Mounting structure

Abstract

This mounting structure is provided with a high-frequency package (10) and a mounting substrate (130) on which the high-frequency package (10) is mounted. In a vicinity area in which a first signal lead pin (121) and a second signal lead pin (122) are abutted on a bottom surface side of a package case (100), the package case is provided with a recessed section (104) in appearance as a result of a package insulator layer and a package conductor layer being selectively eliminated. In a signal-lead-pin disposed region that serves as leading-end sides of the signal lead pins and that is on a lateral surface of the package case (100), the recessed section (104) is formed so as to be recessed towards the inside of the package case (100) to front of the point at which the signal lead pins and the package conductor layer are connected.

Description

[Technical field]

[0001] The present invention relates to a mounting structure including a high-frequency package and a mounting board. [Background technology]

[0002] In recent years, one of the main technical challenges in the development of 800 Gbps and over 1 Tbps optical communications modules, as well as in the development of connection technologies with mounting boards on which the modules are mounted, has been the optimization of mounting mechanisms that enable the transmission of high-frequency signals with low loss and low reflection.

[0003] There are various types of high-frequency packages that constitute optical communication modules, including a type that has high-frequency lead pins that are physically and mechanically separated from the power supply line and the low-speed control signal line. This type is characterized in that not only is it relatively easy to directly introduce high-frequency technology into the lead pins, but also that the lead pins act as a kind of spring mechanism after the high-frequency package is mounted on the mounting board. Supported by this mechanical feature, in the above-mentioned configuration, the mechanical thermal stress that occurs when the high-frequency package and the mounting board are heated after current is passed through can be absorbed by the lead pins, and the desired high-frequency characteristics can be easily obtained at low cost and with high reliability. For this reason, high-frequency packages with lead pins of the above-mentioned configuration have been used in optical communication systems for a long time. [Prior art documents] [Patent documents]

[0004] [Patent Document 1] Patent No. 4934733 [Non-patent literature]

[0005] [Non-Patent Document 1] Implementation Agreement for Integrated Dual Polarization Intradine Coherent Receivers, IA # OIF-DPC-RX-01.2, November 14, 2013. [Non-Patent Document 2] Chang Fei Yee, "Key high-speed connector layout techniques", [Retrieved October 22, 2021], (https: / / www.edn.com / key-high-speed-connector-layout-techniques / ). Summary of the Invention [Problem to be solved by the invention]

[0006] However, standardization organizations such as the Optical Internetworking Forum have determined the size and position of solder-mounted lead pins that must be satisfied by packages mounted on mounting boards, and the spacing and shape of each lead pin cannot be freely determined. As shown in Non-Patent Document 1, the shape of high-frequency lead pins is regulated (see Figure 6), and changes in the pitch between signal (+) and (-) leads, which are necessary to improve high-frequency characteristics, are not permitted. Thus, there has been an issue of low degree of freedom in high-frequency design for high-speed signal transmission.

[0007] For example, Patent Document 1 shows an optical receiving module 700 equipped with an optical circuit 701 that performs optical signal processing on optical signals input from two input ports 702a and 702b, and that has a DC terminal 703 and an output terminal 704, as shown in FIG. 7. However, this technology does not disclose details of the structure of the high-frequency lead pins that affect the high-frequency characteristics in an optical receiving module that has multiple high-frequency lead pins.

[0008] In addition, Non-Patent Document 2 shows the three-dimensional shape of the lead pins (see FIG. 8), but assumes that the pitch intervals of the metal pads on the mounting board and the intervals of the lead pins are all equal from the contact surface. Since there is high impedance in the areas exposed to air, it is desirable to narrow the gap between the ground lead pins and the signal lead pins in the vicinity of the connection with the package, but such a structure is not specifically shown or mentioned at all.

