOx), silicon carbide (SiOxCy), or silicon oxynitride (SiOxNy). However, this disclosure is not limited thereto.

[0163] As described above, a packed layer FIL may be interposed between the first panel PNL1 and the second panel PNL2. The packed layer FIL may contain various transparent organic materials, but examples are not particularly limited.

[0164] According to some embodiments, the color filter layer CFL is formed below the upper layer UPL and may include a color filter CF, an optical layer LR, and an optical capping layer LCP.

[0165] For example, the color filter layer CFL may be formed on the upper substrate USUB and manufactured to be included in the second panel PNL2, thereby allowing it to be positioned below the upper layer UPL.

[0166] According to some embodiments, the color filter CF may include a first color filter CF1 for forming a first subpixel SPX1, a second color filter CF2 for forming a second subpixel SPX2, and a third color filter CF3 for forming a third subpixel SPX3.

[0167] The color filter CF can be placed below the upper substrate USUB. For example, the color filter CF may be placed directly on the upper capping layer UCP.

[0168] The first color filter CF1 can be placed within the first subpixel region SPXA1. The first color filter CF1 may include a color filter material (e.g., a dye or pigment) that transmits (e.g., selectively transmits) light of a first color (e.g., red).

[0169] The second color filter CF2 can be placed within the second subpixel region SPXA2. The second color filter CF2 may include a color filter material (e.g., a dye or pigment) that transmits (e.g., selectively transmits) light of a second color (e.g., green).

[0170] The third color filter CF3 can be placed within the third subpixel region SPXA3. The third color filter CF3 may include a color filter material (e.g., a dye or pigment) that transmits (e.g., selectively transmits) a third color (e.g., blue) of light.

[0171] According to some embodiments, non-subpixel regions SPXA can be formed between subpixel regions SPXA in which no light of a single color can be seen. According to some embodiments, within the non-subpixel regions SPXA, a first color filter CF1, a second color filter CF2, and a third color filter CF3 can be superimposed in a plan view (along the third direction DR3).

[0172] The optical layer LR can be placed on the color filter CF. The optical layer LR may be placed across the sub-pixel region SPXA and the non-sub-pixel region NSPXA.

[0173] The optical layer LR can have a higher refractive index than the layer forming the color filter CF. The optical layer LR can have a lower refractive index than the color conversion layer CCL, allowing for the formation of an optical recycling structure.

[0174] The optical layer LR may contain various materials to have a single refractive index. For example, the optical layer LR may contain various resins and hollow silica. In some examples, the optical layer LR may contain zirconium oxide (ZrOx). However, this disclosure is not limited to examples.

[0175] Here, the optical layer LR can be called the low-refractive-index layer.

[0176] The optical capping layer (LCP) can be placed on the optical layer LR. The optical capping layer (LCP) can be placed across the sub-pixel region SPXA and the non-sub-pixel region NSPXA. The optical capping layer (LCP) can passivate the optical layer LR.

[0177] The optical capping layer LCP may include one or more of the examples described above with reference to the first capping layer QCP1. According to some embodiments, the optical capping layer LCP may be omitted (for example, it may not be provided).

[0178] According to some embodiments, an upper substrate USUB can be placed on the color filter layer CFL as a base material for manufacturing the second panel PNL2, and according to some embodiments, an upper capping layer UCP can be placed on the upper substrate USUB.

[0179] The upper substrate USUB may also be a manufacturing substrate for producing the second panel PNL2 and may contain one or more of the materials described above with reference to the lower substrate BSUB (e.g., base layer BSL). For example, the upper substrate USUB may include an organic substrate.

[0180] The upper capping layer UCP can be placed between the upper substrate USUB and the color filter CF, and may include one or more of the examples (e.g., materials) described above with reference to the first capping layer QCP1.

[0181] According to some embodiments (see Figure 6), a first panel PNL1 can be manufactured by forming a display layer DL and an optical control layer LCL on the lower substrate BSUB, a second panel PNL2 can be manufactured by forming a color filter layer CFL on the upper substrate USUB, and the first panel PNL1 and the second panel PNL2 can be joined by interposing a packing layer FIL between them, thereby providing a display device DD.

[0182] For example, the display device DD shown in Figure 6 differs from the display device DD shown in Figure 5 in that the configuration for forming the light control layer LCL (e.g., bank QBNK, color conversion layer CCL, first capping layer QCP1, first scattering layer SCT1, second scattering layer SCT2, spacer CS, second capping layer QCP2) is arranged on the lower substrate BSUB (for example, even before the first panel PNL1 and the second panel PNL2 are coupled).

[0183] As a result, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 can be arranged adjacent to the display layer DL and included in the first panel PNL1. Furthermore, the packed layer FIL can be interposed between the layer forming the light control layer LCL and the color filter layer CFL.

[0184] According to some embodiments (see Figure 7), the upper substrate USUB is not provided separately, and the first panel PNL1 can be manufactured by forming the display layer DL, optical control layer LCL, color filter layer CFL, and upper layer UPL on the lower substrate BSUB, and the display device DD can be provided without a separate panel bonding process.

[0185] In this case, the display device DD shown in Figure 7 differs from the display device DD shown in Figure 6 in that the color filter layer CFL and the upper layer UPL are also arranged on the lower substrate BSUB.

[0186] In this case, the optical layer LR and the color filter layer CF can be sequentially arranged on the optical control layer LCL. Furthermore, according to some embodiments, a planarization layer PLA containing an organic material may be further arranged on the color filter layer CF. According to some embodiments, the upper substrate USUB does not need to be formed, and an upper film layer UFM can be arranged on the upper capping layer UCP. According to some embodiments, the upper film layer UFM may include one or more of a PET (polyethyleneterephthalate) film, a low-reflection film, a polarizing film, or a transmittance controllable film. However, this disclosure is not limited thereto.

[0187] Various technical features of the optical control layer (LCL) will be described later, referring to Figures 8 to 27.

[0188] Figure 8 is a schematic cross-sectional view illustrating the thickness relationship between the first scattering layer, the second scattering layer, and the color conversion layer in some embodiments.

[0189] Figures 9 to 11 are schematic cross-sectional views illustrating the relationship between the scatterers contained in the first and second scattering layers, respectively, according to some embodiments of this disclosure.

[0190] Figure 8 shows a first subpixel region SPXA1, a second subpixel region SPXA2, a third subpixel region SPXA3, and adjacent regions according to some embodiments of the present disclosure. For example, Figure 8 shows a color conversion layer CCL located in the first subpixel region SPXA1, a first scattering layer SCT1 and a second scattering layer SCT2 located in the second subpixel region SPXA2 and the third subpixel region SPXA3, and a bank QBNK surrounding the color conversion layer CCL, the first scattering layer SCT1 and the second scattering layer SCT2. Referring to Figure 8, the color conversion layer CCL may have a thickness greater than the first and second scattering layers SCT1 and SCT2. Thickness as used herein can be defined with respect to the thickness direction of the base layer BSL (e.g., the third direction DR3).

[0191] For example, the color conversion layer CCL may have a first thickness T1. The first scattering layer SCT1 may have a second thickness T2. The second scattering layer SCT2 may have a third thickness T3. The first thickness T1 may be greater than the second thickness T2 and the third thickness T3. According to some embodiments, the second thickness T2 and the third thickness T3 may be substantially the same as each other.

[0192] According to some embodiments, it is preferable that the subpixels SPX have substantially uniform light emission efficiencies. For example, it may be appropriate for the first subpixel SPX1, the second subpixel SPX2, and the third subpixel SPX3 to have corresponding light emission efficiencies (e.g., substantially equal light emission efficiencies).

[0193] Since the first subpixel SPX1 for emitting the first color can be realized by the color conversion layer CCL, its color realization efficiency (e.g., current efficiency) can be relatively low compared to the second and third subpixels SPX1 and SPX2.

[0194] According to some embodiments, the first thickness T1 of the color conversion layer CCL contained in the first subpixel SPX1 can be defined as being larger than the second and third thicknesses T2 and T3 of the first and second scattering layers SCT1 and SCT2 contained in the second and third subpixels SPX2. In this case, the color conversion layer CCL is defined as being relatively thick, and can contain a larger amount of scatterer SC compared to the first and second scattering layers SCT1 and SCT2, thereby compensating for the difference in color realization efficiency between the first to third subpixels SPX1 to SPX3.

[0195] Furthermore, since the first and second scattering layers SCT1 and SCT2, each containing no single quantum dot, can have corresponding thicknesses (for example, substantially equal thicknesses), the convenience of the process can be improved.

[0196] Figures 9 to 11 show a second subpixel region SPXA2, a third subpixel region SPXA3, and adjacent regions according to some embodiments of the present disclosure. For example, Figures 9 to 11 show a first scattering layer SCT1 and a second scattering layer SCT2 located in the second subpixel region SPXA2 and the third subpixel region SPXA3, and a bank QBNK surrounding the first scattering layer SCT1 and the second scattering layer SCT2.

