A curable composition, a cured film produced using the composition, and a display device containing the cured film.

Abstract

(A) quantum dots surface-modified as a specific compound; and (B) a curable composition containing a polymerizable compound, a cured film produced using the curable composition, and a display device containing the cured film are provided.

Description

[Technical Field]

[0001] This disclosure relates to a curable composition, a cured film manufactured using the composition, and a display device including the cured film. [Background technology]

[0002] In the case of typical quantum dots, the hydrophobic surface properties limit the solvents in which they can be dispersed, which in turn presents many difficulties in introducing them into polar systems such as binders and curable monomers.

[0003] For example, in the case of quantum dot ink compositions, which are being actively researched, in their initial stages, they were dispersed in solvents used for curable compositions that have relatively low polarity and high hydrophobicity. As a result, it was difficult to include more than 20% by weight of quantum dots relative to the total amount of the composition, and it was not possible to increase the light efficiency of the ink beyond a certain level. Even if quantum dots were forcibly added and dispersed to increase the light efficiency, the viscosity range for inkjet printing was exceeded, and fairness could not be met.

[0004] Furthermore, in order to achieve a viscosity range that allows for inkjet printing, a method is used to reduce the ink solid content by including 50% by weight or more of solvent relative to the total amount of the overall composition. However, although this method provides somewhat satisfactory results in terms of viscosity, it has the disadvantage of being difficult to apply to actual processes due to problems such as nozzle drying and clogging caused by solvent evaporation during inkjet printing, and a decrease in single-layer film thickness over time after inkjet printing, which leads to significant deviations in thickness after curing.

[0005] In response to this, solvent-free curable compositions (quantum dot ink compositions) have been developed. However, in this case, due to the excessive content of polymerizable compounds, problems arise such as clogging and poor ejection due to nozzle drying caused by volatilization, and a decrease in single-layer film thickness due to the volatilization of the checked ink composition within the pattern partition pixels. Above all, the biggest problem is that it is difficult to improve the optical properties of solvent-free curable compositions.

[0006] In other words, neither solvent-based nor solvent-free curable compositions have demonstrated satisfactory levels of lightfastness / heatfastness reliability to date. [Overview of the Initiative] [Problems that the invention aims to solve]

[0007] One embodiment provides a curable composition with high quantum dot stability and excellent quantum dot dispersibility, thereby offering superior reliability and optical properties such as heat resistance and light resistance.

[0008] Another embodiment provides a cured film produced using the curable composition.

[0009] Another embodiment provides a display device including the cured film. [Means for solving the problem]

[0010] One embodiment provides a curable composition comprising (A) quantum dots surface-modified as a compound represented by the following chemical formula 1; and (B) a polymerizable compound.

[0011] [Chemical formula 1] [ka]

[0012] In the aforementioned chemical formula 1, X 1 and X 2 Each is independent of the others.* -NR(R is a hydrogen atom or a C1 to C10 alkyl group)-O- * or * -O- * , is; Y 1 and Y 2 are each independently * -O- * , * -S- * or * -C(=O)NH- * , is; R 1 and R 2 are each independently a hydrogen atom, a hydroxy group, a carboxyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a combination thereof; L 1 to L 8 are each independently a single bond, an ester group( * -C(=O)O- * or * -OC(=O)- * ), * -(L 9 -O) n - * (L 9 is a C1 to C10 alkylene group, n is an integer of 1 to 20), or a substituted or unsubstituted C1 to C20 alkylene group.

[0013] The compound represented by the above Chemical Formula 1 may have a symmetric structure.

[0014] The compound represented by the above Chemical Formula 1 may be represented by any one of the following Chemical Formula 1-1 to Chemical Formula 1-5.

[0015] [Chemical Formula 1-1] [Chemical Formula]

[0016] [Chemical formula 1-2] [ka]

[0017] [Chemical formula 1-3] [ka]

[0018] [Chemical formula 1-4] [ka]

[0019] [Chemical formula 1-5] [ka]

[0020] In the above chemical formulas 1-1 to 1-5, X 1 and X 2 Each is independent of the others. * -NR(R is a hydrogen atom or a C1-C10 alkyl group)-O- * or * -O- * And, R 1 and R 2 Each of these is independently a hydrogen atom, a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1-C20 alkoxy group, a substituted or unsubstituted C1-C20 alkyl group, a substituted or unsubstituted C3-C20 cycloalkyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof. L 10 These are single-bonded, substituted, or unsubstituted C1 to C20 alkylene groups, L 11 ~L 13 These are, independently, substituted or unsubstituted C1 to C20 alkylene groups, n1 and n2 are each independent integers between 1 and 10.

[0021] The compound represented by chemical formula 1 can be represented by any one of the following chemical formulas 2 to 17.

[0022] [Chemical formula 2] [ka]

[0023] [Chemical formula 3] [ka]

[0024] [Chemical formula 4] [ka]

[0025] [Chemical formula 5] [ka]

[0026] [Chemical formula 6] [ka]

[0027] [Chemical formula 7] [ka]

[0028] [Chemical formula 8] [ka]

[0029] [Chemical formula 9] [ka]

[0030] [Chemical formula 10] [ka]

[0031] [Chemical formula 11] [ka]

[0032] In the aforementioned chemical formula 11, R x teeth, The file is JPEG2026536509000017.jpg2139.

[0033] [Chemical formula 12] [ka]

[0034] [Chemical formula 13] [ka]

[0035] [Chemical formula 14] [ka]

[0036] [Chemical formula 15] [ka]

[0037] [Chemical formula 16] [ka]

[0038] [Chemical formula 17] [ka]

[0039] The quantum dot may be further surface-modified as a compound shown in the following chemical formula 18.

[0040] [Chemical formula 18] [ka]

[0041] In the aforementioned chemical formula 18, X 3 is a hydroxyl group or * -NR(R is a hydrogen atom or a C1 to C10 alkyl group)-OH, Y 11 teeth, * -O- * , * -S- * or * -C(=O)NH- * And, R 3 This includes a hydrogen atom, a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1-C20 alkoxy group, a substituted or unsubstituted C1-C20 alkyl group, a substituted or unsubstituted C3-C20 cycloalkyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof. L 31 ~L 34 These are, independently, single bonds and ester groups ( * -C(=O)O- * or * -OC(=O)- * ), * -(L 9 -O) n - * (L 9 is a C1 to C10 alkylene group, and n is an integer from 1 to 20, or a substituted or unsubstituted C1 to C20 alkylene group.

[0042] The compound represented by chemical formula 18 can be represented by any one of the following chemical formulas 18-1 to 18-5.

[0043] [Chemical formula 18-1] [ka]

[0044] [Chemical formula 18-2] [ka]

[0045] [Chemical formula 18-3] [ka]

[0046] [Chemical formula 18-4] [ka]

[0047] [Chemical formula 18-5] [ka]

[0048] In the aforementioned chemical formulas 18-1 to 18-5, X 3 is a hydroxyl group or * -NR(R is a hydrogen atom or a C1 to C10 alkyl group)-OH, R 3 This includes a hydrogen atom, a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1-C20 alkoxy group, a substituted or unsubstituted C1-C20 alkyl group, a substituted or unsubstituted C3-C20 cycloalkyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof. L 10 These are single-bonded, substituted, or unsubstituted C1 to C20 alkylene groups, L 11 ~L 13 These are, independently, substituted or unsubstituted C1 to C20 alkylene groups, n1 and n2 are each independent integers between 1 and 10.

[0049] The compound represented by chemical formula 18 can be represented by any one of the following chemical formulas 19 to 34.

[0050] [Chemical formula 19] [ka]

[0051] [Chemical formula 20] [ka]

[0052] [Chemical formula 21] [ka]

[0053] [Chemical formula 22] [ka]

[0054] [Chemical formula 23] [ka]

[0055] [Chemical formula 24] [ka]

[0056] [Chemical formula 25] [ka]

[0057] [Chemical Formula 26]

change

[0058] [Chemical Formula 27]

change

[0059] [Chemical Formula 28]

change

[0060] [Chemical Formula 29]

change

[0061] [Chemical Formula 30]

change

[0062] [Chemical Formula 31]

change

[0063] [Chemical Formula 32]

change

[0064] [Chemical Formula 33]

change

[0065] [Chemical Formula 34]

change

[0066] The curable composition may be a solvent-free curable composition.

[0067] The solvent-free curable composition may contain 5% to 60% by weight of the quantum dots and 40% to 95% by weight of the polymerizable compound, based on the total amount of the solvent-free curable composition.

[0068] The curable composition may further include a polymerization initiator, a light diffusing agent, a polymerization inhibitor, or a combination thereof.

[0069] The light diffusing agent may include barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.

[0070] The curable composition may further include malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a fluorine-based surfactant, or a combination thereof.

[0071] The curable composition may further contain a solvent.

[0072] The curable composition may contain 1% to 40% by weight of the quantum dots; 1% to 20% by weight of the polymerizable compound; and 40% to 80% by weight of the solvent, based on the total weight of the curable composition.

[0073] Another embodiment provides a cured film produced using the curable composition.

[0074] Another embodiment provides a display device including the cured film.

[0075] Other specific aspects of the present invention are included in the detailed description below. [Effects of the Invention]

[0076] By surface-modifying the quantum dots in a quantum dot-containing curable composition with a quantum dot surface-modifying material of a previously unseen composition, the reliability and optical properties of the quantum dot-containing curable composition can be improved. [Modes for carrying out the invention]

[0077] Embodiments of the present invention will be described in detail below. However, these are presented as examples only and do not limit the present invention, which is defined only within the scope of the claims described later.

[0078] Unless otherwise specified herein, “alkyl group” means a C1 to C20 alkyl group, “alkenyl group” means a C2 to C20 alkenyl group, “cycloalkenyl group” means a C3 to C20 cycloalkenyl group, “heterocycloalkenyl group” means a C3 to C20 heterocycloalkenyl group, “aryl group” means a C6 to C20 aryl group, “arylalkyl group” means a C6 to C20 arylalkyl group, “alkylene group” means a C1 to C20 alkylene group, “arylene group” means a C6 to C20 arylene group, “alkylarylene group” means a C6 to C20 alkylarylene group, “heteroarylene group” means a C3 to C20 heteroarylene group, and “alkoxylene group” means a C1 to C20 alkoxylene group.

[0079] Unless otherwise specified herein, “substitution” means that at least one hydrogen atom is substituted with a substituent of a halogen atom (F, Cl, Br, I), a hydroxyl group, a C1 to C20 alkoxy group, a nitro group, a cyano group, an amine group, an imino group, an azide group, an amidino group, a hydrazino group, a hydrazono group, a carbonyl group, a carbamyl group, a thiol group, an ester group, an ether group, a carboxyl group or its salt, a sulfonic acid group or its salt, phosphoric acid or its salt, a C1 to C20 alkyl group, a C2 to C20 alkenyl group, a C2 to C20 alkynyl group, a C6 to C20 aryl group, a C3 to C20 cycloalkyl group, a C3 to C20 cycloalkenyl group, a C3 to C20 cycloalkynyl group, a C2 to C20 heterocycloalkyl group, a C2 to C20 heterocycloalkenyl group, a C2 to C20 heterocycloalkynyl group, a C3 to C20 heteroaryl group, or a combination thereof.

[0080] Furthermore, unless otherwise specified herein, "hetero" means that the chemical formula contains at least one heteroatom from at least one of N, O, S, and P.

[0081] Furthermore, unless otherwise specified herein, "(meth)acrylate" means that both "acrylate" and "methacrylate" are possible, and "(meth)acrylic acid" means that both "acrylic acid" and "methacrylic acid" are possible.

[0082] Unless otherwise specified herein, “combination” means mixing or copolymerization.

[0083] Unless otherwise defined in the chemical formulas herein, the absence of a chemical bond at a position where one should be depicted means that a hydrogen atom is bonded to that position.

[0084] Furthermore, unless otherwise specified herein, * " refers to a part that is linked to the same or different atoms or chemical formulas.

[0085] The quantum dot-containing curable composition according to the present invention can achieve superior heat and light resistance compared to existing quantum dot-containing curable compositions by surface-modifying the quantum dots using a surface-modifying material with a novel structure.

[0086] In recent years, with the shift from OLED to micro-LEDs as the primary light source in the display field, the light resistance of films embedded within displays has become more important than ever. This has made it crucial to improve the light resistance of cured films manufactured by curing quantum dot-containing curable compositions. However, existing quantum dot surface modification materials alone have not provided the excellent film light resistance suitable for use with micro-LED light sources.

[0087] Generally, to improve the curing rate of quantum dot-containing curable compositions, highly sensitive initiators and polyfunctional monomers have been added. However, while these conventional techniques can improve one of the properties of the quantum dot-containing curable composition—dispersibility, heat resistance, or curing rate—by selecting or omitting specific components, they suffer from the problem that other properties are inferior. In other words, to date, no technology is known for quantum dot-containing curable compositions that can achieve high light resistance while maintaining low viscosity.

