Automatic soldering machine

Abstract

To provide an automatic soldering device with easy position control. [Solution] The automatic soldering device 10 comprises a soldering iron body, a rod-shaped soldering iron tip 20 attached to the tip of the soldering iron body and having a groove 23 extending in one direction formed on its tip surface, and a thread-like solder 40 supplied toward the soldering iron tip 20, wherein the axial direction E of the solder 40 when it is supplied toward the soldering iron tip 20 is different from the one direction X which is the direction in which the groove 23 extends.

Description

Technical Field

[0001] This invention relates to an automatic soldering device.

Background Art

[0002] The following Patent Document 1 discloses a soldering iron tip that is bifurcated by providing a notch.

Prior Art Document

Patent Document

[0003]

Patent Document 1

Summary of the Invention

Problems to be Solved by the Invention

[0004] In the soldering iron tip described in the above Patent Document 1, since the solder is supplied and melted along the extending direction of the notch, it is necessary to precisely control the position of at least one of the soldering iron tip and the solder in order to insert the solder into the notch, and there is room for improvement in terms of position control.

[0005] This invention has been made in view of the above circumstances, and an object thereof is to provide an automatic soldering device that can easily perform position control.

Means for Solving the Problems

[0006] The automatic soldering device according to this invention includes a soldering iron body, a rod-shaped soldering iron tip attached to the tip of the soldering iron body and having a groove formed on the tip surface and extending in one direction, and a filamentous solder supplied toward the soldering iron tip, and when the solder is supplied toward the soldering iron tip, the axial direction of the solder is different from the one direction of the groove.

Effects of the Invention

[0007] As explained above, the automatic soldering apparatus according to the present invention offers the excellent advantage of easily controlling the position. [Brief explanation of the drawing]

[0008] [Figure 1] This is a schematic side view showing a part of an automatic soldering apparatus according to one embodiment. [Figure 2] Figure 1 is a magnified view of the soldering iron tip. [Figure 3] Figure 2 is a plan view of the soldering iron tip. [Figure 4] Figure 2 is a perspective view of the soldering iron tip. [Figure 5] Figure 2 is a magnified view of the tip of the soldering iron. [Figure 6] This is a block diagram showing the functional configuration of the control device shown in Figure 1. [Figure 7] Figure 1 is a schematic side view showing a portion of the soldering process of the automatic soldering apparatus. [Figure 8] Figure 1 is a schematic front view from the solder side, showing a portion of the soldering process of the automatic soldering apparatus. [Figure 9] Figure 1 is a flowchart showing an example of the control of an automatic soldering machine. [Figure 10] This is a schematic side view showing the trapezoidal groove. [Figure 11] This is a schematic side view showing the arc-shaped groove. [Modes for carrying out the invention]

[0009] An embodiment of the present invention will be described below with reference to the drawings. In each figure, the Z-axis direction, as indicated as appropriate, indicates the axis direction of the soldering iron tip 20. In this embodiment, the positive side of the Z-axis direction is the tip side of the soldering iron tip 20. The X-axis direction is one direction included in the plane perpendicular to the Z-axis direction and indicates the direction of extension of the groove 23. The Y-axis direction indicates a direction perpendicular to both the Z-axis direction and the X-axis direction.

[0010] Figure 1 is a schematic side view showing a part of the automatic soldering apparatus 10 according to this embodiment. As shown in Figure 1, the automatic soldering apparatus 10 of this embodiment includes, as an example, a soldering iron body 12, a soldering iron tip 20, a control device 30, and solder 40.

[0011] The solder 40 is formed, for example, in a thread-like (linear) form with a diameter D1. The rear end of the solder 40 is connected to a feed device (not shown) equipped with a drive mechanism, etc., and is supplied toward the soldering iron tip 20 by this feed device.

[0012] The soldering iron body 12 is formed in a roughly cylindrical shape. For example, the soldering iron body 12 is held at the rear end by a robot (not shown) equipped with a drive device (not shown), etc., so that the tip end can rotate in the direction of arrow M (up and down direction). The soldering iron body 12 is also movable in the XYZ directions.

