Memory module mounting test system and method

Abstract

To provide a memory module mounting test system and method capable of performing a rapid mounting test of a large number of memory modules.SOLUTION: A memory module mounting test system includes: a test tray mounting a memory module array in which multiple memory modules are positioned in a predetermined pattern; a tester that can seat the test array, and tests the memory module array while a socket corresponding to a predetermined pattern is formed; a transfer transferring the test tray from an initial position to a seating position in which the test tray is seated in the tester; and a mounting apparatus mounting the memory module transferred to the seating position to a socket.SELECTED DRAWING: Figure 1

Description

[Technical field]

[0001] The present invention relates to a memory module mounting test system and method. [Background technology]

[0002] A memory module is a computer's primary storage device and is configured to be detachable from a motherboard. After manufacturing, memory modules undergo various quality inspection tests to check their individual performance. However, even memory modules that are determined to be normal often do not function properly when actually used.

[0003] For this reason, memory modules undergo implementation tests before shipping to determine whether they can operate normally in an environment similar to that of actual use. When the implementation test is performed, the memory module is evaluated to see whether it can operate normally when inserted and installed in a socket on an actual motherboard (or mainboard).

[0004] Such mounting tests are carried out by manually or automatically mounting memory modules one by one into sockets, and therefore it takes a considerable amount of time to carry out mounting tests on a large number of memory modules.

[0005] In addition, when memory module installation is automated, if the memory module is installed with the socket misaligned, it may not be possible to install it or the memory module may be damaged during the installation process. To prevent this, it is necessary to instruct each memory module on how to install, and this process also takes a considerable amount of time. Summary of the Invention [Problem to be solved by the invention]

[0006] An object of the present invention is to provide a memory module mounting test system and method capable of quickly carrying out mounting tests on a large number of memory modules.

[0007] Another problem to be solved by the present invention is to prevent a memory module from being misaligned with a socket during installation of the memory module without requiring a separate teaching operation, which may result in a test being impossible or the memory module being damaged.

[0008] The objects of the present invention are not limited to those mentioned above, and other objects not mentioned will be clearly understood by those skilled in the art from the following description. [Means for solving the problem]

[0009] To solve the above problems, a memory module mounting test system according to an embodiment of the present invention includes a test tray on which a memory module array having a plurality of memory modules arranged in a predetermined pattern is loaded, a tester on which the test tray can be seated and on which sockets corresponding to the predetermined pattern are formed and which performs tests on the memory module array, a transfer which moves the test tray from an initial position to a seating position where the test tray is seated on the tester, and a mounting device which mounts the memory module array transferred to the seating position into the sockets.

[0010] The transfer may include a support part supporting the test tray positioned at the initial position, a first driving part transporting the support part from the initial position to the seating position, a second driving part rotating the support part, an angle adjustment sensor detecting an adjustment angle by which the support part should be rotated so that the memory module array and the socket are aligned, and a control part controlling the first driving part and the second driving part so that the support part is transported to the seating position and rotated corresponding to the adjustment angle.

[0011] The angle adjustment sensor is located adjacent to the socket and recognizes two setting areas that guide the placement state of the socket to grasp the adjustment angle.

[0012] The two defined areas may protrude or recess from the adjacent areas.

[0013] The angle adjustment sensor measures distances by scanning an area including the two set areas, and recognizes two areas having a critical distance difference compared to surrounding areas in the scanned area as the two set areas.

[0014] The angle adjustment sensor measures distances by scanning a first region including one of the two set regions and a second region including the other of the two set regions, and recognizes two regions in the first and second regions that have a critical distance difference compared to surrounding areas in the two set regions.

[0015] Optically recognizable markers are disposed in the two set areas, and the angle adjustment sensor recognizes the two set areas based on light reflected from the markers.

[0016] The initial position and the seating position may have different coordinates according to a first axis, a second axis, and a third axis. The first driving unit may include a first axis driving unit that moves the support part along a first axis, a second axis driving unit that moves the support part along a second axis, and a third axis driving unit that moves the support part along a third axis.

[0017] The test tray moves along a first axis and a second axis, and then moves along a third axis into the seating position.

[0018] The two set regions may be positioned such that an imaginary line connecting the two set regions forms a preset angle with the third axis.

[0019] The transfer may further include a rail formed along the first axis so that the first axis drive portion transports the support portion.

[0020] A plurality of the testers may be provided, and the plurality of testers may be arranged on both sides of the rail along the length of the rail.

[0021] The control unit seats the test trays on the respective testers in a preset order.

[0022] The test tray may be formed with a plurality of through-slits into which the memory modules are respectively inserted.

[0023] The mount presses the memory module array against one side of a through-sleeve to mount the memory module array in the socket located on the other side of the through-sleeve.

[0024] To solve the above problems, a memory module mounting test method according to an embodiment of the present invention includes the steps of loading a memory module array, in which a plurality of memory modules are arranged in a predetermined pattern, on a test tray; a transfer device transporting the test tray to a tester in which sockets corresponding to the predetermined pattern are formed; the transfer device rotating the test tray so that the memory module array is aligned with the sockets; and a mounting device mounting the memory module array in the sockets and the tester testing the memory module array.

[0025] Further details of the invention are contained in the detailed description and the drawings. Effect of the Invention

[0026] According to the embodiment of the present invention, at least the following effects are obtained.

[0027] Rapid on-board testing of a large number of memory modules is possible.

