Resin-containing material processing equipment

Abstract

To suitably press a resin-containing material.SOLUTION: A processing device 10 comprises a mold 11 having a pressing surface 11a for pressing a composite material in which resin and fibers are combined. Cooling water hole 14 through which cooling water flows are formed inside the mold 11. A surface of the cooling water hole 14 is covered with a cooling water pipe 15. A heat transfer coefficient between the mold 11 and the cooling water flowing through the cooling water holes 14 is higher in a downstream area than in an upstream area. A surface roughness of an outer peripheral surface of the cooling water pipe 15 is smaller in the downstream area than in the upstream area.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present disclosure relates to an apparatus for processing resin-containing materials. [Background technology]

[0002] Composite materials containing resins such as thermoplastic carbon fiber reinforced plastics (CFRP) may be used for aircraft parts such as aircraft fuselages and main wings. Press molding is known as a method for processing such thermoplastic composite materials into a desired shape (for example, Patent Document 1).

[0003] Patent Document 1 describes a molding die having a female mold. This female mold has a plurality of cooling flow paths formed therein through which a cooling medium flows to cool the female mold. A heat pipe is disposed in the approximate center of this cooling flow path so as not to come into contact with the inner surface of the cooling flow path. In other words, an appropriate gap is formed between the inner surface of the cooling flow path and the circumferential surface of the heat pipe, and a cooling medium such as cold water or hot water flows through this gap to cool the female mold. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Japanese Utility Model Application Publication No. 4-45714 Summary of the Invention [Problem to be solved by the invention]

[0005] In the mold described in Patent Document 1, cooling holes (cooling flow paths) are formed in the mold (female mold). The coolant flowing through the cooling holes exchanges heat with the mold while flowing. Therefore, the coolant flowing through the cooling holes has a higher temperature in the downstream region than in the upstream region. Therefore, in the mold, the upstream region is easily cooled, and the downstream region is difficult to cool. Therefore, a temperature difference may occur in the mold. If a temperature difference occurs in the mold, a thermal expansion difference occurs in the mold, and the pressing surface (the surface that presses the workpiece such as a composite material) may deform. If the pressing surface is deformed, the workpiece cannot be pressed uniformly, and voids, interlayer peeling, etc. may occur in the molded product after processing, which may deteriorate the internal quality. In addition, surface resin peeling, etc. may occur, which may deteriorate the surface quality. In this way, the quality of the molded product after processing may deteriorate.

[0006] In addition, when the temperature of the mold is not uniform, the temperature of the workpiece (resin-containing material) to which the temperature of the mold is transmitted also varies. In particular, when the temperature of the mold is not uniform during cooling of the resin-containing material, the temperature variation of the resin-containing material causes the solidification progress of the resin-containing material to be non-uniform depending on the location. When the solidification progress of the resin-containing material becomes non-uniform, solidified and unsolidified parts (hereinafter referred to as "unsolidified parts") are generated in the resin-containing material. As a result, the solidified parts come into contact with the mold, hindering the application of pressure to the unsolidified parts. This causes insufficient pressure or poor contact between the composite material and the mold in the unsolidified parts, and there is a possibility that the resin-containing material cannot be pressed appropriately. Since the resin-containing material cannot be pressed appropriately, there is a possibility that voids, interlayer peeling, etc. occur in the molded product after processing, deteriorating the internal quality. In addition, there is a possibility that surface resin peeling occurs, deteriorating the surface quality. In this way, there is a possibility that the quality of the molded product after processing is deteriorated.

[0007] The present disclosure has been made in consideration of the above circumstances, and has an object to provide an apparatus for processing a resin-containing material that can suitably press the resin-containing material. [Means for solving the problem]

[0008] In order to solve the above problems, the processing apparatus for resin-containing materials of the present disclosure employs the following means. A resin-containing material processing apparatus according to one embodiment of the present disclosure includes a mold having a pressing surface for pressing a resin-containing material containing at least a resin, a refrigerant hole through which a refrigerant flows is formed inside the mold, at least an upstream region of the surface of the refrigerant hole is covered with a coating portion, and the heat transfer coefficient between the mold and the refrigerant flowing through the refrigerant hole is higher in the downstream region than in the upstream region. Effect of the Invention

[0009] According to the present disclosure, the resin-containing material can be suitably pressed. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a schematic vertical cross-sectional view showing a processing device according to a first embodiment of the present disclosure. [Diagram 2] FIG. 2 is a cross-sectional view taken along the line AA in FIG. [Diagram 3] FIG. 4 is a schematic vertical cross-sectional view showing a processing device according to a second embodiment of the present disclosure. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment of the processing device for resin-containing material according to the present disclosure will be described with reference to the drawings. In the following description, the direction in which the pressing device presses the mold 11 is referred to as the Z-axis direction, the direction in which the cooling water hole 14 and the cooling water pipe 15 extend is referred to as the X-axis direction, and the direction perpendicular to the Z-axis direction and the X-axis direction is referred to as the Y-axis direction.

