Light emitting device and electronic device

Abstract

To provide a light-emitting element that can be mounted on an array substrate of an electronic appliance efficiently, and the electronic appliance on which the light-emitting element is mounted.SOLUTION: A light-emitting element according to an embodiment includes a light-emitting part including a first main surface and a second main surface, and a first terminal electrode and a second terminal electrode provided on the second main surface side of the light-emitting part. The first terminal electrode includes a first cavity part at a position overlapping with a first connection electrode of the substrate in a plan view when brought into contact with the first connection electrode, and is bonded to the first connection electrode with a laser beam emitted from the light-emitting part side. The second terminal electrode includes a second cavity part at a position overlapping with a second connection electrode of the substrate in a plan view when brought into contact with the second connection electrode, and is bonded to the second connection electrode with the laser beam.SELECTED DRAWING: Figure 3

Description

[Technical field]

[0001] FIELD An embodiment of the present invention relates to a light-emitting device and an electronic device. [Background technology]

[0002] There are known electronic devices (e.g., display devices, sensor devices, etc.) that use light-emitting diodes (LEDs), which are self-emitting elements. In recent years, in order to improve performance, electronic devices that use tiny light-emitting diode elements (hereinafter simply referred to as light-emitting elements), such as micro LEDs and mini LEDs, have been developed.

[0003] In the manufacture of electronic devices using such light-emitting elements, a method is adopted in which the light-emitting elements are mounted on an array substrate of the electronic device. In this method, a terminal electrode of the light-emitting element is brought into contact with a connection electrode formed on the array substrate, and a laser beam is irradiated from the light-emitting element side near the contact surface, and the resulting thermal energy is used to metallically bond the terminal electrode of the light-emitting element to the connection electrode on the array substrate.

[0004] However, in such a mounting method, it is necessary to irradiate the laser light near the contact surface between the connection electrode on the array substrate and the terminal electrode of the light-emitting element, and if the laser light cannot be sufficiently irradiated near the contact surface, the metal bonding between the terminal electrode of the light-emitting element and the connection electrode on the array substrate may be insufficient, which means that the light-emitting element may not be efficiently mounted on the array substrate of the electronic device. [Prior art documents] [Patent documents]

[0005] [Patent Document 1] China Patent Application Publication No. 111063779 [Patent Document 2] US Patent Application Publication No. 2020 / 0161499 Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present disclosure is to provide a light-emitting element that can be efficiently mounted on an array substrate of an electronic device, and an electronic device in which the light-emitting element is mounted. [Means for solving the problem]

[0007] A light-emitting element according to one embodiment is mounted on a substrate on which a pair of a first connection electrode and a second connection electrode are formed. The light-emitting element includes a light-emitting section having a first main surface for emitting light and a second main surface opposite to the first main surface, and a first terminal electrode and a second terminal electrode provided on the second main surface side of the light-emitting section. The first terminal electrode has a first cavity at a position overlapping with the first connection electrode in a planar view when the first terminal electrode is brought into contact with the first connection electrode, and is bonded to the first connection electrode by forming a eutectic alloy with the first connection electrode by a laser beam irradiated from the light-emitting section side. The second terminal electrode has a second cavity at a position overlapping with the second connection electrode in a planar view when the second terminal electrode is brought into contact with the second connection electrode, and is bonded to the second connection electrode by forming a eutectic alloy with the second connection electrode by the laser beam. A first transparent member made of an insulating material and transmitting the laser light is disposed in the first cavity, and a second transparent member made of an insulating material and transmitting the laser light is disposed in the second cavity.

[0008] An electronic device according to an embodiment includes a substrate on which a pair of a first connection electrode and a second connection electrode are formed, and a light-emitting element mounted on the substrate and electrically connected to the first connection electrode and the second connection electrode. The light-emitting element includes a light-emitting section having a first main surface for emitting light and a second main surface opposite to the first main surface, and a first terminal electrode and a second terminal electrode provided on the second main surface side of the light-emitting section. The first terminal electrode includes a first cavity at a position overlapping with the first connection electrode in a planar view when the first terminal electrode is brought into contact with the first connection electrode, and is bonded to the first connection electrode by forming a eutectic alloy with the first connection electrode by a laser beam irradiated from the light-emitting section side. The second terminal electrode includes a second cavity at a position overlapping with the second connection electrode in a planar view when the second terminal electrode is brought into contact with the second connection electrode, and is bonded to the second connection electrode by forming a eutectic alloy with the second connection electrode by the laser beam. A first transparent member made of an insulating material and transmitting the laser light is disposed in the first cavity, and a second transparent member made of an insulating material and transmitting the laser light is disposed in the second cavity. [Brief description of the drawings]

[0009] [Figure 1] FIG. 1 is a perspective view illustrating a schematic configuration of an electronic device in which a light-emitting element according to an embodiment is mounted. [Diagram 2] FIG. 2 is a plan view showing an example of the configuration of the light emitting device according to the embodiment. [Diagram 3] FIG. 3 is a cross-sectional view showing a cross section taken along line AB shown in FIG. [Figure 4] FIG. 4 is a cross-sectional view showing an example of a mounting state of the light emitting device according to the embodiment. [Diagram 5] FIG. 5 is a cross-sectional view showing another example of a mounting mode of the light emitting device according to the embodiment. [Figure 6] FIG. 6 is a cross-sectional view showing yet another example of a mounting mode of the light emitting device according to the embodiment. [Figure 7] FIG. 7 is a cross-sectional view showing an example of the configuration of a light-emitting element according to a comparative example. [Figure 8] FIG. 8 is a plan view showing an example of the configuration of a light emitting element according to a first modified example. [Figure 9] FIG. 9 is a cross-sectional view showing a cross section taken along line CD shown in FIG. [Figure 10] FIG. 10 is a plan view showing an example of the configuration of a light emitting element according to the second modified example. [Figure 11] FIG. 11 is a plan view showing an example of the configuration of a light emitting element according to the third modified example. [Figure 12] FIG. 12 is a plan view showing an example of the configuration of a light emitting element according to the fourth modified example. [Figure 13] FIG. 13 is a plan view showing an example of the configuration of a light emitting element according to the fifth modified example. [Figure 14] FIG. 14 is a plan view showing an example of the configuration of a light emitting element according to the sixth modified example. [Figure 15] FIG. 15 is a plan view showing another example of the configuration of the light emitting element according to the sixth modified example. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0010] Hereinafter, an embodiment will be described with reference to the drawings. The disclosure is merely an example, and those who are skilled in the art can easily conceive of appropriate modifications while keeping the gist of the invention are naturally included in the scope of the present invention. In addition, the drawings may be shown in a schematic manner compared to the embodiment in order to make the explanation clearer, but they are merely an example and do not limit the interpretation of the present invention. In addition, in this specification and each figure, components that perform the same or similar functions as those described above with respect to the previous figures are given the same reference numerals, and duplicate detailed explanations may be omitted.

