Coating film wiping tool, coating film wiping device, and coating film wiping method

Abstract

To suppress generation of a defect in a coating film on a substrate surface as compared to a configuration in which a lower opening of a substrate is blocked by an insertion part.SOLUTION: A coating film wiping jig 62 of a coating film wiping device 60 includes: a base part 68; and an insertion part 70 supported by the base part 68 and configured to be inserted to a lower end 12B of a substrate 12. The coating film wiping jig 62 includes: an inside wiping part 72 that wipes a coating film adhered to a radially inner surface 12C in the lower end 12B of the substrate 12; and an outside wiping part 74 that wipes a coating film adhered to a radially outer surface 12D in the lower end 12B of the substrate 12. The coating film wiping jig 62 includes a solvent supply passage 86 through which a solvent supplied to the inside of the substrate 12 passes, a solvent reservoir 84 in which solvent supplied to the inside of the substrate 12 is stored, and a gas passage 88 connecting an inner space and an outer space of the substrate 12 such that gas can pass therethrough.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a coating film wiping tool, a coating film wiping device, and a coating film wiping method. [Background technology]

[0002] The following Patent Document 1 discloses a manufacturing device for electrophotographic photoreceptors used to remove unnecessary coating films from the lower end of a cylindrically formed substrate. The manufacturing device for electrophotographic photoreceptors includes an inner leg stand inserted into the lower end opening of the substrate and an outer leg stand provided radially outward of the lower end of the inner leg stand. A solvent reservoir is provided between the inner leg stand and the outer leg stand. The manufacturing device for electrophotographic photoreceptors also includes an inner rubbing body attached to the inner leg stand and an outer rubbing body attached to the outer leg stand. When the inner leg stand is inserted into the lower opening of the substrate and a solvent is discharged from the upper end side of the inner leg stand, the solvent adheres to the inner rubbing body and accumulates in the solvent reservoir. In this state, when the inner leg stand and the outer leg stand rotate, the inner peripheral surface of the lower end of the substrate is rubbed by the inner rubbing body, and the outer peripheral surface of the lower end of the substrate is rubbed by the outer rubbing body. This makes it possible to remove unnecessary coating films from the inner peripheral surface and outer peripheral surface of the lower end of the substrate. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] JP 2001-281888 A Summary of the Invention [Problem to be solved by the invention]

[0004] If the pressure inside the substrate increases due to the solvent vapor, there is a concern that bubbles released between the substrate and the jig may adhere to the outer peripheral surface of the substrate, causing defects in the coating film on the outer peripheral surface of the substrate.

[0005] The present invention takes into consideration the above-mentioned facts and aims to provide a coating film wiping tool, a coating film wiping device, and a coating film wiping method that can suppress the occurrence of defects in the coating film on the surface of a substrate, compared to a configuration in which the lower opening of the substrate is blocked by an insertion portion. [Means for solving the problem]

[0006] The coating film wiping jig of the first embodiment comprises a rotatably supported base portion, an insertion portion supported by the base portion and inserted into the lower end portion of a cylindrically formed substrate, an inner wiping portion supported by the insertion portion and configured to wipe off a coating film adhering to the radially inner surface of the lower end portion of the substrate, an outer wiping portion supported by the base portion and configured to wipe off a coating film adhering to the radially outer surface of the lower end portion of the substrate, a solvent supply passage provided in the base portion and the insertion portion through which solvent supplied to the inside of the substrate passes, a solvent reservoir provided around the outer wiping portion and in which the solvent supplied to the inside of the substrate accumulates, and a gas passage provided in the base portion and the insertion portion and configured to connect the inner space and the outer space of the substrate to allow gas to pass therethrough.

[0007] The second embodiment of the coating wiping jig is the coating wiping jig of the first embodiment, wherein the insertion portion is provided with an outlet connected to the solvent supply path and through which the solvent is discharged, and an opening connected to the gas passageway and located below the outlet and opening toward the inside of the substrate, and between the outlet and the opening is provided a eaves-shaped portion that channels the solvent discharged from the outlet to the side away from the opening.

[0008] The third embodiment of the coating film wiping jig is a coating film wiping jig of the first or second embodiment, in which the outer wiping portion is supported so as to be displaceable toward the insertion portion and the side opposite the insertion portion, and when the insertion portion is inserted into the lower end portion of the substrate, the outer wiping portion is displaced toward the insertion portion, and the outer wiping portion contacts the coating film on the radially outer surface at the lower end portion of the substrate in line with the inclination of the substrate relative to the base portion.

[0009] The coating film wiping jig of the fourth embodiment is a coating film wiping jig of the first or second embodiment, in which the outer wiping portion is supported so as to be displaceable toward the insertion portion and toward the opposite side to the insertion portion, and the outer wiping portion is displaced to a position corresponding to the outer diameter of the substrate to contact the coating film on the radially outer surface at the lower end of the substrate.

[0010] The coating film wiping device of the fifth aspect includes a rotating unit having a coating film wiping tool of any one of the first to fourth aspects attached thereto and rotating the base unit, a chuck unit arranged above the rotating unit and supporting an upper end portion of the substrate, and a solvent supply unit that supplies the solvent to the inside of the substrate through the solvent supply path.

[0011] The sixth aspect of the coating film wiping device is the coating film wiping device of the fifth aspect, further comprising a plurality of the coating film wiping tools and a plurality of the chuck portions each supporting the upper end portions of a plurality of the substrates.

[0012] A coating film wiping method of the seventh aspect includes a first step of using the coating film wiping device of the fifth or sixth aspect to lower the substrate supported by the chuck portion so as to insert the insertion portion into the lower end portion of the substrate, and a second step of supplying the solvent to the inside of the substrate through the solvent supply path and rotating the base portion with the rotating portion so as to wipe off the coating film adhering to the radially inner surface of the lower end portion of the substrate with the inner wiping portion and to wipe off the coating film adhering to the radially outer surface of the lower end portion of the substrate with the outer wiping portion.

[0013] The coating film wiping method of the eighth embodiment is the coating film wiping method of the seventh embodiment, using the coating film wiping device of the sixth embodiment, and in the first step, the substrates supported by the chuck portions are lowered simultaneously, thereby inserting the insertion portions of each of the coating film wiping tools into the lower ends of the substrates, respectively, and in the second step, the base portions of each of the coating film wiping tools are rotated simultaneously.

[0014] The method of wiping off a coating film of a ninth aspect is the method of wiping off a coating film of the seventh or eighth aspect, further comprising a third step of raising and lowering the substrate supported by the chuck portion to separate the lower end of the substrate from the coating film wiping tool, and a fourth step of flowing the solvent at a flow rate equal to or greater than that of the second step through the solvent supply path toward the inner wiping portion and the outer wiping portion to wash away residue of the coating film wiped off by the inner wiping portion and the outer wiping portion. Effect of the Invention

[0015] The coating film wiping jig of the first aspect can prevent defects from occurring in the coating film on the surface of the substrate, compared to a configuration in which the lower opening of the substrate is closed by the insertion portion.

[0016] The coating film wiping tool of the second embodiment can prevent the solvent discharged from the discharge port from flowing from the open port towards the gas passage side, compared to a configuration in which the area between the discharge port and the open port is flat.

[0017] The coating film wiping jig of the third embodiment can more uniformly wipe off the coating film on the radially outer surface at the lower end of the substrate, compared to a configuration in which the outer wiping portion is fixed.

[0018] The coating film wiping jig of the fourth embodiment can wipe off coating films on the radially outer surfaces of substrates having different outer diameters, compared to a configuration in which the outer wiping portion is fixed.

