System and method for two-phase immersion cooling

Abstract

An immersion cooling system comprising an apparatus containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene, and an electronic device, wherein the materials used in the apparatus and the electronic device are made of materials compatible with the heat transfer fluid. A method for cooling an electronic device using the immersion cooling system is also provided.

Description

Technical Field

[0001] The present disclosure relates to systems and methods for two-phase immersion cooling, including systems and methods that comprise materials suitable for use in such systems and methods.

Background Art

[0002] Two-phase immersion cooling (2PIC) is one of the emerging technologies for thermal management of high heat density IT equipment and power electronics. In these systems, the electronic components of the IT equipment and power electronics are in direct contact with the heat transfer fluid, therefore the material compatibility and thermal stability of the components in contact with the heat transfer fluid are critical. Particularly in 2PIC for servers, hardware reliability directly correlates with (1) the compatibility between the fluid and information technology (IT) components or power electronics, and (2) the thermal stability of the fluid in the presence of metals present in the system.

[0003] Reactions of the heat transfer fluid in 2PIC systems may cause degradation of materials used in the functional components of such systems. Degradation may generate impurities within the system, and / or reduce the durability and / or reliability of such functional components, and / or result in contamination of the fluid by the impurities as the impurities degrade.

[0004] Material compatibility in 2PIC can be subdivided into two groups: (1) primary compatibility, which arises from direct interactions between materials and the fluid that cause changes in material properties and fluid contamination, and (2) secondary or material-to-material compatibility, where the fluid acts as a vector that transports material extracted from one component to another. Certain materials are incompatible with heat transfer fluids used in 2PIC systems, which means that in the presence of the heat transfer fluid, or in the presence of the heat transfer fluid with moisture and / or air, the materials interact with the fluid in a manner that is detrimental to system performance.

[0005] In addition, some heat transfer fluids have a high global warming potential (GWP). New environmental regulations have led the industry to seek heat transfer fluids with low GWPs. [Overview of the project] [Problems that the invention aims to solve]

[0006] Therefore, a 2PIC system in which the heat transfer fluid is compatible with the materials in the system, as well as a method for cooling the electronic devices within the 2PIC system, is desired. [Means for solving the problem]

[0007] The present invention relates to a 2PIC system, in which the heat transfer fluid and material are adapted to improve the performance of the 2PIC system for cooling electronic devices immersed in the 2PIC system.

[0008] In a first embodiment of the present invention, an immersion cooling system is provided, (i) a device comprising: a housing that defines an internal cavity and has a main fluid tank positioned therein containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a fluid surface extending across the tank; a vapor space above the fluid surface in the internal cavity of the housing; a condensing coil positioned in the vapor space above the main fluid tank; and a buffer fluid tank connected to the main fluid tank and in liquid communication with the main fluid tank, wherein the fluid in the buffer fluid tank flows through a circulation pump to a check valve and check An immersion cooling system is provided, comprising: (ii) an electronic device located in the fluid of a main fluid tank and at least partially immersed in the fluid, wherein the materials used for the tank, the circulation pump, the check valve, the filter, the piping, the lid, and the electronic device are made of materials compatible with the heat transfer fluid.

[0009] In another embodiment, a method for cooling an electronic device is provided. This method comprises immersing the electronic device at least partially in a heat transfer fluid in an immersion cooling system and transferring heat from the electronic device by circulating the heat transfer fluid through the system, wherein the immersion cooling system is (i) a device comprising: a housing that defines an internal cavity and has a main fluid tank positioned within it containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a fluid level extending across the tank; a vapor space above the fluid level in the internal cavity of the housing; a condensing coil positioned within the vapor space above the main fluid tank; and a buffer flow connected to the main fluid tank and in liquid communication with the main fluid tank. (ii) an electronic device located in the fluid of the main fluid tank and at least partially immersed in the fluid, wherein the materials used for the tank, the circulation pump, the check valve, the filter, the seals located inside and outside the housing, and the electronic device are made of materials compatible with the heat transfer fluid.

