Vacuum lamination system and vacuum lamination method

JP7610566B2Active Publication Date: 2025-01-08THE JAPAN STEEL WORKS LTD
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Patent Information

Application Number
JP2022207710
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2022-12-26
Publication Date
2025-01-08
Estimated Expiration
2041-03-10

AI Technical Summary

Benefits of technology

【0008】 本発明の真空積層システムは、搬送フィルムを用いて積層成形物を真空積層装置のチャンバ内へ搬送し積層成形を行う真空積層システムにおいて、積層成形物と当接する部分に粘着材料が付着された搬送フィルムを用いて積層成形物の搬送を行うので、比較的容易に搬送フィルムに対する積層成形物の位置ずれを防止することができる。

✦ Generated by Eureka AI based on patent content.

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Abstract

An object of the present invention is to provide a vacuum lamination system or method that can relatively easily prevent displacement of a laminated molded product relative to a transport film. [Solution] In a vacuum lamination method in which a laminated molded product M is transported into a chamber C of a vacuum lamination device 12 using a transport film F1 and laminated, the laminated molded product M is transported using a transport film F1 having an adhesive material F1b attached to the portion that comes into contact with the laminated molded product M.
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Description

[Technical field]

[0001] The present invention relates to a vacuum lamination system and a vacuum lamination method in which a laminated product is transported into a chamber of a vacuum lamination device using a transport film and laminated. [Background technology]

[0002] In a vacuum lamination system in which a laminated molded product is transported into a chamber of a vacuum lamination device using a transport film and laminated, the laminated molded product on the transport film may become misaligned when the chamber is suctioned by vacuum. When the misalignment occurs, the laminated molded product that is pressurized often becomes defective. The techniques described in Patent Documents 1 and 2 are known to address the above problem.

[0003] Patent Document 1 describes a method of preventing the positional deviation of a laminated molded product by forming a protrusion on the carrier film or by temporarily attaching upper and lower carrier films to form a movement preventing portion, while Patent Document 2 describes a method of temporarily adhering the ends of a pair of carrier films by a crimping mechanism to prevent the positional deviation of a laminated molded product. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2020-29002 A [Patent Document 2] JP 2020-44703 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, when forming a movement preventing portion on the conveying film around the portion where the laminated molded product is placed or when temporarily bonding the upper and lower conveying films as in Patent Document 1 and Patent Document 2, there were the following problems. That is, when the movement preventing portion or the like is formed at a sufficient distance from the outer periphery of the laminated molded product, the laminated molded product may be displaced inside the movement preventing portion or the like. In addition, when the movement preventing portion or the like is formed in the very vicinity of the outer periphery of the laminated molded product, the accuracy of the device for forming the movement preventing portion or the like is required. In addition, when the laminated molded product is placed on the conveying film provided with the movement preventing portion, the laminated molded product may be placed overlapping the movement preventing portion. In addition, when the laminated molded product to be laminated by the vacuum lamination device is changed to a laminated molded product of a different size, the device for forming the movement preventing portion needs to be adjusted or changed, but such adjustments and changes are not easy tasks.

[0006] In view of the above problems, the present invention aims to provide a vacuum lamination system or a vacuum lamination method that can relatively easily prevent the positional deviation of a laminated molded product relative to a carrier film. Other objects and novel features will become apparent from the description of this specification and the accompanying drawings. [Means for solving the problem]

[0007] A vacuum lamination system according to one embodiment is a vacuum lamination system in which a conveying film is used to convey a laminate molded product into a chamber of a vacuum lamination device for laminate molding, and the laminate molded product is conveyed using a conveying film having an adhesive material attached to the portion that comes into contact with the laminate molded product. Effect of the Invention

