Speaker sound module for earphones

Abstract

We provide a speaker sound generation module for earphones that can cover the entire frequency range and achieve better sound quality. [Solution] The speaker sound generation module for earphones includes a dynamic sound generation unit 200, a positioning housing 100, and a piezoelectric sound generation unit 300. The dynamic sound generation unit includes a bracket 21, a magnet 22 fixed to the bracket, a voice coil 23, and a diaphragm 24. The bracket is fixed to the positioning housing, and the diaphragm of the dynamic sound generation unit is positioned within the positioning housing. The piezoelectric sound generation unit is fixed to the positioning housing and positioned away from the dynamic sound generation unit. The positioning housing has a cavity 110 located between the dynamic sound generation unit and the piezoelectric sound generation unit. The piezoelectric sound generation unit includes a vibrating piece 31 and a piezoelectric ceramic piece 32 fixed to the vibrating piece. Sound guide holes 30 are formed in both the vibrating piece and the piezoelectric ceramic piece, and an adhesive is provided between the vibrating piece and the positioning housing. The dynamic sound generation unit and the piezoelectric sound generation unit are integrated coaxially in a composite manner.

Description

Technical Field

[0001] The present invention relates to earphones, and specifically to a speaker sound - generating module for earphones.

Background Art

[0002] Chinese Patent Publication No. CN105979420A discloses a dynamic earphone including a housing, a speaker unit, and a circuit board. The speaker unit is provided in the cavity of the housing. The speaker unit includes a magnetic circuit system and a vibration system composed of a diaphragm and a voice coil. When an audio alternating current is input into the voice coil, an alternating magnetic field is generated in the voice coil. The alternating magnetic field interacts with the steady magnetic field of the magnetic circuit system, so that the voice coil is driven to reciprocate axially, and further the diaphragm vibrates to produce sound.

[0003] The solution only adopts a single integrated dynamic sound - generating unit. Since the overall mass of the diaphragm is large and the vibration inertia is high, it is difficult to perform high - speed and fine reciprocating vibrations following a weak high - frequency electrical signal. Also, the linear operating range of the magnetic field in the magnetic circuit of a single dynamic sound - generating unit is concentrated in the mid - low frequency range, and the driving force in the high - frequency range is insufficient. As a result, it is impossible to effectively reproduce the fine details in the high - frequency range or fully express the high notes, and the sound clarity is also low.

Summary of the Invention

Problems to be Solved by the Invention

[0004] The object of the present invention is to provide a speaker sound - generating module for earphones that can cover the high - frequency and mid - low - frequency ranges and has better sound quality.

Means for Solving the Problems

[0005] To achieve the above objective, the present invention employs a speaker sound module for earphones including a dynamic sound unit, further including a positioning housing, wherein the dynamic sound unit includes a bracket, a magnet fixed to the bracket, a voice coil, and a diaphragm, the bracket is fixed to the positioning housing, and the diaphragm of the dynamic sound unit is positioned within the positioning housing, the piezoelectric sound unit is fixed to the positioning housing and positioned away from the dynamic sound unit, the positioning housing has a cavity located between the dynamic sound unit and the piezoelectric sound unit, the piezoelectric sound unit includes a vibrating piece and a piezoelectric ceramic piece fixed to the vibrating piece, both the vibrating piece and the piezoelectric ceramic piece have perforated and interconnected sound conductor holes, and an adhesive is provided between the vibrating piece and the positioning housing.

[0006] This invention utilizes a dynamic sound unit to handle mid-to-low frequency sound generation and a piezoelectric sound unit to handle high frequency sound generation, thereby covering the entire frequency range. This solves the problem of poor high-frequency response with a single dynamic sound unit, resulting in a more balanced sound quality and clearer detail.

[0007] The dynamic sound generation unit in this invention can adopt the structure of any existing dynamic earphone. Piezoelectric ceramic has an extremely fast response speed, high high-frequency analysis capability, and the vibrating element is thin, lightweight, and easy to drive, so it can complement fine details in the high frequencies, has excellent extensibility, and produces high sound clarity. Conductive holes that communicate with each other are made in the vibrating element and the piezoelectric ceramic element, which balances the air pressure within the cavity, prevents the unit from locking up and distorting due to air pressure, allows for smooth transmission of high and low frequencies, ensures phase consistency, reduces partial vibration of the vibrating element, and improves the smoothness of the high frequencies. By installing adhesive, it can serve as adhesive fixation and also as a buffer and damping of vibrations, reducing the influence of the dynamic sound generation unit on the vibrating element and reducing the possibility of the vibrating element and piezoelectric ceramic element breaking when the earphone is dropped or hit. The cavity located between the dynamic sound generation unit and the piezoelectric sound generation unit in this invention provides an acoustic resonance space, optimizes the frequency response curve, makes the sound more natural, and reduces the mutual influence between the vibration of the vibrating element and the vibration of the diaphragm.

[0008] Preferably, the sound guide holes on the vibrating piece and the sound guide holes on the piezoelectric ceramic piece are installed coaxially with the axis of the voice coil.

