Image pickup device and imaging device

Abstract

To provide an imaging element unit capable of reducing deterioration of an image signal due to the influence of a magnetic field generated in an imaging element unit.SOLUTION: In an imaging element unit in which an imaging element 101 is mounted on an imaging substrate 102, the imaging element 101 includes a pixel unit 270 having a plurality of pixels 260 arranged in a matrix in the horizontal direction and the vertical direction, and a vertical output line 310 that reads out the signal of pixels 260 arranged in the horizontal direction in the vertical direction. In a pixel portion area that overlaps with a pixel portion 270 when the imaging element 101 is projected onto the imaging substrate 102 from a direction orthogonal to the imaging surface of the imaging element 101, a leader wiring unit 420a that is connected to a connector 103 mounted on the imaging substrate 102 and supplies power to the imaging element 101 is not provided along a vertical output line 310.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention , taken The present invention relates to an image sensor unit and an imaging device, and more particularly to a technique for reducing noise that occurs in an image signal due to a magnetic field generated by a current flowing through a power supply wiring provided near an image sensor. [Background technology]

[0002] Electronic devices equipped with an image sensor unit are required to be lightweight and compact, and accordingly, image sensor units are also required to be compact. In general, conventional image sensor units have a structure in which an image sensor is mounted in a package having a concave structure made of ceramics or plastic, and the package is sealed with a cover glass and mounted on a printed circuit board on which peripheral circuit components are mounted. As one method for miniaturizing an image sensor unit, Patent Document 1 proposes a structure in which an image sensor is directly mounted on a printed circuit board. Patent Document 2 proposes an image sensor unit in which an image sensor is directly mounted on a printed circuit board to achieve a thin structure. Patent Document 3 proposes an image sensor in which a pixel unit of the image sensor and a signal processing unit are stacked to achieve a miniaturization. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2015-12211 A [Patent Document 2] JP 2015-106787 A [Patent Document 3] JP 2017-76872 A Summary of the Invention [Problem to be solved by the invention]

[0004] The imaging element units described in the above Patent Documents 1 and 2 can be made thinner than conventional imaging element units. However, because the imaging element is physically close to the power supply wiring on the printed circuit board, the imaging element is susceptible to the effects of magnetism generated by the current flowing through the power supply wiring, which causes a problem that noise is likely to occur in the image signal, which is the output signal from the imaging element.

[0005] In addition, the imaging element described in Patent Document 2 can be made smaller in area than conventional imaging elements. However, since a signal processing unit is located near the pixel unit, there is a problem that noise is likely to occur in the captured image due to the influence of a magnetic field generated by the power supply wiring of the signal processing unit.

[0006] Furthermore, it is generally known that the effect of the magnetic field generated by the current flowing through the power supply wiring on the surrounding area of ​​the power supply wiring depends on the current fluctuation per unit time. Therefore, when trying to reduce the size of the image sensor unit and the noise in the image signal, it is necessary to pay attention to the current fluctuation in the power supply wiring, which is a cause of noise.

[0007] Furthermore, due to the recent increase in the number of pixels and faster readout speeds of image sensors, the current fluctuations during one horizontal sync signal period of the image sensor are larger than before, and there is a problem that the magnetic field caused by the current fluctuations reduces the S / N ratio of the image signal of the image sensor. Generally, noise components are removed by CDS (correlated double sampling), but two-dimensional noise occurs in the image signal because the magnitude of the magnetic field generated during the readout period of the signal component and the noise component differs.

[0008] The present invention aims to provide an image sensor unit capable of reducing noise in an image signal caused by a magnetic field generated by a current flowing through a power supply line, and a compact image sensor unit capable of reducing current fluctuations in the power supply line. [Means for solving the problem]

[0009] The imaging element unit according to the present invention is an imaging element unit including a substrate and an imaging element mounted on the substrate, the imaging element having a pixel section having a plurality of pixels arranged in a matrix in a first direction and a second direction perpendicular to each other, and an output line provided parallel to the second direction and reading out a pixel signal in the second direction for each of the plurality of pixels arranged in the first direction, the substrate having a power supply wiring provided on a surface different from a surface on which the imaging element is mounted and supplying power to the imaging element, the power supply wiring having a first power supply wiring section provided so as not to be disposed along the second direction in a pixel section region overlapping with the pixel section when the imaging element is projected onto the substrate from a third direction perpendicular to the first direction and the second direction, The substrate is a multi-layer substrate, and the first power supply wiring portion is routed from a surface of the multi-layer substrate opposite to a surface on which the imaging element is mounted to an inner layer of the multi-layer substrate, routed to an outer periphery of the pixel region in the inner layer so as not to run parallel to the output line, and then wired so as to be taken out from the inner layer to a surface layer of the multi-layer substrate. It is characterized by: Effect of the Invention

[0010] According to the present invention, it is possible to reduce noise that occurs in an image signal due to a magnetic field generated by a current flowing through a power supply line, and also to reduce current fluctuations in the power supply line even in a small-sized image sensor unit. [Brief description of the drawings]

[0011] [Figure 1] 1 is a cross-sectional view showing a schematic configuration of an image sensor unit according to a first embodiment. [Diagram 2] 2 is a plan view showing a schematic configuration of an image sensor included in the image sensor unit. FIG. [Diagram 3] FIG. 2 is a diagram for explaining signal processing of an imaging element. [Figure 4] 4A and 4B are diagrams showing a power supply wiring pattern according to the first embodiment provided on an imaging substrate. [Diagram 5] 13 is a diagram showing a power supply wiring pattern according to the second embodiment provided on an imaging substrate. FIG. [Figure 6] 13 is a diagram showing a power supply wiring pattern according to a third embodiment provided on an imaging substrate. FIG. [Figure 7] 13 is a diagram showing power supply wiring according to a fourth embodiment provided on an imaging substrate. FIG. [Figure 8] FIG. 13 is a cross-sectional view showing a schematic configuration of an image sensor unit according to a fifth embodiment. [Figure 9] FIG. 13 is a diagram showing a power supply wiring pattern on an imaging substrate in the fifth embodiment. [Figure 10] FIG. 13 is a diagram showing a power supply wiring pattern on an imaging substrate in the sixth embodiment. [Figure 11] 13 is a cross-sectional view showing a schematic configuration of a portion of an image sensor unit according to a seventh embodiment. FIG. [Figure 12] FIG. 23 is a diagram showing a power supply wiring pattern in an image sensor according to the seventh embodiment. [Figure 13] FIG. 1 is a diagram showing an example of a power supply wiring pattern in a conventional imaging substrate. [Figure 14] FIG. 13 is a diagram showing another example of a power supply wiring pattern in a conventional imaging substrate. [Figure 15] FIG. 1 is a diagram showing an example of a power supply wiring pattern in a conventional image sensor. [Figure 16] 13 is a cross-sectional view showing a schematic configuration of an image sensor unit and a signal processing unit according to an eighth embodiment. FIG. [Figure 17] FIG. 17 is a diagram showing a schematic configuration of the image sensor unit in FIG. 16. [Figure 18] FIG. 13 is a diagram showing a schematic configuration of an image sensor unit according to a ninth embodiment. [Figure 19] FIG. 23 is a diagram showing a schematic configuration of an image sensor unit according to a tenth embodiment. [Figure 20] FIG. 23 is a diagram showing a schematic configuration of an image sensor unit according to an eleventh embodiment. [Figure 21] FIG. 1 is a diagram illustrating an example of the configuration of a conventional image sensor unit. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0012] Hereinafter, embodiments of the present invention will be described in detail with reference to the accompanying drawings.

[0013] First Embodiment 1 is a cross-sectional view showing a schematic configuration of an image sensor unit according to the first embodiment. The image sensor unit includes an image sensor 101, an image sensor board 102, a connector 103, a flexible wiring board 104, electronic components 105, wire bonding pads 106, a frame 107, and a cover glass 108.

[0014] 1 shows a cross section perpendicular to the imaging surface of an optical image in an image sensor 101. The image sensor 101 is a CMOS image sensor or the like that outputs an image signal in response to incident light. More specifically, as described later with reference to FIGS. 2 and 3, the image sensor 101 is an XY address type CMOS image sensor that performs an imaging operation in response to a control signal from a control circuit (not shown) and outputs an image signal. Note that, since a signal (pixel signal) output from each of a plurality of pixels 260 (see FIG. 2) constituting the image sensor 101 is a signal that forms an image, in this description, the signal output from the pixel 260 is referred to as an "image signal."

[0015] The imaging board 102 is a printed circuit board having power wiring made of a metal such as copper, and is equipped with the imaging element 101 and the like. A rigid board is suitably used for the imaging board 102 in order to mount the imaging element 101, and is made of, for example, glass epoxy. However, the imaging board 102 is not limited to this, and may be a flexible board using a plastic material, or an LTCC (low temperature co-fired ceramics) board using ceramics and copper wiring. In other words, it is sufficient that the board has a metal wiring pattern of copper or the like formed on a specific material, and that components can be mounted (implemented).

[0016] The connector 103 is a connection terminal such as a flexible connector or a board-to-board connector having multiple contacts, and is mounted on the imaging board 102. One end of the flexible wiring board 104 is connected to the connector 103, and a part of the other end is connected to a power source (not shown). Thus, power is supplied to the connector 103 from the outside through the flexible wiring board 104. Note that the flexible wiring board 104 may include wiring other than the wiring for supplying power, for example, wiring for transmitting control signals and image signals output from the imaging element 101. Also, instead of the flexible wiring board 104, a thin coaxial cable or the like may be used.

[0017] The electronic components 105 include active components such as a regulator that supplies power to the image sensor 101 and an oscillator that supplies the main clock of the image sensor 101, and passive components such as a bypass capacitor that filters noise components in the power supply to ensure stable operation of the image sensor 101.

[0018] The wire bonding pad 106 is an electrode formed by gold plating or other treatment on a surface layer of the imaging substrate 102 in order to connect the imaging element 101 and the imaging substrate 102 by wire bonding or the like. The wire bonding pad 106 is disposed on the same surface of the imaging substrate 102 as the imaging element 101.