[0008] The vacuum lamination system of the present invention is a vacuum lamination system in which a conveying film is used to convey a laminate molded product into the chamber of a vacuum lamination device and laminate molding is performed.Since the laminate molded product is conveyed using a conveying film having an adhesive material attached to the portion that comes into contact with the laminate molded product, it is relatively easy to prevent the laminate molded product from shifting in position relative to the conveying film. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a schematic explanatory diagram of a vacuum lamination system according to an embodiment of the present invention. [Diagram 2] 1A to 1C are diagrams illustrating an example of a transfer film used in the vacuum lamination system of the present embodiment. [Diagram 3] 3 is a cross-sectional view showing the AA and BB sections of FIG. 2. [Figure 4] FIG. 11 is a schematic explanatory diagram of a vacuum lamination system according to a second embodiment. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] The vacuum lamination system 11 of this embodiment will be described with reference to Fig. 1. The vacuum lamination system 11 of this embodiment transports the laminate material and the laminated material that constitute the laminated molded product M to a molding position in a chamber C of a vacuum lamination device 12 using transport films F1, F2, and laminates and molds the laminated product M at the molding position of the vacuum lamination device 12. When the upper platen 13 and the lower platen 14 of the vacuum lamination device 12 are closed, a chamber C that can be suctioned by vacuum is formed, and an elastic membrane body 15 (a diaphragm made of heat-resistant rubber such as silicone rubber) provided on at least one of the plates 13, 14 is expanded toward the other platen 14, 13 within the chamber C to pressurize and laminate the laminated product M. <Structure of the vacuum lamination device for the vacuum lamination molding system>

[0011] More specifically, in the vacuum lamination device 12, a lower platen 14 faces an upper platen 13. The lower platen 14 can be moved toward or away from the upper platen 13 by a lifting device (not shown). When the lower platen 14 rises relative to the upper platen 13 and the gap between the upper platen 13 and the lower platen 14 is closed, a chamber C of a predetermined volume is formed between the upper platen 13 and the lower platen 14, which can be evacuated by a vacuum pump 16. A heatable hot platen 17 is attached to the center of the lower surface of the upper platen 13. An elastic membrane 26 made of heat-resistant rubber such as a silicone rubber membrane is attached to the entire lower surface of the hot platen 17 of the upper platen 13. A side wall 25 is provided around the periphery of the lower surface of the upper platen 13 at a position facing the side wall 19 on the lower platen 14 side.

[0012] Meanwhile, a heatable hot plate 18 is also attached to the center of the upper surface of the lower plate 14. A frame-shaped side wall 19 is attached to the periphery of the upper surface of the lower plate 14. An elastic membrane 15 (diaphragm) is attached between the lower surface of the side wall 19 and the lower plate 14, covering the upper surface of the hot plate 18. The molding position in the center of the chamber C can be pressurized with uniform pressure by the elastic membrane 15, but the end of the chamber C may not be pressurized with uniform pressure. An O-ring 45 is attached to the upper surface of the side wall 19 (opposite surface to the upper plate 13) so as to surround the chamber C. The portion between one side portion of the side wall 25 of the upper plate 13 (the front process side, right side in FIG. 1) and one side portion of the side wall 19 of the lower plate 14 is an entrance 27 through which the laminated molded product M is carried in together with the conveying films F1 and F2. In addition, the portion between the other side portion of the side wall portion 25 of the upper platen 13 and the other side portion of the side wall portion 19 of the lower platen 14 (the subsequent process side, that is, the left side in Figure 1) serves as an outlet 28 through which the laminated molded product M that has completed pressure molding is discharged together with the conveying films F1 and F2.

[0013] A pipe 20 is connected to the hot plate 18 or its periphery below the elastic membrane 15, and the pipe 20 is connected to a compressor 22 for pressurization via an on-off valve 21. A pipe 23 branched from the part of the pipe 20 between the on-off valve and the compressor 22 is connected to a vacuum pump 16 via an on-off valve 24. Therefore, the lower part of the elastic membrane 15 can be connected to both the vacuum pump 16 for decompression and the compressor 22 for pressurization by controlling the on-off valves 21 and 24. When the pipe on the back side of the elastic membrane 15 is connected to the vacuum pump 16, the elastic membrane 15 is in close contact with the hot plate 18, and when it is connected to the compressor 22, the elastic membrane 15 is expanded into the chamber C. The elastic membrane 15 and the compressor 22 constitute the pressurization means of the vacuum lamination device 12.

[0014] A pipe 29 connected to the vacuum pump 16 is connected to the chamber C formed between the upper platen 13 and the lower platen 14 via an opening / closing valve 30 provided at the end where the pipe 23 branches off. More specifically, the pipe 29 is connected to a pipe 31 connected to the upper platen 13, and the air in the chamber C can be sucked almost uniformly from a suction port 46 between the entire periphery of the hot plate 17 and the side wall 25.