[0019] The coating film wiping device of the fifth aspect can prevent defects from occurring in the coating film on the surface of the substrate compared to a configuration equipped with a coating film wiping tool in which the lower opening of the substrate is blocked by an insertion portion.

[0020] The coating wiping device of the sixth aspect allows multiple substrates to be arranged at a higher density than a configuration including a coating wiping tool in which the lower opening of the substrate is closed by an insertion part.

[0021] The seventh aspect of the coating film wiping method can prevent defects from occurring in the coating film on the surface of the substrate compared to a method using a coating film wiping tool in which the lower opening of the substrate is blocked by an insertion part.

[0022] The coating wiping method of the eighth aspect allows multiple substrates to be processed simultaneously while being arranged at high density, compared to a method using a coating wiping tool in which the lower opening of the substrate is blocked by an insertion part.

[0023] The coating film wiping method of the ninth aspect can suppress defects caused by coating film residue adhering to a substrate, compared to a method that does not have a step of washing away coating film residue. [Brief description of the drawings]

[0024] [Figure 1] 1 is a side view showing a schematic diagram of a coating film wiping device according to an embodiment of the present invention; [Diagram 2] FIG. 2 is a side cross-sectional view showing a cross section of a lower end portion of a substrate before a coating film is removed. [Diagram 3] FIG. 2 is a side cross-sectional view showing a cross section of the lower end portion of the substrate after the coating has been removed. [Figure 4] FIG. 2 is a perspective view showing a coating film wiping jig of the first embodiment. [Diagram 5] FIG. 2 is a side view showing the coating film wiping jig of the first embodiment. [Figure 6] 1 is a side cross-sectional view showing a cross section of a coating film wiping jig of a first embodiment taken along a rotation axis direction. FIG. [Figure 7] 1 is a side view showing a step of placing a substrate supported by a chuck portion above a coating film wiping tool in a coating film wiping method. FIG. [Figure 8] FIG. 2 is a side view showing an insertion step of the coating film wiping method. [Figure 9] FIG. 2 is a side view showing a wiping step of the coating film wiping method. [Figure 10] FIG. 4 is a side view showing an initial state of a separation step in the coating film wiping method. [Figure 11]FIG. 2 is a side view showing a cleaning step in the method for wiping off a coating film. [Figure 12] FIG. 11 is a perspective view showing a coating film wiping jig of a second embodiment. [Figure 13] 11 is a side cross-sectional view showing a cross section of a coating film wiping jig of a second embodiment taken along the rotation axis direction. FIG. [Figure 14] FIG. 2 is a cross-sectional view showing a schematic diagram of each layer of a coating film applied to the surface of a substrate. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0025] Hereinafter, an embodiment for implementing the technology of the present disclosure will be described. In the following description, the direction indicated by the arrow X in the drawings as appropriate is the device width direction, and the direction indicated by the arrow Y is the device height direction. In addition, the direction perpendicular to each of the device width direction and the device height direction (arrow Z direction) is the device depth direction.

[0026] FIG. 1 shows a schematic diagram of a coating film wiping device 60 according to the present embodiment. As shown in FIG. 2 and FIG. 3, the coating film wiping device 60 is a device used to remove the coating film 14 applied to the radially inner surface 12C and the radially outer surface 12D of the lower end 12B of the cylindrical substrate 12. As shown in FIG. 1, the coating film wiping device 60 includes a coating film wiping tool 62 that wipes off the coating film 14 applied to the radially outer surface 12D and the radially inner surface 12C of the lower end 12B of the substrate 12, and a rotating unit 64 to which the coating film wiping tool 62 is attached and which rotates the coating film wiping tool 62. The coating film wiping device 60 is also provided with a chuck unit 16 that is disposed above the rotating unit 64 and that supports the upper end 12A of the substrate 12, and a solvent supply unit 66 that supplies a solvent to the inside of the substrate 12. Here, in this embodiment, in order to realize simultaneous processing of multiple substrates 12, multiple coating wiping tools 62, multiple rotating parts 64 and multiple chuck parts 16 are arranged in a line at predetermined intervals in the width direction and depth direction of the device.

[0027] As shown in Fig. 4 and Fig. 5, the coating film wiping jig 62 of the first embodiment includes a disk-shaped base portion 68 rotatably supported by a rotating portion 64 (see Fig. 1) described later, and an insertion portion 70 supported at the radial center of the base portion 68 and protruding upward from the base portion 68. The coating film wiping jig 62 also includes an inner wiping portion 72 that wipes off the coating film 14 attached to the radially inner surface 12C of the lower end portion 12B of the substrate 12, and an outer wiping portion 74 that wipes off the coating film 14 attached to the radially outer surface 12D of the lower end portion 12B of the substrate 12. In the following description, the rotational axial direction, rotational radial direction, and rotational circumferential direction of the coating film wiping jig 62 will be referred to as the axial direction, radial direction, and circumferential direction, respectively.

[0028] As shown in Figs. 5 and 6, the insertion part 70 includes a base end 76 constituting a portion of the insertion part 70 on the base part 68 side, and a tip part 78 constituting a portion opposite to the base part 68. In Fig. 4, the tip part 78 is omitted from illustration. A plurality of inner wiping parts 72 are supported on the radially outer surface of the base end 76. The inner wiping parts 72 are arranged at a predetermined interval along the circumferential direction. The tip part 78 includes a first overhanging part 78A that spreads radially outward as it approaches the lower side, and a second overhanging part 78B that protrudes radially outward below the first overhanging part 78A. A first recess 78C recessed radially inward is formed between the first overhanging part 78A and the second overhanging part 78B in the tip part 78. Further, a second recess 78D recessed radially inward is also formed on the lower side of the second overhanging portion 78B.

[0029] 4, three outer wiping parts 74 are supported via three tilting support parts 80 on the radial outside of the part where the insertion part 70 is supported on the base part 68. The tilting support part 80 includes a base 80A fixed to the base part 68, and an arm part 80B tiltably supported on the base 80A and to which one end of the outer wiping part 74 is fixed. When one end of the outer wiping part 74 is fixed to the arm part 80B, the other end of the outer wiping part 74 is separated from the arm part 80B.

[0030] 4 and 7, before the substrate 12 is set in the coating film wiping jig 62, that is, before the insertion portion 70 of the coating film wiping jig 62 is inserted into the lower end portion 12B of the substrate 12, the three outer wiping portions 74 are inclined obliquely upward with respect to the radial inside. Also, as shown in Fig. 4 and 8, when the substrate 12 is set in the coating film wiping jig 62, that is, when the insertion portion 70 of the coating film wiping jig 62 is inserted into the lower end portion 12B of the substrate 12, the three arm portions 80B are inclined with respect to the three bases 80A, and the three outer wiping portions 74 are displaced toward the radially outer surface 12D of the lower end portion 12B of the substrate 12 and come into contact with the coating film 14 (see Fig. 2) on the radially outer surface 12D. If the speed at which the substrate 12 is lowered when it is set on the coating wiping jig 62 is too fast, damage to the outer wiping portion 74 or a shortened service life may occur. For this reason, it is preferable to set the speed at which the substrate 12 is lowered to a predetermined speed within a range of 450 mm / min or less.

[0031] Here, in the coating film wiping jig 62 of this embodiment, the three outer wiping parts 74 are displaced as described above, so that even if the substrate 12 is set in a state where it is slightly tilted relative to the base part 68 of the coating film wiping jig 62, the three outer wiping parts 74 can be brought into contact with the coating film 14 on the radially outer surface 12D of the lower end part 12B of the substrate 12 in a position that follows the tilt. In other words, even if the substrate 12 is set in a state where it is slightly tilted relative to the coating film wiping jig 62, the three outer wiping parts 74 can be brought into contact with the coating film 14 on the radially outer surface 12D of the lower end part 12B of the substrate 12 in the same state as when the substrate 12 is set in a state where it is not tilted relative to the coating film wiping jig 62.

