Polyester resin composition and molded article thereof

Abstract

The present invention provides a polyester resin composition and molded articles thereof that have excellent laser transmittance and can be used for various automotive electrical components (various control units, various sensors, etc.), connectors, switch components, relay components, etc. [Solution] The polyester resin composition and molded article thereof of the present invention are obtained by blending at least 100 parts by weight of (A) polybutylene terephthalate resin, 15 to 100 parts by weight of (B) amorphous resin, and 0.010 to 5.0 parts by weight of (C) epoxy resin, and the melting point of the polyester resin composition is 210°C or higher and 221°C or lower.

Description

[Technical field]

[0001] The present invention relates to the field of polymeric materials, and in particular to polyester resin compositions and molded articles thereof. [Background technology]

[0002] Polybutylene terephthalate (PBT) resin is widely used in the fields of machine parts, telecommunication parts, automobile parts, etc., due to its excellent properties such as heat resistance, chemical resistance, electrical properties, mechanical properties, and moldability. In the field of automobile parts, etc., its use in various automobile electrical parts has been attracting a lot of attention in recent years. However, these parts may need to be airtight, and conventional joining methods such as screw fastening, adhesive bonding, hot plate welding, and ultrasonic welding all have problems such as long process times and insufficient design freedom.

[0003] Laser welding is an external heating and welding technology, in which a laminated resin molded body is irradiated with laser light, which is transmitted through the irradiated surface and absorbed by the other surface to melt and weld the laminate. This method can achieve the requirements of three-dimensional joining, non-contact processing, and no welding spatter. Therefore, the characteristics of the process being fast, the degree of design freedom being large, and the high bonding strength are attracting wide attention. At the same time, from the above laser welding process, it can be seen that the laser transmittance of the welding material is an important parameter. When joining PBT resin by laser welding, if the laser transmittance of the resin is too low, the heat absorption of the welding surface is likely to be insufficient, and ultimately welding will not be possible. However, if the intensity of the laser light is increased to compensate for the lack of transmittance and the heat absorption of the welding surface is increased, the material will easily be overheated, decomposed, and carbonized. Therefore, how to effectively improve the laser transmittance of the welding material has always been a topic of interest in this field.

[0004] In the existing technology for improving the transmittance of resin materials for laser welding, Patent Document 1 (JP Patent Publication 2010-70626) discloses a polyester resin that is excellent in laser transmittance, cold and heat resistance, heat resistance, and mechanical strength, and is extremely effective for laser welding of resin products. A specific method is a polyester resin composition suitable for laser welding, which is composed of (A) 29 to 84% by weight of polybutylene terephthalate (PBT) resin, (B) 5 to 60% by weight of at least one resin selected from polyester resins in which the repeating unit formed of terephthalic acid residues and 1,4-cyclohexanedimethanol residues accounts for 25 mol % or more, and polycarbonate resins, (C) 10 to 50% by weight of reinforcing fibers, and (D) 1 to 20% by weight of a block copolymer of polyalkyl methacrylate and butyl acrylate. However, in the polyester resin composition of this patent document, the compatibility between the PBT resin and the amorphous resin is insufficient, and the laser transmittance cannot be said to be high.

[0005] Patent Document 2 (JP Patent Publication 2007-186584) discloses a polyester resin composition having excellent laser weldability and a molded product firmly bonded by laser welding. The solution is a polyester resin composition for laser welding to which 0 to 100 parts by weight of (b) a reinforcing filler and 0.1 to 100 parts by weight of (c) an epoxy compound are added to 100 parts by weight of (a) a polyester resin composition. Although an epoxy resin is added to the composition, there is no mention of the fact that the compatibility between PBT resin and amorphous polyester resin can be improved by adding an epoxy resin with a special structure adopted in the present invention, and the transmittance of the polyester resin composition is insufficient.

[0006] Patent Document 3 (Chinese Patent Application Publication No. CN1863870A) describes a specific composition, for example a combination of polybutylene terephthalate resin, polystyrene elastomer, polycarbonate resin, and plasticizer, which has the effect of improving the uniformity of transmittance and reducing the difference in transmittance between different parts of a molded product, but cannot significantly improve the transmittance (transmittance under laser light conditions with a wavelength of 940 nm is 20-34%).

[0007] Furthermore, Patent Document 4 (Japanese Patent Publication No. JP2005-336409) discloses that by controlling the phase structure of a polymer alloy containing at least polybutylene terephthalate and polycarbonate, the molded product can be effectively used as a transparent material for laser welded parts. However, there is no mention of improving the compatibility between PBT resin and amorphous polyester resin, and there is a limit to the level of transmittance improvement that can be achieved with this technology. [Prior art documents] [Patent documents]

[0008] [Patent Document 1] JP 2010-70626 A [Patent Document 2] JP 2007-186584 A [Patent Document 3] China Patent Publication No. 1863870 [Patent Document 4] JP 2005-336409 A Summary of the Invention [Problem to be solved by the invention]

[0009] The present invention provides a polyester resin composition and a molded article thereof which have excellent laser transmittance and can be used for various automobile electrical parts (various control units, various sensors, etc.), connectors, switch parts, relay parts, etc. [Means for solving the problem]

[0010] In order to solve the above-mentioned problem of insufficient laser transmittance in the conventional art, the present inventors have conducted intensive research and have found that a polyester resin composition obtained by blending at least (A) polybutylene terephthalate resin, (B) amorphous resin, and (C) epoxy resin with a special structure and adjusting the melting point to 210°C to 221°C has high laser transmittance. In addition, a molded article produced from the polyester resin composition of the present invention can transmit laser light even when the laser output is low or the thickness of the molded article is large. Therefore, it is suitable as a laser transmitting material for laser welding parts and can be firmly bonded to a laser absorbing material.

[0011] That is, the technical solutions of the present invention are as follows: 1. A polyester resin composition obtained by blending at least the following (A) to (C): (A) 100 parts by weight of polybutylene terephthalate resin, (B) 15 to 100 parts by weight of amorphous resin, (C) 0.010 to 5.0 parts by weight of at least one epoxy resin selected from the group consisting of trisphenolmethane type, tetrakisphenolethane type, novolac type, and naphthalene type. In addition, the polyester resin composition is cooled from a molten state to 20°C at a temperature drop rate of 20°C / min under a nitrogen gas atmosphere using a differential scanning calorimeter, and then heated at a temperature increase rate of 20°C / min, and the temperature of the endothermic peak that appears during the heating process is 210°C or higher and 221°C or lower. 2. The polyester resin composition according to 1 above, wherein the (B) amorphous resin is at least one selected from the group consisting of polycarbonate, amorphous polyester containing cyclohexanedimethylene terephthalate units, and acrylonitrile / styrene copolymers. 3. The polyester resin composition according to 1 above, wherein (C) the epoxy resin has a glycidyl ether or glycidyl ester structure. 4. The polyester resin composition according to 3 above, wherein the epoxy resin (C) is a novolac-type epoxy resin having a glycidyl ether structure represented by the following general formula (1).

