Electrical wiring member and liquid ejection head

Abstract

To prevent the temperature distribution of a support member from becoming uneven without adding a new member that requires a space for arrangement.SOLUTION: An electric wiring member is supported by a support member that supports a recording element substrate configured to eject a liquid, the electric wiring member comprising: a signal line 3 configured to transmit a drive signal for driving the recording element substrate; power lines 5, 6 configured to supply drive power to the recording element substrate; and a heat-generating resistive line 4 configured to heat the support member. The power lines are disposed between the signal line 3 and the heat-generating resistive line 4.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to an electric wiring member such as a flexible wiring board, and a liquid ejection head including the same. [Background technology]

[0002] The liquid ejection head has a flexible wiring board, a recording element substrate having ejection ports for ejecting liquid such as ink, and a support member for supporting the recording element substrate. The recording element substrate is electrically connected to the flexible wiring board. A driving signal and a driving power are supplied to the recording element substrate via the flexible wiring board. The support member is configured to include a flow path that supplies the liquid to the recording element substrate and a flow path that discharges the liquid that has passed through the inside of the recording element substrate, and the liquid is circulated through these flow paths. The liquid is heated inside the recording element substrate. Therefore, the temperature of the liquid flowing through the flow path on the discharge side is higher than the temperature of the liquid flowing through the flow path on the supply side. US Patent No. 5,399,633 describes a flexible circuit incorporated into a printhead. The flexible circuit replaces a thermistor and has a first layer with a resistive heat source and a second layer with a temperature sensing element. The resistive heat source can be used to heat the jet stack. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6514457 Summary of the Invention [Problem to be solved by the invention]

[0004] In the above-mentioned liquid ejection head, the temperature distribution in the support member becomes uneven because the temperature of the liquid differs between the supply flow path and the discharge flow path, and deformation due to thermal stress may occur in the area where the temperature difference occurs. By using the flexible circuit described in Patent Document 1, it is possible to prevent the temperature distribution of the support member from becoming uneven. However, since the flexible wiring board is in contact with the support member, there are spatial restrictions. For this reason, it is difficult to provide a new flexible circuit that requires space to be placed separately from the flexible wiring board. In addition, adding a new flexible circuit leads to an increase in manufacturing costs.

[0005] The present invention has been made in consideration of the above-mentioned problems, and aims to suppress uneven temperature distribution in the support member without adding new components that require placement space. [Means for solving the problem]

[0006] In order to achieve the above object, the present invention According to one aspect The electrical wiring member is an electrical wiring member supported by a support member that supports a recording element substrate that ejects liquid, and includes a signal line that transmits a drive signal for driving the recording element substrate, a power line that supplies drive power to the recording element substrate, and a heating resistor wire that heats the support member. a first wiring layer including the heating resistor wire, and a second wiring layer including the signal line and the power line; The power line is disposed between the signal line and the heating resistor wire. According to another aspect of the present invention, an electric wiring member is supported by a support member that supports a recording element substrate that ejects liquid, and includes a signal line that transmits a drive signal for driving the recording element substrate, a power line that supplies drive power to the recording element substrate, a heating resistor wire for heating the support member, a first wiring layer including the heating resistor wire, a second wiring layer including the signal line, and a third wiring layer including the power line, and the power line is disposed between the signal line and the heating resistor wire. According to yet another aspect of the present invention, an electrical wiring member is supported by a support member that supports a recording element substrate that ejects liquid, and includes a signal line that transmits a drive signal for driving the recording element substrate, a power line that supplies drive power to the recording element substrate, and a heating resistor wire for heating the support member. The power line is disposed between the signal line and the heating resistor wire. The electrical wiring member includes a contact surface that contacts the support member, and the heating resistor wire is formed on the contact surface. According to yet another aspect of the present invention, an electrical wiring member is supported by a support member that supports a recording element substrate that ejects liquid, and includes a signal line that transmits a drive signal for driving the recording element substrate, a power line that supplies drive power to the recording element substrate, a heating resistor wire for heating the support member, and a temperature detection element that detects the temperature of the support member, and the power line is disposed between the signal line and the heating resistor wire. Effect of the Invention

[0007] According to the present invention, it is possible to suppress the temperature distribution of the support member from becoming non-uniform without adding a new member that requires an arrangement space. [Brief description of the drawings]

[0008] [Figure 1] 1 is a schematic diagram showing a configuration of a flexible wiring board according to a first embodiment of the present invention. [Diagram 2] FIG. 4 is a schematic diagram showing a configuration of a flexible wiring board according to a second embodiment of the present invention. [Diagram 3] 3 is a schematic diagram showing a modified example of the flexible wiring board shown in FIG. 2. [Figure 4] 5 is a schematic diagram showing a configuration of a flexible wiring board according to a third embodiment of the present invention. FIG. [Diagram 5] 5 is a cross-sectional view showing an example of a cross section taken along line AA in FIG. 4. [Figure 6] 5 is a cross-sectional view showing another example of a cross section taken along the line AA in FIG. 4. [Figure 7] FIG. 11 is a schematic diagram showing a first modified example of a flexible wiring board according to the third embodiment of the present invention. [Figure 8] FIG. 13 is a schematic diagram showing a second modified example of the flexible wiring board according to the third embodiment of the present invention. [Figure 9] FIG. 13 is a schematic diagram showing a third modified example of the flexible wiring board according to the third embodiment of the present invention. [Figure 10] FIG. 13 is a schematic diagram showing a fourth modified example of the flexible wiring board according to the third embodiment of the present invention. [Figure 11] 1 is a schematic diagram illustrating an example of a liquid ejection head of the present invention. [Figure 12] FIG. 4 is a schematic diagram showing another example of a liquid ejection head of the present invention. [Figure 13] 1 is a block diagram showing a schematic configuration of a temperature adjustment device according to the present invention; DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. However, the components and combinations of elements described in the embodiments are merely examples and are not intended to limit the scope of the present invention.