[0197] According to some embodiments, adjacent banks QBNK surrounding the first scattering layer SCT1 can be separated by a first distance L1. Adjacent banks QBNK surrounding the second scattering layer SCT2 can be separated by a second distance L2.

[0198] Referring to Figure 9, according to some embodiments, the first scatterer SC1 can be larger than the second scatterer SC2. In this case, according to some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 can be manufactured by separate processes.

[0199] In this specification, the size of the scatterer SC can mean the largest diameter that can be defined relative to the particles in the scatterer SC.

[0200] For example, in some embodiments, if the scatterer SC is elliptical, the size of the scatterer SC can be the semi-major axis of the ellipse. For example, in some embodiments, if the scatterer SC is circular, the size of the scatterer SC can be its diameter. For example, in some embodiments, if the scatterer SC has a shape including irregular protruding structures, the size of the scatterer SC can be the distance between the furthest apart ends within the shape of the scatterer SC.

[0201] The scatterer SC can most efficiently scatter light with a wavelength range twice the size of the scatterer SC.

[0202] For example, in some embodiments, when the diameter of the scatterer SC is approximately 300 nm to 375 nm, light in the wavelength range of approximately 600 nm to 750 nm can be efficiently scattered. According to some embodiments, when the diameter of the scatterer SC is approximately 240 nm to 280 nm, light in the wavelength range of approximately 480 nm to 560 nm can be efficiently scattered. According to some embodiments, when the diameter of the scatterer SC is approximately 185 nm to 230 nm, light in the wavelength range of approximately 370 nm to 460 nm can be efficiently scattered.

[0203] As a result, according to some embodiments, the size of the first scatterer SC1 can be set to correspond to the wavelength band of light provided by the second subpixel SPX2, and the size of the second scatterer SC2 can be set to correspond to the wavelength band of light provided by the third subpixel SPX3.

[0204] For example, the first scatterer SC1 can have a size in the range of approximately 240 nm to approximately 280 nm. The second scatterer SC2 can have a size in the range of approximately 185 nm to approximately 230 nm.

[0205] As a result, according to some embodiments, the scattering performance of the first scattering layer SCT1 and the second scattering layer SCT2 can be provided (e.g., optimized) for each subpixel SPX.

[0206] Referring to Figure 10, in some embodiments, the first scatterer SC1 and the second scatterer SC2 may be the same size, the first scatterer SC1 may be included in the first scattering layer SCT1 in a first weight ratio, the second scatterer SC2 may be included in the second scattering layer SCT2 in a second weight ratio, and the first weight ratio may be greater than the second weight ratio. For example, the number of first scatterers SC1 in the first scattering layer SCT1 may be greater than the number of second scatterers SC2 in the second scattering layer SCT2.

[0207] As described above, it is preferable that the subpixels SPX have roughly uniform light emission efficiencies. It may be appropriate for the second subpixel SPX2 and the third subpixel SPX3 to have corresponding light emission efficiencies (for example, substantially equal light emission efficiencies). For example, the light emitted by the light-emitting elements LDs arranged in each of the subpixel regions SPXA may include a second color component and a third color component, but the third color component may be for forming the third subpixel SPX3 which provides third color light and the first subpixel SPX which provides first color light by the color conversion layer CCL. As a result, when comparing the second subpixel SPX2 and the third subpixel SPX3, the third subpixel SPX3 may have a higher light emission efficiency than the second subpixel SPX2, so it is preferable to compensate for the light emission efficiency of the second subpixel SPX2 and the third subpixel SPX3 so that their light emission efficiencies correspond to each other (for example, substantially the same).

[0208] Since the scatterer SC can scatter applied light and improve the light emission efficiency, the higher the proportion of the scatterer SC included in the scattering layer SCT, the higher the light emission efficiency of the corresponding subpixel SPX can be.

[0209] According to some embodiments, the first scatterer SC1 of the first scattering layer SCT1 can be included in a higher weight ratio than the second scatterer SC2 of the second scattering layer SCT2, compensating for the difference in light emission efficiency, so that the second subpixel SPX2 and the third subpixel SPX3 can have roughly uniform light emission efficiencies.

[0210] Referring to Figure 11, according to some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 may be formed by the same process and may contain materials of the same composition. Furthermore, the first scatterer SC1 and the second scatterer SC2 may each contain scatterers of different sizes. For example, the first scatterer SC1 and the second scatterer SC2 may each contain scatterers of different sizes in the same composition ratio.

[0211] The scatterer SC can relatively efficiently scatter light with a wavelength band twice the size of the scatterer SC.

[0212] According to some embodiments, each of the first scatterer SC1 and the second scatterer SC2 may include both a relatively large scatterer for efficiently scattering the second color of light and a relatively small scatterer for efficiently scattering the third color of light. This allows the first scattering layer SCT1 and the second scattering layer SCT2 to be manufactured in the same process, simplifying the process while improving the light emission efficiency for each subpixel SPX.

[0213] Figures 12 to 15 are cross-sectional views illustrating the features of the optical control layer according to some embodiments of this disclosure.

[0214] For the sake of explanation, Figures 12 to 15 show the optical control layer LCL, etc., based on the cross-sectional structure described above with reference to Figure 5. For the sake of explanation, Figures 12 to 15 show the color filter layer CFL and optical control layer LCL arranged on the upper substrate USUB. For example, Figures 12 to 15 show the second panel PNL2, and in order to explain the structure in which the second panel PNL2 is formed, a structure is shown in which the upper substrate USUB is placed at the bottom and the color filter layer CFL and optical control layer LCL are sequentially arranged on the upper substrate USUB.

[0215] Referring to Figure 12, in some embodiments, the optical layer LR can be placed only in a portion of the subpixel region SPXA (for example, selectively).

[0216] For example, the optical layer LR may be located within the first subpixel region SPXA1. The optical layer LR does not have to be located within the second subpixel region SPXA2 and the third subpixel region SPXA3. As a result, according to some embodiments, the first capping layer QCP1 can be directly adjacent (e.g., in contact) with the second and third color filters CF2 and CF3 in the second and third subpixel regions SPXA2 and SPXA3, respectively.

[0217] According to some embodiments, the optical layer LR is a low-refractive-index layer and can have a lower refractive index than the color conversion layer CCL. This allows light supplied from the color conversion layer CCL to be reflected by the optical layer LR and supplied back to the color conversion layer CCL, forming a light recycling structure.

[0218] According to some embodiments, quantum dots (QDs) configured to change the color of light can be placed in the first subpixel region SPXA1 instead of the second and third subpixel regions SPXA2 and SPXA3. Therefore, it is particularly preferable that the light recycling structure be formed in the first subpixel region SPXA1.

[0219] As a result, according to some embodiments, the optical layer LR is selectively placed in only certain areas, thus reducing the process costs for manufacturing the display device DD. Furthermore, since the scattering layer SCT can be placed in the second and third sub-pixel regions SPXA2 and SPXA3, where the optical layer LR is not present, only to the extent of the thickness of the optical layer LR, the scattering performance of the scattering layer SCT in the second and third sub-pixel regions SPXA2 and SPXA3 can be further improved.

[0220] Referring to Figure 13, in some embodiments, the display device DD may further include a black matrix layer BM, and the black matrix layer BM may be placed in the non-subpixel region NSPXA adjacent to the second and third subpixel regions SPXA2 and SPXA3 without a bank QBNK. For example, in some embodiments, the black matrix layer BM may be provided between the second and third subpixel regions SPXA2 and SPXA3 instead of the bank QBNK. The black matrix layer BM can penetrate between the first scattering layer SCT1 and the second scattering layer SCT2.

[0221] According to some embodiments, a bank QBNK can be patterned in a non-subpixel region NSPXA adjacent to a first subpixel region SPXA1, and a black matrix layer BM can be placed in the non-subpixel region NSPXA that is not directly adjacent to the first subpixel region SPXA1. In plan view, the black matrix layer BM can be placed within the non-subpixel region NSPXA and does not overlap with the subpixel region SPXA. According to some embodiments, the black matrix layer BM can be directly adjacent (e.g., in contact) with the first capping layer QCP1. However, this disclosure is not limited to examples.

[0222] According to some embodiments, the second scattering layer SCT2 and the third scattering layer SCT3 can be manufactured by a photolithography process rather than an inkjet process, so that the second scattering layer SCT2 and the third scattering layer SCT3 can be properly patterned even if the bank QBNK is not located adjacent to the second scattering layer SCT2 and the third scattering layer SCT3.

