Heat dissipation devices and domain controllers

Abstract

To provide a heat dissipation device and a domain controller with improved heat dissipation efficiency. [Solution] The domain controller 1000 is equipped with a heat dissipation device 200. The heat dissipation device includes a housing 10, the housing is provided with a cooling chamber 11, a water inlet 12 and a drain port 13 communicating with the cooling chamber, the cooling chamber is used for the flow of coolant, the coolant flows from the water inlet through the cooling chamber and then flows out from the drain port, the cooling chamber includes a first region 111 and a second region 112 along the direction of coolant flow, the flow cross-sectional area of ​​the first region is smaller than the flow cross-sectional area of ​​the second region, the flow cross-section is perpendicular to the direction of coolant flow, and the outer wall of the first region is used for thermal contact with the chip 100.

Description

Technical Field

[0001] The present invention relates to the field of heat dissipation technology, and in particular to a heat dissipation device and a domain controller. Background Art

[0002] As an electronic control unit that implements functions such as driving assistance and intelligent cockpits, vehicle domain controllers are normally integrated with high computing power chips. However, high computing power chips generate a large amount of heat during operation. If heat dissipation is not performed in a timely manner, the chips will overheat, leading to frequency reduction, computing power reduction, deteriorated user experience, and even the domain controller may fail to operate normally. Summary of the Invention Problems to be Solved by the Invention

[0003] To solve the above technical problem, the present invention provides a heat dissipation device and a domain controller, which can improve heat dissipation efficiency. Means for Solving the Problems

[0004] The heat dissipation device according to an embodiment of the first aspect of the present invention is: A heat dissipation device comprising a housing provided with a cooling chamber, and a water supply port and a water discharge port respectively communicating with the cooling chamber, wherein the cooling chamber is provided for flowing of a cooling liquid, the cooling liquid flows out from the water discharge port after flowing through the cooling chamber from the water supply port, along the flowing direction of the cooling liquid, the cooling chamber includes a first region and a second region, the flow cross-sectional area of the first region is smaller than the flow cross-sectional area of the second region, and the flow cross-section is perpendicular to the flowing direction of the cooling liquid, an outer wall of the first region is used for thermal contact with a chip.

[0005] The domain controller according to an embodiment of the second aspect of the present invention comprises: the heat dissipation device according to an embodiment of the first aspect of the present invention, and A circuit board mounted inside the housing chamber of a heat dissipation device, The chip is located between the circuit board and the cooling chamber of the housing and is in contact with the outer wall of the first region of the housing. [Effects of the Invention]

[0006] The heat dissipation device provided by this invention has a first region and a second region in the cooling chamber, and the flow cross-sectional area of ​​the first region is made smaller than the flow cross-sectional area of ​​the second region. As the coolant flows through the cooling chamber and reaches the first region, the flow velocity of the coolant increases due to the reduction in the flow cross-sectional area, removing more heat and thereby improving the heat exchange efficiency. Furthermore, when the chip comes into contact with the outer wall of the first region, the heat exchange efficiency between the coolant and the chip is increased, improving the heat dissipation efficiency. [Brief explanation of the drawing]

[0007] [Figure 1] This is a schematic diagram of the exploded structure of a heat dissipation device provided by some exemplary embodiments of the present invention in an application scenario. [Figure 2] This is a schematic diagram of the first cross-sectional structure of a heat dissipation device provided by some exemplary embodiments of the present invention. [Figure 3] This is a schematic diagram of a second cross-sectional structure of a heat dissipation device provided by some exemplary embodiments of the present invention. [Figure 4] This is a schematic diagram of the enlarged structure at point A in the cross-section of the heat dissipation device shown in Figure 3. [Figure 5] This is a schematic diagram of a third cross-sectional structure of a heat dissipation device provided by some exemplary embodiments of the present invention. [Figure 6] This is a schematic diagram of the contour structure of the heat distribution plate and chip when the heat dissipation device provided by some exemplary embodiments of the present invention is in an application scene. [Figure 7] This is a schematic diagram of the connection structure between the heat distribution plate and the housing in a heat dissipation device provided by some exemplary embodiments of the present invention. [Figure 8]This is a schematic diagram of a partial cross-sectional structure of a domain controller provided by some exemplary embodiments of the present invention. [Figure 9] This is a schematic diagram of a partial cross-sectional structure of a domain controller from a different angle, as provided by some exemplary embodiments of the present invention. [Modes for carrying out the invention]

[0008] To explain the present invention, exemplary embodiments of the present invention will be described in detail below with reference to the drawings. It should be understood that the embodiments described are only some of the embodiments of the present invention, not all embodiments, and that the present invention is not limited to the exemplary embodiments.

[0009] In order to enable those skilled in the art to better understand the technical concept of the present invention, the technical concept in the embodiments of the present invention will be clearly and completely described below, together with the accompanying drawings. However, it is clear that the embodiments described are only a part of the present invention and not all embodiments. All other embodiments obtained based on the embodiments of the present invention, without the creative work of those skilled in the art, shall all fall within the scope of protection of the present invention.

[0010] In this invention, unless otherwise specifically defined and limited, terms such as "connection," "bonding," and "fixing" should be interpreted broadly. For example, a connection may be fixed, detachable, or form a single unit; it may be a direct connection or an indirect connection via an intermediate medium; or it may be internal communication between two elements or an interaction relationship between two elements. However, when a direct connection is specified, it means that the two entities being connected do not establish a connection relationship through an excessive structure, but are connected only through a connecting structure to form a single whole. Those skilled in the art will be able to understand the specific meaning of the above terms in this invention depending on the specific situation.