[0010] Other features and advantages of the present invention will become apparent from the following more detailed description, which is made in conjunction with the accompanying drawings illustrating the principles of the present invention as an example. [Brief explanation of the drawing]

[0011] [Figure 1] This is a perspective view of an immersion cooling device according to one embodiment of the system and method of the present invention. [Figure 2] This is a perspective view of an electronic device. [Modes for carrying out the invention]

[0012] Large-scale computer server systems perform significant workloads and can generate a large amount of heat during operation. The majority of this heat originates from its operation. Partly due to the amount of heat generated, these systems are typically mounted in a stacked configuration with large internal cooling fans and heat dissipation fins. As the size and density of these systems increase, the thermal challenges become even greater, eventually exceeding the capacity of forced air systems.

[0013] Two-phase immersion cooling is a novel cooling technology for the high-performance cooling market, such as for applications in high-performance server systems. This cooling technology relies on the heat absorbed in the process of vaporizing a heat transfer fluid into a gas.

[0014] Certain heat transfer fluids used in immersion cooling have been found to interact with materials used in components of the immersion cooling system, including housings, pumps, seals, and tubing used to circulate the heat transfer fluid, as well as materials used in components of the immersion cell and electronic devices cooled within the cell (e.g., computer servers, batteries, or power electronics devices), which can result in the components losing their effectiveness. For example, the fluid may react with the material by extracting substances from it and contaminating the fluid, and / or by causing a degradation of the material's physical properties, which can lead to a loss of functionality and thus affect the reliability and performance of the system. Therefore, the selection of materials used in both the immersion cell and the electronic devices is crucial.

[0015] The present invention has been made in view of the above, and aims to improve the performance of an immersion cooling system by providing a system comprising components made of specific materials. The performance of the system is improved by the selection of materials.

[0016] In a first embodiment of the present invention, an immersion cooling system is provided, (i) a device comprising: a housing that defines an internal cavity and has a main fluid tank positioned therein containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a fluid surface extending across the tank; a vapor space above the fluid surface in the internal cavity of the housing; a condensing coil positioned in the vapor space above the main fluid tank; and a buffer fluid tank connected to the main fluid tank and in liquid communication with the main fluid tank, wherein the fluid in the buffer fluid tank flows through a circulation pump to a check valve and check An immersion cooling system is provided, comprising: (ii) an electronic device located in the fluid of a main fluid tank and at least partially immersed in the fluid, wherein the materials used for the tank, the circulation pump, the check valve, the filter, the piping, the lid, and the electronic device are made of materials compatible with the heat transfer fluid.

[0017] In another embodiment of the present invention, a method for cooling an electronic device, the method comprising: at least partially immersing a heat-generating electronic device in a heat transfer fluid in an immersion cooling system; and transferring heat generated from the electronic device by circulating the heat transfer fluid through the system, wherein the immersion cooling system is (i) a device comprising: a housing that defines an internal cavity and has a main fluid tank positioned within it containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a liquid surface of the fluid extending across the tank; a vapor space above the liquid surface in the internal cavity of the housing; a condensing coil positioned within the vapor space above the main fluid tank; and connected to the main fluid tank, A device is provided comprising: (ii) a buffer fluid tank in liquid communication with a fluid tank, the buffer fluid tank having a circulating pump through which fluid flows to a check valve and a circulating pump having a circulating pump located within the buffer fluid tank, the filter having a filter located downstream of the buffer fluid tank through which fluid flows from the check valve, the circulating pump, the check valve and the filter being connected by piping, and a lid covering an opening in the housing; and (ii) an electronic device located in the fluid of a main fluid tank and at least partially immersed in the fluid, wherein the materials used for the tank, the circulating pump and check valve, the filter, the piping, the lid and the seals located inside and outside the housing and the electronic device are made of materials compatible with the heat transfer fluid.

[0018] In this embodiment, the buffer fluid tank, filter, circulation pump, and associated piping are located within the internal cavity of the housing. In an alternative embodiment, the buffer fluid tank, filter, circulation pump, and associated piping are located outside the housing, while being connected to the main fluid tank and in liquid communication with the main fluid tank.

[0019] In the immersion cooling systems and methods disclosed herein, the materials used in the apparatus (tanks, barriers, circulation pumps, check valves, filters, piping, lids, and seals located inside and outside the housing), as well as the electronic devices, are made of materials compatible with the heat transfer fluid.

