Substrate processing method
The substrate processing method stabilizes film thickness by applying fluids like DIW or thinner and controlling humidity to address variations over time, ensuring accurate film thickness measurements and improving process consistency in semiconductor manufacturing.
JP7612506B2Active Publication Date: 2025-01-14TOKYO ELECTRON LTD
Patent Information
- Application Number
- JP2021079181
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-05-07
- Publication Date
- 2025-01-14
- Estimated Expiration
- 2041-05-07
Smart Images
Figure 0007612506000001 
Figure 0007612506000002 
Figure 0007612506000003
Abstract
To suppress the variation in the film thickness measurement result of a substrate.SOLUTION: A substrate processing device for processing a substrate to be measured by a film thickness measuring device includes a heating processing unit that heats the substrate coated with a coating film, and a fluid supply unit that suppresses variation in film thickness of the substrate during or after being processed by the heat processing unit due to a difference in a measurement time until the film thickness is measured by the film thickness measuring device.SELECTED DRAWING: Figure 9
Need to check novelty before this filing date? Find Prior Art
Citation Information
Patent Citations
Method and apparatus for baking semiconductor wafer
JP1995161619A
Formation of resist pattern
JP1996022944A
Film thickness measuring apparatus, film thickness measuring method, program, and manufacturing method of semiconductor device
JP2019062003A
Substrate-processing apparatus
US20020014084A1