[0019] The frame 107 is formed on the outer periphery of the imaging substrate 102, and is adhered to the imaging substrate 102 while holding a cover glass 108. The cover glass 108 is a member for sealing the imaging element 101, and is adhered and fixed to the frame 107. An anti-reflection film and the like are formed on the cover glass 108.

[0020] 2 is a plan view showing a schematic configuration of the image sensor 101. The image sensor 101 is a CMOS sensor including a pixel section 270 composed of a plurality of pixels 260, a control section 230, a signal processing section 240, and an output section 250. The pixel section 270 is composed of a plurality of pixels 260 arranged in a matrix in a horizontal direction (H direction (first direction)) and a vertical direction (V direction (second direction)) that are orthogonal to each other. In addition, in the pixel section 270, color filters in a 2×2 array in which odd-numbered rows are repeated with red (R) filters and green (G) filters, and even-numbered rows are repeated with green (G) filters and blue (B) filters are arranged so as to correspond to each pixel 260.

[0021] The control unit 230 is a circuit that selects the pixel array of the pixel unit 270 row by row, and drives and controls the reset operation and readout operation of the selected pixel row. The signal processing unit 240 is a circuit that performs signal processing such as A / D conversion on the image signals sent in units of rows via vertical output lines 310 (see FIG. 3). The output unit 250 is a circuit that outputs the digitized image signals in units of rows to the outside of the image sensor 101.

[0022] 3 is a diagram for explaining signal processing of the image sensor 101. A vertical output line 310 is commonly connected for each pixel column. Image signals of a row selected by a pixel control line 320 are read out to the corresponding vertical output line 310. The pixel control line 320 also simultaneously controls pixels 260 in one horizontal row, enabling resetting and signal readout. A load current source 330 drives the pixels 260 in the selected row via the vertical output line 310.

[0023] An analog signal of the pixel 260 is input to one input terminal of the comparator 340. A reference signal line 350 is connected to the other input terminal of the comparator 340, and a reference signal output from a reference signal generator (not shown) is input through the reference signal line 350. An output terminal of the comparator 340 is connected to a latch circuit 360. The latch circuit 360 holds a count value of a counter (not shown) input from a signal line 370 at the timing when the output of the comparator 340 changes. The held count value is stored in a memory 380 and held as a digital value. Various processes such as offset processing and gain processing of the digital signal stored in the memory are performed in a subsequent stage of the signal processing unit 240 transmitted via a horizontal transfer line 390. The digital signal passed through the signal processing unit 240 is output from the output unit 250 to the outside through an I / F (interface). This I / F is, for example, SubLVDS, SLVS, SLVS-EC, or the like.

[0024] 4 is a diagram showing the power supply wiring pattern according to the first embodiment provided on the imaging substrate 102 on the surface on which the connector 103 is mounted. The imaging element 101 and the wire bonding pads 106 are mounted on the surface opposite to the surface on which the connector 103 is mounted.

[0025] The image sensor 101 has a plurality of input terminals for power supply input, and therefore is also provided with a plurality of wire bonding pads 106 for power supply input.

[0026] 4 of the imaging substrate 102 is defined as end face A, the upper end face as end face B, the left end face as end face C, and the lower end face as end face D. In addition, a region that overlaps with the pixel section 270 when the imaging element 101 is projected onto the imaging substrate 102 from a direction perpendicular to the imaging surface of the imaging element 101 is referred to as a "pixel section region," and a region outside the pixel section region on the imaging substrate 102 is referred to as an "extra-pixel section region."

[0027] The lead-out wiring section 420a (first power supply wiring section) is provided so as to be led out from the connector 103 (electrical connection section connected to the power supply terminal of the connector 103) toward the end face A. The reason for leading out wiring section 420a toward the end face A is to suppress the occurrence of noise in the image signal of the imaging element 101 due to fluctuations in the current flowing through the lead-out wiring section 420a, which would result in a deterioration in the quality of the image signal.

[0028] That is, since the image signal of the image sensor 101 is read out via the vertical output line 310, it is significantly affected by the magnetic field in the vertical direction (V direction) along the vertical output line 310. Therefore, the direction in which the lead-out wiring portion 420a is led out is selected to be substantially parallel to the H direction toward the end face A, rather than the perpendicular direction toward the end face B or the end face D. Note that when the lead-out wiring portion 420a is led out toward the end face C, the wiring length in the H direction becomes longer than when the lead-out wiring portion 420a is led out toward the end face A. Therefore, the lead-out wiring portion 420a is led out toward the end face A from the electrical connection portion connected to the power supply terminal of the connector 103, so that the wiring length in the pixel area is as short as possible.

[0029] In the first embodiment, the lead-out wiring portion 420a is wired on the surface layer of the imaging board 102 on which the connector 103 is mounted. However, the present invention is not limited to this, and for example, when the imaging board 102 is a multi-layer board, the lead-out wiring portion 420a may be provided in an inner layer of the board. In this case, the lead-out wiring portion 420a is wired so as to extend from an electrical connection portion with the connector 103 provided on the board surface toward the inner layer of the board, toward the end face A in the inner layer of the board, and to be taken out from the inner layer of the board to the surface layer of the multi-layer board at the periphery of the pixel section area or in the area outside the pixel section.

[0030] The lead-out wiring section 420a led out towards the end surface A of the imaging substrate 102 is connected to a wiring section 420b (second power supply wiring section) provided along the outer periphery of the imaging substrate 102 in the region outside the pixel section. The wiring section 420b is connected to the wire bonding pad 106 at a portion shown by a dashed line overlapping the wiring section 420b. Here, in order to reduce the influence of a magnetic field generated by a current flowing through the wiring section 420b on the pixel section 270, it is desirable to provide the wiring section 420b at a certain distance (for example, about several millimeters) from the outer periphery of the pixel section region.

[0031] As described above, in the first embodiment, the lead-out wiring portion 420a is provided in the pixel region of the image sensor 101 so as not to run parallel to the wiring direction of the vertical output line 310. This makes it possible to reduce noise that occurs in the image signal due to a magnetic field accompanying a change in current flowing through the lead-out wiring portion 420a when the image sensor 101 is driven. Also, when CDS is performed when reading out the image signal of the image sensor 101, noise that occurs in the image signal due to a magnetic field can be reduced at each sampling timing. This makes it possible to obtain good image quality using an image signal with reduced noise (an image signal with a high S / N ratio).

[0032] <Second embodiment> In the second embodiment, a description will be given of another example of a power supply wiring pattern provided on the imaging board 102. Fig. 5 is a diagram showing a power supply wiring pattern according to the second embodiment provided on the imaging board 102, and is shown on the surface on which the connector 103 is mounted, similarly to Fig. 4.

[0033] 5 differs from the configuration in Fig. 4 in that a capacitor 515 is mounted near the connector 103. For example, when the flexible wiring board 104 is long because the power supply unit is far away from the imaging board 102, it is desirable to place the capacitor 515 near the connector 103 to avoid power supply fluctuations caused by the long power supply wiring length.

[0034] When the capacitor 515 is placed near the connector 103, it becomes necessary to wire the power supply wiring in an optimal pattern. Specifically, it is desirable to draw the power supply wiring in the H direction from the electrical connection portion for the power supply terminal of the connector 103, as in the first embodiment.

[0035] In addition, it is ideal to arrange the electrodes of the capacitor 515 along the H direction (so that the long sides of the capacitor 515 are approximately parallel to the H direction). That is, in the pixel area of ​​the image sensor 101, the orientation of the capacitor 515 is not parallel to the wiring direction of the vertical output line 310. This makes it possible to reduce noise that occurs in the image signal due to a magnetic field generated when a current is supplied from the capacitor 515.

[0036] 5, in the second embodiment, the lead-out wiring section 520a is led out in the direction of the end face A from the electrical connection section between the power supply terminal of the connector 103 and the electrode of the capacitor 515. This makes it possible to reduce noise that occurs in the image signal due to a magnetic field caused by a change in the current flowing through the lead-out wiring section 520a when the imaging element 101 is driven. Note that, similarly to the first embodiment (FIG. 4), the lead-out wiring section 520a is connected to a wiring section 520b provided along the outer periphery of the imaging substrate 102 in the region outside the pixel section.

[0037] As described above, in the second embodiment, similarly to the first embodiment, the lead-out wiring portion 520a is not run parallel to the wiring direction of the vertical output line in the pixel portion area, and the wiring portion 520b is wired along the outer periphery of the imaging substrate 102 in the area outside the pixel portion. This makes it possible to reduce noise in the image signal caused by a magnetic field accompanying a change in current flowing through the lead-out wiring portion 520a and the wiring portion 520b when the imaging element 101 is driven, thereby making it possible to obtain good image quality. Also, in the second embodiment, the capacitor 515 that supplies power is disposed near the connector 103. This makes it possible to suppress power supply fluctuations.

[0038] <Third embodiment> In the third embodiment, a description will be given of yet another example of a power supply wiring pattern provided on the imaging board 102. Fig. 6 is a diagram showing a power supply wiring pattern according to the third embodiment provided on the imaging board 102, and is shown on the surface on which the connector 103 is mounted, similarly to Fig. 4.

[0039] Here, it is assumed that the power supplied from a power supply unit (not shown) via the connector 103 is used after level conversion within the imaging board 102. Therefore, the configuration in Fig. 6 is different from the configurations in Figs. 4 and 5 in that an extraction wiring unit 630a extracted from the connector 103 is connected to a regulator 610.

[0040] Two lead-out wiring sections 630a and 630b are provided in the pixel area. The lead-out wiring section 630a is led out from an electrical connection section with the power supply terminal of the connector 103 toward the end face C in a direction substantially parallel to the H direction, and is connected to an input terminal of the regulator 610. The lead-out wiring section 630b is led out from an electrical connection section with the output terminal of the regulator 610 in a direction substantially parallel to the H direction toward the end face C, and is connected to the outer periphery of the pixel area. The lead-out wiring section 630b is connected to a wiring section 630c provided in the pixel area. The wiring section 630c is provided along the outer periphery of the imaging substrate 102 in the pixel area in the same manner as the wiring section 420b in FIG. 4, and is connected to the wire bonding pad 106 at a predetermined position.