[0015] The vacuum lamination device 12 is not limited to the above, as long as it can perform pressure molding of the laminated molded product M at a molding position in the chamber C that can be suctioned by vacuum. As an example, the molded product may be laminated in the chamber of the vacuum lamination device by a pressure means using a combination of an elastic flat plate other than a diaphragm and a pressure cylinder. Alternatively, the laminated molded product M may be laminated through the conveying films F1 and F2 by a pressure means that applies pressure only by air pressure (including a relative pressure difference). <Laminated product transport mechanism for vacuum laminate molding system>

[0016] Next, the conveying mechanism 32 of the upper and lower conveying films F1, F2 and the laminated molded product M of the vacuum lamination system 11 will be described. In the conveying mechanism 32 of the vacuum lamination system 11, a winding roll 33 of the lower conveying film F1 for conveying the laminated molded product M into the vacuum lamination device 12 is provided below one side (the front process side, the right side in FIG. 1) of the vacuum lamination device 12. The winding roll 33 is driven and controlled by a servo motor (not shown). The lower conveying film F1 set on the winding roll 33 and unwound from the winding roll 33 has its transport direction changed horizontally by a rotatable driven roll 34. In addition, a winding roll 35 of the lower conveying film F1 is provided below the other side of the vacuum lamination device 12. The winding roll 35 is driven and controlled by a servo motor (not shown). The lower conveying film F1 coming out of the discharge port 28 of the vacuum lamination device 12 has its direction changed by a rotatable driven roll 36 and is wound up by the lower winding roll 35.

[0017] A rotatable peeling driven roll 37 is provided between the unwinding roll 33 and the driven roll 34, and only the release film F1c of the transport film F1 is peeled off by this peeling driven roll 37. The release film F1c is then taken up by a take-up roll 38 for the release film F1c. In this embodiment, the take-up roll 38 is in contact with the unwinding roll 33 by its own weight, and is rotated in a driven state together with the rotation of the unwinding roll 33. The take-up roll 38 may be rotated by a motor.

[0018] A supply stage S1 for the laminated molded product M is provided at a portion where the lower conveying film F1 is fed in the horizontal direction. In this embodiment, the laminated molded product M is placed on the lower conveying film F1 at the supply stage S1 by a carry-in device 39 equipped with a holder such as a suction device. At this time, the laminated molded product M may be a product in which the substrate or semiconductor to be molded and the film serving as the laminate material are set from the beginning, or may be a product that is laminated at the supply stage S1.

[0019] An unwinding roll 40 for the upper transport film F2 is provided on one side of the vacuum lamination device 12, above the portion between the vacuum lamination device 12 and the supply stage S1. The unwinding roll 40 is also driven and controlled by a servo motor (not shown). The upper transport film F1, which is set on the unwinding roll 40 and unwound from the unwinding roll 40, is overlapped with the lower transport film F1 by a rotatable driven roll 41, and the transport direction is changed to the horizontal direction. The upper and lower transport films F1, F2 are fed into the chamber C from the carry-in entrance 27 of the vacuum lamination device 12 with the laminated molded product M sandwiched therebetween.

[0020] A take-up roll 42 for the upper transport film F2 is provided above the other side of the vacuum lamination device 12. The take-up roll 42 is driven and controlled by a servo motor (not shown). The upper transport film F2 emerging from the discharge port 28 of the vacuum lamination device 12 is peeled off from the lower transport film F1 by a rotatable driven roll 43, transported upward, and taken up by the upper take-up roll 42. Note that the upper transport film F2 is not essential in the present invention, and the purpose of preventing adhesion of the molten resin to the vacuum lamination device 12 can also be achieved by covering the laminated product M with a cover film having an area larger than that of the laminated product M.

[0021] A take-out stage S2 is provided at a position where the lower conveying film F1 is horizontally transferred after passing through the carry-in entrance 27, chamber C, and carry-out exit 28 of the vacuum lamination device 12 and the upper conveying film F2 is removed. A take-out device 44 equipped with a suction tool is provided above the take-out stage S2, and the laminated molded product M is taken out to a subsequent process. The lower conveying film F1 is then redirected by the driven roll 36 and taken up by the take-up roll 35 as described above.

