Sensor inspection device and sensor inspection method

Abstract

To provide a sensor inspection device and a sensor inspection method which improve the output of a sensor.SOLUTION: A sensor inspection device includes: a suction member which sucks a sensor so as to install it over a rigid body portion not distorted by the suction or pressing force and an elastic body portion to be distorted; a bending mechanism for bending the elastic body portion of the suction member; and a measurement part for measuring the output of the sensor bent by the bending of the elastic body portion of the suction member.SELECTED DRAWING: Figure 5

Description

[Technical field]

[0001] The present invention relates to a sensor inspection device and a sensor inspection method for inspecting the output of a sensor. [Background technology]

[0002] Conventionally, various sensor inspection methods for inspecting the output of a sensor have been proposed. After a sensor is manufactured, it needs to be inspected to see if it produces a proper output before being installed in an electronic device. For example, Patent Document 1 discloses a plate-shaped sensor having a first electrode and a second electrode provided on both sides of a polymer piezoelectric film (hereinafter referred to as a piezoelectric film), and an inspection method for the sensor.

[0003] In the inspection method of Patent Document 1, both ends of the bottom surface of the sensor are fixed, and the center of the top surface of the sensor is pressed. This causes the piezoelectric film to bend in the thickness direction, and electric charges are generated in the first and second electrodes of the piezoelectric film. This sensor detects the voltage generated between the first and second electrodes of the piezoelectric film to detect the fact that it has been pressed and the amount of pressure.

[0004] The inspection method of Patent Document 1 detects the voltage output by this sensor, thereby inspecting whether or not the sensor is outputting properly.

[0005] Patent document 2 discloses a sensor inspection method that can inspect the output of a sensor without damaging it by adsorbing the sensor to the surface of an adsorption member and pressing a second area of ​​the surface of the adsorption member other than the first area to which the sensor is adsorbed. [Prior art documents] [Patent documents]

[0006] [Patent Document 1] Japanese Patent Publication No. 5-102458 [Patent Document 2] Patent Publication No. 2017-041501 Summary of the Invention [Problem to be solved by the invention]

[0007] It is desirable to have improved sensor output during testing.

[0008] An object of the present invention is to provide a sensor inspection device and a sensor inspection method that improve the output of a sensor. [Means for solving the problem]

[0009] The sensor inspection device comprises an adsorption member that adsorbs a sensor and places the sensor across a rigid portion that is not distorted by the adsorption or pressure and an elastic portion that is distorted, a bending mechanism that bends the elastic portion of the adsorption member, and a measurement unit that measures the output of the sensor that bends as the elastic portion of the adsorption member bends.

[0010] Since the sensor is disposed across the rigid portion of the suction member that does not warp and the elastic portion that does warp, when the suction member warps in the thickness direction, the entire one side (front principal surface) of the elastic portion stretches with the rigid portion as a fulcrum. Therefore, the sensor inspection device can maximize the output of the sensor for measurement. Effect of the Invention

[0011] The sensor inspection method and the sensor inspection device of the present invention can improve the output of the sensor. [Brief description of the drawings]

[0012] [Figure 1] 1 is a plan view of a piezoelectric sensor 100 inspected by the inspection method of the first embodiment. [Diagram 2] 2 is a cross-sectional view taken along the line AA shown in FIG. 1. [Diagram 3] Fig. 3(A) is an example of a plan view of the piezoelectric film 31 provided in the sensor unit 16 of the piezoelectric sensor 100 shown in Fig. 1. Fig. 3(B) is an example of a plan view of the piezoelectric film 31 provided in the sensor unit 16 of the piezoelectric sensor 100 shown in Fig. 1. [Figure 4] 1 is a plan view of a sensor inspection device 15 used in the inspection method of the first embodiment. [Diagram 5] 5 is a cross-sectional view taken along the line BB shown in FIG. [Figure 6] 5 is a cross-sectional view taken along line BB of FIG. 4, showing a state in which a part of the attraction plate 150 is pressed. [Figure 7] FIG. 7(A) is a perspective view of the sensor inspection device 15 when the piezoelectric sensor 100 is a bending sensor, and FIG. 7(B) is a plan view. [Figure 8] FIG. 8(A) is a perspective view of the sensor inspection device 15 when the piezoelectric sensor 100 is a torsion sensor, and FIG. 8(B) is a plan view. [Figure 9] 9(A) is a see-through perspective view of the cover film 70, FIG. 9(B) is a plan view of the cover film 70, and FIG. 9(C) is a cross-sectional view taken along the line AA shown in FIG. 9(B). [Figure 10] 13 is a plan view of the sensor inspection device 15 when a cover film 70 is attached. FIG. [Figure 11] 11A is a cross-sectional view taken along line AA in FIG. 10, and FIG. 11B is a cross-sectional view taken along line BB in FIG. [Figure 12] 3 is a flowchart of a sensor inspection method according to the first embodiment. [Figure 13] FIG. 13 is a partial cross-sectional view of a case in which a cover film 70 made of an elastic film 71 is used. [Figure 14] 13 is a partial cross-sectional view of a case where the cover film 70 is used upside down. [Figure 15] FIG. 11 is a plan view of a sensor inspection device 15a according to a first modified example. [Figure 16] 16 is a cross-sectional view taken along the line BB shown in FIG. 15. [Figure 17] 13 is a cross-sectional view taken along line BB, showing a state in which suction pump 159 reduces the pressure inside elastic pad 130 through a plurality of suction holes 151 and adsorbs sensor portion 16. FIG. [Figure 18] 16 is a cross-sectional view taken along line BB of FIG. 15, showing a state in which a part of the attraction plate 150 is pressed. [Figure 19] FIG. 13 is a plan view of the sensor inspection device 15a when a cover film 70 is attached. [Figure 20] 20 is a cross-sectional view taken along the line BB shown in FIG. 19. [Figure 21] 13 is a cross-sectional view taken along line BB, showing a state in which suction pump 159 reduces the pressure inside elastic pad 130 through a plurality of suction holes 151 and adsorbs sensor portion 16. FIG. [Figure 22] FIG. 13 is a plan view of sensor inspection device 15b when cover film 70 is attached. [Figure 23] 23 is a cross-sectional view taken along the line BB shown in FIG. 22. [Figure 24] FIG. 13 is a plan view of the sensor inspection device 15c when a cover film 70 is attached. [Diagram 25] 25 is a cross-sectional view taken along the line BB shown in FIG. 24. [Figure 26] FIG. 13 is a plan view of the sensor inspection device 15d when a cover film 70 is attached. [Figure 27] 27 is a cross-sectional view taken along the line BB shown in FIG. 26. [Figure 28] FIG. 13 is a plan view of a sensor inspection device 15e according to a fifth modified example. [Figure 29] 29 is a cross-sectional view taken along the line BB shown in FIG. 28. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] [First embodiment] Hereinafter, an inspection method according to a first embodiment of the present invention will be described. First, a piezoelectric sensor to be inspected by the inspection method according to the present embodiment will be described.