[0223] For example, according to some embodiments, a base scattering layer containing a scatterer SC can be placed across a second subpixel region SPXA2 and a third subpixel region SPXA3 to produce a first scattering layer SCT1 and a second scattering layer SCT2, and a black matrix layer BM penetrating the base scattering layer can be patterned in regions adjacent to the second subpixel region SPXA2 and the third subpixel region SPXA3.

[0224] According to some embodiments, the black matrix layer BM may contain dyes or pigments that can block or absorb light. For example, the black matrix layer BM may contain carbon black, but this disclosure is not limited to examples.

[0225] Referring to Figures 14 and 15, a display device DD (e.g., light control layer LCL) according to some embodiments may further include a packed scattering layer FSCT containing a packed scattering body FSC. The packed scattering body FSC may include a first packed scattering body FSC1 and a second packed scattering body FSC2. The packed scattering layer FSCT may include a first packed scattering layer FSCT1 on which the first packed scattering body FSC1 is disposed, and a second packed scattering layer FSCT2 on which the second packed scattering body FSC2 is disposed. The packed scattering layer FSCT can mean a material in which the packing material contains a packed scattering body FSC containing a scattering material.

[0226] According to some embodiments, the first packing scattering layer FSCT1 can be placed within the second subpixel region SPXA2. The first packing scattering layer FSCT1 can be superimposed on the first scattering layer SCT1 in a plan view (along the third direction DR3). The second packing scattering layer FSCT2 can be placed within the third subpixel region SPXA3. The second packing scattering layer FSCT2 can be superimposed on the second scattering layer SCT2 in a plan view (along the third direction DR3).

[0227] For example (see Figure 14), the first packed scattering layer FSCT1 can be placed on the first scattering layer SCT1 and can be passivated by the second capping layer QCP2 (e.g., coated or protected). The second packed scattering layer FSCT2 can be placed on the second scattering layer SCT2 and can be passivated by the second capping layer QCP2. According to some embodiments, the first packed scattering layer FSCT1 and the second packed scattering layer FSCT2 can be patterned after the first scattering layer SCT1 and the second scattering layer SCT2 have been patterned.

[0228] In other examples (see Figure 15), the first packed scattering layer FSCT1 may be positioned between the first scattering layer SCT1 and the second color filter CF2, and may be adjacent to (e.g., directly adjacent to) the first capping layer QCP1 depending on the embodiment. The second packed scattering layer FSCT2 may be positioned between the second scattering layer SCT2 and the third color filter CF3, and may be adjacent to (e.g., directly adjacent to) the first capping layer QCP1 depending on the embodiment. According to some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 may be patterned after the first packed scattering layer FSCT1 and the second packed scattering layer FSCT2 have been patterned.

[0229] According to some embodiments, multiple scattering structures with various scattering characteristics are formed in the second and third sub-pixel regions SPXA2 and SPXA3, thereby further improving the scattering performance and, consequently, improving the light output efficiency of the display device DD.

[0230] Figures 16 to 21 are plan views illustrating the arrangement relationship between banks and subpixel regions in some embodiments of this disclosure.

[0231] For ease of explanation, Figures 16 to 21 show a portion of the display area DA, showing the sub-pixel area SPXA and the adjacent bank QBNK. Figures 16 to 19 show a structure in which the first sub-pixel area SPXA1 and the second sub-pixel area SPXA2 are adjacent to the second direction DR2, and the third sub-pixel area SPXA3 is adjacent to the first sub-pixel area SPXA1 and the first direction DR1, according to some embodiments of the present disclosure. Figures 17 to 19 show pixels PXL adjacent to each other within the display area DA according to embodiments of the present disclosure. For example, Figures 17 to 19 show the first pixel PXL1 and the second pixel PXL2 among the pixels PXL adjacent to the first direction DR1. Figures 20 and 21 show a structure in which the sub-pixel areas SPXA are sequentially arranged in the first direction DR1, according to embodiments of the present disclosure.

[0232] Referring to Figure 16, bank QBNK can enclose at least a portion of each subpixel region SPXA. Figure 16 shows a single pixel PXL within display region DA according to some embodiments of the present disclosure.

[0233] According to some embodiments, bank QBNK can form a closed-loop for each of the subpixel regions SPXA. For example, in a plan view, bank QBNK can completely surround the first subpixel region SPXA1 (e.g., the color conversion layer CCL) (e.g., surround all sides). In a plan view, bank QBNK can completely surround the second subpixel region SPXA2 (e.g., the first scattering layer SCT1). In a plan view, bank QBNK can completely surround the third subpixel region SPXA3 (e.g., the second scattering layer SCT2).

[0234] Referring to Figure 17, in plan view, bank BNK can enclose only one of the subpixel regions SPXA (for example, any three subpixel regions SPXA).

[0235] According to some embodiments, the bank QBNK can completely surround the first subpixel region SPXA1 (e.g., the color conversion layer CCL). This allows the bank QBNK to form a closed-loop structure, enabling an inkjet process for manufacturing the color conversion layer CCL.

[0236] Furthermore, according to some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 can be manufactured by a photolithography process rather than an inkjet process, so that the first scattering layer SCT1 and the second scattering layer SCT2 can be manufactured properly even if the bank QBNK does not directly surround the second and third subpixel regions SPXA2 and SPXA3.

[0237] According to some embodiments, the second subpixel region SPXA2 and the third subpixel region SPXA3, which are not directly surrounded by bank QBNK, can be further separated than the separation distance to the first subpixel region SPXA1.

[0238] For example, the separation distance between the second subpixel region SPXA2 and the third subpixel region SPXA3 may be greater than the separation distance between the first subpixel region SPXA1 and the third subpixel region SPXA3, and the separation distance between the first subpixel region SPXA1 and the second subpixel region SPXA2.

[0239] This reduces the risk of color mixing between the second subpixel SPX2 and the third subpixel SPX3, even if bank QBNK is not formed directly adjacent to the second subpixel region SPXA2 and the third subpixel region SPXA3.

[0240] Referring to Figure 18, according to some embodiments, similar to Figure 17, the bank QBNK can completely surround the first subpixel region SPXA1 (e.g., the color conversion layer CCL), but surround only at least a portion of the second subpixel region SPXA2 (e.g., the first scattering layer SCT1), leaving at least the other portion of the second subpixel region SPXA2 (e.g., the first scattering layer SCT1) open. This allows at least one side of the second subpixel region SPXA2 to include an open edge OEDG where the bank QBNK is not located.

[0241] According to some embodiments, the bank QBNK can be located in a region adjacent to the third subpixel region SPXA3 (e.g., the second scattering layer SCT2) and does not have to directly surround the third subpixel region SPXA3 (e.g., the second scattering layer SCT2). This allows the outer perimeter of the third subpixel region SPXA3 to be left open.

[0242] According to some embodiments, the open edge OEDG can be formed to face a direction different from the direction that faces the third subpixel region SPXA3 with respect to the second subpixel region SPXA2. For example, the open edge OEDG can be formed to be farther from the third subpixel region SPXA3 so that the bank QBNK is formed around the second side of the second subpixel region SPXA2—which is closer to the third subpixel region SPXA3 than the open edge OEDG.

[0243] For example, the open edge OEDG may be positioned at the top of the second subpixel region SPXA2 with respect to the second direction DR2, and the third subpixel region SPXA3 may be positioned at the lower right side of the second subpixel region SPXA2 with respect to the second direction DR2.

[0244] In this case, the risk of color mixing between the second subpixel SPX2 and the third subpixel SPX3 can be reduced.

[0245] According to some embodiments, as described above, the bank QBNK does not directly surround the third subpixel region SPXA3, but since it is positioned adjacent to the first and second subpixel regions SPXA1 and SPXA2, it can be roughly adjacent to the third subpixel region SPXA3. For example, the third subpixel region SPXA3 of the first pixel PXL1 can be positioned between a portion of the bank QBNK of the first pixel PXL1 and a portion of the bank QBNK of the second pixel PXL2.

[0246] This allows us to define the separation distance between bank QBNK and the second and third sub-pixel regions SPXA2 and SPXA3. According to some embodiments, the shortest distance between bank QBNK and the second sub-pixel region SPXA2 may be smaller than the shortest distance between bank QBNK and the third sub-pixel region SPXA3.

[0247] Furthermore, according to some embodiments, the bank QBNK can surround the regions where the first scattering layer SCT1 and the second scattering layer SCT2 are located by different ranges. In this case, the thickness of the first scattering layer SCT1 and the second scattering layer SCT2 can be manufactured to be roughly uniform without any additional processes. Moreover, since the first scattering layer SCT1 and the second scattering layer SCT2 can be patterned based on a photolithography process rather than an inkjet process, the uniformity of the first scattering layer SCT1 and the second scattering layer SCT2 (e.g., uniformity of thickness) can be improved. In addition, process operations can be simplified, sufficient process margins can be secured, and process costs can be reduced.

