Injection molding machine

Abstract

To provide a technology that enables a receive side to obtain correct data in a control system that includes an injection molding machine and other device.SOLUTION: An injection molding machine 1 as one embodiment of the present disclosure is equipped with a mold clamping device 100, an injection device 300, and an ejector device 200. Specifically, the mold clamping device 100 clamps a mold device 10. The injection device 300 fills a molding material into the mold device 10 clamped by the mold clamping device 100. The ejector device 200 removes a molded product from the mold device 10 after the molding material filled by the injection device 300 has cooled and solidified. The injection molding machine 1 transmits the same data multiple times to a receive side by a send side, at least one between internal devices and the other between its own device and an external device.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present disclosure relates to injection molding Machine Regarding. [Background technology]

[0002] Traditionally, in a control system, communication occurs between multiple components.

[0003] For example, in industrial machines such as injection molding machines, data output by various sensors is transmitted to a controller, and the data received by the controller is used to control molding operations and the like (see Patent Document 1, etc.). [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2017-105136 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, for example, if an error occurs in the data of a communication frame due to noise, the receiving side may not be able to obtain correct data. Therefore, for example, if the shaping operation is controlled based on that data, it may not be possible to realize an appropriate shaping operation.

[0006] In view of the above problem, an object of the present invention is to provide a technique that enables a receiving side to obtain correct data in a control system that includes an injection molding machine or the like. [Means for solving the problem]

[0007] In order to achieve the above object, in one embodiment of the present disclosure, a mold clamping device that clamps the mold device; an injection unit that fills the mold unit clamped by the mold clamping unit with a molding material; an ejector device that removes a molded product from the mold device after the molding material filled by the injection device is cooled and solidified, At least one of the two communication methods between internal devices and between the device itself and an external device, the sending side communicates with the receiving side, A first operating state in which data is transmitted once and the same data is retransmitted when a communication error occurs, and a second operating state in which the data is transmitted once and the same data is retransmitted when a communication error occurs, until a response regarding reception of the data is received from the receiving side, regardless of the presence or absence of a communication error, Sending the same data multiple times and a second operating state. , An injection molding machine is provided. Effect of the Invention

[0009] According to the above-described embodiment, in a control system including an injection molding machine or the like, the receiving side can obtain correct data. [Brief description of the drawings]

[0010] [Figure 1] FIG. 1 is a diagram illustrating an example of a configuration of an injection molding machine management system including an injection molding machine. [Diagram 2] FIG. 1 is a diagram illustrating an example of a configuration of an injection molding machine management system including an injection molding machine. [Diagram 3] FIG. 2 is a diagram illustrating an example of a configuration regarding internal communication of an injection molding machine. [Figure 4] FIG. 2 is a diagram illustrating an example of a first communication mode related to internal communication of the controller. [Diagram 5] FIG. 2 is a diagram illustrating an example of a first communication mode related to internal communication of the controller. [Figure 6] FIG. 11 is a diagram illustrating an example of a second communication mode related to internal communication of the controller. [Figure 7] FIG. 11 is a diagram illustrating an example of a second communication mode related to internal communication of the controller. [Figure 8] 11A to 11C are diagrams illustrating another example of the second communication mode regarding internal communication of the controller. [Figure 9] 11A to 11C are diagrams illustrating another example of the second communication mode regarding internal communication of the controller. [Figure 10] 11 is a flowchart illustrating an example of a communication mode switching process by an FPGA. [Figure 11] 11 is a flowchart illustrating an example of a process related to internal communication in a first communication mode by the FPGA. [Figure 12] 11 is a flowchart illustrating an example of a process related to internal communication in a second communication mode by the FPGA. [Figure 13] 10 is a flowchart illustrating an example of a process related to internal communication by a CPU. [Figure 14] 13 is a flowchart illustrating an outline of another example of a communication mode selection process by the FPGA. [Figure 15] 13 is a flowchart illustrating an outline of yet another example of a communication mode selection process by the FPGA. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment will be described with reference to the drawings.

[0012] [Outline of the injection molding machine management system] First, an outline of an injection molding machine management system SYS according to this embodiment will be described with reference to FIGS.

[0013] Figures 1 and 2 are diagrams showing an example of an injection molding machine management system according to this embodiment. Specifically, Figure 1 shows a side cross-sectional view illustrating a state of the injection molding machine 1 when mold opening is completed, and Figure 2 shows a side cross-sectional view illustrating a state of the injection molding machine 1 when mold clamping is performed. As shown in Figures 1 and 2, the X-axis, Y-axis, and Z-axis are perpendicular to each other, the positive and negative directions of the X-axis (hereinafter simply referred to as the "X direction") and the positive and negative directions of the Y-axis (hereinafter simply referred to as the "Y direction") represent the horizontal direction, and the positive and negative directions of the Z-axis (hereinafter simply referred to as the "Z direction") represent the vertical direction.

[0014] The injection molding machine management system SYS includes a plurality of injection molding machines 1 (three in this example) and a management device 2.

[0015] The injection molding machine management system SYS may include only one injection molding machine 1.

[0016] <Injection molding machine> The injection molding machine 1 performs a series of operations to obtain a molded product.

[0017] Moreover, the injection molding machine 1 is communicably connected to a management device 2 through a predetermined communication line NW. Moreover, the injection molding machine 1 may be communicably connected to another injection molding machine 1 through the communication line NW.

[0018] The communication line NW may include, for example, a local network (LAN) of the facility (factory) in which the injection molding machine 1 is installed. The local network may be constructed as a wired network, may be constructed as a wireless network, or may be constructed in a form including both. The communication line NW may also include a wide area network (WAN) outside the facility (factory) in which the injection molding machine 1 is installed. The wide area network may include, for example, a mobile communication network with a base station as its terminal. The mobile communication network may include, for example, 4G (4G) including LTE (Long Term Evolution). th Generation) and 5G (5 th The wide area network may be compatible with a standard such as a LTE Generation. The wide area network may also include, for example, a satellite communication network that uses a communication satellite. The wide area network may also include, for example, the Internet. The communication line NW may also include, for example, a short-distance communication line compatible with a wireless communication standard such as Bluetooth (registered trademark) communication or WiFi communication.

[0019] For example, the injection molding machine 1 transmits (uploads) data on the operating state of the injection molding machine 1 (hereinafter, "operating state data") and data on the production state (hereinafter, "production state data") to the management device 2 through the communication line NW. The data on the operating state may include, for example, measurement data and control data on the operating state (e.g., position, speed, angular velocity, acceleration, etc.) of the driven parts of the injection molding machine 1. The data on the operating state may include, for example, measurement data and control data on the operating state (e.g., current, voltage, etc.) of the electric drive part of the injection molding machine 1. The data on the operating state may include, for example, measurement data and control data on the operating state (e.g., pressure of hydraulic oil, etc.) of the hydraulic drive part. The data on the operating state may include, for example, data on the temperature state of a predetermined part of the injection molding machine 1. As a result, the management device 2 can grasp the operating state automatically or manually in response to an input by a manager or an operator, and manage the timing of maintenance of the injection molding machine 1, the operating schedule of the injection molding machine 1, etc. The data on the production status also includes, for example, data on the number of molded products produced (number of shots) from a given point in time. This allows the management device 2 to grasp the production status of molded products produced by the injection molding machine 1.

[0020] Also, for example, the injection molding machine 1, as a master machine, may monitor and control the operation of another injection molding machine 1 as a slave machine through the communication line NW. Specifically, the injection molding machine 1 (slave machine) may transmit operation status data to the injection molding machine 1 (master machine) through the communication line NW. This allows the injection molding machine 1 (master machine) to monitor the operation of the other injection molding machine 1 (slave machine). Also, the injection molding machine 1 (master machine) may transmit a control command regarding the operation to the other injection molding machine 1 (slave machine) through the communication line NW while grasping the operation status of the other injection molding machine 1 (slave machine) based on the operation status data. This allows the injection molding machine 1 (master machine) to control the operation of the other injection molding machine 1 (slave machine).

[0021] <Management device> A management device 2 (an example of an external device) is communicatively connected to the injection molding machine 1 via a communication line NW.

[0022] The management device 2 is, for example, a cloud server installed in a remote location such as a management center outside the factory where the injection molding machine 1 is installed. The management device 2 may also be, for example, an edge server installed inside the factory where the injection molding machine 1 is installed or in a location relatively close to the factory (for example, a wireless base station or station building near the factory). The management device 2 may also be a management terminal device in the factory where the injection molding machine 1 is installed. The management terminal device may be, for example, a stationary terminal device such as a desktop computer terminal. The management terminal device may also be, for example, a portable terminal device that can be carried by a user such as the manager of the injection molding machine 1. The portable terminal device may include, for example, a smartphone, a tablet terminal, a laptop computer terminal, or the like.

[0023] For example, the management device 2 may grasp the operating state of the injection molding machine 1 based on operating state data transmitted (uploaded) from the injection molding machine 1, and manage the operating state of the injection molding machine 1. Furthermore, the management device 2 may perform various diagnoses, such as abnormality diagnosis, of the injection molding machine 1, based on the operating state of the injection molding machine 1 grasped based on the operating state data.

[0024] Furthermore, the management device 2 may manage the production status of the injection molding machine 1, for example, based on production status data transmitted (uploaded) from the injection molding machine 1.

[0025] Also, for example, the management device 2 may transmit a control signal including control information (for example, information related to various setting conditions) for the injection molding machine 1 through the communication line NW. In this way, the management device 2 can control the operation of the injection molding machine 1.

[0026] [Injection molding machine configuration] Next, the configuration of the injection molding machine will be described with reference to FIGS.

[0027] As shown in FIGS. 1 and 2, the injection molding machine 1 includes a mold clamping device 100, an ejector device 200, an injection device 300, a moving device 400, and a controller 700.

[0028] <<Mold clamping device>> The mold clamping device 100 performs mold closing, mold clamping, and mold opening of the mold device 10. The mold clamping device 100 is, for example, a horizontal type, and the mold opening and closing direction is horizontal. The mold clamping device 100 has a fixed platen 110, a movable platen 120, a toggle support 130, a tie bar 140, a toggle mechanism 150, a mold clamping motor 160, a motion conversion mechanism 170, and a mold thickness adjustment mechanism 180.

[0029] In the following description of the mold clamping device 100, the direction in which the movable platen 120 moves when the mold is closed (to the right in Figures 1 and 2) is defined as the front, and the direction in which the movable platen 120 moves when the mold is opened (to the left in Figures 1 and 2) is defined as the rear.

