Continuous double-sided plasma coating system

Abstract

To provide a continuous plasma double-sided coating system that can simultaneously perform a reversal process while a workpiece is undergoing a buffering process, thereby improving coating efficiency, and enabling the entire coating process to be carried out completely in a vacuum environment, effectively improving the uniformity of the coating structure and the stability of quality. [Solution] A continuous plasma double-sided coating system 100 is used to perform horizontal coating processing on a workpiece 200, and comprises a loading device 10, a vacuum coating device 20, and an unloading device 30. The loading device 10 loads the workpiece 200, the vacuum coating device 20 has a first buffer chamber 21, a first sputtering chamber 22, a second buffer chamber 23, a second sputtering chamber 24, and a third buffer chamber 25 connected in sequence, at least one of the first buffer chamber 21, the second buffer chamber 23, and the third buffer chamber 25 has an inversion mechanism 26, which inverts the workpiece 200, the first sputtering chamber 22 and the second sputtering chamber 24 sputter on the workpiece 200, and the unloading device 30 receives and sends out the processed workpiece 200.

Description

[Technical Field]

[0001] The present invention relates to a coating system and a coating method thereof, and more particularly to a continuous plasma double-sided coating system and a coating method thereof. [Background technology]

[0002] In semiconductor-related technologies, plasma coating processes are often used to apply a coating to the surface of a workpiece to impart functionality to the workpiece, such as electrical conductivity, corrosion resistance, and resistance to electromagnetic interference (EMI).

[0003] In the prior art, a double-sided coating method is often adopted to form corresponding coating layers on both surfaces of the object to be treated, so that the object to be treated has the above-mentioned functions. However, conventional double-sided coating methods generally have the problem that the entire coating process cannot be carried out in a vacuum environment, which affects the efficiency of double-sided coating and makes the coating quality susceptible to environmental influences due to the need to enter and exit the vacuum environment. Summary of the Invention [Problem to be solved by the invention]

[0004] In the prior art, a double-sided coating method is used to form coating layers on both sides of the workpiece to impart the above-mentioned functions, but the entire coating process cannot be carried out in a vacuum environment, which reduces efficiency and makes the coating quality susceptible to environmental influences due to changes in the vacuum environment. [Means for solving the problem]

[0005] The present invention relates to a continuous plasma double-sided coating system to solve the problems of low efficiency and quality that is easily affected by the environment in the conventional double-sided coating method.

[0006] The continuous double-sided plasma coating system of the present invention is for performing horizontal coating processing on a first processing surface of a workpiece and a second processing surface opposite to the first processing surface, and the continuous double-sided plasma coating system includes a loading device, a vacuum coating device, and an unloading device; The loading device loads the workpiece, The vacuum coating apparatus communicates with a carrying-in device to receive the workpiece, and has a first buffer chamber, a first sputtering chamber, a second buffer chamber, a second sputtering chamber and a third buffer chamber connected in sequence to the vacuum coating apparatus, the first buffer chamber is connected to the carrying-in device, and at least one of the first buffer chamber, the second buffer chamber and the third buffer chamber has an inversion mechanism, which inverts the workpiece to exchange the positions of the first processing surface and the second processing surface, the first sputtering chamber is for sputtering a first metal layer on the workpiece, and the second sputtering chamber is for sputtering a second metal layer on the workpiece, The unloading device is provided in communication with the side of the vacuum coating apparatus that is farther from the loading device, and the unloading device receives and delivers the processed workpiece.