[0009] The present invention has been made to solve the problems described above, and has an object to suppress reflection loss at high frequency lead pins in a package having high frequency lead pins after the package is mounted on a mounting board, thereby enabling high frequency signals to be propagated with low loss. [Means for solving the problem]

[0010] The mounting structure according to the present invention comprises a high-frequency package and a mounting board on which the high-frequency package is mounted, the high-frequency package comprising a package housing having a multi-layer structure in which package insulator layers and package conductor layers constituting a coplanar line are alternately laminated, a signal lead pin arranged on the mounting surface side of the package housing and having a rear end connected to a signal wiring of one of the package conductor layers constituting the coplanar line, a ground lead pin arranged on the mounting surface side of the package housing and having a rear end connected to a ground wiring of one of the package conductor layers constituting the coplanar line, and a connection point between the signal lead pin and the package conductor layer, the connection point being located on the side of the package housing that is the tip side of the signal lead pin, toward the inside of the package housing. the mounting board has a recess formed by recessing the front end, and each of the ground lead pins and the signal lead pins has a first bent portion and a second bent portion in a direction extending from the rear end, and each of the ground lead pins and the signal lead pins has an inclined portion between the first bent portion and the second bent portion that slopes away from the bottom surface of the package housing, and a parallel portion parallel to the bottom surface of the package housing on the other end side of the second bent portion, the ground lead pins and the signal lead pins have the same tip position, the mounting board has a multilayer board in which board insulator layers and board conductor layers are alternately stacked, and a mounting coplanar line formed on the surface of the multilayer board, the signal lead pin is connected to the signal line of the mounting coplanar line, and the ground lead pin is connected to the ground line of the mounting coplanar line. Effect of the Invention

[0011] As described above, according to the present invention, the signal lead pin arrangement area on the side of the package housing, which is on the tip side of the signal lead pin, is provided with a recess that recesses toward the inside of the package housing.Therefore, when a package having high-frequency lead pins is mounted on a mounting board, reflection loss at the high-frequency lead pins can be suppressed, making it possible to propagate high-frequency signals with low loss. [Brief description of the drawings]

[0012] [Figure 1]FIG. 1 is a perspective view showing a configuration of a mounting structure according to a first embodiment of the present invention. [Diagram 2] FIG. 2 is a perspective view showing the configuration of the mounting structure according to the first embodiment of the present invention. [Figure 3A] FIG. 3A is a perspective view showing a partial configuration of the mounting structure according to the first embodiment of the present invention. [Figure 3B] FIG. 3B is a perspective view showing a partial configuration of the mounting structure according to the first embodiment of the present invention. [Figure 4] FIG. 4 is a perspective view showing a partial configuration of the mounting structure according to the first embodiment of the present invention. [Diagram 5] FIG. 5 is a perspective view showing a partial configuration of the mounting structure according to the first embodiment of the present invention. [Figure 6] FIG. 6 is an explanatory diagram showing the configuration of a conventional high-frequency package. [Figure 7] FIG. 7 is a diagram showing the configuration of a conventional optical receiver module. [Figure 8] FIG. 8 is a perspective view showing a partial configuration of a conventional high-frequency package. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, a mounting structure according to an embodiment of the present invention will be described.

[0014] [Embodiment 1] First, a mounting structure according to a first embodiment of the present invention will be described with reference to Fig. 1, Fig. 2, Fig. 3A, Fig. 3B, and Fig. 4. This mounting structure includes a high-frequency package 10 and a mounting board 130 on which the high-frequency package 10 is mounted.

[0015] The high-frequency package 10 includes a package housing 100 and lead pins 120. The package housing 100 has a multi-layer structure in which package insulator layers and package conductor layers constituting a coplanar line are alternately laminated.

[0016] The lead pins 120 are connected (contacted) and permanently connected in advance to high-frequency lines (not shown in FIG. 1) that include signal wiring and ground wiring formed on a package conductor layer provided on the bottom surface (mounting surface) of the package housing 100. The high-frequency package 10 is also placed on the upper surface of the mounting board 130, and the lead pins 120 are permanently connected to the corresponding wiring by solder 20.

[0017] In this example, the lead pin 120 includes a first ground lead pin 123, a first signal lead pin 121, a second signal lead pin 122, and a second ground lead pin 124, and a high-frequency differential transmission structure is formed in which the intensities of the high-frequency signals propagating through the first signal lead pin 121 and the second signal lead pin 122 are matched and their phases are inverted by 180 degrees.

[0018] The signal lead pins (first signal lead pin 121, second signal lead pin 122) are arranged on the mounting surface side of the package housing 100, and their rear ends are connected to signal wiring formed on any of the package conductor layers constituting the coplanar line (high frequency line). The ground lead pins (first ground lead pin 123, second ground lead pin 124) are arranged on the mounting surface side of the package housing 100, and their rear ends are connected to ground wiring formed on any of the package conductor layers constituting the coplanar line. The first signal lead pin 121 and the second signal lead pin 122 each have the same tip position.

