Resin molded product and method for manufacturing the same

Abstract

To provide a resin molding for a vehicle capable of enhancing the appearance.SOLUTION: A resin molding 10 comprises: a resin-made base material 20 having a surface 21 provided with a rugged pattern 23; and a resin-made surface layer material 30 having a visible light transmissivity, and laminated on the base material 20 to cover the surface 21. The resin molding 10 is formed by two-color molding using the base material 20 as a primary molding material and the surface layer material 30 as a secondary molding material. The base material 20 has a through hole 26 that opens in the surface 21. The base material 20 and the surface layer material 30 separate from each other in a lamination direction X.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a resin molded article and a method for manufacturing a resin molded article. [Background technology]

[0002] Patent Document 1 discloses a decorative film. This decorative film has a first synthetic resin film and a transparent second synthetic resin film laminated on the upper surface of the first synthetic resin film.

[0003] The upper surface of the first synthetic resin film is formed with uneven grains, the cross-sectional shape of which is a sawtooth shape consisting of a number of aligned peaks. In this decorative film, a transparent second synthetic resin film is laminated on the texture of the first synthetic resin film, so the texture is less likely to get dirty or scratched. In addition, the uneven shape of the texture is clearly visible through the second synthetic resin film, giving the decorative film a three-dimensional feel. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2005-14374 A Summary of the Invention [Problem to be solved by the invention]

[0005] However, there is still room for improvement in the three-dimensional effect of such resin molded products, and therefore in improving their appearance. [Means for solving the problem]

[0006] The resin molded product for solving the above problem comprises a resin base material having a surface with an uneven pattern, and a resin surface layer material that is transparent to visible light and is laminated onto the base material to cover the surface, the resin molded product being formed by two-color molding using the base material as a primary molding material and the surface layer material as a secondary molding material, the base material having a through hole that opens into the surface, and the base material and the surface layer material being spaced apart from each other in the stacking direction of the base material and the surface layer material.

[0007] According to this configuration, it is possible to form an intermediate layer by injecting air or a coloring material through the through holes between the base material and the surface layer material. If the refractive index of the intermediate layer is made different from that of the surface layer material, the shadows of the uneven pattern of the base material become clearer, and the three-dimensional effect of the uneven pattern is enhanced. Therefore, the appearance of the resin molded product can be improved.

[0008] In the above resin molded product, the surface layer material is formed from a resin material having a lower melting point than the base material. When manufacturing a resin molded product by forming a surface layer material that is visible light transparent on the surface of a base material on which a textured pattern has been formed, if injection molding is used to form the surface layer material, there is a risk that the textured pattern on the surface of the base material will be destroyed by the injected molten resin.

[0009] In this regard, according to the above-mentioned configuration, the uneven pattern of the substrate is less likely to be destroyed by the heat of the molten resin during secondary molding. In other words, the three-dimensional effect of the uneven pattern of the substrate is more easily maintained. This makes the shadows of the uneven pattern of the substrate clearer, and further enhances the three-dimensional effect of the uneven pattern. Therefore, the appearance of the resin molded product can be further improved.

[0010] In the above-mentioned resin molded product, the surface layer material is formed of a resin material having a molding shrinkage rate larger than that of the base material. According to this configuration, after the secondary molding, the surface layer material shrinks, and the surface layer material is pressed against the side surfaces of the convex portions that constitute the uneven pattern of the base material. This improves the adhesion between the base material and the surface layer material. Therefore, it is possible to prevent the adhesion between the base material and the surface layer material from decreasing while separating the base material and the surface layer material in the stacking direction.

[0011] In the resin molded product, the through hole is provided with a sealant that seals the through hole. According to this configuration, the sealant prevents air, coloring material, and the like that compose the intermediate layer from leaking out through the through holes, thereby preventing deterioration in the appearance of the resin molded product.

[0012] In the resin molded product, a coloring material is filled between the base material and the surface layer material in the stacking direction. According to this configuration, by appropriately setting the refractive index of the coloring material, it is possible to adjust the clarity of the shadows in the uneven pattern of the base material, and therefore the three-dimensional effect of the uneven pattern.

[0013] In the above-mentioned resin molded product, the surface layer material has a main body portion covering the front surface, and an anchor portion connected to the main body portion and covering the back surface of the base material. According to this configuration, the anchor portion of the surface layer material makes it easier to maintain the state in which the base material and the surface layer material are in close contact with each other. Therefore, while the base material and the surface layer material are spaced apart in the stacking direction, it is possible to prevent a decrease in the adhesion between the base material and the surface layer material.