[0041] In this way, even when the regulator 610 is disposed in the imaging substrate 102 to supply power to the imaging element 101, an outgoing wiring section is provided in the pixel area along the H direction of the imaging element 101. Then, the power supply wiring drawn out to the area outside the pixel area is wired along the outer periphery of the imaging substrate 102. This makes it possible to obtain the same effect as that obtained in the first embodiment. Also, as shown in FIG. 6, a capacitor 620 is mounted near the output side (outgoing wiring section 630b side) of the regulator 610. This makes it possible to suppress current fluctuations when the imaging element 101 is driven and to provide a stable power supply.

[0042] As described above, in the third embodiment, similarly to the first embodiment, the lead-out wiring parts 630a and 630b are not arranged parallel to the wiring direction of the vertical output line 310 in the pixel area, and the wiring part 630c is arranged along the outer periphery of the imaging substrate 102 in the area outside the pixel area. This makes it possible to reduce noise generated in the image signal due to a magnetic field caused by a change in the current flowing through the lead-out wiring parts 630a and 620b and the wiring part 630c when the imaging element 101 is driven, thereby obtaining good image quality, even when the power supply wiring is provided via the regulator 610. In addition, by mounting the capacitor 620 near the output side of the regulator 610, it becomes possible to perform a stable power supply to the imaging element 101.

[0043] <Fourth embodiment> The fourth embodiment shows an example in which power supply wiring is not run parallel to internal signal lines that are wired along the horizontal direction of the imaging element 101. Fig. 7 shows power supply wiring according to the fourth embodiment provided on the imaging board 102, and is shown on the surface on which the connector 103 is mounted, as in the previous drawings. Common parts are given the same reference numerals, and detailed explanations will be omitted.

[0044] Here, it is assumed that the power supplied from a power supply unit (not shown) via the connector 103 is used after level conversion within the imaging board 102. Therefore, in the configuration of Fig. 7, similarly to Fig. 6, the lead-out wiring unit 720a led out from the connector 103 is connected to the regulator 610.

[0045] When the imaging element 101 is projected onto the imaging substrate 102 in a direction perpendicular to the imaging surface of the imaging element 101, the reference signal line 350 in Fig. 3 is represented by reference signal lines 350a and 350b in Fig. 7. The reference signal lines 350a and 350b are each connected to a reference signal generator 710.

[0046] When the image sensor 101 reads out an image signal, a reference signal whose voltage has been changed by a predetermined amount is output from the reference signal generator 710. Although one reference signal generator 710 is shown in Fig. 7, a configuration may be adopted in which, for example, different reference signal generators are provided for even-numbered rows and odd-numbered rows of the pixel section, respectively.

[0047] The reference signal line 350a is a wiring for inputting a reference signal to the comparator 340 provided on the end face B side via the vertical output line 310. The reference signal line 350b is a wiring for inputting a reference signal to the comparator 340 provided on the end face D side via the vertical output line 310. That is, the reference signal lines 350a and 350b are wired along the horizontal direction (H direction) of the image sensor 101, and therefore are susceptible to the influence of magnetic field noise from the leading wiring parts 720a and 720b, respectively. In addition, since the reference signal is a reference signal when the image signal of the image sensor 101 is AD converted, it is expected that horizontal shading will occur in the image due to noise being superimposed on the reference signal.

[0048] Therefore, in order to reduce the influence of the magnetic field generated by the current flowing through the lead-out wiring portions 720a and 720b on the reference signal lines 350a and 350b, it is desirable to provide the lead-out wiring portions 720a to 720c at a certain distance from the reference signal lines 350a and 350b. In addition, since the connector 103 connects the power supply unit and the power supply wiring, it is desirable to provide the connector 103 at a certain distance from the reference signal lines 350a and 350b.

[0049] The lead-out wiring portion 720b led out toward the end surface B of the imaging substrate 102 is connected to a lead-out wiring portion 720c provided along the outer periphery of the imaging substrate 102 in the region outside the pixel portion. The lead-out wiring portion 720c is connected to the wire bonding pad 106 in an overlapping portion shown by a dashed line. When the imaging substrate 102 is a multilayer substrate, the lead-out wiring portions 720a to 720c may be provided in an inner layer of the substrate.

[0050] As described above, in the fourth embodiment, the lead-out wiring parts 720a and 720b are not arranged to run parallel to the wiring direction of the reference signal lines 350a and 350b in the pixel area, and the wiring part 720c is arranged along the outer periphery of the imaging substrate 102 in the pixel area. In this way, when the reference signal lines 350a and 350b of the imaging element 101 are arranged along the horizontal direction, noise caused by a magnetic field accompanying a change in the current flowing through the power supply wiring (lead-out wiring parts 720a and 720b) ​​when the imaging element 101 is driven can be reduced, and good image quality can be obtained. Here, the reference signal lines have been described as an example, but the present invention is not limited to this embodiment, and can be applied to any signal wiring that can become a reference signal along the horizontal direction.

[0051] <Fifth embodiment> 8 is a cross-sectional view showing a schematic configuration of an image sensor unit according to the fifth embodiment. The image sensor unit includes an image sensor 101, an image sensor board 102, a connector 103, a flexible wiring board 104, electronic components 105, wire bonding pads 106, a frame 107, and a cover glass 108.

[0052] The imaging element 101 is a CMOS image sensor or the like that outputs an image signal in response to incident light. Note that FIG. 8 shows a cross section perpendicular to the imaging surface of the imaging element 101. The imaging board 102 is a printed circuit board having power wiring made of a metal such as copper, and is equipped with the imaging element 101 or the like. A rigid board is preferably used for the imaging board 102 in order to mount the imaging element 101, and is made of, for example, glass epoxy. However, the imaging board 102 is not limited thereto, and may be a flexible board made of a plastic material, or an LTCC (low temperature co-fired ceramics) board made of ceramics and copper wiring. In other words, it is sufficient that the board has a metal wiring pattern such as copper formed on a specific material, and components can be mounted (implemented).

[0053] The connector 103 is a connection terminal having a plurality of contacts, and is mounted on the imaging board 102. One end of the flexible wiring board 104 is connected to the connector 103, and a portion of the other end is connected to a power source (not shown). Thus, power is supplied to the connector 103 from the outside through the flexible wiring board 104. Note that the flexible wiring board 104 may include wiring other than the wiring for supplying power, for example, wiring for outputting a control signal or a signal of the imaging element 101. Also, instead of the flexible wiring board 104, a thin coaxial cable or the like may be used.

[0054] The electronic component 105 is a regulator, a capacitor, etc., necessary for operating the imaging element 101, and receives power supplied from the flexible wiring board 104 via the connector 103 to supply a desired voltage to the imaging element 101. The electronic component 105 is disposed in the vicinity of the connector 103, and therefore the effect of the current flowing through the power supply wiring between the electronic component 105 and the connector 103 on the imaging element 101 is considered to be small.

[0055] The wire bonding pad 106 is an electrode formed by gold plating or other treatment on a surface layer of the imaging substrate 102 in order to connect the imaging element 101 and the imaging substrate 102 by wire bonding or the like. The wire bonding pad 106 is disposed on the same surface of the imaging substrate 102 as the imaging element 101.

[0056] The frame 107 is formed on the outer periphery of the imaging substrate 102, and is adhered to the imaging substrate 102 while holding a cover glass 108. The cover glass 108 is a member for sealing the imaging element 101, and is adhered and fixed to the frame 107. An anti-reflection film and the like are formed on the cover glass 108.

[0057] Here, an example of a power supply wiring pattern on an imaging board of a conventional imaging element unit will be described. Fig. 13 is a diagram showing an example of a power supply wiring pattern provided on an imaging board of a conventional imaging element unit. The conventional imaging element unit shown in Fig. 13 is different from the imaging element unit according to the present embodiment in Fig. 8 only in the power supply wiring pattern provided on the imaging board. Therefore, among the components of the conventional imaging element unit in Fig. 13, the same components as those of the imaging element unit according to the present embodiment in Fig. 8 will be described using the same names and symbols as those of the components of the imaging element unit according to the present embodiment in Fig. 8.

[0058] 13 shows the surface of the imaging board 102 on which the connector 103 is mounted. The imaging element 101 and the wire bonding pads 106 are mounted on a surface different from the surface on which the connector 103 is mounted. Also, in FIG. 13, only the wire bonding pads 106 that are connected to a specific power source are shown among the multiple wire bonding pads 106. Note that the imaging element 101 has an analog power source that requires a large current, and in order to prevent deterioration of the power source due to wiring within the imaging element 101, multiple inputs are provided to the imaging element 101. For this reason, the wire bonding pads 106 are provided in multiple locations.

[0059] The imaging board 102 is provided with a power supply wiring 201 for supplying power from a power supply (not shown) to the imaging element 101 via the connector 103. In Fig. 13, the power supply wiring 201 runs from an area where the connector 103 is mounted (an area that serves as a contact point with the connector 103, hereinafter referred to as a "power supply connection portion") to the left end of the imaging board 102.

[0060] For convenience of explanation, the portion drawn from the power supply connection portion toward the end of the imaging substrate 102 is referred to as the "drawing wiring portion" below, and is written as the "drawing wiring portion 201A." Note that the definition that "the portion drawn from the power supply connection portion toward the substrate end is referred to as the drawing wiring portion" is used in the same manner for the power supply wiring according to the embodiment of the present invention described below, and for conventional power supply wiring described for comparison.

[0061] The power supply wiring 201 is routed from the lead-out wiring portion 201A to a region that corresponds to the vicinity of the outer periphery of the imaging element 101 when viewed from a direction perpendicular to the imaging surface of the imaging element 101. For convenience of explanation, the portion of the power supply wiring 201 that is provided along the outer periphery of the imaging element 101 will be referred to as the "outer periphery wiring portion" below. The outer periphery wiring portion is electrically connected to the wire bonding pads 106 at multiple points.