[0011] In this specification, the light-emitting element LED will be mainly described. In addition, in this specification, the display device 1 is illustrated as an example of an electronic device in which the light-emitting element LED is mounted, but the present invention is not limited to this, and the light-emitting element LED may be mounted in an electronic device different from the display device 1.

[0012] Fig. 1 is a perspective view that shows a schematic configuration of a display device 1 on which a light-emitting element LED according to this embodiment is mounted. Fig. 1 shows a three-dimensional space defined by a first direction X, a second direction Y perpendicular to the first direction X, and a third direction Z perpendicular to the first direction X and the second direction Y. Note that the first direction X and the second direction Y are orthogonal to each other, but may intersect at an angle other than 90 degrees. In this specification, observing the display device 1 from a direction parallel to the third direction Z is called a planar view.

[0013] As shown in FIG. 1, the display device 1 includes a display panel 2, a first circuit board 3, a second circuit board 4, and the like.

[0014] In one example, the display panel 2 is rectangular. In the illustrated example, the short side EX of the display panel 2 is parallel to the first direction X, and the long side EY of the display panel 2 is parallel to the second direction Y. The third direction Z corresponds to the thickness direction of the display panel 2. The main surface of the display panel 2 is parallel to the XY plane defined by the first direction X and the second direction Y. The display panel 2 has a display area DA and a peripheral area SA outside the display area DA. The peripheral area SA has a terminal area MT. In the illustrated example, the peripheral area SA surrounds the display area DA.

[0015] The display area DA is an area for displaying an image, and includes a plurality of pixels PX arranged in a matrix, for example. Each pixel PX includes a light-emitting element LED, a switching element (drive transistor) for driving the light-emitting element LED, and the like. The drive transistor is formed of, for example, a thin film transistor (TFT).

[0016] The terminal region MT is provided along the short side EX of the display panel 2, and includes terminals for electrically connecting the display panel 2 to an external device or the like.

[0017] The first circuit board 3 is mounted on the terminal area MT and is electrically connected to the display panel 2. The first circuit board 3 is, for example, a flexible printed circuit board. The first circuit board 3 includes an IC chip 5 for driving the display panel 2. In the illustrated example, the IC chip 5 is disposed on the first circuit board 3, but may be disposed below the first circuit board 3. Alternatively, the IC chip 5 may be mounted on a part other than the first circuit board 3. In this case, the IC chip 5 may be mounted in the peripheral area SA of the display panel 2 or on the second circuit board 4. The second circuit board 4 is, for example, a rigid printed circuit board. The second circuit board 4 is connected to the first circuit board 3, for example, below the first circuit board 3.

[0018] The IC chip 5 is connected to a control board (not shown), for example, via the second circuit board 4. The IC chip 5 executes control to display an image on the display panel 2 by driving a plurality of pixels PX based on a video signal output from the control board, for example.

[0019] The display panel 2 may have a folding area BA indicated by hatching. The folding area BA is an area that is folded when the display device 1 is housed in the housing of an electronic device or the like. The folding area BA is located on the terminal area MT side of the peripheral area SA. When the folding area BA is folded, the first circuit board 3 and the second circuit board 4 are disposed to face the display panel 2.

[0020] The light-emitting element LED mounted on the above-mentioned display device 1 (display panel 2) will be described in detail below. FIG. 2 is a plan view showing an example of the configuration of the light-emitting element LED according to this embodiment. 2, the light-emitting element LED is mounted on an array substrate SUB of the display device 1 (display panel 2). More specifically, the light-emitting element LED is mounted on an insulating substrate 11 constituting the array substrate SUB of the display device 1 (display panel 2) so as to be electrically connected to a first connection electrode 12 and a second connection electrode 13 formed on the insulating substrate 11. The first connection electrode 12 and the second connection electrode 13 may be referred to as bump electrodes or simply as bumps.

[0021] The light-emitting element LED includes a light-emitting portion 21, a first terminal electrode 22, and a second terminal electrode 23. As will be described in detail later, the light-emitting element LED overlaps with the insulating layer 31 in a planar view. The first terminal electrode 22 is connected to the light-emitting portion 21 through a first opening CH1 formed in the insulating layer 31. The second terminal electrode 23 is connected to the light-emitting portion 21 through a second opening CH2 formed in the insulating layer 31. The first terminal electrode 22 is an electrode that functions as an anode electrode or a cathode electrode of the light-emitting element LED. The second terminal electrode 23 is an electrode that functions as a cathode electrode or an anode electrode of the light-emitting element LED.

[0022] The first cavity 41 and the second cavity 42 shown in FIG. 2 will be described later, and therefore a detailed description thereof will be omitted here.

[0023] FIG. 3 is a cross-sectional view showing a cross section taken along line AB shown in FIG. 3, the light-emitting element LED is mounted on the array substrate SUB. The substrate SUB includes the insulating substrate 11, the first connection electrode 12, and the second connection electrode 13, as described above.

[0024] Although not shown in FIG. 3, a driving transistor (TFT) for driving the light-emitting element LED and various wiring patterns are formed on the insulating substrate 11. The insulating substrate 11 is not particularly limited as long as it is made of a material that can withstand the processing temperature during the manufacture of the TFT, and may be, for example, a glass substrate such as quartz or non-alkali glass, or a resin substrate such as polyimide. When the insulating substrate 11 is a flexible resin substrate, the display device 1 can be configured as a sheet display. When a resin substrate such as polyimide is used for the insulating substrate 11, it may be more appropriate to call the insulating substrate 11 an organic insulating layer or a resin layer.

