Semiconductor Device

Abstract

The present invention provides a semiconductor device which is provided with a semiconductor substrate that comprises an active part and a plurality of gate trench parts that are formed in the upper surface of the semiconductor substrate in the active part, while extending in the extension direction. This semiconductor device is additionally provided with: a gate wiring line which is arranged between the active part and an edge of the semiconductor substrate; and a plurality of gate polysilicons which are arranged at a distance from each other along the edge so as to respectively connect the plurality of gate trench parts to the gate wiring line.

Description

[Technical field]

[0001] The present invention relates to a semiconductor device. [Background technology]

[0002] It has been known that holes generated in edge termination regions of semiconductor devices such as IGBTs (Insulated Gate Bipolar Transistors) can cause dielectric breakdown (see, for example, Patent Document 1). A configuration is also known in which a gate polysilicon layer is provided as a gate runner (see, for example, Patent Document 2). A technique for increasing the reliability of gate wiring is also known (see, for example, Patent Document 3). Patent Document 1: JP 2018-206873 A Patent Document 2: International Publication No. 2016-098409 Patent Document 3: JP 2017-135245 A Problem to be Solved

[0003] In semiconductor devices such as IGBT devices, it is preferable to suppress breakdown during turn-off.

[0004] In order to solve the above problems, a first aspect of the present invention provides a semiconductor device including a semiconductor substrate. The semiconductor substrate may have an active portion. The semiconductor substrate may have a plurality of gate trench portions. The gate trench portions may be provided in the active portion on the upper surface of the semiconductor substrate. The gate trench portions may extend along the extension direction. The semiconductor device may include a gate wiring. The gate wiring may be provided between the active portion and an edge of the semiconductor substrate. The semiconductor device may include a plurality of gate polysilicon portions. The gate polysilicon portions may be arranged apart from each other along the edge. The gate polysilicon may connect each of the plurality of gate trench portions to the gate wiring.

[0005] At least one of the plurality of gate trench portions may be connected to one of the plurality of gate polysilicon portions.

[0006] At least one gate trench portion may have two straight line portions extending along the extension direction. At least one gate trench portion may have an end portion connecting the two straight line portions. A width of the gate trench portion including the two straight line portions in an arrangement direction perpendicular to the extension direction may be larger than a width of the gate polysilicon connected to the gate trench portion in the arrangement direction.

[0007] At least one gate trench portion may have one straight portion extending along the extension direction. A width of the gate trench portion in an arrangement direction perpendicular to the extension direction may be larger than a width of the gate polysilicon connected to the gate trench portion in the arrangement direction.

[0008] The gate polysilicon may be provided discretely along the direction in which the gate wiring extends.

[0009] The semiconductor substrate may have two first end sides perpendicular to the extension direction. The semiconductor substrate may have two second end sides parallel to the extension direction. The gate wiring may have a first wiring provided between the first end side and the active portion. The gate wiring may have a second wiring provided between the second end side and the active portion. The gate polysilicon may be provided below the first wiring. The gate polysilicon may not be provided below the second wiring.

[0010] The gate polysilicon may have a longitudinal direction in a direction from the gate wiring toward the gate trench portion. The gate polysilicon may have a longitudinal direction in an extension direction.

[0011] At least a part of the gate trench may be provided extending to below the gate wiring, and the gate polysilicon may be provided between the gate trench and the gate wiring in the depth direction.

[0012] The longitudinal directions of at least two of the gate polysilicon layers may form different angles with the extension direction.

[0013] The gate wiring may have a curved portion connecting the first wiring and the second wiring. A longitudinal direction of the gate polysilicon connecting to the first wiring may be different from a longitudinal direction of the gate polysilicon connecting to the curved portion.

[0014] At least a portion of the gate trench may be provided extending below the curved portion of the gate wiring. At least one gate polysilicon may be provided between the gate trench and the curved portion in the depth direction. At least one gate polysilicon may have a longitudinal direction in a direction from the first wiring of the gate wiring toward the gate trench.

[0015] The above summary of the invention does not list all of the features of the present invention. Also, subcombinations of these features may also be inventions. [Brief description of the drawings]

[0016] [Figure 1] FIG. 1 is a top view showing an example of a semiconductor device 100. [Diagram 2] FIG. 2 is a diagram showing a comparative example of region D in FIG. [Diagram 3] FIG. 3 is a diagram showing an example of the gg cross section in FIG. 2. [Figure 4] FIG. 3 is a diagram showing an example of a-a cross section in FIG. 2. [Diagram 5] FIG. 3 is a diagram showing an example of a bb cross section in FIG. 2. [Figure 6] FIG. 3 is a diagram showing an example of a cc cross section in FIG. 2. [Figure 7] FIG. 2 is a diagram showing an example of an embodiment of an area D in FIG. [Figure 8] FIG. 8 is a diagram showing an example of a cross section dd in FIG. [Figure 9] FIG. 8 is a diagram showing an example of an ee cross section in FIG. [Figure 10] FIG. 8 is a diagram showing an example of the ff cross section in FIG. [Figure 11] 1. FIG. 4 is a diagram showing another example of the embodiment of the region D in FIG. [Figure 12] FIG. 12 is a diagram showing an example of the hh cross section in FIG. [Figure 13] 1. FIG. 4 is a diagram showing another example of the embodiment of the region D in FIG. [Figure 14] FIG. 2 is a diagram showing a comparative example of region E in FIG. [Figure 15] FIG. 2 is a diagram showing an example of an embodiment of an area E in FIG. [Figure 16] 1. FIG. 4 is a diagram showing another example of the embodiment of the region E in FIG. [Figure 17] 1. FIG. 4 is a diagram showing another example of the embodiment of the region E in FIG. [Figure 18] FIG. 2 illustrates an example of an edge termination structure 90. [Figure 19] FIG. 2 is a diagram showing an example of a cross section ii in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0017] The present invention will be described below through embodiments of the invention, but the following embodiments do not limit the scope of the invention according to the claims. Furthermore, not all of the combinations of features described in the embodiments are necessarily essential to the solution of the invention.

[0018] In this specification, one side in a direction parallel to the depth direction of a semiconductor substrate is referred to as "upper" and the other side as "lower." Of the two main surfaces of a substrate, layer, or other member, one surface is referred to as the upper surface and the other surface is referred to as the lower surface. The directions of "upper" and "lower" are not limited to the direction of gravity or the directions when the semiconductor device is mounted.

[0019] In this specification, technical matters may be explained using orthogonal coordinate axes of X-axis, Y-axis, and Z-axis. The orthogonal coordinate axes merely identify the relative positions of components, and do not limit a specific direction. For example, the Z-axis does not limit the height direction relative to the ground. Note that the +Z-axis direction and the -Z-axis direction are opposite directions. When the Z-axis direction is described without indicating positive or negative, it means a direction parallel to the +Z-axis and -Z-axis.

[0020] In this specification, the orthogonal axes parallel to the upper and lower surfaces of the semiconductor substrate are the X-axis and the Y-axis. The axis perpendicular to the upper and lower surfaces of the semiconductor substrate is the Z-axis. In this specification, the direction of the Z-axis may be referred to as the depth direction. In this specification, the direction parallel to the upper and lower surfaces of the semiconductor substrate, including the X-axis and the Y-axis, may be referred to as the horizontal direction.

[0021] The region from the center of the semiconductor substrate in the depth direction to the top surface of the semiconductor substrate may be referred to as the top surface side. Similarly, the region from the center of the semiconductor substrate in the depth direction to the bottom surface of the semiconductor substrate may be referred to as the bottom surface side.

[0022] In this specification, when the term "same" or "equal" is used, it may include cases where there is an error due to manufacturing variations, etc. The error is, for example, within 10%.

[0023] In this specification, the conductivity type of a doped region doped with impurities is described as P type or N type. In this specification, the impurity may particularly mean either an N type donor or a P type acceptor, and may be described as a dopant. In this specification, doping means introducing a donor or an acceptor into a semiconductor substrate to make it a semiconductor exhibiting an N type conductivity type or a semiconductor exhibiting a P type conductivity type.

