Flow path member, liquid ejection head, liquid ejection device, and method for manufacturing flow path member

Abstract

To improve reliability of a flow channel member.SOLUTION: A flow channel member includes: a supply flow channel through which liquid flows; a filter disposed in the middle of the supply flow channel and through which liquid passes; a fixing member constituting part of the supply flow channel and to which the filter is fixed; and a first member constituting part of the supply flow channel and to which the fixing member is fixed. The fixing member is constituted of a thermoplastic resin. The first member is constituted of any one of a thermosetting resin, a metal and a ceramic.SELECTED DRAWING: Figure 9

Description

[Technical field]

[0001] The present invention relates to a flow path member, a liquid ejection head, a liquid ejection device, and a method for manufacturing the flow path member. [Background technology]

[0002] Conventionally, liquid ejection devices having a liquid ejection head that ejects liquid such as ink, such as a printer of an inkjet system, are known. For example, a recording head described in Patent Document 1 as a liquid ejection head has a head body that ejects ink droplets from nozzles, and a flow path unit that supplies ink to the head body. Here, the flow path unit has an upstream flow path member provided with an upstream flow path including a filter chamber in which a filter is disposed. In addition, the upstream flow path member is made of a thermoplastic resin, and the filter is fixed to the upstream flow path member by welding.

[0003] Patent Document 2 discloses a flow path member in which a member forming a flow path and a filter member are fixed to each other with an adhesive. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] JP 2016-49725 A

[0005] [Patent Document 2] JP 2014-193556 A Summary of the Invention [Problem to be solved by the invention]

[0006] In the flow path member described in Patent Document 2, the filter member is directly fixed to the member that constitutes the flow path with an adhesive, so there is a first problem in that the adhesive flows into the mesh of the filter member due to capillary force and clogs it.

[0007] On the other hand, in the recording head described in Patent Document 1, the filter is fixed to the upstream flow path member by welding without using an adhesive, so the first problem described above does not occur. Here, in order to further improve the reliability of the structure constituting the flow path, it is considered to use a thermosetting resin or the like, which is generally more rigid than a thermoplastic resin, as a material constituting the structure. However, in the recording head described in Patent Document 1, since the upstream flow path member needs to be made of a thermoplastic resin for the welding, a thermosetting resin or the like cannot be used as a material constituting the upstream flow path member. For this reason, the recording head described in Patent Document 1 has a second problem that it is not possible to further improve the reliability. From the above, it is desired to solve both the first problem and the second problem described above. [Means for solving the problem]

[0008] In order to solve the above problems, a flow path member according to a preferred embodiment of the present invention has a supply flow path through which a liquid flows, a filter disposed midway along the supply flow path and through which the liquid passes, a fixing member constituting part of the supply flow path and to which the filter is fixed, and a first member constituting part of the supply flow path and to which the fixing member is fixed, wherein the fixing member is made of a thermoplastic resin, and the first member is made of any one of a thermosetting resin, a metal, and a ceramic.

[0009] A flow path member according to another preferred embodiment of the present invention has a supply flow path through which a liquid flows, a filter that is disposed midway along the supply flow path and through which the liquid passes, a fixing member that constitutes part of the supply flow path and is made of a thermosetting resin, and a first member that constitutes part of the supply flow path and is made of any of a thermosetting resin, a metal, and a ceramic, wherein the fixing member is molded by insert molding using the filter as an insert item, and the first member and the fixing member are fixed to each other with an adhesive.

[0010] A liquid jet head according to a preferred aspect of the present invention includes the flow path member according to any one of the above aspects, and a nozzle that jets liquid from the supply flow path.

[0011] A liquid ejecting apparatus according to a preferred aspect of the present invention includes the liquid ejecting head according to the above aspect, and a liquid container that stores liquid to be supplied to the liquid ejecting head.

[0012] A preferred embodiment of the present invention provides a method for manufacturing a flow path member having a supply flow path through which a liquid flows, a filter disposed midway along the supply flow path and through which the liquid passes, a fixing member constituting part of the supply flow path and made of a thermoplastic resin, and a first member constituting part of the supply flow path and made of any one of a thermosetting resin, a metal, and a ceramic, wherein the filter and the fixing member are welded together, and then the fixing member and the first member are bonded together with an adhesive.

[0013] A preferred embodiment of the present invention provides a method for manufacturing a flow path member having a supply flow path through which a liquid flows, a filter disposed midway along the supply flow path and through which the liquid passes, a fixing member constituting part of the supply flow path and made of a thermoplastic resin, and a first member constituting part of the supply flow path and made of any one of a thermosetting resin, a metal, and a ceramic, wherein the fixing member is formed by insert molding using the filter as an insert item, and then the fixing member and the first member are bonded together with an adhesive. [Brief description of the drawings]

[0014] [Figure 1] 1 is a schematic diagram illustrating an example of the configuration of a liquid ejecting apparatus according to a first embodiment. [Diagram 2] FIG. 1 is a perspective view of a liquid jet module having a liquid jet head according to a first embodiment. [Diagram 3] 3 is an exploded perspective view of the liquid jet head shown in FIG. 2. [Figure 4] FIG. 2 is a plan view of a head body of the liquid jet head. [Diagram 5] FIG. [Figure 6]FIG. [Figure 7] 7 is a cross-sectional view taken along line AA in FIG. 6. [Figure 8] FIG. [Figure 9] FIG. 4 is an enlarged cross-sectional view illustrating a fixed state of a fixing member and a filter in the first embodiment. [Figure 10] 5A to 5C are diagrams illustrating a manufacturing process of the flow path member according to the first embodiment. [Figure 11] FIG. 11 is a perspective view of a liquid jet module including a liquid jet head according to a second embodiment. [Figure 12] 12 is an exploded perspective view of the liquid jet head shown in FIG. [Figure 13] 13 is a diagram showing a flow path of a flow path member according to a second embodiment. FIG. [Figure 14] FIG. 6 is a cross-sectional view of a flow path member according to a second embodiment. [Figure 15] FIG. 11 is a plan view of a fixing member in the second embodiment. [Figure 16] FIG. 11 is an enlarged cross-sectional view illustrating a fixed state of a fixing member and a filter in a second embodiment. [Figure 17] FIG. 11 is a cross-sectional view of a flow path member according to a third embodiment. [Figure 18] FIG. 11 is a cross-sectional view of a flow path member according to a fourth embodiment. [Figure 19] FIG. 13 is a cross-sectional view of a flow path member according to a fifth embodiment. [Figure 20] FIG. 13 is a cross-sectional view of a flow path member according to a sixth embodiment. [Figure 21] 13A to 13C are diagrams illustrating a manufacturing process of the flow path member according to the sixth embodiment. [Figure 22] 10 is a cross-sectional view of a flow path member according to Modification 1. FIG. [Diagram 23] 11 is a cross-sectional view of a flow path member according to Modification 2. FIG. [Figure 24] 11 is a cross-sectional view of a flow path member according to Modification 3. FIG. [Diagram 25] 13 is a cross-sectional view of a flow path member according to a fourth modified example. FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0015] Hereinafter, preferred embodiments of the present invention will be described with reference to the accompanying drawings. Note that the dimensions or scale of each part in the drawings may differ from the actual dimensions, and some parts are shown diagrammatically to facilitate understanding. Furthermore, the scope of the present invention is not limited to these embodiments unless otherwise specified in the following description to the effect that the present invention is limited thereto.

[0016] In the following description, the mutually intersecting X-axis, Y-axis, and Z-axis are used as appropriate. Furthermore, one direction along the X-axis is referred to as the X1 direction, and the direction opposite to the X1 direction is referred to as the X2 direction. Similarly, the opposite directions along the Y-axis are referred to as the Y1 direction and the Y2 direction. Furthermore, the opposite directions along the Z-axis are referred to as the Z1 direction and the Z2 direction.

[0017] Typically, the Z axis is a vertical axis, and the Z2 direction corresponds to the downward direction in the vertical direction. However, the Z axis does not have to be a vertical axis, and may be inclined with respect to the vertical axis. In addition, the X axis, the Y axis, and the Z axis are typically perpendicular to each other, but are not limited thereto, and may intersect at an angle within a range of 80° to 100°, for example.

[0018] 1. First embodiment 1-1.Liquid injection device 100

[0019] FIG. 1 is a schematic diagram showing an example of the configuration of a liquid ejection device 100 according to a first embodiment. The liquid ejection device 100 is an inkjet printing device that ejects ink, which is an example of a "liquid," as droplets onto a medium 101. The liquid ejection device 100 of this embodiment is a so-called line-type printing device in which a plurality of nozzles that eject ink are distributed across the entire range in the width direction of the medium 101. The medium 101 is typically printing paper. Note that the medium 101 is not limited to printing paper, and may be a printing target made of any material, such as a resin film or fabric.

[0020] 1, a liquid container 102 that stores ink is attached to the liquid ejecting device 100. Specific examples of the liquid container 102 include a cartridge that is detachable from the liquid ejecting device 100, a bag-shaped ink pack made of a flexible film, and an ink tank that can be refilled with ink. The type of ink stored in the liquid container 102 is arbitrary.

[0021] The liquid container 102 of this embodiment includes a first liquid container and a second liquid container, not shown. The liquid container 102 stores ink to be supplied to the liquid jet head 10 described later. The first liquid container stores a first ink. The second liquid container stores a second ink of a different type from the first ink. For example, the first ink and the second ink are inks of different colors. Note that the first ink and the second ink may be the same type of ink. The composition of the ink is not particularly limited, and may be, for example, any of a water-based ink in which a coloring material such as a dye or pigment is dissolved in a water-based solvent, an ultraviolet-curable ink, or a solvent-based ink.

[0022] Solvent-based ink is ink whose main component is an organic solvent, and is also called solvent ink or non-aqueous ink. Solvent-based ink is ink that contains one or more of glycol ethers, glycol ether esters, dibasic acid esters, ester-based solvents, hydrocarbon-based solvents, and alcohol-based solvents.

[0023] Examples of the glycol ether solvent include alkylene glycol monoethers and alkylene glycol diethers.

[0024] Examples of alkylene glycol monoethers include ethylene glycol monomethyl ether, ethylene glycol monoethyl ether, ethylene glycol monoisopropyl ether, ethylene glycol monobutyl ether, ethylene glycol monohexyl ether, ethylene glycol monophenyl ether, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, diethylene glycol monohexyl ether, diethylene glycol monobenzyl ether, triethylene glycol monomethyl ether, triethylene glycol monoethyl ether, triethylene glycol monobutyl ether, tetraethylene glycol monomethyl ether, tetraethylene glycol monoethyl ether, tetraethylene glycol monobutyl ether, pentaethylene glycol monomethyl ether, pentaethylene glycol monoethyl ether, pentaethylene glycol monobutyl ether, propylene glycol monomethyl ether, propylene glycol monoethyl ether, dipropylene glycol monomethyl ether, and dipropylene glycol monoethyl ether.

[0025] Examples of alkylene glycol diethers include ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol dibutyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol ethyl methyl ether, diethylene glycol dibutyl ether, diethylene glycol butyl methyl ether, triethylene glycol dimethyl ether, triethylene glycol diethyl ether, triethylene glycol dibutyl ether, triethylene glycol butyl methyl ether, tetraethylene glycol dimethyl ether, tetraethylene glycol diethyl ether, tetraethylene glycol dibutyl ether, propylene glycol dimethyl ether, propylene glycol diethyl ether, dipropylene glycol dimethyl ether, and dipropylene glycol diethyl ether.

[0026] Examples of glycol ether esters include ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, ethylene glycol monopropyl ether acetate, ethylene glycol monobutyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, propylene glycol monopropyl ether acetate, propylene glycol monobutyl ether acetate, dimethylene glycol monomethyl ether acetate, dimethylene glycol monoethyl ether acetate, dimethylene glycol monopropyl ether acetate, dimethylene glycol monobutyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, diethylene glycol monopropyl ether acetate, diethylene glycol monobutyl ether acetate, and dipropylene glycol monomethyl ether acetate. ether acetate, dipropylene glycol monoethyl ether acetate, dipropylene glycol monopropyl ether acetate, dipropylene glycol monobutyl ether acetate, trimethylene glycol monomethyl ether acetate, trimethylene glycol monoethyl ether acetate, trimethylene glycol monopropyl ether acetate, trimethylene glycol monobutyl ether acetate, triethylene glycol monomethyl ether acetate, triethylene glycol monoethyl ether acetate, triethylene glycol monopropyl ether acetate, triethylene glycol monobutyl ether acetate, tripropylene glycol monomethyl ether acetate, tripropylene glycol monoethyl ether acetate, tripropylene glycol monopropyl ether acetate, tripropylene glycol monobutyl ether acetate, 3-methoxybutyl acetate, and 3-methoxy-3-methyl-1-butyl acetate.

[0027] Examples of dibasic acid esters include monoesters and diesters of dicarboxylic acids (for example, aliphatic dicarboxylic acids such as glutaric acid, adipic acid, and succinic acid), etc. Specifically, dimethyl-2-methylglutarate and the like can be mentioned.