[0010] (First embodiment) 1 is a schematic diagram showing the configuration of a flexible wiring board according to a first embodiment of the present invention. Flexible wiring board 1 is an example of an electrical wiring member of the present invention. Flexible wiring board 1 is electrically connected to a recording element substrate (not shown) that ejects liquid such as ink, and is supported by a holding member (not shown) that holds the recording element substrate. Flexible wiring board 1 is a so-called flexible printed circuit board. Flexible wiring board 1, the recording element substrate, and the supporting member are elements that constitute a liquid ejection head.

[0011] As shown in FIG. 1, the flexible wiring board 1 has pads 2, 7, a signal line 3, a heating resistor line 4, a power line 5, and a power line 6. The signal line 3 transmits a drive signal for driving the recording element substrate. The power lines 5 and 6 are for supplying drive power to the recording element substrate. For example, the power line 5 is used to supply power to the drive circuit of the recording element, and the power line 6 is used to supply power to the recording element. The width (or cross-sectional area) of the power line 5 is narrower than the width (or cross-sectional area) of the power line 6. The heating resistor line 4 is for heating the holding member. The width (or cross-sectional area) of the heating resistor line 4 is narrower than the width (or cross-sectional area) of the power line 5.

[0012] A plurality of signal lines 3, heating resistance lines 4, power lines 5 and power lines 6 are mixed together. Here, two power lines 6 are arranged in the center. Power lines 5 are arranged on both sides of the area of ​​these power lines 6, and further, signal lines 3 are arranged outside the power lines 5. Heating resistance lines 4 are arranged between the signal lines 3 and the power lines 5, and between the power lines 5 and the power lines 6. Furthermore, heating resistance lines 4 are also arranged outside the signal lines 3. In other words, a plurality of heating resistance lines 4 are arranged in parallel in the width direction of flexible wiring board 1, and are configured to be heatable over the entire width direction of flexible wiring board 1.

[0013] The thickness and width of the heating resistance wire 4 are determined based on the results of measuring the temperature rise by changing the thickness and width of the conductor and the current value. For example, when a current of 3 A is passed through a heating resistance wire 4 with a conductor thickness of 35 μm and a conductor width of 2 mm, the temperature rises by approximately 10°C. When the conductor width is changed from 2 mm to 1 mm while the conductor thickness and current value are the same, the temperature rises by approximately 20°C. When the conductor thickness is the same, the conductor width is changed to 0.2 mm, and the current value is changed to 1 A, the temperature rises by approximately 30°C. Based on these results, the thickness and width of the heating resistance wire 4 are determined so as to obtain the desired temperature rise. When a temperature rise curve is provided in advance as resistance data, the thickness and width of the heating resistor wire 4 may be determined based on the temperature rise curve.

[0014] A plurality of pads 7 are provided on one of both ends of the flexible wiring board 1, and a plurality of pads 2 are provided on the other end. The pads 7 are electrically connected to a recording device body on which a liquid ejection head is mounted. The pads 2 are electrically connected to a recording element substrate. The signal lines 3, the heating resistor lines 4, the power lines 5 and the power lines 6 are each electrically connected to the recording device body via different pads 7. The signal lines 3, the power lines 5 and the power lines 6 are each electrically connected to the recording element substrate via different pads 2. Driving power is supplied to the recording element substrate via the pads 7, the power lines 5 or the power lines 6 and the pads 2. Driving signals are supplied to the recording element substrate via the pads 7, the signal lines 3 and the pads 2.

[0015] Both ends of the heating resistance wire 4 are electrically connected to pads 7. In this embodiment, two adjacent pads 7 are used for one heating resistance wire 4. The heating resistance wire 4 extends from one pad 7 toward the pad 2, turns back just before the pad 2, and extends to the other pad 7. A preset amount of current is supplied to the heating resistance wire 4 from the recording device body. A dedicated wiring may be used for the current return path, or a negative wiring of the power supply system may be used. When a dedicated wiring is used, the wiring itself can be used as the heating resistance wire, so that the amount of heat generated can be increased. The amount of current flowing through the heating resistance wire 4 may be set fixedly by a circuit or the like, or may be variable according to the situation.

[0016] According to the flexible wiring board 1 of the present embodiment, when a current is passed through the heating resistor wire 4 while the heating resistor wire 4 is in planar contact with the support member, the heating resistor wire 4 generates heat and can heat the support member. For example, the flexible wiring board 1 is contacted with a low-temperature portion of the support member. For example, when the recording element is driven, the temperature of the liquid in the discharge-side flow path becomes higher than the temperature of the liquid in the supply-side flow path in the support member. In this case, the low-temperature portion is the side surface adjacent to the supply-side flow path, and the flexible wiring board 1 is contacted with this side surface. By supplying a current to the heating resistor wire 4 during the driving period in which the recording element substrate is driven, the heating resistor wire 4 heats the side surface of the support member. In this way, since the low-temperature portion of the support member can be heated, it is possible to suppress the temperature distribution of the support member from becoming non-uniform, and as a result, it is possible to suppress the deformation of the support member due to thermal stress.

[0017] In particular, since the long support member that supports the multiple recording element substrates is easily deformed due to the synergistic effect of thermal stress and stress caused by its own weight, the effect of preventing deformation of the support member using the flexible wiring board 1 of this embodiment is even greater. Furthermore, deformation of the support member is a cause of misalignment of the printed image. If deformation of the support member due to temperature distribution is eliminated, it will be possible to limit the deformation to the weight of the support member, and therefore the amount of misalignment of the printed image due to deformation of the support member can be measured and corrected. When the recording element substrate is driven, the recording element substrate itself generates heat, causing the temperature of the support member supporting the recording element substrate to rise. As a result, the temperature distribution of the support member becomes non-uniform, which may cause deformation due to thermal stress. By using the flexible wiring board 1 of this embodiment, such deformation of the support member can be suppressed.