[0022] The unwinding rolls 33, 40 and the winding rolls 35, 42 of the conveying mechanism 32 are not limited to those driven by a servo motor, and may be other electric motors. A servo motor may be used only to drive the winding rolls 35, 42, and a torque motor or the like may be used for the unwinding rolls 33, 40 that apply tension in the opposite direction. Furthermore, a part of the conveying mechanism 32 may be a film transport device that grips the sides of the conveying films F1, F2 and moves them from right to left in FIG. 1 to accurately move the conveying films F1, F2 horizontally by one pitch, and in that case, the winding rolls 35, 42 may not use a servo motor. Furthermore, one or two flattening press devices for the purpose of further flattening the surface of the laminated molded product M may be installed in a process downstream of the vacuum lamination device 12. <Transport film used in vacuum lamination molding systems>

[0023] The conveying film F1 used in the vacuum lamination system and vacuum lamination method of this embodiment is also called a carrier film, and has an adhesive material attached to the part that contacts the laminated molded product M. Specifically, the conveying film F1 is provided with a core film F1a made of a thermoplastic resin such as polyethylene terephthalate or polyethylene. The core film F1a is also called a base film, and is preferably made of the above-mentioned thermoplastic resin from the viewpoint of cost. The core film F1a is not limited to a single layer, and may be provided with other resin layers such as a fluorine resin coating layer. The thickness of the core film F1a is not limited to this, but is preferably 0.05 mm to 0.30 mm, for example.

[0024] A layer of adhesive material F1b mainly made of silicone is attached to one surface of the core film F1a of the carrier film F1. Here, the "adhesive material mainly made of silicone" refers to silicone rubber and silicone resin with various additives added. In the following specification, the "adhesive material mainly made of silicone" is referred to as a silicone-based adhesive material F1b. The silicone-based adhesive material F1b is also generally referred to as a silicone adhesive. The compounding ratio of silicone rubber in the silicone-based adhesive material F1b is, for example, 30 to 80% by weight, but is not limited thereto. The adhesive material usable in the present invention may be a urethane-based adhesive material, an acrylic-based adhesive material, or a fluorine-based adhesive material other than silicone rubber, or a combination of these materials. The thickness of the layered adhesive material F1b is, for example, 0.005 mm to 0.080 mm, but is not limited thereto, and more preferably 0.018 mm to 0.050 mm. The adhesive strength of the silicone-based adhesive material F1b of this embodiment is determined by the crosslinking method of the silicone rubber, the adjustment of the compounding ratio of the silicone rubber and the silicone resin, etc., but it is preferable that the adhesive strength is weak. More specifically, but not limited to, as an example, the adhesive strength to a smooth glass surface is more preferably about 0.1gf25mm to 10.0gf25mm, and even more preferably about 0.5gf25mm to 5.0gf25mm.

[0025] A release film made of a thermoplastic resin such as polyethylene terephthalate or polyethylene is disposed on one side of the layer of the silicone adhesive material F1b (the side opposite to the side on which the silicone adhesive material F1b and the core film F1a are attached). Although the release film is not essential in the present invention, when the film roll F1d is unwound, The adhesive layer F1b is prevented from peeling off from the core film F1a, and the two are smoothly unwound as an integrated laminated film. As described above, the transport film F1 is a laminate of the core film F1a, the silicone adhesive material F1b attached to the core film F1a, and the release film F1c, and is set on the unwinding roll 33 of the transport mechanism 32 in the form of a film roll F1d wound up to 1,000 m, for example, but not limited to, in this state. <Form of adhesive material of transport film>

[0026] In the carrier film F1 of this embodiment, as shown in Fig. 2(a) and Fig. 3(a), the silicone-based adhesive material F1b is attached in a layer of approximately uniform thickness to the entire surface of the core film F1a, and the surface is a smooth surface. However, as shown in Fig. 2(b), the silicone-based adhesive material F1b may be attached in a layer to the entire surface, and the layered portion may further have a lattice-like projection of the silicone-based adhesive material F1b. As shown in Fig. 2(c), the silicone-based adhesive material F1b may be attached to the entire surface, and a large number of circular or polygonal projections of the silicone-based adhesive material F1b may be formed to provide an embossed surface. As shown in Fig. 2(d), the silicone-based adhesive material F1b may not be attached to the portions on both sides where the laminated molded product M is not placed or abutted, and the silicone-based adhesive material F1b with a smooth layer or embossed surface may be attached only to the portion where the laminated molded product M is placed or abutted on the center side. The surface roughness of the silicone-based adhesive material F1b is appropriately adjusted. FIG. 3(a) shows a cross section taken along the line AA in FIG. 2(a), in which the rear surface M1 of the laminated molded product M such as a semiconductor wafer placed thereon and the front surface of the silicone adhesive material F1b are in almost intimate contact with each other.