[0025] A pair of a first connection electrode 12 and a second connection electrode 13 are formed on the insulating substrate 11. As will be described in detail later, the first connection electrode 12 is eutectic-bonded to a first terminal electrode 22 constituting the light-emitting element LED by irradiation with the bonding laser light LZ, and is electrically connected to the first terminal electrode 22. Similarly, the second connection electrode 13 is eutectic-bonded to a second terminal electrode 23 constituting the light-emitting element LED by irradiation with the bonding laser light LZ, and is electrically connected to the second terminal electrode 23.

[0026] The first connection electrode 12 and the second connection electrode 13 are made of, for example, a metal material having electrical conductivity. In this embodiment, for example, tin (Sn) is used as the metal material. However, the first connection electrode 12 and the second connection electrode 13 are not limited to this example, and any metal material may be used as long as it is a metal material that can be eutectic bonded with the first terminal electrode 22 and the second terminal electrode 23 that constitute the light-emitting element LED.

[0027] As shown in FIG. 3, the light emitting element LED includes a light emitting portion 21, a first terminal electrode 22, and a second terminal electrode . The light-emitting section 21 has a first main surface 21A and a second main surface 21B opposite to the first main surface 21A. For example, R, G, and B light are emitted from the first main surface 21A of the light-emitting section 21. Note that light may be emitted not only from the first main surface 21A but also from the side surface and second main surface 21B of the light-emitting section 21, etc.

[0028] The light-emitting section 21 has a different thickness (length (height) along the third direction Z) between the region R1 where the first terminal electrode 22 is provided and the region R2 where the second terminal electrode 23 is provided. Therefore, the second main surface 21B of the light-emitting section 21 has a step having a predetermined height at the boundary between the region R1 and the region R2, as shown in FIG.

[0029] The second main surface 21B of the light-emitting section 21 is covered with an insulating layer 31. The light-emitting section 21 is connected to the first terminal electrode 22 through a first opening CH1 formed in the insulating layer 31. The light-emitting section 21 is connected to the second terminal electrode 23 through a second opening CH2 formed in the insulating layer 31. The length of the first terminal electrode 22 along the third direction Z and the length of the second terminal electrode 23 along the third direction Z are different due to the presence of the step of the second main surface 21B. This makes it possible to determine which of the first terminal electrode 22 and the second terminal electrode 23 functions as an anode electrode and which functions as a cathode electrode.

[0030] The insulating layer 31 is made of, for example, an insulating material that transmits the bonding laser light LZ, and silicon oxide (SiO2) or the like is used. Note that, although details will be described later, when the first cavity 41 and the second cavity 42 are provided at positions that overlap the first opening CH1 and the second opening CH2 in a plan view, the bonding laser light LZ can transmit through the first cavity 41 and the second cavity 42, so the insulating layer 31 does not have to be made of an insulating material that transmits the bonding laser light LZ.

[0031] The first terminal electrode 22 and the second terminal electrode 23 are made of, for example, a metal material having electrical conductivity. In this embodiment, gold (Au) is used as the metal material. However, the present invention is not limited to this example, and any metal material may be used for the first terminal electrode 22 and the second terminal electrode 23 as long as the metal material can be eutectic bonded to the first connection electrode 12 and the second connection electrode 13.

[0032] As shown in FIG. 3, the first terminal electrode 22 is formed so as to connect to a part of the second main surface 21B of the light-emitting section 21 exposed by the first opening CH1 formed in the insulating layer 31. This allows the first cavity 41 to be provided at a position where the first terminal electrode 22 overlaps with the first connection electrode 12 in a plan view when the first terminal electrode 22 is abutted against the first connection electrode 12. In other words, the first cavity 41 surrounded by the first terminal electrode 22 can be provided between the second main surface 21B of the light-emitting section 21 and the first connection electrode 12 in the third direction Z. As shown in FIG. 3, the diameter r1 of the first cavity 41 is smaller than the diameter r2 of the first opening CH1, and is preferably, for example, about 2 μm to 3 μm or less. However, the diameter r1 of the first cavity 41 is not limited to the above value, and is determined according to the diameter r2 of the first opening CH1 and the sizes of the first terminal electrode 22 and the first connection electrode 12.

[0033] Similarly, the second terminal electrode 23 is formed so as to connect to a part of the second main surface 21B of the light emitting section 21 exposed by the second opening CH2 formed in the insulating layer 31. This allows the second cavity 42 to be provided at a position where the second terminal electrode 23 overlaps with the second connection electrode 13 in a plan view when the second terminal electrode 23 is abutted against the second connection electrode 13. In other words, the second cavity 42 surrounded by the second terminal electrode 23 can be provided between the second main surface 21B of the light emitting section 21 and the second connection electrode 13 in the third direction Z. As shown in FIG. 3, the diameter r3 of the second cavity 42 is smaller than the diameter r4 of the second opening CH2, and is preferably, for example, about 2 μm to 3 μm or less. However, the diameter r3 of the second cavity 42 is not limited to the above value, and is determined according to the diameter r4 of the second opening CH2 and the sizes of the second terminal electrode 23 and the second connection electrode 13.

[0034] As shown in FIG. 3, the length (height) of the first cavity 41 along the third direction Z is greater than the length (height) of the second cavity 42 along the third direction Z due to the presence of a step in the second main surface 21B of the light-emitting section 21.

[0035] Here, as shown in FIG. 3, the first connection electrode 12 and the first terminal electrode 22 are brought into contact, and the second connection electrode 13 and the second terminal electrode 23 are brought into contact, and then the joining laser light LZ is irradiated from the light emitting section 21 side.

[0036] The bonding laser light LZ irradiated from the light emitting portion 21 side passes through the light emitting portion 21 and the first cavity portion 41, and is irradiated to the vicinity of the contact surface between the first connecting electrode 12 and the first terminal electrode 22. The region surrounded by the dashed line in FIG. 3 corresponds to the region irradiated with the bonding laser light LZ. This allows the bonding laser light LZ to be irradiated to the vicinity of the contact surface between the first connecting electrode 12 and the first terminal electrode 22, and the thermal energy caused by the bonding laser light LZ can be efficiently applied to the contact surface between the first connecting electrode 12 and the first terminal electrode 22. Therefore, as shown in FIG. 4, a first alloy layer 51 made of a eutectic alloy is formed between the first connecting electrode 12 and the first terminal electrode 22, and the first connecting electrode 12 and the first terminal electrode 22 are metallically bonded by the first alloy layer 51.