[0018] Moreover, since flexible wiring board 1 of the present embodiment can be realized by incorporating heating resistor wire 4 into an existing flexible wiring board having signal lines and power lines, the arrangement space does not increase significantly compared to existing flexible wiring boards. Moreover, since there is no need to add a new member such as the flexible circuit described in Patent Document 1, an increase in manufacturing costs can be suppressed. The flexible wiring board 1 shown in FIG. 1 has a single-layer wiring structure, but is not limited thereto. The flexible wiring board 1 may have a multi-layer wiring structure. For example, the flexible wiring board 1 may have a first wiring layer including the heating resistor wire 4, and a second wiring layer including the signal line 3 and the power lines (5, 6). The flexible wiring board 1 may also have a first wiring layer including the heating resistor wire 4, a second wiring layer including the signal line 3, and a third wiring layer including the power lines (5, 6). In either case, the first wiring layer is located on the support member side.

[0019] Furthermore, the wiring form of the flexible wiring board 1 is not limited to the wiring form shown in Fig. 1. The wiring form of the flexible wiring board 1 can be changed as appropriate depending on the number and length of the required heating resistor wires 4, the temperature distribution of the support member, the arrangement of the pads 2 and 7, etc. Furthermore, it is preferable that the signal line 3, the heating resistor line 4, the power line 5 and the second drive power line 6 are made of a copper material (copper foil material), thereby making it possible to reduce the manufacturing cost of the flexible wiring board 1. When the supply of current to the heating resistance wire 4 is turned on and off, the heating resistance wire 4 generates a considerable amount of unnecessary electromagnetic radiation, and electromagnetic radiation noise may affect the signal wire 3. For example, electromagnetic radiation noise may affect the drive signal of the recording element substrate, causing the drive circuit on the recording element substrate to malfunction. Therefore, if there is an effect of electromagnetic radiation noise, it is preferable to provide protective wiring or the like for the signal wire 3.

[0020] Second embodiment Fig. 2 is a schematic diagram showing the configuration of a flexible wiring board according to a second embodiment of the present invention. Flexible wiring board 1 has heating layer 10 including heating resistor wire 4, power lines 11a, 11b, and vias 8. Although not shown in Fig. 2, flexible wiring board 1 also has a wiring layer including signal line 3 and power lines (5, 6) described in the first embodiment. Note that to avoid duplication, the description of the configuration described in the first embodiment will be omitted.

[0021] The heating layer 10 has a contact surface 10a that contacts the support member 9. The heating resistance wire 4 is concentratedly arranged on the contact surface 10a. To enhance the heating effect, the heating resistance wire 4 may be exposed to the contact surface 10a. One end of the heating resistance wire 4 is electrically connected to a power line 11a, and the other end of the heating resistance wire 4 is electrically connected to a power line 11b. The heating resistance wire 4 is formed in a pattern having multiple folds (hereinafter, a fold pattern). The width (or cross-sectional area) of the power lines 11a and 11b is wider than the width (or cross-sectional area) of the heating resistance wire 4. The power lines 11a and 11b are each electrically connected to a different pad 7. Here, the pad 7 is provided in a wiring layer (not shown) that includes the signal line 3. The power lines 11a and 11b are electrically connected to the pad 7 through a via 8.

[0022] According to the flexible wiring board 1 of this embodiment, in addition to the effects described in the first embodiment, since the heating resistance wires 4 are concentrated on the contact surface 10a that contacts the support member 9, the support member 9 can be heated efficiently. In addition, since the width (or cross-sectional area) of the power lines 11a, 11b is wider than the width (or cross-sectional area) of the heating resistance wire 4, the amount of heat generated by the power lines 11a, 11b is sufficiently smaller than the amount of heat generated by the heating resistance wire 4. This makes it possible to limit the location of heat generation to the contact surface 10a, thereby suppressing unnecessary heat generation in areas other than the contact surface 10a. By suppressing unnecessary heat generation, excess power consumption can be reduced.

[0023] If there is no problem if the entire flexible wiring board 1 generates heat, the width (or cross-sectional area) of the power lines 11a and 11b may be made the same as the width (or cross-sectional area) of the heating resistance wire 4, as shown in FIG. The pads 7 may also be provided on the heat generating layer 10. In this case, the vias 8 are not necessary. If electromagnetic radiation noise may affect the signal line 3 when switching the current to the heating resistor wire 4 on and off, it is preferable to provide a protective layer to protect the signal line 3 from the electromagnetic radiation noise. It is effective to provide the protective layer with ground wiring on one side, but it may also be used as a power supply wiring layer.

[0024] (Third embodiment) 4 is a schematic diagram showing the configuration of a flexible wiring board according to a third embodiment of the present invention. Flexible wiring board 1 of this embodiment differs from that of the second embodiment in that it has a temperature detection element 12. To avoid duplication, the description of the configuration described in the second embodiment will be omitted.

[0025] As shown in Fig. 4, the temperature detection element 12 is disposed in the center of the contact surface 10a of the heat generating layer 10. The support member 9 is provided with a recess 13 capable of accommodating the temperature detection element 12. With the flexible wiring board 1 in contact with the support member 9, the temperature detection element 12 is accommodated in the recess 13. The temperature detection element 12 detects the temperature of the support member 9. For example, a temperature sensor equipped with an IC (integrated circuit), a thermistor, a diode, etc. can be used as the temperature detection element 12.

[0026] The heating resistance wire 4 is concentrated on the contact surface 10a so as to avoid the temperature detection element 12. Here, the heating resistance wire 4 in a folded pattern is formed on both sides of the temperature detection element 12. The heating resistance wire 4 is spaced a predetermined distance from the temperature detection element 12 so as not to interfere with the temperature measurement of the support member 9 by the temperature detection element 12. The arrangement of the temperature detection element 12 and the heating resistance wire 4 is not limited to the arrangement shown in FIG. 4. For example, the heating resistance wire 4 may be arranged so as to surround the temperature detection element 12.