[0014] A method for manufacturing a resin molded product to solve the above problems includes a primary molding step of molding the base material, a secondary molding step of molding the surface layer material by filling a cavity formed between the surface and a molding die with molten resin while keeping an opening of the through hole that opens to the surface, and a separation step of separating the base material and the surface layer material in the stacking direction by applying pressure between the base material and the surface layer material through the through hole.

[0015] According to this method, in the primary molding step, the substrate is molded. Next, in the secondary molding step, the cavity formed between the surface of the substrate and the mold is filled with molten resin while the opening of the through hole of the substrate is blocked, thereby forming the surface layer material. Next, in the separation step, pressure is applied between the substrate and the surface layer material through the through hole of the substrate, thereby separating the substrate and the surface layer material in the stacking direction. In this manner, the resin molded product can be manufactured. Effect of the Invention

[0016] According to the present invention, the appearance of a resin molded product for a vehicle can be improved. [Brief description of the drawings]

[0017] [Figure 1] FIG. 1 is a cross-sectional view showing one embodiment of a resin molded product. [Diagram 2] FIG. 2 is an enlarged cross-sectional view of the resin molded product of FIG. 1, focusing on the uneven pattern. [Diagram 3] FIG. 3 is an enlarged cross-sectional view of the uneven pattern of FIG. 2, focusing on the side surface of a protrusion. [Figure 4] FIG. 4 is an enlarged cross-sectional view of the resin molded product of FIG. 1, focusing on the anchor portion. [Diagram 5] FIG. 5 is a cross-sectional view showing a primary molding step of molding a base material in the method for producing the resin molded product of FIG. [Figure 6] FIG. 6 is a cross-sectional view showing a secondary molding step of molding a surface layer material in the method for producing the resin molded product of FIG. [Figure 7] FIG. 7 is a cross-sectional view showing a separating step of separating the base material from the surface layer material in the method for producing the resin molded product of FIG. [Figure 8] FIG. 8 is a cross-sectional view showing a trimming step in the method for producing the resin molded product of FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0018] Hereinafter, an embodiment of a resin molded product and a method for manufacturing a resin molded product will be described with reference to Fig. 1 to Fig. 8. In each drawing, some of the components are shown exaggerated or simplified for the sake of convenience, so the dimensional ratios of each component may differ from the actual ratios. In addition, "orthogonal" in the following description does not only mean a case where the components are strictly orthogonal, but also includes a case where the components are approximately orthogonal within a range in which the effects of each embodiment are achieved.

[0019] <Resin molded products 10> As shown in FIGS. 1 and 2, a resin molded product 10 has a resin base material 20 and a resin surface layer material 30 that is laminated on the base material 20 and covers a surface 21 of the base material 20 .

[0020] The resin molded product 10 also has an intermediate layer 40 provided between the base material 20 and the surface layer material 30 , and a sealing material 50 provided on the base material 20 . The resin molded product 10 is formed by trimming an end portion 111 of an intermediate body 110 molded by two-color molding (see Figs. 7 and 8). The resin molded product 10 is applied to an interior material of a vehicle, such as an instrument panel.

[0021] In the following description, the lamination direction of the base material 20 and the surface layer material 30 will be simply referred to as the lamination direction X. <Base material 20> As shown in Figures 1 and 2, the substrate 20 has an uneven pattern 23 provided on the front surface 21 and a plurality of (in this embodiment, two) through holes 26 that penetrate the substrate 20 from the front surface 21 to the back surface 22.

[0022] The uneven pattern 23 is provided in a central portion 21 a in the width direction Y of the surface 21 of the base material 20 . The uneven pattern 23 is composed of a plurality of protrusions 24 arranged side by side on the surface 21, and a plurality of recesses 25 located between the protrusions 24. The plurality of protrusions 24 protrude in the stacking direction X. In this embodiment, the shape of each of the plurality of protrusions 24 is set separately. That is, as shown in FIG. 2, the width and protruding height of each of the protrusions 24 are set separately. Note that FIG. 1 shows a simplified outline of the uneven pattern 23.

[0023] In the following description, the direction perpendicular to the stacking direction X and corresponding to the width direction of the protrusion 24 will be simply referred to as the width direction Y. As shown in FIGS. 2 and 3, each protrusion 24 has a tip surface 24a and a pair of side surfaces 24b that bend and extend from both sides of the tip surface 24a in the width direction Y.

