Crimping equipment and its upper and lower die blocks

Abstract

To provide a crimping facility using a ceramic material having a low coefficient of thermal expansion and heat resistance and antistatic properties, and to provide an upper die block and a lower die block thereof. [Solution] A crimping device 10 suitable for crimping an integrated circuit component W1 covered with a lid portion W2 comprises a lower die device 1 and an upper die device 2, the lower die device 1 is provided with a lower die block 11 capable of holding the integrated circuit component W1, the upper die device 2 is provided with an upper die block 21 capable of applying pressure to the lid portion W2, the upper die device 2 is configured to be movable in the vertical direction relative to the lower die device 1 by driving, and the lower die block 11 and the upper die block 21 are made of ceramic materials of different hardness.

Description

[Technical Field]

[0001] The present invention relates to a crimping apparatus and its upper and lower die blocks, and more particularly to a crimping apparatus and its upper and lower die blocks for crimping integrated circuit components covered with a lid. [Background technology]

[0002] In the packaging process for integrated circuit components, it is often necessary to use a lower die assembly and an upper die assembly of a crimping machine to crimp an integrated circuit (IC) covered with a lid. The lower die assembly is provided with a lower die block capable of holding the integrated circuit component, and the upper die assembly is provided with an upper die block capable of applying pressure to the lid. As described in Patent Document 1, the lower die block and the upper die block can be made of a metal material such as aluminum (Al) or a plastic material such as polyetherimide (PEI). During the crimping process, the lower die block and / or the upper die block must be equipped with multiple heating elements, and the heat from the heating elements is conducted to the integrated circuit component and / or the lid via the aluminum or polyetherimide material.

[0003] However, while aluminum has excellent thermal conductivity, it also has a high thermal expansion coefficient, which means that temperature changes can cause the lower and upper die blocks to deform, affecting bonding accuracy. Furthermore, aluminum requires ultra-hard anodizing and surface treatment to create an anti-static film layer. Even a slight scratch on the film layer increases the risk of electrostatic damage to integrated circuit components. While polyetherimide has a lower thermal expansion coefficient than aluminum, there is a concern that it may soften or melt at temperatures above 200°C. Therefore, the lower and upper die blocks also deform at temperatures above 200°C, affecting bonding accuracy. This indicates that there is still room for improvement in conventional technology. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Taiwan Patent No. I890887 Specification Summary of the Invention [Problem to be solved by the invention]

[0005] In view of the above problems, the present invention can solve at least one of the drawbacks of the prior art. Upper blower block and lower block The purpose is to provide crimping equipment. [Means for solving the problem]

[0006] In order to achieve the above objectives, The invention provides an upper die block (21) suitable for a crimping device (10) that includes a lower die device (1) capable of crimping an integrated circuit component (W1) covered with a cover portion (W2) and holding the integrated circuit component (W1), and an upper die device (2) capable of applying pressure to the cover portion (W2), The upper mold device (2) is provided with a pressure applying device for applying pressure to the cover portion (W2), An upper die block (21) is provided, which is made of a ceramic material.

[0007] Ma Ta, The present invention provides a lower die block (11) suitable for a crimping device (10) that includes a lower die unit (1) capable of crimping an integrated circuit component (W1) covered with a cover portion (W2) and holding the integrated circuit component (W1), and an upper die unit (2) capable of applying pressure to the cover portion (W2), The lower mold device (1) is provided with the integrated circuit component (W1) and can hold the integrated circuit component (W1), A lower die block (11) is provided, which is made of a ceramic material.

[0008] Furthermore, the present invention provides the upper die block (21) or the lower die block (11). A crimping apparatus (10) having the following features is provided. [Effects of the Invention]

[0009] The crimping equipment and its upper and lower mold blocks of the present invention having the above-mentioned configuration have the lower and upper mold blocks made of ceramic material, which not only has a low coefficient of thermal expansion but also has heat resistance and anti-static properties, thereby improving the shortcomings of conventional technology. [Brief explanation of the drawings]

