Semiconductor Device

JP7600128B2Active Publication Date: 2024-12-16NUVOTON TECH CORP JAPAN
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Patent Information

Application Number
JP2021548324
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Priority Date
2019-09-27
Filing Date
2020-05-14
Publication Date
2024-12-16
Estimated Expiration
2040-05-14

AI Technical Summary

Technical Problem

Conventional semiconductor devices with redundant wiring pairs face issues of undetectable short circuits during the manufacturing process, leading to deterioration in soft error resistance due to short-circuiting, which cannot be identified at the inspection stage.

Method used

The semiconductor device incorporates a design with multiple wiring layers where redundant wiring pairs are separated by a distance greater than the interlayer distance, ensuring they belong to different layers and have an overlapping portion with a specific distance arrangement to minimize short-circuit occurrence.

Benefits of technology

This design effectively reduces the likelihood of short circuits between redundant wiring pairs, allowing for detectable faults during manufacturing and maintaining high soft error resistance.

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Abstract

A semiconductor device according to one embodiment of the present disclosure is provided with a plurality of wiring layers (M1 to M3), a first wiring line (11), and a second wiring line (12) which is not connected to the first wiring line (11), while being provided to be redundant for transmission of the same signal level as the first wiring line (11). The first wiring line (11) and the second wiring line (12) are in different wiring layers; and the distance between the first wiring line (11) and the second wiring line (12) is longer than the interlayer distance c between adjacent wiring layers.
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Citation Information

Patent Citations

  • Bath boiler with shower

    JP1978069771A

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  • Semiconductor integrated circuit

    JP1988255941A

  • Semiconductor device

    JP2001298087A

  • Semiconductor device and its inspection method

    JP2007103598A