Vehicle lighting device and vehicle lamp

JP7630770B2Active Publication Date: 2025-02-18TOSHIBA LIGHTING & TECHNOLOGY CORP
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Patent Information

Application Number
JP2021133887
Authority / Receiving Office
JP · JP
Patent Type
Patents
Current Assignee / Owner
Filing Date
2021-08-19
Publication Date
2025-02-18
Estimated Expiration
2041-08-19

AI Technical Summary

Benefits of technology

【0009】 本発明の実施形態によれば、車両用照明装置の小型化と、放熱性の向上とを図ることができる車両用照明装置、および車両用灯具を提供することができる。

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Patent Text Reader

Abstract

To provide a vehicular lighting device which can achieve downsizing of the vehicular lighting device and improvement of heat radiation performance, and to provide a vehicular lamp fitting.SOLUTION: A vehicular lighting device according to an embodiment includes: a socket; a substrate having a base provided at one end side of the socket and including a metal, an insulator layer provided on a surface which is opposite to the socket side of the base, and a wiring pattern provided on a surface, which is opposite to the base side, of the insulator layer; light emitting elements electrically connected with the wiring pattern; multiple power supply terminals each of which is provided within the socket and electrically connected at one end to the wiring pattern; and multiple insulative cylinder parts respectively provided at the multiple power supply terminals. Each power supply terminal extends within the cylinder part and protrudes from one end of the cylinder part. In a base thickness direction, an area near one end of the cylinder part is located within the base.SELECTED DRAWING: Figure 3
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Description

[Technical field]

[0001] An embodiment of the present invention relates to a vehicle lighting device and a vehicle lamp. [Background technology]

[0002] 2. Description of the Related Art From the standpoint of energy saving and life extension, vehicle lighting devices equipped with light emitting diodes have become increasingly popular instead of vehicle lighting devices equipped with filaments. In recent years, there has been a demand for lighter and more compact vehicle lighting devices from the standpoint of improving the driving distance (fuel efficiency) per unit volume of fuel such as gasoline or diesel, or extending the range of electric vehicles.

[0003] When a vehicle lighting device equipped with a light-emitting element is turned on, light is emitted from the light-emitting element, and heat is generated in the light-emitting element, resistors electrically connected to the light-emitting element, etc. In addition, in the case of a vehicle lighting device, the vehicle lighting device may be placed in a high-temperature environment of about 85°C.

[0004] When the temperature of the light-emitting element exceeds the maximum junction temperature due to heat generated in the light-emitting element or resistor, the environmental temperature, etc., the light-emitting element may break down or its lifespan may be shortened. In this case, if the vehicle lighting device is made smaller, the cross-sectional area of ​​the part through which the heat of the vehicle lighting device is transmitted becomes smaller, making it difficult to dissipate the heat generated in the light-emitting element, etc. Furthermore, in recent years, there has been a demand for vehicle lighting devices with higher luminous flux, and this has led to an increase in the current flowing through the light-emitting elements, etc. When the current flowing through the light-emitting elements, etc. is increased, the heat generated in the light-emitting elements, etc. increases, and the temperature of the light-emitting elements that are turned on tends to become even higher.

[0005] Therefore, there has been a demand for the development of technology that can reduce the size of vehicle lighting devices and improve heat dissipation. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] JP 2013-25935 A Summary of the Invention [Problem to be solved by the invention]

[0007] An object of the present invention is to provide a vehicle lighting device and a vehicle lamp that can reduce the size of the vehicle lighting device and improve the heat dissipation performance. [Means for solving the problem]

[0008] The vehicle lighting device according to the embodiment includes: Conductive a substrate including a socket, a base including a metal provided on one end side of the socket, an insulating layer provided on a surface of the base opposite to the socket side, and a wiring pattern provided on a surface of the insulating layer opposite to the base side; and a light-emitting element electrically connected to the wiring pattern; a retaining portion that is provided inside a hole that is provided in the socket, has insulating properties, and has an end portion on the board side that is provided at a position farther away from the board than an opening of the hole on the board side; The above Holding part One end of the , protruding from the end of the holding portion on the substrate side, a plurality of power supply terminals electrically connected to the wiring pattern; and The substrate is connected to the end of the holding portion on the substrate side. and a cylindrical portion having a base. The power supply terminal extends inside the cylindrical portion and protrudes from one end of the cylindrical portion. In the thickness direction of the base, a vicinity of the one end of the cylindrical portion is located inside the base. The other end of the cylindrical portion is provided at the end of the holding portion on the substrate side. Effect of the Invention