[0013] The soldering iron tip 20 and the soldering iron body 12 are a single unit. The rear end of the soldering iron body 12 is socket-shaped and connected to a power supply unit attached to the robot's hand, and is detachable from that part. However, the configuration is not limited to this, and the soldering iron tip 20 may be attached to the tip of the soldering iron body 12, for example, in a detachable manner. The soldering iron tip 20 is electrically connected to a heater unit (not shown) and is heated by the heater unit. Figure 2 is an enlarged view of the soldering iron tip 20 shown in Figure 1, Figure 3 is a plan view of the soldering iron tip 20 shown in Figure 2, and Figure 4 is a perspective view of the soldering iron tip 20 shown in Figure 2. As shown in Figures 1 to 3, the soldering iron tip 20 is formed in a rod shape (approximately cylindrical), and has a pair of side surfaces 21 facing each other in the X-axis direction, located towards the tip from approximately the center. The pair of side surfaces 21 are formed by cutting out the outer circumferential surface of the cylinder. However, the configuration is not limited to this, and it may be a rod shape with a circular cross-section without side surfaces 21.

[0014] Further, a groove portion 23 extending in one direction (the X-axis direction in this embodiment) is formed on the tip surface 22 of the soldering iron tip 20. FIG. 5 is an enlarged view of the tip portion of the soldering iron tip 20 in FIG. 2. As shown in FIGS. 2 and 5, the groove portion 23 is, as an example, V-shaped when viewed from the X-axis direction. At the contact surface 24 (see FIG. 7) where the solder 40 abuts, the length D2 in the direction connecting the bottommost portion 25 of the groove portion 23 and the edge portion 26 of the groove portion 23 is 50% or more of the diameter D1 (see FIG. 1) of the solder 40. Note that the length D2 is preferably 55% or more, more preferably 60% or more of the diameter D1. Since the contact area between the soldering iron tip 20 and the solder 40 increases when the length D2 is 50% or more of the diameter D1 of the solder 40, the solder is more likely to melt.

[0015] The surface including at least the contact surface 24 of the groove portion 23 has a surface roughness Ra formed to be 0.1 μm or more and 6.3 μm or less. The surface roughness Ra is preferably formed to be 0.4 μm or more, more preferably 1.6 μm or more. The larger the surface roughness Ra is, the more easily the solder 40 can catch on the contact surface 24. Further, it is possible to further suppress the solder 40 from jumping out of the groove portion 23.

[0016] Also, the groove portion 23 is formed larger in the region combining the tip regions B1 and B2 (see FIG. 4), which are regions excluding the groove region A corresponding to the groove portion 23, than the groove region A on the tip surface 22 of the soldering iron tip 20. With such a configuration, since the area of the region excluding the groove region A of the soldering iron tip 20 is sufficiently large, it is possible to prevent a decrease in electrothermal efficiency during soldering.

[0017] Also, as shown in FIGS. 3 and 4, the length D3 between the pair of side surfaces 21, which is the length in one direction (the X-axis direction in this embodiment) of the groove portion 23, is 1 times or more of the diameter D1 (see FIG. 1) of the solder 40. Note that the length D3 is preferably 2 times or more, more preferably 3 times or more of the diameter D1. With such a configuration, it is possible to increase the tolerance for misalignment of the relative positions between the soldering iron tip 20 and the solder 40.

[0018] The control unit 30 is composed of a CPU (Central Processing Unit: processor), ROM (Read Only Memory), RAM (Random Access Memory), storage, a communication interface (I / F), and an input / output interface (I / F). Each component is connected to the others via a bus so that they can communicate with each other.

[0019] In this embodiment, the control device 30 controls, for example, the driving of a robot (not shown) that grips the soldering iron body 12 and a feeding device (not shown) that supplies solder 40 toward the soldering iron tip 20. The control device 30 operates the automatic soldering device 10 automatically. In this embodiment, the storage contains programs and various data for moving the soldering iron tip 20 and supplying solder 40, as well as position information of the contact position and the resting time of the soldering iron tip 20, which are set in advance by the setting unit 34 described later. It may also have functions for controlling the attitude of the soldering iron tip 20, such as the angle, and functions for controlling the temperature of the soldering iron tip 20.

[0020] Figure 6 is a block diagram showing the functional configuration of the control device 30 shown in Figure 1. As shown in Figure 6, the control device 30 includes a detection unit 32, a setting unit 34, a movement control unit 36, and a feed amount control unit 38. The detection unit 32 detects the position of the soldering iron tip 20. Specifically, the detection unit 32 detects the coordinate position of the soldering iron tip 20 in the XYZ direction. The detection unit 32 detects the coordinate position of the soldering iron tip 20 based on, for example, the output from a drive unit (not shown) that drives the soldering iron body 12. Alternatively, the position of the soldering iron tip 20 may be detected based on the output from a known position sensor (not shown), such as a laser sensor.