[0012] [First embodiment] Hereinafter, a first embodiment of the present disclosure will be described with reference to FIGS. The processing apparatus 10 according to the present embodiment is an apparatus for forming a composite material (resin-containing material) (not shown) into a desired shape in order to manufacture aircraft parts such as stringers, spars, frames, and ribs that constitute an aircraft structure. That is, the processing apparatus 10 is an apparatus for performing press molding on the composite material. An example of the composite material that is the workpiece is carbon fiber reinforced plastic (CFRP) in which thermoplastic resin and fibers are composited. Specifically, the composite material may be a laminate in which a plurality of fiber reinforced sheets in which fibers are impregnated with resin are laminated. Note that the composite material is not limited to thermoplastic carbon fiber reinforced plastic as long as it is a composite material in which fibers and resin are composited.

[0013] As shown in FIG. 1, a composite material processing apparatus 10 according to this embodiment includes a die 11 for pressing a composite material, and a pressing device (not shown) for pressing the die 11.

[0014] The mold 11 has a first mold 12 arranged on one side in the pressing direction (Z-axis direction) of the composite material, and a second mold 13 arranged on the other side in the Z-axis direction of the composite material. The first mold 12 and the second mold 13 are arranged so as to sandwich the composite material. In this embodiment, the first mold 12 and the second mold 13 have substantially the same configuration, so in the following explanation, the first mold 12 and the second mold 13 will be simply explained as "mold 11" except when it is necessary to explain the first mold 12 and the second mold 13 separately.

[0015] The mold 11 is made of a metal material. Examples of the metal material for forming the mold 11 include carbon steel such as S50C, alloy steel such as SUS304, and Invar. The mold 11 has a pressing surface 11a on the side where the composite material is placed. In this embodiment, the pressing surface 11a is a flat surface.

[0016] The pressing device moves the first mold 12 toward the second mold 13 as shown by the arrow P in Fig. 1. That is, the pressing device moves the mold 11 so that the pressing surface 11a presses the composite material. The composite material is pressed and deformed between the first mold 12 and the second mold 13 by the driving force of the pressing device. Note that the pressing device may move both the first mold 12 and the second mold 13 so as to approach each other.

[0017] The cooling water hole (refrigerant hole) 14 is formed inside the mold 11. The cooling water hole 14 penetrates the mold 11 in the X-axis direction. As shown in FIG. 2, the cooling water hole 14 extends linearly along the X-axis direction (predetermined direction). As shown in FIG. 1, the cooling water hole 14 has a substantially circular cross section when cut along a plane perpendicular to the X-axis direction. The multiple cooling water holes 14 are arranged side by side at predetermined intervals in the Y-axis direction (intersecting direction). The cooling water hole 14 cools the mold 11 with cooling water (refrigerant) flowing inside. In detail, the cooling water hole 14 cools the mold 11 via a cooling water pipe 15 described later.

[0018] The cooling water hole 14 is provided therein with a cooling water pipe (covering portion) 15. The cooling water pipe 15 is made of a metal material. Examples of the metal material for forming the cooling water pipe 15 include metal materials such as stainless steel and copper alloy. The cooling water pipe 15 is a cylindrical member extending in the X-axis direction. The cooling water pipe 15 is provided so as to be fitted into the cooling water hole 14. That is, the surface (inner circumferential surface) of the cooling water hole 14 and the outer circumferential surface of the cooling water pipe 15 are in contact with each other. In other words, the cooling water pipe 15 covers the surface of the cooling water hole 14. The cooling water pipe 15 is provided over substantially the entire area of ​​the cooling water hole 14. Cooling water flows inside the cooling water pipe 15 as shown by the arrows in Fig. 2. In detail, the cooling water flows into the cooling water pipe 15 from an inlet 15a formed at one end of the cooling water pipe 15 in the X-axis direction, and is discharged from an outlet 15b formed at the other end in the X-axis direction.

