Multilayer Electronic Components

Abstract

To provide a multilayer electronic component achieving an improvement in moisture resistance reliability and securing a high capacity.SOLUTION: A multilayer electronic component according to one embodiment of the present invention includes: a body which includes dielectric layers and first and second internal electrodes alternately laminated with respective dielectric layers interposed therebetween, and also includes first and second surfaces opposing each other in a lamination direction, third and fourth surfaces connected to the first and second surfaces and opposing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and opposing each other; a moisture-proof layer which is disposed on any one or more surfaces of the first, second, fifth, and sixth surface and contains a rare-earth oxide; a first external electrode which is disposed on the third surface and connected to the first internal electrodes; and a second external electrode which is disposed on the fourth surface and connected to the second internal electrodes.SELECTED DRAWING: Figure 2

Description

[Technical field]

[0001] The present invention relates to a multilayer electronic component. [Background technology]

[0002] Multi-layered ceramic capacitors (MLCCs), which are one type of multi-layered electronic components, are chip-type capacitors that are mounted on printed circuit boards of various electronic products such as visual devices such as liquid crystal displays (LCDs) and plasma display panels (PDPs), computers, smartphones, and mobile phones to charge and discharge electricity.

[0003] Such multilayer ceramic capacitors have the advantages of being small yet high capacitance and easy to mount, and can be used as components in various electronic devices. As various electronic devices such as computers and mobile devices become smaller and have higher output, there is an increasing demand for multilayer ceramic capacitors that are smaller and have higher capacitance.

[0004] Furthermore, with the recent increase in interest in electrical components for automobiles, multilayer ceramic capacitors are being required to have high reliability and high strength properties so that they can be used in automobiles and infotainment systems.

[0005] In particular, considering the operating environment of automotive electrical components, chip cracks and breakdowns due to moisture penetration are considered to be fatal defects, and a method for ensuring stronger moisture resistance reliability is required. Summary of the Invention [Problem to be solved by the invention]

[0006] One of several objects of the present invention is to improve moisture resistance reliability.

[0007] Another of several objectives of the present invention is to ensure high capacity.

[0008] However, the object of the present invention is not limited to the above-mentioned contents, and can be more easily understood in the course of describing specific embodiments of the present invention. [Means for solving the problem]

[0009] A multilayer electronic component according to one embodiment of the present invention includes a main body including a dielectric layer and first and second internal electrodes alternately stacked with the dielectric layer sandwiched therebetween, the main body including first and second surfaces facing each other in the stacking direction, third and fourth surfaces connected to the first and second surfaces and facing each other, and fifth and sixth surfaces connected to the first to fourth surfaces and facing each other, a waterproof layer disposed on at least one of the first, second, fifth and sixth surfaces and including a rare earth oxide, a first external electrode disposed on the third surface and connected to the first internal electrode, and a second external electrode disposed on the fourth surface and connected to the second internal electrode. Effect of the Invention

[0010] One of the effects of the present invention is that the moisture resistance reliability is improved by disposing a waterproof layer containing a rare earth oxide on the main body.

[0011] However, the various yet significant advantages and effects of the present invention are not limited to the above, and can be more easily understood in the course of describing specific embodiments of the present invention. [Brief description of the drawings]

[0012] [Figure 1] 1 is a perspective view showing a multilayer electronic component according to an embodiment of the present invention; [Diagram 2] 2 is a cross-sectional view taken along line II' in FIG. [Diagram 3] 2 is a cross-sectional view taken along line II-II' in FIG. [Figure 4] FIG. 2 is a perspective view showing a main body of FIG. 1. [Diagram 5] 1A to 1C are diagrams illustrating an example of a process for forming a waterproof layer on the main body of the present invention. [Figure 6] FIG. 2 is a diagram showing a main body on which a waterproof layer is formed in FIG. 1. [Figure 7] FIG. 11 is a perspective view showing a schematic configuration of a main body according to a first modified example of the present invention. [Figure 8] FIG. 11 is a perspective view showing a main body and a waterproof layer according to a first modified example of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0013] Hereinafter, an embodiment of the present invention will be described with reference to a specific embodiment and the attached drawings. However, the embodiment of the present invention may be modified into several other forms, and the scope of the present invention is not limited to the embodiment described below. Furthermore, the embodiment of the present invention is provided to more completely explain the present invention to those having average knowledge in the art. Therefore, the shape and size of elements in the drawings may be enlarged or reduced (or highlighted or simplified) for clearer explanation, and elements indicated by the same reference numerals in the drawings are the same elements.