[0032] 5, a cylindrical outer ring 82 is attached to the outer periphery of the base portion 68. A solvent reservoir 84 for storing a solvent, which will be described later, is formed between the outer ring 82 and the base end portion 76 of the insertion portion. As a result, the solvent reservoir 84 surrounds the three outer wiping portions 74.

[0033] As shown in FIG. 6, the base portion 68 and the insertion portion 70 are provided with a solvent supply passage 86 through which the solvent supplied to the radially inner space of the substrate 12 passes. The solvent supply passage 86 includes a central passage 86A extending in the axial direction at the radial center of the base portion 68 and the insertion portion 70, and an upper passage 86B extending from the upper end of the central passage 86A toward the radially outer side. The radially outer end of the upper passage 86B is an outlet 86C that opens on the radially outer surface of the first overhanging portion 78A. The solvent is discharged from the outlet 86C. The opposite side of the outlet 86C in the solvent supply passage 86 extends downward from the base portion 68 and is connected to the solvent supply unit 66 (see FIG. 1) described later.

[0034] In addition, a gas passage 88 is provided inside the base portion 68 and the insertion portion 70, connecting the space inside the base material 12 and the space outside the base material 12 so that gas can pass through. The gas passage 88 includes a central passage 88A that extends in the axial direction at the radial center of the base portion 68 and the insertion portion 70 and has a double-pipe structure with the central passage 86A of the solvent supply passage 86. The central passage 88A of the gas passage 88 is disposed radially outward relative to the central passage 86A of the solvent supply passage 86. The gas passage 88 includes a pair of upper passages 88B that branch off from the upper end of the central passage 88A and extend radially outward. The radially outer ends of the pair of upper passages 88B are open ports 88C that open into the second recess 78D below the second overhanging portion 78B. The side of the gas passage 88 opposite the open port 88C extends downward from the base portion 68 and is open to a space below or to a side of the coating wiping device 60.

[0035] 1, the rotating unit 64 includes a mounting base 64A on which the coating wiping jig 62 is attached, and a motor (not shown) that rotates the mounting base 64A to rotate the base unit 68. Here, the rotation of the motor can be controlled to control the rotation of the mounting base 64A. Note that a single motor may be configured to rotate multiple mounting bases 64A, or multiple motors may be configured to rotate multiple mounting bases 64A, respectively.

[0036] The chuck portion 16 is configured to support the upper end portion 12A of the substrate 12 by, for example, operating compressed air or an electric actuator. As an example, the chuck portion 16 is inserted into the upper end portion 12A of the substrate 12 and operates to increase its radial dimension, thereby supporting the upper end portion 12A of the substrate 12. The chuck portion 16 is formed with a gas passage hole 16A that connects the space inside the substrate 12 and the space above the substrate 12 so that gas can pass through. In addition, the gas passage hole 16A is connected to an opening / closing valve (not shown). The opening / closing operation of the opening / closing valve can be performed arbitrarily. Therefore, for example, during the period in which the substrate 12 is dip-coated, the gas passage hole 16A can be closed by the opening / closing valve.

[0037] 1 and 6, the solvent supply unit 66 includes a solvent tank that stores a solvent capable of dissolving the coating film 14 applied to the surface of the substrate 12, and a pump that discharges the solvent stored in the solvent tank from the discharge port 86C through the solvent supply path 86. Here, by controlling the output of the pump, it is possible to adjust the amount of solvent discharged from the discharge port 86C.

[0038] Next, a method for wiping off a coating film using the coating film wiping device 60 described above will be described.

[0039] 7, first, upper end portions 12A of the multiple substrates 12 are supported by the multiple chuck portions 16, and the multiple substrates 12 supported by the multiple chuck portions 16 are simultaneously moved above the coating wiping jigs 62. In the coating wiping device 60 of this embodiment, multiple substrates 12 are simultaneously processed through each process described below, but the following description will be given of the processing of one substrate 12.

[0040] Next, as shown in Fig. 8, the chuck portion 16 is lowered to lower the substrate 12 supported by the chuck portion 16, and the insertion portion 70 of the coating wiping jig 62 is inserted into the lower end portion 12B of the substrate 12. This step is the insertion step as the first step. When the insertion step is completed, the inner wiping portion 72 is in contact with the coating film 14 (see Fig. 2) on the radially inner surface 12C of the lower end portion 12B of the substrate 12, and the outer wiping portion 74 is in contact with the coating film 14 on the radially outer surface 12D of the lower end portion 12B of the substrate 12.

[0041] Next, as shown in FIG. 9, the solvent supply unit 66 (see FIG. 1) is operated to supply the solvent 90 to the inside of the substrate 12 through the solvent supply path 86 (see FIG. 6), and the base unit 68 is rotated by the rotation unit 64 to rotate the entire coating film wiping jig 62. This step is the wiping step as the second step. When the solvent 90 is supplied to the inside of the substrate 12 in the wiping step, the solvent 90 adheres to the inner wiping unit 72 and is stored in the solvent reservoir 84. The solvent 90 stored in the solvent reservoir 84 adheres to the outer wiping unit 74. The liquid level of the solvent 90 stored in the solvent reservoir 84 is indicated by a two-dot chain line. In the wiping process, when the entire coating film wiping jig 62 rotates, the coating film 14 attached to the radially inner surface 12C of the lower end 12B of the substrate 12 is wiped off by the inner wiping part 72, and the coating film 14 attached to the radially outer surface 12D of the lower end 12B of the substrate 12 is wiped off by the outer wiping part 74. Then, after a predetermined time has elapsed, the rotation of the coating film wiping jig 62 is stopped. The solvent 90 stored in the solvent reservoir 84 is recovered through a recovery part (not shown) and is again supplied to the inside of the substrate 12 from the solvent supply part 66 through the solvent supply path 86. The solvent used is one that can dissolve the coating film, and is preferably a solvent used in the photosensitive coating liquid.

[0042] Next, as shown in Figures 10 and 11, the chuck portion 16 is raised to raise and lower the substrate 12 supported by the chuck portion 16, and the lower end portion 12B of the substrate 12 is separated from the coating film wiping jig 62. This step is the separation step as the third step. The raising speed of the substrate 12 is preferably set to a predetermined speed in the range of 50 to 400 mm / min in order to improve the evaluation of "external surface wiping residue" and "edge droop" described later. In some cases, such as when the coating film 14 is thick, the external surface wiping residue can be suppressed by repeating this operation.

[0043] Next, by increasing the output of the pump of the solvent supply unit 66 (see FIG. 1) more than in the wiping step, the solvent 90 is caused to flow through the solvent supply passage 86 (see FIG. 6) toward the inner wiping unit 72 and the outer wiping unit 74 at a flow rate equal to or greater than that in the wiping step. This step is the cleaning step as the fourth step. In this cleaning step, the residue of the coating film 14 wiped off by the inner wiping unit 72 and the outer wiping unit 74 is washed away.

[0044] Through the above steps, the coating film 14 applied to the radially outer surface 12D and the radially inner surface 12C of the lower end portion 12B of the substrate 12 is removed as shown in FIG.

[0045] (Effects of this embodiment) Next, the effects of this embodiment will be described.