[0020] As used herein, "heat-transfer fluid compatible" materials mean that the performance of the material and / or electronic device will not change over a period of at least one year, at least two years, or at least five years. Performance indicators include no change in the temperature of the electronic device, no signal loss in communication cables / connectors, no swelling of seals, no voltage drop, no increase in the acidity of the heat-transfer fluid, no significant increase in non-volatile residues, no loss of system function, and no loss of functionality of components. Examples of loss of functionality include, but are not limited to, failure of circulation pumps, loss of seals in lids and resulting fluid loss due to evaporation, damage to plastic tubing and cable / wire insulation, and increased signal intensity attenuation.

[0021] In one embodiment, "compatible with the heat transfer fluid" can be determined by measuring the weight change of the material over a period of time. More specifically, in an accelerated test (according to the test protocol described in the examples), there is a change of less than 20% of the material's weight, or less than 15% of the material's weight, or less than 10% of the material's weight, or less than 5% of the material's weight. "Weight change" includes both an increase in weight (positive weight change) and a decrease in weight (negative weight change).

[0022] The circulation pump, check valve, and filter are provided with sealing components made of an elastomeric material or a fluoroelastomeric material that is compatible with the heat transfer fluid. Such materials are selected from the group consisting of neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosilicone, nitrile rubber, natural rubber, silicone rubber, ethyl vinyl acetate, butyl rubber, and fluoropolymer elastomers (including but not limited to Viton (registered trademark) and FKM fluoroelastomers).

[0023] The piping can be made of a metal-based material or a polymeric material that is compatible with the heat transfer fluid. The polymeric material can be selected from the group consisting of nylon resin, polyamide-imide resin, polytetrafluoroethylene (PTFE), High Density Poly Ethylene (HDPE), polyurethane, polypropylene, polyphenylene Ether (PPE), polyvinyl chloride (PVC), silicone, polystyrene, and polyester (including but not limited to polyethylene terephthalate (PET)). The metal-based material may include one or more of aluminum, copper, carbon steel, galvanized steel, stainless steel, indium, silver, and tin.

[0024] In the present invention, the immersion cooling system and method are also compatible with metals used in electronic devices, and / or metals used for system components (pumps, filters, check valves) located within the housing. The metal component can be selected from one or more of aluminum, copper, carbon steel, galvanized steel, stainless steel, indium, silver, and tin.

[0025] The electronic device may be selected from the group consisting of, or comprising: large-capacity energy storage devices, data center servers, insulated-gate bipolar transistor (IGBT) devices, telecommunications infrastructure, military electronic equipment, televisions (TV), mobile phones, monitors, drones, automotive batteries, electric powertrains (including but not limited to electric vehicles (EV)), power electronics, avionics devices, power devices, and displays. In one embodiment, the electronic device is a large-capacity energy storage device. In one embodiment, the electronic device is one or more data centers or computer servers. In one embodiment, the electronic device is an insulated-gate bipolar transistor (IGBT) device.

[0026] In one embodiment, the electronic device comprises telecommunications infrastructure. In one embodiment, the electronic device comprises military electronic equipment. In one embodiment, the electronic device comprises a television. In one embodiment, the electronic device comprises a mobile phone. In one embodiment, the electronic device comprises a monitor. In one embodiment, the electronic device comprises a drone. In one embodiment, the electronic device comprises an automotive battery. In one embodiment, the electronic device comprises an electric powertrain. In one embodiment, the electronic device comprises an electric powertrain for an electric vehicle. In one embodiment, the electronic device comprises power electronics. In one embodiment, the electronic device comprises an avionics device. In one embodiment, the electronic device comprises a power device. In one embodiment, the electronic device comprises a display.

[0027] Description of the Drawings Figure 1 is a perspective view of one embodiment of the immersion cooling device of the present invention. The immersion cooling system comprises a housing that defines an internal cavity. The housing may be made of stainless steel or galvanized steel, or aluminum, or plastic, or composite material, or natural material, or wood or wood product, or ceramic.

[0028] The top of the housing has an opening (not shown) which is covered by a lid during system operation. The lid is attached to the housing via an O-ring seal. The O-ring reinforces the lid's barrier between the fluid inside the housing and the atmosphere. The O-ring is made from neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosilicone, nitrile rubber, natural rubber, silicone rubber, ethyl vinyl acetate, butyl rubber, and fluoropolymer elastomers (including, but not limited to, Viton® and FKM fluoroelastomers).