[0014] In the drawings, parts not related to the description are omitted in order to clearly explain the present invention, thicknesses are enlarged to clearly express a plurality of layers and regions, and components having the same function within the same concept may be described using the same reference numerals. Furthermore, throughout the specification, "comprising" a certain component does not mean excluding other components, but may further include other components, unless otherwise specified to the contrary.

[0015] In the drawings, the X direction can be defined as the second direction, the L direction or the length direction, the Y direction can be defined as the third direction, the W direction or the width direction, and the Z direction can be defined as the first direction, the stacking direction, the T direction or the thickness direction.

[0016] Multilayer Electronic Components FIG. 1 is a perspective view showing a schematic diagram of a multilayer electronic component according to one embodiment of the present invention, FIG. 2 is a cross-sectional view taken along line I-I' in FIG. 1, FIG. 3 is a cross-sectional view taken along line II-II' in FIG. 1, FIG. 4 is a perspective view showing a schematic diagram of the main body of FIG. 1, FIG. 5 is a diagram showing an example of a process for forming a waterproof layer on the main body of the present invention, and FIG. 6 is a diagram showing the main body of FIG. 1 on which the waterproof layer has been formed.

[0017] Hereinafter, a multilayer electronic component according to one embodiment of the present invention will be described in detail with reference to FIGS.

[0018] A multilayer electronic component 100 according to one embodiment of the present invention includes a dielectric layer 111, and first and second internal electrodes 121, 122 stacked alternately with the dielectric layer sandwiched therebetween, and includes a body 110 including first and second surfaces 1, 2 facing each other in the stacking direction (Z direction), third and fourth surfaces 3, 4 connected to the first and second surfaces and facing each other, and fifth and sixth surfaces 5, 6 connected to the first to fourth surfaces and facing each other, a waterproof layer 117 disposed on at least one of the first, second, fifth and sixth surfaces and including a rare earth oxide, a first external electrode 131 disposed on the third surface and connected to the first internal electrode, and a second external electrode 132 disposed on the fourth surface and connected to the second internal electrode.

[0019] The body 110 may be formed by alternately stacking dielectric layers 111 and internal electrodes 121 and 122 .

[0020] Although there is no particular limitation on the specific shape of the body 110, as shown in the drawings, the body 110 may be hexahedral or a similar shape. In addition, the body 110 may have a substantially hexahedral shape, although not a hexahedral shape having perfect straight lines, due to shrinkage of the ceramic powder contained in the body 110 during the firing process.

[0021] The main body 110 may have first and second surfaces 1, 2 facing each other in a first direction (Z direction), third and fourth surfaces 3, 4 connected to the first and second surfaces 1, 2 and facing each other in a second direction (X direction), and fifth and sixth surfaces 5, 6 connected to the first and second surfaces 1, 2, connected to the third and fourth surfaces 3, 4, and facing each other in the third direction (Y direction).

[0022] The multiple dielectric layers 111 forming the body 110 are in a fired state, and the boundaries between adjacent dielectric layers 111 can be integrated to such an extent that they are difficult to see without the use of a scanning electron microscope (SEM).

[0023] According to an embodiment of the present invention, the raw material for forming the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained. For example, a barium titanate-based material, a lead complex perovskite-based material, or a strontium titanate-based material can be used. The barium titanate-based material can include a BaTiO3-based ceramic powder, and the ceramic powder can be, for example, BaTiO3, BaTiO3 partially solid-dissolved with Ca (calcium), Zr (zirconium), etc. 1-x Ca x )TiO3, Ba(Ti 1-y Ca y )O3, (Ba 1-x Ca x )(Ti 1-y Zr y )O3 or Ba(Ti 1-y Zr y )O3, etc.

[0024] The material forming the dielectric layer 111 may be a powder of barium titanate (BaTiO3) or the like to which various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. may be added according to the purpose of the present invention.

[0025] On the other hand, the thickness of the dielectric layer 111 does not need to be particularly limited.

[0026] However, when the dielectric layer is formed to a thickness of less than 0.6 μm, particularly when the thickness of the dielectric layer is 0.4 μm or less, there is a risk of the moisture resistance reliability being reduced.