[0024] 3, the side surface 24b is inclined with respect to a virtual line V1 extending in the stacking direction X. The angle θ between the side surface 24b and the virtual line V1 is preferably 0.5 degrees or more and less than 20 degrees. In this embodiment, the inclination angle θ of the side surface 24b with respect to the virtual line V1 is set to 0.5 degrees.

[0025] 1 and 2, the through holes 26 are provided at positions adjacent to the uneven pattern 23 in the width direction Y. The through holes 26 are arranged on both sides of the uneven pattern 23 in the width direction Y. Each of the through holes 26 extends linearly in the stacking direction X.

[0026] Examples of the resin material for the base material 20 include PP (polypropylene), ABS resin, and PC-ABS (polymer alloy of polycarbonate and ABS resin). In this embodiment, PC-ABS (melting point: about 250° C., mold shrinkage rate: about 0.7%) is used as the resin material for the base material 20.

[0027] <Surface material 30> As shown in FIGS. 1 and 4, the surface material 30 has a main body portion 31 that covers the front surface 21 of the substrate 20, and an anchor portion 32 that is connected to the main body portion 31 and covers a part of the back surface 22 of the substrate 20.

[0028] The main body portion 31 covers the entire surface 21 in the width direction Y. 2 and 3, the main body 31 and the central portion 21a of the base material 20 are spaced apart from each other in the stacking direction X. In the uneven pattern 23, the tip faces 24a of the protrusions 24 and the bottom faces 25a of the recesses 25 are spaced apart from the main body 31 in the stacking direction X. An intermediate layer 40 is interposed between the main body 31 and the central portion 21a.

[0029] The main body 31 and the concave-convex pattern 23 of the base material 20 are in close contact with each other in the width direction Y. More specifically, the main body 31 and the side surface 24b of the convex portion 24 are in close contact with each other in the width direction Y.

[0030] 1 and 4, the anchor portions 32 are provided on both sides of the main body portion 31 in the width direction Y. The anchor portions 32 have base ends 33 extending from both end edges of the main body portion 31 in the width direction Y along the end faces 27 of the substrate 20, and a tip end portion 34 folding back from the tip of the base end portion 33 and extending to the back surface 22 of the substrate 20.

[0031] The surface layer material 30 is formed of a resin material having visible light transmittance. More specifically, the surface layer material 30 is formed of a resin material having a visible light transmittance to such an extent that the uneven pattern 23 of the base material 20 can be seen through the surface layer material 30. Here, the above-mentioned resin material includes not only colorless and transparent materials, but also materials that contain coloring materials and transmit only a part of visible light.

[0032] The surface layer material 30 is formed of a resin material having a lower melting point than the base material 20. Specifically, the melting point M2 of the resin material of the surface layer material 30 is preferably 50° C. or more lower than the melting point M1 of the resin material of the base material 20 (M1-M2≧50). Moreover, the melting point M2 is more preferably 70° C. or more lower than the melting point M1 (M1-M2≧70). Moreover, the melting point M2 is even more preferably 100° C. or more lower than the melting point M1 (M1-M2≧100).

[0033] The surface layer material 30 is formed from a resin material having a molding shrinkage rate greater than that of the base material 20 . The resin material of the surface layer material 30 may be, for example, hard PU (polyurethane) or polyurea. In this embodiment, the resin material of the surface layer material 30 is hard PU (melting point: about 150°C, molding shrinkage rate: about 1.5%).

[0034] <Intermediate layer 40, sealing material 50> 2, the intermediate layer 40 is a layer formed of a material having a refractive index different from that of the surface layer material 30. In this embodiment, the intermediate layer 40 is a layer constituted by air A.

[0035] As shown in FIGS. 1 and 2, the sealant 50 seals the through-holes 26 of the base material 20, and is provided in each of the two through-holes 26. The material of the sealing material 50 may be, for example, a UV (ultraviolet) curable resin.

[0036] <Intermediate body 110 of resin molded product 10> As shown in FIG. 7, the intermediate body 110 has a base material 120 and a surface layer material 130. The substrate 120 is an intermediate of the substrate 20 before the end 111 is trimmed from the intermediate 110. Therefore, in the following, the components of the substrate 120 that are common to the substrate 20 are given the same reference numerals and the description thereof is omitted.