[0037] Similarly, the bonding laser light LZ irradiated from the light emitting portion 21 side passes through the light emitting portion 21 and the second cavity 42, and is irradiated to the vicinity of the contact surface between the second connecting electrode 13 and the second terminal electrode 23. This allows the bonding laser light LZ to be irradiated to the vicinity of the contact surface between the second connecting electrode 13 and the second terminal electrode 23, and the thermal energy caused by the bonding laser light LZ can be efficiently applied to the contact surface between the second connecting electrode 13 and the second terminal electrode 23. Therefore, as shown in FIG. 4, a second alloy layer 52 made of a eutectic alloy is formed between the second connecting electrode 13 and the second terminal electrode 23, and the second connecting electrode 13 and the second terminal electrode 23 are metallically bonded by the second alloy layer 52.

[0038] As described above, in this embodiment, the first connection electrode 12 and the second connection electrode 13 are made of tin (Sn). On the other hand, the first terminal electrode 22 and the second terminal electrode 23 are made of gold (Au). That is, in this embodiment, layers made of Sn-Au eutectic alloy are formed as the first alloy layer 51 and the second alloy layer 52. As already described, the first connection electrode 12 and the first terminal electrode 22, and the second connection electrode 13 and the second terminal electrode 23 may be made of other metal materials as long as they are materials capable of forming a eutectic alloy with each other. For example, the first connection electrode 12, the first terminal electrode 22, the second connection electrode 13, and the second terminal electrode 23 may all be made of tin (Sn).

[0039] In addition, Figure 4 illustrates, as an example of an implementation form of the light-emitting element LED, a configuration in which the first cavity 41 and the second cavity 42 are filled with a first alloy layer 51 and a second alloy layer 52, respectively, which are made of a eutectic alloy.

[0040] More specifically, the configuration shown is one in which the first connecting electrode 12 and the first terminal electrode 22 are melted by the thermal energy of the bonding laser light LZ irradiated near the abutment surface between the first connecting electrode 12 and the first terminal electrode 22, and the molten metal rises inside the first cavity 41 by so-called capillary action, forming a first alloy layer 51 so as to fill the first cavity 41; in other words, a configuration in which the first alloy layer 51 is formed (filled) inside the first cavity 41 so as to contact the first connecting electrode 12 and the second main surface 21B of the light emitting section 21.

[0041] Similarly, for the second alloy layer 52, the thermal energy of the joining laser light LZ irradiated near the abutment surface between the second connecting electrode 13 and the second terminal electrode 23 melts the second connecting electrode 13 and the second terminal electrode 23, and the molten metal rises inside the second cavity 42 by capillary action, forming the second alloy layer 52 so as to fill the second cavity 42; in other words, the second alloy layer 52 is formed (filled) inside the second cavity 42 so as to contact the second connecting electrode 13 and the second main surface 21B of the light emitting portion 21.

[0042] However, the mounting manner of the light-emitting element LED is not limited thereto, and may be, for example, a mounting manner in which the first alloy layer 51 and the second alloy layer 52 are formed to fill a part of the first cavity 41 and the second cavity 42, as shown in Fig. 5. In other words, the mounting manner may be such that the first alloy layer 51 is formed inside the first cavity 41 so as to be in contact with the first connection electrode 12 and not in contact with the second main surface 21B of the light-emitting section 21, and the second alloy layer 52 is formed inside the second cavity 42 so as to be in contact with the second connection electrode 13 and not in contact with the second main surface 21B of the light-emitting section 21. Even in this case, the first connection electrode 12 and the first terminal electrode 22 are metallically bonded by the first alloy layer 51, and the second connection electrode 13 and the second terminal electrode 23 are metallically bonded by the second alloy layer 52.

[0043] Alternatively, the light-emitting element LED may be mounted by disposing a first transparent member 61 made of a material that transmits the bonding laser light LZ in the first cavity 41 and disposing a second transparent member 62 made of a material that transmits the bonding laser light LZ in the second cavity 42, as shown in Fig. 6, and then irradiating the bonding laser light LZ from the light-emitting section 21 side. The first transparent member 61 and the second transparent member 62 are made of a material that transmits the bonding laser light LZ, and for example, silicon oxide (SiO2) or aluminum oxide (Al2O3) is used. Even in this case, the first connection electrode 12 and the first terminal electrode 22 are metallically bonded by the first alloy layer 51, and the second connection electrode 13 and the second terminal electrode 23 are metallically bonded by the second alloy layer 52.

[0044] As shown in Figures 4 and 6, if the entire first hollow portion 41 and the second hollow portion 42 are filled with the first alloy layer 51, the second alloy layer 52, the first transparent member 61, the second transparent member 62, etc., it is expected that the strength will be improved compared to a configuration that does not do so.

[0045] Furthermore, the first alloy layer 51 and the second alloy layer 52 formed inside the first cavity 41 and the second cavity 42, respectively, can also be simply called the conductive connecting member. As shown in Figures 4 and 5, all of the conductive connecting members formed inside the first cavity 41 and the second cavity 42 may be the first alloy layer 51 and the second alloy layer 52. However, it is sufficient that at least the contact surface between the first terminal electrode 22 forming the side wall of the first cavity 41 and the conductive connecting member, and the contact surface between the second terminal electrode 23 forming the side wall of the second cavity 42 and the conductive connecting member are the first alloy layer 51 and the second alloy layer 52. When the first alloy layer 51 and the second alloy layer 52 are formed on the contact surfaces of the first terminal electrode 22 and the second terminal electrode 23, respectively, the first cavity 41 and the second cavity 42 inside the first alloy layer 51 and the second alloy layer 52 may be filled with, for example, a conductive material, such as tin (Sn), that forms the first connecting electrode 12 and the second connecting electrode 13.