[0024] In this specification, the doping concentration means the concentration of donors or acceptors in a thermal equilibrium state. In this specification, the net doping concentration means the net concentration obtained by adding up the donor concentration as the concentration of positive ions and the acceptor concentration as the concentration of negative ions, including the polarity of the charge. As an example, the donor concentration is N D , acceptor concentration N A Then, the net doping concentration at any position is N D -N A In this specification, the net doping concentration may be simply referred to as the doping concentration.

[0025] A donor has the function of supplying electrons to a semiconductor. An acceptor has the function of receiving electrons from a semiconductor. Donors and acceptors are not limited to impurities themselves. For example, a VOH defect, which is a combination of a vacancy (V), oxygen (O), and hydrogen (H) present in a semiconductor, functions as a donor that supplies electrons. In this specification, a VOH defect may be referred to as a hydrogen donor.

[0026] In this specification, when P+ type or N+ type is described, it means that the doping concentration is higher than that of P type or N type, and when P- type or N- type is described, it means that the doping concentration is lower than that of P type or N type. The unit system in this specification is the SI unit system unless otherwise specified. The unit of length may be expressed in cm, but various calculations may be performed after converting to meters (m).

[0027] In this specification, the chemical concentration refers to the atomic density of an impurity measured regardless of the state of electrical activation. The chemical concentration (atomic density) can be measured, for example, by secondary ion mass spectrometry (SIMS). The above-mentioned net doping concentration can be measured by voltage-capacitance measurement (CV). The carrier concentration measured by spreading resistance measurement (SR) may be the net doping concentration. The carrier concentration measured by CV or SR may be a value in a thermal equilibrium state. In addition, in an N-type region, since the donor concentration is sufficiently larger than the acceptor concentration, the carrier concentration in that region may be the donor concentration. Similarly, in a P-type region, the carrier concentration in that region may be the acceptor concentration. In this specification, the doping concentration in an N-type region may be referred to as the donor concentration, and the doping concentration in a P-type region may be referred to as the acceptor concentration.

[0028] In addition, when the concentration distribution of the donor, acceptor or net doping has a peak, the peak value may be taken as the concentration of the donor, acceptor or net doping in the region. In cases where the concentration of the donor, acceptor or net doping is almost uniform, the average value of the concentration of the donor, acceptor or net doping in the region may be taken as the concentration of the donor, acceptor or net doping. In this specification, the concentration per unit volume is expressed in atoms / cm. 3 , or / cm 3 This unit is used for donor or acceptor concentration or chemical concentration in a semiconductor substrate. The atom count notation may be omitted.

[0029] The carrier concentration measured by the SR method may be lower than the concentration of the donor or acceptor. In the range where the current flows when measuring the spreading resistance, the carrier mobility of the semiconductor substrate may be lower than the value in the crystalline state. The reduction in carrier mobility occurs when the carriers are scattered due to a disorder in the crystal structure caused by lattice defects, etc.

[0030] The concentration of the donor or acceptor calculated from the carrier concentration measured by the CV method or the SR method may be lower than the chemical concentration of the element indicating the donor or acceptor. As an example, the donor concentration of phosphorus or arsenic, which serves as a donor in a silicon semiconductor, or the acceptor concentration of boron, which serves as an acceptor, is about 99% of the chemical concentration. On the other hand, the donor concentration of hydrogen, which serves as a donor in a silicon semiconductor, is about 0.1% to 10% of the chemical concentration of hydrogen. Each concentration in this specification may be a value at room temperature. As an example of the value at room temperature, a value at 300 K (Kelvin) (about 26.9° C.) may be used.

[0031] Fig. 1 is a top view showing an example of a semiconductor device 100. Fig. 1 shows the positions of each component projected onto the top surface of a semiconductor substrate 10. Fig. 1 shows only some of the components of the semiconductor device 100, and some components are omitted.

[0032] The semiconductor device 100 includes a semiconductor substrate 10. The semiconductor substrate 10 is a substrate formed of a semiconductor material. As an example, the semiconductor substrate 10 is a silicon substrate, but the material of the semiconductor substrate 10 is not limited to silicon.

[0033] The semiconductor substrate 10 has a first end side 161 and a second end side 162 in a top view. When simply referred to as a top view in this specification, it means that the semiconductor substrate 10 is viewed from the top surface side. The semiconductor substrate 10 of this example has two pairs of first end sides 161 that face each other in a top view. The semiconductor substrate 10 of this example also has two pairs of second end sides 162 that face each other in a top view. In FIG. 1, the first end sides 161 are parallel to the X-axis direction. The second end sides 162 are parallel to the Y-axis direction. The Z-axis is perpendicular to the top surface of the semiconductor substrate 10. The first end sides 161 are perpendicular to the extension direction of the gate trench portion described later. The second end sides 162 are parallel to the extension direction of the gate trench portion described later.

[0034] An active portion 160 is provided on the semiconductor substrate 10. The active portion 160 is a region through which a main current flows in the depth direction between the upper and lower surfaces of the semiconductor substrate 10 when the semiconductor device 100 is in operation. An emitter electrode is provided above the active portion 160, but is omitted in FIG.

[0035] In this example, the active section 160 is provided with a transistor section 70 including a transistor element such as an IGBT. In another example, the transistor section 70 and a diode section including a diode element such as an FWD (Free Wheel Diode) may be alternately arranged along a predetermined arrangement direction on the upper surface of the semiconductor substrate 10. The transistor section 70 may be provided with a reverse blocking IGBT. In this example, Y Three transistor sections 70 (transistor section 70-1, transistor section 70-2, and transistor section 70-3) are provided along the axial direction. A P+ type well region or a gate polysilicon, which will be described later, may be provided between each of the transistor sections 70.

[0036] The transistor section 70 has a P+ type collector region in a region in contact with the lower surface of the semiconductor substrate 10. Furthermore, the transistor section 70 has a gate structure, which has an N+ type emitter region, a P- type base region, a gate conductive portion, and a gate insulating film, periodically arranged on the upper surface side of the semiconductor substrate 10.

[0037] The semiconductor device 100 may have one or more pads above the semiconductor substrate 10. The semiconductor device 100 of this example has a gate pad 164. The semiconductor device 100 may have pads such as an anode pad, a cathode pad, and a current detection pad. Each pad is disposed in the vicinity of a first end side 161. The vicinity of the first end side 161 refers to the region between the first end side 161 and the emitter electrode in a top view. When the semiconductor device 100 is mounted, each pad may be connected to an external circuit via wiring such as a wire.

[0038] A gate potential is applied to the gate pad 164. The gate pad 164 is electrically connected to a conductive portion of the gate trench portion of the active portion 160. The semiconductor device 100 includes a gate wiring 130 that connects the gate pad 164 and the gate trench portion. In FIG. 1, the gate wiring 130 is hatched with oblique lines.

[0039] The gate wiring 130 is disposed between the active portion 160 and the first end side 161 or the second end side 162 in a top view. The gate wiring 130 of this example surrounds the active portion 160 in a top view. The area surrounded by the gate wiring 130 in a top view may be the active portion 160. The gate wiring 130 is also connected to a gate pad 164. The gate wiring 130 is disposed above the semiconductor substrate 10. The gate wiring 130 may be a metal wiring containing aluminum or the like.

[0040] In this example, the gate wiring 130 has a first wiring 131, a second wiring 132, and a curved portion 133. The first wiring 131 is provided between a first end side 161 and the active portion 160. The second wiring 132 is provided between a second end side 162 and the active portion 160. The curved portion 133 connects the first wiring 131 and the second wiring 132. The curved portion 133 may be provided near the four corners of the semiconductor substrate 10. The curved portion 133 may be a portion having a curve. In this example, the gate wiring 130 has two first wirings 131, two second wirings 132, and four curved portions 133.