[0019] The package housing 100 of the high-frequency package 10 has a multi-layer structure in which package insulator layers 102A, 102B, 102C, and 102D and package conductor layers 101A, 101B, 101C, 101D, and 101E are alternately laminated. As a signal interface for the high-frequency package 10, lead pins 120 are provided on the bottom side of the package housing 100.

[0020] The contact points of package housing 100 where each lead pin 120 contacts and is permanently connected are characterized in that they are not the bottommost surface of package housing 100. In this embodiment, lead pins 120 contact and are permanently connected to package conductor layer 101B, which is the second layer from the bottom side.

[0021] Furthermore, in the vicinity of the area where the first signal lead pin 121 and the second signal lead pin 122 are in contact with the bottom side of the package housing 100, the package insulator layer and the package conductor layer are selectively removed, and the package housing has a recess 104 in appearance. The recess 104 is formed in the signal lead pin arrangement region on the side of the package housing 100 on the tip side of the signal lead pin, recessed toward the inside of the package housing 100 up to just before the connection point between the signal lead pin and the package conductor layer. The external shape of the space formed by the recess 104 is, for example, a rectangular parallelepiped.

[0022] As a further feature, in an area near where the first signal lead pin 121 and the second signal lead pin 122 abut on the package housing 100, a conductor removed area 106 is provided in which the package conductor layers 101B, 101C are selectively removed only approximately directly above the space between the first signal lead pin 121 and the second signal lead pin in the thickness direction of the package housing 100. In this embodiment, parts of the package conductor layers 101C, 101D are selectively removed inside the package housing 100.

[0023] The mounting board 130 is composed of a multi-layer board in which two layers, a board insulator layer 137, a board insulator layer 138, a board conductor layer 135, and a board conductor layer 136, are formed. The bottom board conductor layer 136 is grounded, and the middle board conductor layer 135 is set to a ground potential. The top board conductor layer is patterned to form a first signal line 131, a second signal line 132, a first ground line 133, and a second ground line 134, which constitute a mounting coplanar line. The board conductor layer 136 and the board conductor layer 135 are electrically connected by a via (ground via) 139 that penetrates the board insulator layer 138. The board conductor layer 135 and the first ground line 133 and the second ground line 134 are electrically connected by a ground via 139 that penetrates the board insulator layer 137. The ground via 139 commonizes the ground potential of the grounded substrate conductor layer 136 and the ground potential of the other substrate conductor layers and ground lines.

[0024] The signal lead pins (first signal lead pin 121, second signal lead pin 122) are connected to the signal lines (first signal line 131, second signal line 132) of the coplanar line for mounting described above. Also, the ground lead pins (first ground lead pin 123, second ground lead pin 124) are connected to the ground lines (first ground line 133, second ground line 134) of the coplanar line for mounting.

[0025] The insulating layer constituting the package housing can be made of alumina ceramics, and the conductor layer constituting the package housing can be made of metal such as titanium, tungsten, etc. Also, the width of the connection portion of the ground lead pin with the ground line of the mounting coplanar line can be made wider than other portions.

[0026] The first ground lead pin 123, the second ground lead pin 124, the first signal lead pin 121, and the second signal lead pin 122 constituting the lead pin 120 have a first bent portion 125 and a second bent portion 126 on the side closest to the package housing 100. The initial bending of the first bent portion 125 on the side closest to the package housing 100 causes the lead pins to be inclined toward the bottom surface of the package. Each of the ground lead pins and the signal lead pins has an inclined portion between the first bent portion 125 and the second bent portion 126 that is inclined in a direction away from the bottom surface of the package housing 100.

[0027] Further, by bending the second bent portion 126, the lead pin structure is made to be approximately aligned with the horizontal plane of the bottommost surface of the package housing 100. In other words, the lead pin 120 has a parallel portion that is parallel to the bottom surface of the package housing 100 on the other end side of the second bent portion 126. However, all the lead pins 120 are cut so that their tip positions are aligned.

[0028] Furthermore, the package conductor layer (package conductor layer 101B) of the package casing 100, to which all the lead pins 120 come into contact and are permanently connected, is characterized in that it is not the bottommost package conductor layer (package conductor layer 101A). In this embodiment, the lead pins 120 come into contact and are permanently connected to the package conductor layer that is the second layer counting from the bottommost package conductor layer.