[0046] Here, the effect of the light-emitting element LED according to the present embodiment will be described using a comparative example. Note that the comparative example is intended to explain some of the effects that the light-emitting element LED according to the present embodiment can achieve, and does not exclude the effects common to the comparative example and the present embodiment from the scope of the present invention.

[0047] As shown in Figure 7, the light-emitting element LED' of the comparative example differs in configuration from the light-emitting element LED of this embodiment in that it does not have a first cavity 41 and a second cavity 42 for transmitting the bonding laser light LZ.

[0048] In the light-emitting element LED' according to the comparative example, when the joining laser light LZ is irradiated from the light-emitting portion 21 side, the joining laser light LZ is irradiated to the region surrounded by the dashed line in Fig. 7. In other words, most of the joining laser light LZ is irradiated to positions away from the abutting surfaces of the first connection electrode 12 and the first terminal electrode 22 and the abutting surfaces of the second connection electrode 13 and the second terminal electrode 23, such as the upper surfaces of the first terminal electrode 22 and the second terminal electrode 23.

[0049] According to this, since the thermal energy caused by the bonding laser light LZ cannot be sufficiently applied to the contact surfaces between the first connection electrode 12 and the first terminal electrode 22 and the contact surfaces between the second connection electrode 13 and the second terminal electrode 23, the metal bonding between the first connection electrode 12 and the first terminal electrode 22 and the metal bonding between the second connection electrode 13 and the second terminal electrode 23 may be insufficient. Alternatively, since the thermal energy caused by the bonding laser light LZ cannot be sufficiently applied to the contact surfaces between the first connection electrode 12 and the first terminal electrode 22 and the contact surfaces between the second connection electrode 13 and the second terminal electrode 23, it may take time to form the first alloy layer 51 between the first connection electrode 12 and the first terminal electrode 22 and the second alloy layer 52 between the second connection electrode 13 and the second terminal electrode 23.

[0050] In contrast, the light-emitting element LED of this embodiment has a first cavity 41 and a second cavity 42, and therefore, as shown in Figure 3, the bonding laser light LZ can be irradiated to the vicinity of the abutment surface between the first connecting electrode 12 and the first terminal electrode 22 and the vicinity of the abutment surface between the second connecting electrode 13 and the second terminal electrode 23, and the thermal energy caused by the bonding laser light LZ can be efficiently applied to each abutment surface compared to the light-emitting element LED' of the comparative example.

[0051] In the present embodiment, the light-emitting element LED is a so-called flip-chip type light-emitting element in which the first terminal electrode 22 and the second terminal electrode 23 are arranged adjacent to each other, but the light-emitting element LED may be a so-called upper and lower electrode type in which terminal electrodes are provided on each of the first main surface 21A and the second main surface 21B of the light-emitting section 21. The upper terminal electrode provided on the first main surface 21A side of the light-emitting section 21 is formed of a transparent electrode such as ITO in order to emit light from the light-emitting section 21.

[0052] Even in this case, if the lower terminal electrode provided on the second main surface 21B side of the light-emitting section 21 has a hollow portion for transmitting the joining laser light LZ, the joining laser light LZ irradiated from the light-emitting section 21 side can be irradiated near the abutment surface between the lower terminal electrode and the connection electrode abutted against the lower terminal electrode, so that the thermal energy caused by the connection laser light LZ can be efficiently applied to the abutment surface.

[0053] In the present embodiment, the first terminal electrode 22 and the second terminal electrode 23 are bonded to the first connection electrode 12 and the second connection electrode 13 by eutectic bonding, but a connecting conductive member such as solder may be provided between the first terminal electrode 22 and the first connection electrode 12 and between the second terminal electrode 23 and the second connection electrode 13, and the first terminal electrode 22 and the second terminal electrode 23 may be bonded to the first connection electrode 12 and the second connection electrode 13 by melting each connecting conductive member with the bonding laser light LZ. Even in this case, since the first cavity 41 and the second cavity 42 are provided, it is possible to efficiently apply thermal energy caused by the bonding laser light LZ to each connecting conductive member.

[0054] Various modifications of this embodiment will be described below. (First Modification) First, a first modified example will be described below. Fig. 8 is a plan view showing an example of the configuration of a light emitting element LED1 according to the first modified example.

[0055] 8, the light-emitting element LED1 according to the first modification differs from the configuration of the light-emitting element LED according to the above embodiment in that the first opening CH1 for connecting the first terminal electrode 22 and the light-emitting portion 21 and the first cavity 41 surrounded by the first terminal electrode 22 are arranged so as not to overlap each other in a plan view. In other words, the light-emitting element LED1 according to the first modification differs from the configuration of the light-emitting element LED according to the above embodiment in that the first cavity 41 is arranged outside the first opening CH1.

[0056] 8, the light-emitting element LED1 according to the first modification also differs from the configuration of the light-emitting element LED according to the above embodiment in that the second opening CH2 for connecting the second terminal electrode 23 and the light-emitting portion 21 and the second cavity 42 surrounded by the second terminal electrode 23 are arranged so as not to overlap each other in plan view. In other words, the light-emitting element LED1 according to the first modification differs from the configuration of the light-emitting element LED according to the above embodiment in that the second cavity 42 is arranged outside the second opening CH2.

[0057] FIG. 9 is a cross-sectional view showing a cross section taken along line CD shown in FIG. As shown in FIG. 9, the first terminal electrode 22 is formed so as to connect to the entire surface of the second main surface 21B of the light emitting section 21 exposed by the first opening CH1 formed in the insulating layer 31. Also, as shown in FIG. 9, the first cavity 41 is provided at a position that does not overlap the first opening CH1 formed in the insulating layer 31 in a plan view. In this configuration, the diameter r1 of the first cavity 41 is preferably smaller than the diameter r2 of the first opening CH1, and is preferably, for example, about 2 μm to 3 μm or less. Note that, although FIG. 9 illustrates a configuration in which the first cavity 41 is provided on the left side in the figure and the first opening CH1 is formed on the right side in the figure, the positions of the first cavity 41 and the first opening CH1 may be interchanged. That is, the first cavity 41 may be provided on the right side in the figure and the first opening CH1 may be formed on the left side in the figure.