[0012] [ka]

[0013] (In the above general formula (1), X represents a divalent group represented by the above general formula (2) or (3). In the above general formulas (1) and (3), R 1 , R 2 , R 4 and R 5 R is independently an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an alkyl ether group having 1 to 8 carbon atoms. 3 is either a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an aryl group having 6 to 10 carbon atoms. In the above general formula (1), n ​​represents a value greater than 0 and equal to or less than 10. In the above general formulas (1) and (3), a, c, and d each independently represent an integer of 0 to 4, and b represents an integer of 0 to 3. 5. The polyester resin composition according to the above item 1, wherein the content of the epoxy resin (C) is 0.05 to 3 parts by weight based on 100 parts by weight of the polybutylene terephthalate resin (A). 6. The polyester resin composition according to 1 above, further comprising (D) a filler. 7. The polyester resin composition according to 6 above, wherein the filler (D) is at least one selected from glass fibers and carbon fibers. 8. The polyester resin composition according to the above item 6, wherein the content of the filler (D) is 1 to 150 parts by weight based on 100 parts by weight of the polybutylene terephthalate resin (A). 9. The polyester resin composition according to the above item 1, further comprising (E) an ester exchange inhibitor. 10. The polyester resin composition according to 9 above, wherein the (E) transesterification inhibitor is represented by the following general formula (4):

[0014] [ka]

[0015] (In the above general formula (4), R6 is an alkyl group having 1 to 30 carbon atoms, and m is 1 or 2. 11. The polyester resin composition according to the above item 9, wherein the content of the ester exchange inhibitor (E) is 0.025 to 0.5 parts by weight based on 100 parts by weight of the polybutylene terephthalate resin (A). 12. The polyester resin composition according to 1 above, further comprising (F) a nucleating agent. 13. A polyester resin composition as described in 12 above, wherein the nucleating agent (F) is at least one selected from the group consisting of silica, aluminum oxide, zirconium oxide, titanium oxide, wollastonite, kaolin, talc, mica, silicon carbide, ethylene bislauryl amide, and sorbitol derivatives. 14. The polyester resin composition according to the above 12, wherein the content of the nucleating agent (F) is 0.05 to 5 parts by weight based on 100 parts by weight of the polybutylene terephthalate resin (A). 15. The polyester resin composition according to 1 above, which is molded at a molding temperature of 260°C and a mold temperature of 80°C, and the resulting molded piece having a thickness of 1 mm has a spectrophotometer transmittance of 48% or more at a wavelength of 940 nm. 16. A molded article produced from the polyester resin composition described in any one of 1 to 15 above. 17. The molded article according to claim 16, which is a transparent material for laser welding. 18. A molded product as described in claim 16, wherein the thickness of the laser-transmitting portion of the molded product is 3 mm or less.

[0016] The polyester resin composition has excellent laser light transmittance and can be used for various electrical parts for automobiles (various control units, various sensors, etc.), connectors, switch parts, relay parts, etc. Effect of the Invention

[0017] The polyester resin composition of the present invention and its molded article have excellent laser transmittance and can be used for various automobile electrical parts (various control units, various sensors, etc.), connectors, switch parts, relay parts, etc. [Brief description of the drawings]

[0018] [Figure 1] FIG. 1 shows (A) a plan view and (B) a side view of a test piece for evaluating transmittance. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0019] Specific embodiments of the present invention will be described below.

[0020] (A) Polybutylene terephthalate resin The (A) polybutylene terephthalate (PBT) resin which is the matrix resin in the polyester resin composition of the present invention includes homopolyesters or copolyesters containing butylene terephthalate as the main component.

[0021] Examples of the copolymerizable monomer in the copolyester include a dicarboxylic acid other than terephthalic acid, a diol other than 1,4-butanediol, an oxycarboxylic acid, or a lactone. The copolymerizable monomer may be used alone or in combination of two or more. Among them, the copolymerizable monomer is preferably 30 mol% or less based on the total monomers.

[0022] Examples of dicarboxylic acids other than terephthalic acid include aliphatic dicarboxylic acids (e.g., glutaric acid, adipic acid, pimelic acid, suberic acid, azelaic acid, sebacic acid, undecanedicarboxylic acid, dodecanedicarboxylic acid, and hexadecanedicarboxylic acid), alicyclic dicarboxylic acids (e.g., hexahydrophthalic acid, hexahydroisophthalic acid, and hexahydroterephthalic acid), and aromatic dicarboxylic acids (e.g., C8-16 dicarboxylic acids such as phthalic acid, isophthalic acid, 2,6-naphthalenedicarboxylic acid, 4,4'-diphenyldicarboxylic acid, 4,4'-diphenyletherdicarboxylic acid, 4,4'-diphenylmethanedicarboxylic acid, and 4,4'-diphenylketonedicarboxylic acid). In addition, polyvalent carboxylic acids such as trimellitic acid and pyromellitic acid may be used in combination, if necessary.

[0023] Examples of diols other than 1,4-butanediol include aliphatic alkylene glycols (e.g., C2-12 alkanediols such as ethylene glycol, propylene glycol, pentanediol, neopentyl glycol, hexanediol, heptanediol, octanediol, nonanediol, or decanediol, preferably C2-10 alkanediol), polyoxyalkylene glycols (e.g., glycols having an oxyalkylene unit such as diethylene glycol, dipropylene glycol, ditetramethylene glycol, triethylene glycol, tripropylene glycol, polyethylene glycol, polypropylene glycol, and polytetramethylene glycol), aromatic diols (e.g., C6-C14 aromatic diols such as hydroquinone, resorcinol, and naphthalenediol, biphenol, bisphenols, and xylylene glycol). Also, glycerol, trimethylolpropane, trimethylolethane, or pentaerythritol may be mixed and used as necessary.

[0024] The hydroxycarboxylic acid includes, for example, hydroxybenzoic acid, hydroxynaphthoic acid, hydroxyphenylbutyric acid, glycolic acid, hydroxycaproic acid, and the like, and derivatives thereof.

[0025] Examples of lactones include lactones having 3 to 12 carbon atoms, such as propiolactone, butyrolactone, valerolactone, and caprolactone.

[0026] From the viewpoint of achieving both moldability and laser transmittance, the polybutylene terephthalate resin (A) preferably has an intrinsic viscosity measured at 25° C. using an o-chlorophenol solvent in the range of 0.36 to 3.0 dl / g, more preferably in the range of 0.42 to 2.0 dl / g. In addition, two or more polybutylene terephthalate resins having different intrinsic viscosities may be contained, and the intrinsic viscosities of these resins are preferably within the above range.