[0027] Therefore, as described below, when waterproof layer 117 is included according to one embodiment of the present invention, the moisture resistance reliability of the multilayer electronic component can be improved, and sufficient moisture resistance reliability can be ensured even when the thickness of the dielectric layer is 0.4 μm or less.

[0028] That is, when the thickness of the dielectric layer 111 is 0.4 μm or less, the effect of improving the moisture resistance reliability according to the present invention can be more remarkable.

[0029] The thickness of the dielectric layer 111 may refer to an average thickness of the dielectric layer 111 disposed between the first and second internal electrodes 121 and 122 .

[0030] The average thickness of the dielectric layer 111 can be measured by image scanning a cross section (LT cross section) of the body 110 in the length and thickness direction using a scanning electron microscope (SEM).

[0031] For example, for any dielectric layer extracted from an image obtained by scanning a length and thickness cross section (LT cross section) cut at the center of the width direction of the body 110 with a scanning electron microscope (SEM), the thickness can be measured at 30 points spaced equally apart in the length direction, and the average value can be calculated.

[0032] The thickness at the 30 equally spaced points may be measured at a capacitance forming portion, which means a region where the first and second internal electrodes 121 and 122 overlap each other.

[0033] The main body 110 may include a capacitance forming portion in which capacitance is formed, the capacitance forming portion including a first internal electrode 121 and a second internal electrode 122 arranged inside the main body 110 and facing each other with the dielectric layer 111 therebetween, and cover portions 112 and 113 formed on the upper and lower parts of the capacitance forming portion.

[0034] The capacitance forming portion is a portion that contributes to forming the capacitance of the capacitor, and can be formed by repeatedly laminating a plurality of first and second internal electrodes 121, 122 with a dielectric layer 111 sandwiched therebetween.

[0035] The upper cover part 112 and the lower cover part 113 may be formed by stacking a single dielectric layer or two or more dielectric layers in the vertical direction on the upper and lower surfaces of the capacitance forming part, respectively, and may basically serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0036] The upper cover part 112 and the lower cover part 113 do not include an internal electrode and may include the same material as the dielectric layer 111 .

[0037] Furthermore, the body 110 may include margin portions 114 and 115 disposed on both sides of the capacitance forming portion.

[0038] The margins 114 and 115 refer to regions between the ends of the first and second internal electrodes 121 and 122 and the boundary surface of the body 110 in a cross section of the body 110 cut in the width and thickness (WT) direction as shown in FIG.

[0039] The margins 114 and 115 essentially serve to prevent damage to the internal electrodes due to physical or chemical stress.

[0040] The margins 114 , 115 do not include internal electrodes and may include the same material as the dielectric layer 111 .

[0041] The internal electrodes 121, 122 are arranged to face each other with the dielectric layer 111 interposed therebetween.

[0042] The internal electrodes 121 and 122 may include first and second internal electrodes 121 and 122 that are alternately arranged to face each other with a dielectric layer interposed therebetween.

[0043] The first and second internal electrodes 121 and 122 may be exposed to the third and fourth surfaces 3 and 4 of the body 110, respectively.

[0044] 2 to 4, the first internal electrode 121 may be spaced apart from the fourth surface 4 and exposed to the third surface 3, and the second internal electrode 122 may be spaced apart from the third surface 3 and exposed to the fourth surface 4. A first external electrode 131 may be disposed on the third surface 3 of the main body and connected to the first internal electrode 121, and a second external electrode 132 may be disposed on the fourth surface 4 of the main body and connected to the second internal electrode 122.

[0045] The first and second internal electrodes 121 and 122 may be electrically isolated from each other by a dielectric layer 111 disposed therebetween.

[0046] The body 110 can be formed by alternately stacking dielectric layers 111 on which the first internal electrodes 121 are printed and dielectric layers 111 on which the second internal electrodes 122 are printed in the thickness direction (Z direction) and then firing the laminate.

[0047] There is no particular limitation on the material forming the first and second internal electrodes 121, 122. The first and second internal electrodes 121, 122 may be formed using a conductive paste containing, for example, nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), or an alloy thereof.

[0048] The conductive paste may be printed by screen printing, gravure printing, or the like, but the present invention is not limited to this method.

[0049] Meanwhile, there is no need to particularly limit the thickness of the first and second internal electrodes 121, 122. However, in order to more easily achieve miniaturization and high capacity of the multilayer electronic component, the thickness of the first and second internal electrodes 121, 122 may be 0.4 μm or less.