[0019] The processing device 10 cools the mold 11 by performing heat exchange between the mold 11 and cooling water via a cooling water pipe 15. In addition, the processing device 10 cools the mold 11, thereby cooling the composite material pressed by the mold 11.

[0020] Furthermore, in the processing apparatus 10 according to this embodiment, the heat transfer coefficient between the mold 11 and the cooling water is higher in the downstream region (outlet 15b side) of the cooling water flow than in the upstream region (inlet 15a side).

[0021] Specifically, the surface roughness of the outer circumferential surface of the cooling water pipe 15 is smaller in the downstream region than in the upstream region. That is, the outer circumferential surface is formed rougher in the upstream region than in the downstream region. In other words, when the surface roughness in the upstream region is Ra1 and the surface roughness in the downstream region is Ra2, the relationship Ra1>Ra2 is satisfied. An outer peripheral surface with a small (fine) surface roughness has a larger contact area with the cooling water holes 14 than an outer peripheral surface with a large (coarse) surface roughness. Therefore, the downstream region having an outer peripheral surface with a large surface roughness has a higher heat transfer coefficient than the upstream region.

[0022] The surface roughness of the outer peripheral surface of the upstream region and the surface roughness of the outer peripheral surface of the downstream region are set, for example, within a range of Ra0.2 or more and Ra25 or less. That is, the surface roughness of the upstream region and the downstream region is made different within a range of Ra0.2 or more and Ra25 or less. The specific surface roughness of each region is appropriately set depending on the temperature of the mold 11, the properties of the composite material, etc. Note that the above numerical ranges are merely examples and are not limited to these numerical ranges. The method for roughening the outer peripheral surface of the cooling water pipe 15 is not particularly limited, but examples thereof include a method of scraping with a file, sandblasting, and the like.

[0023] The manner in which the surface roughness of the outer peripheral surface in the upstream region is made greater than that of the outer peripheral surface in the downstream region is not limited to a specific manner. For example, the surface roughness may be gradually increased from the downstream region toward the upstream region. Also, for example, the entire area of ​​the pipe may be divided into several regions in a predetermined direction, and the same surface roughness may be uniform in the same region, with the surface roughness decreasing toward the downstream region. In this case, the number of regions formed by division may be two or more.

[0024] Furthermore, in this embodiment, by providing the cooling water piping 15, the heat transfer coefficient between the mold 11 and the cooling water is lower over almost the entire area in the X-axis direction, compared to when the cooling water piping 15 is not provided (i.e., when the cooling water and the cooling water hole 14 are in direct contact with each other).

[0025] Next, a method for processing the composite material according to this embodiment will be described. First, the mold 11 is heated to a predetermined temperature by a heater (not shown) provided in the mold 11. Next, a composite material is set between the first mold 12 and the second mold 13 in a heated state. After the composite material is set, the first mold 12 is moved toward the second mold 13 by a pressing device as shown by the arrow P in FIG. 1 to press the composite material. As described above, since the mold 11 is in a heated state, the composite material is pressurized while being heated by the heat of the mold 11. In this way, by pressing the composite material in a heated state, the composite material is deformed into a desired shape according to the shape of the pressing surface 11a of the mold 11.

[0026] Next, cooling water is circulated through the cooling water pipes 15 to cool the mold 11 to a predetermined temperature. As a result, the composite material is cooled while being pressurized. As a result, the composite material solidifies while being pressurized. When the composite material has solidified, the pressure of the mold 11 against the composite material is stopped. Then, the composite material (molded product) is removed from the mold 11, and the processing is completed.

[0027] According to this embodiment, the following advantageous effects are obtained. When the cooling water holes 14 are formed in the mold 11, the cooling water flowing through the cooling water holes 14 exchanges heat with the mold 11 while flowing. Therefore, the temperature of the cooling water flowing through the cooling water holes 14 is higher in the downstream region than in the upstream region. Therefore, in the mold 11, the upstream region is easily cooled and the downstream region is difficult to cool. Therefore, a temperature difference may occur in the mold 11. If a temperature difference occurs in the mold 11, a thermal expansion difference may occur in the mold 11, and the pressing surface 11a may deform. If the pressing surface 11a deforms, the composite material cannot be pressed uniformly, and the quality of the molded product after processing may deteriorate. In this embodiment, the heat transfer coefficient between the die 11 and the cooling water flowing through the cooling water hole 14 is higher in the downstream region than in the upstream region. As a result, the heat transfer coefficient is lower in the upstream region where the low-temperature cooling water flows, and the heat transfer coefficient is higher in the downstream region where the high-temperature cooling water flows. Therefore, the amount of heat transfer is uniformed between the upstream region and the downstream region. Therefore, the temperature difference between the upstream region and the downstream region in the die 11 can be reduced. This makes it possible to suppress deformation of the pressing surface 11a. Therefore, the pressing force acting on the composite material can be uniformed, so that the composite material can be pressed suitably. Therefore, the quality of the composite material after processing can be improved.

