Cleaning resin composition

Abstract

To provide a resin composition for cleaning which is usable for cleaning resin-molding machines such as extrusion molding machines and injection molding machines.SOLUTION: A resin composition for cleaning comprises (A) a polycarbonate resin, (B) a styrene-based resin, and (C-1) a polyoxyethylene-polyoxypropylene glycol, wherein the content of the (C-1) component is 0.5-3.5 pts.mass per 100 pts.mass of the sum of the components (A) and (B).SELECTED DRAWING: None

Description

[Technical field]

[0001] The present disclosure relates to a cleaning resin composition that can be used to clean extrusion machines and injection molding machines used in resin molding. [Background technology]

[0002] 2. Description of the Related Art Detergents for cleaning extrusion machines and injection molding machines used in resin molding processes are known. Patent Document 1 (Japanese Patent No. 5409522) describes an invention (claims) relating to a cleaning agent for molding machines that contains (a) 30 to 90 mass % of a thermoplastic resin and (b) 70 to 10 mass % of glass fibers having an average length of 100 μm or less and has an ignition temperature of 400°C or higher. (a) With regard to the thermoplastic resin, it is described that among polystyrene, polyamide, styrene-acrylonitrile copolymer, and polycarbonate, polycarbonate is preferable, and two or more kinds may be mixed and used (paragraphs 0031 and 00364).

[0003] Patent Document 2 (Japanese Patent No. 5171573) describes an invention of a cleaning agent that contains 100 parts by weight of polycarbonate (A), 0.1 to 100 parts by weight of a silicate compound (B), and 0.001 to 10 parts by weight of an organic acid and / or organic acid derivative (C), in which the mixture of the silicate compound (B) and the organic acid and / or organic acid derivative (C) has a pH value of 5 to 8 (claims). It is stated that in addition to polycarbonate, polystyrene, HIPS, AS resin, ABS resin, etc. may be contained. (Paragraph No. 0039)

[0004] Patent Document 3 (WO2019 / 069798 A1) describes an invention relating to a cleaning resin composition for injection molding machines and molds, which contains a thermoplastic resin and a surfactant having a TGA decomposition onset temperature of 200°C or higher and a melting point of less than 100°C, and the surfactant is described as a sulfonate salt (alphasulfo fatty acid methyl ester salt) (claims). A large number of thermoplastic resins are listed, and it is described that polyethylene is particularly preferable. (Paragraph No. 0021)

[0005] Patent Document 4 (JP 2021-734 A) describes a styrene-acrylonitrile copolymer resin having a melt mass-flow rate (MFR) value of 1 g / 10 min to 40 g / 10 min under conditions of a test temperature (θ) of 220° C. and a nominal load (Mnom) of 10 kg, and a melt volume-flow rate (MVR) value of 3 cm or less under conditions of a test temperature (θ) of 300° C. and a nominal load (Mnom) of 1.2 kg. 3 / 10min~130cm 3 The invention relates to a resin composition for cleaning, which is characterized in that the composition comprises 70 to 10 parts by mass of a polycarbonate resin having a viscosity of 100 / 10 min, and the total parts by mass of components (A) and (B) is 100 parts by mass (Claims). Regarding the content of the polycarbonate resin (the content of the AS resin), in the cleaning resin composition of the present invention, the content of the polycarbonate resin is 70 to 10 parts by mass, preferably 60 to 20 parts by mass, and more preferably 50 to 30 parts by mass, per 100 parts by mass of the total of the components (A) and (B). (Paragraph No. 0022) [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Patent No. 5409522 [Patent Document 2] Patent No. 5171573 [Patent Document 3] WO2019 / 069798 A1 [Patent Document 4] Patent Publication No. 2021-734 Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the present disclosure is to provide a cleaning resin composition that has good cleaning performance for resin molding machines such as extrusion machines and injection molding machines. [Means for solving the problem]

[0008] The present disclosure provides a cleaning resin composition comprising (A) a polycarbonate resin, (B) a styrene-based resin, and (C-1) polyoxyethylene polyoxypropylene glycol, in which the content of component (C-1) is 0.5 to 3.5 parts by mass per 100 parts by mass of the combined total of components (A) and (B).

