Mobility measurement device
JP7627071B2Active Publication Date: 2025-02-05UNIQUE CHIPS LLC
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Patent Information
- Application Number
- JP2024087678
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2024-05-30
- Publication Date
- 2025-02-05
- Estimated Expiration
- 2040-12-22
Smart Images

Figure 0007627071000001 
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Abstract
To provide a method and a measuring device that prevent melting of a metal needle by limiting an electric current to the metal needle and does not cause denaturation of a measured sample, when measuring sheet resistance of a conductive layer formed on a conductive substrate or surface, such as a semiconductor substrate, mobility of electrons, holes, and other carriers within the conductive layer, and carrier concentration within the conductive layer.SOLUTION: In a method for measuring a high voltage generating mechanism using a piezoelectric material and a 4-terminal probe, all 2-way switches 9 fall on output terminals A1 to A4 of a 2X4 matrix switch on a 2X4 matrix switch 8 side, metal needles 13-16 are energized and ohmic formation occurs, after the ohmic formation of each metal needle is completed, the 2-way switch 9 falls on the switching side terminals B1-B4 to a measurement side of the 2-way switch to which metal needles 13-16 are connected to a 4X4 matrix switch 10, and are connected to a current source 11 and a voltmeter 12.SELECTED DRAWING: Figure 1
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