[0029] Alternatively, the buffer tank, filter, circulation pump, and plastic tubing may be located outside the main tank housing, but still connected to the main fluid tank and in liquid communication with it.

[0030] The cover, when removed, further allows access to the components of the immersion cooling system within the housing. The condition of the heat transfer fluid, pumps, valves, and circulation pumps, as well as the electronic devices, can be periodically monitored for their condition or removed for inspection as needed.

[0031] Within the housing, a main fluid tank and a buffer fluid tank are positioned, each containing a heat transfer fluid, which is E-HFO-153-10mczz. A barrier separates the main fluid tank from the buffer fluid tank. The barrier may be made of stainless steel or galvanized steel, or aluminum, or plastic, or composite material, or natural product, or wood or wood product, or ceramic. The liquid level above the barrier allows the fluid to overflow over the barrier, as indicated by the curved arrow in Figure 1. The steam space is located above the liquid level and spans the cavity area of ​​the housing across the main fluid tank and the buffer fluid tank.

[0032] Within a barrier fluid tank, a circulation pump is positioned near the lower end of the tank, and the circulation pump circulates fluid within and between the buffer fluid tank and the main fluid tank using a motor (not shown) located within the pump during the operation of an immersion cooling system, such as the method disclosed herein. An O-ring seal providing a barrier between the low-pressure and high-pressure sections of the pump is exemplified within the pump. The O-rings are made from neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosilicone, nitrile rubber, natural rubber, silicone rubber, ethyl vinyl acetate, butyl rubber, and fluoropolymer elastomers (including, but not limited to, Viton® and FKM fluoroelastomers).

[0033] The heat transfer fluid flows through the piping into a circulation pump and out of the circulation pump. In one embodiment, the piping includes a polymer material selected from the group consisting of nylon resin, polyamide-imide resin, polytetrafluoroethylene (PTFE), high-density polyethylene (HDPE), polyurethane, polypropylene, polyphenylene ether (PPE), polyvinyl chloride (PVC), silicone, polystyrene, and polyester (including, but not limited to, polyethylene terephthalate (PET)). In one embodiment, the piping includes a metallic material selected from the group consisting of aluminum, copper, carbon steel, galvanized steel, stainless steel, indium, silver, and tin.

[0034] From the circulation pump, the heat transfer fluid flows through the piping to a check valve, passes through the check valve, and then flows through the piping from the check valve to a filter located above the liquid level. An O-ring seal is located inside the check valve and provides isolation between the upstream and downstream of the valve when the check valve is in the closed position. The O-rings are made from neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosilicone, nitrile rubber, natural rubber, silicone rubber, ethyl vinyl acetate, butyl rubber, and fluoropolymer elastomers (including, but not limited to, Viton® and FKM fluoroelastomers).

[0035] From the filter, the heat transfer fluid flows through the piping into the steam space and downward towards the main fluid tank. An O-ring seal is located within the filter, providing a barrier between the internal filter chamber and the outside of the filter housing. The O-rings are made from neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosilicone, nitrile rubber, natural rubber, silicone rubber, ethyl vinyl acetate, butyl rubber, and fluoropolymer elastomers (including, but not limited to, Viton® and FKM fluoroelastomers).

[0036] Although not shown in Figure 1, the electronic device is at least partially immersed in the heat transfer fluid in the main fluid tank.

[0037] Figure 2 is a perspective view of a server board that can be a device in the system and method of the present invention.

[0038] Figure 2 shows a power supply unit (PSU), a graphics processing unit (GPU), and a central processing unit (CPU). These units are interconnected and provide data transfer through the devices. The motherboard provides connectivity to the entire server. As illustrated, the motherboard has two RAM (memory) slots, and the processing units access these slots to obtain system and program information, but are not limited to this. Cables connect system components to the PSU. Arrows indicate communication links between server components.

[0039] The materials used in the disclosed immersion cooling systems and methods must be compatible with the heat transfer fluid. Fluid-material interactions may result from: Extraction: When a fluid extracts compounds from plastics and elastomers, such as plasticizers. This can result in material shrinkage, hardening, and fluid contamination.

[0040] Absorption: When a fluid is absorbed by a material, causing weight increase, swelling, and potential softening.

[0041] The present invention provides an immersion cooling system and method that overcomes problems related to sensitive components by using a compatible combination of heat transfer fluid and material.