[0030] The stationary platen 110 is fixed to the frame Fr. The stationary mold 11 is attached to the surface of the stationary platen 110 that faces the movable platen 120.

[0031] The movable platen 120 is movable relative to the frame Fr in the mold opening / closing direction. A guide 101 is disposed on the frame Fr to guide the movable platen 120. The movable mold 12 is attached to the surface of the movable platen 120 facing the fixed platen 110.

[0032] The movable platen 120 is advanced or retreated relative to the fixed platen 110 to perform mold closing, mold clamping, and mold opening.

[0033] The mold device 10 includes a fixed mold 11 corresponding to a fixed platen 110 and a movable mold 12 corresponding to a movable platen 120 .

[0034] The toggle support 130 is connected to the fixed platen 110 at a predetermined distance L, and is placed on the frame Fr so as to be movable in the mold opening and closing direction. The toggle support 130 may be movable along a guide laid on the frame Fr, for example. In this case, the guide of the toggle support 130 may be common to the guide 101 of the movable platen 120.

[0035] Although the fixed platen 110 is fixed to the frame Fr and the toggle support 130 is movable relative to the frame Fr in the mold opening / closing direction, the toggle support 130 may be fixed to the frame Fr and the fixed platen 110 may be movable relative to the frame Fr in the mold opening / closing direction.

[0036] The tie bar 140 connects the fixed platen 110 and the toggle support 130 at an interval L in the mold opening / closing direction. A plurality of tie bars 140 (for example, four) may be used. Each tie bar 140 is parallel to the mold opening / closing direction and extends according to the mold clamping force. At least one tie bar 140 is provided with a tie bar strain detector 141 that detects strain of the tie bar 140. The tie bar strain detector 141 is, for example, a strain gauge. The tie bar strain detector 141 sends a signal indicating the detection result to the controller 700. The detection result of the tie bar strain detector 141 is used, for example, to detect the mold clamping force.

[0037] Any clamping force detector that can be used to detect the clamping force may be used instead of or in addition to the tie bar strain detector 141. For example, the clamping force detector is not limited to the strain gauge type, but may be a piezoelectric type, a capacitive type, a hydraulic type, an electromagnetic type, or the like, and the attachment position thereof is not limited to the tie bar 140.

[0038] The toggle mechanism 150 is disposed between the movable platen 120 and the toggle support 130, and moves the movable platen 120 in the mold opening / closing direction relative to the toggle support 130. The toggle mechanism 150 is composed of a crosshead 151, a pair of link groups, etc. Each link group has a first link 152 and a second link 153 that are connected to bendable and extendable by a pin or the like. The first link 152 is attached to the movable platen 120 by a pin or the like so as to be swingable, and the second link 153 is attached to the toggle support 130 by a pin or the like so as to be swingable. The second link 153 is attached to the crosshead 151 via a third link 154. When the crosshead 151 is advanced or retreated relative to the toggle support 130, the first link 152 and the second link 153 are bent or retreated, and the movable platen 120 advances or retreats relative to the toggle support 130.

[0039] The configuration of the toggle mechanism 150 is not limited to the configuration shown in Figures 1 and 2. For example, although the number of joints in each link group is five in Figures 1 and 2, it may be four, and one end of the third link 154 may be connected to a joint between the first link 152 and the second link 153.

[0040] The mold clamping motor 160 is attached to the toggle support 130 and operates the toggle mechanism 150. The mold clamping motor 160 moves the crosshead 151 forward and backward relative to the toggle support 130, thereby bending and extending the first link 152 and the second link 153 and moving the movable platen 120 forward and backward relative to the toggle support 130. The mold clamping motor 160 is directly connected to the motion conversion mechanism 170, but may also be connected to the motion conversion mechanism 170 via a belt, a pulley, or the like.

[0041] The motion conversion mechanism 170 converts the rotational motion of the mold clamping motor 160 into the linear motion of the crosshead 151. The motion conversion mechanism 170 includes a screw shaft 171 and a screw nut 172 that screws onto the screw shaft 171. A ball or a roller may be interposed between the screw shaft 171 and the screw nut 172.

[0042] The mold clamping device 100 performs a mold closing process, a mold clamping process, a mold opening process, and the like under the control of a controller 700 .

[0043] In the mold closing process, the mold clamping motor 160 is driven to advance the crosshead 151 to a mold closing completion position at a set speed, thereby advancing the movable platen 120 and bringing the movable mold 12 into contact with the fixed mold 11. The position and speed of the crosshead 151 are detected, for example, by using a mold clamping motor encoder 161. The mold clamping motor encoder 161 detects the rotation of the mold clamping motor 160 and sends a signal indicating the detection result to the controller 700.

[0044] Incidentally, the crosshead position detector that detects the position of the crosshead 151 and the crosshead speed detector that detects the speed of the crosshead 151 are not limited to the mold clamping motor encoder 161, and general types can be used. Also, the movable platen position detector that detects the position of the movable platen 120 and the movable platen speed detector that detects the speed of the movable platen 120 are not limited to the mold clamping motor encoder 161, and general types can be used.

[0045] In the mold clamping process, the mold clamping motor 160 is further driven to move the crosshead 151 further forward from the mold closing completion position to the mold clamping position, thereby generating a mold clamping force. During mold clamping, a cavity space 14 is formed between the movable mold 12 and the fixed mold 11, and the injection device 300 fills the cavity space 14 with liquid molding material. A molded product is obtained by solidifying the filled molding material. There may be multiple cavity spaces 14, in which case multiple molded products are obtained at the same time.

[0046] In the mold opening process, the mold clamping motor 160 is driven to move the crosshead 151 backward at a set speed to a mold opening completion position, thereby moving the movable platen 120 backward and separating the movable mold 12 from the fixed mold 11. After that, the ejector unit 200 ejects the molded product from the movable mold 12.

[0047] The setting conditions in the mold closing process and the mold clamping process are set together as a series of setting conditions. For example, the speed and position of the crosshead 151 in the mold closing process and the mold clamping process (including the mold closing start position, the speed switching position, the mold closing completion position, and the mold clamping position), the mold clamping force, etc. are set together as a series of setting conditions. The mold closing start position, the speed switching position, the mold closing completion position, and the mold clamping position are arranged in this order from the rear side to the front, and represent the start and end points of the section in which the speed is set. The speed is set for each section. There may be one or more speed switching positions. The speed switching position does not have to be set. Only one of the mold clamping position and the mold clamping force may be set.

[0048] The setting conditions for the mold opening process are also set in a similar manner. For example, the speed and position of the crosshead 151 in the mold opening process (including the mold opening start position, the speed switching position, and the mold opening completion position) are set together as a series of setting conditions. The mold opening start position, the speed switching position, and the mold opening completion position are arranged in this order from the front to the rear, and represent the start and end points of the section in which the speed is set. The speed is set for each section. There may be one or more speed switching positions. The speed switching position does not have to be set. The mold opening start position and the mold clamping position may be the same position. Furthermore, the mold opening completion position and the mold closing start position may be the same position.

[0049] Note that the speed, position, etc. of the movable platen 120 may be set instead of the speed, position, etc. of the crosshead 151. Also, the clamping force may be set instead of the position of the crosshead (e.g., clamping position) or the position of the movable platen.

[0050] The toggle mechanism 150 amplifies the driving force of the mold clamping motor 160 and transmits it to the movable platen 120. The amplification ratio is also called the toggle ratio. The toggle ratio changes according to the angle θ between the first link 152 and the second link 153 (hereinafter referred to as the "link angle"). The link angle θ is determined from the position of the crosshead 151. When the link angle θ is 180°, the toggle ratio is maximum.

[0051] When the thickness of the mold device 10 changes due to replacement of the mold device 10 or a change in temperature of the mold device 10, the mold thickness is adjusted so that a predetermined clamping force is obtained during mold clamping. In the mold thickness adjustment, for example, the distance L between the fixed platen 110 and the toggle support 130 is adjusted so that the link angle θ of the toggle mechanism 150 becomes a predetermined angle at the time of mold touch when the movable mold 12 touches the fixed mold 11.

[0052] The mold clamping device 100 has a mold thickness adjustment mechanism 180 that adjusts the mold thickness by adjusting the distance L between the fixed platen 110 and the toggle support 130. The mold thickness adjustment mechanism 180 has a screw shaft 181 formed at the rear end of the tie bar 140, a screw nut 182 rotatably held by the toggle support 130, and a mold thickness adjustment motor 183 that rotates the screw nut 182 screwed onto the screw shaft 181.

[0053] The screw shaft 181 and the screw nut 182 are provided for each tie bar 140. The rotation of the mold thickness adjustment motor 183 may be transmitted to the multiple screw nuts 182 via a rotation transmission unit 185. The multiple screw nuts 182 can rotate synchronously.

[0054] In addition, by changing the transmission path of the rotation transmission unit 185, it is also possible to rotate the multiple screw nuts 182 individually.

[0055] The rotation transmission unit 185 is composed of, for example, gears, etc. In this case, a passive gear is formed on the outer periphery of each screw nut 182, a drive gear is attached to the output shaft of the mold thickness adjustment motor 183, and an intermediate gear that meshes with the multiple passive gears and the drive gear is rotatably held in the center of the toggle support 130.

[0056] The rotation transmission unit 185 may be configured with a belt, a pulley, or the like, instead of the gears.

[0057] The operation of the mold thickness adjustment mechanism 180 is controlled by a controller 700. The controller 700 drives the mold thickness adjustment motor 183 to rotate the screw nut 182, thereby adjusting the position of the toggle support 130, which rotatably holds the screw nut 182, relative to the fixed platen 110, and adjusting the distance L between the fixed platen 110 and the toggle support 130.

[0058] The distance L is detected using a mold thickness adjustment motor encoder 184. The mold thickness adjustment motor encoder 184 detects the amount of rotation and the direction of rotation of the mold thickness adjustment motor 183, and sends a signal indicating the detection result to the controller 700. The detection result of the mold thickness adjustment motor encoder 184 is used to monitor and control the position of the toggle support 130 and the distance L.

[0059] Incidentally, the toggle support position detector that detects the position of the toggle support 130 and the gap detector that detects the gap L are not limited to the mold thickness adjustment motor encoder 184, and general detectors may be used.

[0060] The mold thickness adjustment mechanism 180 adjusts the gap L by rotating one of a screw shaft 181 and a screw nut 182 that are screwed together. A plurality of mold thickness adjustment mechanisms 180 may be used, and a plurality of mold thickness adjustment motors 183 may be used.

[0061] Incidentally, the mold clamping unit 100 of this embodiment is of a horizontal type in which the mold opening and closing direction is horizontal, but it may be of a vertical type in which the mold opening and closing direction is vertical.