[0088] Specifically, known technologies include surrounding the surface of quantum dots with polymers containing heat-resistant functional groups or siloxane (or TEOS, etc.)-based organic materials, or inorganic encapsulation of the quantum dot surface in aluminum, titanium, or their oxides. More recently, there have also been attempts to simultaneously increase brightness and durability by doping small amounts of transition metal (Cu, Mg, etc.) components during the quantum dot synthesis stage. However, all of the above methods remain at the academic research level and are still difficult to apply to practical display applications. In general, when using quantum dots in displays, efforts are made to increase the intensity of the light source to improve brightness. However, when brightness is improved by increasing the intensity of the light source, the stability of the quantum dot particles decreases, inevitably creating technical challenges to improve the reliability of the panel.

[0089] Through extensive research, the inventors have successfully developed a curable composition with improved dispersibility of quantum dots and excellent heat and light resistance.

[0090] Specifically, in the case of existing quantum dot-containing curable compositions, reliability has been improved by methods such as protecting the quantum dots through ligand modification on the quantum dot surface to improve light / heat resistance, adding inorganic materials to complement defect sites on the quantum dot surface, and forming an organic matrix on the quantum dot surface to block moisture and oxygen.

[0091] However, in the case of solvent-type curable compositions containing quantum dots, aggregation occurs due to the residual inorganic salts used during some ligand modification, making single-film production of the composition itself impossible or negatively affecting storage stability. Furthermore, in the case of thiol-based ligands, thiol-encoupling reactions occur with double bonds such as acrylates of curable substituents in the composition, causing an increase in viscosity when the composition is left standing for a long time.

[0092] Ligands of organic compounds that can bind to the surface of quantum dots include carboxylic acids, thiols, amines, and hydroxamic acids. However, thiol-based ligands have the disadvantage of undergoing a thiol-ene reaction with double bonds such as acrylates of curing groups in the composition when the sulfur atom is converted to a radical or ionic state. The sulfur element causes an odor characteristic of thiol-based ligands in the ligand raw material, the modified quantum dots, and the composition. Hydroxamic acid is a functional group that overcomes these disadvantages while possessing binding stability with quantum dots at the level of thiol-based compounds.

[0093] Hydroxamic acid is generally known to form a bidentate coordinate bond with the dangling bond site of zinc (Zn), which constitutes the shell portion of quantum dots. In fact, it is known that when hydroxamic acid reacts with zinc cations that are not quantum dots, two equivalents of hydroxamic acid form a coordinate bond with one equivalent of zinc atom, while the zinc atom itself also bonds with a monovalent water molecule, forming a metal complex as shown in the figure below. The fact that the water molecule is bonded as a ligand to the zinc metal means that the metal complex can also form a coordinate bond with the sulfur atom that constitutes the shell portion of the quantum dot.

[0094] [ka]

[0095] This application relates to a hydroxamic acid-zinc (or carboxylic acid-zinc) complex compound that can bind to the sulfur (S) dangling bond sites of the Zn-S shell of a quantum dot, along with hydroxamic acid and carboxylic acid that are substituted at the zinc dangling bond sites. The purpose of preparing the zinc-ligand complex compound in advance is that when inorganic zinc salts are used in the ligand substitution step, the zinc cation preferentially binds to the sulfur dangling bond sites before binding to the ligand. However, this causes aggregation in the subsequent manufacturing process of the curable composition, making single-film production impossible. Therefore, by preferentially coordinating the zinc element and the ligand before introducing it into the ligand substitution step and coordinating it with the sulfur dangling bond sites of the quantum dot, the use of inorganic salts is eliminated, thus blocking the aggregation phenomenon. Furthermore, by increasing the substitution rate of ligands with excellent optical properties and other durability, the optical properties and heat resistance and light resistance reliability of the curable composition, especially solvent-type curable compositions, can be greatly improved.

[0096] A curable composition according to one embodiment comprises (A) quantum dots surface-modified as the compound shown in Chemical Formula 1 below; and (B) a polymerizable compound.

[0097] [Chemical formula 1] [ka]

[0098] In the aforementioned chemical formula 1, X 1 and X 2 Each is independent of the others. * -NR(R is a hydrogen atom or a C1-C10 alkyl group)-O- * or * -O- * And, Y 1 and Y 2 Each is independent of the others. * -O- * , * -S- * or * -C(=O)NH-* is, R 1 and R 2 are each independently a hydrogen atom, a hydroxy group, a carboxyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a combination thereof, L 1 to L 8 are each independently a single bond, an ester group( * -C(=O)O- * or * -OC(=O)- * ), *-(L 9 -O) n - * (L 9 is a C1 to C10 alkylene group, n is an integer of 1 to 20) or a substituted or unsubstituted C1 to C20 alkylene group.

[0099] Hereinafter, each component constituting the curable composition according to the embodiment will be specifically described.

[0100] (Quantum Dot) As is well known, the most efficient existing ligand structure capable of passivating the surface of a quantum dot with an organic ligand is a ligand having a thiol group, and a phosphoric acid type ligand has good dispersibility of quantum dots but has a weakness of reducing efficiency (inducing a color change phenomenon). Starting from LCDs in the past, current display technologies have been developed through OLEDs, NEDs, and recent micro LEDs. As the intensity of blue light continues to increase, the durability (especially heat resistance and light resistance) of quantum dots also needs to be greatly improved compared to the current level.

[0101] Therefore, the present invention introduces a ligand having a structure different from that of conventional ligands, specifically the compound shown in Chemical Formula 1, for effective passivation of the quantum dot surface. In this case, unlike conventional methods, the quantum dot-containing curable composition can maintain its initial light efficiency even when exposed to strong blue light, such as micro-LEDs, for extended periods when mounted on a display panel as a single film.

[0102] For example, the compound shown in chemical formula 1 may have a symmetrical structure.

[0103] For example, the compound represented by chemical formula 1 can be represented by any one of the following chemical formulas 1-1 to 1-5, but is not necessarily limited to these.

[0104] [Chemical formula 1-1] [ka]

[0105] [Chemical formula 1-2] [ka]

[0106] [Chemical formula 1-3] [ka]

[0107] [Chemical formula 1-4] [ka]

[0108] [Chemical formula 1-5] [ka]

[0109] In the aforementioned Chemical Formulas 1-1 to 1-5, X 1 and X 2 are each independently * -NR (R is a hydrogen atom or a C1 to C10 alkyl group)-O- * or * -O- * , R 1 and R 2 are each independently a hydrogen atom, a hydroxy group, a carboxyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a combination thereof, L 10 is a single bond or a substituted or unsubstituted C1 to C20 alkylene group, L 11 to L 13 are each independently a substituted or unsubstituted C1 to C20 alkylene group, n1 and n2 are each independently an integer of 1 to 10.

[0110] For example, the compound represented by the aforementioned Chemical Formula 1 may be represented by any one of the following Chemical Formulas 2 to 17, but is not necessarily limited thereto.

[0111] [Chemical Formula 2] [Chemical Structure]

[0112] [Chemical Formula 3] [Chemical Structure]

[0113] [Chemical Formula 4] [Chemical Structure]

[0114] [Chemical formula 5] [ka]

[0115] [Chemical formula 6] [ka]

[0116] [Chemical formula 7] [ka]

[0117] [Chemical formula 8] [ka]

[0118] [Chemical formula 9] [ka]

[0119] [Chemical formula 10] [ka]

[0120] [Chemical formula 11] [ka]

[0121] In the aforementioned chemical formula 11, R x teeth, The file is JPEG2026536509000063.jpg2139.

[0122] [Chemical formula 12] [ka]

[0123] [Chemical Formula 13] [Chem.]

[0124] [Chemical Formula 14] [Chem.]

[0125] [Chemical Formula 15] [Chem.]

[0126] [Chemical Formula 16] [Chem.]

[0127] [Chemical Formula 17] [Chem.]

[0128] For example, the quantum dot may be further surface-modified as a compound represented by the following Chemical Formula 15. In this case, the surface modification effect of the quantum dot can be maximized, and the heat resistance / light resistance reliability of the quantum dot-containing curable composition can be maximized.

[0129] [Chemical Formula 18] [Chem.]

[0130] In Chemical Formula 18 above, X 3 is a hydroxy group or * -NR (R is a hydrogen atom or a C1 to C10 alkyl group)-OH. Y 11 teeth, * -O- * , * -S- * or * -C(=O)NH- * And, R 3 This includes a hydrogen atom, a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1-C20 alkoxy group, a substituted or unsubstituted C1-C20 alkyl group, a substituted or unsubstituted C3-C20 cycloalkyl group, a substituted or unsubstituted C6-C20 aryl group, or a combination thereof. L 31 ~L 34 These are, independently, single bonds and ester groups ( * -C(=O)O- * or * -OC(=O)- * ), * -(L 9 -O) n - * (L 9 is a C1 to C10 alkylene group, and n is an integer from 1 to 20, or a substituted or unsubstituted C1 to C20 alkylene group.

[0131] For example, the compound represented by chemical formula 18 can be represented by any one of the following chemical formulas 18-1 to 18-5, but is not necessarily limited to these.

[0132] [Chemical formula 18-1] [ka]

[0133] [Chemical formula 18-2] [ka]

[0134] [Chemical formula 18-3] [ka]

[0135] [Chemical Formula 18-4]

Chemical Formula

[0136] [Chemical Formula 18-5]

Chemical Formula

[0137] In the aforementioned Chemical Formulas 18-1 to 18-5, X 3 is a hydroxy group or * -NR(R is a hydrogen atom or a C1 to C10 alkyl group)-OH, R 3 is a hydrogen atom, a hydroxy group, a carboxyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a combination thereof, L 10 is a single bond or a substituted or unsubstituted C1 to C20 alkylene group, L 11 to L 13 are each independently a substituted or unsubstituted C1 to C20 alkylene group, n1 and n2 are each independently an integer of 1 to 10.

[0138] For example, the compound represented by the aforementioned Chemical Formula 18 may be represented by any one of the following Chemical Formulas 19 to 34, but is not necessarily limited thereto.

[0139] [Chemical Formula 19]

Chemical Formula

[0140] [Chemical Formula 20]

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[0141] [Chemical Formula 21]

change

[0142] [Chemical Formula 22]

change

[0143] [Chemical Formula 23]

change

[0144] [Chemical Formula 24]

change

[0145] [Chemical Formula 25]

change

[0146] [Chemical Formula 26]

change

[0147] [Chemical Formula 27]

change

[0148] [Chemical Formula 28]

change

[0149] [Chemical formula 29] [ka]

[0150] [Chemical formula 30] [ka]

[0151] [Chemical formula 31] [ka]

[0152] [Chemical formula 32] [ka]

[0153] [Chemical formula 33] [ka]

[0154] [Chemical formula 34] [ka]

[0155] When the surface-modified quantum dots are added to a polymerizable compound (described later) and stirred, a very clear dispersion can be obtained, which serves as an indicator that the surface modification of the quantum dots has been significantly improved.

[0156] For example, the quantum dot may have a maximum fluorescence emission wavelength between 500 nm and 680 nm.

[0157] For example, if the curable composition according to one embodiment is a solvent-free curable composition, the quantum dots may be included in an amount of 5% to 60% by weight, for example, 10% to 60% by weight, for example, 20% to 60% by weight, or for example, 30% to 50% by weight. When the quantum dots are included within the above range, high light retention and light efficiency can be achieved even after curing.

[0158] For example, if the curable composition according to one embodiment is a curable composition containing a solvent, the quantum dots may be present in an amount of 1% to 40% by weight, for example, 3% to 30% by weight, relative to the total amount of the curable composition. When the quantum dots are included within the above range, excellent light conversion efficiency can be achieved, and excellent fairness can be obtained without impeding pattern characteristics and development characteristics.

[0159] To date, development of quantum dot-containing curable compositions (inks) has focused on specializing in thiol-based binders or monomers that have good compatibility with quantum dots, and these have even been commercialized.

[0160] For example, the quantum dot can absorb light in the wavelength range of 360 nm to 780 nm, for example, in the wavelength range of 400 nm to 780 nm, and emit fluorescence in the wavelength range of 500 nm to 700 nm, for example, in the wavelength range of 500 nm to 580 nm, or in the wavelength range of 600 nm to 680 nm. That is, the quantum dot has a maximum fluorescence emission wavelength (fluorescence λ) of 500 nm to 680 nm. em ) can have.

[0161] Each of the quantum dots can independently have a full width at half maximum (FWHM) of 20 nm to 100 nm, for example, 20 nm to 50 nm. When the quantum dots have a FWHM within the above range, the higher the color purity, the higher the color reproduction rate when used as a color material in a color filter.

[0162] Each of the aforementioned quantum dots may independently be organic, inorganic, or a hybrid of organic and inorganic materials.

