Microchannel liquid cooling plate and heat dissipation module having the microchannel liquid cooling plate
Patent Information
- Authority / Receiving Office
- JP · JP
- Patent Type
- Utility models
- Current Assignee / Owner
- 林进东
- Filing Date
- 2026-06-12
- Publication Date
- 2026-08-07
AI Technical Summary
【0023】 本考案のマイクロチャネル液体冷却プレートおよび放熱モジュールにおいて、マイクロチャネル液体冷却プレートにはベースおよび複数のフィンが設けられ、すべてのフィンは、前記ベースに一体的に接続され、かつ平行に分布し、前記フィンには、主フィンと、冷媒との接触面積を増大させ、および通路を仕切ることに用いられる副フィンと、が設けられ、前記主フィンは、前記ベースに一体的に接続され、前記副フィンは、前記主フィンに一体的に接続される。本考案は、フィンと冷媒との接触面積を増大させ、副フィンによって元々フィンと隣接するフィンとの間にある単一の通路を複数の通路に仕切ることにより、冷媒の通路を仕切る役割を果たし、冷媒がマイクロチャネル液体冷却プレートと十分に接触でき、熱交換効率が向上し、最終的にマイクロチャネル液体冷却プレートの放熱効率が向上し、それによってAI演算能力の継続的な向上に伴うより高い熱消費電力の放熱ニーズを満たす。
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Abstract
Description
Technical Field
[0001] The present invention relates to the field of liquid cooling technology, and particularly to a microchannel liquid cooling plate and a heat dissipation module having the microchannel liquid cooling plate.
Background Art
[0002] With the rapid development of technologies such as large-scale language models and multimodal AI, the need for computing power in large-scale AI inference and training scenarios has increased rapidly, and rack-type liquid cooling AI systems designed for such high-load scenarios have emerged. Currently, the thermal design power of the core chips of such AI systems has reached the 1400W level, and the power consumption of next-generation chips will exceed 2000W. Since conventional water cooling technology is limited in heat exchange efficiency and thermal resistance control, it has become difficult to meet such stringent heat dissipation needs.
[0003] A microchannel liquid cooling plate (MLCP: Micro-Laminar Cold Plate) is a highly integrated advanced liquid cooling solution and is used to solve the heat dissipation problem of high-power chips. For example, a heat dissipation device equipped with a microchannel liquid cooling circulation system described in Chinese Patent Publication No. CN120201700A can be cited. The heat dissipation effect of the microchannel liquid cooling plate is realized by the combination of three physical effects: a large specific surface area, a forced convection effect, and a thin thermal boundary layer. The microchannels provide a large heat exchange area, continuously remove heat by flowing the coolant at high speed by a pump, significantly reduce the thermal resistance by fine flow, and promote heat exchange. Although the heat dissipation efficiency of the microchannel liquid cooling plate reaches 3 to 5 times that of conventional liquid cooling, there is still room for improvement in the heat dissipation efficiency of existing microchannel liquid cooling plates for needs of ultra-high heat consumption power of 1400W or more.
[0004] Therefore, providing a microchannel liquid cooling plate and a heat dissipation module having the microchannel liquid cooling plate is necessary to overcome the shortcomings of the prior art. [Overview of the project]
[0005] This invention aims to overcome the shortcomings of the prior art by providing a microchannel liquid cooling plate. The microchannel liquid cooling plate increases the contact area between the fins and the coolant, and partitions the coolant passages, thereby improving heat dissipation efficiency and meeting the heat dissipation needs of the increasing thermal power consumption of AI computing capabilities.
[0006] The above objective of this invention is achieved by the following technical means.
[0007] A microchannel liquid cooling plate is provided, comprising a base and a plurality of fins, all of which are integrally connected to the base and distributed in parallel, with the gaps between fins and adjacent fins forming passages for the refrigerant.
[0008] Preferably, the fin is provided with a main fin and a secondary fin used to increase the contact area with the refrigerant and to partition the passage, the main fin being integrally connected to the base and the secondary fin being integrally connected to the main fin.
[0009] Preferably, the end portion of the sub-fin extends toward the side wall of the adjacent main fin.
[0010] Preferably, the sub-fin is a layered structure newly formed by cutting the side surface of the fin, and the main fin is the structure remaining after the fin has been cut to form the sub-fin.