[0062] Furthermore, the clamping apparatus 100 of the present embodiment has a clamping motor 160 as a drive source, but may have a hydraulic cylinder instead of the clamping motor 160. Furthermore, the clamping apparatus 100 may have a linear motor for opening and closing the mold, and an electromagnet for clamping the mold.

[0063] <<Ejector device>> The ejector device 200 ejects a molded product from the mold device 10. The ejector device 200 includes an ejector motor 210, a motion conversion mechanism 220, an ejector rod 230, and the like.

[0064] In the following description of the ejector unit 200, similar to the description of the mold clamping unit 100, the direction of movement of the movable platen 120 when the mold is closed (to the right in Figures 1 and 2) is defined as the front, and the direction of movement of the movable platen 120 when the mold is opened (to the left in Figures 1 and 2) is defined as the rear.

[0065] The ejector motor 210 is attached to the movable platen 120. The ejector motor 210 is directly connected to the motion conversion mechanism 220, but may be connected to the motion conversion mechanism 220 via a belt, a pulley, or the like.

[0066] The motion conversion mechanism 220 converts the rotational motion of the ejector motor 210 into the linear motion of the ejector rod 230. The motion conversion mechanism 220 includes a screw shaft and a screw nut that screws onto the screw shaft. A ball or a roller may be interposed between the screw shaft and the screw nut.

[0067] The ejector rod 230 is movable forward and backward in a through hole of the movable platen 120. The front end of the ejector rod 230 contacts the movable member 15 disposed inside the movable mold 12 so as to be movable forward and backward. The front end of the ejector rod 230 may or may not be connected to the movable member 15.

[0068] The ejector device 200 performs the ejection process under the control of the controller 700 .

[0069] In the ejection process, the ejector motor 210 is driven to advance the ejector rod 230 from the standby position to the ejection position at a set speed, thereby advancing the movable member 15 and ejecting the molded product. Thereafter, the ejector motor 210 is driven to retreat the ejector rod 230 at a set speed, and the movable member 15 is retreated to its original standby position. The position and speed of the ejector rod 230 are detected, for example, by using an ejector motor encoder 211. The ejector motor encoder 211 detects the rotation of the ejector motor 210 and sends a signal indicating the detection result to the controller 700.

[0070] Incidentally, the ejector rod position detector that detects the position of the ejector rod 230 and the ejector rod speed detector that detects the speed of the ejector rod 230 are not limited to the ejector motor encoder 211, and general detectors may be used.

[0071] <<Injection device>> The injection device 300 is mounted on a slide base 301 which is movable forward and backward with respect to the frame Fr, and is movable forward and backward with respect to the mold device 10. The injection device 300 touches the mold device 10 and fills the cavity space 14 in the mold device 10 with molding material. The injection device 300 has, for example, a cylinder 310, a nozzle 320, a screw 330, a metering motor 340, an injection motor 350, and a pressure detector 360.

[0072] In the following description of the injection device 300, the direction in which the injection device 300 is brought closer to the mold device 10 (leftward in Figures 1 and 2) is defined as the front, and the direction in which the injection device 300 is brought away from the mold device 10 (rightward in Figures 1 and 2) is defined as the rear.

[0073] Cylinder 310 heats the molding material supplied to the inside from supply port 311. The molding material includes, for example, resin. The molding material is formed, for example, in the form of pellets, and is supplied to supply port 311 in a solid state. Supply port 311 is formed at the rear of cylinder 310. A cooler 312 such as a water-cooled cylinder is provided on the outer periphery of the rear of cylinder 310. A heater 313 such as a band heater and a temperature detector 314 are provided on the outer periphery of cylinder 310 forward of cooler 312.

[0074] The cylinder 310 is divided into a plurality of zones in the axial direction of the cylinder 310 (the left-right direction in Figs. 1 and 2). Each zone is provided with a heater 313 and a temperature detector 314. For each zone, the controller 700 controls the heater 313 so that the temperature detected by the temperature detector 314 becomes the set temperature.

[0075] The nozzle 320 is provided at the front end of the cylinder 310 and is pressed against the mold device 10. A heater 313 and a temperature detector 314 are provided on the outer periphery of the nozzle 320. A controller 700 controls the heater 313 so that the detected temperature of the nozzle 320 becomes the set temperature.

[0076] The screw 330 is disposed in the cylinder 310 so as to be rotatable and movable forward and backward. When the screw 330 is rotated, the molding material is sent forward along the spiral groove of the screw 330. As the molding material is sent forward, it is gradually melted by heat from the cylinder 310. As the liquid molding material is sent forward of the screw 330 and accumulates in the front part of the cylinder 310, the screw 330 is moved backward. Thereafter, when the screw 330 is moved forward, the liquid molding material accumulated in front of the screw 330 is injected from the nozzle 320 and filled into the mold device 10.

[0077] A check ring 331 is attached to the front of the screw 330 so as to be movable back and forth as a check valve for preventing the backflow of molding material from the front to the rear of the screw 330 when the screw 330 is pushed forward.

[0078] When the screw 330 is moved forward, the backflow prevention ring 331 is pushed backward by the pressure of the molding material in front of the screw 330, and moves backward relatively to the screw 330 to a blocking position (see FIG. 2) where the flow path of the molding material is blocked. This prevents the molding material accumulated in front of the screw 330 from flowing backward.

[0079] On the other hand, when the screw 330 is rotated, the backflow prevention ring 331 is pushed forward by the pressure of the molding material sent forward along the spiral groove of the screw 330, and moves forward relatively to the screw 330 to an open position (see FIG. 1) where the flow path of the molding material is opened. As a result, the molding material is sent forward of the screw 330.

[0080] The backflow prevention ring 331 may be either a co-rotating type that rotates together with the screw 330 or a non-co-rotating type that does not rotate together with the screw 330.

[0081] The injection device 300 may have a drive source for moving the backflow prevention ring 331 back and forth between the open position and the closed position relative to the screw 330.

[0082] The metering motor 340 rotates the screw 330. The drive source for rotating the screw 330 is not limited to the metering motor 340, and may be, for example, a hydraulic pump or the like.

[0083] The injection motor 350 advances and retreats the screw 330. A motion conversion mechanism that converts the rotational motion of the injection motor 350 into the linear motion of the screw 330 is provided between the injection motor 350 and the screw 330. The motion conversion mechanism has, for example, a screw shaft and a screw nut that screws onto the screw shaft. A ball, a roller, or the like may be provided between the screw shaft and the screw nut. The drive source that advances and retreats the screw 330 is not limited to the injection motor 350, and may be, for example, a hydraulic cylinder, or the like.

[0084] The pressure detector 360 detects the pressure transmitted between the injection motor 350 and the screw 330. The pressure detector 360 is provided on a force transmission path between the injection motor 350 and the screw 330, and detects the pressure acting on the pressure detector 360.

[0085] The pressure detector 360 sends a signal indicating the detection result to the controller 700. The detection result of the pressure detector 360 is used to control and monitor the pressure that the screw 330 receives from the molding material, the back pressure on the screw 330, the pressure that the screw 330 exerts on the molding material, etc.

[0086] The injection device 300 performs a measuring process, a filling process, a pressure holding process, and the like under the control of the controller 700.

[0087] In the metering process, the metering motor 340 is driven to rotate the screw 330 at a set rotation speed, and the molding material is sent forward along the spiral groove of the screw 330. As a result, the molding material is gradually melted. As the liquid molding material is sent forward of the screw 330 and accumulates at the front of the cylinder 310, the screw 330 is moved backward. The rotation speed of the screw 330 is detected, for example, by using a metering motor encoder 341. The metering motor encoder 341 detects the rotation of the metering motor 340 and sends a signal indicating the detection result to the controller 700.

[0088] Incidentally, the screw rotation speed detector for detecting the rotation speed of the screw 330 is not limited to the metering motor encoder 341, and a general one can be used.

[0089] In the metering process, in order to restrict abrupt retraction of the screw 330, the injection motor 350 may be driven to apply a set back pressure to the screw 330. The back pressure on the screw 330 is detected, for example, by a pressure detector 360. The pressure detector 360 sends a signal indicating the detection result to the controller 700. When the screw 330 retracts to the metering completion position and a predetermined amount of molding material is accumulated in front of the screw 330, the metering process is completed.

[0090] In the filling step, the injection motor 350 is driven to advance the screw 330 at a set speed, and the liquid molding material accumulated in front of the screw 330 is filled into the cavity space 14 in the mold device 10. The position and speed of the screw 330 are detected, for example, by using an injection motor encoder 351. The injection motor encoder 351 detects the rotation of the injection motor 350 and sends a signal indicating the detection result to the controller 700. When the position of the screw 330 reaches a set position, switching from the filling step to the pressure holding step (so-called V / P switching) is performed. The position at which the V / P switching is performed is also referred to as a V / P switching position. The set speed of the screw 330 may be changed depending on the position of the screw 330, time, etc.

[0091] After the position of the screw 330 reaches a set position in the filling process, the screw 330 may be temporarily stopped at the set position, and then the V / P switching may be performed. Immediately before the V / P switching, instead of stopping the screw 330, the screw 330 may be moved forward or backward at a slow speed. Furthermore, the screw position detector that detects the position of the screw 330 and the screw speed detector that detects the speed of the screw 330 are not limited to the injection motor encoder 351, and general detectors may be used.

[0092] In the pressure holding step, the injection motor 350 is driven to push the screw 330 forward, and the pressure of the molding material at the front end of the screw 330 (hereinafter also referred to as "holding pressure") is maintained at a set pressure, and the molding material remaining in the cylinder 310 is pushed toward the mold device 10. This makes it possible to replenish the molding material that is insufficient due to cooling contraction in the mold device 10. The holding pressure is detected, for example, by a pressure detector 360. The pressure detector 360 sends a signal indicating the detection result to the controller 700. The set value of the holding pressure may be changed depending on the elapsed time from the start of the pressure holding step, etc.

[0093] In the dwelling process, the molding material in the cavity space 14 in the mold device 10 is gradually cooled, and when the dwelling process is completed, the entrance to the cavity space 14 is blocked by the solidified molding material. This state is called a gate seal, and prevents the molding material from flowing back from the cavity space 14. After the dwelling process, the cooling process is started. In the cooling process, the molding material in the cavity space 14 is solidified. In order to shorten the molding cycle time, a measuring process may be performed during the cooling process.