[0163] Each quantum dot can be independently composed of a core and a shell surrounding the core, and the core and shell can independently have structures such as a core made up of groups II-IV, III-V, etc., a core / shell, a core / first shell / second shell, an alloy, or an alloy / shell.

[0164] For example, the core may include, but is not limited to, at least one material selected from the group consisting of CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, HgS, HgSe, HgTe, GaN, GaP, GaAs, InP, InAs, and alloys thereof. The shell surrounding the core may include, but is not limited to, at least one material selected from the group consisting of CdSe, ZnSe, ZnS, ZnTe, CdTe, PbS, TiO, SrSe, HgSe, and alloys thereof.

[0165] In one embodiment, given the recent significant increase in environmental concerns worldwide and the strengthening of regulations against toxic substances, a non-cadmium-based light-emitting material (such as InP / ZnS or InP / ZeSe / ZnS), which has a slightly lower quantum yield but is more environmentally friendly, was used instead of a light-emitting material with a cadmium-based core. However, the embodiment is not necessarily limited to this.

[0166] In the case of the aforementioned core / shell structure quantum dot, the size (average particle size) of each quantum dot including the shell may be between 1 nm and 15 nm, for example, between 5 nm and 15 nm.

[0167] For example, the quantum dots may each independently include red quantum dots, green quantum dots, or a combination thereof. The red quantum dots may each independently have an average particle size of 10 nm to 15 nm. The green quantum dots may each independently have an average particle size of 5 nm to 8 nm.

[0168] On the other hand, for the dispersion stability of the quantum dots, the curable composition according to one embodiment may further contain a dispersant. The dispersant helps to uniformly disperse the photoconversion material, such as quantum dots, within the curable composition, and any nonionic, anionic, or cationic dispersant can be used. Specifically, polyalkylene glycols or their esters, polyoxyalkylenes, polyhydric alcohol ester alkylene oxide adducts, alcohol alkylene oxide adducts, sulfonic acid esters, sulfonates, carboxylates, carboxyates, alkylamide alkylene oxide adducts, alkylamines, etc., can be used individually or in combination of two or more. The dispersant can be used in an amount of 0.1% to 100% by weight relative to the solid content of the photoconversion material, such as quantum dots, for example, 10% to 20% by weight.

[0169] (polymerizable compound) A curable composition according to one embodiment contains a polymerizable compound, the polymerizable compound may have a carbon-carbon double bond at its terminus.

[0170] The polymerizable compound having a carbon-carbon double bond at its terminus may be present in an amount of 40% to 95% by weight, for example, 50% to 90% by weight, relative to the total amount of the solvent-free curable composition. Only when the content of the polymerizable compound having a carbon-carbon double bond at its terminus is within the above range can a solvent-free curable composition with a viscosity that allows for ink-checking be produced, and the quantum dots in the produced solvent-free curable composition can have excellent dispersibility, thereby improving the optical properties.

[0171] For example, the polymerizable compound having a carbon-carbon double bond at its terminus may have a molecular weight of 170 g / mol to 1,000 g / mol. When the molecular weight of the polymerizable compound having a carbon-carbon double bond at its terminus is within the above range, it may be advantageous for inkjet printing without increasing the viscosity of the composition while not hindering the optical properties of quantum dots.

[0172] For example, the polymerizable compound having a carbon-carbon double bond at its terminus can be represented by the following chemical formula 35, but is not necessarily limited thereto.

[0173] [Chemical formula 35] [ka]

[0174] In the aforementioned chemical formula 35, R 6 and R 7 Each of these is independently a hydrogen atom or a substituted or unsubstituted C1 to C10 alkyl group. L 19 and L 21 These are, independently, single-bonded, substituted, or unsubstituted C1 to C10 alkylene groups. L 20 This includes substituted or unsubstituted C1 to C10 alkylene groups, substituted or unsubstituted C3 to C20 cycloalkylene groups, or ether groups. * -O- * )

[0175] For example, polymerizable compounds having a carbon-carbon double bond at the terminal end can be represented by the following chemical formulas 35-1, 35-2, or 35-3, but are not necessarily limited to these.

[0176] [Chemical formula 35-1] [ka]

[0177] [Chemical formula 35-2] [ka]

[0178] [Chemical formula 35-3] [ka]

[0179] For example, the polymerizable compounds having a carbon-carbon double bond at the terminal may further include, in addition to the compounds shown in chemical formulas 35-1, 35-2, or 35-3, ethylene glycol diacrylate, triethylene glycol diacrylate, 1,4-butanediol diacrylate, neopentyl glycol diacrylate, pentaerythritol diacrylate, pentaerythritol triacrylate, dipentaerythritol diacrylate, dipentaerythritol triacrylate, dipentaerythritol pentaacrylate, pentaerythritol hexaacrylate, bisphenol A diacrylate, trimethylolpropane triacrylate, novolac epoxy acrylate, ethylene glycol dimethacrylate, triethylene glycol dimethacrylate, propylene glycol dimethacrylate, 1,4-butanediol dimethacrylate, 1,6-hexanediol dimethacrylate, or combinations thereof.

[0180] Furthermore, the polymerizable compound having a carbon-carbon double bond at its terminus may further contain monomers commonly used in conventional thermosetting or photocurable compositions. For example, the monomer may further contain oxetane compounds such as bis[1-ethyl(3-oxetanyl)]methyl ether.

[0181] Furthermore, if the curable composition contains a solvent, the polymerizable compound may be present in an amount of 1% to 20% by weight, 1% to 15% by weight, for example, 5% to 15% by weight, relative to the total amount of the curable composition. When the polymerizable compound is present within the above range, the optical properties of the quantum dots can be improved, sufficient curing occurs during exposure in the pattern formation process, resulting in excellent reliability, and the heat resistance, light resistance, chemical resistance, resolution, and adhesion of the pattern are also excellent.

[0182] On the other hand, if the curable composition contains a solvent, the polymerizable compound can be a monofunctional or polyfunctional ester of (meth)acrylic acid having at least one ethylenically unsaturated double bond.

[0183] Because the polymerizable compound has the ethylenically unsaturated double bond, sufficient polymerization occurs during exposure in the pattern formation process, making it possible to form a pattern with excellent heat resistance, light resistance, and chemical resistance.

[0184] Specific examples of polymerizable compounds used in the aforementioned solvent-type curable composition include ethylene glycol di(meth)acrylate, diethylene glycol di(meth)acrylate, triethylene glycol di(meth)acrylate, propylene glycol di(meth)acrylate, neopentyl glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, bisphenol A di(meth)acrylate, pentaerythritol di(meth)acrylate, pentaerythritol tri(meth)acrylate, and pentaerythritol Examples include tetra(meth)acrylate, pentaerythritol hexa(meth)acrylate, dipentaerythritol di(meth)acrylate, dipentaerythritol tri(meth)acrylate, dipentaerythritol penta(meth)acrylate, dipentaerythritol hexa(meth)acrylate, bisphenol A epoxy(meth)acrylate, ethylene glycol monomethyl ether(meth)acrylate, trimethylolpropane tri(meth)acrylate, tris(meth)acryloyloxyethyl phosphate, and novolac epoxy(meth)acrylate.

[0185] Examples of commercially available polymerizable compounds include the following: Examples of monofunctional esters of (meth)acrylic acid include Aronix® M-101, M-111, and M-114 from Toagosei Chemical Industry Co., Ltd.; KAYARAD® TC-110S and TC-120S from Nippon Kayaku Co., Ltd.; and V-158 and V-2311 from Osaka Organic Chemical Industry Co., Ltd. Examples of difunctional esters of (meth)acrylic acid include Aronix M-210, M-240, and M-6200 from Toagosei Chemical Industry Co., Ltd.; KAYARAD HDDA, HX-220, and R-604 from Nippon Kayaku Co., Ltd.; and V-260, V-312, and V-335HP from Osaka Organic Chemical Industry Co., Ltd. Examples of the aforementioned trifunctional esters of (meth)acrylic acid include Aronix M-309, M-400, M-405, M-450, M-7100, M-8030, and M-8060 from Toagosei Chemical Industry Co., Ltd.; KAYARAD TMPTA, DPCA-20, -30, -60, and -120 from Nippon Kayaku Co., Ltd.; and V-295, -300, -360, -GPT, -3PA, and -400 from Osaka Organic Chemical Industry Co., Ltd. These products can be used individually or in combination of two or more.

[0186] The polymerizable compound may also be treated with an acid anhydride before use to impart better developability.

[0187] (Light diffusing agent) A curable composition according to one embodiment may further include a light diffusing agent.

[0188] For example, the light diffusing agent may include barium sulfate (BaSO4), calcium carbonate (CaCO3), titanium dioxide (TiO2), zirconia (ZrO2), or a combination thereof.

[0189] The light diffusing agent reflects light that has not been absorbed by the quantum dots, allowing the quantum dots to reabsorb the reflected light. In other words, the light diffusing agent can increase the amount of light absorbed by the quantum dots and thereby increase the photoconversion efficiency of the curable composition.

[0190] The light diffusing agent has an average particle size (D 50 The particle size can be between 150 nm and 250 nm, specifically between 180 nm and 230 nm. When the average particle size of the light diffusing agent is within the above range, a better light diffusing effect can be achieved, and the light conversion efficiency can be increased.

[0191] The light diffusing agent may be included in an amount of 1% to 20% by weight, for example, 2% to 15% by weight, or for example, 2% to 10% by weight, relative to the total amount of the curable composition. If the light diffusing agent is included in an amount of less than 1% by weight relative to the total amount of the curable composition, it is difficult to expect an improvement in the light conversion efficiency by using the light diffusing agent, and if it is included in an amount exceeding 20% ​​by weight, there is a risk of quantum dot sedimentation problems occurring.

[0192] (Polymerization initiator) A curable composition according to one embodiment may further contain a polymerization initiator, which may include, for example, a photopolymerization initiator, a thermal polymerization initiator, or a combination thereof.

[0193] The aforementioned photopolymerization initiator can be, but is not limited to, acetophenone compounds, benzophenone compounds, thioxanthone compounds, benzoin compounds, triazine compounds, oxime compounds, aminoketone compounds, and others, which are commonly used initiators in photosensitive resin compositions.

[0194] Examples of the aforementioned acetophenone compounds include 2,2'-diethoxyacetophenone, 2,2'-dibutoxyacetophenone, 2-hydroxy-2-methylpropiophenone, pt-butyltrichloroacetophenone, pt-butyldichloroacetophenone, 4-chloroacetophenone, 2,2'-dichloro-4-phenoxyacetophenone, 2-methyl-1-(4-(methylthio)phenyl)-2-mopolinopropan-1-one, and 2-benzyl-2-dimethylamino-1-(4-mopolinophenyl)-butan-1-one.

[0195] Examples of the aforementioned benzophenone compounds include benzophenone, benzoylbenzoic acid, methyl benzoylbenzoate, 4-phenylbenzophenone, hydroxybenzophenone, acrylic benzophenone, 4,4'-bis(dimethylamino)benzophenone, 4,4'-bis(diethylamino)benzophenone, 4,4'-dimethylaminobenzophenone, 4,4'-dichlorobenzophenone, and 3,3'-dimethyl-2-methoxybenzophenone.

[0196] Examples of the thioxanthone compounds include thioxanthone, 2-methylthioxanthone, isopropylthioxanthone, 2,4-diethylthioxanthone, 2,4-diisopropylthioxanthone, and 2-chlorothioxanthone.

[0197] Examples of the aforementioned benzoin compounds include benzoin, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, and benzyl dimethyl ketal.

[0198] Examples of the aforementioned triazine compounds include 2,4,6-trichloro-s-triazine, 2-phenyl-4,6-bis(trichloromethyl)-s-triazine, 2-(3',4'-dimethoxystyryl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4'-methoxynaphthyl)-4,6-bis(trichloromethyl)-s-triazine, 2-(p-methoxyphenyl)-4,6-bis(trichloromethyl)-s-triazine, and 2-(p-tolyl)-4,6-bis(trichloromethyl)-s-tri Examples include azine, 2-biphenyl-4,6-bis(trichloromethyl)-s-triazine, bis(trichloromethyl)-6-styryl-s-triazine, 2-(naphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-(4-methoxynaphtho-1-yl)-4,6-bis(trichloromethyl)-s-triazine, 2-4-bis(trichloromethyl)-6-piperonyl-s-triazine, and 2-4-bis(trichloromethyl)-6-(4-methoxystyryl)-s-triazine.

[0199] Examples of the aforementioned oxime compounds include O-acyloxime compounds, 2-(O-benzoyloxime)-1-[4-(phenylthio)phenyl]-1,2-octanedione, 1-(O-acetyloxime)-1-[9-ethyl-6-(2-methylbenzoyl)-9H-carbazole-3-yl]ethanone, and O-ethoxycarbonyl-α-oxyamino-1-phenylpropan-1-one. Specific examples of the O-acyloxime compounds include 1,2-octanedione, 2-dimethylamino-2-(4-methylbenzyl)-1-(4-morpholine-4-ylphenyl)-butan-1-one, 1-(4-phenylsulfanylphenyl)-butan-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1,2-dione-2-oxime-O-benzoate, 1-(4-phenylsulfanylphenyl)-octane-1-one oxime-O-acetate, and 1-(4-phenylsulfanylphenyl)-butan-1-one oxime-O-acetate.