[0011] Vehicle domain controllers, acting as the brains of intelligent driving, typically integrate high-performance chips, leading to increasingly high power consumption. Addressing the heat dissipation of these domain controllers is an urgent issue that needs to be resolved.

[0012] In related technologies, heat dissipation for domain controllers is typically achieved using pure die-cast aluminum water coolers. However, the low heat exchange efficiency of these water coolers makes it impossible to meet the heat dissipation needs of high-power chips. Alternatively, one method involves soldering high-density fins into the water cooler's flow channels to improve heat exchange efficiency, but this method is costly.

[0013] This invention provides a heat dissipation device and a domain controller, and is used to improve the heat dissipation efficiency of the heat dissipation device without increasing costs.

[0014] Figure 1 is a schematic diagram of the exploded structure of a heat dissipation device provided by some exemplary embodiments of the present invention in an application scene. As shown in Figure 1, the heat dissipation device 200 provided by the present invention includes a housing 10, the housing 10 is provided with a cooling chamber 11, a water inlet 12 and a drain outlet 13 communicating with the cooling chamber 11, the outer wall of the cooling chamber 11 is in contact with the chip 100, the cooling chamber 11 is used to allow coolant to flow, the coolant flows from the water inlet 12 through the cooling chamber 11 and then flows out from the drain outlet 13, the cooling chamber 11 includes a first region 111 and a second region 112 along the direction of coolant flow, the flow cross-sectional area of ​​the first region 111 is smaller than the flow cross-sectional area of ​​the second region 112, the flow cross-section is perpendicular to the direction of coolant flow, and the outer wall of the first region is used to make thermal contact with the chip.

[0015] In the present utility model, the flow cross-sectional area can be understood as the effective cross-sectional area through which the coolant passes when flowing through the cooling chamber 11. As shown in FIG. 1, the flow cross-sectional area of the coolant in the first region 111 is the cross-sectional area of the flowable region of the first region 111 in a direction perpendicular to the flow direction of the coolant. For example, when turbulence columns 15 are provided in the first region 111, the flowable region is a region in the first region 111 that does not correspond to the turbulence columns 15. The flow cross-sectional area of the coolant in the first region 111 is a difference between the inner cross-sectional area of the first region 111 in a direction perpendicular to the coolant flow direction and the outer cross-sectional area of the turbulence columns 15 in a direction perpendicular to the coolant flow direction.

[0016] In the present utility model, thermal contact means that there is a heat conduction path between the heat dissipation device 200 and the chip 100, allowing heat energy to transfer from the high-temperature region (chip 100) to the low-temperature region (heat dissipation device 200), thereby achieving heat dissipation via heat exchange. Since the chip 100 is in contact with the first region 111 of the cooling chamber, when the coolant flows into the cooling chamber 11 through the water inlet 12 and flows out through the water outlet 13, the heat of the chip 100 is transferred to the coolant in the cooling chamber 11 through the outer wall of the first region 111 of the cooling chamber 11, thereby reducing the heat generated by the chip 100 via heat exchange and achieving heat dissipation.

[0017] In some embodiments, the coolant may be an aqueous-based coolant, for example, pure water, deionized water, an ethylene glycol aqueous solution, a propylene glycol aqueous solution, or the like. The coolant may also be a fluorinated liquid; for example, the cooling medium may be an electronic fluorinated liquid, a decafluoro coolant, or the like. In the embodiments of the present utility model, the type of coolant is not limited.

[0018] It should be noted that the present utility model does not limit the number of the first regions 111 and the second regions 112, nor does it limit the arrangement order of the first regions 111 and the second regions 112 in the cooling chamber 11. In one embodiment, the number of the first regions 111 may be set to be the same as the number of chips 100 to be heat-dissipated.

[0019] Based on the heat dissipation device 200 provided by the present invention, a first region 111 and a second region 112 are provided in a cooling chamber, and the flow cross-sectional area of the first region 111 is smaller than the flow cross-sectional area of the second region 112, such that when the cooling fluid flows into the first region 111, the flow velocity of the cooling fluid increases due to the reduction in the flow cross-sectional area, thereby taking away more heat and improving the heat exchange efficiency. Furthermore, when the chip 100 is in contact with the outer wall of the first region 111, the heat exchange efficiency between the cooling fluid and the chip 100 is improved, and the heat dissipation efficiency is enhanced.

[0020] In other words, the outer wall of the cooling chamber 11 is in thermal contact with the chip 100. When the heat from the chip 100 is transferred to the cooling chamber 11, the chip 100 can be regarded as a heat source of the cooling chamber 11. Then, the heat flux density at the position of the cooling chamber 11 adjacent to the chip 100 is higher than the heat flux density at the position far away from the chip 100. Here, the higher the heat flux density, the faster the heat transfer rate. By providing the first region 111 and the second region 112 in the cooling chamber 11, and bringing the first region 111 with a smaller flow cross-sectional area into thermal contact with the chip 100, the first region 111 is closer to the heat source. Accordingly, by providing a smaller flow cross-sectional area of the cooling chamber 11 at a position with a high heat flux density, the heat transfer efficiency between the chip 100 and the cooling fluid in the first region 111 is improved, so that the structure of the cooling chamber 11 can be matched with the change of the heat flux density, the structure of the cooling chamber 11 can be optimized, and the heat dissipation efficiency can be improved.

