Inductor Components

Abstract

To prevent variation of thickness of an interlayer insulation layer from being increased due to a mean particle diameter of a filler.SOLUTION: An inductor component 10 comprises: an element assembly; and an inductor wiring 30. The element assembly includes a planar first main surface. The inductor wiring 30 extends inside the element assembly. The inductor wiring 30 includes a plurality of wiring portions arranged in a direction vertical to the first main surface. The element body includes a plurality of interlayer insulating layers NL that embed portions between wiring portions adjacent to each other in a direction vertical to the first main surface. Each interlayer insulating layer NL includes: an insulating base material; and a plurality of fillers scattered into the base material. In a first interlayer insulating layer NL1 that is one of the plurality of interlayer insulating layers NL, a mean particle diameter of each filler becomes a standard deviation or less of the thickness of the first interlayer insulating layer NL1.SELECTED DRAWING: Figure 4

Description

[Technical field]

[0001] The present invention relates to an inductor component. [Background technology]

[0002] The inductor component described in Patent Document 1 includes an element body and inductor wiring. The element body is a rectangular parallelepiped having six outer surfaces. The inductor wiring extends inside the element body. The inductor wiring has multiple wiring parts. When one of the outer surfaces of the element body is taken as a main surface, each wiring part extends parallel to the main surface. The multiple wiring parts are also aligned in a direction perpendicular to the main surface. Adjacent wiring parts in the direction perpendicular to the main surface are connected by vias. The element body also has an interlayer insulating layer. The interlayer insulating layer fills the gaps between the wiring parts in the direction perpendicular to the main surface. [Prior art documents] [Patent documents]

[0003] [Patent Document 1] Patent No. 6519561 Summary of the Invention [Problem to be solved by the invention]

[0004] In an inductor component such as that described in Patent Document 1, the thickness of the interlayer insulating layer varies due to manufacturing errors and the like. Here, the inventors discovered that if the variation in the thickness of the interlayer insulating layer is large, the loss when a current flows through the inductor wiring is large. In addition to an insulating base material, the element body may have a plurality of fillers dispersed in the base material. In this case, if the average particle size of the filler is excessively large, the variation in the interlayer insulating layer is likely to become greater. [Means for solving the problem]

[0005] In order to solve the above problems, the present invention provides an inductor component comprising an element body having a planar main surface on its outer surface, and an inductor wiring extending inside the element body, the inductor wiring having a plurality of wiring portions lined up in a first direction perpendicular to the main surface, and a via connecting the wiring portions adjacent in the first direction, the element body having a plurality of interlayer insulating layers filling the spaces between the wiring portions adjacent in the first direction, the interlayer insulating layers having an insulating base material and a plurality of fillers dispersed within the base material, and in a first interlayer insulating layer which is one of the plurality of interlayer insulating layers, the average particle size of the filler is less than or equal to the standard deviation of the thickness of the first interlayer insulating layer.

[0006] According to the above configuration, the average particle size of the filler is small relative to the standard deviation of the thickness of the first interlayer insulating layer. Therefore, the average particle size of the filler is unlikely to have a large effect on the standard deviation of the thickness of the first interlayer insulating layer. Therefore, it is possible to prevent the variation in the thickness of the first interlayer insulating layer from becoming large due to the average particle size of the filler. Effect of the Invention

[0007] It is possible to prevent the variation in thickness of the interlayer insulating layer from becoming large due to the average particle size of the filler. [Brief description of the drawings]

[0008] [Figure 1] FIG. 1 is a perspective view of an inductor component according to an embodiment. [Diagram 2] FIG. 2 is an exploded perspective view of the inductor component of the embodiment. [Diagram 3] FIG. 3 is a transparent plan view of the inductor component of the embodiment. [Figure 4] FIG. 4 is a cross-sectional view taken along line 4-4 in FIG. [Diagram 5] FIG. 5 is an enlarged cross-sectional view of the wiring portion of FIG. [Figure 6] FIG. 6 is a cross-sectional view taken along line 6-6 in FIG. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0009] <One embodiment> An embodiment of an inductor component will be described below. In the drawings, components may be shown enlarged to facilitate understanding. The dimensional ratios of components may differ from the actual ones or from those in other drawings. In addition, although hatching is applied in the cross-sectional views, hatching of some components may be omitted to facilitate understanding.

[0010] (Overall structure) 1, the inductor component 10 includes a rectangular parallelepiped element body 11. Also, as shown in Fig. 3, the inductor component 10 includes an inductor wiring 30 extending inside the element body 11, a first electrode 40 connected to a first end of the inductor wiring 30, and a second electrode 50 connected to a second end of the inductor wiring 30.

[0011] As shown in FIG. 2, the element body 11 has a structure in which a plurality of plate-like layers are stacked as a whole. Each layer has a rectangular shape in a plan view. The element body 11 has six planar outer surfaces because it is a rectangular parallelepiped. As shown in FIG. 1, among these six outer surfaces, a specific surface parallel to the main surface of each layer is defined as a first main surface 11A. A surface parallel to the first main surface 11A is defined as a second main surface 11B. A specific surface perpendicular to the first main surface 11A is defined as a first end surface 11C. A surface parallel to the first end surface 11C is defined as a second end surface 11D. A specific surface perpendicular to both the first main surface 11A and the first end surface 11C is defined as a bottom surface 11E. A surface parallel to the bottom surface 11E is defined as a top surface 11F.

[0012] In the following description, the axis along the direction in which the layers are stacked, that is, the axis perpendicular to the first main surface 11A, is defined as the first axis X. The axis perpendicular to the first end surface 11C is defined as the second axis Y. The axis perpendicular to the bottom surface 11E is defined as the third axis Z. The direction along the first axis X in which the first main surface 11A faces is defined as the first positive direction X1, and the opposite direction to the first positive direction X1 is defined as the first negative direction X2. The direction along the second axis Y in which the first end surface 11C faces is defined as the second positive direction Y1, and the opposite direction to the second positive direction Y1 is defined as the second negative direction Y2. The direction along the third axis Z in which the top surface 11F faces is defined as the third positive direction Z1, and the opposite direction to the third positive direction Z1 is defined as the third negative direction Z2.

[0013] As shown in Fig. 2, the element body 11 has a first layer L1 to a ninth layer L9. The first layer L1 to the ninth layer L9 are arranged in this order in the first negative direction X2. The first layer L1 to the ninth layer L9 all have substantially the same thickness, i.e., the dimension in the direction along the X-axis. As shown in Fig. 3, the first layer L1 is composed of a first electrode portion 41, a second electrode portion 51, a first wiring portion 31, and a first insulating portion 21.

[0014] The first electrode portion 41 is made of a conductive material such as silver. When the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is L-shaped as a whole. When the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is located on the second positive direction Y1 side and the third negative direction Z2 side of the center of the first layer L1. In other words, when the first layer L1 is viewed in the first negative direction X2, the first electrode portion 41 is located at a position including a corner on the second positive direction Y1 side and the third negative direction Z2 side of the center of the first layer L1.

[0015] The second electrode portion 51 is made of a conductive material such as silver. When the first layer L1 is viewed in the first negative direction X2, the second electrode portion 51 is L-shaped as a whole. When the first layer L1 is viewed in the first negative direction X2, the second electrode portion 51 is located on the second negative direction Y2 side and the third negative direction Z2 side of the center of the first layer L1. In other words, when the first layer L1 is viewed in the first negative direction X2, the second electrode portion 51 is located at a position including a corner on the second negative direction Y2 side and the third negative direction Z2 side of the center of the first layer L1.

