Liquid-cooled, compact form factor, detachable optical module

Abstract

A detachable optical module includes a body, a cold plate coupled to the body, and a pair of quick disconnects for cooling fluid supply and return lines coupled to the cold plate and extending from the cold plate and the body. Optionally, the cold plate is integrated into the body. Alternatively, the cold plate is coupled adjacent to the outer surface of the body using one or more fastening mechanisms, and a thermal interface material is positioned between the cold plate and the outer surface of the body. The body and cold plate are adapted to be inserted into a host card, circuit pack, or module as a single unit, and the pair of quick disconnects for cooling fluid supply and return lines are adapted to fluidically engage with a corresponding pair of quick disconnects for cooling fluid supply and return lines coupled to a fluid supply and return manifold or plenum located on the host card, circuit pack, or module.

Description

TECHNICAL FIELD

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS This disclosure claims the benefit of priority of co-pending U.S. Patent Application No. 18 / 432,141, filed on February 5, 2024, entitled "LIQUID-COOLED SMALL FORM FACTOR PLUGGABLE OPTICAL MODULE", which claims the benefit of priority of U.S. Provisional Patent Application No. 63 / 544,516, filed on October 17, 2023, entitled "LIQUID-COOLED SMALL FORM FACTOR PLUGGABLE OPTICAL MODULE", the entire contents of both of which are hereby incorporated by reference into this specification.

[0002] The present disclosure relates generally to the fields of telecommunications and optical networks. More specifically, the present disclosure relates to a liquid-cooled small form factor pluggable optical module (POM). BACKGROUND ART

[0003] Conventionally, POMs are cooled using air-cooled riding heat sinks, where when the POM is inserted into an associated card, circuit pack, or module, it makes interfacial contact with the heat sink in a dry / sliding manner, resulting in significant thermal penalty due to dry sliding. Replacing the air-cooled riding heat sink with an externally disposed liquid-cooled riding cold plate fails to solve this dry sliding thermal penalty problem, and rather may introduce the additional problem of bulky quick disconnects.

[0004] Existing solutions have significant drawbacks. Performance degradation is due to heat loss at the dry / sliding interface, as well as the disadvantage of air cooling for high-power detachable optical modules. Bulky external quick disconnects hinder compact designs and the maintenance of minimum plug pitch, consequently limiting port density on the faceplate of cards, circuit packs, or modules. On the height-limited printed circuit boards (PCBs) of cards, circuit packs, or modules, there is often not enough space to accommodate two separate manifolds.

[0005] The background technology presented here is provided only as an illustrative environmental context and should not be interpreted as limiting in any sense. Those skilled in the art will readily understand that the principles and concepts of this disclosure are implementable without limitation in other environmental contexts. [Overview of the project]

[0006] This disclosure provides a liquid-cooled, small form factor POM that utilizes embedded quick disconnects positioned to mate with a dual-flow (i.e., two-plenum) manifold assembly placed on a PCB of a card, circuit pack, or module, minimizing the plug-to-plug pitch. Integrating liquid cooling into the POM eliminates the dry / sliding interface and the heat loss due to dry / sliding associated with a riding heatsink. Furthermore, the use of liquid cooling significantly improves cooling performance. New POMs can be provided, and existing POMs can be upgraded to integrate liquid cooling and eliminate this dry / sliding interface. The female quick-disconnect array associated with the dual-flow manifold assembly complements the minimized plug-to-plug pitch of the POM. Two manifolds or plenums combined into one manifold assembly reduce the size and cost of fluid distribution. This idea can be used in confined spaces, thereby allowing more space for other devices. Therefore, this disclosure enables thermal management of high-power POMs (e.g., QSFP-DDs) that are extremely difficult to cool by other means, increases the port density of high-power plugs on the faceplate, and enables future liquid cooling in applications with limited space. Furthermore, this disclosure enables effective liquid cooling of components located in the nose of the POM, which typically protrudes from the associated faceplate and does not come into thermal contact with the riding heatsink or cold plate with conventional cooling measures.

