LED filament and LED filament lamp

Abstract

This application discloses an LED light bulb. [Solution] One of the plurality of LED chips has an electrical connection portion, one end of the conductive portion is connected to the electrical connection portion, the conductive portion has a first bent portion and a second bent portion, the conductive portion extends from the electrical connection portion along a first direction of the LED chip, extends through the first bent portion in a second direction of the LED chip, extends through the second bent portion in a third direction of the LED chip, and the first direction, second direction and third direction are different directions.

Description

[Technical Field]

[0001] This application relates to the technical field of LED lighting devices, and more specifically, to LED filaments and LED filament lamps. [Background technology]

[0002] LED lighting devices have many advantages, such as a long lifespan, small size, energy saving, and low power consumption, and are therefore widely used in the market, gradually replacing conventional incandescent and fluorescent light bulbs.

[0003] Tungsten lamps, as one of the earliest types of electric lighting devices, have a long and extensive track record of use, making them one of the most widely accepted forms of lighting by consumers. However, due to the manufacturing process and materials used, tungsten lamps suffer from low luminous efficiency, significant heat generation, high energy consumption, and an average lifespan of generally 1,000 to 3,000 hours. Currently, LED lighting devices, also known as LED filament lamps, use LED filaments as light-emitting elements and have a form similar to tungsten lamps. Leveraging their superior luminous performance, low energy consumption, long lifespan, and form similar to tungsten lamps, they are rapidly gaining consumer acceptance and are rapidly replacing tungsten lamps in the traditional lighting market and position.

[0004] An LED filament is a light-emitting element that is packaged by arranging and connecting multiple LED chips in a specific direction, and typical LED filaments are striped. In order to make an LED filament as close as a tungsten wire, it is necessary to make the LED filament into a form with an extremely small cross-section. Such a form inevitably challenges structural strength, and especially if the LED filament is flexible and needs to be bent, the LED filament itself or the internal conductive structure may break, making it impossible to conduct electricity or light up.

[0005] As described above, in light of the shortcomings and defects present in conventional LED filament lamps, how to design LED filament lamps to avoid breakage is a technical challenge that those skilled in the art should attempt to solve. [Overview of the project]

[0006] This abstract relates to many embodiments of the present invention. However, the present invention is used only to illustrate some embodiments disclosed herein (whether or not they fall within the scope of the utility model claims) and is not a complete description of all possible embodiments. It has been stated above that several embodiments of each feature or aspect of the present invention can be combined in different ways to form an LED lighting device or part thereof.

[0007] The present invention aims to provide an LED light bulb lamp.

[0008] The lamp includes a lamp housing having a central axis, a lamp head connected to the lamp housing, a stem installed in the lamp housing along the central axis of the lamp housing, two conductive brackets having opposite polarities installed in the lamp housing, a drive circuit installed in the lamp head and electrically connected to the two conductive brackets, and a flexible LED filament installed in the lamp housing and electrically connected to the two conductive brackets, wherein the flexible LED filament includes an LED segment, the LED segment includes a plurality of LED chips connected in series and a light conversion layer enclosing the plurality of LED chips, and a first conductive electrode provided at one of the ends of the LED segment and electrically connected to the plurality of LED chips and one of the two conductive brackets A second conductive electrode is provided, a portion of which is enclosed in the light conversion layer, and which is provided at the other end of both ends of the LED segment and electrically connected to the plurality of LED chips and the other of the two conductive brackets, a portion of which is enclosed in the light conversion layer and electrically connected to a conductive portion between the plurality of LED chips, one of the plurality of LED chips having an electrical connection portion, one end of which is connected to the electrical connection portion, the conductive portion having a first bent portion and a second bent portion, the conductive portion extending from the electrical connection portion along a first direction of the LED chip, extending through the first bent portion in a second direction of the LED chip, and extending through the second bent portion in a third direction of the LED chip, the first direction, the second direction and the third direction being different directions.

[0009] In one embodiment of the present invention, the first direction is the height direction of the LED chip, the second direction is the width direction of the LED chip, and the third direction is the length direction of the LED chip.

[0010] In one embodiment of the present invention, the distance between the first bent portion and the surface of the LED chip is 80 μm to 120 μm, and the distance between the first bent portion and the second bent portion is 100 μm to 120 μm.

[0011] In one embodiment of the present invention, the LED filament further comprises a first solder layer, the first solder layer is made of a solder material, and an end of the conductive portion is located between the electrical connection portion of the LED chip and the first solder layer.

[0012] In one embodiment of the present invention, the projected area of the first solder layer at the electrical connection portion of the LED chip is larger than the projected area of the bonding region between the conductive portion and the electrical connection portion of the LED chip.

[0013] In one embodiment of the present invention, the end of the conductive portion, the electrical connection portion of the LED chip and the first solder layer are integrally formed into a connection portion, the connection portion has a mesh-shaped surface, and a plurality of protrusions and a plurality of recesses are alternately arranged on the mesh-shaped surface.

[0014] In one embodiment of the present invention, the LED filament comprises a second solder layer, the second solder layer is made of a solder material, and an end of the conductive portion is located between the first solder layer and the second solder layer.

[0015] In one embodiment of the present invention, each of the projected area of the first solder layer at the electrical connection portion of the LED chip and the projected area of the second solder layer at the electrical connection portion of the LED chip is larger than the projected area of the bonding region between the first solder layer and the second solder layer at the electrical connection portion of the LED chip between the conductive portion and the LED chip.

[0016] In one embodiment of the present invention, the projected area of the bonding region between the conductive portion and the electrical connection portion of the LED chip is smaller than the projected area of the first solder layer, and the projected area of the first solder layer is smaller than the projected area of the second solder layer.

[0017] In one embodiment of the present invention, the plurality of LED chips further includes a first row of LED chips and a second row of LED chips, the first row of LED chips and the second row of LED chips are connected in parallel, the LED chips in the first row of LED chips are connected in series, the LED chips in the second row of LED chips are connected in series, and the first row of LED chips and the second row of LED chips are alternately arranged along the width direction of the LED filament.

[0018] In one embodiment of the present invention, the LED filament further includes a first conductive portion and a second conductive portion electrically connected between the LED chip and the first conductive electrode, one of both ends of the first conductive portion is connected to the LED chip, the other end of the first conductive portion is connected to the first conductive electrode, one of both ends of the second conductive portion is connected to the first conductive electrode, the other end of the second conductive portion is connected to the LED chip, the first conductive portion first extends downward with the first bending point of the first conductive portion as the first bending point of the first conductive portion, and then extends upward, then extends upward with the second bending point of the first conductive portion as the second bending point of the first conductive portion, and then extends downward, and the second conductive portion first extends upward with the first bending point of the second conductive portion as the first bending point of the second conductive portion, and then extends downward, and thereafter extends downward with the second bending point of the second conductive portion as the second bending point of the second conductive portion, and then extends upward.

[0019] A person skilled in the art can easily understand other aspects and advantages of the present invention from the following detailed description. The following detailed description only shows and describes exemplary embodiments of the present invention. As will be appreciated by those skilled in the art, the content of the present invention allows those skilled in the art to modify the disclosed specific embodiments without departing from the spirit and scope of the invention to which the present invention pertains. Correspondingly, the descriptions in the drawings and specification of the present invention are merely exemplary and not restrictive. [Brief Description of the Drawings]

[0020] The specific features of the invention are shown in the attached utility model claims. The features and advantages of the invention can be better understood by referring to the exemplary embodiments and drawings described in detail below. [Figure 1] Figure 1 is a schematic three-dimensional partial perspective view of an LED filament in one embodiment of the present invention. [Figure 2] Figure 2 is a schematic cross-sectional view of position 2-2 in Figure 1. [Figure 3] Figure 3 is a schematic diagram showing the arrangement of LED chips and electrodes in a different embodiment of the present invention. [Figure 4] Figure 4 is a schematic diagram showing the arrangement of LED chips and electrodes in a different embodiment of the present invention. [Figure 5] Figure 5 is a schematic diagram showing the arrangement of LED chips and electrodes in a different embodiment of the present invention. [Figure 6] Figure 6 is a schematic diagram showing the arrangement of LED chips and electrodes in a different embodiment of the present invention. [Figure 7] Figure 7 is a schematic diagram showing the arrangement of LED chips and electrodes in a different embodiment of the present invention. [Figure 8] Figure 8 is a schematic diagram of the structure of the conductive part in one embodiment of the present invention. [Figure 9] Figure 9 is a schematic diagram of the structure of the second joint in the related technology of the present invention. [Figure 10A] Figure 10A is a schematic diagram of the structure of a ceramic nozzle in a related technology of the present invention. [Figure 10B] Figure 10B is a schematic diagram of the cross-sectional structure of a ceramic nozzle in the related technology shown in Figure 10A of the present invention. [Figure 11A] Figure 11A is a schematic diagram of the structure of a ceramic nozzle in one embodiment of the present invention. [Figure 11B] Figure 11B is a schematic diagram of the cross-sectional structure of a ceramic nozzle in the related technology shown in Figure 11A of this invention. [Figure 12] Figure 12 is a schematic diagram of the structure of the second joint in one embodiment of the present invention. [Figure 13]Figure 13 is a schematic diagram of the structure of a ceramic nozzle in one embodiment of the present invention. [Figure 14] Figure 14 is a schematic diagram of the structure of the second joint in one embodiment of the present invention. [Figure 15A] Figure 15A is a schematic diagram of a ceramic nozzle having two different surface roughnesses in a different embodiment of the present invention. [Figure 15B] Figure 15B is a schematic diagram of a ceramic nozzle having two different surface roughnesses in a different embodiment of the present invention. [Figure 15C] Figure 15C is a schematic diagram of a ceramic nozzle having two different surface roughnesses in a different embodiment of the present invention. [Figure 15D] Figure 15D is a schematic diagram of a ceramic nozzle having two different surface roughnesses in a different embodiment of the present invention. [Figure 16] Figure 16 is a schematic diagram of the structure of the second joint in one embodiment of the present invention. [Figure 17A] Figure 17A is a schematic diagram of the structure of the second joint in one embodiment of the present invention. [Figure 17B] Figure 17B is a schematic cross-sectional view of the second joint shown in Figure 17A in one embodiment of the present invention. [Figure 18A] Figure 18A is a schematic diagram of the structure of the second joint in one embodiment of the present invention. [Figure 18B] Figure 18B is a schematic cross-sectional view of the second joint shown in Figure 18A in one embodiment of the present invention. [Figure 19A] Figure 19A is a schematic diagram showing the cutting position of the second end of the conductive part in the conventional technology. [Figure 19B] Figure 19B is a schematic diagram showing the cutting position of the second end of the conductive part in the conventional technology. [Figure 20] Figure 20 is a schematic diagram of the structure of the first joint in the prior art of the present invention. [Figure 21] Figure 21 is a schematic diagram of the structure of the first joint in one embodiment of the present invention. [Figure 22A]Figure 22A shows schematic diagrams of the first end portion of the corresponding conductive part from different viewing angles in the prior art. [Figure 22B] Figure 22B shows schematic diagrams of the first end portion of the corresponding conductive part from different viewing angles in the prior art. [Figure 23A] Figures 23A and 23B are schematic diagrams of the first end of the corresponding conductive portion in one embodiment of the present invention. [Figure 23B] Figure 23B is a schematic diagram of a portion of the first end of a corresponding conductive part in one embodiment of the present invention. [Figure 24A] Figure 24A is a schematic diagram of the partial structure of an LED filament from a different viewing angle in one embodiment of the present invention. [Figure 24B] Figure 24B is a schematic diagram of the partial structure of an LED filament at a different viewing angle in one embodiment of the present invention. [Figure 25] Figure 25 shows the inclined arrangement of LED chips in one embodiment of the present invention. [Figure 26] Figure 26 is a schematic diagram of the connection structure between an electrode and an LED chip in one embodiment of the present invention. [Figure 27A] Figure 27A is a schematic diagram of a structure in which an LED chip and its corresponding electrode are connected via two conductive parts at different viewing angles in one embodiment of the present invention. [Figure 27B] Figure 27B is a schematic diagram of a structure in which an LED chip and its corresponding electrode are connected via two conductive parts at different viewing angles in one embodiment of the present invention. [Figure 27C] Figure 27C is a schematic diagram of a structure in which an LED chip and its corresponding electrode are connected via two conductive parts at different viewing angles in one embodiment of the present invention. [Figure 28] Figure 28 is a schematic diagram of a light bulb lamp using the LED filament shown in Figures 1 to 27A, according to one embodiment of the present invention. [Modes for carrying out the invention]

[0021] Embodiments of the present invention will be described below with reference to specific examples, and those skilled in the art will be able to easily understand other advantages and effects of the present invention from the contents disclosed herein.