[0050] The thickness of the first and second internal electrodes 121 and 122 may refer to the average thickness of the first and second internal electrodes 121 and 122 .

[0051] The average thickness of the first and second internal electrodes 121 and 122 may be measured by image scanning a cross section (LT cross section) of the body 110 in the length and thickness direction using a scanning electron microscope (SEM).

[0052] For example, the thickness of any first and second internal electrodes 121, 122 extracted from an image obtained by scanning a cross section (LT cross section) of the body 110 cut at the center of the width direction W with a scanning electron microscope (SEM) can be measured at 30 points equally spaced in the length direction, and the average thickness can be calculated.

[0053] The thickness at the equally spaced points 30 may be measured at a capacitance forming portion, which means a region where the first and second internal electrodes 121 and 122 overlap each other.

[0054] The waterproof layer 117 is disposed on at least one of the first, second, fifth and sixth faces 1, 2, 5 and 6, and contains a rare earth oxide.

[0055] Waterproof layer 117 can prevent moisture from penetrating into the inside of the main body through the outer surface of the main body by covering fine pores and cracks in main body 110. Furthermore, waterproof layer 117 contains rare earth oxides, and therefore has water-repellent properties, making it possible to more effectively prevent moisture from penetrating into the inside of the main body through the outer surface of the main body.

[0056] Rare earth oxides have a low interaction with water molecules due to the structural characteristics of the outermost electron shell (obital) being in an octet state. Therefore, rare earth oxides cannot form a hydrogen bonding structure with water molecules and exhibit hydrophobic characteristics. Therefore, by making the waterproof layer 117 contain a rare earth oxide, it is possible to improve the reliability of moisture resistance as well as prevent ion migration, etc.

[0057] Conventionally, in order to improve moisture resistance reliability, a method of coating the surface of the main body with silicone resin or fluorine water repellent has been used. However, the waterproof layer 117 containing rare earth oxide according to the present invention has a significantly lower moisture permeability than conventional coating materials such as silicone resin and fluorine water repellent, and has the advantage of excellent bonding strength with the main body 110.

[0058] The rare earth oxide is not particularly limited, but may be, for example, Dy2O3, CeO2, Pr6O 11 , Nd2O3, Sm2O3, Eu2O3, Gd2O3, Tb4O7, Ho2O3, Er2O3, Tm2O3, Yb2O3, and Lu2O3.

[0059] However, when the rare earth oxide is Dy2O3, it is possible to obtain an effect of improving the compatibility with the main body 110, as compared with other rare earth oxides. Therefore, it is more preferable that the rare earth oxide is Dy2O3.

[0060] The thickness of the waterproof layer 117 can be 100 nm or more.

[0061] If the thickness of the waterproof layer 117 is less than 100 nm, the effect of improving the moisture resistance reliability may be insufficient.

[0062] The upper limit of the thickness of waterproof layer 117 does not need to be particularly limited, and can be determined in consideration of the capacitance and size of the capacitor, etc. For example, the upper limit of the thickness of waterproof layer 117 may be 100 μm or less.

[0063] Meanwhile, the method for forming the waterproof layer 117 containing rare earth oxide is not particularly limited. For example, the waterproof layer 117 may be formed by using an atomic layer deposition (ALD) method, a molecular layer deposition (MLD) method, a chemical vapor deposition (CVD) method, a sputtering method, or the like.

[0064] A more preferable method for forming waterproof layer 117 containing rare earth oxide is to produce a sheet of rare earth oxide and transfer it to main body 110 to form waterproof layer 117.

[0065] 4 to 6, after the body 110 is provided, the coating layer 117 can be formed by transferring the sheets 117a, 117b, 117c, and 117d containing rare earth oxides to the body 110.

[0066] The sheet containing rare earth oxide may include components that form the dielectric layer 111, and rare earth oxide may be added to a powder such as barium titanate (BaTiO3) and various ceramic additives, organic solvents, plasticizers, binders, dispersants, etc. depending on the purpose of the present invention.

[0067] By making the waterproof layer 117 contain the same material as the dielectric layer 111, it is possible to further improve the bonding strength between the main body 110 and the waterproof layer 117. In addition, there is an advantage that the shape of the waterproof layer 117 can be easily controlled.