[0042] In one embodiment, the heat transfer fluid is an O-ring seal with a suitable fit between the lid and the housing. Poor fit between the heat transfer fluid and the O-ring of the lid can lead to fluid loss / steam leakage. Suitable materials for the O-ring seal include elastomers and fluoroelastomers. For example, EPDM and fluoroelastomers, such as those sold under the registered trademark "Viton".

[0043] In one embodiment, the heat transfer fluid is compatible with the pipe / piping material. Poor compatibility between the heat transfer fluid and the pipe / piping material can lead to cracks and fluid loss or potential circulation / filtration failures, and therefore to contamination buildup in the system. Suitable materials for the pipe / piping material include, for example, silicone and polypropylene.

[0044] In one embodiment, the heat transfer fluid is compatible with the check valve O-ring. Poor compatibility between the heat transfer fluid and the check valve O-ring can lead to check valve failure, pumping problems, and / or loss / blockage of circulation. Suitable materials for check valve O-rings include elastomers and fluoroelastomers. Examples include EPDM and fluoroelastomers such as those sold under the registered trademark "Viton," as well as nitrile rubber including beech rubber (acrylonitrile butadiene rubber or NBR).

[0045] In one embodiment, the heat transfer fluid is compatible with the pump seal. These seals may be O-rings or gaskets. Poor compatibility between the heat transfer fluid and the pump seal can lead to pump failure. Suitable materials for pump seals include elastomers and fluoroelastomers. Examples include EPDM and fluoroelastomers such as those sold under the registered trademark "Viton," as well as nitrile rubber including beech rubber (acrylonitrile butadiene rubber or NBR).

[0046] In one embodiment, the heat transfer fluid is compatible with the O-ring present in the filter. Poor compatibility between the heat transfer fluid and the filter O-ring can lead to a decrease in filtration efficiency. Suitable materials for pump seals include elastomers and fluoroelastomers. For example, EPDM and fluoroelastomers, such as those sold under the registered trademark "Viton".

[0047] When these compatibility issues between the heat transfer fluid and the materials of the immersion cooling system are compromised, a decrease in fluid purity may occur as a result, which can lead to adverse effects (e.g., degradation of dielectric properties, system stability, and the formation of deposits within the system).

[0048] When electronic devices include large-capacity energy storage devices or data center servers, they may encounter additional problems that are addressed by the immersion cooling system and method of the present invention.

[0049] In one embodiment, the electronic device includes a cable, and the heat transfer fluid is compatible with the cable within the electronic device. Poor compatibility between the heat transfer fluid and the cable can lead to fluid contamination, and further, loss of wire insulation and insulation cracking. It can also affect the dielectric properties of the cable sheath, potentially leading to reduced signal intensity and / or signal interference. These may further have other adverse effects on performance. Suitable materials for cables within electronic devices include, for example, PVC, LDPE, fluorinated ethylenepropylene copolymer (FEP), polyether ether ketone (PEEK), or low-smoke, zero-halogen materials.

[0050] In one embodiment, the electronic device includes a capacitor, and the heat transfer fluid is compatible with the capacitor material. Poor compatibility between the heat transfer fluid and the capacitor can lead to capacitor rupture and loss of functionality. Another problem is fluid contamination. Suitable materials for the capacitor include elastomers and fluoroelastomers containing EPDM.

[0051] In one embodiment, the electronic device includes a connector, and the heat transfer fluid is compatible with the connector material. The connector is necessary to maintain contact between the implementing components (e.g., GPU, motherboard). Poor compatibility between the heat transfer fluid and the connector can lead to contact damage and loss, or reduced / loosening of mating contact, and an overall loss of functionality of the electronic device. Suitable materials for capacitors include elastomers and fluoroelastomers, including polypropylene.

[0052] In one embodiment, the electronic device includes a battery seal, and the heat transfer fluid is compatible with the battery seal. Poor compatibility between the heat transfer fluid and the battery seal can lead to leakage of battery material and loss of power to the electronic device. Suitable materials for the battery include silicone, polyurethane, or PET.

[0053] Based on the foregoing, the immersion cooling systems and methods disclosed herein provide excellent performance and long-term operational stability. [Examples]

[0054] Both the materials and the heat transfer fluids used in the immersion cooling systems and methods disclosed herein were tested.