[0009] According to the embodiments of the present invention, it is possible to provide a vehicle lighting device and a vehicle lamp that are capable of achieving a reduction in size of the vehicle lighting device and improved heat dissipation. [Brief description of the drawings]

[0010] [Figure 1] 1 is a schematic perspective view illustrating a vehicle lighting device according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view of the vehicle lighting device taken along line AA in FIG. 1. [Diagram 3] 4 is a schematic cross-sectional view illustrating a cylindrical portion. FIG. [Figure 4] 1 is a schematic partial cross-sectional view illustrating a vehicle lamp. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0011] Hereinafter, an embodiment will be described with reference to the drawings. In the drawings, the same components are denoted by the same reference numerals, and detailed description thereof will be omitted as appropriate.

[0012] (Vehicle lighting device) The vehicle lighting device 1 according to the present embodiment can be installed in, for example, an automobile or a railcar. Examples of the vehicle lighting device 1 installed in an automobile include a front combination light (for example, a combination of a daytime running lamp (DRL), a position lamp, a turn signal lamp, etc.) and a rear combination light (for example, a combination of a stop lamp, a tail lamp, a turn signal lamp, a back lamp, a fog lamp, etc.). However, the uses of the vehicle lighting device 1 are not limited to these.

[0013] FIG. 1 is a schematic perspective view illustrating a vehicle lighting device 1 according to the present embodiment. FIG. 2 is a cross-sectional view of the vehicle lighting device 1 taken along line AA in FIG. As shown in FIGS. 1 and 2, a vehicle lighting device 1 includes a socket 10, a light emitting module 20, a power supply unit 30, and a heat transfer unit 40, for example.

[0014] The socket 10 has, for example, a mounting portion 11, a bayonet 12, a flange 13, heat dissipation fins 14, and a connector holder 15. The mounting part 11 is provided, for example, on a surface of the flange 13 opposite to the side on which the heat dissipation fins 14 are provided. The outer shape of the mounting part 11 can be columnar. The outer shape of the mounting part 11 is, for example, cylindrical. The mounting part 11 has, for example, a recess 11a that opens at the end opposite to the flange 13 side.

[0015] The bayonet 12 is provided, for example, on a side surface of the mounting portion 11. The bayonet 12 protrudes, for example, toward the outside of the vehicle lighting device 1. The bayonet 12 faces the flange 13. A plurality of bayonets 12 may be provided. The bayonet 12 is used when mounting the vehicle lighting device 1, for example, to a housing 101 of a vehicle lamp 100 described later. The bayonet 12 may be used for a twist lock.

[0016] The flange 13 has, for example, a plate shape. The flange 13 has, for example, a substantially circular plate shape. A side surface of the flange 13 is located outward of the vehicle lighting device 1 with respect to a side surface of the bayonet 12.

[0017] The heat dissipating fin 14 is provided, for example, on the side of the flange 13 opposite to the mounting portion 11 side. At least one heat dissipating fin 14 can be provided. For example, the socket 10 illustrated in FIG. 1 is provided with a plurality of heat dissipating fins 14. The plurality of heat dissipating fins 14 can be arranged side by side in a predetermined direction. The heat dissipating fin 14 has, for example, a plate or cylinder shape.

[0018] The connector holder 15 is provided, for example, on the side of the flange 13 opposite to the mounting portion 11. The connector holder 15 can be provided alongside the heat dissipation fins 14. The connector holder 15 has a cylindrical shape, and a connector 105 having a seal member 105a therein is inserted into the connector holder 15.

[0019] The socket 10 has a function of holding the light-emitting module 20 and the power supply unit 30, and a function of transferring heat generated in the light-emitting module 20 to the outside. Therefore, the socket 10 is preferably made of a material with high thermal conductivity. For example, the socket 10 can be made of a metal such as an aluminum alloy.

[0020] In recent years, it is desirable for the socket 10 to be lightweight and capable of efficiently dissipating heat generated in the light-emitting module 20. For this reason, it is more preferable for the socket 10 to be formed from, for example, a highly thermally conductive resin. The highly thermally conductive resin includes, for example, a resin and a filler using an inorganic material. The highly thermally conductive resin is, for example, a resin such as PET (Polyethylene terephthalate) or nylon mixed with a filler using carbon, aluminum oxide, or the like.