[0046] As shown in FIG. 6, in the coating film wiping jig 62 of this embodiment, the gas passage 88 is provided in the base part 68 and the insertion part 70. Therefore, in the wiping process shown in FIG. 9, the space inside the substrate 12 and the space outside the substrate 12 are connected so that gas can pass through them. As a result, even if the amount of vapor of the solvent 90 discharged from the gas passage hole 16A of the chuck part 16 is insufficient, the vapor of the solvent 90 in the space inside the substrate 12 can be discharged through the gas passage 88, and the pressure in the space inside the substrate 12 is prevented or suppressed from increasing due to the vapor of the solvent 90. As a result, in the insertion process to the separation process shown in FIG. 10, the release of the vapor of the solvent 90 from between the lower opening of the substrate 12 and the insertion part 70 is prevented or suppressed. This prevents or suppresses bubbles generated in the solvent reservoir 84 due to the release of vapor of the solvent 90 from adhering to the radially outer surface 12D of the substrate 12, thereby making it possible to prevent or suppress defects from occurring in the coating film 14 on the radially outer surface 12D of the substrate 12. Furthermore, since the release of vapor of the solvent 90 prevents or suppresses bubbles generated in the solvent reservoir 84 from adhering to the radially outer surface 12D of an adjacent substrate 12, when multiple substrates 12 are treated simultaneously, the multiple substrates 12 can be arranged at high density.

[0047] 6, in the coating wiping jig 62 of this embodiment, the open port 88C of the gas passage 88 is opened in the second recess 78D below the second overhanging portion 78B. This allows the solvent discharged from the discharge port 86C of the solvent supply passage 86 to be diverted to the side away from the open port 88C by the second overhanging portion 78B. As a result, it is possible to prevent the solvent discharged from the discharge port 86C from flowing from the open port 88C toward the gas passage 88 side.

[0048] 4 and 8, in the coating film wiping jig 62 of this embodiment, when the insertion portion 70 of the coating film wiping jig 62 is inserted into the lower end portion 12B of the substrate 12, the three arm portions 80B are tilted relative to the three bases 80A, and the three outer wiping portions 74 are displaced toward the radially outer surface 12D of the lower end portion 12B of the substrate 12 to contact the coating film 14 (see FIG. 2) on the radially outer surface 12D. As a result, even if the substrate 12 is set in a state in which it is slightly tilted relative to the base portion 68 of the coating film wiping jig 62, the three outer wiping portions 74 can be brought into contact with the coating film 14 on the radially outer surface 12D of the lower end portion 12B of the substrate 12 in the same state as when the substrate 12 is set in a state not inclined relative to the coating film wiping jig 62. As a result, compared to a configuration in which the outer wiping portion 74 does not displace along the inclination of the substrate 12 relative to the base portion 68, the coating film on the radially outer surface 12D of the lower end portion 12B of the substrate 12 can be wiped off more uniformly.

[0049] 11, in the cleaning step of this embodiment, the solvent 90 is caused to flow through the solvent supply passage 86 (see FIG. 6) toward the inner wiping portion 72 and the outer wiping portion 74 at a flow rate equal to or greater than that of the wiping step, thereby washing away the residue of the coating film 14 wiped away by the inner wiping portion 72 and the outer wiping portion 74. This makes it possible to suppress defects caused by the residue of the coating film 14 adhering to the substrate 12, as compared to a method that does not have a step of washing away the residue of the coating film 14.

[0050] In the above-described embodiment, an example has been described in which the coating film wiping jig 62 capable of treating the substrate 12 having a single outer diameter is used, but the embodiment of the present disclosure is not limited to this. For example, as shown in Fig. 12, a coating film wiping jig 92 of a second form capable of treating substrates 12 having outer diameters in a predetermined range may be used.

[0051] The coating film wiping jig 92 includes a base portion 68 rotatably supported by the rotating portion 64 (see FIG. 1), and an insertion portion 70 supported at the radial center of the base portion 68 and protruding upward from the base portion 68. The coating film wiping jig 92 also includes an inner wiping portion 72 that wipes off the coating film 14 attached to the radially inner surface 12C of the lower end portion 12B of the substrate 12, and an outer wiping portion 74 that wipes off the coating film 14 attached to the radially outer surface 12D of the lower end portion 12B of the substrate 12. The coating film wiping jig 92 also includes a cylindrical adjustment pipe 94 arranged radially outward of the base portion 68. In addition, the components and parts of the coating film wiping jig 92 that correspond to those of the coating film wiping jig 62 described above will be given the same reference numerals as those of the components and parts corresponding to those of the coating film wiping jig 62 described above, and their descriptions may be omitted.

[0052] As shown in FIG. 12 and FIG. 13, the insertion part 70 includes a base end part 76 constituting a part of the insertion part 70 on the base part 68 side, and a tip part 78 constituting a part opposite to the base part 68. In FIG. 12, the tip part 78 is omitted from illustration. As shown in FIG. 13, a plurality of inner wiping parts 72 are supported on the radially outer surface of the base end part 76. The inner wiping parts 72 are arranged at equal intervals along the circumferential direction. The tip part 78 includes an eave-shaped part 78E as an eave-shaped part that expands radially outward as it approaches the lower side. A recess 78F recessed radially inward is formed on the lower side of the eave-shaped part 78E in the tip part 78. In addition, in the solvent supply path 86 of this embodiment, the upper end of the central flow path 86A is a discharge port 86C that opens on the upper surface of the eave-shaped part 78E. Furthermore, in the gas passage 88 of this embodiment, the upper flow path 88B has a U-shape that is open on the lower side in a side cross-sectional view, so that the opening direction of the open end 88C of the gas passage 88 faces downward within the recess 78F.

[0053] As shown in FIG. 12, four outer wiping parts 74 are supported via four tilting support parts 96 on the radial outside of the part where the insertion part 70 is supported on the base part 68. One end part 96A of the tilting support part 96 is supported on the base part 68 so as to be tiltable in the radial direction with the vertical direction as the axial direction. A load is applied to the tilting support part 96 in the radial outward direction by a spring (not shown). In addition, the outer wiping part 74 is attached to the radially inner surface of the other end part 96B of the tilting support part 96. Furthermore, a protruding part 96C protruding radially outward is provided between the one end part 96A and the other end part 96B of the tilting support part 96.

[0054] The adjustment tube 94 is provided so as to be movable in the vertical direction relative to the base portion 68. The surface of the adjustment tube 94 with which the protruding portion 96C of the tilt support portion 96 comes into contact is an inclined surface 94A that is inclined radially outward as it moves upward. When the adjustment tube 94 moves upward relative to the base portion 68, the protruding portion 96C is pushed radially inward by the inclined surface 94A, and the tilt support portion 96 tilts radially inward. On the other hand, when the adjustment tube 94 moves downward relative to the base portion 68, the tilt support portion 96 tilts radially outward. In this way, the outer wiping portion 74 attached to the tilt support portion 96 is displaced in the radial direction, so that the outer wiping portion 74 is displaced to a position corresponding to the outer diameter of the substrate 12 and comes into contact with the coating film on the radially outer surface 12D of the lower end portion 12B of the substrate 12. This allows the outer wiping portion 74 to wipe the radially outer surface 12D of the base material 12 within a predetermined range of outer diameter.

[0055] As described above, the coating wiping jigs 62, 92 can prevent defects from occurring in the coating on the surface of the substrate 12, compared to a configuration in which the lower opening of the substrate 12 is closed by the insertion portion.

[0056] Compared to a configuration in which the second overhanging portion 78B or the overhanging portion 78E is not provided, the coating film wiping tool 62, 92 can prevent the solvent discharged from the discharge port 86C from flowing from the open port 88C toward the gas passage 88 side.

[0057] Compared to a configuration in which the outer wiping portion 74 does not displace in accordance with the inclination relative to the base portion 68 of the substrate 12, the coating film wiping jig 62 can suppress uneven wiping of the coating film 14 on the radially outer surface 12D at the lower end portion 12B of the substrate 12.