[0028] Furthermore, in this embodiment, since the temperature of the mold 11 can be made uniform as described above, the heat transferred from the mold 11 to the composite material can also be made uniform. Therefore, the degree of solidification of the composite material in the flow direction of the cooling water (X-axis direction) can be made uniform. Therefore, it is possible to suppress a situation in which a part of the composite material solidifies early, causing a decrease in the pressing force acting on other parts. Therefore, it is possible to make the pressing force acting on the composite material uniform, so that the composite material can be pressed suitably. Therefore, it is possible to improve the quality of the composite material after processing.

[0029] Specifically, in this embodiment, the surface roughness of the outer circumferential surface of the cooling water pipe 15 is smaller in the downstream region than in the upstream region. As a result, the contact area between the surface of the cooling water hole 14 and the outer circumferential surface of the cooling water pipe 15 is larger in the downstream region than in the upstream region. Therefore, the heat transfer coefficient is high in the downstream region where high-temperature cooling water flows, so the amount of heat transfer is uniform between the upstream region and the downstream region. This makes it possible to reduce the temperature difference between the upstream region and the downstream region in the mold 11. Therefore, it is possible to suppress the deformation of the pressing surface 11a of the mold 11 and to uniformize the degree of solidification of the composite material. Therefore, it is possible to uniformize the pressing force acting on the composite material, so that the composite material can be pressed suitably. Therefore, it is possible to improve the quality of the composite material after processing.

[0030] Furthermore, if the composite material is cooled too quickly, the time required for the resin contained in the composite material to crystallize cannot be secured, resulting in a low degree of crystallization of the resin. On the other hand, in this embodiment, the cooling water pipe 15 has a lower thermal conductivity than the mold 11. This makes it difficult to cool the mold 11 by the cooling water flowing through the cooling water hole 14, and therefore makes it difficult to cool the composite material. Therefore, the speed at which the composite material is cooled can be slower than when the cooling water pipe 15 is not provided. This makes it possible to increase the crystallinity of the resin contained in the composite material. This improves the quality of the composite material after processing.

[0031] In the above description, an example has been described in which the contact areas between the surface of the cooling water hole 14 and the outer peripheral surface of the cooling water pipe 15 are made different by varying the surface roughness, but the method of making the contact areas different is not limited to this. For example, the contact areas may be made different by forming thin grooves or the like on the surface of the cooling water hole 14 and / or the outer peripheral surface of the cooling water pipe 15.

[0032] Second Embodiment Next, the processing apparatus according to the second embodiment of the present disclosure will be described with reference to FIG. 3. The processing apparatus 20 according to the present embodiment differs from that of the first embodiment in the structure of the cooling water piping. Since other points are the same as those of the first embodiment, the same reference numerals are given to the same configurations and the detailed description thereof is omitted.

[0033] As shown in FIG. 3, the cooling water piping 25 provided in the processing apparatus 20 according to the present embodiment includes an upstream piping 25a provided in the upstream region of the cooling water flow, a central piping 25b provided in the central region, and a downstream piping 25c provided in the downstream region. The upstream piping 25a, the central piping 25b, and the downstream piping 25c are each a cylindrical member extending in the X-axis direction.

[0034] The upstream piping 25a, the central piping 25b, and the downstream piping 25c are each formed of a material having a different thermal conductivity. Specifically, the upstream piping 25a, the central piping 25b, and the downstream piping 25c are formed of a material having a higher thermal conductivity for the piping provided on the downstream side than for the piping provided on the upstream side. That is, when the thermal conductivity of the upstream piping 25a is T1, the thermal conductivity of the central piping 25b is T2, and the thermal conductivity of the downstream piping 25c is T3, the relationship T1 < T2 < T3 is satisfied.