[0016] The first wiring portion 31 is made of a conductive material such as silver. When the first layer L1 is viewed in the first negative direction X2, the first wiring portion 31 extends in a spiral shape centered on the center of the first layer L1 as a whole. Specifically, the first end 31A of the first wiring portion 31 is connected to the end of the first electrode portion 41 on the third positive direction Z1 side in the direction along the third axis Z. That is, the first end 31A is the first end of the inductor wiring 30. The wiring width of the first wiring portion 31 is approximately constant except for the second end 31B. The position of the second end 31B of the first wiring portion 31 in the direction along the third axis Z is on the third positive direction Z1 side from the center in the direction along the third axis Z. Also, the position of the second end 31B of the first wiring portion 31 in the direction along the second axis Y is on the second positive direction Y1 side from the center in the direction along the second axis Y. When the first wiring portion 31 is viewed in the first negative direction X2, the first wiring portion 31 extends clockwise from the first end portion 31A to the second end portion 31B.

[0017] The second end 31B of the first wiring portion 31 functions as a pad for connecting to a via 32 described later. When the first layer L1 is viewed in the first negative direction X2, the second end 31B has a substantially circular shape. The second end 31B of the first wiring portion 31 has a wiring width larger than other portions of the first wiring portion 31.

[0018] In the first layer L1, the portion excluding the first electrode portion 41, the second electrode portion 51, and the first wiring portion 31 is the first insulating portion 21. The first insulating portion 21 is made of a non-magnetic insulator such as glass, resin, or alumina.

[0019] 2, the second layer L2 is laminated on a main surface of the first layer L1 facing the first negative direction X2. When the second layer L2 is viewed facing the first negative direction X2, the second layer L2 has the same rectangular shape as the first layer L1. The second layer L2 is composed of a third electrode portion 42, a fourth electrode portion 52, a via 32, and a second insulating portion 22.

[0020] The third electrode portion 42 is made of the same material as the first electrode portion 41. When the second layer L2 is viewed in the first negative direction X2, the third electrode portion 42 has an L-shape with the same dimensions as the first electrode portion 41. When the second layer L2 is viewed in the first negative direction X2, the third electrode portion 42 is located in the same position as the first electrode portion 41. Therefore, the third electrode portion 42 is laminated on the surface of the first electrode portion 41 facing the first negative direction X2.

[0021] The fourth electrode portion 52 is made of the same material as the second electrode portion 51. When the second layer L2 is viewed in the first negative direction X2, the fourth electrode portion 52 has an L-shape with the same dimensions as the second electrode portion 51. When the second layer L2 is viewed in the first negative direction X2, the fourth electrode portion 52 is located in the same position as the second electrode portion 51. Therefore, the fourth electrode portion 52 is laminated on the surface of the second electrode portion 51 facing the first negative direction X2.

[0022] The via 32 is made of the same material as the first wiring portion 31. The via 32 has a cylindrical shape extending in a direction along the first axis X. The via 32 is laminated on a surface of the second end portion 31B of the first wiring portion 31 facing the first negative direction X2. Therefore, the via 32 is electrically connected to the second end portion 31B of the first wiring portion 31. The via 32 extends from the second end portion 31B of the first wiring portion 31 in the first negative direction X2.

[0023] In the second layer L2, the portion excluding the third electrode portion 42, the fourth electrode portion 52, and the vias 32 constitutes the second insulating portion 22. The second insulating portion 22 is made of the same nonmagnetic insulator as the first insulating portion 21.

[0024] The third layer L3 is laminated on a main surface of the second layer L2 facing the first negative direction X2. When the third layer L3 is viewed in the first negative direction X2, the third layer L3 has the same rectangular shape as the first layer L1. The third layer L3 is composed of a fifth electrode portion 43, a sixth electrode portion 53, a second wiring portion 33, and a third insulating portion 23.

[0025] The fifth electrode portion 43 is made of the same material as the first electrode portion 41. When the third layer L3 is viewed in the first negative direction X2, the fifth electrode portion 43 has an L-shape with the same dimensions as the third electrode portion 42. When the third layer L3 is viewed in the first negative direction X2, the fifth electrode portion 43 is located in the same position as the third electrode portion 42. Therefore, the fifth electrode portion 43 is laminated on the surface of the third electrode portion 42 facing the first negative direction X2.

[0026] The sixth electrode portion 53 is made of the same material as the second electrode portion 51. When the third layer L3 is viewed in the first negative direction X2, the sixth electrode portion 53 has an L-shape with the same dimensions as the fourth electrode portion 52. When the third layer L3 is viewed in the first negative direction X2, the sixth electrode portion 53 is located in the same position as the fourth electrode portion 52. Therefore, the sixth electrode portion 53 is laminated on the surface of the fourth electrode portion 52 facing the first negative direction X2.

[0027] The second wiring portion 33 is made of the same material as the first wiring portion 31. When the third layer L3 is viewed in the first negative direction X2, the second wiring portion 33 extends in a spiral shape centered on the center of the third layer L3 as a whole. Specifically, the position of the first end 33A of the second wiring portion 33 is on the surface of the via 32 facing the first negative direction X2. Therefore, the first end 33A of the second wiring portion 33 is connected to the via 32. The wiring width of the second wiring portion 33 is approximately constant except for the first end 33A and the second end 33B. The position of the second end 33B of the second wiring portion 33 in the direction along the third axis Z is on the third negative direction Z2 side from the center in the direction along the third axis Z. Furthermore, the position of the second end 33B of the second wiring portion 33 in the direction along the second axis Y is closer to the second positive direction Y1 than the center in the direction along the second axis Y, and is closer to the center in the direction along the second axis Y than the position of the second end 31B of the first wiring portion 31 in the direction along the second axis Y. When the second wiring portion 33 is viewed in the first negative direction X2, the second wiring portion 33 extends clockwise from the first end 33A toward the second end 33B.

[0028] In the third layer L3, the portion excluding the fifth electrode portion 43, the sixth electrode portion 53, and the second wiring portion 33 is the third insulating portion 23. The third insulating portion 23 is made of a nonmagnetic insulator made of the same material as the first insulating portion 21.

[0029] The fourth layer L4 is laminated on a main surface of the third layer L3 facing the first negative direction X2. When the fourth layer L4 is viewed in the first negative direction X2, the fourth layer L4 has the same rectangular shape as the first layer L1. The fourth layer L4 is composed of a seventh electrode portion 44, an eighth electrode portion 54, a via 34, and a fourth insulating portion 24.

[0030] The seventh electrode portion 44 is made of the same material as the first electrode portion 41. When the fourth layer L4 is viewed in the first negative direction X2, the seventh electrode portion 44 has an L-shape with the same dimensions as the fifth electrode portion 43. When the fourth layer L4 is viewed in the first negative direction X2, the seventh electrode portion 44 is located in the same position as the fifth electrode portion 43. Therefore, the seventh electrode portion 44 is laminated on the surface of the fifth electrode portion 43 facing the first negative direction X2.

[0031] The eighth electrode portion 54 is made of the same material as the second electrode portion 51. When the fourth layer L4 is viewed in the first negative direction X2, the eighth electrode portion 54 has an L-shape with the same dimensions as the sixth electrode portion 53. When the fourth layer L4 is viewed in the first negative direction X2, the eighth electrode portion 54 is located in the same position as the sixth electrode portion 53. Therefore, the eighth electrode portion 54 is laminated on the surface of the sixth electrode portion 53 facing the first negative direction X2.