[0007] An embodiment of the present invention further provides a continuous plasma double-sided coating method, which uses a continuous plasma coating system to perform horizontal coating on a first processing surface and a second processing surface opposite to the first processing surface of a workpiece, The continuous plasma double-sided coating method includes a pre-treatment step, a loading step, a first sputtering step, a reversing step, a second sputtering step, a third sputtering step, a fourth sputtering step, and a loading step; Pre-processing step: The workpiece is put into the loading device and pre-processed; A carrying step: carrying the workpiece through a carrying device to a vacuum coating device communicating with the carrying device, the vacuum coating device having a first buffer chamber, a first sputtering chamber, a second buffer chamber, a second sputtering chamber and a third buffer chamber connected in sequence, at least one of the first buffer chamber, the second buffer chamber and the third buffer chamber having an inversion mechanism; First sputtering step: moving the workpiece from the first buffer chamber toward the second buffer chamber, and sputtering a first metal layer onto the first processing surface in the first sputtering chamber; Inverting step: transporting the workpiece into a buffer chamber having an inverting mechanism, inverting the workpiece to exchange the positions of the first processing surface and the second processing surface; A second sputtering step: returning the workpiece to the first sputtering chamber and sputtering a first metal layer onto the second work surface; a third sputtering step: transferring the workpiece to a second sputtering chamber, sputtering a second metal layer on the second processing surface, and then performing a reverse step again; a fourth sputtering step: transferring the workpiece to a second sputtering chamber and sputtering a second metal layer onto the first processed surface; Unloading step: The processed workpiece is transported to an unloading device that communicates with the vacuum coating device via the third buffer chamber, and then unloaded.

[0008] The present invention integrates the inversion mechanism into the buffer chamber, so that the workpiece can undergo the inversion process simultaneously while undergoing the buffering process, thereby improving coating efficiency. Furthermore, the above-mentioned integrated structure allows the entire coating process to be carried out completely under vacuum environment, which can effectively improve the uniformity of the coating structure and the stability of the quality. [Brief explanation of the drawings]

[0009] [Figure 1] 1 is a schematic diagram of the layout of the equipment in a continuous double-sided plasma coating system according to an embodiment of the present invention; [Figure 2]4 is a schematic diagram of the structure of a second buffer chamber according to an embodiment of the present invention and a partially enlarged view of the workpiece before it is turned over. [Figure 3] 4 is a schematic diagram of the structure of a second buffer chamber according to an embodiment of the present invention and a partially enlarged view of the workpiece, showing that the workpiece has already been turned over. [Figure 4] 10 is a structural schematic diagram of a second buffer chamber according to another embodiment of the present invention and a partial enlarged view of a workpiece before it is turned over. [Figure 5] 10 is a structural schematic diagram of a second buffer chamber according to another embodiment of the present invention and a partial enlarged view of a workpiece after the workpiece has been turned over. [Figure 6] 1 is a schematic diagram of a first sputtering chamber, a second buffer chamber, and a second sputtering chamber according to an embodiment of the present invention, illustrating how a transfer device transfers a workpiece between the chambers. [Figure 7] 1 is a schematic diagram of a first sputtering chamber, a second buffer chamber, and a second sputtering chamber according to an embodiment of the present invention, illustrating how the first sputtering chamber and the second sputtering chamber simultaneously sputter a workpiece. [Figure 8] 1 is a flowchart of a continuous plasma double-sided coating method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE INVENTION

[0010] In order to clearly explain the central idea of ​​the present invention as set forth above, specific embodiments will be described below. It should be noted in advance that the various components shown in the embodiments are drawn based on the ratios for the purpose of listing and illustrating them for the convenience of explanation, and do not represent the actual ratios of each component.

[0011] As shown in Figures 1 to 8, the continuous plasma double-sided coating system 100 according to an embodiment of the present invention is for performing horizontal coating processing on a first processing surface 210 of a workpiece 200 and a second processing surface 220 opposite to the first processing surface 210, and the continuous plasma double-sided coating system 100 has a loading device 10, a vacuum coating device 20 and an unloading device 30. Among these, the workpiece 200 may be a substrate or a target object that requires plasma coating treatment, such as a glass substrate or a wafer.

[0012] The loading device 10 loads the workpiece 200 and performs pre-processing on the workpiece 200 .

