Wafer transfer system

Abstract

The present invention provides a wafer transfer device that can stably transfer wafers and reduce deformation due to force. [Solution] This invention provides a wafer transfer device that can be connected to a wafer and is equipped with a positioning means for linking the movement of the wafer. The positioning means comprises a main fork arm 3, a tensioning means, and a negative pressure vacuum device 9. A gas flow passage is provided inside the main fork arm, and the negative pressure vacuum device is connected to the gas flow passage. A suction force is generated at the flow opening, and the tensioning means adsorbs and positions the wafer. In this invention, when the fork head 4 is moved so that the wafer is located within the positioning opening and the wafer is in contact with the positioning plate, the operation of the negative pressure vacuum device causes a flat cylindrical body to move in conjunction with the positioning plate before adsorbing the wafer. As the positioning plate moves, a limiting strip is fitted into the clip, and the clip provides a certain auxiliary gripping force to the wafer. Because the wafer is positioned by the suction force, the gripping force received by the wafer is relatively small, the wafer has stability, and deformation due to gripping can be avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and particularly relates to a wafer transfer device.

Background Art

[0002] Wafer processing is an intermediate manufacturing stage in the semiconductor industry chain. It is necessary to place the wafer on a processing table and then perform etching processing. After the etching processing is completed, it is necessary to remove the wafer from the processing table of the etching processing and transfer it to another place.

[0003] In the conventional technology, generally, a robot arm is used to grip the wafer and the wafer is transferred by the movement of the robot arm. However, when the wafer is gripped by the robot arm, the wafer only receives the gripping force from the robot arm. In order to prevent the wafer from separating from the robot arm during transportation, there are certain requirements for the magnitude of the gripping force. Especially when the thickness of the wafer is thin, the wafer is likely to be deformed when receiving the gripping force, so it is necessary to correct the wafer afterwards, which affects the processing efficiency.

Summary of the Invention

[0004] An object of the present invention is to provide a wafer transfer device that can stably transfer a wafer and reduce force-induced deformation. To achieve the above objective, the present invention provides a wafer transfer device that is connectable to a wafer and equipped with a positioning means for linking the movement of the wafer, wherein the positioning means comprises a main fork arm, a fork head, a positioning opening, a tensioning means, and a negative pressure vacuum device, wherein a gas flow passage is provided inside the main fork arm, the fork head is abutted against the end of the main fork arm, a positioning opening is provided in the fork head, the tensioning means is connected to the fork head with one end located in the gas flow passage and the other end located in the positioning opening, a flow port is provided in the tensioning means so that gas can enter the gas flow passage through the flow port, and a negative pressure vacuum device is connected to the gas flow passage so that an attractive force is generated at the flow port (15), and the tensioning means adsorbs and positions the wafer, thereby providing a wafer transfer device.

[0005] Furthermore, the tensioning means comprises a flattened cylindrical body, a blocking plate, a positioning plate, and a notch, wherein the flattened cylindrical body is movably connected to a fork head (4), the blocking plate is fixed to the inner end of the flattened cylindrical body and located in the gas flow passage, the positioning plate is fixed to the outer end of the flattened cylindrical body and located within the positioning opening, the flow port is provided in the positioning plate, and the notch is provided in the flattened cylindrical body, through which the gas flows out and enters the gas flow passage.

[0006] Furthermore, the fork head is provided with an adsorption passage, the flattened cylindrical body is passed through the adsorption passage, and the flattened cylindrical body can move along the axial direction within the adsorption passage.

[0007] Furthermore, the tensioning mechanism is hinged to the end of the positioning plate and further includes a clip for applying gripping force to the wafer.

[0008] Furthermore, the clip is equipped with a limiting strip located within the positioning opening (5), which allows the clip to swing inward as the flattened cylindrical body moves into the gas flow passage.

[0009] Furthermore, a torsion spring is connected between the clip and the positioning plate, and the torsion spring provides a restoring force to the clip, and a rubber layer is provided on the clip.

[0010] Furthermore, a detection means is connected to the positioning means, allowing both to move synchronously. When the positioning means moves in conjunction with the detection means, the detection means measures the wafer in the positioning means.