[0022] The following description refers to the drawings, which illustrate several embodiments of the present invention. It should be understood that other embodiments may be used, and that modifications to the configuration of modules and units, as well as electrical and operational changes, are possible without departing from the spirit and scope of this disclosure. The following detailed description is not intended to be restrictive, and the scope of embodiments of the present invention is limited solely by the claims of the utility model registration application. The terms used herein are for the purpose of describing specific embodiments and are not intended to limit the present invention in any way.

[0023] In some examples, terms such as first, second, etc. may be used herein to describe various elements or parameters, but it should be understood that these elements or parameters should not be limited by these terms. These terms are used only to divide one element or parameter into another element or parameter. For example, a first electrical connection may be called a second electrical connection, and similarly, a second electrical connection may be called a first electrical connection without departing from the scope of various embodiments. Both the first electrical connection and the second electrical connection describe the same electrical connection, but they are not the same electrical connection unless the context otherwise clearly indicates. Similarly, this further includes a first joint and a second joint, a first bend and a second bend, and a first inflection and a second inflection.

[0024] As used herein, the terms “or” and “and / or” are to be interpreted as encompassing or any combination thereof. Accordingly, “A, B or C” or “A, B and / or C” means any one of A, B, C, A and B, A and C, B and C, with exceptions to this definition occurring only when combinations of elements, functions, steps, or operations of A, B, and C are intrinsically mutually exclusive in some way.

[0025] When an element is said to be "on top of" or "extending over" another element, for example, when an element of a layer, region, or substrate is said to be "in" or "extending over" another element, the element may be directly in or directly extending over another element, or an intermediate element may exist. Conversely, when an element is said to be "in" or "extending directly over" another element, no intermediate element exists. Furthermore, when an element is said to be "connected" or "linked" to another element, it should be understood that it may be directly connected or linked to the other element, or an intermediate element may exist. Conversely, when an element is said to be "directly connected" or "directly linked" to another element, no intermediate element exists.

[0026] In this specification, relative terms such as “downward,” “upward,” “upper,” “lower,” “horizontal,” and “vertical” may be used to describe the relationship between one element, layer, or region and another element, layer, or region as shown in the figures. It is understood that these terms are intended to cover different device orientations other than those depicted in the drawings. In this invention, “vertical,” “horizontal,” and “parallel” are defined as situations including a standard defined basic ±10%. For example, vertical usually means that the angle with respect to the reference line is 90 degrees, but in this invention, vertical includes cases between 80 and 100 degrees.

[0027] The terms used herein are for the purpose of describing specific embodiments and are not intended to limit the present invention. Where used herein, unless the context otherwise explicitly states, the singular forms “one kind,” “one,” and “the one” are intended to include the plural form. Furthermore, where used herein, the terms “include,” “contain,” “include,” and / or “include” specify the presence of the described features, integers, steps, operations, elements, and / or components, but should be understood not to exclude the presence or increase of one or more other features, integers, steps, operations, elements, components, and / or combinations thereof.

[0028] Unless otherwise specified, all terms used herein (including technical and scientific terms) have the same meaning as those generally understood by those skilled in the art. Furthermore, terms used herein should be interpreted as having the same meaning as their meanings in the context of this specification and in the relevant fields, and should not be interpreted in an idealized or overly formal sense unless expressly limited herein.

[0029] Unless otherwise specified, a relatively large number of terms (e.g., "greater than or equal to" and "less than or equal to") are intended to cover the concept of equality. For example, "greater than or equal to" can represent not only "greater than" in a mathematical sense, but also "equal to."

[0030] This invention discloses an LED filament that has a certain degree of bendability as a light-emitting element and can be bent into the required shape and placed in the lighting 12. For example, the LED filament disclosed in this invention can be applied to an LED light bulb lamp or other LED filament lamps.

[0031] Referring to Figures 1 and 2, Figure 1 shows a schematic perspective partial view of an LED filament in one embodiment of the present invention, and Figure 2 shows a schematic cross-sectional view of position 282 in Figure 1. As shown in Figures 1 and 2, the LED filament 10 includes at least one LED chip (at least two LED chips 101, 102 are shown in the figure), at least one electrode (at least two electrodes 103, 104 are shown in the figure), a light conversion layer 105 (in a particular embodiment, the light conversion layer may be called an adhesive layer or a silica gel layer), and a conductive portion 106, wherein adjacent LED chips are connected to each other via the conductive portion 106 to achieve electrical conductivity, and the LED chips and electrodes (103, 104) are connected to each other via the conductive portion 106 to achieve electrical conductivity. The light conversion layer 105 encloses at least a portion of the LED chips (101, 102), the conductive portion 106, and the electrodes (103, 104).

[0032] Here, the LED filament 10 can emit light after its electrodes (103, 104) are connected to a power source (voltage source or current source). As shown in Figures 1 and 2, the cross-section of the LED filament 10 is set to be rectangular, but the cross-sectional shape of the LED filament 10 is not limited to this and may be triangular, circular, elliptical, polygonal, or rhombus, or it may be an irregular shape such as a square with chamfered or filleted corners.

[0033] In one embodiment, the photoconversion layer 105 includes silica gel and fluorescent powder, and may further include heat dissipation particles. The heat dissipation particles are, for example, oxidized nanoparticles, and include, but are not limited to, nanoparticles formed from materials such as aluminum oxide (Al2O3), silicon dioxide (SiO2), zirconium oxide (ZrO2), titanium dioxide (TiO2), calcium oxide (CaO), strontium oxide (SrO), and barium oxide (BaO).

[0034] In one embodiment, as shown in Figures 1 and 2, the light conversion layer 105 includes a top layer 1051 and a support layer 1052 (in certain embodiments, the support layer may be called a base layer). The top layer 1051 encloses the LED chips (101, 102), the conductive part 106 and the electrodes (103, 104), exposing parts of at least two electrodes (103, 104), or at least parts of two electrodes (103, 104). The support layer 1052 includes an upper surface and a lower surface opposite the upper surface, with the upper surface of the support layer 1052 being close to the top layer 1051 relative to the lower surface of the support layer. In some examples, the top layer 1051 and the support layer 1052 may each be at least one layered structure, preferably one of a fluorescent powder adhesive with high moldability (relative to a fluorescent powder film), a fluorescent powder film with low moldability, or a transparent layer, or any combination of the above at least two layered structures. The fluorescent powder adhesive or fluorescent powder film includes organosilicon-modified polyimide and / or adhesive, and the fluorescent powder adhesive / fluorescent powder film may further include fluorescent powder, inorganic oxide nanoparticles (or heat dissipation particles). The transparent layer can be made of a light-transmitting resin (e.g., silica gel, polyimide) or a combination thereof. The adhesive may be silica gel, but is not limited thereto. Note that the structure and composition of the top layer 1051 and the support layer 1052 are merely examples, and in other examples, the top layer 1051 and the support layer 1052 may have the same or different structures and / or components, and multiple LED filaments with different properties may be combined.

[0035] In one embodiment, in the height direction (Z-axis direction in Figures 1 and 2) of the LED filament 10, the height of the top layer 1051 is greater than the height of the support layer 1052. The top layer 1051 includes opposing upper and lower surfaces, and the upper surface of the support layer 1052 is in contact with at least a portion of the lower surface of the top layer 1051. The LED chips (101, 102) include opposing upper and lower surfaces. The upper surface of the LED chips (101, 102) is closer to the upper surface of the top layer 1051 than the lower surface of the LED chips (101, 102). The distance from the lower surface of the LED chips (101, 102) to the lower surface of the support layer 1052 is smaller than the distance from the lower surface of the LED chips (101, 102) to the upper surface of the top layer 1051. In other words, the distance over which the heat generated by the LED chips (101, 102) is conducted to the outer surface of the support layer 1052 is relatively short, heat does not accumulate easily, and the LED filament 10 can obtain an excellent heat dissipation effect.

[0036] To increase the bonding strength between the top layer 1051 and the support layer 1052, in some embodiments, the contact area between the top layer 1051 and the support layer 1052 can be appropriately adjusted, their shapes can be adjusted, or their interface can be adjusted so that the bonding surface between them is not a single plane. In one example, at least a portion of the contact surfaces between the top layer 1051 and the support layer 1052 are formed as bonding surfaces, and the bonding may be a mating, for example, the mating surfaces may be wavy, sawtooth, etc. In another example, the upper surface of the support layer 1052 may be made rougher to improve the bonding strength with the top layer 1051. In yet another example, the support layer 1052 may have multiple through holes, which allows the top layer 1051 to penetrate the support layer 1052 and increase the contact area between them. Furthermore, after penetrating the through holes, the top layer 1051 can extend to the opposite side of the support layer 1052. In this case, the top layer 1051 can sandwich the support layer 1052 from above and below, thus creating a crimped relationship between the two.

[0037] The top layer 1051 shown in Figures 1 and 2 is positioned on the upper surface of the support layer 1052 and is merely one example of the structure of the light conversion layer 105. The top layer 1051 and the support layer 1052 may be provided in other combinations. For example, the support layer 1052 may have a housing groove formed in the longitudinal direction of the LED filament (i.e., the Y direction in Figures 1 and 2), the LED chip may be positioned at the bottom of the housing groove, and the top layer 1051 may be formed by filling the housing groove. Alternatively, for example, the support layer 1052 may be provided so as to enclose the six surfaces of the LED chip (i.e., the LED chip is enclosed in the central part of the support layer 1052), and the top layer 1051 may be formed by being enclosed in the support layer 1052. This invention does not limit the structure of the light conversion layer.

[0038] The LED chip is encased in a light conversion layer, and the LED filament may contain a single LED chip, two LED chips, or of course, multiple LED chips, i.e., three or more LED chips. The shape of the LED chip may be a long type, but is not limited thereto. Long type chips may have fewer electrodes, reducing the opportunity for the light emitted by the LED to be blocked. Furthermore, a layer of conductive transparent indium tin oxide (Indiμm Tim Oxide, ITO) can be plated onto the surface of the LED chip. This indium tin oxide layer contributes to the uniform diffusion distribution of current and improvement of luminous efficiency of the LED chip. Specifically, the aspect ratio of the LED chip may be set to 2:1 to 10:1, and is not limited to, for example, 14×28 or 10×20. The LED chip can use a high-power LED chip and then be operated with a low current. In this way, the LED chip can maintain sufficient brightness while being kept at a low current density, and the LED chip does not generate a large amount of heat, resulting in good overall luminous efficiency.

[0039] The LED chip itself can be made of a sapphire substrate or a light-transmitting transparent substrate. In this way, the substrate of the LED chip itself does not obstruct the light emitted by the LED chip, meaning that the LED chip itself can emit light from its surrounding surface.

[0040] Each LED chip is electrically connected to the others, and as shown in Figures 1 and 2, adjacent LED chips (101, 102) are electrically connected to each other via a conductive part 106. As shown in Figures 1 and 2 as an example, each LED chip (101, 102) may be electrically connected in a series connection method, but the electrical connection method is not limited to this. They may be connected in parallel first and then electrically connected in series. For example, each pair of LED chips (101, 102) may be connected in parallel first, and then each pair of parallel-connected chips (101, 102) may be connected in series. Alternatively, they may be connected in series first and then electrically connected in parallel.