[0055] Material compatibility and thermal stability tests were performed by exposing the materials to E-HFO-153-10mczz. The following tests were conducted:

[0056] Example 1. Sealing test: Plastics and elastomers were immersed in a sealing tube at 80°C for two weeks.

[0057] The results of the sealed tube test are shown in Table 1. Me% is the mass percentage of the extract, and Ma% is the mass percentage of the absorption, calculated by the following formula: Me% = NVR (non-volatile residue). In the formula, MF f MF is the final mass of the material being tested after the fluid has evaporated. i M is the initial mass of the material being tested before the fluid evaporated. i is the initial mass of the material being tested, and Me is the mass of the material extracted by the fluid. Me% is the extractable mass%, representing the percentage of the mass of the material extracted by the fluid relative to the initial mass of the material being tested. Ma% is the absorbed mass%, representing the percentage of the mass of the fluid absorbed by the material relative to the initial mass of the material being tested. The fluid being tested is E-HFO-153-10mczz.

[0058]

number

[0059] [Table 1]

[0060] As can be seen from Table 1, E-HFO-153-10mczz is compatible with the tested material.

[0061] Example 2. Soxhlet extraction: Plastics and elastomers were exposed to fluid in a Soxhlet extractor for 48 hours.

[0062] The results of the Soxhlet extraction are shown in Table 2.

[0063] [Table 2]

[0064] As can be seen from Table 2, E-HFO-153-10mczz is compatible with the tested materials.

[0065] Example 3 Thermal stability: Metals (Al, Cu, and carbon steel) were exposed to the liquid and vapor of the heat transfer fluid for 1 week at 175°C in sealed tubes with and without air and moisture. The concentrations of fluoride ions and chloride ions were evaluated, as was the acidity. (<MDL indicates less than the method detection limit.) The test results are provided in Table 3.

[0066] [Table 3]

[0067] As can be seen from Table 3, E-HFO-153-10mczz is compatible with the tested metals.

[0068] Example 4 Soxhlet extraction and thermal stability tests were performed to make a comparison with the commercially available fluid Novec™ 649, dodecafluoro-2-methylpentan-3-one (CF3CF2C(O)CF(CF3)2).

[0069] The Soxhlet extraction test was performed in the same manner as described above in Example 2. Table 4 provides the results.

[0070] [Table 4]

[0071] As can be seen from Table 4, E-HFO-153-10mczz is a compatible tested material, and exhibits better compatibility than Novec™ 649, except with respect to tubing materials. It is noted that the compatibility of E-HFO-153-10mczz with tubing materials is still within an acceptable range.

[0072] The thermal stability test was slightly modified from Example 3, in that the metals (Al, Cu, and carbon steel) were exposed to liquid and vapor heat transfer fluids at 150°C for one week in sealed tubes containing and without air and moisture. Table 5 provides the results.

[0073] [Table 5]

[0074] As can be seen in Table 5, E-HFO-153-10mczz exhibits better compatibility with the tested metal than Novec® 649.

[0075] While the present invention has been described with reference to one or more embodiments, those skilled in the art will understand that various modifications can be made and equivalents can be used in place of elements without departing from the scope of the invention. In addition, many modifications can be made without departing from the essential scope of the invention to adapt the teachings of the invention to specific situations or materials. Thus, the present invention is not limited to the specific embodiments disclosed as the best mode intended for carrying out the invention, but is intended to include all embodiments included within the appended claims. All numerical values ​​specified in the detailed description shall be interpreted as if both exact and approximate values ​​were explicitly specified.

Claims

1. Immersion cooling system, (i) apparatus, comprising: a housing that defines an internal cavity and has a main fluid tank positioned inside containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a liquid surface of the fluid extending across the tank; a vapor space above the liquid surface in the internal cavity of the housing; a condensing coil positioned within the vapor space above the main fluid tank; and a buffer fluid tank connected to the main fluid tank and in liquid communication with the main fluid tank, wherein the fluid in the buffer fluid tank flows through a circulation pump to a check valve and through the check valve (ii) an immersion cooling system comprising: (ii) an electronic device located in the fluid of the main fluid tank and at least partially immersed in the fluid, wherein the tank, the circulation pump, the check valve, the filter, and the seals located inside and outside the housing, and the materials used for the electronic device are made of materials compatible with the heat transfer fluid.