[0200] Examples of the aforementioned aminoketone compounds include 2-benzyl-2-dimethylamino-1-(4-morpholinophenyl)-butanone-1.

[0201] In addition to the aforementioned compound, the photopolymerization initiator can also be a carbazole compound, a diketone compound, a sulfonium borate compound, a diazo compound, an imidazole compound, a non-imidazole compound, or the like.

[0202] The aforementioned photopolymerization initiator can be used together with a photosensitizer that induces a chemical reaction by absorbing light, becoming detached, and then transferring that energy.

[0203] Examples of the aforementioned photosensitizers include tetraethylene glycol bis-3-mercaptopropionate, pentaerythritol tetrakis-3-mercaptopropionate, and dipentaerythritol tetrakis-3-mercaptopropionate.

[0204] Examples of the aforementioned thermal polymerization initiators include peroxides, specifically benzoyl peroxide, dibenzoyl peroxide, lauryl peroxide, dilauryl peroxide, di-tert-butyl peroxide, cyclohexane peroxide, methyl ethyl ketone peroxide, hydroperoxides (e.g., tert-butyl hydroperoxide, cumene hydroperoxide), dicyclohexyl peroxydicarbonate, 2,2-azobis(isobutyronitrile), t-butyl perbenzoate, and 2,2'-azobis-2-methylpropionitrile, but are not necessarily limited to these; any that are widely known in the industry can be used.

[0205] The polymerization initiator may be present in an amount of 0.1% to 10% by weight, for example, 2% to 8% by weight, relative to the total amount of the curable composition. When the polymerization initiator is within the above range, sufficient curing occurs during exposure or thermal curing, resulting in excellent reliability, preventing a decrease in transmittance due to unreacted initiators, and preventing a decrease in the optical properties of quantum dots.

[0206] (Binder resin) The curable composition according to one embodiment may further contain a binder resin.

[0207] The binder resin may include acrylic resins, cardo resins, epoxy resins, or combinations thereof.

[0208] The acrylic resin may be a copolymer of a first ethylenically unsaturated monomer and a second ethylenically unsaturated monomer copolymerizable therewith, and may contain one or more repeating acrylic units.

[0209] Specific examples of the acrylic binder resin include, but are not limited to, polybenzyl methacrylate, (meth)acrylic acid / benzyl methacrylate copolymer, (meth)acrylic acid / benzyl methacrylate / styrene copolymer, (meth)acrylic acid / benzyl methacrylate / 2-hydroxyethyl methacrylate copolymer, and (meth)acrylic acid / benzyl methacrylate / styrene / 2-hydroxyethyl methacrylate copolymer. These can also be used individually or in combination of two or more.

[0210] The weight-average molecular weight of the acrylic resin may be between 5,000 g / mol and 15,000 g / mol. When the weight-average molecular weight of the acrylic resin is within the above range, it exhibits excellent adhesion to the substrate, good physical and chemical properties, and appropriate viscosity.

[0211] The acid value of the acrylic resin can be between 80 mg KOH / g and 130 mg KOH / g. When the acid value of the acrylic resin is within the above range, the resolution of the pixel pattern is excellent.

[0212] The cardo-based resin can be one used in ordinary curable resin (or photosensitive resin) compositions, and for example, the one disclosed in Korean Published Patent No. 10-2018-0067243 can be used, but is not limited thereto.

[0213] The aforementioned cardo-based resin can be produced by mixing two or more of the following: fluorene-containing compounds such as 9,9-bis(4-oxyranylmethoxyphenyl)fluorene; anhydride compounds such as benzenetetracarboxylic acid dianhydride, naphthalenetetracarboxylic acid dianhydride, biphenyltetracarboxylic acid dianhydride, benzophenonetetracarboxylic acid dianhydride, pyromeretic dianhydride, cyclobutanetetracarboxylic acid dianhydride, perylenetetracarboxylic acid dianhydride, tetrahydrofurantetracarboxylic acid dianhydride, and tetrahydrophthalic acid anhydride; glycol compounds such as ethylene glycol, propylene glycol, and polyethylene glycol; alcohol compounds such as methanol, ethanol, propanol, n-butanol, cyclohexanol, and benzyl alcohol; solvent compounds such as propylene glycol methyl ethyl acetate and N-methylpyrrolidone; phosphorus compounds such as triphenylphosphine; and amine or ammonium salt compounds such as tetramethylammonium chloride, tetraethylammonium bromide, benzyl diethylamine, triethylamine, tributylamine, and benzyltriethylammonium chloride.

[0214] The weight-average molecular weight of the cardo resin may be between 500 g / mol and 50,000 g / mol, for example, between 1,000 g / mol and 30,000 g / mol. When the weight-average molecular weight of the cardo resin is within the above range, pattern formation is improved without residue during curing film production, and good patterns can be obtained without loss of film thickness during development of the curable composition.

[0215] When the binder resin is a cardo-type resin, the curable composition containing it, particularly the photosensitive resin composition, exhibits excellent developability, good sensitivity during photocuring, and excellent fine pattern formation.

[0216] The epoxy resin is a monomer or oligomer that can be polymerized by heat, and may include compounds having carbon-carbon unsaturated bonds and carbon-carbon cyclic bonds.

[0217] The epoxy resin may include, but is not limited to, bisphenol A type epoxy resin, bisphenol F type epoxy resin, phenol novolac type epoxy resin, cyclic aliphatic epoxy resin, and aliphatic polyglycidyl ether.

[0218] Commercially available products of this type of compound include YX4000 and YX4000H from Yukashell Epoxy Co., Ltd., which are bisphenyl epoxy resins. , YL6121H, YL6640, YL6677; as cresol novolac type epoxy resins, EOCN-102, EOCN-103S, EOCN-104S, EOCN-1020, EOCN-1025, EOCN-1027 from Nippon Kayaku Co., Ltd., and Epicote 180S75 from Yukashell Epoxy Co., Ltd.; as bisphenol A type epoxy resins, Epicote 1001, 1002, 1003, 1004, 1007, 1009, 1010, and 828 from Yukashell Epoxy Co., Ltd.; as bisphenol F type epoxy resins, Epicote 807 and 834 from Yukashell Epoxy Co., Ltd.; as phenol novolac type epoxy resins, Epicote 152, 154, 157H65 from Yukashell Epoxy Co., Ltd., and EPPN201, 202 from Nippon Kayaku Co., Ltd.; as other cyclic aliphatic epoxy resins, CIBA-GEIGYA Examples include CY175, CY177, and CY179 from AG, ERL-4234, ERL-4299, ERL-4221, and ERL-4206 from UCC, Shodine 509 from Showa Denko K.K., Araldite CY-182, CY-192, and CY-184 from CIBA-GEIGY AG, Epiclon 200 and 400 from Dainippon Ink & Industrial Co., Ltd., Epicote 871, 872, and EP1032H60 from Yukashell Epoxy Co., Ltd., ED-5661 and ED-5662 from Celanese Coating Co., Ltd.; Epicote 190P and 191P from Yukashell Epoxy Co., Ltd. as aliphatic polyglycidyl ethers, Epolite 100MF from Kyoeisha Oil & Fat Chemical Industry Co., Ltd., and Epiol TMP from Nippon Oil & Fat Co., Ltd.

[0219] For example, if the curable composition according to one embodiment is a solvent-free curable composition, the binder resin may be included in an amount of 0.5% to 10% by weight, for example, 1% to 5% by weight, relative to the total amount of the curable composition. In this case, the heat resistance and chemical resistance of the solvent-free curable composition can be improved, and the storage stability of the composition can also be improved.

[0220] For example, if the curable composition according to one embodiment is a curable composition containing a solvent, the binder resin may be included in an amount of 1% to 30% by weight, for example, 3% to 20% by weight, relative to the total amount of the curable composition. In this case, pattern properties, heat resistance, and chemical resistance can be improved.

[0221] (Other additives) To improve the stability and dispersibility of the quantum dots, the curable composition according to one embodiment may further contain a polymerization inhibitor.

[0222] The polymerization inhibitor may include, but is not limited to, a hydroquinone compound, a catechol compound, or a combination thereof. By further including the hydroquinone compound, catechol compound, or a combination thereof in the curable composition according to one embodiment, room-temperature crosslinking can be prevented between printing (coating) and exposure of the curable composition.

[0223] For example, the hydroquinone compounds, catechol compounds, or combinations thereof may include, but are not limited to, hydroquinone, methylhydroquinone, methoxyhydroquinone, t-butylhydroquinone, 2,5-di-t-butylhydroquinone, 2,5-bis(1,1-dimethylbutyl)hydroquinone, 2,5-bis(1,1,3,3-tetramethylbutyl)hydroquinone, catechol, t-butylcatechol, 4-methoxyphenol, pyrogallol, 2,6-di-t-butyl-4-methylphenol, 2-naphthol, tris(N-hydroxy-N-nitrosophenylaminato-O,O')aluminium, or combinations thereof.

[0224] The hydroquinone-based compound, catechol-based compound, or combination thereof can be used in the form of a dispersion, and the polymerization inhibitor in the form of a dispersion may be contained in an amount of 0.001% to 3% by weight, for example, 0.01% to 2% by weight, relative to the total amount of the curable composition. When the polymerization inhibitor is contained within the above range, the problem of deterioration over time at room temperature can be resolved, and the decrease in sensitivity and the surface peeling phenomenon can be prevented.

[0225] Furthermore, the curable composition according to one embodiment may further contain malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a fluorine-based surfactant, or a combination thereof, in order to improve heat resistance and reliability.

[0226] For example, the curable composition according to one embodiment may further contain a silane coupling agent having a reactive substituent such as a vinyl group, a carboxyl group, a methacrylate group, an isocyanate group, or an epoxy group in order to improve adhesion to the substrate.

[0227] Examples of the silane coupling agents include trimethoxysilylbenzoic acid, γ-methacrylateoxypropyltrimethoxysilane, vinyltriacetoxysilane, vinyltrimethoxysilane, γ-isocyanatetopropyltriethoxysilane, γ-glycidoxypropyltrimethoxysilane, and β-epoxycyclohexyl)ethyltrimethoxysilane, which can be used individually or in combination of two or more.

[0228] The silane coupling agent may be included in an amount of 0.01 to 10 parts by weight per 100 parts by weight of the curable composition. When the silane coupling agent is included within the above range, it exhibits excellent adhesion, storage properties, and other characteristics.

[0229] Furthermore, the curable composition may further contain a surfactant, such as a fluorinated surfactant, if necessary, to improve coating properties and prevent the formation of defects, i.e., to improve leveling performance.

[0230] The fluorinated surfactant may have a low weight-average molecular weight of 4,000 g / mol to 10,000 g / mol, specifically, 6,000 g / mol to 10,000 g / mol. Furthermore, the fluorinated surfactant may have a surface tension of 18 mN / m to 23 mN / m (measured in a 0.1% propylene glycol monomethyl ether acetate (PGMEA) solution). When the weight-average molecular weight and surface tension of the fluorinated surfactant are within the above ranges, the leveling performance can be further improved, preventing staining during high-speed coating, resulting in less bubble generation and fewer film defects, thus providing excellent properties for slit coating in high-speed coating methods.

[0231] As the aforementioned fluorine-based surfactants, you can use fluorine-based surfactants that are commercially available under names such as BM-1000 and BM-1100 from BM Chemie; Megafac® F142D, F172, F173, and F183 from Dainippon Ink and Chemicals, Inc.; Florard FC-135, FC-170C, FC-430, and FC-431 from Sumitomo 3M Limited; Saffron® S-112, S-113, S-131, S-141, and S-145 from Asahi Glass Co., Ltd.; SH-28PA, SH-190, SH-193, SZ-6032, and SF-8428 from Toray Silicone Co., Ltd.; and F-482, F-484, F-478, and F-554 from DIC Corporation.

[0232] Furthermore, the curable composition according to one embodiment may also use a silicone-based surfactant in addition to the aforementioned fluorine-based surfactant. Specific examples of the silicone-based surfactant include, but are not limited to, Toshiba Silicone's TSF400, TSF401, TSF410, and TSF4440.

[0233] The surfactant, including the fluorine-based surfactant, may be included in an amount of 0.01 to 5 parts by weight, for example, 0.1 to 2 parts by weight, per 100 parts by weight of the curable composition. When the surfactant is included within the above range, the phenomenon of foreign matter being generated in the sprayed composition will be reduced.

[0234] Furthermore, the curable composition according to one embodiment may have a certain amount of other additives, such as antioxidants, added to it, as long as they do not impair its physical properties.