[0027] According to the flexible wiring board 1 of this embodiment, in addition to the effects described in the first and second embodiments, the temperature detection element 12 can measure the temperature of the support member 9. Therefore, it is possible to control the temperature of the support member 9 using the temperature detection element 12. For example, it is possible to maintain the support member 9 at a desired temperature by controlling the amount of current flowing through the heating resistor wire 4 based on the output value of the temperature detection element 12. In order to accurately measure the temperature of the support member 9, a material with high thermal conductivity may be disposed between the temperature detection element 12 and the support member 9. Examples of the material with high thermal conductivity include thermal grease (thermal conductive grease) and a thermal conductive sheet. These materials are existing materials, and in the field of electronic devices, for example, they are known to be disposed between a CPU (Central Processing unit), a transistor, etc., and a heat sink.

[0028] In the flexible wiring board 1 of this embodiment, the width (or cross-sectional area) of the power lines 11a and 11b is wider than the width (or cross-sectional area) of the heating resistance wire 4, but is not limited to this. As in the second embodiment, the width (or cross-sectional area) of the power lines 11a and 11b may be the same as the width (or cross-sectional area) of the heating resistance wire 4. Furthermore, the heating resistance wire 4 may be arranged biased to one side on the contact surface 10a to avoid the temperature detection element 12. However, if the heating resistance wire 4 is arranged biased, the support member 9 may be partially overheated, resulting in uneven temperature. In this case, the width (or cross-sectional area) of the heating resistance wire 4 in the part where the temperature is high is made wider than the width (or cross-sectional area) of the heating resistance wire 4 in other parts. By widening the wire width (or cross-sectional area), the amount of heat generated by the heating resistance wire 4 decreases, making it possible to suppress temperature differences caused by bias in the heating resistance wire 4.

[0029] In the second and third embodiments described above, flexible wiring board 1 has a multilayer wiring structure consisting of a wiring layer including heating resistance wire 4 and a wiring layer including signal wire 3 and power wires (5, 6). The multilayer wiring structure of flexible wiring board 1 of the third embodiment will be specifically described below. Fig. 5 shows an example of a multi-layer wiring structure, and Fig. 6 shows another example of a multi-layer wiring structure. Fig. 5 and Fig. 6 both show a cross-sectional structure of flexible wiring board 1 taken along line AA in Fig. 4.

[0030] Referring to FIG. 5, the flexible wiring board 1 has a first wiring layer 52 and a second wiring layer 53. The first wiring layer 52 includes a heating resistor wire 4. The second wiring layer 53 includes a signal line 3, a power line 5, and a power line 6. The first wiring layer 52 is formed on one surface of a base layer 51, and the second wiring layer 53 is formed on the other surface of the base layer 51. Furthermore, two coverlay films 50 are provided so as to sandwich the first wiring layer 52 and the second wiring layer 53 from above and below. Here, the coverlay film 50 is composed of, for example, a protective film layer and an adhesive layer. The base layer 51 is composed of polyimide or the like.

[0031] The temperature detection element 12 is disposed on the coverlay film 50 on the first wiring layer 52 side (on the surface of the first wiring layer 52 facing the support member 9). In the first wiring layer 52, the heating resistance wire 4 is provided in an area other than the area adjacent to the temperature detection element 12. In the second wiring layer 53, the power line 6 is disposed in the center, and the signal line 3 and the power line 5 are disposed on both sides of the power line 6. The second wiring layer 53 may be divided into a wiring layer including the signal line 3 and a wiring layer including the power line 5 and the power line 6.

[0032] 6, flexible wiring board 1 has a first wiring layer 52, a second wiring layer 54, a third wiring layer 55, and a fourth wiring layer 56. First wiring layer 52 includes heating resistor wire 4. Second wiring layer 54 and third wiring layer 55 each include power line 6. Fourth wiring layer 56 includes signal line 3 and power line 5. The first base material layer 51 is disposed between the second wiring layer 54 and the third wiring layer 55. The first wiring layer 52 is disposed on the side of the second wiring layer 54, and the second base material layer 51 is disposed between the first wiring layer 52 and the second wiring layer 54. The fourth wiring layer 56 is disposed on the side of the third wiring layer 55, and the third base material layer 51 is disposed between the fourth wiring layer 56 and the third wiring layer 55. Two coverlay films 50 are provided so as to sandwich the first wiring layer 52 and the fourth wiring layer 56 from above and below. The first base material layer 51 in the center may be an adhesive layer.

[0033] The temperature detection element 12 is disposed on the coverlay film 50 on the first wiring layer 52 side (on the surface of the first wiring layer 52 opposite the third wiring layer 55). In the first wiring layer 52, the heating resistance wire 4 is provided in an area other than the area adjacent to the temperature detection element 12. In the second wiring layer 54 and the third wiring layer 55, the power lines 6 are formed over the entire surface without any gaps. The first wiring layer 52 including the heating resistance wire 4 and the fourth wiring layer 56 including the signal lines 3 are separated by a wiring layer over which the power lines 6 are formed.

[0034] When the influence of electromagnetic radiation noise is small, it is preferable to use a flexible wiring board 1 having a two-layer wiring structure shown in Fig. 5. When the influence of electromagnetic radiation noise is large, it is preferable to use a flexible wiring board 1 having a four-layer wiring structure shown in Fig. 6. In this case, the second wiring layer 54 and the third wiring layer 55 function as layers that protect the signal line 3 from electromagnetic radiation noise. Both the two-layer wiring structure shown in Fig. 5 and the four-layer wiring structure shown in Fig. 6 can be applied to the flexible wiring board 1 of the second embodiment.

[0035] In the flexible wiring board 1 of the present embodiment described above, the temperature detection element 12 and the heating resistor wire 4 may be arranged in any manner as long as the temperature of the supporting member 9 can be accurately detected and the temperature distribution of the supporting member can be prevented from becoming uneven. Below, modified examples in which the wiring form of the heating resistor wire is different will be described.