[0007] This disclosure provides the integration of liquid cooling into POM in a small form factor, and the integration of blind-mate liquid quick disconnects into POM, while maintaining the minimum plug pitch. This integration can be carried out in two ways: one is a method of manufacturing liquid-cooled plugs by replacing the top of the plug case with a cold plate having liquid quick disconnects (during the plug manufacturing process); the other is a method of upgrading existing plugs by attaching a cold plate with liquid quick disconnects to the top of the plug case using a thermal interface material. Thus, this disclosure makes it possible to convert existing POM into liquid-cooled POM. A female quick-disconnect array in a dual-flow manifold assembly combines multiple embedded female quick-disconnects (thereby minimizing the required spacing). A dual-flow (i.e., two-plenum) manifold assembly is provided in combination with a female quick-disconnect array, which enables parallel flow of the faceplate into liquid-cooled POM. Furthermore, tapered distribution channels may also contribute to flow control along the length of the manifold assembly.

[0008] In one embodiment, the disclosure provides a detachable optical module comprising a body, a cold plate coupled to the body, and a pair of quick disconnects for cooling fluid supply and return lines coupled to the cold plate and extending from the cold plate and the body. The cold plate extends to the nose of the body and is positioned adjacent to components located at the nose of the body. Optionally, the cold plate is integrated into the body. Alternatively, the cold plate is coupled adjacent to the outer surface of the body using one or more security mechanisms, and a thermal interface material is positioned between the cold plate and the outer surface of the body. The body and the cold plate are adapted to be inserted into a host card, circuit pack, or module as a single unit, and the pair of quick disconnects for cooling fluid supply and return lines are adapted to fluidically engage with a corresponding pair of quick disconnects for cooling fluid supply and return lines coupled to a fluid supply and return manifold or plenum located in the host card, circuit pack, or module. Optionally, the pair of quick disconnects for the cooling fluid supply and return lines coupled to the cold plate are male quick disconnects. Optionally, the corresponding pair of quick disconnects for the cooling fluid supply and return lines are female quick disconnects. Optionally, the pair of quick disconnects for the cooling fluid supply and return lines are positioned diagonally at the insertion end of the removable optical module, and each of the pair of quick disconnects for the cooling fluid supply and return lines is offset perpendicularly with respect to the transverse axis of the cold plate and / or the body. When the removable optical module is inserted into the host card, circuit pack, or module faceplate, the vertical offset minimizes the plug-to-plug pitch on the faceplate of the host card, circuit pack, or module.Alternatively, the pair of quick disconnects for the cooling fluid supply and return lines are positioned horizontally at the insertion end of the detachable optical module, and each of the pair of quick disconnects for the cooling fluid supply and return lines is positioned adjacently and in parallel along the lateral axis of the cold plate and / or the body. Optionally, each of the pair of quick disconnects for the cooling fluid supply and return lines is a separate component coupled to the cold plate and the body using one or more fastening mechanisms. Alternatively, the pair of quick disconnects for the cooling fluid supply and return lines are coupled to each other as a single component coupled to the cold plate and the body using one or more fastening mechanisms.

[0009] In another embodiment, the Disclosure provides a female quick-disconnect array assembly comprising a defining structure for a plurality of embedded female quick-disconnect outer housings and a plurality of female quick-disconnect inner valves disposed within the plurality of embedded female quick-disconnect outer housings, wherein the plurality of embedded female quick-disconnect outer housings and the plurality of female quick-disconnect inner valves form a plurality of female quick-disconnects adapted to accommodate a plurality of corresponding male quick-disconnects associated with one or more detachable optical modules. Each of the embedded female quick-disconnect outer housings is sized to accommodate a misaligned quick-disconnect and to house the sealing O-ring of the associated inner valve in contact with the rear wall of the embedded female quick-disconnect outer housing to prevent leakage. Optionally, the female quick-disconnect array assembly further includes walls coupled to the structure for securing the multiple female quick-disconnect inner valves within the multiple recessed female quick-disconnect outer housings. Optionally, the structure is fluidically coupled to cooling fluid supply and return lines via one or more plenums or manifolds. Alternatively, the structure is a manifold including a plenum coupled to the cooling fluid supply and return lines. Optionally, the pair of fluid supply and return female quick-disconnects are positioned diagonally on one face of the structure, with each of the pair of female quick-disconnects offset perpendicularly to the transverse axis of the structure. Alternatively, the pair of fluid supply and return female quick-disconnects are positioned horizontally on one face of the structure, with each of the pair of female quick-disconnects positioned adjacently and in parallel along the transverse axis of the structure. Optionally, the structure may have one or more recesses or notches defined front to back on its upper and / or lower surfaces, providing one or more air passages through the interior and periphery of the structure.