[0041] The peripheral well region 11 is provided so as to overlap with the gate wiring 130. That is, similar to the gate wiring 130, the peripheral well region 11 surrounds the active portion 160 in a top view. The peripheral well region 11 is also provided so as to extend by a predetermined width into an area where it does not overlap with the gate wiring 130. The peripheral well region 11 is a region of the second conductivity type. In this example, the peripheral well region 11 is of P+ type (see FIG. 2). The impurity concentration of the peripheral well region 11 is 5.0×10 17 atoms / cm 3 Above 5.0 x 10 19 atoms / cm 3 The impurity concentration of the peripheral well region 11 may be 2.0×10 18 atoms / cm 3 Above 2.0×10 19 atoms / cm 3 It may be the following:

[0042] The semiconductor device 100 may also include a temperature sensor (not shown) that is a PN junction diode made of polysilicon or the like, and a current detector (not shown) that simulates the operation of the transistor section 70 provided in the active section 160. The temperature sensor may be connected to the anode pad and the cathode pad via wiring. When a temperature sensor is provided, it is preferably provided in the center of the semiconductor substrate 10 in the X-axis direction and the Y-axis direction.

[0043] In the present example, the semiconductor device 100 includes an edge termination structure 90 between the active section 160 and the first edge 161 or the second edge 162 when viewed from above. The edge termination structure 90 in the present example is disposed between the peripheral gate wiring 130 and the first edge 161 or the second edge 162. The edge termination structure 90 relieves electric field concentration on the top surface side of the semiconductor substrate 10. The edge termination structure 90 may include at least one of a guard ring, a field plate, and a resurf that are provided in an annular shape surrounding the active section 160. The edge termination structure 90 will be described in detail with reference to FIG. 18.

[0044] Fig. 2 is a diagram showing a comparative example of region D in Fig. 1. Fig. 2 is an enlarged view of region D in Fig. 1. Region D is a region including a transistor portion 70 near a first wiring 131 of a gate wiring 130. The semiconductor device 100 of this example includes a gate trench portion 40, a dummy trench portion 30, a peripheral well region 11, an emitter region 12, and a contact region 15 provided inside the upper surface side of a semiconductor substrate 10. The gate trench portion 40 and the dummy trench portion 30 are each an example of a trench portion.

[0045] The semiconductor device 100 of this example includes an emitter electrode 52 and a gate wiring 130 (first wiring 131) provided above the upper surface of the semiconductor substrate 10. The emitter electrode 52 and the gate wiring 130 are provided separately from each other. An interlayer insulating film is provided between the emitter electrode 52 and the gate wiring 130 and the upper surface of the semiconductor substrate 10. The interlayer insulating film is omitted in FIG. 2.

[0046] The emitter electrode 52 is provided above the gate trench portion 40, the dummy trench portion 30, the outer periphery well region 11, the emitter region 12, and the contact region 15. The emitter electrode 52 contacts the emitter region 12 and the contact region 15 on the upper surface of the semiconductor substrate 10 through a contact hole 54. The emitter electrode 52 is connected to the dummy conductive portion in the dummy trench portion 30 through a contact hole 56 provided in the interlayer insulating film. In this example, the emitter electrode 52 is connected to the dummy conductive portion in the dummy trench portion 30 through the dummy polysilicon 36. The emitter electrode 52 may be connected to the dummy conductive portion of the dummy trench portion 30 at the tip of the dummy trench portion 30 in the Y-axis direction. The dummy polysilicon 36 is formed of polysilicon, which is a conductive material. The dummy polysilicon 36 may be provided above the semiconductor substrate 10.

[0047] The gate wiring 130 is connected to the gate polysilicon 46 through a contact hole 58 provided in the interlayer insulating film. The gate polysilicon 46 is connected to the gate trench portion 40. That is, the gate wiring 130 is connected to the gate trench portion 40 via the gate polysilicon 46. The gate wiring 130 may be connected to the gate conductive portion of the gate trench portion 40 at the tip portion 41 of the gate trench portion 40 in the Y-axis direction. The gate wiring 130 is not connected to the dummy conductive portion in the dummy trench portion 30. The gate polysilicon 46 is formed of polysilicon, which is a conductive material. The gate polysilicon 46 may be provided above the semiconductor substrate 10. The gate polysilicon 46 is provided along the extension direction (X-axis direction) of the gate wiring 130. The gate polysilicon 46 is provided along the end side (first end side 161 in FIG. 1). In the comparative example, the gate polysilicon 46 is provided continuously in the X-axis direction.

[0048] The emitter electrode 52 is formed of a material containing a metal. For example, at least a portion of the emitter electrode 52 is formed of aluminum or an aluminum-silicon alloy, such as a metal alloy such as AlSi or AlSiCu. The emitter electrode 52 may have a barrier metal made of titanium, a titanium compound, or the like, below the region made of aluminum or the like. Furthermore, the emitter electrode 52 may have a plug formed by embedding tungsten or the like in the contact hole so as to be in contact with the barrier metal and aluminum or the like.

[0049] The transistor section 70 has a plurality of trench sections arranged in the arrangement direction. In this example, the trench sections are provided in the active section 160 and the peripheral well region 11 on the upper surface of the semiconductor substrate 10. The trench sections are provided in a striped pattern in the transistor section 70 when viewed from above. In the transistor section 70, one or more gate trench sections 40 and one or more dummy trench sections 30 are alternately provided along the arrangement direction. In this example, one gate trench section 40 and one dummy trench section 30 are alternately provided. The arrangement direction in FIG. 2 is the X-axis direction.

[0050] The gate trench portion 40 in this example may have two straight line portions 39 (portions of the trench that are straight along the extension direction) extending along an extension direction perpendicular to the arrangement direction, and a tip portion 41 connecting the two straight line portions 39. The extension direction in FIG. 2 is the Y-axis direction.

[0051] At least a part of the tip portion 41 is preferably curved in a top view. By connecting the ends of the two straight portions 39 in the Y-axis direction with each other by the tip portion 41, electric field concentration at the ends of the straight portions 39 can be alleviated.

[0052] In the transistor portion 70, the dummy trench portion 30 is provided between each straight portion 39 of the gate trench portion 40. One dummy trench portion 30 may be provided between each straight portion 39, or multiple dummy trench portions 30 may be provided. In this example, one dummy trench portion 30 is provided between each straight portion 39.

[0053] The diffusion depth of the peripheral well region 11 may be deeper than the depth of the gate trench portion 40 and the dummy trench portion 30. The ends of the gate trench portion 40 and the dummy trench portion 30 in the Y-axis direction are provided in the peripheral well region 11 in a top view. That is, at the ends of each trench portion in the Y-axis direction, the bottoms of each trench portion in the depth direction are covered by the peripheral well region 11. This makes it possible to alleviate electric field concentration at the bottoms of each trench portion. The semiconductor device 100 may also include the gate trench portion 40 or the dummy trench portion 30 whose entirety is provided in the peripheral well region 11 in a top view.

[0054] A mesa portion is provided between each trench portion in the arrangement direction. The mesa portion refers to a region inside the semiconductor substrate 10 that is sandwiched between the trench portions. As an example, the upper end of the mesa portion is the upper surface of the semiconductor substrate 10. The depth position of the lower end of the mesa portion is the same as the depth position of the lower end of the trench portion. The mesa portion in this example is provided on the upper surface of the semiconductor substrate 10, extending in the extension direction (Y-axis direction) along the trench. In this example, the mesa portion 60 is provided in the transistor portion 70.

[0055] At least one of a first conductive type emitter region 12 and a second conductive type contact region 15 may be provided in each mesa portion 60. In this example, the emitter region 12 is N+ type, and the contact region 15 is P+ type. The emitter region 12 and the contact region 15 may be provided between the base region and the upper surface of the semiconductor substrate 10 in the depth direction.

[0056] The mesa portion 60 of the transistor section 70 has an emitter region 12 exposed on the upper surface of the semiconductor substrate 10. The emitter region 12 is provided in contact with the gate trench portion 40. The mesa portion 60 in contact with the gate trench portion 40 may be provided with a contact region 15 exposed on the upper surface of the semiconductor substrate 10. In this example, the region of the mesa portion 60 that is exposed on the upper surface of the semiconductor substrate 10 and is disposed closest to the gate wiring 130 is the contact region 15.

[0057] Each of the contact region 15 and the emitter region 12 in the mesa portion 60 is provided from one trench portion to the other trench portion in the X-axis direction. As an example, the contact region 15 and the emitter region 12 in the mesa portion 60 are alternately arranged along the extension direction of the trench portion (the Y-axis direction).