[0041] The electrodes are arranged in accordance with the LED chips and electrically connected to the LED chips. As shown in the embodiments in Figures 1 and 2, each LED chip (101, 102) is arranged in a "straight" shape, adjacent LED chips (101, 102) are electrically connected in series, and two electrodes (103, 104) are placed at both ends of the LED filament and connected to both ends of the LED chips (101, 102), with each electrode (103, 104) partially exposed outside the light conversion layer 105. The arrangement of the electrodes (103, 104) and LED chips (101, 102) is not limited to this.

[0042] Of course, in this invention, the number of chip rows along the width direction of the LED filament may be multiple rows; that is, at least two rows of chips may be provided on the LED filament in parallel or alternately.

[0043] Figures 3 to 7 are schematic diagrams showing the arrangement of LED chips and electrodes in different embodiments of the present invention.

[0044] In the embodiment shown in Figure 3, adjacent LED chips (101, 102) are still electrically connected in series, but the multiple LED chips (101, 102) are divided into two rows on the LED filament 10 (i.e., adjacent LED chips (101, 102) are alternately arranged in the width direction of the LED filament 10 (X-axis direction in Figure 3), the two rows of LED chips (101, 102) are spaced apart, or the corresponding LED chips (101, 102) located in different rows do not completely overlap from the filament side, or the overlap area is 100% or less), and these two rows of LED chips (101, 102) are each arranged along the length direction of the LED filament 10 (Y-axis direction in Figure 3). Adjacent LED chips (101, 102) are connected using conductive parts 106. In Figure 3, two electrodes (103, 104) are positioned at both ends of the LED filament and connected to both ends of the LED chips (101, 102) via conductive parts 106, and each electrode (103, 104) is partially exposed outside the light conversion layer 105. In the embodiment shown in Figure 3, the LED chips (101, 102) have a length dimension wc along the longitudinal direction of the LED filament 10, and the ratio of the sum of the lengths wc of all LED chips (101, 102) (i.e., Σwc) to the length of the LED filament 10 is greater than 0.5, 0.6, 0.65, or 0.7, thereby ensuring the installation density of LED chips (101, 102) in the longitudinal direction of the LED filament 10, thereby improving the total luminous flux and effectively reducing the graininess of light. 2) Since the LED filaments are alternately arranged in the width direction of the LED filament 10, assuming that the same spacing is maintained between the LED chips (101, 102), better bendability can be achieved. Conversely, if the ratio of the sum of the lengths of all the LED chips (101, 102) to the length of the LED filament 10 is greater than 0.5, 0.6, 0.65, or 0.7, and the LED chips (101, 102) are arranged in a single row, the bendability of the LED filament 10 will be poor, it will not be able to be bent properly, and the shape of the LED filament 10 will be limited.

[0045] In the embodiment shown in Figure 4, multiple LED chips (101, 102) are arranged in an inverted "U" shape or an "n" shape, and adjacent LED chips (101, 102) are electrically connected in series. The electrodes (103, 104) are positioned at the open ends of the inverted "U" shape or "n" shape and are electrically connected to the corresponding LED chips (101, 102). From an external view, both electrodes (103, 104) are positioned at one end of the LED filament (corresponding to the open end of the inverted "U" shape or "n" shape) and are partially exposed outside the light conversion layer 105.

[0046] In some embodiments, as shown in Figures 5 and 6, multiple LED chips (101, 102) may be arranged in parallel in approximately parallel manner in at least two rows (two rows are used as an example in Figures 5 and 6), with each row of LED chips being electrically connected in series, and two electrodes (103, 104) positioned at both ends of at least two rows of LED chips, each connected to the LED chips in each row, forming an electrical connection method where they are first connected in series and then in parallel. Figures 5 and 6 show two electrodes as an example, but are not limited to this, and three or four electrodes may be used. For example, one electrode (103, 104) in Figure 5 or Figure 6 may be replaced with two separate sub-electrodes, with the two sub-electrodes each being the positive power electrode and the reserved electrode being the common ground terminal, or both electrodes in Figure 5 or Figure 6 may be replaced with two sub-electrodes, and this can be applied to different applications.

[0047] In the embodiment shown in Figure 6, if we denote the LED chip closest to the LED filament in one of the rows as LED chip a1, then the LED chips in that row from one end of the LED filament to the other are sequentially a1, a2, a3, ..., a m (where m is an integer) If we denote the LED chip closest to one end of the LED filament in the other row as LED chip b1, then in the other row, the LED chips from one end of the LED filament to the other are in order b1, b2, b3, ..., b n(n is an integer). In the longitudinal direction of the LED filament 10 (the Y-axis direction in Figure 6), the LED chip b n is the LED chip a n and the LED chip a n+1 (for example, when viewed from the length direction, the LED chip b1 is located between the LED chip a1 and the LED chip a2, and the LED chip b2 is located between the LED chip a2 and the LED chip a3), and the projection of the LED chip b in the width direction of the LED filament does not have an area that does not overlap with the projection of the LED chip a in the width direction of the LED filament 10 (the X-axis direction in Figure 6). That is, the LED chips in one of the rows and the LED chips in the other row are alternately arranged in the width direction of the LED filament 10 (the X-axis direction in Figure 6). Of course, in some embodiments, the projection of the LED chip bn in the width direction of the LED filament has a certain overlapping area with the projection of the LED chip a in the width direction of the LED filament 10 (the X-axis direction in Figure 6), but the overlapping area is less than 100%. It should be understood that Figure 6 takes having the same number of LED chips in two rows as an example. In practical applications, the number of LED chips in the two rows does not necessarily have to be the same or different, that is, the maximum value of n may be greater than, less than, or equal to the maximum value of m. The LED chips in the row with a smaller number and the corresponding number of LED chips in the other row only need to be arranged alternately or at least partially alternately, and the remaining LED chips in the row with a larger number are continuously arranged to extend in the length direction of the LED filament. n of the LED filament in the width direction does not have an area that does not overlap with the projection of the LED chip a n of the LED filament 10 in the width direction (the X-axis direction in Figure 6). That is, the LED chips in one of the rows and the LED chips in the other row are alternately arranged in the width direction of the LED filament 10 (the X-axis direction in Figure 6). Of course, in some embodiments, the projection of the LED chip bn in the width direction of the LED filament has a certain overlapping area with the projection of the LED chip a in the width direction of the LED filament 10 (the X-axis direction in Figure 6), but the overlapping area is less than 100%. It should be understood that Figure 6 takes having the same number of LED chips in two rows as an example. In practical applications, the number of LED chips in the two rows does not necessarily have to be the same or different, that is, the maximum value of n may be greater than, less than, or equal to the maximum value of m. The LED chips in the row with a smaller number and the corresponding number of LED chips in the other row only need to be arranged alternately or at least partially alternately, and the remaining LED chips in the row with a larger number are continuously arranged to extend in the length direction of the LED filament. n has a certain overlapping area with the projection, but the overlapping area is less than 100%. It should be understood that Figure 6 takes having the same number of LED chips in two rows as an example. In practical applications, the number of LED chips in the two rows does not necessarily have to be the same or different, that is, the maximum value of n may be greater than, less than, or equal to the maximum value of m. The LED chips in the row with a smaller number and the corresponding number of LED chips in the other row only need to be arranged alternately or at least partially alternately, and the remaining LED chips in the row with a larger number are continuously arranged to extend in the length direction of the LED filament.

[0048] In some embodiments, the projection of the LED chip b in the width direction of the LED filament n does not have an area that does not overlap with the projection of the LED chip a in the longitudinal direction of the LED filament 10 (the Y-axis direction in Figure 6). n does not have an area that does not overlap with the projection.

[0049] In some embodiments, the projection of the LED chip b in the width direction of the LED filament nThe projection shows the LED chip a in the longitudinal direction (Y-axis direction in Figure 6) of the LED filament 10. n It overlaps, at least partially, with the projection.

[0050] In an arrangement of the same number of LED chips, the longer the length of the LED filament, the greater the spacing between two adjacent LED chips. After the LED filament is lit, the visible light spots (or granularity) become more pronounced, seriously affecting the user's visual comfort. Also, with the same length of LED filament, the more LED chips there are, the smaller the spacing between two adjacent LED chips becomes, and the heat generated by adjacent LED chips affects each other. To ensure that the LED filament has excellent light emission and heat dissipation performance, in the embodiment shown in Figure 6, two rows of LED chips are connected in parallel, and the LED chips in one row and the LED chips in the other row are alternately arranged in the width direction of the LED filament. In this way, the light emitted by the LED chips in one row can supplement the spots generated by the LED chips in the other row, improving the light emission effect of the LED filament. Furthermore, compared to LED filaments of the same length and the same number of LED chips, the spacing between two adjacent LED chips in each row is larger, the heat generated by adjacent LED chips does not affect each other as much, and the junction temperature of the LED filament decreases.

[0051] Furthermore, as shown in Figure 7, based on the arrangement of LED chips shown in Figure 6, the projection of one row of LED chips and the other rows of LED chips overlaps in the longitudinal direction (Y-axis direction in Figure 7) of the LED filament 10, thereby reducing the width of the LED filament. This makes the width of the LED filament closer to that of a conventional tungsten lamp, resulting in a more aesthetically pleasing design when the LED filament is bent and wound. Specifically, LED chip a m LED chip b n Each has multiple sides, and in the longitudinal direction of the LED filament 10, the LED chip b n One aspect is LED chip an and LED chip an+1 Located between the same side (for example, one side b of LED chip b1 in Figure 7) 11 This is one side of LED chip a1 a 11 and side a of LED chip a2 21 (located between) In some embodiments, side a 11 is side a 21 It opposes.

[0052] In some embodiments, the LED chip a is located in the longitudinal direction of the LED filament 10 (for example, in the Y-axis direction in Figure 7). m LED chip b n The widths are wa and wb, respectively, and the length ww of the LED filament 10 is greater than or equal to the sum of waa and wbb, i.e., ww ≥ waa + wbb. Furthermore, the length ww of the LED filament 10 is greater than or equal to the sum of the sum of waa and the sum of wbb, i.e., ww ≥ Σwaa + Σwbb.

[0053] In some embodiments, the LED chip a is located in the width direction of the LED filament 10 (for example, in the X-axis direction in Figure 7). m LED chip b n The widths of the filaments are wa and wb, respectively, and the width w of the LED filament 10 is greater than or equal to the sum of wa and wb, i.e., w ≥ wa + wb. Furthermore, the width w of the LED filament 10 is greater than or equal to the sum of the sum of Σwa + Σwb and the sum of wb.

[0054] As shown in any of the embodiments in Figures 1 to 7, adjacent LED chips (101, 102) are connected to each other via the conductive part 106 to achieve electrical conductivity, and the LED chips (101, 102) and electrodes (103, 104) are also connected to each other via the conductive part 106 to achieve electrical conductivity. The conductive part 106 may be a conductive metal wire, a conductive film, or a conductive metal sheet. In some subsequent embodiments, the conductive part 106 is described as being arranged as a conductive metal wire, but this should not be understood as limiting the present invention. For example, when the conductive part 106 is arranged as a conductive metal wire, the diameter of the conductive metal wire may be 0.5 mil to 1.5 mil, and it may be a single metal wire such as a gold wire, silver wire, aluminum wire, or copper wire, or it may be an alloy wire, and the alloy wire is manufactured from at least two types of metals in a certain ratio, for example, a gold-silver alloy wire.

[0055] The connections between the conductive part 106 and the LED chips (101, 102) and between the conductive part 106 and the electrodes (103, 104) are fixed connections. Specifically, the LED chips (101, 102) are provided with a first electrical connection part and a second electrical connection part (the electrical connection part may be, for example, a welding point or a pad), the first end of the conductive part 106 is fixed to the second electrical connection part of the LED chip 101, and the second end is fixed to the first electrical connection part of another LED chip 102 adjacent to the LED chip 101, thereby enabling electrical connection or signal communication between adjacent LED chips (101, 102). The electrodes (103, 104) are also provided with electrical connection points (the electrical connection points may be, for example, welding points or pads), and by fixing the first and second ends of the conductive part 106 to the electrical connection points of the electrodes (103, 104) and the LED chips (101, 102) adjacent to the electrodes (103, 104), an electrical connection or signal communication can be achieved between the electrodes (103, 104) and the LED chips (101, 102).