[0028] The effects of the present invention are not limited to the above-mentioned examples, and more various effects are included in the present specification. [Brief description of the drawings]

[0029] [Figure 1] 1 is a perspective view of a memory module mounting test system according to an embodiment of the present invention; [Diagram 2] FIG. 2 illustrates a test tray according to one embodiment of the present invention. [Diagram 3] FIG. 2 is a conceptual diagram illustrating a handler according to an embodiment of the present invention. [Figure 4] FIG. 2 is a schematic representation of a transfer according to an embodiment of the present invention. [Diagram 5] FIG. 2 is a block diagram of a transfer and control unit according to the present invention. [Figure 6] FIG. 2 is a perspective view of a tester array according to one embodiment of the present invention. [Figure 7] FIG. 2 is an enlarged view of a tester and a tester rack according to an embodiment of the present invention. [Figure 8] FIG. 1 illustrates a tester being misaligned with respect to adjacent testers. [Figure 9] 11 is a view for explaining how the angle adjustment sensor grasps the adjustment angle. [Figure 10] 13 is a diagram illustrating an example of a method for an angle adjustment sensor to recognize a layer number identifier. [Figure 11] FIG. 2 is a representation of the installation of a memory module array into a socket. [Figure 12] 1 is a diagram conceptually illustrating a memory module mounting test system according to an embodiment of the present invention. [Figure 13] 1 is a conceptual diagram illustrating a transfer according to an embodiment of the present invention transporting a test tray from an initial position to a seating position. [Figure 14] 4 is a flowchart of a memory module mounting test method according to an embodiment of the present invention. DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

[0030] The advantages and features of the present invention, as well as the methods for achieving them, will become clear from the following detailed description of the embodiments in conjunction with the accompanying drawings. However, the present invention is not limited to the embodiments disclosed below, and may be realized in various different forms, and the embodiments are provided to fully disclose the present invention and fully inform those skilled in the art of the scope of the invention, and the present invention is only defined by the scope of the claims.

[0031] In addition, the embodiments described in this specification are described with reference to cross-sectional views and / or schematic diagrams which are ideal exemplary views of the present invention. Therefore, the shapes of the exemplary views may be modified due to manufacturing techniques and / or tolerances. In addition, in each of the views shown in the present specification, each component may be slightly enlarged or reduced for convenience of explanation. The same reference numerals refer to the same components throughout the specification.

[0032] DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, the present invention will be described with reference to the drawings for explaining a memory module mounting test system and method according to an embodiment of the present invention.

[0033] FIG. 1 is a perspective view of a memory module mounting test system according to an embodiment of the present invention.

[0034] As shown in FIG. 1, a memory module mounting and testing system 1 according to the present invention includes a handler 100, a transfer 200, and a tester array 300.

[0035] The handler 100 may be a unit that receives memory modules that require an external mounting test and stores memory modules that have undergone a mounting test before being removed. More specifically, when a memory module is loaded into the handler 100, the handler 100 may align the memory module on a test tray, which will be described later.

[0036] In addition, the handler 100 arranges the memory modules that have completed the mounting test so that they can be removed. At this time, the handler 100 can classify and arrange the memory modules according to the results of the mounting test.

[0037] The transfer 200 may be a transfer unit that transfers memory modules between the tester 330 and the handler 100. The transfer 200 transfers memory modules stored in the handler 100 to the tester 330 for implementation testing. In addition, the transfer 200 pulls out memory modules for which implementation testing has been completed from the tester 330 and transfers them to the handler 100.

[0038] The transfer 200 may be configured to support the test tray and then move it in six axial directions. The transfer 200 may also be configured to rotate the test tray it holds. This will be described in detail later.

[0039] For ease of explanation, the position where the transfer 200 supports the test tray 30 in the handler 100 will be referred to as the initial position, and the position where the transfer 200 places the test tray 30 on the tester 330 will be referred to as the placement position.

[0040] The tester array 300 may be formed by arranging a plurality of testers 330. The tester 330 may be a test unit that performs an implementation test of a memory module. The tester 330 may include a motherboard and a socket electrically connected to the motherboard.

[0041] Although FIG. 1 illustrates that the tester array 300 is disposed on only one side of the transfer 200, the present invention is not limited thereto. For example, the tester array 300 may be disposed symmetrically on both sides of the transfer 200 as necessary. As an example, the testers 330 may be arranged at a predetermined interval in the vertical and horizontal directions. Also, FIG. 1 illustrates an example in which the testers 330 are disposed in two layers, one above the other, but the present invention is not limited thereto, and the number of layers of the testers 330 may be freely set.

[0042] FIG. 2 shows a test tray according to one embodiment of the present invention.

[0043] 2, the test tray 30 is a tray on which the memory module array 10 is loaded. Here, the memory module array 10 may be formed by arranging a plurality of memory modules 11 in a predetermined pattern.

[0044] The test tray 30 may be formed with a through-slit (not numbered) into which the memory modules 11 are attached. The through-slit may be defined by a space between a pair of inserts 31 that selectively fix the memory modules 11. When attached to the inserts 31, the upper side of the memory module 11 is exposed to one side of the test tray 30 and the lower side is exposed to the rear surface of the test tray 30. Meanwhile, the predetermined arrangement pattern of the memory module array 10 may be set to match with the sockets formed in the tester 330. That is, the pattern in which the memory modules 11 are arranged may correspond to the pattern of the multiple sockets formed in the tester 330.

[0045] 3 is a conceptual diagram of a handler according to an embodiment of the present invention. As shown in FIG. 3, a test tray 30 and a user tray 20 may be arranged in the internal space of a handler 100.

[0046] The user tray 20 is a tray for loading and unloading the memory modules 11. Memory modules 11 for which a mounting test is to be performed may be placed on the user tray 20. Furthermore, memory modules 11 that have completed a mounting test may be classified according to the test results and placed on the user tray 20. This will be described later when explaining the loading site L and the unloading site UL.

[0047] The space inside the handler 100 is divided into a loading site L and an unloading site UL depending on the purpose. The loading site L may be a space where the memory modules 11 of the carried user tray 20 are loaded onto the test tray 30 for mounting test.