[0058] Compared to a configuration in which the outer wiping portion 74 is fixed, the coating film wiping jig 92 can wipe off the coating film 14 on the radially outer surface 12D of the substrate 12, which has a different outer diameter.

[0059] Compared to a coating wiping device equipped with a coating wiping tool in which the lower opening of the substrate 12 is blocked by an insertion portion, the coating wiping device 60 can prevent defects from occurring in the coating 14 on the surface of the substrate 12.

[0060] The coating wiping device 60 allows multiple substrates 12 to be arranged at a higher density than in a configuration including a coating wiping tool in which the lower opening of the substrate 12 is closed by an insertion part.

[0061] This coating wiping method can prevent defects from occurring in the coating 14 on the surface of the substrate 12 compared to a method using a coating wiping tool in which the lower opening of the substrate 12 is blocked by an insertion part.

[0062] Compared to a method using a coating wiping tool in which the lower opening of the substrate 12 is blocked by an insertion part, this coating wiping method allows multiple substrates 12 to be processed simultaneously while being arranged at high density.

[0063] The method of wiping off the coating film can suppress defects caused by the residue of the coating film 14 adhering to the substrate 12, as compared to a method that does not include a step of washing away the residue of the coating film 14.

[0064] (Example of application to electrophotographic photoreceptors) Next, an example in which the above-mentioned coating film wiping device 60 and coating film wiping method are applied to the manufacture of an electrophotographic photoreceptor 48 (see FIG. 4) will be described.

[0065] 9, any material that has been conventionally used may be used as the conductive substrate 12. Examples include metals such as aluminum, nickel, chromium, and stainless steel, and plastic films provided with thin films of aluminum, titanium, nickel, chromium, stainless steel, gold, vanadium, tin oxide, indium oxide, ITO, and the like, as well as paper and plastic films coated or impregnated with a conductive agent. The shape of the substrate 12 is not limited to a drum (cylinder) shape, and may be a sheet or plate shape.

[0066] When a metal pipe is used as the substrate 12, the surface may be left as is or may have been previously treated by mirror cutting, etching, anodizing, rough cutting, centerless grinding, sandblasting, wet honing, or the like.

[0067] The undercoat layer 50 is provided as necessary for the purpose of preventing light reflection on the surface of the substrate 12 and preventing unnecessary carriers from flowing from the substrate 12 into the photosensitive layer 52. Examples of materials for the undercoat layer 50 include metal powders such as aluminum, copper, nickel, and silver, conductive metal oxides such as antimony oxide, indium oxide, tin oxide, and zinc oxide, and conductive materials such as carbon fiber, carbon black, and graphite powder dispersed in a binder resin and applied to the substrate. Two or more types of metal oxide particles can also be mixed and used. Furthermore, the powder resistance can be controlled by subjecting the metal oxide particles to surface treatment with a coupling agent. In the following description, the undercoat layer 50 may be referred to as a UCL (Under Coat Layer).

[0068] Examples of the binder resin contained in the undercoat layer 50 include known polymer resin compounds such as acetal resins such as polyvinyl butyral, polyvinyl alcohol resins, casein, polyamide resins, cellulose resins, gelatin, polyurethane resins, polyester resins, methacrylic resins, acrylic resins, polyvinyl chloride resins, polyvinyl acetate resins, vinyl chloride-vinyl acetate-maleic anhydride resins, silicone resins, silicone-alkyd resins, phenolic resins, phenol-formaldehyde resins, melamine resins, and urethane resins, as well as charge transporting resins having charge transporting groups and conductive resins such as polyaniline. Among these, resins that are insoluble in the coating solvent of the upper layer are preferably used, and in particular, phenolic resins, phenol-formaldehyde resins, melamine resins, urethane resins, and epoxy resins are preferably used.

[0069] The ratio of the metal oxide particles to the binder resin in the undercoat layer 50 is not particularly limited, and can be set arbitrarily within a range that provides desired electrophotographic photoreceptor characteristics.

[0070] When forming the undercoat layer 50, a coating liquid in which the above components are added to a predetermined solvent is used. Examples of such solvents include organic solvents such as aromatic hydrocarbon solvents such as toluene and chlorobenzene, aliphatic alcohol solvents such as methanol, ethanol, n-propanol, iso-propanol, and n-butanol, ketone solvents such as acetone, cyclohexanone, and 2-butanone, halogenated aliphatic hydrocarbon solvents such as methylene chloride, chloroform, and ethylene chloride, cyclic or linear ether solvents such as tetrahydrofuran, dioxane, ethylene glycol, and diethyl ether, and ester solvents such as methyl acetate, ethyl acetate, and n-butyl acetate. These solvents can be used alone or in combination of two or more. When mixing, any solvent can be used as long as it can dissolve the binder resin as a mixed solvent.

[0071] As a method for dispersing the metal oxide particles in the coating liquid for forming the undercoat layer, a media dispersing machine such as a ball mill, a vibration ball mill, an attritor, a sand mill, or a horizontal sand mill, or a media-less dispersing machine such as an agitator, an ultrasonic dispersing machine, a roll mill, or a high-pressure homogenizer, can be used. Furthermore, examples of the high-pressure homogenizer include a collision type in which the dispersion liquid is dispersed by liquid-liquid collision or liquid-wall collision under high pressure, and a penetration type in which the dispersion liquid is dispersed by penetrating a fine flow path under high pressure.

[0072] Methods for applying the thus obtained coating solution for forming an undercoat layer onto the substrate 12 include dip coating, push-up coating, wire bar coating, spray coating, blade coating, knife coating, curtain coating, and the like. The thickness of the undercoat layer 50 is preferably 15 μm or more, more preferably 20 to 50 μm. Resin particles can also be added to the undercoat layer 50 to adjust the surface roughness. As the resin particles, silicone resin particles, crosslinked PMMA resin particles, and the like can be used.

[0073] The charge generating layer 54 is formed by dispersing a charge generating material in a suitable binder resin. As such a charge generating material, phthalocyanine pigments such as metal-free phthalocyanine, chlorogallium phthalocyanine, hydroxygallium phthalocyanine, dichlorotin phthalocyanine, titanyl phthalocyanine, etc., can be used. In particular, chlorogallium phthalocyanine crystals having strong diffraction peaks at Bragg angles (2θ±0.2°) of at least 7.4°, 16.6°, 25.5°, and 28.3° for CuKα characteristic X-rays, and chlorogallium phthalocyanine crystals having strong diffraction peaks at Bragg angles (2θ±0.2°) of at least 7.7°, 9.3°, 16. Metal-free phthalocyanine crystals having strong diffraction peaks at 9°, 17.5°, 22.4° and 28.8°, hydroxygallium phthalocyanine crystals having strong diffraction peaks at Bragg angles (2θ±0.2°) of at least 7.5°, 9.9°, 12.5°, 16.3°, 18.6°, 25.1° and 28.3° to CuKα characteristic X-rays, and titanyl phthalocyanine crystals having strong diffraction peaks at Bragg angles (2θ±0.2°) of at least 9.6°, 24.1° and 27.2° to CuKα characteristic X-rays can be used. Other charge generating materials include quinone pigments, perylene pigments, indigo pigments, bisbenzimidazole pigments, anthrone pigments, quinacridone pigments, etc. These charge generating materials can be used alone or in combination of two or more kinds. In the following description, the charge generating layer 54 may be called a CGL (Charge Generation Layer).