[0028] Examples of ester-based solvents include methyl acetate, ethyl acetate, n-propyl acetate, isopropyl acetate, n-butyl acetate, isobutyl acetate, isopentyl acetate, sec-butyl acetate, amyl acetate, methoxybutyl acetate, methyl lactate, ethyl lactate, butyl lactate, methyl caprylate, methyl laurate, isopropyl laurate, isopropyl myristate, isopropyl palmitate, isooctyl palmitate, isostearyl palmitate, methyl oleate, ethyl oleate, isopropyl oleate, butyl oleate, methyl linoleate, isobutyl linoleate, ethyl linoleate, isopropyl isostearate, methyl soybean oil, isobutyl soybean oil, and thiamine. Examples of the fatty acids and fatty acids that can be used include methyl tall oil, isobutyl tall oil, diisopropyl adipate, diisopropyl sebacate, diethyl sebacate, propylene glycol monocaprate, trimethylolpropane tris(2-ethylhexanoate), glyceryl tris(2-ethylhexanoate), ethylene glycol monomethyl ether acetate, ethylene glycol monoethyl ether acetate, propylene glycol monomethyl ether acetate, propylene glycol monoethyl ether acetate, diethylene glycol monomethyl ether acetate, diethylene glycol monoethyl ether acetate, and diethylene glycol monobutyl ether acetate.

[0029] Examples of the hydrocarbon solvent include aliphatic hydrocarbons (eg, paraffin, isoparaffin), alicyclic hydrocarbons (eg, cyclohexane, cyclooctane, cyclodecane, etc.), and aromatic hydrocarbons (eg, benzene, toluene, xylene, naphthalene, tetralin, etc.). As such a hydrocarbon solvent, commercially available products may be used, and examples thereof include aliphatic or alicyclic hydrocarbons such as IP Solvent 1016, IP Solvent 1620, IP Clean LX (all of the above are product names manufactured by Idemitsu Kosan Co., Ltd.), Isopar G, Isopar L, Isopar H, Isopar M, Exxsol D40, Exxsol D80, Exxsol D100, Exxsol D130, Exxsol D140 (all of the above are product names manufactured by Exxon Corporation), NS Clean 100, NS Clean 110, NS Clean 200, NS Clean 220 (all of the above are product names manufactured by JXTG Nippon Oil & Energy Corporation), Naphtesol 160, Naphtesol 200, Naphtesol 220 (all of the above are product names manufactured by JXTG Nippon Oil & Energy Corporation), and aromatic hydrocarbons such as Solvesso 200 (product name manufactured by Exxon Corporation).

[0030] Examples of alcohol-based solvents include methanol, ethanol, isopropanol, 1-propanol, 1-butanol, 2-butanol, 3-pentanol, 2-methyl-1-butanol, 2-methyl-2-butanol, isoamyl alcohol, 3-methyl-2-butanol, 3-methoxy-3-methyl-1-butanol, 4-methyl-2-pentanol, allyl alcohol, 1-hexanol, 1-heptanol, 2-heptanol, 3-heptanol, isomyristyl alcohol, isopalmityl alcohol, isostearyl alcohol, and oleyl alcohol.

[0031] Here, the ultraviolet curable ink is, for example, a UV ink containing a monomer or oligomer that undergoes a polymerization reaction and hardens when irradiated with ultraviolet light. Examples of the ultraviolet curable ink composition include inks containing any of (meth)acrylates, (meth)acrylamides, and N-vinyl compounds as a polymerizable compound.

[0032] Examples of monofunctional (meth)acrylates include hexyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, tert-octyl (meth)acrylate, isoamyl (meth)acrylate, decyl (meth)acrylate, isodecyl (meth)acrylate, stearyl (meth)acrylate, isostearyl (meth)acrylate, cyclohexyl (meth)acrylate, 4-n-butylcyclohexyl (meth)acrylate, bornyl (meth)acrylate, isobornyl (meth)acrylate, benz ... ethylhexyldiglycol (meth)acrylate, butoxyethyl (meth)acrylate, 2-chloroethyl (meth)acrylate, 4-bromobutyl (meth)acrylate, cyanoethyl (meth)acrylate, benzyl (meth)acrylate, butoxymethyl (meth)acrylate, 3-methoxybutyl (meth)acrylate, alkoxymethyl (meth)acrylate, alkoxyethyl (meth)acrylate, 2-(2-methoxyethoxy)ethyl (meth)acrylate, 2-(2-butoxyethoxy)ethyl (meth)acrylate, 2,2 ,2-Tetrafluoroethyl (meth)acrylate, 1H,1H,2H,2H-perfluorodecyl (meth)acrylate, 4-butylphenyl (meth)acrylate, phenyl (meth)acrylate, 2,4,5-tetramethylphenyl (meth)acrylate, 4-chlorophenyl (meth)acrylate, phenoxymethyl (meth)acrylate, phenoxyethyl (meth)acrylate, glycidyl (meth)acrylate, glycidyloxybutyl (meth)acrylate, glycidyloxyethyl (meth)acrylate, glycidyloxypropyl (Meth)acrylate, tetrahydrofurfuryl (meth)acrylate, hydroxyalkyl (meth)acrylate, 2-hydroxyethyl (meth)acrylate, 3-hydroxypropyl (meth)acrylate, 2-hydroxypropyl (meth)acrylate, 2-hydroxybutyl (meth)acrylate, 4-hydroxybutyl (meth)acrylate, dimethylaminoethyl (meth)acrylate, diethylaminoethyl (meth)acrylate, dimethylaminopropyl (meth)acrylate, diethylaminopropyl (meth)acrylate,Trimethoxysilylpropyl (meth)acrylate, dicyclopentenyl (meth)acrylate, dicyclopentenyloxyethyl (meth)acrylate, trimethoxysilylpropyl (meth)acrylate, trimethylsilylpropyl (meth)acrylate, polyethylene oxide monomethyl ether (meth)acrylate, oligoethylene oxide monomethyl ether (meth)acrylate, polyethylene oxide (meth)acrylate, oligoethylene oxide (meth)acrylate, oligoethylene oxide monoalkyl ether (meth)acrylate, polyethylene oxide monoalkyl ether (meth)acrylate, dipropylene glycol (meth)acrylate, polypropylene oxide monoalkyl ether (meth)acrylate p) acrylate, oligopropylene oxide monoalkyl ether (meth)acrylate, 2-methacryloyloxyethyl succinate, 2-methacryloyloxyhexahydrophthalic acid, 2-methacryloyloxyethyl-2-hydroxypropyl phthalate, butoxydiethylene glycol (meth)acrylate, trifluoroethyl (meth)acrylate, perfluorooctylethyl (meth)acrylate, 2-hydroxy-3-phenoxypropyl (meth)acrylate, EO modified phenol (meth)acrylate, EO modified cresol (meth)acrylate, EO modified nonylphenol (meth)acrylate, PO modified nonylphenol (meth)acrylate, EO modified 2-ethylhexyl (meth)acrylate.

[0033] Examples of polyfunctional (meth)acrylates include 1,6-hexanediol di(meth)acrylate, 1,10-decanediol di(meth)acrylate, neopentyl glycol di(meth)acrylate, dipropylene glycol di(meth)acrylate (DPGD(M)A), tripropylene glycol di(meth)acrylate (TPGD(M)A), 2,4-dimethyl-1,5-pentanediol di(meth)acrylate, butyl ethyl propanediol di(meth)acrylate, ethoxylated cyclohexanemethanol di(meth)acrylate, triethylene glycol di(meth)acrylate (TEGD(M)A), polyethylene glycol di(meth)acrylate, oligoethylene glycol di(meth)acrylate, and ethylene glycol di(meth)acrylate. and bifunctional (meth)acrylates such as bisphenol A di(meth)acrylate, 2-ethyl-2-butyl-butanediol di(meth)acrylate, hydroxypivalic acid neopentyl glycol di(meth)acrylate, dimethylol tricyclodecane di(meth)acrylate, EO modified bisphenol A di(meth)acrylate, bisphenol F polyethoxy di(meth)acrylate, polypropylene glycol di(meth)acrylate, oligopropylene glycol di(meth)acrylate, 1,4-butanediol di(meth)acrylate, 2-ethyl-2-butyl-propanediol di(meth)acrylate, 1,9-nonanediol di(meth)acrylate, propoxylated ethoxylated bisphenol A di(meth)acrylate, and tricyclodecane di(meth)acrylate.

[0034] Further, examples of polyfunctional (meth)acrylates include trimethylolpropane tri(meth)acrylate, trimethylolethane tri(meth)acrylate, alkylene oxide-modified tri(meth)acrylate of trimethylolpropane, pentaerythritol tri(meth)acrylate, dipentaerythritol tri(meth)acrylate, trimethylolpropane tri((meth)acryloyloxypropyl)ether, alkylene oxide-modified tri(meth)acrylate of isocyanuric acid, dipentaerythritol propionate tri(meth)acrylate, tri((meth)acryloyloxyethyl)isocyanurate, hydroxypivalaldehyde-modified dimethylolpropane tri(meth)acrylate, sorbitol tri(meth)acrylate, and propoxylated trimethylolpropane. tri(meth)acrylate, ethoxylated glycerin tri(meth)acrylate: trifunctional or more, pentaerythritol tetra(meth)acrylate, sorbitol tetra(meth)acrylate, ditrimethylolpropane tetra(meth)acrylate, propionic acid dipentaerythritol tetra(meth)acrylate, ethoxylated pentaerythritol tetra(meth)acrylate: tetrafunctional or more, sorbitol penta(meth)acrylate, dipentaerythritol penta(meth)acrylate: pentafunctional or more, dipentaerythritol hexa(meth)acrylate, sorbitol hexa(meth)acrylate, alkylene oxide modified hexa(meth)acrylate of phosphazene, caprolactone modified dipentaerythritol hexa(meth)acrylate: hexafunctional or more, and the like.

[0035] Examples of (meth)acrylamides include (meth)acrylamide, N-methyl(meth)acrylamide, N-ethyl(meth)acrylamide, N-propyl(meth)acrylamide, Nn-butyl(meth)acrylamide, Nt-butyl(meth)acrylamide, N-butoxymethyl(meth)acrylamide, N-isopropyl(meth)acrylamide, N-methylol(meth)acrylamide, N,N-dimethyl(meth)acrylamide, N,N-diethyl(meth)acrylamide, and (meth)acryloylmorpholine.

[0036] The N-vinyl compound has a structure in which a vinyl group is bonded to nitrogen (>N-CH=CH2). Specific examples of the N-vinyl compound include N-vinylformamide, N-vinylcarbazole, N-vinylindole, N-vinylpyrrole, N-vinylacetamide, N-vinylpyrrolidone, N-vinylcaprolactam, and derivatives thereof, and among these compounds, N-vinylcaprolactam is particularly preferred.

[0037] The liquid ejection device 100 has a control unit 20, a conveying mechanism 30, a liquid ejection module 40, and a circulation mechanism 50. The control unit 20 controls the operation of each element of the liquid ejection device 100. The control unit 20 includes a processing circuit such as a CPU (Central Processing Unit) or an FPGA (Field Programmable Gate Array), and a storage circuit such as a semiconductor memory. Various programs and various data are stored in the storage circuit. The processing circuit executes the programs and appropriately uses the data to realize various controls.

[0038] The transport mechanism 30 transports the medium 101 in a direction DM under the control of the control unit 20. The direction DM in this embodiment is the Y2 direction. In the example shown in FIG. 1, the transport mechanism 30 includes a long transport roller along the X axis and a motor that rotates the transport roller. Note that the transport mechanism 30 is not limited to a configuration using a transport roller, and may be configured to use, for example, a drum or an endless belt that transports the medium 101 while adsorbing it to its outer circumferential surface by electrostatic force or the like.

[0039] The liquid ejection module 40 ejects ink, supplied from a liquid container 102 via a circulation mechanism 50, from each of a plurality of nozzles in the Z2 direction onto the medium 101 under the control of the control unit 20. The liquid ejection module 40 is a line head having a plurality of liquid ejection heads 10 arranged so that a plurality of nozzles are distributed over the entire range of the medium 101 in the direction of the X axis. In other words, the plurality of liquid ejection heads 10 constitute a line head that is long in the direction extending along the X axis. An image is formed of ink on the surface of the medium 101 by ejecting ink from the plurality of liquid ejection heads 10 in parallel with the transport of the medium 101 by the transport mechanism 30. Note that the liquid ejection module 40 may be a line head that is long in the direction extending along the X axis and is composed of only a single liquid ejection head 10 arranged so that a plurality of nozzles are distributed over the entire range of the medium 101 in the direction extending along the X axis.

[0040] In the example shown in FIG. 1, the liquid container 102 is connected to the liquid ejection module 40 via a circulation mechanism 50. The circulation mechanism 50 is a mechanism that supplies ink to the liquid ejection module 40 and recovers ink discharged from the liquid ejection module 40 for resupply to the liquid ejection module 40. The circulation mechanism 50 has, for example, a sub-tank for storing ink, a supply flow path for supplying ink from the sub-tank to the liquid ejection module 40, a recovery flow path for recovering ink from the liquid ejection module to the sub-tank, and a pump for appropriately flowing the ink. These are provided for each of the first ink and the second ink described above. The above operation of the circulation mechanism 50 can suppress an increase in the viscosity of the ink and reduce the retention of air bubbles in the ink.

[0041] The liquid ejection device 100 may have a maintenance mechanism used for maintenance operations of the liquid ejection module 40. The maintenance operations include, for example, a flushing operation and a cleaning operation. The flushing operation is an operation in which ink that does not directly contribute to image formation is forcibly ejected from a plurality of nozzles. The cleaning operation is an operation in which ink inside the liquid ejection module 40 is forcibly discharged from the plurality of nozzles by applying pressure from the upstream side of the liquid ejection module 40 or suctioning from the downstream side. The maintenance mechanism has a flushing box that receives ink ejected from each nozzle N by the flushing operation, and a cap that seals the plurality of nozzles N when the cleaning operation is performed.