[0058] Similarly, the second terminal electrode 23 is formed so as to connect to the entire surface of the second main surface 21B of the light emitting section 21 exposed by the second opening CH2 formed in the insulating layer 31. As shown in FIG. 9, the second cavity 42 is provided at a position that does not overlap the second opening CH2 formed in the insulating layer 31 in a plan view. In this configuration, the diameter r3 of the second cavity 42 is preferably smaller than the diameter r4 of the second opening CH2, and is preferably, for example, about 2 μm to 3 μm or less. Note that, although FIG. 9 illustrates a configuration in which the second cavity 42 is provided on the right side in the figure and the second opening CH2 is formed on the left side in the figure, the positions of the second cavity 42 and the second opening CH2 may be interchanged. That is, the second cavity 42 may be provided on the left side in the figure and the second opening CH2 may be formed on the right side in the figure.

[0059] When a joining laser light LZ is irradiated from the light emitting section 21 side in order to mount the light emitting element LED1 according to the first modified example described above on the array substrate SUB, the joining laser light LZ is irradiated to the area surrounded by the dashed line shown in Fig. 9. That is, even with the configuration according to the first modified example, compared to the configuration according to the comparative example shown in Fig. 7, the joining laser light LZ can be irradiated to the vicinity of the abutting surface between the first connection electrode 12 and the first terminal electrode 22 and the vicinity of the abutting surface between the second connection electrode 13 and the second terminal electrode 23, and the thermal energy caused by the joining laser light LZ can be efficiently applied to each abutting surface compared to the configuration according to the comparative example.

[0060] In the configuration according to the first modification, the first cavity 41 and the second cavity 42 may be completely filled with the first alloy layer 51 and the second alloy layer 52, as in the configuration shown in Fig. 4, or may be partially filled with the first alloy layer 51 and the second alloy layer 52, as in the configuration shown in Fig. 5. Alternatively, a first transmitting member 61 and a second transmitting member 62 may be disposed in the first cavity 41 and the second cavity 42, as in the configuration shown in Fig. 6.

[0061] (Second Modification) Next, a description will be given of Modification 2. Fig. 10 is a plan view showing an example of the configuration of a light emitting element LED2 according to Modification 2.

[0062] The light-emitting element LED2 of the second modified example differs from the configuration of the light-emitting element LED of the above-described embodiment in that, as shown in FIG. 10, the second terminal electrode 23 has a U-shape in plan view, and the first terminal electrode 22 has a shape that is the left-right inverted shape of the second terminal electrode 23 in plan view (hereinafter referred to as an inverted U-shape).

[0063] Both the inverted U-shaped first terminal electrode 22 and the U-shaped second terminal electrode 23 are connected to the light-emitting section 21 through openings (not shown) formed in the insulating layer 31. The openings formed to connect the inverted U-shaped first terminal electrode 22 and the light-emitting section 21 may be formed at any position as long as they overlap the first terminal electrode 22 in a plan view, and the shape and number of the openings may be arbitrary. Similarly, the openings formed to connect the U-shaped second terminal electrode 23 and the light-emitting section 21 may also be formed at any position as long as they overlap the second terminal electrode 23 in a plan view, and the shape and number of the openings may be arbitrary.

[0064] In the light-emitting element LED2 of the second modified example, the opening (recess) of the inverted U-shaped first terminal electrode 22 corresponds to the first cavity 41, and the opening (recess) of the U-shaped second terminal electrode 23 corresponds to the second cavity 42.

[0065] When the light emitting element LED2 according to the second modified example described above is irradiated with a joining laser beam LZ from the light emitting section 21 side in order to mount the light emitting element LED2 according to the second modified example on the array substrate SUB, the joining laser beam LZ passes through the light emitting section 21, the first cavity 41, and the second cavity 42, and most of the joining laser beam LZ is irradiated to the vicinity of the contact surface between the first connecting electrode 12 and the first terminal electrode 22 and the vicinity of the contact surface between the second connecting electrode 13 and the second terminal electrode 23. That is, even with the configuration according to the second modified example, the joining laser beam LZ can be irradiated to the vicinity of the contact surface between the first connecting electrode 12 and the first terminal electrode 22 and the vicinity of the contact surface between the second connecting electrode 13 and the second terminal electrode 23, as compared to the configuration according to the comparative example shown in FIG. 7, and the thermal energy caused by the joining laser beam LZ can be efficiently applied to each contact surface, as compared to the configuration according to the comparative example.

[0066] In the light-emitting element LED2 according to the second modification, each of the side that is a part of the first terminal electrode 22 and extends along the second direction Y and the side that is a part of the second terminal electrode 23 and extends along the second direction Y can function as a wall for preventing metals melted by the thermal energy of the joining laser light LZ from flowing into each other's electrode side. This makes it possible to prevent the first terminal electrode 22 and the second terminal electrode 23 from being connected to each other and causing a short circuit.

[0067] (Third Modification) Next, a third modified example will be described below. Fig. 11 is a plan view showing an example of the configuration of a light emitting element LED3 according to the third modified example.

[0068] The light-emitting element LED3 of the third modified example differs from the configuration of the light-emitting element LED of the above-described embodiment in that, as shown in FIG. 11, the first terminal electrode 22 and the second terminal electrode 23 both have an H-shape in plan view.

[0069] Both the H-shaped first terminal electrode 22 and the second terminal electrode 23 are connected to the light emitting section 21 through openings (not shown) formed in the insulating layer 31. The positions, shapes and number of the openings may be arbitrary as in the case of the second modified example described above, and therefore detailed explanations thereof will be omitted here.

[0070] In the light-emitting element LED3 of the third modified example, the two openings (recesses) of the H-shaped first terminal electrode 22 both correspond to the first cavity 41, and the two openings (recesses) of the H-shaped second terminal electrode 23 both correspond to the second cavity 42.

[0071] Even when the bonding laser light LZ is irradiated from the light emitting section 21 side in order to mount the light emitting element LED3 according to the third modified example described above on the array substrate SUB, as in the case of the second modified example described above, most of the light can be irradiated to the vicinity of the contact surface between the first connection electrode 12 and the first terminal electrode 22 and the vicinity of the contact surface between the second connection electrode 13 and the second terminal electrode 23. In other words, the configuration according to the third modified example can also provide the same effects as those already described.

