Ceramic-coated heat exchange drum with nozzles and non-sealing and sealing mesa sections.

Abstract

This disclosure provides a cooling drum. The cooling drum is a curved drum surface for supporting a substrate, comprising a dielectric portion, a plurality of sealing mesa portions, a plurality of non-sealing mesa portions, a curved drum surface having a plurality of grooves, and a plurality of gas inlets disposed on the plurality of sealing mesa portions and the plurality of non-sealing mesa portions.

Description

Background Art

[0001] [Field] Embodiments described herein generally relate to metal electrodes, more specifically lithium-containing anodes, high-performance electrochemical devices such as primary and secondary electrochemical devices including the aforementioned lithium-containing electrodes, and methods of manufacturing the same.

[0002] [Description of Related Art] Lithium (Li) ion batteries play a critical role in the development of current-generation mobile devices, microelectronics, and electric vehicles. A typical lithium ion battery consists of a positive electrode (cathode), a negative electrode (anode), an ion-conductive electrolyte, a porous separator membrane (electrical insulator) that physically separates and maintains both electrodes, and a package.

[0003] Processes for depositing lithium onto substrates such as large flexible substrates are temperature-sensitive and may cause the occurrence of wrinkles and other defects. The substrate may be guided onto and supported by a rotatable coating drum having a curved drum surface. While the substrate moves over the curved drum surface of the rotating drum and passes by an evaporation source, vapor may be deposited onto the substrate. The drum may be used to maintain and control the temperature of the substrate by uniformly maintaining the gap height between the substrate and the curved drum surface at high pressure to cool and pressurize the back side of the substrate. Low pressure may be used for wide, thin film substrates because machine direction wrinkles occur due to particles, film stress, or misalignment.

[0004] Accordingly, there is a need for apparatus and methods that maintain low pressure and enhance substrate cooling to improve throughput.

Summary of the Invention

[0005] This disclosure provides a cooling drum. In one embodiment, the cooling drum may comprise a dielectric portion, a plurality of sealing mesa portions, a plurality of non-sealing mesa portions, a plurality of grooves, a minimum curved drum surface for supporting a substrate, and a plurality of gas inlets disposed on the plurality of sealing mesa portions and the plurality of non-sealing mesa portions.

[0006] This disclosure provides a vapor deposition apparatus. The vapor deposition apparatus may include a cooling drum having a dielectric portion, a plurality of sealing mesa portions, a plurality of non-sealing mesa portions, and a plurality of grooves, and a minimum curved drum surface for supporting a substrate, and a plurality of gas inlets disposed on the plurality of sealing mesa portions and the plurality of non-sealing mesa portions. The vapor deposition apparatus may also include an evaporation source configured to deposit a material onto a substrate disposed on the curved surface of the cooling drum, the substrate being disposed on the curved drum surface and substantially in contact with the plurality of sealing mesa portions and the plurality of non-sealing mesa portions.

[0007] This disclosure provides a method for coating a substrate in a vacuum chamber. The method may include the step of transporting the substrate along a curved surface of a cooling drum for supporting the substrate, which has a dielectric portion, a plurality of sealing mesa portions, a plurality of non-sealing mesa portions, and a plurality of grooves. The substrate is positioned on the curved surface and is substantially in contact with the plurality of sealing mesa portions and the plurality of non-sealing mesa portions, the material is evaporated in an evaporation crucible, and the evaporated material is guided from the evaporation crucible to the substrate. [Brief explanation of the drawing]

[0008] To better understand the features of this disclosure described above, a more specific description of the disclosure, as briefly summarized above, can be given by referring to embodiments illustrated in part in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate exemplary embodiments and should not be considered limiting in scope, as other equally valid embodiments are also permissible.

[0009] [Figure 1]Figure 1 shows a perspective view of a cooling drum having a set of gas inlet and gas outlet according to an embodiment of the present disclosure.

[0010] [Figure 2] Figure 2 shows a side view of the cooling drum of Figure 1 having a set of gas inlet and gas outlet according to an embodiment of the present disclosure.

[0011] [Figure 3] Figure 3 shows a cross-sectional view of a cooling drum in a roll-to-roll (R2R) system according to an embodiment of the present disclosure.

[0012] [Figure 4] Figure 4 shows a schematic diagram of a mesa ventilation drum having a variable temperature gap according to an embodiment of the present disclosure.

[0013] [Figure 5A] Figures 5A and 5B show schematic diagrams of a portion of a cooling drum according to an embodiment of the present disclosure. [Figure 5B] (the above)

[0014] [Figure 6] Figure 6 shows a schematic diagram of a mesa vent drum having a set of gas inlet and gas outlet according to an embodiment of the present disclosure.

[0015] [Figure 7] Figure 7 shows a procedure for manufacturing a mesa vent drum having a set of gas inlet and gas outlet according to an embodiment of the present disclosure.