[0011] The plane on which the base is located is defined as the bottom surface, and the plane opposite the bottom surface is defined as the top surface.
[0012] Preferably, the opening of the cutting angle between the sub-fin and the main fin faces the upper surface.
[0013] More preferably, the opening of the cutting angle between the sub-fin and the main fin faces the bottom surface.
[0014] In the cross-section of the fin, the area of the sub-fin is smaller than the area of the main fin.
[0015] By bending the upper ends of all main fins and sealing them against adjacent main fins, an upper closed surface is formed, and by welding this closed surface to the upper cover of the external heat dissipation module, pressure resistance and explosion-proof effects are achieved.
[0016] The region consisting of the upper surfaces of all the fins is defined as the upper region, and this upper region is divided into a plurality of sub-regions, with the dividing line between two adjacent sub-regions being perpendicular to the extension line formed on the fin.
[0017] At least one sub-region exists, and the upper end of the main fin located in the sub-region is bent and sealed against the adjacent main fin to form a partial closed surface. The sub-region of the partial closed surface is defined as a welding region, and the welding region is welded to the upper cover of the external heat dissipation module to achieve pressure resistance and explosion-proof effects for the flow path.
[0018] The sub-region excluding the welding region is defined as an opening region, and a gap is provided between the welding region and the adjacent opening region, and this gap is formed by a notch in the fin.
[0019] Preferably, the notch extends upward from the central part of the fin. Below the gap, the passage at the bottom of the fin passes through.
[0020] This invention aims to overcome the shortcomings of the prior art and provides a heat dissipation module. The microchannel liquid cooling plate of the heat dissipation module increases the contact area between the fins and the coolant and partitions the coolant passages, thereby improving heat dissipation efficiency and meeting the heat dissipation needs of the increasing thermal power consumption of AI computing capabilities.
[0021] The above objective of this invention is achieved by the following technical means.
[0022] The present invention provides a heat dissipation module equipped with the aforementioned micro-channel liquid cooling plate. [Effects of the Invention]
[0023] In the microchannel liquid cooling plate and heat dissipation module of the present invention, the microchannel liquid cooling plate is provided with a base and a plurality of fins, all of which are integrally connected to the base and distributed in parallel, and the fins are provided with main fins and sub-fins used to increase the contact area with the refrigerant and partition the passages, the main fins are integrally connected to the base and the sub-fins are integrally connected to the main fins. The present invention increases the contact area between the fins and the refrigerant and partitions the single passage that originally existed between a fin and an adjacent fin into multiple passages with the sub-fins, thereby partitioning the passages of the refrigerant, allowing the refrigerant to make sufficient contact with the microchannel liquid cooling plate, improving heat exchange efficiency, and ultimately improving the heat dissipation efficiency of the microchannel liquid cooling plate, thereby meeting the heat dissipation needs of the higher heat consumption accompanying the continuous improvement of AI computing power. [Brief explanation of the drawing]
[0024] The present invention will be further explained with reference to the drawings, but the contents of the drawings are not intended to limit the present invention. [Figure 1] This is a schematic diagram of the structure of a microchannel liquid cooling plate equipped with one sub-fin according to Example 1. [Figure 2]It is a schematic structural diagram of a microchannel liquid cooling plate with two auxiliary fins according to Example 1. [Figure 3] It is a schematic structural diagram of a microchannel liquid cooling plate with two auxiliary fins according to Example 1. [Figure 4] It is a schematic structural diagram of a microchannel liquid cooling plate with three auxiliary fins according to Example 1. [Figure 5] It is a schematic structural diagram of a microchannel liquid cooling plate with one auxiliary fin according to Example 2. [Figure 6] It is a schematic structural diagram of a microchannel liquid cooling plate with two auxiliary fins according to Example 2. [Figure 7] It is a perspective schematic diagram of Figure 6. [Figure 8] It is a schematic structural diagram of a microchannel liquid cooling plate with three auxiliary fins according to Example 2. [Figure 9] It is a schematic diagram of the cutting of the cutter of the microchannel liquid cooling plate according to Example 2. [Figure 10] It is a schematic structural diagram of a microchannel liquid cooling plate according to Example 3. [Figure 11] It is a perspective schematic diagram of Figure 10. [Figure 12] It is a perspective schematic diagram of a microchannel liquid cooling plate according to Example 4. [Figure 13] It is a left side view of Figure 12. [Figure 14] It is a perspective schematic diagram of a microchannel liquid cooling plate according to Example 5. [[ID=?]] [Figure 15] It is a left side view of Figure 14.