[0032] The via 34 is made of the same material as the first wiring portion 31. The via 34 has a cylindrical shape extending in a direction along the first axis X. The via 34 is laminated on a surface of the second end portion 33B of the second wiring portion 33 facing the first negative direction X2. Therefore, the via 34 is electrically connected to the second end portion 33B of the second wiring portion 33. The via 34 extends from the second end portion 33B of the second wiring portion 33 in the first negative direction X2.

[0033] In the fourth layer L4, the portion excluding the seventh electrode portion 44, the eighth electrode portion 54, and the vias 34 constitutes the fourth insulating portion 24. The fourth insulating portion 24 is made of the same nonmagnetic insulator as the first insulating portion 21.

[0034] The fifth layer L5 is laminated on a main surface of the fourth layer L4 facing the first negative direction X2. When the fifth layer L5 is viewed in the first negative direction X2, the fifth layer L5 has the same rectangular shape as the first layer L1. The fifth layer L5 is composed of a ninth electrode portion 45, a tenth electrode portion 55, a third wiring portion 35, and a fifth insulating portion 25.

[0035] The ninth electrode portion 45 is made of the same material as the first electrode portion 41. When the fifth layer L5 is viewed in the first negative direction X2, the ninth electrode portion 45 has an L-shape with the same dimensions as the seventh electrode portion 44. When the fifth layer L5 is viewed in the first negative direction X2, the ninth electrode portion 45 is located in the same position as the seventh electrode portion 44. Therefore, the ninth electrode portion 45 is laminated on the surface of the seventh electrode portion 44 facing the first negative direction X2.

[0036] The tenth electrode portion 55 is made of the same material as the second electrode portion 51. When the fifth layer L5 is viewed in the first negative direction X2, the tenth electrode portion 55 has an L-shape with the same dimensions as the eighth electrode portion 54. When the fifth layer L5 is viewed in the first negative direction X2, the tenth electrode portion 55 is located in the same position as the second electrode portion 51. Therefore, the tenth electrode portion 55 is laminated on the surface of the eighth electrode portion 54 facing the first negative direction X2.

[0037] The third wiring portion 35 is made of the same material as the first wiring portion 31. When the fifth layer L5 is viewed in the first negative direction X2, the third wiring portion 35 extends in a spiral shape centered on the center of the fifth layer L5 as a whole. Specifically, the position of the first end 35A of the third wiring portion 35 is on the surface of the via 34 facing the first negative direction X2. Therefore, the first end 35A of the third wiring portion 35 is connected to the via 34. The wiring width of the third wiring portion 35 is approximately constant except for the first end 35A and the second end 35B. The position of the second end 35B of the third wiring portion 35 in the direction along the third axis Z is on the third negative direction Z2 side from the center in the direction along the third axis Z. In addition, the position of the second end 35B of the third wiring portion 35 in the direction along the second axis Y is on the second negative direction Y2 side from the center in the direction along the second axis Y. When the third wiring portion 35 is viewed in the first negative direction X2, the third wiring portion 35 extends clockwise from the first end portion 35A to the second end portion 35B.

[0038] In the fifth layer L5, the portion excluding the ninth electrode portion 45, the tenth electrode portion 55, and the third wiring portion 35 is the fifth insulating portion 25. The fifth insulating portion 25 is made of a nonmagnetic insulator made of the same material as the first insulating portion 21.

[0039] The sixth layer L6 is laminated on a main surface of the fifth layer L5 facing the first negative direction X2. When the sixth layer L6 is viewed in the first negative direction X2, the sixth layer L6 has the same rectangular shape as the first layer L1. The sixth layer L6 is composed of an eleventh electrode portion 46, a twelfth electrode portion 56, a via 36, ​​and a sixth insulating portion 26.

[0040] The eleventh electrode portion 46 is made of the same material as the first electrode portion 41. When the sixth layer L6 is viewed in the first negative direction X2, the eleventh electrode portion 46 has an L-shape with the same dimensions as the ninth electrode portion 45. When the sixth layer L6 is viewed in the first negative direction X2, the eleventh electrode portion 46 is located in the same position as the ninth electrode portion 45. Therefore, the eleventh electrode portion 46 is laminated on the surface of the ninth electrode portion 45 facing the first negative direction X2.

[0041] The twelfth electrode portion 56 is made of the same material as the second electrode portion 51. When the sixth layer L6 is viewed in the first negative direction X2, the twelfth electrode portion 56 has an L-shape with the same dimensions as the tenth electrode portion 55. When the sixth layer L6 is viewed in the first negative direction X2, the twelfth electrode portion 56 is located in the same position as the tenth electrode portion 55. Therefore, the twelfth electrode portion 56 is laminated on the surface of the tenth electrode portion 55 facing the first negative direction X2.

[0042] The via 36 is made of the same material as the first wiring portion 31. The via 36 has a cylindrical shape extending in a direction along the first axis X. The via 36 is laminated on a surface of the second end portion 35B of the third wiring portion 35 facing the first negative direction X2. Therefore, the via 36 is electrically connected to the second end portion 35B of the third wiring portion 35. The via 36 extends from the second end portion 35B of the third wiring portion 35 in the first negative direction X2.

[0043] In the sixth layer L6, the portion excluding the eleventh electrode portion 46, the twelfth electrode portion 56, and the vias 36 constitutes the sixth insulating portion 26. The sixth insulating portion 26 is made of the same nonmagnetic insulator as the first insulating portion 21.

[0044] The seventh layer L7 is laminated on a main surface of the sixth layer L6 facing the first negative direction X2. When the seventh layer L7 is viewed in the first negative direction X2, the seventh layer L7 has the same rectangular shape as the first layer L1. The seventh layer L7 is composed of a thirteenth electrode portion 47, a fourteenth electrode portion 57, a fourth wiring portion 37, and a seventh insulating portion 27.

[0045] The thirteenth electrode portion 47 is made of the same material as the first electrode portion 41. When the seventh layer L7 is viewed in the first negative direction X2, the thirteenth electrode portion 47 has an L-shape with the same dimensions as the eleventh electrode portion 46. When the seventh layer L7 is viewed in the first negative direction X2, the thirteenth electrode portion 47 is located in the same position as the eleventh electrode portion 46. Therefore, the thirteenth electrode portion 47 is laminated on the surface of the eleventh electrode portion 46 facing the first negative direction X2.

[0046] The fourteenth electrode portion 57 is made of the same material as the second electrode portion 51. When the seventh layer L7 is viewed in the first negative direction X2, the fourteenth electrode portion 57 has an L-shape with the same dimensions as the twelfth electrode portion 56. When the seventh layer L7 is viewed in the first negative direction X2, the fourteenth electrode portion 57 is located in the same position as the twelfth electrode portion 56. Therefore, the fourteenth electrode portion 57 is laminated on the surface of the twelfth electrode portion 56 facing the first negative direction X2.