[0048] In contrast, the unloading site UL may be a space where memory modules 11 that have completed the mounting test are unloaded onto a user tray 20 to be delivered to the outside. At this time, the memory modules 11 are classified and arranged on the user tray 20 according to the results of the mounting test. For example, the memory modules 11 are classified into normal, defective, and need re-inspection, and memory modules 11 with different results are arranged in different areas on the user tray 20.

[0049] Meanwhile, the test tray 30 that has completed unloading at the unloading site UL moves to the loading site L to load the memory modules 11 again. That is, the test tray 30 circulates inside the memory module mounting test system 1 to load or unload the memory modules 11.

[0050] For this purpose, the handler 100 includes at least one hand (not shown) for picking and placing the memory module 11. Preferably, the handler 100 may include a first hand (not shown) for transferring the memory module 11 to the loading site L and a second hand (not shown) for transferring the memory module 11 to the unloading site UL.

[0051] One side of the loading site L and one side of the unloading site UL are configured so that the transfer 200 can enter the handler 100 and hold and / or support the test tray 30. In contrast, the other side of the loading site L and the other side of the unloading site UL are configured so that the user tray 20 can be transferred to and from the outside. For example, the user tray 20 is automatically transferred by a robot such as an AGV (Automated Guided Vehicle) or manually transferred by a user.

[0052] 4 is a schematic diagram of a transfer according to an embodiment of the present invention. As shown in FIG. 4, a transfer 200 according to an embodiment of the present invention includes a frame 240, a transfer plate 210, a column member 220, and a support part 230.

[0053] The frame 240 defines an area in which the transfer 200 can move, and is configured to be able to entirely support the transfer 200. Specifically, the frame 240 may be in the shape of a substantially rectangular parallelepiped having a length in the first axis direction, a height in the second axis direction, and a width in the third axis direction.

[0054] The rail 241 constitutes a part of the frame 240 and is a member for the first-axis linear motion of the support part 230. For this purpose, the rail 241 is formed to extend along the first axis. For example, the rail 241 is provided in a pair and constitutes a lower part of the frame 240.

[0055] The transfer plate 210 may be configured to be movable with respect to a first axis on the frame 240. The transfer plate 210 is coupled to a rail 241 by a linear guide, and moves along the first axis by a first axis driving unit 251 (see FIG. 5) described later.

[0056] The pillar member 220 is configured to extend in the vertical direction and is supported by the transfer plate 210. The pillar member 220 is formed so that the support part 230 can move in the vertical direction (second axial direction).

[0057] The support portion 230 may be configured to support or grip the test tray 30 (see FIGS. 2 and 3 ) and may be configured to be linearly movable in the third axial direction by a predetermined length so that the test tray 30 can be exchanged with the handler 100 or the tester 300.

[0058] Therefore, the transfer 200 can enter the inside of the handler 100 or the tester 300 to seat the test tray 30 and then exit, or can enter the inside of the handler 100 or the tester 300 to remove the test tray 30.

[0059] In addition, the support unit 230 is configured to be able to rotate the supported test tray 30. More specifically, the support unit 230 can rotate the test tray 30 around the second axis as a rotation axis.

[0060] The support part 230 may include a lower structure including a sliding member 231 , a supporting plate 232 , a rotating plate 233 and a retractable member 234 .

[0061] One side of the sliding member 231 is slidably connected to the pillar member 220 and can move up and down along the second axis direction. The support plate 232 may be connected to the other side of the sliding member 231 and can move in the third axis direction. The rotation plate 233 is connected to the upper surface of the support plate 232 and is formed to be rotatable about the second axis.

[0062] The retractable member 234 rotates together with the rotating plate 233 and is formed so as to be retractable on the rotating plate 233. The retractable member 234 is configured to play a role in directly gripping or supporting the test tray 30.

[0063] For example, when the test tray 30 is removed from the handler 100, the support part 230 enters below the test tray 30 with the retractable member 234 inserted inside the rotating plate 233. After the support part 230 enters, the retractable member 234 can protrude to grip or support the test tray 30.

[0064] Also, for example, when the supporter 230 seats the test tray 30 on the tester 330, the supporter 230 transfers the test tray 30 to a transfer device (not shown) provided on the tester 330, and then the retractable member 234 may be inserted again into the inside of the rotating plate 233. Here, the transfer device may be realized in various configurations. For example, the transfer device may be positioned between a pair of retractable members 234 below the test tray 30 as the supporter 230 enters the seating position, and may transfer the test tray 30. Alternatively, the transfer device may be configured as a separate third hand (not shown).

[0065] However, the above-mentioned configuration of the transfer 200 is merely illustrative, and the transfer 200 may be implemented differently from the above-mentioned example as long as the first to third axes are capable of six-directional movement and rotational movement around the second axis, and the transfer 200 is configured to transport the test tray 30.

[0066] FIG. 5 is a block diagram of the transfer and control units of the present invention.

[0067] As shown in FIG. 5, to realize the movement of the transfer, the transfer 200 includes a first drive unit 250, a second drive unit 260 and an angle adjustment sensor 270.

[0068] The first actuator 250 may be a drive unit for moving the transfer from the initial position to the seated position. For example, the first actuator 250 may be realized using various conventional configurations such as a piston-cylinder mechanism, a motor, etc.

[0069] The first driving part 250 is divided into a first shaft driving part 251, a second shaft driving part 253, and a third shaft driving part 255 according to the direction in which the support part 230 is moved.

[0070] The first axis driving unit 251 is a driving unit that moves the transfer plate 210 in both directions (front-back direction) along the first axis. The second axis driving unit 253 is a driving unit that moves the slide member 231 in both directions (up-down direction) along the second axial direction. In contrast, the third axis driving unit 255 is a driving unit that moves the support plate 232 in both directions (left-right direction) along the third axis.