Embodiments for Carrying Out the Invention
[0025] The technical solution of the present invention will be further described with reference to the following examples.
Examples
[0026] It seems there is a typo in the original text where the tag [[ID=?]] should probably be . If this is the case, the correct translation for that line would be: [Figure 15] It is a left side view of Figure 14. which would then be: [Figure 15] It is a left side view of Figure 14. in the English translation.The microchannel liquid cooling plate, as shown in Figures 1 to 4, is provided with a base 100 and a plurality of fins 200, all of which are integrally connected to the base 100 and distributed in parallel, and the gaps between fins 200 and adjacent fins 200 form coolant passages 700.
[0027] In this invention, "parallel" refers to a situation where the main fins 210 of each fin 200 are parallel to each other (Figure 2) or approximately parallel to each other (Figure 3), or where the secondary fins 220 of each fin 200 are parallel to each other (Figure 2) or approximately parallel to each other (Figure 3) of other fins 200.
[0028] The fin 200 is provided with a main fin 210 and a secondary fin 220 used to increase the contact area with the refrigerant and to partition the passage 700. The main fin 210 is integrally connected to the base 100, and the secondary fin 220 is integrally connected to the main fin 210. All secondary fins 220 of this invention are oriented in the same direction.
[0029] In this invention, the fact that all the sub-fins 220 are oriented in the same direction means that the extension directions of all the sub-fins 220 are perfectly aligned, and there is no situation where some sub-fins 220 are facing upwards, some downwards, or some left and some right. However, it is not strictly required that the angle of attachment between each sub-fin 220 and the main fin 210 be the same, and a certain degree of variation in the attachment angle is acceptable, as shown in Figure 3.
[0030] The end portion of the sub-fin 220 extends toward the side wall of the adjacent main fin 210. The sub-fin 220 is a layered structure newly formed by cutting the side surface of the fin 200, while the main fin 210 is the structure remaining after cutting the fin 200. The sub-fin 220 of this invention is formed by cutting a part of the side surface of the fin 200 with a cutting machine, and therefore the method of forming the fin 200 of this invention is simple.
[0031] In the cross-section of fin 200, the area of the secondary fin 220 is smaller than the area of the main fin 210. The relationship between the area of the secondary fin 220 and the area of the main fin 210 ensures the connection strength between fin 200 and base 100 and improves the overall stability of fin 200.
[0032] The plane on which the base 100 is located is defined as the bottom surface, and the plane opposite the bottom surface is defined as the top surface. The opening of the cutting angle between the sub-fin 220 and the main fin 210 faces the top surface.
[0033] In this embodiment, the number of sub-fins 220 on the same main fin 210 may be 1, 2, 3, 4, 5, 8, 10, 20, etc., and the specific number is set according to the actual needs. When there is one sub-fin 220, it is as shown in Figure 1. When there are two sub-fins 220, it is as shown in Figure 2. When there are three sub-fins 220, it is as shown in Figure 4.
[0034] The cutting direction when the cutting machine cuts the main fin is defined as forward. Before cutting the main fin 210, the cutting machine first cuts from the front, machining the sub-fin 220 onto the upper surface of the structure on which the main fin 210 is provided. After machining the sub-fin 220, the machine then cuts the main fin 210.
[0035] The microchannel liquid cooling plate increases the contact area between the fins 200 and the refrigerant, and the sub-fins 220 divide the single passage 700 originally between the fins 200 and adjacent fins 200 into multiple passages 700, thereby dividing the refrigerant passages 700. This allows the refrigerant to make sufficient contact with the microchannel liquid cooling plate, improving heat exchange efficiency and ultimately increasing the heat dissipation efficiency of the microchannel liquid cooling plate, thereby meeting the heat dissipation needs of the higher heat consumption associated with the continuous improvement of AI computing power. [Examples]
[0036] This is a microchannel liquid cooling plate, with the same other features as in Example 1, except that, as shown in Figures 4 to 8, the opening of the cutting angle between the sub-fin 220 and the main fin 210 faces the bottom surface.