[0047] The fourth wiring portion 37 is made of the same material as the first wiring portion 31. When the seventh layer L7 is viewed in the first negative direction X2, the fourth wiring portion 37 extends in a spiral shape centered on the center of the seventh layer L7 as a whole. Specifically, the position of the first end 37A of the fourth wiring portion 37 is on the surface of the via 36 facing the first negative direction X2. Therefore, the first end 37A of the fourth wiring portion 37 is connected to the via 36. The wiring width of the fourth wiring portion 37 is approximately constant except for the first end 37A and the second end 37B. The position of the second end 37B of the fourth wiring portion 37 in the direction along the third axis Z is on the third positive direction Z1 side from the center in the direction along the third axis Z. The position of the second end 37B of the fourth wiring part 37 in the direction along the second axis Y is closer to the second negative direction Y2 than the center in the direction along the second axis Y and is closer to the second negative direction Y2 than the position of the first end 37A in the direction along the second axis Y. When the fourth wiring part 37 is viewed in the first negative direction X2, the fourth wiring part 37 extends clockwise from the first end 37A to the second end 37B. The fourth wiring part 37 is rotationally symmetrical with the second wiring part 33 about an axis in the direction along the third axis Z that passes through the center in the extension direction of the inductor wiring 30.

[0048] In the seventh layer L7, the portion excluding the thirteenth electrode portion 47, the fourteenth electrode portion 57, and the fourth wiring portion 37 is the seventh insulating portion 27. The seventh insulating portion 27 is made of a nonmagnetic insulator made of the same material as the first insulating portion 21.

[0049] The eighth layer L8 is laminated on the main surface of the seventh layer L7 facing the first negative direction X2. When the eighth layer L8 is viewed in the first negative direction X2, the eighth layer L8 has the same rectangular shape as the first layer L1. The eighth layer L8 is composed of a fifteenth electrode portion 48, a sixteenth electrode portion 58, a via 38, and an eighth insulating portion 28.

[0050] The fifteenth electrode portion 48 is made of the same material as the first electrode portion 41. When the eighth layer L8 is viewed in the first negative direction X2, the fifteenth electrode portion 48 has an L-shape with the same dimensions as the thirteenth electrode portion 47. When the eighth layer L8 is viewed in the first negative direction X2, the fifteenth electrode portion 48 is located in the same position as the thirteenth electrode portion 47. Therefore, the fifteenth electrode portion 48 is laminated on the surface of the thirteenth electrode portion 47 facing the first negative direction X2.

[0051] The sixteenth electrode portion 58 is made of the same material as the second electrode portion 51. When the eighth layer L8 is viewed in the first negative direction X2, the sixteenth electrode portion 58 has an L-shape with the same dimensions as the fourteenth electrode portion 57. When the eighth layer L8 is viewed in the first negative direction X2, the sixteenth electrode portion 58 is located in the same position as the fourteenth electrode portion 57. Therefore, the sixteenth electrode portion 58 is laminated on the surface of the fourteenth electrode portion 57 facing the first negative direction X2.

[0052] The via 38 is made of the same material as the first wiring portion 31. The via 38 has a cylindrical shape extending in a direction along the first axis X. The via 38 is laminated on a surface of the second end portion 37B of the fourth wiring portion 37 facing the first negative direction X2. Therefore, the via 38 is electrically connected to the second end portion 37B of the fourth wiring portion 37. The via 38 extends from the second end portion 37B of the fourth wiring portion 37 in the first negative direction X2.

[0053] In the eighth layer L8, the portion excluding the fifteenth electrode portion 48, the sixteenth electrode portion 58, and the vias 38 constitutes the eighth insulating portion 28. The eighth insulating portion 28 is made of the same nonmagnetic insulator as the first insulating portion 21.

[0054] The ninth layer L9 is laminated on the main surface of the eighth layer L8 facing the first negative direction X2. When the ninth layer L9 is viewed in the first negative direction X2, the ninth layer L9 has the same rectangular shape as the first layer L1. The ninth layer L9 is composed of a seventeenth electrode portion 49, an eighteenth electrode portion 59, a fifth wiring portion 39, and a ninth insulating portion 29.

[0055] The 17th electrode portion 49 is made of the same material as the first electrode portion 41. When the ninth layer L9 is viewed in the first negative direction X2, the 17th electrode portion 49 has an L-shape with the same dimensions as the 15th electrode portion 48. When the ninth layer L9 is viewed in the first negative direction X2, the 17th electrode portion 49 is located in the same position as the 15th electrode portion 48. Therefore, the 17th electrode portion 49 is laminated on the surface of the 15th electrode portion 48 facing the first negative direction X2.

[0056] The 18th electrode portion 59 is made of the same material as the second electrode portion 51. When the ninth layer L9 is viewed in the first negative direction X2, the 18th electrode portion 59 has an L-shape with the same dimensions as the 16th electrode portion 58. When the ninth layer L9 is viewed in the first negative direction X2, the 18th electrode portion 59 is located in the same position as the 16th electrode portion 58. Therefore, the 18th electrode portion 59 is laminated on the surface of the 16th electrode portion 58 facing the first negative direction X2.

[0057] The fifth wiring portion 39 is made of the same material as the first wiring portion 31. When the ninth layer L9 is viewed in the first negative direction X2, the fifth wiring portion 39 extends in a spiral shape centered on the center of the ninth layer L9 as a whole. Specifically, the position of the first end 39A of the fifth wiring portion 39 is on the surface of the via 38 facing the first negative direction X2. Therefore, the first end 39A of the fifth wiring portion 39 is connected to the via 38. The wiring width of the fifth wiring portion 39 is approximately constant except for the first end 39A. The second end 39B of the fifth wiring portion 39 is connected to the end of the eighteenth electrode portion 59 on the third positive direction Z1 side in the direction along the third axis Z. Then, when the fifth wiring portion 39 is viewed in the first negative direction X2, the fifth wiring portion 39 extends clockwise from the first end 39A to the second end 39B. The second end 39B of the fifth wiring part 39 is the second end of the inductor wiring 30. The fifth wiring part 39 is rotationally symmetric with the first wiring part 31 about a rotation axis that is in the direction along the third axis Z passing through the center of the inductor wiring 30 in the extension direction.

[0058] In the ninth layer L9, the portion excluding the seventeenth electrode portion 49, the eighteenth electrode portion 59, and the fifth wiring portion 39 is the ninth insulating portion 29. The ninth insulating portion 29 is made of the same insulator material as the first insulating portion 21.

[0059] The element body 11 has a first covering insulating layer 61 and a second covering insulating layer 62. When the first covering insulating layer 61 is viewed in the first negative direction X2, the first covering insulating layer 61 has the same rectangular shape as the first layer L1. The first covering insulating layer 61 is laminated on a main surface of the first layer L1 facing the first positive direction X1. When the second covering insulating layer 62 is viewed in the first positive direction X1, the second covering insulating layer 62 has the same rectangular shape as the first layer L1. The second covering insulating layer 62 is laminated on a main surface of the ninth layer L9 facing the first negative direction X2.

[0060] The above-mentioned first insulating portion 21 to ninth insulating portion 29, first covering insulating layer 61, and second covering insulating layer 62 are integrated together. Hereinafter, when there is no need to distinguish between them, they will be collectively referred to as insulating portion 20.

[0061] In addition, the first wiring portion 31, the second wiring portion 33, the third wiring portion 35, the fourth wiring portion 37, the fifth wiring portion 39, the vias 32, 34, 36, and 38 are integrated together. Hereinafter, when there is no need to distinguish between them, they will be collectively referred to as the inductor wiring 30. The inductor wiring 30 is wound in a spiral shape as a whole. The central axis of the inductor wiring 30 when it is wound is an axis extending along the first axis X.

[0062] Furthermore, the above-mentioned first electrode section 41, third electrode section 42, fifth electrode section 43, seventh electrode section 44, ninth electrode section 45, eleventh electrode section 46, thirteenth electrode section 47, fifteenth electrode section 48, and seventeenth electrode section 49 are integrated together to form the first electrode 40.