[0021] The setting unit 34 pre-sets the contact position at which the tip of the solder 40 contacts the contact surface 24, which is the inner surface of the groove 23 (see Figure 5). Specifically, the setting unit 34 sets the coordinate position of the soldering iron tip 20 at which the tip of the solder 40 supplied to the soldering iron tip 20 at a predetermined feed rate contacts the contact surface 24 of the groove 23 of the soldering iron tip 20 as the contact position. Note that the control of the contact position is not limited to the method described above; for example, a sensor that detects contact may be provided, and the feed rate may be controlled according to the sensor's response.

[0022] The movement control unit 36 ​​controls the movement of the soldering iron tip 20 based on the position of the soldering iron tip 20 detected by the detection unit 32. Specifically, the movement control unit 36 ​​moves the soldering iron tip 20 in the XYX direction and the direction of arrow M (see Figure 1) via a drive unit (not shown). In this embodiment, as an example, when the soldering iron tip 20 is in contact position, the movement control unit 36 ​​keeps the soldering iron body 12, i.e., the soldering iron tip 20, stationary for a predetermined time.

[0023] The feed amount control unit 38 controls the amount of solder 40 supplied to the soldering iron tip 20. However, the concept of the present invention is not limited to the above embodiment. For example, the feed amount control unit 38 may feed the solder 40 first, and then the movement control unit 36 ​​may move the soldering iron tip 20 so that it comes into contact with the solder 40.

[0024] Figure 7 is a schematic side view showing a portion of the soldering process of the automatic soldering apparatus 10 in Figure 1, and Figure 8 is a schematic front view from the soldering side showing a portion of the soldering process of the automatic soldering apparatus 10 in Figure 1, as seen from the soldering side. As shown in Figures 7 and 8, the position of the soldering iron tip 20 is controlled by the movement control unit 36 ​​(see Figure 6) so that the tip faces diagonally downward. On the other hand, the feed amount of the solder 40 is controlled by the feed amount control unit 38 when it is supplied toward the soldering iron tip 20, that is, when it is supplied in the direction of arrow E.

[0025] In this embodiment, the movement control unit 36 ​​(see Figure 6) controls the position of the soldering iron body 12, i.e., the soldering iron tip 20, so that the axial direction (E direction) of the solder 40 and the direction of extension of the groove 23 (X direction) are different when the solder 40 is supplied toward the soldering iron tip 20. Specifically, as shown in Figure 8, the angle α between the axial direction (E direction) of the solder 40 and the direction of extension of the groove 23 (X direction) is tilted to be between 45 degrees and 135 degrees. Preferably, the angle α is between 75 degrees and 165 degrees, and more preferably, approximately 90 degrees.

[0026] Furthermore, in this embodiment, as an example, as shown in Figure 7, the angle β between the axial direction (E direction) of the solder 40 and the axial direction P of the soldering iron tip 20 is controlled to be greater than 90 degrees and less than 180 degrees. Here, the axial direction (E direction) of the solder 40 refers to the axial direction of the region of the solder 40 that is linear in shape. The angle β is preferably greater than 100 degrees and less than 170 degrees, and more preferably greater than 120 degrees and less than 150 degrees. By bringing the soldering iron tip 20 and the solder 40 into contact within the above angle range, the groove 23 is more likely to make contact with the solder 40 in a state that is closer to perpendicular, the heat transfer from the soldering iron tip 20 to the solder 40 is stabilized, and the solder can be melted more easily.

[0027] Figure 9 is a flowchart illustrating an example of the control of the automatic soldering apparatus 10 shown in Figure 1. The automatic soldering apparatus 10 is controlled by the control device 30.

[0028] As shown in Figure 9, first, in step S11, the control device 30 supplies solder 40 toward the soldering iron tip 20 at a predetermined feed rate and moves the soldering iron tip 20 toward a predetermined position on the object to be soldered (e.g., a terminal). At this time, the control device 30 controls the position of the soldering iron body 12, i.e., the soldering iron tip 20, so that the axial direction (E direction) of the solder 40 and the direction of extension of the groove portion 23 (X direction) are different. Specifically, the control device 30 controls the angle α (see Figure 8) to be 45 degrees or more and 135 degrees or less, preferably 75 degrees or more and 165 degrees or less, and more preferably approximately 90 degrees. The control device 30 also tilts the soldering iron tip 20 so that the angle β (see Figure 7) is greater than 90 degrees and less than 180 degrees.