[0021] In one specific embodiment, one first region 111 and one second region 112 are respectively provided in the cooling chamber 11, and the first region 111 and the second region 112 are continuously arranged between the water supply port 12 and the water discharge port 13.

[0022] As shown in Figure 1, one end of the first region 111 communicates with the water inlet 12, and the second region 112 communicates between the other end of the first region 111 and the drain port 13. The flow path of the coolant flows from the water inlet 12 into the cooling chamber 11, passes through the first region 111 and the second region 112, and then flows out from the drain port 13. As a result, the coolant enters the first region 111 at a high flow velocity, rapidly exchanges heat between the coolant and the tip 100, and accelerates heat dissipation efficiency. Subsequently, as the coolant flows out through the second region 112, the flow velocity decreases due to the large flow cross-sectional area, thereby reducing pressure loss to the drain port 13 and avoiding damage to the heat dissipation device 200.

[0023] Alternatively, in the example shown in Figure 1 where the water inlet 12 and the drain outlet 13 are swapped, one end of the second region 112 communicates with the water inlet 12, and the first region 111 communicates between the other end of the second region 112 and the drain outlet 13. In this case, the flow path of the coolant flows from the water inlet 12 into the cooling chamber 11, passes through the second region 112 and the first region 111, and then flows out from the drain outlet 13. The coolant enters the second region 112 to eliminate inlet turbulence, improves the uniformity of the coolant flow, reduces pressure loss due to abrupt changes in the flow cross-sectional area, and then, when it flows into the first region 111, the flow cross-sectional area decreases, thereby improving the flow velocity, enhancing heat exchange, and improving the heat dissipation efficiency to the tip 100.

[0024] In another specific embodiment, if there are two or more of at least one of the first region 111 or the second region 112 in the cooling chamber 11, the first region 111 and the second region 112 can be arranged alternately between the water inlet 12 and the drain port 13. In this case, the coolant may flow from the first region 111 to the second region 112, or from the second region 112 to the first region 111. The effects of implementing the cases where the coolant flows from the first region 111 to the second region 112, and where the coolant flows from the second region 112 to the first region 111, can be described by referring to the embodiment described above in which the first region 111 and the second region 112 are arranged continuously between the water inlet 12 and the drain port 13, and will not be described again here.

[0025] In one specific embodiment, an example of a technical proposal in which at least one of the first region 111 or the second region 112 in the cooling chamber 11 is two or more will be described.

[0026] In some embodiments, the cooling chamber 11 includes one first region 111 and two second regions 112. In this case, one end of each of the two second regions 112 communicates with a water inlet 12 and a drain port 13, respectively, and the first region 111 communicates between the other ends of the two second regions 112. At this time, the flow path of the coolant flows into the cooling chamber 11 from the water inlet 12, passes through the second region 112, the first region 111, and the second region 112, and then flows out from the drain port 13. The heat exchange is enhanced as the coolant flows through the first region 111 to improve the heat dissipation efficiency to the tip 100, and the flow velocity is reduced by providing the second regions 112 at the water inlet 12 and the drain port 13, optimizing the flow resistance and preventing the generation of turbulent noise at the drain port 13.

[0027] In some embodiments, the cooling chamber 11 includes two first regions 111 and one second region 112. In this case, one end of each of the two first regions 111 communicates with a water inlet 12 and a drain port 13, respectively, and the second region 112 communicates between the other ends of the two first regions 111. At this time, the flow path of the coolant flows into the cooling chamber 11 from the water inlet 12, passes through the first region 111, the second region 112, and the first region 111 again, and then flows out from the drain port 13. The coolant flows through the first region 111 at high speed, dissipating heat from the chip 100 with high heat exchange efficiency, while the flow velocity can be reduced by utilizing the second region 112 to optimize flow resistance and reduce energy loss of the coolant.

[0028] In some embodiments, when the number of both the first region 111 and the second region 112 is two or more, the first region 111 and the second region 112 can be alternately arranged between the water inlet 12 and the drain outlet 13. In this case, the flow path of the coolant includes the alternating arrangement of the first region 111 and the second region 112, forming a periodic flow between the first region 111 and the second region 112, allowing the second region 112 to reduce flow resistance and the first region 111 to improve heat dissipation efficiency.

[0029] In some examples, when the heat dissipation device 200 needs to dissipate heat from at least two chips 100 that are spaced apart, the cooling chamber 11 is arranged with at least two first regions 111 and at least two second regions 112 alternatingly, and the outer wall of each first region 111 is used to make thermal contact with at least one chip 100.

[0030] In one specific embodiment, the number of first regions 111 provided in the cooling chamber 11 may differ from the number of chips 100 that require heat dissipation. For example, if the dimensions of the chips 100 along the direction of coolant flow are large, the chips 100 may be in thermal contact with the outer walls of a plurality of spaced-apart first regions 111 in order to maintain heat exchange efficiency. As can be understood, the space between adjacent first regions 111 is a second region 112, and the heat dissipation efficiency can be improved by the periodic flow of the coolant between the first regions 111 and the second regions 112.