[0063] Similarly, the second electrode portion 51, the fourth electrode portion 52, the sixth electrode portion 53, the eighth electrode portion 54, the tenth electrode portion 55, the twelfth electrode portion 56, the fourteenth electrode portion 57, the sixteenth electrode portion 58, and the eighteenth electrode portion 59 are integrated together to form the second electrode 50.

[0064] In this embodiment, the insulating part 20, the first electrode 40, and the second electrode 50 form the element body 11 of the inductor component 10. The inductor wiring 30 extends inside the element body 11. The inductor wiring 30, the first electrode 40, and the second electrode 50 may be integrated together. In other words, there may not be a physical boundary between the inductor wiring 30 and the first electrode 40.

[0065] As a result of stacking the first layer L1 to the ninth layer L9, the first covering insulating layer 61, and the second covering insulating layer 62, the element body 11 has an overall rectangular parallelepiped shape, as shown in Fig. 1. As shown in Fig. 3, the first electrode 40 is exposed to the outside of the element body 11 in a region from the first end face 11C to the bottom face 11E. Moreover, the second electrode 50 is exposed to the outside of the element body 11 in a region from the second end face 11D to the bottom face 11E.

[0066] 1, the inductor component 10 includes a first covered electrode 71 and a second covered electrode 72. The first covered electrode 71 covers a surface of the first electrode 40 that is exposed to the outside from the element body 11. Although not shown, the first covered electrode 71 has a two-layer structure made of nickel plating and tin plating.

[0067] The second covered electrode 72 covers the surface of the second electrode 50 that is exposed to the outside from the element body 11. Although not shown, the second covered electrode 72 has a two-layer structure of nickel plating and tin plating. Note that the first covered electrode 71 and the second covered electrode 72 are not shown in Figs. 2 and 3.

[0068] (Interlayer insulation layer thickness and average particle size of filler) 4, the first wiring portion 31, the second wiring portion 33, the third wiring portion 35, the fourth wiring portion 37, and the fifth wiring portion 39 in the inductor wiring 30 are aligned in a direction along the first axis X. In this embodiment, the first negative direction X2 is the first direction.

[0069] A part of the insulating section 20 is an interlayer insulating layer NL. The interlayer insulating layer NL fills the gaps between the wiring sections aligned along the first axis X. Specifically, the insulating section 20 has four interlayer insulating layers NL. When distinguishing between the four interlayer insulating layers NL, they are called the first interlayer insulating layer NL1 to the fourth interlayer insulating layer NL4. Of the second insulating section 22 in the second layer L2, the portion filling the gap between the first wiring section 31 and the second wiring section 33 is the first interlayer insulating layer NL1 between the first wiring section 31 and the second wiring section 33. Of the fourth insulating section 24 in the fourth layer L4, the portion filling the gap between the second wiring section 33 and the third wiring section 35 is the second interlayer insulating layer NL2 between the second wiring section 33 and the third wiring section 35. Of the sixth insulating section 26 in the sixth layer L6, the portion filling the gap between the third wiring section 35 and the fourth wiring section 37 is the third interlayer insulating layer NL3 between the third wiring section 35 and the fourth wiring section 37. Of the eighth insulating section 28 in the eighth layer L8, the portion filling the gap between the fourth wiring section 37 and the fifth wiring section 39 is the fourth interlayer insulating layer NL4 between the fourth wiring section 37 and the fifth wiring section 39. The interlayer insulating layer NL refers to only the portion of the insulating section 20 that is sandwiched between adjacent wiring sections. In other words, the interlayer insulating layer NL does not include the portion that is not sandwiched between adjacent wiring sections.

[0070] The dimensions of the multiple interlayer insulating layers NL in the direction along the first axis X vary due to materials, processes, manufacturing errors, and the like. Specifically, in this embodiment, the interlayer insulating layers NL are formed by sintering powder, i.e., multiple particles, so that the dimensions of the interlayer insulating layers NL in the direction along the first axis X vary. The average thickness, which is the average value of the thicknesses of the first interlayer insulating layers NL1, is greater than five times the standard deviation of the thicknesses of the first interlayer insulating layers NL1. The average thickness and standard deviation of the first interlayer insulating layers NL1 are calculated as follows.

[0071] First, a cross section where the first wiring portion 31, the second wiring portion 33, and the first interlayer insulating layer NL1 are laminated along the first axis X is identified. The cross section is parallel to the first axis X. The cross section includes, for example, a portion where the first wiring portion 31 and the second wiring portion 33 extend linearly, and where the first interlayer insulating layer NL1 can be detected over a length of at least 100 μm or more. Specifically, the cross section is a cross section where the first interlayer insulating layer NL1 exists for the longest period. In particular, the cross section is preferably a cross section obtained by cutting out the center portion of the portion where the first wiring portion 31 and the second wiring portion 33 extend linearly.

[0072] Next, an image of the specified cross section is acquired using an electron microscope. The resolution of the acquired image is set to 0.4 μm or less per pixel. Next, the acquired image is subjected to binarization processing. The binarized data is then converted into a bitmap format.

[0073] Next, from the bitmap image, in a range of 100 μm in length in the center of the first interlayer insulating layer NL1, the thickness values ​​of the first interlayer insulating layer NL1 are obtained for each column of pixels aligned along the first axis X, when the direction perpendicular to the first axis X is taken as the length. For example, when one pixel is 0.4 μm, the thickness values ​​of the first interlayer insulating layer NL1 are obtained in 250 columns. The arithmetic mean of these 250 values ​​is calculated as the average thickness. In addition, the standard deviation obtained by assuming that these 250 values ​​are normally distributed is calculated. The average thickness and standard deviation are calculated in the same manner for the second interlayer insulating layer NL2, the third interlayer insulating layer NL3, and the fourth interlayer insulating layer NL4. In this embodiment, the average thickness of each interlayer insulating layer NL is 5.0 μm or more. In addition, the standard deviation of the thickness of each interlayer insulating layer NL is smaller than 1.0 μm.

[0074] 5, the insulating part 20 includes a base material 20A and a plurality of fillers 20B. The base material 20A is made of an insulating material. Specifically, the material of the base material 20A is borosilicate glass.

[0075] The filler 20B is a powder of a crystalline material dispersed in the base material 20A, and includes two types of fillers, a first filler and a second filler, which are different materials. The material of the first filler of the filler 20B is aluminum oxide, and the material of the second filler is silicon dioxide. In the first interlayer insulating layer NL1, the average particle size of the filler 20B is equal to or smaller than the standard deviation of the thickness of the first interlayer insulating layer NL1. In the first interlayer insulating layer NL1, the average thickness of the first interlayer insulating layer NL1 is greater than five times the average particle size of the filler 20B. In this embodiment, the second interlayer insulating layer NL2, the third interlayer insulating layer NL3, and the fourth interlayer insulating layer NL4 have the same relationship. Therefore, the average particle size of the filler 20B in the entire multiple interlayer insulating layers NL is equal to or smaller than the standard deviation of the thickness in the entire multiple interlayer insulating layers NL. The average particle size of the filler 20B in the entire interlayer insulating layers NL is calculated as the average value of the average particle size of the filler 20B in each interlayer insulating layer NL. Also, the standard deviation of the thickness in the entire interlayer insulating layers NL is calculated as the average value of the standard deviations of the thickness of each interlayer insulating layer NL.