[0029] Next, in step S12, the control device 30 applies the soldering iron tip 20 to the solder 40 from above. In step S13, the control device 30 determines whether the solder 40 has come into contact with the inner surface of the groove 23 of the soldering iron tip 20. Specifically, the control device 30 determines that contact has occurred when, for example, the soldering iron tip 20 is in the contact position. In step S13, if the control device 30 determines that the solder 40 has not come into contact with the inner surface of the groove 23 of the soldering iron tip 20 (step S13; NO), it continues the process of step S13 until contact occurs.

[0030] On the other hand, if in step S13 the control device 30 determines that the solder 40 has come into contact with the inner surface of the groove 23 of the soldering iron tip 20 (step S13; YES), then in step S14 the control device 30 stops the soldering iron tip 20. In step S15 the control device 30 determines whether a predetermined time has elapsed. Here, the predetermined time is the time required for the required amount of solder 40 to melt, and is a preset time.

[0031] In step S15, if the control device 30 determines that the predetermined time has not elapsed (step S15; NO), it continues the process of step S15 until the predetermined time has elapsed. On the other hand, in step S15, if the control device 30 determines that the predetermined time has elapsed (step S15; YES), in step S16, the control device 30 moves the soldering iron tip 20.

[0032] Next, in step S17, the control device 30 determines whether or not the soldering of the solder 40 is complete. If the control device 30 determines in step S17 that the soldering of the solder 40 is not complete (step S17; NO), the control device 30 proceeds to step S12 and performs the processing from step S12 onward. On the other hand, if the control device 30 determines in step S17 that the soldering of the solder 40 is complete (step S17; YES), the control device 30 terminates the process.

[0033] (Mechanism of Action and Effects) Next, the effects and advantages of this embodiment will be described.

[0034] In the automatic soldering apparatus 10 according to this embodiment, the axial direction of the solder 40 when it is supplied toward the soldering iron tip 20 is different from the direction of extension of the groove 23 (one direction, X direction). Therefore, since the tip of the solder 40 comes into contact with the inner surface of the groove 23, the solder 40 can come into contact with the inner surface of the groove 23 even if the position of the solder 40 is varied in the direction of extension of the groove 23 (one direction, X direction). This increases the likelihood that the solder 40 will settle into the groove 23, making position control easier.

[0035] As shown in Figure 8, the automatic solder welding apparatus 10 according to this embodiment is tilted such that the angle α between the axial direction (E direction) of the solder 40 and the direction in which the groove portion 23 extends (X direction) is between 45 degrees and 135 degrees, thereby making it easier for the solder 40 to come into contact with the inner surface of the groove portion 23. Furthermore, when the angle α is between 75 degrees and 165 degrees, it is possible to make even easier contact with the inner surface of the groove portion 23, and when the angle α is approximately 90 degrees, it is possible to make even easier contact with the inner surface of the groove portion 23.

[0036] Furthermore, in the automatic soldering apparatus 10 according to this embodiment, the soldering iron tip 20 is applied from above the solder 40, meaning the angle β is less than 180 degrees. Therefore, even if solder residue falls down, it is possible to prevent solder residue from accumulating on the robot that grips the soldering iron body 12.

[0037] Furthermore, in the automatic soldering apparatus 10 according to this embodiment, the length D2 in the direction connecting the bottom 25 of the groove 23 and the edge 26 of the groove 23 on the contact surface 24 where the solder 40 abuts is 50% or more of the diameter D1 of the solder 40. Therefore, the solder 40 can be applied more easily to the contact surface 24 of the groove 23. Also, since the contact area between the soldering iron tip 20 and the solder 40 is increased, the solder 40 melts more easily. When the length D2 is 55% or more of the diameter D1, the solder 40 can be applied even more easily to the contact surface 24 of the groove 23, and the solder melts even more easily. When the length D2 is 60% or more of the diameter D1, the solder 40 can be applied even more easily to the contact surface 24 of the groove 23, and the solder melts even more easily.