[0010] [Figure 1] 1 is a perspective view showing an integrated circuit component covered with a lid as an object to be crimped in the embodiment of the crimping equipment of the present invention; [Figure 2] 1 is a partial exploded perspective view showing that objects to be crimped are arranged in a matrix on a holding tray in an embodiment of the crimping equipment of the present invention; FIG. [Figure 3] 1 is a perspective view showing a lower die assembly and an upper die assembly in an embodiment of the crimping equipment of the present invention; FIG. [Figure 4] 1 is a partial exploded perspective view showing a lower die unit of the crimping equipment according to the present invention, in which a plurality of lower die blocks are provided; FIG. [Figure 5] 1 is a partial exploded perspective view showing a plurality of upper die blocks provided in an upper die unit of the crimping equipment of the present invention; FIG. [Figure 6] 10 is a perspective view showing that a holding tray on which an object to be crimped is placed is held by a lower die device. FIG. DETAILED DESCRIPTION OF THE INVENTION

[0011] In order to more clearly explain the objectives, technical means, and advantages of the embodiments of the present invention, the following will clearly and completely describe the technical means in the embodiments of the present invention in combination with the accompanying drawings of the embodiments of the present invention. It should be apparent that the described embodiments are only some embodiments of the present invention, and not all embodiments. Generally, the components of the embodiments of the present invention depicted and shown in the accompanying drawings can be arranged and designed in various different configurations. Therefore, the detailed description of the embodiments of the present invention provided below in the accompanying drawings does not constitute any limitation on the protection scope of the present invention, but merely represents selected embodiments of the present invention.

[0012] Also, in the following description, please note that elements that fulfill the same role or function are denoted by the same numbers even if they do not have exactly the same configuration.

[0013] As shown in FIG. 1, the crimping apparatus of this embodiment of the present invention is suitable for crimping an object W, which is an integrated circuit component W1 covered with a cover W2. In this embodiment, the integrated circuit component W1 is a substrate carrying a chip, and the cover W2 is a heat dissipation fin that dissipates heat from the chip on the substrate. A thermal interface material (TIM) can be filled between the heat dissipation fin and the chip to conduct heat between the integrated circuit component W1 and the cover W2. Examples of the thermal interface material include thermal conductive film (Film TIM), metal thermal conductive material (Metal TIM), and liquid metal thermal conductive material (Liquid Metal TIM). An adhesive can also be filled between the heat dissipation fin and the substrate to bond the integrated circuit component W1 and the cover W2.

[0014] 2, a plurality of crimping objects W are placed on a holding tray A and transported. The holding tray A is provided with a plurality of storage areas A1 arranged in a matrix and a plurality of openings A2 corresponding to each storage area A1. Each storage area A1 is arranged to store one crimping object W.

[0015] As shown in FIG. 3, the crimping equipment 10 of the embodiment of the present invention is provided with a lower die device 1 and an upper die device 2, and the upper die device 2 is configured to be movable in the vertical direction relative to the lower die device 2 by being driven.

[0016] As shown in Figures 2 to 4, the lower mold device 1 has a plurality of lower mold blocks 11, a lower mold table 12 on which the lower mold blocks 11 are placed, and a plurality of fixing means 13 for fixing each lower mold block 11 to the lower mold table 12.

[0017] Each lower die block 11 is suitable for holding a bonding object W. Specifically, the lower die block 11 supports an integrated circuit component W1 of the bonding object W from below. The lower die blocks 11 are square and made of a ceramic material such as silicon carbide (SiC) ceramic or alumina (Al2O3) ceramic. Ceramic materials not only have a low coefficient of thermal expansion, but can withstand high temperatures exceeding 1000°C and are also antistatic. Furthermore, the thermal conductivity of ceramic materials is superior to that of plastic materials and close to that of metal materials.

[0018] As shown in Figures 2, 3 and 4, the size of each lower mold block 11 is set to a size that allows it to pass through each opening A2 of the holding tray A, and each lower mold block 11 is fitted with a heating element TA1 for heating and a temperature sensing element TS1 for sensing the temperature of the lower mold block 11.

[0019] Each lower mold block 11 has a accommodating surface 111 located above and in contact with the substrate of the integrated circuit component W1, an opposite surface 112 located opposite the accommodating surface 111, two fixing surfaces 113 located between the accommodating surface 111 and the opposite surface 112, an air groove 114 formed in the accommodating surface 111, and an insertion hole 115 communicating with the air groove 114 and extending from the accommodating surface 111 to the opposite surface 112.