2. The immersion cooling system according to claim 1, wherein the circulation pump, check valve, and filter are provided with sealing components made of an elastomer material or fluoroelastomer material compatible with the heat transfer fluid.

3. The immersion cooling system according to claim 2, wherein the sealing component is made of an elastomer material or fluoroelastomer material selected from the group consisting of neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosilicone, nitrile rubber, natural rubber, silicone rubber, ethyl vinyl acetate, butyl rubber, and fluoropolymer elastomers (including, but not limited to, Viton® and FKM fluoroelastomers).

4. The immersion cooling system according to any one of claims 1 to 3, wherein the piping comprises a polymer material selected from the group consisting of nylon resin, polyamide-imide resin, polytetrafluoroethylene (PTFE), high-density polyethylene (HDPE), polyurethane, polypropylene, polyphenylene ether (PPE), polyvinyl chloride (PVC), silicone, polystyrene, and polyester (including, but not limited to, polyethylene terephthalate (PET)).

5. The immersion cooling system according to claim 4, wherein the piping comprises silicone or polypropylene.

6. An immersion cooling system according to any one of claims 1 to 5, wherein the electronic devices include, or are selected from, a large-capacity energy storage device, a data center server, an insulated-gate bipolar transistor (IGBT) device, telecommunications infrastructure, military electronic equipment, televisions (TVs), mobile phones, monitors, drones, automotive batteries, electric vehicle (EV) powertrains, power electronics, avionics devices, power devices, and displays.

7. The immersion cooling system according to any one of claims 1 to 6, wherein the O-ring seal between the lid and the housing comprises an elastomer selected from EPDM and fluoroelastomers or a fluoroelastomer.

8. The immersion cooling system according to any one of claims 1 to 7, wherein the heat transfer fluid is compatible with a check valve O-ring, and the check valve O-ring comprises an elastomer or a fluoroelastomer.

9. The immersion cooling system according to claim 8, wherein the check valve O-ring comprises EPDM, fluoroelastomer, or nitrile rubber.

10. The immersion cooling system according to any one of claims 1 to 9, wherein the heat transfer fluid is compatible with the pump seal, and the seal is an O-ring or a gasket.

11. The immersion cooling system according to claim 10, wherein the seal comprises EPDM, fluoroelastomer, or nitrile rubber.

12. The immersion cooling system according to any one of claims 1 to 11, wherein the system comprises a filter having an O-ring, the heat transfer fluid is compatible with the filter O-ring, and the filter O-ring comprises an elastomer or a fluoroelastomer.

13. The immersion cooling system according to any one of claims 1 to 12, wherein the electronic device comprises a large-capacity energy storage device or a data center server.

14. The immersion cooling system according to claim 13, wherein the electronic device comprises a cable, and the heat transfer fluid is compatible with the cable within the electronic device.

15. The immersion cooling system according to claim 14, wherein the cable comprises PVC, LDPE, fluorinated ethylene propylene copolymer (FEP), polyether ether ketone (PEEK), or a low-smoke, zero-halogen material.

16. The immersion cooling system according to claim 13, wherein the electronic device comprises a capacitor, and the heat transfer fluid is compatible with the capacitor in the electronic device.

17. The immersion cooling system according to claim 16, wherein the capacitor comprises an elastomer and a fluoroelastomer.

18. The immersion cooling system according to claim 13, wherein the electronic device comprises a connector, and the heat transfer fluid is compatible with the material of the connector within the electronic device.

19. The immersion cooling system according to claim 18, wherein the connector comprises an elastomer and a fluoroelastomer.

20. The immersion cooling system according to claim 18, wherein the connector comprises polypropylene.

21. The immersion cooling system according to claim 13, wherein the electronic device comprises a battery seal, and the heat transfer fluid is compatible with the battery seal.