[0056] In some embodiments, conductive parts are formed by a wire bonding process, which is a wire bonding process in which wires (conductors) are bonded and fixed to the corresponding electrical connections to form each conductive part in the LED filament by methods such as hot press bonding, ultrasonic bonding, and thermal ultrasonic bonding. All of these combinations require pressure to be applied to the wires.

[0057] Specifically, the wire bonding process can be completed by a wire bonder (or bonding wire machine), which is equipped with a ceramic nozzle, which has a through-hole (or wire hole) through which the wire can pass, an ignition rod sinters the wire in front of the ceramic nozzle to form a spherical object, the ceramic nozzle descends to the electrical connection to which the spherical object needs to be connected (e.g., the second electrical connection of an LED chip) and pressurizes the wire to form a first joint (or first welding point), thus completing the fixing of the first end of the conductive part. Subsequently, the ceramic nozzle moves in a certain trajectory toward the other electrical connection to which it needs to be connected (e.g., the first electrical connection of another LED chip adjacent to the LED chip), in this process also forming a wire arc of the conductive part and descending to the electrical connection to pressurize the wire to form a second joint (or second welding point), that is, completing the fixing of the second end of the conductive part, after which the ceramic nozzle slides laterally to form a tangent and form one bonded conductive part. In other words, during the wire bonding process, the wire is positioned between the LED chip or electrode and the ceramic nozzle, and pressure is applied to the wire through the ceramic nozzle, further bonding the wire to the LED chip (or electrode).

[0058] Note that "wire" refers to the material used to form the conductive part; for example, if it is a conductive wire, the formed conductive part is also a conductive wire. In this invention, the region formed by joining the wire and the electrical connection part is called a joint, and in order to distinguish between different joints, in the process of forming the conductive part, the region formed by joining the starting point of the wire and the electrical connection part is called the first joint (or first welding point), and the region formed by joining the ending point of the wire and the electrical connection part is called the second joint (or second welding point). The end of the conductive part connected to the first joint is defined as the first end of the conductive part, and the end of the conductive part connected to the second joint is defined as the second end of the conductive part.

[0059] Figure 8 shows a schematic diagram of the structure of a conductive part in one embodiment of the present invention. In Figure 8, the conductive part 106 is shown as an example of being connected to two adjacent LED chips 101 and 102, although it may also be connected between the LED chip and the electrode. After the conductive part 106 is formed, its connection quality is mainly determined by three locations B, C, and D in Figure 8. In other words, the reason why the connection of the conductive part 106 is unreliable is generally due to a quality problem in one of the three locations B, C, and D. Here, location B is the connection point between the first end of the conductive part 106 and the first coupling part 1061, location D is the connection point between the second end of the conductive part 106 and the second coupling part 1062, and location C is the line segment portion of the conductive part 106 (i.e., the region between location B and location D).

[0060] In conventional related technologies, the conductive part 106 is formed using a BSOB (Bond Stick on Ball) bonding process, as shown in Figure 8. Specifically, a spherical solder is first pre-set on the first electrical connection part of the LED chip 102, and during bonding, the first joint part 1061 is formed, followed by the formation of the second joint part 1062. The second joint part 1062 is formed by pressing a wire onto the pre-set spherical solder, thereby forming the second joint part 1062 shown in Figure 9 (schematic diagram of the structure of the second joint part in the related technology), and the surface of the second joint part 1062 is a grid surface. The second joint 1062 and the grid surface are shown in Figures 10A and 10B (Figure 10A is a schematic diagram of the structure of a ceramic capillary in the prior art, and Figure 10B is a schematic cross-sectional diagram of a ceramic capillary in the prior art). The ceramic capillary 20 shown is formed after pressurizing a wire, and regions of clearly different heights are formed on its surface, specifically, protruding structures and recessed structures, and the first height difference G1 between the highest point of the protrusion and the lowest point of the recess is between 5 and 15 μm, i.e., 5 ≤ G1 ≤ 15 μm. Here, the height difference between the protruding structure and the recessed structure in region D may also be called G1, and 5 ≤ G1 ≤ 15 μm.The ceramic nozzle 20 includes a surface 201 and a wire hole 202 through which a wire (which can be arranged as a conductive metal wire) passes, where the surface 201 is the surface that contacts the wire, and in Figures 10A and 10B, the surface 201 is arranged as a grid structure, and the grid structure is arranged to have an array of recessed structures, and furthermore, because the depth of the recessed structures is large, the surface 201 is rough, and deep indentations remain on the surface of the wire during the wire bonding process, as shown in Figure 9, the second joint 1062 The surface of the surface 201 has a protruding structure and a recessed structure corresponding to the grid structure of the ceramic nozzle 20. If the depth of the recessed structure is relatively large, the overall thickness of the region where the recessed structure is located is relatively small. The thin portion is a weak region, and the weak region is easily fractured relative to other regions, i.e., fracture at position D is likely to occur, causing problems such as disconnection or overlapping connection with other circuits to form a short circuit, which in turn causes abnormalities in the LED filament, for example, some or all of the LED chips not lighting up or having abnormal brightness. In this embodiment, the first electrical connection part of the LED chip 102 is arranged as the negative electrode (also called the cathode) of the LED chip 102, and the second electrical connection part is arranged as the positive electrode (also called the anode) of the LED chip 102. That is, the first coupling part 1061 is formed on the positive electrode of the LED chip 101, and the second coupling part 1062 is formed on the negative electrode of the LED chip 102.

[0061] To solve the problem of fracture at position D, some embodiments of the present invention provide ceramic nozzles with different surface structures so that the surface of the second joint has a corresponding structure. Referring to Figures 11A and 11B, Figure 11A is a schematic diagram of the structure of a ceramic nozzle in one embodiment of the present invention, and Figure 11B is a corresponding cross-sectional view thereof. Compared to the ceramic nozzle structure shown in Figures 10A and 10B, the surface 201 of the ceramic nozzle 20 in Figures 11A and 11B is also arranged as a grid structure, but the grid structure in Figures 11A and 11B is arranged as an array of protrusions, and the protrusions are micro-protrusions, that is, the height difference between the protruding and non-protruding parts of the protrusion structure is small, at least smaller than the depth of the recess structure shown in Figures 10A and 10B, and furthermore, the edges of each protrusion in the protrusion structure are set in a smooth arc shape. The ceramic nozzle 20 presses the second end of the conductive part through the surface 201 of the protruding structure in Figure 11A or Figure 11B, thereby forming a structure corresponding to the surface of the second end. As shown in Figure 12, a schematic diagram of the structure of the second joint in one embodiment of the present invention is shown, corresponding to the minute protruding structure of the surface 201 of the ceramic nozzle 20 in Figure 11A. The surface of the second joint 1062 is a minute recessed surface, and the height difference between the highest point of the protruding structure and the lowest point of the recessed groove structure is called the second height difference G2, and the range of G2 is between 1 and 5 μm, i.e., 1 ≤ G2 ≤ ​​5 μm. The highest point of the protruding structure and the lowest point of the recessed structure at position D may also be called the second height difference G2, and the range of G2 is between 1 and 5 μm, i.e., 1 ≤ G2 ≤ ​​5 μm. Since there are no particularly weak parts at position D and the second joint 1062, the fracture problem at position D is improved.

[0062] Figure 13 is a schematic diagram of the structure of a ceramic nozzle in one embodiment of the present invention. Compared to the ceramic nozzle structure shown in Figure 10A, the surface 201 of the ceramic nozzle 20 in Figure 13 is arranged as a polished structure (matte finish structure). The polished structure has a granular texture on the surface. Such a granular texture may be formed, for example, by fine protrusions and recesses. However, the height difference between such protrusions and recesses is small and insufficient to form a clear grid texture. A structure corresponding to the surface of the second joint 1062 is formed, and as shown in Figure 14, a schematic diagram of the structure of the second joint in one embodiment of the present invention is shown, which corresponds to the polished structure of the surface 201 of the ceramic nozzle 20 in Figure 13. The surface of the second joint 1062 is a polished surface, there are no obvious weak areas, and the fracture problem at position D is greatly improved. As shown in Figure 14, the second joint 1062 formed by the ceramic nozzle 20 in Figure 13 and formed at position D, the height difference between the highest point of each protruding structure and the lowest point of the recessed structure is called the third height difference G3, and the range of G3 is 0 to 1 μm, i.e., 0 ≤ G3 ≤ 1 μm.

[0063] Referring to Figures 15A to 15D, schematic diagrams of ceramic nozzles having two different surface roughnesses in different embodiments of the present invention are shown. Compared to the ceramic nozzle structure shown in Figure 10A, the surface 201 of the ceramic nozzle in Figures 15A to 15D is arranged to include a first portion 2011 and a second portion 2012. The second portion 2012 surrounds the first portion 2011 and together with the first portion 2011 constitutes the surface 201 of the ceramic nozzle, and the roughness of the first portion 2011 and the second portion 2012 are different. Specifically, in the embodiment shown in Figure 15A, the first portion 2011 is arranged as a grooved grid structure, and the second portion 2012 is arranged as an abrasive structure. There is a clear difference in surface roughness between the two portions (201, 2012), and the surface roughness of the first portion 2011 is much greater than that of the second portion 2012. In the embodiment shown in Figure 15B, the first portion 2011 is arranged as a protruding grid structure, and the second portion 2012 is arranged as a polished structure, and there is a clear difference in surface roughness between the two portions (201, 2012), with the surface roughness of the first portion 2011 being much greater than that of the second portion 2012. In the embodiment shown in Figure 15C, the first portion 2011 is arranged as a polished structure, and the second portion 2012 is arranged as a grooved grid structure, and there is a clear difference in surface roughness between the two portions (201, 2012), with the surface roughness of the first portion 2011 being much smaller than that of the second portion 2012. In the embodiment shown in Figure 15D, the first portion 2011 is arranged as an abrasive structure, and the second portion 2012 is arranged as a protruding grid structure, and there is a clear difference in surface roughness between the two portions (201, 2012), with the surface roughness of the first portion 2011 being much smaller than that of the second portion 2012.

[0064] In any embodiment of a ceramic nozzle including two types of surface roughness settings, for example, the ceramic nozzle shown in any of the embodiments in Figures 15A to 15D can be configured so that when pressure is applied to the wire (conductive wire or conductive part) during wire bonding, the surface of the corresponding wire also exhibits two types of surface roughness. Of course, the surface roughness of the ceramic nozzle may be set to one or more types, and the surface of the corresponding wire will exhibit one or more types of roughness, and at the same time, the rough surface is set, making it easier to cut the wire against a smooth surface and complete the wire bonding. As shown in Figure 16, Figure 16 is a schematic diagram of the structure of the second joint in one embodiment of the present invention, corresponding to the surface 201 of the ceramic nozzle 20 in Figure 15B. The surface of the second joint 1062 has two roughnesses, or the surface of the second joint 1062 and position D, which includes at least two roughnesses, is formed by applying pressure to the recessed surface of the first portion 2011 in Figure 15B and the rough surface of the second portion 2012 in Figure 15B, respectively, and at position D in Figure 16, the first portion 2011 in Figure 15 is formed by applying pressure. The second joint 1062 in Figure 16 is formed by applying pressure with the second part 2012 in Figure 15, and the position of the second joint 1062 away from position D is formed by cutting the wire through an outward movement of the first part 2011 or the second part 2012, and its surface roughness is close to that of the surface roughness at position D in Figure 16, which can improve the fracture problem at position D to some extent.

[0065] In other embodiments, the surface of the ceramic nozzle may have more than two different roughness regions, thereby the surface of the joint formed by the pressurization may also have more than two different roughness regions, which can improve the fracture problem at position D to some extent. Furthermore, the surfaces of the ceramic nozzle having different surface roughness may be distributed in an annular manner, in an independent block or strip distribution, or in other forms, as long as there are surfaces with two or more distinct surface roughnesses on the surface to which pressure is applied to the ceramic nozzle.