[0062] The current in the power supply wiring 201 fluctuates according to current fluctuations in the loads connected to the power supply wiring 201. Also, this is a portion of the power supply wiring 201 where current concentrates. Therefore, when there is only one wiring portion drawn out from the connector 103 (power supply wiring section) like the power supply wiring 201, the current flowing through the drawn-out wiring section 201A fluctuates according to current fluctuations in all the loads of the image sensor 101 connected to the power supply wiring 201. As a result, magnetic noise is likely to occur due to fluctuations in the current flowing through the drawn-out wiring section 201A.

[0063] To address this problem, in the image sensor unit of this embodiment, as described below with reference to FIG. 9, the power supply wiring is divided into multiple parts, thereby reducing current fluctuations in the power supply wiring (especially the lead-out wiring section).

[0064] 9(a) to (c) are diagrams showing an example of a power wiring pattern on the imaging board 102, and similarly to FIG. 6, they show the surface of the imaging board 102 on which the connector 103 is mounted. FIG. 9(a) is a diagram showing a first example of power wiring that supplies power to the imaging element 101. The power wiring in FIG. 9(a) has a first power wiring 301 and a second power wiring 302.

[0065] In FIG. 9(a), the first power wiring 301 is wired from the power connection portion that serves as the contact point with the connector 103 toward the left end of the imaging board 102, and then routed to a region that corresponds to the vicinity of the outer periphery of the imaging element 101 when viewed from a direction perpendicular to the imaging surface of the imaging element 101.

[0066] Hereinafter, the wiring portion of the first power supply wiring 301 extending from the connector 103 (power supply connection portion) to the left end of the imaging board 102 will be referred to as the "first outgoing wiring portion 301A." Also, the wiring portion of the first power supply wiring 301 provided along the outer periphery of the imaging element 101 will be referred to as the "first outer periphery wiring portion." The first outgoing wiring portion 301A is a portion of the first power supply wiring 301 where current is concentrated.

[0067] In FIG. 9(a), the second power wiring 302 is wired from the power connection portion that serves as the contact point with the connector 103 toward the right end of the imaging board 102, and then routed to a region that corresponds to the vicinity of the outer periphery of the imaging element 101 when viewed from a direction perpendicular to the imaging surface of the imaging element 101.

[0068] Hereinafter, the wiring portion of the second power supply wiring 302 extending from the connector 103 (power supply connection portion) to the right end of the imaging board 102 in FIG. 9(a) is referred to as the "second outgoing wiring portion 302A." Also, the wiring portion of the second power supply wiring 302 provided along the outer periphery of the imaging element 101 is referred to as the "second outer periphery wiring portion." The second outgoing wiring portion 302A is a portion of the second power supply wiring 302 where current is concentrated.

[0069] Power is supplied to all of the wire bonding pads 106 through the first power supply wiring 301 and the second power supply wiring 302. When the imaging substrate 102 has a multi-layer structure, it is desirable to wire the first power supply wiring 301 and the second power supply wiring 302 on a layer far from the imaging element 101 in order to minimize the influence of magnetic noise generated from the first power supply wiring 301 and the second power supply wiring 302 on the imaging element 101.

[0070] In the conventional power wiring in FIG. 13, all the loads of the imaging element 101 are connected to the power wiring 201. In contrast, when the power wiring is divided into the first power wiring 301 and the second power wiring 302 and provided on the imaging board 102 as in the present embodiment, the load of the imaging element 101 is distributed to the first power wiring 301 and the second power wiring 302. Therefore, the loads of the imaging element 101 connected to the first power wiring 301 and the second power wiring 302 are smaller than the load of the imaging element 101 connected to the power wiring 201. Therefore, compared to the lead-out wiring section 201A of the conventional power wiring 201 in FIG. 13, it is possible to reduce the current fluctuation in the first lead-out wiring section 301A and the second lead-out wiring section 302A.

[0071] The direction in which the second wiring portion 302A is drawn out from the connector 103 (hereinafter referred to as the "drawing direction") is desirably different from the direction in which the first wiring portion 301A is drawn out from the connector 103. This is because magnetic fields in the same direction have the property of being strengthened by overlapping with each other, and when magnetic fields in the same direction are generated, the image quality of the captured image (image signal) is degraded due to the influence of magnetic noise. In addition, it is desirably that the angle between the drawing direction of the second wiring portion 302A from the connector 103 and the drawing direction of the first wiring portion 301A from the connector 103 is 90° or more. This is because orthogonal magnetic fields do not interfere with each other, and magnetic fields in opposite directions have the property of canceling each other out, so that it is possible to more effectively suppress the degradation of the image quality of the captured image due to magnetic noise.

[0072] In consideration of these, the first and second escape wiring portions 301A and 302A are escaped in opposite directions from the connector 103. This makes it possible to minimize the superposition of magnetic fields caused by current fluctuations in the first and second escape wiring portions 301A and 302A, and minimize degradation of image quality caused by the influence of magnetic noise on the captured image.

[0073] It is desirable that the first power supply wiring 301 and the second power supply wiring 302 are provided so that the fluctuations of the load currents flowing through them are uniform. An example of wiring in this case will be described with reference to FIG. 9(b).

[0074] Fig. 9(b) is a diagram showing a second example of power supply wiring for supplying power to the imaging element 101. The power supply wiring in Fig. 9(b) is a wiring example in the case where the fluctuation in load current at two wire bonding pads 106B at the center of the left edge of the imaging substrate 102 is larger than that at the other wire bonding pads 106, and includes a first power supply wiring 303 and a second power supply wiring 304.

[0075] The first power supply wiring 303 is wired so as to be connected from the connector 103 to only the two wire bonding pads 106B having large load fluctuations. The second power supply wiring 304 is wired so as to be connected from the connector 103 to the wire bonding pads 106 other than the two wire bonding pads 106B. This makes it possible to effectively reduce the current fluctuations of the first outgoing wiring section 303A and the second outgoing wiring section 304A by making the fluctuations of the load currents flowing through the first power supply wiring 303 and the second power supply wiring 304 approximately the same. As a result, it is possible to reduce the degradation of the image quality of a captured image caused by magnetic noise generated from the first power supply wiring 303 and the second power supply wiring 304 wired from the connector 103.

[0076] One or more supplementary wires for supplying power for the same purpose as the first power supply wire 301 and the second power supply wire 302 may be drawn out from the connector 103 separately from the first power supply wire 301 and the second power supply wire 302. An example of this will be described with reference to FIG.

[0077] Fig. 9(c) is a diagram showing a third example of power supply wiring for supplying power to the image sensor 101. The power supply wiring in Fig. 9(c) has a first power supply wiring 305 and a second power supply wiring 306, as well as a third power supply wiring 307 and a fourth power supply wiring 308 as supplementary wiring.

[0078] 9(c), the third power supply wiring 307 is wired from the power supply connection portion that serves as the contact point with the connector 103 toward the upper end direction of the imaging substrate 102, and then routed to a region that corresponds to the vicinity of the outer periphery of the imaging element 101 when viewed from a direction perpendicular to the imaging surface of the imaging element 101. Also, in FIG. 9(c), the fourth power supply wiring 308 is wired from the power supply connection portion that serves as the contact point with the connector 103 toward the lower end direction of the imaging substrate 102, and then routed to a region that corresponds to the vicinity of the outer periphery of the imaging element 101 when viewed from a direction perpendicular to the imaging surface of the imaging element 101.

[0079] Hereinafter, the wiring portion of the third power supply wiring 307 extending from the connector 103 (power supply connection portion) to the upper end of the imaging board 102 is referred to as the "third outgoing wiring portion 307A." The wiring portion of the fourth power supply wiring 308 extending from the connector 103 (power supply connection portion) to the lower end of the imaging board 102 is referred to as the "fourth outgoing wiring portion 308A."

[0080] 9(c), the load of the image sensor 101 is distributed to four power supply wirings, the first power supply wiring 305 to the fourth power supply wiring 308. Therefore, the load of the image sensor 101 connected to each of the first power supply wiring 305 to the fourth power supply wiring 308 is smaller than the load of the image sensor 101 connected to each of the first power supply wiring 301 and the second power supply wiring 302 in FIG.

[0081] Therefore, it is possible to reduce current fluctuations in the first escape wiring portion 305A, the second escape wiring portion 306A, the third escape wiring portion 307A, and the fourth escape wiring portion 308A, compared to current fluctuations in the first escape wiring portion 301A and the second escape wiring portion 302A. This makes it possible to further reduce degradation of image quality of captured images caused by magnetic noise generated from the power supply wiring extending from the connector 103.

[0082] In addition, when three or more power supply wires are drawn out from the connector 103 like the power supply wires in Fig. 9(c), it is desirable to make the angle between the drawing directions of two arbitrarily selected drawing wiring parts from the connector 103 90° or more. In addition, when a supplementary wiring is used, it is possible to reduce the current fluctuation in each drawing wiring part, but the wiring area that generates magnetic noise increases. Therefore, it is desirable to provide the supplementary wiring only when the influence of magnetic noise on the captured image is small, taking into consideration the total wiring area on the imaging board 102.

[0083] As described above, in the fifth embodiment, the power supply wiring provided on the imaging board 102 is divided into multiple parts and drawn out from the power supply connection portion, which is the contact point with the connector 103. This reduces current fluctuations in the power supply wiring, and makes it possible to reduce degradation of image quality of a captured image due to magnetic noise generated from the power supply wiring.

[0084] Sixth embodiment Before describing the power supply wiring according to the sixth embodiment, another example of a conventional power supply wiring pattern will be described. Fig. 14 is a diagram showing another example of a power supply wiring pattern provided on an imaging substrate of a conventional imaging element unit.

[0085] The conventional image sensor unit shown in Fig. 14 differs from the image sensor unit according to this embodiment in Fig. 8 only in the power supply wiring pattern provided on the imaging board. Therefore, among the components of the conventional image sensor unit in Fig. 14, the same components as those of the image sensor unit according to this embodiment in Fig. 8 will be described using the same names and symbols as those of the components of the image sensor unit according to this embodiment in Fig. 8.