[0016] [Figure 8] Figure 8 shows an exemplary substrate holder pattern according to an embodiment of the present disclosure.

[0017] [Figure 9] Figure 9 shows a schematic diagram of a mesa vent drum having a set of gas inlet and gas outlet according to an embodiment of the present disclosure.

[0018] [Figure 10] FIG. 10 is a flow diagram illustrating a method for coating a substrate according to several embodiments described herein.

[0019] For ease of understanding, identical reference numerals are used wherever possible to designate identical elements that are common to the figures. It is contemplated that elements and features of one embodiment may be beneficially incorporated in other embodiments without further recitation. DETAILED DESCRIPTION

[0020] A vapor deposition system for coating a web-shaped substrate guided over a rotatable coating drum is referred to herein as a roll-to-roll (R2R) vapor deposition system. As described herein, a flexible substrate can be considered to include, among others, strips of film, foil, web, plastic material, metal, paper, or other materials. Typically, terms such as "web", "foil", "strip material", and "substrate" are used synonymously.

[0021] For example, energy storage devices such as lithium-ion batteries typically include a positive electrode (e.g., cathode) and a negative electrode (e.g., anode) separated by a polymer separator together with a liquid electrolyte. Solid-state batteries also typically include a positive electrode and a negative electrode, but replace both the polymer separator and the liquid electrolyte with an ion-conducting material. Lithium may be vapor-deposited onto a substrate by vapor depositing molten lithium or lithium vapor onto a substrate such as a graphite-coated copper foil, copper foil, or other suitable material.

[0022] In an R2R system, lithium is deposited onto a substrate as it moves between a roll unwinding system and a roll winding system. As the substrate moves between the two systems, it is temperature-controlled and mechanically supported on a rotating cooling drum. The substrate is in thermally conductive contact with the cooling drum as it passes through one or more deposition sources that deposit lithium onto the substrate. During lithium deposition, radiant heat and latent heat energy flow from the substrate, the gap between the substrate and the drum surface, and the drum shell, and are transferred to a low-temperature, controlled heat transfer fluid. The substrate is susceptible to wrinkling and tearing due to the damaging thermal load. To mitigate the effects of heat, the substrate temperature is uniformly maintained below a predetermined temperature. In one example, a gas cushion drum is used to mitigate the effects of latent heat energy present during lithium deposition. As lithium is deposited on the surface facing the deposition source, the opposite surface of the substrate is in thermally conductive contact with the low-temperature, uniform cooling drum surface via a high-temperature, uniform heat transfer gas. By dynamically supplying and discharging a gas with a high heat transfer coefficient between the drum and the substrate, the high uniform pressure within the gap is balanced, while simultaneously compensating for gas leakage from the substrate edges. The rate of lithium deposition onto the substrate is limited by the substrate cooling rate. In many cases, the gas cushion contains a cooling gas that does not react with lithium. In some embodiments, the cooling gas includes argon, helium, or a combination thereof. In some embodiments, the substrate temperature during deposition is between approximately 70°C and 90°C (e.g., 80°C), but other values ​​are also possible.

[0023] Conventional gas cushion heat exchange drums may have low heat transfer across the gap (e.g., less than approximately 150 W / m²K, although other values ​​are possible). Low and uneven heat transfer / gas pressure can lead to high web temperatures and a decrease in lithium deposition rate. A low lithium deposition rate, in turn, reduces substrate throughput. In addition, as the substrate moves along the cooling drum under high tension, it may laminate and adhere tightly, blocking the gas inlet and forming a vacuum insulated area. When the substrate moves along the cooling drum under high tension, pressure gradients and lift-offs are likely to occur in the substrate, potentially forming a gas (e.g., argon or other inert gas) insulated area. In the embodiments described herein, the substrate temperature is made uniform by maintaining a thin substrate gap (for example, from about 5 microns or more to about 100 microns or less, for example, from about 10 microns or more to about 80 microns or less) and adjusting a high gap pressure (for example, from about 200 pascals or more to about 2600 pascals or less, for example, from about 240 pascals or more to about 2400 pascals or less).

[0024] At the current level of technology, the distribution of heat transfer gases within the gap of thin substrates is related to the heating and cooling of thick wafers (e.g., over approximately 500 microns, but other values ​​are also possible). In some cases, thick wafers can be rigid. Thin (e.g., less than approximately 4 microns, but other values ​​are also possible) flexible foils and other substrates are not supported by millimeter-scale tape-cast and bead-blast patterned mesa sections designed for rigid substrates and are prone to deformation. The embodiments described herein provide micron-scale mesa section structures, mesa section-nozzle arrangements, and distributions of smooth sealing mesa sections and rough non-sealing mesa sections to control high gap pressure while maintaining a thin gap and resulting in a uniform web temperature.