[0066] In some embodiments, the wire holes located in the ceramic nozzle have at least two different diameters. The wire holes may include a frustoconical through-hole and a cylindrical through-hole connected to the smaller surface of the frustoconical through-hole, wherein the diameter of the larger surface of the frustoconical through-hole is greater than the diameter of the wire.

[0067] In the above embodiment, the problem of fracture of the conductive part can be improved by changing the surface structure of the second joint.

[0068] In some other embodiments of the present invention, the conductive portion 106 is formed by a BWB (Ball Wire Bonding) welding process, as shown in Figure 8. Specifically, a spherical solder is first pre-set on the first electrical connection of the LED chip 102, and during bonding, the first joint 1061 is formed, followed by the formation of the second joint 1062. The formation of the second joint 1062 is achieved by pressing down a ceramic nozzle to bond the wire to the spherical solder pre-set on the first electrical connection, and then welding another spherical solder on top of it, thereby forming the second joint 1062 shown in Figure 17A (shown as a schematic diagram of the structure of the second joint in one embodiment of the present invention), forming a three-layer structure in which the conductive portion 106 is sandwiched between two welding materials. Figure 17B is a corresponding schematic cross-sectional view. In this way, the second end of the conductive portion has solder ball protection, effectively preventing breakage at position D of the conductive portion. In other words, in this solution, first, it is necessary to pressurize and bond the first spherical solder to the corresponding position on the LED chip 102 to form the required shape, then bond the conductive part 106 to the surface of the first spherical solder away from the LED chip 102, and finally, the conductive part 106 bonded with the second spherical solder separates from the first spherical solder, thereby fixing the conductive part 106 to the LED chip 102 and ultimately forming a second bond 1062. The LED chip 102 is first bonded to the molten solder, and during the conduction process, the current is conducted from the conductive part 106 to the solder bonded to the LED chip 102 (i.e., the first spherical solder), and then to the LED chip 102.

[0069] In some embodiments, when a first spherical solder (first spherical brazing material) and a second spherical solder (second spherical brazing material) are joined to a conductive part 106, the projections of the first and second spherical solder onto the LED chip 102 are both larger than the projections of the conductive part 106 and the joint positions of the first and second spherical solder onto the LED chip 102. The first and second spherical solders enclose the conductive part 106 and the joint between them, and the first and second spherical solders are joined at least partially. The spherical brazing material can completely enclose the joint area of ​​the conductive part 106, improving the strength of the joint area of ​​the conductive part 106 and preventing fracture.

[0070] In some embodiments, the projection of the conductive portion 106 onto the LED chip is smaller than the projection of the first spherical solder onto the LED chip, the projection of the first spherical solder onto the LED chip is smaller than the projection of the second spherical solder onto the LED chip, the second spherical solder completely covers the junction area between the first spherical solder and the conductive portion 106 on the LED chip 102, and the second spherical solder at least partially bonds with the LED chip 102.

[0071] In several other embodiments of the present invention, the conductive portion 106 is formed by a BBOS (Bond Ball on Stitch) wire bonding process, as shown in Figure 8. That is, a first joint portion 1061 is formed during bonding, the ceramic nozzle is moved, and then the wire is bonded to the first electrical connection portion of the LED chip 102 under downward pressure, and then a solder ball is formed on top of it, thereby forming a second joint portion 1062 as shown in Figures 18A and 18B (Figure 18A shows a schematic diagram of the structure of the second joint portion in one embodiment of the present invention, and Figure 18B shows a schematic cross-sectional view of Figure 18A). By further covering the second end of the conductive portion with a solder ball in this way, the problem of breakage at position D of the conductive portion can be greatly improved, and the efficiency of wire bonding can be improved. In this embodiment, the first electrical connection portion of the LED chip 102 is positioned as the positive electrode (also called the anode) of the LED chip 102, and the second electrical connection portion is positioned as the negative electrode (also called the cathode) of the LED chip 102. That is, the first coupling portion 1061 is formed on the negative electrode of the LED chip 101, and the second coupling portion 1062 is formed on the positive electrode of the LED chip 102. In this embodiment, the conductive portion 106 is first bonded to the LED chip 102, and then a second bonding portion 1062 is finally formed on one side of the conductive portion 106 away from the LED chip 102. The projected area of ​​the solder onto the LED chip 102 is larger than the bonding area between the conductive portion 106 and the LED chip 102, and the bonding area of ​​the conductive portion 106 can be completely covered with the LED chip 102. In other words, the conductive portion 106 itself is bonded to the LED chip 102, and then the LED chip is encased in spherical solder, improving the robustness of the fixation through at least two fixing steps, and relatively reducing the number of process steps.

[0072] Furthermore, in any embodiment in which wire bonding is completed by applying pressure to the wire using the ceramic nozzle described above, if the support surface below the wire is not flat, for example, if there is a step below the wire, when pressure is applied to the wire, a large cutting effect occurs without being supported downwards, making the wire more prone to breakage. As shown in Figures 19A and 19B below, these are schematic diagrams of the cutting position at the second end of the conductive part in different embodiments, where the cutting position M is indicated by a circle in the figure. If the bonding position is too close to the edge of the LED chip or electrode, the downward pressure applied to the wire corresponds to or is close to the edge of the LED chip or electrode, and this edge usually has a sudden change in height. In this way, a cutting effect occurs at the bonding position at the second end of the conductive part, significantly increasing the risk of breakage of the conductive part.

[0073] In view of this, in any embodiment in which wire bonding is completed by applying pressure to the wire using the above-mentioned ceramic nozzle, a second joint can be further installed on the LED chip (or electrode), and has a first planned distance from the edge of the LED chip (or electrode), wherein in this embodiment, the edge of the LED chip (or electrode) refers to the edge corresponding to the side where the projections of the LED filament in the height direction of the LED chip (or electrode) and the conductive part intersect. Having a first planned distance between the second joint and the edge of the LED chip (or electrode) means that, in wire bonding, the wire is applied to the pressure position and supported by a flat support surface, eliminating the cutting effect and significantly reducing the risk of wire breakage. As shown in Figures 18A and 18B as examples, the edge of the second coupling portion 1062 and the LED chip 102 have a first planned distance wd, and the coupling surface between the second coupling portion 1062 formed on the positive electrode of the LED chip 102 and the conductive portion 106 tends to gradually slope or gradually rise from the near end to the far end (i.e., in the direction of extension of the conductive portion 106 from the positive electrode of the LED chip 102), further forming a coupling gradient or coupling slope, or forming a coupling portion that gradually thickens from the near end to the far end, and further resolving the problem of abrupt changes in edge presentation height shown in Figures 19A and 19B. The coupling surface between the second coupling portion 1062 and the conductive portion 106 of the positive electrode of the LED chip 102 forms a complete mounting surface for the second coupling portion 1062. Compared to Figure 19B, the second coupling portion 1062 moves a certain distance forward toward the interior of the LED chip. As a result, the area below the wire in Figure 18A is a complete mounting surface, no cut occurs at position D, and the risk of wire breakage is further reduced.

[0074] In Figures 18A and 18B, the distance between the edge of the second coupling portion 1062 and the edge of the LED chip (or electrode) represents the first planned distance. For example, the distance between the second coupling portion and the first planned distance may be set to any value between 20 μm and 60 μm, and preferably to any value between 30 μm and 50 μm, such as 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm. Of course, in other embodiments, the distance between the center point of the second joint 1062 and the edge of the LED chip (or electrode) represents the first planned distance, and as shown in Figures 18A and 18B, it is sufficient to simply superimpose the length corresponding to the radius of the second joint. For example, the distance between the second joint and the first planned distance may be any value between 20μm+R1 and 60μm+R1, preferably any value between 30μm+R1 and 50μm+R1, for example, 30μm+R1, 35μm+R1, 40μm+R1, 45μm+R1, or 50μm+R1, where R1 represents the radius of the second joint.

[0075] In some embodiments, the second joint is formed in wire bonding by continuously pressurizing the wire after the ceramic nozzle descends to the electrical connection to be connected to the LED chip (or electrode). Therefore, in some embodiments, the second joint may be located on the LED chip (or electrode) and have a first planned distance from the edge of the LED chip (or electrode) by positioning the electrical connection on the LED chip (or electrode) to have a second planned distance from the edge of the LED chip (or electrode). Here, the first and second planned distances do not necessarily have a greater-than-less-than relationship, and the second planned distance may be greater than or equal to the second planned distance. In some examples, the distance between the edge of the electrical connection and the edge of the LED chip (or electrode) represents a second planned distance, which may be set to any value between 20 μm and 60 μm, and preferably any value between 30 μm and 50 μm, for example, 30 μm, 35 μm, 40 μm, 45 μm, or 50 μm. In some other examples, the distance between the center of the electrical connection and the edge of the LED chip (or electrode) can represent a second planned distance, for example, the second planned distance may be any number between 20 μm + R2 and 60 μm + R2, preferably any number between 30 μm + R2 and 50 μm + R2, for example, 30 μm + R2, 35 μm + R2, 40 μm + R2, 45 μm + R2, or 50 μm + R2, where R2 indicates the radius of the electrical connection, for example, the radius R2 of the electrical connection may be any number between 25 μm and 35 μm, for example, 25 μm, 30 μm, or 35 μm.

[0076] Figures 9 to 19B and their related explanations above primarily analyzed and resolved cases where the rupture of the conductive part 106 occurred at position D. However, the rupture of the conductive part 106 can also occur at position B, and a rupture at position B still causes abnormality in the conductive part 106, which in turn causes abnormality in the LED filament.

[0077] In some related technologies, the conductive part is usually a conductive metal wire coated with silver and gold. While such conductive metal wires are inexpensive, gold and silver have certain differences in their properties, resulting in differences in fluidity during melting or re-hardening time. During the process of forming the first joint, abnormalities occur in the burning ball of the ignition rod, and damage to position B becomes severe. As shown in Figure 20, which is a schematic diagram of the structure of the first joint in the related technologies of this invention, in the area enclosed by the dashed line, the wire undergoes serious vertical displacement, and fracture is likely to occur in the dislocation area. Therefore, in some embodiments of this invention, the conductive part is configured to use a conductive wire made of silver. Such conductive wires are cheaper than gold-gold coated with silver and employ a single-attribute metal, so during the process of forming the first joint, the burning ball is normal and there is no damage to position B. As shown in Figure 21, which is a schematic diagram of the structure of the first joint in one embodiment of this invention, the vertical extension of the wire is smooth and there is no displacement.

[0078] Furthermore, as shown in Figure 8, the conductive portion 106 extends between the first coupling portion 1061 and the second coupling portion 1062 and has a certain wire arc. As shown in Figures 22A and 22B, schematic diagrams of the first end portion of the corresponding conductive portion in the prior art of the present invention from different viewing angles are shown, respectively, where the first coupling portion 1061 is formed on the surface of the LED chip 101, the conductive portion 106 extends upward along the first coupling portion 1061 and forms a roughly 90-degree eggplant angle with the surface on which the first coupling portion 1061 is located, that is, the conductive portion 106 extends from the first coupling portion 1061 almost in the height direction of the LED chip (Z-axis direction in Figures 22A and 22B). The conductive portion 106 further has a bent portion 1063 (also called a bending point), and the bending portion 1063 bends the extending direction of the conductive portion 106 from the height direction of the LED chip to the longitudinal direction of the LED chip (the Y-axis direction in Figures 22A and 22B).

[0079] Figures 8, 22A, and 22B show the wire arc structure of the conductive part 106 in the prior art. The starting direction of the bent part 1063 corresponds to the height direction of the LED chip (i.e., the direction toward the first joint part 1061 or the Z-axis direction in Figure 22A), and the bending direction corresponds to the length direction of the LED chip (or the Y-axis direction in Figure 22A). With such a wire arc structure, the position where the conductive part 106 and the first joint part 1061 are joined (i.e., position B) constitutes the fulcrum of the bent part 1063, and the force received by the bent part 1063 is ultimately transmitted to position B. Thus, during the production or use of the LED filament, situations occur where the bent part 1063 is subjected to force due to vibration, bending, or dropping, all of which cause fracture at position B and lead to abnormalities in the LED filament.