[0010] In a further embodiment, the Disclosure provides a method for providing a removable optical module, comprising the steps of: providing a removable optical module body; coupling a cold plate adjacent to the outer surface of the removable optical module body using one or more fastening mechanisms; and arranging a thermal interface material between the cold plate and the outer surface of the removable optical module body, wherein the removable optical module body and the cold plate are adapted to be inserted into a host card, circuit pack, or module as an integrated unit.

[0011] It will be readily apparent to those skilled in the art that each aspect and feature of the described embodiments may be incorporated, omitted, and / or combined as necessary in a given application, without limitation. [Brief explanation of the drawing]

[0012] This disclosure is illustrated and described with reference to various drawings, in which similar reference numerals are used to represent similar assembly components / steps of methods as appropriate.

[0013] [Figure 1] This demonstrates the elimination of the dry / sliding interface related to POM.

[0014] [Figure 2] This shows a liquid-cooled POM with diagonally positioned liquid connectors.

[0015] [Figure 3] This demonstrates how a typical POM plug can be upgraded to a liquid-cooled plug by installing a cold plate with diagonally positioned liquid connectors.

[0016] [Figure 4]In both variants of single cages and coupled cages, a liquid-cooled POM is shown that uses the entire body of each female quick disconnect (i.e., the outer housing and inner valve), which undesirably occupies a large amount of space in space-constrained applications.

[0017] [Figure 5] A manifold assembly and liquid-cooled plug having an angled arrangement of liquid connectors are shown to achieve minimum inter-plug pitch via a recessed female quick disconnect (i.e., inner valve only).

[0018] [Figure 6] A liquid-cooled plug having a parallel (i.e., horizontal) arrangement of liquid connectors for cases where the inter-plug pitch is larger is shown.

[0019] [Figure 7] A typical female quick disconnect is shown.

[0020] [Figure 8] A female quick disconnect array is shown in which the liquid connector inner valve is embedded in a single component, which may be integrated with the plenum of the dual flow manifold assembly or may be separate.

[0021] [Figure 9] The profile (i.e., recess) of the manifold assembly provided to minimize air blockage by the dual flow manifold assembly is shown.

[0022] It will be readily apparent to those skilled in the art that the respective aspects and features of the illustrated embodiments may be incorporated, omitted, and / or combined as needed in a given application without limitation. [Mode for Carrying Out the Invention]

[0023] The present disclosure provides a cooling solution to address the challenging thermal demands associated with current and future small form factor POMs (e.g., QSFP-DD). This cooling solution directly integrates liquid cooling into the POM body while desirably maintaining maximum port density on the faceplate.

[0024] As described above, a liquid-cooled riding cold plate can likewise be used in place of an air-cooled riding heat sink, and heat loss due to dry / sliding still occurs. In certain configurations that utilize an integrated cold plate assembly, the design may incorporate conventional bulky quick disconnects. These quick disconnects are typically only compatible with larger POM form factors, thus adversely affecting port density. In such designs, two separate manifolds are used for the supply line and return line to which the liquid connections are mated. Quick disconnects are usually attached to the manifold (e.g., externally threaded into the manifold) instead of being embedded in the manifold. A female quick disconnect is typically two separate components (including an inner valve and an outer housing in a typical configuration).

[0025] As shown in Figure 1, a conventional method for cooling the POM 10 is to use a riding heat sink / cold plate 12 on top of the POM 10. The interface 14 between the POM 10 and the riding heat sink / cold plate 12 is a sliding / dry contact interface, which causes significant temperature loss and degrades cooling performance. The higher the plug output, the greater the temperature loss, making thermal management of the next high-power POM extremely difficult.

[0026] To address this problem, the POM 20 of this disclosure utilizes a liquid-cooled feature 22 integrated or fixedly coupled to the body 24 of the POM 20 to eliminate a sliding / dry contact interface. This liquid-cooled feature 22 includes a coolant supply and return line 26 which, when the POM 20 is inserted into the associated card, circuit pack, or module, is coupled to an associated manifold assembly located on the PCB of the card, circuit pack, or module via a blind-mate type quick disconnect.