[0014] Fig. 1 is a plan view of a piezoelectric sensor 100 inspected by the inspection method of the first embodiment. Fig. 2 is a cross-sectional view of the line AA shown in Fig. 1. Fig. 3(A) is an example of a plan view of a piezoelectric film 31 provided in the sensor unit 16 of the piezoelectric sensor 100 shown in Fig. 1. Fig. 3(B) is an example of a plan view of a piezoelectric film 31 provided in the sensor unit 16 of the piezoelectric sensor 100 shown in Fig. 1.

[0015] As shown in Fig. 1, the piezoelectric sensor 100 includes a sensor unit 16, a component mounting unit 38, and a circuit component 39. The component mounting unit 38 is a part of a flexible printed circuit board 30. As shown in Figs. 1 and 2, the flexible printed circuit board 30 is made up of a board unit 36, a board unit 37, and the component mounting unit 38. The material of the flexible printed circuit board 30 is a resin such as polyimide.

[0016] A first terminal 32 and a second terminal 33, which are conductor patterns, are formed on the front main surface of the component mounting portion 38. Furthermore, a circuit component 39 and an output terminal 390 are mounted on the front main surface of the component mounting portion 38.

[0017] 1 and 2, a first end of the first terminal 32 is connected to a first detection electrode 34. Meanwhile, a second end of the first terminal 32 is connected to a circuit component 39. Furthermore, a first end of the second terminal 33 is connected to a second detection electrode 35. Meanwhile, a second end of the second terminal 33 is connected to the circuit component 39.

[0018] 1 and 2, the circuit component 39 is connected to the first detection electrode 34 and the second detection electrode 35 via the first terminal 32 and the second terminal 33. In addition, the circuit component 39 is connected to an output terminal 390.

[0019] As shown in FIG. 2, the sensor unit 16 includes a piezoelectric film 31, an adhesive layer 91, an adhesive layer 92, a first detection electrode 34, a second detection electrode 35, a substrate unit 36, and a substrate unit 37.

[0020] 2, the first detection electrode 34, the second detection electrode 35, the piezoelectric film 31, the substrate portion 36, and the substrate portion 37 are each flat and have a front principal surface and a back principal surface that face each other in the thickness direction. Note that the upper surface in FIG. 2 is referred to as the front principal surface, and the lower surface is referred to as the back principal surface.

[0021] As shown in FIG. 2, the substrate portion 37, the second detection electrode 35, the adhesive layer 91, the piezoelectric film 31, the adhesive layer 92, the first detection electrode 34, and the substrate portion 36 are laminated in this order from the front main surface side to the back main surface side.

[0022] Specifically, the second detection electrode 35 is laminated on the front principal surface of the piezoelectric film 31 via an adhesive layer 91, and a substrate portion 37 is further laminated on the front principal surface of the second detection electrode 35. The first detection electrode 34 is laminated on the rear principal surface of the piezoelectric film 31 via an adhesive layer 92, and a substrate portion 36 is further laminated on the rear principal surface of the first detection electrode 34.

[0023] The second detection electrode 35, the first detection electrode 34, the piezoelectric film 31, the substrate portion 37, and the substrate portion 36 each have a generally rectangular outer shape in a plan view. The outer shapes of the substrate portion 37 and the substrate portion 36 are slightly larger than the outer shape of the piezoelectric film 31.

[0024] A second detection electrode 35 is formed on the rear main surface of the substrate portion 37, and a first detection electrode 34 is formed on the front main surface of the substrate portion 36. Then, as shown in Fig. 2, a piezoelectric film 31 is attached to the front main surface of the first detection electrode 34 with an adhesive layer 92. Also, a piezoelectric film 31 is attached to the rear main surface of the second detection electrode 35 with an adhesive layer 91.

[0025] The adhesive layer 91 and the adhesive layer 92 are made of, for example, an acrylic adhesive.

[0026] Next, the configuration of the piezoelectric film 31 will be described in detail.

[0027] When the piezoelectric sensor 100 is used as a bending sensor, the piezoelectric film 31 has its molecules oriented in a direction 19 that forms an angle of approximately 45° with respect to the long and short sides, as shown in Fig. 3(A). When the piezoelectric sensor 100 is used as a torsion sensor, the piezoelectric film 31 has its molecules oriented in a direction 191 that is parallel to the long or short sides, as shown in Fig. 3(B). The piezoelectric film 31 is a film whose main material is a chiral polymer such as polylactic acid. The polylactic acid may be either L-type polylactic acid (PLLA) or D-type polylactic acid (PDLA).

[0028] Polylactic acid is a chiral polymer with a helical main chain, and has the property of exhibiting piezoelectricity when oriented in a specific axial direction. This piezoelectricity is expressed by the piezoelectric tensor component d14, with the thickness direction of the film as the first axis and the direction in which the polylactic acid molecules are oriented as the third axis.

[0029] In the piezoelectric film 31, if the direction in which the molecules of polylactic acid are oriented is set to a direction intersecting the long and short sides, polarization occurs due to expansion and contraction in the long or short side direction. For example, in Fig. 3(A), by setting the direction in which the molecules of polylactic acid are oriented to be approximately 45° from the long and short sides, polarization occurs due to expansion and contraction in the long or short side direction, and an output appears when the piezoelectric sensor 100 is bent.