[0074] Examples of the binder resin in the charge generating layer 54 include polycarbonate resins such as bisphenol A type or bisphenol Z type, acrylic resins, methacrylic resins, polyarylate resins, polyester resins, polyvinyl chloride resins, polystyrene resins, acrylonitrile-styrene copolymer resins, acrylonitrile-butadiene copolymers, polyvinyl acetate resins, polyvinyl formal resins, polysulfone resins, styrene-butadiene copolymer resins, vinylidene chloride-acrylonitrile copolymer resins, vinyl chloride-vinyl acetate-maleic anhydride resins, silicone resins, phenol-formaldehyde resins, polyacrylamide resins, polyamide resins, and poly-N-vinylcarbazole resins. These binder resins can be used alone or in combination of two or more. The compounding ratio of the charge generating material to the binder resin is preferably in the range of 10:1 to 1:10.

[0075] When forming the charge generating layer 54, a coating liquid in which the above components are added to a predetermined solvent is used. Examples of such solvents include organic solvents such as aromatic hydrocarbon solvents such as toluene and chlorobenzene, aliphatic alcohol solvents such as methanol, ethanol, n-propanol, iso-propanol, and n-butanol, ketone solvents such as acetone, cyclohexanone, and 2-butanone, halogenated aliphatic hydrocarbon solvents such as methylene chloride, chloroform, and ethylene chloride, cyclic or linear ether solvents such as tetrahydrofuran, dioxane, ethylene glycol, and diethyl ether, and ester solvents such as methyl acetate, ethyl acetate, and n-butyl acetate. These solvents can be used alone or in combination of two or more. When mixing, any solvent can be used as long as it can dissolve the binder resin as a mixed solvent.

[0076] In order to disperse the charge generating material in the resin, the coating liquid is subjected to a dispersion treatment. As a dispersion method, a media dispersing machine such as a ball mill, a vibration ball mill, an attritor, a sand mill, or a horizontal sand mill, or a media-less dispersing machine such as an agitator, an ultrasonic dispersing machine, a roll mill, or a high-pressure homogenizer, can be used. Furthermore, examples of high-pressure homogenizers include a collision method in which the dispersion liquid is dispersed by liquid-liquid collision or liquid-wall collision under high pressure, and a penetration method in which the dispersion is dispersed by penetrating a fine flow path under high pressure.

[0077] Methods for applying the coating liquid thus obtained onto the undercoat layer 50 include dip coating, push-up coating, wire bar coating, spray coating, blade coating, knife coating, curtain coating, etc. The thickness of the charge generation layer 54 is set in the range of preferably 0.01 to 5 μm, more preferably 0.05 to 2.0 μm.

[0078] The charge transport layer 56 is, for example, a layer containing a charge transport material and a binder resin, or may be a layer containing a polymer charge transport material.

[0079] Examples of the charge transport material include electron transporting compounds such as quinone compounds such as p-benzoquinone, chloranil, bromanil, and anthraquinone; tetracyanoquinodimethane compounds; fluorenone compounds such as 2,4,7-trinitrofluorenone; xanthone compounds; benzophenone compounds; cyanovinyl compounds; and ethylene compounds. Examples of the charge transport material include hole transporting compounds such as triarylamine compounds, benzidine compounds, arylalkane compounds, aryl-substituted ethylene compounds, stilbene compounds, anthracene compounds, and hydrazone compounds. These charge transport materials may be used alone or in combination, but are not limited to these.

[0080] As the charge transport material, from the viewpoint of charge mobility, a triarylamine derivative represented by the following structural formula (a-1) and a benzidine derivative represented by the following structural formula (a-2) are preferable.

[0081] [ka]

[0082] In structural formula (a-1), Ar T1 , Ar T2 , and Ar T3 each independently represents a substituted or unsubstituted aryl group, -C6H4-C(R T4 )=C(R T5 )(R T6 ), or -CH-CH=CH-CH=C(R T7 )(R T8 ) is shown. T4 , R T5 , R T6 , R T7 , and R T8 each independently represents a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group. Examples of the substituent for each of the above groups include a halogen atom, an alkyl group having from 1 to 5 carbon atoms, and an alkoxy group having from 1 to 5 carbon atoms. Examples of the substituent for each of the above groups also include a substituted amino group substituted with an alkyl group having from 1 to 3 carbon atoms.

[0083] [ka]

[0084] In structural formula (a-2), R T91 and R T92 R each independently represents a hydrogen atom, a halogen atom, an alkyl group having 1 to 5 carbon atoms, or an alkoxy group having 1 to 5 carbon atoms. T101 , R T102 , R T111 and R T112 each independently represents a halogen atom, an alkyl group having from 1 to 5 carbon atoms, an alkoxy group having from 1 to 5 carbon atoms, an amino group substituted with an alkyl group having from 1 to 2 carbon atoms, a substituted or unsubstituted aryl group, -C(R T12 )=C(R T13 )(R T14), or -CH=CH-CH=C(R T15 )(R T16 ) and R T12 , R T13 , R T14 , R T15 and R T16 each independently represents a hydrogen atom, a substituted or unsubstituted alkyl group, or a substituted or unsubstituted aryl group. Tm1, Tm2, ​​Tn1, and Tn2 each independently represent an integer of 0 or more and 2 or less. Examples of the substituent for each of the above groups include a halogen atom, an alkyl group having from 1 to 5 carbon atoms, and an alkoxy group having from 1 to 5 carbon atoms. Examples of the substituent for each of the above groups also include a substituted amino group substituted with an alkyl group having from 1 to 3 carbon atoms.

[0085] Among the triarylamine derivatives represented by the structural formula (a-1) and the benzidine derivatives represented by the structural formula (a-2), in particular, "-C6H4-CH=CH-CH=C(R T7 )(R T8 )" and triarylamine derivatives having "-CH=CH-CH=C(R T15 )(R T16 ) is preferable from the viewpoint of charge mobility.

[0086] As the polymer charge transport material, known materials having charge transport properties such as poly-N-vinylcarbazole and polysilane are used. In particular, polyester-based polymer charge transport materials disclosed in JP-A-8-176293 and JP-A-8-208820 are particularly preferred. The polymer charge transport material may be used alone or in combination with a binder resin.

[0087] Examples of the binder resin used in the charge transport layer 56 include polycarbonate resin, polyester resin, polyarylate resin, methacrylic resin, acrylic resin, polyvinyl chloride resin, polyvinylidene chloride resin, polystyrene resin, polyvinyl acetate resin, styrene-butadiene copolymer, vinylidene chloride-acrylonitrile copolymer, vinyl chloride-vinyl acetate copolymer, vinyl chloride-vinyl acetate-maleic anhydride copolymer, silicone resin, silicone alkyd resin, phenol-formaldehyde resin, styrene-alkyd resin, poly-N-vinylcarbazole, polysilane, etc. Among these, polycarbonate resin or polyarylate resin is preferable as the binder resin. These binder resins are used alone or in combination of two or more. The compounding ratio of the charge transport material to the binder resin is preferably from 10:1 to 1:5 by mass.

[0088] The charge transport layer 56 may also contain other well-known additives.

[0089] The charge transport layer 56 may contain a copolymer and fluorine-based resin particles. This copolymer is a fluorine-based graft polymer containing repeating units represented by structural formula A and structural formula B. Specifically, structural formula A is a macromonomer made of, for example, an acrylic acid ester compound, a methacrylic acid ester compound, etc., and structural formula B is, for example, perfluoroalkylethyl (meth)acrylate, perfluoroalkyl (meth)acrylate, and is a resin synthesized by, for example, graft polymerization using these. Here, (meth)acrylate refers to acrylate or methacrylate.

[0090] In the copolymer, the content ratio of Structural Formula A to Structural Formula B, i.e., l:m, is preferably (A) 1:9 to 9:1, more preferably 3:7 to 7:3. When l:m is in the range of (A) 3:7 to 7:3, the tetrafluoroethylene resin can be dispersed in both rows.