[0036] (First Modification) FIG. 7 is a schematic diagram for explaining a first modified example of flexible wiring board 1 of the third embodiment. 7 has a heating resistance wire 34 in addition to the heating resistance wire 4, which differs from that shown in FIG. 4. The heating resistance wire 34 is arranged on the contact surface 10a in parallel with the heating resistance wire 4 so as to avoid the temperature detection element 12. Like the heating resistance wire 4, the heating resistance wire 34 also has a folded pattern. The width (or cross-sectional area) of the heating resistance wire 34 is the same as the width (or cross-sectional area) of the heating resistance wire 4.

[0037] One end of the heating resistance wire 34 is electrically connected to the power line 31a, and the other end of the heating resistance wire 34 is electrically connected to the power line 31b. The power lines 31a and 31b are electrically connected to the printing apparatus main body via different pads 37. The width (or cross-sectional area) of the power lines 31a and 31b is the same as the width (or cross-sectional area) of the power lines 11a and 11b. Here, like the pad 7, the pad 37 is also provided in a wiring layer (not shown) including the signal line 3, so the power lines 31a and 31b are electrically connected to the pad 37 through the via 38.

[0038] According to the flexible wiring board 1 of this modification, the supporting member can be heated by the two heating resistor wires 4, 34. Compared to that shown in Fig. 4, the heating resistor wires occupy a larger proportion of the contact surface 10a, so the amount of heat generated on the entire contact surface 10a increases, and the supporting member can be heated uniformly. Moreover, it is possible to supply power separately to the heating resistance wire 4 and the heating resistance wire 34. By making the directions of currents flowing through the heating resistance wire 4 and the heating resistance wire 34 opposite to each other, the electromagnetic fields generated by the heating resistance wire 4 and the heating resistance wire 34 cancel each other out, thereby making it possible to suppress unnecessary electromagnetic radiation.

[0039] (Second Modification) FIG. 8 is a schematic diagram for explaining a second modified example of flexible wiring board 1 of the third embodiment. 8 differs from the first modified example in that the heating resistance wire 4 and the heating resistance wire 34 are connected in parallel. One end of each of the heating resistance wires 3, 34 is electrically connected to a power line 11a, and the other end of each of the heating resistance wires 3, 34 is electrically connected to a power line 11b. The power lines 11a, 11b are capable of supplying power capable of raising each of the heating resistance wires 3, 34 to a desired temperature. Flexible wiring board 1 of this modification does not require power lines 31a, 31b, pads 37 and vias 38, and therefore manufacturing costs can be reduced, as compared with the first modification.

[0040] (Third Modification) FIG. 9 is a schematic diagram for explaining a third modified example of flexible wiring board 1 of the third embodiment. The flexible wiring board 1 shown in FIG. 9 differs from that shown in FIG. 4 in that heating resistor wires 4 in a folded pattern are arranged above, below, left and right of temperature detection element 12. In the flexible wiring board 1 of this modified example, the heating resistance wire 4 occupies a larger proportion of the contact surface 10a compared to that shown in FIG. 4, so that the amount of heat generated on the entire contact surface 10a increases, and the support member can be heated uniformly.

[0041] (Fourth Modification) FIG. 10 is a schematic diagram for explaining a fourth modified example of flexible wiring board 1 of the third embodiment. 10 includes two heating resistor wires 34a and 34b to which power can be supplied individually, as in the first modification, except that the shape and length of the wiring patterns of the heating resistor wires 34a and 34b are different from those in the first modification.

[0042] One end of the heating resistance wire 34a is electrically connected to the power line 11a, and the other end of the heating resistance wire 34a is electrically connected to the power line 31a. The power line 11a is electrically connected to the pad 7 through a via 8, and the power line 31a is electrically connected to the pad 37 through a via 38. The width (or cross-sectional area) of the power lines 11a and 31a is wider than the width (or cross-sectional area) of the heating resistance wire 34a. The heating resistance wire 34b is also electrically connected to the power lines 11b and 31b, like the heating resistance wire 34a. The power lines 11b and 31b are electrically connected to the pads 7 and 37 through the vias 8 and 38. The width (or cross-sectional area) of the power lines 11b and 31b is wider than the width (or cross-sectional area) of the heating resistance wire 34b. The heating resistor wires 34a, 34b are arranged to sandwich the temperature detection element 12 from both sides. Both heating resistor wires 34a, 34b have a folded pattern, but the folded portions are formed in a curved shape. The folded length L is longer toward the power line (11a, 11b, 31a, 31b) side. On the contact surface 10a, the amount of heat generated in an area with a long folded length L is greater than the amount of heat generated in an area with a short folded length L.

[0043] In this modification, the side surface of the holding member 9 that contacts the contact surface 10a has a temperature distribution in the direction of the arrow A. Specifically, the temperature of the side surface of the holding member 9 is lower on the power line (11a, 11b, 31a, 31b) side. In contrast, the amount of heat generated by the abutment surface 10a is greater on the power line (11a, 11b, 31a, 31b) side. For this reason, the low temperature region of the side surface of the holding member 9 is heated by the region of the abutment surface 10a that generates a large amount of heat, and the high temperature region of the side surface of the holding member 9 is heated by the region of the abutment surface 10a that generates a small amount of heat. This makes it possible to prevent the temperature of the side surface of the holding member 9 from becoming uneven.

[0044] As in the first modification, the heating resistor wires 34a and 34b can be supplied with power individually. By making the directions of the currents flowing through the heating resistor wires 34a and 34b opposite to each other, the electromagnetic fields generated by the heating resistor wires 34a and 34b cancel each other out, thereby suppressing unnecessary electromagnetic radiation. Furthermore, by forming the folded back portions of the heating resistance wires 34a, 34b in a curved shape, it is possible to further suppress unnecessary electromagnetic radiation. For example, when current is switched on and off at high speed, it is possible to suppress unnecessary electromagnetic radiation caused by current disturbances at the folded back portions of the heating resistance wires 4. Note that the folded back portions of the heating resistance wires 34a, 34b are not limited to curved wiring. For example, the folded back portions of the heating resistance wires 34a, 34b may be wired in a straight line at an angle that is not an acute angle. In this case, the angle between the two wires that form the corner is preferably, for example, 135 degrees or more.