[0035] Examples of the material of the upstream piping 25a include glass fiber. Examples of the material of the central piping 25b include metals such as iron. Examples of the material of the downstream piping 25c include metals having a high thermal conductivity such as copper and aluminum. The specific material forming each piping is appropriately selected according to the temperature of the mold 11, the properties of the composite material, and the like. Note that the above materials are merely examples and are not limited thereto.

[0036] According to the present embodiment, the following operational effects are achieved. In this embodiment, the thermal conductivity of the cooling water pipe 25 is higher in the downstream region than in the upstream region. As a result, the heat of the mold 11 is more easily transferred to the refrigerant through the cooling water pipe 25 in the downstream region than in the upstream region. Therefore, the heat transfer coefficient can be made higher in the downstream region than in the upstream region. In this way, the heat transfer coefficient is higher in the downstream region where the high-temperature refrigerant flows, so the amount of heat transfer is uniform between the upstream region and the downstream region. This makes it possible to reduce the temperature difference between the upstream region and the downstream region in the mold 11. Therefore, it is possible to suppress the deformation of the pressing surface 11a of the mold 11 and to uniform the degree of solidification of the composite material. Therefore, it is possible to uniformize the pressing force acting on the composite material, so that the composite material can be pressed suitably. Therefore, it is possible to improve the quality of the composite material after processing.

[0037] In this embodiment, the cooling water pipe 25 is divided into three in the X-axis direction, but the present disclosure is not limited to this. For example, the cooling water pipe 25 may be divided into two. Also, the cooling water pipe 25 may be divided into four or more.

[0038] The present disclosure is not limited to the above-described embodiments, and various modifications are possible without departing from the spirit and scope of the present disclosure.

[0039] For example, in each of the above embodiments, an example has been described in which cooling water piping is provided over the entire area of ​​the cooling water hole 14 in the X-axis direction, but the present disclosure is not limited to this. For example, cooling water piping having a lower thermal conductivity than the mold 11 may be provided only in the upstream region. That is, in this case, no cooling water piping is provided in the downstream region. In this manner, the heat transfer coefficient between the mold 11 and the cooling water may be made higher in the downstream region than in the upstream region.

[0040] Also, for example, the heat transfer coefficient between the mold 11 and the cooling water may be higher for the cooling water holes 14 formed in the central region in the Y-axis direction than for the cooling water holes 14 formed in the end region in the Y-axis direction (intersecting direction). In the mold 11, the end regions in the Y-axis direction are easily cooled by the outside air. As a result, the temperature of the end regions is easily lowered. Conversely, the central region in the Y-axis direction is less easily cooled by the outside air than the end regions. As a result, the temperature of the central region is easily raised. In this configuration, the coefficient of heat transfer between the mold 11 and the coolant is high in the central region where the temperature is high. In other words, the amount of heat absorbed by the cooling water is large. Also, the coefficient of heat transfer between the mold 11 and the coolant is low in the end regions where the temperature is low. In other words, the amount of heat absorbed by the coolant is small. Therefore, it is possible to suppress temperature variations in the Y-axis direction of the mold 11.

[0041] The apparatus for processing a resin-containing material according to the embodiment described above can be understood, for example, as follows. A composite processing apparatus according to one embodiment of the present disclosure includes a mold (11) having a pressing surface (11a) for pressing a resin-containing material that contains at least a resin, a refrigerant hole (14) through which a refrigerant flows is formed inside the mold, at least an upstream region of the surface of the refrigerant hole is covered with a covering portion (15), and the heat transfer coefficient between the mold and the refrigerant flowing through the refrigerant hole is higher in the downstream region than in the upstream region.

