Compound, method for producing same, curable resin composition and cured product thereof

Abstract

Provided are a compound having excellent low dielectric properties, a curable resin composition, and a cured product thereof. A compound represented by the following formula (1): [Formula 1] TIFF0007602311000039.tif56170In the above formula (1), there are multiple R 1 Each independently represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms. 2 Each independently represents a hydrocarbon group represented by the following formula (a). X has a structure represented by the following formulas (c) to (f). Each of the multiple 1's independently represents an integer of 1 to 4. Each of the multiple m's independently represents an integer of 0 to 3, and the average value of m ave is 0 <m ave ≦3. n is the number of repetitions, and the average value of n ave is 0.05≦n ave <=20. [Case 2] In the above formula (a), * represents the bonding position to the fluorene structure of formula (1). 3 represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms. k represents an integer of 1 to 5. [C3] In the above formulas (c) to (f), * indicates the bonding position to the fluorene structure of formula (1). 4 each independently represents a hydrogen atom or a hydrocarbon group having 1 to 5 carbon atoms. Each of the multiple p's each independently represents an integer of 1 to 4, and each of the multiple q's each independently represents an integer of 1 to 3.

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