[0045] Also, configurations other than the above-mentioned modified examples can be applied. For example, the signal line, the heating resistor line, and the power line may be formed in the same wiring layer, the power line may be disposed between the signal line and the heating resistor line, and the temperature detection element 12 may be disposed on the signal line area of ​​the wiring layer. With this configuration, it is possible to suppress the influence of unnecessary electromagnetic radiation noise, accurately detect the temperature of the support member 9, and prevent the temperature of the side surface of the holding member 9 from becoming uneven.

[0046] Next, a liquid ejection head to which the flexible wiring board 1 of the present invention is applied will be described. Fig. 11 is a schematic diagram showing an example of a liquid ejection head. The liquid ejection head shown in Fig. 11 has four recording element substrates 14, four flexible wiring boards 1, and a long support member 9. The support member 9 is a rectangular parallelepiped and has a support surface 9a that supports the recording element substrates 14. In Fig. 11, the long side direction of the support surface 9a is the X-axis direction, and the short side direction of the support surface 9a is the Y-axis direction. The height direction (thickness direction) of the support member 9 is the Z-axis direction.

[0047] The four recording element substrates 14 are arranged in a line in the X-axis direction on the support surface 9a of the support member 9. The support member 9 has a flow path 15 for supplying liquid such as ink to the recording element substrates 14, and a flow path 16 for discharging the liquid that has passed through the inside of the recording element substrate 14. Both the supply side flow path 15 and the discharge side flow path 16 extend in the X-axis direction. The liquid is supplied to each recording element substrate 14 via the flow path 15. The liquid that has passed through the inside of each recording element substrate 15 is discharged via the flow path 16.

[0048] The flexible wiring board 1 is any one of the first to third embodiments described above, and is provided for each recording element substrate 14. One end (the end on the pad 2 side) of the flexible wiring board 1 is fixed to the support surface 9a of the support member 9 together with the recording element substrate 14, and the pads 2 are electrically connected to the recording element substrate 14. The flexible wiring board 1 is bent at the edge on the long side of the support surface 9a and abuts against a side surface 17 of the support member 9. The side surface 17 is adjacent to the flow path 15 on the liquid supply side.

[0049] In the support member 9, the liquid is heated inside the recording element substrate 14, so the temperature of the liquid flowing through the flow path 16 on the discharge side is higher than the temperature of the liquid flowing through the flow path 15 on the supply side. This causes a temperature difference between the portion including the flow path 16 and the portion including the flow path 15, making the temperature distribution in the Y-axis direction uneven. As a result, the support member 9 may be deformed by thermal stress. For example, warping occurs in the X-axis direction. 11, the side surface 17, which is a low-temperature portion of the support member 9, can be heated by using the flexible wiring board 1. This makes it possible to prevent the temperature distribution of the support member 9 from becoming uneven, and thus makes it possible to suppress deformation due to thermal stress.

[0050] By using the flexible wiring board 1 of the third embodiment, the temperature of the side surface 17 of the support member 9 can be measured using the temperature detection element 12. By adjusting the amount of current flowing through the heating resistor wire 4 based on the temperature measured by the temperature detection element 12, the temperature difference between the portion including the flow path 16 and the portion including the flow path 15 can be made smaller. Therefore, the warping in the X-axis direction can be effectively suppressed.

[0051] In addition, the recording element substrate 14 itself may generate heat, causing the temperature distribution of the support member 9 to become non-uniform. For example, in order to provide high-quality printing, a heating resistor called a sub-heater is provided inside the recording element substrate 14, and temperature control is performed to uniformly heat the entire recording element substrate 14 with the heating resistor. In this case, the temperature of the recording element substrate 14 is higher than the temperature of the liquid supplied to the flow path 17, so that a temperature distribution in the Z-axis direction occurs in the support member 9. Specifically, the temperature of the support surface 9a becomes higher than the temperature of the side surface 19 opposite to the support surface 9a. The side surface 17 of the support member 9 is heated using the flexible wiring board 1 so that the temperature of the support member 9 becomes the same as the temperature of the recording element substrate 14. This makes it possible to suppress the temperature distribution in the Z-axis direction from becoming non-uniform, and suppress the warping of the support member 9 in the Z-axis direction.

[0052] Fig. 12 is a schematic diagram showing another example of a liquid ejection head. The liquid ejection head shown in Fig. 12 differs from that shown in Fig. 11 in that flexible wiring board 1 abuts against both side surfaces of support member 9, i.e., side surface 17 and side surface 18. 12, it is possible to use the flexible wiring board 1 to heat not only the side surface 17 but also the side surface 18 opposite to the side surface 17. Therefore, for example, it is possible to efficiently heat the supporting member 9 using the flexible wiring board 1 so that the temperature of the supporting member 9 becomes the same as the temperature of the recording element substrate 14.

[0053] Next, the temperature control device for the liquid ejection head will be described. Fig. 13 is a block diagram showing a schematic configuration of a temperature control device. The temperature control device shown in Fig. 13 controls the temperature of a liquid ejection head 100, and has a control unit 101 and a power supply unit 102. The liquid ejection head 100 includes a flexible wiring board 1 of the present invention, and is, for example, the liquid ejection head shown in Fig. 11 or 12. The power supply unit 102 supplies power to the liquid ejection head 100. For example, the power supply unit 102 supplies the flexible wiring board 1 with driving power for driving the recording element substrate 14 and power for causing the heating resistor wire 4 to generate heat.