[0011] Furthermore, the detection means comprises a detection disk, a light-emitting element, and a photoelectric conversion disk, wherein the detection disk is located below the fork head, the light-emitting element is attached to the detection disk and can emit a light ray onto the wafer at the fork head, and the photoelectric conversion disk is located above the wafer and connected to the fork head.

[0012] Furthermore, a straight groove is provided on the workbench, a mating rail is provided within the straight groove, the detection disc can move along the longitudinal direction of the mating rail, and the light-emitting element can perform circumferential motion as the detection disc moves.

[0013] Furthermore, the detection means further comprises a translation base and a translation base connected to a detection disc and a mating rail, allowing the detection disc to move in conjunction with it. A gear transmission means is provided on the translation base, and a rack located in a straight groove is engaged with and connected to the gear transmission means. As the translation base moves linearly in conjunction with the detection disc, the detection disc is rotated by the gear transmission means.

[0014] The beneficial effects of this invention compared to conventional technology are as follows: When the fork head is moved so that the wafer is positioned within the positioning opening and the wafer is in contact with the positioning plate, the operation of the negative pressure vacuum device causes the flattened cylindrical body to move in conjunction with the positioning plate and then adsorb the wafer. As the positioning plate moves, the limiting strip is fitted into the clip, and the clip provides a certain auxiliary gripping force to the wafer. As a result, since the wafer is positioned mainly by the suction force at this time, the gripping force received by the wafer is relatively small, the wafer has stability, and deformation due to gripping can be avoided. [Brief explanation of the drawing]

[0015] [Figure 1] This is a schematic diagram of the overall structure of the present invention. [Figure 2] This is a schematic diagram of the cross-sectional structure of the mechanical fork of the present invention. [Figure 3] This is a schematic diagram of the flattened cylindrical structure of the present invention. [Figure 4] This is a schematic diagram showing the detection means of the present invention connected to a workbench. [Figure 5] This is a schematic diagram of the translational base structure of the present invention. [Figure 6] This is a schematic diagram of the detection disk structure of the present invention. [Figure 7] This is a schematic diagram showing the photoelectric conversion disc of the present invention connected to a forkhead. [Figure 8] This is a schematic diagram showing the translational base of the present invention connected to the main fork arm. [Modes for carrying out the invention]

[0016] In order to further clarify the purpose, solution, and advantages of the embodiments of the present invention, the technical proposal of the embodiments of the present invention will be clearly and completely described below, accompanied by drawings of the embodiments. Clearly, the embodiments described are only a part of the embodiments of the present invention, not all of them. All other embodiments of the present invention obtained by persons skilled in the art without creative work are all within the scope of the present invention.

[0017] Furthermore, in describing this invention, it should be explained that unless explicitly defined or limited, the terms "attachment," "connection," and "connection" should be understood in a broad sense. For example, they may be fixed connections, detachable connections, or integral connections; they may be mechanical connections, electrical connections, direct connections, indirect connections via an intermediate medium, or internal communication between two elements. Those skilled in the art will be able to understand the specific meaning of these terms in this invention depending on the specific situation.

[0018] Referring to Figures 1 and 2, the wafer transfer device comprises a workbench 1 and a positioning means. The positioning means is connected to the workbench 1 by guide rails and is movable on the workbench 1. The positioning means removes the etched wafer and transfers it to the collection area.

[0019] The positioning mechanism comprises a movable arm 2 and a mechanical fork. When these two are brought together, a positioning pickup arm is formed. The workbench 1 is provided with a slide base connected to a guide rail. The movable arm 2 of the positioning pickup arm is fixed to the slide base. As the slide base moves along the guide rail, the mechanical fork moves in conjunction with it. When the mechanical fork comes into contact with the wafer, the wafer can be positioned. Then, by continuously moving the mechanical fork, the etched wafer can be picked up.

[0020] The above-mentioned mechanical fork includes a main fork arm 3 and a fork head 4. The main fork arm 3 abuts against the moving arm 2. The fork head 4 abuts against the end of the main fork arm 3. A positioning opening 5 is provided on the fork head 4, and the wafer can enter into the positioning opening 5 of the fork head 4. Then, by connecting the fork head 4 to the wafer, the positioning of the wafer is realized.