[0071] The second driving unit 260 is a driving unit capable of rotating the rotating plate 233 about a second axis as a central axis. The second driving unit 260 may be realized based on a motor, for example.

[0072] When the first axis driving unit 251, the second axis driving unit 253, the third axis driving unit 255 and the second driving unit 260 are realized based on motors, the first axis driving unit 251, the second axis driving unit 253, the third axis driving unit 255 and the second driving unit 260 may further include an encoder capable of grasping the amount of movement and / or the amount of rotation.

[0073] More specifically, the encoder can sense the rotation speed and direction of the motor to obtain sensing information, which the control unit 280 can use to grasp the first, second and third axis coordinates of the support unit 230 and to grasp the rotation state of the rotation plate 233.

[0074] The angle adjustment sensor 270 is configured to grasp an adjustment angle for the rotating plate 233. Here, the adjustment angle means an angle by which the rotating plate 233 should be rotated so that the test tray 30 supported by the support part 230 and the socket of the tester 330 are aligned. The adjustment angle will be described in detail later.

[0075] The control unit 280 may be a control unit that controls the first driving unit 250 and the second driving unit 260. Under the control of the control unit 280, the support unit 230 can transfer the test tray 30 (see FIGS. 2 and 3) from an initial position. Also, under the control of the control unit 280, the support unit 230 can move to a seating position and transfer the test tray 30 to the tester 330.

[0076] FIG. 6 is a perspective view of a tester array according to one embodiment of the present invention.

[0077] 6, the tester array 300 may include a tester rack 310 to which a plurality of testers 330 are attached. The tester rack 310 may be a framework structure to which a plurality of testers 330 and a plurality of attachments 320 are attached.

[0078] The mount 320 may be mounted on the tester rack 310 so as to be located above each tester 330. In addition, the mount 320 may perform a pressing operation by lowering its lower end while its upper end is fixed to the tester rack 310. Such a pressing operation may be achieved by a mount driver 321. The mount driver 321 may be achieved by any of various conventional driving units that enable the mount 320 to perform a pressing operation.

[0079] Meanwhile, coordinate identifiers 351 and 352 are positioned on the tester rack 310. The coordinate identifiers 351 and 352 are positioned to grasp the seating position and adjustment angle of each tester 330.

[0080] The coordinate identifiers 351 and 352 can be realized in various configurations depending on the coordinate identification method of the transfer 200. The positions of the coordinate identifiers 351 and 352 are set to guide the first axis coordinate, the second axis coordinate, or the third axis coordinate of the tester 330, or to guide the arrangement state of the tester 330 (or the socket of the tester). Hereinafter, for convenience of explanation, the area where the coordinate identifiers 351 and 352 are located is referred to as a set area.

[0081] In addition, for the sake of convenience, the following description will be given using an example in which the angle adjustment sensor 270 recognizes all of the first axis coordinate, the second axis coordinate, the third axis coordinate, and the placement state of the tester 330, but the present invention is not limited to this.

[0082] For example, at least one of the first axis coordinate, the second axis coordinate, the third axis coordinate, and the placement state of the tester 330 may be sensed by any one sensor, or each may be sensed by one sensor.

[0083] The coordinate identifiers 351 and 352 are classified into a length coordinate identifier 351 and a layer number coordinate identifier 352 according to the object of identification. The length coordinate identifier 351 may be located according to the second axis coordinate same as the initial position. The layer number coordinate identifier 352 may be located according to the second axis coordinate same as the seating position.

[0084] The tester and its supporting structure will be further described below with reference to Fig. 7. Fig. 7 is an enlarged view of a tester and a tester rack according to an embodiment of the present invention.

[0085] 7, the tester rack 310 (see FIG. 6) can be divided into a plurality of support racks 311. For example, the tester rack 310 may be formed by arranging a plurality of support racks 311 along the first axial direction.

[0086] Meanwhile, two layer number coordinate identifiers 352a and 352b are located adjacent to the socket 331 in the support rack 311. The setting areas of the layer number coordinate identifiers 352a and 352b may have the same second axis coordinate as the second axis coordinate of the seating position of the tester 330.

[0087] The tester 330 may be connected to a linear guide 340 so as to be movable in a planar direction on the support rack 311. Therefore, the tester 330 may be pulled out as required, improving accessibility during maintenance.

[0088] Meanwhile, since the tester rack 310 can be formed by connecting a plurality of support racks 311, a phenomenon in which the support racks 311 are misaligned with respect to other support racks 311 may occur due to various reasons, such as human error occurring during the process of positioning the support racks 311 or vibrations caused by repeated testing.

[0089] The function of compensating for such a misalignment and seating the test tray 30 will be described below with reference to Figures 8 and 9. Figure 8 is a diagram expressing that a tester is not aligned with an adjacent tester. Figure 9 is a diagram for explaining how the angle adjustment sensor detects the adjustment angle.

[0090] When the support rack 311 (see FIG. 7) is misaligned, a specific tester 330b may be twisted at a certain angle relative to the adjacent testers 330a and 330c, as shown in FIG. 8. However, the matter shown in FIG. 8 is exaggerated for ease of understanding, and the actual misalignment angle may be very small.

[0091] In such a case, if the memory module array 10 is moved and attached to a specific tester 330b as shown by the arrow in FIG. 8, the memory module array 10 and the socket 331 will not be aligned, which may result in the test tray 30 being unable to be attached to the tester 330b or the memory modules 11 being damaged.

[0092] When the support rack 311 is misaligned, the layer number identifiers 352a, 352b for guiding the corresponding tester 330b are also misaligned, different from the other testers 330a, 330c. More specifically, the imaginary line connecting the layer number identifiers 352a, 352b of the non-misaligned testers 330a, 330c is approximately perpendicular to the approach direction (b) (or the third axis direction). In contrast, the angle that the imaginary line connecting the layer number identifiers 352a, 352b of the misaligned tester 330b makes with the approach direction (B) (or the third axis direction) differs by the angle (A) misaligned from the original angle.