[0025] In some embodiments, the R2R system maintains a gap distance between the substrate and the drum surface. Conventional solutions to mitigate damage to the substrate include mechanical measures at the drum's edges, such as placing retaining rollers around the cooling drum to physically bond the substrate to the drum and prevent expansion or melting of the substrate. These solutions can cause damage or delamination at the edges. In the embodiments described herein, a cooling structure is provided between the substrate and the drum surface to reduce damage to the substrate as it moves along the drum.

[0026] The embodiments described herein provide a substrate holder disposed on a cooling drum. The substrate holder comprises one or a combination of a gas inlet, a gas outlet, a non-sealing mesa, and / or a sealing mesa. The structure of the substrate holder facilitates optimal heating and / or cooling of the substrate during the vacuum processing process. In some embodiments, the non-sealing mesa on the substrate holder regulates the pressure in the gap between the substrate and the substrate holder by obstructing or metering heat transfer of the gas flow from the gas inlet to the outlet and along the edge of the cooling drum. The sealing mesa blocks heat transfer and gas flow, forming an isolated pressure zone that counteracts the uneven heat flux absorbed by the substrate. Combining the sealing and non-sealing mesa can facilitate the homogenization of the web temperature.

[0027] The embodiments described herein enable commercially viable lithium deposition onto foils, transfer laminate films, and anodes by adjusting the gap pressure. Maximizing heat transfer and minimizing coating non-uniformity reduces area costs and improves yield. Furthermore, minimizing the volume associated with the substrate holder mesa reduces heat transfer / gas consumption and allows the use of highly thermally conductive fluids such as helium.

[0028] Figure 1 shows a perspective view of a cooling drum 100 having a plurality of gas outlets 102 according to an embodiment of the present disclosure. The drum 100 comprises at least a plurality of gas outlets 102, a supply section 104, an oil return section 106, a drum surface 108, and a drum body 110. The gas outlets 102 are substantially arranged on the drum surface 108 of the drum body 110. The plurality of gas outlets 102 may be arranged as a plurality of parallel and collinearly oriented groups extending from the oil return section 106 side of the drum body 110 to the end of the drum body 110 opposite the oil return section 106. In one embodiment, the spacing between the individual gas outlets 102 of the plurality of gas outlets 102 is substantially uniform throughout the drum body 110. In other embodiments, the arrangement, distribution, and spacing of the gas outlets 102 of the plurality of gas outlets 102 may be non-uniform or may be any pattern selected to generate a desired gas flow adjacent to the drum body 110. The supply unit 108 is located coaxially with the oil return port 106 and the drum body 110 along the axis 112. The supply unit 104 supplies gas (not shown) to the gas outlet 102, which releases the gas along the surface 108 of the drum body 110. In some embodiments, the supply unit 104 supplies argon gas or any other suitable gaseous material. The gas supplied to the gas outlet 102 via the supply unit 104 is supplied to the area between the substrate (not shown) and the surface 108 of the drum body 110, beneath the substrate. In some embodiments, the gas outlet 102 is an argon port or a port for any other suitable fluid material. Figure 2 shows a side view of the cooling drum 100 of Figure 1.

[0029] Figure 3 shows a cross-sectional view of a cooling drum system 300 in an R2R system according to a predetermined embodiment. The cooling drum system 300 comprises at least one or more unwinding rollers 302, a cooling drum 304, a substrate 306, an energy supply unit 308, a rotation direction 310, a vacuum chamber 312, and one or more winding rollers 314. As shown in the figure, the system 300 is disposed within the vacuum chamber 312. In one embodiment, the vacuum chamber 312 is 1 × 10 -5A vacuum level greater than Torr is used, but other values ​​are also possible. One or more unwinding rollers 302 move the substrate 306 in the rotational direction 310. As the substrate 306 is transported across the surface of the cooling drum 304, it passes through and is thus exposed to the energy supply unit 308. In some embodiments, the energy supply unit 308 deposits lithium or any other suitable material onto the surface of the substrate 306. After the deposition of lithium by the energy supply unit 308, the substrate 306 moves toward the unwinding rollers 314 in the rotational direction 310. In some embodiments, the substrate 306 contacts the cooling drum 304 along a contact arc 318. In some embodiments, the substrate 306 does not contact the cooling drum 304 along a non-contact arc 316. The contact arc 318 can be between approximately 250 degrees and approximately 350 degrees, but other values ​​are also possible. For example, as shown in Figure 3, the contact arc 318 can be approximately 286 degrees. The non-contact arc 316 can be between approximately 110 degrees and approximately 10 degrees, but other values ​​are also possible. In one embodiment, as shown in Figure 3, the non-contact arc 316 can be approximately 74 degrees.