[0009] The present disclosure also provides a cleaning resin composition comprising (A) a polycarbonate resin, (B) a styrene-based resin, (C-1) a polyoxyethylene polyoxypropylene glycol, and (C-2) a sodium alkyl (C10-16)benzenesulfonate, wherein the content of component (C-1) is 20 to 80 mass% and the content of component (C-2) is 80 to 20 mass% in 100 mass% of the total of components (C-1) and (C-2), and the total content of components (C-1) and (C-2) is 1 to 5 parts by mass per 100 parts by mass of the total of components (A) and (B). Effect of the Invention

[0010] The cleaning resin composition of the present disclosure has excellent cleaning performance for resin molding machines such as extrusion molding machines and injection molding machines. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] The polycarbonate resin of component (A) can be the same as those described in, for example, JP 2019-127516 A, JP 2021-734 A, and Japanese Patent No. 5171573.

[0012] Examples of the styrene-based resin (B) include polystyrene (PS), high impact polystyrene (HIPS), acrylonitrile-styrene resin (AS resin), acrylonitrile-butadiene-styrene resin (ABS resin), methyl methacrylate-butadiene-styrene resin (MBS resin), and butyl acrylate-acrylonitrile-styrene resin (AAS resin). Among these, AS resin is preferred.

[0013] Of the total of component (A) and component (B) 100% by mass, The content of the (A) component is preferably 60 to 95 mass%, more preferably 70 to 90 mass%, and further preferably 75 to 90 mass%, The content of the component (B) is preferably from 40 to 5 mass %, more preferably from 30 to 10 mass %, and even more preferably from 25 to 10 mass %.

[0014] In addition, as a surfactant, (C-1) Contains polyoxyethylene polyoxypropylene glycol alone, or It may contain both (C-1) polyoxyethylene polyoxypropylene glycol and (C-2) sodium alkyl (C10-16) benzene sulfonate. The alkyl group of the sodium alkyl (C10-16) benzenesulfonate, component (C-2), may be either a linear alkyl group or a branched alkyl group, but a linear alkyl group is preferred, and the alkyl group preferably has 10 to 13 carbon atoms.

[0015] When the component (C-1) is used alone, the content is preferably 0.5 to 3.5 parts by mass, more preferably 1 to 3.5 parts by mass, and even more preferably 1.5 to 3 parts by mass, per 100 parts by mass of the combined total of the components (A) and (B). When both the (C-1) component and the (C-2) component are contained, the content ratio thereof is preferably 1 to 5 parts by mass in total, more preferably 1.5 to 4 parts by weight, and even more preferably 2 to 4 parts by weight, per 100 parts by weight of the combined total of the (A) component and the (B) component. When both the (C-1) component and the (C-2) component are contained, the content of the (C-1) component is preferably 20 to 80 mass%, more preferably 30 to 70 mass%, and the content of the (C-2) component is preferably 80 to 20 mass%, more preferably 70 to 30 mass%, of 100 mass% combined of the (C-1) component and the (C-2) component.

[0016] In addition to the above-mentioned components (C-1) and (C-2), other surfactants (anionic surfactants, nonionic surfactants, etc.) may be contained. The content of the other surfactants is preferably 10 mass % or less, more preferably 5 mass % or less, and even more preferably 2 mass % or less, of the total amount of surfactants.

[0017] Furthermore, glass fibers may be contained as component (E). The glass fibers of component (E) may be made of known E glass, C glass, S glass, or D glass, but glass fibers made of E glass are preferred. The content of the component (E) is preferably 10 to 100 parts by mass per 100 parts by mass of the total of the components (A) and (B).