22. A method for cooling an electronic device, the method comprising: at least partially immersing a heat-generating electronic device in a heat transfer fluid within an immersion cooling system; and transferring heat generated from the electronic device by circulating the heat transfer fluid through the system, wherein the immersion cooling system is (i) a device comprising: a housing that defines an internal cavity and has a main fluid tank positioned within it containing a heat transfer fluid comprising E-1,1,1,2,2,5,5,6,6,6-decafluoro-3-hexene (E-HFO-153-10mczz); a liquid surface of the fluid extending across the tank; a vapor space above the liquid surface in the internal cavity of the housing; a condensing coil positioned within the vapor space above the main fluid tank; and connected to the main fluid tank and the main fluid tank A device comprising: (ii) an electronic device located in the fluid of the main fluid tank and at least partially immersed in the fluid, wherein the tank, the circulation pump, the check valve, and the electronic device are made of materials compatible with the heat transfer fluid. The device comprises: a buffer fluid tank having liquid communication, the buffer fluid tank being located in the buffer fluid tank, the fluid of which flows through a circulation pump to a check valve, and the circulation pump being located in the check valve; a filter located downstream of the buffer fluid tank, the fluid of which flows from the check valve, the circulation pump, the check valve, and the electronic device are each connected by piping; and a lid covering the opening of the housing.

23. The method according to claim 22, wherein the circulation pump, check valve, and filter are provided with sealing components made of an elastomer material or fluoroelastomer material compatible with the heat transfer fluid.

24. The method according to claim 23, wherein the sealing component is made of an elastomer material or fluoroelastomer material selected from the group consisting of neoprene rubber, epichlorohydrin butyl rubber, ethylene propylene diene monomer (EPDM), fluorosilicone, nitrile rubber, natural rubber, silicone rubber, ethyl vinyl acetate, butyl rubber, and fluoropolymer elastomers (including, but not limited to, Viton® and FKM fluoroelastomers).

25. The method according to any one of claims 22 to 24, wherein the piping comprises a polymer material selected from the group consisting of nylon resin, polyamide-imide resin, polytetrafluoroethylene (PTFE), high-density polyethylene (HDPE), polyurethane, polypropylene, polyphenylene ether (PPE), polyvinyl chloride (PVC), silicone, polystyrene, and polyester (including, but not limited to, polyethylene terephthalate (PET)).

26. The method according to claim 25, wherein the piping comprises silicone or polypropylene.

27. The method according to any one of claims 22 to 26, wherein the electronic device includes, or is selected from, a large-capacity energy storage device, a data center server, an insulated-gate bipolar transistor (IGBT) device, telecommunications infrastructure, military electronic equipment, televisions (TVs), mobile phones, monitors, drones, automotive batteries, electric powertrains, power electronics, avionics devices, power devices, and displays.

28. The method according to any one of claims 22 to 27, wherein the O-ring seal between the lid and the housing comprises an elastomer selected from EPDM and fluoroelastomers or a fluoroelastomer.

29. The method according to any one of claims 22 to 28, wherein the heat transfer fluid is compatible with a check valve O-ring, and the check valve O-ring comprises an elastomer or a fluoroelastomer.

30. The method according to claim 29, wherein the check valve O-ring comprises EPDM, fluoroelastomer, or nitrile rubber.

31. The method according to any one of claims 22 to 30, wherein the heat transfer fluid is compatible with the pump seal, and the seal is an O-ring or a gasket.

32. The method according to claim 31, wherein the seal comprises EPDM, fluoroelastomer, or nitrile rubber.

33. The method according to any one of claims 22 to 32, wherein the system comprises a filter having an O-ring, the heat transfer fluid is compatible with the filter O-ring, and the filter O-ring comprises an elastomer or a fluoroelastomer.

34. The method according to any one of claims 22 to 33, wherein the electronic device comprises a large-capacity energy storage device or a data center server.

35. The method according to claim 34, wherein the electronic device comprises a cable, and the heat transfer fluid is compatible with the cable within the electronic device.

36. The method according to claim 35, wherein the cable comprises PVC, LDPE, fluorinated ethylene propylene copolymer (FEP), polyether ether ketone (PEEK), or a low-smoke, zero-halogen material.

37. The method according to claim 34, wherein the electronic device comprises a capacitor, and the heat transfer fluid is compatible with the capacitor in the electronic device.

38. The immersion cooling system according to claim 37, wherein the capacitor comprises an elastomer and a fluoroelastomer.

39. The method according to claim 34, wherein the electronic device comprises a connector, and the heat transfer fluid is compatible with the material of the connector within the electronic device.

40. The method according to claim 39, wherein the connector comprises an elastomer and a fluoroelastomer.

41. The method according to claim 40, wherein the connector comprises polypropylene.

42. The method according to claim 34, wherein the electronic device comprises a battery seal, and the heat transfer fluid is compatible with the battery seal.

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