[0091] The content of the copolymer according to this embodiment in the surface layer, i.e., the charge transport layer 56, is preferably 1% by mass or more and 5% by mass or less with respect to the content (mass basis) of the fluororesin particles in the surface layer. The average molecular weight of the fluororesin graft polymer is preferably 20,000 to 80,000, more preferably 50,000 to 70,000. In this embodiment, the average molecular weight of the fluororesin particles refers to a value measured by GPC.

[0092] The content of the fluororesin particles relative to the total solid content of the surface layer, i.e., the charge transport layer 56, is preferably 1% by mass or more and 15% by mass or less, and more preferably 2% by mass or more and 12% by mass or less. If the content of the fluororesin particles is 2% by mass or more, the surface energy of the charge transport layer 56 can be reduced, and the durability of the electrophotographic photoreceptor can be improved. In addition, if the content of the fluororesin particles is 15% by mass or less, a decrease in light transmittance and a decrease in film strength are unlikely to occur.

[0093] The fluororesin particles are preferably one or more selected from tetrafluoroethylene resin (PTFE), trifluorochloroethylene resin, hexafluoropropylene resin, vinyl fluoride resin, vinylidene fluoride resin, difluorodichloroethylene resin and copolymers thereof, more preferably tetrafluoroethylene resin and vinylidene fluoride resin, and particularly preferably tetrafluoroethylene resin. When the fluororesin particles according to this embodiment contain tetrafluoroethylene resin, the effect of wear resistance is obtained.

[0094] The method for applying the thus obtained coating solution for forming the charge transport layer onto the charge generating layer includes a dip coating method, a push-up coating method, a wire bar coating method, a spray coating method, a blade coating method, a knife coating method, a curtain coating method, etc. The thickness of the charge transport layer 56 is preferably 15 μm or more, more preferably 20 to 50 μm.

[0095] (Specific examples) The present invention will be described in more detail below based on examples and comparative examples, but the present invention is not limited to the following examples in any way.

[0096] (Regarding Examples 1 to 4) The test conditions and results of Example 1 are shown in Table 1 below. [Table 1]

[0097] Example 1 As shown in Table 1, in Example 1, the coating film 14 wiped off by the coating film wiping tool is the UCL, which is the undercoat layer 50. In Example 1, the outer diameter of the substrate 12 is 30 mm, and the length of the substrate 12 is 340 mm. In Example 1, the wiping time, which is the time required to remove the coating film 14 applied to the lower end 12B of the substrate 12, is 20 seconds, the solvent circulation amount is 1.2 L / min, and the solvent circulation amount during the interval is 1.5 L / min. The wiping time is the time from the time when the lower end of the substrate 12 contacts the inner wiping portion 72 in the insertion process to the time when the lower end of the substrate 12 leaves the inner wiping portion 72 in the separation process. It is the time from the start of rotation of the coating film wiping tool to the end of rotation in the wiping process shown in FIG. The solvent circulation amount corresponds to the discharge amount of the solvent 90 extruded from the discharge port 86C in the wiping process shown in FIG. The amount of solvent circulated during the interval corresponds to the amount of solvent 90 ejected from the ejection port 86C in the cleaning process shown in Fig. 11. In addition, in Example 1, the rotation speed of the coating film wiping jig is set to 50 rpm. Furthermore, in Example 1, an air vent mechanism is provided (at the lower end), and the form of the coating film wiping jig is the coating film wiping jig 92 of the second form described above (see Figs. 12 and 13). The presence of an air vent mechanism (at the lower end) corresponds to a state in which the inner space and the outer space of the substrate 12 are connected by the gas passage 88 so that gas can pass therethrough.

[0098] In this Example 1, four evaluation items were evaluated after each process shown in Figures 7 and 8. The evaluation items were "external surface wiping residue," "edge dripping," "splash defects," and "wiping sponge stains."

[0099] The "external surface wiping residue" was evaluated to see whether or not the coating film 14 remained on the radially outer surface 12D of the lower end portion 12B of the substrate 12. The evaluations of "external surface wiping residue" indicated by "◯", "△", and "×" correspond to evaluations that no coating film 14 remains, a small amount of coating film 14 remains, and some coating film 14 remains, respectively.

[0100] The "edge rounding" was evaluated to see whether the boundary between the part where the coating film 14 was removed and the part where it was not removed was clearly separated on the radially outer surface 12D of the lower end portion 12B of the substrate 12. The "edge rounding" evaluations of "◯", "△", and "×" correspond to "clearly separated", "somewhat clearly separated", and "not clearly separated", respectively.

[0101] The evaluation of "splash defects" was performed by evaluating whether or not defects occurred due to bubbles of the solvent 90 adhering to the radially outer surface 12D of the substrate 12. The evaluations of "splash defects" indicated by "◯", "△", and "×" correspond to evaluations of no splash defects, almost no splash defects, and some splash defects, respectively.

[0102] In the evaluation of "wiping sponge stains," whether or not any residue of the coating film 14 was attached to the inner wiping portion 72 was evaluated in the state after the cleaning process shown in Fig. 11. The evaluations of "wiping sponge stains" indicated by "◯," "△," and "×" correspond to evaluations that there is no residue of the coating film 14, there is almost no residue of the coating film 14, and there is residue of the coating film 14, respectively.

[0103] As shown in Table 1, in Example 1, the evaluation of "◯" was obtained in all of the above four evaluation items.

[0104] Example 2 As shown in Table 1, Example 2 was similar to Example 1 except that the form of the coating film wiping jig was the above-mentioned first form of coating film wiping jig 62 (see Figs. 4 to 6). Example 2 was rated as "◯" in all of the above four evaluation items.

[0105] Example 3 As shown in Table 1, Example 3 was similar to Example 2 except that the outer diameter of the substrate 12 was 84 mm. Example 3 was rated as "○" in all of the above four evaluation items.

[0106] Example 4 As shown in Table 1, Example 4 was similar to Example 3 in conditions, except that the coating film 14 wiped off by the coating film wiping tool was a CGL, which was a charge generating layer 54. Example 4 was rated as "◯" in all of the above four evaluation items.

[0107] (Comparative Example 1 and Comparative Example 2) The test conditions and results of Comparative Example 1 and Comparative Example 2 are shown in Table 2 below. [Table 2]

[0108] As shown in Table 2, Comparative Example 1 was similar to Example 1 except that an air vent mechanism was provided (chuck). Comparative Example 2 was similar to Example 3 except that an air vent mechanism was provided (chuck). Incidentally, "having an air vent mechanism (chuck)" means that the gas passage 88 (see FIG. 6 and FIG. 13) is blocked and the inner space and the outer space of the substrate 12 are connected only by the gas passage hole 16A (see FIG. 1) of the chuck portion 16. Comparative Example 1 and Comparative Example 2 were evaluated as "x" for "splash defect" compared with Example 1 and Example 3. This shows that the evaluation of "splash defect" cannot be improved by only the gas passage hole 16A of the chuck portion 16.

[0109] (Comparative Example 3 and Comparative Example 4) Table 3 below shows the test conditions and results of Comparative Example 3 and Comparative Example 4. [Table 3]

[0110] As shown in Table 3, in Comparative Example 3, the conditions are the same as in Example 1, except that the rotation speed is 70 rpm. In Comparative Example 4, the conditions are the same as in Example 1, except that the rotation speed is 5 rpm. In Comparative Example 3, the evaluation of "splatter defect" was "△" for Examples 1, 5, and 6. From this, it can be seen that even if the rotation speed is too fast, the evaluation of "splatter defect" cannot be improved. In Comparative Example 4, the evaluation of "external surface wiping residue" was "X" for Examples 1, 5, and 6. From this, it can be seen that if the rotation speed is too slow, the coating film 14 cannot be completely wiped off, and the evaluation of "external surface wiping residue" cannot be improved. In Example 5, the conditions are the same as in Example 1, except that the rotation speed is set to 10 rpm. In Example 6, the conditions are the same as in Example 1, except that the rotation speed is set to 60 rpm and the coating film wiping jig 92 of the second form is used. Here, in experiments, it has been found that by setting the rotation speed to a predetermined value in the range of 10 to 60 rpm, the evaluations of "splash defects" and "external surface wiping residue" can be set to "good."