[0030] Figure 4 shows a schematic diagram of a portion of a mesa vent drum 400 having a variable temperature gap. The drum 400 comprises a cooling drum 402, a thermal interface 404, a substrate (web) 406, and an energy supply unit 408. The surface 410 of the cooling drum 402 is maintained at a constant or substantially constant temperature. The thermal interface 404 is a variable thermal interface 404 extending over the surface 410 of the cooling drum 402 between the cooling drum 402 and the substrate 406. As the substrate 406 is transported on the cooling drum 402, lithium or other suitable material (not shown) is deposited onto the substrate 406 by the energy supply unit 408. As the substrate 406 passes through the energy supply unit 408, the thermal interface 404 is positioned between the cooling drum 402 and the substrate 406. In some embodiments, the rate of lithium deposition by the energy supply unit 408 may affect the temperature of the thermal interface 404, which in turn may contribute to the deformation of the substrate 406. Rapid deposition of lithium onto substrate 406 may cause the substrate 406 to temporarily reach its maximum temperature. Slow deposition of lithium onto substrate 406 may cause the substrate 406 to reach its steady-state temperature. While not bound by theory, it has been observed that maintaining the substrate at a steady-state temperature improves lithium deposition characteristics and reduces wrinkling and deformation of the substrate, which can negatively affect the uniformity of lithium deposition.

[0031] Figure 5A shows a schematic diagram of a portion 500 of a substrate (web) 506 disposed on a cooling drum 502 according to a predetermined embodiment. In the shown embodiment, the substrate 506 extends over a portion of the drum surface 508 of the cooling drum 502. On the cooling drum 502, the drum surface 508 extends in the lateral direction 522 between the drum centerline 504 and the drum edge 510. In one embodiment, the substrate 506 extends over a portion of the drum surface 508 in the lateral direction 522 from the drum centerline 504 to the substrate edge 512. During operation, lithium may be deposited on the substrate 506 in the mechanical direction 524 in the portion of the substrate 506 corresponding to the substrate coating width 514. For example, the substrate coating width 514 may be defined by the lateral direction 522 between the inner coating edge 516 and the outer coating edge 518.

[0032] Figure 5B shows a schematic diagram of the drum surface 508 in portion 500 of Figure 5A according to a predetermined embodiment. As shown in Figure 5B, the drum surface 508 of the cooling drum 502 comprises a rough cooling surface 520 extending laterally 522 between a plurality of smooth cooling surfaces 526. The drum surface 508 also comprises a plurality of feed grooves 528 formed on the rough cooling surface 520 and extending in the machine direction 524. The rough cooling surface 520 and the plurality of smooth cooling surfaces 526 are arranged between the drum centerline 504 and the drum edge 510. In one embodiment, the width of the rough cooling surface 520 in the later direction 522 substantially coincides with the coating width 514 in Figure 5A when lithium is deposited on the substrate 506. In some embodiments, the rough cooling surface 520 is manufactured from stainless steel (SST).

[0033] In some embodiments, a gap (not shown) is formed in the cooling drum 502 between the drum surface 508 and the substrate 506 on the rough cooling surface 520. This gap is approximately 125 W / m 2 From K above approximately 225W / m 2 Up to K (for example, 150-200 W / m²) 2 It may have a heat transfer coefficient of K), but other values ​​are also possible.

[0034] Figure 6 shows a schematic diagram of a part of a mesa-ventilated cooling drum 602 according to a predetermined embodiment. The cooling drum 600 has a drum surface having a drum edge 602, a substrate edge region 604, an outer coating edge region 606, a heat transfer groove 608, a non-sealing mesa region 610, an inner coating edge region 612, a drum centerline 614, a sealing mesa region 616, a gas outlet 618, an outermost gas inlet 620, an innermost gas inlet 622, an outer edge mask zone 624, a uniform latent heat zone 626, and an inner edge mask zone 628. Similar to the cooling drum 502 discussed above in Figure 5, the cooling drum 600 extends laterally 638 from the drum edge 602 to the substrate edge 604 and then to the outer coating edge 606. The cooling drum 600 further extends laterally 638 across the heat transfer groove 608 and the non-sealing mesa region 610. The cooling drum 600 further extends from the non-sealing mesa portion 610 to the inner coating edge portion 612, and then to the drum centerline 614.

[0035] A substrate holder 640 is substantially disposed on the cooling drum 600 between the substrate edge 604 and the drum centerline 614, supporting a substrate (not shown), such as a web-like substrate. In one embodiment, the substrate holder 640 is the substrate support surface of the cooling drum 600. The substrate holder 640 includes a sealing mesa 616 disposed along the substrate edge 604. A gas outlet 618, disposed within a portion of a heat transfer groove 608 on the substrate holder 640, is disposed adjacent to the sealing mesa 616. Gas inlets 642 are also disposed on each non-sealing mesa 610. The outermost gas inlet 620 is disposed along the outer coating edge 606 in the machine direction 636. The innermost gas inlet 622 is disposed along the inner coating edge 612 in the machine direction 636. In the machine direction 636, an outer mask zone is defined between the gas outlet 618 and the outermost gas inlet 620. In the machine direction 636, a uniform latent heat zone is defined between the outermost gas inlet 620 and the innermost gas inlet 622. In the machine direction 636, an inner mask edge zone 628 is defined between the innermost gas inlet 622 and the drum centerline 614.