[0030] If the piezoelectric film 31 is arranged so that the orientation direction of the polylactic acid molecules coincides with the long and short sides, polarization occurs due to expansion and contraction in a direction intersecting the long or short side. For example, in Fig. 3(B), by setting the direction of approximately 0° with respect to the long side to the direction in which the polylactic acid molecules are oriented, polarization occurs due to expansion and contraction in a direction intersecting the long or short side, and an output appears when the piezoelectric sensor 100 is twisted.

[0031] However, the angle of direction 19 in piezoelectric film 31 is not limited to an exact 45° or 0° with respect to the long and short sides, but may be any angle close to 45° or 0°. The closer the angle of direction 19 is to 45° or 0° with respect to the long and short sides, the more efficiently bending or twisting forces can be detected.

[0032] Therefore, in the present invention, "approximately 45°" refers to an angle in a predetermined range with 45° as the center, for example, about 45°±10°. "Approximately 0°" refers to an angle in a predetermined range with 0° as the center, for example, about 0°±10°. These specific angles may be appropriately determined according to the overall design based on the application of the displacement sensor and the characteristics of each part.

[0033] The piezoelectric film 31 may be a film mainly made of polyvinylidene fluoride (PVDF). However, the piezoelectricity of the piezoelectric film 31 mainly made of chiral polymer such as PLLA or PDLA is not expressed by ion polarization like ferroelectrics such as PVDF or PZT, but is derived from the helical structure, which is a characteristic structure of molecules.

[0034] Therefore, chiral polymers do not require poling treatment to develop piezoelectricity, as is the case with other polymers such as PVDF, or piezoelectric ceramics using piezoelectric crystal thin films. Furthermore, while the piezoelectric constant of PVDF and other materials varies over time and in some cases may decrease significantly, the piezoelectric constant of chiral polymers is extremely stable over time.

[0035] Furthermore, chiral polymers do not exhibit pyroelectricity, which occurs in other ferroelectric piezoelectric materials, and therefore, the piezoelectric film 31 made mainly of chiral polymers can obtain a detection voltage that corresponds only to the bending or twisting force, without depending on the temperature at the detection position, when detecting bending or twisting.

[0036] In addition, chiral polymers are polymers and have flexibility, so unlike piezoelectric ceramics, they are not damaged by large displacements. Therefore, piezoelectric film 31, which is mainly made of chiral polymers, is not damaged even if the displacement is large, and can reliably detect the displacement.

[0037] After being manufactured, the above piezoelectric sensor 100 must be inspected before being installed in an electronic device to determine whether it outputs a proper voltage when pressed (i.e., whether it is a good product or a defective product). If the piezoelectric sensor 100 outputs a proper voltage when pressed, the piezoelectric sensor 100 can be determined to be a good product.

[0038] The following describes a method for inspecting the piezoelectric sensor 100. The method for inspecting the piezoelectric sensor 100 uses a sensor inspection device 15.

[0039] Fig. 4 is a plan view of a sensor inspection device 15 used in the inspection method of the first embodiment. Fig. 5 is a cross-sectional view taken along line BB shown in Fig. 4.

[0040] 4 and 5, the sensor unit 16 of the piezoelectric sensor 100 is set in the sensor inspection device 15. Specifically, the sensor unit 16 of the piezoelectric sensor 100 is placed on an adsorption plate 150, and the output terminal 390 of the piezoelectric sensor 100 is connected to the measurement unit 158 ​​of the sensor inspection device 15.

[0041] 4 and 5, the sensor inspection device 15 includes a piezoelectric actuator 120, an adsorption plate 150, a housing 152, a suction pump 159, and a measurement unit 158. The adsorption plate 150 is an example of an adsorption member of the present invention. The piezoelectric actuator 120 is an example of a bending mechanism of the present invention.

[0042] Housing 152 has a rectangular parallelepiped shape with an open top surface. As shown in Figures 4 and 5, suction plate 150 is placed on housing 152 so as to cover the open surface of housing 152. Housing 152 is made of a material such as aluminum.

[0043] The suction plate 150 has a plurality of suction holes 151. The material of the suction plate 150 is, for example, SUS (stainless steel). The suction plate 150 forms a vacuum chamber 155 together with a housing 152. An air hole (not shown) is provided on the side of the housing 152. The vacuum chamber 155 is connected to a suction hole of a suction pump 159 via the air hole.

[0044] Next, the sensor inspection device 15 drives the suction pump 159 in a state in which the sensor portion 16 of the piezoelectric sensor 100 is placed so as to block the multiple suction holes 151. As a result, the vacuum chamber 155 is depressurized by the suction pump 159. This causes the sensor portion 16 to be sucked into the multiple suction holes 151 and adsorbed to the suction plate 150. At this time, even if the sensor portion 16 is warped in the thickness direction, it will have a flat shape because it is adsorbed to the suction plate 150.

[0045] Fig. 6 is a cross-sectional view taken along line BB, showing a state in which a part of the suction plate 150 shown in Fig. 4 is pressed. Note that in Fig. 6, in order to explain a state in which the sensor unit 16 and the suction plate 150 are bent, the bending of these is emphasized.

[0046] As shown in Fig. 6, the sensor inspection device 15 presses a second region of the surface of the suction plate 150 other than the first region to which the sensor unit 16 is suctioned, with the tip 121 of the piezoelectric actuator 120. This causes the suction plate 150 to bend in the thickness direction. The suction plate 150 has contracting and expanding portions on either side of a neutral plane 80 that does not expand or contract (where no stress is generated). The tip 121 of the piezoelectric actuator 120 may be vibrated. In this case, the suction plate 150 vibrates in the thickness direction.

[0047] Here, when the suction plate 150 bends in the thickness direction, the sensor unit 16 also bends in the thickness direction. That is, a detection voltage having a voltage value according to the magnitude of the pressing force (the amount of expansion of the piezoelectric film 31) is generated between the first detection electrode 34 and the second detection electrode 35, with a voltage polarity according to the direction of the pressing force. This detection voltage is input to the circuit component 39 via the first terminal 32 and the second terminal 33 as a pressing detection signal (see FIG. 1). The measurement unit 158 ​​of the sensor inspection device 15 measures the detection voltage from the output terminal 390 of the circuit component 39.