[0076] The average particle size of the filler 20B is calculated as follows. First, an image is taken by an electron microscope at 5000 times magnification of the cross section of each interlayer insulating layer NL for which the average thickness and standard deviation have been calculated. Next, 20 to 30 fillers 20B are randomly extracted from the captured image. Next, the maximum length of each of the extracted fillers 20B is measured. The arithmetic mean value of the measured maximum lengths is set as the average particle size of the filler 20B. The maximum length of the filler 20B is the length of the longest line segment that can be drawn from one outer edge to the other outer edge of the filler 20B.

[0077] (Thickness of wiring part and average grain size of crystallites) As shown in FIG. 4, the wiring thickness, which is the dimension of the first wiring portion 31 in the direction along the first axis X, varies in accordance with the variation of the first interlayer insulating layer NL1. The average value of the wiring thickness of the first wiring portion 31 is greater than five times the standard deviation of the wiring thickness of the first wiring portion 31. The average value and standard deviation of the wiring thickness of the first wiring portion 31 are calculated in the same manner as the average thickness and standard deviation of the first interlayer insulating layer NL1. Furthermore, the average thickness and standard deviation of the second wiring portion 33, the third wiring portion 35, the fourth wiring portion 37, and the fifth wiring portion 39 are calculated in the same manner. In this embodiment, the average value of the wiring thickness of each wiring portion is 5.0 μm or more. The standard deviation of the wiring thickness in each wiring portion is smaller than 1.0 μm.

[0078] As shown in FIG. 6, the inductor wiring 30 is a sintered body of metal obtained by sintering powder made of metal. Therefore, microscopically, the inductor wiring 30 is a polycrystalline body composed of a plurality of crystallites 30A formed by sintering powder. In the first wiring portion 31, the average grain size of the crystallites 30A is larger than the standard deviation of the wiring thickness of the first wiring portion 31. Specifically, the average grain size of the crystallites 30A is 2.5 μm or more and 4.1 μm or less. In addition, it is preferable that the average value of the wiring thickness of the first wiring portion 31 is larger than five times the average grain size of the crystallites 30A. In this embodiment, the relationship between the average grain size of the crystallites 30A and the standard deviation of the wiring thickness of each wiring portion is the same in the second wiring portion 33, the third wiring portion 35, the fourth wiring portion 37, and the fifth wiring portion 39. Therefore, the average grain size of the crystallites 30A in the entire plurality of wiring portions is equal to or smaller than the standard deviation of the wiring thickness in the entire plurality of wiring portions. The average grain size of the crystallites 30A in the entire wiring parts is calculated as the average grain size of the crystallites 30A in each wiring part. Also, the standard deviation of the wiring thickness in the entire wiring parts is calculated as the average of the standard deviations of the wiring thickness in each wiring part.

[0079] The average grain size of the crystallites 30A is calculated as follows. First, five cross sections are identified in a direction perpendicular to the extension direction of the wiring portion of the inductor wiring 30. Of the five cross sections, a range including the first wiring portion 31 is observed with an electron microscope. In the electron microscope, an electron beam is irradiated onto the range, and reflected electrons generated from the range are detected. The reflected electrons can be observed with different contrasts for each crystal orientation of the crystallites 30A. That is, by observing the reflected electrons, the grain boundary between the crystallites 30A and the adjacent crystallites 30A can be identified. Next, the area of ​​one crystallite 30A is calculated by the grain boundary identified in the same cross section. Next, the diameter of the crystallite 30A when the area of ​​one crystallite 30A is assumed to be a circle is calculated as the grain size of the crystallite 30A. Then, the grain sizes of all the crystallites 30A in the same cross section are calculated. Similarly, the grain sizes of all the crystallites 30A in other cross sections are calculated. Next, the average value of the grain sizes of all the crystallites 30A measured in the five cross sections is calculated as the average grain size of the crystallites 30A in the first wiring portion 31. In this embodiment, the average grain size of the crystallites 30A is 2.5 μm or more and 4.1 μm or less.

[0080] (Effects of the embodiment) According to the above embodiment, the following effects are achieved. (1) According to the above embodiment, the average particle size of the filler 20B in the first interlayer insulating layer NL1 is smaller than the standard deviation of the thickness of the first interlayer insulating layer NL1. Therefore, the average particle size of the filler 20B is unlikely to have a large effect on the standard deviation of the thickness of the first interlayer insulating layer NL1. Therefore, it is possible to prevent the variation in the thickness of the first interlayer insulating layer NL1 from becoming large due to the average particle size of the filler 20B.

[0081] Also, suppose that the average particle size of the filler 20B is larger than the standard deviation of the first interlayer insulating layer NL1. In this case, the standard deviation of the thickness of the first interlayer insulating layer NL1 becomes correspondingly large. Then, the protrusions protruding toward the adjacent first wiring portion 31 and second wiring portion 33 become sharp. If the protrusions are sharp, when a current flows through the inductor wiring 30, the current concentrates at the tip of the protrusion. Therefore, the current loss increases. On the other hand, according to the above embodiment, the variation in the thickness of the first interlayer insulating layer NL1 can be prevented from increasing due to the average particle size of the filler 20B, and such protrusions become smoother. Therefore, when a current flows through the inductor wiring 30, the current is dispersed not only to the tip of the protrusion but also around the tip of the protrusion. As a result, the current loss is reduced compared to when the protrusions are sharp.

[0082] (2) According to the above embodiment, the standard deviation of the thickness of the first interlayer insulating layer NL1 is smaller than 1.0 μm. In this case, the standard deviation of the thickness of the first interlayer insulating layer NL1 is small enough to suppress loss even if a high-frequency current of Sub6 class is passed through the inductor wiring 30.

[0083] (3) According to the above embodiment, the average thickness of the first interlayer insulating layer NL1 is greater than five times the standard deviation of the thickness of the first interlayer insulating layer NL1. In other words, the thickness of the first interlayer insulating layer NL1 as a whole is considerably greater than the standard deviation. Therefore, even at the location where the thickness of the interlayer insulating layer NL is the thinnest, a sufficient thickness is ensured. This makes it possible to prevent multiple wiring parts from shorting out at the location where the thickness of the interlayer insulating layer NL is thin.

[0084] (4) According to the above embodiment, the average thickness of the first interlayer insulating layer NL1 is greater than five times the average particle size of the filler 20B. That is, the average particle size of the filler 20B is smaller than one-fifth the average thickness of the first interlayer insulating layer NL1. Therefore, in the first interlayer insulating layer NL1, a plurality of fillers 20B are arranged in the direction along the first axis X, or the fillers 20B and the base material 20A are arranged alternately. In this way, the fillers 20B are easily dispersed evenly in the first interlayer insulating layer NL1 in the direction along the first axis X, and therefore the characteristics such as the insulation property of the first interlayer insulating layer NL1 are easily stabilized.

[0085] (5) According to the embodiment described above, the average particle size of the filler 20B in the entire interlayer insulating layers NL is equal to or smaller than the standard deviation of the thickness of the entire interlayer insulating layers NL, thereby making it possible to suppress the variation in thickness of the entire interlayer insulating layers NL.

[0086] (6) According to the above embodiment, in the first wiring portion 31, the average grain size of the crystallites 30A is large relative to the standard deviation of the wiring thickness of the first wiring portion 31. Therefore, the shape of the outer surface of the crystallites 30A tends to dominate the variation in the wiring thickness of the first wiring portion 31. Therefore, the variation in the thickness of the wiring portion can be controlled by the average grain size of the crystallites 30A.