[0027] The carrier film F1 may have a silicone-based adhesive material F1b attached to a part of the surface of the core film f1a, as shown in Figs. 2(e), (f), (g), (h) and 3(e). In Fig. 2(e), protrusions of the silicone-based adhesive material F1b are formed in a linear shape. The direction in which the protrusions of the silicone-based adhesive material F1b are formed may be the same as the conveying direction of the carrier film F1 or the other direction. In Fig. 2(f), protrusions of the silicone-based adhesive material F1b are formed in a lattice shape on the core film F1a. Furthermore, in Fig. 2(g), the core film F1a has an embossed surface on which a large number of protrusions of the silicone-based adhesive material F1b, such as circles and polygons, are formed on the core film F1a. In Fig. 2(h), the silicone-based adhesive material F1b is randomly attached on the core film F1a. In each of the above examples, the surface roughness of the silicone-based adhesive material F1b is appropriately adjusted. In these Fig. 2 (e), (f), (g), (h), a part of the core film F1a such as polyethylene terephthalate is exposed on the surface. Therefore, the carrier film F1 of Fig. 2 (e), (f), (g), (h) may be able to reduce the amount of silicone-based adhesive material F1b used. Fig. 3 (e) shows a BB cross section of Fig. 2 (e), in which the back surface M1 of the laminated molded product M such as a semiconductor wafer placed on it is supported only by the protruding part of the silicone-based adhesive material F1b, and a gap D is formed between the back surface M1 other than the supported part and the surface of the core film F1a.

[0028] 2(b) and (c), when a gap D is formed between the back surface M1 of the laminated molded product M and the surface of the core film F1a, the release between the conveying film F1 and the laminated molded product M is often good when the laminated molded product M is removed after being laminated in the vacuum lamination device 12. However, depending on the material of the laminated molded product M and the hardness of the adhesive material, if the gap D is large, only the protruding parts of the silicone-based adhesive material F1b are strongly pressurized during the laminated molding, and the effects of uneven pressure may occur, so the optimal conveying film F1 is selected according to the laminated molded product M. Similarly, the optimal relationship between the adhesive strength of the silicone-based adhesive material F1b itself, the surface roughness, and the releasability is also selected.

[0029] The carrier film F1 to which the adhesive material (silicone-based adhesive material F1b) mainly composed of silicone rubber of the present invention is attached is expensive compared to the commonly available carrier film made only of polyethylene terephthalate, and therefore, in the present invention, it is used only for the lower carrier film F1 on which the laminated molded product M is placed. And, the upper carrier film F2 is a carrier film F2 made only of general polyethylene terephthalate. This is because the lower carrier film F1 is subjected to the weight of the laminated molded product M, and the friction coefficient between the upper surface of the carrier film F1 and the lower back surface M1 of the laminated molded product M has the greatest effect on the positional deviation of the laminated molded product M.

[0030] However, depending on the type of laminated molded product M, a conveying film with a silicone-based adhesive material F1b attached to the upper and lower conveying films F1, F2 may be used. When a conveying film with a silicone-based adhesive material F1b attached to the upper conveying film F2 is used, the silicone-based adhesive material F1b is attached to the surface that becomes the lower side of the core film during horizontal conveyance, and the silicone-based adhesive material F1b is used in contact with the laminated molded product M. Alternatively, depending on the laminated molded product M, a conveying film with a silicone-based adhesive material F1b attached to only the upper conveying film F2 may be used, and the conveying film with a silicone-based adhesive material F1b attached to at least one of the upper and lower conveying films F1, F2 may be used. <Vacuum lamination method for vacuum lamination molding system>

[0031] Next, the vacuum lamination method of the vacuum lamination system 11 of this embodiment will be described with reference to Fig. 1. Before lamination molding is started, the transport film F1 to which the silicone-based adhesive material F1b is attached is set so that the film roll F1d is set on the unwinding roll 33 of the transport mechanism 32, and is unwound from the unwinding roll 33, passes through the vacuum lamination device 12, and is wound up on the winding roll 35. Then, only the release film F1c of the transport film F1 unwound from the unwinding roll 33 is separated from the layer of the core film F1a and the silicone-based adhesive material F1b at the peeling driven roll 37, folded back, and wound up by the release film winding roll 38. The upper transport film F2 is also set so that the film roll F2a is set on the unwinding roll 40, and is unwound from the unwinding roll 40, passes through the vacuum lamination device 12, and is wound up on the winding roll 42.