[0086] Fig. 14 shows the same surface as the surface on which the electronic component 105 is mounted in the imaging board 102 in Fig. 8, and the imaging element 101 and wire bonding pads 106 are mounted on a surface different from the surface on which the electronic component 105 is mounted. Also, as in Fig. 13, Fig. 14 shows only the wire bonding pad 106 connected to a specific power source among the multiple wire bonding pads. Note that the power supply wiring between the connector 103 and the electronic component 105 is not shown.

[0087] Here, the electronic component 105 is a linear regulator that generates a predetermined voltage. The imaging board 102 is provided with a power supply wiring 401 for supplying power from the electronic component 105 to the imaging element 101. An extraction wiring section 401A that is extracted from a power supply connection section, which is a contact point between the power supply wiring 401 and the electronic component 105, toward an end of the imaging board 102 is a section of the power supply wiring 401 where current concentrates.

[0088] The current fluctuation in the power supply wiring 401 is determined by the current fluctuation in the load connected to the power supply wiring 401. When there is only one wiring portion drawn out from the connector 103 (power supply wiring section) like the power supply wiring 401, the current flowing through the drawn-out wiring section 401A varies greatly according to the current fluctuation in all the loads of the image sensor 101 connected to the power supply wiring 401.

[0089] To address this problem, in the image sensor unit of this embodiment, as described below with reference to FIG. 10, the power supply wiring from the electronic component 105 is divided into multiple wirings, thereby reducing current fluctuations in each power supply wiring.

[0090] Figures 10(a) to (c) are diagrams showing another example of the power wiring pattern on the imaging board 102, and similar to Figures 9(a) to (c), show the surface of the imaging board 102 on which the electronic components 105 are mounted.

[0091] FIG. 10(a) is a diagram showing a fourth example of power supply wiring for supplying power to the imaging element 101. The power supply wiring in FIG. 10(a) has a first power supply wiring 501 and a second power supply wiring 502. In FIG. 10(a), the first power supply wiring 501 is wired from a power supply connection portion that is a contact point with the electronic component 105 toward the left end direction of the imaging substrate 102, and then routed to a region corresponding to the vicinity of the outer periphery of the imaging element 101 when viewed from a direction perpendicular to the imaging surface of the imaging element 101. In FIG. 10(a), the second power supply wiring 502 is wired from a power supply connection portion that is a contact point with the connector 103 toward the right end direction of the imaging substrate 102, and then routed to a region corresponding to the vicinity of the outer periphery of the imaging element 101 when viewed from a direction perpendicular to the imaging surface of the imaging element 101. The first outgoing wiring portion 501A of the first power supply wiring 501 is a portion where the current of the first power supply wiring 501 concentrates, and the second outgoing wiring portion 502A of the second power supply wiring 502 is a portion where the current of the second power supply wiring 502 concentrates.

[0092] Power is supplied to all of the wire bonding pads 106 through the first power supply wiring 501 and the second power supply wiring 502. When the imaging substrate 102 has a multi-layer structure, it is desirable to wire the first power supply wiring 501 and the second power supply wiring 502 on a layer far from the imaging element 101 in order to minimize the influence of magnetic noise generated from the first power supply wiring 501 and the second power supply wiring 502 on the imaging element 101.

[0093] In the conventional power wiring in FIG. 14, the load of the imaging element 101 is entirely connected to the power wiring 401. In contrast, when the power wiring is divided into a first power wiring 501 and a second power wiring 502 and provided on the imaging board 102, the load of the imaging element 101 is distributed to the first power wiring 501 and the second power wiring 502. Therefore, the load of the imaging element 101 connected to each of the first power wiring 501 and the second power wiring 502 is smaller than the load of the imaging element 101 connected to the power wiring 401. Therefore, in the first lead-out wiring portion 501A and the second lead-out wiring portion 502A, it is possible to reduce the current fluctuation compared to the lead-out wiring portion 401A of the power wiring 401 in FIG. 14.

[0094] The direction of the second wiring portion 502A leading out from the electronic component 105 is preferably different from the direction of the first wiring portion 501A leading out from the electronic component 105. This is because magnetic fields in the same direction have the property of being strengthened by overlapping with each other, and therefore, when magnetic fields in the same direction are generated, the effect of magnetic noise on the captured image becomes large. In addition, the angle between the direction of the second wiring portion 502A leading out from the electronic component 105 and the direction of the first wiring portion 501A leading out from the electronic component 105 is preferably 90° or more. This makes it possible to further reduce the effect of magnetic noise on the captured image and suppress deterioration of the image quality of the captured image due to magnetic noise.

[0095] In consideration of this, the first and second escape wiring portions 501A and 502A are escaped in opposite directions from the electronic component 105. This makes it possible to minimize the superposition of magnetic fields caused by current fluctuations in the first and second escape wiring portions 501A and 502A, and minimize degradation of image quality of captured images caused by magnetic noise.

[0096] It is desirable that the first power supply wiring 501 and the second power supply wiring 502 are provided so that the fluctuations of the load currents flowing through them are uniform. An example of wiring in this case will be described with reference to FIG. 10(b).

[0097] Fig. 10(b) is a diagram showing a fifth example of power supply wiring for supplying power to the imaging element 101. The power supply wiring in Fig. 10(b) is a wiring example in the case where the fluctuation in load current at two wire bonding pads 106B at the center of the left edge of the imaging substrate 102 is larger than that at the other wire bonding pads 106, and has a first power supply wiring 503 and a second power supply wiring 504.

[0098] The first power supply wiring 503 is wired so as to be connected from the electronic component 105 to only the two wire bonding pads 106B having large load fluctuations. The second power supply wiring 304 is wired so as to be connected from the electronic component 105 to the wire bonding pads 106 other than the two wire bonding pads 106B. This makes it possible to efficiently reduce the current fluctuations of the first outgoing wiring section 503A and the second outgoing wiring section 504A by making the fluctuations of the load currents flowing through the first power supply wiring 503 and the second power supply wiring 504 approximately the same. As a result, it is possible to reduce the influence of magnetic noise generated from the first power supply wiring 503 and the second power supply wiring 504 wired from the electronic component 105 on the captured image.

[0099] One or more supplementary wirings for supplying power for the same purpose as the first power supply wiring 501 and the second power supply wiring 502 may be drawn out from the electronic component 105 separately from the first power supply wiring 501 and the second power supply wiring 502. An example of this will be described with reference to FIG.

[0100] Fig. 10(c) is a diagram showing a sixth example of power supply wiring for supplying power to the image sensor 101. The power supply wiring in Fig. 10(c) has a first power supply wiring 505 and a second power supply wiring 506, as well as a third power supply wiring 507 and a fourth power supply wiring 508 as supplementary wiring.

[0101] 10(c), the third power supply wiring 507 is wired from the power supply connection portion that serves as the contact point with the electronic component 105 toward the upper end direction of the imaging substrate 102, and then routed to a region corresponding to the vicinity of the outer periphery of the imaging element 101 when viewed from a direction perpendicular to the imaging surface of the imaging element 101. In FIG. 10(c), the fourth power supply wiring 508 is wired from the power supply connection portion that serves as the contact point with the electronic component 105 toward the lower end direction of the imaging substrate 102, and then routed to a region corresponding to the vicinity of the outer periphery of the imaging element 101 when viewed from a direction perpendicular to the imaging surface of the imaging element 101.

[0102] 10(c), the load of the image sensor 101 is distributed to four power supply wirings, the first power supply wiring 505 to the fourth power supply wiring 508. Therefore, the load of the image sensor 101 connected to each of the first power supply wiring 505 to the fourth power supply wiring 508 is smaller than the load of the image sensor 101 connected to each of the first power supply wiring 501 and the second power supply wiring 502 in FIG.

[0103] Therefore, it is possible to reduce current fluctuations in the first escape wiring portion 505A, the second escape wiring portion 506A, the third escape wiring portion 507A, and the fourth escape wiring portion 508A, compared to current fluctuations in the first escape wiring portion 501A and the second escape wiring portion 502A. This makes it possible to further suppress degradation of image quality of a captured image due to magnetic noise generated from the power supply wiring routed from the electronic component 105.

[0104] In addition, when supplementary wiring is used, it is possible to reduce the current fluctuation in each lead-out wiring section, but the wiring area that generates magnetic noise increases. Therefore, it is desirable to provide supplementary wiring only when the influence of magnetic noise on the captured image is small, taking into consideration the total wiring area on the imaging board 102.

[0105] As described above, in the sixth embodiment, the power supply wiring provided on the imaging board 102 is divided into multiple parts and drawn out from the electronic component 105 (power supply connection portion). This reduces current fluctuations in the power supply wiring, and can reduce the effect of magnetic noise generated from the power supply wiring on the imaging element 101 (captured image).

[0106] Seventh embodiment In the fifth and sixth embodiments, the power supply wiring pattern provided on the imaging substrate has been described, whereas in the seventh embodiment, an embodiment of a power supply wiring pattern provided inside the imaging element will be described.

[0107] 11 is a cross-sectional view showing a schematic configuration of a portion of an image sensor unit according to the seventh embodiment. The image sensor unit has an image sensor 600 and an imaging substrate 603. The image sensor 600 has a light receiving layer 601, a signal processing layer 602, and a connector 605.

[0108] The light receiving layer 601 includes a pixel unit that outputs an image signal in response to incident light. The signal processing layer 602 includes a signal processing circuit (not shown) that processes the signal of the light receiving layer 601. The imaging board 603 is a printed circuit board, and the imaging element 600 is mounted (implemented). The imaging board 603 is preferably a rigid board in order to mount the imaging element 600, and is formed of, for example, glass epoxy. However, the imaging board 603 is not limited to this, and may be a flexible board using a plastic material, an LTCC (low temperature co-fired ceramics) board using ceramics and copper wiring, or the like. In other words, the imaging board 603 may be a board on which a metal wiring pattern such as copper is formed on a specific material and on which components can be mounted.