[0031] In some embodiments, the cooling chamber 11 communicates with an external liquid cooling circulation circuit via a water inlet 12 and a drain port 13. As a result, the coolant discharged from the drain port 13 is cooled via the external liquid cooling circulation circuit and then repeatedly supplied to the cooling chamber 11, enabling the circulation of the coolant and reducing the cost of using the coolant.

[0032] In some embodiments, a transition region is provided on the side of the second region 112 that communicates with the first region 111, along the direction of coolant flow, to prevent the formation of large vortices that affect heat exchange efficiency when the coolant flows from the first region 111 to the second region 112. In the direction from the first region 111 to the second region 112, the flow cross-sectional area of ​​the transition region gradually increases, thereby preventing the reduction of the heat exchange area due to large vortices when the coolant flows from the first region 111 to the second region 112, which would affect heat exchange efficiency.

[0033] To make the circulation cross-sectional area of ​​the first region 111 smaller than the circulation cross-sectional area of ​​the second region 112, this can be achieved in several ways, including, but not limited to, the following methods.

[0034] Referring to the schematic diagram of the first cross-sectional structure of the heat dissipation device provided by the exemplary embodiment of the present invention shown in Figure 2, the flow path height d1 of the first region 111 is smaller than the flow path height d2 of the second region 112. Here, by setting the flow path height d1 of the first region 111 to be smaller than the flow path height d2 of the second region 112, it is achieved to set the flow cross-sectional area of ​​the first region 111 to be smaller than the flow cross-sectional area of ​​the second region 112, thereby increasing the heat exchange efficiency of the first region 111.

[0035] Specifically, the flow path height d1 of the first region 111 can be set in the following manner. As shown in Figure 2, a projection 14 is formed on the inner bottom wall of the cooling chamber 11 toward the interior of the cooling chamber 11, and the first region 111 is formed between the projection 14 and the top wall of the cooling chamber 11. By providing the projection 14, the flow path height d1 of the first region 111 can be reduced. Furthermore, the projection 14 is advantageous in improving the overall rigidity of the cooling chamber 11 and improving the deformation resistance capability of the housing 10.

[0036] In some embodiments, the projection of the projection 14 onto the inner bottom wall of the cooling chamber 11 overlaps with the projection of the first region 111 onto the inner bottom wall of the cooling chamber 11.

[0037] In another embodiment, the number of protrusions 14 is multiple, and the multiple protrusions 14 are provided at intervals within the first region 111, thereby increasing the contact area between the coolant and the cooling chamber 11 and improving heat dissipation efficiency.

[0038] In some examples, the direction of protrusion of the projection 14 (coinciding with the height direction h of the cooling chamber 11) is perpendicular to the flow direction of the coolant, so that the projection 14 has little influence on the flow direction of the coolant, reducing the flow resistance of the coolant and increasing the heat exchange efficiency of the coolant in the cooling chamber.

[0039] In the second method, as shown in Figure 3, the heat dissipation device 200 further includes a turbulence column 15 located inside the cooling chamber 11, the turbulence column 15 extending in the height direction h of the cooling chamber 11 to increase the heat exchange efficiency between the coolant and the cooling chamber wall, and the turbulence column 15 is located in the first region 111.

[0040] The turbulence column 15 disrupts the linear motion of the coolant along the extension direction of the first region 111, generating turbulence and improving the heat exchange efficiency between the coolant and the wall of the first region 111 by ensuring sufficient contact between the coolant and the inner wall of the first region 111.

[0041] Here, the dimension of the turbulence column 15 along the height direction h is smaller than the height dimension of the cooling chamber 11, so that the coolant forms a vortex between the top of the turbulence column 15 and the inner top wall of the cooling chamber 11, thereby improving the heat exchange efficiency. Alternatively, the dimension of the turbulence column 15 along the height direction h is equal to the height dimension of the cooling chamber 11, so that the turbulence column 15 can function as a support structure for the first region 111 and increase the structural strength of the cooling chamber 11.

[0042] In some embodiments, the cross-section of the turbulence column 15 in a direction parallel to the flow direction of the coolant is configured to be elliptical, so that in the flow cross-section of the coolant, for the same width dimension, the side walls of the elliptical turbulence column 15 have a larger surface area, thereby increasing the disturbance in the direction of coolant flow and increasing the heat exchange efficiency between the coolant and the walls of the cooling chamber 11.

[0043] Specifically, the turbulence column 15 can be set up in the following manner. The direction in which the major axis of the elliptical turbulence column 15 is located coincides with the flow direction of the coolant, thereby reducing the flow resistance of the coolant and achieving disturbance in the flow direction of the coolant.

[0044] In some embodiments, the turbulence column 15 is integrally molded with the inner wall of the cooling chamber 11, so that the turbulence column 15 and the wall of the cooling chamber 11 are made of the same material. Since contact thermal resistance is the heat conduction resistance caused by microscopic irregularities, gaps, or differences in material properties at the material interface, integrally molding the turbulence column 15 with the inner wall of the cooling chamber 11 greatly enhances the structural continuity between the turbulence column 15 and the wall of the cooling chamber 11, drastically reducing or completely eliminating contact thermal resistance and improving the efficiency of heat transfer to the coolant.

