Resin composition

JP7600582B2Active Publication Date: 2024-12-17AJINOMOTO CO INC
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Patent Information

Application Number
JP2020153334
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2020-09-11
Publication Date
2024-12-17
Estimated Expiration
2040-09-11

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Patent Text Reader

Abstract

To provide a resin composition for obtaining a cured product excellent in adhesion to base wiring and reflectance.SOLUTION: The resin composition contains (A) a curing agent, (B) an epoxy resin, and (C) a white inorganic pigment. The component (A) contains a curing agent selected from a bisphenol compound having a fluorine atom, a bisphenol compound having an alicyclic structure, and a bisphenol compound having a fluorene skeleton.SELECTED DRAWING: None
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Citation Information

Patent Citations

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  • Epoxy resin composition for sealing semiconductor

    JP1994005741A

  • Epoxy resin composition

    JP1994100658A

  • Fluorene-based composition and molded product of the same

    JP2004339499A

  • Fluorine-containing epoxy resin modified by methoxy-containing silane, epoxy resin composition, and its cured material and its production method

    JP2006176732A