[0013] The vacuum coating apparatus 20 communicates with the loading device 10 to receive the workpiece 200, and has a first buffer chamber 21, a first sputtering chamber 22, a second buffer chamber 23, a second sputtering chamber 24 and a third buffer chamber 25 connected in sequence. The first buffer chamber 21 is connected to the loading device 10, and at least one of the first buffer chamber 21, the second buffer chamber 23, and the third buffer chamber 25 has an inversion mechanism 26, which inverts the workpiece 200 to exchange the positions of the first processing surface 210 and the second processing surface 220. The first sputtering chamber 22 is for sputtering a first metal layer 300 onto the workpiece 200 , and the second sputtering chamber 24 is for sputtering a second metal layer 400 onto the workpiece 200 .

[0014] The unloading device 30 is provided in communication with the side of the vacuum coating device 20 that is farther from the loading device 10, and the unloading device 30 receives and sends out the processed workpiece 200.

[0015] As shown in FIGS. 1 and 6, in one embodiment, the present invention further includes a conveying device 40, which conveys the workpiece 200 and moves the workpiece 200 between the loading device 10, the vacuum coating device 20, and the unloading device 30. Among these, the conveying device 40 may be provided continuously within each device, and the conveying device 40 can move the workpiece 200 in both directions along the serial direction of each device. The transport device 40 may be composed of elements that have the function of supporting and moving the workpiece 200, such as a conveyor belt, rollers, and a mounting table.

[0016] As shown in FIG. 1, in one embodiment, a first gate 50 can be provided between the loading device 10 and the vacuum coating device 20, and a second gate 60 can be provided between the vacuum coating device 20 and the unloading device 30. The first gate 50 and the second gate 60 are used to load and unload the workpiece 200 into and out of the vacuum coating apparatus 20, thereby maintaining the vacuum level and isolation of the vacuum coating apparatus 20.

[0017] Gates can also be installed between each chamber in the vacuum coating apparatus 20 according to design or requirements, which can further prevent interference between the chambers and improve the product yield of the workpieces 200.

[0018] As shown in FIG. 1, in one embodiment, the loading device 10 further comprises a degassing chamber 11 and a cleaning chamber 12 . The degassing chamber 11 is for removing gases adsorbed on the workpiece 200 , and the cleaning chamber 12 is for removing dirt from the surface of the workpiece 200 . In this way, the chamber can improve the coating quality in the subsequent vacuum coating device 20, and increase the product yield of the workpieces 200.

[0019] As shown in FIGS. 2 and 3, in one embodiment, the number of the reversing mechanism 26 is one, and it is installed in the second buffer chamber 23. Of course, the reversing mechanism 26 can be installed in the first buffer chamber 21 or the third buffer chamber 25 according to the usage demand. Thus, the design using a single inversion mechanism 26 reduces the hardware installation costs of the system, and by providing a single inversion mechanism 26 in the second buffer chamber 23, the distance and time that the workpiece 200 travels within the vacuum coating apparatus 20 can be shortened, thereby improving processing efficiency.

[0020] In one embodiment, the number of reversing mechanisms 26 is two, and they are installed in the first buffer chamber 21 and the third buffer chamber 25, respectively. Of course, the reversing mechanism 26 can be provided in the first buffer chamber 21 and the second buffer chamber 23, or in the second buffer chamber 23 and the third buffer chamber 25, respectively, according to the usage demands. As a result, when there are two workpieces 200, the two workpieces 200 can be individually inverted by the separate inversion mechanisms 26 in the first buffer chamber 21 and the third buffer chamber 25, respectively. This allows the present invention to process multiple workpieces 200 simultaneously, thereby improving overall processing efficiency.

[0021] Furthermore, the number of reversing mechanisms 26 may be three, and the reversing mechanisms 26 may be installed in the first buffer chamber 21, the second buffer chamber 23, and the third buffer chamber 25, respectively.