[0037] In addition to the through hole 26, the base material 120 has a plurality of (two in this embodiment) through holes 128 penetrating the base material 120 from the front surface 121 to the back surface 122. A part of an inner circumferential surface 128a of the through hole 128 is formed by an end surface 27 of the base material 20.

[0038] The surface layer material 130 is an intermediate body of the surface layer material 30 before the end portion 111 is trimmed from the intermediate body 110. The surface material 130 has a main body portion 131 that covers the front surface 121 of the base material 120, and an anchor portion 132 that is continuous with the main body portion 131 and covers the back surface 122 of the base material 120. A portion of the anchor portion 132 is inserted into the through hole 128 of the base material 120.

[0039] <Manufacturing equipment 60> Next, a manufacturing apparatus 60 for molding the intermediate body 110 of the resin molded product 10 will be described. As shown in FIGS. 5 and 6, the manufacturing apparatus 60 includes a primary molding die 70 for molding the base material 120 and a secondary molding die 80 for molding the surface layer material 130.

[0040] As shown in FIG. 5, the primary molding die 70 includes a first die 71A, a sliding die 71B, and a second die 72 that is provided so as to be capable of approaching or being separated from the first die 71A and the sliding die 71B in the stacking direction X.

[0041] A molding surface 73 for molding the rear surface 122 of the substrate 120 is formed on the surfaces of the first die 71A and the slide die 71B facing the second die 72. The first die 71A has an insertion hole 75 through which a pin 91 for forming the through hole 26 is inserted. One end 91a of the pin 91 in the extending direction is in contact with the second die 72 when the primary molding die 70 is in a clamped state. The pin 91 is configured to be movable in the stacking direction X relative to the first die 71A.

[0042] The first die 71A is configured so as to be separable in the stacking direction X from the slide die 71B and the molded base material 120 when the primary molding die 70 is opened. The slide die 71B has a molding convex portion 71b for forming the through hole 128. The tip of the molding convex portion 71b abuts against the second die 72 when the primary molding die 70 is in a clamped state.

[0043] The slide die 71B is configured to be slidable in the width direction Y relative to the base material 120 in a state in which the first die 71A is separated from the base material 120 when the primary molding die 70 is opened.

[0044] A molding surface 74 for molding the surface 121 of the substrate 120 is formed on the surface of the second die 72 facing the first die 71A and the sliding die 71B. The molding surface 74 has a molding concave-convex portion 74a for forming the concave-convex pattern 23.

[0045] The molding surface 73, the molding surface 74, the molding convex portion 71b, and the pin 91 form a cavity 76, which is a space into which the molten resin for molding the substrate 120 is filled. As shown in FIG. 6, the secondary molding die 80 includes a first die 81 and a second die 82 that is disposed so as to be movable toward or away from the first die 81 in the stacking direction X.

[0046] A support surface 83 for supporting the substrate 120 is formed on the surface of the first die 81 facing the substrate 120 . The first die 81 has a through hole 85 formed therein, which is in communication with the through hole 26 of the base material 120. A pin 92 is inserted into the through hole 26 and the through hole 85. One end 92a of the pin 92 in the extending direction is spaced apart from the second die 82 when the secondary molding die 80 is in a clamped state. The pin 92 is configured to be movable relative to the first die 81 in the stacking direction X.

[0047] The first die 81 is configured so as to be separable from the base material 120 in the stacking direction X when the secondary molding die 80 is opened. On the surface of the second die 82 facing the first die 81, a molding surface 84 for molding a surface 131a (see FIG. 7) of the main body portion 131 of the surface layer material 130 is formed.

[0048] A portion of the support surface 83 of the first mold 81, the back surface 122 of the substrate 120, and the inner surface 128a of the through hole 128 form a cavity 86, which is a space into which molten resin is filled to mold the anchor portion 132.

[0049] The molding surface 84 and the surface 121 of the base material 120 form a cavity 87 which is a space into which molten resin for molding the main body portion 131 of the surface layer material 130 is filled. <Method of Manufacturing Resin Molded Product 10> Next, a method for producing the resin molded product 10 using the production apparatus 60 will be described with reference to FIGS.