[0027] From the viewpoints of compatibility with the amorphous resin (B) and increasing the laser transmittance, the polybutylene terephthalate resin (A) preferably has a carboxyl group content of 50 mol / ton or less. Here, the carboxyl content of the polybutylene terephthalate resin (A) can be determined by dissolving the resin in an o-cresol / chloroform solvent and then titrating the resin with ethanolic potassium hydroxide.

[0028] (A) Polybutylene terephthalate resin can be produced by polymerizing terephthalic acid or its ester-forming derivative, 1,4-butanediol, and optionally a copolymerizable monomer through a conventional method (e.g., ester exchange, direct esterification).

[0029] (B) Amorphous resin Examples of the amorphous resin (B) in the polyester resin composition of the present invention include styrene homopolymer / copolymer, aromatic polyethers such as polyphenylene ether and polyetherimide, polycarbonate, polyarylate, polysulfone, polyethersulfone, polyimide, and amorphous polyesters containing cyclohexanedimethylene terephthalate units.

[0030] Styrene homopolymers / copolymers include polystyrene, polychlorostyrene, poly-α-methylstyrene, styrene / chlorostyrene copolymers, styrene / propylene copolymers, styrene / acrylonitrile copolymers, styrene / butadiene copolymers, styrene / vinyl chloride copolymers, styrene / vinyl acetate copolymers, styrene / maleic acid copolymers, styrene / acrylic acid copolymers (e.g., styrene / methyl acrylate copolymers, styrene / ethyl acrylate copolymers, or styrene / butyl acrylate copolymers, styrene / octyl acrylate copolymers, styrene / phenyl acrylate copolymers), styrene / methacrylate copolymers (e.g., styrene / methyl methacrylate copolymers, styrene / ethyl methacrylate copolymers, styrene / butyl methacrylate copolymers, or styrene / phenyl methacrylate copolymers), styrene / α-chloromethacrylate copolymers, or styrene / acrylonitrile / acrylate copolymers.

[0031] Here, the polycarbonate is produced using one or more dihydroxy compounds selected from 2,2'-bis(4-hydroxyphenyl)propane (bisphenol A), 4,4'-dihydroxydiphenylalkane, 4,4'-dihydroxydiphenylsulfone, 4,4'-dihydroxydiphenylether, 2,2'-bis(3,5-dimethyl-4-hydroxyphenyl)propane, and 1,1'-bis(4-hydroxyphenyl)cyclohexane as the main raw material. Among these, polycarbonate produced using 2,2'-bis(4-hydroxyphenyl)propane (bisphenol A) as the main raw material is preferred.

[0032] In addition, other dihydroxy compounds than bisphenol A, such as 4,4'-dihydroxydiphenylalkanes, 4,4'-dihydroxydiphenyl sulfones, and 4,4'-dihydroxydiphenyl ethers, can also be used simultaneously with bisphenol A. The amount of other dihydroxy compounds used is preferably 10 mol % or less based on the total amount of dihydroxy compounds.

[0033] The degree of polymerization of these polycarbonates is not particularly limited, and from the viewpoint of improving the compatibility between the (B) polycarbonate and the (A) polybutylene terephthalate and improving moldability, the viscosity average molecular weight (Mv) of the (B) polycarbonate resin is preferably 10,000 to 50,000, more preferably 15,000 or more, and even more preferably 18,000 or more. On the other hand, it is more preferably 40,000 or less, and even more preferably 35,000 or less.

[0034] Here, the viscosity average molecular weight (Mv) is calculated by using dichloromethane as a solvent, measuring the intrinsic viscosity [η] (unit: dl / g) at 20°C using an Ubbelohde viscometer, and then calculating the viscosity using the Schnell viscosity formula, i.e., [η] = 1.23 × 10 -4 ×(Mv) 0.83 Here, the intrinsic viscosity [η] is a value calculated by measuring the specific viscosity [ηsp] at each solution concentration [c] (g / dl) and using the following formula: [η] = lim ηsp / c(c→0).

[0035] The amorphous polyester containing cyclohexanedimethylene terephthalate units refers to a polyester obtained by polymerizing a dicarboxylic acid mainly composed of terephthalic acid, 1,4-cyclohexanedimethanol, and other diols. Examples of other diols include aliphatic alkylene glycols (e.g., C2-12 alkanediols such as ethylene glycol, propylene glycol, butanediol, pentanediol, neopentyl glycol, hexanediol, heptanediol, octanediol, nonanediol, and decanediol, preferably C2-10 alkanediols), polyoxyalkylene glycols (e.g., diethylene glycol, dipropylene glycol, ditetramethylene glycol, triethylene glycol, tripropylene glycol, polyethylene glycol, polypropylene glycol, and polytetramethylene glycol), and the like. glycols having oxyalkylene units), alicyclic diols (e.g., 1,2-cyclohexanediol, 1,3-cyclohexanediol, 1,4-cyclohexanediol, spiroglycol, 1,3-cyclobutanediol, 1,3-cyclohexanediol, 1,4-cyclohexanediol, spiroglycol, 2,2,4,4-tetramethyl-1,3-cyclobutanediol, pentacyclopentadecanedimethanol), aromatic diols (e.g., C6-C14 aromatic diols such as hydroquinone, resorcinol, and naphthalenediol, biphenol, bisphenols, and xylylene glycol).

[0036] Here, the molar ratio [(I) / (II)] of the other diol unit (I) to the 1,4-cyclohexanedimethanol unit (II) is 1 / 99 to 99 / 1. From the viewpoint of improving compatibility with the (A) polybutylene terephthalate resin, [(I) / (II)] is preferably smaller than 80 / 20. More preferably, it is smaller than 75 / 25, and even more preferably, it is smaller than 50 / 50. On the other hand, it is preferably larger than 25 / 75, and even more preferably, it is larger than 30 / 70.

[0037] In consideration of compatibility with the (A) polybutylene terephthalate resin, the (B) amorphous resin is preferably at least one selected from polycarbonate, amorphous polyester containing cyclohexanedimethylene terephthalate, and styrene-acrylonitrile copolymer.

[0038] In the present invention, the content of the (B) amorphous resin is 15 to 100 parts by weight per 100 parts by weight of the (A) polybutylene terephthalate resin. By setting it in this range, it is possible to improve the laser transmittance and moldability. It is more preferably 20 parts by weight or more, and even more preferably 30 parts by weight or more. On the other hand, it is preferably 90 parts by weight or less, and even more preferably 80 parts by weight or less.