[0042] As described above, the liquid ejection device 100 includes the liquid ejection head 10, a liquid container 102 that stores ink to be supplied to the liquid ejection head 10, and a transport mechanism 30 that transports the medium 101 that receives the ink from the liquid ejection head 10.

[0043] 1-2. Liquid injection module 40

[0044] FIG. 2 is a perspective view of a liquid jet module 40 having a liquid jet head 10 of the first embodiment. As shown in FIG. 2, the liquid jet module 40 has a support 41 and a plurality of liquid jet heads 10. The support 41 is a member that supports the plurality of liquid jet heads 10. In the example shown in FIG. 2, the support 41 is a plate-like member made of metal or the like, and is provided with mounting holes 41a for mounting the plurality of liquid jet heads 10. The plurality of liquid jet heads 10 are inserted into the mounting holes 41a in a state of being aligned in a direction along the X-axis, and each liquid jet head 10 is fixed to the support 41 by screwing or the like. In FIG. 2, two liquid jet heads 10 are representatively illustrated. The number of liquid jet heads 10 in the liquid jet module 40 is arbitrary. In addition, the shape of the support 41 is not limited to the example shown in FIG. 2, and is arbitrary.

[0045] 1-3. Liquid jet head 10 3 is an exploded perspective view of the liquid jet head 10 shown in FIG. 3. As shown in FIG. 3, the liquid jet head 10 has a flow path structure 11, a wiring board 12, a holder 13, a plurality of head bodies 14_1, 14_2, 14_3, 14_4, 14_5, and 14_6, a fixing plate 15, and a base 16. These are arranged in the Z2 direction in the order of the base 16, the flow path structure 11, the wiring board 12, the holder 13, the plurality of head bodies 14_1, 14_2, 14_3, 14_4, 14_5, and 14_6, and the fixing plate 15. Each part of the liquid jet head 10 will be described in order below. Note that, hereinafter, each of the head bodies 14_1, 14_2, 14_3, 14_4, 14_5, and 14_6 may be referred to as the head body 14.

[0046] The flow path structure 11 is a structure in which a flow path for flowing ink between the circulation mechanism 50 and the plurality of head bodies 14 is provided. As shown in FIG. 3, the flow path structure 11 has a flow path member 1 and connection pipes 11a, 11b, 11c, and 11d. Although not shown in FIG. 3, the flow path member 1 is provided with a supply flow path for supplying the first ink to the plurality of head bodies 14, a supply flow path for supplying the second ink to the plurality of head bodies 14, a discharge flow path for discharging the first ink from the plurality of head bodies 14, and a discharge flow path for discharging the second ink from the plurality of head bodies 14. In addition, a filter for capturing foreign matter and the like is provided midway through each supply flow path. The internal configuration of the flow path member 1 will be described in detail later.

[0047] The flow path member 1 has layers 21, 22, and 23, which are laminated in this order in the Z2 direction. By providing grooves or holes or the like appropriately in these layers, flow paths such as a supply flow path and a discharge flow path are formed. Each of the layers 21, 22, and 23 is made of, for example, a resin material and formed by injection molding. The layers 21, 22, and 23 are bonded to each other, for example, by an adhesive. The thicknesses of the layers 21, 22, and 23 along the Z axis may be the same or different from each other.

[0048] The flow path member 1 is in the form of a plate extending in a direction perpendicular to the Z axis. In the example shown in Fig. 3, the flow path member 1 is provided with a hole 1a into which a connector 12c (described later) is inserted. Connection pipes 11a, 11b, 11c, and 11d protrude from the surface of the flow path member 1 facing the Z1 direction.

[0049] The connecting pipe 11a is a pipe that constitutes a flow path for supplying a first ink to the flow path member 1. The connecting pipe 11b is a pipe that constitutes a flow path for supplying a second ink to the flow path member 1. The connecting pipe 11c is a pipe that constitutes a flow path for discharging the first ink from the flow path member 1. The connecting pipe 11d is a pipe that constitutes a flow path for discharging the second ink from the flow path member 1.

[0050] The wiring board 12 is a mounting component for electrically connecting the head main bodies 14 and the collective substrate 16b described later. The wiring board 12 is, for example, a rigid wiring board. The wiring board 12 is disposed between the flow path structure 11 and the holder 13, and a connector 12c is provided on the surface of the wiring board 12 facing the flow path structure 11. The connector 12c is a connection part connected to the collective substrate 16b described later. The wiring board 12 is also provided with a plurality of holes 12a and a plurality of openings 12b. Each hole 12a is a hole for allowing the connection between the flow path structure 11 and the holder 13. Each opening 12b is a hole through which a wiring member 14a that connects the head main body 14 and the wiring board 12 is passed. The wiring member 14a is connected to the surface of the wiring board 12 facing the Z1 direction. The wiring member 14a is a member including wiring electrically connected to the driving element Ea or Eb described later, and is, for example, an FPC (Flexible Printed Circuits) or a COF (Chip On Film).

[0051] The holder 13 is a structure that houses and supports a plurality of head bodies 14. The holder 13 is made of, for example, a resin material or a metal material. The holder 13 is in the form of a plate that extends in a direction perpendicular to the Z axis. The holder 13 is provided with a plurality of ink holes 13a and a plurality of wiring holes 13b. Each ink hole 13a is an opening on the flow path on the flow path structure 11 side in a flow path that allows ink to flow between the head body 14 and the flow path structure 11. Each wiring hole 13b is a hole through which a wiring member 14a that connects the head body 14 and the wiring board 12 is passed. Here, the holder 13 has, inside thereof (not shown), a supply flow path that supplies a first ink to the head body 14, a supply flow path that supplies a second ink to the head body 14, a circulation flow path for causing the first ink to flow from the head body 14 to the discharge flow path CM of the flow path structure 11, and a circulation flow path for causing the second ink to flow from the head body 14 to the discharge flow path CM of the flow path structure 11. Although not shown, branch flow paths are provided inside the holder 13 for distributing or collecting ink between each ink hole 13a and the multiple head bodies 14. Although not shown, a surface of the holder 13 facing the Z2 direction is provided with a plurality of recesses for accommodating the multiple head bodies 14.

[0052] Each head body 14 ejects ink. Specifically, although not shown in Fig. 3, each head body 14 has a plurality of nozzles that eject a first ink and a plurality of nozzles that eject a second ink. These nozzles are provided on a nozzle surface FN, which is the surface of each head body 14 that faces the Z2 direction. The configuration of the head body 14 will be described later.

[0053] The fixing plate 15 is a plate member for fixing the multiple head bodies 14 to the holder 13. Specifically, the fixing plate 15 is arranged in a state in which the multiple head bodies 14 are sandwiched between the fixing plate 15 and the holder 13, and is fixed to the holder 13 by adhesive. The fixing plate 15 is made of, for example, a metal material. The fixing plate 15 is provided with multiple openings 15a for exposing the nozzles of the multiple head bodies 14. In the example shown in FIG. 3, the multiple openings 15a are provided individually for each head body 14. Note that the openings 15a may be shared by two or more head bodies 14.

[0054] The base 16 is a member for fixing the flow path structure 11, the wiring board 12, the holder 13, the plurality of head bodies 14, and the fixed plate 15 to the aforementioned support 41. The base 16 has a body 16a, an assembly board 16b, and a cover 16c.

[0055] The main body 16a is fixed to the holder 13 by screwing or the like, thereby holding the flow path structure 11 and the wiring board 12 disposed between the base 16 and the holder 13. The main body 16a is made of, for example, a resin material or the like. The main body 16a has a plate-like portion facing the above-mentioned flow path member 1, and the plate-like portion is provided with a plurality of holes 16d into which the above-mentioned connection pipes 11a, 11b, 11c, and 11d are inserted. The main body 16a also has a portion extending from the plate-like portion in the Z2 direction, and a flange 16e for fixing to the above-mentioned support body 41 is provided at the tip of the portion.

[0056] The collective substrate 16b is a mounting component for electrically connecting the control unit 20 and the wiring substrate 12 described above. The collective substrate 16b is, for example, a rigid wiring substrate. The cover 16c is a plate-like member for protecting the collective substrate 16b and for fixing the collective substrate 16b to the main body 16a. The cover 16c is made of, for example, a resin material, and is fixed to the main body 16a by screws or the like.

[0057] 1-4. Head body 14 Fig. 4 is a plan view of the head body 14 of the liquid jet head 10. Fig. 4 shows a schematic diagram of the internal structure of the head body 14 as viewed in the Z1 direction. As shown in Fig. 4, the head body 14 has a liquid jetting unit Qa and a liquid jetting unit Qb. The liquid jetting unit Qa has a nozzle row La consisting of a plurality of nozzles N that jet the first ink supplied from the circulation mechanism 50 described above. The liquid jetting unit Qb has a nozzle row Lb consisting of a plurality of nozzles N that jet the second ink supplied from the circulation mechanism 50. The plurality of nozzles N in each of the nozzle row La and the nozzle row Lb are arranged in the direction DN.

[0058] The liquid ejection unit Qa has a liquid storage chamber Ra, a plurality of pressure chambers Ca, and a plurality of drive elements Ea. The liquid storage chamber Ra is a common liquid chamber that is continuous across the plurality of nozzles N of the nozzle row La. Each of the pressure chambers Ca and the drive elements Ea is provided for each nozzle N of the nozzle row La. The pressure chamber Ca is a space that communicates with the nozzle N. Each of the plurality of pressure chambers Ca is filled with a first ink supplied from the liquid storage chamber Ra. The drive elements Ea vary the pressure of the first ink in the pressure chamber Ca. The drive elements Ea are, for example, a piezoelectric element that changes the volume of the pressure chamber Ca by deforming the wall surface of the pressure chamber Ca, or a heating element that generates air bubbles in the pressure chamber Ca by heating the first ink in the pressure chamber Ca. The drive elements Ea vary the pressure of the first ink in the pressure chamber Ca, causing the first ink in the pressure chamber Ca to be ejected from the nozzle N.

[0059] Like the liquid ejection unit Qa, the liquid ejection unit Qb has a liquid storage chamber Rb, multiple pressure chambers Cb, and multiple drive elements Eb. The liquid storage chamber Rb is a common liquid chamber that is continuous across the multiple nozzles N of the nozzle row Lb. Each of the pressure chambers Cb and the drive elements Eb is provided for each nozzle N of the nozzle row Lb. Each of the multiple pressure chambers Cb is filled with the second ink supplied from the liquid storage chamber Rb. The drive elements Eb are, for example, the above-mentioned piezoelectric elements or heat generating elements. The drive elements Eb vary the pressure of the second ink in the pressure chambers Cb, causing the second ink in the pressure chambers Cb to be ejected from the nozzles N.

[0060] 4, the head main body 14 is provided with an inlet Ra_in, an outlet Ra_out, an inlet Rb_in, and an outlet Rb_out. The inlet Ra_in and the outlet Ra_out each communicate with the liquid storage chamber Ra. The inlet Rb_in and the outlet Rb_out each communicate with the liquid storage chamber Rb.

[0061] In the head main body 14 described above, the first ink that is not ejected from each nozzle N of the nozzle row La and is stored in the liquid storage chamber Ra circulates via the discharge port Ra_out, the circulation flow path for the first ink in the holder 13, the discharge flow path for the first ink in the flow path structure 11, the sub-tank for the first ink in the circulation mechanism 50, the supply flow path for the first ink in the flow path structure 11, the supply flow path for the first ink in the holder 13, the inlet port Ra_in, and the liquid storage chamber Ra in this order. Similarly, the second ink that is not ejected from each nozzle N of the nozzle row Lb and is stored in the liquid storage chamber Rb circulates via the discharge port Rb_out, the circulation flow path for the second ink in the holder 13, the discharge flow path for the second ink in the flow path structure 11, the sub-tank for the second ink in the circulation mechanism 50, the supply flow path for the second ink in the flow path structure 11, the supply flow path for the second ink in the holder 13, the inlet port Rb_in, and the liquid storage chamber Rb in this order.

[0062] FIG. 5 is a plan view of the holder 13. As shown in FIG. 5, the holder 13 holds six head bodies 14_1 to 14_6. These head bodies are arranged in the X2 direction in the order of head bodies 14_1, 14_4, 14_2, 14_5, 14_3, and 14_6. Here, the head bodies 14_1 to 14_3 are arranged at positions shifted in the Y1 direction with respect to the head bodies 14_4 to 14_6. However, the head bodies 14_1 to 14_6 have portions that overlap with each other when viewed in the X1 direction or the X2 direction. In addition, the head bodies 14_1 to 14_6 are arranged such that the directions DN in which the nozzle rows La and Lb extend are parallel to each other. However, each of the head bodies 14_1 to 14_6 is arranged such that the direction DN is inclined with respect to the direction DM that is the transport direction of the medium 101.

[0063] As described above, the liquid jet head 10 has the flow path member 1 and the nozzles N that jet ink from the supply flow path.

[0064] 1-5. Flow path member 1 Fig. 6 is a plan view of the flow path structure 11. In Fig. 6, an example of the structure inside the flow path member 1 as viewed in the Z2 direction is indicated by dashed lines. As shown in Fig. 6, two supply flow paths CC, two discharge flow paths CM, and two filter chambers RF are provided inside the flow path member 1.