[0248] Referring to Figure 19, according to some embodiments, similar to Figure 18, the bank QBNK can be positioned so as to be directly adjacent to the first and second subpixel regions SPXA2 and relatively separated from the third subpixel region SPXA3, but in plan view, the bank QBNK can completely surround the second subpixel region SPXA2.

[0249] For example, bank QBNK can form a closed-loop structure surrounding the second subpixel region SPXA2.

[0250] In this case, when patterning a transparent organic material containing a scatterer SC to form the first scattering layer SCT1 and the second scattering layer SCT2, the thickness of the second scattering layer SCT2 can be manufactured to be relatively thinner than that of the first scattering layer SCT1. For example, since the first scattering layer SCT1 and the second scattering layer SCT2 contain organic material, a phenomenon of diffusion (e.g., spreading) can occur in the first scattering layer SCT1 and the second scattering layer SCT2. According to some embodiments, since the second subpixel region SPXA2 is entirely surrounded by bank QBNK, the diffusion phenomenon of the first scattering layer SCT1 can be substantially prevented, and a portion of the second scattering layer SCT2 can be diffused over a relatively wide area. For this reason, the second scattering layer SCT2 can be provided with a thinner thickness than the first scattering layer SCT1.

[0251] According to some embodiments, as described above, it may be appropriate for the first scattering layer SCT1 to contain a larger amount of scatterer SC than the second scattering layer SCT2 so that the second subpixel SPX2 and the third subpixel SPX3 can have relatively corresponding light emission efficiencies. According to some embodiments, the second scattering layer SCT2 can be provided with a thinner thickness than the first scattering layer SCT1, so the second scattering layer SCT2 can contain a relatively larger amount of scatterer SC than the first scattering layer SCT1. As a result, according to the structure of the bank QBNK in some embodiments, the second subpixel SPX2 and the third subpixel SPX3 can be provided to have relatively corresponding light emission efficiencies (e.g., substantially the same light emission efficiency).

[0252] Referring to Figures 20 and 21, the first subpixel region SPXA1, the second subpixel region SPXA2, and the third subpixel region SPXA3 may be arranged sequentially along the first direction DR1, and bank QBNK may surround at least a portion of the subpixel region SPXA.

[0253] For example (see Figure 20), bank QBNK can form a closed-loop structure surrounding the first subpixel region SPXA1, the second subpixel region SPXA2, and the third subpixel region SPXA3, respectively.

[0254] In other examples (see Figure 21), bank QBNK may completely surround the first subpixel region SPXA1, leaving at least a portion of the second and third subpixel regions SPXA2 and SPXA3 open. For example, bank QBNK does not have to be located on at least one side of the second and third subpixel regions SPXA2 and SPXA3.

[0255] According to some embodiments, bank QBNK may include an isolated bank portion QBNK_I. The isolated bank portion QBNK_I can be a part of bank QBNK that is separated from other bank QBNKs. The isolated bank portion QBNK_I may be located between the second subpixel region SPXA2 and the third subpixel region SPXA3.

[0256] According to some embodiments, the isolated bank portion QBNK_I can extend in a direction different from the direction in which the second subpixel region SPXA2 and the third subpixel region SPXA3 are separated from each other (for example, the second direction DR2).

[0257] According to some embodiments, the first scatterer SCT1 and the second scatterer SCT2 do not need to be manufactured by the ink process, so the bank QBNK can also leave one side of the second subpixel region SPXA2 and the third subpixel region SPXA3 open.

[0258] According to some embodiments, the area where the bank QBNK is placed can be minimized, thereby reducing process costs. Furthermore, since the first scattering layer SCT1 and the second scattering layer SCT2 can be patterned based on a photolithography process rather than an inkjet process, the uniformity of the first scattering layer SCT1 and the second scattering layer SCT2 (e.g., uniformity of thickness) can be improved.

[0259] According to some embodiments, the isolated bank portion QBNK_I, which is part of bank QBNK, can be positioned (e.g., selectively positioned) between the second subpixel region SPXA2 and the third subpixel region SPXA3, thereby reducing the risk of color mixing between the second subpixel SPX2 and the third subpixel SPX3.

[0260] According to some embodiments, the isolated bank portion QBNK_I, which is part of bank QBNK, does not have to be located between the first pixel PXL1 and the second pixel PXL2, which are separated by a relatively wide distance (for example, between the second and third sub-pixel regions SPXA2, SPXA3 of the first pixel PXL1 and the second and third sub-pixel regions SPXA2, SPXA3 of the second pixel PXL2). In other words, the isolated bank portion QBNK_I does not need to be located in areas where the risk of color mixing is relatively low, thereby reducing the cost of process materials.

[0261] FIGS. 22 to 26 are plan views for explaining the positional relationship between spacers and sub-pixel regions according to some embodiments of the present disclosure.

[0262] For convenience of explanation, FIGS. 22 to 26 show a partial region of the display area DA, illustrating the sub-pixel region SPXA and the spacer CS arranged adjacent thereto.

[0263] FIGS. 22 to 24 show a planar structure in which sub-pixel regions SPXA are sequentially arranged along the first direction DR1. For convenience of explanation, FIGS. 22 to 24 show a planar structure in which the first pixel PXL1 and the second pixel PXL2 are adjacent in the second direction DR2. FIGS. 25 and 26 show a planar structure in which the first sub-pixel region SPXA1 and the third sub-pixel region SPXA3 are adjacent in the first direction DR1, and the second sub-pixel region SPXA2 is spaced apart from the first sub-pixel region SPXA1 and the third sub-pixel region SPXA3 in the second direction DR2. For convenience of explanation, FIGS. 25 and 26 show a planar structure in which the first pixel PXL1 and the second pixel PXL2 are adjacent in the first direction DR1 according to some embodiments of the present disclosure.

[0264] Referring to FIGS. 22 to 24, the spacer CS may be arranged in a region where the sub-pixel region SPXA is not formed (for example, the non-sub-pixel region NSPXA). The spacers CS may be arranged adjacently between the sub-pixel regions SPXA.

[0265] According to some embodiments (see FIG. 22), the spacer CS may be arranged between the sub-pixel regions SPXA with reference to the first direction DR1. For example, the spacer CS may be arranged between the first sub-pixel region SPXA1 and the second sub-pixel region SPXA2. The spacer CS may be arranged between the second sub-pixel region SPXA2 and the third sub-pixel region SPXA3. The spacer CS may be arranged between the first sub-pixel region SPXA1 and the third sub-pixel region SPXA3. Accordingly, the spacers CS can be sequentially arranged in the first direction DR1, and can be sequentially arranged along the second direction DR2.

[0266] According to some embodiments (see Figure 23), the spacer CS can be placed between sub-pixel regions SPXA with respect to the second direction DR2. The spacer CS can be placed between different pixels PXL adjacent to each other in the second direction DR2. For example, the spacer CS may be placed between the first sub-pixel region SPXA1 of the first pixel PXL1 and the first sub-pixel region SPXA1 of the second pixel PXL2. The spacer CS may be placed between the second sub-pixel region SPXA2 of the first pixel PXL1 and the second sub-pixel region SPXA2 of the second pixel PXL2. The spacer CS may be placed between the third sub-pixel region SPXA3 of the first pixel PXL1 and the third sub-pixel region SPXA3 of the second pixel PXL2.

[0267] According to some embodiments (see Figure 24), the spacer CS does not have to overlap with the subpixel region SPXA along the first direction DR1 or the second direction DR2. For example, the spacer CS may be positioned between the first pixel PXL1 and the second pixel PXL2 along the first direction DR1, or it may be positioned so as not to overlap with the subpixel region SPXA along the second direction DR2.

[0268] Referring to Figures 25 and 26, the spacer CS can be placed in a relatively large area where the sub-pixel area SPXA is not located. According to some embodiments, the spacer CS can be placed in a relatively large area that is part of the region where the pixel PXL is formed but where the sub-pixel area SPXA is not formed, thereby enabling more efficient use of the display area DA.

[0269] According to some embodiments (see Figure 25), the spacer CS can be placed between different pixels PXL. For example, the spacer CS may be placed along a first direction DR1 between the second subpixel region SPXA2 of the first pixel PXL1 and the second subpixel region SPXA2 of the second pixel PXL2. The spacer CS does not have to overlap the subpixel region SPXA in a direction different from the direction in which the first pixel PXL1 and the second pixel PXL2 are separated from each other (e.g., the second direction DR2).

[0270] In some embodiments, the sub-pixel regions SPXA may be separated by a predetermined distance. In this case, the spacer CS can be placed between sub-pixel regions SPXA that are separated by a relatively wide distance. For example, in a single pixel PXL, the first sub-pixel region SPXA1 and the second sub-pixel region SPXA2 may be separated by a first separation distance PL1. The second sub-pixel region SPXA2 of the first pixel PXL1 and the second sub-pixel region SPXA2 of the second pixel PXL2 may be separated by a second separation distance PL2 which is greater than the first separation distance PL1. In some embodiments, the second separation distance PL2 can be the largest separation distance between sub-pixel regions SPXA defined within the display region DA. In some embodiments, the spacer CS may be placed within the region in which the second separation distance PL2 is defined.