[0039] (C) Epoxy resin The polyester resin composition of the present invention contains at least one epoxy resin selected from the group consisting of trisphenolmethane type, tetrakisphenolethane type, novolac type, and naphthalene type. In consideration of improving the compatibility between the polybutylene terephthalate resin (A) and the amorphous resin (B), it is preferable that the epoxy resin (C) has a glycidyl ether structure or a glycidyl ester structure.

[0040] In the present invention, the novolac type epoxy resin may be, for example, a glycidyl ether structure-containing novolac type epoxy resin represented by the following structural formula (1).

[0041] [ka]

[0042] In the above general formula (1), X represents a divalent group represented by an alkyl group, an aryl group, an aralkyl group, or an alicyclic hydrocarbon group having 1 to 8 carbon atoms, and may contain multiple Xs. 1 , and R 2 may be the same or different, and each independently represents a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an alkyl ether group having 1 to 8 carbon atoms.3 is either a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an aryl group having 6 to 10 carbon atoms. In the above general formula (1), n ​​is a value greater than 0 and equal to or less than 20. a is an integer of 0 to 4, and b is an integer of 0 to 3.

[0043] Among these, from the viewpoints of high reactivity with the terminal carboxyl group of the polybutylene terephthalate resin (A) and low volatility, it is preferable that the epoxy resin (C) is a solid at room temperature (25° C.) Therefore, the novolac epoxy resin containing the glycidyl ether structure represented by the above structural formula (1) has the following structure.

[0044] [ka]

[0045] (In the formula, X represents a divalent group represented by formula (2) or formula (3). In the formulas (1) and (3), R 1 , R 2 , R 4 and R 5 may be the same or different, and each independently represents an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an alkyl ether group having 1 to 8 carbon atoms. 3 is either a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an aryl group having 6 to 10 carbon atoms. In the above general formula (1), n ​​represents a value greater than 0 and equal to or less than 10. In the above general formulas (1) and (3), a, c, and d each independently represent an integer of 0 to 4, and b represents an integer of 0 to 3.

[0046] In addition, the triphenol-based methane type has a structure represented by the following structural formula 5, the tetraphenol-based ethane type has a structure represented by the following structural formula 6, and the naphthalene-based epoxy resin has a structure represented by the following structural formulas 7 and 8.

[0047] [ka]

[0048] The epoxy value of the epoxy compound is preferably 100 to 1000 g / eq. By setting it in this range, gas generation during melt processing can be suppressed and the compound can react efficiently with the terminal carboxyl group of the polybutylene terephthalate resin (A). The epoxy value is more preferably 200 g / eq or more. On the other hand, the epoxy value is more preferably 500 g / eq or less, and even more preferably 400 g / eq or less.

[0049] In the present invention, the content of the epoxy resin (C) is 0.010 parts by weight or more and 5.0 parts by weight or less with respect to 100 parts by weight of the polybutylene terephthalate resin (A). By making it 0.010 parts by weight or more, the compatibility between the polybutylene terephthalate resin (A) and the amorphous resin (B) can be improved, and the transmittance can be improved. In addition, by making the epoxy resin (C) 5.0 parts by weight or less, the dispersibility of the epoxy resin (C) in the polyester resin composition can be improved, and the transmittance can be improved. More preferably, it is 0.050 parts by weight or more, even more preferably, it is 0.10 parts by weight or more, and most preferably, it is 0.40 parts by weight or more. On the other hand, it is preferably 3.0 parts by weight or less, and even more preferably, it is 1.5 parts by weight or less.

[0050] (D) Filler The polyester resin composition of the present invention may further contain a filler (D). As the filler (D), a resin filler used in the prior art may be used. For example, glass fiber, carbon fiber, potassium titanate whisker, zinc oxide whisker, aluminum borate whisker, aramid fiber, alumina fiber, silicon carbide fiber, ceramic fiber, asbestos fiber, gypsum fiber, metal fiber, glass flake, wollastonite, zeolite, sericite, kaolin, mica, talc, clay, pyrophyllite, bentonite, montmorillonite, hectorite, synthetic mica, asbestos, graphite, aluminosilicate, alumina, silica, magnesium oxide, zirconium oxide, titanium oxide, iron oxide, calcium carbonate, magnesium carbonate, dolomite, calcium sulfate, barium sulfate, magnesium hydroxide, calcium hydroxide, aluminum hydroxide, glass beads, hollow glass beads, ceramic beads, boron nitride, silicon carbide, or wollastonite may be mentioned. The filler may be a hollow filler, and two or more of these fillers may be used in combination. The average particle size of the filler is not particularly limited, but is preferably 0.001 to 20 μm in order to improve the appearance of the polyester resin composition.

[0051] In particular, in consideration of low molding shrinkage and high fluidity, in order to obtain a polyester resin composition with excellent performance, it is preferable that the filler is at least one of glass fiber and carbon fiber. The glass fiber is not particularly limited, and may be glass fiber used in the prior art. The glass fiber may be a fiber in a shape such as chopped strands of a certain length, coarse sand, or crushed fiber. In general, it is preferable to use glass fiber having an average diameter of 5 to 15 μm. When using chopped strands, the length is not particularly limited, but it is preferable to use standard 3 mm long fibers suitable for extrusion kneading. In addition, in the present invention, the cross-sectional shape of the fibrous filler is not particularly limited, and one or more of circular or flat fibers may be used in combination.

[0052] Considering the balance between the rigidity and toughness of the polyester resin composition of the present invention, the content of the filler (D) is preferably 1-150 parts by weight, more preferably 10 parts by weight or more, and even more preferably 30 parts by weight or more, relative to 100 parts by weight of the polybutylene terephthalate resin (A). On the other hand, it is more preferably 100 parts by weight or less, and even more preferably 80 parts by weight or less.

[0053] (E) Esterification inhibitor The polyester resin composition of the present invention may further contain an (E) transesterification inhibitor. The (E) transesterification inhibitor may be any compound that deactivates the transesterification catalyst contained in the (A) polybutylene terephthalate resin, and is not particularly limited. Phosphite-based compounds and phosphate-based compounds are preferably used.