[0109] The imaging substrate 603 and the signal processing layer 602 are connected by microbumps 604 or the like, and power and signals are supplied to a connector 605 via wiring 606 formed as a through electrode in the signal processing layer 602. Power is then supplied from the connector 605 to the light receiving layer 601 and the signal processing layer 602 via power wiring (not shown).

[0110] Here, an example of a conventional power supply wiring pattern provided in the signal processing layer 602 will be described. Fig. 15 is a diagram showing an example of a conventional power supply wiring pattern provided in the signal processing layer 602, and shows the surface of the signal processing layer 602 in contact with the light receiving layer 601 described in Fig. 11. The signal processing layer 602 is provided with power supply wiring 701 for supplying power to the light receiving layer 601 and the signal processing layer 602. The signal processing layer 602 is provided with a plurality of signal processing circuits 702, each of which has a predetermined function such as a DFE or an A / D.

[0111] Power supply wiring 701 is formed so as to be drawn out from connector 605 towards one end of signal processing layer 602 and then connected to a plurality of signal processing circuits 702. Current fluctuations in power supply wiring 701 are determined by current fluctuations in a load connected to power supply wiring 701. When there is only one wiring portion drawn out from connector 605 (power connection portion) like power supply wiring 701, the current flowing through drawn-out wiring portion 701A fluctuates greatly according to current fluctuations in the loads of light receiving layer 601 and all of signal processing circuits 702 connected to power supply wiring 701.

[0112] To address this problem, in the image sensor unit according to this embodiment, as will be described below with reference to FIG. 12, the power supply wiring is divided into multiple parts, thereby reducing current fluctuations in the power supply wiring.

[0113] 12(a) to (c) are diagrams showing an example of a power supply wiring pattern in the signal processing layer 602, and similarly to FIG. 15, show the surface of the signal processing layer 602 in contact with the light receiving layer 601. FIG. 12(a) is a diagram showing a seventh example of the power supply wiring. The power supply wiring in FIG. 12(a) has a first power supply wiring 801 and a second power supply wiring 802 provided in the signal processing layer 602, which supply power to the light receiving layer 601 and the signal processing circuit 702.

[0114] 12(a), the first power supply wiring 801 is drawn from the contact point (power supply connection portion) with the connector 605 toward the upper end direction of the signal processing layer 602 and connected to two signal processing circuits 702. The second power supply wiring 802 is drawn from the contact point (power supply connection portion) with the connector 605 toward the lower end direction of the signal processing layer 602 and connected to the two signal processing circuits 702. When the signal processing layer 602 has a multi-layer structure, it is desirable to wire the first power supply wiring 801 and the second power supply wiring 802 in layers far from the light receiving layer 601 in order to minimize the influence of magnetic noise generated from the first power supply wiring 801 and the second power supply wiring 802 on the light receiving layer 601.

[0115] In the conventional power wiring in FIG. 15, the loads of the light receiving layer 601 and the signal processing circuit 702 are all connected to the power wiring 701. In contrast, when the power wiring is divided into the first power wiring 801 and the second power wiring 802 and provided in the signal processing layer 602, the loads of the light receiving layer 601 and the signal processing circuit 702 are distributed to the first power wiring 801 and the second power wiring 802. Therefore, the loads of the light receiving layer 601 and the signal processing circuit 702 connected to the first power wiring 801 and the second power wiring 802, respectively, are smaller than the loads of the light receiving layer 601 and the signal processing circuit 702 connected to the power wiring 701. Therefore, in the first lead wiring portion 801A and the second lead wiring portion 802A, the current fluctuation can be reduced compared to the lead wiring portion 701A of the power wiring 701 in FIG. 15.

[0116] The direction in which the second lead-out wiring portion 802A is led out from the connector 605 is preferably different from the direction in which the first lead-out wiring portion 801A is led out from the connector 605. Also, the angle between the direction in which the second lead-out wiring portion 802A is led out from the connector 605 and the direction in which the first lead-out wiring portion 801A is led out from the connector 605 is preferably 90° or more. In consideration of this, the first lead-out wiring portion 801A and the second lead-out wiring portion 802A are led out in opposite directions from the connector 605. This makes it possible to further reduce degradation of image quality of captured images caused by magnetic noise.

[0117] It is desirable that the first power supply wiring 801 and the second power supply wiring 802 are provided so that the fluctuations of the load currents flowing through them are uniform. An example of wiring in this case will be described with reference to FIG. 12(b).

[0118] Fig. 12(b) is a diagram showing an eighth example of power supply wiring, which is a wiring example when the load fluctuation of the signal processing circuit 702 at the bottom right in Fig. 12(a) is larger than the load fluctuation of the other three signal processing circuits 702. The power supply wiring in Fig. 12(b) has a first power supply wiring 803 and a second power supply wiring 804 provided in the signal processing layer 602.

[0119] The first power supply wiring 803 is wired so as to be connected from the connector 605 only to the lower right signal processing circuit 702 which has a large load fluctuation. The second power supply wiring 804 is wired so as to be connected from the connector 605 to other signal processing circuits 702 to which the first power supply wiring 803 is not wired. This makes it possible to efficiently reduce the current fluctuations in the first outgoing wiring section 803A and the second outgoing wiring section 804A by making the fluctuations in the load currents flowing through the first power supply wiring 803 and the second power supply wiring 804 about the same.

[0120] Now, one or more supplementary wirings for supplying power for the same purpose as the first power supply wiring 801 and the second power supply wiring 802 may be drawn out from the connector 605 and wired, and an example of this will be described with reference to Figure 12 (c).

[0121] Fig. 12(c) is a diagram showing a ninth example of the power supply wiring. The power supply wiring in Fig. 12(c) is provided in the signal processing layer 602, and includes a first power supply wiring 805 and a second power supply wiring 806, as well as a third power supply wiring 807 and a fourth power supply wiring 808 as supplementary wiring. In Fig. 12(c), the third power supply wiring 807 is drawn out from the connector 605 in the left direction and wired to the signal processing circuit 702 at the lower left, and the fourth power supply wiring 808 is drawn out from the connector 605 in the right direction and wired to the signal processing circuit 702 at the upper right.

[0122] In the power supply wiring of FIG. 12(c), the loads of the light receiving layer 601 and the signal processing circuit 702 are distributed to the first power supply wiring 805, the second power supply wiring 806, the third power supply wiring 807, and the fourth power supply wiring 808. Therefore, the loads of the light receiving layer 601 and the signal processing circuit 702 connected to the first power supply wiring 805 to the fourth power supply wiring 808 are smaller than the loads connected to the first power supply wiring 801 and the second power supply wiring 802 of FIG. 12(a). Therefore, the current fluctuations in the first lead-out wiring portion 805A, the second lead-out wiring portion 806A, the third lead-out wiring portion 807A, and the fourth lead-out wiring portion 808A can be reduced compared to the current fluctuations in the first lead-out wiring portion 801A and the second lead-out wiring portion 802A.

[0123] As described above, in the seventh embodiment, the power supply wiring provided in the signal processing layer 602 is divided into multiple parts and drawn out from the connector 605 (power supply connection section). This reduces the current fluctuation in the power supply wiring, and reduces the effect of magnetic noise generated from the power supply wiring on the light receiving layer 601.

[0124] Eighth embodiment 16 is a cross-sectional view showing a schematic configuration of an imaging element unit and a signal processing unit according to the eighth embodiment. The imaging element unit has an imaging element 101, an imaging board 102, a connector 103, a flexible wiring board 104, electronic components 105, wire bonding pads 106, a frame 107, and a cover glass 108. The signal processing unit has a signal processing board 210, a connector 202, a power supply IC 203, and a signal processing CPU 204.

[0125] The image sensor 101 is a CMOS image sensor or the like that outputs an image signal in response to incident light. Note that Fig. 16 shows a cross section perpendicular to the imaging surface of the image sensor 101 on which an optical image is formed. The image sensor 101 is generally divided into a pixel block including a photodiode and the like, and a processing circuit block that performs A / D conversion and the like.

[0126] In a CMOS image sensor, before the charge of the photodiode is read out, the subsequent circuits in the pixel excluding the photodiode and the pixel readout circuit are reset. After this reset operation, the charge of the photodiode is not output to the subsequent circuits in the pixel, and only the noise signal N, such as noise generated during the reset operation, is read out. Hereinafter, such reading of the noise signal N is referred to as "N reading."

[0127] Next, the charge accumulated in the photodiode is output to a subsequent circuit within the pixel, and this pixel signal is read out as an optical signal S. Hereinafter, reading out the optical signal S is referred to as "S reading." The signal read out by N reading and S reading is subjected to subtraction of the noise signal N from the optical signal S (hereinafter referred to as "SN operation"), thereby removing the noise component from the pixel signal. In this way, the SN operation can reduce noise.

[0128] The imaging board 102 is a printed circuit board having power wiring made of a metal such as copper, and is equipped with the imaging element 101 and the like. A rigid board is suitably used for the imaging board 102 in order to mount the imaging element 101, and is made of, for example, glass epoxy. However, the imaging board 102 is not limited to this, and may be a flexible board using a plastic material, or an LTCC (low temperature co-fired ceramics) board using ceramics and copper wiring. In other words, it is sufficient that the board has metal wiring such as copper formed on a specific material and that components can be mounted (implemented).

[0129] The connector 103 mounted on the imaging board 102 is a connection terminal having a plurality of contacts. The flexible wiring board 104 electrically connects the connector 103 mounted on the imaging board 102 to the connector 202 mounted on the signal processing board 210. Although not shown, the connector 202 is connected to an external power source. The flexible wiring board 104 has wiring (power supply wiring) for supplying power to the imaging board 102 (connector 103) via the signal processing board 210 (connector 202). Note that the flexible wiring board 104 may include wiring other than the wiring for supplying power, for example, wiring for outputting a control signal or a signal of the imaging element 101.

[0130] The electronic components 105 are passive components such as a capacitor, resistor, coil, etc., which are necessary for operating the imaging element 101, a linear regulator that generates a predetermined voltage, an oscillator that generates a clock, etc. Note that the electronic components 105 may be used for purposes other than operating the imaging element 101, such as a thermometer that monitors the temperature of the imaging element 101, a ROM that stores individual information of the imaging element 101, etc.