[0022] As shown in FIGS. 2 and 3, in one embodiment, the second buffer chamber 23 in which the reversing mechanism 26 is installed has a transfer space A1 and a reversing space A2 located above the transfer space A1. Of course, even when the reversing mechanism 26 is provided in the first buffer chamber 21 and the third buffer chamber 25, the first buffer chamber 21 and the third buffer chamber 25 similarly have the transfer space A1 and the reversing space A2. In one embodiment, the inversion mechanism 26 can have a lifting member 261 and a holding and inverting member 262, and the lifting member 261 can vertically raise and lower the workpiece 200 in the transfer space A1 and the inverting space A2. The holding and reversing member 262 is provided in the reversing space A2, and when the workpiece 200 is positioned in the reversing space A2, it fixes it and then turns it over.

[0023] It should be noted that the reversing space A2 is the minimum space required to turn over the workpiece 200, that is, the size of the reversing space A2 varies depending on the size of the workpiece 200 itself. After the workpiece 200 is fixed by the holding and reversing member 262, the lifting member 261 moves away from the reversing space A2, thereby preventing the workpiece 200 from colliding with the lifting member 261 and being damaged during the reversing process.

[0024] Furthermore, if the volume or weight of the workpiece 200 is relatively small, the number of holding and reversing members 262 can be set to one, which can further reduce the installation cost of the entire device without affecting the reversing process of the workpiece 200. On the other hand, if the volume or weight of the workpiece 200 is relatively large, the number of holding and reversing members 262 can be set to two, and they can be arranged symmetrically on both horizontal sides of the reversing space A2, thereby enabling stable reversing processing of the workpiece 200, increasing the stability of the processing of the workpiece 200, and improving product yield.

[0025] Furthermore, in one embodiment, the holding and reversing member 262 can have a rotation axis 262a and a clamping claw 262b. The rotating shaft 262a is installed horizontally, and the clamping claws 262b are connected to the end of the rotating shaft 262a, and grip and turn over the workpiece 200 around the rotating shaft 262a. This allows the clamping claws 262b to stably perform the inversion process of the workpiece 200 via the horizontally arranged rotation axis 262a, and also allows the workpiece 200 to be fixed and held in place by vacuum suction or other methods.

[0026] Of these, the rotating shaft 262a may have an extension / contraction section 262c that can extend and contract horizontally, and the extension / contraction section 262c extends and contracts the clamping claws 262b horizontally, allowing the clamping claws 262b to avoid the vertical movement path of the workpiece 200 and preventing collision between the clamping claws 262b and the workpiece 200. In addition, the holding and reversing member 262 can be connected to a moving device (not shown), which moves the holding and reversing member 262 horizontally to avoid the vertical movement path of the workpiece 200, thereby preventing collision between the two.

[0027] As shown in Figures 4 and 5, in one embodiment, the inversion mechanism 26 includes a lifting control member 263 and a holding and inversion member 262 connected to each other, and the lifting control member 263 can raise and lower the holding and inversion member 262 vertically in the conveying space A1 and the inversion space A2. The holding and reversing member 262 fixes the workpiece 200 when it is positioned in the transfer space A1, and turns it over when it is positioned in the reversing space A2. Among these, the lift control member 263 can be connected to a power unit (not shown), which provides power for driving the lift control member 263 .

[0028] Furthermore, the holding and reversing member 262 similarly has a rotating shaft 262a and a clamping claw 262b. Of these, the rotating shaft 262a is installed horizontally, one end of the rotating shaft 262a is connected to the lifting control member 263, and the clamping claw 262b is connected to the other end of the rotating shaft 262a, and grips and inverts the workpiece 200 around the rotating shaft 262a. This allows the clamping claws 262b to stably perform the inversion process of the workpiece 200 via the horizontally installed rotation shaft 262a. Among these, the holding and reversing member 262 may have the above-mentioned expandable portion 262c, or both the lifting control member 263 and the holding and reversing member 262 may be simultaneously connected to the moving device and moved laterally.

[0029] As shown in FIG. 6, in one embodiment, the first sputtering chamber 22 has a plurality of first sputtering sources 221 arranged consecutively along the serial direction of the chambers, and the second sputtering chamber 24 has a plurality of second sputtering sources 241 arranged consecutively along the serial direction of the chambers. In one embodiment, the target material used in the first sputtering source 221 is titanium, and the first metal layer 300 is formed from titanium. In one embodiment, the target material used in the second sputtering source 241 is copper, and the second metal layer 400 is formed of copper. The selection of these materials can be adjusted as needed.