[0021] The positioning of the wafer is adsorption positioning. For example, a gas flow passage 6 is provided in the main fork arm 3, and an adsorption passage 7 is provided in the fork head 4. The adsorption passage 7 communicates with the gas flow passage 6 and the positioning opening 5. A rubber pad is provided in the adsorption passage 7, and the adhesion between the fork head 4 and the wafer is improved by the corresponding rubber pad. A negative pressure vacuum pumping device 9 is connected to the main fork arm 3 by a vacuum pumping line pipe 8. By the operation of the negative pressure vacuum pumping device 9, the air pressure in the gas flow passage 6 and the adsorption passage 7 decreases, and a suction force is generated at the port of the adsorption passage 7, and the wafer is adsorbed and positioned. Note that the negative pressure vacuum pumping device 9 must move synchronously with the moving arm 2. Thereby, it is not necessary to change the length of the vacuum pumping line pipe 8. For example, a tray 10 is provided on the moving arm 2, and the negative pressure vacuum pumping device 9 is provided on the corresponding tray 10.

[0022] However, when the wafer is adsorbed around by the adsorption passage 7, if there is excessive corrosion or other defects around the wafer, it may not be possible to adsorb and position the wafer. Therefore, as shown in Figures 1 to 3, a flat cylindrical body 11 may be provided inside the adsorption passage 7. The inner end of the flat cylindrical body 11 is located inside the gas flow passage 6. The cross-sectional area of ​​the gas flow passage 6 is larger than the cross-sectional area of ​​the adsorption passage 7. The flat cylindrical body 11 can move along the axial direction inside the adsorption passage 7, but a sealing material pad is connected between the adsorption passage 7 and the flat cylindrical body 11, and a blocking plate 12 is fixed to the inner end of the flat cylindrical body 11. The blocking plate 12 is located inside the gas flow passage 6, and there is a gap between its edge and the inner wall of the gas flow passage 6. Initially, the blocking plate 12 blocks the adsorption passage 7. When the negative pressure vacuum device 9 is activated at this time, it can be linked to move the flat cylindrical body 11 into the gas flow passage 6. A notch 13 is provided in the flattened cylindrical body 11. When the blocking plate 12 blocks the adsorption passage 7, the notch 13 is located inside the adsorption passage 7. When the flattened cylindrical body 11 moves into the gas flow passage 6, the notch 13 can be exposed. At this time, the airflow can enter from the outer end of the flattened cylindrical body 11 and flow through the notch 13 into the flow passage. When the entire wafer is placed inside the positioning opening 5 and comes into contact with the outer end of the flattened cylindrical body 11, the wafer can be adsorbed and positioned.

[0023] In order to ensure that the wafer is positioned, an arc-shaped positioning plate 14 is provided at the outer end of the flat cylindrical body 11. The positioning plate 14 covers the gap port between the flat cylindrical body 11 and the suction passage 7. A circulation port 15 is provided in the positioning plate 14. When the negative pressure vacuum drawing device 9 operates, a suction force is generated at the circulation port 15. At this time, the flat cylindrical body 11, the positioning plate 14, and the closing plate 12 constitute a tensioning means. Air can enter the flat cylindrical body 11 through the circulation port 15. Clips 16 are hinged to both ends of the positioning plate 14. A rubber layer is provided on the inner surface of the clip 16. The thickness of the rubber layer is 1 to 3 mm. The clip 16 is located within the positioning opening 5 of the fork head 4. A limiting strip 17 is further provided in the positioning opening 5. There are two strips 17, which are respectively located on the sides of the positioning plate 14. The strip 17 is located in the moving path of the clip 16. During the process of the flat cylindrical body 11 moving into the gas flow passage 6, the positioning plate 14 can be moved in conjunction. Accordingly, the clip 16 is synchronously moved and contacts the corresponding limiting strip 17. Due to the limiting function of the limiting strip 17, the clip 16 can swing inward. That is, the distance between the two clips 16 becomes smaller. At this time, by the clip 16 gripping the wafer, the stability of the wafer can be improved. A torsion spring is connected to the location where the clip 16 and the positioning plate 14 are hinged. The torsion spring provides a restoring force to the clip 16. That is, when the two clips 16 grip the wafer, the torsion spring begins to deform and a restoring force is generated. When the limiting function of the limiting strip 17 disappears, the two clips 16 are restored by the restoring force of the torsion spring. During this process, the distance between the two clips 16 increases, so that the wafer can be loosened. At the same time, by stopping the operation of the negative pressure vacuum drawing device 9, the suction positioning of the wafer can be stopped.