[0058] In another example, the contact region 15 and the emitter region 12 of the mesa portion 60 may be provided in a stripe shape along the extension direction (Y-axis direction) of the trench portion. For example, the emitter region 12 is provided in a region in contact with the trench portion, and the contact region 15 is provided in a region sandwiched between the emitter regions 12.

[0059] Fig. 3 is a diagram showing an example of the gg cross section in Fig. 2. The gg cross section is an XZ plane passing through the emitter region 12. Note that the dimensions in Fig. 3 do not necessarily match those in Fig. 2. In this cross section, the semiconductor device 100 of this example has a semiconductor substrate 10, an interlayer insulating film 38, an emitter electrode 52, a collector electrode 24, and a protective film 150.

[0060] The interlayer insulating film 38 is provided on the upper surface 21 of the semiconductor substrate 10. The interlayer insulating film 38 is a film including at least one layer of an insulating film such as silicate glass doped with impurities such as boron or phosphorus, a thermal oxide film, and other insulating films. The interlayer insulating film 38 is provided with the contact hole 54 described in FIG. 2.

[0061] The emitter electrode 52 is provided above the interlayer insulating film 38. The emitter electrode 52 passes through a contact hole 54 in the interlayer insulating film 38 and is in contact with the upper surface 21 of the semiconductor substrate 10. The emitter electrode 52 may be provided above the peripheral well region 11. A gate wiring 130 may be provided above the peripheral well region 11. In this example, a gate polysilicon 46 is provided below the gate wiring 130.

[0062] Collector electrode 24 is provided on lower surface 23 of semiconductor substrate 10. Emitter electrode 52 and collector electrode 24 are formed of a metal material such as aluminum. In this specification, the direction connecting emitter electrode 52 and collector electrode 24 (Z-axis direction) is referred to as the depth direction.

[0063] A base region 14 of the second conductivity type is provided in each mesa portion 60. The emitter region 12 and the contact region 15 are provided between the upper surface 21 of the semiconductor substrate 10 and the base region 14. In this example, the base region 14 is of P-type.

[0064] The semiconductor substrate 10 has a drift region 18 of a first conductivity type. In this example, the drift region 18 is N-type.

[0065] In the mesa portion 60, an N+ type emitter region 12 and a P- type base region 14 are provided in this order from the upper surface 21 side of the semiconductor substrate 10. A drift region 18 is provided below the base region 14. In addition, the mesa portion 60 may be provided with an N+ type accumulation region (not shown).

[0066] The emitter region 12 is exposed on the upper surface 21 of the semiconductor substrate 10, and is provided in contact with the gate trench portion 40. The emitter region 12 may be in contact with the trench portions on both sides of the mesa portion 60. The emitter region 12 has a higher doping concentration than the drift region 18.

[0067] The base region 14 is provided below the emitter region 12. In this example, the base region 14 is provided in contact with the emitter region 12. The base region 14 may be in contact with the trench portions on both sides of the mesa portion 60. value For example, 2.5×10 17 atoms / cm 3 The impurity concentration of the base region 14 is 5.0×10 16 atoms / cm 3 Above 1.0×10 18 atoms / cm 3 It may be the following:

[0068] In another cross section, in the mesa portion 60, a P+ type contact region 15 and a P- type base region 14 are provided in this order from the upper surface 21 side of the semiconductor substrate 10. Below the base region 14, a drift region 18 is provided.

[0069] An N+ type buffer region 20 may be provided under the drift region 18. The doping concentration of the buffer region 20 is higher than that of the drift region 18. The buffer region 20 may have a concentration peak with a higher doping concentration than the drift region 18. The doping concentration of the concentration peak refers to the doping concentration at the apex of the concentration peak. The doping concentration of the drift region 18 may be the average value of the doping concentration in a region where the doping concentration distribution is approximately flat.

[0070] The buffer region 20 may be formed by ion implantation of an N-type dopant such as hydrogen (protons) or phosphorus. In this example, the buffer region 20 is formed by ion implantation of hydrogen. The buffer region 20 may function as a field stop layer that prevents a depletion layer extending from the lower end of the base region 14 from reaching the P+ type collector region 22.

[0071] A P+ type collector region 22 is provided below the buffer region 20. The acceptor concentration of the collector region 22 is higher than the acceptor concentration of the base region 14. The collector region 22 may contain the same acceptor as the base region 14, or may contain a different acceptor. The acceptor of the collector region 22 is, for example, boron. The element serving as the acceptor is not limited to the above example.

[0072] The collector region 22 is exposed on the lower surface 23 of the semiconductor substrate 10, and is connected to a collector electrode 24. The collector electrode 24 may be in contact with the entire lower surface 23 of the semiconductor substrate 10. The emitter electrode 52 and the collector electrode 24 are formed of a metal material such as aluminum.

[0073] At least one gate trench portion 40 and at least one dummy trench portion 30 are provided on the upper surface 21 side of the semiconductor substrate 10. In this example, a plurality of gate trench portions 40 and a plurality of dummy trench portions 30 are provided on the upper surface 21 side of the semiconductor substrate 10. Each trench portion penetrates the base region 14 from the upper surface 21 of the semiconductor substrate 10 and reaches the drift region 18. In a region where at least one of the emitter region 12 and the contact region 15 is provided, each trench portion also penetrates these doping regions and reaches the drift region 18. The trench portion penetrating the doping region is not limited to a case where the trench portion is formed in the order of forming the doping region and then the trench portion. A case where the trench portion is formed and then the doping region is formed between the trench portions is also included in the case where the trench portion penetrates the doping region.

[0074] The gate trench portion 40 has a gate trench provided on the upper surface 21 of the semiconductor substrate 10, a gate insulating film 42, and a gate conductive portion 44. The gate conductive portion 44 is formed of polysilicon, which is a conductive material. The gate conductive portion 44 may be formed of the same material as the gate polysilicon 46. The gate insulating film 42 is provided to cover the inner wall of the gate trench. The gate insulating film 42 may be formed by oxidizing or nitriding the semiconductor on the inner wall of the gate trench. In FIG. 3, the gate conductive portion 44 is provided inside the gate insulating film 42 inside the gate trench. That is, the gate insulating film 42 insulates the gate conductive portion 44 from the semiconductor substrate 10.

[0075] The gate conductive portion 44 in the gate trench portion 40 may be provided longer in the depth direction than the base region 14. The gate trench portion 40 in this cross section is covered with an interlayer insulating film 38 on the upper surface 21 of the semiconductor substrate 10. The gate conductive portion 44 is electrically connected to the gate wiring 130. When a predetermined gate voltage is applied to the gate conductive portion 44, a channel is formed by an electron inversion layer in the surface layer of the interface of the base region 14 that contacts the gate trench portion 40.

[0076] The dummy trench portion 30 may have the same structure as the gate trench portion 40 in the cross section. The dummy trench portion 30 has a dummy trench provided on the upper surface 21 of the semiconductor substrate 10, a dummy insulating film 32, and a dummy conductive portion 34. The dummy conductive portion 34 is formed of polysilicon, which is a conductive material. The dummy conductive portion 34 may be formed of the same material as the dummy polysilicon 36. The dummy conductive portion 34 is electrically connected to the emitter electrode 52. The dummy insulating film 32 is provided to cover the inner wall of the dummy trench. In FIG. 3, the dummy conductive portion 34 is provided inside the dummy trench and is provided on the inner side of the dummy insulating film 32. The dummy insulating film 32 insulates the dummy conductive portion 34 from the semiconductor substrate 10. The dummy conductive portion 34 may have the same length as the gate conductive portion 44 in the depth direction.

[0077] The gate trench portion 40 and the dummy trench portion 30 in this example are covered with an interlayer insulating film 38 on the upper surface 21 of the semiconductor substrate 10. The bottoms of the dummy trench portion 30 and the gate trench portion 40 may be curved and convex downward (curved in cross section).

[0078] A protective film 150 is provided on the upper surface of the emitter electrode 52. By providing the protective film 150 on the upper surface of the emitter electrode 52, the electrode can be protected. The protective film 150 may be provided by patterning. One example of the protective film 150 is a polyimide film.