[0030] Furthermore, the workpiece 200 can be fixed in a predetermined position in the first sputtering chamber 22 or the second sputtering chamber 24 and processed in a fixed-point manner to sputter the metal layer, i.e., the workpiece 200 is placed in a specific position and then the metal layer is sputtered. Alternatively, if the sputtering source is a linear source, the workpiece 200 can be moved through the sputtering region of the linear source to perform the sputtering process of the metal layer, thereby reducing the overall required volume of the coating space.

[0031] In some embodiments, the number of sputter chambers and buffer chambers in the vacuum coating apparatus 20 can also be increased depending on the user's requirements. For example, if the thickness of the second metal layer 400 is to be increased or if a metal layer of a different material is to be sputtered onto the workpiece 200, the user can install one or more additional sputtering chambers and buffer chambers according to the purpose.

[0032] As shown in FIG. 8, the present invention further provides a continuous plasma double-sided coating method 500, which uses the continuous plasma double-sided coating system 100 to perform horizontal coating processing on the first processing surface 210 of the workpiece 200 and the second processing surface 220 opposite to the first processing surface 210. The continuous plasma double-sided coating method 500 includes a pre-treatment step S1, a loading step S2, a first sputtering step S3, a turning over step S4, a second sputtering step S5, a third sputtering step S6, a fourth sputtering step S7, and an unloading step S8. In each step, the transfer device 40 controls the movement of the workpiece 200 so that the workpiece 200 can move between the devices.

[0033] Pre-processing step S1: The workpiece 200 is loaded into the carry-in device 10, and pre-processing of the workpiece 200 is performed. Among these, the pre-treatment includes, for example, a degassing process for removing gas adsorbed on the workpiece 200 using the degassing chamber 11, or a cleaning process for removing dirt adhering to the workpiece 200 using the cleaning chamber 12.

[0034] Carry-in step S2: The workpiece 200 is transported via the carry-in device 10 to the vacuum coating device 20 that communicates with the carry-in device 10.

[0035] First sputtering step S3: The workpiece 200 is moved from the first buffer chamber 21 toward the second buffer chamber 23, and in the first sputtering chamber 22, a first metal layer 300 is sputtered onto the first processing surface 210 by plasma coating. In one embodiment, an electrode (not shown) and a target (not shown) are installed in the upper part of the first sputtering chamber 22, and ions to be sputtered can be transferred from the target onto the first processing surface 210 of the workpiece 200.

[0036] Inversion step S4: The workpiece 200 is transported into a buffer chamber having an inversion mechanism 26, and the workpiece 200 is inverted to exchange the positions of the first processing surface 210 and the second processing surface 220. As shown in FIG. 6, in one embodiment, taking the inversion mechanism 26 installed in the second buffer chamber 23 as an example, the workpiece 200 that has completed the first sputtering step S3 is transported from the first sputtering chamber 22 to the second buffer chamber 23, and the inversion mechanism 26 inverts the workpiece 200, swapping the positions of the first processed surface 210 and the second processed surface 220 so that the second processed surface 220 faces upward.

[0037] Second sputtering step S5: After the inversion is completed, the workpiece 200 is returned to the first sputtering chamber 22, and the first metal layer 300 is sputtered onto the second processing surface 220. As a result, sputtering of the first metal layer 300 is completed on both sides of the workpiece 200 .

[0038] Third sputtering step S6: The workpiece 200 is transported to the second sputtering chamber 24, and after sputtering the second metal layer 400 onto the second processing surface 220, it is transported to a buffer chamber having an inversion mechanism 26, and in the embodiment shown in Figure 6, it is placed in the second buffer chamber 23, and the inversion step S4 is performed again.