[0020] The fixing surfaces 113 of each lower mold block 11 are located on both sides of the storage surface 111, and are lower than the storage surface 111 in the height direction. The fixing means 13 includes a fixing member 131 and two pressing members 132. The lower mold block 11 can be fixed to the lower mold table 12 by inserting the fixing member 131 into the insertion hole 115 and pressing the pressing members 132 against the fixing surfaces 113. The air groove 114 can introduce negative pressure. The fixing member 131 is provided with an air passage 131A that communicates with the air groove 114.

[0021] As shown in FIGS. 2 and 5, the upper mold device 2 has a plurality of upper mold blocks 21, a plurality of pressure rods 22, and an upper mold table 23 on which the pressure rods 22 are installed.

[0022] Each upper die block 21 is installed corresponding to the bottom of each pressure rod 22 and is suitable for applying pressure to the crimping object W. Specifically, the upper die blocks 21 apply pressure to the lid portion W2 of the crimping object W. The upper die blocks 21 are square and made of a ceramic material such as silicon carbide (SiC) ceramic or alumina (Al2O3) ceramic. Ceramic materials not only have a low coefficient of thermal expansion, but can also withstand high temperatures exceeding 1000°C and are antistatic. Furthermore, the thermal conductivity of ceramic materials is superior to that of plastic materials and similar to that of metal materials.

[0023] The size of each upper mold block 21 is set to correspond to the size of the lid portion W2, and a heating element TA2 for heating and a temperature sensing element TS2 for sensing the temperature of the upper mold block 21 are fitted into each upper mold block 21.

[0024] In an embodiment of the present invention, the lower mold block 11 and the corresponding upper mold block 21 have different hardnesses. For example, the lower mold block 11 is made of a relatively soft alumina (Al2O3) ceramic, and the upper mold block 21 is made of a relatively hard silicon carbide (SiC) ceramic, but the present invention is not limited thereto. The lower mold block 11 can also be made of a relatively hard silicon carbide (SiC) ceramic, and the upper mold block 21 can also be made of a relatively soft alumina (Al2O3) ceramic.

[0025] The effect of crimping the crimping object W with the lower die block 11 and upper die block 21 having different hardness is to provide an appropriate cushioning effect, reduce cracking of the crimping object W, and reduce horizontal misalignment between the lid portion W2 and the integrated circuit component W1.

[0026] 6, the object W to be bonded is placed on a holding tray A and transported between the lower mold device 1 and the upper mold device 2, and the holding tray A on which the object W to be bonded is placed is transported to the lower mold device 1. The holding tray A is placed on a lower mold table 12, and each lower mold block 11 passes through each opening A2 of the holding tray A to support the integrated circuit component W1 of the object W to be bonded.

[0027] In an embodiment of the present invention, after the lower mold block 11 supports the integrated circuit component W1 of the crimping object W, the upper mold device 2 is driven to move downward relative to the lower mold device 1 so that the upper mold block 21 presses the lid portion W2 of the crimping object W.

[0028] Then, each pressure rod 22 is driven to move downward relative to the upper mold table 23, and each upper mold block 21 is linked to apply force to the lid portion W2 to pressurize the integrated circuit component W1, or the lower mold device 1 is driven to move upward relative to the upper mold device 2, and applies force to the integrated circuit component W1 to pressurize the lid portion W2.

[0029] In the crimping equipment and its upper and lower die blocks according to the embodiment of the present invention, the lower die block 11 and the upper die block 21 are made of ceramic material, which not only has a low coefficient of thermal expansion but also has heat resistance and anti-static properties, thereby overcoming the shortcomings of the prior art.

[0030] In other embodiments of the present invention, ceramic material may be used in only one of the lower die block 11 or the upper die block 21.

[0031] For example, if the crimping object W is filled with a thermally conductive film (Film Tim) or a liquid metal thermally conductive material (Liquid Metal Tim), the crimping object W needs to be heated mainly by the lower die block 11 to harden the adhesive in the crimping object W. Therefore, the lower die block 11 is made of a ceramic material such as silicon carbide (SiC) ceramic or alumina (Al2O3) ceramic, while the upper die block 21 can be replaced with a metal material such as aluminum (Al) or a plastic material such as polyetherimide (PEI).