[0009] With the above setup, the dynamic and piezoelectric sound-producing units form coaxial sound sources, ensuring synchronized radiation and phase consistency of high and low frequencies. Simultaneously, a penetrating central sound guide path is formed, quickly balancing the air pressure in the cavity and reducing vibration distortion and dips in the frequency response. Ultimately, this results in the technical effects of smoother transitions across the entire frequency range, a more accurate sound field, and clearer, more natural sound quality.

[0010] Preferably, one end of the positioning housing is fixed to the bracket of the dynamic sound generation unit, a groove is formed at the other end of the positioning housing, the piezoelectric sound generation unit is located in the groove, the vibrating piece is fixed to the axial groove wall of the groove via the adhesive, and the piezoelectric sound generation unit does not come into contact with the circumferential groove wall of the groove.

[0011] By installing grooves, the precise positioning and assembly of the piezoelectric sound-producing unit can be facilitated. The vibrating element is fixed to the axial groove wall of the groove via adhesive, providing flexible support. Furthermore, because it does not come into contact with the circumferential groove wall of the groove, the degree of freedom of high-frequency vibration of the piezoelectric element is maintained, ensuring high-frequency analytical capability and avoiding situations such as high-frequency distortion caused by low-frequency crosstalk.

[0012] Preferably, the depth of the groove is greater than the thickness of the piezoelectric sound-producing unit, and the plane on which the axial end face of the positioning housing is located is located on the axial side of the plane on which the axial end face of the piezoelectric sound-producing unit is located.

[0013] This invention achieves structural protection against compression, collision, and damage by setting the depth of the groove greater than the thickness of the piezoelectric sound-producing unit, thereby completely concealing the piezoelectric sound-producing unit within the groove. At the same time, it ensures sufficient clearance space for piezoelectric vibrations, allowing high-frequency vibrations to occur freely and without restriction, and furthermore, it allows more air to be utilized as a sound transmission medium.

[0014] Preferably, the positioning housing and the bracket are fitted together, and laterally extending positioning protrusions are formed on the circumferential inner wall of the positioning housing or the circumferential outer wall of the bracket at positions away from their ends, and these positioning protrusions are used to limit the bracket from being inserted excessively into the positioning housing.

[0015] The positioning housing and bracket are interlocked and automatically centered in the circumferential direction, resulting in greater coaxiality. The positioning protrusions act as clear assembly stoppers, preventing the distance between the two sound units from being too large or too small, ensuring product consistency and stable acoustic performance.

[0016] Preferably, a circuit board is provided on the axial side of the bracket, and both the voice coil and the piezoelectric ceramic piece are electrically connected to the circuit board.

[0017] Dynamic and piezoelectric sound-generating units share the same drive circuit, which not only simplifies the overall structure and reduces the module volume, but also improves the reliability of electrical connections, reduces signal loss, and ensures synchronous transmission of high and low frequency signals. [Effects of the Invention]

[0018] This invention has the advantage of being able to cover the entire frequency range and achieve better sound quality by integrating a dynamic sound generation unit and a piezoelectric sound generation unit coaxially. [Brief explanation of the drawing]

[0019] [Figure 1] This is a schematic diagram of the structure of the present invention. [Modes for carrying out the invention]

[0020] The present invention will be further described below in combination with the drawings and specific embodiments.

[0021] As shown in Figure 1, this embodiment discloses a speaker sound generation module for earphones, comprising a positioning housing 100, a dynamic sound generation unit 200, and a piezoelectric sound generation unit 300, the dynamic sound generation unit 200 and the piezoelectric sound generation unit 300 being fixed to both ends of an internal cavity of the positioning housing 100, the dynamic sound generation unit 200 being positioned away from the piezoelectric sound generation unit 300, and the positioning housing 100 having a cavity 110 located between the dynamic sound generation unit 200 and the piezoelectric sound generation unit 300.

[0022] The dynamic sound generation unit 200 includes a bracket 21, a magnet 22 fixed to the bracket 21, a voice coil 23, and a diaphragm 24. The bracket 21 includes an axially extending axial portion 211 and an annular radial portion 212 extending radially. A yoke 25 is fixed inside the bracket 21 with adhesive. The yoke 25 has a hollow structure and has an axially extending yoke support 251. Both the voice coil 23 and the annular magnet 22 are fitted onto the yoke support 251. The voice coil 23 does not come into contact with the yoke 25 or the magnet 22, and a magnetic guide plate 27 is provided on the end face of the magnet 22.

[0023] The voice coil 23 is fixed to the middle of the diaphragm 24, and the outer edge of the diaphragm 24 is fixed to the end face of the protective cover 26. Both the diaphragm 24 and the protective cover 26 are located inside the positioning housing 100. The protective cover 26 is fixed to the inside of the bracket 21 with adhesive. A through hole 261 is provided in the middle of the protective cover 26, which is coaxial with the axis of the voice coil 23. The diameter of the through hole 261 is larger than the diameter of the central hole 250 of the yoke 25. The yoke 25 has a positioning portion 252 located inside the radial portion 212 in the circumferential direction, and the shape of the circumferential outer edge of the positioning portion 252 is the same as the shape of the circumferential inner edge of the radial portion 212.