[0036] The heat transfer groove 608 has a width 632, w, which is optionally variable. In some embodiments, the width 632 of the heat transfer groove 608 is from about 15 micrometers or more to about 270 micrometers or less (e.g., 25 micrometers to 250 micrometers), but other values ​​are also possible. In some embodiments, the depth (not shown) of the heat transfer groove 608 is from about 5 micrometers or more to about 30 micrometers or less (e.g., 10 micrometers to 25 micrometers), but other values ​​are also possible. The non-sealing mesa portion 610 has a length 634, l, which is optionally variable. In some embodiments, the length 634 of the non-sealing mesa portion 610 is from about 200 micrometers or more to about 27,000 micrometers or less (e.g., 250 micrometers to 25,000 micrometers), but other values ​​are also possible.

[0037] The gas inlets 642, 620, and 622 have a nozzle pitch 630, m, which is optionally variable. In some embodiments, the pitch 630 of the gas inlets 642, 620, and 622 is from about 5 mm to about 25 mm (e.g., 7 micrometers to 25 micrometers), but other values ​​are also possible. Each gas inlet 642, 620, and 622 can be from about 300 micrometers to about 1700 micrometers (e.g., 500 micrometers to 1500 micrometers), but other values ​​are also possible. In some embodiments, the outer mask edge zone 624 has a Torr gap pressure from about 10 Torr to about 20 Torr (e.g., 15 Torr), but other values ​​are also possible. In some embodiments, the uniform latent heat zone 626 has a Torr gap pressure from about 10 Torr to about 20 Torr (e.g., 15 Torr), but other values ​​are also possible. In some embodiments, the inner mask edge zone 628 has a Torr gap pressure ranging from about 10 Torr or more to about 20 Torr or less (e.g., 15 Torr), but other values ​​are also possible.

[0038] In some embodiments, the cooling drum 600 includes a ceramic (e.g., laser-cuttable dielectric) substrate holder. The cooling drum 600 has a power output of approximately 150 W / m². 2 Approximately 550 W / m² from K or above 2 Up to K (for example, 200-500 W / m²) 2 A heat transfer coefficient (HTC) of KHTC is achieved, but other values ​​are also possible. The cooling drum 600 and substrate holder 640 also play a role in minimizing heat transfer gas leakage in the mechanical direction (MD). In some embodiments that can be combined with other embodiments described herein, the cooling drum 600 may have an adjustable gap pressure in the mechanical direction 636, the transverse direction 638, or both. In some embodiments, the realization of the cooling drum 600 can improve the durability of the material (e.g., lithium or any other suitable material) deposited on the surface of the substrate being transported on the cooling drum 600.

[0039] In another embodiment, an advantage of the present disclosure is that the cooling drum 600 results in an increased rate of lithium deposition onto the substrate. As discussed above, the surface of the cooling drum 600 is formed of a densely patterned, deep, regularly spaced mesa structure, in which the substrate is supported by contact between the substrate and the substrate holder, resulting in little to no damage to the substrate. Conversely, the densely patterned, deep, regularly spaced groove structure enables a substantially uniform gas flow along the grooves, optimizing heat transfer. Thus, heat transfer of the inlet gas can be optimized, and the usable surface area of ​​the substrate can be expanded.

[0040] Figure 7 illustrates a procedure 700 for manufacturing a mesa vent drum having a set of gas inlets and gas outlets according to an embodiment of the present disclosure. In step 702, a heat exchanger is manufactured. The heat exchanger may have a cylindricity in the range of, for example, about 30 micrometers or more and about 70 micrometers or less (e.g., 50 micrometers). In one embodiment, the heat exchanger may be a heat exchange drum.

[0041] In step 704, the drum is then subjected to dimensional grinding, and in step 706, the drum undergoes grit blasting and bond coating. Bond coating in step 706 can modify the surface of the drum using a suitable material such as nickel aluminide. After bond coating, in step 708, the drum undergoes metal or ceramic coating. Metal or ceramic coating may include yttrium oxide-containing materials, aluminum oxide-containing materials, aluminum nitride-containing materials, or other suitable ceramic or metallic materials. In some embodiments, the ceramic or metal coating in step 708 may be applied to the drum by thermal spraying or stainless cold spraying techniques. After the metal or ceramic coating is formed, in step 710, the drum undergoes dimensional grinding and polishing. During the dimensional grinding process, the drum is reshaped to achieve a target shape with target dimensions. Generally, the target dimensions range from approximately 50 micrometers to approximately 700 micrometers (for example, 70-100 micrometers or 250-500 micrometers), but other values ​​are also possible.