[0235] (solvent) On the other hand, the curable composition according to one embodiment may further contain a solvent.

[0236] The aforementioned solvents include, for example, alcohols such as methanol and ethanol; glycol ethers such as ethylene glycol methyl ether, ethylene glycol ethyl ether, and propylene glycol methyl ether; cellosolve acetates such as methyl cellosolve acetate, ethyl cellosolve acetate, and diethyl cellosolve acetate; carbitols such as methyl ethyl carbitol, diethyl carbitol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol dimethyl ether, diethylene glycol methyl ethyl ether, and diethylene glycol diethyl ether; propylene glycol alkyl ether acetates such as propylene glycol monomethyl ether acetate and propylene glycol propyl ether acetate; and ketones such as methyl ethyl ketone, cyclohexanone, 4-hydroxy-4-methyl-2-pentanone, methyl-n-propyl ketone, methyl-n-butyl ketone, methyl-n-amyl ketone, and 2-heptanone. Alkyl acetates; saturated aliphatic monocarboxylate alkyl esters such as ethyl acetate, n-butyl acetate, and isobutyl acetate; alkyl lactate esters such as methyl lactate and ethyl lactate; alkyl hydroxyacetate esters such as methyl hydroxyacetate, ethyl hydroxyacetate, and butyl hydroxyacetate; alkoxyalkyl acetate esters such as methoxymethyl acetate, methoxyethyl acetate, methoxybutyl acetate, ethoxymethyl acetate, and ethoxyethyl acetate; alkyl 3-hydroxypropionate esters such as methyl 3-hydroxypropionate and ethyl 3-hydroxypropionate; alkyl 3-alkoxypropionate esters such as methyl 3-methoxypropionate, ethyl 3-methoxypropionate, ethyl 3-ethoxypropionate, and methyl 3-ethoxypropionate; alkyl 2-hydroxypropionate esters such as methyl 2-hydroxypropionate, ethyl 2-hydroxypropionate, and propyl 2-hydroxypropionate;Alkyl 2-alkoxypropionate esters such as methyl 2-methoxypropionate, ethyl 2-methoxypropionate, ethyl 2-ethoxypropionate, and methyl 2-ethoxypropionate; Alkyl 2-hydroxy-2-methylpropionate esters such as methyl 2-hydroxy-2-methylpropionate and ethyl 2-hydroxy-2-methylpropionate; Alkyl 2-alkoxy-2-methylpropionate esters such as methyl 2-methoxy-2-methylpropionate and ethyl 2-ethoxy-2-methylpropionate; 2-hydroxyethylpropionate, 2-hydroxy-2-methylethylpropionate, hydroxyethyl acetate, methyl 2-hydroxy-3-methyl Examples include esters such as rubutanoate; or ketonic acid esters such as ethyl pyruvate; and also, but are not limited to, N-methylformamide, N,N-dimethylformamide, N-methylformanilide, N-methylacetamide, N,N-dimethylacetamide, N-methylpyrrolidone, dimethyl sulfoxide, benzyl ethyl ether, dihexyl ether, acetylacetone, isophorone, caproic acid, caprylic acid, 1-octanol, 1-nonanol, benzyl alcohol, benzyl acetate, ethyl benzoate, diethyl oxalate, diethyl maleate, γ-butyrolactone, ethylene carbonate, propylene carbonate, and phenyl cellosolve acetate.

[0237] For example, the solvent is preferably a glycol ether such as ethylene glycol monoethyl ether or ethylene diglycol methyl ethyl ether; an ethylene glycol alkyl ether acetate such as ethyl cellosolve acetate; an ester such as ethyl 2-hydroxypropionate; a carbitol such as diethylene glycol monomethyl ether; an propylene glycol alkyl ether acetate such as propylene glycol monomethyl ether acetate or propylene glycol propyl ether acetate; an alcohol such as ethanol; a cyclohexyl acetate; or a combination thereof.

[0238] For example, the solvent may be a high-boiling polar solvent containing propylene glycol monomethyl ether acetate, dipropylene glycol methyl ether acetate, ethanol, ethylene glycol dimethyl ether, ethylene diglycol methyl ethyl ether, diethylene glycol dimethyl ether, 2-butoxyethanol, N-methylpyrrolidine, N-ethylpyrrolidine, propylene carbonate, γ-butyrolactone, cyclohexyl acetate, or a combination thereof.

[0239] The solvent may be present in an amount of 40% to 80% by weight, for example, 45% to 80% by weight, relative to the total amount of the curable composition. When the solvent is within the above range, the solvent-type curable composition has an appropriate viscosity, which allows for excellent coating properties during spin coating and large-area coating using slits.

[0240] Another embodiment provides the curable composition, for example, a cured film produced using the curable composition, a color filter containing the cured film, and a display device containing the color filter. For example, the display device may include a micro-LED light source.

[0241] One of the methods for manufacturing the cured film includes the steps of: applying the curable composition onto a substrate by an inkjet spraying method to form a pattern (S1); and curing the pattern (S2).

[0242] (S1) Stage of forming a pattern The curable composition is preferably applied to a substrate to a thickness of 0.5 to 20 μm by an inkjet spraying method. The inkjet spraying method can form a pattern by spraying only a single color from each nozzle and repeating the spraying for the required number of colors, or it can also form a pattern by simultaneously spraying the required number of colors through each inkjet nozzle to reduce the number of steps.

[0243] (S2) Hardening stage Pixels can be obtained by curing the patterns obtained above. In this case, both a thermocuring process and a photocuring process can be applied as curing methods. The thermocuring process is preferably cured by heating at a temperature of 100°C or higher, more preferably by heating at 100°C to 300°C, and even more preferably by heating at 160°C to 250°C. The photocuring process involves irradiating with active rays such as UV light of 190 nm to 450 nm, for example, 200 nm to 400 nm. Depending on the case, light sources used for irradiation may include low-pressure mercury lamps, high-pressure mercury lamps, ultra-high-pressure mercury lamps, metal halide lamps, argon gas lasers, i-lines, KrF, ArF, I-ArF, EUV, X-rays, and electron beams.

[0244] Another method for manufacturing the cured film involves using the curable composition to produce the cured film using a lithography method, and the manufacturing method is as follows.

[0245] (1) Coating and film formation stage The curable composition is applied to a substrate that has undergone a predetermined pretreatment using methods such as spin coating, slit coating, roll coating, screen printing, or applicator coating to a desired thickness, for example, 2 μm to 10 μm. The coating film is then formed by heating at a temperature of 70°C to 90°C for 1 to 10 minutes to remove the solvent.

[0246] (2) Exposure step After interposing a mask of a predetermined shape to form the pattern required for the obtained coating film, an active ray such as UV light in the range of 190 nm to 450 nm, for example, 200 nm to 400 nm, is irradiated. Depending on the circumstances, the light source used for irradiation may also be a low-pressure mercury lamp, high-pressure mercury lamp, ultra-high-pressure mercury lamp, metal halide lamp, argon gas laser, i-line, KrF, ArF, I-ArF, EUV, X-ray, or electron beam.

[0247] The exposure dose varies depending on the type and amount of each component in the curable composition, as well as the thickness of the dried film. For example, when using a high-pressure mercury lamp, it is 500 mJ / cm². 2 The following (based on a 365nm sensor):

[0248] (3) Development stage Following the exposure step, an alkaline aqueous solution is used as a developer to dissolve and remove unwanted parts, leaving only the exposed areas to form an image pattern. That is, when developing with an alkaline developer, the unexposed areas dissolve, and an image color filter pattern is formed.

[0249] (4) Post-processing stage The image pattern obtained by the aforementioned development can be cured by heating or irradiating with activated light again in order to obtain a pattern with superior properties in terms of heat resistance, light resistance, adhesion, crack resistance, chemical resistance, high strength, and storage stability. [Examples]

[0250] Preferred embodiments of the present invention are described below. However, the following embodiments are merely preferred embodiments of the present invention, and the present invention is not limited to the following embodiments.

[0251] (Synthesis of surface modifying materials) <First Ligand> <Synthesis Example 1-1> An aqueous solution prepared by dissolving 1 equivalent of zinc acetate in 50 times its weight in distilled water is rapidly added dropwise to a solution prepared by dissolving 2.5 equivalents of the precursor (chemical formula 19) in a solvent mixture of 10 times its weight in distilled water and methyl alcohol in a 1:1 ratio. After stirring at room temperature, the pH is adjusted from 4.5 to 6.4 or 7 by adding a 10% potassium hydroxide aqueous solution dropwise. The resulting white precipitate is filtered under reduced pressure, passing excess distilled water through it to remove water-soluble impurities, and then dried to obtain the compound shown in chemical formula 2 below.

[0252] [Chemical formula 2] [ka]

[0253] <Synthesis Example 1-2> An aqueous solution of 1 equivalent of zinc acetate dissolved in 50 times its weight in distilled water is rapidly added dropwise to a solution of 2.5 equivalents of the precursor (chemical formula 20) dissolved in 10 times its weight in a solvent mixture of distilled water and methyl alcohol in a 1:1 ratio. After stirring at room temperature, the pH is adjusted from 4.5 to 6.4 or 7 while adding a 10% potassium hydroxide aqueous solution dropwise. The resulting white precipitate is filtered under reduced pressure, passing excess distilled water through it to remove water-soluble impurities, and then dried to finally produce the compound shown in chemical formula 3 below.

[0254] [Chemical formula 3] [ka]

[0255] <Synthesis Example 1-3> An aqueous solution of 1 equivalent of zinc acetate dissolved in 50 times its weight in distilled water is rapidly added dropwise to a solution of 2.5 equivalents of the precursor chemical formula 21 dissolved in 10 times its weight in a solvent mixture of distilled water and methyl alcohol in a 1:1 ratio. After stirring at room temperature, the pH is adjusted from 4.5 to 6.4 or 7 while adding a 10% potassium hydroxide aqueous solution dropwise. The resulting white precipitate is filtered under reduced pressure, passing excess distilled water through it to remove water-soluble impurities, and then dried to finally produce the compound shown in chemical formula 4 below.

[0256] [Chemical formula 4] [ka]

[0257] <Synthesis Example 1-4> An aqueous solution of 1 equivalent of zinc acetate dissolved in 50 times its weight in distilled water is rapidly added dropwise to a solution of 2.5 equivalents of the precursor (chemical formula 22) dissolved in 10 times its weight in a solvent mixture of distilled water and methyl alcohol in a 1:1 ratio. After stirring at room temperature, the pH is adjusted from 4.5 to 6.4 or 7 while adding a 10% potassium hydroxide aqueous solution dropwise. The resulting white precipitate is filtered under reduced pressure, passing excess distilled water through it to remove water-soluble impurities, and then dried to produce the compound shown in chemical formula 5 below.

[0258] [Chemical formula 5] [ka]

[0259] <Synthesis Example 1-5> An aqueous solution of 1 equivalent of zinc acetate dissolved in 50 times its weight in distilled water is rapidly added dropwise to a solution of 2.5 equivalents of the precursor chemical formula 23 dissolved in 10 times its weight in a solvent mixture of distilled water and methyl alcohol in a 1:1 ratio. After stirring at room temperature, the pH is adjusted from 4.5 to 6.4 or 7 while adding a 10% potassium hydroxide aqueous solution dropwise. The resulting white precipitate is filtered under reduced pressure, passing excess distilled water through it to remove water-soluble impurities, and then dried to finally produce the compound shown in chemical formula 6 below.

[0260] [Chemical formula 6] [ka]

[0261] <Synthesis Example 1-6> An aqueous solution of 1 equivalent of zinc acetate dissolved in 50 times its weight in distilled water is rapidly added dropwise to a solution of 2.5 equivalents of the precursor (chemical formula 24) dissolved in 10 times its weight in a solvent mixture of distilled water and methyl alcohol in a 1:1 ratio. After stirring at room temperature, the pH is adjusted from 4.5 to 6.4 or 7 while adding a 10% potassium hydroxide aqueous solution dropwise. The resulting white precipitate is filtered under reduced pressure, passing excess distilled water through it to remove water-soluble impurities, and then dried to finally produce the compound shown in chemical formula 7 below.

[0262] [Chemical formula 7] [ka]

[0263] <Synthesis Example 1-7> An aqueous solution of 1 equivalent of zinc acetate dissolved in 50 times its weight in distilled water is rapidly added dropwise to a solution of 2.5 equivalents of the precursor (chemical formula 25) dissolved in 10 times its weight in a solvent mixture of distilled water and methyl alcohol in a 1:1 ratio. After stirring at room temperature, the pH is adjusted from 4.5 to 6.4 or 7 while adding a 10% potassium hydroxide aqueous solution dropwise. The resulting white precipitate is filtered under reduced pressure, passing excess distilled water through it to remove water-soluble impurities, and then dried to finally produce the compound shown in chemical formula 8 below.