[0021] If the socket 10 contains a highly thermally conductive resin and has the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 molded integrally, the heat generated in the light-emitting module 20 can be efficiently dissipated. In addition, the weight of the socket 10 can be reduced. In this case, the mounting portion 11, bayonet 12, flange 13, heat dissipation fins 14, and connector holder 15 can be molded integrally using a method such as injection molding. Also, the socket 10 and the power supply portion 30 can be molded integrally using a method such as insert molding.

[0022] The light emitting module 20 includes, for example, a substrate 21, a light emitting element 22, a frame portion 23, a sealing portion 24, and an element 25. The substrate 21 has a plate shape. The planar shape of the substrate 21 is, for example, a rectangle. The substrate 21 is provided on one end side of the socket 10. The substrate 21 is, for example, bonded to the upper surface of the heat transfer section 40. When the heat transfer section 40 is not provided, the substrate 21 is, for example, bonded to the bottom surface 11a1 of the recess 11a. In this case, it is preferable that the adhesive be an adhesive with high thermal conductivity. For example, the adhesive can be an adhesive mixed with a filler using an inorganic material. The thermal conductivity of the adhesive is, for example, 0.5 W / (m·K) or more and 10 W / (m·K) or less.

[0023] When the vehicle lighting device 1 including the light-emitting element 22 is turned on, light is emitted from the light-emitting element 22 and heat is generated in the light-emitting element 22 and the element 25 electrically connected to the light-emitting element 22. The generated heat is transmitted to the socket 10 via the substrate 21 and is released to the outside from the socket 10. Therefore, from the viewpoint of heat dissipation, it is preferable to form the substrate 21 using a material with high thermal conductivity. For example, the substrate 21 can be formed from ceramics such as aluminum oxide or aluminum nitride, highly thermally conductive resin, or the like.

[0024] Furthermore, the substrate 21 may be a metal core substrate. The substrate 21 illustrated in Fig. 2 is a metal core substrate. If the substrate 21 is a metal core substrate, the heat generated in the light emitting element 22 and the element 25 can be efficiently transferred to the socket 10.

[0025] As shown in FIG. 2, substrate 21, which is a metal core substrate, has base 21a and insulating layer 21b. The base 21a is plate-shaped and contains a metal, such as aluminum, an aluminum alloy, copper, or a copper alloy, that has high thermal conductivity. The insulating layer 21b can be provided on the surface of the base 21a opposite to the socket 10 side. Note that the insulating layer 21b can also be provided on the surface of the base 21a facing the socket 10. The insulating layer 21b can be made of an insulating material. The insulating layer 21b can be made of, for example, an organic material such as a resin, or an inorganic material such as a ceramic.

[0026] Moreover, a wiring pattern 21c is provided on the surface of the insulating layer 21b opposite to the base 21a side. The wiring pattern 21c is formed of, for example, a material mainly composed of silver or a material mainly composed of copper. The surface of the wiring pattern 21c may be plated with gold or nickel-palladium-gold.

[0027] The substrate 21 may also be provided with a covering portion 21e that covers the wiring pattern 21c, a film resistor described later, and the like. For example, the covering portion 21e may be provided so as to cover an area of ​​the substrate 21 outside an area in which the frame portion 23 is provided. In this case, a portion of the wiring pattern 21c on which the element 25 is mounted, and a portion of the wiring pattern 21c on which a plurality of power supply terminals 31 described later are soldered, and the like may be exposed from the covering portion 21e.

[0028] The covering portion 21e may include, for example, white resist, glass, etc. If the covering portion 21e is formed of a material with high reflectance such as white resist, the light emitted from the light emitting element 22 and incident on the covering portion 21e can be reflected toward the front side of the vehicle lighting device 1. Therefore, the utilization efficiency of the light emitted from the light emitting element 22 can be improved.

[0029] The light emitting element 22 is provided on the substrate 21. The light emitting element 22 is electrically connected to the wiring pattern 21c. At least one light emitting element 22 can be provided. When a plurality of light emitting elements 22 are provided, the plurality of light emitting elements 22 can be connected in series.