[0094] The injection device 300 of this embodiment is of an in-line screw type, but may be of a pre-plastication type or the like. A pre-plastication type injection device supplies molding material molten in a plasticization cylinder to an injection cylinder, and injects the molding material from the injection cylinder into a mold device. A screw is disposed in the plasticization cylinder so as to be rotatable or so as to be rotatable and movable forward and backward, and a plunger is disposed in the injection cylinder so as to be movable forward and backward.

[0095] Furthermore, the injection device 300 of this embodiment is a horizontal type in which the axial direction of the cylinder 310 is horizontal, but may be a vertical type in which the axial direction of the cylinder 310 is vertical. A mold clamping device to be combined with the vertical injection device 300 may be either a vertical type or a horizontal type. Similarly, a mold clamping device to be combined with the horizontal injection device 300 may be either a horizontal type or a vertical type.

[0096] <<Mobile device>> The moving device 400 moves the injection device 300 forward and backward relative to the mold device 10. In addition, the moving device 400 presses the nozzle 320 against the mold device 10 to generate a nozzle touch pressure. The moving device 400 has a hydraulic pump 410, a motor 420 as a drive source, a hydraulic cylinder 430 as a hydraulic actuator, and the like.

[0097] In the following description of the moving device 400, similar to the description of the injection device 300, the direction in which the injection device 300 is brought closer to the mold device 10 (leftward in Figures 1 and 2) is defined as the front, and the direction in which the injection device 300 is brought away from the mold device 10 (rightward in Figures 1 and 2) is defined as the rear.

[0098] Although the moving device 400 is disposed on one side of the cylinder 310 of the injection device 300 in FIGS. 1 and 2, it may be disposed on both sides of the cylinder 310, or may be disposed symmetrically with the cylinder 310 as the center.

[0099] The hydraulic pump 410 has a first port 411 and a second port 412. The hydraulic pump 410 is a pump that can rotate in both directions, and by switching the rotation direction of the motor 420, the hydraulic pump 410 draws in hydraulic fluid (e.g., oil) from one of the first port 411 and the second port 412 and discharges it from the other port, thereby generating hydraulic pressure. The hydraulic pump 410 can also draw in hydraulic fluid from a tank and discharge the hydraulic fluid from one of the first port 411 and the second port 412.

[0100] The motor 420 operates the hydraulic pump 410. The motor 420 drives the hydraulic pump 410 with a rotational direction and rotational torque according to a control signal from the controller 700. The motor 420 may be an electric motor or an electric servo motor.

[0101] The hydraulic cylinder 430 has a cylinder body 431, a piston 432, and a piston rod 433. The cylinder body 431 is fixed to the injection device 300. The piston 432 divides the inside of the cylinder body 431 into a front chamber 435 as a first chamber and a rear chamber 436 as a second chamber. The piston rod 433 is fixed to the fixed platen 110.

[0102] A front chamber 435 of the hydraulic cylinder 430 is connected to a first port 411 of the hydraulic pump 410 via a first flow path 401. The hydraulic fluid discharged from the first port 411 is supplied to the front chamber 435 via the first flow path 401, thereby pushing the injection unit 300 forward. The injection unit 300 is moved forward, and the nozzle 320 is pressed against the fixed die 11. The front chamber 435 functions as a pressure chamber that generates a nozzle touch pressure of the nozzle 320 by the pressure of the hydraulic fluid supplied from the hydraulic pump 410.

[0103] On the other hand, the rear chamber 436 of the hydraulic cylinder 430 is connected to the second port 412 of the hydraulic pump 410 via the second flow path 402. The hydraulic fluid discharged from the second port 412 is supplied to the rear chamber 436 of the hydraulic cylinder 430 via the second flow path 402, thereby pushing the injection unit 300 backward. The injection unit 300 is moved backward, and the nozzle 320 is separated from the fixed mold 11.

[0104] The moving device 400 is not limited to a configuration including the hydraulic cylinder 430. For example, instead of the hydraulic cylinder 430, an electric motor and a motion conversion mechanism that converts the rotational motion of the electric motor into the linear motion of the injection device 300 may be used.

[0105] <<Controller>> The controller 700 directly transmits control signals to the clamping unit 100, the ejector unit 200, the injection unit 300, the moving unit 400, and the like, and performs various controls related to the injection molding machine 1.

[0106] The controller 700 may be realized by any hardware or any combination of hardware and software. The controller 700 is mainly configured with a computer having, for example, a CPU (Central Processing Unit) 701, a memory device 702, an auxiliary storage device 703, and an interface device 704 for input / output. The controller 700 performs various controls by making the CPU 701 execute a program installed in the auxiliary storage device 703. The controller 700 also receives external signals and outputs signals to the outside through the interface device 704. For example, the controller 700 is communicably connected to the management device 2 through a communication line NW based on the interface device 704. The controller 700 may also be communicably connected to another injection molding machine 1 (the controller 700 of the other injection molding machine 1) through a communication line NW based on the interface device 704.

[0107] The functions of the controller 700 may be realized by a single controller 700 alone, or may be shared by a plurality of controllers (for example, a higher-level controller 700A and a lower-level controller 700B, etc.) as described below (see FIG. 2).

[0108] The controller 700 causes the injection molding machine 1 to repeatedly perform a mold closing process, a mold clamping process, a mold opening process, etc., to repeatedly manufacture molded products. In addition, the controller 700 causes the injection device 300 to perform a metering process, a filling process, a pressure holding process, etc., during the mold clamping process.

[0109] A series of operations for obtaining a molded product, for example, an operation from the start of a metering process by the injection unit 300 to the start of a metering process by the next injection unit 300, is also called a "shot" or a "molding cycle." The time required for one shot is also called a "molding cycle time."

[0110] One molding cycle is, for example, configured in the following order: a metering process, a mold closing process, a mold clamping process, a filling process, a pressure dwell process, a cooling process, a mold opening process, and an ejection process. This order is the order in which each process starts. The filling process, the pressure dwell process, and the cooling process are performed from the start of the mold clamping process to the end of the mold clamping process. The end of the mold clamping process coincides with the start of the mold opening process.

[0111] In addition, in order to shorten the molding cycle time, a plurality of processes may be performed simultaneously. For example, the metering process may be performed during the cooling process of the previous molding cycle, and in this case, the mold closing process may be performed at the beginning of the molding cycle. The filling process may be started during the mold closing process. The ejection process may be started during the mold opening process. In addition, if an opening / closing valve for opening and closing the flow path of the nozzle 320 of the injection device 300 is provided, the mold opening process may be started during the metering process. This is because even if the mold opening process is started during the metering process, the molding material will not leak from the nozzle 320 as long as the opening / closing valve closes the flow path of the nozzle 320.

[0112] The controller 700 is connected to an operation device 750, a display device 760, and the like.

[0113] The operation device 750 receives operation input from a user regarding the injection molding machine 1, and outputs a signal corresponding to the operation input to the controller 700.

[0114] The display device 760 displays various images under the control of the controller 700 .

[0115] The display device 760 displays, for example, an operation screen related to the injection molding machine 1 in response to an operation input on the operation device 750.

[0116] The operation screen displayed on the display device 760 is used for settings related to the injection molding machine 1. The settings related to the injection molding machine 1 include, for example, settings of molding conditions related to the injection molding machine 1 (specifically, input of set values). The settings also include, for example, settings related to selection of types of detection values ​​of various sensors and the like related to the injection molding machine 1 to be recorded as logging data during molding operations. The settings also include, for example, settings of display specifications (for example, types of actual values ​​to be displayed and display manner, etc.) on the display device 760 of detection values ​​(actual values) of various sensors and the like related to the injection molding machine 1 during molding operations. A plurality of operation screens are prepared, and are switched and displayed on the display device 760, or are displayed overlapping each other. The user can perform settings related to the injection molding machine 1 (including input of set values) and the like by operating the operation device 750 while watching the operation screen displayed on the display device 760.

[0117] Further, under the control of the controller 700, for example, the display device 760 displays an information screen that provides the user with various information corresponding to operations on the operation screen. A plurality of information screens are prepared, and are switched and displayed on the display device 760, or are displayed overlapping each other. For example, the display device 760 displays the setting contents related to the injection molding machine 1 (for example, the setting contents related to the molding conditions of the injection molding machine 1). Also, for example, the display device 760 displays management information (for example, information related to the operation record of the injection molding machine 1, etc.).

[0118] The operation device 750 and the display device 760 may be configured as, for example, a touch panel display and integrated together.

[0119] Although the operation device 750 and the display device 760 in this embodiment are integrated, they may be provided independently. Also, a plurality of operation devices 750 may be provided.

[0120] [Configuration of internal communication of injection molding machine] Next, a configuration regarding internal communication of the injection molding machine 1 will be described with reference to FIG.

[0121] FIG. 3 is a diagram showing an example of a configuration regarding internal communication of the injection molding machine 1. As shown in FIG.

[0122] As shown in FIG. 3, the controller 700 includes a CPU 701 and a field programmable gate array (FPGA) 710.

[0123] The CPU 701 (an example of an internal device) is a processor that, as described above, realizes various functions of the controller 700 by loading various programs installed in the auxiliary storage device 703 into the memory device 702 and executing them.

[0124] The FPGA 710 (an example of an internal device) functions as an interface for input / output between the controller 700 and the sensor 800. That is, the interface device 704 of the controller 700 includes the FPGA 710.

[0125] The FPGA 710 is connected to the sensor 800 via a communication line, receives output data from the sensor 800, and outputs control signals to the sensor 800 under the control of the CPU 701.

[0126] Furthermore, the FPGA 710 is connected to the CPU 701 via a communication line inside the controller 700. The FPGA 710 transmits output data acquired from the sensor 800 to the CPU 701 and receives a control signal to the sensor 800 from the CPU 701, for example.

[0127] The sensor 800 acquires measurement data relating to the operating state and production status of the injection molding machine 1. The sensor 800 includes, for example, sensors 800A to 800C. Hereinafter, any one of the sensors 800A to 800C may be referred to individually as "sensor 800X," or the sensors 800A to 800C may be referred to collectively as "sensor 800X."

[0128] The number of sensors 800X connected to the controller 700 (FPGA 710) via a communication line may be one, two, or four or more.

[0129] The sensors 800A to 800C may include, for example, a sensor that outputs measurement data related to the operating state of a driven part in the injection molding machine 1. For example, the sensors 800A to 800C may include an encoder that measures the position (including the rotational position) and speed (including the rotational speed) of the driven part. The encoders include, for example, the mold clamping motor encoder 161, the mold thickness adjustment motor encoder 184, the ejector motor encoder 211, the metering motor encoder 341, the injection motor encoder 351, and the like. In addition, for example, the sensors 800A to 800C may include a sensor (for example, the pressure detector 360, and the like) that outputs measurement data related to the power transmitted from the driving part to the driven part.