[0093] Therefore, by grasping the degree of misalignment (A) of the layer number identifiers 352a and 352b, it is possible to rotate the test tray 30 by the amount of the misalignment (A) and then mount it on the tester 330b.

[0094] 9, the angle adjustment sensor 270 recognizes the layer number identifiers 352a and 352b to determine the degree of deviation, and based on this, determines the adjustment angle. To this end, the angle adjustment sensor 270 includes a lower component including a measurement wave transmitter 271, a measurement wave receiver 272, and a sensor driver 273.

[0095] The measurement wave transmitter 271 may be disposed on the housing (not numbered) of the angle adjustment sensor 270 so as to face the front of the housing. The measurement wave transmitter 271 is provided to emit a measurement wave capable of measuring distance. In the following, a description will be given of an example in which the measurement wave transmitter 271 emits infrared rays to the outside, but the present invention is not limited thereto.

[0096] The measurement wave receiver 272 is a unit that receives the measurement wave reflected from the external object. The measurement wave receiver 272 can also be positioned facing the front of the housing. The angle adjustment sensor 270 is configured to grasp the distance to the external object based on the information received by the measurement wave receiver 272.

[0097] The sensor driver 273 is a drive unit that adjusts the direction in which the housings face each other. For example, the sensor driver 273 may be provided with a motor that can rotate the housing of the angle adjustment sensor 270.

[0098] The sensor driver 273 is operated under the control of the controller 280 (see FIG. 5). The controller 280 controls the sensor driver 273 to adjust the direction in which the angle adjustment sensor 270 looks.

[0099] For example, the control unit 280 may control the sensor driving unit 273 to rotate the angle adjustment sensor 270 over a large angle range. In this case, the angle adjustment sensor 270 may scan an area (SS) including both layer number identifiers 352a and 352b to obtain distance information for the layer number identifiers 352a and 352b. In this case, the area (SS) may be set in consideration of an average degree of deviation.

[0100] As another example, the control unit 280 may control the sensor driving unit 273 to scan the areas including the layer number identifiers 352a and 352b, respectively. In this case, the angle adjustment sensor 270 performs two scans in two different angle ranges (a first angle range and a second angle range).

[0101] For example, the first angle range rotation by the sensor driver 273 may cause the angle adjustment sensor 270 to scan a first region (S1). The first region (S1) may be a region that is preset in consideration of an average degree of deviation and is likely to include any one of the layer number identifiers 352a.

[0102] In contrast, the second angle range rotation by the sensor driver 273 may cause the angle adjustment sensor 270 to scan a second region (S2). The second region (S2) may be a region that is set in advance in consideration of an average degree of deviation and is likely to include any one of the layer number identifiers 352b.

[0103] The angle adjustment sensor 270 acquires distance information for the layer number identifier 352a in the first region (S1), and acquires distance information for the layer number identifier 352b in the second region (S2).

[0104] Meanwhile, the angle adjustment sensor 270 that has acquired the distance information can calculate an adjustment angle based on the distance to each of the layer number identifiers 352a, 352b. For such calculation, the angle adjustment sensor 270 includes a calculation unit that calculates an adjustment angle based on the distance to each of the layer number identifiers 352a, 352b.

[0105] The reason why the adjustment angle can be determined based on the distance between each of the layer number identifiers 352a, 352b (see FIG. 8) is that when the testers 330a, 330c are correctly positioned, the distance between the layer number identifiers 352a, 352b from the angle adjustment sensor 270 before entering each tester (when the support part has moved only along the first and second axes) is always a constant value or is within the error range. That is, the distance between the angle adjustment sensor 270 and the layer number identifiers 352a, 352b for the correctly positioned testers 330a, 330c is different from the distance between the layer number identifiers 352a, 352b for the misaligned tester 330b.

[0106] Meanwhile, the method in which the angle adjustment sensor 270 scans the area to obtain the distance to the layer number identifiers 352a, 352b varies depending on the type of the layer number identifiers 352a, 352b.

[0107] For example, the layer number identifiers 352a and 352b may be formed to protrude or recess from the support rack 311. In this case, the angle adjustment sensor 270 may be configured to measure distance information for all scan areas.

[0108] Continuing with the explanation with reference to FIG. 10, FIG. 10 is a diagram depicting an example of how the angle adjustment sensor recognizes the layer number identifier.

[0109] In this case, the control unit 280 controls the sensor driving unit 273 and / or the first axis driving unit 251 so that the angle adjustment sensor 270 scans an area including the layer number identifiers 352a and 352b in a direction (D1) parallel to the first axis.

[0110] When the layer number identifiers 352a and 352b are protruding or recessed, the distance information of the scanned area indicates that the distance to the layer number identifiers 352a and 352b is significantly different from the distance to the surroundings. Therefore, a critical difference in distance value occurs between the layer number identifiers 352a and 352b and the surrounding boundaries P11 and P12.

[0111] The angle adjustment sensor 270 scans an external object in the first axis direction (D1), and then grasps the coordinates of the boundaries P11 and P12, and grasps the first axis center coordinate P10 at the center of the boundaries P11 and P12. The first axis center coordinate P10 can be obtained by averaging the first axis coordinates of the boundaries P11 and P12.

[0112] Thereafter, the angle adjustment sensor 270 may transmit information regarding the center coordinate P10 to the controller 280. Thereafter, the controller 280 controls the sensor driver 273 and / or the second axis driver 253 to scan an area including the layer number identifiers 352a and 352b in a direction (D2) parallel to the second axis, passing through the first axis center coordinate P10.