[0065] Of the two supply channels CC, one supply channel CC is a channel for supplying ink from the connecting tube 11a to the liquid storage chamber Ra of each head body 14, and the other supply channel CC is a channel for supplying ink from the connecting tube 11b to the liquid storage chamber Rb of each head body 14. Each supply channel CC is connected to an outlet CE that discharges ink toward the head body 14. In addition, the supply channel CC communicates with the internal space of the connecting tube 11a or 11b via the filter chamber RF. The filter chamber RF is a space in which a filter 25 described later is installed, and communicates with the supply channel CC via the first channel C1 and the second channel C2. Note that one of the first channel C1 and the second channel C2 may be omitted. In this case, it is preferable to place the other of the first channel C1 and the second channel C2 on the central axis of the filter chamber RF.

[0066] Of the two discharge flow paths CM, one discharge flow path CM is a flow path for discharging ink from the liquid storage chamber Ra of each head body 14 to the connecting pipe 11c, and the other discharge flow path CM is a flow path for discharging ink from the liquid storage chamber Rb of each head body 14 to the connecting pipe 11d. Each discharge flow path CM is connected to an inlet CI through which ink is supplied from the head body 14.

[0067] Fig. 7 is a cross-sectional view taken along line AA in Fig. 6. Fig. 7 illustrates a configuration of the flow path member 1 that corresponds to the connecting pipe 11a. For ease of viewing, Fig. 7 omits the illustration of adhesives such as adhesives B1, B2, and Ba shown in Fig. 9, which will be described later.

[0068] The following will explain the configuration corresponding to the connecting pipe 11a as a representative example. The configuration corresponding to the connecting pipe 11b is similar to the configuration corresponding to the connecting pipe 11a. Moreover, the configurations corresponding to the connecting pipes 11c and 11d are similar to the configuration corresponding to the connecting pipe 11a, except that the configuration related to the filter chamber RF is omitted and the shapes are different.

[0069] As shown in Fig. 7, in the flow path member 1, layers 21, 22, and 23 are laminated in this order in the Z2 direction. Each of the layers 21, 22, and 23 is made of a thermosetting resin, a metal, or a ceramic. Therefore, the liquid resistance and rigidity of the layers 21, 22, and 23 can be improved compared to when the layers 21, 22, and 23 are made of a thermoplastic resin. Here, the constituent materials of the layers 21, 22, and 23 may be the same as or different from each other. For example, one of the layers 21, 22, and 23 may be made of a thermosetting resin, and the other layers may be made of a metal or a ceramic.

[0070] When the layers 21, 22, or 23 are made of a thermosetting resin, the thermosetting resin is not particularly limited, and examples thereof include phenolic resin, urea resin, melamine resin, epoxy resin, alkyd resin, unsaturated polyester resin, epoxy resin, diallyl phthalate resin, etc. These may be used alone or in combination of two or more kinds in the form of a copolymer or blend, etc.

[0071] The thermosetting resin may contain either or both of an inorganic filler and an inorganic fiber base material. In particular, when each of the layers 21 and 22 surrounding the fixing member 24 contains either or both of an inorganic filler and an inorganic fiber base material, the gas barrier properties of the filter chamber RF can be improved. This makes it possible to suppress the growth of air bubbles in the filter chamber RF, thereby reducing the possibility of clogging the filter 25. In this case, the viscosity of the ink can also be suppressed. Furthermore, by using such an inorganic filler or inorganic fiber base material, the rigidity of the layers 21, 22, or 23 can also be improved compared to a configuration using only a thermosetting resin.

[0072] Examples of the inorganic filler include metals such as aluminum; silicates such as clay, talc, mica, kaolin, zeolite, calcium silicate, montmorillonite, and bentonite; oxides such as silica, diatomaceous earth, aluminum oxide, zirconium oxide, barium ferrite, barium oxide, and pumice; hydroxides such as aluminum hydroxide, magnesium hydroxide, and basic magnesium carbonate; carbonates such as calcium carbonate, magnesium carbonate, dolomite, and dawsonite; sulfates or sulfites such as calcium sulfate, barium sulfate, and calcium sulfite; and fibers made of inorganic materials such as glass fibers. The average particle size of the inorganic filler is not particularly limited, but is preferably 0.1 μm or more and 100 μm or less from the viewpoint of enhancing the gas barrier properties of layer 21, layer 22, or layer 23. The content of the inorganic filler in the material constituting layer 21, layer 22, or layer 23 is preferably 20 vol% or more and 50 vol% or less. In this case, it is possible to suitably improve the gas barrier properties of layer 21, layer 22, or layer 23 while ensuring the necessary mechanical strength, etc., of layer 21, layer 22, or layer 23. The average particle size of the inorganic filler is measured by a known method depending on the shape of the filler.

[0073] Examples of the inorganic fiber substrate include glass fiber substrates such as woven glass fabric and nonwoven glass fabric, woven or nonwoven fabrics such as metal fibers and mineral fibers, or mats thereof. The content of the inorganic fiber substrate in the material constituting layer 21, layer 22, or layer 23 is preferably 20 vol% or more and 50 vol% or less. In this case, the gas barrier properties of layer 21, layer 22, or layer 23 can be suitably improved while ensuring the necessary mechanical strength, etc. of layer 21, layer 22, or layer 23.

[0074] In addition, when layer 21, layer 22, or layer 23 contains both an inorganic filler and an inorganic fiber base material, it is preferable that the combined content of the inorganic filler and the inorganic fiber base material in the material constituting layer 21, layer 22, or layer 23 is 20 vol% or more and 50 vol% or less.

[0075] The thermosetting resin may also contain a colorant such as a dye or a pigment. By using a colorant, the light transmittance of the thermosetting resin decreases, so that even if the ink has photocurability or low light resistance, deterioration of the ink can be reduced.

[0076] When the layers 21, 22, or 23 are made of a metal, the metal may be, but is not limited to, aluminum, aluminum alloys, titanium, titanium alloys, iron, stainless steel, or the like. One of these may be used alone, or two or more may be combined in a laminated form or the like. When the layers 21, 22, or 23 are made of a ceramic, the ceramic may be, but is not limited to, oxide ceramics such as alumina, silica, titania, zirconia, or nitride ceramics such as silicon nitride, aluminum nitride, or titanium nitride. One of these may be used alone, or two or more may be combined in a laminated form or the like.

[0077] The layer 21 is provided with a concave surface 21a, an inlet 21b, and a groove 21c. The concave surface 21a is provided on the surface of the layer 21 facing the Z2 direction, and constitutes a part of the wall surface of the filter chamber RF. In the example shown in FIG. 7, the concave surface 21a has a shape that is continuously deepened toward the inlet 21b. The inlet 21b is a through hole that opens to the concave surface 21a and communicates with the internal space of the connecting pipe 11a. In the example shown in FIG. 7, the connecting pipe 11a is integrally formed with the layer 21. Therefore, the connecting pipe 11a is made of a resin material like the layer 21. The groove 21c is provided along the outer periphery of the concave surface 21a on the surface of the layer 21 facing the Z2 direction, and constitutes a space that accommodates a part of the fixing member 24 described later. The groove 21c can also function as an escape portion for the adhesive.

[0078] The connecting pipe 11a may be formed separately from the layer 21. In this case, the connecting pipe 11a may be formed of a metal material or the like, and is fixed to the layer 21 by an adhesive or the like. The groove 21c may be provided as necessary, and may be omitted.

[0079] The layer 22 is provided with a recess 22a, a groove 22b, a hole 22c, and a hole 22d. The recess 22a is provided on a surface of the layer 22 facing the Z1 direction, and forms a space for accommodating a part of the fixing member 24 described later. The groove 22b is provided on a surface of the layer 22 facing the Z2 direction, and forms a part of the flow path C3 in the supply flow path CC. In the example shown in Figs. 6 and 7, the flow path C3 extends along the Y axis and has a shape having a part whose area in the XZ plane narrows in the Y2 direction. Therefore, the groove 22b has a shape extending along the Y axis. The hole 22c and the hole 22d open to the recess 22a and the groove 22b, respectively, and are holes penetrating the layer 22. In the example shown in Fig. 7, the hole 22c is connected to the end of the groove 22b in the Y2 direction. The hole 22d is connected to the groove 22b at a position in the Y1 direction relative to the hole 22c.

[0080] A groove 23a is provided in the layer 23. The groove 23a is provided on a surface of the layer 23 facing the Z1 direction, and constitutes a part of the flow path C3. In the example shown in Fig. 7, the groove 23a has a shape extending along the Y axis. Note that, in the example shown in Fig. 7, the supply flow path CC is constituted by the groove 22b of the layer 22 and the groove 23a of the layer 23, but the flow path C3 may be constituted by one of the groove 22b and the groove 23a.

[0081] 7, in addition to the above layers 21, 22, and 23, the flow path member 1 has a fixing member 24 and a filter 25 interposed between the layer 21 and the layer 22. Note that hereinafter, a view in the direction in which the layer 22 and the fixing member 24 overlap will be referred to as a "planar view."

[0082] Fig. 8 is a plan view of the fixing member 24. Fig. 9 is an enlarged cross-sectional view for explaining the fixed state of the fixing member 24 and the filter 25 in the first embodiment. Hereinafter, the fixing member 24 and the filter 25 will be explained with reference to Figs. 7 to 9.

[0083] 7, fixing member 24 is a substantially plate-shaped member that fixes filter 25 to at least one of layer 21 and layer 22 and constitutes a part of the wall surface of filter chamber RF. In the example shown in Fig. 7, fixing member 24 is installed in the aforementioned recess 22a.

[0084] As shown in FIG. 9, the fixing member 24 is fixed to the layer 22 by an adhesive B1, which is an example of a "first adhesive", and is fixed to the layer 21 by an adhesive B2, which is an example of a "second adhesive". The adhesives B1 and B2 are not particularly limited as long as they have resistance to ink and can bond the fixing member 24 to the layer 21 or 22. Various adhesives can be used, such as epoxy adhesives, silicone adhesives, and P-aminophenol adhesives, and among them, epoxy adhesives are preferably used from the viewpoint of excellent liquid resistance. In addition, various light-curing adhesives such as urethane adhesives may be used as the adhesives B1 and B2. In this case, either a visible light-curing type or an ultraviolet-curing type may be used, but an ultraviolet-curing type is preferably used from the viewpoint of preventing adverse effects due to heat during curing.

[0085] The adhesives B1 and B2 may be the same as or different from each other. The adhesives B1 or B2 may be the same as or different from the adhesive Ba that bonds the layer 21 and the layer 22. Two or more of the adhesives B1, B2, and Ba may be integrated. One of the adhesives B1 and B2 may be omitted. However, by using both the adhesives B1 and B2, the fixing member 24 can be firmly fixed to the laminate consisting of the layers 21 to 23, and an unintended gap between the laminate and the fixing member 24 can be reduced.

[0086] In this way, by fixing filter 25 to at least one of layers 21 and 22 via fixing member 24, the range of materials from which layers 21 and 22 can be selected is wider and unintentional adhesion of adhesive B1 or B2 to filter 25 can be reduced compared to a configuration in which filter 25 is directly fixed to at least one of layers 21 and 22.

[0087] The fixing member 24 is made of a resin material and is formed by, for example, injection molding. The material of the fixing member 24 may be the same as or different from the material of the layer 21 or layer 22.

[0088] Here, the resin material constituting the fixing member 24 may be a thermosetting resin or a thermoplastic resin. However, whether the fixing member 24 is made of a thermosetting resin or a thermoplastic resin is appropriately determined depending on the shape of the fixing member 24 and the like. In addition, the resin material constituting the fixing member 24 may contain, for example, an inorganic fiber base material such as glass fiber, or an inorganic filler such as silica powder. By using such an inorganic fiber base material or inorganic filler, the rigidity of the fixing member 24 can be improved compared to a configuration using only resin.

[0089] However, it is preferable that fixing member 24 does not contain an inorganic filler or an inorganic fiber base material, or contains an inorganic filler or an inorganic fiber base material at a content lower than those of each of aforementioned layers 21 and 22. By lowering the content of inorganic filler and inorganic fiber base material in fixing member 24 in this manner, when fixing member 24 is made of a thermoplastic resin, it is possible to make it difficult for burrs, which cause foreign matter, to occur when fixing member 24 and filter 25 are welded together.

[0090] When the fixing member 24 is made of a thermosetting resin, the rigidity and liquid resistance of the fixing member 24 can be increased compared to when the fixing member 24 is made of a thermoplastic resin.

[0091] The thermosetting resin is not particularly limited, but examples thereof include phenol resins, urea resins, melamine resins, epoxy resins, alkyd resins, unsaturated polyester resins, epoxy resins, diallyl phthalate resins, etc., as in the above-described layers 21, 22, and 23. These may be used alone or in combination of two or more kinds in the form of a copolymer or blend, etc.

[0092] When the fixing member 24 is made of a thermoplastic resin, the filter 25 can be fixed to the fixing member 24 by welding. Therefore, making the fixing member 24 out of a thermoplastic resin is useful when it is difficult to form the fixing member 24 by insert molding with the filter 25 as an insert item due to the shape of the fixing member 24 or the like. In this embodiment, since the filter 25 is disposed on the outer surface of the fixing member 24, it is difficult to form the fixing member 24 by insert molding with the filter 25 as an insert item. Therefore, in this embodiment, it is preferable to make the fixing member 24 out of a thermoplastic resin.

[0093] The thermoplastic resin is not particularly limited, but examples thereof include polyphenylene ether resin (PPE), modified polyphenylene ether resin (m-PPE), polyethylene resin (PE), polystyrene resin (PS), polyamide resin (PA), polyphenylene sulfide (PPS), polypropylene (PP), liquid crystal polymer (LCP), acrylonitrile butadiene styrene resin (ABS resin), vinyl chloride-vinyl acetate copolymer resin, polyvinyl chloride resin, etc. These may be used alone or in combination of two or more types in the form of a copolymer or blend. Among them, polyolefin thermoplastic resins such as polypropylene are preferably used as the thermoplastic resin because they can be injection molded and have excellent chemical resistance.