[0130] Furthermore, the sensors 800A to 800C may include, for example, a sensor that outputs measurement data related to the operating state of an electric drive unit in the injection molding machine 1. The electric drive unit of the injection molding machine 1 may include, for example, the mold clamping motor 160, the mold thickness adjustment motor 183, the ejector motor 210, the metering motor 340, the injection motor 350, the motor 420, etc. For example, the sensors 800A to 800C may include a current sensor that measures the current of the electric drive unit and a voltage sensor that measures the voltage.

[0131] Furthermore, the sensors 800A to 800C may include, for example, a sensor that outputs measurement data related to the operating state of a hydraulic drive unit in the injection molding machine 1. The hydraulic drive unit includes, for example, a hydraulic cylinder, etc. For example, the sensors 800A to 800C may include, for example, a pressure sensor that detects the pressure of hydraulic oil in the hydraulic drive unit.

[0132] The sensors 800A to 800C may include, for example, a temperature sensor that measures the temperature state at a predetermined location in the injection molding machine 1. The sensors 800A to 800C include, for example, a temperature detector 314.

[0133] [First communication mode for internal communication in injection molding machines] Next, a first communication mode (an example of a first operating state) regarding internal communication of the injection molding machine 1 will be described with reference to Fig. 4 and Fig. 5. Specifically, the first communication mode regarding internal communication in a case where output data of the sensor 800X is transmitted from the FPGA 710 to the CPU 701 will be described.

[0134] 4 and 5 are diagrams for explaining an example of the first communication mode regarding the internal communication of the controller 700. Specifically, Fig. 4 is a diagram that typically illustrates the state of the internal communication of the controller 700 in the first communication mode when a packet transmitted from the FPGA 710 is received by the CPU 701 with no error in the data contained in the packet. Also, Fig. 5 is a diagram that typically illustrates the state of the internal communication of the controller 700 in the first communication mode when a packet transmitted from the FPGA 710 is received by the CPU 701 with an error in the data contained in the packet.

[0135] In this example, the FPGA 710 mainly divides the output data of each of the sensors 800A to 800C into a plurality of packets P1, . . . , Pn (n: an integer of 2 or more) and transmits them. In this case, the FPGA 710 completes transmission of all of the plurality of packets P1, . . . , Pn, which contain the divided output data of the sensor 800X to be transmitted, to the CPU 701 in a time shorter than the transmission cycle of the output data. However, when the amount of output data of the sensor 800X to be transmitted is equal to or smaller than the size that can be transmitted in one packet, the FPGA 710 may transmit the output data in one packet P1. The same applies to an example of the second communication mode and other examples (see FIGS. 6 to 9) described below.

[0136] As shown in FIGS. 4 and 5, the FPGA 710 (transmission side) transmits a packet Pi (i: any integer from 1 to n) to the CPU 701 (reception side).

[0137] When the CPU 701 receives a packet Pi, it uses an error correction code included in the header of the packet Pi to determine whether or not there is an error in the data of the packet Pi. The error correction code is, for example, a CRC (Cyclic Redundancy Code).

[0138] As shown in FIG. 4, if there is no error in the data of the received packet Pi, the CPU 701 captures the data of the packet Pi and returns a response signal indicating that the packet Pi has been received normally (hereinafter referred to as a “normal response signal”) to the FPGA 710.

[0139] On the other hand, as shown in FIG. 5, when the CPU 701 detects an error in the data of the received packet Pi, it returns a response signal indicating that an error has been detected in the data of the packet Pi (hereinafter, referred to as an “error response signal”) to the FPGA 710 and discards the received packet Pi.

[0140] 4, when the FPGA 710 receives a normal response signal from the CPU 701 after transmitting a packet Pi, the FPGA 710 transmits a next packet Pj (j=i+1) including different data. In this case, the FPGA 710 transmits the next packet Pj to the CPU 701 after the time RT required from the first transmission of packet Pi to the reception of a response signal from the CPU 701 (hereinafter, "response time") has elapsed.

[0141] 5, when the FPGA 710 receives an error response signal from the CPU 701 after transmitting a packet Pi, the FPGA 710 retransmits the same packet Pi. In other words, the FPGA 710 waits for the time (response time RT) from the transmission of the packet Pi to the reception of the response signal to elapse, and then retransmits the packet Pi to the CPU 701.

[0142] When the CPU 701 receives the retransmitted packet Pi, it determines whether or not there is an error in the data of the packet Pi, just as it did the previous time.

[0143] As shown in FIG. 5, the CPU 701 transmits a normal response signal to the FPGA 710 if there is no error in the data of the retransmitted packet Pi.

[0144] After retransmitting packet Pi to the CPU 701, the FPGA 710 transmits the next packet Pj (j=i+1) including different data when it receives a normal response signal from the CPU 701. In this case, the FPGA 710 transmits the next packet Pj to the CPU 701 after a time period twice the response time RT (twice) has elapsed from the first transmission of packet Pi.

[0145] Thus, in this example (first communication mode), the FPGA 710 sequentially transmits a plurality of packets P1 to Pn to the CPU 701 in such a manner that the FPGA 710 basically transmits the packet Pi once. This allows the FPGA 710 to relatively reduce the processing load since it basically needs to transmit the packet Pi only once. However, if an error occurs in the data of the packet Pi during the communication process and the error is detected by the CPU 701, the FPGA 710 retransmits the packet Pi in response to receiving an error response signal from the CPU 701. This allows the CPU 701 to have another opportunity to obtain normal data contained in the packet Pi.

[0146] [Second communication mode for internal communication in injection molding machines] 6 to 9, a second communication mode (an example of a second operating state) related to internal communication of the injection molding machine 1 will be described. Specifically, the second communication mode related to internal communication in a case where output data of the sensor 800X is transmitted from the FPGA 710 to the CPU 701 will be described.

[0147] <An example of the second communication mode> 6 and 7 are diagrams for explaining an example of the second communication mode regarding the internal communication of the controller 700. Specifically, Fig. 6 is a diagram that typically illustrates the state of the internal communication of the controller 700 in the second communication mode when a packet transmitted from the FPGA 710 is received by the CPU 701 with no error in the data contained in the packet. Also, Fig. 7 is a diagram that typically illustrates the state of the internal communication of the controller 700 in the second communication mode when a packet transmitted from the FPGA 710 is received by the CPU 701 with an error in the data contained in the packet.

[0148] In this example, the headers of the multiple packets P1 to Pn transmitted from the FPGA 710 to the CPU 701 include unique identifiers (IDs) that are distinguishable from one another. Specifically, IDs="1" to "n" are assigned to the headers of the packets P1 to Pn, respectively. The same applies to other examples of the second communication mode described below.

[0149] As shown in FIGS. 6 and 7, the FPGA 710 (transmitting side) transmits a packet Pi (ID="i") to the CPU 701 (receiving side) (first time).

[0150] Thereafter, unlike the first communication mode described above, the FPGA 710 transmits the same packet Pi to the CPU 701 (for the second time) without waiting for receipt of a normal response signal from the CPU 701. Specifically, the FPGA 710 transmits the same packet Pi to the CPU 701 when a time T1, which is set shorter than the response time RT, has elapsed since the transmission of the first packet Pi, without waiting for the response time RT to elapse.

[0151] When the CPU 701 receives the packet Pi, it determines whether or not there is an error in the data of the packet Pi by using the error correction code included in the header of the packet Pi, in the same manner as in the first communication mode described above.

[0152] In this example, as described above, the second packet Pi is transmitted without waiting for the response time RT to elapse. Therefore, as shown in Figures 6 and 7, the CPU 701 receives the second packet Pi regardless of whether the first packet Pi has been received normally or not. The CPU 701 can determine whether the currently received packet Pi is the same as the previously received packet by checking the ID included in the header of the received packet Pi.

[0153] 6, when the data of the first received packet Pi is free of error, the CPU 701 takes in the data of the packet Pi and, as in the first communication mode, returns a normal response signal to the FPGA 710. After that, when the data of the second received packet Pi is also free of error, the CPU 701 discards the packet Pi without returning a normal response signal to the FPGA 710.

[0154] In addition, as shown in Fig. 6, when there is no error in the data of the first received packet Pi, the CPU 701 may discard the second received packet Pi without judging whether or not there is an error in the data. The same may be true for the case of Fig. 8 described below.

[0155] 7, when the data of the first packet Pi received by the CPU 701 is erroneous, the CPU 701 discards the packet Pi without returning an error response signal (see the dashed arrow in the figure), unlike the first communication mode. After that, when the data of the second packet Pi received by the CPU 701 is free of error, the CPU 701 takes in the data of the second packet Pi and returns a normal response signal to the FPGA 710.

[0156] If the packet Pi cannot be received normally both the first and second times, the CPU 701 may transmit an error response signal to the FPGA 70210 (see step S426 in FIG. 13). The same may be true for other examples of the second communication mode described below.

[0157] As shown in FIGS. 6 and 7, when the FPGA 710 receives a normal response signal from the CPU 701 after transmitting the second packet Pi, it transmits the next packet Pj (ID="j") including different data.

[0158] As shown in FIG. 6, if there is no error in the first packet Pi received by the CPU 701, the FPGA 710 transmits the next packet Pj to the CPU 701 after the response time RT has elapsed, starting from the first transmission of packet Pi, as in the case of FIG. 4 described above.

[0159] On the other hand, as shown in Fig. 7, if there is no error in only the second packet Pi received by the CPU 701, the FPGA 710 transmits the next packet Pj to the CPU 701 after the total time of the response time RT and time T1 has elapsed, starting from the first transmission of packet Pi. The total time of the response time RT and time T1 is shorter than twice the response time RT. As a result, the time required for the FPGA 710 to transmit the first packet Pj from the first transmission of packet Pi is shorter than that in the case of Fig. 5 described above.

[0160] Thus, in this example (second communication mode), the FPGA 710 transmits the packet Pi to the CPU 701 twice, regardless of whether or not a response signal is received from the CPU 701. Specifically, in this example, the FPGA 710 transmits the second packet Pi to the CPU 701 after a time T1 set to be shorter than the response time RT has elapsed since the transmission of the first packet Pi. As a result, even if an error occurs in the data of the first packet Pi, the FPGA 710 can relatively shorten the interval from the first transmission of the packet Pi to the first transmission of the next packet Pj, as long as there is no error in the data of the second packet Pi. Therefore, even if an error occurs in the data during the communication of the packet Pi, the time until the data of the sensor 800X to be transmitted is completed can be relatively shortened. Therefore, for example, when the transmission period of data from the sensor 800X to be transmitted is relatively short, the FPGA 710 can relatively increase the probability that data transmission will be completed within the transmission period, thereby suppressing the occurrence of a situation in which the CPU 701 is unable to obtain data from the FPGA 710.