[0271] According to some embodiments (see Figure 26), the spacer CS can be positioned along a first direction DR1 between the second subpixel regions SPXA2 of different pixels PXL. For example, the spacer CS can be superimposed along the first direction DR1 with the second subpixel regions SPXA2 of the first pixel PXL1 and the second subpixel regions SPXA2 of the second pixel PXL2. For example, the spacer CS and the second subpixel regions SPXA2 may be arranged alternately along the first direction DR1.

[0272] According to some embodiments, the spacer CS can be superimposed on the third subpixel region SPXA3 along the second direction DR2. This prevents the spacer CS from superimposing on the first subpixel region SPXA1 along the first direction DR1 and the second direction DR2, respectively.

[0273] According to some embodiments (see Figures 27 and 28), the color conversion layer CCL and the first scattering layer SCT1 are manufactured by an inkjet process, while the second scattering layer SCT2 may be manufactured by a photolithography process using a mask.

[0274] Figure 27 is a schematic plan view showing the display area of ​​a display device according to some embodiments. Figure 28 is a schematic cross-sectional view along A to A' of Figure 27, and is a schematic cross-sectional view showing the second panel. In some embodiments of this disclosure, for the sake of explanation, Figure 28 shows an embodiment in which the second panel PNL2 includes an optical control layer LCL, and shows a structure in which a color filter layer CFL and an optical control layer LCL are arranged on the upper substrate USUB.

[0275] Referring to Figures 27 and 28, bank QBNK can form a closed-loop structure surrounding the first subpixel region SPXA1 and the second subpixel region SPXA2, respectively. This allows the color conversion layer CCL and the first scattering layer SCT1 to be manufactured by an inkjet process.

[0276] According to some embodiments, the first capping layer QCP1 may be manufactured after the color conversion layer CCL and the first scattering layer SCT1 are manufactured by an inkjet process, and the second scattering layer SCT2 may be patterned after the first capping layer QCP1 is placed. This allows the first capping layer QCP1 to passivate the color conversion layer CCL and the first scattering layer SCT1, and allows the second scattering layer SCT2 to be placed on the first capping layer QCP1.

[0277] According to some embodiments, similar to the above, in a plan view, bank QBNK can leave at least a portion of the side of the third subpixel region SPXA3 open. Therefore, the second scattering layer SCT2 patterned to the third subpixel region SPXA3 can extend beyond the region defined by the third subpixel region SPXA3 (for example, it can spread out). For this reason, the second scattering layer SCT2 can be provided with a relatively thinner thickness compared to the first scattering layer SCT1.

[0278] Next, a display device DD according to some embodiments will be described with reference to Figures 29 to 31. Content that may overlap with the above will be briefly explained or omitted. For example, the technical features described above with reference to Figures 5 to 28 can be applied to the display device DD according to the embodiments described with reference to Figures 29 to 31, insofar as they do not contradict the features described in the embodiments described later.

[0279] The display device DD according to the embodiment shown in Figures 29 to 31 differs from the display device DD according to the embodiment described above in that the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 are manufactured by a photolithography process.

[0280] Figures 29 to 31 are schematic cross-sectional views showing a display device according to some embodiments of the present disclosure. According to some embodiments, Figure 29 can show a planar structure of a display device DD similar to that of Figure 5 described above. Figure 30 can show a planar structure of a display device DD similar to that of Figure 6 described above. Figure 31 can show a planar structure of a display device DD similar to that of Figure 7 described above.

[0281] According to some embodiments, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 can be manufactured without performing an inkjet process. As a result, the first capping layer QCP1 may be placed after the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 have been manufactured, and the first capping layer QCP1 can passivate the bank QBNK, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2, respectively.

[0282] According to some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 can be patterned after the color conversion layer CCL has been patterned, and according to some embodiments, the color conversion layer CCL can be patterned after the first scattering layer SCT1 and the second scattering layer SCT2 have been patterned. According to some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 can have similar (e.g., substantially the same) thicknesses.

[0283] According to some embodiments (see FIG. 29), the light control layer LCL may be arranged to be included in the second panel PNL2. For example, the light control layer LCL may be disposed on the color filter layer CFL arranged on the upper substrate USUB.

[0284] According to some embodiments (see FIG. 30), the light control layer LCL may be arranged to be included in the first panel PNL1. For example, the light control layer LCL may be disposed on the display layer DL arranged on the lower substrate BSUB.

[0285] According to some embodiments (FIG. 29 and FIG. 30), the spacer CS may be patterned in the same process as the first scattering layer SCT1 and the second scattering layer SCT2, and may include the same material. According to an embodiment, the spacer CS may be passivated by the first capping layer QCP1.

[0286] According to some embodiments (see FIG. 31), the second panel PNL2 is not separately manufactured, and the display layer DL, the light control layer LCL, the optical layer LR, the color filter layer CFL, the planarization layer PLA, and the upper layer UPL may be sequentially disposed on the lower substrate BSUB to manufacture the first panel PNL, and the display device DD may be manufactured without performing a separate bonding process between panels. In this case, when patterning the first scattering layer SCT1 and the second scattering layer SCT2, the spacer CS may not be formed.

[0287] Next, a display device DD according to some embodiments of the present disclosure will be described with reference to FIGS. 32 to 35. Contents that may overlap with the above description will be briefly described or omitted. For example, the technical features described above with reference to FIGS. 5 to 31 may be applied to the display device DD according to the embodiments described with reference to FIGS. 32 to 35, as long as they do not conflict with the features described in the embodiments to be described later.

[0288] The display device DD according to the embodiment shown in Figures 32 to 35 differs from the display device DD according to the embodiment described above in that the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 are manufactured by an inkjet process.

[0289] Figures 32 to 34 are schematic cross-sectional views showing a display device according to some embodiments of the present disclosure. Figure 35 is a schematic cross-sectional view illustrating the relationship between the first scattering layer and the second scattering layer according to some embodiments of the present disclosure. According to some embodiments, Figure 32 can show a planar structure of a display device DD similar to that of Figure 5 described above. Figure 33 can show a planar structure of a display device DD similar to that of Figure 8 described above. Figure 34 can show a planar structure of a display device DD similar to that of Figure 7 described above. Figure 35 shows the second subpixel region SPXA2, the third subpixel region SPXA3, and the adjacent bank QBNK.

[0290] According to some embodiments, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 can be manufactured without a photolithography process. This allows each of the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 to be manufactured by an inkjet process. According to some embodiments, after the inkjet process for manufacturing each of the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 is performed within the region surrounded by bank QBNK, the first capping layer QCP1 can passivate the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2.

[0291] According to some embodiments, an inkjet process for manufacturing the color conversion layer CCL may be performed first, followed by an inkjet process for the first scattering layer SCT1 and the second scattering layer SCT2. According to some embodiments, an inkjet process for manufacturing the first scattering layer SCT1 and the second scattering layer SCT2 may be performed first, followed by an inkjet process for the color conversion layer CCL.

[0292] According to some embodiments (see Figure 32), the optical control layer LCL can be arranged to be included in the second panel PNL2. For example, the optical control layer LCL may be placed on a color filter layer CFL located on the upper substrate USUB.

[0293] According to some embodiments (see Figure 33), the optical control layer LCL can be arranged to be included in the first panel PNL1. For example, the optical control layer LCL may be arranged on the display layer DL which is located on the lower substrate BSUB.

[0294] According to some embodiments (Figures 32 and 33), the spacer CS can be patterned (e.g., by a photolithography process) within the non-subpixel region NSPXA after the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 have been manufactured (e.g., after the first capping layer QCP1 has been manufactured).

[0295] According to some embodiments (see Figure 34), the second panel PNL2 may not be manufactured separately, and the first panel PNL may be manufactured by sequentially arranging the display layer DL, light control layer LCL, optical layer LR, color filter layer CFL, planarization layer PLA, and upper layer UPL on the lower substrate BSUB, and the display device DD may be manufactured without a separate panel coupling process. In this case, after the inkjet process for the first scattering layer SCT1 and the second scattering layer SCT2, the process for forming the spacer CS may not be performed.

[0296] According to some embodiments (see Figure 35), the first distance L1, which is the separation distance between bank QBNK1 (e.g., the first bank portion) that can define the second subpixel region SPXA2, may be smaller than the second distance L2, which is the separation distance between bank QBNK1 (e.g., the second bank portion) that can define the third subpixel region SPXA3. For example, the first distance L1 can correspond to the distance between the first bank portion and the second bank portion, and the second distance L2 can correspond to the distance between the third bank portion and the second bank portion.