[0039] Fourth sputtering step S7: After the inversion is completed, the workpiece 200 is transported to the second sputtering chamber 24 with the first processing surface 210 facing upward, and the second metal layer 400 is sputtered onto the first processing surface 210. As a result, sputtering of the second metal layer 400 is completed on both sides of the workpiece 200 .

[0040] Unloading step S8: After all the processing processes are completed, the processed workpiece 200 is transported to the unloading device 30, which is in communication with the vacuum coating device 20, via the third buffer chamber 25, and unloaded.

[0041] As shown in FIGS. 1 and 2, in one embodiment, the number of the reversing mechanism 26 is one, which is installed in the second buffer chamber 23, and in this case, the reversing step S4 is performed in the second buffer chamber 23.

[0042] In one embodiment, the number of reversing mechanisms 26 is two, which are installed in the first buffer chamber 21 and the third buffer chamber 25, respectively. At this time, the reversing step S4 is carried out in the first buffer chamber 21 or the third buffer chamber 25. For example, since the distance between the first sputtering chamber 22 and the first buffer chamber 21 is relatively short, the inversion step S4 between the first sputtering step S3 and the second sputtering step S5 can be performed by an inversion mechanism 26 installed in the first buffer chamber 21. Furthermore, since the distance between the second sputtering chamber 24 and the third buffer chamber 25 is relatively short, the reversing step S4 between the third sputtering step S6 and the fourth sputtering step S7 can be performed by the reversing mechanism 26 of the third buffer chamber 25. As a result, when performing the inversion step S4, an appropriate inversion mechanism 26 can be selected according to the actual situation to invert the workpiece 200, thereby maintaining the high processing efficiency of the present invention and a high product yield of the workpiece 200.

[0043] In some embodiments, multiple workpieces 200 can be processed simultaneously in succession. For example, when one workpiece 200 has completed steps S1-S5 and is in the third sputtering step S6, another workpiece 200 can be introduced into the vacuum coating apparatus 20 via the loading device 10 and the first sputtering step S3 can be performed synchronously or asynchronously. In other words, by designing with multiple sputter chambers, some embodiments of the present invention allow for the coating process of multiple workpieces 200 to be performed simultaneously. Furthermore, when multiple inversion mechanisms 26 are arranged in different buffer chambers, they can perform inversion and buffering processes on different workpieces 200, thereby further improving the overall processing efficiency.

[0044] For example, when the first workpiece 200a has completed coating in the first sputtering chamber 22 and is about to enter the second sputtering chamber 24 (i.e., the third sputtering step S6), the second workpiece 200b can be introduced into the loading device 10, which then performs the pre-processing step S1 and the loading step S2, and the second workpiece 200b can be allowed to enter the first sputtering chamber 22 (i.e., the first sputtering step S3), and the first sputtering step S3 of the second workpiece 200b can be synchronized with the third sputtering step S6 of the first workpiece 200a, thereby enabling the present invention to simultaneously perform the coating process on multiple workpieces 200 and improve overall processing efficiency. Among these, by setting the sputtering times of the first sputtering step S3 and the third sputtering step S6 to be the same, the advance of both workpieces 200 into the sputtering chamber can be synchronized, and collisions due to time differences can be prevented. Of course, precise time control or the installation of a sensor can effectively prevent collisions from occurring.

[0045] 2 and 3 illustrate the reversal step S4 that is performed after the third sputtering step S6. When the reversing mechanism 26 includes the lifting member 261 and the holding and reversing member 262, the operation sequence of each component is as follows. The workpiece 200 is transported to the transport space A1, and the lifting member 261 vertically lifts the workpiece 200 into the reversing space A2. After the holding and inverting member 262 fixes the workpiece 200, the lifting member 261 moves down vertically and away from the inverting space A2, and the holding and inverting member 262 inverts the workpiece 200. Thereafter, the lifting member 261 again rises vertically and enters the reversing space A2, receives the inverted workpiece 200, and lowers it into the transfer space A1.