[0045] Method 3, as shown in Figure 3, the heat dissipation device 200 further includes turbulence columns 15 located within the cooling chamber 11, the turbulence columns 15 extending in the height direction h of the cooling chamber 11, the turbulence columns 15 distributed in a first region 111 and a second region 112, and the density of turbulence columns 15 in the first region 111 is greater than the density of turbulence columns 15 in the second region 112. Here, the density of turbulence columns 15 can be understood as the number of turbulence columns 15 provided within the same area of ​​the inner bottom wall of the cooling chamber 11.

[0046] In this invention, by providing a high-density turbulent column 15 in the first region 111, the heat exchange area between the coolant and the first region 111 is increased, the contact time of the coolant in the first region 111 is extended, and the flow direction and velocity of the coolant are changed, thereby increasing the efficiency of the coolant removing heat from the inner wall of the first region 111. By providing a low-density turbulent column 15 in the second region 112, the sudden change in flow velocity when the coolant flows from the second region 112 to the first region 111 is mitigated, and pressure loss can be reduced.

[0047] In this invention, regarding the technical method of providing the turbulence column 15 in the second region 112, one can refer to the embodiment in which the turbulence column 15 is provided in the first region 111 (i.e., method two), which will not be described again here.

[0048] In some specific embodiments, the turbulence columns 15 in the second region 112 can be configured in the following manner. As shown in Figure 3, the turbulence columns 15 are provided in a region adjacent to the first region 111 along the flow direction of the coolant in the second region 112, and their arrangement density is smaller than that of the turbulence columns 15 in the first region 111. This reduces the pressure loss when the coolant flows from the second region 112 to the first region 111 and reduces the cost of providing turbulence columns 15 in the second region 112.

[0049] Figure 4 is a schematic diagram of the enlarged structure of location A in the cross-section of the heat dissipation device shown in Figure 3.

[0050] In some specific embodiments, the turbulence columns 15 in the first region 111 or the second region 112 may be close to a water nozzle (water inlet 12 or drain outlet 13). For example, Figure 4 shows an example where the turbulence columns 15 in the second region 112 are close to the water inlet 12. The turbulence columns 15 in the area close to the water nozzle can be set in the following manner: The density of the turbulence columns 15 in region 11a facing the water nozzle (water inlet 12 or drain outlet 13) along the flow direction of the coolant in the cooling chamber 11 is a first density, and the density of the turbulence columns 15 in regions 11b located on both sides of the water nozzle along the flow direction of the coolant in the cooling chamber 11 is a second density. The first density is smaller than the second density, so that the coolant in region 11a with the first density experiences less interference from the turbulence columns 15, and the coolant can pass through the water inlet 12 or drain outlet 13 quickly. The second density region 11b comes into thermal contact with the inner wall of the cooling chamber 11 due to the action of the turbulence column 15, preventing localized heat dissipation deficiencies within the cooling chamber 11.

[0051] Referring to the example shown in Figure 4, regions 11a and 11b are provided in the vicinity of the water inlet 12 of the cooling chamber 11, and the second density of the turbulent column 15 in region 11b is greater than the first density of the turbulent column 15 in region 11a.

[0052] In some embodiments, the flow cross-sectional area of ​​the first region 111 can be achieved by comprehensively using methods such as adjusting the height of the cooling chamber 11 and providing a turbulence column 15. Accordingly, embodiments that set the height of the cooling chamber 11 and provide a turbulence column 15 within the cooling chamber 11 can be referenced, but will not be described again here.

[0053] In some embodiments, the flow cross-sectional area of ​​the cooling chamber 11 near the water inlet 12 and the flow cross-sectional area of ​​the cooling chamber 11 near the drain outlet 13 are different along the direction of coolant flow.

[0054] In some specific embodiments, the flow cross-sectional area of ​​the cooling chamber near the water inlet 12 is larger than the flow cross-sectional area of ​​the cooling chamber near the drain port 13. As a result, the coolant flows from the water inlet 12 into the region with a larger flow cross-sectional area and flows out to the drain port 13 from the region with a smaller flow cross-sectional area. This reduces turbulence loss when the coolant flows in and improves the heat exchange efficiency in the region near the drain port 13. This is particularly applicable to heat dissipation devices 200 where the first region 111 is close to the drain port 13, or to water supply devices. The flow cross-sectional area of ​​the cooling chamber near the port 12 is smaller than the flow cross-sectional area of ​​the cooling chamber near the drain port 13. As a result, the coolant flows from the water inlet 12 into the area with the smaller flow cross-sectional area and flows out to the drain port 13 from the area with the larger flow cross-sectional area. After the coolant flows into the cooling chamber 11, the flow velocity increases, enhancing the heat exchange efficiency with the cooling chamber 11 and reducing the pressure loss when the coolant flows out of the drain port 13. This is particularly applicable to heat dissipation devices 200 where the first region 111 is close to the water inlet 12.

[0055] In some specific embodiments, the cooling chamber 11 can be obtained in the following manner. As shown in Figure 1, the housing 10 further includes a cover plate 101 and a main housing 102, the main housing 102 being provided with a groove, the cover plate 101 being fitted onto the opening of the groove, and the cooling chamber 11 being formed between the cover plate 101 and the groove. The side wall of the cover plate 101 facing the main housing 102 may be the top wall of the cooling chamber 11.

[0056] Here, the main housing 102 and the cover plate 101 can be integrally formed into a cooling chamber 11 by welding.