[0054] The phosphite compounds are preferably triphenyl phosphite, trisnonylphenyl phosphite, tricresyl phosphite, trimethyl phosphite, triethyl phosphite, tris(2-ethylhexyl) phosphite, tridecyl phosphite, trilauryl phosphite, tris(tridecyl) phosphite, trioleyl phosphite, diphenyl mono(2-ethylhexyl) phosphite, diphenyl monodecyl phosphite, diphenyl mono(tridecyl) phosphite, monophenyl didecyl phosphite, trilauric acid ... aryl trithiophosphite, diethyl hydrogen phosphite, bis(2-ethylhexyl) hydrogen phosphite, dilauryl hydrogen phosphite, dioleyl hydrogen phosphite, diphenyl hydrogen phosphite, tetraphenyl dipropylene glycol diphosphite, tetra(C12-C15 alkyl)-4,4'-isopropylidene diphenyl diphosphite, 4,4'-butylidene-bis(3-methyl-6-tert-butylphenyl)tetratridecyl diphosphite, bis(decyl)pentaerythritol di Phosphite, bis(tridecyl)pentaerythritol diphosphite, tristearyl phosphite, distearyl pentaerythritol diphosphite, tris(2,4-di-tert-butylphenyl)phosphite, hydrogenated bisphenol A phenol phosphite polymer, tetraphenyltetra(tridecyl)pentaerythritol tetraphosphite, tetra(tridecyl)4,4'-isopropylidene diphenyl diphosphite, bis(nonylphenyl)pentaerythritol diphosphite, dilauryl pentaerythritol diphos phosphite, tris(4-tert-butylphenyl)phosphite, tris(2,4-di-tert-butylphenyl)phosphite, hydrogenated bisphenol A pentaerythritol phosphite polymer, bis(2,4-di-tert-butylphenyl)pentaerythritol diphosphite, bis(2,6-di-tert-butyl-4-methylphenyl)pentaerythritol diphosphite, bis(2-tert-butylphenyl)phenyl phosphite, bis(2,4,6-tri-t-butylphenyl)pentaerythritol diphosphite, 2,Examples of the compounds include one or more of 2'-methylenebis(4,6-di-tert-butylphenyl)-2-ethylhexyl phosphite, 2,2'-methylenebis(4,6-di-tert-butylphenyl)octyl phosphite, bis(2,4-dicumylphenyl)pentaerythritol diphosphite, and tetrakis(2,4-di-t-butylphenyl)-4,4'-biphenylene diphosphite.

[0055] In addition, preferred examples of the phosphate-based compound include the compounds represented by the following general formula (4).

[0056] [ka]

[0057] (In formula (4), R 6 is an alkyl group having 1 to 30 carbon atoms, and m is 1 or 2.

[0058] In addition, methyl acid phosphate, dimethyl acid phosphate, ethyl acid phosphate, diethyl acid phosphate, isopropyl acid phosphate, diisopropyl acid phosphate, butyl acid phosphate, dibutyl acid phosphate, butoxyethyl acid phosphate, dibutoxyethyl acid phosphate, 2-ethylhexyl acid phosphate, di-2-ethylhexyl acid phosphate, octyl acid phosphate, dioctyl acid phosphate, isodecyl acid phosphate, Preferred are phosphate compounds such as stearyl acid phosphate, diisodecyl acid phosphate, isotridecyl acid phosphate, diisotridecyl acid phosphate, lauryl acid phosphate, dilauryl acid phosphate, stearyl acid phosphate, distearyl acid phosphate, tetracosyl acid phosphate, ditetracosyl acid phosphate, oleyl acid phosphate, dioleyl acid phosphate, phenyl acid phosphate, and diphenyl acid phosphate.Furthermore, preferred as the phosphate compound is stearyl acid phosphate or distearyl acid phosphate.These phosphate compounds can be used alone or in combination of two or more.Furthermore, the above phosphate compounds can be used as metal salts formed with zinc or aluminum.

[0059] Regarding the deactivation of the catalyst for the transesterification reaction, the use of a phosphate-based compound results in a faster deactivation rate than the use of a phosphite-based compound, and therefore the use of a phosphate-based compound is preferred.

[0060] If the (E) transesterification inhibitor is added in excess, it may decompose the (A) polybutylene terephthalate resin, so the content of the (E) transesterification inhibitor is preferably 0.025 to 0.5 parts by weight, more preferably 0.03 parts by weight or more, and even more preferably 0.1 parts by weight or more, relative to 100 parts by weight of the (A) polybutylene terephthalate resin, while being more preferably 0.3 parts by weight or less, and even more preferably 0.25 parts by weight or less.

[0061] (F) Nucleating agent As the crystal nucleating agent (F) used as a crystallization promoter in the polyester resin composition of the present invention, any of those commonly used as crystal nucleating agents for polymers are satisfactory, and any one or more of inorganic crystal nucleating agents and organic crystal nucleating agents can be used.

[0062] Examples of the inorganic crystal nucleating agent include silica, aluminum oxide, zirconium oxide, titanium oxide, wollastonite, kaolin, talc, mica, and silicon carbide.

[0063] Examples of the organic crystal nucleating agent include aliphatic carboxylic acid amides and sorbitol derivatives. Examples of the aliphatic carboxylic acid amide include aliphatic monocarboxylic acid amides such as lauric acid amide, palmitic acid amide, oleic acid amide, stearic acid amide, erucic acid amide, behenic acid amide, ricinoleic acid amide, and hydroxystearic acid amide; N-substituted aliphatic monocarboxylic acid amides such as N-oleyl palmitic acid amide, N-oleyl oleic acid amide, N-oleyl stearic acid amide, N-stearyl oleic acid amide, N-stearyl stearic acid amide, N-stearyl erucic acid amide, N-methylol stearic acid amide, and N-methylol behenic acid amide; methylene bisstearic acid amide, ethylene bislauric acid amide, ethylene bisdecanoic acid amide, ethylene bisoleic acid amide, ethylene bisstearic acid amide, ethylene biserucic acid amide, ethylene bisbehenic acid amide, ethylene bisisostearic acid amide, ethylene bishydroxystearic acid amide, butylene bisstearic acid amide, hexamethylene bisoleic acid amide, and the like. aliphatic biscarboxylic acid amides such as hexamethylene bisstearic acid amide, hexamethylene bisbehenic acid amide, hexamethylene bishydroxystearic acid amide, m-xylylene bisstearic acid amide, or m-xylylene bis-12-hydroxystearic acid amide; N,N'-dioleyl sebacic acid amide, N,N'-dioleyl adipic acid amide, N,N-distearyl adipic acid amide, N,N'-distearyl sebacic acid amide, N,N'-distearyl isophthal ... Examples of the amide include N-substituted aliphatic carboxylic acid bisamides such as N,N'-distearyl terephthalic acid amide, and N-substituted ureas such as N-butyl-N'-stearyl urea, N-propyl-N'-stearyl urea, N-stearyl-N'-stearyl urea, N-phenyl-N'-stearyl urea, xylylene bisstearyl urea, toluylene bisstearyl urea, hexamethylene bisstearyl urea, diphenylmethane bisstearyl urea, and diphenylmethane bislauryl urea.

[0064] Examples of sorbitol derivatives include bisbenzylidene sorbitol, bis(p-methylbenzylidene) sorbitol, bis(p-ethylbenzylidene) sorbitol, bis(p-chlorobenzylidene) sorbitol, bis(p-brombenzylidene) sorbitol, and sorbitol derivatives obtained by chemically modifying the above sorbitol derivatives.