[0161] Note that the FPGA 710 may transmit the packet Pi three or more times, including the first time, before the response time RT has elapsed since the first packet Pi.

[0162] <Another example of the second communication mode> 8 and 9 are diagrams for explaining another example of the second communication mode regarding the internal communication of the controller 700. Specifically, Fig. 8 is a diagram that illustrates the state of the internal communication of the controller 700 in the second communication mode when a packet transmitted from the FPGA 710 is received by the CPU 701 with an error occurring in the data contained in the packet. Also, Fig. 9 is a diagram that illustrates the state of the internal communication of the controller 700 in the second communication mode when a packet transmitted from the FPGA 710 is received by the CPU 701 with no error in the data contained in the packet.

[0163] As shown in FIGS. 8 and 9, the FPGA 710 (transmitting side) transmits a packet Pi (ID="i") to the CPU 701 (receiving side) (first time).

[0164] Thereafter, the FPGA 710 transmits the same packet Pi to the CPU 701 (second time) without waiting for receipt of a normal response signal from the CPU 701. Specifically, the FPGA 710 transmits the second packet Pi to the CPU 701 immediately after transmitting the first packet Pi, without waiting for the response time RT to elapse. More specifically, the FPGA 710 may transmit the second packet Pi to the CPU 701 immediately after completing transmission of the first packet Pi, when it becomes possible to transmit the packet Pi.

[0165] When the CPU 701 receives a packet Pi, similarly to the above-described examples of the first and second communication modes, the CPU 701 determines whether or not there is an error in the data of the packet Pi by using the error correction code included in the header of the packet Pi.

[0166] In this example, as described above, the second packet Pi is transmitted without waiting for the response time RT to elapse. Therefore, as shown in Figures 8 and 9, the CPU 701 receives the second packet Pi regardless of whether the first packet Pi has been received normally or not. The CPU 701 can determine whether the currently received packet Pi is the same as the previously received packet by checking the ID included in the header of the received packet Pi.

[0167] 8, when there is no error in the data of the first received packet Pi, the CPU 701 takes in the data of the packet Pi and returns a normal response signal to the FPGA 710, as in the case of the examples of the first and second communication modes described above. After that, when there is no error in the data of the second received packet Pi, the CPU 701 discards the packet Pi without returning a normal response signal to the FPGA 710.

[0168] 9, when the data of the first packet Pi received by the CPU 701 is erroneous, the CPU 701 discards the packet Pi without returning an error response signal (see the dashed arrow in the figure) as in the example of the first communication mode. After that, when the data of the second packet Pi received by the CPU 701 is free of error, the CPU 701 takes in the data of the second packet Pi and returns a normal response signal to the FPGA 710.

[0169] As shown in FIGS. 8 and 9, when the FPGA 710 receives a normal response signal from the CPU 701 after transmitting the second packet Pi, it transmits the next packet Pj (ID="j") including different data.

[0170] As shown in FIG. 8, if there is no error in the first packet Pi received by the CPU 701, the FPGA 710 transmits the next packet Pj to the CPU 701 after the response time RT has elapsed, starting from the first transmission of packet Pi, as in the cases of FIGS. 4 and 6 described above.

[0171] On the other hand, as shown in Fig. 9, if there is no error only in the second packet Pi received by the CPU 701, the FPGA 710 transmits the next packet Pj to the CPU 701 after the total time of the response time RT and the time T2 has elapsed, starting from the first transmission of the packet Pi. The time T2 corresponds to the time physically required from the start of the transmission process of the first packet Pi to the start of the transmission process of the second packet Pi, and the total time of the response time RT and the time T2 is shorter than twice the response time RT. As a result, the time required for the FPGA 710 to transmit the first packet Pj starting from the first transmission of the packet Pi is shorter than the case of Fig. 5 described above, as in the case of the example of the second communication mode described above.

[0172] Thus, in this example (the second communication mode), the FPGA 710 transmits the packet Pi to the CPU 701 twice regardless of the response signal from the CPU 701. Specifically, in this example, the FPGA 710 transmits the packet Pi continuously twice. Thereby, even if there is an error in the data of the first packet Pi, if there is no error in the data of the second packet Pi, the interval from the first transmission of the packet Pi to the first transmission of the next packet Pj can be made shorter. Therefore, even if a data error occurs during the communication process of the packet Pi, the time until the output data of the sensor 800X to be transmitted is completely transmitted can be made shorter. Thus, for example, when the data transmission cycle of the sensor 800X to be transmitted is relatively short, the FPGA 710 can further increase the probability that the data transmission is completed within the transmission cycle, and further suppress the occurrence of a situation where the CPU 701 cannot acquire data from the FPGA 710.

[0173] Note that the FPGA 710 may transmit the packet Pi three or more times including the first time before the response time RT elapses from the first packet Pi. The same may apply to other examples of the second communication mode described later.

[0174] [An Example of Control Processing for Internal Communication of an Injection Molding Machine] Next, with reference to FIGS. 10 to 13, an example of control processing for internal communication of the injection molding machine 1 will be described.

[0175] <Control Processing of FPGA> First, with reference to FIGS. 10 to 12, the control processing of the FPGA 710 will be described.

[0176] <<Communication Mode Switching Processing>> Fig. 10 is a flowchart showing an example of a communication mode switching process by the FPGA 710. This flowchart is repeatedly executed, for example, while the injection molding machine 1 is in operation (power ON) and every time the timing occurs for output data of the sensors 800A-800C to be sent to the CPU 701. Specifically, this flowchart may be executed when the FPGA 710 receives output data from the sensor 800X while the injection molding machine 1 is in operation. The same applies to the processes in Figs. 14 and 15 described below.

[0177] 10, in step S102, the FPGA 710 determines whether the frequency of occurrence of communication errors during data transmission to the CPU 701 is equal to or lower than a predetermined standard. Specifically, the FPGA 710 determines whether the frequency of receiving an error response signal from the CPU 701 is equal to or lower than a predetermined standard. If the frequency of occurrence of communication errors during data transmission to the CPU 701 is equal to or lower than the predetermined standard, the FPGA 710 proceeds to step S104, and if not, proceeds to step S106.

[0178] In step S104, the FPGA 710 transmits, in the first communication mode, output data of the sensor 800X that is the transmission target to the CPU 701. As a result, in a situation where communication errors are relatively unlikely to occur, the FPGA 710 basically adopts a mode of transmitting a packet only once, and can prioritize reduction of the processing load.

[0179] When the process of step S104 is completed, the FPGA 710 ends the process of this flowchart.

[0180] On the other hand, in step S106, the FPGA 710 transmits, in the second communication mode, output data of the sensor 800X that is the transmission target to the CPU 701. As a result, in a situation in which communication errors are relatively likely to occur, the FPGA 710 can transmit a packet multiple times, including the first time, before the response time RT has elapsed, and prioritize reducing the time required for transmitting data to the CPU 701.

[0181] When the process of step S106 is completed, the FPGA 710 ends the process of this flowchart.

[0182] In this way, in this example, the FPGA 710 can selectively switch between the first communication mode and the second communication mode depending on the frequency of occurrence of communication errors during data transmission from the FPGA 710 to the CPU 701.

[0183] <<Processing for the first communication mode>> 11 is a flowchart outlining an example of processing related to internal communication in the first communication mode by the FPGA 710. This flowchart corresponds to the processing in step S104 in FIG.

[0184] As shown in FIG. 11, in step S202, the FPGA 710 transmits a packet including a part or all of the output data of the sensor 800X to be transmitted once to the CPU 701.

[0185] When the process of step S202 is completed, the FPGA 710 proceeds to step S204.

[0186] In step S 204 , the FPGA 710 receives the response signal from the CPU 701 .

[0187] When the process of step S204 is completed, the FPGA 710 proceeds to step S206.

[0188] In step S206, the FPGA 710 determines whether or not an error response signal was received in step S204. If the FPGA 710 received an error response signal, the process proceeds to step S208, and if the FPGA 710 did not receive an error response signal, i.e., if the FPGA 710 received a normal response signal, the process proceeds to step S210.

[0189] In step S208, the FPGA 710 retransmits to the CPU 701 the same packet that was transmitted in step S202.

[0190] When the process of step S208 is completed, the FPGA 710 returns to step S204.

[0191] On the other hand, in step S210, the FPGA 710 determines whether data transmission is complete. Specifically, the FPGA 710 determines whether transmission of one or more packets corresponding to the data to be transmitted is complete. If data transmission is not complete, the FPGA 710 returns to step S202 and transmits the next packet to the CPU 701. If data transmission is complete, the FPGA 710 ends the process of this flowchart.

[0192] In this way, in the first communication mode, the FPGA 710 basically transmits a packet to the CPU 701 once, and only retransmits the packet to the CPU 701 if an error occurs in the packet data. This allows the FPGA 710 to prioritize reduction of the processing load, as described above.

[0193] <<Processing for the second communication mode>> 12 is a flowchart outlining an example of processing related to internal communication in the second communication mode by the FPGA 710. This flowchart corresponds to the processing in step S106 in FIG.

[0194] As shown in Fig. 12, in step S302, the FPGA 710 transmits a packet including a part or all of the output data of the sensor 800X to be transmitted twice to the CPU 701. For example, the FPGA 710 may transmit the packet twice with an interval of time T1 as in the above-mentioned example of the second communication mode (see Figs. 6 and 7). Also, for example, the FPGA 710 may transmit the packet twice in succession as in another example of the above-mentioned second communication mode (see Figs. 8 and 9). Also, the FPGA 710 may transmit the packet three or more times as described above.

[0195] When the process of step S302 is completed, the FPGA 710 proceeds to step S304.

[0196] Steps S304 to S310 are the same as the processes of steps S204 to S210 in FIG. 11, so the description thereof is omitted.

[0197] As described above, in the second communication mode, before receiving the response signal for the first packet from the CPU 701, the FPGA 710 transmits the packet twice including the first time. Thereby, even if an error occurs in the data when transmitting the output data of the sensor 800X to be transmitted to the CPU 701, the FPGA 710 can relatively shorten the time required for completing the data transmission as described above. That is, the FPGA 710 can prioritize shortening the time required for completing the data transmission.

[0198] <CPU Control Process> Subsequently, with reference to FIG. 13, the control process of the CPU 701 will be described.

[0199] FIG. 13 is a flowchart schematically showing an example of a process related to internal communication by the CPU 701. This flowchart is executed, for example, when a packet is received from the FPGA 710.