[0038] Furthermore, according to the automatic solder welding apparatus 10 of this embodiment, since the surface roughness Ra of the groove portion 23 is 0.1 μm or more and 6.3 μm or less, the solder 40 can be more easily applied to the groove portion 23. This suppresses the solder 40 from spilling out of the groove portion 23. When the surface roughness Ra is 0.4 μm or more, the spillage of solder 40 from the groove portion 23 can be further suppressed, and when the surface roughness Ra is 1.6 μm or more, the spillage of solder 40 from the groove portion 23 can be suppressed even further.

[0039] Furthermore, in the automatic soldering apparatus 10 according to this embodiment, the area of ​​the tip surface 22 of the soldering iron tip 20 is larger than the area of ​​the groove 23 excluding groove region A, i.e., the combined area of ​​tip region B1 and tip region B2. Therefore, the area of ​​the tip surface 22 of the soldering iron tip 20 can be made larger, thereby improving the heating efficiency during soldering.

[0040] Furthermore, in the automatic soldering apparatus 10 according to this embodiment, the length D3 in one direction (X direction) of the tip of the soldering iron tip 20, where the groove portion 23 is formed, is at least 1 times the diameter D1 of the solder 40. Therefore, the allowable range of misalignment in the extending direction (one direction, X direction) of the groove portion 23 of the solder 40 can be increased. If the length D3 is at least 2 times the diameter D1, the allowable range of misalignment in the extending direction (one direction, X direction) of the groove portion 23 of the solder 40 can be increased even further. If the length D3 is at least 3 times the diameter D1, the allowable range of misalignment in the extending direction (one direction, X direction) of the groove portion 23 of the solder 40 can be increased even further.

[0041] Furthermore, in the automatic soldering apparatus 10 according to this embodiment, the angle β between the axial direction of the solder 40 and the axial direction P of the soldering iron tip 20 when the solder 40 is supplied toward the soldering iron tip 20 is greater than 90 degrees and less than 180 degrees. Therefore, the solder 40 can be easily caught in the groove 23. Also, when the angle β is greater than 100 degrees and less than 170 degrees, the solder 40 can be easily caught in the groove 23, and when it is greater than 120 degrees and less than 150 degrees, the solder 40 can be caught in the groove 23 even more easily.

[0042] Furthermore, in the automatic soldering apparatus 10 according to this embodiment, the movement control unit 36 ​​keeps the soldering iron body 12 stationary for a predetermined time when the soldering iron tip 20 is positioned at the contact position where the tip of the solder 40 contacts the inner surface of the groove 23. As a result, the required amount of solder 40 can be efficiently melted in the groove 23.

[0043] (supplementary explanation) In the above embodiment, the length D3 of the groove 23 in one direction is equal to the length between the pair of side surfaces 21. That is, the groove 23 is formed from one side surface 21 to the other side surface 21 of the pair of side surfaces 21, but the groove 23 may also be formed in a portion of the area between the pair of side surfaces 21.

[0044] Furthermore, although the groove 23 is V-shaped in the above embodiment, the technology of this disclosure is not limited to this. The groove 23 may be trapezoidal. Figure 10 is a schematic side view showing a trapezoidal groove 23. As shown in Figure 10, when the groove 23 is trapezoidal, the point on the bottom surface 23A closest to the edge 26 is defined as the bottommost point 25.

[0045] Furthermore, although the groove 23 is V-shaped in the above embodiment, the technology of this disclosure is not limited thereto. The groove 23 may also be arc-shaped. Figure 11 is a schematic side view showing an arc-shaped groove 23. As shown in Figure 11, when the groove 23 is arc-shaped, the length of the arc 27 in the region R of the contact surface 24 including the bottom 25 of the groove 23 and the edge 26 of the groove 23 is defined as the length D2 in the direction connecting the bottom 25 and the edge 26.

[0046] Furthermore, in the above embodiment, one control device 30 is mounted on the automatic soldering apparatus 10, but the technology of this disclosure is not limited to this. For example, it may be mounted on a robot (not shown) that grips the soldering iron body 12 and a feeding device (not shown) that supplies solder 40 toward the soldering iron tip 20. In this case, the detection unit 32, setting unit 34, and movement control unit 36 ​​of Figure 6 are provided on a first control device mounted on the robot, and the feed amount control unit 38 is provided on a second control device mounted on the feeding device. The first control device and the second control device are configured to communicate with each other.