[0131] Since the peripheral portion of the imaging substrate 102 is fixed to a mechanical structure (not shown) by adhesive or the like, the electronic components 105 and the connector 103 are often disposed near the center of the imaging substrate 102 .

[0132] The wire bonding pad 106 is an electrode formed by gold plating or other treatment on a surface layer of the imaging substrate 102 in order to connect the imaging element 101 and the imaging substrate 102 by wire bonding or the like. The wire bonding pad 106 is disposed on the same surface of the imaging substrate 102 as the imaging element 101.

[0133] The frame 107 is formed on the outer periphery of the imaging substrate 102, and is adhered to the imaging substrate 102 while holding a cover glass 108. The cover glass 108 is a member for sealing the imaging element 101, and is adhered and fixed to the frame 107. An anti-reflection film and the like are formed on the cover glass 108.

[0134] In the signal processing unit, the signal processing board 210 supplies power and transmits / receives signals to / from the imaging board 102 via a flexible wiring board 104 that connects a connector 202 mounted on the signal processing board 210 and a connector 103 mounted on the imaging board 102. The power supply IC 203 is connected to a power supply (not shown) and generates power to be supplied to the imaging board 102. The power generated by the power supply IC 203 is supplied to the imaging board 102 via the connector 202, the flexible wiring board 104, and the connector 103. The signal processing CPU 204 receives an output signal (image signal) from the imaging element 101 via the flexible wiring board 104 and performs predetermined signal processing (image processing). The signal processing CPU 204 also outputs a drive signal (control signal) for the imaging element 101 to the imaging element 101.

[0135] In this embodiment, the flexible wiring board 104 is used as a member for connecting the imaging board 102 and the signal processing board 210, but instead of this, a thin coaxial cable or the like may be used.

[0136] Before describing the configuration of the imaging element unit according to the eighth embodiment, particularly the power supply wiring provided on the imaging substrate 102, an example of conventional power supply wiring will be described.

[0137] Fig. 21 is a diagram for explaining an example of the configuration of a conventional imaging element unit. The conventional imaging element unit shown in Fig. 21 differs from the imaging element unit according to this embodiment, the details of which will be described later, in the pin arrangement of the connector mounted on the imaging board 102, and as a result, the pull-out position of the power supply wiring is different. Therefore, in contrast to the connector 103 constituting the imaging element unit in Fig. 16, the connector constituting the conventional imaging element unit in Fig. 21 is referred to as "connector 903," and the other components will be described using the same names and symbols as in Fig. 16.

[0138] The upper left part of Fig. 21, like Fig. 16, shows a cross section of the image sensor unit in a plane perpendicular to the imaging surface of the image sensor 101. The lower left part of Fig. 21 shows a diagram (projection plane) showing the configuration of the image sensor unit when viewed from a direction perpendicular to the imaging surface of the image sensor 101, and a pin arrangement of the connector 903. The right part of Fig. 21 is a diagram showing a schematic diagram of the distribution of noise (hereinafter referred to as "image noise") occurring in the pixel region of the image sensor 101 when viewed from a direction perpendicular to the imaging surface of the image sensor 101.

[0139] The power supply wiring 120 is formed of a metal such as copper on the imaging substrate 102. In Fig. 21, the power supply wiring 120 has a wiring portion (hereinafter referred to as "outgoing wiring portion 120A") formed from the connector 903 toward the right end of the imaging substrate 102. The power supply wiring 120 also has a wiring portion (hereinafter referred to as "peripheral wiring portion") branching off from the outgoing wiring portion 120A and formed along the outer periphery of the imaging substrate 102.

[0140] The lead-out wiring section 120A is formed from a portion corresponding to the approximate center of the connector 903 toward the right end of the imaging board 102. This is because the pins V1, V2, V3, and V4 of the connector 903 are used for power supply. The power supply wiring 120 includes a plurality of wirings connected to the pins V1, V2, V3, and V4 used for power supply among the plurality of pins of the connector 903 and insulated from each other. In FIG. 21, the wirings connected to the pins used for purposes other than power supply among the plurality of pins of the connector 903 are omitted from the illustration.

[0141] The power supply wiring 120 is connected from the connector 903 to the wire bonding pad 106 through an inner layer or a surface layer of the imaging substrate 102. The wire bonding pad 106 to which the power supply wiring 120 is connected is not limited to one location, and may be connected to multiple locations. The power supply wiring 120 is electrically connected to the imaging element 101 via a wire connecting the imaging element 101 and the imaging substrate 102 (wire bonding pad 106).

[0142] Area 109 shown in Fig. 21 represents an area that overlaps with image sensor 101 when viewed from a direction perpendicular to the imaging surface of image sensor 101, and is hereinafter referred to as the "pixel projection area 109." Area 110 shown in Fig. 21 represents an area outside pixel projection area 109 on imaging substrate 102 (hereinafter referred to as the "outer area 110"). Note that Fig. 21 shows the entire image sensor 101 and the pixel area of ​​image sensor 101 as having the same size, but there are cases where processing circuit blocks and the like other than the pixel area of ​​image sensor 101 exist in outer area 110.

[0143] As described above, low noise can be achieved by the SN operation in the image sensor 101. However, since the sampling timings for N reading and S reading are different, if the current flowing through the power supply wiring during SN operation fluctuates significantly, the magnitude of the magnetic field generated at each sampling timing will differ, and the amount of generated noise will increase.

[0144] Here, when power supply wiring is provided within pixel projection area 109 obtained by projecting the pixel area of ​​image sensor 101 onto imaging substrate 102, the distance between the power supply wiring and the pixels of image sensor 101 becomes short. As a result, the output signals of pixels near the power supply wiring are significantly affected by the magnetic field generated by the current flowing through the power supply wiring, making it easier for image noise to occur along the power supply wiring.

[0145] 21, since the peripheral wiring portion of the power supply wiring 120 is formed in the outer region 110, even if the current flowing through the peripheral wiring portion fluctuates, image noise is not substantially generated. On the other hand, the lead-out wiring portion 120A is a portion where wiring for supplying power to the image sensor 101 is concentrated. Therefore, when the lead-out wiring portion 120A is formed in the pixel projection region 109, image noise is likely to occur in the output signal of the pixel near the lead-out wiring portion 120A due to the influence of a magnetic field generated by the current flowing through the lead-out wiring portion 120A.

[0146] Here, pin V1 of connector 903 is a pin that is connected to a power supply wiring having the largest current fluctuation among a plurality of power supply wirings that supply power to image sensor 101. In this case, image noise increases in a portion of lead-out wiring section 120A where a power supply wiring connected to pin V1 of connector 903 is provided. As a result, as shown in the right part of Fig. 21, image noise appears in image 901 along lead-out wiring section 120A. In Fig. 21, a region in which image noise appears in image 901 is diagrammatically shown as image noise occurrence region 909 in image 901.

[0147] In order to reduce the image noise generating region 909, it is desirable to provide the lead-out wiring portion 120A in the outer region 110 (an eleventh embodiment described later). However, the location of the connector 903 is often limited in relation to other components, and from the viewpoint of miniaturizing the image sensor unit, it is not easy to provide the power supply wiring only in the outer region 110.

[0148] Therefore, in the eighth embodiment, the image noise generating region 909 is reduced by providing power wiring using a connector 103 in which the terminal arrangement in the connector 903 has been revised. The following description will be centered on the configuration of the connector 103.

[0149] Fig. 17 is a diagram showing a schematic configuration of an image sensor unit according to the eighth embodiment, and is illustrated in the same manner as Fig. 21. The mounting position of the connector 103 on the imaging board 102 is the same as the mounting position of the connector 903 in Fig. 21.

[0150] When the connector 103 is disposed in the pixel projection area 109, image noise can be reduced by arranging the pins of the connector 103 as shown in Fig. 17. That is, the pins V1, V2, V3, and V4 of the connector 103 are pins for supplying power to the image sensor 101, and the connector 103 is provided with GND pins through which return current flows for each power supply pin.

[0151] The magnitude of current fluctuation in the power supply wiring connected to pins V1 to V4 of connector 903, expressed using the pin symbols, is in the order of V1>V2>V3>V4. As described above, image noise occurring along power supply wiring 120 depends on current fluctuation in power supply wiring 120. The larger the current fluctuation, the more noise appears in the image, and therefore image noise tends to increase in pixel regions corresponding to the lead-out wiring portions.

[0152] 21, the power supply pin V1, which has a large current fluctuation that generates image noise, is provided near the center of the connector 103. In this case, the distance from the pin V1 to the end of the imaging substrate 102 within the pixel projection area 109 becomes long, and the image noise generation area 909 becomes wider.

[0153] In contrast, in the connector 103 mounted on the imaging board 102 in the imaging element unit of Fig. 17, the pins V1 to V4 connected to wiring with large current fluctuations are arranged in order from the end of the imaging board 102. This makes it possible to make the length of the extraction wiring section 120A shorter in the configuration of Fig. 17 than in the configuration of Fig. 21. Therefore, compared to the case where the connector 903 shown in Fig. 21 is mounted, it is possible to reduce the image noise occurrence region 909 in the image 901 as shown in the right part of Fig. 17.

[0154] The pins SCLK, MOSI, MISO, and CS of the connector 103 are pins for serial communication between the imaging element 101 and the signal processing CPU 204. The signal processing CPU 204 communicates with the imaging element 101 via the pins and wiring for serial communication, and sets registers such as the sensitivity of the imaging element 101. The pins CNT1 and CNT2 are pins for control signals of a linear regulator (one of the electronic components 105) on the imaging board 102, and are controlled by the signal processing CPU 204 on the signal processing board 210. The pins VD and HD are pins for the vertical synchronization signal and the horizontal synchronization signal of the imaging element 101, respectively, and are controlled by the signal processing CPU 204 on the signal processing board 210. The pins I / F1 to I / F8 are pins for signals output from the imaging element 101, and are connected to the signal processing CPU 204 on the signal processing board 210. The positions of the pins for signals (SCLK, MOSI, MISO, CS, CNT1, CNT2, VD, HD, and I / F1 to I / F8) other than the power supply pins V1 to V4 may be appropriately changed to facilitate wiring.