[0111] (Comparative Examples 5 and 6) Table 4 below shows the test conditions and results of Comparative Example 5 and Comparative Example 6. [Table 4]

[0112] As shown in Table 4, in Comparative Example 5, the conditions are the same as those of Examples 1, 7, and 8, except that the wiping time is 60 seconds. In Comparative Example 6, the conditions are the same as those of Examples 1, 7, and 8, except that the wiping time is 5 seconds. In Comparative Example 5, the evaluation of "edge droop" was "x" for Examples 1, 7, and 8. This shows that the evaluation of "edge droop" cannot be improved even if the wiping time is too long. In Comparative Example 6, the evaluation of "external surface wiping residue" was "x" for Examples 1, 7, and 8. Note that, in Example 7, the conditions are the same as those of Example 1, except that the wiping time is 8 seconds. In Example 8, the conditions are the same as those of Example 1, except that the wiping time is 50 seconds. This shows that if the wiping time is too short, the coating film 14 cannot be completely wiped off, and the evaluation of "external surface wiping residue" cannot be improved. Here, in experiments, it has been found that by setting the wiping time to a predetermined number of seconds in the range of 8 to 50 seconds, the evaluations of "edge droop" and "external surface wiping residue" can be evaluated as "good."

[0113] Comparative Example 7 Table 5 below shows the test conditions and results of Comparative Example 7. [Table 5]

[0114] As shown in Table 5, the conditions of Comparative Example 7 are the same as those of Examples 4 and 9, except that the solvent circulation amount is 2.2 L / min. In Comparative Example 7, the evaluation of "edge dripping" was "△" compared to Example 4. The conditions of Example 9 are the same as those of Example 3, except that the wiping time is 20 seconds and the solvent circulation amount is 2.0 L / min. From this, it can be seen that the evaluation of "edge dripping" cannot be improved even if the solvent circulation amount is too large. Here, in the experiment, it was found that the evaluation of "edge dripping" can be "◯" by setting the solvent circulation amount to a predetermined amount in the range of 0 to 2.0 L / min.

[0115] Comparative Example 8 Table 6 below shows the test conditions and results of Comparative Example 8. [Table 6]

[0116] As shown in Table 6, in Comparative Example 8, the conditions are the same as those of Examples 1 and 10, except that the amount of solvent circulated during the interval is 0.9 L / min. In Comparative Example 8, the evaluation of "wiping sponge stains" was "x" compared to Examples 1 and 10. This shows that if the amount of solvent circulated during the interval is too small, the evaluation of "wiping sponge stains" cannot be improved. Note that, in Example 10, the conditions are the same as those of Example 1, except that the amount of solvent circulated during the interval is 1.2 L / min. Here, in the experiment, it has been found that the evaluation of "wiping sponge stains" can be "good" by setting the amount of solvent circulated during the interval to 1 time or more the amount of solvent circulated.

[0117] Although one embodiment of the present invention has been described above, the present invention is not limited to the above, and it is of course possible to implement the present invention in various other modified forms without departing from the spirit and scope of the present invention. [Explanation of symbols]

[0118] 12 Base material 12B Bottom end of substrate 12C: Radially inner surface at the lower end of the substrate 12D Radial outer surface at the bottom end of the substrate 14 Coating 16 Chuck part 60 Paint film wiping device 62 Paint film wiping tool 64 Rotating Part 66 Solvent Supply Section 68 Base 70 Insertion section 72 Inner wiping section 74 Outer wiping section 78B Second eave-shaped part (eave-shaped part) 78E Eave shaped part 84 Solvent Reservoir 86 Solvent supply line 86C outlet 88 Gas passage 88C open mouth 92 Paint film wiping tool

Claims

1. A rotatably supported base portion; an insertion portion that is supported by the base portion and is inserted into a lower end portion of a cylindrical substrate; an inner wiping portion supported by the insertion portion and configured to wipe off a coating film adhering to a radially inner surface of a lower end portion of the substrate; an outer wiping portion supported by the base portion and configured to wipe off a coating film adhering to a radially outer surface of a lower end portion of the substrate; a solvent supply path provided in the base portion and the insertion portion, through which a solvent supplied to an inside of the base passes; a solvent reservoir provided around the outer wiping portion and configured to accumulate the solvent supplied to the inside of the base material; a gas passage provided in the base portion and the insertion portion, through which gas discharged from inside the base passes; A coating film wiping tool equipped with the above.

2. the insertion portion is provided with an outlet port connected to the solvent supply path and through which the solvent is discharged, and an opening connected to the gas passage and disposed below the outlet port and opening toward an inside of the base material, The coating film wiping tool according to claim 1, wherein a visor-like portion is provided between the discharge port and the open port to channel the solvent discharged from the discharge port to a side away from the open port.

3. The outer wiping portion is supported so as to be displaceable toward the insertion portion side and toward the opposite side to the insertion portion, A coating film wiping tool as described in claim 1 or claim 2, wherein when the insertion portion is inserted into the lower end portion of the substrate, the outer wiping portion is displaced toward the insertion portion, and the outer wiping portion contacts the coating film on the radially outer surface at the lower end portion of the substrate along an inclination of the substrate relative to the base portion.

4. The outer wiping portion is supported so as to be displaceable toward the insertion portion side and toward the opposite side to the insertion portion, 3. The coating film wiping tool according to claim 1, wherein the outer wiping portion is displaced to a position corresponding to an outer diameter of the substrate so as to contact the coating film on the radially outer surface of the lower end portion of the substrate.

5. A rotating part to which the coating film wiping jig according to any one of claims 1 to 4 is attached and which rotates the base part; A chuck portion disposed above the rotating portion and supporting an upper end portion of the substrate; a solvent supply unit that supplies the solvent to an inside of the base material through the solvent supply path; A coating film wiping device equipped with the above.

6. A plurality of coating film wiping tools; A plurality of the chuck portions each supporting an upper end portion of a plurality of the substrates; The coating film wiping device according to claim 5 , comprising:

7. Using the coating film wiping device according to claim 5 or 6, a first step of lowering the base material supported by the chuck portion so as to insert the insertion portion into a lower end portion of the base material; a second step of supplying the solvent to the inside of the substrate through the solvent supply path and rotating the base portion by the rotating portion, thereby wiping off the coating film adhering to the radially inner surface of the lower end portion of the substrate by the inner wiping portion and wiping off the coating film adhering to the radially outer surface of the lower end portion of the substrate by the outer wiping portion; A method for wiping off a coating film having the above structure.

8. Using the coating film wiping device according to claim 6, In the first step, the substrates supported by the chuck portions are lowered simultaneously, so that the insertion portions of the coating film wiping jigs are inserted into lower ends of the substrates, respectively; The method for wiping a coating film according to claim 7 , wherein in the second step, the base portions of the plurality of wiping jigs for the coating film are rotated simultaneously.

9. a third step of lifting the substrate supported by the chuck portion to separate a lower end of the substrate from the coating film wiping jig; a fourth step of flowing the solvent through the solvent supply passage toward the inner wiping portion and the outer wiping portion at a flow rate equal to or greater than that of the second step, thereby washing away residues of the coating film wiped off by the inner wiping portion and the outer wiping portion; The method for wiping a coating film according to claim 7 or claim 8, further comprising:

Images