[0080] Therefore, in some embodiments of the present invention, the wire arc structure of the conductive part is structurally designed to improve the fracture problem at position B. In one embodiment, the conductive part includes at least two bent portions so as to extend in at least two different planes. For example, the conductive part is provided with a first bent portion and a second bent portion such that there is at least a portion perpendicular to the LED chip (or in the height direction of the LED chip) and a portion parallel to the LED chip.

[0081] Referring to Figures 23A and 23B, schematic diagrams of the first end portion of a corresponding conductive part in one embodiment of the present invention are shown. As shown in the figures, the conductive part 106 is bent upward from the first joint 1061 (which may be understood as forming a rounded corner of approximately 90 degrees with the surface on which the first joint 1061 is located) along the width direction of the LED chip to form a first bent portion 1064. The conductive part 106 continues to extend and is bent along the longitudinal direction of the LED chip to form a second bent portion 1065. That is, the conductive part 106 has a first bent portion 1064 and a second bent portion 1065. The conductive part extends upward from the first joint 1061, extends through the first bent portion 1064 toward the width direction of the LED chip, and extends through the second bent portion 1065 toward the longitudinal direction of the LED chip. The fact that the conductive portion 106 extends upward from the first coupling portion 1061 can be understood as the conductive portion 106 extending to the first coupling portion 1061 along the height direction or vertical direction (Z-axis direction in Figures 23A and 23B) of the LED chip, and the conductive portion 106 extending toward the width direction of the LED chip, or it can be understood as extending substantially along the width direction of the LED chip.

[0082] In comparison with the structures shown in Figures 22A and 22B, in the conductive portion 106 shown in Figures 23A and 23B, the region between the first bent portion 1064 and the second bent portion 1065 may be used as a buffering region to buffer or disperse the force on the conductive portion 106, thereby avoiding or reducing deformation of the conductive portion 106 and preventing fracture at position B. Specifically, Figures 23A and 23B show a first bent portion 1064 and a second bent portion 1065. First, the extension direction of the conductive portion 106, which extends in the direction of the plane perpendicular to the chip, is adjusted in the width direction of the chip. Then, the extension direction of the conductive portion 106 can be adjusted along the length direction of the chip using the second bent portion 1065. This does not affect the connection of the conductive portion 106 to two adjacent LED chips, nor does it affect the connection between the LED chip and the electrode. However, with this structure, the conductive portion 106 forms an arc-shaped pendulum, that is, it corresponds to a buffer region, and the force received by the conductive portion 106 is released in the buffer region (that is, the force can be said to be decomposed in two parts in different directions in the buffer region). As a result, it is not transmitted to the first bent portion 1064, or only a small part of it is transmitted to the first bent portion 1064 and the subsequent position B. Since there is no obvious force in the region prone to breakage, the conductive portion 106 becomes less likely to break.

[0083] Furthermore, the height D1 of the first bent portion 1064 (i.e., the height from the first bent portion 1064 to the surface of the LED chip) is set to any value between 80 μm and 120 μm. The length D2 of the buffer region (i.e., the length between the first bent portion 1064 and the second bent portion 1065) is set to any value between 100 μm and 120 μm.

[0084] In some embodiments, referring to Figures 24A and 24B, which are schematic diagrams of the structure of a portion of an LED filament at different viewing angles in one embodiment of the present invention, the conductive portion 106 has a first portion 1066, a second portion 1067 connected to the first portion 1066, and a third portion 1068 connected to the second portion 1067. The first portion 1066 may be understood to be such that, when projected onto an LED chip (or electrode) disposed thereon in the height or thickness direction of the LED filament (Z-axis direction in Figures 24A and 24B), it is entirely within the range limited by the LED chip (or electrode), or the length direction of the LED filament of the first portion 1066 (Y-axis direction in Figures 24A and 24B) does not exceed the edge cross section of the LED chip (or electrode) disposed thereon. The second portion 1067 may be understood as being located between two adjacent LED chips (or one LED chip and electrode) when projected onto two adjacent LED chips (or one LED chip and electrode) connected to the conductive portion 106 in the longitudinal direction of the LED filament, or between two adjacent LED chips (or one LED chip and electrode) disposed thereon in the longitudinal direction of the LED filament, i.e., between the two adjacent LED chips (or one LED chip and electrode), i.e., between the opposing edge cross-sections of the two adjacent LED chips (or one LED chip and electrode). The third portion 1068 corresponds to the second end of the conductive portion 106 and is used to connect an LED chip (or electrode), and when projected onto an LED chip (or electrode) disposed thereon in the height or thickness direction of the LED filament, it may be understood as being entirely within the range limited by the LED chip (or electrode), or the third portion 1068 may be understood not to extend beyond the edge cross-section of the LED chip (or electrode) disposed thereon in the longitudinal direction of the LED filament.

[0085] In some embodiments, the first portion 1066 corresponds to the first end of the conductive portion 106, with one end connected to an LED chip (or electrode) and the other end connected to a second portion 1067, the other end not extending beyond the LED chip (or electrode) that fits it in the longitudinal direction of the LED filament. Furthermore, the first portion 1066 includes a first bent portion 1064 and a second bent portion 1065 as shown in Figures 23A and 23B.

[0086] In some embodiments, the ratio of the length of the first portion 1066 to the distance from the connection point between the first portion 1066 and the LED chip to the longitudinal edge cross section of the LED chip (the projected length of the first portion 1066 in the height or thickness direction of the LED filament) is greater than 1.15, 1.2, 1.3, or 1.4, thereby reducing the risk of the first portion 1066 being subjected to tensile force and the connection point with the LED chip breaking.

[0087] In some embodiments, the ratio of the length of the first portion 1066 to the distance from the connection point between the first portion 1066 and the LED chip to the longitudinal edge cross section of the LED chip (the projected length of the first portion 1066 in the height or thickness direction of the LED filament) is less than 2. If the first portion 1066 is too long, it will inevitably have a large bend width or occupy space in the height or thickness direction of the LED filament, both of which have an unfavorable effect on the LED filament. For example, a larger bend width can cause greater internal stress in the first portion 1066, and occupying space in the height or thickness direction of the LED filament requires covering a thicker light conversion layer.

[0088] In some embodiments, the ratio of the length of the first portion 1066 to the projected length of the first portion 1066 in the height or thickness direction of the LED filament is greater than the ratio of the length of the second portion 1067 to the projected length of the second portion 1067 in the height or thickness direction of the LED filament. Expressed as an equation, L1 / T1 > L2 / T2, where L1 is the length of the first portion 1066, T1 is the projected length of the first portion 1066 in the height or thickness direction of the LED filament, L2 is the length of the second portion 1067, and T2 is the projected length of the second portion 1067 in the height or thickness direction of the LED filament. Normally, when the LED filament is bent, the connection point between the first portion 1066 and the LED chip (or electrode) is subjected to greater tensile force and is more likely to break. Therefore, by providing L1 / T1 > L2 / T2, the risk of the connection point between the first portion 1066 and the LED chip (or electrode) breaking can be further reduced.

[0089] Here, the length of the third portion 1068 is adopted from the length provided in any embodiment of the first portion 1066, and the description for the first portion 1066 can be referenced, as the third portion 1068 will not be described in detail here.

[0090] When the LED filament is bent, the second portion 1067 of the conductive part 106 is the main bending region (the part where the LED chip itself is located is less likely to be bent), and to reduce the risk of the second portion 1067 being torn apart when the LED filament is bent, the length of the second portion 1067 is set to be greater than the distance between the two adjacent LED chips (or LED chips and electrodes) that it matches. In other words, the length of the second portion 1067 is set to be greater than the projected length of the second portion 1067 in the height or thickness direction of the LED filament, and the conductive part 106 provided by this design has more margin when the LED filament 100 is bent, and can avoid the occurrence of breakage.

[0091] In some embodiments, the ratio of the length of the second portion 1067 to the distance between the corresponding two adjacent LED chips (or one LED chip and an electrode) (or the projected length of the second portion 1067 in the height or thickness direction of the LED filament) is greater than 1.1, 1.2, 1.3, or 1.4, so that when the LED filament is bent, the second portion 1067 is long enough to bend and deform in such a way that it is not pulled.

[0092] In some embodiments, the ratio of the length of the second portion 1067 to the distance between two adjacent LED chips (or one LED chip and an electrode) (or the projected length of the second portion 1067 in the height or thickness direction of the LED filament) is less than 2. If the length of the second portion 1067 is too long, it is detrimental to the coating effect of the light conversion layer, and consequently, the conductive portion 106 may be exposed from the light conversion layer. Furthermore, an excessively long second portion 1067 leads to material waste.

[0093] In some embodiments, the second portion 1067 has at least two inflection points such that the conductive portion 106 is substantially wavy ("w" shaped or "m" shaped), as shown in Figure 24A, the second portion 1067 has a first inflection point 1067a and a second inflection point 1067b, with the surface on which the LED chip is connected to the conductive portion 106 as the reference plane, the first inflection point 1067a is located in a height region below the first engagement portion 1061 or the second coupling portion 1062, and the second inflection point 1067b is located in a height region above the first engagement portion 1061 or the second coupling portion 1062. As a result, after the second part 1067 is connected to the first part 1066, it first extends downward to the first bending point 1067a, then turns after the first bending point 1067a and extends upward to the second bending point 1067b, then turns after the second bending point 1067b and connects to the third part 1068 in a downward direction, thereby causing the conductive part 106 to exhibit a wavy shape (inverted "w" shape or "m" shape), and furthermore, the conductive part 106 has a large expansion and contraction rate and is resistant to breakage.

[0094] Referring to Figure 25, which shows a schematic diagram of an embodiment of the present invention in which LED chips are installed at an angle, as shown in the figure, two adjacent LED chips are installed at an angle. This angled installation means that the chips are installed at an angle with respect to the longitudinal direction of the LED filament, and the long sides to which the two LED chips are connected are kept parallel, that is, they are installed at the same angle of inclination. In this way, the wire arc span of the conductive part connecting the chips can be reduced by 1 / 3, the expansion and contraction rate of the conductive part increases, and the risk of breakage of the conductive part between the chips can be reduced. Furthermore, the angle of inclination of the LED chips may be set to any value between 10° and 20°, and the angle of the inclination is the eggplant angle between the long side of the LED chip and the longitudinal direction of the filament, that is, the α angle in Figure 25.

[0095] The conductive part connecting the LED chip and the electrode is prone to breakage at position C. For example, in an embodiment where multiple rows of LED chips are installed and the distance between the LED chips adjacent to the two rows of electrodes is different, as shown in Figures 6 and 7, the two rows of LED chips are installed alternately, and the LED chip b n The distance between the LED chip a and electrode 104 is m The distance between the LED chip a is clearly smaller than the distance between the electrode 104, and thus, m The wire arc span of the conductive part 106 directly connected between the LED chip b and electrode 104 is n The wire arc span directly connected to the conductive part 106 between the electrode 104 must be clearly larger, and thus, LED chip b n Compared to the conductive portion 106 between the LED chip a and electrode 104, m The wire arc expansion rate of the conductive portion 106 between the electrode 104 and the electrode 104 is small, making it prone to breakage.

[0096] Therefore, in some embodiments, the length of the conductive portion can be reduced and the breakage of the conductive portion between the chip and the electrode can be reduced by connecting at least two LED chips that need to be connected to the electrode in the vicinity of the electrode so as to share a welding spot. Referring to Figure 26, a schematic diagram of the structure in which an electrode is connected to an LED chip in one embodiment of the present invention is shown, where LED chip a m This is the chip closest to electrode 104 in the first row of chips, and LED chip b n This is the chip closest to electrode 104 in the second row of chips, and both ends of one conductive part 106 are LED chip a m The first electrical connection point and LED chip b n By being connected to the first electrical connection point, the LED chip a m and LED chip b n The two poles become the same (common cathode or common anode; when the first electrical connection is positioned as a cathode, it becomes a common cathode, and when the first electrical connection point is positioned as an anode, the common pole becomes a common anode), that is, LED chip b n The first electrical connection point is designated as the common electrode connection point, and the other conductive part 106 is connected between the common electrode connection point and the electrode 104. In this configuration, the LED chip a m The wire arc span required for the conductive part 106 connected to it is significantly reduced (by almost half), which can reduce the likelihood of breakage from the tip to the electrode conductive part.