[0057] Specifically, the grooves of the main housing 102 can be configured in the following manner. As shown in Figure 3, the grooves may include a first groove and a second groove that are parallel to each other and communicate with each other, where one of the first groove and the second groove communicates with the water inlet 12 and the other communicates with the drain outlet 13. The groove communicating with the water inlet 12 forms a water supply channel with the cover plate 101, and the groove communicating with the drain outlet 13 forms a drain channel with the cover plate 101.

[0058] Figure 5 is a schematic diagram of a third cross-sectional structure of a heat dissipation device provided by some exemplary embodiments of the present invention.

[0059] As shown in Figure 1 or Figure 5, in some embodiments the heat dissipation device 200 further includes a vapor chamber (VC) 20, at least a portion of which is provided on the outer wall of the first region 111, and the vapor chamber 20 is used to make thermal contact with the chip 100 and to transfer the heat on the chip 100 to the coolant in the cooling chamber 11.

[0060] The heat flux density on the surface of the chip 100 is not uniformly distributed, meaning the surface temperature of the chip 100 is not uniform. Therefore, by providing at least a portion of the heat equalization plate 20 on the outer wall of the first region 111, the heat equalization plate 20 is sandwiched between the chip 100 and the outer wall of the first region 111. After the heat from the chip 100 is transferred to the heat equalization plate 20, it is uniformly distributed on the heat equalization plate 20, thereby forming an isothermal heat exchange interface between the heat equalization plate 20 and the wall of the first region 111. This effectively improves the efficiency of heat transfer from the heat equalization plate 20 to the coolant via the wall of the first region 111, thereby improving the efficiency of heat transfer from the chip 100 to the coolant.

[0061] Here, the outer wall of the heat equalization plate 20 is made of a heat-conducting material, and the heat equalization plate 20 utilizes the heat conductivity of the heat-conducting material to form a heat transfer path between the chip 100 and the outer wall of the first region 111, thereby enabling the heat from the chip 100 to be transferred to the first region 111 via the heat equalization plate 20. In some examples, the outer wall of the heat equalization plate 20 can be made of copper or other heat-conducting material, and the present invention is not limited to the material of the heat equalization plate 20.

[0062] In some embodiments, the heat equalization plate 20 is provided on the outer wall of the first region 111 and extends to the outer wall of the second region 112, thereby allowing the heat from the heat equalization plate 20 to be transferred to the coolant through the wall of the second region 112, thereby increasing the thermal contact area between the heat equalization plate 20 and the coolant and improving the heat dissipation efficiency to the chip 100.

[0063] Figure 6 is a schematic diagram of the contour structure of the heat distribution plate and chip in a heat dissipation device provided by some exemplary embodiments of the present invention.

[0064] As shown in Figure 6, in the stacking direction of the heat distribution plate 20 and the chip 100 (referring to the direction perpendicular to the plane of the paper in Figure 6), the dimensions of the heat distribution plate 20 are greater than or equal to the dimensions of the chip 100. By setting the dimensions of the heat distribution plate to be greater than or equal to the dimensions of the chip, the entire area of ​​the chip 100 facing the heat distribution plate 20 can form thermal contact with the heat distribution plate 20, ensuring that all of the heat from the chip 100 is transferred to the heat distribution plate 20 via the contact surface. This avoids the problem of localized heat dissipation deficiency due to heat accumulation in the chip 100 and improves the quality of heat dissipation to the chip 100.

[0065] In some cases, the direction in which the long side of the heat distribution plate 20 is located coincides with the flow direction T1 of the coolant. Alternatively, the direction in which the short side of the heat distribution plate 20 is located coincides with the flow direction T1 of the coolant. By setting a larger dimension of the heat distribution plate 20 along the flow direction T1 of the coolant, the heat dissipation area along the flow direction T1 between the chip 100 and the coolant is increased, improving heat dissipation efficiency and reducing the manufacturing cost of the heat dissipation device 200 to meet high heat dissipation needs.

[0066] One point to explain is that the orientation in which the heat equalization plate 20 is provided on the outer wall of the first region 111 is not limited; it is sufficient that thermal contact can be formed between the entire area of ​​the chip 100 facing the heat equalization plate 20 and the heat equalization plate 20.

[0067] In some embodiments, as shown in Figure 2, the orthographic projection of the heat equalizer 20 onto the bottom wall of the cooling chamber 11 covers the projection of the first region 111 onto the bottom wall of the cooling chamber 11. Here, the orthographic projection of the heat equalizer 20 onto the bottom wall of the cooling chamber 11 refers to the region of the heat equalizer 20 used for thermal contact with the tip 100 or the first region 111.

[0068] According to the above plan, the heat distribution plate 20 is positioned to cover the outer wall of the first region 111 that is in thermal contact with the chip 100. As a result, when the coolant flows through the first region 111, the entire first region 111 exchanges heat with the heat distribution plate 20, maximizing the heat exchange effect of the first region 111, and thereby maximizing the efficiency of the heat dissipation device 200 in dissipating heat from the chip 100.