[0050] First, as shown in Fig. 5, in a state in which the first die 71A and the slide die 71B are clamped to the second die 72, a pin 91 is inserted into the insertion hole 75 of the first die 71A. Then, a molten resin is filled into a cavity 76 formed by the molding surface 73, the molding surface 74, the molding convex portion 71b, and the pin 91. In this way, the base material 120 is molded (the above is the primary molding process). At this time, the molding convex portion 74a forms the concave-convex pattern 23 on the surface 121 of the base material 120. In addition, the pin 91 forms a through hole 26. In addition, the molding convex portion 71b forms a through hole 128.

[0051] Next, as shown in FIG. 6, in a state where the base material 120 removed from the primary molding die 70 is supported on the support surface 83 of the first die 81, a pin 92 is inserted into the through hole 85 and the through hole 26. At this time, the opening 26a of the through hole 26 that opens to the surface 121 is blocked by the pin 92. Then, in a state where the first die 81 and the second die 82 are clamped, a molten resin is filled into a cavity 87 formed between the molding surface 84 and the surface 121 of the base material 120. At this time, the molten resin is also filled into a cavity 86 formed by a part of the support surface 83 of the first die 81, the back surface 122 of the base material 120, and the inner peripheral surface 128a of the through hole 128. As a result, a main body portion 131 of the surface layer material 130 that covers the surface 121 of the base material 120 and an anchor portion 132 are molded. That is, an intermediate body 110 is molded (above, the secondary molding process).

[0052] Next, as shown in Figs. 7 and 8, air A is injected through the through-holes 26 of the intermediate body 110 removed from the secondary molding die 80 to apply pressure between the base material 120 and the surface layer material 130. This causes the base material 120 and the surface layer material 130 to be separated in the stacking direction X (separation process). At this time, an intermediate layer 40 made of air A is formed between the center portion 21a of the base material 120 and the surface layer material 130. Note that Figs. 7 and 8 show the intermediate body 110 in a simplified manner, and therefore the intermediate layer 40 is omitted from the illustration. Next, a UV-curable resin is injected into the through-holes 26, and then the UV-curable resin is quickly cured by irradiating it with UV. This forms a sealant 50 that seals the through-holes 26 (see Fig. 8).

[0053] Next, the intermediate body 110 is trimmed along an imaginary plane V2 that passes through the axis L of the through hole 128 and is perpendicular to the stacking direction X, thereby cutting off the end portion 111 from the intermediate body 110. This produces a resin molded product 10 including the base material 20 and the surface layer material 30 (this is the trimming process).

[0054] Next, the effects of this embodiment will be described. (1) The resin molded product 10 includes a resin base material 20 having a surface 21 with a concave-convex pattern 23, and a resin surface layer material 30 covering the surface 21. The base material 20 has a through hole 26 that opens into the surface 21. The base material 20 and the surface layer material 30 are spaced apart from each other in the stacking direction X.

[0055] According to this configuration, it is possible to form the intermediate layer 40 by injecting air A between the base material 20 and the surface layer material 30 through the through holes 26. By making the refractive index of the intermediate layer 40 different from that of the surface layer material 30, the shadows of the uneven pattern 23 of the base material 20 become clearer, and the three-dimensional effect of the uneven pattern 23 increases. Therefore, the appearance of the resin molded product 10 can be improved.

[0056] (2) The surface layer material 30 is made of a resin material having a lower melting point than the base material 20 . When manufacturing a resin molded product 10 by forming a surface layer material 30 having visible light transparency on the surface 21 of a base material 20 on which a rugged pattern 23 is formed, if injection molding is used to form the surface layer material 30, there is a risk that the rugged pattern 23 on the surface 21 of the base material 20 will be destroyed by the injected molten resin.

[0057] In this regard, according to the above-mentioned configuration, the uneven pattern 23 of the substrate 20 is less likely to collapse due to the heat of the molten resin during secondary molding. In other words, the three-dimensional effect of the uneven pattern 23 of the substrate 20 is more easily maintained. As a result, the shadows of the uneven pattern 23 of the substrate 20 become clearer, and the three-dimensional effect of the uneven pattern 23 is further enhanced. Therefore, the appearance of the resin molded product 10 can be further improved.

[0058] (3) The surface layer material 30 is made of a resin material having a molding shrinkage rate greater than that of the base material 20 . According to this configuration, after secondary molding, the surface layer material 30 shrinks under molding, so that the surface layer material 30 is pressed against the side surfaces 24b of the protrusions 24 constituting the uneven pattern 23 of the base material 20. This improves the adhesion between the base material 20 and the surface layer material 30. Therefore, while the base material 20 and the surface layer material 30 are spaced apart in the stacking direction X, it is possible to prevent the adhesion between the base material 20 and the surface layer material 30 from decreasing.