[0297] For example, the first distance L1 can be the shortest distance between banks QBNK adjacent to (e.g., directly adjacent to) the second subpixel region SPXA2 (or the first scattering layer SCT1). The second distance L2 can be the shortest distance between banks QBNK adjacent to (e.g., directly adjacent to) the third subpixel region SPXA3 (or the second scattering layer SCT2).

[0298] According to some embodiments, the first scattering layer SCT1 and the second scattering layer SCT2 can be formed in the same inkjet process and may contain materials of the same composition. Alternatively, the bank QBNK can be patterned such that the first distance L1 is smaller than the second distance L2, so that the first scattering layer SCT1 has a greater thickness than the second scattering layer SCT2.

[0299] Experimentally, the scattering efficiency in the first scattering layer SCT1 and the second scattering layer SCT2 can be increased as the thickness of each layer increases.

[0300] As described above, it is desirable that the second subpixel SPX2 and the third subpixel SPX3 have corresponding light emission efficiencies. For this reason, the first scattering layer SCT1 can be manufactured to be relatively thicker than the second scattering layer SCT2. In this case, by providing a relatively thick first scattering layer SCT1, even if the light efficiency for the second color is relatively low, the difference in light emission efficiencies between the second subpixel SPX2 and the third subpixel SPX3 is compensated, and the second subpixel SPX2 and the third subpixel SPX3 can have relatively similar light emission efficiencies.

[0301] According to some embodiments, separate processes are not required to manufacture the first scattering layer SCT1 and the second scattering layer SCT2, and the first and second scattering layers SCT1 and SCT2 can be manufactured by the same inkjet process. According to some embodiments, since the first distance L1 is smaller than the second distance L2, the space in which the first scattering layer SCT1 is located, defined by the surrounding bank QBNK, can be smaller than the space in which the second scattering layer SCT2 is located, defined by the surrounding bank QBNK. In this case, when performing the inkjet process, even if the volume of ink drops containing the scatterer SC provided to each region is not further adjusted separately, the thickness of the ink supplied to the second subpixel region SPXA2 and the third subpixel region SPXA3 can be defined to be different.

[0302] In short, according to some embodiments, the display device DD can be manufactured such that the differences in light emission efficiency between subpixels SPX are compensated for while the convenience of the process is improved, resulting in uniform light emission efficiency for each subpixel SPX.

[0303] Referring to Figures 36 to 49, a method for manufacturing the display device DD according to some embodiments will be described later. Content that may overlap with the above will be briefly explained or omitted.

[0304] Figures 36 to 43 illustrate the operation of a method for manufacturing a display device DD, in which a first panel PNL1 and a second panel PNL2 are provided separately, and the first panel PNL1 and the second panel PNL2 are coupled to each other to manufacture the display device DD. According to some embodiments of this disclosure, the light control layer LCL can be included in the second panel PNL2 during manufacturing.

[0305] Figure 36 is a flowchart showing a method for manufacturing a display device according to some embodiments of the present disclosure. Figure 37 is a flowchart showing detailed operations for manufacturing a second panel according to some embodiments of the present disclosure. Figures 38 to 43 are schematic cross-sectional views showing process operations for manufacturing a display device according to some embodiments of the present disclosure.

[0306] A method for manufacturing a display device DD according to some embodiments may include an operation S100 for manufacturing a first panel, an operation S200 for manufacturing a second panel, and an operation S300 for joining the first panel and the second panel.

[0307] According to some embodiments, operation S200 for manufacturing the second panel can be performed after operation S100 for manufacturing the first panel. Alternatively, operation S100 for manufacturing the first panel can be performed after operation S200 for manufacturing the second panel. In some examples, operation S100 for manufacturing the first panel and operation S200 for manufacturing the second panel may be performed within substantially the same time section. For the sake of explanation, the method for manufacturing the display device DD will be described based on an embodiment in which operation S100 for manufacturing the first panel is performed followed by operation S200 for manufacturing the second panel.

[0308] Referring to Figures 36 and 38, in operation S100 for manufacturing the first panel, a first panel PNL1 including a display layer DL may be provided.

[0309] In this operation S100, a layer for forming the display layer DL can be placed on the lower substrate BSUB that forms the base layer BSL.

[0310] According to some embodiments, conductive or insulating layers on the lower substrate BSUB or upper substrate USUB can be formed based on processes for manufacturing semiconductor devices. For example, conductive or insulating layers on the base layer BSL may be formed by a photolithography process, etched by various methods (wet etching, dry etching, etc.), or deposited by various methods (sputtering, chemical vapor deposition, etc.). This disclosure is not necessarily limited to specific examples.

[0311] In this operation S100, a pixel circuit PXC can be patterned on the lower substrate BSUB to form a pixel circuit layer PCL, and a light-emitting element LD can be placed on the pixel circuit layer PCL. According to some embodiments, in this operation S100, the light-emitting element LD can be placed on the lower substrate BSUB (for example, the pixel circuit layer PCL) in various ways.

[0312] For example, as shown in conjunction with Figure 3, the light-emitting element LD may include an organic light-emitting diode, and the light-emitting element LD can be manufactured on the lower substrate BSUB by a deposition process.

[0313] According to some embodiments, the light-emitting element LD may include an inorganic light-emitting diode, and an element ink containing the light-emitting element LD may be supplied onto a lower substrate BSUB, and an alignment signal can be supplied to each of the first and second alignment electrodes, and the light-emitting element LD can be aligned between the first and second alignment electrodes based on the electric field formed thereby.

[0314] According to some embodiments, the light-emitting element LD may include an inorganic light-emitting diode, and the light-emitting element LD can be transferred onto the pixel circuit layer PCL by various methods.

[0315] Referring to Figure 36, operation S200 for manufacturing the second panel may be performed. In some embodiments, referring also to Figure 37, operation S200 for manufacturing the second panel may include operation S220 for placing a color filter layer on the upper substrate and operation S240 for placing a light control layer on the color filter layer.

[0316] Referring to Figures 36, 37, and 39, in operation S220 for placing the color filter layer on the upper substrate, the color filter CF may be patterned (for example, sequentially patterned) on the upper substrate USUB, and the optical layer LR and the optical capping layer LCP may be placed on the color filter CF.

[0317] In this operation S220, the third color filter CF3, the second color filter CF2, and the first color filter CF1 can be arranged on the upper substrate USUB. The color filters CF may be formed by various processes such as photolithography. According to some embodiments, the formation order of the color filters CF is not particularly limited.

[0318] In this operation S220, the optical layer LR can be formed (e.g., by deposition) to cover the color filter CF. According to some embodiments, the optical layer LR may be selectively placed within the first subpixel region SPXA1 as described above.

[0319] In this operation S220, the optical capping layer LCP can cover the optical layer LR in such a way that it passesivates the optical layer LR.

[0320] Referring to Figures 36, 37, and 39-42, in operation S240, in which an optical control layer is placed on a color filter layer, a configuration for forming an optical control layer LCL on the color filter layer CFL can be arranged.

[0321] Referring to Figure 39, in this operation S240, bank QBNK can be patterned on the color filter layer CFL. Bank QBNK can be arranged to surround a portion of each of at least some of the regions.

[0322] In operation S240, after bank QBNK is patterned, a color conversion layer CCL containing quantum dots QD can be placed on the color filter layer CFL by an inkjet process. This allows the color conversion layer CCL within the first subpixel region SPXA1 to be patterned. For example, an ink containing material for forming the color conversion layer CCL can be supplied into the region surrounding bank QBNK. However, the disclosure is not limited thereto, and according to some embodiments, the color conversion layer CCL may be patterned based on a photolithography process. Subsequently, a first capping layer QCP1 for passivating (e.g., capping) the color conversion layer CCL can be formed (e.g., deposited) over the entire upper substrate USUB.

[0323] Referring to Figures 40 to 42, in this operation S240, the process of forming the first scattering layer SCT1 and the second scattering layer SCT2 can be carried out.

[0324] For example, referring to Figure 40, the first scattering layer SCT1 and the second scattering layer SCT2 can be patterned in the second subpixel region SPXA2 and the third subpixel region SPXA3, respectively, and a spacer CS can be formed in the non-subpixel region NSPXA (for example, simultaneously).

[0325] According to some embodiments, the first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS can be patterned based on a photolithography process. Subsequently, although not shown in Figure 40, a second capping layer QCP2 that passivates the first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS can be formed (e.g., by deposition).