[0113] The angle adjustment sensor 270 obtains the coordinates of the boundaries P21 and P22 in the same manner as the first axis center coordinate P10, and obtains the second axis center coordinate P20 using the obtained coordinates. Thereafter, the angle adjustment sensor 270 can determine the distance value for the second axis center coordinate P20 as the distance value for the corresponding layer number identifiers 352a and 352b while scanning along the direction (D2).

[0114] On the other hand, in the above example, when scanning a large area SS (see FIG. 9), there are two first axis center coordinates, which correspond to different layer number identifiers 352a and 352b. In this case, the angle adjustment sensor 270 can scan in the D2 direction from each first axis center coordinate to obtain distance information for each layer number identifier 352a and 352b.

[0115] As another example, the layer number identifiers 352a and 352b may be provided in the form of optically recognizable markers. Correspondingly, the angle adjustment sensor 270 may further include an additional device (hereinafter, a marker recognition unit) that recognizes the presence or absence of a marker according to light reflected from the marker.

[0116] For example, the marker may be a barcode and the angle adjustment sensor 270 may include a barcode reader, or the marker may be a reflector and the angle adjustment sensor 270 may include a light source and an optical receiver that receives light reflected from the light source.

[0117] If the layer number identifiers 352a and 352b are optically recognizable markers, the angle adjustment sensor 270 may omit measuring the distance to all scanned areas. In this case, the angle adjustment sensor may use a marker recognition unit when scanning the aforementioned areas. In this case, when the marker recognition unit finds a marker during the scanning process, it may measure the distance to the point where the marker is recognized, and determine the distance to the layer number identifiers 352a and 352b.

[0118] Continuing with the explanation with reference to FIG. 8, if the angle adjustment sensor 270 grasps the distances to the layer number identifiers 352a and 352b as in the above-mentioned method, the degree (A) of deviation of the tester 330b can be grasped based on the obtained distances. The angle adjustment sensor 270 sets the angle of deviation of the tester 330b as an adjustment angle and transmits information about the adjustment angle to the control unit 280. When the control unit 280 receives the information about the adjustment, it controls the second driving unit to rotate the rotation plate 233 (see FIG. 4) by the adjustment angle. Thereafter, the control unit controls the third axis driving unit to move the support plate 232 (see FIG. 4) in the third axis direction. When the third axis direction movement is completed, the test tray 30 (see FIG. 8) can enter the seating position of the misaligned tester 330b in an aligned state. At this time, entering in an aligned state means that the memory module can enter the socket without being damaged, and when the memory module is projected into the socket at the seating position, the projected memory module and the socket are aligned.

[0119] The following describes the process of inserting the memory module array into the socket after entering the aligned state with reference to Figure 11. Figure 11 is a diagram illustrating the process of inserting the memory module array into the socket.

[0120] When the adjustment angle is adjusted so that the sockets 331 and the memory module array are aligned, the test tray 30 is moved to the seating position, as shown in FIG. 11(b).

[0121] 11B shows a state in which the test tray 30 is seated at the seating position of the tester 330 after the transfer is completed and the memory modules 11 are seated on the upper portions of the sockets 331.

[0122] Thereafter, as shown in FIG. 11( a ), when the mount 320 descends and presses the memory module 11 , each memory module 11 is inserted into the socket 331 and electrically connected to the motherboard 332 .

[0123] Thereafter, the tester 330 performs a test on the memory module 11 according to a predetermined algorithm.

[0124] FIG. 12 is a conceptual diagram of a memory module mounting test system according to an embodiment of the present invention.

[0125] 12, the tester arrays 300 are disposed on both sides of the transfer 200. Specifically, the tester arrays 300 are disposed on both sides along the length direction of the rail 242 (see FIG. 4).

[0126] The control unit 280 controls the transfer 200 so that the test trays 30 are sequentially attached to the testers 330 included in the tester array 300. The transfer 200 sequentially supplies the test trays 30 to the testers 330 under the control of the control unit 280, and collects the test trays 30 for which testing has been completed and places them in the handler.

[0127] In FIG. 12, the arrow P1 represents the transport of a test tray to each tester 330, and the arrow P2 represents the bringing in of a user tray for testing or the removal of a user tray that has completed testing.

[0128] Meanwhile, the memory module mounting test system 1 according to the embodiment of the present invention has an advantage that the test tray can be stably mounted even on a long tester array 300 due to the above-mentioned adjustable angle alignment function.

[0129] Specifically, as the length of the tester array 300 increases, the socket arrangement may become misaligned as shown in FIG. 8 due to various reasons, such as accumulation of tolerances or accumulation of arrangement errors.

[0130] Even in such a case, the present invention has the advantage that the test tray can be automatically taught to be correctly attached to the tester without the need to reinstall the tester array 300 to realign it or to separately control the transfer 200.

[0131] Continuing with the description with reference to FIG. 13, FIG. 13 is a conceptual diagram illustrating a transfer in accordance with one embodiment of the present invention transferring a test tray from an initial position to a seating position.

[0132] In Fig. 13, st1 to st4 indicate the test trays transferred to the corresponding positions. Also, t100, t200, t300, t410, t320, and t420 indicate the coordinate identifiers arranged on the tester rack 310 (see Fig. 6). The transfer can recognize the coordinate identifiers t100, t200, t300, t410, t320, and t420 to grasp the amount of displacement from the current position.

[0133] In this case, t100, t200, and t300 are length coordinate identifiers for guiding the displacement amount of the first axis coordinate. Meanwhile, t320 and t420 are coordinate identifiers located on the support rack 311 (see FIG. 7) of a specific tester on which the test tray is to be seated. Also, t310 is a coordinate identifier located on the support rack of a tester located on a lower layer than the specific tester.

[0134] In the following description, it is assumed that the angle adjustment sensor is disposed at the front end side of the test tray based on the first axis direction, but it goes without saying that this can be changed to various embodiments. Also, in the following description, it is assumed that the transfer searches for the seating position (st4) for a specific tester based on the coordinate identifier t320 that is relatively close to the initial position (st1), but this can also be changed to various embodiments.