[0094] The fixed member 24 is provided with a recess 24a, a frame portion 24b, a first outlet 24c, and a second outlet 24d.

[0095] The recess 24a is provided on the surface of the fixing member facing the Z1 direction, and constitutes a part of the wall surface of the filter chamber RF. In the example shown in FIG. 7, the recess 24a has a shape that is continuously deepened toward each of the first discharge port 24c and the second discharge port 24d. The frame portion 24b is an annular wall portion along the outer circumferential edge of the recess 24a, and constitutes the side wall of the filter chamber RF. More specifically, a part of the inner circumferential surface of the frame portion 24b constitutes the side wall 24i of the downstream chamber R2. The frame portion 24b also has a mounting surface 24p on which the filter 25 is mounted, a convex portion 24r protruding in the Z1 direction from the mounting surface 24p, and a cutout portion 24q. The mounting surface 24p is a surface of the frame portion 24b facing the Z1 direction, and has an annular shape surrounding the recess 24a in a plan view as shown in FIG. 8. 8, the protrusion 24r has an annular shape surrounding the mounting surface 24p in a plan view. The cutout portion 24q is recessed in the Z1 direction with respect to the surface of the frame portion 24b facing the Z2 direction, and is a stepped and annular cutout disposed on the outermost periphery of the frame portion 24b as viewed in the Z1 direction.

[0096] In the example shown in FIG. 7, the convex portion 24r of the frame portion 24b is inserted into the groove 21c. This insertion positions the fixing member 24 with respect to the layer 21. The convex portion 24r of the frame portion 24b abuts against the bottom of the groove 21c, thereby functioning as a wall portion that prevents the adhesive B2 and the adhesive Ba from adhering to the filter 25. A gap is formed between the outer peripheral surface of the frame portion 24b and the recessed portion 22a. This gap can function as an escape portion for the adhesive B1 applied between the cutout portion 24q and the bottom surface of the recessed portion 22a, the adhesive B2 applied between the outer peripheral surface of the convex portion 24r and the groove 21c, and the adhesive Ba. Each of the first outlet 24c and the second outlet 24d is a hole that opens into the recessed portion 24a and penetrates the fixing member 24. The first outlet 24c is connected to the hole 22c described above, and together with the hole 22c, forms the first flow path C1. The second outlet 24d is connected to the aforementioned hole 22d, and constitutes the second flow path C2 together with the hole 22d.

[0097] In the example shown in Fig. 9, the layer 21 and the layer 22 are bonded by the adhesive Ba, but the adhesive Ba may be partially missing in the circumferential direction or may be omitted. In this case, instead of the bonding surface between the layer 21 and the layer 22, a meandering gap like a labyrinth seal may be provided between the layer 21 and the layer 22. When such a gap is provided, the bonding area can be reduced, and as a result, costs can be reduced. Even if such a gap is provided, the fixing member 24 is covered with the layers 21 and 22, which have high gas barrier properties, so that problems such as ink thickening or bubble growth are unlikely to occur.

[0098] 8, the fixing member 24 is provided with a flange 24g that protrudes from the frame portion 24b in a direction away from the center line LC. The flange 24g is provided with a hole 24h for positioning with respect to the layer 22. Although not shown, a protrusion that is inserted into the hole 24h is provided on the surface of the layer 22 facing the Z1 direction. The center line LC is a straight line that passes through the center PC and is parallel to the Z axis. The center PC is the geometric center of the downstream chamber R2 in a plan view. The flange 24g may be provided as necessary, and may be omitted.

[0099] The filter 25 is a plate- or sheet-shaped member that allows the ink to pass through while capturing foreign matter mixed into the ink. The filter 25 is made of, for example, metal fibers such as twill weave or plain weave. The filter 25 is not limited to a configuration using metal fibers, and may be made of, for example, resin fibers such as nonwoven fabric.

[0100] The filter 25 is fixed to the frame 24b of the fixing member 24 described above, and is provided in an area that encompasses the entire area of ​​the recess 24a, as shown by the two-dot chain line in Fig. 8. Therefore, as shown in Fig. 7, the filter chamber RF is divided into an upstream chamber R1 and a downstream chamber R2 by the filter 25. The upstream chamber R1 is located in the Z1 direction from the filter 25, and is a space with the recess 21a as part of its wall surface. The downstream chamber R2 is located in the Z2 direction from the filter 25, and is a space with the side wall 24i and the recess 24a as part of its wall surface.

[0101] The filter 25 is fixed to the fixing member 24 without using an adhesive. Therefore, the adhesive is prevented from adhering to the filter 25. Specifically, when the fixing member 24 is formed by insert molding with the filter 25 as an insert product, the filter 25 is fixed integrally to the fixing member 24. In this case, the fixing member 24 may be made of a thermosetting resin or a thermoplastic resin. When the fixing member 24 is made of a thermoplastic resin, the filter 25 may be fixed to the fixing member 24 by welding. In this embodiment, since it is difficult to form the fixing member 24 by insert molding with the filter 25 as an insert product as described above, it is preferable that the fixing member 24 is made of a thermoplastic resin and the filter 25 is fixed to the fixing member 24 by welding.

[0102] As described above, the flow path member 1 has the supply flow path CC, the filter 25, the fixing member 24, and the layer 22 which is an example of a "first member." Here, as described above, ink which is an example of a "liquid" flows through the supply flow path CC. The filter 25 is disposed midway through the supply flow path CC, and the ink passes through the filter 25. The fixing member 24 constitutes a part of the supply flow path CC, and the filter 25 is fixed to the fixing member 24. The layer 22 constitutes a part of the supply flow path CC, and the fixing member 24 is fixed to the layer 22.

[0103] In this way, since filter 25 is fixed to layer 22 via fixing member 24, if no adhesive is used to fix filter 25 to fixing member 24, even if adhesive B1 is used to fix fixing member 24 to layer 22, adhesion of adhesive to filter 25 can be reduced.

[0104] Moreover, the fixing member 24 is made of a thermoplastic resin, while the layer 22 is made of any one of a thermosetting resin, a metal, and a ceramic.

[0105] Generally, the Young's modulus of each of thermosetting resin, metal, and ceramic is higher than that of thermoplastic resin. Therefore, by including layer 22 made of any of thermosetting resin, metal, and ceramic in flow path member 1, the rigidity of flow path member 1 can be increased compared to a configuration in which flow path member 1 is made of only thermoplastic resin.

[0106] In addition, generally, each of thermosetting resin, metal, and ceramic has a superior liquid resistance compared to thermoplastic resin. Therefore, by including the layer 22 made of any one of thermosetting resin, metal, and ceramic in the flow path member 1, the liquid resistance of the flow path member 1 can be improved compared to a configuration in which the flow path member 1 is made of only thermoplastic resin. In addition, generally, the linear expansion coefficient of each of thermosetting resin, metal, and ceramic is smaller than that of thermoplastic resin. Therefore, deformation such as warping of the flow path member 1 due to temperature change can be reduced compared to the case where a thermoplastic resin is used. As a result, peeling of the adhesive in the flow path member 1 can be reduced.

[0107] On the other hand, thermoplastic resins can be fixed to other members by welding. Therefore, the filter 25 can be fixed to the fixing member 24 by welding without using an adhesive. Here, there are types of thermoplastic resins that have excellent liquid resistance. Therefore, by appropriately selecting the type of thermoplastic resin constituting the fixing member 24, the liquid resistance required for the flow path member 1 can be realized. Note that the thermoplastic resin constituting the fixing member 24 itself does not need to be liquid resistant. In this case, for example, a surface treatment such as a coating having liquid resistance may be appropriately applied to the fixing member 24.

[0108] From the above, it is possible to increase the rigidity and liquid resistance of the flow path member 1 while preventing adhesion of adhesive to the filter 25, and as a result, it is possible to provide a flow path member 1 having superior reliability compared to conventional flow path members.

[0109] In this embodiment, the area of ​​the fixing member 24 in a plan view is smaller than the area of ​​the layer 22 in a plan view. Therefore, the effect of the rigidity of the fixing member 24 on the rigidity of the entire flow path member 1 is smaller than the effect of the rigidity of the layer 22 on the rigidity of the entire flow path member 1. In other words, the effect of the rigidity of the layer 22 on the rigidity of the entire flow path member 1 is larger than the effect of the rigidity of the fixing member 24 on the rigidity of the entire flow path member 1. Therefore, by forming the layer 22 from any one of a thermosetting resin, a metal, and a ceramic, the rigidity of the entire flow path member 1 can be suitably increased. On the other hand, even if the fixing member 24 is formed from a thermoplastic resin, it can be said that the rigidity of the entire flow path member 1 is unlikely to decrease.

[0110] As described above, the fixing member 24 and the layer 22 are fixed to each other by the adhesive B1, which is an example of a "first adhesive." The fixing member 24 and the filter 25 are fixed to each other by, for example, welding, without using an adhesive. In this way, the filter 25 is fixed to the layer 22 via the fixing member 24 without using an adhesive to fix the fixing member 24 and the filter, and therefore, it is possible to prevent the adhesive B1 from blocking the pores of the filter 25.

[0111] Here, the welding may be any method capable of fixing the fixing member 24 and the filter 25 to each other, and may be, for example, heat welding, laser welding, ultrasonic welding, etc. In this embodiment, the fixing member 24 and the filter 25 are fixed to each other by heat welding. When ultrasonic welding is used, the fixing member 24 needs to be made of two thermoplastic resins arranged to sandwich the filter 25. When laser welding is used, the fixing member 24 needs to be made of a light-transmitting resin and a light-absorbing resin made of thermoplastic resins arranged to sandwich the filter 25. The light-transmitting resin used in laser welding is not limited to one that transmits 100% of the laser light, and the light-absorbing resin used in laser welding is not limited to one that absorbs 100% of the laser light. The light-absorbing resin and the light-transmitting resin may have different light absorptance (or light transmittance) for at least one wavelength of the laser light, and the light-transmitting resin may be more easily transmitted than the light-absorbing resin. Therefore, the light absorbing resin may have a light absorptance of less than 100%, and the light transparent resin may have a light transmittance of less than 100%. In order to stably perform laser welding, the laser light transmittance of the light transparent resin is preferably, for example, 20% or more, and more preferably 30% or more.

[0112] In addition, when the adhesive B1 is a photocurable adhesive, it is preferable that the fixing member 24 is a member having translucency. In this case, the time required for the adhesive B1 to be cured or solidified during bonding can be shortened compared to when the adhesive B1 is a thermosetting adhesive or other adhesive. Therefore, the flow of the adhesive B1 toward the filter 25 during bonding can be reduced. In addition, since the fixing member 24 has translucency, light for photocuring can be irradiated to the adhesive B1 through the fixing member 24. Therefore, even if the adhesive B1 has a portion disposed between the fixing member 24 and the layer 22, the portion can be photocured. Here, the fixing member 24 only needs to have translucency that allows the adhesive B1 to be cured when light is irradiated to the adhesive B1 through the fixing member 24. For example, when the adhesive B1 is an ultraviolet curable type, the fixing member 24 only needs to have translucency that allows the adhesive B1 to be cured when ultraviolet light is irradiated to the adhesive B1 through the fixing member 24. Note that, even if the adhesive B2 is a photocurable adhesive, the same effect as described above can be achieved.

[0113] It is preferable that the adhesive B1 does not adhere to the portion of the filter 25 that should exhibit the filtering function. In this embodiment, the portion of the filter 25 that should exhibit the filtering function is the portion of the filter 25 that overlaps the recess 24a in a plan view. In this embodiment, the adhesive B1 adheres the surface of the fixing member 24 facing the Z2 direction to the layer 22, while the filter 25 is fixed to the surface of the fixing member 24 facing the Z1 direction. Therefore, the adhesive B1 does not adhere to the filter 25. Also, as described above, the frame portion 24b has a portion that is inserted into the groove 21c, so the adhesives B2 and Ba do not adhere to the filter 25 either. In this way, since neither adhesive adheres to the filter 25, the possibility that the mesh of the filter 25 will be blocked is extremely low.

[0114] As described above, the flow path member 1 has the layer 21, which is an example of the "second member." The layer 21 constitutes a part of the supply flow path CC, and is made of any one of a thermosetting resin, a metal, and a ceramic. The layers 21 and 22 are laminated together with the fixing member 24 interposed therebetween. Therefore, the rigidity of the flow path member 1 can be increased compared to a configuration in which the fixing member 24 is not interposed between the layers 21 and 22.

[0115] As in the comparison with layer 22 described above, the area of ​​fixing member 24 is smaller than the area of ​​layer 21 in a plan view. For this reason, by forming layer 21 from any one of a thermosetting resin, a metal, and a ceramic, the rigidity of the entire flow path member 1 can be suitably increased. On the other hand, even if fixing member 24 is formed from a thermoplastic resin, it can be said that the rigidity of the entire flow path member 1 is unlikely to decrease.

[0116] As described above, the fixing member 24 and the layer 21 are fixed to each other by the adhesive B2, which is an example of a “second adhesive.” In this embodiment, the adhesive B2 is used in addition to the adhesive B1, so that the fixing member 24 can be more firmly fixed to the laminate including the layers 21 and 22, compared to a configuration in which only one of the adhesives B1 and B2 is used.