[0024] A compression return spring 18 is fitted onto the flattened cylindrical body 11. The compression return spring 18 is located between the positioning plate 14 and the suction passage 7 of the fork head 4. When the negative pressure vacuum device 9 is activated, moving the flattened cylindrical body 11 compresses the compression return spring 18. At this time, the compression return spring 18 has a return force. After the operation of the negative pressure vacuum device 9 stops, the flattened cylindrical body 11 returns to its original position due to the return force of the compression return spring 18. At this time, the clip 16 loosens the wafer in accordance with the return force of the torsion spring.

[0025] The fork head 4 moves the wafer, causing the slide base to move, which in turn moves the wafer. During this process, the detection means can regularly measure the wafer.

[0026] As shown in Figures 1, 4 to 6, the detection means is provided on the workbench 1. Specifically, the workbench 1 is provided with a straight groove 19, and when the slide base moves, the fork head 4 can be moved above the straight groove 19. In other words, the fork head 4 moves along the longitudinal direction of the straight groove 19. By providing the detection means within the straight groove 19, the detection means is used to inspect the wafer on the fork head 4.

[0027] The detection method proposed in this technology is primarily intended to inspect the regularity of the wafer, that is, to detect warping after etching and problems such as edge over-etching.

[0028] As shown in Figures 4 to 7, the detection means includes a mating rail 20 provided in a straight groove 19. The mating rail 20 extends along the longitudinal direction of the straight groove 19. A translation base 21 is provided on the mating rail 20. The translation base 21 is connected to the mating rail 20 and can move the mating rail 20. A detection disk 22 is detachably connected to the translation base 21. A light-emitting element 23 is provided on the detection disk 22. The light-emitting element 23 emits a light beam onto the wafer and, in accordance with the operation of a photoelectric conversion disk 24 provided above the wafer, can detect whether the wafer is circular. If the wafer is detected as not being circular, it is indicated that deformation or over-etching occurs in the wafer.

[0029] Specifically, the detection disk 22 comprises a disc body 44. A light-emitting element 23 is mounted on the disc body 44, and the light-emitting element 23 can emit a light ray. The straight-line distance from the light-emitting element 23 to the center of the disc body 44 is equal to the radius of the wafer, and at this time, the wafer and the disc body 44 are coaxial. In other words, the light ray emitted from the light-emitting element 23 can be emitted to the edge of the wafer. At this time, the light ray is blocked by the edge of the wafer and cannot be received by the photoelectric conversion disk 24, and the photoelectric conversion disk 24 cannot produce an electrical signal output. If the wafer is already deformed (for example, warped), the wafer will not be circular but elliptical. At this time, when the detection disk 22 rotates, the light-emitting element 23 performs circumferential motion, and if the wafer is circular, the wafer can block the light ray. On the other hand, if the wafer is deformed, at a certain position it will no longer be able to block the light ray, and the light ray can be emitted to the photoelectric conversion disk 24. At this time, when the photoelectric conversion disk 24 receives a light ray, it converts that energy into an electrical signal and outputs that electrical signal to the display, thereby forming a distribution image on the display. This makes it possible to intuitively display whether the wafer in question is in a satisfactory condition.

[0030] Similarly, detection is possible even if the wafer is over-etched and has a cut edge. The light-emitting element 23 in this proposed technology is preferably an infrared light-emitting element. The photoelectric conversion disk 24 includes an arm support 25. The arm support 25 is connected to the fork head 4 by a tie bar 26. The arm support 25 is provided with a photoelectric detector (e.g., a photodiode) for receiving light rays. Since the original electrical signal from the photoelectric detector is very weak (a minute current of about microamperes or even smaller, or a voltage of about millivolts), a microcover 27 is provided on the upper surface of the arm support 25. A signal amplifier is mounted inside the microcover 27. The signal first passes through the amplifier circuit to be amplified to a level that can be processed by the subsequent circuit. Accordingly, since a processor or microcontroller is provided in the signal amplifier, the amplified signal is transmitted to the processing chip.