[0079] FIG. 4 is a diagram showing an example of the aa cross section in FIG. 2. The aa cross section is a YZ plane passing through the contact hole 56. The dimensions in FIG. 4 do not necessarily match those in FIG. 2. The semiconductor device 100 of this example has a semiconductor substrate 10, an interlayer insulating film 38, an emitter electrode 52, a collector electrode 24, and a protective film 150 in the cross section. In FIG. 4, the vicinity of the lower surface 23 of the semiconductor substrate 10 is omitted. In the cross section, the dummy conductive portion 34 in the dummy trench portion 30 is connected to the emitter electrode 52 through the contact hole 56. In addition, the gate wiring 130 is connected to the gate conductive portion 44.

[0080] 5 is a diagram showing an example of the bb cross section in FIG. 2. The bb cross section is a YZ plane passing through the contact hole 54. The dimensions in FIG. 5 do not necessarily match those in FIG. 2. In this cross section, the semiconductor device 100 of this example has a semiconductor substrate 10, an interlayer insulating film 38, an emitter electrode 52, a collector electrode 24, and a protective film 150. In FIG. 5, the vicinity of the lower surface 23 of the semiconductor substrate 10 is omitted. In this cross section, the upper surface 21 of the semiconductor substrate 10 is connected to the emitter electrode 52 via the contact hole 54.

[0081] 6 is a diagram showing an example of a cc cross section in FIG. 2. The cc cross section is a YZ plane passing through the straight portion 39 of the gate trench portion 40. The dimensions in FIG. 6 do not necessarily match those in FIG. 2. In this cross section, the semiconductor device 100 of this example has a semiconductor substrate 10, an interlayer insulating film 38, an emitter electrode 52, a collector electrode 24, and a protective film 150. In FIG. 6, the vicinity of the lower surface 23 of the semiconductor substrate 10 is omitted. In this cross section, the gate wiring 130 is connected to the gate conductive portion 44.

[0082] In FIG. 5, a thin insulating film 43 is provided between the gate polysilicon 46 and the peripheral well region 11. The insulating film 43 is provided when the gate insulating film 42 and the dummy insulating film 32 are formed. When the semiconductor device 100 is turned off, a hole current is generated that flows from the edge termination structure 90 to the emitter electrode 52. The hole current increases the potential of the peripheral well region 11, and a potential difference is generated between the gate polysilicon 46 and the peripheral well region 11. If the thin insulating film 43 is present between the gate polysilicon 46 and the peripheral well region 11, the insulating film 43 may be destroyed by the potential difference. For example, if the potential difference exceeds 80V, the insulating film 43 between the gate polysilicon 46 and the peripheral well region 11 may be destroyed, causing a chip failure.

[0083] Fig. 7 is a diagram showing an example of an embodiment of region D in Fig. 1. Fig. 7 is an enlarged view of region D in Fig. 1. The semiconductor device 100 in Fig. 7 differs from the semiconductor device 100 in Fig. 2 in the configuration of the gate polysilicon 46. Other configurations of the semiconductor device 100 in Fig. 7 may be the same as those of the semiconductor device 100 in Fig. 2.

[0084] In Fig. 7, a plurality of gate polysilicon layers 46 are provided. The plurality of gate polysilicon layers 46 are provided along the extension direction (X-axis direction) of the gate wiring 130. The gate polysilicon layers 46 are provided discretely along the extension direction of the gate wiring 130. The plurality of gate polysilicon layers 46 are provided along an end side (first end side 161 in Fig. 1). By providing a plurality of gate polysilicon layers 46, the area in which the gate polysilicon layers 46 are provided can be reduced in top view.

[0085] Further, the multiple gate polysilicon 46 connects the multiple gate trench portions 40 to the gate wiring 130, respectively. In this example, at least one of the multiple gate trench portions 40 is connected to one of the multiple gate polysilicon 46. That is, one gate trench portion 40 is connected to one gate polysilicon 46. In this example, one gate trench portion 40 is connected to one gate polysilicon 46 at the tip portion 41. With this configuration, even if the gate polysilicon 46 is provided discretely, the gate conductive portion 44 and the gate wiring 130 can be electrically connected.

[0086] In this example, the width D1 in the arrangement direction of the gate trench portion 40 including the two straight line portions 39 may be larger than the width D2 in the arrangement direction of the gate polysilicon 46 connected to the gate trench portion 40. With this configuration, the gate polysilicon 46 can be provided only in the region overlapping with the gate trench portion 40 in the arrangement direction, and the area in which the gate polysilicon 46 is provided in the top view can be reduced.

[0087] It is preferable that the width D2 is large in order to increase the contact area between the gate trench portion 40 and the gate polysilicon 46. The width D2 may be 50% or more of the width D1. The width D2 may be 80% or more of the width D1.

[0088] In this example, the gate polysilicon 46 has a longitudinal direction in a direction from the gate wiring 130 toward the gate trench portion 40. The gate polysilicon 46 has a longitudinal direction in an extension direction of the gate trench portion 40. In this example, the gate polysilicon 46 has a longitudinal direction in the Y-axis direction.

[0089] Fig. 8 is a diagram showing an example of the dd cross section in Fig. 7. The dd cross section is a YZ plane passing through the contact hole 56. In this cross section, the gate polysilicon 46 is provided below the first wiring 131 of the gate wiring 130, so it is the same as Fig. 4. Therefore, in this cross section, the gate wiring 130 is connected to the gate conductive portion 44.

[0090] Fig. 9 is a diagram showing an example of an ee cross section in Fig. 7. The ee cross section is a YZ plane passing through the contact hole 54. The cross section in Fig. 9 differs from the cross section in Fig. 5 in that the gate polysilicon 46 is not provided. Other configurations of the cross section in Fig. 9 may be the same as those in Fig. 5.

[0091] As explained in Fig. 7, in this example, the area in which the gate polysilicon 46 is provided is reduced in top view. In the cross section of Fig. 9, since the gate polysilicon 46 is not provided, an interlayer insulating film 38 that is thicker than the insulating film 43 is provided between the gate wiring 130 and the peripheral well region 11. Therefore, even if the potential of the peripheral well region 11 increases due to the hole current, the insulating film between the gate wiring 130 and the peripheral well region 11 can be prevented from being destroyed.

[0092] Fig. 10 is a diagram showing an example of the ff cross section in Fig. 7. The ff cross section is a YZ plane passing through the straight portion 39 of the gate trench portion 40. The cross section in Fig. 10 differs from the cross section in Fig. 6 in that the gate polysilicon 46 is not provided. Other configurations of the cross section in Fig. 10 may be the same as those in Fig. 6. Since the gate polysilicon 46 is not provided in this cross section, the gate wiring 130 is not connected to the gate conductive portion 44.

[0093] Fig. 11 is a diagram showing another example of the embodiment of region D in Fig. 1. Fig. 11 is an enlarged view of region D in Fig. 1. The semiconductor device 100 in Fig. 11 differs from the semiconductor device 100 in Fig. 7 in the configurations of the gate polysilicon 46 and the gate trench portion 40. Other configurations of the semiconductor device 100 in Fig. 11 may be the same as those of the semiconductor device 100 in Fig. 7.

[0094] In this example, at least a part of the gate trench portion 40 is extended to the gate wiring 130. At least a part of the gate trench portion 40 is extended to below the gate wiring 130. In FIG. 11, the tip portion 41 of the gate trench portion 40 overlaps with the gate wiring 130 in a top view. By extending at least a part of the gate trench portion 40 to the gate wiring 130, the area in which the gate polysilicon 46 is provided in a top view can be further reduced. Therefore, the area in which a thick insulating film is provided between the gate wiring 130 and the peripheral well region 11 as in the cross section of FIG. 9 can be increased, and the breakdown of the insulating film at the time of turn-off can be suppressed.

[0095] Fig. 12 is a diagram showing an example of the hh cross section in Fig. 11. The hh cross section is a YZ plane passing through the contact hole 56. The cross section in Fig. 12 differs from the cross section in Fig. 8 in the configurations of the gate polysilicon 46 and the gate trench portion 40. Other configurations in the cross section in Fig. 12 may be the same as those in the cross section in Fig. 8.

[0096] In this example, the gate polysilicon 46 is provided between the gate trench portion 40 and the gate wiring 130 in the depth direction. With such a configuration, the area in which the gate polysilicon 46 is provided can be further reduced in top view. In order to further reduce the area in which the gate polysilicon 46 is provided in top view, it is preferable that the gate polysilicon 46 is provided only between the gate trench portion 40 and the gate wiring 130.