[0068] The external electrodes 131 and 132 are disposed on the body 110 and connected to the internal electrodes 121 and 122. As shown in Fig. 2, the electrochemical cell may include first and second external electrodes 131 and 132 connected to the first and second internal electrodes 121 and 122, respectively.

[0069] The first and second external electrodes 131, 132 may be electrically connected to the first and second internal electrodes 121, 122, respectively, to form capacitance, and the second external electrode 132 may be connected to a different potential than the first external electrode 131.

[0070] The first external electrode 131 may be disposed on the third surface 3 and connected to the first internal electrode 121 , and the second external electrode 132 may be disposed on the fourth surface 4 and connected to the second internal electrode 122 .

[0071] The first external electrode 131 may be arranged to extend from the third surface 3 to cover a portion of the waterproof layer 117, and the second external electrode 132 may be arranged to extend from the fourth surface 4 to cover a portion of the waterproof layer 117.

[0072] Meanwhile, the external electrodes 131 and 132 may be formed using any material having electrical conductivity such as metal, and a specific material may be determined in consideration of electrical characteristics, structural stability, etc. Furthermore, the external electrodes 131 and 132 may have a multi-layer structure.

[0073] For example, the external electrodes 131 and 132 may be fired electrodes containing a conductive metal and glass, or may be resin-based electrodes containing a conductive metal and resin.

[0074] The external electrodes 131 and 132 may also be formed by using an atomic layer deposition (ALD) method, a molecular layer deposition (MLD) method, a chemical vapor deposition (CVD) method, a sputtering method, or the like.

[0075] Moreover, the external electrodes 131 and 132 can also be formed by transferring a sheet containing a conductive metal onto the main body 110 .

[0076] Referring to Figure 2, a specific example of the external electrodes 131, 132 is as follows: the first external electrode 131 includes a first electrode layer 131a arranged so as to be in contact with the first internal electrode 121, and a first conductive resin layer 131b arranged on the first electrode layer 131a, and the second external electrode 132 includes a second electrode layer 132a arranged so as to be in contact with the second internal electrode 122, and a second conductive resin layer 132b arranged on the second electrode layer 132a.

[0077] In this case, the electrode layers 131a and 132a may include a conductive metal and glass.

[0078] The conductive metal included in the electrode layers 131a and 132a is not particularly limited as long as it is a material that can be electrically connected to the internal electrodes to form capacitance. For example, the conductive metal used for the electrode layers 131a and 132a may be one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0079] The electrode layers 131a and 132a can be formed by applying a conductive paste prepared by adding glass frit to the conductive metal powder, and then firing the paste.

[0080] Moreover, the conductive resin layers 131b and 132b may contain a conductive metal and a base resin.

[0081] The conductive metal contained in the conductive resin layers 131b and 132b serves to electrically connect the electrode layers 131a and 132a.

[0082] The conductive metal contained in the conductive resin layers 131b and 132b is not particularly limited as long as it is a material that can be electrically connected to the electrode layers 131a and 132a. The conductive metal contained in the conductive resin layers 131b and 132b may be, for example, one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0083] The conductive metal contained in the conductive resin layers 131b and 132b may contain one or more of spherical powder and flake powder. That is, the conductive metal may consist of only flake powder or only spherical powder. Alternatively, the conductive metal may be a mixture of flake powder and spherical powder.

[0084] Here, the spherical powder may include a shape that is not a perfect sphere. For example, it may include a shape in which the ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) is 1.45 or less.

[0085] The flake-like powder means a powder having a long and flat shape, and is not particularly limited, and may have, for example, a ratio of the length of the major axis to the length of the minor axis (major axis / minor axis) of 1.95 or more.

[0086] The lengths of the major and minor axes of the spherical powder and the flaky powder can be measured from an image obtained by scanning a cross section (LT cross section) in the X and Z directions cut at the center of the width Y direction of the multilayer electronic component with a scanning electron microscope (SEM).

[0087] The base resin contained in the conductive resin layers 131b and 132b ensures bonding properties and plays a role in shock absorption.

[0088] The base resin contained in the conductive resin layers 131b and 132b is not particularly limited as long as it has bonding and shock absorbing properties and can be mixed with the conductive metal powder to produce a paste. The base resin may be, for example, an epoxy resin.

[0089] Meanwhile, the external electrodes 131 and 132 may further include plating layers 131c and 132c disposed on the conductive resin layers 131b and 132b in order to improve mounting characteristics.