[0069] As shown in Figure 2, in some embodiments, a recess (not shown) is formed in the outer bottom wall corresponding to the first region 111 of the cooling chamber 11, and the heat equalizer plate 20 is provided in the recess, thereby providing positioning for the heat equalizer plate 20 so that it can be connected to the outer wall of the first region 111. Providing the heat equalizer plate 20 in the recess means that the entire heat equalizer plate 20 is located within the recess, thereby reducing the thickness dimension of the heat equalizer plate 20, shortening the path through which the heat from the chip 100 is transferred to the coolant via the heat equalizer plate 20, and improving the heat transfer efficiency. Alternatively, in the stacking direction between the heat equalizer plate 20 and the chip 100, a part of the heat equalizer plate 20 may be located within the recess and a part may be located outside the recess.

[0070] In some embodiments, the location of the recess can refer to the position where the heat equalization plate 20 is connected to the outer wall of the cooling chamber 11, which will not be described again here.

[0071] Figure 7 is a schematic diagram of the connection structure between the heat equalizer plate and the housing in a heat dissipation device provided by some exemplary embodiments of the present invention. As shown in Figure 7, the heat equalizer plate 20 is welded to the outer wall of the first region 111.

[0072] In some cases, solder, such as tin or wax, is applied to the surface of the heat distribution plate 20 for connection to the recess, and the outer wall of the heat distribution plate 20 and the inner wall of the recess are connected via the solder. Alternatively, the heat distribution plate 20 is press-fitted into the recess.

[0073] It should be noted that the welding or press-fitting described above are merely illustrative examples of connection methods between the heat equalization plate 20 and the outer wall of the first region 111, and the embodiments of the present invention are not limited to connection methods between the heat equalization plate 20 and the outer wall of the first region 111.

[0074] Figure 8 is a schematic diagram of a partial cross-sectional structure of a domain controller provided by some exemplary embodiments of the present invention. As shown in Figures 1 and 8, based on the same idea, the present invention further provides a domain controller 1000, which includes a chip 100, a heat dissipation device 200, and a circuit board 300, the circuit board 300 being mounted in a housing chamber of the housing 10 of the heat dissipation device 200, the chip 100 being located between the circuit board 300 and the cooling chamber 11 of the housing 10, and the chip 100 being in contact with the outer wall of a first region 111 of the housing 10. In the domain controller 1000, the chip 100 is in thermal contact with the first region 111 of the heat dissipation device 200, thereby transferring heat from the chip 100 to the coolant in the cooling chamber 11 via the first region 111 of the heat dissipation device 200, the coolant removing heat from the chip 100, improving the heat dissipation efficiency of the chip 100, and improving the operating performance of the domain controller 1000.

[0075] Here, chip 100 functions as the core computing power hardware of the domain controller 1000 and may be an intelligent driving chip, an intelligent cockpit chip, or another high computing power chip, and the embodiments of this invention are not limited to the type of chip. Of course, there may be multiple chips 100, and this is not limited here.

[0076] It should be explained that the domain controller 1000 corresponds to the concept of the aforementioned heat dissipation device 200 and has the same technical effects as the aforementioned heat dissipation device 200. Furthermore, since the heat dissipation device 200 can improve the heat dissipation efficiency for the chip 100, the chip 100 can operate in an appropriate temperature environment, thereby improving the performance of the domain controller 1000.

[0077] The technical features and embodiments of the domain controller 1000 can be found by referring to the technical proposal for the heat dissipation device 200 described above, and will not be explained again here.

[0078] Here, the housing chamber of the housing 10 is located on the opposite side of the bottom wall of the cooling chamber 11 from the cooling chamber 11.

[0079] In some embodiments, the chip 100 is mounted on a circuit board 300 and connected to an external power supply via the circuit board 300, which is used to supply power to the chip 100 so that the chip 100 can perform its functions.

[0080] Figure 9 is a schematic diagram of a partial cross-sectional structure of a domain controller from a different angle, provided by some exemplary embodiments of the present invention.

[0081] As shown in Figures 1, 8, and 9, in some embodiments, the domain controller 1000 further includes a bracket 400, which is located on the side of the circuit board 300 opposite to the chip 100, and the bracket 400 and the circuit board 300 are connected to the housing 10 via a fastening member 410, thereby sandwiching the chip 100 between the circuit board 300 and a first region 111 of the housing 10.

[0082] According to the above method, when connecting the circuit board 300 and the housing 10 via the fastening member 410, it is necessary to tighten the fastening member 410 in order to increase the thermal contact area between the tip 100 and the outer wall of the first region 111. The fastening member 410 provides a clamping force, reducing the gap between the tip 100 and the outer wall of the first region 111, thereby increasing the reliability of the thermal contact between the tip 100 and the outer wall of the first region 111, and thereby increasing the thermal conduction efficiency. By providing the bracket 400 on the side of the circuit board 300 opposite to the tip 100, the clamping force acts on the bracket 400 during the process of tightening the fastening member 410, avoiding the phenomenon of the circuit board 300 being damaged or broken by the clamping force acting directly on the circuit board 300, and thus ensuring the safety of the circuit board 300. Furthermore, the bracket 400 is provided on the side of the circuit board 300 opposite to the chip 100, providing support to the circuit board 300 when it is subjected to heat or vibration, preventing deformation of the circuit board 300, maintaining the shape of the chip 100, keeping the heat sink gap between the chip 100 and the outer wall of the cooling chamber 11 small, ensuring thermal contact between the chip 100 and the outer wall of the cooling chamber 11, thereby ensuring heat dissipation efficiency for the chip 100.