[0027] As shown in Figure 2, the liquid-cooled miniature form factor POM 20 of this disclosure includes a POM body 24 that accommodates conventional POM components and includes a liquid-cooled feature section 22 integrated or mounted on the upper (or lower) part. Conventional POM components are well known to those skilled in the art and will not be described in further detail for the sake of brevity. At the insertion end of the POM body 24, the POM 20 includes a drip-free blind-mate type liquid supply and return quick disconnect 28. In typical applications, due to the size associated with male and female quick disconnects, and space constraints associated with the POM and cards, circuit packs, or modules, the POM 20 typically incorporates a male quick disconnect, and the female quick disconnect is typically incorporated into the associated manifold; however, this arrangement can be reversed if permissible and desired in a particular application. Once the POM 20 is inserted into the host PCB, both electrical and liquid connections are made in a blind-mate manner. As shown in the figure, in order to minimize the plug pitch of the POM 20, the supply and return quick disconnects 28 on the POM 20 and manifold are offset diagonally, with one quick disconnect 28a positioned relatively below the transverse axis of the liquid-cooled feature section 22 and / or POM 20, and one quick disconnect 28b positioned relatively above the transverse axis of the liquid-cooled feature section 22 and / or POM 20. Thus, each quick disconnect 28 is vertically offset (one up and one down) to the desired degree. Each quick disconnect 28 is fastened to the liquid-cooled feature section 22 and / or POM body 24 (i.e., POM 20) by a screw 30 or other fastening mechanism. Optionally, it is envisioned that the quick disconnects 28 can be manufactured in pairs so that the quick disconnects 28a and 28b can be fastened simultaneously using a single screw 30 or other fastening mechanism. Furthermore, it is assumed (contemplated) that the quick disconnect 28 itself may simply have threads cut into it and be screwed into the liquid cooling feature section 22 and / or the POM body 24.Furthermore, if the plug pitch and faceplate plug density are not significant concerns, the POM20 and the supply and return quick disconnects 28 on the manifold may simply be horizontally offset, with the quick disconnects 28a and 28b positioned along the lateral axis of the liquid-cooled feature section 22 and / or POM20, and not vertically offset. This overall configuration not only utilizes the excellent thermal properties of the liquid to cool the POM20 but also eliminates the need for an external heat sink / cold plate that cannot be attached, thereby eliminating dry / sliding interfaces and further improving the thermal performance of the POM20. In addition, the horizontal arrangement of the male quick disconnects shortens the POM20, resulting in reduced airflow obstruction in applications requiring intake air to cool downstream devices.

[0028] As shown in Figure 3, the integration / mounting of the cooling feature of this disclosure can be carried out in two ways: (1) by replacing the top of the POM 20 case with the cold plate 22a described above, or (2) by mounting the cold plate 22a to the top of the POM 20 case using a thermal interface material 32 and a number of screws 34 or other fastening mechanisms. The latter option can be used on existing plugs to convert them into liquid-cooled plugs. The thermal interface material is generally preferred but not essential. For example, it may be completely eliminated if the opposing surfaces have sufficiently low flatness and roughness. The former option leads to a new plug, i.e., a higher plug featuring an integrated liquid connector. The latter option can be carried out on existing plugs, i.e., by mounting the cold plate 22a to a common plug, it can be air-cooled in an air-cooled system and / or liquid-cooled in a liquid-cooled system. This option may require the development of a new plug standard that specifies the location of the mounting points on the plug body 24 for mounting the cold plate 22a.

[0029] As shown in Figure 3, in order to facilitate heat transfer between the POM 20 and the liquid-cooled feature section 22, the cold plate 22a and quick disconnect 28 constituting the liquid-cooled feature section 22 are fixed to the top of the case of the body 24 of the POM 20 (which may otherwise be an air-cooled or liquid-cooled POM) via a number of screws 34 or other fastening mechanisms, and the thermal interface material 32 is placed between the liquid-cooled feature section 22 and the body 24 of the POM 20. The key point of integrating or attaching the liquid-cooled feature section 22 to the POM 20 is that the cold plate 22a no longer slides against the POM 20 as the POM is inserted into or removed from the associated card, circuit pack, or module, thereby eliminating the existence of a dry / sliding interface between the cold plate 22a and the POM 20. Essentially, the cold plate 22a does not movably contact the POM 20, is part of the POM 20, is inserted / removed together with the POM 20, and supply and return connections are made via the engagement / disengagement of a quick disconnect 28 at the rear of the POM 20. One of the advantages of providing a liquid-cooled POM is its ability to effectively cool the nose of the plug, which is located outside the associated faceplate and does not have thermal contact with the riding heatsink / cold plate in conventional cooling measures. Thus, the cold plate 22a of this disclosure optionally extends to the nose of the POM 20 and is positioned partially adjacent to the components within the nose of the POM 20.