[0048] Therefore, the inspection method of the present embodiment can measure the output of the sensor portion 16 without pressing the sensor portion 16. Therefore, the inspection method of the present embodiment can inspect the output of the piezoelectric sensor 100 without damaging it.

[0049] Even if the sensor unit 16 is warped in the thickness direction, it will have a flat shape because it is adsorbed to the adsorption plate 150. Therefore, the inspection method of the present embodiment can measure the output of the sensor unit 16 regardless of individual differences of the sensor unit 16.

[0050] The sensor unit 16 is disposed on the adsorption plate 150, which is an adsorption member, across a rigid portion 60 where the sensor unit 16 does not distort when adsorbed or pressed, and an elastic portion 61 where the sensor unit 16 distorts. In other words, the sensor unit 16 is cantilever-supported with the end in the long side direction as a fulcrum.

[0051] If the sensor unit 16 were entirely arranged overlapping the elastic body portion 61 in plan view, the piezoelectric film 31 would have some portions that expand and some portions that contract when the suction plate 150 is pressed, resulting in a small output. However, in the piezoelectric film 31 of the sensor unit 16 of this embodiment, when the suction plate 150 is pressed and bent in the thickness direction, the rigid body portion 60 is used as a fulcrum and all of one surface (front main surface) of the elastic body portion 61 is stretched. As shown in FIG. 6, the one surface (front main surface) of the suction plate 150 that suctions the sensor unit 16 is on the Z direction side of the neutral plane 80 of stress and is entirely stretched. Therefore, the piezoelectric film 31 is also stretched on one surface. This allows the sensor inspection device 15 to maximize and measure the output of the sensor unit 16.

[0052] In the example of Figures 5 and 6, the portion of the suction plate 150 that contacts and overlaps with the housing 152 when viewed in a plan view is the rigid portion 60, and the portion that is not in contact with the housing 152 is the elastic portion 61, but by giving high strength to a portion of the suction plate 150, the portion that is not in contact with the housing 152 can also be made into the rigid portion 60.

[0053] As described above, the piezoelectric sensor 100 can be used as a bending sensor that is polarized by expansion and contraction along the long side direction, or as a twisting sensor that is polarized by expansion and contraction in a direction intersecting the long side direction or the short side direction. The sensor inspection device 15 of this embodiment can measure the output whether the piezoelectric sensor 100 is a bending sensor or a twisting sensor.

[0054] Fig. 7(A) is a perspective view of the sensor inspection device 15 when the piezoelectric sensor 100 is a bending sensor, and Fig. 7(B) is a plan view. When the piezoelectric sensor 100 is a bending sensor, the piezoelectric actuator 120 presses the elastic part 61 on the central axis of the sensor part 16. When the piezoelectric actuator 120 presses the elastic part 61 on the central axis of the sensor part 16, the amount of extension in the direction along the long side of the sensor part 16 increases. Therefore, the output of the piezoelectric sensor 100, which is a bending sensor, can be increased.

[0055] On the other hand, Fig. 8(A) is a perspective view of the sensor inspection device 15 when the piezoelectric sensor 100 is a torsion sensor, and Fig. 8(B) is a plan view. When the piezoelectric sensor 100 is a torsion sensor, the piezoelectric actuator 120 presses the side of the elastic body portion 61 of the sensor portion 16 that is off the central axis of the sensor portion 16. When the piezoelectric actuator 120 presses the side of the elastic body portion 61 of the sensor portion 16 that is off the central axis of the sensor portion 16, the amount of extension in the directions intersecting the long and short sides of the sensor portion 16 increases. Therefore, the output of the piezoelectric sensor 100, which is a torsion sensor, can be increased.

[0056] In this way, the sensor inspection device 15 of this embodiment can maximize the output of the sensor section 16 and measure it at the optimal pressing position depending on the mode of the piezoelectric sensor 100 (whether it is a bending sensor or a twisting sensor).

[0057] Next, the sensor inspection device 15 in the case where a cover film 70 is used will be described. Fig. 9(A) is a see-through perspective view of the cover film 70, Fig. 9(B) is a plan view of the cover film 70, and Fig. 9(C) is a cross-sectional view taken along line AA in Fig. 9(B). Fig. 10 is a plan view of the sensor inspection device 15 in the case where the cover film 70 is attached. Fig. 11(A) is a cross-sectional view taken along line AA in Fig. 10. Fig. 11(B) is a cross-sectional view taken along line BB in Fig. 10. Fig. 12 is a flowchart of the sensor inspection method according to the first embodiment.

[0058] The sensor inspection device 15 according to this example further includes a suction pump 159A. The housing 152 forms independent vacuum chambers 155 and 155A. The suction pump 159 reduces the pressure in the vacuum chamber 155 that overlaps with the position where the sensor unit 16 is placed in a plan view. The suction pump 159A reduces the pressure in the vacuum chamber 155A that overlaps with the outer periphery of the position where the sensor unit 16 is placed.

[0059] The cover film 70 has an elastic film 71 and a rigid film 72. The rigid film 72 has a rectangular parallelepiped shape with openings on the top and bottom in a plan view. A flat elastic film 71 is attached to the rigid film 72 so as to cover the opening on the top. The area of ​​the elastic film 71 in a plan view and the area of ​​the rigid film 72 in a plan view are approximately the same. A space corresponding to the opening of the rigid film 72 is formed in the cover film 70.

[0060] The elastic film 71 and the rigid film 72 may be made of the same material (for example, PET: polyethylene terephthalate), or may be made of different materials.

[0061] When inspecting the piezoelectric sensor 100, the cover film 70 is placed over the sensor portion 16 so as to house and cover the sensor portion 16 within the space. As shown in Fig. 12, when inspecting, first, the sensor portion 16 of the piezoelectric sensor 100 is placed on the adsorption plate 150, and the output terminal 390 of the piezoelectric sensor 100 is connected to the measurement portion 158 of the sensor inspection device 15 (S11).