[0037] In this embodiment, the cutting machine has two cutters, and the cutting directions of the two cutters are different. Furthermore, the cutting direction when the cutting machine cuts the main fin is defined as forward. Before cutting the main fin 210, the first cutter of the cutting machine first cuts from the rear, cutting out the sub-fin 220 from the upper surface of the structure on which the main fin 210 is provided. After the sub-fin 220 has been cut out, the second cutter of the cutting machine cuts the main fin 210. As shown in Figure 9, the two arrows on the right in Figure 9 indicate the cutting direction of the first cutter, and the arrow on the left indicates the cutting direction of the second cutter.
[0038] In this embodiment, the number of sub-fins 220 on the same main fin 210 may be 1, 2, 3, 4, 5, 8, 10, 20, etc., and the specific number is set according to the actual needs. When there is one sub-fin 220, it is as shown in Figure 5. When there are two sub-fins 220, it is as shown in Figures 6 and 7. When there are three sub-fins 220, it is as shown in Figure 8.
[0039] Compared to Example 1, this embodiment increases the flexibility of the sub-fin 220, thereby meeting the heat dissipation needs of the increasing thermal power consumption of AI computing power. [Examples]
[0040] The microchannel liquid cooling plate, as shown in Figures 10 and 11, is otherwise identical to that of Embodiment 1, except that the upper ends of all main fins 210 are bent and sealed against adjacent main fins 210 to form an upper closed surface 300, and this closed surface 300 is welded to the upper cover of the external heat dissipation module to achieve pressure resistance and explosion-proof effects.
[0041] Furthermore, the closure surface 300 of this invention can be designed in various structural forms, such as a planar structure, a substantially arc-shaped surface structure where a portion of the area is a planar area, or a stepped structure, depending on the application scene and performance of the liquid cooling plate. Regardless of which structural form is adopted, the upper closure surface 300 must satisfy the requirement of being continuously and gaplessly sealed; otherwise, the functions of preventing the ingress of welding slag and suppressing bulging deformation due to pressure cannot be achieved.
[0042] Compared to Example 1, the upper closing surface 300 of this embodiment is weldable to the structure of the external heat dissipation module, and through its own rigidity and the support and constraint of the external module, it counteracts the outward pressing force caused by the high pressure of the refrigerant, thereby preventing bulging deformation of the microchannel liquid cooling plate due to excessive refrigerant pressure. Furthermore, the upper closing surface 300 acts as a physical partition, preventing welding slag generated during welding from entering the microchannel 700 and blocking the passage 700. In addition, the upper closing surface 300 can form a rigid connection with the upper end of the fin 200, thereby dispersing the refrigerant pressure acting on the fin 200, limiting the displacement of its upper end, and further reinforcing the fin 200, effectively preventing deformation of the fin 200 due to excessive refrigerant pressure. [Examples]
[0043] This is a microchannel liquid cooling plate, which, as shown in Figures 12 and 13, has the same other features as in Example 1, the only difference being that the region consisting of the upper surfaces of all the fins 200 is defined as the upper region.
[0044] The upper region is divided into multiple sub-regions, and the dividing line between two adjacent sub-regions is perpendicular to the extension line formed on the fin 200. At least one sub-region exists, and the upper end of the main fin 210 located in that sub-region is bent and sealed against the adjacent main fin 210 to form a partial closed surface. The sub-region of the partial closed surface is defined as a welding region 400, and the welding region 400 is welded to the upper cover of the external heat dissipation module to achieve pressure resistance and explosion-proof effects for the flow path.
[0045] Compared to Example 1, the welding region 400 in this embodiment is weldable to the structure of the external heat dissipation module, and through its own rigidity and the support constraint of the external module, it counteracts the outward pressing force caused by the high pressure of the refrigerant, thereby preventing bulging deformation of the microchannel liquid cooling plate due to excessive refrigerant pressure. Furthermore, the welding region 400 acts as a physical partition, preventing welding slag generated during welding from entering the microchannel 700 and blocking the passage 700. In addition, the welding region 400 can form a rigid connection with the upper end of the fin 200, dispersing the refrigerant pressure acting on the fin, limiting the displacement of its upper end, and further reinforcing the fin 200, effectively preventing deformation of the fin 200 due to excessive refrigerant pressure. [Examples]
[0046] This is a microchannel liquid cooling plate, and as shown in Figures 14 and 15, it has the same other features as in Example 1, the difference being that the sub-regions excluding the welding region 400 are defined as the opening region 500.