[0264] [Chemical formula 8] [ka]

[0265] <Synthesis Example 1-8> An aqueous solution of 1 equivalent of zinc acetate dissolved in 50 times its weight in distilled water is rapidly added dropwise to a solution of 2.5 equivalents of the precursor chemical formula 26 dissolved in 10 times its weight in a solvent mixture of distilled water and methyl alcohol in a 1:1 ratio. After stirring at room temperature, the pH is adjusted from 4.5 to 6.4 or 7 while adding a 10% potassium hydroxide aqueous solution dropwise. The resulting white precipitate is filtered under reduced pressure, passing excess distilled water through it to remove water-soluble impurities, and then dried to finally produce the compound shown in chemical formula 9 below.

[0266] [Chemical formula 9] [ka]

[0267] <Synthesis Example 1-9> To a suspension of the carboxylic acid precursor (chemical formula 27) dissolved in dichloromethane, 5 times the weight of thionyl chloride and 0.1 times the weight of dimethylformamide were added dropwise. A reflux condenser was then installed and the reaction was heated for 1 hour, after which the solvent was removed under reduced pressure. The remaining white solid was dissolved again in dichloromethane, and 1 equivalent each of 4-aminopyridine and triethylamine were added dropwise. A reflux condenser was again installed and the reaction was heated for 24 hours. After solvent removal and drying, the mixture was dissolved again in dichloromethane, washed with a saturated aqueous solution of sodium bicarbonate, and then dried. A methanol solution of the synthesized compound was added dropwise to a methanol solution of 1 equivalent of zinc chloride, and the mixture was heated to produce the compound shown in chemical formula 10.

[0268] [Chemical formula 10] [ka]

[0269] <Synthesis Example 1-10> Dissolve 2.5 equivalents of the carboxylic acid precursor of chemical formula 28 and 1 equivalent of zinc oxide in ethanol, then stir at 70°C for 60 minutes under an inert gas atmosphere. After cooling to room temperature, centrifuge at 6000 rpm for 3 minutes to remove the supernatant, then add the precipitate to ethanol twice and repeat centrifugation to produce the compound shown in chemical formula 11.

[0270] [Chemical formula 11] [ka]

[0271] In the aforementioned chemical formula 11, R x teeth, The file is JPEG2026536509000106.jpg2139.

[0272] <Synthesis Example 1-11> 2.5 equivalents of the carboxylic acid precursor (chemical formula 29) and 1 equivalent of zinc oxide are dissolved in ethanol, and the mixture is stirred at 70°C for 60 minutes under an inert gas atmosphere. After cooling to room temperature, the mixture is centrifuged at 6000 rpm for 3 minutes to remove the supernatant, and the precipitate is added to ethanol twice and centrifuged repeatedly to produce the compound shown in chemical formula 12.

[0273] [Chemical formula 12] [ka]

[0274] <Synthesis Example 1-12> Dissolve 2.5 equivalents of the carboxylic acid precursor of chemical formula 30 and 1 equivalent of zinc oxide in ethanol, then stir at 70°C for 60 minutes under an inert gas atmosphere. After cooling to room temperature, centrifuge at 6000 rpm for 3 minutes to remove the supernatant, then add the precipitate to ethanol twice and repeat centrifugation to produce the compound shown in chemical formula 13.

[0275] [Chemical formula 13] [ka]

[0276] <Synthesis Example 1-13> Dissolve 2.5 equivalents of the carboxylic acid precursor (chemical formula 31) and 1 equivalent of zinc oxide in ethanol, then stir at 70°C for 60 minutes under an inert gas atmosphere. After cooling to room temperature, centrifuge at 6000 rpm for 3 minutes to remove the supernatant, then add the precipitate to ethanol twice and repeat centrifugation to produce the compound shown in chemical formula 14.

[0277] [Chemical formula 14] [ka]

[0278] <Synthesis Example 1-14> Dissolve 2.5 equivalents of the carboxylic acid precursor (chemical formula 32) and 1 equivalent of zinc oxide in ethanol, then stir at 70°C for 60 minutes under an inert gas atmosphere. After cooling to room temperature, centrifuge at 6000 rpm for 3 minutes to remove the supernatant, then add the precipitate to ethanol twice and repeat centrifugation to produce the compound shown in chemical formula 15.

[0279] [Chemical formula 15] [ka]

[0280] <Synthesis Example 1-15> Dissolve 2.5 equivalents of the carboxylic acid precursor (chemical formula 33) and 1 equivalent of zinc oxide in ethanol, then stir at 70°C for 60 minutes under an inert gas atmosphere. After cooling to room temperature, centrifuge at 6000 rpm for 3 minutes to remove the supernatant, then add the precipitate to ethanol twice and repeat centrifugation to produce the compound shown in chemical formula 16.

[0281] [Chemical formula 16] [ka]

[0282] <Synthesis Example 1-16> Dissolve 2.5 equivalents of the carboxylic acid precursor (chemical formula 34) and 1 equivalent of zinc oxide in ethanol, then stir at 70°C for 60 minutes under an inert gas atmosphere. After cooling to room temperature, centrifuge at 6000 rpm for 3 minutes to remove the supernatant, then add the precipitate to ethanol twice and repeat centrifugation to produce the compound shown in chemical formula 17.

[0283] [Chemical formula 17] [ka]

[0284] <Second Ligand> <Synthesis Example 2-1> To five times the volume of tetrahydrofuran, carboxylic acid precursor 27 and 5 equivalents of 1,1-carbonyldiimide were added, and the mixture was stirred at room temperature under inert nitrogen gas. After 1 hour, 2 equivalents of hydroxylamine hydrochloride were added, and the mixture was continued to stir at room temperature. After 24 hours, the reaction mixture was poured into a 5% aqueous solution of sodium bisulfate and stirred. The reaction mixture was extracted twice with ethyl acetate, and the organic layer was dried and filtered. The product was dissolved in visible ethyl acetate, and after adding an excess of charcoal and stirring, it was filtered through a silica gel pad filter to finally produce the compound shown in chemical formula 19 below.

[0285] [Chemical formula 19] [ka]

[0286] <Synthesis Example 2-2> To five times the volume of tetrahydrofuran, carboxylic acid precursor 28 and 5 equivalents of 1,1-carbonyldiimide were added, and the mixture was stirred at room temperature under inert nitrogen gas. After 1 hour, 2 equivalents of hydroxylamine hydrochloride were added, and the mixture was continued to stir at room temperature. After 24 hours, the reaction mixture was poured into a 5% aqueous solution of sodium bisulfate and stirred. The reaction mixture was extracted twice with ethyl acetate, and the organic layer was dried and filtered. The product was dissolved in visible ethyl acetate, and after adding an excess of charcoal and stirring, it was filtered through a silica gel pad filter to finally produce the compound shown in chemical formula 20 below.

[0287] [Chemical formula 20] [ka]

[0288] <Synthesis Example 2-3> To five times the volume of tetrahydrofuran, carboxylic acid precursor 29 and 5 equivalents of 1,1-carbonyldiimide were added, and the mixture was stirred at room temperature under inert nitrogen gas. After 1 hour, 2 equivalents of hydroxylamine hydrochloride were added, and the mixture was continued to stir at room temperature. After 24 hours, the reaction mixture was poured into a 5% aqueous solution of sodium bisulfate and stirred. The reaction mixture was extracted twice with ethyl acetate, and the organic layer was dried and filtered. The product was dissolved in visible ethyl acetate, and after adding an excess of charcoal and stirring, it was filtered through a silica gel pad filter to finally produce the compound shown in chemical formula 21 below.

[0289] [Chemical formula 21] [ka]

[0290] <Synthesis Example 2-4> To five times the volume of tetrahydrofuran, 30 carboxylic acid precursors and 5 equivalents of 1,1-carbonyldiimide were added, and the mixture was stirred at room temperature under inert nitrogen gas. After 1 hour, 2 equivalents of hydroxylamine hydrochloride were added, and the mixture was continued to stir at room temperature. After 24 hours, the reaction mixture was poured into a 5% aqueous solution of sodium bisulfate and stirred. The reaction mixture was extracted twice with ethyl acetate, and the organic layer was dried and filtered. The product was dissolved in visible ethyl acetate, and after adding an excess of charcoal and stirring, it was filtered through a silica gel pad filter to finally produce the compound shown in chemical formula 22 below.

[0291] [Chemical formula 22] [ka]

[0292] <Synthesis Example 2-5> To five times the volume of tetrahydrofuran, carboxylic acid precursor 31 and 5 equivalents of 1,1-carbonyldiimide were added, and the mixture was stirred at room temperature under inert nitrogen gas. After 1 hour, 2 equivalents of hydroxylamine hydrochloride were added, and the mixture was continued to stir at room temperature. After 24 hours, the reaction mixture was poured into a 5% aqueous solution of sodium bisulfate and stirred. The reaction mixture was extracted twice with ethyl acetate, and the organic layer was dried and filtered. The product was dissolved in visible ethyl acetate, and after adding an excess of charcoal and stirring, it was filtered through a silica gel pad filter to finally produce the compound shown in chemical formula 23 below.

[0293] [Chemical formula 23] [ka]

[0294] <Synthesis Example 2-6> To five times the volume of tetrahydrofuran, carboxylic acid precursor 32 and 5 equivalents of 1,1-carbonyldiimide were added, and the mixture was stirred at room temperature under inert nitrogen gas. After 1 hour, 2 equivalents of hydroxylamine hydrochloride were added, and the mixture was continued to stir at room temperature. After 24 hours, the reaction mixture was poured into a 5% aqueous solution of sodium bisulfate and stirred. The reaction mixture was extracted twice with ethyl acetate, and the organic layer was dried and filtered. The product was dissolved in visible ethyl acetate, and after adding an excess of charcoal and stirring, it was filtered through a silica gel pad filter to finally produce the compound shown in chemical formula 24 below.

[0295] [Chemical formula 24] [ka]

[0296] <Synthesis Example 2-7> To five times the volume of tetrahydrofuran, carboxylic acid precursor 33 and 5 equivalents of 1,1-carbonyldiimide were added, and the mixture was stirred at room temperature under inert nitrogen gas. After 1 hour, 2 equivalents of hydroxylamine hydrochloride were added, and the mixture was continued to stir at room temperature. After 24 hours, the reaction mixture was poured into a 5% aqueous solution of sodium bisulfate and stirred. The reaction mixture was extracted twice with ethyl acetate, and the organic layer was dried and filtered. The product was dissolved in visible ethyl acetate, and after adding an excess of charcoal and stirring, it was filtered through a silica gel pad filter to finally produce the compound shown in chemical formula 25 below.

[0297] [Chemical formula 25] [ka]

[0298] <Synthesis Example 2-8> To five times the volume of tetrahydrofuran, carboxylic acid precursor 34 and 5 equivalents of 1,1-carbonyldiimide were added, and the mixture was stirred at room temperature under inert nitrogen gas. After 1 hour, 2 equivalents of hydroxylamine hydrochloride were added, and the mixture was continued to stir at room temperature. After 24 hours, the reaction mixture was poured into a 5% aqueous solution of sodium bisulfate and stirred. The reaction mixture was extracted twice with ethyl acetate, and the organic layer was dried and filtered. The product was dissolved in visible ethyl acetate, and after adding an excess of charcoal and stirring, it was filtered through a silica gel pad filter to finally produce the compound shown in chemical formula 26 below.

[0299] [Chemical formula 26] [ka]

[0300] <Synthesis Example 2-9> A precursor with the same structure as chemical formula 27 but with a hydroxyl group at the end (in chemical formula 27, the end is * -COOH *A 2 molar solution of m-xylene (CH2OH structure) is mixed with 1.5 equivalents of sodium chloroacetate and 1.5 equivalents of sodium hydroxide powder while stirring. The mixture is then slowly added using a powder feed glass for 10 minutes, stirred at 70°C for 1 hour, cooled to room temperature, and then 1.5 equivalents of 10% hydrochloric acid aqueous solution are added to a pipette. The mixture is then heated again to 70°C. After 30 minutes, the cooled reaction mixture is transferred to a fractionation funnel, the aqueous layer is removed, and the mixture is washed with sodium chloride aqueous solution. The organic layer is dried, filtered, and concentrated by rotation to finally produce the compound shown in chemical formula 27, in which the carboxylic acid is substituted as shown below.

[0301] [Chemical formula 27] [ka]

[0302] <Synthesis Example 2-10> A precursor in which a hydroxyl group is substituted at the end of the same structure as chemical formula 28 (in chemical formula 28, the end is * -COOH * A 2 molar solution of m-xylene (with the structure -CH2OH) is mixed with 1.5 equivalents of sodium chloroacetate and 1.5 equivalents of sodium hydroxide powder while stirring. The mixture is then slowly added for 10 minutes using a powder feed glass, stirred at 70°C for 1 hour, cooled to room temperature, and then 1.5 equivalents of 10% hydrochloric acid aqueous solution are added to a pipette. The mixture is then heated again to 70°C. After 30 minutes, the cooled reaction mixture is transferred to a fractionation funnel, the aqueous layer is removed, and the mixture is washed with sodium chloride aqueous solution. The organic layer is dried, filtered, and concentrated by rotation to finally produce the compound shown in chemical formula 28 with the carboxylic acid substituted below.

