Buffer material

JP7600588B2Active Publication Date: 2024-12-17SEIKO EPSON CORP
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Patent Information

Application Number
JP2020158308
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2020-09-23
Publication Date
2024-12-17
Estimated Expiration
2040-09-23

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Patent Text Reader

Abstract

To provide a molded fiber product having a reduced environmental load, with a good strength.SOLUTION: A fiber structure includes a cellulose fiber and a binding material for binding the cellulose fiber. The cellulose fiber content relative to the fiber structure is 50.0 mass% or more and 70.0 mass% or less. The binding material is a natural component.SELECTED DRAWING: Figure 1
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Citation Information

Patent Citations

  • Regenerating and molding of waste paper

    JP1997296398A

  • Packaging material and packaging body containing natural resin, and their manufacturing methods

    JP2002172728A

  • Composition for producing molded article and method for producing molded article comprising said composition

    JP2002529568A

  • Sound absorbing material

    JP2007223273A

  • Mold

    JP2007320168A