[0032] The remaining conveying film F1 from which the release film F1c has been peeled off is folded back at the driven roll 34, and moved to the mounting stage S1 in a state in which a layer of silicone-based adhesive material F1b is laminated on the core film F1a. At the mounting stage S1, a laminated molded product M is placed on the layer of silicone-based adhesive material F1b using a carry-in device 39. The laminated molded product M to be laminated and molded in this embodiment is not particularly limited, but is targeted to be one that is prone to positional deviation during transportation or vacuum suction in the chamber C of the vacuum lamination device 12. Therefore, the laminated molded product is lightweight, or has a smooth back surface and a small friction coefficient. In particular, in the case of wafers, those with an average back surface roughness Ra of 0.2 um or less are slippery and therefore are targeted. In addition, the number of laminated molded products to be laminated and molded at one time is not limited, but in particular when a large number of products (for example, 9 or more) are molded simultaneously in the vacuum lamination device 12, or when laminated molded products of different sizes are molded successively in small quantities in the vacuum lamination device 12, adjustments are difficult when using devices such as those in Patent Document 1 and Patent Document 2, so it is effective to use the conveying film F1 of the present invention.

[0033] When the previous lamination is completed in the vacuum lamination device 12, the lower platen 14 is lowered and the chamber C is opened. Next, a servo motor (not shown) for the take-up roll 35 of the lower conveying film F1 of the conveying mechanism 32 is driven, and the lower conveying film F1 is unwound from the film roll F1d and pulled and moved toward the other side (the post-process side, the left side in FIG. 1). Accordingly, the laminated molded product M placed on the supply stage S1 is conveyed toward the chamber C of the vacuum lamination device 12 together with the lower conveying film F1. At this time, the servo motor for the take-up roll 42 of the upper conveying film F2 is also driven, and the upper conveying film F2 is unwound from the film roll F2a and pulled and moved toward the other side. Then, from the driven roll 41, the upper conveying film F2 is superimposed on the laminated molded product M on the lower conveying film F1, and the upper and lower conveying films F1 and F2 are conveyed together with the laminated molded product M toward the entrance 27 of the vacuum lamination device 12 at the same speed. At this time, it is desirable that the unwinding roll 33 for the lower transport film F1 and the unwinding roll 40 for the upper transport film F2 are applied with torque by a servo motor in the direction of winding the transport films F1, F2 onto the film rolls F1d, F2a, thereby maintaining a state in which tension is applied to the upper and lower transport films F1, F2.

[0034] Then, the upper and lower transport films F1, F2 are moved by one pitch, and transport by the upper and lower transport films F1, F2 is stopped when the laminated product M is transported to the molding position in the chamber C of the vacuum lamination device 12. At this time, even if a forward inertial force acts on the laminated product M due to the shock caused by the stop of the lower transport film F1, at least a part of the portion of the upper surface of the transport film F1 that abuts against the laminated product M is made of the silicone-based adhesive material F1b and has an adhesive effect on the back surface M1 of the laminated product M, so that the positional deviation of the laminated product M is prevented.

[0035] When the laminated molded product M is set at the molding position, the lower plate 14 is raised by the operation of a lifting device (not shown) to form a chamber C between the lower plate 14 and the upper plate 13. Then, the opening and closing valves 24, 30 are controlled, and the atmosphere in the chamber C is sucked by the vacuum pump 16 to reduce the pressure (vacuum) to a predetermined level. At this time, in the case of a conventional carrier film made only of polyethylene terephthalate, the laminated molded product M may unexpectedly move from the initial molding position to another position due to airflow generated in the chamber C and the vibration of the carrier films F1, F2 associated with the airflow, causing a "displacement". However, in the present invention, at least a part of the part of the upper surface of the lower carrier film F1 that is in contact with the laminated molded product M is made of a silicone-based adhesive material F1b, so that the displacement is prevented even if an airflow or vibration of the carrier films F1, F2 occurs in the chamber C. Similarly, the displacement of the laminated molded product M due to the expansion of the elastic film body 15 when pressurized is also prevented.