[0072] In the light-emitting element LED3 according to the third modification, similarly to the above-described second modification, each of the side that is a part of the first terminal electrode 22 and extends along the second direction Y and the side that is a part of the second terminal electrode 23 and extends along the second direction Y can function as a wall for preventing metals melted by the thermal energy of the joining laser light LZ from flowing into each other's electrode side. This makes it possible to prevent the first terminal electrode 22 and the second terminal electrode 23 from being connected to each other and causing a short circuit.

[0073] (Fourth Modification) Next, a fourth modified example will be described below. Fig. 12 is a plan view showing an example of the configuration of a light emitting element LED4 according to the fourth modified example.

[0074] The light-emitting element LED4 of the fourth modified example differs from the configuration of the light-emitting element LED of the above-described embodiment in that, as shown in FIG. 12, the first terminal electrode 22 and the second terminal electrode 23 both have a cross shape when viewed in a plane.

[0075] Both the cross-shaped first terminal electrode 22 and the second terminal electrode 23 are connected to the light-emitting section 21 through openings (not shown) formed in the insulating layer 31. The positions, shapes and number of the openings may be arbitrary as in the second and third modified examples described above, and therefore detailed explanations thereof will be omitted here.

[0076] In the light-emitting element LED4 of the fourth modified example, all of the four openings (recesses) of the cross-shaped first terminal electrode 22 correspond to the first cavity 41, and all of the four openings (recesses) of the cross-shaped second terminal electrode 23 correspond to the second cavity 42.

[0077] Even when the bonding laser light LZ is irradiated from the light emitting section 21 side in order to mount the light emitting element LED4 according to the fourth modified example described above on the array substrate SUB, as in the second and third modified examples described above, most of the light can be irradiated to the vicinity of the contact surface between the first connection electrode 12 and the first terminal electrode 22 and the vicinity of the contact surface between the second connection electrode 13 and the second terminal electrode 23. In other words, the configuration according to the fourth modified example can also provide the same effects as those already described.

[0078] (Fifth Modification) Next, a fifth modified example will be described below. Fig. 13 is a plan view showing an example of the configuration of a light emitting element LED5 according to the fifth modified example.

[0079] The light-emitting element LED5 of the fifth modified example differs from the configuration of the light-emitting element LED of the above-described embodiment in that, as shown in FIG. 13, both the first terminal electrode 22 and the second terminal electrode 23 have a shape in which multiple electrodes are arranged in a matrix when viewed in a planar view.

[0080] The first terminal electrode 22 and the second terminal electrode 23, which are composed of a plurality of electrodes arranged in a matrix, are both connected to the light-emitting section 21 through openings (not shown) formed in the insulating layer 31. The openings formed for connecting the first terminal electrode 22 and the light-emitting section 21 are formed, for example, for each of the plurality of electrodes that constitute the first terminal electrode 22. The openings formed for connecting the second terminal electrode 23 and the light-emitting section 21 are formed, for example, for each of the plurality of electrodes that constitute the second terminal electrode 23.

[0081] In the light-emitting element LED5 of the fifth modified example, with regard to the multiple electrodes constituting the first terminal electrode 22, a collection of numerous gaps existing between adjacent electrodes corresponds to the first cavity 41, and with regard to the multiple electrodes constituting the second terminal electrode 23, a collection of numerous gaps existing between adjacent electrodes corresponds to the second cavity 42.

[0082] Even when the bonding laser light LZ is irradiated from the light emitting section 21 side in order to mount the light emitting element LED5 according to the fifth modified example described above on the array substrate SUB, similarly to the second to fourth modified examples described above, most of the light can be irradiated to the vicinity of the contact surface between the first connection electrode 12 and the first terminal electrode 22 and the vicinity of the contact surface between the second connection electrode 13 and the second terminal electrode 23. In other words, the configuration according to the fifth modified example can also provide the same effects as those already described.

[0083] (Sixth Modification) Next, a sixth modified example will be described. Fig. 14 is a plan view showing an example of the configuration of a light-emitting element LED6A according to the sixth modified example, and Fig. 15 is a plan view showing an example of the configuration of a light-emitting element LED6B according to the sixth modified example.

[0084] The light-emitting element LED6A and the light-emitting element LED6B of the sixth modified example differ from the configuration of the light-emitting element LED of the above-described embodiment in that, as shown in Figures 14 and 15, the first cavity 41 and the second cavity 42 have different areas when viewed in a plan view.

[0085] As already described, the length of the first terminal electrode 22 along the third direction Z and the length of the second terminal electrode 23 along the third direction Z are different due to the presence of a step on the second main surface 21B of the light-emitting section 21. According to this, when the first terminal electrode 22 and the second terminal electrode 23 are irradiated with the same output of the bonding laser light LZ, there is a possibility that the way in which the thermal energy caused by the bonding laser light LZ is applied may differ between the first terminal electrode 22 and the second terminal electrode 23. More specifically, there is a possibility that a difference may occur in that it takes more time for the thermal energy to spread on the first terminal electrode 22 side, which has a longer length along the third direction Z, and it takes less time for the thermal energy to spread on the second terminal electrode 23 side, which has a shorter length along the third direction Z.

[0086] However, in the light-emitting element LED6A shown in Figure 14, the area (size) of the first cavity 41 provided in the first terminal electrode 22, which has a longer length along the third direction Z, is larger than the area (size) of the second cavity 42 provided in the second terminal electrode 23, which has a shorter length along the third direction Z.

[0087] According to this, when the joining laser light LZ is irradiated from the light emitting section 21 side, the first terminal electrode 22 can transmit more joining laser light LZ than the second terminal electrode 23. Therefore, it is possible to shorten the time required for thermal energy to spread to the first terminal electrode 22 side, and as a result, it is possible to make the time required for thermal energy to spread to the first terminal electrode 22 and the second terminal electrode 23 approximately the same.