[0018] The cleaning resin composition of the present disclosure can be produced by premixing the above-mentioned components in a mixer such as a Henschel mixer, a tumbler blender, or a kneader, and then kneading the premix in an extruder or melt-kneading in a heated roll or Banbury mixer.

[0019] Each feature disclosed herein may be combined with any other feature disclosed herein. Each configuration and combination thereof in each embodiment is merely an example, and addition, omission, substitution, and other modifications of the configuration are possible as appropriate within the scope of the gist of the disclosure of the present invention. The present disclosure is not limited by the embodiments, but is limited only by the claims. EXAMPLES

[0020] Component (A) Polycarbonate resin: Caliber 300-4 (Sumika Styron Polycarbonate Co., Ltd.) (B) Component Styrene-based resin: SAN-A 100LS (Techno UMG Co., Ltd.) (C-1) Component Polyoxyethylene polyoxypropylene glycol: ADEKA Pluronic (registered trademark) F-108 (ADEKA Corporation) (C-2) Component Linear alkyl (C10-13) sodium benzenesulfonate: Neurex Soft 60-N (NOF Corporation) (C10: 8% by mass, C11: 32% by mass, C12: 34% by mass, C13: 26% by mass) Comparison (C) component Sodium alkanesulfonate: WeylClean SAS 93 (Clariant Japan Co., Ltd.) Ethylene glycol distearate: Emanon 3201M-V (Kao Corporation) (E) Component Glass fiber: ECS03 T-571 (Nippon Electric Glass Co., Ltd.)

[0021] Examples 1 to 4, Comparative Examples 1 to 7 The components shown in Table 1 were mixed in a tumbler blender (mixing time: 120 seconds, mixing speed: 120 r / min), and then melt-kneaded in an extruder to obtain a cleaning resin composition. The obtained cleaning resin composition was used to carry out the following cleaning tests 1 and 2. The results are shown in Table 1. The amount of each component in the table is in parts by mass. The injection molding machines and preforms used in cleaning tests 1 and 2 are as follows:

[0022] (injection molding machine) Mitsubishi Fanuc Model: 2000i-100B (screw diameter 32, clamping force 100t) Conditions: Injection speed 100mm / sec, rotation speed 100r / min, cylinder temperature: 280℃~300℃, back pressure: 0.3MPa Stroke: 50mm when using front material, 40mm when cleaning (front material) Polycarbonate resin: Caliber 200-10 (Sumika Styron Polycarbonate Co., Ltd.) Black master: PLASBLAK UN2014 (Cabot Plastics Hong Kong Ltd.) Polycarbonate resin and black master were mixed in a ratio of 100:0.5 using a tumbler blender (mixing time: 20 s, mixing speed: 120 r / min).

[0023] <Checking slipperiness> The cleaning resin composition was charged into the hopper of an injection molding machine, and then weighed to evaluate the metering time. The metering was performed by filling a predetermined amount of the cleaning resin composition into the cylinder of the injection molding machine from the hopper while rotating and retracting the screw in the cylinder. The term "slipperiness" refers to a state in which the washing resin composition slides violently against the screw or cylinder, resulting in a very long metering time or even inability to meter. "Slipperiness" was judged based on the weighing time during molding. A case in which no slipping occurred and the weighing time was completed within 5 seconds was rated as "good", and a case in which weighing and molding were not possible was rated as "bad".

[0024] <Cleaning test 1> 500 g of the starting material was placed in the injection molding machine (cylinder temperature 300° C.) and discharged under the above conditions. Thereafter, the cleaning resin composition was replaced at a cylinder temperature of 300°C, and the cleaning was deemed complete when the black color of the previous material was no longer visible to the naked eye. The cleaning performance of the cleaning resin composition was evaluated by measuring the mass (g) of the cleaning resin composition required to complete the cleaning. After that, the cylinder temperature was set at 300°C and the transparent PC resin (Caliber 200-10) was substituted, while checking whether any resin from the previous material remained. If there was no residue, it was marked with an ◯, and if there was residue (if the transparent PC resin was discolored), it was marked with an X. Furthermore, when replacing with the cleaning resin composition, the thermal stability of the cleaning resin composition was evaluated based on whether or not white smoke containing gas derived from the cleaning resin composition was generated. A case in which no white smoke containing gas was generated (good thermal stability) was marked with ◯, and a case in which white smoke containing gas was generated (poor thermal stability) was marked with ×. The presence or absence of the white smoke was confirmed by visual inspection.