[0024] The bracket 21 is fixed to the positioning housing 100. The positioning housing 100 and the bracket 21 are fitted to each other and fixed integrally with an adhesive. On the inner wall in the circumferential direction of the positioning housing 100, at a position away from its own end, a positioning protrusion 101 extending inward in the circumferential direction is formed. The positioning protrusion 101 is used to limit the excessive insertion of the bracket 21 into the positioning housing 100, and the bracket 21 is only partially arranged in the positioning housing 100. The positioning protrusions 101 may be installed annularly at equal intervals on the inner wall of the positioning housing 100, or the positioning protrusions 101 may be arranged annularly around the positioning housing 100.

[0025] A concave groove 102 is formed at the end of the positioning housing 100 away from the dynamic sound - generating unit 200. A piezoelectric sound - generating unit 300 is provided in the concave groove 102. The axial depth of the concave groove 102 is 2 - 3 times the total thickness of the piezoelectric sound - generating unit 300. The plane where the axial end face of the positioning housing 100 is located is axially located on the side of the plane where the axial end face of the piezoelectric sound - generating unit 300 is located.

[0026] The piezoelectric sound - generating unit 300 includes a vibrating piece 31 and a piezoelectric ceramic piece 32 fixed to the vibrating piece 31. Through - holes 30 with the same diameter that penetrate and communicate with each other are formed in both the vibrating piece 31 and the piezoelectric ceramic piece 32. The vibrating piece 31 is fixed to the axial groove wall of the concave groove 102 through an adhesive, and both the vibrating piece 31 and the piezoelectric ceramic piece 32 do not contact the circumferential groove wall of the concave groove 102. The sound - guiding holes on the vibrating piece 31, the sound - guiding holes on the piezoelectric ceramic piece 32, the central hole 250 of the yoke 25, and the through - hole 261 of the protective cover 26 are all installed coaxially with the axis of the voice coil 23. The diameter of the sound - guiding hole 30 is larger than the diameter of the through - hole 261.

[0027] A circuit board 28 is provided on the radial portion 212 of the bracket 21, and both the voice coil 23 and the piezoelectric ceramic piece 32 are electrically connected to the circuit board 28. A first wiring groove 103 extending in the axial direction is provided on the circumferential inner wall of the positioning housing 100, and both ends of the first wiring groove 103 pass through both ends of the positioning housing 100. A second wiring groove 213 extending in the axial direction is provided on the circumferential inner wall of the axial portion 211 of the bracket 21, and the second wiring groove 213 passes through the radial portion 212.

[0028] This embodiment has the advantage of being able to cover the entire frequency range and achieve better sound quality by integrating a dynamic sound generation unit and a piezoelectric sound generation unit coaxially.

Claims

1. A speaker sound module for earphones, comprising a dynamic sound unit, further comprising a positioning housing, wherein the dynamic sound unit comprises a bracket, a magnet fixed to the bracket, a voice coil, and a diaphragm, the bracket is fixed to the positioning housing, and the diaphragm of the dynamic sound unit is disposed within the positioning housing, the piezoelectric sound unit is fixed to the positioning housing and disposed away from the dynamic sound unit, the positioning housing has a cavity located between the dynamic sound unit and the piezoelectric sound unit, the piezoelectric sound unit comprises a vibrating piece and a piezoelectric ceramic piece fixed to the vibrating piece, both the vibrating piece and the piezoelectric ceramic piece have perforated and interconnected sound guide holes, and an adhesive is provided between the vibrating piece and the positioning housing.

2. The speaker sound generation module for earphones according to claim 1, characterized in that the sound guide holes on the vibrating piece and the sound guide holes on the piezoelectric ceramic piece are installed coaxially with the axis of the voice coil.

3. The speaker sound module for an earphone according to claim 1, characterized in that one end of the positioning housing is fixed to the bracket of the dynamic sound unit, a groove is formed at the other end of the positioning housing, the piezoelectric sound unit is located in the groove, the vibrating piece is fixed to the axial groove wall of the groove via the adhesive, and the piezoelectric sound unit does not come into contact with the circumferential groove wall of the groove.

4. The speaker sound generation module for earphones according to claim 3, characterized in that the depth of the groove is greater than the thickness of the piezoelectric sound generation unit, and the plane on which the axial end face of the positioning housing is located is located on the axial side of the plane on which the axial end face of the piezoelectric sound generation unit is located.

5. The speaker sound generation module for earphones according to claim 1, characterized in that the positioning housing and the bracket are fitted together, and a laterally extending positioning projection is formed on the circumferential inner wall of the positioning housing or the circumferential outer wall of the bracket at a position away from its own end, and the positioning projection is used to limit the bracket from being excessively inserted into the positioning housing.

6. The speaker sound generation module for earphones according to claim 1, characterized in that a circuit board is provided on the axial side of the bracket, and both the voice coil and the piezoelectric ceramic piece are electrically connected to the circuit board.

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