[0083] In other words, the introduction of the bracket 400 provides a base for tightening the fastening member 410 and applying clamping force, ensuring reliable contact between the heat equalization plate 20, the tip 100, and the outer wall of the first region 111. In embodiments where the heat equalization plate 20 is not introduced, the bracket 400 provides a base for tightening the fastening member 410 and applying clamping force, ensuring reliable contact between the tip 100 and the outer wall of the first region 111, and ensuring reliable heat conduction. That is, the introduction of the bracket 400 ensures that the physical gap between the tip 100 and the outer wall of the cooling chamber 11 is controlled to a minimum range, ensuring efficient heat conduction and not affecting the mechanical reliability of the tip 100. In other words, it ensures a minimum heat sink gap.

[0084] In some specific embodiments, the bracket 400 includes a first portion and a second portion, the first portion being used to pass through the fastening member 410, and the second portion being used to connect the first portion, thereby forming an integrated member between the first and second portions.

[0085] In some embodiments, the fastening member 410 may be a screw, bolt and nut, or other fastening member, and the embodiments of the present invention are not limited to the type of fastening member 410.

[0086] In some embodiments, the heat dissipation device 200 is also referred to as the water cooling plate system for the domain controller 1000 and is used to achieve water-cooled heat dissipation for the domain controller 1000. The water cooling plate system includes a main housing 102, a cover plate 101, a bracket 400, and a heat distribution plate 20.

[0087] Those skilled in the art can make various modifications and variations to the present invention without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application fall within the scope of the claims of the present invention and the equivalent art, the present invention is intended to include these modifications and variations. [Explanation of Symbols]

[0088] 1000 Domain Controllers 100 chips 300 circuit boards 400 bracket 410 Fastening member 20 Soaking plate 14 Protrusion. 200 Heat dissipation device 10 Housing 11 Cooling Chamber 111 First area 112 Second area 12 Water inlet 13 Drain 101 Cover Plate 102 Main Housing 15 Turbulence Column 11a Region facing the water nozzle 11b Regions located on both sides of the water nozzle d1, d2 channel height h (height direction)

Claims

1. A heat dissipation device including a cooling chamber and a housing provided with a water inlet and a drain outlet communicating with the cooling chamber, wherein the cooling chamber is used for the flow of a coolant, and the coolant flows from the water inlet through the cooling chamber and then flows out from the drain outlet, and along the direction of the flow of the coolant, the cooling chamber includes a first region and a second region, the flow cross-sectional area of ​​the first region is smaller than the flow cross-sectional area of ​​the second region, and the flow cross-section is perpendicular to the direction of the flow of the coolant, A heat dissipation device characterized in that the outer wall of the first region is used to make thermal contact with the chip.

2. The heat dissipation device according to claim 1, characterized in that the flow path height of the first region is smaller than the flow path height of the second region.

3. The heat dissipation device according to claim 2, characterized in that a projection is formed on the inner bottom wall of the cooling chamber toward the interior of the cooling chamber, and the first region is formed between the projection and the top wall of the cooling chamber.

4. The heat dissipation device further includes a turbulent column located within the cooling chamber, the turbulent column extending in the height direction of the cooling chamber, The turbulence column is located in the first region, or The heat dissipation device according to claim 1, characterized in that the turbulent columns are distributed in the first region and the second region, and the density of the turbulent columns in the first region is greater than the density of the turbulent columns in the second region.

5. The heat dissipation device according to claim 4, characterized in that the cross-section of the turbulence column is configured to be elliptical along a direction parallel to the flow direction of the coolant.

6. The heat dissipation device according to claim 1, characterized in that the flow cross-sectional area of ​​the cooling chamber at a location close to the water inlet and the flow cross-sectional area of ​​the cooling chamber at a location close to the drain outlet are different, along the flow direction of the coolant.

7. The heat dissipation device further includes a heat equalization plate, The heat dissipation device according to claim 1, characterized in that at least a portion of the heat equalizing plate is provided on the outer wall of the first region, the heat equalizing plate is further used to make thermal contact with the chip, and the amount of heat on the chip is transferred to the coolant in the cooling chamber.

8. The heat dissipation device according to claim 7, characterized in that, in the stacking direction of the heat dissipation plate and the chip, the outer dimensions of the heat dissipation plate are greater than or equal to the outer dimensions of the chip.

9. The heat dissipation device according to claim 7, characterized in that the orthographic projection of the heat uniforming plate onto the bottom wall of the cooling chamber covers the projection of the first region onto the bottom wall of the cooling chamber.

10. The heat dissipation device according to claim 9, characterized in that the cooling chamber has a recess formed in the outer bottom wall corresponding to the first region, and the heat equalization plate is provided in the recess.

11. The heat dissipation device according to claim 1, wherein the housing includes a cover plate and a main housing, the main housing is provided with a groove, the cover plate is fitted to the opening of the groove, and the cooling chamber is formed between the cover plate and the groove.

12. A heat dissipation device according to any one of claims 1 to 11, A circuit board mounted inside the housing chamber of the heat dissipation device, A domain controller characterized by including a chip located between the circuit board and the cooling chamber of the housing, and in contact with the outer wall of a first region of the housing.

13. The domain controller further includes a bracket, the bracket being provided on the circuit board opposite to the chip, The domain controller according to claim 12, wherein the bracket and the circuit board are connected to the housing via fastening members, thereby the chip is sandwiched between the circuit board and a first region of the housing.

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