Substrate wet processing apparatus capable of suppressing residual liquid
JP3256069UActive Publication Date: 2026-05-29SCIENTECH CORPORATION
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Utility models
- Current Assignee / Owner
- SCIENTECH CORPORATION
- Filing Date
- 2026-04-01
- Publication Date
- 2026-05-29
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Figure 0003256069000001_ABST
Abstract
To provide a substrate wet processing apparatus capable of suppressing residual liquid. [Solution] The substrate wet processing apparatus comprises a chemical tank 1, at least one immersion material 2, and an inclined structure 3. The chemical tank is used to contain the chemical solution W such that it forms a liquid surface L within the tank. The immersion material is installed in the chemical tank and includes at least a substrate 20, the substrate having an upper edge S2 and positioned below the liquid surface. The inclined structure is installed in the chemical tank and is spaced apart from the liquid surface of the chemical solution and positioned below the immersion material, and the inclined structure is in contact with the immersion material such that the upper edge of the substrate and the liquid surface form an inclined angle. In this way, the amount of residue remaining on the substrate when the chemical solution is discharged can be suppressed.
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