[0155] As described above, in the eighth embodiment, when the connector 103 must be mounted in the pixel projection area 109, the pins of the connector 103 that are connected to the power supply wiring with large current fluctuations are moved as close as possible to the edge of the imaging board 102. This makes it possible to shorten the length of the power supply wiring with large current fluctuations in the pixel projection area 109, thereby reducing the area where image noise occurs.

[0156] <Ninth embodiment> Fig. 18 is a diagram showing a schematic configuration of an image sensor unit according to a ninth embodiment, and is shown similarly to Fig. 21, but a diagram corresponding to the right part of Fig. 17 (image 901 and image noise occurrence region 909) is omitted. Note that the basic configuration of the image sensor unit conforms to Fig. 16 and its description, and the description thereof will be omitted here.

[0157] In the eighth embodiment, the entire connector 103 is disposed in the pixel projection area 109. In contrast to this, the ninth embodiment is a configuration example in which a part of the connector 103 can be disposed in the outer area 110. That is, the connector 103 is mounted on the imaging board 102 across the pixel projection area 109 and the outer area 110. The connector 103 itself is the same as that described in the eighth embodiment (FIG. 17), and the pin V1 connected to a power supply wiring with large current fluctuations is disposed in the outer area 110. This eliminates the need to provide the power supply wiring connected to the pin V1 within the pixel projection area 109, making it possible to suppress the occurrence of image noise in the pixel projection area 109.

[0158] Tenth embodiment In the tenth embodiment, a configuration that is effective when there are multiple power supply wirings with large current fluctuations will be described. Fig. 19 is a diagram showing a schematic configuration of an image sensor unit according to the tenth embodiment, and is shown in the same manner as Fig. 18. The basic configuration of the image sensor unit is the same as the configuration shown in Fig. 16, except for the connector mounted on the imaging board 102 and the power supply wirings provided on the imaging board 102, and a description of the configuration common to the eighth embodiment will be omitted.

[0159] A first connector 103a and a second connector 103b are mounted on the imaging board 102. The first connector 103a has a pin V1 for supplying power. The second connector 103b has a pin V2 for supplying power. Here, the power supply wiring 130A connected to the pin V1 is formed on the imaging board 102 from a metal such as copper, and has a large current fluctuation. Also, the power supply wiring 130B connected to the pin V2 is formed on the imaging board 102 from a metal such as copper, and has a large current fluctuation.

[0160] When there are multiple power supply wirings that cause current fluctuations that generate image noise, the connectors are divided into multiple connectors (in this case, two connectors (first connector 103a and second connector 103b) and mounted on the imaging board 102. In this case, pins V1 and V2 are disposed near the ends of the imaging board 102, preferably in the outer area 110, as shown in FIG. 19, and power supply wirings 130A and 130B are provided so as to be connected to pins V1 and V2. This makes it possible to reduce the generation of image noise caused by power supply wirings 130A and 130B that have large current fluctuations. In other words, the tenth embodiment can also obtain the same effect as the eighth embodiment.

[0161] The positions of the pins for signals other than the power supply pins V1 to V4 (SCLK, MOSI, MISO, CS, CNT1, CNT2, VD, HD, and I / F1 to I / F8) may be appropriately changed to facilitate wiring.

[0162] <Eleventh embodiment> In the eleventh embodiment, an example will be described in which power supply wiring with large current fluctuations is provided in the outer region 110. Fig. 20 is a diagram showing a schematic configuration of an image sensor unit according to the eleventh embodiment, and is shown in the same manner as Fig. 18. Note that the basic configuration of the image sensor unit is the same as the configuration shown in Fig. 16 except for the mounting position of the connector 103 mounted on the imaging board 102, and a description of the configuration common to the eighth embodiment will be omitted.

[0163] In the eleventh embodiment, there is no restriction on the mounting position of the connector 103, and therefore the connector 103 is mounted in the outer region 110 of the imaging board 102, and the power supply wiring is provided only in the outer region 110. This makes it possible to suppress the occurrence of image noise more effectively than the configurations in the eighth to tenth embodiments described above. Note that, if it is possible to mount the entire connector 103 in the outer region 110, the pin arrangement of the connector 103 is not limited to the arrangement shown in FIG. 17 (FIG. 20), and there is no particular restriction. For example, the connector 903 of the conventional imaging element unit in FIG. 21 can be used.

[0164] In the above-mentioned eighth to eleventh embodiments, the connector 103 and the connector 202 connected thereto are described as being a board-to-board connector (BtoB connector) having a plurality of connection pins, but the present invention is not limited thereto. For example, the connector 103 may be a flip-type connector having a plurality of connection pins that electrically connect to contacts provided on the flexible wiring board 104 itself. As another example, the connector 103 may be a type having a socket or a type that elastically brings the contacts into contact with the imaging board 102. Furthermore, the flexible wiring board 104 may have a connectorless structure in which the flexible wiring board 104 is directly bonded to a contact pattern provided on the imaging board 102 using a conductive adhesive or the like. In other words, when a plurality of wirings are bonded to the imaging board 102, the effect of the present invention can be obtained by drawing out the power supply wiring included in the wiring from a portion close to the end of the imaging board 102 and connecting it to the imaging element regardless of the bonding form. The flexible wiring board 104 may be wire wiring using a linear member.

[0165] The imaging element units according to the above-described embodiments can be used in various electronic devices, including imaging devices such as digital cameras and digital video cameras, as well as electronic devices with imaging functions (e.g., smartphones, portable game consoles, tablet PCs, etc.). [Explanation of symbols]

[0166] 101 Image sensor 102 Imaging board 103 Connector 105 Electronic Components 260 pixels 270 Pixel section 310 Vertical output line 350a,350b reference signal line 420a Wiring section 420b Wiring section 515 Capacitor 520a Wiring section 520b Wiring section 610 Regulator 620 Capacitor 630a,630b Output wiring section 720a,720b Output wiring section

Claims

1. A substrate; an imaging element unit including an imaging element mounted on the substrate, The imaging element includes: a pixel section having a plurality of pixels arranged in a matrix in a first direction and a second direction perpendicular to each other; an output line that is provided in parallel with the second direction and reads out pixel signals in the second direction for each of a plurality of pixels that are arranged in the first direction; the substrate has a power supply wiring provided on a surface different from a surface on which the image sensor is mounted and supplies power to the image sensor; the power supply wiring has a first power supply wiring portion provided so as not to be disposed along the second direction in a pixel unit region overlapping with the pixel unit when the imaging element is projected onto the substrate from a third direction orthogonal to the first direction and the second direction, The substrate is a multilayer substrate, an imaging element unit characterized in that the first power supply wiring section is routed from the surface of the multilayer substrate opposite to the surface on which the imaging element is mounted to an inner layer of the multilayer substrate, routed to the outer periphery of the pixel area in the inner layer so as not to run parallel to the output line, and then wired so as to be taken out from the inner layer to a surface layer of the multilayer substrate.

2. the power supply wiring includes a second power supply wiring portion connected to the first power supply wiring portion and the imaging element, 2 . The image sensor unit according to claim 1 , wherein the second power supply wiring section is formed along an outer periphery of the substrate in an outer region of the pixel section on the outside of the pixel section of the substrate.

3. 3. The image sensor unit according to claim 2, wherein the second power supply wiring section is provided in the outer pixel area at a constant distance from an outer periphery of the pixel area.

4. A substrate, an imaging element unit including an imaging element mounted on the substrate, The imaging element includes: a pixel section having a plurality of pixels arranged in a matrix in a first direction and a second direction perpendicular to each other; an output line that is provided in parallel with the second direction and reads out pixel signals in the second direction for each of a plurality of pixels that are arranged in the first direction; the substrate has a power supply wiring provided on a surface different from a surface on which the image sensor is mounted and supplies power to the image sensor; the power supply wiring has a first power supply wiring portion provided so as not to be disposed along the second direction in a pixel unit region overlapping with the pixel unit when the imaging element is projected onto the substrate from a third direction orthogonal to the first direction and the second direction, The image sensor unit is characterized in that the substrate has a power supply connection portion that serves as a contact point with a connector connected to an external power supply, and a plurality of power supply wirings that are pulled out in different directions toward the end of the substrate and connected to the image sensor.

5. 5. The image sensor unit according to claim 4, wherein the plurality of power supply wirings are arranged so that fluctuations in load current flowing through the respective power supply wirings are uniform.

6. The image sensor unit according to claim 5, characterized in that the plurality of power supply wirings are wired such that when any two power supply wirings are selected, the angle between the directions in which the two power supply wirings are drawn out from the power supply connection portion is 90° or more.

7. A substrate, an imaging element unit including an imaging element mounted on the substrate, The imaging element includes: a pixel section having a plurality of pixels arranged in a matrix in a first direction and a second direction perpendicular to each other; an output line that is provided in parallel with the second direction and reads out pixel signals in the second direction for each of a plurality of pixels that are arranged in the first direction; the substrate has a power supply wiring provided on a surface different from a surface on which the image sensor is mounted and supplies power to the image sensor; the power supply wiring has a first power supply wiring portion provided so as not to be disposed along the second direction in a pixel unit region overlapping with the pixel unit when the imaging element is projected onto the substrate from a third direction orthogonal to the first direction and the second direction, an electronic component mounted on the substrate and configured to supply power to the imaging element; the substrate has a plurality of power supply wirings that are led from a power supply connection portion that serves as a contact point with the electronic component toward an end of the substrate and are connected to the imaging element; The imaging element unit according to claim 1, wherein the plurality of power supply wirings are wired so that fluctuations in load current flowing through the respective power supply wirings are uniform.

8. The image sensor unit according to claim 7, characterized in that the plurality of power supply wirings are wired such that when any two power supply wirings are selected, the angle between the directions in which the two power supply wirings are drawn out from the power supply connection portion is 90° or more.

9. An imaging device comprising the imaging element unit according to claim 1 .

Images