[0062] Next, the suction pump 159 reduces the pressure in the vacuum chamber 155 through the multiple suction holes 151, and suctions the sensor portion 16 (S12). As a result, the sensor portion 16 is suctioned and temporarily fixed to the suction plate 150.

[0063] Then, the worker places the cover film 70 on the upper surface of the suction plate 150 so as to cover the sensor unit 16 (S13). Since the shape of the cover film 70 is fixed by the rigid film 72, the worker can easily align the position of the cover film 70 so as to cover the sensor unit 16.

[0064] Next, the suction pump 159A reduces the pressure in the vacuum chamber 155A and adsorbs the cover film 70 (S14). Then, the sensor inspection device 15 presses the elastic portion 61 on the upper surface of the adsorption plate 150 with the piezoelectric actuator 120 (S15) and performs measurement (S16).

[0065] The cover film 70 is made up of a rigid film 72 that is in contact with the suction plate 150 and is arranged on the outer periphery of the cover film 70 in a plan view, and an elastic film 71 that covers the upper surface of the rigid film 72. Therefore, when the cover film 70 is placed over the sensor unit 16, a space 75 is generated between the rigid film 72 and the sensor unit 16 in a cross-sectional view, as shown in Fig. 11(B). The space 75 communicates with the vacuum chamber 155A via the suction hole 151A.

[0066] The suction hole includes suction hole 151 that overlaps with sensor portion 16 in plan view and suctions sensor portion 16, and suction hole 151A that overlaps with space 75 in plan view. Therefore, when suction pump 159A reduces the pressure in vacuum chamber 155A, space 75 is also reduced in pressure. This allows sensor inspection device 15 to suction cover film 70 to suction plate 150.

[0067] If the sensor section 16 has a large localized warp, there is a possibility that the sensor section 16 cannot be uniformly attracted to the suction plate 150 by the suction holes 151 alone. However, the elastic film 71 of the cover film 70 overlaps the sensor section 16 in a plan view and uniformly covers the sensor section 16, so that the entire upper surface of the sensor section 16 is pressed against the suction plate 150 by the reduced pressure in the space 75. Therefore, the sensor section 16 is uniformly held on the upper surface of the suction plate 150. Therefore, the sensor inspection device 15 can perform accurate measurement. In addition, the cover film 70 is made of the elastic film 71 and the rigid film 72, and the rigid film 72 maintains its shape, so that the sensor section 16 can be pressed more uniformly.

[0068] However, it is not essential that the cover film 70 includes the rigid film 72. Fig. 13 is a partial cross-sectional view of a case where a cover film 70 made of an elastic film 71 is used. In this case as well, a space 75 is generated between the elastic film 71 and the sensor unit 16 in cross-sectional view. Therefore, when the suction pump 159A reduces the pressure in the vacuum chamber 155A, the space 75 is also reduced in pressure. Therefore, as shown in Fig. 13, even if there is no rigid film 72, the sensor inspection device 15 can uniformly press the sensor unit 16 against the suction plate 150.

[0069] 14, even when the cover film 70 is used upside down, the sensor inspection device 15 can press the sensor unit 16 evenly against the adsorption plate 150. FIG. 14 is a partial cross-sectional view of the cover film 70 used upside down. In this case, a space 75 is generated between the elastic film 71 and the sensor unit 16 in cross-sectional view. Therefore, when the suction pump 159A reduces the pressure in the vacuum chamber 155A, the space 75 is also reduced in pressure. Therefore, even when the cover film 70 is turned upside down, as shown in FIG. 14, the sensor inspection device 15 can press the sensor unit 16 evenly against the adsorption plate 150. Even when the cover film 70 is turned upside down, the cover film 70 is fixed in shape by the rigid film 72, so that the operator can easily align the position of the cover film 70 so that the cover film 70 covers the sensor unit 16.

[0070] In addition, in the sensor inspection device 15 shown in Figures 10 to 14, a portion of the sensor section 16 may be arranged on the suction plate 150 across the rigid portion 60 and the elastic portion 61, as shown in Figures 4 and 5.

[0071] [First Modification] A sensor inspection device 15a according to a first modified example of the present invention will be described below. Note that, for the sensor inspection device 15a according to the first modified example, only the parts different from the sensor inspection device 15 according to the first embodiment will be described, and the rest will be omitted. Note that the suction hole 151 is an example of the first suction hole of the present invention. Also, the suction hole 151A is an example of the second suction hole of the present invention.

[0072] Fig. 15 is a plan view of a sensor inspection device 15a according to a first modified example. Fig. 16 is a cross-sectional view taken along line BB shown in Fig. 15. Fig. 17 is a cross-sectional view taken along line BB showing a state in which a suction pump 159 reduces the pressure inside the elastic pad 130 through a plurality of suction holes 151 and suctions the sensor unit 16.

[0073] The sensor inspection device 15a differs from the sensor inspection device 15 in that it further includes an elastic pad 130. In this modification, there is one elastic pad 130. In this modification, the suction hole of the suction pump 159 is an example of the second suction hole of the present invention.

[0074] The elastic pad 130 overlaps with the multiple suction holes 151 in plan view as shown in Fig. 15. Moreover, the elastic pad 130 is attached to the lower surface of the suction plate 150 as shown in Fig. 16. That is, the elastic pad 130 is provided in a vacuum chamber 155. The elastic pad 130 is an elastic member. Therefore, the elastic pad 130 is elastically deformed.

[0075] 16, the elastic pad 130 has a suction hole 131. In this modification, the suction hole 131 is an example of a first suction hole of the present invention. The suction hole 131 is connected to a plurality of adsorption holes 151.

[0076] 17, the suction hole 131 is connected to a suction hole of the suction pump 159 via a part of the housing 152 (for example, a hole provided on the bottom surface of the housing 152 as shown in FIG. 17). At this time, the elastic pad 130 forms a vacuum chamber 155B independent from the vacuum chamber 155.