[0029] Only on the package conductor layer where the first ground lead pin 123 and the second ground lead pin 124 are in contact, a package insulator layer 111 and a package conductor layer 112 are selectively stacked toward the bottom surface of the package housing 100, so that the package conductor layer 112 located at the bottommost surface of the package housing 100 is exposed (FIG. 3A). Note that the package insulator layer 111 is a part of the package insulator layer 102A in FIG. 2, and the package conductor layer 112 is a part of the package conductor layer 101A in FIG. 2.

[0030] In this case, the exposed surface of the added laminated portion is at ground potential on which a conductive layer is formed by plating or the like, and gap 103A, gap 103B generated between the end of the added laminated portion and first ground lead pin 123, and between the rear end of first ground lead pin 123 and gap 103B, respectively, are zero or a desired extremely small gap (Figure 3B).

[0031] The height position in the thickness direction of the package conductor layer to which the first signal lead pin 121 and the second signal lead pin 122 abut and are permanently connected is the same as that of the first ground lead pin 123 and the second ground lead pin 124 in the package housing 100. However, the first signal wiring 109 to which the first signal lead pin 121 is connected and the second signal wiring 110 to which the second signal lead pin 122 is connected have an exposed structure 113 exposed to the external environment (FIG. 3A). The region of the exposed structure 113 is, for example, a groove region formed on the bottom surface (mounting surface) side of the package housing 100 and extending in the lead pin extending direction, and at least one package conductor layer is removed. The first signal wiring 109 and the second signal wiring 110 are differential high-frequency signal lines that can propagate high-frequency signals with the same signal strength and 180-degree phase inversion.

[0032] Furthermore, a countersunk portion 107 is provided between the locations where the first signal lead pin 121 and the first ground lead pin 123 are connected to the package housing 100. Similarly, a countersunk portion 108 is provided between the locations where the second signal lead pin 122 and the second ground lead pin 124 are connected to the package housing 100 (FIG. 3A).

[0033] 4, a removal area 140 is provided in which a substrate conductor layer (substrate conductor layer 135) disposed inside the multilayer substrate is selectively removed in a connection region 201 where the lead pins 120 of the first signal line 131 and the second signal line 132 of the mounting substrate 130 are soldered. In the removal area 140, the grounded substrate conductor layer 135 is not formed below the first signal line 131 and the second signal line 132.

[0034] With the above-mentioned configuration, the lead pin 120, the first signal wiring 109, the second signal wiring 110, and the mounting board 130 are all capable of propagating differential high-frequency signals.

[0035] The principle will now be described. The differential high-frequency signal propagating through the mounting board 130 can propagate without reflection at the location where the lead pins 120 are connected, due to the removed area 140 that suppresses the decrease in differential characteristic impedance. Next, when the differential high-frequency signal is propagated through the lead pins 120 to the high-frequency line formed in the package housing 100 that is located higher than the top surface of the mounting board 130, it is necessary to provide an inclined portion in the lead pins 120 and then connect them to the package housing 100.

[0036] From the inclined portion between the first bent portion 125 and the second bent portion 126 of the lead pin 120 to the connection to the package housing 100, the lead pin 120 is surrounded by air, so the electromagnetic field distribution forming the differential high frequency signal easily spreads, causing discontinuity in the characteristic impedance. The configuration that solves this problem is the recess 104, the countersunk portion 107, and the countersunk portion 108. Since the ground potential is provided at the desired portion in these structures, the result is equivalent to providing a ground wall around the electromagnetic field. The characteristic impedance can be freely designed by the proximity or distance of the ground wall as seen from the signal line, and at the same time, leakage of the electromagnetic field can be suppressed and radiation can be suppressed. These electrophysical actions suppress the spread of the electromagnetic field and at the same time provide the characteristic impedance continuity.

[0037] Furthermore, the first signal wiring 109 and the second signal wiring 110 provided in the package housing 100 have a part of their surfaces exposed to the outside, but are not located at the bottommost surface of the package housing 100, and a package insulator layer 111 and a package conductor layer 112 having a stable ground potential are formed on both sides in the longitudinal direction, which is the extension direction of the lead pins. These package insulator layer 111 and package conductor layer 112 act electrically as a ground wall (guard ground structure). This suppresses the spread of the electromagnetic field even in the package housing 100, enabling stable signal propagation. Moreover, each of the signal lead pins and the ground lead pins has the same width at the tip, and can be arranged at a predetermined interval.