[0030] The light emitting elements 22 may be, for example, light emitting diodes, organic light emitting diodes, laser diodes, or the like. The light emitting element 22 may be a chip-shaped light emitting element, a surface mount type light emitting element such as a PLCC (Plastic Leaded Chip Carrier) type, or a light emitting element having a lead wire such as a bullet type. The light emitting element 22 illustrated in Figs. 1 and 2 is a chip-shaped light emitting element. In this case, in consideration of the miniaturization of the light emitting module 20 and therefore the miniaturization of the vehicle lighting device 1, it is preferable to use a chip-shaped light emitting element. In the following, as an example, a case where the light emitting element 22 is a chip-shaped light emitting element will be described.

[0031] The chip-shaped light-emitting element 22 can be mounted on the wiring pattern 21c by COB (Chip On Board). The chip-shaped light-emitting element 22 can be, for example, an upper electrode type light-emitting element, an upper and lower electrode type light-emitting element, a flip chip type light-emitting element, etc. The chip-shaped light-emitting element 22 illustrated in Figs. 1 and 2 is an upper and lower electrode type light-emitting element. The electrode of the upper electrode type light-emitting element or the upper electrode of the upper and lower electrode type light-emitting element can be electrically connected to the wiring pattern 21c by the wiring 21d. In this case, the wiring 21b can be connected by, for example, a wire bonding method. The flip chip type light-emitting element 22 can be directly mounted on the wiring pattern 21c.

[0032] The number, size, arrangement, etc. of the light-emitting elements 22 are not limited to those exemplified above, and can be changed as appropriate depending on the size, use, etc. of the vehicle lighting device 1.

[0033] The frame portion 23 is provided on the substrate 21. The frame portion 23 has a frame shape and is bonded onto the substrate 21. The light emitting elements 22 are arranged in the area surrounded by the frame portion 23. The frame portion 23 is formed from, for example, a resin. The resin may be, for example, a thermoplastic resin such as PBT (polybutylene terephthalate), PC (polycarbonate), PET, nylon, PP (polypropylene), PE (polyethylene), or PS (polystyrene).

[0034] Frame 23 can have a function of defining the formation range of sealing portion 24 and a function of a reflector. Therefore, frame 23 can contain titanium oxide particles or the like or a white resin in order to improve reflectance.

[0035] Also, the frame portion 23 can be omitted. However, if the frame portion 23 is provided, it is possible to improve the efficiency of using the light irradiated from the light emitting element 22. Also, since the area in which the sealing portion 24 is formed can be reduced, it is possible to reduce the size of the light emitting module 20, and therefore the size of the vehicle lighting device 1.

[0036] The sealing portion 24 is provided inside the frame portion 23. The sealing portion 24 is provided so as to cover the area surrounded by the frame portion 23. The sealing portion 24 is provided so as to cover the light-emitting element 22. The sealing portion 24 contains a resin having light-transmitting properties. The sealing portion 24 is formed, for example, by filling the inside of the frame portion 23 with resin. The filling of the resin is performed, for example, using a dispenser or the like. The resin to be filled is, for example, a silicone resin or the like. When the frame portion 23 is omitted, for example, a dome-shaped sealing portion 24 is provided on the substrate 21.

[0037] Furthermore, the sealing portion 24 may contain a phosphor. The phosphor may be, for example, a YAG phosphor (yttrium-aluminum-garnet phosphor). However, the type of phosphor may be appropriately changed so as to obtain a predetermined emission color depending on the application of the vehicle lighting device 1.

[0038] The element 25 can be a passive element or an active element used to configure a light-emitting circuit having the light-emitting element 22. The element 25 is provided on the substrate 21. For example, the element 25 can be provided on the periphery of the frame portion 23. The element 25 is electrically connected to the wiring pattern 21c. At least one element 25 can be provided.

[0039] The element 25 may be, for example, a resistor 25a and a control element 25b. However, the type of element 25 is not limited to the exemplified ones, and can be changed as appropriate depending on the configuration of the light-emitting circuit having the light-emitting element 22. For example, in addition to the above-mentioned ones, the element 25 may be a capacitor, a positive characteristic thermistor, a negative characteristic thermistor, an inductor, a surge absorber, a varistor, a transistor such as a FET or a bipolar transistor, an integrated circuit, a computing element, and the like.