[0077] Next, the sensor inspection device 15a drives the suction pump 159 in a state in which the sensor portion 16 of the piezoelectric sensor 100 is placed so as to block the multiple suction holes 151. As a result, the vacuum chamber 155B is depressurized by the suction pump 159. As a result, the sensor portion 16 is sucked into the multiple suction holes 151 and adsorbed to the suction plate 150. At this time, even if the sensor portion 16 is warped in the thickness direction, it will have a flat shape because it is adsorbed to the suction plate 150.

[0078] Fig. 18 is a cross-sectional view taken along line BB, showing a state in which a part of the suction plate 150 shown in Fig. 15 is pressed. In Fig. 18, the deflection of the sensor unit 16, the suction plate 150, and the elastic pad 130 is emphasized in order to explain the state in which these deflections occur.

[0079] 18, the sensor inspection device 15a presses a second area of ​​the surface of the suction plate 150 other than the first area to which the sensor unit 16 is suctioned, with the tip 121 of the piezo actuator 120. When the suction plate 150 bends in the thickness direction, the sensor unit 16 and the elastic pad 130 also bend in the thickness direction. At this time, the elastic pad 130 is elastically deformed.

[0080] Next, the sensor inspection device 15a in the case where the cover film 70 is used will be described. Fig. 19 is a plan view of the sensor inspection device 15a in the case where the cover film 70 is attached. Fig. 20 is a cross-sectional view taken along the line BB shown in Fig. 19. Fig. 21 is a cross-sectional view taken along the line BB showing a state in which the suction pump 159 reduces the pressure inside the elastic pad 130 through the multiple suction holes 151 and adsorbs the sensor unit 16.

[0081] The sensor inspection device 15a according to this example further includes a suction pump 159A as shown in Fig. 19. The elastic pad 130 is attached to the lower surface of the suction plate 150 as shown in Fig. 20. Also, the suction hole 131 is connected to a plurality of suction holes 151. In this modification, the suction hole 131 is not connected to the suction hole 151A.

[0082] Elastic pad 130 forms an independent vacuum chamber 155B. As a result, in this modification, housing 152 does not form vacuum chamber 155A as shown in Fig. 20. Therefore, in this modification, housing 152 forms only vacuum chamber 155 as shown in Fig. 20. In this modification, housing 152 and elastic pad 130 form independent vacuum chambers 155 and 155B, respectively, as shown in Fig. 21.

[0083] 21, the suction pump 159 reduces the pressure in the vacuum chamber 155B that overlaps with the position where the sensor unit 16 is placed in a plan view, without going through the vacuum chamber 155. The suction pump 159A reduces the pressure in the vacuum chamber 155. When the suction pump 159A reduces the pressure in the vacuum chamber 155, the space 75 is also reduced in pressure. This allows the sensor inspection device 15a to adsorb the cover film 70 to the adsorption plate 150.

[0084] According to the sensor inspection device 15a, the output of the sensor can be further improved. More specifically, the elastic pad 130 has a suction hole 131. Moreover, the suction hole 131 is connected to the suction hole 151. Moreover, the suction hole 131 is connected to the suction hole of the suction pump 159. That is, the elastic pad 130 forms an independent vacuum chamber 155B. This eliminates the need for the housing 152 to form the vacuum chamber 155A. Therefore, the housing 152 does not need to have a portion that separates the vacuum chamber 155 and the vacuum chamber 155A. Moreover, since the elastic pad 130 is easily flexible, it does not hinder the flexibility of the suction plate 150. This allows the suction plate 150 to flex more in the thickness direction. As a result, the suction plate 150 of the sensor inspection device 15a can flex more in the thickness direction than the suction plate 150 of the sensor inspection device 15. As a result, according to the sensor inspection device 15a, the output of the sensor can be further improved.

[0085] [Second modified example] The following describes a sensor inspection device 15b according to a second modified example of the present invention. Note that, for the sensor inspection device 15b according to the second modified example, only the differences from the sensor inspection device 15a according to the first modified example will be described, and the rest will be omitted.

[0086] Fig. 22 is a plan view of sensor inspection device 15b when attaching cover film 70. Fig. 23 is a cross-sectional view taken along line BB shown in Fig. 22.

[0087] The sensor inspection device 15a differs from the sensor inspection device 15 in that the suction hole 131 is connected to a plurality of adsorption holes 151A. In this modification, the number of elastic pads 130 is two.

[0088] Each of the two elastic pads 130 overlaps with a plurality of suction holes 151A in plan view as shown in Fig. 22. Each of the two elastic pads 130 is attached to the lower surface of the suction plate 150 as shown in Fig. 23.

[0089] Each of the two elastic pads 130 has a suction hole 131 as shown in Fig. 23. The suction hole 131 is connected to a plurality of suction holes 151A. In this modification, the suction hole 131 is not connected to the suction hole 151.

[0090] The suction hole 131 is connected to a suction hole of a suction pump 159A (not shown) through an air hole (not shown) of the housing 152. At this time, each of the two elastic pads 130 forms a vacuum chamber 155B independent from the vacuum chamber 155.

[0091] A suction pump 159 (not shown) reduces the pressure in the vacuum chamber 155. A suction pump 159A (not shown) reduces the pressure in the vacuum chamber 155B without passing through the vacuum chamber 155A.

[0092] The sensor inspection device 15b as described above also provides the same effects as the sensor inspection device 15a.

[0093] [Third modified example] The following describes a sensor inspection device 15c according to a third modified example of the present invention. Note that, for the sensor inspection device 15c according to the third modified example, only the differences from the sensor inspection device 15a according to the first modified example will be described, and the rest will be omitted.

[0094] Fig. 24 is a plan view of the sensor inspection device 15c when attaching the cover film 70. Fig. 25 is a cross-sectional view taken along the line BB shown in Fig. 24.

[0095] The sensor inspection device 15b differs from the sensor inspection device 15a in that the sensor inspection device 15b further includes an elastic pad 132 in which the suction hole 133 is connected to a plurality of suction holes 151A. In this modification, the number of elastic pads 130 is one. In addition, the number of elastic pads 132 is one. In this modification, the elastic pad 130 is an example of the first elastic pad of the present invention. In addition, the elastic pad 132 is an example of the second elastic pad of the present invention. In addition, the suction hole 131 is an example of the third suction hole of the present invention. In addition, the suction pump 159 is an example of the first suction pump of the present invention. In addition, the suction pump 159A is an example of the second suction pump of the present invention. In addition, the suction hole of the suction pump 159 is an example of the fifth suction hole of the present invention. In addition, the suction hole of the suction pump 159A is an example of the sixth suction hole of the present invention.