[0303] [Chemical formula 28] [ka]

[0304] <Synthesis Example 2-11> A precursor in which a hydroxyl group is substituted at the end of the same structure as chemical formula 29 (in chemical formula 29, the end is *-COOH * A 2 molar solution of m-xylene (with the structure -CH2OH) is mixed with 1.5 equivalents of sodium chloroacetate and 1.5 equivalents of sodium hydroxide powder while stirring. The mixture is then slowly added using a powder feed glass for 10 minutes, stirred at 70°C for 1 hour, cooled to room temperature, and then 1.5 equivalents of 10% hydrochloric acid aqueous solution are pipetted into the mixture. The temperature is then raised again to 70°C. After 30 minutes, the cooled reaction mixture is transferred to a fractionation funnel, the aqueous layer is removed, and the mixture is washed with sodium chloride aqueous solution. The organic layer is dried, filtered, and concentrated by rotation to finally produce the compound shown in chemical formula 29, in which the carboxylic acid is substituted as shown below.

[0305] [Chemical formula 29] [ka]

[0306] <Synthesis Example 2-12> A precursor having the same structure as chemical formula 30 but with a hydroxyl group substituted at the end (in chemical formula 30, the end is * -COOH * A 2 molar solution of m-xylene (with the structure -CH2OH) is mixed with 1.5 equivalents of sodium chloroacetate and 1.5 equivalents of sodium hydroxide powder while stirring. The mixture is then slowly added using a powder feed glass for 10 minutes, stirred at 70°C for 1 hour, cooled to room temperature, and then 1.5 equivalents of 10% hydrochloric acid aqueous solution are added to a pipette. The mixture is then heated again to 70°C. After 30 minutes, the cooled reaction mixture is transferred to a fractionation funnel, the aqueous layer is removed, and the mixture is washed with sodium chloride aqueous solution. The organic layer is dried, filtered, and concentrated by rotation to finally produce the compound shown in chemical formula 30, in which the carboxylic acid is substituted as shown below.

[0307] [Chemical formula 30] [ka]

[0308] <Synthesis Example 2-13> A precursor having the same structure as chemical formula 31 but with a hydroxyl group substituted at the end (in chemical formula 31, the end is * -COOH * A 2 molar solution of m-xylene (with the structure -CH2OH) is mixed with 1.5 equivalents of sodium chloroacetate and 1.5 equivalents of sodium hydroxide powder while stirring. The mixture is then slowly added using a powder feed glass for 10 minutes, stirred at 70°C for 1 hour, cooled to room temperature, and then 1.5 equivalents of 10% hydrochloric acid aqueous solution are added to a pipette. The temperature is then raised again to 70°C. After 30 minutes, the cooled reaction mixture is transferred to a fractionation funnel, the aqueous layer is removed, and the mixture is washed with sodium chloride aqueous solution. The organic layer is dried, filtered, and concentrated by rotation to finally produce the compound shown in chemical formula 31, in which the following carboxylic acid is substituted.

[0309] [Chemical formula 31] [ka]

[0310] <Synthesis Example 2-14> A precursor in which a hydroxyl group is substituted at the end of the same structure as chemical formula 32 (in chemical formula 32, the end is * -COOH * A 2 molar solution of m-xylene (with the structure -CH2OH) is mixed with 1.5 equivalents of sodium chloroacetate and 1.5 equivalents of sodium hydroxide powder while stirring. The mixture is then slowly added for 10 minutes using a powder feed glass, stirred at 70°C for 1 hour, cooled to room temperature, and then 1.5 equivalents of 10% hydrochloric acid aqueous solution are added to a pipette. The mixture is then heated again to 70°C. After 30 minutes, the cooled reaction mixture is transferred to a fractionation funnel, the aqueous layer is removed, and the mixture is washed with sodium chloride aqueous solution. The organic layer is dried, filtered, and concentrated by rotation to finally produce the compound shown in chemical formula 32, in which the carboxylic acid is substituted as shown below.

[0311] [Chemical formula 32] [ka]

[0312] <Synthesis Example 2-15> A precursor in which a hydroxyl group is substituted at the end of the same structure as chemical formula 33 (in chemical formula 33, the end is * -COOH * A 2 molar solution of m-xylene (with the structure -CH2OH) is mixed with 1.5 equivalents of sodium chloroacetate and 1.5 equivalents of sodium hydroxide powder while stirring. The mixture is then slowly added over 10 minutes using a powder feed glass, stirred at 70°C for 1 hour, cooled to room temperature, and then 1.5 equivalents of 10% hydrochloric acid aqueous solution are pipetted into the mixture. The temperature is then raised again to 70°C. After 30 minutes, the cooled reaction mixture is transferred to a fractionation funnel, the aqueous layer is removed, and the mixture is washed with sodium chloride aqueous solution. The organic layer is dried, filtered, and concentrated by rotation to finally produce the compound shown in chemical formula 33, in which the following carboxylic acid is substituted.

[0313] [Chemical formula 33] [ka]

[0314] <Synthesis Example 2-16> A precursor having the same structure as chemical formula 34 but with a hydroxyl group substituted at the end (in chemical formula 34, the end is * -COOH * A 2 molar solution of m-xylene (with the structure -CH2OH) is mixed with 1.5 equivalents of sodium chloroacetate and 1.5 equivalents of sodium hydroxide powder while stirring. The mixture is then slowly added using a powder feed glass for 10 minutes, stirred at 70°C for 1 hour, cooled to room temperature, and then 1.5 equivalents of 10% hydrochloric acid aqueous solution are added to a pipette. The mixture is then heated again to 70°C. After 30 minutes, the cooled reaction mixture is transferred to a fractionation funnel, the aqueous layer is removed, and the mixture is washed with sodium chloride aqueous solution. The organic layer is dried, filtered, and concentrated by rotation to finally produce the compound shown in chemical formula 34, in which the following carboxylic acid is substituted.

[0315] [Chemical formula 34] [ka]

[0316] (Manufacturing of surface-modified quantum dots) <Manufacturing Example 1> A magnetic bar is placed in a three-necked round-bottom flask, and a green quantum dot dispersion solution (InP / ZnSe / ZnS, Hansol Chemical; 26% by weight of quantum dot solids) is added. The green quantum dots have oleic acid substituted on their surface. The first ligand (shown in chemical formula 2) is added and the mixture is stirred at 60°C for 2 hours under a nitrogen atmosphere. Subsequently, the second ligand (shown in chemical formula 19) is added together with ZnCl2, and the mixture is stirred at 25°C under a nitrogen atmosphere for 2 hours. After the reaction is complete, the mixture is cooled to room temperature (23°C), and the quantum dot reaction solution is added to cyclohexane to collect the precipitate. The precipitate and cyclohexane are separated by centrifugation, and the precipitate is thoroughly dried in a vacuum oven for one day to obtain surface-modified green quantum dots.

[0317] <Manufacturing Example 2> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 3 and Chemical Formula 20 were used as the first and second ligands, respectively.

[0318] <Manufacturing Example 3> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 4 and Chemical Formula 21 were used as the first and second ligands, respectively.

[0319] <Manufacturing Example 4> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 5 and Chemical Formula 22 were used as the first and second ligands, respectively.

[0320] <Manufacturing Example 5> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 6 and Chemical Formula 23 were used as the first and second ligands, respectively.

[0321] <Manufacturing Example 6> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 7 and Chemical Formula 24 were used as the first and second ligands, respectively.

[0322] <Manufacturing Example 7> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 8 and Chemical Formula 25 were used as the first and second ligands, respectively.

[0323] <Manufacturing Example 8> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 9 and Chemical Formula 26 were used as the first and second ligands, respectively.

[0324] <Manufacturing Example 9> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 10 and Chemical Formula 27 were used as the first and second ligands.

[0325] <Manufacturing Example 10> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 11 and Chemical Formula 28 were used as the first and second ligands.

[0326] <Manufacturing Example 11> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 12 and Chemical Formula 29 were used as the first and second ligands, respectively.

[0327] <Manufacturing Example 12> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 13 and Chemical Formula 30 were used as the first and second ligands, respectively.

[0328] <Manufacturing Example 13> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 14 and Chemical Formula 31 were used as the first and second ligands, respectively.

[0329] <Manufacturing Example 14> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 15 and Chemical Formula 32 were used as the first and second ligands.

[0330] <Manufacturing Example 15> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 16 and Chemical Formula 33 were used as the first and second ligands, respectively.

[0331] <Manufacturing Example 16> The preparation was carried out in the same manner as in Preparation Example 1, except that the compounds shown in Chemical Formula 17 and Chemical Formula 34 were used as the first and second ligands, respectively.

[0332] <Manufacturing Example 17> The preparation was the same as in Production Example 1, except that the second ligand was not used.

[0333] <Manufacturing Example 18> The process was the same as in Production Example 2, except that the second ligand was not used.

[0334] <Manufacturing Example 19> The process was the same as in Production Example 3, except that the second ligand was not used.

[0335] <Manufacturing Example 20> The process was the same as in Production Example 4, except that the second ligand was not used.

[0336] <Manufacturing Example 21> The process was the same as in Production Example 5, except that the second ligand was not used.

[0337] <Manufacturing Example 22> The process was the same as in Production Example 6, except that the second ligand was not used.

[0338] <Manufacturing Example 23> The process was the same as in Production Example 7, except that the second ligand was not used.

[0339] <Manufacturing Example 24> The preparation was the same as in example 8, except that the second ligand was not used.

[0340] <Manufacturing Example 25> The preparation was the same as in Production Example 9, except that the second ligand was not used.

[0341] <Manufacturing Example 26> The preparation was the same as in Production Example 10, except that the second ligand was not used.

[0342] <Manufacturing Example 27> The preparation was the same as in Production Example 11, except that the second ligand was not used.

[0343] <Manufacturing Example 28> The preparation was the same as in Production Example 12, except that the second ligand was not used.

[0344] <Manufacturing Example 29> The preparation was the same as in Production Example 13, except that the second ligand was not used.

[0345] <Manufacturing Example 30> The preparation was the same as in Production Example 14, except that the second ligand was not used.

[0346] <Manufacturing Example 31> The preparation was the same as in Production Example 15, except that the second ligand was not used.

[0347] <Manufacturing Example 32> The preparation was the same as in Production Example 16, except that the second ligand was not used.

[0348] <Comparative Manufacturing Example 1> The process was the same as in Production Example 1, except that the first ligand was not used.

[0349] <Comparative Manufacturing Example 2> The process was the same as in Production Example 2, except that the first ligand was not used.

[0350] <Comparative Manufacturing Example 3> The process was the same as in Production Example 3, except that the first ligand was not used.

[0351] <Comparative Manufacturing Example 4> The process was the same as in Production Example 4, except that the first ligand was not used.

[0352] <Comparative Manufacturing Example 5> The preparation was the same as in Production Example 5, except that the first ligand was not used.

[0353] <Comparative Manufacturing Example 6> The process was the same as in Production Example 6, except that the first ligand was not used.

[0354] <Comparative Manufacturing Example 7> The process was the same as in Production Example 7, except that the first ligand was not used.

[0355] <Comparative Manufacturing Example 8> The preparation was the same as in Production Example 8, except that the first ligand was not used.

[0356] <Comparative Manufacturing Example 9> The preparation was the same as in Production Example 9, except that the first ligand was not used.

[0357] <Comparative Manufacturing Example 10> The preparation was the same as in Production Example 10, except that the first ligand was not used.

[0358] <Comparative Manufacturing Example 11> The preparation was the same as in Production Example 11, except that the first ligand was not used.

[0359] <Comparative Manufacturing Example 12> The preparation was the same as in Production Example 12, except that the first ligand was not used.

[0360] <Comparative Manufacturing Example 13> The preparation was the same as in Production Example 13, except that the first ligand was not used.

[0361] <Comparative Manufacturing Example 14> The preparation was the same as in Production Example 14, except that the first ligand was not used.

[0362] <Comparative Manufacturing Example 15> The preparation was the same as in Production Example 15, except that the first ligand was not used.

[0363] <Comparative Manufacturing Example 16> The preparation was the same as in Production Example 16, except that the first ligand was not used.

[0364] <Comparative Manufacturing Example 17> The preparation was carried out in the same manner as in Preparation Example 1, except that mono(2-acryloyloxyethyl) succinate (TCI) and the compound shown in Chemical Formula 20 were used as the first and second ligands.

