Buffer material
JP7600588B2Active Publication Date: 2024-12-17SEIKO EPSON CORP
Patent Information
- Application Number
- JP2020158308
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2020-09-23
- Publication Date
- 2024-12-17
- Estimated Expiration
- 2040-09-23
Smart Images

Figure 0007600588000003 
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Abstract
To provide a molded fiber product having a reduced environmental load, with a good strength.SOLUTION: A fiber structure includes a cellulose fiber and a binding material for binding the cellulose fiber. The cellulose fiber content relative to the fiber structure is 50.0 mass% or more and 70.0 mass% or less. The binding material is a natural component.SELECTED DRAWING: Figure 1
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Citation Information
Patent Citations
Regenerating and molding of waste paper
JP1997296398A
Packaging material and packaging body containing natural resin, and their manufacturing methods
JP2002172728A
Composition for producing molded article and method for producing molded article comprising said composition
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Sound absorbing material
JP2007223273A
Mold
JP2007320168A