[0054] The control unit 101 controls the power supply operation of the power supply unit 102. For example, the control unit 101 causes the power supply unit 102 to supply power to the heating resistor wire 14 during a driving period in which the recording element substrate 14 is driven. When the liquid ejection head 100 includes the flexible wiring board 1 of the third embodiment, the control unit 101 acquires an output value (a value obtained by measuring the temperature of the support member 9) of the temperature detection element 12. Based on the output value of the temperature detection element 12, the control unit 101 adjusts the amount of current flowing through the heating resistor wire 4 so that the support member 9 reaches a predetermined temperature.

[0055] As a method for controlling the current to the heating resistor wire 4, a current chopper method or a current limiting method can be applied. The current chopper method controls the current flowing through the heating resistance wire 4 by alternating between periods when current flows and periods when current does not flow. Examples of this current chopper method include the pulse width modulation (PWM) method and the pulse frequency modulation (PFM) method. The pulse width modulation method keeps the on / off switching period of the current constant and adjusts the pulse width to switch the distribution (duty) of the on and off periods. The pulse frequency modulation method keeps the pulse width constant and adjusts the period; specifically, it keeps the on period constant and modulates the off period. The current limiting method is a method for adjusting the current flowing through the heating resistance wire 4 by changing the voltage applied to the heating resistance wire 4. One example of this current limiting method is a method for adjusting the on-resistance by controlling the base current of a transistor, thereby varying the current flowing through the heating resistance wire 4.

[0056] It is preferable to appropriately apply a method of controlling the current to the heating resistor wire 4 depending on the usage environment of the liquid ejection head 100 or the difference between the current temperature of the support member 9 and the target temperature. Here, the current temperature of the support member 9 can be obtained from the output value of the temperature detection element 12. The control unit 101 may use a pulse width modulation method to supply power to the heating resistance wire 4, for example, when the heat capacity of the support member 9 is small and it heats up easily and cools down easily. The control unit 101 may use a pulse frequency modulation method to supply power to the heating resistance wire 4, for example, when the heat capacity of the support member 9 is large and it is difficult to heat up and cool down. This power supply using the pulse frequency modulation method is effective when a heat quantity such as intermittent operation is sufficient. In general, when the period is long in the pulse width modulation method, it becomes difficult to finely adjust the duty ratio, so when a long period is desired, it is preferable to use the pulse frequency modulation method.

[0057] Furthermore, the control unit 101 may selectively switch between the pulse width modulation method and the pulse frequency modulation method based on the difference between the current temperature and the target temperature of the support member 9. For example, the control unit 101 selects the pulse width modulation method when the difference between the current temperature and the target temperature of the support member 9 is greater than a threshold value T, and selects the pulse frequency modulation method when the difference between the current temperature and the target temperature of the support member 9 is equal to or smaller than the threshold value T. For example, if the current temperature is lower than the target temperature (e.g., the difference is 20°C) and it is desired to approach the target temperature as quickly as possible, the pulse width modulation method is selected. If the difference between the current temperature and the target temperature is small (e.g., a few degrees Celsius) and there is a possibility that the target temperature will be exceeded with the pulse width modulation method, the pulse frequency modulation method is selected. In this case, the threshold T is set to a few degrees Celsius.

[0058] Furthermore, the control unit 101 may supply power to the heating resistor wire 4 using a current limiting method. For example, the current limiting method is selected when analog information from a sensor or the like is acquired via the signal line 3 or the like. When the pulse width modulation method or the pulse frequency modulation method is used, unnecessary electromagnetic radiation may be generated by the pulse current, causing the drive circuit on the recording element substrate to malfunction. By using the current limiting method, such unnecessary electromagnetic radiation can be suppressed. Furthermore, the control unit 101 may selectively switch between any one of the pulse width modulation method, the pulse frequency modulation method, and the current limiting method based on the difference between the current temperature (the output value of the temperature detection element 12) and the target temperature to supply power to the heating resistance wire 4. This allows the support member 9 to be heated efficiently and reliably to the target temperature. Furthermore, the control unit 101 may supply power to the heating resistor wire 4 by combining either one of the pulse width modulation method and the pulse frequency modulation method with the current limiting method.

[0059] When the pulse width modulation method and the current limiting method are combined, for example, the current is controlled from 10% of the maximum current to the maximum by the pulse width modulation method, and the current limiting method is used to control less than 10%. Also, the pulse width modulation method and the current limiting method may be used together to fine-tune the current by 10% or more of the maximum current. When the pulse frequency modulation method and the current limiting method are combined, for example, 50% or less of the maximum current may be controlled by the pulse frequency modulation method, and the current exceeding 50% may be controlled by the current limiting method. As described above, by combining the pulse width modulation method or the pulse frequency modulation method with the current limiting method, it is possible to control the current range that cannot be controlled by the pulse width modulation method or the pulse frequency modulation method by combining the current limiting method. In addition, when handling analog signals from a sensor or the like, it is possible to suppress unnecessary electromagnetic radiation caused by the pulse current by temporarily switching to the current limiting method, thereby obtaining an analog signal with less noise. [Explanation of symbols]

[0060] 1 Flexible wiring board 3 Signal Line 4 Heating resistor wire 5, 6 Power Lines

Claims

1. An electric wiring member supported by a support member that supports a recording element substrate that ejects liquid, a signal line for transmitting a drive signal for driving the recording element substrate; a power line for supplying driving power to the recording element substrate; A heating resistor wire for heating the support member; a first wiring layer including the heating resistor wire; a second wiring layer including the signal lines and the power lines; The electric wiring member, wherein the power line is disposed between the signal line and the heating resistance wire.

2. An electric wiring member supported by a support member that supports a recording element substrate that ejects liquid, a signal line for transmitting a drive signal for driving the recording element substrate; a power line for supplying driving power to the recording element substrate; A heating resistor wire for heating the support member; a first wiring layer including the heating resistor wire; a second wiring layer including the signal lines; a third wiring layer including the power line; The electric wiring member, wherein the power line is disposed between the signal line and the heating resistance wire.

3. 3. The electric wiring member according to claim 1, wherein a plurality of the heating resistance wires are arranged in parallel in a width direction of the electric wiring member.