[0326] In some embodiments, the spacer CS may be appropriately spaced apart from the upper substrate USUB compared to the configuration of other optical control layers LCL such as the first scattering layer SCT1 and the second scattering layer SCT2. This allows the spacer CS to be positioned on bank QBNK, which forms a relatively high base, and to form a protruding structure. In some embodiments, if the height of the spacer CS is excessive, an excessive cell gap may be formed between the first panel PNL1 and the second panel PNL2 in a subsequent process; therefore, in some embodiments, a further step may be taken to remove at least a portion of the spacer CS.

[0327] In another example, referring to Figure 41, after the color conversion layer CCL is manufactured based on a photolithography process, the first scattering layer SCT1 and the second scattering layer SCT2 can be patterned before the first capping layer QCP1 is formed. For example, the first scattering layer SCT1 and the second scattering layer SCT2 can be manufactured based on a photolithography process, and the spacer CS can be patterned in the same process as the first scattering layer SCT1 and the second scattering layer SCT2. Then, after the first scattering layer SCT1 and the second scattering layer SCT2 are formed, the first capping layer QCP1 can be manufactured.

[0328] In yet another example, referring to Figure 42, the first scattering layer SCT1 and the second scattering layer SCT2 can be manufactured by an inkjet process before the first capping layer QCP1 is formed. Subsequently, the first capping layer QCP1 can be formed covering the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2. Then, the spacer CS can be patterned in a separate photolithography process. Subsequently, although not shown in Figure 42, the second capping layer QCP2 that passivates the first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS can be formed (e.g., by vapor deposition).

[0329] Referring to Figures 36 and 43, in operation S300, which joins the first panel and the second panel, a packed layer FIL is interposed between the first panel PNL1 and the second panel PNL2, allowing the first panel PNL1 and the second panel PNL2 to be adjacent to each other.

[0330] In this operation S300, the first panel PNL1, which includes the display layer DL, can be coupled with the second panel PNL2, which includes the upper layer UPL, the color filter layer CFL, and the light control layer LCL. According to some embodiments, a spacer CS may be formed so that the first panel PNL1 and the second panel PNL2 can be properly coupled to each other.

[0331] Figures 36 and 44-48 show a method for manufacturing a display device DD, in which a first panel PNL1 and a second panel PNL2 are provided separately, and the first panel PNL1 and the second panel PNL2 are coupled to each other to manufacture the display device DD. However, the figures also show an embodiment in which the light control layer LCL is included in the first panel PNL1 during manufacturing.

[0332] Figure 44 is a flowchart detailing the operation of manufacturing the first panel according to some embodiments. Figures 45 to 48 are schematic cross-sectional views showing the manufacturing method of the display device according to some embodiments, broken down by process operation.

[0333] Referring to Figures 36 to 43, a method for manufacturing the display device DD according to some embodiments will be described, focusing on the differences compared to the manufacturing method described above.

[0334] According to some embodiments, the method for manufacturing the display device DD may include an operation S100 for manufacturing a first panel, an operation S200 for manufacturing a second panel, and an operation S300 for joining the first and second panels. However, referring to Figure 44 in conjunction with this, the operation S100 for manufacturing the first panel may also include an operation S120 for arranging a pixel circuit layer and a light-emitting element layer on a lower substrate, and an operation S140 for arranging a light control layer on the light-emitting element layer.

[0335] According to some embodiments, after operation S120 is performed to arrange the pixel circuit layer and the light-emitting element layer on the lower substrate, a layer for forming the light control layer LCL can be placed on the manufactured display layer DL (e.g., light-emitting element layer LEL).

[0336] For example, referring to Figures 45 to 46, in this operation S140, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 can be arranged on the display layer DL so that the first panel PNL1 is manufactured.

[0337] According to some embodiments (see Figure 45), in operation S140, a color conversion layer CCL can be manufactured on the display layer DL by an inkjet process, and after a first capping layer QCP1 that passesivates the color conversion layer CCL is formed, a first scattering layer SCT1, a second scattering layer SCT2, and a spacer CS can be manufactured by a photolithography process.

[0338] According to some embodiments (see Figure 46), in operation S140, the color conversion layer CCL can be manufactured by an inkjet process, the first scattering layer SCT1, the second scattering layer SCT2, and the spacer CS can be manufactured by a photolithography process, and thereafter the first capping layer QCP1 can be formed.

[0339] According to some embodiments (see Figure 47), in operation S140, the color conversion layer CCL, the first scattering layer SCT1, and the second scattering layer SCT2 can be manufactured by an inkjet process, and after the first capping layer QCP1 is formed, the spacer CS can be manufactured by a photolithography process.

[0340] According to some embodiments, an operation S200 for manufacturing a second panel is performed to provide a second panel PNL2 on an upper substrate USUB, in which a color filter layer CFL is placed.

[0341] Referring to Figures 36 and 48, in operation S300, which joins the first panel and the second panel, a packed layer FIL is interposed between the first panel PNL1 and the second panel PNL2, allowing the first panel PNL1 and the second panel PNL2 to be adjacent to each other.

[0342] In this operation S300, the first panel PNL1, which includes the display layer DL and the light control layer LCL, can be coupled with the second panel PNL2, which includes the upper layer UPL and the color filter layer CFL.

[0343] Figure 49 shows a method for manufacturing a display device DD, in which the layers of the display device DD are sequentially arranged on the lower substrate BSUB without manufacturing the second panel PNL2.

[0344] Figure 49 is a flowchart showing a method for manufacturing a display device according to some embodiments.

[0345] Referring to Figures 36 to 48, a method for manufacturing the display device DD according to some embodiments will be described, focusing on the differences compared to the manufacturing method described above.

[0346] According to some embodiments, the method for manufacturing the display device DD may include operation S1000 for arranging a pixel circuit layer on a lower substrate, operation S2000 for arranging a light-emitting element layer on the pixel circuit layer, operation S3000 for arranging a light-control layer on the light-emitting element layer, operation S4000 for arranging a color filter layer on the light-control layer, and operation S5000 for arranging an upper film on the color filter layer.

[0347] In other words, according to some embodiments, without providing an upper substrate USUB, the display layer DL, light control layer LCL, color filter layer CFL, and upper layer UPL can be sequentially formed on the lower substrate BSUB, using the lower substrate BSUB as a base. According to some embodiments, the process for manufacturing each layer can be specified by referring to the above description. For example, various processes such as inkjet processes and / or photolithography processes can be utilized to form the light control layer LCL.

[0348] While various embodiments have been described above, those skilled in the art will see that various modifications, additions, and substitutions are possible within the scope and spirit of this disclosure.

[0349] Accordingly, the embodiments disclosed herein are not intended to limit the technical idea of ​​this disclosure, but are merely illustrative. The scope of this disclosure should be defined by the appended claims.

Claims

1. The subpixel includes a first subpixel formed on the base layer and configured to provide light of a first color, a second subpixel forming a second subpixel region configured to provide light of a second color, and a third subpixel forming a third subpixel region configured to provide light of a third color. The above sub-pixels are, A display layer including a light-emitting element on the above base layer, An optical control layer on the above-mentioned display layer, comprising: a color conversion layer disposed within the first subpixel region and containing quantum dots; a first scattering layer disposed within the second subpixel region and containing a first scatterer; and a second scattering layer disposed within the third subpixel region and containing a second scatterer; The optical control layer includes a color filter layer comprising a first color filter located in a first subpixel region, a second color filter located in a second subpixel region, and a third color filter located in a third subpixel region, The light emitted by the above-mentioned light-emitting element includes the second color of light and the third color of light, and at least a portion of the emitted light passes through the light control layer and the color filter layer and is emitted. A display device in which the color of light transmitted through the first scattering layer and the second scattering layer is not altered by the first scattering layer and the second scattering layer.

2. It further includes a capping layer that passesivates at least part of the above color conversion layer, The display device according to claim 1, wherein the first portion of the capping layer is arranged on the color conversion layer within the first subpixel region, and the second portion of the capping layer is arranged below the first scattering layer and the second scattering layer within the respective second subpixel region and third subpixel region.

3. The above color filter layer is placed on top of the upper layer, and further includes an upper layer which includes an upper substrate, The above color filter layer and the above light control layer are sequentially stacked on the lower part of the above upper substrate. The display device according to claim 2, wherein a packing layer is interposed between the display layer, the color conversion layer, the first scattering layer, and the second scattering layer.

4. The above color filter layer is placed on top of the upper layer, and further includes an upper layer which includes an upper substrate, The above-mentioned light control layer is placed on the above-mentioned display layer. The display device according to claim 2, wherein a packing layer is interposed between the above-mentioned color conversion layer, the above-mentioned first scattering layer, and the above-mentioned second scattering layer and the above-mentioned color filter layer.

5. The above color filter layer is placed on top of an upper layer which further includes an upper film, The display device according to claim 2, wherein the above-mentioned light control layer and the above-mentioned color filter layer are sequentially laminated on the above-mentioned display layer.