[0087] (7) According to the above embodiment, the standard deviation of the wiring thickness of the first wiring part 31 is smaller than 1.0 μm. In this case, the standard deviation of the wiring thickness of the first wiring part 31 is small enough to suppress loss even if a high-frequency current of Sub6 class is passed through the inductor wiring 30.

[0088] (8) According to the above embodiment, the average value of the wiring thickness of the first wiring portion 31 is greater than five times the standard deviation of the wiring thickness of the first wiring portion 31. In other words, the wiring thickness of the first wiring portion 31 is considerably greater than the standard deviation as a whole. Therefore, even at the location where the wiring thickness of the first wiring portion 31 is the thinnest, a sufficient thickness can be ensured. Therefore, it is possible to prevent the first wiring portion 31 from being broken.

[0089] (9) According to the above embodiment, the average grain size of the crystallites 30A in the entire wiring portion is larger than the standard deviation of the wiring thickness in the entire wiring portion, which makes it possible to suppress the variation in the wiring thickness in the entire wiring portion.

[0090] (10) According to the above embodiment, the filler 20B is a crystalline material, and includes a first filler made of aluminum oxide and a second filler made of silicon dioxide. Aluminum oxide has a relatively high strength. Therefore, it is easy to ensure the strength of the insulating part 20. Aluminum oxide also has high chemical stability, such as heat resistance. Therefore, it is easy to withstand aging when the inductor component 10 is used for a long period of time. However, since aluminum oxide has a relatively high dielectric constant, if it is contained in excess, the dielectric constant of the entire element body 11 becomes excessively large. Therefore, by simultaneously containing a crystalline second filler made of silicon dioxide, which has a smaller dielectric constant than aluminum oxide, it is possible to prevent the dielectric constant of the entire element body 11 from becoming excessively large.

[0091] (11) According to the above embodiment, the material of the inductor wiring 30 contains silver, and the material of the base material 20A of the insulating section 20 contains borosilicate glass. In order to co-sinter the inductor wiring 30 containing silver and the insulating section 20, it is necessary to sinter them at a low temperature of 900 degrees or less. Borosilicate glass can be sintered at a lower temperature than, for example, silicate glass. Therefore, it is possible to realize co-sintering of the inductor wiring 30 containing silver and the insulating section 20.

[0092] <Other embodiments> The above embodiment can be modified as follows: The above embodiment and the following modifications can be combined and implemented within a range that does not cause technical contradiction.

[0093] The thicknesses of the first layer L1 to the ninth layer L9, i.e., the dimensions in the direction along the first axis X, do not all have to be the same. All the thicknesses may be different from one another, or the thicknesses of some layers may be different from the thicknesses of the other layers.

[0094] The element body 11 may be a rectangular parallelepiped elongated in a direction along the first axis X, or may be a rectangular parallelepiped elongated in a direction along the third axis Z. The element body 11 may also be a rectangular parallelepiped whose dimensions along the first axis X, the second axis Y, and the third axis Z are equal. For example, the dimensions along each axis of the element body 11 may be such that the dimension along the first axis X and the dimension along the third axis Z are equal, and the dimension along the second axis Y is larger than the dimension along the first axis X. For example, the dimensions along each axis of the element body 11 may be such that the dimension along the second axis Y is larger than the dimension along the third axis Z, and the dimension along the third axis Z is larger than the dimension along the first axis X. Also, for example, the dimension along the second axis Y may be greater than the dimension along the first axis X, and the dimension along the first axis X may be greater than the dimension along the third axis Z.

[0095] The insulating portions 20 do not all need to be made of the same material. It is sufficient that the material of the portion that is the interlayer insulating layer NL contains the base material 20A and the filler 20B. Therefore, for example, the first covering insulating layer 61 and the second covering insulating layer 62 may be made of an insulating material different from that of the first insulating portion 21 to the ninth insulating portion 29.

[0096] The base material 20A may contain other insulating materials in addition to borosilicate glass, or may be an insulating material other than borosilicate glass. For example, the material of the base material 20A may be silicate glass. It is preferable that the base material 20A is a sintered body. In this case, the strength and chemical stability of the element body 11, particularly the interlayer insulating layer NL, can be improved. Furthermore, in this case, the forming accuracy of the inductor component 10 can also be improved.

[0097] The material of the filler 20B may contain other materials in addition to aluminum oxide and silicon dioxide. The material of the filler 20B may not contain aluminum oxide or silicon dioxide. The filler 20B may be made of a material different from that of the base material 20A. For example, when the base material 20A is an amorphous material, the filler 20B may be made of a crystalline material. The filler 20B does not necessarily have to be a crystalline material, but it is necessary that the filler 20B is not integrated with the base material 20A and that an interface exists between the filler 20B and the base material 20A.

[0098] The average particle size of the filler 20B may be equal to or smaller than the standard deviation of the thickness of the first interlayer insulating layer NL1. The average particle size of the filler 20B is preferably 0.4 μm or more and 1.4 μm or less. In this case, even if the standard deviation of the thickness of the first interlayer insulating layer NL1 is considerably small, the influence of the average particle size of the filler 20B on the standard deviation of the thickness of the first interlayer insulating layer NL1 can be suppressed within a practical range. Also, for example, the average particle size of the filler 20B may be equal to or larger than one-fifth of the average thickness of the first interlayer insulating layer NL1.

[0099] The standard deviation of the wiring thickness of the first interlayer insulating layer NL1 may be 1.0 μm or more. Even in this case, as long as the average particle size of the filler 20B is equal to or smaller than the standard deviation of the thickness of the first interlayer insulating layer NL1, the effect of the average particle size of the filler 20B on the variation in the thickness of the first interlayer insulating layer NL1 can be suppressed.

[0100] The average thickness of the first interlayer insulating layer NL1 may be five times or less the standard deviation of the thickness of the first interlayer insulating layer NL1. For example, if the standard deviation of the thickness of the first interlayer insulating layer NL1 is appropriately small, it is possible to prevent multiple wiring parts from being electrically connected via the first interlayer insulating layer NL1 even if the average thickness of the first interlayer insulating layer NL1 is small.

[0101] The average grain size of the crystallites 30A is not limited to that in the above embodiment. For example, the average grain size of the crystallites 30A may be smaller than 2.5 μm or larger than 4.1 μm. The average grain size of the crystallites 30A is preferably smaller than one-fifth the average value of the wiring thickness of the first wiring portion 31. In other words, the average value of the wiring thickness of the first wiring portion 31 is preferably larger than five times the average grain size of the crystallites 30A. In this case, the wiring thickness of the wiring portion is considerably larger than the average grain size of the crystallites 30A. Therefore, it is possible to prevent the wiring portion from being broken.

[0102] The standard deviation of the wiring thickness of the first wiring portion 31 may be 1.0 μm or more. Even in this case, as long as the average grain size of the crystallites 30A is equal to or smaller than the standard deviation of the wiring thickness of the first wiring portion 31, the effect of the average grain size of the crystallites 30A on the variation in the wiring thickness of the first wiring portion 31 can be suppressed.

[0103] The average wiring thickness of the first wiring portion 31 may be five times or less than the standard deviation of the wiring thickness of the first wiring portion 31. For example, if the variation in the wiring thickness of the first wiring portion 31 is appropriately small, even if the average wiring thickness of the wiring portion is small, breakage of the wiring portion can be avoided.

[0104] The average grain size of the crystallites 30 A may be equal to or smaller than the standard deviation of the wiring thickness of the first wiring portion 31 . The inductor wiring 30 does not have to be a sintered body of the crystallites 30A. For example, it may be a wound wire made of a metal. In this case, the wire may be a single crystal.