[0065] Considering the crystallization promoting effect of the polybutylene terephthalate resin (A), the nucleating agent (F) is preferably silica, aluminum oxide, zirconium oxide, titanium oxide, wollastonite, kaolin, talc, mica, silicon carbide, ethylene bislauric acid amide, or a sorbitol derivative. The content of the nucleating agent (F) is preferably 0.05 to 5 parts by weight relative to 100 parts by weight of the polybutylene terephthalate resin (A). By setting it within this range, the crystallization promoting effect can be maintained and the laser transmittance can be improved. The content of the nucleating agent (F) is more preferably 0.1 parts by weight or more. On the other hand, the content is more preferably 3 parts by weight or less, and even more preferably 2 parts by weight or less.

[0066] (G) Other additives The polyester resin composition of the present invention may further contain additives such as an antioxidant, a release agent, a flame retardant, or a masterbatch, in addition to the components (A) to (F).

[0067] The antioxidant is preferably at least one of a phenol-based antioxidant and a sulfur-based antioxidant. In consideration of heat resistance and thermal stability, it is preferable to use a phenol-based antioxidant and a sulfur-based antioxidant in combination.

[0068] Here, examples of the phenol-based antioxidant include 2,4-dimethyl-6-t-butylphenol, 2,6-di-t-butylphenol, 2,6-di-t-butyl-p-cresol, 2,6-di-t-butyl-4-ethylphenol, 4,4'-butylidenebis(6-t-butyl-3-methylphenol), 2,2'-methylene-bis(4-methyl-6-t-butylphenol), 2,2'-methylene-bis(4-ethyl-6-t-butylphenol), octadecyl-3-(3',5'-di-t-butyl-4'-hydroxyphenyl)propionate, and the like. Pionate, pentaerythritol tetrakis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], 1,1,3-tris(2-methyl-4-hydroxy-5-di-t-butylphenyl)butane, tris(3,5-di-t-butyl-4-hydroxybenzyl)isocyanurate, triethylene glycol-bis[3-(3-t-butyl-4-hydroxy-5-methylphenyl)propionate], 1,6-hexanediol bis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate] ], 2,4-bis-(n-octylthio)-6-(4-hydroxy-3,5-di-t-butylanilino)-1,3,5-triazine, 2,2-thio-diethylenebis[3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate], N,N'-hexamethylenebis(3,5-di-t-butyl-4-hydroxyhydrocinnamide), 3,5-di-t-butyl-4-hydroxybenzylphospho ester, 1,3,5-trimethyl-2,4,6-tris(3,5-di-t-butyl-4-hydroxybenzyl)benzene, tris(3,5-di-t-butyl-4-hydroxybenzyl)isocyanurate, 2,4-bis[(octylthio)methyl]-o-cresol, or isooctyl-3-(3,5-di-t-butyl-4-hydroxyphenyl)propionate.

[0069] Examples of the sulfur-based antioxidant include dilauryl thiodipropionate, dimyristyl thiodipropionate, distearyl thiodipropionate, ditridecyl thiodipropionate, pentaerythritol (3-lauryl thiopropionate), and 2-mercaptobenzimidazole.

[0070] These antioxidants may be used alone, or two or more of them may be used in combination since a synergistic effect may be obtained by combining two or more of them.

[0071] The content of the antioxidant is preferably 0.01 to 3 parts by weight per 100 parts by weight of the total of (A) polybutylene terephthalate resin and (B) amorphous resin. By setting it within this range, it is possible to maintain the antioxidant effect and suppress gas generation during melt processing. It is more preferably 0.05 parts by weight or more, and even more preferably 0.1 parts by weight or more. On the other hand, it is more preferably 2 parts by weight or less, and even more preferably 1 part by weight or less.

[0072] The release agent is not particularly limited, and any release agent used for ordinary thermoplastic resins can be used. Specific examples include fatty acids, fatty acid metal salts, hydroxy fatty acids, fatty acid esters, partially saponified aliphatic esters, paraffins, low molecular weight polyolefins, fatty acid amides, alkylene bis fatty acid amides, aliphatic ketones, fatty acid lower alcohol esters, fatty acid polyol esters, fatty acid polyglycol esters, and modified polysiloxanes.

[0073] The fatty acid is preferably a fatty acid having 6 to 40 carbon atoms, and specific examples thereof include oleic acid, lauric acid, stearic acid, hydroxystearic acid, behenic acid, arachidonic acid, linoleic acid, linolenic acid, ricinoleic acid, palmitic acid, stearic acid, montanic acid, and mixtures thereof.

[0074] The fatty acid metal salt is preferably an alkali metal salt or alkaline earth metal salt of a fatty acid having 6 to 40 carbon atoms, and specific examples thereof include calcium stearate, sodium montanate, and calcium montanate.

[0075] Hydroxy fatty acids include 1,2-hydroxy fatty acids.

[0076] Examples of the fatty acid ester include stearic acid ester, oleic acid ester, linoleic acid ester, linolenic acid ester, adipic acid ester, behenic acid ester, arachidonic acid ester, montanic acid ester, and isostearic acid or polymeric acid ester.

[0077] Examples of the partially saponified aliphatic esters include partially saponified montanic acid esters.

[0078] The paraffin preferably has 18 or more carbon atoms, and examples thereof include liquid paraffin, natural paraffin, microcrystalline wax, and petrolatum.

[0079] The low molecular weight polyolefin preferably has a weight average molecular weight of 5000 or less, and specific examples thereof include polyethylene wax, maleic acid modified polyethylene wax, oxidized polyethylene wax, chlorinated polyethylene wax, and polypropylene wax.

[0080] The fatty acid amide is preferably one having 6 or more carbon atoms, and specific examples thereof include oleic acid amide, erucic acid amide, and behenic acid amide.

[0081] The alkylene bis(fatty acid amide) is preferably one having 6 or more carbon atoms, and specific examples thereof include methylene bis(stearamide), ethylene bis(stearamide), and N,N-bis(2-hydroxyethyl)stearamide.

[0082] Examples of the aliphatic ketone include higher aliphatic ketones.

[0083] The fatty acid lower alcohol ester is preferably one having 6 or more carbon atoms, and specific examples thereof include ethyl stearate, butyl stearate, ethyl behenate, rice wax, and the like.

[0084] Examples of the fatty acid polyol ester include glycerin monostearate, pentaerythritol monostearate, pentaerythritol tetrastearate, pentaerythritol adipate stearate, dipentaerythritol adipate stearate, and sorbitan monobehenate.

[0085] Examples of the fatty acid polyglycol ester include polyethylene glycol fatty acid ester and polypropylene glycol fatty acid ester.