[0030] As shown in Figure 4, when the liquid-cooled POM 20 is inserted into the host card 40, the plugged liquid connector 42 is mated to the coolant line 44 on the host card 40 for the supply and return of coolant. Variations of both a single cage accommodating one POM 20 and a linked cage (accommodating multiple POM 20s) are shown. To achieve a seamless blind-mate liquid connection, the coolant line 44 on the host card 40 is typically equipped with a female blind-mate liquid connector 42b that allows for a radial misalignment between the male connector 42a (on the POM 20) and the female connector 42b (on the host card 40) of up to, for example, ±0.75 mm.

[0031] The coolant line 44 on the host card 40 consists of two manifolds or plenums 46, a supply path for delivering fresh coolant to the POM cold plate 22a, and a return path for collecting hot coolant from the POM cold plate 22a. If there is sufficient space / height on the host card 40, the supply path and return path may be two separate manifolds 46. Alternatively, the two plenums 46 can be combined into a single structure to save board space / height and evenly distribute the parallel cooling channels. Furthermore, the structure holding the connector 42 may be the same as the manifold or plenum 46, formed integrally with the manifold or plenum 46, or it may be separate from the manifold or plenum 46 and fluidically coupled to the manifold or plenum 46.

[0032] Maintaining the minimum plug-to-plug pitch of QSFP-DD is a point of interest in this disclosure. The objective is to maintain the width of the QSFP-DD module and achieve maximum port density on the panel.

[0033] As shown in Figure 5, in order to maintain a smaller pitch (e.g., 22.5 mm) for the QSFP-DD module (i.e., the smallest pitch possible in a single QSFP-DD cage), the liquid connector 42 is positioned obliquely on both the plug 20 (i.e., male connector 42a) and the manifold 46 (i.e., female connector 42b). This oblique mounting of the quick disconnect provides the smallest plug pitch for a given liquid connector diameter, but requires greater height, so the POM 20 and manifold 46 are taller within the space allowed on the host card / host PCB 40. Figure 5 also shows the faceplate 48 of the host card / PCB 40.

[0034] As shown in Figure 6, to reduce the required height (i.e., shorten the POM 20 and manifold 46), the liquid connectors 42 may be arranged horizontally (i.e., in parallel), which requires a wider spacing between the QSFP-DD ports. A larger plug pitch (e.g., >24.7 mm) makes it possible to arrange the liquid connectors 42 in parallel, minimizing the required height. As shown, the male liquid connectors 42a can be mounted to the POM cold plate 22a and POM 20 using a single common mounting point with overlapping flanges 50, i.e., two male liquid connectors 42a are mounted in the center by a single common screw 52. This allows the male liquid connectors 42a to be mounted on the same horizontal plane. If necessary and space allows, separate flanges 50 and screw 52 can also be used for separate connectors 42a.

[0035] As shown in Figure 7, female liquid connectors 42b can be relatively bulky, especially when designed to accommodate large misalignment tolerances. Therefore, it is difficult to achieve a compact design for a single row of QSFP-DDs while maintaining the minimum plug-to-plug pitch. A typical female blind-mate connector 42b consists of two main parts: an inner valve 54a and an outer housing 54b. The outer housing 54b restricts the inner valve 54a, providing sufficient space for the inner valve 54a to meet misalignment requirements, and presses the inner valve's O-ring 54c against the rear wall to seal the component and prevent leakage.