[0200] As shown in FIG. 13, in step S402, the CPU 701 determines whether the first communication mode is adopted. Whether the communication mode adopted by the FPGA 710 is the first communication mode or the second communication mode may be determined, for example, from the content of the packet header. In this case, the FPGA 710 sets information indicating the communication mode to be adopted in the packet header. If the first communication mode is adopted, the CPU 701 proceeds to step S404. If the first communication mode is not adopted, that is, if the second communication mode is adopted, the CPU 701 proceeds to step S410.

[0201] In step S404, the CPU 701 determines whether an error is detected in the data of the received packet. If the CPU 701 does not detect an error in the data of the received packet, it proceeds to step S406. If an error is detected, it proceeds to step S408.

[0202] In step S406, the CPU 701 takes in the data of the received packet and returns a normal response signal to the FPGA 710. This allows the FPGA 710 to recognize that no error has been detected in the packet data (YES in step S206 in FIG. 11). Therefore, the CPU 701 can move on to transmitting the next packet (NO in step S210 in FIG. 11), or end data transmission upon completion of transmission of all packets (YES in step S210 in FIG. 11).

[0203] When the process of step S406 is completed, the CPU 701 ends the process of this flowchart.

[0204] On the other hand, in step S408, the CPU 701 discards the received packet and returns an error response signal to the FPGA 710. This allows the FPGA 710 to recognize that an error has been detected in the packet data (NO in step S206 in FIG. 11). Therefore, the FPGA 710 can resend the packet to the CPU 701 (step S208 in FIG. 11).

[0205] When the CPU 701 completes the process of step S408, it ends the process of this flowchart.

[0206] Also, in step S410, the CPU 701 determines whether the ID included in the header of the received packet is the same as the ID of the previously received packet. If the ID of the received packet is not the same as the ID of the previously received packet, the CPU 701 determines that the packet is received for the first time and proceeds to step S412, and if the IDs are the same, the CPU 701 determines that the packet is received for the second time and proceeds to step S418.

[0207] In step S412, the CPU 701 determines whether or not an error has been detected in the received data. If the CPU 701 has not detected an error in the data of the received packet, the process proceeds to step S414, and if an error has been detected, the process proceeds to step S416.

[0208] In step S414, the CPU 701 takes in the data of the received packet and returns a normal response signal to the FPGA 710. This allows the FPGA 710 to recognize that no error was detected in the data of the packet received by the CPU 701 (NO in step S306 in FIG. 12). Therefore, the CPU 701 can move on to transmitting the next packet (NO in step S310 in FIG. 12), or end data transmission upon completion of transmission of all packets (YES in step S310 in FIG. 12).

[0209] When the process of step S414 is completed, the CPU 701 ends the process of this flowchart.

[0210] On the other hand, in step S416, the CPU 701 discards the received packet without returning a response signal to the FPGA 710. This is because there is an opportunity to receive the second packet even if there is an error in the data of the first packet.

[0211] When the process of step S416 is completed, the CPU 701 ends the process of this flowchart.

[0212] In step S418, the CPU 701 determines whether the previous packet was received normally, i.e., whether the previous packet was error-free. If the previous packet was received normally, the CPU 701 proceeds to step S420, and if the previous packet was not received normally, the CPU 701 proceeds to step S422.

[0213] In step S420, the CPU 701 discards the received packet without determining whether there is an error or not, and without returning a response signal to the FPGA 710. This is because there is no error in the data of the first packet, normal data has been received, and a normal response signal has been returned to the CPU 701 (see step S414).

[0214] When the process of step S420 is completed, the CPU 701 ends the process of this flowchart.

[0215] On the other hand, in step S422, the CPU 701 determines whether or not an error has been detected in the received data. If the CPU 701 has not detected an error in the data of the received packet, the process proceeds to step S424, and if an error has been detected, the process proceeds to step S426.

[0216] In step S424, the CPU 701 takes in the data of the received packet and returns a normal response signal to the FPGA 710. This allows the FPGA 710 to recognize that no error was detected in the data of the packet received by the CPU 701 (NO in step S306 in FIG. 12). Therefore, the CPU 701 can move on to transmitting the next packet (NO in step S310 in FIG. 12), or end data transmission upon completion of transmission of all packets (YES in step S310 in FIG. 12).

[0217] When the CPU 701 completes the process of step S424, it ends the process of this flowchart.

[0218] On the other hand, in step S426, the CPU 701 discards the received packet and returns an error response signal to the FPGA 710. As a result, the FPGA 710 recognizes that an error has occurred in the data of both the packets received by the CPU 701 on the first and second days. (YES in step S306 in FIG. 12). Therefore, the FPGA 710 can retransmit the packet to the CPU 701 (step S308 in FIG. 12).

[0219] When the process of step S426 is completed, the CPU 701 ends the process of this flowchart.

[0220] In this way, the CPU 701 can adopt an appropriate process in accordance with the communication mode (the first communication mode or the second communication mode) adopted by the FPGA 710.

[0221] [Another example of control processing related to internal communication in an injection molding machine] Next, another example of the control process relating to the internal communication of the injection molding machine 1 will be described with reference to FIG.

[0222] In this example, only the communication mode switching process by the FPGA 710 is different from the above example, and the other processes are the same as those in the above example (FIGS. 11 to 13). The following mainly describes the parts that are different from the above example.

[0223] FIG. 14 is a flowchart illustrating another example of the communication mode switching process by the FPGA 710.

[0224] 14, in step S502, the FPGA 710 determines whether the transmission period of the output data of the sensor 800X to be transmitted is equal to or shorter than a predetermined standard. The predetermined standard is, for example, 100 μsec. If the transmission period of the output data of the sensor 800X to be transmitted is not equal to or shorter than the predetermined standard, the FPGA 710 proceeds to step S504, and if it is equal to or shorter than the predetermined standard, the FPGA 710 proceeds to step S506.

[0225] In step S504, the FPGA 710 transmits, in the first communication mode, output data of the sensor 800X to be transmitted to the CPU 701. As a result, when the transmission cycle is relatively long and there is a certain amount of time required to complete transmission of the data to be transmitted, the FPGA 710 basically adopts a mode of transmitting a packet only once, and can prioritize reduction of the processing load.

[0226] When the process of step S504 is completed, the FPGA 710 ends the process of this flowchart.

[0227] On the other hand, in step S506, the FPGA 710 transmits, in the second communication mode, output data of the sensor 800X that is the transmission target to the CPU 701. As a result, when the transmission cycle is relatively short, the FPGA 710 can transmit a packet multiple times, including the first time, before the response time RT has elapsed, and prioritize reducing the time required for transmitting data to the CPU 701.

[0228] When the process of step S506 is completed, the FPGA 710 ends the process of this flowchart.

[0229] Incidentally, steps S504 and S506 are the same as steps S104 and S106 in Fig. 10. Therefore, in steps S504 and S506, the above-mentioned processes in Fig. 11 and Fig. 12 are respectively executed.

[0230] In this way, in this example, the FPGA 710 can selectively switch between the first communication mode and the second communication mode depending on the transmission cycle of data to be transmitted from the FPGA 710 to the CPU 701.

[0231] [Another example of control process related to internal communication of injection molding machine] Next, another example of the control process relating to the internal communication of the injection molding machine 1 will be described with reference to FIG.

[0232] In this example, only the communication mode switching process by the FPGA 710 is different from the above-mentioned example and other examples, and other processes are the same as the above-mentioned example (FIGS. 11 to 13). The following mainly describes the parts that are different from the above-mentioned example and other examples.

[0233] FIG. 15 is a flowchart illustrating another example of the communication mode switching process by the FPGA 710.

[0234] 15, the FPGA 710 determines whether the output data of the sensor 800X to be transmitted is applicable to the second communication mode. For each of the output data of the sensors 800A to 800C, whether the output data is applicable to the first communication mode or the second communication mode is set in advance, and the setting contents are stored in the controller 700 (FPGA 710) in advance.

[0235] The data to which the first communication mode is applied is, for example, output data of sensor 800X (an example of a first sensor) in which the rate of change in the physical quantity to be measured in response to disturbance is relatively small among sensors 800A to 800C. Specifically, the data to which the first communication mode is applied may be data from a temperature sensor, etc.

[0236] In contrast, data to which the second communication mode is applied is, for example, output data of sensor 800X (an example of a second sensor) in which the rate of change in the physical quantity to be measured (detected) in response to disturbance is relatively high among sensors 800A to 800C. Specifically, data to which the second communication mode is applied may be data from a voltage sensor, a current sensor, a pressure sensor, an encoder (an example of a rotation state sensor), etc.

[0237] If the output data of the sensor 800X to be transmitted is not applicable to the second communication mode, i.e., is applicable to the first communication mode, the FPGA 710 proceeds to step S604, and if it is applicable to the second communication mode, the FPGA 710 proceeds to step S606.

[0238] In step S604, the FPGA 710 transmits the output data of the sensor 800X to be transmitted to the CPU 701 in the first communication mode. As a result, when the rate of change in the physical quantity corresponding to the output data of the sensor 800X to be transmitted is relatively small in response to disturbances, the FPGA 710 basically adopts a mode of transmitting the packet Pi only once, and can prioritize reduction of the processing load. This is because, even if many communication errors occur and a situation occurs in which data transmission cannot be completed within the transmission period, the physical quantity is unlikely to change significantly until the next data is received, and control performance can be maintained by extrapolation on the CPU 701 side, etc.

[0239] When the process of step S604 is completed, the FPGA 710 ends the process of this flowchart.

[0240] On the other hand, in step S606, the FPGA 710 transmits the output data of the sensor 800X to be transmitted to the CPU 701 in the second communication mode. In this way, when the rate of change in the physical quantity corresponding to the output data of the sensor 800X to be transmitted is relatively large in response to a disturbance, the FPGA 710 transmits the packet multiple times, including the first time, before the response time RT has elapsed, and can prioritize suppression of the time required for data transmission. This is because if many communication errors occur and a situation occurs in which data transmission cannot be completed within the transmission period, the physical quantity may change significantly until the next data is received, making it difficult to maintain the control performance on the CPU 701 side.

[0241] When the process of step S606 is completed, the FPGA 710 ends the process of this flowchart.

[0242] Incidentally, steps S604 and S606 are the same as steps S104 and S106 in Fig. 10. Therefore, in steps S604 and S606, the above-mentioned processes in Fig. 11 and Fig. 12 are respectively executed.

[0243] In this way, in this example, the FPGA 710 can selectively switch between the first communication mode and the second communication mode depending on the transmission cycle of data to be transmitted from the FPGA 710 to the CPU 701.