[0059] (4) The through hole 26 is provided with a sealant 50 for sealing the through hole 26 . According to this configuration, the sealant 50 prevents the air A constituting the intermediate layer 40 from leaking out through the through holes 26. Therefore, deterioration in the appearance of the resin molded product 10 can be suppressed.

[0060] (5) The surface material 30 has a main body portion 31 that covers the front surface 21 and an anchor portion 32 that is connected to the main body portion 31 and covers the back surface 22 of the base material 20. According to this configuration, the base material 20 and the surface layer material 30 can be easily maintained in close contact with each other by the anchor portion 32 of the surface layer material 30. Therefore, while the base material 20 and the surface layer material 30 are spaced apart in the stacking direction X, it is possible to prevent the adhesion between the base material 20 and the surface layer material 30 from decreasing.

[0061] (6) The method for manufacturing the resin molded product 10 includes a primary molding step of molding the base material 120, and a secondary molding step of molding the surface layer material 130. The method for manufacturing the resin molded product 10 also includes a separation step of applying pressure between the base material 120 and the surface layer material 130 through the through holes 26 to separate the base material 120 and the surface layer material 130 in the stacking direction X.

[0062] According to this method, in the primary molding step, the base material 120 is molded. Next, in the secondary molding step, the cavity 86 formed between the surface 121 of the base material 120 and the molding surface 84 of the second die 82 is filled with molten resin while the opening 26a of the through hole 26 of the base material 120 is closed, thereby molding the surface layer material 130. Next, in the separation step, pressure is applied between the base material 120 and the surface layer material 130 through the through hole 26 of the base material 120, thereby separating the base material 120 and the surface layer material 130 in the stacking direction X. In this manner, the intermediate body 110 of the resin molded product 10 can be manufactured.

[0063] <Example of change> This embodiment can be modified as follows: This embodiment and the following modifications can be combined with each other to the extent that there is no technical contradiction.

[0064] The manufacturing method of the resin molded product according to the present invention is not limited to the one having the trimming step as in the present embodiment, and the trimming step can be omitted. In this case, the intermediate body 110 corresponds to the resin molded product according to the present invention, and the base material 120 and the surface layer material 130 correspond to the base material and the surface layer material according to the present invention.

[0065] The anchor portions 32, 132 may be omitted. In this case, the through hole 128 can also be omitted. Accordingly, the slide mold 71B having the molding protrusion 71b can be omitted from the primary molding mold .

[0066] According to this configuration, the configuration of the primary molding die 70 is prevented from becoming complicated. The arrangement of the embossed pattern 23 is not limited to being provided in the central portion 21 a of the surface 21 as illustrated in this embodiment, but may be changed as appropriate in accordance with the specifications of the resin molded product 10 .

[0067] The arrangement of the through holes 26 is not limited to being provided at a position adjacent to the uneven pattern 23 in the width direction Y as exemplified in this embodiment. The arrangement can be changed as appropriate as long as pressure can be applied between the base material 120 and the surface material 130 by injecting air A through the through holes 26. For example, the through holes 26 may be provided at a position overlapping the uneven pattern 23 in the stacking direction X.

[0068] The number of through holes 26 is not limited to two as exemplified in this embodiment, but may be one, or three or more. The through-holes 26 are not limited to those extending linearly in the stacking direction X as exemplified in this embodiment. For example, the through-holes 26 may extend at an angle with respect to the stacking direction X as long as they open to the front surface 21.

[0069] The intermediate layer 40 is not limited to being made of air A as exemplified in this embodiment, and may be made of any suitable material as long as the refractive index of the intermediate layer 40 is different from that of the surface layer material 30. For example, a coloring material may be filled between the base material 20 and the surface layer material 30 to form an intermediate layer made of a coloring material.

[0070] According to this configuration, by appropriately setting the refractive index of the coloring material, the clarity of the shadows in the uneven pattern 23 of the base material 20, and therefore the three-dimensional effect of the uneven pattern 23, can be adjusted. The sealing material 50 may be omitted. In this case, a viscous coloring material or the like may be used as the material for forming the intermediate layer.