[0032] Furthermore, for example, if the crimping object W is filled with a metal thermal conductive material (Metal Tim), the metal thermal conductive material (Metal Tim) needs to be heated and melted mainly by the upper block 21, so the upper block 21 is made of a ceramic material such as silicon carbide (SiC) ceramic or alumina (Al2O3) ceramic, while the lower block 11 can be replaced with a metal material such as aluminum (Al) or a plastic material such as polyetherimide (PEI).

[0033] The above-described embodiments are illustrative of the principles and effects of the present invention, and are not intended to limit the present invention. Those skilled in the art may make slight changes or modifications to the above-described embodiments without departing from the spirit and scope of the present invention. Therefore, all changes and modifications made by those skilled in the art without departing from the gist of the present invention should be considered to fall within the scope of protection of the present invention. [Explanation of symbols]

[0034] 10 Crimping Equipment 1 Lower mold device 11 Lower block 111 Storage area 112 opposite side 113 Fixed surface 114 Air Groove 115 Insertion hole 12 Lower mold stand 13 Fixing means 131 Fixing member 131A Air passage 132 Pressing member TA1 heating element TS1 Temperature Sensing Material 2 Upper mold device 21 Upper block 22 Pressure rod 23 Upper mold stand TA2 heating element TS2 Temperature Sensing Material A Holding dish A1 Containment Area A2 opening W Crimping object W1 Integrated Circuit Components W2 Lid

Claims

1. A crimping apparatus suitable for crimping an integrated circuit component covered with a lid, the crimping apparatus comprising a lower die device and an upper die device, the lower die device is provided with a lower die block capable of holding the integrated circuit component; The upper mold device is provided with an upper mold block that can pressurize the lid portion, the upper mold device is configured to be movable in the up and down direction relative to the lower mold device by being driven, The lower die block and the upper die block are made of ceramic materials with different hardnesses.

2. 2. The crimping equipment according to claim 1, wherein the lower die block is made of alumina ceramic, and the upper die block is made of silicon carbide ceramic.

3. 2. The crimping equipment according to claim 1, wherein the lower die block is made of silicon carbide ceramic, and the upper die block is made of alumina ceramic.

4. 2. The crimping equipment according to claim 1, wherein a heating member for heating and a temperature sensing member for sensing the temperature of the lower die block are fitted to the lower die block.

5. 2. The crimping equipment according to claim 1, wherein a heating member for heating and a temperature sensing member for sensing the temperature of the upper die block are fitted to the upper die block.

6. A crimping apparatus suitable for crimping an integrated circuit component covered with a lid, the crimping apparatus comprising a lower die device and an upper die device, the lower die device is provided with a lower die block capable of holding the integrated circuit component; The upper mold device is provided with an upper mold block that can pressurize the lid portion, the upper mold device is configured to be movable in the up and down direction relative to the lower mold device by being driven, The lower die block is made of a ceramic material.

7. 7. The crimping equipment according to claim 6, wherein the lower die block is made of silicon carbide ceramic or alumina ceramic.

8. 8. The crimping equipment according to claim 7, wherein the upper die block is made of a metal material or a plastic material.

9. A crimping apparatus suitable for crimping an integrated circuit component covered with a lid, the crimping apparatus comprising a lower die device and an upper die device, the lower die device is provided with a lower die block capable of holding the integrated circuit component; The upper mold device is provided with an upper mold block that can pressurize the lid portion, the upper mold device is configured to be movable in the up and down direction relative to the lower mold device by being driven, The crimping equipment, wherein the upper die block is made of a ceramic material.

10. 10. The crimping equipment according to claim 9, wherein the upper die block is made of silicon carbide ceramic or alumina ceramic.

11. The crimping equipment according to claim 10, wherein the lower die block is made of a metal material or a plastic material.

12. An upper die block suitable for crimping equipment that includes a lower die device that can crimp an integrated circuit component covered with a lid and hold the integrated circuit component, and an upper die device that can pressurize the lid, The upper mold device is provided with the upper mold device and is capable of pressurizing the lid portion, Upper die block made of ceramic material.

13. A lower die block suitable for crimping equipment that includes a lower die device that can crimp an integrated circuit component covered with a lid and hold the integrated circuit component, and an upper die device that can pressurize the lid, The lower mold device is provided with the integrated circuit component, The lower die block is made of ceramic material.

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