[0244] [Other embodiments] Next, another embodiment will be described.

[0245] The contents of the above-described embodiment may be modified or changed as appropriate.

[0246] For example, in the above-described embodiment, the first communication mode and the second communication mode are applied when data is transmitted from the FPGA 710 to the CPU 701, but the first communication mode and the second communication mode may also be applied when data is transmitted from the CPU 701 to the FPGA 710.

[0247] Also, for example, in the above-mentioned embodiment and its modified and altered examples, one FPGA 710 is connected to the CPU 701, but multiple FPGAs 710 (slaves) may be daisy-chained to the CPU 701 (master). In this case, the multiple FPGAs 710 may be of the same type, or at least some of them may be of different types. In this case, the above-mentioned first communication mode, second communication mode, etc. may be applied to internal communication between two adjacent FPGAs 701 connected in a daisy chain.

[0248] Also, for example, in the above-mentioned embodiment and examples of the variations and modifications thereof, the first communication mode and the second communication mode are applied to the internal communication of the controller 700, but they may be applied to communication between other internal devices of the injection molding machine 1 and the controller 700 (an example of an internal device) or between other internal devices of the injection molding machine 1. The other internal devices of the injection molding machine 1 include, for example, a sensor 800X (an example of an internal device). The other internal devices of the injection molding machine 1 include other controllers. The other controllers may include, for example, a higher-level controller (an example of an internal device) such as a PLC (Programmable Logic Controller). The other controllers may include, for example, a lower-level controller (an example of an internal device) such as a driver that drives an electric drive unit.

[0249] Also, for example, in the above-described embodiment and modified examples, the first communication mode and the second communication mode are applied to the internal communication in the injection molding machine 1, but they may be applied to the communication between the injection molding machine 1 and an external device. Specifically, the first communication mode and the second communication mode may be applied to the communication between the injection molding machine 1 itself (the injection molding machine 1) and another injection molding machine 1 (an example of an external device) or to the communication between the injection molding machine 1 and the management device 2 (an example of an external device).

[0250] Also, for example, in the above-described embodiment and its variations and modifications, the first communication mode and the second communication mode are applied to data that is transmitted periodically, but they may also be applied to data that is transmitted in response to the occurrence of a specified event.

[0251] Also, for example, in the above-described embodiment and its variations and modifications, the first communication mode and the second communication mode are switched, but communication may always be performed in the second communication mode.

[0252] [Effect] Next, the operations of the injection molding machine 1 and the controller 700 according to this embodiment will be described.

[0253] In this embodiment, the injection molding machine 1 includes a clamping device 100, an injection device 300, and an ejector device 200. Specifically, the clamping device 100 clamps the mold device 10. The injection device 300 fills the mold device 10 clamped by the clamping device 100 with molding material. The ejector device 200 removes a molded product from the mold device 10 after the molding material filled by the injection device 300 has cooled and solidified. In the injection molding machine 1, the transmitting side transmits the same data to the receiving side multiple times between the internal devices and / or between the machine itself and an external device.

[0254] Furthermore, in this embodiment, the controller 700 transmits the same data multiple times from the transmitting side to the receiving side at least one of between the internal devices and between the controller 700 itself and an external device.

[0255] As a result, even if the data in the first packet contains an error, the injection molding machine 1 and the controller 700 (hereinafter, "the injection molding machine 1, etc.") have a chance to normally obtain error-free data by receiving the second or subsequent packets. Therefore, the injection molding machine 1, etc. can obtain correct data on the receiving side.

[0256] Furthermore, in this embodiment, the transmitting side may transmit the same data to the receiving side multiple times in succession until a response signal regarding reception of the data is received from the receiving side (i.e., before the response time RT has elapsed).

[0257] This allows the injection molding machine 1 etc. to relatively shorten the time required for transmitting all data from the transmitting side to the receiving side, as described above.

[0258] Furthermore, in this embodiment, the transmitting side may transmit the same data to the receiving side multiple times in succession.

[0259] This allows the injection molding machine 1 etc. to further shorten the time required to transmit all data from the transmitting side to the receiving side, as described above.

[0260] In addition, in this embodiment, the transmitting side may have a first communication mode in which the transmitting side transmits data once to the receiving side and retransmits the same data if a communication error occurs, and a second communication mode in which the transmitting side transmits the same data multiple times regardless of whether a communication error occurs or not.

[0261] As a result, the injection molding machine 1, etc., can switch between the first communication mode and the second communication mode to achieve a balance between reducing the processing load and shortening the time required to transmit all data from the sending side to the receiving side.

[0262] Furthermore, in this embodiment, the transmitting side may switch between the first communication mode and the second communication mode depending on the data to be transmitted.

[0263] This allows the injection molding machine 1 etc. to switch between the first communication mode and the second communication mode in accordance with the conditions related to the data to be transmitted.

[0264] Furthermore, in this embodiment, the transmitting side may select the first communication mode when the transmission cycle of the data to be transmitted is relatively long, and may select the second communication mode when the transmission cycle of the data to be transmitted is relatively short.

[0265] As a result, the injection molding machine 1 etc. can prioritize reducing the processing load when the transmission cycle of the data to be transmitted is relatively long and there is relatively ample time available for transmitting all the data from the transmitting side to the receiving side. On the other hand, the injection molding machine 1 etc. can prioritize shortening the time required for transmitting all the data when the transmission cycle of the data to be transmitted is relatively short and there is relatively little time available for transmitting all the data from the transmitting side to the receiving side.

[0266] Furthermore, in this embodiment, the data to be transmitted may be output data of sensor 800X. The transmitting side may select the first communication mode when the output data to be transmitted is output from sensor 800X (first sensor) of sensors 800A-800C, in which the physical quantity of the object to be measured changes at a relatively slow rate. On the other hand, the transmitting side may select the second communication mode when the output data to be transmitted is output from sensor 800X (second sensor) of sensors 800A-800C, in which the physical quantity of the object to be measured changes at a relatively fast rate.

[0267] As a result, the injection molding machine 1 etc. can prioritize reducing the processing load when the rate of change in the physical quantity of the measurement target of the sensor 800X is relatively small and even if the transmission of the output data of the sensor 800X cannot be completed within the transmission cycle, it is possible to ensure the control performance by extrapolation etc. On the other hand, the injection molding machine 1 etc. can prioritize shortening the time required to transmit all data when the rate of change in the physical quantity of the measurement target of the sensor 800X is relatively large and it is difficult to ensure the control performance if the transmission of the output data of the sensor 800X cannot be completed within the transmission cycle.

[0268] Furthermore, in this embodiment, the first sensor may include a temperature sensor, and the second sensor may include at least one of a voltage sensor, a current sensor, a pressure sensor, and a rotational state sensor (eg, an encoder, etc.).

[0269] This allows the injection molding machine 1 and the like to switch between the first communication mode and the second communication mode in accordance with the type of the sensor 800.

[0270] In addition, in this embodiment, the transmitting side may switch between the first communication mode and the second communication mode depending on the frequency of occurrence of communication errors during data transmission from the transmitting side to the receiving side.

[0271] As a result, the injection molding machine 1 etc. can select the first communication mode and prioritize reducing the processing load, for example, when the frequency of occurrence of communication errors is relatively low, since the delay due to retransmission of data is also small to a certain extent. On the other hand, the injection molding machine 1 etc. can select the second communication mode and prioritize shortening the time required for transmitting all data, for example, when the frequency of occurrence of communication errors is relatively high, since the delay due to retransmission of data is large to a certain extent.

[0272] [Transformation, modification] The above describes embodiments of the injection molding machine management system SYS, etc., but the present disclosure is not limited to the above-described embodiments, etc., and various modifications and changes are possible within the scope of the gist described in the claims.

[0273] For example, in the above-mentioned embodiment, the configuration regarding data exchange between the internal devices of the injection molding machine 1 and between the injection molding machine 1 and an external device has been described, but the same content may be applied to data exchange between the internal devices of other machines and between the machine and an external device. The other machines may be, for example, industrial machines or industrial robots used in factories. The other machines may also be, for example, work machines (for example, excavators, bulldozers, cranes, etc.) used at work sites. In other words, the configuration regarding data exchange between the internal devices of the injection molding machine 1 and between the injection molding machine 1 and an external device may be applied to any control system including a transmitting unit and a receiving unit that exchange data, and a control unit that uses the data received by the receiving unit. [Explanation of symbols]

[0274] 1 injection molding machine 2 Management device (external device) 100 Mold clamping device 200 Ejector device 300 Injection device 400 Mobile Device 700 Controller 701 CPU (internal equipment) 702 Memory device 703 Auxiliary storage 704 Interface Device 710 FPGA (internal equipment) 750 Operating device 760 Display device SYS Injection molding machine management system

Claims

1. a mold clamping device that clamps the mold device; an injection unit that fills the mold unit clamped by the mold clamping unit with a molding material; an ejector device that removes a molded product from the mold device after the molding material filled by the injection device is cooled and solidified, At least one of between internal devices and between the device itself and an external device has a first operating state in which a transmitting side transmits data to a receiving side once and retransmits the same data when a communication error occurs, and a second operating state in which the transmitting side transmits the same data multiple times to the receiving side regardless of the presence or absence of a communication error until a response regarding the reception of the data is received from the receiving side. Injection molding machine.

2. the transmitting side transmits the same data to the receiving side multiple times in succession in the second operating state; 2. The injection molding machine according to claim 1.

3. The transmitting side switches between the first operating state and the second operating state depending on data to be transmitted.

3. The injection molding machine according to claim 1 or 2.

4. the transmitting side selects the first operating state when a transmission cycle of the data to be transmitted is relatively long, and selects the second operating state when a transmission cycle of the data to be transmitted is relatively short; 4. The injection molding machine according to claim 3.

5. the data to be transmitted is output data from a sensor, the transmitting side selects the first operating state when output data of a first sensor, of the sensors, in which a rate of change in the physical quantity of the object to be measured is relatively small, and selects the second operating state when output data of a second sensor, of the sensors, in which a rate of change in the physical quantity of the object to be measured is relatively large, is to be transmitted.

5. The injection molding machine according to claim 3 or 4.

6. the first sensor includes a temperature sensor; the second sensor includes at least one of a voltage sensor, a current sensor, a pressure sensor, and a rotation state sensor; 6. The injection molding machine according to claim 5.

7. the transmitting side switches between the first operating state and the second operating state depending on a frequency of occurrence of a communication error during data transmission from the transmitting side to the receiving side; 7. An injection molding machine according to any one of claims 1 to 6.

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