[0086] Examples of modified polysiloxanes include methylstyryl-modified polysiloxanes, polyether-modified polysiloxanes, higher fatty acid alkoxy-modified polysiloxanes, higher fatty acid-containing polysiloxanes, higher fatty acid ester-modified polysiloxanes, methacrylic acid-modified polysiloxanes, and fluorine-modified polysiloxanes.

[0087] Examples of the flame retardant include bromine-based flame retardants, such as decabromodiphenyl ether, octabromodiphenyl ether, tetrabromodiphenyl ether, tetrabromophthalic anhydride, hexabromocyclododecane, bis(2,4,6-tribromophenoxy)ethane, ethylene bis-tetrabromophthalimide, hexabromobenzene, 1,1-sulfonyl[3,5-dibromo-4]-(2,3-dibromopropoxy)]benzene, polydibromophenylene oxide, tetrabromobisphenol-S, tris(2,3-dibromopropyl)isocyanurate, tribromophenol, tribromophenyl allyl ether, tribromoneopentyl alcohol, brominated polystyrene, brominated polyethylene, tetrabromobisphenol A, tetrabromobisphenol A derivatives, and tetrabromobisphenol-A-epoxide oligomers. or brominated epoxy resins such as polymers or brominated phenol novolac epoxides, brominated epoxy resins such as tetrabromobisphenol-A-carbonate oligomers or polymers, tetrabromobisphenol-A-bis(2-hydroxydiethyl ether), tetrabromobisphenol-A-bis(2,3-dibromopropyl ether), tetrabromobisphenol-A-bis(allyl ether), tetrabromocyclooctane, ethylene bispentabromodiphenyl, tris(tribromoneopentyl)phosphate, poly(pentabromobenzyl polyacrylate), octabromotrimethylphenylindane, dibromoneopentyl glycol, pentabromobenzyl polyacrylate, dibromotrisyl glycidyl ether, or N,N'-ethylidene-bis-tetrabromobenzimide. In the present invention, the flame retardant may be a chlorine-based flame retardant, such as chlorinated paraffin, chlorinated polyethylene, perchlorocyclopentadecane, or tetrachlorophthalic anhydride.

[0088] The polyester resin composition of the present invention is cooled from a molten state to 20°C at a rate of 20°C / min under a nitrogen gas atmosphere using a differential scanning calorimeter, and then heated at a rate of 20°C / min. The endothermic peak temperature (melting point) that appears during the heating process is 210°C or higher and 221°C or lower. By controlling the endothermic peak temperature within this range, the compatibility of (A) polybutylene terephthalate resin and (B) amorphous resin is improved, the transmittance is increased, and a polyester resin composition with excellent heat resistance can be obtained. The endothermic peak temperature is preferably 220°C or lower, more preferably 219°C or lower. On the other hand, it is preferably 215°C or higher, more preferably 217°C or higher.

[0089] The polyester resin composition of the present invention can be produced by melt-kneading the main components (A), (B), and (C) and, if necessary, the components (E) and (F) in a known melt kneader such as a single-screw or twin-screw extruder, a Banbury mixer, a kneader, or a mixer.

[0090] The polyester resin composition of the present invention can be used to obtain a molded product by injection molding, extrusion molding or the like.

[0091] In the case of injection molding, the mold temperature is preferably 40° C. or more and 250° C. or less. From the viewpoint of solidification in the temperature range of not less than the glass transition temperature and not more than the melting point of (A) polyethylene terephthalate resin, in order to obtain high molding efficiency and good appearance of the molded product, the mold temperature is preferably in the range of not less than 60° C. and not more than 140° C.

[0092] The polyester resin composition of the present invention preferably has a transmittance of 48% or more when measured by a spectrophotometer at a wavelength of 940 nm in a molded article having a thickness of 1 mm obtained by molding at a molding temperature of 260°C and a mold temperature of 80°C. The molded article of the present invention has high laser transmittance and can be used as a laser welding transparent material. Here, the transmittance refers to a value measured by a spectrophotometer using an integrating sphere as a detector.

[0093] The thickness of the molded article is not particularly limited, but from the viewpoint of increasing the laser transmittance, the thickness of the part of the molded article through which the laser transmits is preferably 3 mm or less. EXAMPLES

[0094] The present invention will be described in the following examples, which are provided for the purpose of illustrating the present invention only and are not intended to limit the scope of the present invention. The raw materials and test equipment used in the following examples are as follows:

[0095] 1. Raw materials for polyester resin composition (A) Polybutylene terephthalate resin Polybutylene terephthalate resin (PBT): Toray Industries, Inc. Polybutylene terephthalate resin with intrinsic viscosity of 0.76 dl / g and carboxy end group concentration of 15 mol / ton (B) Amorphous resin Polycarbonate (PC): Mitsubishi Engineering Plastics Corporation S1000 Cyclohexanedimethylene terephthalate / ethylene terephthalate copolymer (PCTG): Eastman Eastar EB062 (C) Epoxy resin Epoxy resin 1: DIC Corporation HP-7200H (novolac type epoxy resin with aromatic glycidyl ether structure, epoxy value 280g / eq) Epoxy resin 2: DIC Corporation HP4700 (naphthalene type epoxy resin with aromatic glycidyl ether structure, epoxy value 160g / eq) Epoxy resin 3: Hexion Cardura E10P (Versatic acid glycidyl ester, epoxy value 244g / eq) Epoxy resin 4: Mitsubishi Chemical Corporation JER1009 (bisphenol A type epoxy resin, epoxy value 2950g / eq) (D) Filler Glass fiber: Nippon Electric Glass Co., Ltd. T187 (E) Esterification inhibitor Ester exchange inhibitor: ADEKA AX-71 (a mixture of distearyl acid phosphate and stearyl acid phosphate) (F) Nucleating agent Nucleating agent 1: Takehara Chemical Industry Co., Ltd. Hightron (talc) Nucleating agent 2: Guangzhou Ouying Chemical Co., Ltd. EBL (Ethylene bis lauryl amide)

[0096] 2. Performance test of polyester resin compositions obtained in the examples and comparative examples (1) Transmittance measurement Transmittance evaluation was performed using a Shimadzu ultraviolet / near infrared spectrophotometer (UV-3100). An integrating sphere was used as a detector. Laser transmittance was measured by measuring the light transmittance of a 1 mm thick sample in the near infrared 940 nm wavelength region. The ratio of transmitted light to incident light is shown in the table as a percentage. Transmittance in the near infrared 940 nm wavelength region was measured, and the transmittance was measured every 10 nm to determine the maximum and minimum transmittance in the near infrared 940 nm wavelength region. Measurements were performed five times, and the average of the upper and lower limits was calculated.

