Resin sealing equipment
JP7603315B2Active Publication Date: 2024-12-20YAMAHA ROBOTICS HLDG CO LTD
9 Cites -1 Cited by
Patent Information
- Application Number
- JP2021059338
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-03-31
- Publication Date
- 2024-12-20
- Estimated Expiration
- 2041-03-31
Abstract
To provide a resin-sealing device which supplies and sucks clean air to a sealing die having a press part, and thereby forms a clean air flow crossing and passing an upper die and a lower die and prevents die contamination by attaching a foreign matter to a die surface.SOLUTION: Clean air flow formed by crossing and passing clean air supplied from a clean air supply part 17 through an upper die 2a and a lower die 2b is formed, and is sucked to and removed by an air suction duct 19 provided on the opposite side through a sealing die 2.SELECTED DRAWING: Figure 2
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Citation Information
Patent Citations
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