[0097] Furthermore, the problem of the conductive part connecting the LED chip and the electrode breaking can be improved in other ways. In some embodiments, the LED chip and its corresponding electrode are connected via at least two conductive parts, each conductive part forming at least two bent regions, and the bent regions of the at least two conductive parts are alternately distributed in the height or thickness direction of the LED filament. In some examples, the at least two conductive parts may be configured as the conductive part structure described in any of the embodiments above, and can be referred to above-mentioned Figures 22A to 24B and their related descriptions, provided that the connection positions of the at least two conductive parts are adjusted accordingly.

[0098] Referring to Figures 27A to 27C, these are schematic diagrams of a structure in which an LED chip and its corresponding electrode are connected via two conductive parts at different viewing angles in one embodiment of the present invention. For convenience of explanation, the two conductive parts will be referred to as the first conductive part 106' and the second conductive part 106'', respectively. The first end of the first conductive part 106' is connected to the LED chip 101, and the second end is connected to the electrode 104. The first end of the second conductive part 106'' is connected to the electrode 104, and the second end is connected to the LED chip 101. The first conductive part 106 has a first inflection point 1067a' and a second inflection point 1067b'. The first bending point 1067a' is formed correspondingly to form an upward first bending region (it may also be understood that the first conductive portion 106' rotates through the first bending point 1067a' to form the first bending region), and the second bending point 1067b' is formed corresponding to a second bending region with a downward opening (it can also be understood that the first conductive portion 106' bends upward at the first bending point 1067a' and extends downward through the second bending point 1067b' to form the second bending region). The second conductive portion 106'' has a first inflection point 1067a'' and a second inflection point 1067b'', the first inflection point 1067a'' being formed to form an upward first inflection region (this may be understood as the second conductive portion 106'' initially extending downward, then rotating through the first inflection point 1067a'' and extending upward to form the first inflection region), and the second inflection point 1067b'' being formed to form a downward second inflection region (this may be understood as the second conductive portion 106'' rotating through the first inflection point 1067a'' and extending upward, then passing through the second inflection point 1067b'' and extending downward to form the second inflection region).Since the first conductive portion 106' and the second conductive portion 106' are connected between the LED chip 101 and the electrode 104 with opposite upward and downward tendencies, after connection, the first bent region formed by the first bending point 1067a' of the first conductive portion 106' intersects vertically with the second bent region formed by the second bending point 1067b'' of the second conductive portion 106'', and the second bent region formed by the second bending point 1067b' of the first conductive portion 106' intersects vertically with the first bent region formed by the first bending point 1067a'' of the second conductive portion 106''. Notably, this vertical intersection does not necessarily require absolute alignment of the two bent regions in the height or thickness direction of the LED filament; it is sufficient for them to intersect with the overall bending tendency of the two bent regions.

[0099] Here, the position and method of forming the bends of the first conductive portion 106' and the second conductive portion 106'' can be described by referring to the explanations of Figures 24A and 24B above, and will not be described here. The connection method and wire arc structure between the first end of the first conductive portion 106' and the LED chip 101 can adopt the structure described in any one of the embodiments described in Figures 22A to 23B above, and the connection method and wire arc structure between the first end of the second conductive portion 106'' and the electrode 104 can adopt the structure described in any one of the embodiments described in Figures 22A to 23B above, and will not be described here. Furthermore, the first conductive portion 106' and the second conductive portion 106'' may have more bends. For example, the second conductive portion 106'' in Figure 27B further has a third bend 1067c'', and the second conductive portion 106'' continues to be connected to the LED chip 101 via the third bend 1067c''.

[0100] In any embodiment in which at least two conductive parts are connected between an LED chip and its corresponding electrode, the bending regions of the at least two conductive parts are alternately distributed in the height or thickness direction of the LED filament, thereby forming complementarity, achieving force distribution and common load, and preventing fracture of the conductive parts between the electrode and the chip.

[0101] As shown in Figure 27C, the length D3 from the electrode edge of the conductive part closest to the LED filament edge (i.e., the first conductive part 106' in Figure 27B) among the at least two conductive parts is 30 μm or more, preferably 50 μm or more.

[0102] As shown in Figure 27A, when viewed from the longitudinal direction of the LED filament, the step difference h1 (i.e., the distance between one inflection point) from the first inflection point 1067A' of the first conductive portion 106' to the corresponding joint on the chip (the joint of the LED chip 101 in Figure 27A) is set to 40 μm ± 5%. The step difference h2 (i.e., the distance between two inflection points) from the second inflection point 1067b' of the first conductive portion 106' to the corresponding joint on the chip (the joint of the LED chip 21 in Figure 27A) is set to 75 μm ± 5%. In terms of the height or thickness of the LED filament, the vertical distance from the first inflection point 1067a' of the first conductive part 106' to the corresponding surface of the chip is lower than any value in the range of 30 μm to 100 μm of the height of the chip surface (which is the surface connected to the first conductive part 106') (height of the first inflection point in Figure 27A), and the vertical distance from the second inflection point 1067b' of the first conductive part 106' to the corresponding surface of the chip is higher than any value in the range of 100 μm to 160 μm of the height of the chip surface (which is the surface connected to the first conductive part 106') (height of the second inflection point in Figure 27A).

[0103] As shown in Figure 27B, when viewed from the longitudinal direction of the LED filament, the horizontal distance S1 (i.e., the distance of one bending point) from the first bending point 1067a'' of the second conductive part 106'' to the corresponding joint on the electrode 104 is set to 40 μm ± 5%. The horizontal distance S2 (i.e., the distance of two bending points) from the second bending point 1067b'' of the second conductive part 106'' to the corresponding joint on the electrode 104 is set to 75 μm ± 5%. The horizontal distance S3 (i.e., the distance of three bending points) from the third bending point 1067c'' of the second conductive part 106'' to the corresponding joint on the electrode 104 is set to 90 μm ± 5%. In terms of the height or thickness of the LED filament, the vertical distance from the first inflection point 1067a'' of the second conductive part 106'' to the surface of the corresponding chip (LED chip 101 in Figure 27B) is lower than any value in the range of 30 μm to 100 μm of the height of the chip surface (the surface connected to the second conductive part 106'') (the height of the first inflection point in Figure 27B). The vertical distance from the second inflection point 1067b'' of the second conductive part 106'' to the surface of the corresponding chip (LED chip 21 in Figure 27B) is higher than any value in the range of 80 μm to 120 μm of the height of the chip surface (the surface connected to the second conductive part 106'') (the height of the second inflection point in Figure 27B).

[0104] It should be understood that, for an LED filament, electrodes need to be connected to multiple LED chips and conductive parts, and different LED chips may be connected to different electrodes. This invention does not necessarily require that the connection between the LED chip and its corresponding electrode adopt the same structure. Those skilled in the art can adopt a combination of the above-mentioned methods. For example, as shown in Figures 27A and 27B, a method can be adopted in which an LED chip 101 close to electrode 104 and far from electrode 104 is connected to a double conductive part, or in which an LED chip 102 close to electrode 104 is connected to a conductive part. Of course, such a method of providing at least two conductive parts as shown in Figures 27A and 27B may also be used to connect two adjacent LED chips, and this invention is not limited thereto.

[0105] This invention further discloses methods for connecting chips and methods for connecting chips and electrodes, the methods of which are used to form structures corresponding to LED filaments disclosed in any embodiment of this invention, and the relevant explanations in Figures 1 to 27C described above can be found, and are omitted here.

[0106] This invention further discloses an LED filament lamp, in which an LED filament disclosed in any embodiment of this invention is arranged inside. The structure of the LED filament is described in the related explanations in Figures 1 to 27C above and is omitted here. Specifically, the LED filament may be provided in the LED filament lamp by certain bending or deformation, and the LED filament lamp is, for example, a light bulb lamp.

[0107] The present invention further discloses an LED bulb comprising a lamp housing and a lamp head connected to the lamp housing, wherein at least one cantilever, a stem and at least one LED filament are provided within the lamp housing, the stem comprising an upright rod, and each cantilever comprising opposing first and second ends, the first end of the cantilever being connected to the upright rod and the second end of the cantilever being connected to the LED filament. Here, the structure of the LED filament can be configured as the LED filament disclosed in any embodiment of the present invention, and the relevant description in Figures 1 to 27C above can be found, and is omitted here. The LED bulb may have other structures, for example, the LED bulb comprising a lamp housing and a lamp head connected to the lamp housing, wherein the stem and LED filament are provided within the lamp housing.

[0108] Specifically, as shown in Figure 28, Figure 28 shows a schematic diagram of a light bulb using the LED filament described in Figures 1 to 27A in one embodiment of the present invention. The LED light bulb 1 comprises a lamp head 4 and a lamp housing 5 connected to the lamp head 4, the lamp housing 5 and the lamp head 4 forming a sealed housing chamber, inside which are provided at least one cantilever 31, a stem 3 and at least one LED filament 10, the stem 3 is connected to the lamp head 4 and extends a standing rod 30 toward the direction away from the lamp head 4, the stem 3 is provided with at least one cantilever 31, each cantilever 31 includes opposing first and second ends, the first end of the cantilever is connected to the standing rod 30 (or stem 3) and the second end of the cantilever 31 is connected to the LED filament 10, in some other embodiments the cantilever may be called a conductive bracket. Electrodes 103 and 104 are provided at the ends of the LED filament 10, one electrode is connected to the cantilever 31 and the other electrode is connected to the standing rod 30 (or stem 3), and the LED filament 10 includes a light conversion layer 105, at least one LED chip (101, 102), at least one electrode (103, 104) and a conductive part 106. Of these, the light conversion layer 105 includes a top layer 1051 and a support layer 1052, the top layer 105 includes opposing upper and lower surfaces, the support layer 1052 includes opposing upper and lower surfaces, the chips (101, 102) include opposing upper and lower surfaces, the upper surface and at least a portion of the support layer 1052 are in contact with the lower surface of the top layer 1051, the upper surfaces of the LED chips (101, 102) are closer to the upper surface of the top layer 1051 than to the lower surfaces of the LED chips, the distance from the lower surfaces of the LED chips (101, 102) to the lower surface of the support layer is smaller than the distance from the lower surface of the LED chips to the upper surface of the top layer, adjacent LED chips are connected and electrically conductive via the conductive portion, the light conversion layer encloses at least a portion of the LED chips (101, 102), the conductive portion 106 and the electrodes, the conductive portion includes at least two bent portions and the conductive portion extends in at least two different planes.

[0109] The LED filament 10 located inside the LED bulb has LED chips (101, 102) arranged alternately along the width direction of the LED filament 1, and the ratio of the sum of the lengths of the LED chips (101, 102) along the length direction of the LED filament to the length of the LED filament is 0.5 or more. The LED chips are connected to each other in series or parallel, or connected in series first and then in parallel, or connected in parallel first and then in series, or a connection of two of these methods is made. The conductive portion 106 of the LED filament 1 includes a first bent portion and a second bent portion, the first bent portion extending along the length direction of the LED chip, and the second bent portion extending along the width direction of the LED chip. A buffer region is formed between the first bent portion and the second bent portion, and the buffer region has an arc-shaped structure or other multiple reflection domains, and the length of the buffer region is 100 μm to 120 μm.