[0040] The resistor 25a is provided on the substrate 21. The resistor 25a is electrically connected to the wiring pattern 21c. The resistor 25a is connected in series to the light-emitting element 22 via the wiring pattern 21c. The resistor 25a can be, for example, a surface-mount resistor, a resistor having leads (metal oxide film resistor), or a film resistor formed by using a screen printing method or the like. The resistor 25a illustrated in FIG. 1 is a film resistor.

[0041] The material of the film resistor is, for example, ruthenium oxide (RuO2). The film resistor is formed, for example, by using a screen printing method and a baking method. If the resistor 25a is a film resistor, the contact area between the resistor 25a and the substrate 21 can be increased, so that the heat dissipation can be improved. In addition, a plurality of resistors 25a can be formed at once. Therefore, the productivity can be improved. In addition, the variation in the resistance value of the plurality of resistors 25a can be suppressed.

[0042] Here, since there is variation in the forward voltage characteristics of the light-emitting element 22, if the voltage applied between the anode terminal and the ground terminal is constant, variation occurs in the brightness (luminous flux, luminance, luminous intensity, illuminance) of the light irradiated from the light-emitting element 22. Therefore, in order to keep the brightness of the light irradiated from the light-emitting element 22 within a predetermined range, the value of the current flowing through the light-emitting element 22 is controlled to be within a predetermined range by the resistor 25a connected in series to the light-emitting element 22. In this case, the resistance value of the resistor 25a is changed to keep the value of the current flowing through the light-emitting element 22 within the predetermined range.

[0043] When the resistor 25a is a surface mount resistor or a resistor with leads, the resistor 25a is selected to have an appropriate resistance value according to the forward voltage characteristics of the light emitting element 22. When the resistor 25a is a film resistor, the resistance value can be increased by removing a part of the resistor 25a. For example, a part of the film resistor can be easily removed by irradiating the film resistor with laser light. The number and size of the resistors 25a are not limited to those exemplified, and can be appropriately changed according to the number and specifications of the light emitting elements 22.

[0044] The control element 25b is provided on the substrate 21. The control element 25b is electrically connected to the wiring pattern 21c. The control element 25b is provided, for example, to prevent a reverse voltage from being applied to the light-emitting element 22 and to prevent pulse noise from the reverse direction from being applied to the light-emitting element 22. The control element 25b is, for example, a surface-mounted diode or a diode having a lead wire. The control element 25b illustrated in FIG. 1 is a surface-mounted diode.

[0045] Other optical elements may be provided as necessary. The optical elements may be provided, for example, on the sealing portion 24. The optical elements may be, for example, a convex lens, a concave lens, a light guide, or the like.

[0046] The heat transfer section 40 is provided, for example, between the substrate 21 and the bottom surface 11a1 of the recess 11a. The heat transfer section 40 can be attached, for example, to the bottom surface 11a1 of the recess 11a. The adhesive that bonds the heat transfer section 40 to the bottom surface 11a1 of the recess 11a is preferably an adhesive with high thermal conductivity. The adhesive can be, for example, the same as the adhesive that bonds the substrate 21 and the heat transfer section 40.

[0047] The heat transfer unit 40 can also be embedded in the bottom surface 11a1 of the recess 11a by insert molding. The heat transfer unit 40 can also be attached to the bottom surface 11a1 of the recess 11a via a layer of thermally conductive grease (heat dissipating grease). There is no particular limitation on the type of thermally conductive grease, but it can be, for example, a mixture of modified silicone and a filler using a material with high thermal conductivity (for example, ceramics such as aluminum oxide or aluminum nitride). The thermal conductivity of the thermally conductive grease can be, for example, 1 W / (m·K) or more and 5 W / (m·K) or less.

[0048] The heat transfer section 40 is provided to facilitate the transfer of heat generated in the light-emitting module 20 to the socket 10. For this reason, the heat transfer section 40 is preferably formed from a material with high thermal conductivity. The heat transfer section 40 has a plate shape, and can be formed from a metal such as aluminum, an aluminum alloy, copper, or a copper alloy. In addition, when the amount of heat generated in the light-emitting module 20 is small, the heat transfer section 40 can be omitted.