[0042] In step 712, the drum undergoes mesa definition groove formation. The dimensions of the groove can be understood in relation to the width 632 of the heat transfer groove 608 discussed above in Figure 6. In some embodiments, the groove may be formed and defined on the drum by a green laser, an infrared laser ablation mask, and / or grit blasting. In step 714, the drum then undergoes a sealing mesa mask formation process, followed by a non-sealing mesa texture formation process in step 716 by laser processing or grit blasting. Texture formation may be performed in step 716v with dimensions between approximately 0.1 micrometers and approximately 5 micrometers (e.g., 2 micrometers). In step 718, the drum undergoes nozzle hole machining, contouring, and chemical milling. In some embodiments, a uniform nozzle diameter is obtained by laser trepanning. Optionally, in step 720, the drum undergoes quality inspection.

[0043] Figure 8 schematically shows a substrate holder pattern according to an embodiment of the present disclosure. The nozzle array 802 increases the number of nozzles compared to substrate holders of the current state of the art, thereby increasing the mass flow rate and gap pressure. Gas grooves 804 are positioned on the nozzle array 802, and the nozzles in the nozzle array 802 are positioned within the intersections 808 of the gas grooves. The intersections 808 are intersections positioned along a linear gas groove 804. The gas grooves 804 are linear and may extend in the mechanical direction 812, the transverse direction 810, or at a 45-degree angle from the mechanical direction 812 or the transverse direction 810. The gas grooves 804 transport heat transfer gas in a direction away from the nozzle array 802. The substrate holder 640 in Figure 600 is positioned across the cooling drum 600, and the heat transfer grooves 608 extend across the cooling drum 600, offset at a 45-degree angle from the transverse direction 638. As shown in Figure 8, the substrate holder (not shown) may be provided with additional grooves 804 extending in the machine direction. Texturing grooves 806 may be optionally provided in the non-sealing mesa portion. The texturing grooves 806 prevent or significantly reduce the probability of the substrate laminating onto the mesa portion. Various substrate holder patterns can be implemented in procedure 700 to adjust the proportion of the substrate that is in contact with the substrate holder. Adjusting the amount of contact between the substrate and the substrate holder helps maintain a high and uniform gap pressure, which optimizes the cooling of the material on the substrate.

[0044] Figure 9 shows a schematic diagram of the mesa vent drum 900 compared to the cooling drum 600 in Figure 6. The drum 900 can be implemented according to the embodiment described in Figure 6, but without the gas outlet 618. Both embodiments can improve the durability of the deposited material (e.g., the durability of LiOH) and reduce the laser processing cost during manufacturing. Drums 602 and 900 improve the material deposition rate on the substrate, compensate for uneven heat distribution along the substrate, minimize heat transfer gas loss along the back surface of the substrate, and increase the usable drum surface area for deposition on the substrate.

[0045] Figure 10 is a flowchart illustrating a method 1000 for coating a substrate according to some embodiments described herein.

[0046] In step 1002, the deposition system transports the substrate (web-like) onto the curved surface of a cooling drum for supporting the substrate. In one embodiment, the cooling drum comprises a dielectric section, a plurality of sealing mesa sections, a plurality of non-sealing mesa sections, and a plurality of grooves. The substrate is positioned on the curved surface and is substantially in contact with the plurality of sealing mesa sections and the plurality of non-sealing mesa sections.

[0047] In some embodiments, the dielectric portion is manufactured from materials such as aluminum nitride, yttrium oxide, diamond-like carbon, aluminum oxide, boron nitride, polyimide, and combinations thereof. In some embodiments, multiple sealing mesa portions are arranged along the substrate edge, along the drum centerline, or along both the substrate edge and the drum centerline. In some embodiments, multiple non-sealing mesa portions are arranged between multiple sealing mesa portions. In some embodiments, multiple grooves are arranged between multiple non-sealing mesa portions, between multiple sealing mesa portions, or between multiple non-sealing mesa portions and multiple sealing mesa portions. In some embodiments, the outer surface of the substrate is in close contact with the vapor-deposited material.

[0048] In step 1004, the deposition system evaporates the material in an evaporation crucible. In one embodiment, the evaporated material is a lithium-containing material, but other suitable materials may also be used. In step 1006, the deposition system directs the material evaporated in step 1004 from the evaporation crucible to the substrate. The apparatus and method described herein improve the coating performance of thin, flexible substrates. In the embodiments described herein, a cooling drum and a substrate holder on the cooling drum are provided to achieve an optimal balance of contact between the drum and the substrate and gas flow. The substrate moving on the cooling drum is supported on the cooling drum by the substrate holder, and damage to the substrate along the contact line is completely eliminated or minimized. Another advantage of the present disclosure is that the substrate is optimally cooled because the gas can be distributed uniformly across the substrate on the cooling drum.