[0046] 4 and 5 take the inversion step S4 after the third sputtering step S6 as an example. When the reversing mechanism 26 includes the lifting control member 263 and the holding and reversing member 262, the operation sequence of each component is as follows. The lift control member 263 controls the holding and reversing member 262 to move it vertically to the transfer space A1, and the holding and reversing member 262 fixes the workpiece 200. Next, the lift control member 263 controls the holding and inverting member 262 and the workpiece 200 to move them vertically to the inverting space A2, and the holding and inverting member 262 inverts the workpiece 200 within the inverting space A2. Thereafter, the lift control member 263 controls the holding and reversing member 262 and the inverted workpiece 200 to lower them to the transfer space A1.

[0047] In addition, during the period when the processing of multiple workpieces 200 according to the present invention is being carried out, when one workpiece 200 is undergoing inversion processing in the inversion space A2, the transport space A1 is temporarily opened, so that the workpieces 200 in other positions can pass through the transport space A1 via the transport device 40 and be transported to other chambers to undergo the specified processing process. Therefore, the spatial design of the buffer chamber of the present invention can effectively improve the overall manufacturing efficiency of the workpiece 200.

[0048] In order to clearly show the change in position of the workpiece 200 in the reversing step S4, FIGS. 2 to 5 are partially enlarged views that schematically show the change in the structural position of the workpiece 200. FIG. Furthermore, since there is a large difference in the dimensional ratio between the first metal layer 300 and the second metal layer 400 and the workpiece 200, the workpiece 200, the first metal layer 300 and the second metal layer 400 in the figure are not drawn to their actual proportions in order to clearly show the inversion surface and position of the workpiece 200.

[0049] As a result of the above, the present invention has the following advantages: 1. By incorporating the inversion mechanism 26 into the buffer chamber, the present invention can simultaneously perform the inversion process while the workpiece 200 is undergoing the buffering process, thereby improving coating efficiency. Furthermore, the above-mentioned configuration allows the entire coating process to be performed completely in a vacuum environment, which improves the uniformity and quality stability of the coating structure. 2. In this invention, the conveying space A1 and the turning space A2 are arranged vertically. While the workpiece 200 is undergoing the turning process, other workpieces 200 can be passed through the conveying space A1 by the conveying device 40 and transported to other chambers for predetermined processing. This improves the overall manufacturing efficiency through the spatial design of the buffer chamber. 3. In this invention, by alternately arranging the buffer chamber and the sputtering chamber and providing an inversion mechanism 26 in the buffer chamber, the coating process of the workpiece 200 can be completed with a minimum number of pieces of equipment, thereby reducing the installation area and construction costs of the entire system. 4. By providing gates between each device, the present invention can keep each device isolated from each other, prevent interference during processing of the workpiece 200, and avoid a decrease in the product yield. 5. The first sputtering step S3 on multiple workpieces 200 can be synchronized with the third sputtering step S6, allowing multiple workpieces 200 to be coated simultaneously, improving overall processing efficiency.

[0050] The embodiments described herein are merely examples and are not intended to be limiting. Those skilled in the art will understand that the features, components, or steps of the present invention are not mutually exclusive and can be combined, modified, or substituted in various different forms without departing from the spirit and scope of the present invention. In particular, unless expressly limited, one or more features of any embodiment can be freely combined with features of other embodiments to form new embodiments. All embodiments obtained by combining or modifying these features are included in the scope of the present invention and do not limit the scope of the present invention. [Explanation of symbols]

[0051] 100 Continuous double-sided plasma coating system, 200 Workpiece, 200a 1st workpiece, 200b 2nd workpiece, 210 1st processing surface, 220 2nd processing surface, 300 first metal layer, 400 second metal layer, 500 Continuous plasma double-sided coating method, 10 loading device, 11 degassing chamber, 12 washing chamber, 20 vacuum coating equipment, 21 first buffer chamber, 22 first sputtering chamber, 221 first sputter source, 23 second buffer chamber, 24 second sputter chamber, 241 Secondary sputter source, 25 third buffer chamber, 26 Reversing mechanism, 261 lifting members, 262 Retaining inversion member, 262a axis of rotation, 262b clamping claws, 262c telescopic part, 263 Lifting control member, 30 Unloading device; 40 conveying device, 50 Gate 1, 60 Gate 2, A1 conveying space, A2 inverted space, S1 pre-processing step, S2 loading step, S3 first sputtering step, S4 inversion step, S5 second sputtering step; S6 third sputtering step, S7 fourth sputtering step, S8 Unloading step.