[0049] The power supply unit 30 has, for example, a plurality of power supply terminals 31, a holding portion 32, and a tube portion 33. The plurality of power supply terminals 31 can be rod-shaped. One end of each of the plurality of power supply terminals 31 protrudes from the bottom surface 11a1 of the recess 11a. The plurality of power supply terminals 31 are arranged, for example, in a predetermined direction. One end of each of the plurality of power supply terminals 31 is soldered to the wiring pattern 21c provided on the substrate 21. That is, the plurality of power supply terminals 31 are provided inside the socket 10, and one end is electrically connected to the wiring pattern 21c. The other end of each of the plurality of power supply terminals 31 is exposed inside the hole of the connector holder 15. The connector 105 is fitted to the plurality of power supply terminals 31 exposed inside the hole of the connector holder 15. The plurality of power supply terminals 31 are formed of, for example, a metal such as a copper alloy. The shape, arrangement, material, and the like of the multiple power supply terminals 31 are not limited to those exemplified above, and can be modified as appropriate.

[0050] As described above, it is preferable that the socket 10 is made of a material having high thermal conductivity. However, materials having high thermal conductivity may have electrical conductivity. For example, metals such as aluminum alloys and highly thermally conductive resins containing a filler using carbon have electrical conductivity. Therefore, the holding portion 32 is provided to insulate the multiple power supply terminals 31 from the socket 10 having electrical conductivity. The holding portion 32 also has a function of holding the multiple power supply terminals 31. If the socket 10 is made of a highly thermally conductive resin having electrical insulation (for example, a highly thermally conductive resin containing a filler using aluminum oxide), the holding portion 32 can be omitted. In this case, the socket 10 holds the multiple power supply terminals 31. The holding portion 32 is made of, for example, a resin having electrical insulation. The holding portion 32 can be, for example, pressed into a hole 10a provided in the socket 10 or adhered to the inner wall of the hole 10a.

[0051] Here, when the light-emitting element 22 is turned on, heat is generated in the light-emitting element 22 and the element 25 electrically connected to the light-emitting element 22. In the case of the vehicle lighting device 1, the vehicle lighting device 1 may be placed in a high-temperature environment of about 85° C. If the temperature of the turned-on light-emitting element 22 exceeds the maximum junction temperature due to the heat generated in the light-emitting element 22 or the environmental temperature, the light-emitting element 22 may break down or have a shortened lifespan.

[0052] In recent years, there has been a demand for a vehicle lighting device 1 with higher luminous flux, and there are cases where the current flowing through the light-emitting element 22 is increased. If the current flowing through the light-emitting element 22 is increased, the heat generated in the light-emitting element 22 and the element 25 increases.

[0053] Furthermore, from the viewpoint of improving fuel efficiency or extending the driving range of an electric vehicle, there is a demand for reducing the weight of the vehicle lighting device 1 and, in turn, reducing the size of the vehicle lighting device 1. In this case, if the socket 10 is made smaller, the cross-sectional area of ​​the mounting portion 11 in a direction perpendicular to the central axis of the socket 10 is reduced. If the cross-sectional area of ​​the mounting portion 11 is reduced, the cross-sectional area of ​​the portion through which heat is transmitted between the light-emitting module 20 and the heat dissipation fins 14 is also reduced, so that heat generated in the light-emitting element 22 and the like is less likely to be transmitted to the heat dissipation fins 14. Therefore, if the socket 10 and, in turn, the vehicle lighting device 1 are made smaller, there is a risk that the heat dissipation performance will decrease.

[0054] In this case, if the substrate 21 is a metal core substrate, the heat generated in the light emitting element 22 and the element 25 can be efficiently conducted to the socket 10 even if the vehicle lighting device 1 is made compact. Therefore, if the substrate 21 is a metal core substrate, the vehicle lighting device 1 can be made smaller and its heat dissipation properties can be improved.

[0055] 1, the power supply terminal 31 is soldered to the wiring pattern 21c. The wiring pattern 21c is provided on the surface of the insulating layer 21b opposite to the base 21a. Therefore, the power supply terminal 31 extends inside the board 21 in the thickness direction of the board 21. As described above, the base 21a of the board 21 contains metal, so a short circuit will occur if the power supply terminal 31 and the base 21a come into contact with each other.

[0056] Therefore, the power supply unit 30 is provided with a cylindrical portion 33 . FIG. 3 is a schematic cross-sectional view illustrating the tube portion 33. As shown in FIG. FIG. 3 is a cross-sectional view of the vehicle lighting device 1 taken along line BB in FIG.