[0071] ·The surface layer material 30 is not limited to being formed of a resin material having a larger molding shrinkage rate than the base material 20. For example, the molding shrinkage rate S2 of the resin material of the surface layer material 30 may be the same as the molding shrinkage rate S1 of the resin material of the base material 20 (S2 = S1), or the molding shrinkage rate S2 may be smaller than the molding shrinkage rate S1 (S2 < S1). Even in such cases, it is sufficient that the melting point M2 of the resin material of the surface layer material 30 is higher than the melting point M1 of the resin material of the base material 20.

[0072] ·The resin molded product according to the present invention is not limited to being applied to interior materials of vehicles such as instrument panels, and can also be applied to exterior materials of vehicles, for example.

Explanation of reference numerals

[0073] θ... Angle A... Air L... Axis M1, M2... Melting point S1, S2... Molding shrinkage rate V1... Virtual straight line V2... Virtual plane X... Laminating direction Y... Width direction 10... Resin molded product 20, 120... Base material 21, 121... Surface 21a... Central portion 22, 122... Back surface 23... Concavo-convex pattern 24... Protrusion 24a... Tip surface 24b... Side surface 25... Recess 25a... Bottom surface 26... Through hole 26a... Opening 27... End surface 30, 130... Surface layer material 31, 131... Main body portion 32, 132... Anchor portion 33... Base end portion 34... Tip end portion 40... Intermediate layer 50... Sealing material 60... Manufacturing apparatus 70...Primary mold 71A…Type 1 71B...Slide type 71b…Convex 72…2nd type 73…molding surface 74…molding surface 74a…Molding uneven part 75...Through hole 76…Cavity 80...Secondary mold 81…Type 1 82…2nd type 83…support surface 84…molding surface 85...Through hole 86…Cavity 87…Cavity 91…Pin 91a...one end 92…Pin 92a…one end 110...Intermediate 111...End 128...Through hole 128a…Inner peripheral surface 131a…Surface

Claims

1. A resin substrate having a surface with a concave-convex pattern; a surface layer material made of a resin having visible light transparency and laminated on the base material to cover the surface, the resin molded product being formed by two-color molding using the base material as a primary molding material and the surface layer material as a secondary molding material, The substrate has a through hole that opens to the surface, The surface layer material is formed of a resin material having a melting point lower than that of the base material, The base material and the surface layer material are spaced apart from each other in a stacking direction of the base material and the surface layer material. Resin molded product.

2. The surface layer material is formed of a resin material having a molding shrinkage rate larger than that of the base material. The resin molded product according to claim 1.

3. A sealant that seals the through hole is provided in the through hole. The resin molded product according to claim 1 or 2.

4. A coloring material is filled between the base material and the surface layer material in the stacking direction. The resin molded product according to any one of claims 1 to 3.

5. The surface layer material has a main body portion covering the front surface and an anchor portion connected to the main body portion and covering the back surface of the base material. The resin molded product according to any one of claims 1 to 4.

6. A method for producing a resin molded product according to any one of claims 1 to 5, a primary molding step of molding the substrate; a secondary molding step of molding the surface layer material by filling a cavity formed between the surface and a molding die with a molten resin while closing an opening of the through hole that opens to the surface; and a separating step of separating the base material and the surface layer material in the stacking direction by applying pressure between the base material and the surface layer material through the through hole. A method for manufacturing a resin molded product.

7. A resin substrate having a surface with a concave-convex pattern; a surface layer material made of a resin having visible light transparency and laminated on the base material to cover the surface, the resin molded product being formed by two-color molding using the base material as a primary molding material and the surface layer material as a secondary molding material, The substrate has a through hole that opens to the surface, The surface layer material has a main body portion covering the front surface and an anchor portion connected to the main body portion and covering the back surface of the base material, The base material and the surface layer material are spaced apart from each other in a stacking direction of the base material and the surface layer material. Resin molded product.

8. A resin substrate having a surface with a concave-convex pattern; A surface layer material made of a resin having visible light transparency and laminated on the base material to cover the surface, The substrate has a through hole that opens to the surface, A method for producing a resin molded product, wherein the base material and the surface layer material are spaced apart from each other in a lamination direction of the base material and the surface layer material, a primary molding step of molding the substrate; a secondary molding step of molding the surface layer material by filling a cavity formed between the surface and a molding die with a molten resin while closing an opening of the through hole that opens to the surface; and a separating step of separating the base material and the surface layer material in the stacking direction by applying pressure between the base material and the surface layer material through the through hole. A method for manufacturing a resin molded product.

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