[0097] Fig. 13 is a diagram showing another example of the embodiment of region D in Fig. 1. The semiconductor device 100 in Fig. 13 differs from the semiconductor device 100 in Fig. 7 in the configurations of the gate polysilicon 46 and the gate trench portion 40. Other configurations of the semiconductor device 100 in Fig. 13 may be the same as those of the semiconductor device 100 in Fig. 7.

[0098] The gate trench portion 40 of this example has only one straight line portion 39 extending along an extension direction perpendicular to the arrangement direction. In the gate trench portion 40 of this example, the straight line portion 39 of one gate trench portion 40 is connected to one gate polysilicon 46.

[0099] In this example, the width D3 of the gate trench portion 40 in the arrangement direction is larger than the width D4 of the gate polysilicon 46 connected to the gate trench portion in the arrangement direction. With this configuration, the gate polysilicon 46 can be provided only in the region overlapping with the gate trench portion 40 in the arrangement direction, and the area in which the gate polysilicon 46 is provided in the top view can be reduced. Therefore, the area in which a thick insulating film is provided between the gate wiring 130 and the peripheral well region 11 can be increased, and breakdown of the insulating film at the time of turn-off can be suppressed.

[0100] It is preferable that the width D4 is large in order to increase the contact area between the gate trench portion 40 and the gate polysilicon 46. The width D4 may be 50% or more of the width D3. The width D4 may be 80% or more of the width D3.

[0101] In this example, the gate polysilicon 46 has a longitudinal direction in a direction from the gate wiring 130 toward the gate trench portion 40. The gate polysilicon 46 has a longitudinal direction in an extension direction of the gate trench portion 40. In this example, the gate polysilicon 46 has a longitudinal direction in the Y-axis direction.

[0102] FIG. 14 is a diagram showing a comparative example of region E in FIG. 1414 is an enlarged view of region E in Fig. 1. Region E is a region including a transistor portion 70 near a curved portion 133 of a gate wiring 130. The semiconductor device 100 of this example includes a gate trench portion 40, a dummy trench portion 30, and a peripheral well region 11 provided inside the upper surface side of a semiconductor substrate 10. In Fig. 14, the emitter region 12 and the contact region 15 are omitted.

[0103] The gate polysilicon 46 is provided along a curved portion 133 of the gate wiring 130. Therefore, the gate polysilicon 46 also has a curve. Furthermore, the tip portion 41 of the gate trench portion 40 is provided along the gate polysilicon 46. The peripheral well region 11 may be provided in a stepped shape as shown in FIG. 14. In the comparative example, the gate polysilicon 46 is provided continuously in the X-axis direction.

[0104] Fig. 15 is a diagram showing an example of an embodiment of region E in Fig. 1. Fig. 15 is an enlarged view of region E in Fig. 1. The semiconductor device 100 in Fig. 15 differs from the semiconductor device 100 in Fig. 14 in the configuration of the gate polysilicon 46. Other configurations of the semiconductor device 100 in Fig. 15 may be the same as those of the semiconductor device 100 in Fig. 14.

[0105] In FIG. 15, a plurality of gate polysilicon 46 is provided. The plurality of gate polysilicon 46 is provided along an arrangement direction (X-axis direction) perpendicular to the extension direction of the gate trench portion 40. The gate polysilicon 46 is provided discretely along the X-axis direction. The plurality of gate polysilicon 46 is provided along a curved portion 133 of the gate wiring 130. By providing a plurality of gate polysilicon 46, the area in which the gate polysilicon 46 is provided in the vicinity of the curved portion 133 of the gate wiring 130 in a top view can be reduced. Therefore, the area in which a thick insulating film is provided between the gate wiring 130 and the outer periphery well region 11 in the vicinity of the curved portion 133 of the gate wiring 130 can be increased, and the breakdown of the insulating film at the time of turn-off can be suppressed. Also, as in FIG. 7, one gate trench portion 40 is connected to one gate polysilicon 46 at the tip portion 41.

[0106] 15, as in FIG. 7, the width D5 in the arrangement direction of the gate trench portion 40 including the two straight line portions 39 may be larger than the width D6 of the gate polysilicon 46 connected to the gate trench portion 40 in the arrangement direction. With this configuration, the gate polysilicon 46 can be provided only in the region overlapping with the gate trench portion 40 in the arrangement direction, and the area in which the gate polysilicon 46 is provided in the top view can be reduced. Therefore, the region in which a thick insulating film is provided between the gate wiring 130 and the peripheral well region 11 can be increased, and breakdown of the insulating film at the time of turn-off can be suppressed.

[0107] It is preferable that the width D6 is large in order to increase the contact area between the gate trench portion 40 and the gate polysilicon 46. The width D6 may be 50% or more of the width D5. The width D6 may be 80% or more of the width D5.

[0108] In this example, the gate polysilicon 46 has a longitudinal direction in a direction from the gate wiring 130 toward the gate trench portion 40. The gate polysilicon 46 has a longitudinal direction in an extension direction of the gate trench portion 40. In this example, the gate polysilicon 46 has a longitudinal direction in the Y-axis direction.

[0109] FIG. 16 is a diagram showing another example of the embodiment of the region E in FIG. 1. FIG. 16 is an enlarged view of the region E in FIG. 1. The semiconductor device 100 in FIG. 16 differs from the semiconductor device 100 in FIG. 15 in the configuration of the gate polysilicon 46. The other configurations of the semiconductor device 100 in FIG. 16 may be the same as those of the semiconductor device 100 in FIG. 15. The gate polysilicon 46 in FIG. 16 is defined as the gate polysilicon 46-1, the gate polysilicon 46-2, and the gate polysilicon 46-3 from the negative side in the X-axis direction. The longitudinal directions of the gate polysilicon 46 are defined as the longitudinal direction E1, the longitudinal direction E2, and the longitudinal direction E3, respectively. The extension directions of the portions of the gate wiring 130 connected to the gate polysilicon 46 are defined as the extension direction E4, the extension direction E5, and the extension direction E6, respectively.

[0110] In this example, the longitudinal direction of each gate polysilicon 46 is changed based on the extension direction of the portion of the gate wiring 130 connected to the gate polysilicon 46. For example, the longitudinal direction of each gate polysilicon 46 is changed so as to be approximately perpendicular to the extension direction of the portion of the gate wiring 130 connected to the gate polysilicon 46. Approximately perpendicular may include an error of ±10% from perpendicular. Therefore, the angle between the longitudinal direction and the extension direction of the gate trench portion 40 becomes smaller in the order of the gate polysilicon 46-1, the gate polysilicon 46-2, and the gate polysilicon 46-3. By changing the longitudinal direction of each gate polysilicon 46 in this manner, the gate wiring 130 and the gate trench portion 40 can be connected at the shortest distance, and the gate potential can be applied without delay.

[0111] In this example, the longitudinal directions of at least two gate polysilicon 46 are different in angle with the extension direction (Y-axis direction) of the gate trench portion 40. In FIG. 16, the angle θ2 between the longitudinal direction E2 of the gate polysilicon 46-2 and the extension direction of the gate trench portion 40 and the angle θ3 between the longitudinal direction E3 of the gate polysilicon 46-3 and the extension direction of the gate trench portion 40 are different. Note that the angle θ1 between the longitudinal direction E1 of the gate polysilicon 46-1 and the extension direction of the gate trench portion 40 and the angle θ2 between the longitudinal direction E2 of the gate polysilicon 46-2 and the extension direction of the gate trench portion 40 may be different or the same. The angles θ1, θ2, and θ3 may be different from each other.

[0112] 17 is a diagram showing another example of the embodiment of the region E in FIG. E FIG. 17 The semiconductor device 100 in this embodiment differs from the semiconductor device 100 in FIG. 15 in the configurations of the gate polysilicon 46 and the gate trench portion 40. 17 The rest of the configuration of the semiconductor device 100 may be the same as that of the semiconductor device 100 in FIG.