Claims

1. A continuous plasma double-sided coating system for performing a horizontal coating process on a first processing surface of a workpiece and a second processing surface opposite to the first processing surface, the continuous plasma double-sided coating system including a loading device, a vacuum coating device, and an unloading device; The loading device loads the workpiece, the vacuum coating apparatus communicates with the loading device to receive the workpiece, the vacuum coating apparatus having a first buffer chamber, a first sputtering chamber, a second buffer chamber, a second sputtering chamber and a third buffer chamber connected in sequence, the first buffer chamber being connected to the loading device, and at least one of the first buffer chamber, the second buffer chamber and the third buffer chamber having an inversion mechanism, the inversion mechanism inverting the workpiece to exchange positions of the first processing surface and the second processing surface, the first sputtering chamber for sputtering a first metal layer onto the workpiece, and the second sputtering chamber for sputtering a second metal layer onto the workpiece; The unloading device is provided in communication with the side of the vacuum coating device farther from the loading device, and the unloading device receives and delivers the processed workpiece. Characterized by Continuous double-sided plasma coating system.

2. The number of the reversing mechanism is one, and it is installed in the second buffer chamber. Characterized by 2. The continuous double-sided plasma coating system according to claim 1.

3. The number of the reversing mechanisms is two, and they are respectively installed in the first buffer chamber and the third buffer chamber. Characterized by 2. The continuous double-sided plasma coating system according to claim 1.

4. At least one of the first buffer chamber, the second buffer chamber, and the third buffer chamber, to which the reversing mechanism is correspondingly installed, has a conveying space and a reversing space located above the conveying space, the inversion mechanism includes a lifting member and a holding and inversion member, and the lifting member is capable of transporting the workpiece vertically between the transfer space and the inversion space; The holding and inverting member is installed in the inverting space, and grips and inverts the workpiece when the workpiece is positioned in the inverting space. Characterized by 2. The continuous double-sided plasma coating system according to claim 1.

5. The holding and reversing member has a rotation shaft and a clamping claw, The rotating shaft is installed horizontally, and the clamping claws are connected to the end of the rotating shaft to grip and turn over the workpiece around the rotating shaft. Characterized by 5. The continuous double-sided plasma coating system according to claim 4.

6. At least one of the first buffer chamber, the second buffer chamber, and the third buffer chamber to which the reversing mechanism is correspondingly installed has a transport space and a reversing space located above the transport space, and the reversing mechanism includes a lifting control member and a holding and reversing member connected to each other, the lifting control member controls the holding and reversing member to vertically lift and lower it between the conveying space and the reversing space; The holding and reversing member holds the workpiece when the workpiece is positioned within the conveying space, and reverses the workpiece when the workpiece is positioned within the reversing space. Characterized by 2. The continuous double-sided plasma coating system according to claim 1.

7. The holding and reversing member has a rotation shaft and a clamping claw, The rotary shaft is installed horizontally, and one end of the rotary shaft is connected to the lift control member; The clamping claw is connected to the other end of the rotary shaft and grips and turns the workpiece around the rotary shaft. Characterized by 7. The continuous double-sided plasma coating system according to claim 6.

8. the first sputtering chamber has a plurality of first sputtering sources arranged consecutively along the serial direction of the chamber; The second sputtering chamber has a plurality of second sputtering sources arranged consecutively along the serial direction of the chamber. Characterized by 2. The continuous double-sided plasma coating system according to claim 1.

9. a first gate is provided between the loading device and the vacuum coating device; A second gate is installed between the vacuum coating device and the unloading device. Characterized by 2. The continuous double-sided plasma coating system according to claim 1.

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