Substrate, substrate connection structure, and substrate manufacturing method
JP7632183B2Active Publication Date: 2025-02-19IHI CORP
Patent Information
- Application Number
- JP2021138653
- Authority / Receiving Office
- JP · JP
- Patent Type
- Patents
- Current Assignee / Owner
- Filing Date
- 2021-08-27
- Publication Date
- 2025-02-19
- Estimated Expiration
- 2041-08-27
Smart Images
Figure 0007632183000001 
Figure 0007632183000002 
Figure 0007632183000003
Abstract
To secure a conductive route between a terminal inserted into a substrate having a metal plate, and a conductive layer provided to the substrate.SOLUTION: A substrate 1 providing a substrate hole 10h into which a press-fitting terminal 2 is inserted, comprises: a metal plate 11; an isolation layer 12; a substrate part 10 haing a conductive layer 13 provided onto the isolation layer 12; and a conductive part 20 electrically connecting the conductive layer 13 and the metal plate 11. In the metal plate 11, a metal plate hole 11h constructing the substrate hole 10h and holding the press-fitting terminal 2 by its inner surface is provided. The conductive part 20 connects the conductive layer 13 and the metal plate 11 at a position on an outer side of a radial direction of the metal plate hole 11h from an inner surface of the metal plate hole 11h.SELECTED DRAWING: Figure 1
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Citation Information
Patent Citations
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