[0042] In the above configuration, the refrigerant hole is formed in the mold. The refrigerant flowing through the refrigerant hole exchanges heat with the mold while flowing. Therefore, the temperature of the refrigerant flowing through the refrigerant hole is higher in the downstream region than in the upstream region. Therefore, in the mold, the upstream region is easily cooled and the downstream region is difficult to cool. Therefore, a temperature difference may occur in the mold. If a temperature difference occurs in the mold, a thermal expansion difference may occur in the mold, and the pressing surface may deform. If the pressing surface is deformed, the resin-containing material cannot be pressed uniformly, and the quality of the molded product after processing may deteriorate. In the above configuration, the heat transfer coefficient between the mold and the refrigerant flowing through the refrigerant hole is higher in the downstream region than in the upstream region. As a result, the heat transfer coefficient is lower in the upstream region where the low-temperature refrigerant flows, and the heat transfer coefficient is higher in the downstream region where the high-temperature refrigerant flows. Therefore, the amount of heat transfer is uniformed between the upstream region and the downstream region. Therefore, the temperature difference between the upstream region and the downstream region in the mold can be reduced. This makes it possible to suppress deformation of the pressing surface. Therefore, the pressing force acting on the resin-containing material can be uniformed, so that the resin-containing material can be pressed suitably. Therefore, the quality of the resin-containing material after processing can be improved. In addition, in the above configuration, since the temperature of the mold can be made uniform as described above, the heat transferred from the mold to the resin-containing material can also be made uniform. Therefore, the degree of solidification of the resin-containing material in the flow direction of the refrigerant can be made uniform. Therefore, it is possible to suppress a situation in which a part of the resin-containing material solidifies early, thereby reducing the pressing force acting on other parts. Therefore, since the pressing force acting on the resin-containing material can be made uniform, the resin-containing material can be pressed suitably. Therefore, the quality of the resin-containing material after processing can be improved. One example of a method for making the heat transfer coefficient between the mold and the refrigerant flowing through the refrigerant hole higher in the downstream region than in the upstream region is to provide a covering portion having a lower thermal conductivity than the mold only in the upstream region.

[0043] In addition, in an apparatus for processing a resin-containing material according to one embodiment of the present disclosure, the coating portion has a cylindrical shape whose outer peripheral surface is in contact with the surface of the refrigerant hole, and the contact area between the surface of the refrigerant hole and the outer peripheral surface of the coating portion is larger in the downstream region than in the upstream region.

[0044] In the above configuration, the contact area between the surface of the refrigerant hole and the outer peripheral surface of the covering portion is larger in the downstream region than in the upstream region. This allows the heat transfer coefficient to be higher in the downstream region than in the upstream region. In this way, the heat transfer coefficient is higher in the downstream region where the high-temperature refrigerant flows, so the amount of heat transfer is uniform between the upstream region and the downstream region. This allows the temperature difference between the upstream region and the downstream region in the mold to be reduced. Therefore, the deformation of the pressing surface of the mold can be suppressed and the degree of solidification of the resin-containing material can be made uniform. Therefore, the pressing force acting on the resin-containing material can be made uniform, so that the resin-containing material can be pressed suitably. Therefore, the quality of the resin-containing material after processing can be improved.

[0045] In addition, in the processing apparatus for a resin-containing material according to one aspect of the present disclosure, the surface roughness of the outer peripheral surface of the coating portion is smaller in the downstream region than in the upstream region.

[0046] In the above configuration, the surface roughness of the outer peripheral surface of the covering portion is smaller in the downstream region than in the upstream region. As a result, the contact area between the surface of the refrigerant hole and the outer peripheral surface of the covering portion is larger in the downstream region than in the upstream region. Therefore, the heat transfer coefficient is high in the downstream region where the high-temperature refrigerant flows, so the amount of heat transfer is uniform between the upstream region and the downstream region. This makes it possible to reduce the temperature difference between the upstream region and the downstream region in the mold. Therefore, it is possible to suppress deformation of the pressing surface of the mold and to uniformize the degree of solidification of the resin-containing material. Therefore, it is possible to uniformize the pressing force acting on the resin-containing material, so that the resin-containing material can be pressed suitably. Therefore, it is possible to improve the quality of the resin-containing material after processing.

[0047] In addition, in a resin-containing material processing apparatus according to one embodiment of the present disclosure, the coating portion has a cylindrical shape with an outer peripheral surface abutting the surface of the refrigerant hole, and the thermal conductivity of the coating portion is higher in the downstream region than in the upstream region.

[0048] In the above configuration, the thermal conductivity of the covering portion is higher in the downstream region than in the upstream region. As a result, the heat of the mold is more easily transferred to the refrigerant through the covering portion in the downstream region than in the upstream region. Therefore, the heat transfer coefficient can be made higher in the downstream region than in the upstream region. In this way, the heat transfer coefficient is higher in the downstream region where the high-temperature refrigerant flows, so the amount of heat transfer is uniform between the upstream region and the downstream region. This makes it possible to reduce the temperature difference between the upstream region and the downstream region in the mold. Therefore, it is possible to suppress deformation of the pressing surface of the mold and to uniformize the degree of solidification of the resin-containing material. Therefore, it is possible to uniformize the pressing force acting on the resin-containing material, so that the resin-containing material can be pressed suitably. Therefore, it is possible to improve the quality of the resin-containing material after processing. One example of a method for making the thermal conductivity different between the upstream region and the downstream region is to form the covering portion with materials having different thermal conductivities in the upstream region and the downstream region.