4. 3. The electric wiring member according to claim 2, wherein the third wiring layer is disposed between the first wiring layer and the second wiring layer.

5. The electric wiring member according to claim 1 , wherein the first wiring layer is disposed on a side that is in contact with the support member.

6. An electric wiring member supported by a support member that supports a recording element substrate that ejects liquid, a signal line for transmitting a drive signal for driving the recording element substrate; a power line for supplying driving power to the recording element substrate; a heating resistor wire for heating the support member; the power line is disposed between the signal line and the heating resistor line, An electric wiring member comprising: a contact surface adapted to be in contact with the support member, the heating resistance wire being formed on the contact surface.

7. 7. The electric wiring member according to claim 6, wherein the heating resistor wire is exposed on the contact surface.

8. 8. The electric wiring member according to claim 6, further comprising a temperature detection element provided on the contact surface.

9. 9. The electric wiring member according to claim 8, wherein the heating resistor wire is disposed at a predetermined distance from the temperature detection element.

10. The electrical wiring member according to claim 9 , wherein the heating resistor wire is disposed on both sides of the temperature detection element.

11. The electrical wiring member according to claim 9, wherein the heating resistor wire is disposed so as to surround the temperature detection element.

12. 12. The electric wiring member according to claim 8, wherein the temperature detection element is accommodated in a recess of the support member.

13. An electric wiring member supported by a support member that supports a recording element substrate that ejects liquid, a signal line for transmitting a drive signal for driving the recording element substrate; a power line for supplying driving power to the recording element substrate; A heating resistor wire for heating the support member; a temperature detection element for detecting a temperature of the support member; The electric wiring member, wherein the power line is disposed between the signal line and the heating resistance wire.

14. the signal line, the heating resistor line and the power line are formed in the same wiring layer; 14. The electric wiring member according to claim 13, wherein the power line is disposed between the signal line and the heating resistor line, and the temperature detection element is disposed on a region of the signal line on the wiring layer.

15. a first wiring layer including the heating resistor wire; a second wiring layer including the signal lines and the power lines; 14. The electrical wiring member according to claim 13, wherein the first wiring layer is disposed on a side that is in contact with the support member, and the temperature detection element is disposed on a surface of the first wiring layer that faces the support member.

16. a first wiring layer including the heating resistor wire; a second wiring layer including the signal lines; a third wiring layer including the power line; 14. The electrical wiring member according to claim 13, characterized in that the first wiring layer is arranged on a side abutting the support member, the third wiring layer is arranged between the first wiring layer and the second wiring layer, and the temperature detection element is arranged on a surface of the first wiring layer opposite the third wiring layer.

17. 17. The electric wiring member according to claim 1, wherein the heating resistance wire, the signal wire, and the power wire are made of copper.

18. The electric wiring member according to any one of claims 1 to 17, a recording element substrate electrically connected to the electric wiring member and configured to eject liquid; a support member for supporting the recording element substrate, The liquid ejection head according to claim 1, wherein the electric wiring member is supported by the supporting member.

19. The support member is a first flow path for supplying a liquid to the recording element substrate; a second flow path for discharging the liquid that has passed through the recording element substrate; 19. The liquid ejection head according to claim 18, wherein the electric wiring member abuts against a side surface of the support member on the side of the first flow path.

20. 20. The liquid ejection head according to claim 18, wherein the electric wiring member and the supporting member are bonded with a thermally conductive adhesive.

21. A temperature control method for adjusting a temperature of a support member that supports a recording element substrate that ejects liquid, comprising the steps of:

18. A temperature control method comprising the steps of: bringing the electric wiring member according to claim 1 into contact with the support member; and supplying power to the heating resistor wire of the electric wiring member during a driving period in which the recording element substrate is driven.

22. 22. The temperature control method according to claim 21, wherein power is supplied to the heating resistor wire by any one of a pulse width modulation method, a pulse frequency modulation method, and a current limiting method.

23. 22. The temperature control method according to claim 21, wherein power is supplied to the heating resistor wire by selectively switching between any one of a pulse width modulation method, a pulse frequency modulation method, and a current limiting method.

24. 22. The temperature control method according to claim 21, wherein power is supplied to the heating resistor wire by combining either one of a pulse width modulation method or a pulse frequency modulation method with a current limiting method.

25. 18. A temperature control device for a liquid ejection head, comprising: an electric wiring member according to claim 1; a recording element substrate electrically connected to the electric wiring member and configured to eject liquid; and a support member configured to support the recording element substrate, the electric wiring member being supported by the support member, a power supply unit that supplies power to the heating resistor wire of the electrical wiring member; A control unit that controls the power supply operation of the power supply unit, The temperature adjusting device according to the present invention, wherein the control unit controls the power supply unit to supply power to the heating resistor wire during a driving period in which the recording element substrate is driven.

26. 17. A temperature control device for a liquid ejection head, comprising: an electric wiring member according to claim 8; a recording element substrate electrically connected to the electric wiring member and configured to eject liquid; and a support member configured to support the recording element substrate, the electric wiring member being supported by the support member, a power supply unit that supplies power to the heating resistor wire of the electrical wiring member; A control unit that controls the power supply operation of the power supply unit, The temperature control device is characterized in that the control unit controls the power supply to the heating resistor wire based on an output value of the temperature detection element.

27. 27. The temperature control device according to claim 26, wherein the control unit selectively switches between a pulse width modulation method and a pulse frequency modulation method based on a difference between an output value of the temperature detection element and a target temperature to supply power to the heating resistor wire.

28. 27. The temperature control device according to claim 26, wherein the control unit selectively switches between a pulse width modulation method, a pulse frequency modulation method, and a current limiting method based on a difference between an output value of the temperature detection element and a target temperature to supply power to the heating resistor wire.

29. 27. The temperature adjusting device according to claim 25, wherein the control unit supplies power to the heating resistor wire by combining one of a pulse width modulation method and a pulse frequency modulation method with a current limiting method.

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