[0135] The process by which the transfer transports a test tray to a specific tester is as follows.

[0136] The transfer, which holds the test tray at the initial position (st1), receives a control signal from the control unit to transfer the test tray to a specific tester. At this time, the sensor driving unit 273 (see FIG. 9) adjusts the angle adjustment sensor 270 (see FIG. 9) so that it is parallel to the third axis at the initial position (st1) and faces the right side as viewed in FIG. 13. This is because the third axis coordinate value of the specific tester is on the right side as viewed in FIG. 13.

[0137] For example, at this time, the angle adjustment sensor can view the plane indicated by the third axis coordinate of the coordinate identifier t320 assigned to the specific tester. More specifically, if the first axis is the X axis, the second axis is the Z axis, and the third axis is the Y axis, and the xyz coordinates of t320 are (a, b, c), the angle adjustment sensor can view the plane where Y=c.

[0138] Thereafter, the control unit can control the first driving unit to move the test tray along the first axis until a length coordinate identifier t300 indicating the same first axis coordinate as the coordinate identifier t320 assigned to the specific tester is recognized.

[0139] The method of identifying the first axis coordinate and / or length coordinate identifier t300 to be transferred may be by using the numbers of the recognized coordinate identifiers. More specifically, a number corresponding to the order of appearance is set for each length coordinate identifier. The control unit may control the first driving unit to transfer the support unit until the same number of coordinate identifiers as the order of appearance of the length coordinate identifiers are recognized.

[0140] For example, the number of times a protruding or recessed portion appears during the process of the transfer scanning along the first axis (the number of times an area having a critical distance difference compared to other portions appears), the number of times a barcode reader recognizes a barcode, and / or the number of times light irradiated from a light source (e.g., an LED) is reflected by a reflector and the optical receiver recognizes the reflected light can indicate the order of appearance.

[0141] As another example, the control unit can determine the coordinates of the current support based on a barcode recognized by the transfer unit, where the barcode is recognized by a barcode reader attached to the transfer unit and includes information on the first and / or second axis coordinates of the corresponding position.

[0142] When the control unit recognizes the length coordinate identifier t300 that is the target of the primary transfer of the support unit, the control unit can complete the first axis movement at the corresponding position (st2). After that, the transfer unit can raise and lower the test tray along the second axis until the coordinate identifier t320 assigned to the specific tester is recognized.

[0143] When the control unit determines the coordinates of the transfer target from the recognized coordinate identifier number, it can determine the second axis coordinate from the recognized coordinate identifier number during the transfer lifting process (second axis moving process). Determining the second axis coordinate from the coordinate identifier number is the same or similar to the first axis.

[0144] On the other hand, if a barcode containing information regarding the coordinates is used, the barcode can be recognized and the coordinates of the second axis can be confirmed in the same manner as in the case of the first axis.

[0145] When the coordinate identifier t320 assigned to the specific tester is confirmed, the control unit can temporarily stop the support unit at the corresponding position (st3). Then, the transfer can drive the angle adjustment sensor to grasp the positional state of the specific tester. For convenience of explanation, hereinafter, t320 will be referred to as the reference assigned identifier and t420 as the auxiliary assigned identifier.

[0146] When the angle adjustment sensor recognizes the reference identifier t320 and the auxiliary identifier t420 and grasps the adjustment angle, the transfer rotates the test tray by the adjustment angle. The method of grasping the adjustment angle has been described above, so it will be omitted.

[0147] After the rotation is completed, the angle adjustment sensor measures the linear distance to the specific tester. After that, the control unit can move the test tray linearly by adding a preset value to the measured linear distance. At this time, the preset value can be the distance from the support rack to the actual seating position (st4). At this time, when the adjustment angle is 0 degrees, the transfer can move the test tray in a direction parallel to the third axis.

[0148] When the transfer has completed the transportation to the seating position (st4), it can seat the test tray in the tester and then return to the initial position (st1).

[0149] Hereinafter, a memory module mounting test method according to an embodiment of the present invention will be described with reference to Fig. 14. Fig. 14 is a flow chart of a memory module mounting test method according to an embodiment of the present invention. In order to avoid repetition, a description of parts common to the above description will be omitted.

[0150] As shown in FIG. 14, a memory module mounting test method according to one embodiment of the present invention includes a step of loading memory modules onto a test tray (S100), a step of a transfer transferring the test tray to a tester (S200), a step of rotating and aligning the test tray by the transfer (S300), a step of mounting a memory module array onto the tester and performing testing (S400), and a step of transferring the test tray after the mounting test is completed to a handler (S500).

[0151] The memory module mounting test method according to the embodiment of the present invention utilizes the memory module mounting test system 1 according to the embodiment of the present invention described above. Alternatively, the memory module mounting test method according to the embodiment of the present invention can be realized by an apparatus other than the memory module mounting test system 1 according to the embodiment of the present invention described above.

[0152] In the step of loading memory modules onto a test tray (S100), memory modules to be subjected to an on-board test are loaded onto the test tray. A plurality of memory modules are loaded onto the test tray in a predetermined pattern. Such a plurality of memory modules may form a memory module array. Such loading may be performed by a handler at an initial position.

[0153] In step S200 of transferring the test tray to the tester, the transferer transfers the test tray to one of a plurality of testers. In this step, the test tray may be transferred from an initial position to a seating position, or the test tray may be transferred to the front of the tester to which it is to be transferred. At this time, a plurality of sockets may be formed in the tester, and the sockets may have a pattern that is matched with the memory module array.

[0154] In the step S300 of the transfer rotating and aligning the test tray, the transfer grasps the adjustment angle and rotates the test tray by the adjustment angle. When the test tray is rotated by the adjustment angle, the memory module array and the sockets loaded on the test tray can be aligned.