[0105] The shape of the first electrode 40 is not limited to the example in the above embodiment. For example, the first electrode 40 may be connected to the first end of the inductor wiring 30, and at least a portion of the electrode may be exposed to the outside of the element body 11. Alternatively, for example, the first electrode 40 may be omitted, and the first end of the inductor wiring 30 may be directly connected to the first covered electrode 71. The same applies to the second electrode 50.

[0106] The structure of the first covered electrode 71 is not limited to the example of the above embodiment. For example, the first covered electrode 71 may be made of only tin plating. Also, the first covered electrode 71 may be omitted. In this case, for example, the first electrode 40 may be fixed to a substrate or the like by applying solder. The same applies to the second covered electrode 72.

[0107] The technical ideas that can be understood from the above embodiments and modifications are described below. <1> An element body having a planar main surface on an outer surface thereof; an inductor wiring extending inside the element body; Equipped with the inductor wiring includes a plurality of wiring parts arranged in a first direction perpendicular to the main surface, and a via connecting the wiring parts adjacent to each other in the first direction, the element body has a plurality of interlayer insulating layers filling spaces between the wiring portions adjacent to each other in the first direction, The interlayer insulating layer includes an insulating base material and a plurality of fillers dispersed in the base material, In a first interlayer insulating layer which is one of the plurality of interlayer insulating layers, the average particle size of the filler is equal to or smaller than the standard deviation of the thickness of the first interlayer insulating layer. Inductor components.

[0108] <2> The average particle size of the filler is 0.4 μm or more and 1.4 μm or less. <1> 2. An inductor component according to claim 1 .

[0109] <3> The standard deviation of the thickness of the first interlayer insulating layer is less than 1.0 μm. <1> or <2> 2. An inductor component according to claim 1 .

[0110] <4> The average thickness of the first interlayer insulating layer is greater than five times the standard deviation of the thickness of the first interlayer insulating layer. <1> ~ <3> 2. An inductor component according to claim 1 .

[0111] <5> The average thickness of the first interlayer insulating layer is greater than five times the average particle size of the filler. <1> ~ <4> 2. An inductor component according to claim 1 .

[0112] <6> The average particle size of the filler in the entirety of the plurality of interlayer insulating layers is equal to or less than the standard deviation of the thickness of the entirety of the plurality of interlayer insulating layers. <1> ~ <5> 2. An inductor component according to claim 1 .

[0113] <7> the inductor wiring is a sintered body containing crystallites made of a metal, When the dimension of the wiring portion in the first direction is defined as a wiring thickness, In a first wiring portion which is one of the plurality of wiring portions, the average grain size of the crystallites is larger than the standard deviation of the thickness of the wiring. <1> ~ <6> 2. An inductor component according to claim 1 .

[0114] <8> The average grain size of the crystallites is 2.5 μm or more and 4.1 μm or less. <7> 2. An inductor component according to claim 1 .

[0115] <9> The standard deviation of the wiring thickness of the first wiring portion is smaller than 1.0 μm. <7> or <8> 2. An inductor component according to claim 1 .

[0116] <10> The average value of the wiring thickness of the first wiring portion is greater than five times the standard deviation of the wiring thickness of the first wiring portion. <7> ~ <9> 2. An inductor component according to claim 1 .

[0117] <11> The average value of the wiring thickness of the first wiring portion is greater than five times the average grain size of the crystallites of the first wiring portion. <7> ~ <10> 2. An inductor component according to claim 1 .

[0118] <12> The average grain size of the crystallites in the entirety of the plurality of wiring portions is larger than the standard deviation of the wiring thickness in the entirety of the plurality of wiring portions. <7> ~ <11> 2. An inductor component according to claim 1 .

[0119] <13> The base material is a sintered body. <1> ~ <12> 2. An inductor component according to claim 1 .

[0120] <14> The filler is a crystalline material and includes a first filler having a material of aluminum oxide and a second filler having a material of silicon dioxide. <1> ~ <13> 2. An inductor component according to claim 1 .

[0121] <15> The material of the wiring portion contains silver, The material of the base material includes borosilicate glass. <1> ~ <14> 2. An inductor component according to claim 1 . [Explanation of symbols]

[0122] 10...Inductor components 11...Base body 20…Insulation section 20A…Base material 20B…Filler 30…Inductor wiring 30A…Crystalline 31...1st wiring section 32, 34, 36, 38…Via 33…Second wiring section 35...Third wiring section 37…4th wiring section 39…5th wiring section 40...1st electrode 50…Second electrode 61...First coating layer 62…Second coating layer 71...First coated electrode 72...Second coated electrode

Claims

1. An element body having a planar main surface on an outer surface thereof; an inductor wiring extending inside the element body; Equipped with the inductor wiring includes a plurality of wiring parts arranged in a first direction perpendicular to the main surface, and a via connecting the wiring parts adjacent to each other in the first direction, the element body has a plurality of interlayer insulating layers filling spaces between the wiring portions adjacent to each other in the first direction, The interlayer insulating layer includes an insulating base material and a plurality of fillers dispersed in the base material, In a first interlayer insulating layer which is one of the plurality of interlayer insulating layers, the average particle size of the filler is equal to or smaller than the standard deviation of the thickness of the first interlayer insulating layer. Inductor components.

2. The average particle size of the filler is 0.4 μm or more and 1.4 μm or less. The inductor component according to claim 1 .

3. The standard deviation of the thickness of the first interlayer insulating layer is less than 1.0 μm. The inductor component according to claim 1 .

4. The average thickness of the first interlayer insulating layer is greater than five times the standard deviation of the thickness of the first interlayer insulating layer. The inductor component according to claim 1 .

5. The average thickness of the first interlayer insulating layer is greater than five times the average particle size of the filler. The inductor component according to claim 1 .

6. The average particle size of the filler in the entirety of the plurality of interlayer insulating layers is equal to or less than the standard deviation of the thickness of the entirety of the plurality of interlayer insulating layers. The inductor component according to claim 1 .

7. the inductor wiring is a sintered body containing crystallites made of a metal, When the dimension of the wiring portion in the first direction is defined as a wiring thickness, In a first wiring portion which is one of the plurality of wiring portions, the average grain size of the crystallites is larger than the standard deviation of the wiring thickness. The inductor component according to claim 1 .

8. The average grain size of the crystallites is 2.5 μm or more and 4.1 μm or less. The inductor component according to claim 7 .

9. The standard deviation of the wiring thickness of the first wiring portion is smaller than 1.0 μm. The inductor component according to claim 7 .

10. The average value of the wiring thickness of the first wiring portion is greater than five times the standard deviation of the wiring thickness of the first wiring portion. The inductor component according to claim 7 .

11. The average value of the wiring thickness of the first wiring portion is greater than five times the average grain size of the crystallites of the first wiring portion. The inductor component according to claim 7 .

12. The average grain size of the crystallites in the entirety of the plurality of wiring portions is larger than the standard deviation of the wiring thickness in the entirety of the plurality of wiring portions. The inductor component according to claim 7 .

13. The base material is a sintered body. The inductor component according to claim 1 .

14. The filler is a crystalline material and includes a first filler having a material of aluminum oxide and a second filler having a material of silicon dioxide. The inductor component according to claim 1 .

15. The material of the wiring portion contains silver, The material of the base material includes borosilicate glass. The inductor component according to claim 1 .

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