Multi-layer resin sheet for sealing

JP7600111B2Active Publication Date: 2024-12-16NITTO DENKO CORP
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Patent Information

Application Number
JP2021532796
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-12-18
Filing Date
2020-07-06
Publication Date
2024-12-16
Estimated Expiration
2040-07-06

AI Technical Summary

Technical Problem

Conventional sealing methods for semiconductor elements and electronic components using thermosetting resins result in significant intrusion of cured material between the elements and substrates, necessitating improved dimensional accuracy during curing.

Method used

A multilayer resin sheet comprising a first sealing resin sheet with a layered silicate compound and a second sealing resin sheet with a high content of inorganic filler, where the filler ratios are optimized to minimize intrusion during curing.

Benefits of technology

The multilayer resin sheet effectively reduces the amount of cured material intrusion between semiconductor elements and substrates, ensuring better dimensional accuracy and sealing reliability.

✦ Generated by Eureka AI based on patent content.

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Patent Text Reader

Abstract

A multilayer resin sheet 11 for sealing according to the present invention sequentially comprises a first resin sheet 1 for sealing and a second resin sheet 12 for sealing in one direction along the thickness direction. The first resin sheet 1 for sealing contains a layered silicate compound and a first inorganic filler. The second resin sheet 12 for sealing contains a second inorganic filler. The content ratio (B) of the first inorganic filler to the first resin sheet 1 for sealing is 50% by mass or more. The content ratio (A) of the second inorganic filler to the second resin sheet 12 for sealing is 60% by mass or more. The content ratio (B) of the first inorganic filler to the first resin sheet 1 for sealing and the content ratio (A) of the second inorganic filler to the second resin sheet 12 for sealing are in a specific relationship.
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Citation Information

Patent Citations

  • Multilayered insulating film

    JP2008302677A

  • Method for manufacturing multilayer insulating film, and multilayer printed wiring board

    JP2009088303A

  • Manufacturing method of multilayer insulating film and multilayer printed wiring board

    JP2009202517A

  • Thermosetting resin composition and method for manufacturing semiconductor device

    JP2014210880A

  • Thermosetting resin sheet for semiconductor chip sealing and method of producing semiconductor package

    JP2015086359A