[0057] As shown in FIG. 2 and FIG. 3, the tube portion 33 has a tube shape and is provided on each of the multiple power supply terminals 31. The tube portion 33 has, for example, a cylindrical shape or a square tube shape. The power supply terminal 31 extends inside the tube portion 33 and protrudes from one end of the tube portion 33. In the thickness direction of the base 21a, the vicinity of one end of the tube portion 33 is located inside the base 21a. For example, the base 21a has a hole penetrating in the thickness direction, and the vicinity of one end of the tube portion 33 can be provided inside the hole. The vicinity of one end of the tube portion 33 may be pressed into the hole, may be provided inside the hole via a gap, or may be bonded to the hole. The other end of the tube portion 33 can be provided, for example, at the end of the holding portion 32.

[0058] The cylindrical portion 33 has insulating properties. The cylindrical portion 33 can be formed from, for example, an inorganic material such as ceramics, or an organic material such as resin. If the cylindrical portion 33 has insulating properties, it is possible to prevent a short circuit between the power supply terminal 31 and the base 21a of the substrate 21.

[0059] When the vehicle lighting device 1 is made smaller, the planar dimensions of the substrate 21 may become smaller. Furthermore, as shown in Fig. 1, a plurality of power supply terminals 31 may be arranged side by side along the sides of the substrate 21. In such a case, the distance between the power supply terminals 31 may be shortened according to the planar dimensions of the substrate 21. If the tube portion 33 is provided, it is possible to prevent the power supply terminals 31 from shorting out with the adjacent power supply terminals 31 even if the distance between the power supply terminals 31 becomes shorter.

[0060] In the thickness direction of base 21a, one end of tubular portion 33 may be flush with the surface of insulating layer 21b opposite to base 21a, or may be positioned between the surface of insulating layer 21b opposite to base 21a and the surface of insulating layer 21b facing base 21a. However, as shown in Fig. 3, it is preferable that one end of the tube portion 33 protrudes from the surface of the insulating layer 21b opposite to the base 21a in the thickness direction of the base 21a. In this way, when the power supply terminal 31 is soldered to the wiring pattern 21c, it is possible to prevent the solder from reaching the base 21a.

[0061] As described above, the heat transfer part 40 may be provided between the board 21 and the socket 10. When the heat transfer part 40 is provided, a hole or a notch for inserting the tubular part 33 may be provided in the heat transfer part 40. If the tubular part 33 having insulating properties is provided, it is possible to prevent a short circuit between the power supply terminal 31 and the heat transfer part 40 including metal.

[0062] As described above, if the substrate 21 is a metal core substrate and the cylindrical portion 33 is provided, the vehicle lighting device 1 can be further reduced in size and the heat dissipation performance can be improved.

[0063] (Vehicle lighting fixtures) Next, the vehicle lamp 100 will be illustrated. In the following, as an example, a case where the vehicular lamp 100 is a front combination light installed in an automobile will be described. However, the vehicular lamp 100 is not limited to a front combination light installed in an automobile. The vehicular lamp 100 may be any vehicular lamp that is installed in an automobile, a railroad car, or the like.

[0064] FIG. 4 is a schematic partial cross-sectional view illustrating the vehicle lamp 100. As shown in FIG. As shown in FIG. 4, the vehicle lamp 100 includes, for example, the vehicle lighting device 1, a housing 101, a cover 102, an optical element 103, a seal member 104, and a connector 105.

[0065] The vehicle lighting device 1 is attached to the housing 101. The housing 101 holds the mounting portion 11. The housing 101 is box-shaped with one end side open. The housing 101 is formed of, for example, a resin that does not transmit light. The bottom surface of the housing 101 is provided with a mounting hole 101a into which the portion of the mounting portion 11 provided with the bayonet 12 is inserted. A recess is provided around the mounting hole 101a into which the bayonet 12 provided on the mounting portion 11 is inserted. Note that, although the case where the mounting hole 101a is directly provided in the housing 101 has been exemplified, a mounting member having the mounting hole 101a may be provided on the housing 101.