[0097] (2) Melting point (Tm) measurement Using a differential scanning calorimeter (DSC250) manufactured by TA Instruments, 5 to 7 mg of the thermoplastic resin composition obtained in each Example and Comparative Example was accurately weighed, and the temperature was raised to a temperature 30°C higher than the temperature of the endothermic peak (T0) that appears when the temperature rise is started from 20°C at a heating rate of 20°C / min under a nitrogen atmosphere, and the temperature was held at this temperature for 2 min, and then the temperature was lowered to 20°C at a heating rate of 20°C / min, held at 20°C for 2 min, and the temperature was raised again to a temperature 30°C higher than T0 at a heating rate of 20°C / min to determine the melting point Tm. Tm is the temperature corresponding to the endothermic peak during the second heating process.

[0098] Examples 1-7 The raw materials are shown in Table 1. The materials were melt-kneaded using a TEX30α twin-screw extruder (L / D=45.5) manufactured by Japan Steel Works. The extruder has 13 heating zones, two feeders equipped with weighing devices, and a vacuum exhaust system. After mixing the raw materials other than the glass fiber, they were fed from the main feeder of the extruder, and the glass fiber was fed from the side feeder of the extruder. The temperature of the extruder was set to 100°C to 260°C, and a granular polyester resin composition was obtained through melt-kneading, cooling, and pelletization. The granular material was dried for 3 hours in an oven at 130°C, and then a permeability evaluation sample (mold size: length 80 mm, width 80 mm, thickness 1 mm) was injection molded using a NEX50 injection molding machine manufactured by Nissei Plastic Industrial Co., Ltd. under conditions of a molding temperature of 260°C and a mold temperature of 80°C. Measurements were performed using the above-mentioned transmittance and melting point measurement methods. The measurement results are shown in Table 1.

[0099] Comparative Example 1- 6、8- 10 The manufacturing method was the same as in Example 1, and the raw materials were as shown in Table 2. The results of tests performed according to the above-mentioned transmittance and melting point test methods are shown in Table 2.

[0100] [Table 1]

[0101] [Table 2]

[0102] A comparison of Examples 1-7 and Comparative Examples 1-4 reveals that when the specific components of the present invention, (A) polybutylene terephthalate resin, (B) amorphous resin, and (C) epoxy resin, are satisfied, and the melting point of the composition (under measurement conditions specified by DSC) is in the range of 210°C or higher and 221°C or lower, the transmittance of the resin composition (>48%) is much higher than that of a resin composition that does not simultaneously satisfy the above conditions.

[0103] Comparison of Example 1 with Comparative Examples 5 and 8 shows that when the content of the (C) specific epoxy resin is too high or too low, the transmittance of the polyester resin composition is poor.

[0104] From a comparison of Example 4, Comparative Example 9, and Comparative Example 10, the transmittance of the polyester resin composition to which the epoxy resin (HP-7200H0) was added is higher than that of the polyester resin compositions to which the epoxy resin (Cardura E10P) and the epoxy resin (JER1009) were added. It can be seen that in the present invention, high transmittance can be achieved by adding an epoxy resin having a specific structure.

[0106] Also, Example 3 and Example of 4 From the comparison, it is seen that the presence or absence of a nucleating agent and the type of nucleating agent affect the compatibility of (A) and (B) in the polyester resin composition and the transmittance.

Claims

1. A polyester resin composition obtained by blending at least the following (A) to (C): (A) 100 parts by weight of polybutylene terephthalate resin, (B) 15 to 100 parts by weight of at least one amorphous resin selected from polycarbonate and a copolymer of cyclohexanedimethylene terephthalate / ethylene terephthalate; (C) 0.010 to 5.0 parts by weight of a novolac-type epoxy resin having a glycidyl ether structure represented by the following general formula (1): 【Chemistry 1】 In the above general formula (1), X represents a divalent group represented by the above general formula (2) or (3). １ , R ２ , R ４ and R ５ may be the same or different, and each independently represents an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 10 carbon atoms, or an alkyl ether group having 1 to 8 carbon atoms. R ３ is either a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, or an aryl group having 6 to 10 carbon atoms. In the above general formula (1), n ​​represents a value greater than 0 and equal to or less than 10. In the above general formulas (1) and (3), a, c, and d each independently represent an integer of 0 to 4, and b represents an integer of 0 to 3. In addition, the polyester resin composition is cooled from a molten state to 20°C at a temperature drop rate of 20°C / min using a differential scanning calorimeter in a nitrogen gas atmosphere, and then heated at a temperature increase rate of 20°C / min, and the temperature of an endothermic peak that appears during the heating process is 210°C or higher and 221°C or lower.

2. 2. The polyester resin composition according to claim 1, wherein the content of the epoxy resin (C) is 0.05 to 3 parts by weight based on 100 parts by weight of the polybutylene terephthalate resin (A).

3. The polyester resin composition according to claim 1 , further comprising (D) a filler.

4. The polyester resin composition according to claim 3, wherein the filler (D) is at least one selected from the group consisting of glass fiber and carbon fiber.

5. 5. The polyester resin composition according to claim 4, wherein the content of the filler (D) is 1 to 150 parts by weight based on 100 parts by weight of the polybutylene terephthalate resin (A).

6. The polyester resin composition according to claim 1, further comprising (E) an ester exchange inhibitor.

7. The polyester resin composition according to claim 6, wherein the transesterification inhibitor (E) is represented by the following general formula (4): 【Chemistry 2】 In general formula (4), R ６ is an alkyl group having 1 to 30 carbon atoms, and m is 1 or 2.

8. 7. The polyester resin composition according to claim 6, wherein the content of the ester exchange inhibitor (E) is 0.025 to 0.5 parts by weight based on 100 parts by weight of the polybutylene terephthalate resin (A).

9. The polyester resin composition according to claim 1 , further comprising (F) a nucleating agent.

10. 10. The polyester resin composition according to claim 9, wherein the nucleating agent (F) is at least one selected from the group consisting of silica, aluminum oxide, zirconium oxide, titanium oxide, wollastonite, kaolin, talc, mica, silicon carbide, ethylene bislauryl amide, and sorbitol derivatives.

11. 10. The polyester resin composition according to claim 9, wherein the content of the nucleating agent (F) is 0.05 to 5 parts by weight based on 100 parts by weight of the polybutylene terephthalate resin (A).

12. 2. The polyester resin composition according to claim 1, wherein the polyester resin composition is molded at a molding temperature of 260°C and a mold temperature of 80°C, and the resulting molded piece having a thickness of 1 mm has a transmittance of 48% or more at a wavelength of 940 nm as measured by a spectrophotometer.

13. A molded article produced from the polyester resin composition according to any one of claims 1 to 12.

14. The molded article according to claim 13, which is a laser welding transparent material.

15. 14. The molded article according to claim 13, wherein the thickness of the laser-transmitting portion of the molded article is 3 mm or less.

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