[0038] Thus, according to the first embodiment, even when the height positions of the high-frequency signal lines formed on the mounting substrate 130 and the package housing 100 are different, the high-frequency lead pin connection mechanism enables the high-frequency signal to propagate without reflection and with low loss.

[0039] [Embodiment 2] Next, a mounting structure according to a second embodiment of the present invention will be described with reference to Fig. 5. The second embodiment also includes a high-frequency package 10a and a mounting board on which the high-frequency package 10a is mounted, but the mounting board is not shown in Fig. 5.

[0040] In the high-frequency package 10a having a mounting structure according to the second embodiment, the first ground lead pin 123 has structures 125A and 125B in which the width of a portion of the pin is increased, and the second ground lead pin 124 has structures 126A and 126B in which the width of a portion of the pin is increased.

[0041] Structures 125A and 125B are provided on the inclined portion of first ground lead pin 123. Structures 126A and 126B are provided on the inclined portion of second ground lead pin 124. Thus, in the second embodiment, the width of the ground lead pin at the inclined portion is wider than the width of the signal lead pin at the inclined portion. In this example, as a basic structure, the ground lead pin is wider than the signal lead pin, but in the inclined portion, the ground lead pin is further wider than the signal lead pin compared to other regions.

[0042] In the inclined portion, structure 125A is provided on the inside from first ground lead pin 123 toward first signal lead pin 121, and structure 125B is provided on the opposite side, thereby further widening the inclined portion. Also, in the inclined portion, structure 126A is provided on the inside from second ground lead pin 124 toward second signal lead pin 122, and structure 126B is provided on the opposite side, thereby further widening the inclined portion.

[0043] The inwardly expanded structures 125A and 126A are used for optimum design of the characteristic impedance at the inclined portion of the lead pin 120. That is, they are used for optimization to reduce the characteristic impedance at the inclined portions of the first signal lead pin 121 and the second signal lead pin 122.

[0044] On the other hand, in the present embodiment, the structure 125B and the structure 126B expanded outward are only the lead pins 120 that realize a set of differential lines, but these structures are intended for general use when multiple lead pins are arranged in a horizontal row. In other words, assuming that multiple lead pins 120 are arranged in parallel in either the left or right direction of the arrangement direction of the multiple lead pins 120, or in either the left or right direction, and a case is handled in which a multi-lane differential high-frequency signal is handled, signal lead pins are arranged on both sides of the ground lead pin. In response to this configuration, the structure 125B and the structure 126B expanded outward are provided.

[0045] According to the second embodiment, even when the high-frequency signal lines provided on the mounting board and package housing 100 are at different height positions, the high-frequency lead pin connection mechanism enables the high-frequency signal to propagate without reflection and with low loss.

[0046] Incidentally, the additional laminate adjacent to or in contact with the ground lead pin on the bottom side of the package housing does not have to be a single layer, and a structure can be formed in which multiple package insulator layers and package conductor layers are alternately laminated and the package conductor layers are electrically connected by ground vias formed in the package insulator layers. In this case, the high-frequency line provided on the bottom side of the package housing is not located on the second package conductor layer from the bottom, but is on three or more package conductor layers.

[0047] In the above embodiment, the package insulator layers are four and the package conductor layers are five, but the number of layers is not limited to these. A plurality of laminated structures may be provided on top of the package conductor layer 101E having the ground potential, and the shape of the plurality of laminated structures is free because the electromagnetic field distribution of the high frequency signal is extremely small in this region.

[0048] In addition, in the example shown in the embodiment, the base material (package insulator layer) that occupies most of the structure is alumina ceramics, but it goes without saying that this is not the only possible material. For example, aluminum nitride, zirconia, etc. can be used as ceramic materials, quartz glass, low-melting glass can be used as inorganic materials, and resin materials and fluororesin materials can be used as organic materials. Materials can be appropriately selected and used, taking into account the manufacturing process.

[0049] As described above, according to the present invention, the signal lead pin arrangement area on the side of the package housing, which is on the tip side of the signal lead pin, is provided with a recess that recesses toward the inside of the package housing.Therefore, when a package having high-frequency lead pins is mounted on a mounting board, it is possible to suppress reflection loss at the high-frequency lead pins and enable high-frequency signals to be propagated with low loss.