[0088] Similarly, in the light-emitting element LED6B shown in FIG. 15, the area of ​​each of the multiple electrodes constituting the first terminal electrode 22 is made smaller than the area of ​​each of the multiple electrodes constituting the second terminal electrode 23, or the number of the multiple electrodes constituting the first terminal electrode 22 is made smaller than the number of electrodes constituting the second terminal electrode 23, so that the area (size) of the first cavity 41 provided in the first terminal electrode 23 having a longer length along the third direction Z is larger than the area (size) of the second cavity 42 provided in the second terminal electrode 23 having a shorter length along the third direction Z.

[0089] According to this, when the joining laser light LZ is irradiated from the light emitting section 21 side, the first terminal electrode 22 can transmit more joining laser light LZ than the second terminal electrode 23. Therefore, it is possible to shorten the time required for thermal energy to spread to the first terminal electrode 22 side, and as a result, it is possible to make the time required for thermal energy to spread to the first terminal electrode 22 and the second terminal electrode 23 approximately the same.

[0090] According to at least one of the embodiments described above, it is possible to provide a light-emitting element LED that can be efficiently mounted on an array substrate SUB of an electronic device (display device 1), and an electronic device (display device 1) in which the light-emitting element LED is mounted.

[0091] Although some embodiments of the present invention have been described, these embodiments are presented as examples and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, substitutions, and modifications can be made without departing from the spirit of the invention. These embodiments and their modifications are included in the scope and spirit of the invention, and are included in the scope of the invention and its equivalents described in the claims. [Explanation of symbols]

[0092] Reference Signs List: 11...insulating substrate, 12...first connecting electrode, 13...second connecting electrode, 21...light-emitting portion, 22...first terminal electrode, 23...second terminal electrode, 31...insulating layer, 41...first cavity, 42...second cavity, 51...first alloy layer, 52...second alloy layer, 61...first transparent member, 62...second transparent member, SUB...array substrate, LED...light-emitting element, CH1...first opening, CH2...second opening.

Claims

1. A light emitting element mounted on a substrate on which a pair of a first connection electrode and a second connection electrode are formed, a light emitting portion having a first main surface that emits light and a second main surface opposite to the first main surface; a first terminal electrode and a second terminal electrode provided on the second main surface side of the light emitting portion; Equipped with the first terminal electrode has a first cavity at a position overlapping the first connection electrode in a plan view when the first terminal electrode is brought into contact with the first connection electrode, and is joined to the first connection electrode by forming a eutectic alloy with the first connection electrode by a laser beam irradiated from the light emitting unit side; the second terminal electrode has a second cavity at a position overlapping with the second connection electrode in a plan view when the second terminal electrode is brought into contact with the second connection electrode, and is joined to the second connection electrode by forming a eutectic alloy with the second connection electrode by the laser light; a first transparent member that is made of an insulating material and transmits the laser light is disposed in the first cavity; A second transparent member made of an insulating material and transmitting the laser light is disposed in the second cavity. Light emitting element.

2. The first terminal electrode is higher than the second terminal electrode, The height of the first cavity is greater than the height of the second cavity. The light-emitting device according to claim 1 .

3. The light emitting element further includes an insulating layer provided to cover the second main surface of the light emitting portion, the first terminal electrode is connected to the light emitting portion through a first opening formed in the insulating layer; the second terminal electrode is connected to the light emitting portion through a second opening formed in the insulating layer; the first cavity is provided at a position overlapping with the first opening in a plan view, The second cavity is provided at a position overlapping with the second opening in a plan view. The light-emitting device according to claim 1 .

4. the first terminal electrode is connected to a part of the second main surface of the light emitting portion exposed by the first opening, the second terminal electrode is connected to a part of the second main surface of the light emitting portion exposed by the second opening. The light-emitting device according to claim 3 .

5. the first cavity is surrounded by the first terminal electrode, the second cavity is surrounded by the second terminal electrode; The light-emitting device according to claim 4 .

6. The light emitting element further includes an insulating layer provided to cover the second main surface of the light emitting portion, the first terminal electrode is connected to the light emitting portion through a first opening formed in the insulating layer; the second terminal electrode is connected to the light emitting portion through a second opening formed in the insulating layer; the first cavity is provided at a position not overlapping with the first opening in a plan view, The second cavity is provided at a position not overlapping with the second opening in a plan view. The light-emitting device according to claim 1 .

7. The first cavity and the second cavity have the same area in a plan view. The light-emitting device according to any one of claims 1 to 6.

8. The laser light is the light is transmitted through the light emitting portion and the first cavity portion and is irradiated to a vicinity of a contact surface between the first terminal electrode and the first connection electrode; the light is transmitted through the light emitting portion and the second cavity portion, and is irradiated toward a vicinity of a contact surface between the second terminal electrode and the second connection electrode; The light-emitting device according to any one of claims 1 to 7.

9. a substrate on which a pair of a first connection electrode and a second connection electrode are formed; a light-emitting element mounted on the substrate and electrically connected to the first connection electrode and the second connection electrode; Equipped with The light-emitting element is a light emitting portion having a first main surface that emits light and a second main surface opposite to the first main surface; a first terminal electrode and a second terminal electrode provided on the second main surface side of the light emitting portion; having the first terminal electrode includes a first cavity portion at a position overlapping with the first connection electrode in a plan view when the first terminal electrode is brought into contact with the first connection electrode, and is joined to the first connection electrode by forming a eutectic alloy with the first connection electrode by a laser beam irradiated from the light emitting portion side; the second terminal electrode includes a second cavity portion at a position overlapping with the second connection electrode in a plan view when the second terminal electrode is brought into contact with the second connection electrode, and is joined to the second connection electrode by forming a eutectic alloy with the second connection electrode by the laser light; a first transparent member that is made of an insulating material and transmits the laser light is disposed in the first cavity; A second transparent member made of an insulating material and transmitting the laser light is disposed in the second cavity. electronic equipment.

10. The light emitting element further includes an insulating layer provided to cover the second main surface of the light emitting portion, the first terminal electrode is connected to the light emitting portion through a first opening formed in the insulating layer; the second terminal electrode is connected to the light emitting portion through a second opening formed in the insulating layer; the first cavity is provided at a position overlapping with the first opening in a plan view, The second cavity is provided at a position overlapping with the second opening in a plan view.

10. The electronic device according to claim 9.

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