[0365] (Manufacturing of solvent-type curable compositions) Based on the components listed below, curable compositions according to Examples 1 to 32 and Comparative Examples 1 to 17 were prepared according to the compositions shown in Tables 1 to 6 below. Specifically, a photopolymerization initiator was dissolved in a solvent and then thoroughly stirred at room temperature for 2 hours. Next, a polymerizable compound, binder resin, and light diffusing agent were added and thoroughly mixed for about 15 minutes, and then stirred again at room temperature for 1 hour. Meanwhile, quantum dots and a dispersant were placed in a dispersion medium and stirred at room temperature for 30 minutes to produce a quantum dot solution. After that, the quantum dot solution was mixed with the solution containing the photopolymerization initiator, etc., stirred at room temperature for 30 minutes, and the product was filtered three times to remove impurities, thereby producing a solvent-type curable composition.

[0366] (A) Quantum dots (A-1) Quantum dots in manufacturing example 1 (A-2) Quantum dots in manufacturing example 2 (A-3) Quantum dots in manufacturing example 3 (A-4) Quantum dots in manufacturing example 4 (A-5) Quantum dots in manufacturing example 5 (A-6) Quantum dots in manufacturing example 6 (A-7) Quantum dots in manufacturing example 7 (A-8) Quantum dots in manufacturing example 8 (A-9) Quantum dots in manufacturing example 9 (A-10) Quantum dots in manufacturing example 10 (A-11) Quantum dots in manufacturing example 11 (A-12) Quantum dots in manufacturing example 12 (A-13) Quantum dots from manufacturing example 13 (A-14) Quantum dots in manufacturing example 14 (A-15) Quantum dots in manufacturing example 15 (A-16) Quantum dots in manufacturing example 16 (A-17) Quantum dots in manufacturing example 17 (A-18) Quantum dots from manufacturing example 18 (A-19) Quantum dots in manufacturing example 19 (A-20) Quantum dots from manufacturing example 20 (A-21) Quantum dots from manufacturing example 21 (A-22) Quantum dots in manufacturing example 22 (A-23) Quantum dots from manufacturing example 23 (A-24) Quantum dots from manufacturing example 24 (A-25) Quantum dots in manufacturing example 25 (A-26) Quantum dots in manufacturing example 26 (A-27) Quantum dots from manufacturing example 27 (A-28) Quantum dots from manufacturing example 28 (A-29) Quantum dots in manufacturing example 29 (A-30) Quantum dots from manufacturing example 30 (A-31) Quantum dots from manufacturing example 31 (A-32) Quantum dots in manufacturing example 32 (A-33) Quantum dots in comparative manufacturing example 1 (A-34) Quantum dots in comparative manufacturing example 2 (A-35) Quantum dots in comparative manufacturing example 3 (A-36) Quantum dots in comparative manufacturing example 4 (A-37) Quantum dots in comparative manufacturing example 5 (A-38) Quantum dots in comparative manufacturing example 6 (A-39) Quantum dots in comparative manufacturing example 7 (A-40) Quantum dots in comparative manufacturing example 8 (A-41) Quantum dots in comparative manufacturing example 9 (A-42) Quantum dots in comparative manufacturing example 10 (A-43) Quantum dots in comparative manufacturing example 11 (A-44) Quantum dots in comparative manufacturing example 12 (A-45) Quantum dots in comparative manufacturing example 13 (A-46) Quantum dots in comparative manufacturing example 14 (A-47) Quantum dots in comparative manufacturing example 15 (A-48) Quantum dots in comparative manufacturing example 16 (A-49) Quantum dots in comparative manufacturing example 17

[0367] (B) Polymerizable compound Dipentaerythritol hexaacrylate (DPHA, Nippon Kayaku Co., Ltd.)

[0368] (C) Photopolymerization initiator Oxine-based initiators (PBG-305, Tronyl)

[0369] (D) Light diffusing agent Titanium dioxide dispersion (rutile type TiO2; D50 (180nm), solid content 50% by weight, Iridose Co., Ltd.)

[0370] (E) Binder resin (E-1)RY67-1(showa denko) (E-2)TA-001 (Tacoma)

[0371] (F) Solvent Propylene glycol monomethyl ether acetate (PGMEA) (Sigma-Aldrich)

[0372] (G) Other additives Leveling agent (F-554, DIC)

[0373] [Table 1]

[0374] [Table 2]

[0375] [Table 3]

[0376] [Table 4]

[0377] [Table 5]

[0378] [Table 6]

[0379] (Evaluation: Evaluation of the lightfastness reliability of curable compositions) The lightfastness reliability of each curable composition produced by Examples 1 to 32 and Comparative Examples 1 to 17 was evaluated, and the results are shown in Tables 7 and 8 below.

[0380] (Method for evaluating lightfastness reliability) A single-film test specimen measuring 2 cm x 2 cm was prepared from the curable composition described above, and the change in luminous efficiency over time was measured using a self-made blue LED surface light source under blue 100,000 nit light source conditions.

[0381] The single-film test specimens were measured for light efficiency and time-dependent luminance using an integrating sphere (QE-2100, otsuka electronics) and an inline luminance meter (M7000, Mcscience).

[0382] The comparison and evaluation were based on the time to reach T90 (the time it takes for the initial light efficiency measurement to decrease to 90%, with the initial measurement being 100%).

[0383] [Table 7]

[0384] [Table 8]

[0385] From Tables 7 and 8, it can be seen that the curable composition according to one embodiment can significantly improve light resistance reliability.

[0386] The present invention is not limited to the embodiments described above and can be manufactured in a variety of different forms. Those with ordinary skill in the art to which the present invention pertains should understand that the invention can be implemented in other specific forms without altering the technical idea or essential features. Therefore, the embodiments described above should be understood as illustrative in all respects and not limiting.

Claims

1. (A) Quantum dots surface-modified as the compound shown in Chemical Formula 1 below; and, (B) Polymerizable compound A curable composition containing: [Chemical formula 1] 【Chemistry 1】 In the aforementioned chemical formula 1, X １ and X ２ Each is independent of the others. ＊ -NR (where R is a hydrogen atom or a C1 to C10 alkyl group)-O- ＊ or ＊ -O- ＊ And, Y １ and Y ２ each independently represent ＊ -O- ＊ , ＊ -S- ＊ or ＊ -C(=O)NH- ＊ and are R １ and R ２ Each of these is independently a hydrogen atom, a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a combination thereof. L １ ~L ８ Each of these consists of a single bond and an ester group ( ＊ -C(=O)O- ＊ or ＊ -OC (=O)- ＊ ), ＊ - (L ９ -O) ｎ - ＊ (L ９ (where n is a C1 to C10 alkylene group, and n is an integer from 1 to 20) or a substituted or unsubstituted C1 to C20 alkylene group.

2. The curable composition according to claim 1, wherein the compound represented by chemical formula 1 has a symmetrical structure.

3. The compound represented by chemical formula 1 is represented by any one of the following chemical formulas 1-1 to 1-5, and is the curable composition according to claim 1: [Chemical formula 1-1] 【Chemistry 2】 [Chemical formula 1-2] 【Transformation 3】 [Chemical formula 1-3] 【Chemistry 4】 [Chemical formula 1-4] 【Transformation 5】 [Chemical formula 1-5] 【Transformation 6】 In the above chemical formulas 1-1 to 1-5, X １ and X ２ Each is independent of the others. ＊ -NR (where R is a hydrogen atom or a C1 to C10 alkyl group)-O- ＊ or ＊ -O- ＊ And, R １ and R ２ Each of these is independently a hydrogen atom, a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a combination thereof. L １０ These are single-bonded, substituted, or unsubstituted C1 to C20 alkylene groups. L １１ ~L １３ These are, independently, substituted or unsubstituted C1 to C20 alkylene groups, n1 and n2 are each independent integers between 1 and 10.

4. The compound represented by chemical formula 1 is the curable composition according to claim 1, wherein the compound represented by chemical formula 1 is one of the following chemical formulas 2 to 17. [Chemical formula 2] 【Transformation 7】 [Chemical formula 3] 【Transformation 8】 [Chemical formula 4] 【Chemistry 9】 [Chemical formula 5] 【Chemistry 10】 [Chemical formula 6] 【Chemistry 11】 [Chemical formula 7] 【Chemistry 12】 [Chemical formula 8] 【Chemistry 13】 [Chemical formula 9] 【Chemistry 14】 [Chemical formula 10] 【Chemistry 15】 [Chemical formula 11] 【Chemistry 16】 (In the above chemical formula 11, R ｘ teeth, 【change】 (That is the case.) [Chemical formula 12] 【Chemistry 17】 [Chemical formula 13] [Chemistry 18] [Chemical formula 14] 【Chemistry 19】 [Chemical formula 15] 【Chemistry 20】 [Chemical formula 16] 【Chemistry 21】 [Chemical formula 17] 【Chemistry 22】

5. The curable composition according to claim 1, wherein the quantum dot is further surface-modified as a compound shown in the following chemical formula 18: [Chemical formula 18] 【Chemistry 23】 In the aforementioned chemical formula 18, X ３ is a hydroxyl group or ＊ -NR (where R is a hydrogen atom or a C1 to C10 alkyl group)-OH, Y １１ teeth, ＊ -O- ＊ , ＊ -S- ＊ or ＊ -C(=O)NH- ＊ And, R ３ This includes a hydrogen atom, a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a combination thereof. L ３１ ~L ３４ Each of these consists of a single bond and an ester group ( ＊ -C(=O)O- ＊ or ＊ -OC (=O)- ＊ ), ＊ - (L ９ -O) ｎ - ＊ (L ９ (where n is a C1 to C10 alkylene group, and n is an integer from 1 to 20) or a substituted or unsubstituted C1 to C20 alkylene group.

6. The compound represented by chemical formula 18 is represented by any one of the following chemical formulas 18-1 to 18-5, the curable composition according to claim 5: [Chemical formula 18-1] 【Chemistry 24】 [Chemical formula 18-2] 【Chemistry 25】 [Chemical formula 18-3] 【Chemistry 26】 [Chemical formula 18-4] 【Chemistry 27】 [Chemical formula 18-5] 【Chemistry 28】 In the above chemical formulas 18-1 to 18-5, X ３ is a hydroxyl group or ＊ -NR (where R is a hydrogen atom or a C1 to C10 alkyl group)-OH, R ３ This includes a hydrogen atom, a hydroxyl group, a carboxyl group, a substituted or unsubstituted C1 to C20 alkoxy group, a substituted or unsubstituted C1 to C20 alkyl group, a substituted or unsubstituted C3 to C20 cycloalkyl group, a substituted or unsubstituted C6 to C20 aryl group, or a combination thereof. L １０ These are single-bonded, substituted, or unsubstituted C1 to C20 alkylene groups. L １１ ~L １３ These are, independently, substituted or unsubstituted C1 to C20 alkylene groups, n1 and n2 are each independent integers between 1 and 10.

7. The compound represented by chemical formula 18 is represented by any one of the following chemical formulas 19 to 34, the curable composition according to claim 5. [Chemical formula 19] 【Chemistry 29】 [Chemical formula 20] 【Transformation 30】 [Chemical formula 21] 【Chemistry 31】 [Chemical formula 22] 【Chemistry 32】 [Chemical formula 23] 【Transformation 33】 [Chemical formula 24] 【Transformation 34】 [Chemical formula 25] 【Chemistry 35】 [Chemical formula 26] 【Transformation 36】 [Chemical formula 27] 【Chemistry 37】 [Chemical formula 28] 【Transformation 38】 [Chemical formula 29] 【Chemistry 39】 [Chemical formula 30] 【Chemistry 40】 [Chemical formula 31] 【Chemistry 41】 [Chemical formula 32] 【Chemistry 42】 [Chemical formula 33] 【Chemistry 43】 [Chemical formula 34] 【Chemistry 44】

8. The curable composition according to claim 1, wherein the curable composition is a solvent-free curable composition.

9. The solvent-free curable composition is, in relation to the total amount of the solvent-free curable composition, The quantum dots 5% to 60% by weight; and, 40% to 95% by weight of the polymerizable compound A solvent-free curable composition according to claim 8, comprising:

10. The curable composition according to claim 1, further comprising a polymerization initiator, a light diffusing agent, a polymerization inhibitor, or a combination thereof.

11. The curable composition according to claim 10, wherein the light diffusing agent comprises barium sulfate, calcium carbonate, titanium dioxide, zirconia, or a combination thereof.

12. The curable composition according to claim 1, further comprising malonic acid, 3-amino-1,2-propanediol, a silane coupling agent, a leveling agent, a fluorine-based surfactant, or a combination thereof.

13. The curable composition according to claim 1, further comprising a solvent.

14. The curable composition, relative to the total weight of the curable composition, The aforementioned quantum dots: 1% to 40% by weight; The polymerizable compound in an amount of 1% to 20% by weight; and, The aforementioned solvent 40% to 80% by weight The curable composition according to claim 13, comprising:

15. A cured film produced using the curable composition described in any one of claims 1 to 14.

16. A display device comprising the cured film of claim 15.

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