[0117] As described above, the fixing member 24 has a recess 24a recessed with respect to the surface to which the filter 25 is fixed. The bottom surface of the recess 24a constitutes a part of the supply flow path CC, and has the first outlet 24c and the second outlet 24d which are through holes. Therefore, the fixing member 24 constitutes the bottom wall of the downstream chamber R2. With this configuration, the distance between the filter 25 and the first outlet 24c and the second outlet 24d can be shortened compared to a configuration in which the fixing member 24 does not have the recess 24a. As a result, air bubbles in the downstream chamber R2 can be suitably discharged to the first outlet 24c and the second outlet 24d.

[0118] As described above, the supply flow path CC has a flow path C3 extending in a direction intersecting the direction in which the layer 22 and the filter 25 are stacked. The flow path C3 is provided in the layer 22. The layer 22 in which the flow path C3 is provided is enlarged in a direction intersecting the direction in which the layer 22 and the filter 25 are stacked, and the ratio of the hollowed-out portion in the layer 22 is increased. Therefore, if the layer 22 is made of a thermoplastic resin, it is likely to have insufficient rigidity. In contrast, by making the layer 22 out of any one of a thermosetting resin, a metal, and a ceramic, it is possible to prevent the layer 22 from having insufficient rigidity even if the layer 22 has the flow path C3. Furthermore, if the layer 22 has the flow path C3, the liquid contact area of ​​the layer 22 that comes into contact with the ink increases. Therefore, if the layer 22 is made of a thermoplastic resin that is less liquid resistant than a thermosetting resin, a metal, or a ceramic, the layer 22 is likely to deteriorate, and there is a risk of foreign matter being generated or swelling. In contrast, by forming layer 22 from any one of thermosetting resin, metal, and ceramics, even if layer 22 has flow path C3 provided therein, deterioration of layer 22 can be prevented.

[0119] In general, thermosetting resins, metals, and ceramics each have excellent resistance not only to water-based inks, but also to solvent inks and ultraviolet-curable inks. When the ink flowing through the supply flow path CC is ultraviolet-curable ink or solvent ink, the ink contains a solvent, and if the flow path member 1 is made only of a thermoplastic resin, the flow path member 1 is likely to be deteriorated by the solvent. In contrast, by making at least a portion of the flow path member 1 out of any of thermosetting resins, metals, and ceramics, deterioration of the flow path member 1 by solvent ink or ultraviolet-curable ink is reduced, even if solvent ink or ultraviolet-curable ink is used as the liquid to be sprayed from the liquid jet head 10.

[0120] As described above, the liquid jet head 10 has a circulation flow path through which ink that has not been ejected from the nozzle N after passing through the supply flow path CC flows. Here, at least a part of the discharge flow path CM that constitutes a part of the circulation flow path is provided in the layer 22. Therefore, the layer 22 constitutes a part of the circulation flow path. The layer 22 in which a part of the circulation flow path is provided in this way becomes larger in the direction intersecting the direction in which the layer 22 and the filter 25 are laminated, and the ratio of the hollowed-out portion in the layer 22 increases. Therefore, if the layer 22 is made of a thermoplastic resin, it is likely to have insufficient rigidity. In contrast, by making the layer 22 out of any one of a thermosetting resin, a metal, and a ceramic, it is possible to prevent the layer 22 from having insufficient rigidity even if a part of the circulation flow path is provided in the layer 22. Furthermore, if the layer 22 has a part of the circulation flow path, the liquid contact area of ​​the layer 22 that comes into contact with the ink increases, so that if the layer 22 is made of a thermoplastic resin, the layer 22 is likely to deteriorate. In contrast, by forming layer 22 from any one of thermosetting resin, metal, and ceramics, it is possible to prevent deterioration of layer 22 even if part of the circulation flow path is provided in layer 22.

[0121] The liquid resistance of each material, such as thermoplastic resin, thermosetting resin, metal, ceramics, etc., can be measured by experiment. Specifically, a member, such as a film, of a certain mass is immersed as a test piece in the target ink for a certain period of time, and the dissolution ratio is calculated from the change in mass at that time, whereby the liquid resistance can be quantitatively evaluated. By using the above method, the resistance of each material to, for example, a specific solvent-based ink, ultraviolet-curable ink, or water-based ink can be measured.

[0122] 1-6. Manufacturing method of flow path member 1 Fig. 10 is a diagram showing the manufacturing process of the flow path member 1 according to the first embodiment. Fig. 10 illustrates the manufacturing process of the flow path member 1 when the fixing member 24 and the filter 25 are fixed by welding. As shown in Fig. 10, the manufacturing method of the flow path member 1 includes a preparation step S11, a welding step S12, and an adhesion step S13, which are performed in this order.

[0123] In the preparation step S11, the fixing member 24 and the filter 25 are prepared. The fixing member 24 is formed by injection molding a thermoplastic resin. The fixing member 24 has a director 24s protruding from the mounting surface 24p. Although not shown, the director 24s is provided in an annular shape surrounding the recess 24a when viewed in the direction in which the filter 25 and the fixing member 24 are stacked. The filter 25 is obtained by appropriately cutting metal fibers such as twill weave or plain weave.

[0124] In the welding step S12, the fixing member 24 and the filter 25 are fixed to each other by welding. Specifically, as shown in Fig. 12, the filter 25 is placed on the director 24s of the fixing member 24, and then, in this state, energy EG is applied to the fixing member 24 over an area that contacts the outer periphery of the filter 25, in other words, by applying energy EG to the director 24s, the director 24s melts and the fixing member 24 and the filter 25 are welded to each other. Since the welding method in this embodiment is thermal welding, the energy EG is heat.

[0125] In the bonding step S13, the fixing member 24 and the layer 21 are fixed to each other by an adhesive B1.

[0126] As described above, in the method for producing flow path member 1, filter 25 and fixing member 24 are welded together, and then fixing member 24 and layer 22 are bonded together with adhesive B1. In the above-described method for producing flow path member 1, it is possible to produce a flow path member 1 having excellent reliability as described above.

[0127] In the first embodiment, layer 22 is an example of a "first member," layer 21 is an example of a "second member," adhesive B1 is an example of a "first adhesive," and adhesive B2 is an example of a "second adhesive." However, layer 22 may be an example of a "second member," layer 21 may be an example of a "first member," adhesive B1 may be an example of a "second adhesive," and adhesive B2 may be an example of a "first adhesive."

[0128] 2. Second embodiment A second embodiment of the present invention will be described below. In the following example, for elements having the same actions and functions as those in the first embodiment, the reference numerals used in the description of the first embodiment will be used and detailed descriptions of each will be omitted as appropriate.

[0129] FIG. 11 is a perspective view of a liquid jet module 40A having a liquid jet head 10A according to the second embodiment. As shown in FIG. 11, the liquid jet module 40A has a support 41A and a plurality of liquid jet heads 10A. The support 41A is a member that supports the plurality of liquid jet heads 10A. In the example shown in FIG. 11, the support 41A is a plate-shaped member made of metal or the like, and is provided with a plurality of mounting holes 41b for mounting the plurality of liquid jet heads 10A. The liquid jet heads 10A are inserted into the respective mounting holes 41b, and each liquid jet head 10A is fixed to the support 41A by screwing or the like. In FIG. 11, the plurality of liquid jet heads 10A are arranged in a matrix along the X-axis and the Y-axis. Note that the number of liquid jet heads 10A in the liquid jet module 40A is not limited to the example shown in FIG. 11 and is arbitrary. In addition, the shape, etc. of the support 41A is also not limited to the example shown in FIG. 11 and is arbitrary.

[0130] Fig. 12 is an exploded perspective view of the liquid jet head 10A shown in Fig. 11. As shown in Fig. 12, the liquid jet head 10A has a flow path structure 11A, a wiring board 12A, a holder 13A, head bodies 14_1, 14_2, 14_3, and 14_4, a fixed plate 15A, a reinforcing plate 17, and a cover 18. These are arranged in the Z2 direction in the following order: cover 18, wiring board 12A, flow path structure 11A, holder 13A, head bodies 14_1, 14_2, 14_3, and 14_4, reinforcing plate 17, and fixed plate 15A. Each part of the liquid jet head 10A will be described below in order.

[0131] The flow path structure 11A is configured similarly to the flow path structure 11 of the first embodiment described above, except that it is configured by laminating layers Su1 to Su5 and has a different shape. Thus, like the flow path structure 11, the flow path structure 11A has a filter-related configuration. This configuration will be described in detail later. The layers Su1 to Su5 are made of any one of thermosetting resin, metal, and ceramics. The layers Su1 to Su5 are fixed to each other by an adhesive. The layer Su3 is an example of a "first member." The layer Su2 is an example of a "second member."

[0132] The wiring board 12A is a mounting component for electrically connecting the head bodies 14_1, 14_2, 14_3, and 14_4 to the control unit 20. The wiring board 12A is composed of, for example, a flexible wiring board or a rigid wiring board. The wiring board 12A is disposed between the flow path structure 11A and the cover 18, and a connector 12c is provided on the surface of the wiring board 12A opposite to the surface facing the flow path structure 11A. The connector 12c is a connection component for electrically connecting to the control unit 20. The wiring board 12A is electrically connected to the multiple head bodies 14 via wiring (not shown). The wiring is composed of, for example, a combination of a flexible wiring board and a rigid wiring board. The wiring may be integral with the wiring board 12A.

[0133] The holder 13A is similar to the holder 13A of the first embodiment described above, except for the shape. Here, the head bodies 14_1, 14_2, 14_3, and 14_4 are held by the holder 13A in a state in which the arrangement direction of the nozzles N in the nozzle rows La and Lb is parallel to the Y axis. The fixing plate 15A is similar to the fixing plate 15 of the first embodiment described above, except for the shape. However, a reinforcing plate 17 is disposed between the holder 13A and the fixing plate 15A. Note that FIG. 12 shows a configuration in which the holder 13A does not have a branch flow path.

[0134] The reinforcing plate 17 is a plate-like member that reinforces the fixed plate 15A. The reinforcing plate 17 is disposed on the fixed plate 15A and fixed to the fixed plate 15A with an adhesive. The reinforcing plate 17 is provided with a plurality of openings 17a in which the plurality of head bodies 14 are disposed. The reinforcing plate 17 is made of, for example, a metal material.

[0135] The cover 18 is a box-shaped member that houses the flow path member 1A and the wiring board 12A of the flow path structure 11A. The cover 18 is made of, for example, a resin material. The cover 18 is provided with four through holes 18a and an opening 18b. The four through holes 18a correspond to the four connection pipes 11a of the flow path structure 11A, and the corresponding connection pipes 11a, 11b, 11c, or 11d are passed through each through hole 18a. The connector 12c is passed through the opening 18b from inside the cover 18 to the outside.

[0136] Fig. 13 is a diagram showing flow paths of a flow path member 1A according to the second embodiment. As shown in Fig. 13, a supply flow path Sa, a discharge flow path Da, a supply flow path Sb, and a discharge flow path Db are provided inside the flow path member 1A. The supply flow path Sa is a flow path from the connection pipe 11a to the liquid storage chamber Ra of each head main body 14. The discharge flow path Da is a flow path from the liquid storage chamber Ra of each head main body 14 to the connection pipe 11b. The supply flow path Sb is a flow path from the connection pipe 11c to the liquid storage chamber Rb of each head main body 14. The discharge flow path Db is a flow path from the liquid storage chamber Rb of each head main body 14 to the connection pipe 11b. These flow paths are constituted by grooves and through holes appropriately provided in the layers Su1 to Su5 described above.

[0137] As shown in Fig. 13, four filter parts Fa_1 to Fa_4 are provided in the supply flow path Sa. Similarly, four filter parts Fb_1 to Fb_4 are provided in the supply flow path Sb. Below, the filter part Fa_1 will be representatively described. The filter parts Fa_2 to Fa_4 are configured in the same manner as the filter part Fa_1.

[0138] Fig. 14 is a cross-sectional view of a flow path member 1A according to a second embodiment. Fig. 14 illustrates a configuration in which a filter part Fa_1 is provided between a layer Su2 and a layer Su3. As shown in Fig. 14, the filter part Fa_1 has a filter chamber RF, a fixing member 24A, and a filter 25A.

[0139] In this embodiment, the filter chamber RF is composed of a recess 26a provided on the surface of the layer Su2 facing the Z2 direction, and recesses 27a and 27b provided on the surface of the layer Su3 facing the Z1 direction. In the example shown in Fig. 14, the recess 27a is provided over a range that coincides with the recess 26a in a plan view. The recess 27b is provided on the bottom surface of the recess 27a and is provided over a range that is more inward than the recess 26a in a plan view.

[0140] The fixing member 24A and the filter 25A are disposed in the filter chamber RF, and divide the filter chamber RF into an upstream chamber R1 and a downstream chamber R2. Here, the upstream chamber R1 communicates with the aforementioned connecting pipe 11a via a flow path Pa1. Although not shown, the flow path Pa1 is formed of grooves provided on the surface of the layer Su2 facing the Z2 direction and the surface of the layer Su3 facing the Z1 direction. Meanwhile, the downstream chamber R2 communicates with the head main body 14 via a flow path Pa2. The flow path Pa2 is formed of a hole 27c that opens to the bottom surface of the recess 27b and penetrates the layer Su3.

[0141] Fixing member 24A is similar to fixing member 24 of the first embodiment described above, except for its shape. Similarly, filter 25A is similar to filter 25 of the first embodiment described above, except for its shape. Fixing member 24A and filter 25A will be described below, focusing on differences between fixing member 24 and filter 25.