[0049] In addition, in the apparatus for processing a resin-containing material according to one aspect of the present disclosure, the covering portion has a lower thermal conductivity than the mold.

[0050] If the resin-containing material is cooled too quickly, the crystallinity of the resin contained in the resin-containing material decreases. On the other hand, in the above configuration, the coating portion has a lower thermal conductivity than the mold. This makes it difficult for the mold to be cooled by the coolant flowing through the coolant holes, and therefore makes it difficult for the resin-containing material to be cooled. Therefore, the rate at which the resin-containing material is cooled can be slower than when the coating portion is not provided. This makes it possible to increase the crystallinity of the resin contained in the resin-containing material.

[0051] In addition, in an apparatus for processing a resin-containing material according to one embodiment of the present disclosure, the refrigerant holes extend in a predetermined direction (X-axis direction) and are formed in multiple numbers, and the multiple refrigerant holes are arranged in a line at predetermined intervals in a transverse direction (Y-axis direction) that intersects the predetermined direction, and the heat transfer coefficient between the mold and the refrigerant flowing through the refrigerant holes is higher for the refrigerant holes formed in a central region of the transverse direction than for the refrigerant holes formed in end regions of the transverse direction.

[0052] In the mold, the end regions in the cross direction are easily cooled by the outside air, so the temperature of the end regions is easily low. Conversely, the central region in the cross direction is less easily cooled by the outside air than the end regions, so the temperature of the central region is easily high. In the above configuration, the heat transfer coefficient between the mold and the coolant flowing through the coolant hole is higher for the coolant hole formed in the central region in the cross direction than for the coolant hole formed in the end region. This increases the heat transfer coefficient between the mold and the coolant in the central region where the temperature is high. In other words, the amount of heat absorbed by the coolant increases. Also, in the end region where the temperature is low, the heat exchange coefficient between the mold and the coolant decreases. In other words, the amount of heat absorbed by the coolant decreases. Therefore, the temperature variation in the cross direction can be suppressed. [Explanation of symbols]

[0053] 10: Processing equipment 11: Mold 11a: Pressing surface 12: First mold 13: Second mold 14: Cooling water hole (cooling hole) 15: Cooling water piping (covered part) 15a: Entrance 15b:Exit 20: Processing equipment 25: Cooling water piping 25a: Upstream piping 25b: Central piping 25c: Downstream piping

Claims

1. A mold having a pressing surface for pressing a resin-containing material containing at least a resin, A refrigerant hole through which a refrigerant flows is formed inside the mold, At least an upstream region of a surface of the refrigerant hole is covered with a covering portion, An apparatus for processing a resin-containing material, wherein the coefficient of heat transfer between the mold and the coolant flowing through the coolant hole is higher in the downstream region than in the upstream region.

2. The covering portion has a cylindrical shape with an outer circumferential surface in contact with the surface of the refrigerant hole, 2 . The apparatus for processing a resin-containing material according to claim 1 , wherein a contact area between the surface of the coolant hole and the outer circumferential surface of the covering portion is larger in the downstream region than in the upstream region.

3. The apparatus for processing a resin-containing material according to claim 2 , wherein the surface roughness of the outer circumferential surface of the covering portion is smaller in the downstream region than in the upstream region.

4. The covering portion has a cylindrical shape with an outer circumferential surface abutting against the surface of the refrigerant hole, The apparatus for processing a resin-containing material according to claim 1 , wherein the thermal conductivity of the covering portion is higher in the downstream region than in the upstream region.

5. The apparatus for processing a resin-containing material according to claim 1 , wherein the covering portion has a lower thermal conductivity than the mold.

6. The refrigerant holes are formed in a plurality of holes extending in a predetermined direction, The plurality of refrigerant holes are arranged at predetermined intervals in a cross direction that crosses the predetermined direction, 6. The processing device for resin-containing materials according to claim 1, wherein the heat transfer coefficient between the mold and the coolant flowing through the coolant hole is higher in the coolant hole formed in the central region of the intersecting direction than in the coolant hole formed in the end region of the intersecting direction.

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