[0090] The type of the plating layers 131c and 132c is not particularly limited, and may be a plating layer containing at least one of Ni, Sn, Pd, and alloys thereof, and may be formed of a plurality of layers.

[0091] Furthermore, the plating layers 131c and 132c may include, for example, a Ni plating layer and a Sn plating layer disposed on the Ni plating layer.

[0092] Meanwhile, the waterproof layer 117 may be disposed on all of the first, second, fifth and sixth surfaces of the body 110. By disposing the waterproof layer 117 on all of the first, second, fifth and sixth surfaces of the body 110, the effect of improving moisture resistance reliability can be further improved.

[0093] However, the present invention is not limited to the case where the waterproof layer 117 is disposed on all of the first, second, fifth and sixth surfaces of the main body 110, and the waterproof layer 117 may be disposed only on the first surface, or only on the first and second surfaces, or only on the fifth and sixth surfaces.

[0094] FIG. 7 is a perspective view showing a main body 110' according to a first modified example of the present invention, and FIG. 8 is a perspective view showing a main body 110' and a waterproof layer 117 according to the first modified example of the present invention.

[0095] 7 and 8, the waterproof layer 117 is arranged on the first, second, fifth and sixth surfaces of the main body 110, the first internal electrode 121' is spaced apart from the fourth surface 4 and exposed to the third, fifth and sixth surfaces 3, 5 and 6, and the second internal electrode 122' is spaced apart from the third surface 3 and exposed to the fourth, fifth and sixth surfaces 4, 5 and 6.

[0096] As a result, the first and second internal electrodes 121', 122' exposed on the fifth and sixth surfaces of the body 110' are covered with the waterproof layer 117, thereby making it possible to protect the multilayer electronic component from the outside.

[0097] That is, the waterproof layer 117 serves the role of the margin parts 114, 115 or the cover parts 112, 113, and thus can prevent damage to the internal electrodes due to physical or chemical stress.

[0098] Furthermore, by maximizing the overlapping area between the first internal electrode 121' and the second internal electrode 122', the capacitance per unit volume can be improved.

[0099] Although the embodiments of the present invention have been described in detail above, it will be apparent to those skilled in the art that the scope of the present invention is not limited thereto, and that various modifications and variations are possible within the scope of the technical idea of ​​the present invention described in the claims. [Explanation of symbols]

[0100] 100 Multilayer electronic components 110 Main unit 121, 122 First and second internal electrodes 111 Dielectric layer 112, 113 Cover part 117 Waterproof layer 131, 132 First and second external electrodes 131a, 132a electrode layer 131b, 132b Conductive resin layer 131c, 132c plating layer

Claims

1. A body including a dielectric layer, and first and second internal electrodes which are alternately stacked with the dielectric layer sandwiched therebetween, the body including a first face and a second face which face each other in the stacking direction, a third face and a fourth face which are connected to the first face and the second face and face each other, and a fifth face and a sixth face which are connected from the first face to the fourth face and face each other; A waterproof layer disposed on one or more of the first surface, the second surface, the fifth surface, and the sixth surface, the waterproof layer including a rare earth oxide; a first external electrode disposed on the third surface and connected to the first internal electrode; a second external electrode disposed on the fourth surface and connected to the second internal electrode, The laminated electronic component, wherein the waterproof layer is made of a rare earth oxide.

2. The rare earth oxide is Dy ２ O ３ , CeO ２ , P ６ O １１ , Nd ２ O ３ , Sm ２ O ３ , Eu ２ O ３ , Gd ２ O ３ , Tb ４ O ７ , Ho ２ O ３ , Er ２ O ３ , Tm ２ O ３ , Yb ２ O ３ , and Lu ２ O ３ 2. The multilayer electronic component according to claim 1, wherein the multilayer electronic component is one or more selected from the following:

3. The rare earth oxide is Dy ２ O ３ 3. The multilayer electronic component according to claim 1 or 2,

4. 4. The multilayer electronic component according to claim 1, wherein the waterproof layer has a thickness of 100 nm or more.