[0142] Fig. 15 is a plan view of a fixing member 24A in the second embodiment, and Fig. 16 is an enlarged cross-sectional view for explaining the fixed state of a fixing member 24A and a filter 25A in the second embodiment.

[0143] As shown in Fig. 15, the fixing member 24A has a frame shape in a plan view. In the example shown in Fig. 15, the outer peripheral edge and the inner peripheral edge of the fixing member 24A each have a substantially rectangular shape. The filter 25A also has a rectangular shape in a plan view. The outer peripheral portion of the filter 25A is fixed to one surface of the fixing member 24A by welding or the like without using an adhesive.

[0144] As shown in FIG. 16, a structure consisting of the fixing member 24A and the filter 25A is placed in the recess 27a. Here, of both sides of the fixing member 24A, the surface to which the filter 25A is fixed is fixed to the layer Su3 with adhesive B1. Therefore, the inner circumferential surface 24j of the fixing member 24A constitutes a part of the wall surface of the upstream chamber R1. Also, by fixing, of both sides of the fixing member 24A, the surface to which the filter 25A is fixed to the layer Su3 with adhesive B1, the distance between the filter 25A and the flow path Pa2 can be shortened. As a result, air bubbles in the downstream chamber R2 can be suitably discharged to the flow path Pa2.

[0145] Here, the adhesive B1 adheres not only to the fixing member 24A and the layer Su3, but also to the outer peripheral portion of the filter 25A, which is a welded portion that does not have a filter function. As shown in FIG. 16, the filled-in area T of the filter 25A indicates the portion where the director of the fixing member 24A melts due to welding, thereby blocking the mesh of the filter 25A. That is, the resin of the fixing member 24A that melts during welding does not exist in the portion having the filter function that is inside the area T of the filter 25A and in the outer peripheral portion of the filter 25A that is outside the area T of the filter 25A. Therefore, by adhering the adhesive B1 between the outer peripheral portion of the filter 25A that is outside the area T and the recess 27a, the adhesive force of the adhesive B1 is increased by the anchor effect using the unevenness of the filter 25A. Furthermore, the adhesive B1 does not adhere to the portion closer to the center of the filter 25A than the area T in a plan view. Therefore, the adhesive B1 flows out to the portion having the filter function of the filter 25A due to the capillary force, thereby reducing blocking of the mesh of the filter 25A. In FIG. 16, adhesive B1 is adhered between region T of filter 25A and the bottom surface of recess 27a, and in a more peripheral portion than region T of filter 25A; however, adhesive B1 may be arranged not to be adhered between region T of filter 25A and the bottom surface of recess 27a, but to be adhered in a more peripheral portion than region T of filter 25A.

[0146] The second embodiment described above can provide a flow path member 1A having excellent reliability, similar to the first embodiment described above. In addition, in this embodiment, as described above, the fixing member 24A is a frame-shaped member that fits along the outer periphery of the filter 25A. Therefore, the fixing member 24A can have a smaller area that comes into contact with ink than the fixing member 24 of the first embodiment described above. Therefore, even if the fixing member 24A is formed of a thermoplastic resin in order to fix the fixing member 24A and the filter 25 by welding, deterioration and swelling of the fixing member 24A due to contact with a solvent-based ink, an ultraviolet-curable ink, or the like can be suppressed.

[0147] Although the fixing member 24A has one opening by the inner peripheral surface 24j, it may have multiple openings. In other words, the fixing member 24A may have not only a portion along the outer periphery of the filter 25A, but also a beam-like portion that spans the portion, and in this case, it can also be said to be a frame-like member. In this case, multiple filters may be provided for each opening.

[0148] In addition, each of the supply channels Sa and Sb has a branch channel that branches out, as shown in FIG. 13. When the branch channel is provided in the layer Su3, the layer Su3 becomes larger and the ratio of the hollowed-out portion increases, so if the layer Su3 is made of a thermoplastic resin, it is likely to have insufficient rigidity. In contrast, by making the layer Su3 out of any of a thermosetting resin, metal, and ceramics, it is possible to prevent the layer Su3 from having insufficient rigidity even if a part of the circulation channel is provided in the layer Su3. Furthermore, when the layer Su3 has a branch channel, the liquid contact area of ​​the layer Su3 that comes into contact with the ink increases, so if the layer Su3 is made of a thermoplastic resin, it is likely to deteriorate. In contrast, by making the layer Su3 out of any of a thermosetting resin, metal, and ceramics, it is possible to prevent the layer Su3 from deteriorating even if the layer Su3 has a branch channel.

[0149] According to the second embodiment, similarly to the above-described first embodiment, the reliability of the flow path member 1A can be improved.

[0150] 3. Third embodiment The third embodiment of the present invention will be described below. In the following exemplary embodiment, for elements having the same actions and functions as those in the first embodiment, the reference numerals used in the description of the first embodiment will be used and detailed descriptions of each will be omitted as appropriate.

[0151] 17 is a cross-sectional view of a flow path member 1B according to a third embodiment. The flow path member 1B is similar to the flow path member 1A of the second embodiment described above, except that the installation posture of the structure consisting of the fixing member 24A and the filter 25A is reversed. That is, in the flow path member 1B, of both surfaces of the fixing member 24A, the surface opposite to the surface to which the filter 25A is fixed is fixed to the layer Su3 with the adhesive B1.

[0152] The above third embodiment can also improve the reliability of the flow path member 1B, as in the above-described first embodiment. Moreover, in this embodiment, the surface of the fixing member 24A opposite to the surface to which the filter 25A is fixed is fixed to the layer Su3 with the adhesive B1, which is an advantage over the second embodiment in that the adhesive B1 is less likely to adhere to the filter 25A.

[0153] 17, the adhesive B1 is provided between the surface of the fixing member 24A opposite to the surface to which the filter 25A is fixed and the bottom surface of the recess 27a, and between the outer peripheral surface of the fixing member 24A and the inner peripheral surface of the recess 27a, for the purpose of improving the adhesive strength, but this is not limited to the embodiment, and the adhesive B1 may be provided only between the surface of the fixing member 24A opposite to the surface to which the filter 25A is fixed and the bottom surface of the recess 27a. Such a configuration has the advantage that the adhesive B1 is less likely to adhere to the filter 25A than the third embodiment.

[0154] 4. Fourth embodiment The fourth embodiment of the present invention will be described below. In the following exemplary embodiment, for elements having the same actions and functions as those in the first embodiment, the reference numerals used in the description of the first embodiment will be used and detailed descriptions of each will be omitted as appropriate. FIG. 18 is a cross-sectional view of a flow path member 1C according to the fourth embodiment. The flow path member 1C is similar to the flow path member 1B of the third embodiment described above, except that a recess 27d is provided in the layer Su3. The recess 27d is provided on the bottom surface of the recess 27a along the inner circumference of the recess 27b. The recess 27d has an annular shape in a plan view, and has a bottom surface 27d-1, a first inner peripheral surface 27d-2, and a second inner peripheral surface 27d-3. The first inner peripheral surface 27d-2 is the inner peripheral surface of the recess 27d that is disposed closer to the center of the recess 27a than the second inner peripheral surface 27d-3. Here, the end of the fixing member 24A in the Z2 direction is accommodated in the recess 27d, and the fixing member 24A is fixed to the wall surface of the recess 27d by the adhesive B1. Specifically, adhesive B1 is provided between the face of fixing member 24A opposite to the face to which filter 25A is fixed and bottom face 27d-1, between the outer peripheral face of fixing member 24A and second inner peripheral face 27d-3, and between the inner peripheral face of fixing member 24A and first inner peripheral face 27d-2.

[0155] The above fourth embodiment can improve the reliability of the flow path member 1C, as in the first embodiment. In addition, in this embodiment, the fixing member 24A is placed in the recess 27d, thereby shortening the distance between the filter 25A and the flow path Pa2. As a result, air bubbles in the downstream chamber R2 can be suitably discharged to the flow path Pa2. Furthermore, in this embodiment, the area in which the adhesive B1 is provided is increased, thereby improving the adhesive strength between the fixing member 24A and the layer Su3.

[0156] 5. Fifth embodiment The fifth embodiment of the present invention will be described below. In the following exemplary embodiments, the elements having the same actions and functions as those in the first embodiment will be designated by the same reference numerals as those in the first embodiment, and detailed descriptions thereof will be omitted as appropriate.

[0157] 19 is a cross-sectional view of a flow path member 1D according to the fifth embodiment. The flow path member 1D is similar to the flow path member 1A of the first embodiment described above, except that the flow path member 1D has a fixing member 24D instead of the fixing member 24A.

[0158] The fixing member 24D is similar to the fixing member 24A of the above-described first embodiment, except that the fixing member 24D has a recess 24k for mounting the filter 25A. The recess 24k is provided on the surface of the fixing member 24D facing the Z1 direction, and houses the filter 25A.

[0159] The fifth embodiment described above can improve the reliability of the flow path member 1D, as in the first embodiment described above. In addition, in this embodiment, the filter 25A is installed in the recess 24k, so that the distance between the filter 25A and the flow path Pa2 can be shortened. As a result, air bubbles in the downstream chamber R2 can be suitably discharged to the flow path Pa2.

[0160] 6. Sixth embodiment The sixth embodiment of the present invention will be described below. In the following exemplary embodiments, the elements having the same actions and functions as those in the first embodiment will be designated by the same reference numerals as those in the first embodiment, and detailed descriptions thereof will be omitted as appropriate.

[0161] 20 is a cross-sectional view of a flow path member 1E according to a sixth embodiment. The flow path member 1E is similar to the flow path member 1A of the first embodiment described above, except that the flow path member 1E has a fixing member 24E instead of the fixing member 24A.

[0162] The fixing member 24E is similar to the fixing member 24A of the first embodiment described above, except that the filter 25A is fixed midway through the thickness direction of the fixing member 24E. The fixing member 24E is integrated with the filter 25A by being formed by insert molding using the filter 25A as an insert item.

[0163] As described above, in the flow path member 1E, the fixing member 24E is formed by insert molding using the filter 25A as an insert part. That is, the fixing member 24E and the filter 25A are integrally formed by insert molding. Therefore, the fixing member 24E and the filter 25A can be fixed to each other without using an adhesive. The layer Su3, which is an example of the "first member", and the fixing member 24E are fixed to each other by the adhesive B1.

[0164] Fig. 21 is a diagram showing a manufacturing process of a flow path member 1E according to a sixth embodiment. Fig. 21 shows the manufacturing process of the flow path member 1E in the case where a fixing member 24E and a filter 25A are fixed by insert molding. As shown in Fig. 21, the manufacturing method of the flow path member 1E includes an insert step S21, a molding step S22, a demolding step S23, and an adhesion step S24, which are performed in this order.

[0165] In the insert step S21, with the molding dies 301 and 302 open, the filter 25A is inserted as an insert product at a desired position in the die.

[0166] In the molding step S22, the molds 301 and 302 are closed and resin is filled into the molds. The resin may be either a thermoplastic resin or a thermosetting resin, but is preferably a thermosetting resin in terms of liquid resistance and rigidity. When the resin is a thermoplastic resin, the mold is filled with the thermoplastic resin softened by heating, and then the thermoplastic resin is solidified by cooling, thereby obtaining the fixing member 24E to which the filter 25A is fixed. When the resin is a thermosetting resin, the mold is filled with a thermosetting resin having fluidity before hardening, and then the thermosetting resin is hardened by a hardening reaction, thereby obtaining the fixing member 24E to which the filter 25A is fixed.

[0167] In the demolding step S23, the fixing member 24E obtained as described above is demolded from the molding dies 301 and 302.

[0168] In the bonding step S24, similarly to the bonding step S13 in the above-described first embodiment, the fixing member 24E and the layer Su3 are fixed to each other by the adhesive B1.

[0169] As described above, in the method for manufacturing the flow path member 1E, the fixing member 24E is formed by insert molding using the filter 25A as an insert item, and then the fixing member 24E and the layer Su3 are bonded with the adhesive B1. In the above-described method for manufacturing the flow path member 1E, it is possible to manufacture a flow path member 1E having excellent reliability as described above. Furthermore, when the fixing member 24E is formed of a thermosetting resin, it is possible to improve liquid resistance and rigidity compared to when the fixing member 24E is formed of a thermoplastic resin.

[0170] The above sixth embodiment can improve the reliability of the flow path member 1E, as in the first embodiment. In this embodiment, the filter 25A is fixed to the middle of the fixing member 24E in the thickness direction, thereby shortening the distance between the filter 25A and the flow path Pa2. As a result, air bubbles in the downstream chamber R2 can be suitably discharged to the flow path Pa2.

[0171] 7. Variations The above-mentioned exemplary embodiments may be modified in various ways. Specific modified embodiments that may be applied to the above-mentioned embodiments are exemplified below. Two or more embodiments selected from the following examples may be appropriately combined as long as they are not mutually contradictory.

[0172] 7-1. Variation 1 FIG. 22 is a cross-sectional view of a flow path member 1F according to Modification 1. The flow path member 1F has a layer 21F which is an example of a "fixing member", a layer 22F which is an example of a "first member", and a filter 25F. The layers 21F and 22F are laminated in this order in the Z2 direction and fixed to each other by an adhesive. Here, in a plan view, the area of ​​the layer 21F is smaller than the area of ​​the layer 22F. Furthermore, the layer 21F is made of a thermoplastic resin, and the layer 22F is made of a thermosetting resin, a metal, or a ceramic.