[0031] The detection disk 22 and photoelectric conversion disk 24 described above are a kit. When changing wafers, it is also necessary to change the detection disk 22 and photoelectric conversion disk 24. For this reason, positioning pins 28, which have a triangular, square, or polygonal cross-section, are fixed to the underside of the disc body 44. Positioning slots 29 are provided in the translation base 21. The detection disk 22 and the translation base 21 can be connected by inserting the positioning pins 28 into the positioning slots 29. Similarly, the arm support 25 and the tie bar 26 are detachably connected. For example, a square base 30 is fixed to the end of the tie bar 26. The square base 30 is provided with a horizontal through hole and a limiting blind hole. The arm support 25 is provided with a lock rod and a limiting pin. After passing the lock rod through the horizontal through hole, the limiting pin can be inserted into the limiting blind hole. The lock rod is provided with a male screw, and the lock disk is screwed in by the male screw. At this time, the square base 30 is sandwiched between the lock disc and the arm support 25, thereby enabling the attachment of the arm support 25.

[0032] Referring to Figures 4 to 8, the rotation speed of the detection disc 22 is slow to improve the stability of the measurement, so that the detection disc 22 can rotate when the translation base 21 moves linearly within the linear groove 19. Specifically, the translation base 21 is equipped with a rectangular base body 39 having a sliding groove on its bottom surface. The base body 39 is connected in alignment with the mating rail 20. For example, the cross-sections of both the mating rail 20 and the sliding groove are "T" shaped, and a central groove is provided on the upper surface of the base body 39, with a transmission gear disc 31 provided within the central groove. An intermediate gear disc and a lateral gear disc 32 are provided inside the base body 39. The intermediate gear disc is connected to the base body 39 by an intermediate shaft. An outer ring pinion is fixed to the intermediate shaft. The outer ring pinion engages with the transmission gear disc 31. A flattened opening is provided on the vertical side surface of the base body 39, and the edge of the lateral gear disc 32 extends out from the flattened opening. The lateral gear disc 32 is engaged with the intermediate gear disc, and the gear ratio between the two is 5:1, meaning that when the lateral gear disc 32 rotates 5 times, the intermediate gear disc rotates 1 time. The gear transmission means is composed of the transmission gear disc 31, the intermediate gear disc, and the lateral gear disc 32. A rack 33 is provided on the vertical inner surface of the straight groove 19. The rack 33 extends along the longitudinal direction of the straight groove 19 and is engaged with the lateral gear disc 32. As a result, when the base body 39 moves along the mating rail 20, it rotates the lateral gear disc 32 and, in conjunction with it, rotates the intermediate gear disc. A positioning slot 29 is provided at the center of the transmission gear disc 31, and after the detection disc 22 abuts against the transmission gear disc 31, the translation base 21 moves into the straight groove 19, allowing the detection disc 22 to rotate.

[0033] As the translational base 21 moves into the straight groove 19, the mechanical fork is in linear motion. In other words, the mechanical fork and the translational base 21 move simultaneously. For example, a boom 34, which is installed vertically, abuts against the lower surface of the main fork arm 3. A width-adjusting arm, which is connected to the translational base 21, abuts against the lower end of the boom 34. When the main fork arm 3 is moved onto the wafer, the width-adjusting arm applies thrust to the translational base 21, causing both to move synchronously and in the same direction. Conversely, when the main fork arm 3 moves the fork head 4 back in conjunction with it, the width-adjusting arm applies tensile force to the translational base 21, causing both to return to their original positions simultaneously.

[0034] Here, the width-adjusting arm consists of two round bars 35 and one suspension plate 36. The two round bars 35 are parallel to each other and both are mounted horizontally. The mating rail 20 is parallel to the round bars 35. One end of each of the two round bars 35 is fixed to the suspension plate 36, and a return locking plate 37 is fixed between the other ends of the two round bars 35. The suspension plate 36 is fixed to the lower end of the boom 34, and the base body 39 is provided with two guide holes 38. Both guide holes 38 pass through the base body 39. The two round bars 35 are each located in the corresponding guide holes 38. A pressing plate 40 and a positioning base 41 are connected to the two round bars 35. The pressing plate 40 is movably connected to the round bars 35. The base body 39 is positioned between the pressing plate 40 and the return locking plate 37, and each round bar 35 is fitted with a tightening spring 42, which is a spring that has a return force after being compressed. The tightening spring 42 is positioned between the pressing plate 40 and the positioning base 41. The mating rail 20 has a retaining block 43 at its tip, which prevents the base body 39 from detaching from the mating rail 20 when it moves in a straight line.