[0049] This specification includes details of many specific embodiments, but these should not be interpreted as limitations on the scope that may be described in the claims, but rather as descriptions of features that may be specific to a particular embodiment. Certain features described in this specification in the context of separate embodiments may also be implemented in combination in a single embodiment. Conversely, various features described in the context of a single embodiment may also be implemented individually in multiple embodiments or in any suitable subcombination. Furthermore, even if the aforementioned features are described to operate in a certain combination and are initially described in the claims as such a combination, one or more features may be deleted from the claimed combination, and the claimed combination may be directed towards a subcombination or a variation of a subcombination.

[0050] Specific embodiments of the subject matter have been described. As those skilled in the art will understand, other embodiments, modifications, and reorderings of the described embodiments are included in the following claims. In the drawings or claims, operations are shown in a specific order, but this should not be understood as requiring that such operations be performed in a specific or sequential order as shown, or that all illustrated operations be performed to achieve a desired result (some operations may be considered optional). In certain circumstances, multitasking or parallel processing (or a combination of multitasking and parallel processing) may be advantageous and appropriate, and may be performed.

[0051] Furthermore, the separation or integration of various system modules and components in the embodiments described above should not be understood as requiring such separation or integration in all embodiments. It should be understood that the described program components and systems can generally be integrated into a single software product or packaged into multiple software products.

[0052] Accordingly, the exemplary embodiments described above do not define or limit this disclosure. Other modifications, substitutions, and alterations are also possible without departing from the spirit and scope of this disclosure.

[0053] Although the various steps in the method or process of the embodiment are presented and described sequentially, those skilled in the art will understand that some or all of the steps may be performed in a different order, combined, or omitted, or that some or all of the steps may be performed in parallel. The steps may be performed actively or passively. The method or process may be repeated or extended to support multiple components or multiple users in a field environment. Therefore, the scope should not be considered to be limited to a specific arrangement of steps shown in the flowchart or diagram.

[0054] Unless otherwise defined, all technical and scientific terms used have the same meaning as those commonly understood by those skilled in the art to which these systems, apparatus, methods, processes, and compositions belong.

[0055] In this disclosure, terms such as “top,” “bottom,” “side,” “above,” “below,” “up,” “down,” “upward,” “downward,” “horizontal,” and “vertical” do not refer to absolute directions. Instead, these terms refer to directions relative to a nonspecific reference plane, which may be vertical, horizontal, or other angular directions.

[0056] The singular forms "a," "an," and "the" include plural referents unless the context clearly indicates otherwise. When an element is referred to in the singular form in a claim, unless otherwise specified, it does not mean "only one," but rather "one or more." Unless otherwise specified, the term "several" refers to one or more.

[0057] Embodiments of the Disclosure may appropriately “comprise,” “consist,” or “consist essentially of” the disclosed limiting features, and may be implemented even if no undisclosed limiting features are present. As used herein and in the appended claims, the words “comprise,” “has,” and “include,” and all their grammatical variations, are intended to have an open and non-restrictive meaning that does not exclude any additional elements or steps.

[0058] "Optional" and "optional" mean that the materials, events, or circumstances described below may or may not exist or occur. This description includes cases where the materials, events, or circumstances occur and cases where they do not.

[0059] When used, the term "decide" encompasses a wide variety of actions. For example, "decide" may include calculation, operation, processing, derivation, investigation, retrieval, such as searching in tables, databases, or other data structures, and verification. It may also include receiving, such as receiving information, and accessing, such as accessing data in memory. Furthermore, "decide" may include resolving, selecting, choosing, and establishing.

[0060] When the words "approximately" or "about" are used, this term may mean that the value may have a variance of up to ±10%, up to 5%, up to 2%, up to 1%, up to 0.5%, up to 0.1%, or up to 0.01%.

[0061] A range can be expressed as an approximate range from one specific value to another specific value (including both ends). When such a range is expressed, another embodiment should be understood as a range from one specific value to another specific value, along with all specific values ​​and combinations of those values ​​within that range.

[0062] Where used, terms such as "first" and "second" are arbitrarily assigned and are merely intended to distinguish between two or more components of a system, apparatus, or composition. It should be understood that the terms "first" and "second" have no other purpose, are not part of the names or descriptions of the components, and do not necessarily define the relative locations or positions of the components. Furthermore, the mere use of the terms "first" and "second" does not require the existence of a "third" component, although its possibility is assumed within the scope of the various embodiments described.

[0063] Although only a few exemplary embodiments have been described in detail, those skilled in the art will readily understand that many modifications are possible to these exemplary embodiments without substantially departing from the scope of the disclosed information. Therefore, all such modifications are intended to fall within the scope of this disclosure as defined in the following claims. In the claims, the means + function clauses are intended to encompass not only structurally equivalent structures, but also structurally equivalent structures, that are described as performing the function described. For example, nails and screws may not be structurally equivalent in that nails use a cylindrical surface to fasten wooden parts together, while screws use a helical surface; however, in the context of fastening wooden parts, nails and screws can be structurally equivalent. Unless the phrase “means for” is explicitly used in a claim in conjunction with the relevant function, the applicant expresses that no limitation of any claim is intended to evoke Section 112(f) of the U.S. Patent Act.