[0047] A gap is provided between the welding area 400 and the adjacent opening area 500. The gap is formed by a notch 600 in the fin 200. The notch 600 extends upward from the center of the fin 200. Below the gap, the passage 700 at the bottom of the fin 200 passes through.
[0048] In comparison with Example 4, this embodiment has a gap between the welding area 400 and the adjacent opening area 500. This gap makes it easier to bend the upper end of the main fin 210 in the welding area 400, while not affecting the main fin 210 in the adjacent opening area 500. [Examples]
[0049] A heat dissipation module is provided, which includes the microchannel liquid cooling plates of Examples 1 to 5.
[0050] The microchannel liquid cooling plate of the heat dissipation module increases the contact area between the fins 200 and the refrigerant, and the sub-fins 220 divide the single passage 700 originally between the fins 200 and adjacent fins 200 into multiple passages 700, thereby dividing the passages 700 for the refrigerant. This allows the refrigerant to make sufficient contact with the microchannel liquid cooling plate, improving heat exchange efficiency and ultimately improving the heat dissipation efficiency of the microchannel liquid cooling plate, thereby meeting the heat dissipation needs of the higher thermal power consumption associated with the continuous improvement of AI computing power.
[0051] Finally, it should be noted that the above embodiments are merely for illustrating the technical solutions of the present invention and do not limit the scope of protection of the present invention. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the present invention. [Explanation of Symbols]
[0052] Figures 1 to 15 include the following components. 100 base 200 fins 210 Main Fins 220 secondary fins 300 Upper closed surface 400 welding area 500 aperture area 600 notches 700 aisle
Claims
1. A microchannel liquid cooling plate is provided with a base and a plurality of fins, all of which are integrally connected to the base and distributed in parallel, and the gaps between fins and adjacent fins form passages for the coolant. The microchannel liquid cooling plate is characterized in that the fins are provided with main fins and sub-fins used to increase the contact area with the refrigerant and partition the passages, the main fins are integrally connected to the base and the sub-fins are integrally connected to the main fins.
2. The microchannel liquid cooling plate according to claim 1, characterized in that all sub-fins are oriented in the same direction.
3. The microchannel liquid cooling plate according to claim 2, characterized in that the end portion of the sub-fin extends toward the side wall of the adjacent main fin.
4. The microchannel liquid cooling plate according to claim 3, characterized in that the sub-fin is a layered structure newly formed by cutting the side surface of the fin, and the main fin is a structure remaining after the sub-fin has been formed by cutting the fin.
5. The plane on which the base is located is defined as the bottom surface, and the plane opposite the bottom surface is defined as the top surface. The opening of the cutting angle between the sub-fin and the main fin faces upward. or The microchannel liquid cooling plate according to claim 3, characterized in that the opening of the cutting angle between the sub-fin and the main fin faces the bottom surface.
6. The microchannel liquid cooling plate according to claim 1, characterized in that, in the cross-section of the fin, the area of the sub-fin is smaller than the area of the main fin.
7. A microchannel liquid cooling plate according to any one of claims 1 to 6, characterized in that the upper ends of all main fins are bent and sealed against adjacent main fins to form an upper closed surface.
8. The region consisting of the upper surfaces of all the fins is defined as the upper region. The upper region is divided into multiple sub-regions, and the dividing line between two adjacent sub-regions is perpendicular to the extension line formed on the fin. A microchannel liquid cooling plate according to any one of claims 1 to 6, characterized in that at least one sub-region exists, the upper end of a main fin is bent in the sub-region and sealed and in contact with an adjacent main fin to form a partially closed surface, and the sub-region of the partially closed surface is defined as a welding region.
9. The sub-region excluding the aforementioned welding region is defined as the opening region. A gap is provided between the welding area and the adjacent opening area, and this gap is formed by the notch in the fin. The aforementioned notch extends upward from the central part of the fin, The microchannel liquid cooling plate according to claim 8, characterized in that the passage at the bottom of the fin penetrates below the gap.
10. A heat dissipation module characterized by being provided with a microchannel liquid cooling plate according to any one of claims 1 to 6.