Superconducting device and manufacturing method thereof
JP7600546B2Active Publication Date: 2024-12-17NEC CORP
Patent Information
- Application Number
- JP2020094778
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2020-05-29
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2040-05-29
Smart Images
Figure 0007600546000001 
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Abstract
To provide a superconducting device that can obtain an input-output characteristic as designed with noncontact coupling, and a manufacturing method for the same.SOLUTION: A superconducting device includes a superconducting integrated circuit chip and a circuit board. The superconducting integrated circuit chip includes a first electrode formed of a first superconducting material and a first noncontact coupling circuit on a surface thereof. The circuit board includes a second electrode formed of a second superconducting material and a second noncontact coupling circuit on a surface thereof. The second electrode includes a protrusion with predetermined height having a flat upper surface. The upper surface of the protrusion is directly coupled with a surface of the first electrode, and the first noncontact coupling circuit and the second noncontact coupling circuit are disposed to face each other.SELECTED DRAWING: Figure 1
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Citation Information
Patent Citations
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