[0036] As shown in Figure 8, in order to achieve a compact design and maximize port density (i.e., minimize the plug pitch), the Disclosure combines the outer housings 54b of multiple connectors 42b into a single structure 56 into which the inner valves 54a are embedded. This structure 56 may be the same as the manifold 46, or it may be separate from the manifold 46 but fluidly coupled to it. Thus, the female quick-disconnect array assembly is formed by the structure 56 into which the outer housings 54b are incorporated and embedded. Alternatively, this female quick-disconnect array may be a separate component or may be mounted on the supply and return manifold / plenum 46. Alternatively, it may be machined into the supply and return manifold / plenum 46. This method eliminates the need for the bulky outer housings 54b of the female fluid connectors 42b, and since these features are incorporated and embedded in the structure 56 or manifold 46, a more compact design is possible. The diameter of the hole 56a of the female quick-disconnect array is the same as the inner diameter of the female connector outer housing 54b and is a function of a specified misalignment tolerance. The bottom of the hole 56b is where the O-ring 54c of the inner valve is pressed to seal the flow of coolant. A front panel 58 is attached to the body of the structure 56 to hold the inner valve 54a within the hole 56a and press it against the rear wall. Alternatively, a rear panel can be used to confine the inner valve 54a to the female quick-disconnect array. The components of the female quick-disconnect array (i.e., the body and the front / rear panels) must be attached to each other after the inner valve and O-ring 54c have been assembled. The panel components can be attached by various means, including brazing / soldering, or by screws. If brazing / soldering is used, the material of the O-ring must be suitable for the relevant processing temperature.

[0037] Because the female quick-disconnect array 56 and manifold 46 (alone or in combination) are bulky components, they can block airflow over the remaining air-cooled components on the host PCB / card 40, for example, in a hybrid liquid / air-cooled system. To address this, unnecessary areas of the female quick-disconnect array 56 and manifold 46 (alone or in combination) may be cut out or recessed to allow more airflow to pass through the female quick-disconnect array 56 and manifold 46 (alone or in combination). This is shown in Figure 9, where, in the bulk material of the female quick-disconnect array 56 and manifold 46 (alone or in combination), semicircular or arc-shaped notches 60 are placed front to back between each hole 56a, although other shapes and orientations can be used as well. This provides airflow channels through the interior and periphery of the female quick-disconnect array 56 and manifold 46 (alone or in combination).

[0038] Accordingly, this disclosure provides a liquid-cooled, small form factor POM that utilizes quick disconnects arranged to mate with a dual-flow (i.e., two-plenum) manifold assembly placed on the PCB of a card, circuit pack, or module, minimizing the plug-to-plug pitch. Integrating liquid cooling into the POM eliminates the dry / sliding interface and the heat loss due to dry / sliding associated with a riding heatsink. Furthermore, the use of liquid cooling significantly improves cooling performance, and the cold plate used extends to components within the nose of the POM and is typically located outside the associated faceplate after insertion. New POMs can be provided, and existing POMs can be upgraded to integrate liquid cooling and eliminate this dry / sliding interface. The female quick-disconnect array associated with the dual-flow manifold assembly complements the minimized plug-to-plug pitch of the POM. Two manifolds or plenums combined into one manifold assembly reduce the size and cost of fluid distribution. This idea can be used in confined spaces, thereby allowing more space for other devices. Therefore, this disclosure enables thermal management of high-power POMs (e.g., QSFP-DDs) that are extremely difficult to cool by other means, increases the port density of high-power plugs on the panel, and enables future liquid cooling in applications with limited space.

[0039] This disclosure provides the integration of liquid cooling into POM in a small form factor, and the integration of blind-mate liquid quick disconnects into POM, while maintaining a minimum plug pitch. This integration can be achieved in two ways: one is to manufacture liquid-cooled plugs by replacing the top of the plug case with a cold plate having liquid quick disconnects (during the plug manufacturing process); the other is to upgrade existing plugs by attaching a cold plate with liquid quick disconnects to the top of the plug case using a thermal interface material. Thus, this disclosure makes it possible to convert existing POM into liquid-cooled POM. A female quick-disconnect array in a dual-flow manifold assembly combines multiple female quick-disconnects (thereby minimizing the required spacing). A dual-flow (i.e., two-plenum) manifold assembly is provided in combination with a female quick-disconnect array, which enables parallel flow of the faceplate into the liquid-cooled POM. Additionally, tapered distribution channels may contribute to flow control along the length of the manifold assembly.

[0040] While this disclosure is described and written with reference to preferred embodiments and specific examples thereof, it will be readily apparent to those skilled in the art that other embodiments and examples may perform similar functions and / or achieve similar results. All such equivalent embodiments and examples are in the spirit and scope of this disclosure, contemplated thereby, and are intended to be covered by the following non-limiting claims for all purposes.

Claims

1. The main body (24) and A cold plate (22) is connected to the main body (24), A detachable optical module (20) comprising a pair of quick disconnects (28) for cooling fluid supply and return lines, coupled to the cold plate (22) and the body (24).