[0113] In this example, at least a portion of the gate trench portion 40 is provided so as to extend to the gate wiring 130. Also, at least a portion of the gate trench portion 40 is provided so as to extend to below the gate wiring 130. 17 In the semiconductor device, the tip portion 41 of the gate trench portion 40 overlaps with the gate wiring 130 in a top view. By extending at least a portion of the gate trench portion 40 up to the gate wiring 130, the area in which the gate polysilicon 46 is provided in a top view can be further reduced. Therefore, the area in which a thick insulating film is provided between the gate wiring 130 and the peripheral well region 11 can be increased, and breakdown of the insulating film at the time of turn-off can be suppressed. As shown in FIG. 12, the gate polysilicon 46 may be provided between the gate trench portion 40 and the gate wiring 130 in the depth direction.

[0114] The embodiment of the region D and the embodiment of the region E may be appropriately combined. For example, the embodiment of FIG. 7 and the embodiment of FIG. 16 are combined. In FIG. 7, the extension direction of the gate wiring 130 is approximately perpendicular to the longitudinal direction of each gate polysilicon 46. By having the configuration of FIG. 7 in the vicinity of the first wiring 131 and the configuration of FIG. 16 in the vicinity of the curved portion 133, the longitudinal direction of each gate polysilicon 46 can be changed based on the extension direction of the portion of the gate wiring 130 that connects to the gate polysilicon 46 in the entire gate wiring 130. By combining the embodiment of FIG. 7 and the embodiment of FIG. 16, each gate trench portion 40 and the gate wiring 130 can be connected at the shortest distance. By combining the embodiment of FIG. 7 and the embodiment of FIG. 16, the longitudinal direction of the gate polysilicon 46 connected to the first wiring 131 is different from the longitudinal direction of the gate polysilicon 46 connected to the curved portion 133.

[0115] 7 and the embodiment of FIG. 17 may be combined. In this case, as shown in FIG. 17, at least a part of the gate trench portion 40 is provided extending to below the curved portion 133 of the gate wiring 130. Furthermore, at least one gate polysilicon 46 is provided between the gate trench portion 40 and the curved portion 133 in the depth direction. Furthermore, as shown in FIG. 7, at least one gate polysilicon 46 has a longitudinal direction in a direction from the first wiring 131 of the gate wiring 130 toward the gate trench portion 40. Examples of combinations of the embodiments are not limited to these.

[0116] Figure 18 is a diagram showing an example of an edge termination structure 90. Figure 18 shows edge termination structure 90 in the vicinity of the cc cross section of Figure 6. Edge termination structure 90 includes polysilicon 47, a plurality of guard rings 92, an oxide film 94, and a field plate 96.

[0117] Each guard ring 92 may be provided to surround the active portion 160 on the upper surface 21. The multiple guard rings 92 may have a function of spreading a depletion layer generated in the active portion 160 to the outside of the semiconductor substrate 10. This makes it possible to prevent electric field concentration inside the semiconductor substrate 10, and improve the breakdown voltage of the semiconductor device 100.

[0118] The guard ring 92 of this example is a P+ type semiconductor region formed by ion irradiation in the vicinity of the upper surface 21. The depth of the bottom of the guard ring 92 may be deeper than the depth of the bottom of the gate trench portion 40 and the dummy trench portion 30.

[0119] The upper surface of guard ring 92 is covered with interlayer insulating film 38 and oxide film 94. Field plate 96 is formed of a conductive material such as metal. Field plate 96 may be formed of the same material as emitter electrode 52. Field plate 96 is provided on interlayer insulating film 38. Field plate 96 is connected to guard ring 92 via polysilicon 47. As described above, in edge termination structure 90, a hole current is generated that flows from edge termination structure 90 to emitter electrode 52 at the time of turn-off.

[0120] Fig. 19 is a diagram showing an example of a cross section taken along line ii in Fig. 1. The cross section ii is an XZ plane passing through the second wiring 132 of the gate wiring 130. Note that the dimensions in Fig. 19 do not necessarily match those in other figures.

[0121] In this cross section, the gate trench portion 40 is not connected to the gate wiring 130. Therefore, the gate polysilicon 46 is not provided. The gate polysilicon 46 does not need to be provided below the second wiring 132 of the gate wiring 130. As shown in FIG. 8, the gate polysilicon 46 may be provided below the first wiring 131 of the gate wiring 130. With this configuration, it is possible to increase the area where a thick insulating film is provided between the gate wiring 130 and the outer periphery well region 11 in the vicinity of the second wiring 132 of the gate wiring 130, and to suppress breakdown of the insulating film at the time of turn-off.

[0122] Although the present invention has been described above using the embodiments, the technical scope of the present invention is not limited to the scope described in the above embodiments. It is clear to those skilled in the art that various modifications and improvements can be made to the above embodiments. It is clear from the claims that such modifications and improvements can also be included in the technical scope of the present invention.

[0123] It should be noted that the order of execution of each process, such as operations, procedures, steps, and stages, in the devices, systems, programs, and methods shown in the claims, specifications, and drawings is not specifically indicated as "before," "prior to," etc., and may be realized in any order unless the output of a previous process is used in a later process. Even if the operational flow in the claims, specifications, and drawings is explained using "first," "next," etc. for convenience, it does not mean that it is essential to perform the process in this order. [Explanation of symbols]

[0124] 10 semiconductor substrate, 11 peripheral well region, 12 emitter region, 14 base region, 15 contact region, 18 drift region, 20 buffer region, 21 upper surface, 22 collector region, 23 lower surface, 24 collector electrode, 30 dummy trench portion, 32 dummy insulating film, 34 dummy conductive portion, 36 dummy polysilicon, 38 interlayer insulating film, 39 straight portion, 40 gate trench portion, 41 tip portion, 42 gate insulating film, 43 insulating film, 44 gate conductive portion, 46 gate a gate polysilicon, 47 polysilicon, 52 emitter electrode, 54 contact hole, 56 contact hole, 58 contact hole, 60 mesa portion, 70 transistor portion, 90 edge termination structure portion, 92 guard ring, 94 oxide film, 96 field plate, 100 semiconductor device, 130 gate wiring, 131 first wiring, 132 second wiring, 133 curved portion, 150 protective film, 160 active portion, 161 first edge, 162 second edge, 164 gate pad

Claims

1. A semiconductor device including a semiconductor substrate, The semiconductor substrate is An active portion; a plurality of gate trench portions provided in the active portion on the upper surface of the semiconductor substrate and extending along an extension direction; having a gate wiring provided between the active portion and an edge of the semiconductor substrate; a plurality of gate polysilicon layers arranged apart from one another along the edge and connecting the plurality of gate trench portions to the gate wiring, respectively; Further comprising: In a depth direction of the semiconductor substrate, a lower surface of the gate wiring is farther from the upper surface of the semiconductor substrate than a lower surface of the gate polysilicon, over the entire upper surface of the semiconductor substrate; In the active portion, the semiconductor substrate is A drift region of a first conductivity type; an emitter region of a first conductivity type exposed on an upper surface of the semiconductor substrate and having a doping concentration higher than that of the drift region; a second conductive type base region provided between the emitter region and the drift region in a depth direction; having The gate polysilicon is connected to the gate trench portion outside the emitter region provided on the outermost side of the active portion in the extension direction. Semiconductor device.

2. A semiconductor device including a semiconductor substrate, The semiconductor substrate is An active portion; a plurality of gate trench portions provided in the active portion on the upper surface of the semiconductor substrate and extending along an extension direction; having a gate wiring provided between the active portion and an edge of the semiconductor substrate; a plurality of gate polysilicon layers arranged apart from one another along the edge and connecting the plurality of gate trench portions to the gate wiring, respectively; Further comprising: In a depth direction of the semiconductor substrate, a lower surface of the gate wiring is farther from the upper surface of the semiconductor substrate than a lower surface of the gate polysilicon, over the entire upper surface of the semiconductor substrate; In the active portion, the semiconductor substrate is A drift region of a first conductivity type; a contact region of a second conductivity type exposed on the top surface of the semiconductor substrate; a second conductive type base region provided between the contact region and the drift region in a depth direction and having a doping concentration lower than that of the contact region; having The gate polysilicon is connected to the gate trench portion outside the contact region provided on the outermost side of the active portion in the extension direction. Semiconductor device.