[0110] The LED filament 10 located inside the LED bulb further includes a first portion, a second portion connected to the first portion, and a third portion connecting the second portion, wherein the first portion, when projected onto an LED chip (or electrode) disposed thereon in the thickness direction of the LED filament, completely falls within the range limited by the LED chip (or electrode); the second portion, in the longitudinal direction of the LED filament, is projected onto two adjacent LED chips (or connected LED chips) connected to the conductive portion; the third portion corresponds to the second end of the conductive portion for connecting the LED chip (or electrode) and, when projected onto an LED chip (or electrode) disposed in the thickness direction of the LED filament, completely falls within the range limited by the LED chip (or electrode).

[0111] An LED filament 10 located inside an LED light bulb, wherein the LED chips (101, 102) contained therein are provided with a first electrical connection portion and a second electrical connection portion, the conductive portion 106 forms a first coupling portion with the first electrical connection portion, and a second coupling portion is formed with the first coupling portion via a tin ball, the second coupling portion and the edge of the LED chip are at a predetermined distance apart, and in some embodiments, the surface of the second coupling portion has at least two types of roughness.

[0112] In some embodiments, the LED filament 10 located inside the LED bulb is connected to the LED chip (10, 102) and the electrodes (103, 104) via at least two conductive parts 106.

[0113] In some embodiments, the LED filament 10 located inside the LED bulb has a conductive portion 106 which includes a first conductive portion and a second conductive portion, and the first conductive portion and the second conductive portion have a first bending point and a second bending point. A first bending region with an upward-facing opening is formed corresponding to the first bending point of the first conductive portion, a second bending region with a downward-facing opening is formed corresponding to the second bending point, a first bending region with a downward-facing opening is formed corresponding to the first bending point of the second conductive portion, and a second bending region with an upward-facing opening is formed corresponding to the second bending point, that is, the first conductive portion and the second conductive portion are connected to the LED chip and the electrode in opposite upward and downward directions.

[0114] In some embodiments, an LED filament 10 having a three-dimensional structure is installed inside the LED bulb 1.

[0115] In some embodiments, the LED bulb 1 is provided with at least two mutually wound LED filaments 10 inside.

[0116] Referring to Figure 28 and the further development description above, the LED bulb 1 has a lamp housing 5 with a central axis, i.e., the housing 5 is designed symmetrically with respect to the central axis. In some embodiments, the central axis is also the central axis of the lamp head 4, the lamp head 4 is connected to the housing 5, and a stem 3 is further provided, located within the lamp housing 5 along the central axis of the lamp housing 5.

[0117] The lamp housing 5 is further provided with at least one cantilever 31, which may also be called a conductive bracket 31, and in one embodiment includes two conductive brackets 31, the two conductive brackets having opposite polarities.

[0118] A drive circuit is provided inside the lamp head 4, and this drive circuit is electrically connected to the two conductive holders 31, and includes a flexible LED filament provided inside the lamp housing and electrically connected to the two conductive holders, the flexible LED filament includes the following:

[0119] The LED segment includes a plurality of LED chips (101, 102) connected in series and a light conversion layer 105 enclosing the plurality of LED chips. A first conductive electrode 103 is provided at one of the ends of the LED segment, electrically connected to the plurality of LED chips (101, 102) and one of the two conductive brackets 31, and a portion of the first conductive electrode 103 is encased in the light conversion layer 105.

[0120] As shown in Figures 1-3, a second conductive electrode 104 is provided at the other end of each end of the LED segment, fixed to and electrically connected to the plurality of LED chips and the other of the two conductive brackets 31, and a part of the second conductive electrode 104 is encased in the light conversion layer 105. A conductive portion 106 is provided between the plurality of LED chips, and this conductive portion 106 connects electrodes to adjacent LED chips or LED chips to create conductivity, that is, it has a conductive portion 106 that is electrically connected between the plurality of LED chips.

[0121] Here, each of the multiple LED chips has an electrical connection part, and one end of the conductive part is connected to the electrical connection part. As shown in Figures 23A and 23B, the conductive part 106 has a first bent part 1064 and a second bent part 1065. The conductive part extends from the electrical connection part along a first direction of the LED chip (101, 102), extends through the first bent part 1064 in a second direction of the LED chip, and extends through the second bent part 1065 in a third direction of the LED chip. The first, second, and third directions are different directions. The first direction is the height direction of the LED chip, the second direction is the width direction of the LED chip, and the third direction is the length direction of the LED chip. The distance between the first bent portion 1064 and the surface of the LED chip is 80 μm to 120 μm, and the distance between the first bent portion 1064 and the second bent portion 1065 is 100 μm to 120 μm.

[0122] As shown in Figures 18A and 18B, the LED filament further includes a first solder layer, the first solder layer being made of solder material (e.g., solder paste, solder balls, etc.), the end of the conductive portion 106 is located between the electrical connection portion of the LED chip 102 and the first solder layer, and the projected area of ​​the first solder layer 1062 at the electrical connection portion of the LED chip 102 is larger than the projected area of ​​the bonding region between the conductive portion 16 and the electrical connection portion of the LED chip 102.

[0123] As shown in Figure 18B, the end (or end thereof) of the conductive portion 106, the electrical connection portion in the LED chip 102, and the first solder layer form a connection portion 1062, the connection portion 1062 has a mesh surface, and a plurality of protrusions and a plurality of recessed marks are arranged alternately on the mesh surface.

[0124] As shown in Figures 17A and 17B, the LED filament further includes a second solder layer, the second solder layer being made of a soldering material (e.g., solder paste, solder balls, etc.), and the end of the conductive portion 106 is located between the first solder layer and the second solder layer.

[0125] The projected area of ​​the first solder layer at the electrical connection portion of the LED chip 102 and the projected area of ​​the second solder layer at the electrical connection portion of the LED chip 102 are each larger than the projected area of ​​the bonding region between the conductive portion and the first solder layer and the second solder layer at the electrical connection portion of the LED chip 102.

[0126] The projected area of ​​the coupling region between the conductive portion 106 and the electrical connection portion of the LED chip 102 is smaller than the projected area of ​​the first solder layer, and the projected area of ​​the first solder layer is smaller than the projected area of ​​the second solder layer.

[0127] As shown in Figure 7, the multiple LED chips (101, 102) further include a first row of LED chips and a second row of LED chips, the first row of LED chips and the second row of LED chips are connected in parallel, the LED chips in the first row of LED chips are connected in series, the LED chips in the second row of LED chips are connected in series, and the first row of LED chips and the second row of LED chips are arranged alternately along the width direction of the LED filament.

[0128] As shown in Figures 27A, 27B, and 27C, the LED filament further includes a first conductive portion 106' and a second conductive portion 106'' electrically connected between the LED chip 101 and the first conductive electrode 104. One end of the first conductive portion 106' is connected to the LED chip 101, the other end of the first conductive portion 106' is connected to the first conductive electrode 104, one end of the second conductive portion 106'' is connected to the first conductive electrode 104, and the other end of the second conductive portion 106'' is connected to the LED chip 101. The first conductive portion 106' extends downward and upward, with a first inflection point 1067a' of the first conductive portion as the first inflection point of the first conductive portion, and then extends upward and downward, with a second inflection point 1067b' of the first conductive portion as the second inflection point of the first conductive portion. The second conductive portion 106'' first extends upward and downward with its first inflection point 1067b'' as the first inflection point of the second conductive portion, and then extends downward and upward with its second inflection point 1067a'' as the second inflection point of the second conductive portion.

[0129] It is particularly important to explain that the above-mentioned features of this invention can be combined in any arrangement and used to improve LED lamps, and that only the above-mentioned embodiments can be described in an exemplary manner. This invention is not limited thereto, and many modifications are possible without departing from the spirit of this invention and the scope limited by the attached utility model registration claims.

[0130] The above embodiments are merely illustrative examples illustrating the principle and effects of the present invention and do not limit it. Those skilled in the art can modify or alter the above embodiments without departing from the spirit and scope of the present invention. Therefore, any equivalent modifications or alterations completed by those skilled in the art without departing from the spirit and technical idea disclosed herein should still be included within the scope of the utility model claims of the present invention.

Claims

1. Lamp housing with a central axis, Lamp head connected to the lamp housing, A stem installed inside the lamp housing along the central axis of the lamp housing, Two conductive brackets having opposite polarities are installed inside the lamp housing. A drive circuit installed inside the lamp head and electrically connected to the two conductive brackets, It includes a flexible LED filament installed within the lamp housing and electrically connected to the two conductive brackets, The aforementioned flexible LED filament is An LED segment having a plurality of LED chips connected in series and a light conversion layer enclosing the plurality of LED chips, A first conductive electrode is provided at one of the ends of the LED segment, electrically connected to the plurality of LED chips and one of the two conductive brackets, and a portion of which is encased in the light conversion layer, A second conductive electrode is provided at the other end of both ends of the LED segment, electrically connected to the plurality of LED chips and the other of the two conductive brackets, and a portion of which is encased in the light conversion layer, and The plurality of LED chips include a conductive part that is electrically connected between them, One of the plurality of LED chips has an electrical connection portion, one end of the conductive portion is connected to the electrical connection portion, the conductive portion has a first bent portion and a second bent portion, the conductive portion extends from the electrical connection portion along a first direction of the LED chip, extends through the first bent portion in a second direction of the LED chip, extends through the second bent portion in a third direction of the LED chip, and the first direction, second direction and third direction are different directions. An LED light bulb characterized by [feature].

2. The LED light bulb according to claim 1, characterized in that the first direction is the height direction of the LED chip, the second direction is the width direction of the LED chip, and the third direction is the length direction of the LED chip.

3. The LED light bulb according to claim 1, characterized in that the distance between the first bent portion and the surface of the LED chip is 80 μm to 120 μm, and the distance between the first bent portion and the second bent portion is 100 μm to 120 μm.

4. The LED light bulb according to claim 1, wherein the flexible LED filament further includes a first solder layer, the first solder layer is made of solder material, and the end of the conductive portion is located between the electrical connection portion of the LED chip and the first solder layer.

5. The LED light bulb according to claim 4, characterized in that the projected area of ​​the first solder layer at the electrical connection portion of the LED chip is larger than the projected area of ​​the junction region between the conductive portion and the electrical connection portion of the LED chip.

6. The LED bulb according to claim 4, characterized in that the end of the conductive part, the electrical connection part of the LED chip, and the first solder layer are integrally formed to form a connection part, the connection part has a mesh-like surface, and a plurality of protrusions and a plurality of recesses are arranged alternately on the mesh-like surface.

7. The LED light bulb according to claim 4, characterized in that the flexible LED filament includes a second solder layer, the second solder layer is made of solder material, and the end of the conductive portion is located between the first solder layer and the second solder layer.

8. The LED light bulb according to claim 7, characterized in that the projected area of ​​the first solder layer at the electrical connection portion of the LED chip and the projected area of ​​the second solder layer at the electrical connection portion of the LED chip are each larger than the projected area of ​​the junction region between the conductive portion and the first solder layer and the second solder layer at the electrical connection portion of the LED chip.

9. The LED light bulb according to claim 7, characterized in that the projected area of ​​the coupling region between the conductive portion and the electrical connection portion of the LED chip is smaller than the projected area of ​​the first solder layer, and the projected area of ​​the first solder layer is smaller than the projected area of ​​the second solder layer.

10. The LED light bulb according to claim 1, wherein the plurality of LED chips further include a first row of LED chips and a second row of LED chips, the first row of LED chips and the second row of LED chips are connected in parallel, the LED chips in the first row of LED chips are connected in series, the LED chips in the second row of LED chips are connected in series, and the first row of LED chips and the second row of LED chips are arranged alternately along the width direction of the flexible LED filament.

11. The flexible LED filament further includes a first conductive portion and a second conductive portion electrically connected between the LED chip and the first conductive electrode, wherein one end of the first conductive portion is connected to the LED chip, the other end of the first conductive portion is connected to the first conductive electrode, one end of the second conductive portion is connected to the first conductive electrode, and the other end of the second conductive portion is connected to the LED chip. The first conductive portion extends downward and upward from its first bending point, and then extends upward and downward from its second bending point, The LED light bulb according to claim 1, characterized in that the second conductive portion first extends upward and downward from a first bending point of the second conductive portion, and then extends downward and upward from a second bending point of the second conductive portion.

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