[0155] In step S200, the transfer transfers the test tray to the tester. When the test tray is transferred to a seating position, the test tray rotates and the memory module array is mounted in the tester for testing (S400).

[0156] In step S200 of transferring the test tray to the tester, when the test tray is transferred to the front of the tester, the test tray may be rotated and aligned in this step and then transferred further to a seating position.

[0157] In the step of mounting the memory module array on a tester and performing a test (S400), the aligned memory modules are mounted in sockets and can be subjected to an on-board test.

[0158] In the step S500 in which the test tray on which the mounting test has been completed is transferred to the handler, the transfer may hold the test tray again at the seating position after the mounting test is completed, and return to the inside of the handler, which is the initial position. After returning to the handler, the memory modules loaded on the test tray may be sorted according to the results of the mounting test and organized in a state that they can be taken out.

[0159] Those skilled in the art will understand that the present invention can be embodied in other specific forms without changing the technical idea or essential features of the present invention. Therefore, the above-described embodiments should be understood to be illustrative and not limiting in all respects. The scope of the present invention is represented by the claims below rather than the above detailed description, and all modifications or variations derived from the meaning and scope of the claims and their equivalent concepts should be interpreted as being included in the scope of the present invention. [Explanation of symbols]

[0160] 1: Memory module mounting test system 10: Memory module array 11: Memory module 30: Test tray 31: Insert 100: Handler 200:Transfer 210: Transfer plate 220: Pillar member 230: Support part 231: Slide member 232: Support plate 233: Rotating plate 234: Appearance parts 250: First drive unit 251: First axis drive unit 253: Second axis drive unit 255: 3rd axis drive unit 260: Second drive unit 270: Angle adjustment sensor 271: Measurement wave transmitter 272: Measurement frequency receiver 273: Sensor drive unit 280: Control unit 300: Tester array 310: Tester rack 311: Support rack 320:Attachment device 321: Mounting device drive unit 330: Tester 331: Socket 332: Motherboard 340: Linear guide 351, 352, 352a, 352b: coordinate identifiers

Claims

1. a test tray on which a memory module array is loaded, in which a plurality of memory modules are arranged in a predetermined pattern; a tester on which the test tray can be seated and which is formed with sockets corresponding to the predetermined pattern and which performs a test on the memory module array; a transfer for transferring the test tray from an initial position to a seating position where the test tray is seated on the tester; and an attachment device for attaching the memory module array transferred to the mounting position to the socket; The transfer is a support portion for supporting the test tray located at the initial position; a first driving unit that moves the support unit from the initial position to the seating position; a second drive unit that rotates the support unit; an angle adjustment sensor for detecting an adjustment angle at which the support should be rotated so that the memory module array and the socket are aligned; and a control unit that controls the first driving unit and the second driving unit so that the support unit is moved to the seating position and rotated corresponding to the adjustment angle; The angle adjustment sensor recognizes two setting areas located adjacent to the socket and guiding the arrangement state of the socket to grasp the adjustment angle.

2. The two set regions are protruding or recessed from the adjacent regions, The angle adjustment sensor is 2. The memory module mounting test system with test tray alignment function of claim 1, further comprising: a test tray alignment function that scans an area including the two set areas to measure the distance; and recognizes two areas in the scanned area that have a critical distance difference compared to the surrounding areas as the two set areas.

3. The two set regions are protruding or recessed from the adjacent regions, The angle adjustment sensor is Scanning a first area including one of the two set areas and a second area including the other of the two set areas to measure distances; 2. The memory module mounting and testing system with test tray alignment function of claim 1, wherein the first area and the second area are recognized as two set areas having a critical distance difference compared to the surroundings.

4. Optically recognizable markers are arranged in the two set areas, 2. The memory module mounting and testing system with test tray alignment function according to claim 1, wherein the angle adjustment sensor recognizes the two setting areas based on light reflected from the marker.

5. The initial position and the seating position have different coordinates according to the first axis, the second axis, and the third axis, The first driving unit is a first axis drive portion for moving the support portion along a first axis; a second axis drive portion for moving the support portion along a second axis; and 2. The memory module mounting and testing system with test tray alignment function according to claim 1, further comprising: a third axis driving section for moving said support section along a third axis.

6. the test tray moves along a first axis and a second axis, and then moves along a third axis to the seating position; The two setting areas are:

6. The memory module mounting and testing system with test tray alignment function according to claim 5, wherein an imaginary line connecting said two set areas is positioned so as to form a preset angle with said third axis.

7. The transfer is The first axis driving portion further includes a rail formed along the first axis so that the support portion is moved by the first axis driving portion, A plurality of the testers are provided, the plurality of testers being arranged on both sides of the rail along the length direction of the rail; 6. The memory module mounting and testing system with test tray alignment function of claim 5, wherein the control unit seats the test trays on the respective testers in a preset order.

8. the test tray is formed with a plurality of through slits into which the memory modules are respectively inserted; The attachment device includes:

2. The memory module mounting and testing system with test tray alignment function as claimed in claim 1, further comprising: pressing the memory module array at one side of the through slit to mount the memory module array in the socket located at the other side of the through slit.

9. loading a memory module array, in which a plurality of memory modules are arranged in a predetermined pattern, on a test tray; a transfer step of transferring the test tray to a tester having sockets formed therein corresponding to the predetermined pattern; the transfer rotating the test tray so that the memory module arrays are aligned with sockets; and an attachment device attaching the memory module array to the socket, and a tester performing a test on the memory module array; In the step of rotating the test tray by the transfer, an angle adjustment sensor of the transfer recognizes two setting areas located adjacent to the socket and guiding the placement state of the socket to determine an adjustment angle, the adjustment angle being an angle by which the test tray needs to be rotated to place the memory module array in the socket.

Images