3. A semiconductor device comprising a semiconductor substrate, The semiconductor substrate is An active portion; a plurality of gate trench portions provided in the active portion on the upper surface of the semiconductor substrate and extending along an extension direction; having a gate wiring provided between the active portion and an edge of the semiconductor substrate; a plurality of gate polysilicon layers disposed apart from one another along the edge and connecting the plurality of gate trench portions to the gate wiring, respectively; an emitter electrode provided above the upper surface of the semiconductor substrate in the active portion; Further comprising: In a depth direction of the semiconductor substrate, a lower surface of the gate wiring is farther from the upper surface of the semiconductor substrate than a lower surface of the gate polysilicon, over the entire upper surface of the semiconductor substrate; The gate polysilicon is connected to the gate trench portion on the outer side of the emitter electrode in the extension direction. Semiconductor device.

4. A semiconductor device comprising a semiconductor substrate, The semiconductor substrate is An active portion; a plurality of gate trench portions provided in the active portion on the upper surface of the semiconductor substrate and extending along an extension direction; A plurality of dummy trench portions extending along the extension direction; having a gate wiring provided between the active portion and an edge of the semiconductor substrate; a plurality of gate polysilicon layers disposed apart from one another along the edge and connecting the plurality of gate trench portions to the gate wiring, respectively; an emitter electrode provided above the upper surface of the semiconductor substrate in the active portion and connected to the dummy trench portion; Further comprising: In a depth direction of the semiconductor substrate, a lower surface of the gate wiring is farther from the upper surface of the semiconductor substrate than a lower surface of the gate polysilicon, over the entire upper surface of the semiconductor substrate; When viewed from above, the gate polysilicon does not overlap the dummy trench portion. Semiconductor device.

5. A semiconductor device comprising a semiconductor substrate, The semiconductor substrate is An active portion; a plurality of gate trench portions provided in the active portion on the upper surface of the semiconductor substrate and extending along an extension direction; having a gate wiring provided between the active portion and an edge of the semiconductor substrate; a plurality of gate polysilicon layers arranged apart from one another along the edge and connecting the plurality of gate trench portions to the gate wiring, respectively; Further comprising: In a depth direction of the semiconductor substrate, a lower surface of the gate wiring is farther from the upper surface of the semiconductor substrate than a lower surface of the gate polysilicon, over the entire upper surface of the semiconductor substrate; At least one of the plurality of gate trench portions is connected to one of the plurality of gate polysilicon portions; At least one of the gate trench portions has Two straight line portions extending along the extension direction; a tip portion connecting the two straight portions; having a width of the gate trench portion including the two straight line portions in an arrangement direction perpendicular to the extension direction is larger than a width of the gate polysilicon connected to the gate trench portion in the arrangement direction; The gate polysilicon is connected to the tip of the gate trench portion. Semiconductor device.

6. A semiconductor device comprising a semiconductor substrate, The semiconductor substrate is An active portion; a plurality of gate trench portions provided in the active portion on the upper surface of the semiconductor substrate and extending along an extension direction; having a gate wiring provided between the active portion and an edge of the semiconductor substrate; a plurality of gate polysilicon layers arranged apart from one another along the edge and connecting the plurality of gate trench portions to the gate wiring, respectively; Further comprising: In a depth direction of the semiconductor substrate, a lower surface of the gate wiring is farther from the upper surface of the semiconductor substrate than a lower surface of the gate polysilicon, over the entire upper surface of the semiconductor substrate; At least one of the plurality of gate trench portions is connected to one of the plurality of gate polysilicon portions; At least one of the gate trench portions has a straight portion extending along the extension direction, The width of the linear portion of the gate trench portion in an arrangement direction perpendicular to the extension direction is greater than the width of the gate polysilicon connected to the gate trench portion in the arrangement direction. Semiconductor device.

7. A semiconductor device comprising a semiconductor substrate, The semiconductor substrate is An active portion; a plurality of gate trench portions provided in the active portion on the upper surface of the semiconductor substrate and extending along an extension direction; having a gate wiring provided between the active portion and an edge of the semiconductor substrate; a plurality of gate polysilicon layers arranged apart from one another along the edge and connecting the plurality of gate trench portions to the gate wiring, respectively; Further comprising: In a depth direction of the semiconductor substrate, a lower surface of the gate wiring is farther from the upper surface of the semiconductor substrate than a lower surface of the gate polysilicon, over the entire upper surface of the semiconductor substrate; At least one of the plurality of gate trench portions is connected to one of the plurality of gate polysilicon portions; At least a portion of the gate trench portion is provided extending to below the gate wiring, The gate polysilicon is provided between the gate trench portion and the gate wiring in the depth direction. Semiconductor device.

8. A semiconductor device comprising a semiconductor substrate, The semiconductor substrate is An active portion; a plurality of gate trench portions provided in the active portion on the upper surface of the semiconductor substrate and extending along an extension direction; having a gate wiring provided between the active portion and an edge of the semiconductor substrate; a plurality of gate polysilicon layers arranged apart from one another along the edge and connecting the plurality of gate trench portions to the gate wiring, respectively; Further comprising: In a depth direction of the semiconductor substrate, a lower surface of the gate wiring is farther from the upper surface of the semiconductor substrate than a lower surface of the gate polysilicon, over the entire upper surface of the semiconductor substrate; At least one of the plurality of gate trench portions is connected to one of the plurality of gate polysilicon portions; At least two of the longitudinal directions of the gate polysilicon have different angles with respect to the extension direction. Semiconductor device.

9. A semiconductor device comprising a semiconductor substrate, The semiconductor substrate is An active portion; a plurality of gate trench portions provided in the active portion on the upper surface of the semiconductor substrate and extending along an extension direction; having a gate wiring provided between the active portion and an edge of the semiconductor substrate; a plurality of gate polysilicon layers arranged apart from one another along the edge and connecting the plurality of gate trench portions to the gate wiring, respectively; Further comprising: In a depth direction of the semiconductor substrate, a lower surface of the gate wiring is farther from the upper surface of the semiconductor substrate than a lower surface of the gate polysilicon, over the entire upper surface of the semiconductor substrate; At least one of the plurality of gate trench portions is connected to one of the plurality of gate polysilicon portions; The semiconductor substrate is Two first end sides perpendicular to the extension direction; Two second end sides parallel to the extension direction; having The gate wiring is a first wiring provided between the first end side and the active portion; a second wiring provided between the second end side and the active portion; a curved portion connecting the first wiring and the second wiring; having At least a portion of the gate trench portion is provided to extend below the curved portion of the gate wiring, At least one of the gate polysilicon layers is provided between the gate trench portion and the curved portion in a depth direction, At least one of the gate polysilicon has a longitudinal direction in a direction from the first wiring of the gate wiring toward the gate trench portion. Semiconductor device.

10. At least one of the plurality of gate trench portions is connected to one of the plurality of gate polysilicon portions. The semiconductor device according to claim 1 .

11. The gate polysilicon is provided discretely along the direction in which the gate wiring extends. The semiconductor device according to claim 5 , wherein the first insulating layer is a first insulating layer.

12. The semiconductor substrate is Two first end sides perpendicular to the extension direction; Two second end sides parallel to the extension direction; having The gate wiring is a first wiring provided between the first end side and the active portion; a second wiring provided between the second end side and the active portion; having The gate polysilicon is provided below the first wiring, Not provided below the second wiring The semiconductor device according to claim 5 , 8 , 10 or 11 .

13. The gate polysilicon has a longitudinal direction in a direction from the gate wiring toward the gate trench portion.

11. The semiconductor device according to claim 5, 6, 8 or 10.

14. The gate polysilicon has a longitudinal direction in the extension direction. The semiconductor device according to claim 13.

15. The semiconductor substrate is Two first end sides perpendicular to the extension direction; Two second end sides parallel to the extension direction; having The gate wiring is a first wiring provided between the first end side and the active portion; a second wiring provided between the second end side and the active portion; a curved portion connecting the first wiring and the second wiring; having A longitudinal direction of the gate polysilicon connected to the first wiring is different from a longitudinal direction of the gate polysilicon connected to the curved portion. The semiconductor device according to claim 8.

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