[0096] The elastic pad 132 overlaps with the plurality of suction holes 151A in plan view as shown in Fig. 24. Moreover, the elastic pad 132 is attached to the lower surface of the suction plate 150 as shown in Fig. 25.

[0097] 25, the elastic pad 132 has a suction hole 133. The suction hole 133 is an example of a fourth suction hole of the present invention. The suction hole 133 is connected to a plurality of adsorption holes 151A.

[0098] The suction hole 131 is connected to a suction hole of a suction pump 159 (not shown) through an air hole (not shown) of the housing 152. At this time, the elastic pad 130 forms a vacuum chamber 155B independent from the vacuum chamber 155 and the vacuum chamber 155C. In addition, the suction hole 133 is connected to a suction hole of a suction pump 159A (not shown) through an air hole (not shown) of the housing 152. At this time, the elastic pad 132 forms a vacuum chamber 155C independent from the vacuum chamber 155B.

[0099] Suction pump 159 (not shown) reduces the pressure in vacuum chamber 155B without going through vacuum chamber 155. Suction pump 159A (not shown) reduces the pressure in vacuum chamber 155 and vacuum chamber 155C.

[0100] The sensor inspection device 15c as described above also provides the same effects as the sensor inspection device 15a.

[0101] [Fourth Variation] The following describes a sensor inspection device 15d according to a fourth modified example of the present invention. Note that, regarding the sensor inspection device 15d according to the fourth modified example, only the parts that are different from the sensor inspection device 15c according to the third modified example will be described, and the rest will be omitted.

[0102] Fig. 26 is a plan view of sensor inspection device 15d when attaching cover film 70. Fig. 27 is a cross-sectional view taken along line BB shown in Fig. 26.

[0103] Sensor inspection device 15c differs from sensor inspection device 15c in that sensor inspection device 15c includes two elastic pads 132 in which suction holes 133 are connected to a plurality of adsorption holes 151A.

[0104] Each of the two elastic pads 132 overlaps with a plurality of suction holes 151A in plan view as shown in Fig. 26. Moreover, the two elastic pads 132 are attached to the lower surface of the suction plate 150 as shown in Fig. 27.

[0105] 25, each of the two elastic pads 132 has a suction hole 133. The suction hole 133 is connected to a plurality of suction holes 151A. Thus, in this modification, all of the suction holes 151A are connected to the suction hole 133. Here, the elastic pad 130 forms a vacuum chamber 155B independent from the vacuum chamber 155. Each of the two elastic pads 132 forms a vacuum chamber 155C independent from the vacuum chamber 155B.

[0106] Suction pump 159 (not shown) reduces the pressure in vacuum chamber 155B without going through vacuum chamber 155. Suction pump 159A (not shown) reduces the pressure in vacuum chamber 155C without going through vacuum chamber 155.

[0107] The sensor inspection device 15d as described above also provides the same effects as the sensor inspection device 15c.

[0108] [Fifth Variation] The following describes a sensor inspection device 15b according to a fifth modified example of the present invention. Regarding the sensor inspection device 15e according to the fifth modified example, only the differences from the sensor inspection device 15a according to the first modified example will be described, and the rest will be omitted.

[0109] Fig. 28 is a plan view of a sensor inspection device 15e according to the fifth modified example, and Fig. 29 is a cross-sectional view taken along line BB shown in Fig. 28.

[0110] Sensor inspection device 15e differs from sensor inspection device 15a in that elastic pad 130 is fixed to housing 152 by sealing.

[0111] In this modification, the ventilation holes (not shown) of the housing 152 are provided on the bottom surface of the housing 152.

[0112] As shown in Fig. 29, the sensor inspection device 15e further includes a seal member 135. The seal member 135 fixes the elastic pad 130 to the housing 152. The seal member 135 is, for example, an O-ring. That is, in this modification, the shape of the seal member 135 is cylindrical. The axial direction of the cylinder is the Z-axis direction. The seal member 135 is provided on the inner bottom surface of the housing 152.

[0113] The suction hole 131 is connected to a suction hole of a suction pump 159 via a sealing member 135 and an air hole (not shown) of the housing 152 .

[0114] The sensor inspection device 15e as described above also has the same effects as the sensor inspection device 15a. Moreover, the sensor inspection device 15e can fix the elastic pad 130 to the housing 152. Moreover, the sensor inspection device 15e can efficiently reduce the pressure in the vacuum chamber 155B. More specifically, the seal member 135 fixes the vacuum chamber 155B to the housing 152. This can improve the airtightness of the vacuum chamber 155B. As a result, the sensor inspection device 15e can efficiently reduce the pressure in the vacuum chamber 155B.

[0115] In the above embodiment and modified example, the planar shape of the piezoelectric film 31 is rectangular, but is not limited thereto. The planar shape of the piezoelectric film 31 may be other planar shapes such as a square, a circle, a trapezoid, a parallelogram, a polygon having more than a square, an ellipse, an oval, etc. In addition, the cover film 70 may be appropriately adjusted according to the shape of the piezoelectric film 31.

[0116] In the above embodiment and modified example, the material of the adsorption plate 150 is SUS (stainless steel), but this is not limited thereto. The material of the adsorption plate 150 may be, for example, a glass plate.

[0117] In addition, in the above embodiment and the above modified example, the sensor inspection device 15 inspects the piezoelectric sensor 100, but this is not limited to this. The sensor inspection device 15 may inspect other sensors, such as an acceleration sensor.

[0118] In addition, in the above embodiment and the above modified example, the piezoelectric actuator 120 is used as the pressing mechanism, but the present invention is not limited to this. The sensor inspection device 15 may use an electric actuator driven by a motor as the pressing mechanism. However, the amount of pressing of the piezoelectric actuator 120 can be set more precisely than that of an electric actuator. The piezoelectric actuator 120 is driven by the piezoelectric effect. Therefore, the amount of pressing of the piezoelectric actuator 120 can be set much more precisely than that of an electric actuator by changing the voltage applied to the piezoelectric element.