2. The detachable optical module according to claim 1, wherein the cold plate extends to the nose of the main body and is positioned adjacent to a component located on the nose of the main body.

3. The aforementioned cold plate is It will be integrated into the aforementioned main body, or A detachable optical module according to claim 1, wherein one or more fixing mechanisms (24) are used to bond adjacent to the outer surface of the main body, and a thermal interface material (32) is disposed between the cold plate and the outer surface of the main body.

4. The removable optical module according to claim 1, wherein the body and the cold plate are adapted to be inserted into a host card, circuit pack, or module (40) as an integrated unit, and the pair of quick disconnects for cooling fluid supply and return lines are adapted to fluidly engage with a corresponding pair of quick disconnects for cooling fluid supply and return lines coupled to a fluid supply and return manifold or plenum (46) located on the host card, circuit pack, or module.

5. The pair of quick disconnects for the cooling fluid supply and return lines, which are coupled to the cold plate, It is a male quick disconnect, or A detachable optical module according to claim 4, which is a female type quick disconnect.

6. The removable optical module according to claim 1, wherein the pair of quick disconnects for the cooling fluid supply and return lines are positioned obliquely at the insertion end of the removable optical module, and each of the pair of quick disconnects for the cooling fluid supply and return lines is offset perpendicularly with respect to the lateral axis of the cold plate and / or the body.

7. The removable optical module according to claim 1, wherein when the removable optical module is inserted into the faceplate (48) of the host card, circuit pack, or module, the vertical offset minimizes the plug-to-plug pitch on the faceplate of the host card, circuit pack, or module.

8. The removable optical module according to claim 1, wherein the pair of quick disconnects for the cooling fluid supply and return lines are arranged horizontally at the insertion end of the removable optical module, and each of the pair of quick disconnects for the cooling fluid supply and return lines is arranged adjacently and in parallel along the transverse axis of the cold plate and / or the body.

9. Each of the pair of quick disconnects for the cooling fluid supply and return lines is a separate component connected to the cold plate and the body using one or more fixing mechanisms (30), or The detachable optical module according to claim 1, wherein the pair of quick disconnects for the cooling fluid supply and return lines are coupled to each other as a single component that is coupled to the cold plate and the body using one or more fixing mechanisms (52).

10. A structure defining multiple embedded female quick-disconnect outer housings (54b), The set includes a plurality of female quick-disconnect inner valves (54a) arranged within the plurality of embedded female quick-disconnect outer housings (54b), A female quick-disconnect array assembly (56) is formed by the plurality of embedded female quick-disconnect outer housings (54b) and the plurality of female quick-disconnect inner valves (54a) forming a plurality of female quick-disconnects (42b) adapted to accommodate a plurality of corresponding male quick-disconnects (42a) associated with one or more detachable optical modules (20).

11. The female quick-disconnect array assembly according to claim 10, wherein each of the recessed female quick-disconnect outer housings has dimensions to accommodate misaligned quick-disconnects by providing a certain tolerance for housing the associated inner valve within the outer housing.

12. The female quick-disconnect array assembly according to claim 10, wherein each of the recessed female quick-disconnect outer housings accommodates a sealing O-ring (56c) of the associated inner valve in contact with the rear wall (56b) of the recessed female quick-disconnect outer housing to prevent leakage.

13. The female quick-disconnect array assembly according to claim 10, further comprising a wall (58) coupled to the structure for securing the plurality of female quick-disconnect inner valves within the plurality of embedded female quick-disconnect outer housings.

14. The structure is fluidly coupled to cooling fluid supply and return lines via one or more plenums or manifolds (46), or The female quick-disconnect array assembly according to claim 10, wherein the structure is a manifold including a plenum (46) coupled to a cooling fluid supply and return line.

15. The pair of female quick disconnectors for fluid supply and return are, The pair of female quick disconnects are arranged diagonally on one surface of the structure, and each of them is offset perpendicularly to the horizontal axis of the structure, or The female quick-disconnect array assembly according to claim 10, wherein each of the pair of female quick-disconnects is arranged horizontally on one surface of the structure, and adjacent to each other in parallel along the horizontal axis of the structure.

16. The female quick-disconnect array assembly according to claim 10, wherein the structure has one or more recesses or notches (60) defined front to back on the upper and / or lower surfaces of the structure, and provides one or more air passages passing through the interior and periphery of the structure.

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