[0050] It should be noted that the present invention is not limited to the above-described embodiments, and it is apparent that many modifications and combinations can be made by a person having ordinary knowledge in the art within the technical concept of the present invention. [Explanation of symbols]

[0051] 10...high frequency package, 20...solder, 100...package housing, 101A, 101B, 101C, 101D...package conductor layer, 102A, 102B, 102C, 102D...package insulator layer, 103A, 103B...gap, 104...recess, 106...conductor removal area, 107, 108...counterbore portion, 109...first signal wiring, 110...second signal wiring, 111...package insulator layer, 112...package conductor layer, 113...exposed structure, 1 20...lead pin, 121...first signal lead pin, 122...second signal lead pin, 123...first ground lead pin, 124...second ground lead pin, 125...first bend, 126...second bend, 130...mounting board, 131...first signal line, 132...second signal line, 133...first ground line, 134...second ground line, 135, 136...substrate conductor layer, 137, 138...substrate insulator layer, 139...via (ground via), 140...removal area, 201...connection area.

Claims

1. A high-frequency package and a mounting board on which the high-frequency package is mounted, The high frequency package includes: a package housing having a multi-layer structure in which package insulator layers and package conductor layers constituting a coplanar line are alternately laminated; a signal lead pin arranged on the mounting surface side of the package housing, the signal lead pin having a rear end connected to a signal wiring of any one of the package conductor layers constituting the coplanar line; a ground lead pin disposed on the mounting surface side of the package housing, the ground lead pin having a rear end connected to a ground wiring of any one of the package conductor layers constituting the coplanar line; a recess formed in a region of the side surface of the package housing on the tip side of the signal lead pin, the recess being recessed toward the inside of the package housing up to just before a connection portion between the signal lead pin and the package conductor layer; Equipped with each of the ground lead pin and the signal lead pin has a first bent portion and a second bent portion extending from the rear end; each of the ground lead pin and the signal lead pin has an inclined portion between the first bent portion and the second bent portion, the inclined portion being inclined in a direction away from the bottom surface of the package housing, and a parallel portion on the other end side of the second bent portion and parallel to the bottom surface of the package housing; the ground lead pin and the signal lead pin have their tips aligned with each other; The mounting board is a multilayer substrate in which substrate insulator layers and substrate conductor layers are alternately laminated; a coplanar line for mounting formed on a surface of the multilayer substrate; Equipped with the signal lead pin is connected to a signal line of the mounting coplanar line; The mounting structure is characterized in that the ground lead pin is connected to a ground line of the mounting coplanar line.

2. 2. The mounting structure according to claim 1, A mounting structure comprising: a countersunk portion formed on a side surface of the package housing on the tip side of the signal lead pin between a connection point of the signal lead pin and a connection point of the ground lead pin.

3. 3. The mounting structure according to claim 1, A mounting structure, characterized in that a portion of said ground lead pin connected to the ground line of said mounting coplanar line is formed wider than other portions.

4. In the mounting structure according to any one of claims 1 to 3, A mounting structure, characterized in that the width of the ground lead pin at the inclined portion is wider than the width of the signal lead pin at the inclined portion.

5. In the mounting structure according to any one of claims 1 to 4, the signal lead pin is connected to the signal wiring of the package conductor layer other than the package conductor layer on the bottom surface of the package housing; the ground lead pin is connected to the ground wiring of the package conductor layer on the bottom surface of the package housing; A groove is formed in a rear surface of the package housing in an area where the signal lead pins are arranged, in a direction in which the signal lead pins extend, and the package conductor layer to which the signal lead pins arranged in the groove are connected is sandwiched between package insulator layers that form the wall surface of the groove on which the package conductor layer to which the ground lead pins are connected is formed, forming a guard ground structure. A mounting structure characterized by:

6. In the mounting structure according to claim 4 or 5, A mounting structure, wherein each of the signal lead pins and the ground lead pins has the same width at its tip and is arranged at a predetermined interval.

7. In the mounting structure according to any one of claims 1 to 6, A mounting structure, characterized in that the package conductor layer connected to the ground lead pin and the package conductor layers in other layers are at ground potential.

8. In the mounting structure according to any one of claims 1 to 7, the signal lead pin includes a first signal lead pin and a second signal lead pin that form a differential line; A mounting structure, characterized in that at least one of the package conductor layers of the package housing in an area where the first signal lead pin is connected and an area where the second signal lead pin is connected is removed.

9. In the mounting structure according to any one of claims 1 to 8, A mounting structure, characterized in that at least one of the substrate conductor layers is removed in a region where the signal lead pin of the signal line of the mounting coplanar line is connected.

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