5. A body including a dielectric layer, and first and second internal electrodes stacked alternately with the dielectric layer sandwiched therebetween, the body including a first face and a second face opposing each other in the stacking direction, a third face and a fourth face connected to the first face and the second face and opposing each other, and a fifth face and a sixth face connected from the first face to the fourth face and opposing each other; A waterproof layer disposed on one or more of the first surface, the second surface, the fifth surface, and the sixth surface, the waterproof layer including a rare earth oxide; a first external electrode disposed on the third surface and connected to the first internal electrode; a second external electrode disposed on the fourth surface and connected to the second internal electrode, The laminated electronic component, wherein the waterproof layer further includes the same material as the dielectric layer.

6. The multilayer electronic component according to claim 1 , wherein the waterproof layer is disposed on all of the first surface, the second surface, the fifth surface, and the sixth surface.

7. the first internal electrode is spaced apart from the fourth surface of the body and exposed to the third surface, the fifth surface, and the sixth surface; The multilayer electronic component according to claim 6 , wherein the second internal electrodes are spaced apart from the third surface of the body and exposed to the fourth surface, the fifth surface, and the sixth surface.

8. the first external electrode includes a first electrode layer disposed so as to be in contact with the first internal electrode, and a first conductive resin layer disposed on the first electrode layer, 8. The multilayer electronic component according to claim 1, wherein the second external electrode includes a second electrode layer arranged so as to be in contact with the second internal electrode, and a second conductive resin layer arranged on the second electrode layer.

9. 9. The laminated electronic component according to claim 8, wherein the first electrode layer and the second electrode layer comprise a conductive metal and a glass.

10. 10. The multilayer electronic component according to claim 8, wherein the first conductive resin layer and the second conductive resin layer each contain a conductive metal and a base resin.

11. 11. The multilayer electronic component according to claim 8, further comprising a plating layer disposed on the first conductive resin layer and the second conductive resin layer.

12. 12. The multilayer electronic component according to claim 1, wherein the dielectric layers have an average thickness of 0.4 μm or less.

13. 13. The multilayer electronic component according to claim 1, wherein the first internal electrodes and the second internal electrodes have an average thickness of 0.4 μm or less.

14. 12. The multilayer electronic component according to claim 1, wherein the dielectric layers have an average thickness of 0.4 μm or less, and the first internal electrodes and the second internal electrodes have an average thickness of 0.4 μm or less.

15. a main body including a dielectric layer, and first and second internal electrodes alternately stacked with the dielectric layer sandwiched therebetween, the main body including a first surface and a second surface facing each other in the stacking direction, a third surface and a fourth surface connected to the first surface and the second surface and facing each other, and a fifth surface and a sixth surface connected to the first surface and the fourth surface and facing each other; an oxide layer made of a rare earth oxide and disposed on at least one of the first surface, the second surface, the fifth surface, and the sixth surface; a first external electrode disposed on the third surface and connected to the first internal electrode; a second external electrode disposed on the fourth surface and connected to the second internal electrode.

16. The rare earth oxide is Dy ２ O ３ , CeO ２ , P ６ O １１ , Nd ２ O ３ , Sm ２ O ３ , Eu ２ O ３ , Gd ２ O ３ , Tb ４ O ７ , Ho ２ O ３ , Er ２ O ３ , Tm ２ O ３ , Yb ２ O ３ , and Lu ２ O ３ 16. The multilayer electronic component according to claim 15, wherein the multilayer electronic component is one or more selected from the following:

17. The rare earth oxide is Dy ２ O ３ The multilayer electronic component according to claim 15 or 16,

18. 18. The multilayer electronic component according to claim 15, wherein the oxide layer has a thickness of 100 nm or more.

19. The multilayer electronic component according to claim 15 , wherein the oxide layer further contains the same material as the dielectric layer.

20. 20. The multilayer electronic component according to claim 15, wherein the oxide layer is disposed on all of the first surface, the second surface, the fifth surface, and the sixth surface.

21. the first external electrode includes a first electrode layer disposed so as to be in contact with the first internal electrode, and a first conductive resin layer disposed on the first electrode layer, the second external electrode includes a second electrode layer disposed so as to be in contact with the second internal electrode, and a second conductive resin layer disposed on the second electrode layer, 21. The multilayer electronic component according to claim 15, wherein the first conductive resin layer and the second conductive resin layer contain a conductive metal and a base resin, and further include a plating layer disposed on the first conductive resin layer and the second conductive resin layer.

22. 22. The laminated electronic component of claim 21, wherein the first electrode layer and the second electrode layer comprise a conductive metal and a glass.

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