[0047] Although one embodiment of the present disclosure has been described above, the present disclosure is not limited to this embodiment, and the embodiment and various modifications may be used in appropriate combinations, and of course, it can be implemented in various ways without departing from the gist of the present disclosure.

[0048] The following additional information is disclosed regarding the above-described embodiments.

[0049] (Note 1) Soldering iron body and A rod-shaped soldering iron tip is attached to the tip of the soldering iron body, and has a groove formed on its tip surface that extends in one direction. The thread-like solder supplied toward the tip of the soldering iron, Equipped with, An automatic soldering device in which the axial direction of the solder when it is supplied toward the soldering iron tip is different from the direction of the groove. (Note 2) The automatic soldering apparatus according to Appendix 1, wherein the groove portion, on the surface in contact with the solder, has a length in the direction connecting the bottom of the groove portion and the edge of the groove portion that is 50% or more of the diameter of the solder. (Note 3) The automatic soldering apparatus according to Appendix 1 or Appendix 2, wherein the surface roughness of the groove portion is 0.1 μm or more and 6.3 μm or less. (Note 4) An automatic soldering apparatus according to any one of the appendices 1 to 3, wherein the area excluding the groove portion is larger than the area of ​​the groove portion on the tip surface of the soldering iron. (Note 5) An automatic soldering apparatus according to any one of the appendices 1 to 4, wherein the length in one direction of the tip of the soldering iron, in which at least the groove portion is formed, is at least 1 times the diameter of the solder. (Note 6) An automatic soldering apparatus according to any one of the appendices 1 to 5, wherein the angle between the axial direction of the solder and the axial direction of the soldering iron tip when the solder is supplied toward the soldering iron tip is greater than 90 degrees and less than 180 degrees. (Note 7) A detection unit for detecting the position of the soldering iron tip, Based on the position of the soldering iron tip detected by the detection unit, a movement control unit controls the movement of the soldering iron tip. A feed amount control unit that controls the amount of solder fed when supplying the solder towards the soldering iron tip, A setting unit for pre-setting the contact position of the soldering iron tip where the tip of the solder contacts the inner surface of the groove, Furthermore, The automatic soldering apparatus according to any one of the appendices 1 to 6, wherein the movement control unit keeps the soldering iron body still for a predetermined time when the soldering iron tip is in the contact position. [Explanation of Symbols]

[0050] 10. Automatic soldering machine. 12 Soldering iron body 20 soldering iron tips 22 Tip surface 23 Groove 24. Contact surface (the surface that the solder contacts) 30 Control device 32 Detection unit 34. Settings section 36 Movement Control Unit 38 Feed control unit 40 Solder

Claims

1. Soldering iron body and A rod-shaped soldering iron tip is attached to the tip of the soldering iron body, and has a groove formed on its tip surface that extends in one direction. The thread-like solder supplied toward the tip of the soldering iron, Equipped with, An automatic soldering device in which the axial direction of the solder when it is supplied toward the soldering iron tip is different from the direction of the groove.

2. The automatic soldering apparatus according to claim 1, wherein the groove portion, on the surface in which the solder contacts, has a length in the direction connecting the bottom of the groove portion and the edge of the groove portion that is 50% or more of the diameter of the solder.

3. The automatic soldering apparatus according to claim 1, wherein the surface roughness of the groove portion is 0.1 μm or more and 6.3 μm or less.

4. The automatic soldering apparatus according to claim 1, wherein the area excluding the groove portion is larger than the area of ​​the groove portion on the tip surface of the soldering iron.

5. The automatic soldering apparatus according to claim 1, wherein the length in one direction of the tip of the soldering iron, in which at least the groove is formed, is one time or more than the diameter of the solder.

6. The automatic soldering apparatus according to claim 1, wherein the angle between the axial direction of the solder and the axial direction of the soldering iron tip when the solder is supplied toward the soldering iron tip is greater than 90 degrees and less than 180 degrees.

7. A detection unit for detecting the position of the soldering iron tip, Based on the position of the soldering iron tip detected by the detection unit, a movement control unit controls the movement of the soldering iron tip. A feed amount control unit that controls the amount of solder fed when supplying the solder towards the soldering iron tip, A setting unit for pre-setting the contact position of the soldering iron tip where the tip of the solder contacts the inner surface of the groove, Furthermore, The automatic soldering apparatus according to claim 1, wherein the movement control unit causes the soldering iron body to remain stationary for a predetermined time when the soldering iron tip is positioned at the contact position.

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