[0066] When mounting the vehicle lighting device 1 to the vehicle lamp 100, the portion of the mounting portion 11 on which the bayonet 12 is provided is inserted into the mounting hole 101a, and the vehicle lighting device 1 is rotated. Then, for example, the bayonet 12 is held in a fitting portion provided on the periphery of the mounting hole 101a. This type of mounting method is called a twist lock.

[0067] The cover 102 is provided so as to cover the opening of the housing 101. The cover 102 is made of a light-transmitting resin or the like. The cover 102 may also have a function such as a lens.

[0068] Light emitted from the vehicle lighting device 1 is incident on the optical element 103. The optical element 103 reflects, diffuses, guides, and collects the light emitted from the vehicle lighting device 1, and forms a predetermined light distribution pattern. For example, the optical element 103 illustrated in Fig. 4 is a reflector. In this case, the optical element 103 reflects the light emitted from the vehicle lighting device 1 to form a predetermined light distribution pattern.

[0069] The seal member 104 is provided between the flange 13 and the housing 101. The seal member 104 has an annular shape and is made of an elastic material such as rubber or silicone resin.

[0070] When the vehicle lighting device 1 is attached to the vehicle lamp 100, the seal member 104 is sandwiched between the flange 13 and the housing 101. Therefore, the seal member 104 can seal the internal space of the housing 101. In addition, the bayonet 12 is pressed against the housing 101 by the elastic force of the seal member 104. Therefore, it is possible to prevent the vehicle lighting device 1 from coming off the housing 101.

[0071] The connector 105 is fitted to ends of the multiple power supply terminals 31 exposed inside the connector holder 15. A power source (not shown) and the like are electrically connected to the connector 105. Therefore, by fitting the connector 105 to ends of the multiple power supply terminals 31, the power source (not shown) and the light-emitting element 22 can be electrically connected.

[0072] Furthermore, a seal member 105a is provided on the connector 105. When the connector 105 having the seal member 105a is inserted into the inside of the connector holder 15, the inside of the connector holder 15 is sealed so as to be watertight.

[0073] Although some embodiments of the present invention have been illustrated above, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, modifications, etc. can be made without departing from the gist of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention and its equivalents described in the claims. In addition, the above-mentioned embodiments can be implemented in combination with each other. [Explanation of symbols]

[0074] REFERENCE SIGNS LIST 1 vehicle lighting device, 10 socket, 11 mounting portion, 20 light emitting module, 21 substrate, 21a base, 21b insulating layer, 21c wiring pattern, 22 light emitting element, 25 element, 30 power supply portion, 31 power supply terminal, 33 tube portion

Claims

1. A conductive socket; a substrate provided on one end side of the socket, the substrate including a base including a metal, an insulating layer provided on a surface of the base opposite to the socket side, and a wiring pattern provided on a surface of the insulating layer opposite to the base side; a light-emitting element electrically connected to the wiring pattern; a retaining portion that is provided inside a hole that is provided in the socket, has insulating properties, and has an end portion on the board side that is provided at a position farther away from the board than an opening of the hole on the board side; a plurality of power supply terminals provided inside the holding portion, the power supply terminals having one end protruding from the end of the holding portion on the substrate side and electrically connected to the wiring pattern; a cylindrical portion provided on each of the plurality of power supply terminals, the cylindrical portion having insulating properties and extending between the end of the holding portion on the substrate side and the substrate; Equipped with the power supply terminal extends inside the cylindrical portion and protrudes from one end of the cylindrical portion, A vehicle lighting device, wherein in the thickness direction of the base, the vicinity of one end of the tubular portion is located inside the base, and the other end of the tubular portion is provided at the end of the holding portion on the substrate side.

2. The vehicle lighting device according to claim 1 , wherein the base has a hole penetrating therethrough in a thickness direction, and the vicinity of one end of the cylindrical portion is provided inside the hole.

3. The vehicle lighting device according to claim 1 , wherein one end of the cylindrical portion in a thickness direction of the base protrudes from a surface of the insulating layer opposite to the base side.

4. 3. The vehicle lighting device according to claim 1, wherein, in the thickness direction of the base, one end of the tubular portion is flush with a surface of the insulating layer opposite the base side, or is located between a surface of the insulating layer opposite the base side and a surface of the insulating layer on the base side.

5. A vehicle lighting device according to any one of claims 1 to 4; A housing in which the vehicle lighting device is mounted; A vehicle lamp equipped with:

Citation Information

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