[0036] In the vacuum lamination device 12, the temperature of the hot plates 17, 18 is set to 100°C to 180°C, for example, and compressed air is sent from the compressor 22 to the rear side of the elastic film 15 through the pipe 20 to expand the elastic film 15, and the laminated product M is pressurized and molded through the transport films F1, F2 for a predetermined time. However, the heat resistance temperature of silicone rubber is higher than the temperature of the hot plates 17, 18, so that the silicone adhesive material F1b of the transport film F1 does not change in quality and adversely affect the laminated product. When the pressurized product is completed, the vacuum in the chamber C is broken, and then the lower platen 14 is lowered to open the chamber C. Then, the upper and lower transport films F1, F2 and the laminated product M that has been molded are sent to the other side from the discharge port 28 of the vacuum lamination device 12 by driving the winding rolls 35, 42 of the upper and lower transport films F1, F2. Then, the upper transport film F2 is peeled off at the driven roll 34, and the lower transport film F1 and the laminated molding M are sent to the removal stage S2 and stopped.

[0037] Next, the laminated molded product M is removed by the discharge device 44. At this time, the silicone-based adhesive material F1b attached to the core film F1a of the conveying film F1 is weakly adhesive and has an optimal peeling force (adhesive force) for releasing the laminated molded product M, and the core film F1a of the conveying film F1 and the laminated molded product M are not firmly adhered to each other, so that the laminated molded product M can be easily released without damaging it. Paradoxically speaking, an adhesive material having an optimal type, shape, thickness, etc. is selected and used for the conveying film F1 based on a balance between the performance of preventing the laminated molded product M from being displaced, the laminated molding performance, and the releasing performance.

[0038] In relation to the above, the conveying film F1 in which the silicone-based adhesive material F1b of this embodiment is attached in layers on the entire pressure surface may be effective not only in preventing the positional deviation of the laminated molded product M, but also in molding the laminated molded product M. Specifically, the hardness (JIS-K 6353 durometer type A hardness) of the silicone-based adhesive material F1b may be selected between 15 and 80, but is not limited thereto. Therefore, when the A hardness is low, it may contribute to improving the embedding property of the molten resin film in the recess on the substrate or wafer side of the laminated molded product M. This is particularly effective when the recess or groove of the substrate or wafer is narrow or deep. When the conveying film F1 is the conveying film F1 in which the silicone-based adhesive material F1b is attached in layers only on the lower conveying film F1, pressure molding is performed with the side of the substrate or wafer with the recess or groove facing the conveying film F1 toward the lower surface. When the recess or groove is present on both sides of the substrate or the like, the embedding property may be improved by using conveying films with silicone-based adhesive materials such as silicone rubber layers on the upper and lower conveying films F1 and F2.

[0039] Next, a vacuum lamination system 51 of a second embodiment will be described with reference to FIG. 4, focusing on differences from the present embodiment of FIG. 1. However, the same parts as those in FIG. 1 will be designated by the same reference numerals and description will be omitted. In the second embodiment, the upper and lower conveying films F1 and F2 are made of general polyethylene terephthalate or the like. An adhesive material such as a silicone-based adhesive material F1b is applied by an adhesive applicator 52 of the vacuum lamination system 51 to the surface of the conveying film F1, which corresponds to the core film F1a unwound from the unwinding roll 33 of the conveying mechanism 32 of the laminated product, that comes into contact with the laminated product M. The type of adhesive applicator 52 is not limited, and an appropriate one can be selected from various types such as a die coater or a roll type.

[0040] The adhesive material such as silicone adhesive material F1b may be applied to the entire surface of the carrier film F1 such as polyethylene terephthalate, which is the core film F1a, or may be applied partially as shown in each example in FIG. 2. The carrier film F1 coated with the adhesive material is moved to the mounting stage S1 for the laminated product M through the number of pitches (number of lamination moldings) required for drying. In the second embodiment, the time required for lamination molding in the vacuum lamination device 12 (including the time to evacuate the chamber C) is about 1 minute, and the adhesive material is dried in about 2 minutes for two pitches. Note that, if necessary, a heating and drying device 53 for the adhesive material may be arranged at a position opposite the conveying path of the carrier film F1 to promote drying of the adhesive material.

[0041] According to the second embodiment, the equipment cost of the vacuum lamination system 51 itself including the adhesive application device 52 increases, but since it is possible to use a common conveying film such as inexpensive polyethylene terephthalate, it is often possible to reduce running costs even if an adhesive material is prepared and applied separately.