[0035] Initially, the detection disk 22 on the translational base 21 is located directly below the fork head 4. When the fork head 4 is moved to the wafer (at this point, the wafer has been etched and is located on the processing table), the fork head 4 and the detection disk 22 on the translational base 21 move simultaneously. When the translational base 21 comes into contact with the retaining block 43, the translational base 21 cannot move continuously. At this time, the fork head 4 can move continuously in a straight line, so that the clamping spring 42 is compressed. Subsequently, the fork head 4 can extend into the chamber. When the positioning plate 14 on the fork head 4 comes into contact with the wafer, the wafer is positioned by the operation of the negative pressure vacuum device 9. Then, the return movement of the slide base causes the main fork arm 3 and the fork head 4 to move back in conjunction. In the initial stage of the return movement, the wafer on the fork head 4 cannot be aligned vertically with the detection disk 22. As the main fork arm 3 returns to its original position, the translation base 21 does not move when it begins to return due to the return force of the clamping spring 42. When the return locking plate 37 contacts the translation base 21, the detection disk 22 on the translation base 21 is positioned directly beneath the wafer on the fork head 4. Subsequently, as the main fork arm 3 continues to return to its original position, the translation base 21 moves in conjunction with it within the linear groove 19. In this process, the detection disk 22 on the translation base 21 is rotated, causing the light-emitting element 23 to move in conjunction with it, thereby inspecting the wafer. In other words, wafer inspection can be achieved during wafer transfer, improving processing efficiency.

[0036] In this proposed technology, the movement of the slide base is controlled by a drive mechanism. The drive mechanism is provided on the workbench 1, and specifically, the drive mechanism comprises a drive motor. A synchronous belt is connected to the drive motor by a drive wheel, and a synchronous pulley is provided on the workbench 1. The synchronous belt is simultaneously connected to the drive wheel and the synchronous pulley. At this time, the synchronous belt is in a closed state. The slide base is connected to the synchronous belt by a positioning clamp. The slide base moves in conjunction with the operation of the drive motor. The direction of movement of the slide base can be changed according to the rotation direction of the drive wheel. Ultimately, linear reciprocating motion of the slide base can be achieved.

[0037] To improve safety, an impact bar with a vibration-damping and expandable structure is attached to the slide base, and a blocking seat is provided on the workbench 1. When the slide base moves close to the blocking seat, the impact bar comes into contact with the blocking seat. The blocking seat is equipped with a limit position sensor connected to the drive motor. When the impact bar comes into contact with the blocking seat, the limit position sensor outputs a control signal to the drive motor, stopping the operation of the drive motor and thus preventing damage to the equipment.

[0038] Furthermore, since the upper surface of the detection disk 22 in this proposed technology is not flat but spherical, even if there is residual liquid on the wafer, the residual liquid can fall onto the detection disk 22 and then flow downwards. Note that the bottom area of ​​the detection disk 22 is larger than the upper surface area of ​​the translation base 21. A drainage groove is provided within the straight groove 19. Liquid can be allowed to flow into the drainage groove and finally discharged from the drainage groove. The specific structure of the drainage groove is the same as in conventional technology, so redundant explanations will be omitted.

[0039] The above-described apparatus embodiments are merely outlines; units described as separate elements may or may not be physically separated, elements shown as units may or may not be physical units, they may be located in the same place, or they may be distributed across multiple network units. Some or all of these modules can be selected as needed to achieve the objectives of this embodiment. Those skilled in the art can understand and implement this without requiring creative effort.