[0119] Finally, the above-mentioned embodiment and the above-mentioned modified examples are illustrative in all respects and should not be considered as limiting. For example, the configurations of the sensor inspection devices 15, 15a to 15e may be arbitrarily combined. The scope of the present invention is indicated by the claims, not by the above-mentioned embodiment and the above-mentioned modified examples. Furthermore, the scope of the present invention is intended to include all modifications within the meaning and scope of the claims.

[0120] The number of elastic pads 130 is not limited to one or two. For example, the elastic pads 130 may be provided in correspondence with the plurality of suction holes 151, respectively.

[0121] The number of elastic pads 132 is not limited to one or two. For example, the elastic pads 132 may be provided in correspondence with the plurality of suction holes 151A, respectively.

[0122] The elastic pad 132 may be fixed to the housing 152 with a seal. Each of the elastic pad 130 and the elastic pad 132 may be fixed to the housing 152 with a seal. [Explanation of symbols]

[0123] 15, 15a, 15b, 15c, 15d, 15e...Sensor inspection device 16…Sensor section 30...Flexible printed circuit board 31...Piezoelectric film 32...1st terminal 33…Second terminal 34...First detection electrode 35...Second detection electrode 36, 37…Board section 38…Component mounting section 39...Circuit components 60…Rigid part 61...Elastic part 70…Cover film 71...Elastic film 72...Rigid film 75…space 91, 92...Adhesive layer 100...Piezoelectric sensor 120...Piezo actuator 121...Tip 150...Adsorption plate 151,151A…Adsorption hole 152…Housing 155,155A…Vacuum chamber 158…Measurement section 159, 159A…Suction pump 390...Output terminal

Claims

1. A housing having an open top; an adsorption member that covers the opening of the housing and adsorbs the flat membrane-shaped sensor when the sensor is placed on the housing, the adsorption member placing the sensor across a rigid portion that is not distorted by the adsorption or pressure and an elastic portion that is distorted; a bending mechanism for bending the elastic portion of the attraction member; a measurement unit that is located outside the housing and measures an output of the sensor that is deflected when the elastic portion of the attraction member is deflected; a connection portion that electrically connects the measurement portion to an output terminal of the sensor; Equipped with the connection portion being located within the housing and within the rigid portion; Sensor inspection equipment.

2. One end of the sensor in the longitudinal direction is disposed on the rigid portion, and the other end is disposed on the elastic portion. The sensor inspection device of claim 1 .

3. The deflection mechanism presses a second area of ​​the surface of the attraction member other than a first area to which the sensor is attracted, The position of the second region is on the central axis of the sensor when the sensor is a bending sensor, and is on the side of the sensor when the sensor is a torsion sensor. The sensor inspection device according to claim 1 or 2.

4. the suction member has a suction hole on an outer periphery of the sensor in a plan view, A cover film for covering the sensor is attached by suction. The sensor inspection device according to any one of claims 1 to 3.

5. A housing having an open top surface, an adsorption member that closes an opening of the housing and adsorbs the flat membrane sensor when the sensor is placed on the housing; a bending mechanism for bending the adsorption member; a measurement unit that is located outside the housing and measures an output of the sensor that is deflected when the attraction member is deflected; a cover film including an elastic film that covers the sensor when the sensor is placed on the adsorption member; Equipped with the suction member has a suction hole on an outer periphery of the sensor in a plan view, When the sensor is placed on the adsorption member, the adsorption member adsorbs the elastic film through the adsorption holes. Sensor inspection equipment.

6. The cover film includes an elastic film and a rigid film. The sensor inspection device according to claim 4 or 5.

7. When viewed in cross section, there is a space between the rigid film and the sensor. The sensor inspection device according to claim 6.

8. The suction hole includes a first suction hole overlapping the sensor in a plan view and suctioning the sensor, and a second suction hole overlapping the space in a plan view. The sensor inspection device of claim 7.

9. Further comprising one or more elastic pads, Each of the one or more elastic pads has a first suction hole, The first suction hole is connected to the first suction hole or the second suction hole. The sensor inspection device of claim 8.

10. The first suction hole is connected to the first adsorption hole. The sensor inspection device of claim 9.

11. The first suction hole is connected to the second suction hole. The sensor inspection device of claim 9.

12. one or more suction pumps; Each of the one or more suction pumps has a second suction hole; The second suction hole is connected to the first suction hole. The sensor inspection device according to any one of claims 9 to 11.

13. Each of the one or more elastic pads is sealed and fixed to the housing. The sensor inspection device according to any one of claims 9 to 12.

14. The one or more elastic pads include a first elastic pad and a second elastic pad, The first elastic pad has a third suction hole, The second elastic pad has a fourth suction hole, The third suction hole is connected to the first suction hole, The fourth suction hole is connected to the second suction hole. The sensor inspection device of claim 9.

15. Further comprising a first suction pump and a second suction pump, The first suction pump has a fifth suction hole, The second suction pump has a sixth suction hole, The fifth suction hole is connected to the third suction hole, The sixth suction hole is connected to the fourth suction hole.

15. The sensor inspection apparatus of claim 14.

16. Each of the first elastic pad and the second elastic pad is sealed and fixed to the housing.

16. The sensor inspection device according to claim 14 or 15.

17. a suction step of suctioning the sensor onto a suction member and installing the sensor on the suction member across a rigid portion of the suction member that is not distorted by the suction or pressure and an elastic portion of the suction member that is distorted; a bending step of bending the elastic portion of the adsorption member; a measuring step of measuring an output of the sensor that is deflected due to the deflection of the elastic portion of the attraction member; A sensor inspection method comprising:

18. a suction step of suctioning the sensor to the suction member; a bending step of bending the adsorption member; a measuring step of measuring an output of the sensor that is deflected due to the deflection of the attraction member; Equipped with the suction member has a suction hole on an outer periphery of the sensor in a plan view, A cover film for covering the sensor is attached by suction. Sensor inspection methods.

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