[0042] Although not listed individually, the present invention is not limited to the above-described embodiments, but it goes without saying that the present invention can also be applied to modifications made by those skilled in the art based on the spirit of the present invention, and to combinations of parts of the above-described embodiments. [Explanation of symbols]

[0043] 11,51 Vacuum Lamination System 12 Vacuum lamination equipment 32 Transport mechanism C Chamber F1 Lower transport film F1a Core film F1b Silicone adhesive material F1c Release Film F2 Upper transport film M Laminated molded product

Claims

1. A vacuum lamination system that conveys a laminated molded product by a conveying film and performs lamination molding, A vacuum lamination device for laminating the laminated molded product; A conveying mechanism for conveying the laminated molded product; a peeling roll for peeling off the release film from the conveying film, the release film being attached via an adhesive material provided on a portion of the core film where the laminated product contacts, A vacuum lamination system in which the laminated product is carried into and carried out from the vacuum lamination device while being held by the core film by the adhesive force of the adhesive material.

2. 2. The vacuum lamination system according to claim 1, further comprising a release film take-up roll for taking up the release film after peeling.

3. The vacuum lamination system of claim 1 , wherein the adhesive material is silicone based.

4. The vacuum lamination system of claim 1 , wherein the release film is made of a thermoplastic resin.

5. The transport mechanism includes: a winding roll for feeding the laminated product into the vacuum lamination device; a take-up roll for carrying the laminate out of the vacuum lamination device; 10. The vacuum lamination system of claim 1, comprising:

6. A vacuum lamination system for laminating a laminate by conveying the laminated molded product using a conveying film, A vacuum lamination device for laminating the laminated molded product; A conveying mechanism for conveying the laminated molded product; an adhesive applicator that applies an adhesive material to a portion of the conveying film that contacts the laminated product; A vacuum lamination system in which the laminated product is carried into and carried out from the vacuum lamination device while being held on the carrier film by the adhesive force of the adhesive material.

7. The vacuum lamination system of claim 6 , wherein the adhesive material is silicone based.

8. The transport mechanism includes: a winding roll for feeding the laminated product into the vacuum lamination device; a take-up roll for carrying the laminate out of the vacuum lamination device; 7. The vacuum lamination system of claim 6, comprising:

9. A vacuum lamination method in a vacuum lamination system in which a laminated molding is transported by a transport film and laminated, comprising: a film peeling step of peeling the release film from a first conveying film including a core film and a release film attached via an adhesive material provided on a portion of the core film where the laminated molding contacts; a step of placing the laminate on a portion of the core film on which the adhesive material is provided; a carrying-in step of carrying the laminate molded product into a vacuum lamination device in a state in which the laminate molded product is held on the core film by the adhesive force of the adhesive material after the placing step; a pressurizing step of pressurizing the laminated molded product in a vacuum after the carrying-in step; a carrying-out step of carrying out the laminated molding from the vacuum lamination device in a state where the laminated molding is held on the core film by the adhesive force of the adhesive material after the pressurizing step; A vacuum lamination method comprising:

10. The vacuum lamination method according to claim 9, wherein in the pressurizing step, the laminate is transported into the vacuum lamination apparatus in a state where it is sandwiched between a second transport film and the core film.

11. The vacuum lamination method according to claim 9 , wherein the adhesive material is mainly composed of silicone.

12. 10. The vacuum lamination method of claim 9, wherein the release film is made of a thermoplastic resin.

13. A vacuum lamination method in a vacuum lamination system in which a laminated molding is transported by a transport film and laminated, comprising: a coating step of coating an adhesive material on a portion of the conveying film that contacts the laminated product; a placing step of placing the laminate on a portion of the conveying film on which the adhesive material is provided; a carrying step of carrying the laminate molded product into a vacuum lamination device while the laminate molded product is held on the conveying film by the adhesive force of the adhesive material after the placing step; a pressurizing step of pressurizing the laminated molded product in a vacuum after the carrying-in step; a carrying-out step of carrying out the laminated molded product from the vacuum lamination device in a state in which the laminated molded product is held on the conveying film by the adhesive force of the adhesive material after the pressurizing step; A vacuum lamination method comprising:

14. The vacuum lamination method according to claim 13 , wherein the adhesive material is mainly composed of silicone.

Citation Information

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