Resin-sealed electronic substrate and method for manufacturing the same

Abstract

To prevent a short circuit between two terminals of an electronic component on a substrate during the manufacture of a resin-encapsulated electronic substrate.SOLUTION: A short circuit includes an electronic component 20 having two terminals 20a and 20k, a substrate 22 having two lands 32 provided on the first surface 22A and on which two terminals 20a and 20k of the electronic component 20 are respectively mounted, and a through hole 36 formed between the two lands 32, a coating layer 24 made of an insulating resin that covers the first surface 22A of the substrate 22, and a second surface molded body 26 formed from an insulating resin on the second surface 22B side of the substrate 22 opposite to the first surface 22A and formed in a manner to fill the through holes 36.SELECTED DRAWING: Figure 2

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