[0025] <Cleaning test 2> 500 g of the starting material was placed in the injection molding machine (cylinder temperature 300° C.) and discharged under the above conditions. Thereafter, the cleaning resin composition was replaced at a cylinder temperature of 300°C, and the cleaning was deemed complete when the black color of the previous material was no longer visible to the naked eye. The cleaning performance of the cleaning resin composition was evaluated by measuring the mass (g) of the cleaning resin composition required to complete the cleaning. After that, the cylinder temperature was set at 240°C and a transparent AS resin (050SF, Daicel Miraize Co., Ltd.) was used to replace the resin, while checking whether any resin from the previous material remained. If there was no residue, it was marked with an ◯, and if there was residue (if the transparent AS resin was discolored), it was marked with an X. In addition, slipperiness and thermal stability were tested in the same manner as in cleaning test 1.

[0026] [Table 1]

[0027] As is clear from a comparison between Examples 1 to 4 and Comparative Examples 1 to 7, good results were obtained in both cleaning tests 1 and 2. Gas originating from the cleaning resin composition was generated during the cleaning work in Comparative Examples 1, 2, and 5. Whether or not gas was generated is important in terms of maintaining an appropriate working environment and ensuring the health of workers. Comparative Example 3 had poor slipperiness. In Comparative Example 4, the cleaning resin composition was not melted when replacing with the transparent AS resin, and therefore replacement with the transparent AS resin was not possible. In Comparative Example 6, since no surfactant was blended in the replacement with the transparent AS resin and PC resin, the cleaning resin composition was difficult to discharge, and replacement was not possible. In Comparative Example 7, the viscosity of the AS resin was extremely reduced due to the high temperature, and the AS resin flowed out of the nozzle during metering, making it impossible to meter it. [Industrial Applicability]

[0028] The cleaning resin composition of the present disclosure can be used to clean resin molding machines such as extrusion machines and injection molding machines.

Claims

1. (A) a polycarbonate resin, (B) a styrene-based resin; and (C-1) Contains polyoxyethylene polyoxypropylene glycol, The content of the component (C-1) is 0.5 to 3.5 parts by mass per 100 parts by mass of the total of the components (A) and (B).

2. (A) a polycarbonate resin, (B) a styrene-based resin, (C-1) Polyoxyethylene polyoxypropylene glycol and Contains sodium (C-2) alkyl (C10-16) benzenesulfonate, the content of the component (C-1) is 20 to 80 mass% and the content of the component (C-2) is 80 to 20 mass% based on 100 mass% of the total of the component (C-1) and the component (C-2), The cleaning resin composition comprises 1 to 5 parts by mass of the total of the components (C-1) and (C-2) per 100 parts by mass of the total of the components (A) and (B).

3. 3. The cleaning resin composition according to claim 1, further comprising (E) glass fibers in an amount of 10 to 100 parts by mass per 100 parts by mass of the total of the components (A) and (B).

4. 4. The cleaning resin composition according to claim 1, wherein the content of component (A) is 75 to 95 mass%, and the content of component (B) is 25 to 5 mass%, based on 100 mass% of the total of component (A) and component (B).

5. The cleaning resin composition according to any one of claims 1 to 4, wherein the styrene-based resin of component (B) is selected from the group consisting of polystyrene (PS), high impact polystyrene (HIPS), acrylonitrile-styrene resin (AS resin), acrylonitrile-butadiene-styrene resin (ABS resin), methyl methacrylate-butadiene-styrene resin (MBS resin) and butyl acrylate-acrylonitrile-styrene resin (AAS resin).

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