[0040] The above embodiments are used merely to illustrate the technical solutions of the present invention, but are not intended to limit them. Although the present invention has been described in detail with reference to the above embodiments, it is possible to modify the technical solutions described in each of the above embodiments or to substitute some of their technical features with equivalents, as can be understood by those skilled in the art. Such modifications or substitutions do not cause the intent of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of each embodiment of the present invention. [Explanation of Symbols]

[0041] 1...Workbench, 2...Moving arm, 3...Main fork arm, 4...Fork head, 5...Positioning opening, 6...Gas flow passage, 7...Adsorption passage, 8...Vacuum line tube, 9...Negative pressure vacuum device, 10...Tray, 11...Flat cylinder, 12...Blocking plate, 13...Notch, 14...Positioning plate, 15...Flow port, 16...Clip, 17...Restriction strip, 18...Compression return spring, 19...Straight groove, 20...Mating rail, 21...Translation base, 22...Detection disc, 23...Light-emitting element, 24...Photoelectric conversion disc, 25...Arm support, 26...Tie bar, 27...Micro cover, 28...Positioning pin, 29...Positioning slot, 30...Square base, 31...Transmission gear disc, 32...Side gear disc, 33...Rack, 34...Boom, 35...Round bar, 36...Suspension plate, 37...Return locking plate, 38...Guide hole, 39...Base body, 40...Pressing plate, 41...Positioning base, 42...Tightening spring, 43...Retaining block, 44...Disc body

Claims

1. A wafer transfer device comprising a workbench (1) and a positioning means that can be connected to a wafer and is linked to the movement of the wafer, The positioning means is The main fork arm (3) has a gas flow passage (6) inside, The fork head (4) is abutted against the end of the main fork arm (3), The positioning opening (5) provided in the fork head (4), A tensioning means is connected to the fork head (4), with one end located within the gas flow passage (6) and the other end located within the positioning opening (5), A flow port (15) is provided in the tensioning means, which allows gas to enter the gas flow passage (6) through the flow port (15), The tensile means is connected to the gas flow passage (6) and generates an attractive force at the flow port (15), and the negative pressure vacuum device (9) that suction positions the wafer by suction, A wafer transfer apparatus equipped with [a specific feature].

2. The aforementioned tensile means is A flat cylindrical body (11) is movably connected to the fork head (4), A blocking plate (12) is fixed to the inner end of the flattened cylindrical body (11) and is located in the gas flow passage (6), A positioning plate (14) is fixed to the outer end of the flattened cylindrical body (11), located within the positioning opening (5), and having the flow port (15) provided therein. The flattened cylindrical body (11) has a notch (13) through which gas flows out and enters the gas flow passage (6), Equipped with, The wafer transfer apparatus according to claim 1.

3. A suction passage (7) is provided in the fork head (4), the flattened cylindrical body (11) passes through the suction passage (7), and the flattened cylindrical body (11) can move along the axial direction within the suction passage (7). The wafer transfer apparatus according to claim 2.

4. The tensioning means further comprises a clip (16) that is hinged to the end of the positioning plate (14) and provides gripping force to the wafer. The wafer transfer apparatus according to claim 2.

5. The clip (16) is fitted with a limiting strip (17) provided within the positioning opening (5), As the flattened cylindrical body (11) moves into the gas flow passage (6), the limiting strip (17) allows the clip (16) to swing inward. The wafer transfer apparatus according to claim 4.

6. A torsion spring is connected between the clip (16) and the positioning plate (14), and the torsion spring provides a restoring force to the clip (16), and a rubber layer is provided on the clip (16). The wafer transfer apparatus according to claim 5.

7. A detection means is connected to the positioning means, and both can move synchronously. When the positioning means moves in conjunction with the detection means, the detection means measures the wafer in the positioning means. The wafer transfer apparatus according to claim 1.

8. The detection means is A detection disc (22) located below the fork head (4), A light-emitting element (23) is attached to the detection disk (22) and is capable of emitting a light beam onto the wafer in the fork head (4), A photoelectric conversion disk (24) is located above the wafer and connected to the fork head (4), Equipped with, The wafer transfer apparatus according to claim 7.

9. A straight groove (19) is provided in the workbench (1), and a mating rail (20) is provided within the straight groove (19). The detection disk (22) can move along the longitudinal direction of the mating rail (20), When the detection disk (22) moves, the light-emitting element (23) can perform circumferential motion. The wafer transfer apparatus according to claim 8.

10. The detection means is A translation base (21) connected to the detection disk (22) and the mating rail (20), which can move the detection disk (22) in conjunction with it, The gear transmission means provided on the translation base (21), Furthermore, A rack (33) located within the straight groove (19) is engaged with and connected to the gear transmission means. As the translation base (21) moves linearly in conjunction with the detection disk (22), the detection disk (22) is rotated by the gear transmission means. The wafer transfer apparatus according to claim 9.

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