6. The above color conversion layer has a first thickness, The above-mentioned first scattering layer has a second thickness, The above-mentioned second scattering layer has a third thickness, The first thickness is greater than the second and third thicknesses. The display device according to claim 1, wherein the second thickness and the third thickness are substantially the same as each other.

7. The display device according to claim 1, wherein each of the first and second scattering materials is included in the first and second scattering layers in an amount of about 1.5% by weight to about 8.5% by weight.

8. The display device according to claim 1, wherein the size of the first scattering body is greater than the size of the second scattering body.

9. The first scattering material is included in the first scattering layer in a first weight ratio. The above-mentioned second scattering material is included in the above-mentioned second scattering layer in a second weight ratio, The display device according to claim 1, wherein the first weight ratio is greater than the second weight ratio.

10. The above-mentioned first scattering layer includes one or more scattering bodies that have the same composition ratio as the above-mentioned first scattering body but differ in size. The display device according to claim 1, wherein the second scattering layer comprises one or more scattering bodies having the same composition ratio as the second scattering body but different sizes.

11. The above color filter layer further includes an optical layer having a refractive index smaller than that of the above color conversion layer, and the optical layer is disposed between the above light control layer and the above first color filter, the above second color filter, and the above third color filter. The display device according to claim 1, wherein the optical layer is arranged only in the first subpixel region among the first subpixel region, the second subpixel region, and the third subpixel region.

12. The display device according to claim 1, further comprising a packing scattering layer disposed within the second subpixel region and the third subpixel region, superimposed with the first scattering layer and the second scattering layer along the thickness direction, and containing a packing material and a scattering substance.

13. The display device according to claim 1, further comprising a bank that extends in the thickness direction and at least a portion of the first subpixel region surrounds the first subpixel region.

14. The above bank is not located between the second subpixel region and the third subpixel region. The display device according to claim 13, wherein at least a portion of the display device is disposed between the second subpixel region and the third subpixel region, and further includes a black matrix layer penetrating between the first scattering layer and the second scattering layer.

15. The display device according to claim 13, wherein the bank is formed around all sides of the first subpixel region in a plan view, but is not formed around any part of the second subpixel region or the third subpixel region, respectively.

16. At least one side of the second subpixel region includes an open edge where the bank is not located. The display device according to claim 15, wherein the open edge is formed so as to be oriented away from the third subpixel region.

17. The display device according to claim 13, wherein the bank is formed around all sides of the first subpixel region and the second subpixel region in a plan view, but is not formed around at least a portion of the third subpixel region.

18. The material further includes, at least in part, a capping layer that passesivates the above-mentioned color conversion layer and the above-mentioned first scattering layer. The display device according to claim 17, wherein at least a portion of the capping layer is arranged between the second scattering layer and the third color filter in the third subpixel region.

19. The display device according to claim 18, wherein the thickness of the first scattering layer is greater than the thickness of the second scattering layer.

20. The above bank further includes an isolated bank section, The display device according to claim 13, wherein the isolated bank portion is arranged between the second subpixel region and the third subpixel region.

21. The display device according to claim 13, further comprising a spacer disposed on the bank and positioned above the color conversion layer, the first scattering layer, and the second scattering layer.

22. The display device according to claim 21, wherein the spacers are arranged between the first subpixel region and the second subpixel region, between the second subpixel region and the third subpixel region, and between the first subpixel region and the third subpixel region.

23. The first subpixel, the second subpixel, and the third subpixel are adjacent to each other in a first direction and form a first pixel. The first pixel described above is adjacent to the second pixel in a second direction different from the first direction described above. The display device according to claim 21, wherein the spacers are arranged between the first subpixel region of the first pixel and the first subpixel region of the second pixel, between the second subpixel region of the first pixel and the second subpixel region of the second pixel, and between the third subpixel region of the first pixel and the third subpixel region of the second pixel.

24. The first subpixel region and the third subpixel region are adjacent in a first direction, and the second subpixel region is adjacent to the first subpixel region and the third subpixel region in a second direction different from the first direction. The display device according to claim 21, wherein the spacer is superimposed on the second sub-pixel region along the first direction.

25. The display device according to claim 21, further comprising at least a portion of the above-mentioned color conversion layer, the above-mentioned bank, the above-mentioned first scattering layer, the above-mentioned second scattering layer, and the above-mentioned spacer, a capping layer that passes through them.

26. At least a portion of the color conversion layer, the bank, the first scattering layer, and the second scattering layer further comprises a capping layer that passesivates them. The display device according to claim 21, wherein the spacer is placed on the capping layer.

27. The above bank, The second subpixel region includes a first bank portion separated by a first distance from the second bank portion, and the second subpixel region is positioned between the first bank portion and the second bank portion. The third bank portion includes a third bank portion separated by a second distance from the second bank portion, and the third subpixel region is arranged between the third bank portion and the second bank portion. The display device according to claim 26, wherein the thickness of the first scattering layer is greater than the thickness of the second scattering layer.

28. The display device according to claim 1, wherein the light-emitting element includes one or more organic light-emitting diodes containing an organic material or inorganic light-emitting diodes containing an inorganic material.

29. The stage of manufacturing the first panel, The stage of manufacturing the second panel, The process includes the step of joining the first panel and the second panel, The step of manufacturing the first panel described above includes the step of providing a light-emitting element on the lower substrate, The steps for manufacturing the second panel include the steps of providing a color filter layer on the upper substrate and providing a light control layer on the color filter layer. The step of providing the above-mentioned optical control layer is, The above step involves patterning the bank onto the color filter layer, The steps include: arranging a color conversion layer containing quantum dots within the first subpixel region; The steps include: arranging a first scattering layer containing a first scatterer within a second subpixel region; The process includes the step of arranging a second scattering layer containing a second scatterer within a third subpixel region, A method for manufacturing a display device, wherein the first scattering layer and the second scattering layer are configured such that the applied light does not change the color of the applied light and the applied light is transmitted through the first scattering layer and the second scattering layer.

30. The step of providing the above-mentioned light control layer further includes the step of forming a capping layer on the above-mentioned color conversion layer, wherein the capping layer passes through the above-mentioned color conversion layer. The step of providing the above-mentioned color conversion layer includes the step of patterning the above-mentioned color conversion layer using an inkjet process. The method for manufacturing a display device according to claim 29, wherein the steps of providing the first scattering layer and providing the second scattering layer are performed after the step of forming the capping layer and are performed based on a photolithography process.

31. The above color conversion layer, the above first scattering layer, and the above second scattering layer are patterned based on a photolithography process. The method for manufacturing a display device according to claim 29, wherein the step of providing the above-mentioned light control layer further includes the step of forming a capping layer on the above-mentioned color conversion layer, and the capping layer passesivates the above-mentioned color conversion layer.

32. The method for manufacturing a display device according to claim 29, wherein the above-mentioned color conversion layer, the first scattering layer, and the second scattering layer are formed based on an inkjet process.

33. The method for manufacturing a display device according to claim 29, wherein the bonding step further includes the step of providing a packing layer between the first panel and the second panel.

34. The stage of manufacturing the first panel, The stage of manufacturing the second panel, The step includes joining the first panel and the second panel as described above, The steps for manufacturing the first panel include providing a display layer including a light-emitting element on a lower substrate and providing a light control layer on the display layer. The step of manufacturing the second panel described above includes the step of providing a color filter layer on the upper substrate, The step of providing the above-mentioned optical control layer is, The stage of patterning the bank on the above display layer, The steps include providing a color conversion layer containing quantum dots within the first subpixel region, The steps include providing a first scattering layer containing a first scatterer within a second subpixel region, The step includes providing a second scattering layer containing a second scatterer within a third subpixel region, A method for manufacturing a display device, wherein the first scattering layer and the second scattering layer are configured to transmit applied light through the first scattering layer and the second scattering layer without changing the color of the applied light.

35. The step of providing the above-mentioned light control layer further includes the step of forming a capping layer on the above-mentioned color conversion layer, wherein the capping layer passes through the above-mentioned color conversion layer. The step of providing the above-mentioned color conversion layer includes the step of patterning the above-mentioned color conversion layer using an inkjet process. The method for manufacturing a display device according to claim 34, wherein the steps of providing the first scattering layer and providing the second scattering layer are performed after the step of forming the capping layer and are performed based on a photolithography process.

36. The above color conversion layer, the above first scattering layer, and the above second scattering layer are patterned based on a photolithography process. The method for manufacturing a display device according to claim 34, wherein the step of providing the above-mentioned light control layer further includes the step of forming a capping layer on the above-mentioned color conversion layer, the capping layer passing through the above-mentioned color conversion layer, the above-mentioned first scattering layer, and the above-mentioned second scattering layer.

37. The method for manufacturing a display device according to claim 34, wherein the above-mentioned color conversion layer, the first scattering layer, and the second scattering layer are formed by an inkjet process.

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