[0064] The following claims are not intended to be limited to the embodiments provided, but rather should conform to the full scope consistent with the language of the claims.

Claims

1. A curved drum surface for supporting a substrate, Dielectric part; Multiple sealing mesa sections; Multiple non-sealing mesa sections; and Multiple grooves A curved drum surface with, Multiple gas inlets are arranged on multiple sealing mesa sections and multiple non-sealing mesa sections. A cooling drum equipped with the following.

2. The cooling drum according to claim 1, wherein the dielectric portion comprises a material selected from the group consisting of aluminum nitride, yttrium oxide, diamond-like carbon, aluminum oxide, boron nitride, polyimide, and combinations thereof.

3. The cooling drum according to claim 1, wherein multiple grooves are arranged between multiple non-sealing mesa portions, between multiple sealing mesa portions, or between multiple non-sealing mesa portions and multiple sealing mesa portions.

4. The cooling drum according to claim 3, wherein multiple non-sealing mesa portions are arranged between multiple sealing mesa portions.

5. The cooling drum according to claim 1, wherein multiple grooves are arranged between multiple non-sealing mesa portions, between multiple sealing mesa portions, or between multiple non-sealing mesa portions and multiple sealing mesa portions.

6. The cooling drum according to claim 1, wherein a vapor deposition material is coated on a substrate surface substantially facing away from the curved drum surface.

7. Multiple gas outlets located within parts of multiple grooves The cooling drum according to claim 1, further comprising the above.

8. The cooling drum according to claim 7, wherein a plurality of gas outlets are disposed between the base material edge and the outer coating edge, between the inner coating edge and the drum centerline, or between the base material edge and the outer coating edge and between the inner coating edge and the drum centerline.

9. A curved drum surface for supporting a substrate, Multiple sealing mesa sections; Multiple non-sealing mesa sections; and Multiple grooves A curved drum surface with Multiple gas inlets arranged on multiple sealing mesa sections and multiple non-sealing mesa sections; and An evaporation source configured to deposit material onto a substrate placed on the curved surface of a cooling drum. A vapor deposition apparatus equipped with the following:

10. The vapor deposition apparatus according to claim 9, wherein the curved drum surface further comprises a dielectric portion.

11. The vapor deposition apparatus according to claim 10, wherein the dielectric portion comprises a material selected from the group consisting of aluminum nitride, yttrium oxide, diamond-like carbon, aluminum oxide, boron nitride, polyimide, and combinations thereof.

12. The vapor deposition apparatus according to claim 9, wherein multiple sealing mesa portions are arranged along the edge of the substrate, along the centerline of the drum, or along both the edge of the substrate and the centerline of the drum.

13. The vapor deposition apparatus according to claim 12, wherein multiple non-sealing mesa portions are arranged between multiple sealing mesa portions.

14. The vapor deposition apparatus according to claim 9, wherein multiple grooves are arranged between multiple non-sealing mesa portions, between multiple sealing mesa portions, or between multiple non-sealing mesa portions and multiple sealing mesa portions.

15. The vapor deposition apparatus according to claim 9, wherein the substrate is substantially in contact with a plurality of sealing mesa portions and a plurality of non-sealing mesa portions, and the surface of the substrate substantially facing away from the curved drum surface is coated with a material from a vapor deposition source.

16. Multiple gas outlets located within parts of multiple grooves The vapor deposition apparatus according to claim 9, further comprising the above.

17. The vapor deposition apparatus according to claim 16, wherein a plurality of gas outlets are disposed between the substrate edge and the outer coating edge, between the inner coating edge and the drum centerline, or between the substrate edge and the outer coating edge and between the inner coating end and the drum centerline.

18. In a method for coating a substrate in a vacuum chamber, A process for transporting a substrate onto a curved surface of a cooling drum for supporting the substrate, wherein the curved surface is Dielectric part; Multiple sealing mesa sections; Multiple non-sealing mesa sections; and Multiple grooves A conveying process comprising a substrate arranged on a curved surface and substantially in contact with a plurality of sealing mesa portions and a plurality of non-sealing mesa portions; The process of evaporating the material in an evaporation crucible; and The process of guiding the evaporated material from the evaporation crucible to the substrate. A method that includes the following.

19. The method according to claim 18, wherein multiple grooves are arranged between multiple non-sealing mesa portions, between multiple sealing mesa portions, or between multiple non-sealing mesa portions and multiple sealing mesa portions.

20. The method according to claim 18, wherein multiple grooves are arranged between multiple non-sealing mesa portions, between multiple sealing mesa portions, or between multiple non-sealing mesa portions and multiple sealing mesa portions.

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