[0173] A filter 25F is disposed in the space formed between the layer 21F and the layer 22F. A recess 21d provided on the surface of the layer 21F facing the Z2 direction and a recess 22e provided on the surface of the layer 22F facing the Z1 direction form a filter chamber RF. The filter 25F is disposed in the recess 21d, and is fixed to the layer 21F by welding or the like without using an adhesive.

[0174] Here, the filter 25F divides the filter chamber RF into an upstream chamber R1 and a downstream chamber R2. The layer 21F is provided with a connecting pipe 11a, which communicates with the upstream chamber R1. The layer 22F is provided with an outlet 22f that opens into the downstream chamber R2. The above modification 1 also provides the same effects as the above-mentioned embodiment. Note that the layer 22F may be configured such that the recess 22e is not formed and only the outlet 22f is formed.

[0175] As described above, since the area of ​​the layer 21F is smaller than the area of ​​the layer 22F in a plan view, even if the layer 21F is made of a thermoplastic resin, the decrease in the rigidity of the entire flow path member 1F can be reduced. Furthermore, the layer 22F may be configured by laminating not only the layer 21F in which the connecting pipe 11a is formed, but also a plurality of layers 21F in which each of the connecting pipes 11b to 11d is formed, with an adhesive. Even in such a configuration, if the layer 22F, which has an area larger than each of the layers 21F in a plan view, is made of a thermosetting resin, the decrease in the rigidity of the flow path member 1F can be suppressed. Note that the area of ​​the layer 21F and the area of ​​the layer 22F may be substantially the same in a plan view. The area of ​​the layer 21F and the area of ​​the layer 22F being substantially the same includes the case where the area of ​​the layer 21F is 90% or more and less than 110% of the area of ​​the layer 22F.

[0176] 7-2.Modification 2 FIG. 23 is a cross-sectional view of a flow path member 1G according to the second modification. The flow path member 1G is similar to the flow path member 1F of the first modification, except that the flow path member 1G has layers 22G and 23G instead of the layer 22F, and the filter 25F is disposed at a different position. That is, the flow path member 1G has a layer 21F, which is an example of a "first member", a layer 22G, which is an example of a "fixing member", a layer 23G, which is an example of a "second member", and a filter 25F. The layer 21F is also an example of a "second member", and in this case, the layer 23G is an example of a "first member". The layers 21F, 22G, and 23G are laminated in this order in the Z2 direction, and are fixed to each other by an adhesive. Each of the layers 21F and 23G is made of a thermosetting resin, a metal, or a ceramic, and the layer 22G is made of a thermoplastic resin.

[0177] A filter 25F is disposed in the space formed between the layer 21F and the layer 22G. A filter chamber RF is formed by a recess 21d provided on the surface of the layer 21F facing the Z2 direction, an opening 22g penetrating the layer 22G, and a surface of the layer 23G facing the Z1 direction. The filter 25F is disposed in the opening 22g, and is fixed to the layer 22G by welding or the like without using an adhesive.

[0178] Here, the filter 25F divides the filter chamber RF into an upstream chamber R1 and a downstream chamber R2. The layer 21F is provided with a connecting pipe 11a, which communicates with the upstream chamber R1. The layer 23G is provided with an outlet 23b that opens into the downstream chamber R2. The above-described second modification also provides the same effects as the above-described embodiment.

[0179] 7-3. Variation 3 24 is a cross-sectional view of a flow path member 1H according to Modification 3. The flow path member 1H is similar to the flow path member 1F of Modification 1 described above, except that a filter 25F is fixed to a layer 21F via a fixing member 24H. That is, the flow path member 1H has a layer 21F which is an example of a "first member", a layer 22F which is an example of a "second member", a fixing member 24H, and a filter 25F.

[0180] Here, the fixing member 24H is made of a thermoplastic resin and has a frame shape. The fixing member 24H is fixed to the layer 21F by an adhesive (not shown). The filter 25F is fixed to the fixing member 24H by welding or the like without using an adhesive. The above-mentioned third modification also provides the same effects as the above-mentioned embodiment. Note that the fixing member 24H may be made of a thermosetting resin when the fixing member 24H is insert-molded integrally with the filter 25F so as to sandwich the filter 25F as in the above-mentioned sixth embodiment.

[0181] 7-4.Modification 4 25 is a cross-sectional view of a flow path member 1I according to Modification 4. The flow path member 1I has a layer 21H which is an example of a "second member", a layer 22F which is an example of a "first member", a fixing member 24H, and a filter 25F. The layers 21H and 22F are laminated in this order in the Z2 direction, and are fixed to each other by an adhesive. Here, each of the layers 21H and 22F is made of a thermosetting resin, a metal, or a ceramic.

[0182] A filter 25F is disposed in the space formed between the layer 21H and the layer 22F. A recess 21d provided on the surface of the layer 21H facing the Z2 direction and a recess 22e provided on the surface of the layer 22F facing the Z1 direction form a filter chamber RF. A fixing member 24H and a filter 25F are disposed in the recess 22e, and the filter 25F is fixed to the layer 21F via the fixing member 24H.

[0183] In this modification, the fixing member 24H is composed of a laminate of two members 24m and 24n. Here, both members 24m and 24n are composed of thermoplastic resin. The members 24m and 24n are joined to each other and to the filter 25F by laser welding, ultrasonic welding, or the like. In the case of laser welding, one of the members 24m and 24n is made of a light-transmitting resin and the other is made of a light-absorbing resin. The above modification 4 also provides the same effects as the above-mentioned embodiment.

[0184] 7-5. Variation 5 In the above embodiment, the liquid jet head 10 constitutes a line head, but the present invention is not limited to this configuration, and may be configured as a serial type in which the liquid jet head 10 reciprocates along the X axis.

[0185] 7-6. Variation 6 The liquid ejection apparatus 100 exemplified in each of the above-mentioned embodiments can be adopted in various devices such as facsimile machines and copy machines, in addition to devices dedicated to printing. However, the use of the liquid ejection apparatus of the present invention is not limited to printing. For example, a liquid ejection apparatus that ejects a solution of a coloring material is used as a manufacturing device that forms a color filter of a liquid crystal display device. Also, a liquid ejection apparatus that ejects a solution of a conductive material is used as a manufacturing device that forms wiring and electrodes of a wiring board. [Explanation of symbols]

[0186] 1...flow path member, 1A...flow path member, 1B...flow path member, 1C...flow path member, 1D...flow path member, 1E...flow path member, 1F...flow path member, 1G...flow path member, 1H...flow path member, 10...liquid jet head, 10A...liquid jet head, 21...layer, 21F...layer, 21H...layer, 21d...recess, 22...layer, 22F...layer, 22G...layer, 22a...recess, 22e...recess, 23...layer, 23G...layer, 24...fixing member, 24A...fixing member, 24D...fixing member, 24E...fixing member, 24H...fixing member, 24a...recess, 24k...recess, 25...filter, 25A...filter, 25F...filter, 26a...recess, 27a...recess, 27b...recess, 27c...hole, 27d...recess, 30...transport mechanism, 100...liquid ejection device, 101...medium, B1...adhesive, B2...adhesive, CC...supply flow path, CM...discharge flow path (circulation flow path), Da...discharge flow path (circulation flow path), Db...discharge flow path (circulation flow path), N...nozzle, Sa...supply flow path, Sb...supply flow path, Su1...layer, Su2...layer, Su3...layer, Su4...layer, Su5...layer.

Claims

1. a supply channel through which a liquid flows; a filter disposed midway through the supply flow path and through which the liquid passes; a fixing member that forms a part of the supply flow path and to which the filter is fixed; a first member that constitutes a part of the supply flow path and to which the fixing member is fixed, the fixing member is made of a thermoplastic resin, the first member is made of any one of a thermosetting resin, a metal, and a ceramic; the fixing member and the filter are fixed to each other by welding, The fixing member and the first member are fixed to each other by a first adhesive. Flow path components.

2. A supply flow path through which a liquid flows; a filter disposed midway through the supply flow path and through which the liquid passes; a fixing member that forms a part of the supply flow path and to which the filter is fixed; a first member that constitutes a part of the supply flow path and to which the fixing member is fixed, the fixing member is made of a thermoplastic resin, the first member is made of any one of a thermosetting resin, a metal, and a ceramic; In a plan view, the area of ​​the fixing member is smaller than the area of ​​the first member. Flow path components.

3. the fixing member and the filter are fixed to each other by welding, The fixing member and the first member are fixed to each other by a first adhesive. The flow path member according to claim 2 .

4. the fixing member is a light-transmitting member, The first adhesive is a photocurable adhesive. The flow path member according to claim 3 .

5. The filter is free of adhesive. The flow path member according to claim 1 .

6. A supply flow path through which a liquid flows; a filter disposed midway through the supply flow path and through which the liquid passes; a fixing member that forms a part of the supply flow path and to which the filter is fixed; a first member that constitutes a part of the supply flow path and to which the fixing member is fixed; a second member that constitutes a part of the supply flow path and is made of any one of a thermosetting resin, a metal, and a ceramic; the fixing member is made of a thermoplastic resin, the first member is made of any one of a thermosetting resin, a metal, and a ceramic; The first member and the second member are stacked on each other with the fixing member interposed therebetween. Flow path components.

7. a second member that constitutes a part of the supply flow path and is made of any one of a thermosetting resin, a metal, and a ceramic; The first member and the second member are stacked on each other with the fixing member interposed therebetween. The flow path member according to claim 1 .

8. In a plan view, the area of ​​the fixing member is smaller than the area of ​​the second member. The flow path member according to claim 6 or 7.

9. The fixing member and the second member are fixed to each other by a second adhesive. The flow path member according to any one of claims 6 to 8.

10. the fixing member and the filter are fixed to each other by welding, each of the first member and the second member includes a thermosetting resin and at least one of an inorganic filler and an inorganic fiber base material; The fixing member does not contain an inorganic filler or an inorganic fiber base material, or contains an inorganic filler or an inorganic fiber base material at a content lower than that of each of the first member and the second member. The flow path member according to any one of claims 6 to 9.

11. The fixing member is a frame-shaped member. The flow path member according to claim 1 .

12. the fixing member has a recess that is recessed relative to a surface to which the filter is fixed, a bottom surface of the recessed portion forming a part of the supply flow path and having a through hole; The flow path member according to claim 1 .

13. the supply flow path has a flow path extending in a direction intersecting a direction in which the first member and the filter are stacked, The first member is provided with the flow path. The flow path member according to claim 1 .

14. A supply flow path through which a liquid flows; a filter disposed midway through the supply flow path and through which the liquid passes; a fixing member that forms a part of the supply flow path and to which the filter is fixed; a first member that constitutes a part of the supply flow path and to which the fixing member is fixed, the fixing member is made of a thermoplastic resin, the first member is made of any one of a thermosetting resin, a metal, and a ceramic; the supply flow path has a branch flow path branching from it, The first member is provided with the branch flow path. Flow path components.

15. the supply flow path has a branch flow path branching from it, The first member is provided with the branch flow path. The flow path member according to any one of claims 1 to 13.

16. a supply channel through which a liquid flows; a filter disposed midway through the supply flow path and through which the liquid passes; a fixing member that constitutes a part of the supply flow path and is made of a thermosetting resin; a first member that constitutes a part of the supply flow path and is made of any one of a thermosetting resin, a metal, and a ceramic; The fixing member and the filter are integrally molded by insert molding, The first member and the fixing member are fixed to each other by an adhesive. Flow path components.

17. A flow path member according to any one of claims 1 to 16; a nozzle for spraying the liquid that has passed through the supply flow path, Liquid injection head.

18. the liquid flowing through the supply flow path is an ultraviolet curable ink or a solvent ink; The liquid jet head according to claim 17.

19. A flow path member having a supply flow path through which a liquid flows, a filter arranged midway along the supply flow path and through which the liquid passes, a fixing member constituting a part of the supply flow path and to which the filter is fixed, and a first member constituting a part of the supply flow path and to which the fixing member is fixed; a nozzle that sprays the liquid that has passed through the supply flow path; a circulation flow path through which the liquid that has passed through the supply flow path but has not been ejected from the nozzle flows, the first member constitutes a part of the circulation flow path, the fixing member is made of a thermoplastic resin, The first member is made of any one of a thermosetting resin, a metal, and a ceramic. Liquid injection head.

20. a circulation flow path through which the liquid that has passed through the supply flow path but has not been ejected from the nozzle flows; The first member constitutes a part of the circulation flow path. The liquid jet head according to claim 17 or 18.

21. The liquid jet head according to any one of claims 17 to 20, a liquid container that stores a liquid to be supplied to the liquid jet head, Liquid injection device.

22. A method for manufacturing a flow path member having a supply flow path through which a liquid flows, a filter that is disposed midway along the supply flow path and through which the liquid passes, a fixing member that constitutes a part of the supply flow path and is made of a thermoplastic resin, and a first member that constitutes a part of the supply flow path and is made of any one of a thermosetting resin, a metal, and a ceramic, the method comprising: After the filter and the fixing member are welded together, the fixing member and the first member are bonded together with an adhesive. A method for manufacturing a flow path member.

23. A method for manufacturing a flow path member having a supply flow path through which a liquid flows, a filter that is disposed midway along the supply flow path and through which the liquid passes, a fixing member that constitutes a part of the supply flow path and is made of a thermoplastic resin, and a first member that constitutes a part of the supply flow path and is made of any one of a thermosetting resin, a metal, and a ceramic, the method comprising: After forming the fixing member by insert molding using the filter as an insert component, the fixing member and the first member are bonded together with an adhesive. A method for manufacturing a flow path member.

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